TW202201608A - Wafer stage device and method for controlling the wafer stage device - Google Patents

Wafer stage device and method for controlling the wafer stage device Download PDF

Info

Publication number
TW202201608A
TW202201608A TW109146650A TW109146650A TW202201608A TW 202201608 A TW202201608 A TW 202201608A TW 109146650 A TW109146650 A TW 109146650A TW 109146650 A TW109146650 A TW 109146650A TW 202201608 A TW202201608 A TW 202201608A
Authority
TW
Taiwan
Prior art keywords
ejector
cassette
dome
catapult
unit
Prior art date
Application number
TW109146650A
Other languages
Chinese (zh)
Inventor
金相銀
Original Assignee
南韓商韓華精密機械股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 南韓商韓華精密機械股份有限公司 filed Critical 南韓商韓華精密機械股份有限公司
Publication of TW202201608A publication Critical patent/TW202201608A/en

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The present invention provides a wafer stage device, wherein the main body of the stage is mounted on the main body of the stage and has a wafer support part with an internal space, and can be placed on the ejector dome in the internal space of the wafer support; The ejector main body, which is installed with the ejector dome; the ejector main body driving part, moves the ejector main body; at least one box unit supporting the ejector dome; the box body, which is installed It is movable on one side of the main body part of the stand; and a cartridge drive unit that moves the cartridge unit and a control unit that controls at least one of the ejector main body drive unit and the cartridge drive unit.

Description

晶圓承載平台裝置及其控制方法 Wafer carrier platform device and control method thereof

本發明係有關一種用於半導體晶圓的彈射程序之晶圓承載平台裝置及其控制方法。 The present invention relates to a wafer carrier platform device used for the ejection process of semiconductor wafers and a control method thereof.

通過切割程序，半導體晶圓可分割為多個晶粒，並且，將通過切割程序的半導體晶圓轉移至晶圓承載平台裝置以進行彈射程序。 Through the dicing process, the semiconductor wafer can be divided into a plurality of dies, and the semiconductor wafer that has passed the dicing process is transferred to the wafer carrier platform device for the ejection process.

放置在晶圓承載平台裝置上的半導體晶圓的晶粒係被彈射器裝置上推，並且被上推的晶粒被晶粒拾取裝置拾取，且被運送到下一步驟。 The dies of the semiconductor wafer placed on the wafer carrier platform device are pushed up by the ejector device, and the pushed up dies are picked up by the die pickup device and transported to the next step.

對於彈射程序，有時需要根據半導體晶圓的類型以及分離的晶粒的尺寸和厚度來更換彈射器圓頂罩和彈射器的拾取頭。通常，在這種情況下，係藉由使用與晶圓承載平台設備分開安裝的多軸機械手臂系統來更換彈射器圓頂罩。 For ejection procedures, it is sometimes necessary to replace the ejector dome and ejector pick-up head depending on the type of semiconductor wafer and the size and thickness of the separated dies. Typically, in this case, the ejector dome is replaced by using a multi-axis robotic arm system installed separately from the wafer carrier platform equipment.

韓國專利第10-1791788號公開了一種技術，該技術使用與晶圓承載平台分開安裝的機器人來更換圓頂 罩。 Korean Patent No. 10-1791788 discloses a technique for replacing the dome using a robot installed separately from the wafer carrier cover.

背景技術文獻 Background Art Documents

專利文獻：專利文獻1為韓國專利公開第10-1791788號 Patent document: Patent document 1 is Korean Patent Publication No. 10-1791788

根據本發明的一個要點，主要目的是提供一種具有改進的構造和控制方法的晶圓承載平台裝置。 According to one aspect of the present invention, the main object is to provide a wafer carrier platform apparatus with an improved method of construction and control.

根據本發明的一個要點，晶圓承載平台裝置有一機台主體部分；以及安裝在機台主體部分上的晶圓支撐部分，其上放置有半導體晶圓；與一內部空間；以及可位於晶圓支撐部分的內部空間中的彈射器圓頂罩。並且，其上安裝有彈射器圓頂罩的彈射器主體部分；使彈射器主體部分移動的彈射器主體驅動部分；以及至少一個支撐彈射器圓頂罩的卡匣單元，並且，機台主體部分可向其一側移動。因此本發明乃在提供一種晶圓承載平台裝置，其包括：一安裝的卡匣單元；使卡匣單元移動的卡匣驅動部；以及用以控制彈射器主體驅動單元和卡匣驅動單元中的至少一個的控制單元。 According to one aspect of the present invention, a wafer carrier platform device has a machine body portion; and a wafer support portion mounted on the machine body portion on which semiconductor wafers are placed; and an interior space; The catapult dome in the inner space of the support section. Also, a catapult body portion on which the catapult dome is mounted; a catapult body drive portion for moving the catapult body portion; and at least one cassette unit supporting the catapult dome, and the machine body portion can be moved to its side. Therefore, the present invention provides a wafer carrier platform device, which includes: a mounted cassette unit; a cassette drive unit for moving the cassette unit; and a drive unit for controlling the ejector main body and the cassette drive unit at least one control unit.

此處，可以在彈射器圓頂的側面上形成一夾持引導部。 Here, a gripping guide may be formed on the side of the catapult dome.

此處，一第一定位部分可形成在彈射器圓頂罩 的下方，並且與第一定位部分相對應的一第二定位部分可形成在彈射器主體部分的上方。 Here, a first positioning portion may be formed in the ejector dome and a second positioning portion corresponding to the first positioning portion may be formed above the ejector body portion.

此處，用以固定彈射器圓頂罩的下部本體夾持器可以安設在彈射器主體部分上。 Here, a lower body holder for securing the catapult dome may be mounted on the catapult body portion.

此處，一卡式盒可以包括至少一個用以感測彈射器圓頂罩的感測器。 Here, a cartridge may include at least one sensor for sensing the catapult dome.

此處，卡匣移動引導器被安裝在平台架主體中，並且卡匣部分可以沿著卡匣移動引導器移動。 Here, the cassette moving guide is installed in the platform frame body, and the cassette part can move along the cassette moving guide.

此處，卡匣單元可以包括支撐彈射器圓頂的一卡匣夾持器。 Here, the cassette unit may include a cassette holder supporting the catapult dome.

此處，在彼此正交的x軸，y軸和z軸上，卡匣部可在x軸方向上移動，並且彈射器主體部分可以在y軸和z軸方向上移動。 Here, on the x-axis, y-axis, and z-axis orthogonal to each other, the cassette part is movable in the x-axis direction, and the ejector main body part is movable in the y-axis and z-axis directions.

另外，根據本發明的另一要點提供了一種控制晶圓承載平台裝置的方法，其移動卡匣單元以將空卡匣單元在卡匣單元之間移動到替換位置；並將附接於彈射器主體的彈射器圓頂罩裝設到空置卡匣單元。且，藉由控制彈射器主體的主體夾持器，將彈射器圓頂與彈射器主體分開；並且，移動卡匣單元以將具有要更換的彈射器圓頂的卡匣單元在卡匣單元之間移動到更換位置。並且，使在替換位置中安裝在卡匣單元上的彈射器圓頂罩與彈射器主體部接觸；並且，藉由控制主體夾持器，將彈射器圓頂罩裝 設到彈射器主體部。 In addition, according to another gist of the present invention, there is provided a method of controlling a wafer carrier platform apparatus that moves a cassette unit to move an empty cassette unit between the cassette units to a replacement position; and attaches to an ejector The catapult dome of the main body is attached to the empty cassette unit. And, by controlling the body gripper of the catapult body, the catapult dome is separated from the catapult body; and the cassette unit is moved to place the cassette unit with the catapult dome to be replaced between the cassette units move to the replacement position. And, the ejector dome mounted on the cassette unit in the replacement position is brought into contact with the ejector main body; and, by controlling the main body holder, the ejector dome is mounted Set to the main body of the catapult.

根據本發明的一個要旨的晶圓承載平台裝置，在承載平台主體的一側安裝有卡式盒部，並且由該卡式盒部的卡式盒單元支撐著彈射圓頂罩。因此，簡化了用於更換彈射器圓頂罩的整體操作和控制，並且減小了安裝空間，從而使設備小型化並實現了設備操作的效率。 In the wafer stage apparatus according to one gist of the present invention, a cassette part is mounted on one side of the stage main body, and the ejection dome is supported by the cassette unit of the cassette part. Therefore, the overall operation and control for replacing the catapult dome is simplified, and the installation space is reduced, thereby miniaturizing the device and realizing the efficiency of the device operation.

W:半導體晶圓 W: semiconductor wafer

100:晶圓承載平台裝置 100: Wafer carrier platform device

110:機台主體 110: The main body of the machine

120:晶圓支撐部 120: Wafer support

121:內部空間 121: Interior Space

130:晶圓支撐部驅動單元 130: Wafer support drive unit

140、140_1、140_2、140_3、140_4:彈射器圓頂罩 140, 140_1, 140_2, 140_3, 140_4: catapult domes

140a:安裝凸緣 140a: Mounting flange

141:夾持器引導部 141: Gripper guide

142:定位孔 142: Positioning hole

L:彈射器圓頂罩140的標籤 L: Label for catapult dome 140

150:彈射器本體部 150: Catapult body part

152:主體夾持器 152: Body holder

152a:夾持部 152a: clamping part

152b:夾持部驅動部 152b: Clamping part driving part

160:彈射器本體驅動部 160: Catapult body drive part

170:卡匣部 170: Cassette Department

170a:卡匣移動引導部 170a: Cassette moving guide

171、171_1、171_2、171_3、171_4:卡匣單元 171, 171_1, 171_2, 171_3, 171_4: cassette unit

171a:卡匣夾持器 171a: Cassette Holder

171a_1、171a_2:手部 171a_1, 171a_2: Hands

171b:拉伸彈簧 171b: Extension spring

172:感測器單元 172: Sensor unit

R:夾持輥 R: pinch roller

180:卡匣驅動單元 180: Cartridge drive unit

190:控制單元 190: Control Unit

第1圖是根據本發明實施例的晶圓承載平台設備的示意性透視圖。 FIG. 1 is a schematic perspective view of a wafer carrier platform apparatus according to an embodiment of the present invention.

第2圖是第1圖中所示除半導體晶圓及晶圓支撐構件外的晶圓承載平台裝置之示意性透視圖，。 FIG. 2 is a schematic perspective view of the wafer carrier platform apparatus shown in FIG. 1, excluding the semiconductor wafer and wafer support members.

第3圖是根據本發明實施例在彈射器主體上安裝彈射器圓頂罩的狀態示意圖。 FIG. 3 is a schematic diagram of a state in which a catapult dome is installed on the catapult body according to an embodiment of the present invention.

第4圖是根據本發明實施例彈射器圓頂罩的示意性側視圖。 Figure 4 is a schematic side view of a catapult dome in accordance with an embodiment of the present invention.

第5圖是顯示出第4圖所示彈射器圓頂罩的下表面之示意圖。 FIG. 5 is a schematic view showing the lower surface of the catapult dome shown in FIG. 4. FIG.

第6圖是顯示出根據本發明實施例在彈射器主體上安裝彈射器圓頂罩的狀態的示意圖。 FIG. 6 is a schematic diagram showing a state in which the ejector dome is mounted on the ejector main body according to the embodiment of the present invention.

第7圖是顯示出根據本發明實施例的晶圓承載平台裝置之卡匣部分的示意性透視圖。 FIG. 7 is a schematic perspective view showing a cassette portion of a wafer stage apparatus according to an embodiment of the present invention.

第8圖是顯示出根據本發明實施例中卡匣單元的示意性透視圖。 Fig. 8 is a schematic perspective view showing a cassette unit according to an embodiment of the present invention.

第9圖是顯示出根據本發明實施例的彈射器主體部分和卡匣部分移動以替換晶圓承載平台裝置的彈射器圓頂罩方向的示意圖。 FIG. 9 is a schematic diagram showing the orientation of the ejector body portion and cassette portion moving to replace the ejector dome of the wafer carrier platform apparatus according to an embodiment of the present invention.

第10圖是顯示出根據本發明實施例更換彈射器圓頂罩的過程示意圖，並顯示出其中處於彈射位置的彈射器主體朝向卡匣移動以將現有彈射器圓頂罩安裝在空卡匣上的狀態。 Figure 10 is a schematic diagram showing the process of replacing the catapult dome in accordance with an embodiment of the present invention and showing where the catapult body in the ejection position is moved toward the cassette to install the existing catapult dome on the empty cassette status.

第11圖是顯示出根據本發明一實施例的更換彈射器圓頂罩的過程之示意圖，並顯示出在將現有的彈射器圓頂罩安裝到卡匣部之後彈射器主體部向下移動的狀態。 FIG. 11 is a schematic diagram showing a process of replacing the ejector dome according to an embodiment of the present invention, and showing the downward movement of the ejector body portion after the existing ejector dome is installed to the cassette portion. state.

第12圖是顯示出根據本發明一實施例作為更換彈射器圓頂罩過程的彈射器主體部分向上移動以安裝一新的彈射器圓頂罩之狀態示意圖。 FIG. 12 is a schematic diagram showing a state in which the catapult body portion is moved upward to install a new catapult dome as a process of replacing the catapult dome according to an embodiment of the present invention.

第13圖是顯示出根據本發明一實施例的更換彈射器圓頂罩的過程之示意圖，顯示了其中配備有新的彈射器圓頂罩的彈射器主體部移動到彈射位置的狀態。 13 is a schematic diagram showing a process of replacing the ejector dome according to an embodiment of the present invention, showing a state in which the ejector main body portion equipped with the new ejector dome is moved to the ejection position.

在下文中，將參考附圖詳細描述根據較佳實施例的本發明。在本說明書和附圖中，藉由對具有基本上相同的構造的元件，係使用相同的附圖標記來省略多餘的描述。 Hereinafter, the present invention according to preferred embodiments will be described in detail with reference to the accompanying drawings. In this specification and the drawings, redundant descriptions are omitted by using the same reference numerals for elements having substantially the same configuration.

第1圖是根據本發明實施例的晶圓承載平台設備的示意性透視圖，第2圖顯示出第1圖所示晶圓承載平台設備中的半導體晶圓和晶圓支撐部的示意性透視圖。 FIG. 1 is a schematic perspective view of a wafer carrier platform apparatus according to an embodiment of the present invention, and FIG. 2 shows a schematic perspective view of a semiconductor wafer and a wafer support in the wafer carrier platform apparatus shown in FIG. 1 picture.

根據本發明實施例的晶圓承載平台裝置100可以應用於半導體製造和半導體組裝製程，例如，晶粒鍵合機，晶片貼片機，晶片鍵合機裝置等。 The wafer carrier platform apparatus 100 according to the embodiment of the present invention can be applied to semiconductor manufacturing and semiconductor assembly processes, for example, a die bonder, a wafer mounter, a wafer bonder apparatus, and the like.

晶圓承載平台裝置100包括一機台主體110，一晶圓支撐部120，一晶圓支撐部驅動單元130，一彈射器圓頂罩140，一彈射器本體部150，一彈射器本體驅動部160，一卡匣部170，一卡匣驅動單元180，並且包括一控制單元190。 The wafer carrier platform device 100 includes a machine body 110, a wafer support portion 120, a wafer support portion drive unit 130, an ejector dome 140, an ejector body portion 150, and an ejector body drive portion 160 , a cassette part 170 , a cassette drive unit 180 , and includes a control unit 190 .

機台主體110是一包括晶圓承載平台裝置100的框架、各種驅動裝置、感應器以及諸如電纜之各種裝置的主體。 The machine main body 110 is a main body including the frame of the wafer carrier platform device 100, various driving devices, sensors, and various devices such as cables.

晶圓支撐部120被安裝在機台主體110的上方，而且，半導體晶圓W被放置在晶圓支撐部120的上表面上。 The wafer support portion 120 is mounted above the table main body 110 , and the semiconductor wafer W is placed on the upper surface of the wafer support portion 120 .

晶圓支撐部120為環形，並且在晶圓支撐部120中存在著內部空間121。 The wafer support portion 120 is annular, and an inner space 121 exists in the wafer support portion 120 .

晶圓支撐部120可以安裝在機台主體110上，使得能夠在x-y平面中移動以進行彈射程序。 The wafer support 120 may be mounted on the table body 110 so as to be movable in the x-y plane for the ejection procedure.

晶圓支撐部驅動單元130可使得晶片支撐部120在x-y平面上移動，因此，晶圓支撐部驅動單元130包括多個馬達，並且包括能夠在x-y平面上移動的各種機構機件。 The wafer supporting portion driving unit 130 can move the wafer supporting portion 120 on the x-y plane. Therefore, the wafer supporting portion driving unit 130 includes a plurality of motors and various mechanisms capable of moving on the x-y plane.

依照本實施方式的晶圓承載平台裝置100的安設係使得晶圓支撐部120能夠在x-y平面上移動，並且晶圓支撐部驅動單元130被配置為使晶圓支撐部120移動，但是本發明不限於此。亦即，可以用固定晶圓支撐部的方式安設本發明的晶圓承載平台裝置，在這種情況下，可以不包括晶圓支撐部驅動單元。 The wafer stage apparatus 100 according to the present embodiment is installed so that the wafer support 120 can move on the xy plane, and the wafer support drive unit 130 is configured to move the wafer support 120, but the present invention Not limited to this. That is, the wafer stage apparatus of the present invention may be installed in a manner of fixing the wafer support, and in this case, the wafer support drive unit may not be included.

同時，彈射器圓頂罩140可以位於晶圓支撐部120的內部空間121中。如第3圖所示，彈射器圓頂罩140推動半導體晶圓W的晶粒。其有兩個引腳(P)。 Meanwhile, the ejector dome 140 may be located in the inner space 121 of the wafer supporter 120 . As shown in FIG. 3 , the ejector dome 140 pushes the die of the semiconductor wafer W. As shown in FIG. It has two pins (P).

第3圖是顯示根據本發明實施例的在彈射器主體上安裝有彈射器圓頂罩的狀態之示意圖，第4圖是根據本發明實施例的彈射器圓頂罩的示意性側視圖。第5圖顯示第4圖所示彈射器圓頂罩下表面的示意圖。第6圖顯示根據本發明實施例的在彈射器主體上安裝彈射器圓頂罩 的狀態之示意圖。 FIG. 3 is a schematic view showing a state in which the ejector dome is mounted on the ejector body according to the embodiment of the present invention, and FIG. 4 is a schematic side view of the catapult dome according to the embodiment of the present invention. Figure 5 shows a schematic view of the lower surface of the catapult dome shown in Figure 4. Figure 6 shows the installation of the catapult dome on the catapult body according to an embodiment of the present invention Schematic diagram of the state.

參照第3圖和第4圖，一對夾持器引導部141形成在彈射器圓頂罩140的側面上，而彼此面對，並且，夾持器引導部141是為卡匣部170的卡匣夾持器所形成，以便於卡匣夾持器171進行夾持動作(170、171示於後圖)。 Referring to FIGS. 3 and 4 , a pair of clamper guides 141 are formed on the side surfaces of the ejector dome 140 to face each other, and the clamper guides 141 are cards of the cassette part 170 The cassette holder is formed to facilitate the clamping action of the cassette holder 171 (170, 171 are shown in the rear figure).

雖然根據本實施例，夾持器引導部141形成在彈射器圓頂罩140的側面上，但是本發明不限於此。即，根據本發明的夾持器引導部可以不形成在彈射器圓頂的側面上。 Although the gripper guide 141 is formed on the side surface of the ejector dome 140 according to the present embodiment, the present invention is not limited thereto. That is, the gripper guide according to the present invention may not be formed on the side surface of the ejector dome.

一安裝凸緣140a乃形成在彈射器圓頂罩140的下方，並且，安裝凸緣140a是由主體夾持器152的三個夾持部152a夾持並固定的部分。 A mounting flange 140a is formed below the catapult dome 140, and the mounting flange 140a is a portion held and fixed by the three holding portions 152a of the main body holder 152. As shown in FIG.

另外，如第5圖所示，在彈射器圓頂罩140的下表面上形成有定位孔142作為第一定位部。如第6圖所示，定位孔142可被裝設成與定位突起151套合的狀態，是定位突起151乃形成在彈射器本體部150上表面的第二定位部分，從而彈射器圓頂罩140被***到彈射器本體部150上。當安裝在該彈射器本體部150上時，即確定了方便安裝的位置。 In addition, as shown in FIG. 5 , a positioning hole 142 is formed on the lower surface of the ejector dome 140 as a first positioning portion. As shown in FIG. 6 , the positioning holes 142 can be installed in a state of being fitted with the positioning protrusions 151 . The positioning protrusions 151 are the second positioning portions formed on the upper surface of the ejector body 150 , so that the ejector dome covers 140 is inserted onto the ejector body portion 150 . When installed on the catapult body portion 150, a convenient installation position is determined.

在該實施例中，定位孔142形成為彈射器圓頂罩140的下表面上的第一定位部分，定位突起151形成為彈射器本體部150上的第二定位部分。雖然此可確定位置，但 是本發明不限於此；亦即，根據本發明，與上述情況相反，可在彈射器圓頂罩140的下表面上形成定位突起作為第一定位部，並且在彈射器本體部150的上表面上形成定位孔作為第二定位部。藉由此形成，也可以確定位置。另外，在安裝凸緣140a或彈射器本體部150的形體中，除了孔或突出部以外，可具有預定的變形部，由於在安裝凸緣140a或彈射器本體部150中存在與該變形部相對應的部分，因此可以引導彈射器圓頂罩140物理上準確地將彈射器本體部150定位在預定位置。 In this embodiment, the positioning hole 142 is formed as a first positioning portion on the lower surface of the ejector dome 140 , and the positioning protrusion 151 is formed as a second positioning portion on the ejector body portion 150 . Although this determines the location, However, the present invention is not limited to this; that is, according to the present invention, contrary to the above, positioning protrusions may be formed on the lower surface of the ejector dome 140 as the first positioning portion, and on the upper surface of the ejector body portion 150 A positioning hole is formed thereon as a second positioning portion. By this formation, the position can also be determined. In addition, in the shape of the mounting flange 140a or the ejector body portion 150, there may be a predetermined deformation portion in addition to the hole or the protruding portion. Accordingly, the ejector dome 140 can be guided to physically accurately position the ejector body portion 150 at a predetermined position.

由於存在著各種類型的半導體晶圓W，所以彈射器圓頂罩140也具有與半導體晶圓W的類型相對應的適合於每個半導體晶圓W的類型。因此，在彈射過程中，根據半導體晶圓W的類型使用合適類型的彈射器圓頂罩140。彈射器圓頂罩140的類型可以在彈射器圓頂罩140的標籤L上指示。亦即，在標籤L上顯示包括彈射器圓頂罩140的類型和規格的信息，並且該信息的規格可以包括字樣，符號和條碼等。 Since there are various types of semiconductor wafers W, the ejector dome 140 also has a type suitable for each semiconductor wafer W corresponding to the type of semiconductor wafer W. FIG. Therefore, in the ejection process, an appropriate type of ejector dome 140 is used according to the type of semiconductor wafer W. As shown in FIG. The type of catapult dome 140 may be indicated on the label L of the catapult dome 140 . That is, information including the type and specification of the catapult dome 140 is displayed on the label L, and the specification of the information may include words, symbols, barcodes, and the like.

使用感應器部172讀取彈射器圓頂罩140的標籤L。而控制單元190基於從感應器部172讀取的結果，識別卡匣部170的卡匣單元171所支撐的彈射器圓頂罩140的類型，其後，彈射器圓頂罩140即將在更換的情況下使用。 The tag L of the catapult dome 140 is read using the sensor unit 172 . The control unit 190 recognizes the type of the ejector dome 140 supported by the cassette unit 171 of the cassette unit 170 based on the result read from the sensor unit 172 , and then the ejector dome 140 is about to be replaced. use in case.

同時，彈射器圓頂罩140安裝在彈射器本體部 150上。 At the same time, the catapult dome 140 is installed on the catapult body part 150 on.

如上所述，定位突起151係形成在彈射器本體部150的上表面上，並且定位突起151***形成在彈射器圓頂罩140下方的定位孔142中，以允許彈射器圓頂罩140的位置得以確定。 As described above, the positioning protrusions 151 are formed on the upper surface of the ejector body portion 150, and the positioning protrusions 151 are inserted into the positioning holes 142 formed under the ejector dome 140 to allow the position of the ejector dome 140 be determined.

另外，在彈射器本體部150上，形成有固定彈射器圓頂罩140下部的主體夾持器152。 In addition, on the ejector main body portion 150, a main body holder 152 for fixing the lower portion of the ejector dome 140 is formed.

如第3圖所示，主體夾持器152具有對稱配置的三個夾持部152a。三個夾持部152a具有能夠在徑向上相互分離或接近的結構，其移動由夾持部驅動部152b所驅動。 As shown in FIG. 3, the main body holder 152 has three clamping parts 152a arranged symmetrically. The three gripping portions 152a have structures capable of being separated from or approaching each other in the radial direction, and their movement is driven by the gripping portion driving portion 152b.

另外，在夾持部152a的端部，裝設有作為軸承的夾持輥R，通過該夾持輥R，能夠容易地夾持彈射器圓頂罩140的安裝凸緣140a。 In addition, at the end of the nip portion 152a, a nip roll R serving as a bearing is attached, and the attachment flange 140a of the ejector dome 140 can be easily pinched by the nip roll R.

同時，第1圖所示之彈射器本體驅動部160移動彈射器本體部150。即，彈射器本體驅動部160升高/降低彈射器本體部150或向卡匣部170移動，以更換彈射器圓頂罩140。為此，彈射器本體驅動部160可以包括至少一個馬達，並且還可以包括各種傳送機構，例如能夠進行傳送的螺桿傳送裝置等。 At the same time, the ejector body driving part 160 shown in FIG. 1 moves the ejector body part 150 . That is, the ejector body driving part 160 raises/lowers the ejector body part 150 or moves toward the cassette part 170 to replace the ejector dome 140 . To this end, the ejector body driving part 160 may include at least one motor, and may also include various conveying mechanisms, such as a screw conveying device capable of conveying, and the like.

具體地，彈射器本體驅動部160被構造為在y-z平面中移動彈射器本體部150。亦即，通過彈射器本體驅動部160，使彈射器本體部150在y軸方向和z軸方向上移 動，稍後將對其詳細的運動進行描述。 Specifically, the ejector body driving portion 160 is configured to move the ejector body portion 150 in the y-z plane. That is, the ejector body portion 150 is moved in the y-axis direction and the z-axis direction by the ejector body driving portion 160 . movement, the detailed movement of which will be described later.

第7圖是示出根據本發明實施例的晶圓承載平台設備的卡匣單元的示意性透視圖，第8圖是示出根據本發明實施例卡匣單元的示意性透視圖。 FIG. 7 is a schematic perspective view showing a cassette unit of a wafer carrier platform apparatus according to an embodiment of the present invention, and FIG. 8 is a schematic perspective view showing a cassette unit according to an embodiment of the present invention.

參照第1圖和第2圖，卡匣部170係被安裝為可在機台主體110的一側上移動。為此，卡匣部170乃被安裝為可沿著卡匣移動引導部170a滑動者。 Referring to FIGS. 1 and 2 , the cassette part 170 is installed so as to be movable on one side of the machine body 110 . To this end, the cassette part 170 is installed so as to be slidable along the cassette moving guide part 170a.

卡匣移動引導部170a安裝在機台主體110的一側，並且，卡匣部170可以沿著卡匣移動引導部170a移動。 The cassette moving guide portion 170a is installed on one side of the table main body 110, and the cassette portion 170 can move along the cassette moving guide portion 170a.

卡匣部170包括四個卡匣單元171。每個卡匣單元171保持並支撐彈射器圓頂罩140。每個卡匣單元171包括用以支撐彈射器圓頂罩140的卡匣夾持器171a。 The cassette part 170 includes four cassette units 171 . Each cassette unit 171 holds and supports the catapult dome 140 . Each cassette unit 171 includes a cassette holder 171 a to support the catapult dome 140 .

根據本實施例，卡匣部170包括四個卡匣單元171，但是本發明不限於此。亦即，根據本發明的卡匣部僅需要包括至少一個卡匣單元，並且對數量沒有特別限制。例如，包括在根據本發明的卡匣部中的卡匣單元的數量可以是1、2、3、5、6等。另外，如果要更換的彈射器圓頂罩140的數量較大，則卡匣單元171的佈置和佈置可被配置成多行，但是卡匣單元171的佈置和佈置以左右佈置和豎直佈置來佈置。在這種情況下，可以進一步設置單獨的驅動單元，使得包括卡匣單元171的整個殼體可以上下旋轉或移動。 According to the present embodiment, the cassette part 170 includes four cassette units 171, but the present invention is not limited thereto. That is, the cassette part according to the present invention only needs to include at least one cassette unit, and the number is not particularly limited. For example, the number of cassette units included in the cassette part according to the present invention may be 1, 2, 3, 5, 6, and the like. In addition, if the number of ejector domes 140 to be replaced is large, the arrangement and arrangement of the cassette units 171 may be arranged in a plurality of rows, but the arrangement and arrangement of the cassette units 171 are arranged in a left-right arrangement and a vertical arrangement layout. In this case, a separate driving unit may be further provided so that the entire housing including the cassette unit 171 can be rotated or moved up and down.

卡匣夾持器171a包括兩個手部171a_1和171a_2，並且，兩個手部171a_1和171a_2被構造成使得它們之間的距離係被彈性地加寬或變窄。亦即，拉伸彈簧171b裝設在手部171a_1和171a_2中，從而可以彈性地保持它們之間的距離。另外，被安裝為軸承的夾持輥R被裝設在手部171a_1和171a_2中的每一個的端部，從而容易地夾緊彈射器圓頂罩140的側表面。 The cassette holder 171a includes two hands 171a_1 and 171a_2, and the two hands 171a_1 and 171a_2 are configured such that the distance therebetween is elastically widened or narrowed. That is, the tension spring 171b is installed in the hands 171a_1 and 171a_2 so that the distance therebetween can be elastically maintained. In addition, a pinch roller R installed as a bearing is installed at the end of each of the hands 171a_1 and 171a_2 so as to easily pinch the side surface of the ejector dome 140 .

另外，卡匣部170可以包括至少一個感測彈射器圓頂罩140的感測器單元172。 Additionally, the cassette portion 170 may include at least one sensor unit 172 that senses the catapult dome 140 .

感測器單元172裝置在每個卡匣部171中，並且可以識別由每個卡匣部171支撐的彈射器圓頂罩140的標籤L，並且還可以識別卡匣部171所識別出彈射器圓頂罩140是被夾持還是被支撐著，或者處於不被支撐的空置狀態，如果是，則檢測支撐是否得到了良好的維護，並向控制單元195發送信號。 The sensor unit 172 is installed in each cassette part 171 and can identify the label L of the ejector dome 140 supported by each cassette part 171 and can also identify the ejector recognized by the cassette part 171 Whether the dome 140 is clamped or supported, or in a vacant state without being supported, if so, it is detected whether the support is well maintained and a signal is sent to the control unit 195 .

感測器單元172可安裝在多個卡匣部171中的每一個上，並且可以使用能夠讀取彈射器圓頂罩140的標籤L之裝置。例如，可以將CCD元件，CMOS元件，照相機等用作感測器單元172，並且，控制單元190從感測器單元172和彈射器圓頂罩140接收並讀取關於標籤L的信息，識別類型並將其用於控制。 The sensor unit 172 may be mounted on each of the plurality of cassette parts 171, and a device capable of reading the label L of the ejector dome 140 may be used. For example, a CCD element, a CMOS element, a camera, etc. may be used as the sensor unit 172, and the control unit 190 receives and reads information on the label L from the sensor unit 172 and the ejector dome 140, identifying the type and use it for control.

雖然在本實施例中使用的感測器單元172具有 讀取標籤L的功能，但是本發明不限於此。亦即，根據本發明，即使感測器單元不具有讀取標籤L的功能，也可以應用僅能夠檢測彈射器圓頂140的夾持狀態的感測器。即，當彈射器圓頂罩140的類型受到限制時，僅需要掌握彈射器圓頂罩140的夾持狀態，並且在這種情況下，可以使用光感測器，磁感測器，霍爾(Hall)感測器，照相機等。 Although the sensor unit 172 used in this embodiment has The function of reading the label L, but the present invention is not limited to this. That is, according to the present invention, even if the sensor unit does not have the function of reading the label L, a sensor that can only detect the clamping state of the ejector dome 140 can be applied. That is, when the type of the catapult dome 140 is limited, it is only necessary to grasp the clamping state of the catapult dome 140, and in this case, a light sensor, a magnetic sensor, a Hall (Hall) sensors, cameras, etc.

另外，在本實施例的情況下，彈射器圓頂罩140的類型可由讀取標籤L和標籤L的感測器單元172識別，但是本發明不限於此。亦即，在本發明的情況下，對藉由檢測彈射器圓頂罩來識別彈射器圓頂罩的類型的方法沒有特別限制。例如，諸如RFID的無線識別標籤，無線傳輸裝置等可以被裝設在彈射器圓頂罩140上，並且感測器部分可包括用以識別這種無線信號的接收器。在這種情況下，可以使用各種無線通信，例如Wi-Fi，藍牙，NFC，Zigbee和Z-Wave等。 In addition, in the case of the present embodiment, the type of the ejector dome 140 can be recognized by the sensor unit 172 that reads the tag L and the tag L, but the present invention is not limited thereto. That is, in the case of the present invention, the method of identifying the type of the ejector dome by detecting the ejector dome is not particularly limited. For example, a wireless identification tag such as RFID, a wireless transmission device, etc. may be mounted on the catapult dome 140, and the sensor portion may include a receiver to identify such wireless signals. In this case, various wireless communications such as Wi-Fi, Bluetooth, NFC, Zigbee, and Z-Wave, etc. can be used.

同時，卡匣驅動單元180移動卡匣部170。亦即，卡匣驅動單元180移動卡匣部170，以使彈射器圓頂罩140在所選位置被卡匣單元171替換。為此，卡匣驅動單元180可包括至少一個驅動馬達，並且還可以包括各種輸送機構，例如能夠移動的螺桿輸送裝置。 At the same time, the cassette driving unit 180 moves the cassette part 170 . That is, the cassette driving unit 180 moves the cassette part 170 so that the ejector dome 140 is replaced by the cassette unit 171 at the selected position. To this end, the cassette drive unit 180 may include at least one drive motor, and may also include various conveying mechanisms, such as a movable screw conveying device.

特別地，卡匣驅動單元180在x軸方向上移動卡匣部170，稍後亦將對其詳細的移動進行描述。 In particular, the cassette driving unit 180 moves the cassette part 170 in the x-axis direction, and the detailed movement thereof will also be described later.

同時，控制單元190控制晶圓片支撐部驅動單元130，彈射器本體驅動部160和卡匣驅動單元180。亦即，控制單元190從卡匣部170的感測器單元172接收信號，並且根據預設程序，執行各種控制動作。為此，控制單元190可以包括能夠識別和處理能夠識別和處理圖像和圖像數據的硬體，軟體，固件，例如電路板和集成電路晶片，以及用戶或控制算法。其是在控制下驅動的。 Meanwhile, the control unit 190 controls the wafer support part driving unit 130 , the ejector body driving part 160 and the cassette driving unit 180 . That is, the control unit 190 receives a signal from the sensor unit 172 of the cassette part 170, and performs various control actions according to a preset program. To this end, the control unit 190 may include hardware, software, firmware, such as circuit boards and integrated circuit chips, and user or control algorithms capable of recognizing and processing images and image data. It is driven under control.

控制單元190可以被專門配置用於晶圓承載平台裝置100，但是若在應用晶圓承載平台裝置100的半導體製造過程中的裝置之整個控制單元時，即晶粒鍵合機，晶片貼片機，晶片鍵合機等；也可以集體和配置。 The control unit 190 may be specially configured for the wafer carrier platform apparatus 100, but if the entire control unit of the apparatus in the semiconductor manufacturing process of the wafer carrier platform apparatus 100 is applied, ie die bonder, die bonder, chip mounter , wafer bonders, etc.; can also be collective and configured.

以下，將參照第9圖至第13圖，描述根據本實施例的晶圓承載平台裝置100的操作和控制方法。 Hereinafter, the operation and control method of the wafer stage apparatus 100 according to the present embodiment will be described with reference to FIGS. 9 to 13 .

第9圖是顯示為了更換本發明的一個實施方式的晶圓承載平台裝置之彈射器圓頂罩而使彈射器主體部和卡匣部移動的方向示意圖。第10圖是顯示出根據本發明的實施例之更換彈射器圓頂罩的過程之示意圖，顯示出如下狀態：其中處於彈出位置的彈射器主體部分朝著卡匣部移動以將現有的彈射器圓頂罩部分安裝到空卡匣部分。另外，第11圖是顯示出根據本發明的實施例之在將現有的彈射器圓頂罩部分安裝在卡匣部分中之後，作為更換彈射器圓頂罩部分的過程，使彈射器圓頂罩部分向下移動之狀態 的示意圖，第12圖是顯示出根據本發明實施例之更換頂蓋的過程，該圖是顯示出了使頂蓋主體向上移動，以安裝新頂蓋的狀態的示意圖，第13圖是根據本發明實施例的頂蓋，表示圓頂罩的更換工序的示意圖，其中，具有新的彈射器圓頂罩的彈射器主體部移動到彈出位置的狀態。 FIG. 9 is a schematic diagram showing the direction in which the ejector main body and the cassette are moved in order to replace the ejector dome of the wafer stage apparatus according to the embodiment of the present invention. FIG. 10 is a schematic diagram showing the process of replacing the ejector dome according to an embodiment of the present invention, showing a state in which the ejector body portion in the ejected position is moved toward the cassette portion to replace the existing ejector The dome portion is mounted to the empty cassette portion. In addition, FIG. 11 is a diagram showing the ejector dome as a procedure for replacing the ejector dome portion after the existing ejector dome portion is installed in the cassette portion in accordance with an embodiment of the present invention. Partially moving down Fig. 12 is a schematic diagram showing the process of replacing the top cover according to an embodiment of the present invention, and Fig. 13 is a schematic diagram showing the state of moving the top cover body upward to install a new top cover The top cover of the embodiment of the invention is a schematic diagram showing the replacement process of the dome cover, in which the ejector main body with the new ejector dome is moved to the ejected position.

在第9圖中，卡匣單元171_1、171_2、171_3和171_4按順序佈置。卡匣單元171_1配備有彈射器圓頂罩140_1，卡匣單元171_3配備有彈射器圓頂140_3，並且，卡匣單元171_4配備有彈射器圓頂140_4，但是卡匣單元171_2則顯示為空無的情形。另外，顯示出了彈射器圓頂罩140_2係安裝在彈射器本體部150上的狀態。第9圖中所示的箭頭顯示出了彈射器本體部150和卡匣部170的移動方向，並且在彼此垂直的x軸，y軸和z軸上，彈射器本體部150是在y軸。它可以在x軸和z軸的兩個方向上移動，並且，卡匣部170可以在x軸的方向上移動。 In Fig. 9, the cassette units 171_1, 171_2, 171_3 and 171_4 are arranged in order. Cassette unit 171_1 is equipped with catapult dome 140_1, cassette unit 171_3 is equipped with catapult dome 140_3, and cassette unit 171_4 is equipped with catapult dome 140_4, but cassette unit 171_2 is shown empty situation. In addition, a state in which the ejector dome 140_2 is attached to the ejector body portion 150 is shown. The arrows shown in Fig. 9 show the direction of movement of the ejector body portion 150 and the cassette portion 170, and the ejector body portion 150 is on the y-axis on the x-axis, y-axis and z-axis which are perpendicular to each other. It can move in both directions of the x-axis and the z-axis, and the cassette part 170 can move in the direction of the x-axis.

在下文中，將依序描述彈射器圓頂罩140之更換過程的示例。不言而喻，以下替換過程僅是示例，並且也可以應用其他各種替換過程。 Hereinafter, an example of the replacement process of the ejector dome 140 will be sequentially described. It goes without saying that the following replacement procedures are only examples, and other various replacement procedures can also be applied.

首先，當將半導體晶圓W傳送到晶圓承載平台裝置100以進行彈射程序時，有關半導體晶圓W的類型數據即被傳送到控制單元190。 First, when the semiconductor wafer W is transferred to the wafer stage apparatus 100 for the ejection process, the type data about the semiconductor wafer W is transferred to the control unit 190 .

控制單元190根據傳送到晶圓承載平台裝置 100的半導體晶圓W的類型，確定當前安裝在彈射器本體部150上的彈射器圓頂140_2是否適合於彈出處理，如果確定半導體晶圓W被放置在晶片支撐單元120上，則驅動當前安裝的彈射器圓頂罩140以執行排出處理。 The control unit 190 transmits to the wafer carrier platform device according to the The type of the semiconductor wafer W of the 100, it is determined whether the ejector dome 140_2 currently mounted on the ejector body portion 150 is suitable for the ejection process, if it is determined that the semiconductor wafer W is placed on the wafer support unit 120, the current mounting is driven The ejector dome 140 to perform the ejection process.

如果控制器190確定當前安裝在彈射器本體部150上的彈射器圓頂140_2不適合彈射過程，則安裝在卡匣部170上的彈射器圓頂罩140_1。如果確定需要更換140_3和140_4中的彈射器圓頂罩140_3，則執行以下作業。 If the controller 190 determines that the ejector dome 140_2 currently installed on the ejector body part 150 is not suitable for the ejection process, the ejector dome 140_1 installed on the cassette part 170 is installed. If it is determined that the catapult dome 140_3 in 140_3 and 140_4 needs to be replaced, perform the following operations.

控制單元190首先驅動卡匣驅動單元180以移動卡匣部170，從而在卡匣單元171_1、171_2、171_3和171_4中更換空的卡匣單元171_2。另外，控制單元190驅動彈射器本體驅動部160以使彈射器本體部150沿①的箭頭方向(z軸的負方向)和②的箭頭方向(如第10圖所示)順序地移動。在負y軸方向和箭頭方向③(z軸正方向)上移動，然後將安裝在彈射器本體部150上的彈射器圓頂140_2移動到卡匣單元171_2而嵌合之。 The control unit 190 first drives the cassette driving unit 180 to move the cassette part 170 to replace the empty cassette unit 171_2 among the cassette units 171_1 , 171_2 , 171_3 and 171_4 . In addition, the control unit 190 drives the ejector body driving part 160 to sequentially move the ejector body part 150 in the arrow direction of ① (negative direction of the z-axis) and the arrow direction of ② (as shown in FIG. 10 ). After moving in the negative y-axis direction and the arrow direction ③ (positive z-axis direction), the ejector dome 140_2 attached to the ejector body 150 is moved to the cassette unit 171_2 and fitted.

然後，控制單元190控制彈射器本體部150的主體夾持器152，以使彈射器圓頂單元140_2與彈射器本體部150分離，從而可以移動彈射器本體部150。如第11圖所示，藉由驅動彈射器本體驅動部160之動作，彈射器本體部150乃下降。 Then, the control unit 190 controls the main body holder 152 of the ejector body part 150 to separate the ejector dome unit 140_2 from the ejector body part 150 so that the ejector body part 150 can be moved. As shown in FIG. 11, by driving the ejector main body driving part 160, the ejector main body part 150 is lowered.

然後，控制單元190驅動卡匣驅動單元180以移 動卡匣部170，從而將卡匣單元171_1、171_2、171_3和171_4中的卡匣單元171_3移動到替換位置。為了移動，將要更換的彈射器圓頂罩140_3乃裝設在卡匣單元171_3上。 Then, the control unit 190 drives the cassette driving unit 180 to move The cassette part 170 is moved, thereby moving the cassette unit 171_3 of the cassette units 171_1, 171_2, 171_3 and 171_4 to the replacement position. For movement, the ejector dome 140_3 to be replaced is mounted on the cassette unit 171_3.

然後，如第12圖所示，控制單元190驅動彈射器本體驅動部160以使彈射器本體部150升高，使得彈射部器本體部150的上表面和彈射器圓頂單元140_3之安裝凸緣140a接觸。隨後，通過控制彈射器本體部150的主體夾具152，將彈射器圓頂罩140_3安裝在彈射器本體部150上。在這樣的安裝過程中，彈射器圓頂罩140_3的定位孔142和彈射器本體部150的定位突起151使得能夠精確且容易地安裝。 Then, as shown in FIG. 12, the control unit 190 drives the ejector body driving part 160 to raise the ejector body part 150 so that the upper surface of the ejector body part 150 and the mounting flange of the ejector dome unit 140_3 140a contacts. Subsequently, the ejector dome 140_3 is mounted on the ejector body portion 150 by controlling the main body clamp 152 of the ejector body portion 150 . In such an installation process, the positioning holes 142 of the ejector dome 140_3 and the positioning protrusions 151 of the ejector body portion 150 enable precise and easy installation.

然後，如第13圖所示，控制單元190使彈射器本體部150沿y軸方向移動以使其與卡匣部170分離，然後沿z軸方向使其升高，從而使彈射器圓頂罩140_3通過將機台放置在足以進行彈出過程的高度來完成更換過程。在排出過程中，將半導體晶圓W放置在晶圓支撐部120上，並且驅動替換的彈射器圓頂罩140_3以執行彈射程序。 Then, as shown in FIG. 13, the control unit 190 moves the ejector body portion 150 in the y-axis direction to separate it from the cassette portion 170, and then raises it in the z-axis direction, thereby causing the ejector dome The 140_3 completes the replacement process by placing the table high enough for the ejection process. During the ejection process, the semiconductor wafer W is placed on the wafer support 120, and the replacement ejector dome 140_3 is driven to perform the ejection procedure.

如上所述，根據本實施例的晶圓承載平台裝置100，卡匣部170安裝在機台主體110的一側，並且卡匣部170的卡匣單元171是彈射器圓頂罩。其具有支撐的結構(140)。在那種情況下，與晶圓承載平台裝置分開裝設以運送彈射器圓頂罩之機械手臂結構的傳統技術相比，可以 減小整體安裝空間。然後，可以實現設備的小型化和裝設空間的優化。 As described above, according to the wafer stage apparatus 100 of the present embodiment, the cassette part 170 is installed on one side of the table main body 110 , and the cassette unit 171 of the cassette part 170 is an ejector dome. It has a supporting structure (140). In that case, compared to the conventional technology of the robot arm structure in which the wafer carrier platform device is installed separately to transport the ejector dome, it is possible to Reduce the overall installation space. Then, miniaturization of equipment and optimization of installation space can be achieved.

另外，根據本實施例的晶圓承載平台裝置100，為了更換彈射器圓頂罩140，彈射器本體部150可以在y軸和z軸這兩個方向上移動，並且，由於卡匣部170僅需要在x軸方向上移動，因此可以最小化更換彈射器圓頂罩140所需的驅動部件和傳送機構，從而降低了製造成本和維護成本。另外，由於可以使移動路徑最小化，所以可以使更換彈射器圓頂罩140所需的工作空間最小化。 In addition, according to the wafer stage apparatus 100 of the present embodiment, in order to replace the ejector dome 140, the ejector body portion 150 can be moved in both directions of the y-axis and the z-axis, and since the cassette portion 170 only Movement in the x-axis direction is required, so the drive components and transfer mechanisms required to replace the catapult dome 140 can be minimized, thereby reducing manufacturing and maintenance costs. In addition, since the movement path can be minimized, the work space required to replace the catapult dome 140 can be minimized.

另外，根據本實施例的晶圓承載平台裝置100，多個卡匣單元171中的每一個均包括感應測器單元172，從而可以識別被支撐的彈射器圓頂罩140的類型和支撐狀態。因此，可以根據半導體晶圓W的類型快速確定合適的彈射器圓頂罩140，並且如果需要，可以更換彈射器圓頂罩140以進行彈射處理。 In addition, according to the wafer stage apparatus 100 of the present embodiment, each of the plurality of cassette units 171 includes the sensor unit 172 so that the type and support state of the ejector dome 140 to be supported can be identified. Therefore, a suitable ejector dome 140 can be quickly determined according to the type of semiconductor wafer W, and if necessary, the ejector dome 140 can be replaced for the ejection process.

另外，根據本實施例的晶圓承載平台裝置100，在彈射器圓頂罩140的下表面上形成定位孔142，並且在彈射器本體部150的上表面上形成定位突起151。由於其形成可快速且準確地確定安裝位置，因此當將彈射器圓頂罩140安裝在彈射器本體部150上時，實現了快速且穩定的安裝。 In addition, according to the wafer stage apparatus 100 of the present embodiment, the positioning holes 142 are formed on the lower surface of the ejector dome 140 , and the positioning protrusions 151 are formed on the upper surface of the ejector body portion 150 . Since it is formed to quickly and accurately determine the installation position, when the ejector dome 140 is installed on the ejector body portion 150, a fast and stable installation is achieved.

上述說明已參考附圖中示出的實施例就本發 明的一個要點進行描述，惟所述僅為例示性，並且本領域普通技術人員可以進行各種修改和其他等效實施例。因此，本發明的真正保護範圍應僅由所附申請專利範圍來確定。 The foregoing description has been made of the present invention with reference to the embodiments shown in the accompanying drawings. In order to describe an important point, the description is only exemplary, and various modifications and other equivalent embodiments may be made by those of ordinary skill in the art. Therefore, the true scope of protection of the present invention should be determined only by the scope of the appended claims.

〔產業利用性〕 [Industrial Availability]

根據本發明的一個要點，以上所述可以用於與晶圓承載平台裝置有關的產業中。 According to one aspect of the present invention, the above can be used in industry related to wafer carrier platform apparatus.

W:半導體晶圓 W: semiconductor wafer

100:晶圓承載平台裝置 100: Wafer carrier platform device

110:機台主體 110: The main body of the machine

120:晶圓支撐部 120: Wafer support

121:內部空間 121: Interior Space

130:晶圓支撐部驅動單元 130: Wafer support drive unit

140:彈射器圓頂罩 140: Catapult Dome

150:彈射器本體部 150: Catapult body part

160:彈射器本體驅動部 160: Catapult body drive part

170:卡匣部 170: Cassette Department

170a:卡匣移動引導部 170a: Cassette moving guide

180:卡匣驅動單元 180: Cartridge drive unit

190:控制單元 190: Control Unit

Claims (9)

一種晶圓承載平台裝置，其包含： A wafer carrier platform device, comprising: 一晶圓承載平台主體； a main body of a wafer carrying platform; 一晶圓支撐部，其被設置在承載平台的主體上，而載置有半導體晶片，並具有內部空間； a wafer support part, which is arranged on the main body of the carrying platform, carries the semiconductor wafer, and has an inner space; 一可以位於晶圓支撐部內部空間中的彈射器圓頂； an ejector dome that can be located in the interior space of the wafer support; 一彈射器主體部分，其上嵌設有彈射器圓頂罩部分； a catapult main body part, on which the catapult dome cover part is embedded; 一彈射器主體驅動單元，其使彈射器主體移動； a catapult body drive unit that moves the catapult body; 一卡匣部，其具有至少一個支撐彈射器圓頂罩部分的卡匣單元，並設置成可在承載平台主體部的一側上移動； a cassette portion having at least one cassette unit supporting the catapult dome portion and arranged to be movable on one side of the carrying platform body portion; 一卡匣驅動單元，其移動卡匣單元；以及 a cassette drive unit that moves the cassette unit; and 控制單元，用以控制彈射器主體驅動單元和卡匣驅動單元中的至少一個。 The control unit is used to control at least one of the ejector main body drive unit and the cassette drive unit. 如申請專利範圍第1項所述之晶圓承載平台的控制方法，其中在所述彈射器圓頂的側面上形成有夾持引導部。 The control method of the wafer carrier platform according to claim 1, wherein a clamping guide is formed on the side surface of the ejector dome. 如申請專利範圍第1項所述之晶圓承載平台的控制方法，其中在彈射器圓頂罩的下方形成有第一定位部，與 第一定位部對應的第二定位部則形成在彈射器主體部的上側。 The control method of the wafer carrier platform according to the claim 1, wherein a first positioning part is formed under the ejector dome, and the The second positioning portion corresponding to the first positioning portion is formed on the upper side of the main body portion of the ejector. 如申請專利範圍第1項所述之晶圓承載平台的控制方法，其中用以固定彈射器圓頂下部的主體夾持器裝設在彈射器主體上。 The control method of the wafer carrier platform according to the claim 1, wherein the main body holder for fixing the lower part of the dome of the ejector is installed on the main body of the ejector. 如申請專利範圍第1項所述之晶圓承載平台的控制方法，其中卡匣部包括至少一個感測器部，用於感測彈射器圓頂罩。 The control method of the wafer carrier platform according to the claim 1, wherein the cassette part includes at least one sensor part for sensing the ejector dome. 如申請專利範圍第1項所述之晶圓承載平台的控制方法，其中盒式磁帶移動導向器裝設在承載平台的主體上，卡匣部沿卡匣移動引導部移動。 The control method of the wafer carrier platform according to the claim 1, wherein the cassette moving guide is installed on the main body of the carrier platform, and the cassette portion moves along the cassette moving guide portion. 如申請專利範圍第1項所述之晶圓承載平台的控制方法，其中卡匣單元包括用於支撐彈射器圓頂的卡匣夾具。 The control method of the wafer carrier platform as described in claim 1, wherein the cassette unit includes a cassette holder for supporting the dome of the ejector. 如申請專利範圍第1項所述之晶圓承載平台的控制方法，其中在彼此正交的x軸，y軸和z軸上，卡匣部可在x軸方向上移動，並且，彈射器主體部分可在y軸和z軸方向上移動。 The control method of the wafer stage according to the claim 1, wherein the cassette part is movable in the x-axis direction on the x-axis, the y-axis and the z-axis which are orthogonal to each other, and the ejector main body Sections can be moved in the y-axis and z-axis directions. 一種晶圓承載平台的控制方法，其實施方式包括： A control method of a wafer carrying platform, the implementation of which includes: 移動卡匣單元，以將卡匣單元中的一空置的卡匣單元移動到一更換位置； moving the cassette unit to move an empty cassette unit in the cassette unit to a replacement position; 將裝附在彈射器主體的彈射器圓頂罩嵌設到空置的 卡匣單元上； Insert the catapult dome attached to the catapult body into the vacant on the cassette unit; 藉由控制彈射器主體的主體夾持器將彈射器圓頂與彈射器主體分離； separating the ejector dome from the ejector body by controlling the body gripper of the ejector body; 移動卡匣單元，以使卡匣單元中具有要更換的彈射器圓頂罩的卡匣單元移動到更換位置； moving the cassette unit to move the cassette unit with the catapult dome to be replaced in the cassette unit to the replacement position; 在更換位置中，使裝設在卡匣單元上的彈射器圓頂罩與彈出彈射器主體部分接觸；以及 In the replacement position, the ejector dome mounted on the cassette unit is brought into contact with the ejection ejector body portion; and 藉由控制主體夾持具將彈射器圓頂罩安裝到彈射器主體上。 Install the catapult dome to the catapult body by controlling the body holder.
TW109146650A 2020-06-25 2020-12-29 Wafer stage device and method for controlling the wafer stage device TW202201608A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020200078043A KR102405424B1 (en) 2020-06-25 2020-06-25 Wafer stage device
KR10-2020-0078043 2020-06-25

Publications (1)

Publication Number Publication Date
TW202201608A true TW202201608A (en) 2022-01-01

Family

ID=79348529

Family Applications (1)

Application Number Title Priority Date Filing Date
TW109146650A TW202201608A (en) 2020-06-25 2020-12-29 Wafer stage device and method for controlling the wafer stage device

Country Status (2)

Country Link
KR (1) KR102405424B1 (en)
TW (1) TW202201608A (en)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100960598B1 (en) * 2008-01-29 2010-06-07 주식회사 탑 엔지니어링 Apparatus for supplying wefer in bonding machine
KR101304030B1 (en) * 2011-12-08 2013-09-04 리드텍(주) The ejection apparatus for pick up semiconductor chip
KR101593801B1 (en) * 2014-05-29 2016-02-12 세메스 주식회사 Apparatus for ejecting dies
KR102503284B1 (en) * 2016-09-29 2023-02-23 세메스 주식회사 Apparatus for exchanging a collet and a hood
JP7102305B2 (en) * 2018-09-19 2022-07-19 ファスフォードテクノロジ株式会社 Manufacturing method of die bonding equipment and semiconductor equipment

Also Published As

Publication number Publication date
KR20220000282A (en) 2022-01-03
KR102405424B1 (en) 2022-06-07

Similar Documents

Publication Publication Date Title
TW200903696A (en) Probe apparatus
US6160905A (en) Material loader apparatus and method using a single image recognition device for bar code and vision mark recognition
JP5633950B2 (en) Taping unit, electronic component accommodation method, and electronic component inspection apparatus
JP2011233736A (en) Backup pin device, backup pin arrangement method and arrangement apparatus
JP6787612B2 (en) Devices and methods for positioning the first object with respect to the second object
CN111933561A (en) Automatic unloading equipment of going up of special wafer in toilet
KR101422355B1 (en) Buffer stage and die bonder including the same
EP2059112B1 (en) Electronic component taking out apparatus, surface mounting apparatus and method for taking out electronic component
CN115346904A (en) Wafer conveying and measuring system
KR102649912B1 (en) Bonding module and die bonding apparatus having the same
TW202201608A (en) Wafer stage device and method for controlling the wafer stage device
JP4122170B2 (en) Component mounting method and component mounting apparatus
JPWO2008120519A1 (en) TCP handling equipment
US4913335A (en) Method and apparatus for die bonding
KR20210009843A (en) Die pickup method
KR20130011903A (en) A semiconductor manufacturing apparatus and a method for manufacturing a semiconductor
US20200321237A1 (en) Substrate supporting apparatus and method of controlling substrate supporting apparatus
KR20190043731A (en) Die bonding apparatus
KR20220081143A (en) Semiconductor manufacturing equipment, method of reading position of carrier and method of attaching semiconductor die on carrier using semiconductor manufacturing equipment
CN114093793A (en) Automatic chip testing device and method
KR102145848B1 (en) Die transfer module and die bonding apparatus having the same
JP5439141B2 (en) Semiconductor chip mounting apparatus and mounting method
JP5873988B2 (en) Parts transfer device
TWI793882B (en) Parts picking device, parts mounting device
JP5954969B2 (en) Component supply apparatus and component position recognition method