TW202138095A

TW202138095A - Control device of laser processing apparatus, laser processing apparatus, and laser processing method that controls processing performed with a laser beam scanned by a beam scanner for static processing and movement processing

Info

Publication number: TW202138095A
Application number: TW110108437A
Authority: TW
Inventors: 奧平恭之
Original assignee: 日商住友重機械工業股份有限公司
Priority date: 2020-03-11
Filing date: 2021-03-10
Publication date: 2021-10-16
Also published as: KR20210114873A; CN113385806A; CN113385806B; TWI818242B; JP2021142537A; JP7348109B2

Abstract

An object of the present invention is to provide a control device of a laser processing apparatus that realizes shortening of processing time. The solution of the present invention is a control device that controls processing performed with a laser beam scanned by a beam scanner. The control device possesses a function of scanning a laser beam in a state that a relative position of the beam scanner and a substrate is fixed in order to move an incident position of the laser beam in a part area of a surface of the substrate for performing static processing. It also possesses a function of moving the substrate with respective to the beam scanner to have the laser beam incident onto an area of the surface of the substrate that is to be processed subsequently. Furthermore, it possesses a function of scanning the laser beam during the time period in which the substrate is being moved with respective to the beam scanner to move the incident position of the laser beam in at least one area of an area in which the static processing is performed before the movement is started or an area in which the static processing is performed after the movement is started in order to preform movement processing.

Description

雷射加工裝置的控制裝置、雷射加工裝置及雷射加工方法Control device of laser processing device, laser processing device and laser processing method

本發明係有關一種雷射加工裝置的控制裝置、雷射加工裝置及雷射加工方法。The invention relates to a control device of a laser processing device, a laser processing device and a laser processing method.

已知有向印刷基板等射入雷射光束而進行鑽孔加工的雷射加工裝置(例如，參照專利文獻1。)。專利文獻1中揭示的雷射加工裝置一邊以一定速度移動保持基板的工作台一邊利用電流計鏡掃描雷射光束並使經掃描之雷射光束射入到基板表面的既定的位置而形成孔。Known is a laser processing device that injects a laser beam onto a printed circuit board or the like to perform drilling processing (for example, refer to Patent Document 1). The laser processing apparatus disclosed in Patent Document 1 scans a laser beam with a galvano mirror while moving a table holding a substrate at a constant speed and injects the scanned laser beam to a predetermined position on the surface of the substrate to form a hole.

又，還已知有在使基板靜止之狀態下掃描雷射光束，向既定的位置射入雷射光束而形成孔的加工技術。在該技術中，藉由交替地重複使基板靜止而加工的製程及使基板移動之製程而進行基板表面的整個區域的加工。該加工方法被稱為分步重複方式。 [先前技術文獻]In addition, there is also known a processing technique in which a laser beam is scanned while the substrate is stationary, and the laser beam is injected into a predetermined position to form a hole. In this technique, the entire area of the substrate surface is processed by alternately repeating the process of making the substrate stationary and processing and the process of moving the substrate. This processing method is called a step-and-repeat method. [Prior Technical Literature]

[專利文獻1] 日本特開2004-66300號公報[Patent Document 1] JP 2004-66300 A

在分步重複方式中，由於在基板的移動中不進行加工，因此難以實現為了加工基板的整個區域所需的時間的縮短化。在專利文獻1中揭示的加工方法中，基板的移動速度被限定為進行要加工的孔的分布最緊密的區域的加工時的移動速度。因此，在加工孔的分布密度高的區域時，基板的移動追不上雷射光束的掃描而可能發生等待雷射光束的輸出的狀況。因此，有時導致加工時間變得比分步重複方式更長。In the step-and-repeat method, since processing is not performed during the movement of the substrate, it is difficult to reduce the time required to process the entire area of the substrate. In the processing method disclosed in Patent Document 1, the moving speed of the substrate is limited to the moving speed when processing a region where the holes to be processed is most closely distributed. Therefore, in the area where the distribution density of the processing holes is high, the movement of the substrate cannot keep up with the scanning of the laser beam, and a situation of waiting for the output of the laser beam may occur. Therefore, sometimes the processing time becomes longer than the step-and-repeat method.

[發明所欲解決之問題][The problem to be solved by the invention]

本發明的目的為提供一種能夠實現加工時間的縮短化的雷射加工裝置的控制裝置、雷射加工裝置及雷射加工方法。 [解決問題之技術手段]The object of the present invention is to provide a control device of a laser processing device, a laser processing device, and a laser processing method that can reduce the processing time. [Technical means to solve the problem]

根據本發明的一觀點，提供一種控制裝置，其係控制基於被光束掃描器掃描之雷射光束的加工，前述控制裝置，具有：藉由在固定前述光束掃描器與基板的相對位置之狀態下掃描雷射光束，在前述基板表面的一部分區域移動雷射光束的入射位置而進行靜止加工之功能；向前述光束掃描器移動前述基板使得能夠向前述基板表面的接著要加工的區域射入雷射光束之功能；及藉由在向前述光束掃描器移動前述基板的期間掃描雷射光束，在開始移動前進行了前述靜止加工的區域或移動後進行前述靜止加工的區域中的至少1個區域移動雷射光束的入射位置而進行移動加工之功能。According to an aspect of the present invention, a control device is provided, which controls processing based on a laser beam scanned by a beam scanner. The aforementioned control device has: By scanning the laser beam in a state where the relative position of the beam scanner and the substrate is fixed, the incident position of the laser beam is moved on a part of the surface of the substrate to perform the function of static processing; The function of moving the substrate to the beam scanner so that the laser beam can be injected into the area to be processed next on the surface of the substrate; and By scanning the laser beam while moving the substrate to the beam scanner, at least one of the area where the static processing is performed before starting the movement or the area where the static processing is performed after the movement moves the incidence of the laser beam Position and move processing function.

根據本發明的另一觀點，提供一種雷射加工裝置，其係具有：光束掃描器，掃描雷射光束；移動機構，在被前述光束掃描器掃描之雷射光束所射入之位置向前述光束掃描器移動基板；及控制裝置，控制前述光束掃描器及前述移動機構，前述控制裝置，具有：藉由在固定前述光束掃描器與前述基板的相對位置之狀態下掃描雷射光束，在前述基板表面的一部分區域移動雷射光束的入射位置而進行靜止加工之功能；向前述光束掃描器移動前述基板使得能夠向前述基板表面的接著要加工的區域射入雷射光束之功能；及藉由在向前述光束掃描器移動前述基板的期間使前述光束掃描器進行動作，在開始移動前進行了前述靜止加工的區域或移動後進行前述靜止加工的區域中的至少1個區域移動雷射光束的入射位置而進行移動加工之功能。According to another aspect of the present invention, a laser processing device is provided, which has: Beam scanner, scanning the laser beam; The moving mechanism moves the substrate toward the beam scanner at the position where the laser beam scanned by the beam scanner is incident; and The control device controls the aforementioned beam scanner and the aforementioned moving mechanism, The aforementioned control device has: By scanning the laser beam in a state where the relative position of the beam scanner and the substrate is fixed, the incident position of the laser beam is moved on a part of the surface of the substrate to perform static processing; The function of moving the substrate to the beam scanner so that the laser beam can be injected into the area to be processed next on the surface of the substrate; and By operating the beam scanner while the substrate is being moved to the beam scanner, at least one of the area where the static processing is performed before the start of the movement or the area where the static processing is performed after the movement is moved. The function of moving and processing the incident position of the beam.

根據本發明的又一觀點，提供一種雷射加工方法，其係交替地執行如下製程：藉由在相對於掃描雷射光束的光束掃描器固定基板的位置之狀態下，利用前述光束掃描器掃描雷射光束並向前述基板射入雷射光束來進行靜止加工；及藉由一邊向前述光束掃描器相對移動前述基板，一邊利用前述光束掃描器掃描雷射光束並向前述基板射入雷射光束來進行移動加工。 [發明之效果]According to another aspect of the present invention, a laser processing method is provided, which alternately performs the following processes: By using the beam scanner to scan the laser beam and inject the laser beam onto the substrate to perform static processing while fixing the position of the substrate relative to the beam scanner that scans the laser beam; and While the substrate is relatively moved to the beam scanner, the laser beam is scanned by the beam scanner and the laser beam is incident on the substrate to perform movement processing. [Effects of Invention]

在靜止加工與下一個靜止加工之間的基板的移動中進行移動加工，藉此能夠實現加工時間的縮短化。The moving processing is performed during the movement of the substrate between the stationary processing and the next stationary processing, thereby shortening the processing time.

參照圖1～圖5C對基於實施例的雷射加工裝置及雷射加工方法進行說明。The laser processing apparatus and laser processing method based on the embodiment will be described with reference to FIGS. 1 to 5C.

圖1係基於實施例的雷射加工裝置的概略圖。基於實施例的雷射加工裝置包括雷射光學系統10、保持並移動基板40的移動機構30以及控制雷射光學系統10和移動機構30之控制裝置20。Fig. 1 is a schematic diagram of a laser processing apparatus based on the embodiment. The laser processing device based on the embodiment includes a laser optical system 10, a moving mechanism 30 that holds and moves the substrate 40, and a control device 20 that controls the laser optical system 10 and the moving mechanism 30.

以下，對雷射光學系統10的構成進行說明。雷射振盪器11根據來自控制裝置20的指令而輸出脈衝雷射光束。從雷射振盪器11輸出的脈衝雷射光束通過導光光學系統12及孔徑13而射入聲光元件(AOD)14。導光光學系統12例如包括光束擴展器等。聲光元件14根據來自控制裝置20的指令使所射入之脈衝雷射光束轉向第1路徑15A、第2路徑15B及朝向光束阻尼器19的路徑中的任一個路徑中。Hereinafter, the configuration of the laser optical system 10 will be described. The laser oscillator 11 outputs a pulsed laser beam according to an instruction from the control device 20. The pulsed laser beam output from the laser oscillator 11 passes through the light guiding optical system 12 and the aperture 13 and enters the acousto-optic element (AOD) 14. The light guiding optical system 12 includes, for example, a beam expander and the like. The acousto-optic element 14 turns the incident pulsed laser beam to any one of the first path 15A, the second path 15B, and the path toward the beam damper 19 in accordance with an instruction from the control device 20.

轉向第1路徑15A的脈衝雷射光束通過光束掃描器16A及聚光透鏡17A而射入作為加工對象物的基板40。轉向第2路徑15B的脈衝雷射光束被折返鏡18反射並通過光束掃描器16B及聚光透鏡17B而射入作為加工對象物的另一基板40。向2個基板40分別射入脈衝雷射光束，藉此進行鑽孔加工。2個基板40例如為印刷配線基板。The pulsed laser beam turned to the first path 15A passes through the beam scanner 16A and the condenser lens 17A and enters the substrate 40 as the object to be processed. The pulsed laser beam turned to the second path 15B is reflected by the folding mirror 18, passes through the beam scanner 16B and the condenser lens 17B, and enters the other substrate 40 that is the object to be processed. A pulsed laser beam is injected into the two substrates 40, respectively, to perform drilling processing. The two substrates 40 are, for example, printed wiring boards.

作為光束掃描器16A、16B，例如使用包括一對擺動反射鏡的加爾瓦諾掃描儀。光束掃描器16A、16B根據來自控制裝置20的指令掃描雷射光束，分別在2個基板40的表面移動脈衝雷射光束的入射位置。作為聚光透鏡17A、17B，例如使用fθ透鏡。As the beam scanners 16A and 16B, for example, a Galvano scanner including a pair of swinging mirrors is used. The beam scanners 16A and 16B scan the laser beams in accordance with instructions from the control device 20, and move the incident positions of the pulsed laser beams on the surfaces of the two substrates 40, respectively. As the condenser lenses 17A and 17B, for example, fθ lenses are used.

2個基板40被支撐在移動機構30的可動工作台31的水平支撐面上。移動機構30根據來自控制裝置20的指令，使2個基板40向光束掃描器16A、16B在與支撐面平行的二維方向上移動。向光束掃描器16A、16B移動基板40係指，使基板40向光束掃描器16A、16B上的入射部位中的光束路徑(掃描前的光束路徑)移動。The two substrates 40 are supported on the horizontal support surface of the movable table 31 of the moving mechanism 30. The moving mechanism 30 moves the two substrates 40 to the beam scanners 16A, 16B in a two-dimensional direction parallel to the supporting surface in accordance with an instruction from the control device 20. Moving the substrate 40 to the beam scanners 16A and 16B means moving the substrate 40 to the beam path (beam path before scanning) in the incident portion on the beam scanner 16A and 16B.

圖2A係表示在基板40的表面定義的複數個被加工點41的分布的一例的圖。圖2A中僅示出複數個被加工點41中的一部分。在被支撐在移動機構30(圖1)上之2個基板40所定義的複數個被加工點41的分布相同。基板40的外形例如為長方形。FIG. 2A is a diagram showing an example of the distribution of a plurality of processed points 41 defined on the surface of the substrate 40. FIG. 2A shows only a part of the plurality of processed points 41. The distribution of the plurality of processed points 41 defined by the two substrates 40 supported on the moving mechanism 30 (FIG. 1) is the same. The outer shape of the substrate 40 is, for example, a rectangle.

在長方形基板40的4個角上分別設有對準標記42。在基板40的表面定義複數個被加工點41。圖2A中用圓形記號表示被加工點41，但實際上在基板40表面沒有標出任何標記，而是在控制裝置20中儲存了定義複數個被加工點41的位置的位置數據。Alignment marks 42 are respectively provided on the four corners of the rectangular substrate 40. A plurality of processed points 41 are defined on the surface of the substrate 40. In FIG. 2A, the processed point 41 is indicated by a circular mark, but in fact, no mark is marked on the surface of the substrate 40. Instead, the control device 20 stores position data defining the positions of a plurality of processed points 41.

在基板40的表面定義複數個掃描區域45。每個掃描區域45的形狀為正方形，其大小與能夠藉由使光束掃描器16A、16B(圖1)各自進行動作而掃描脈衝雷射光束來射入脈衝雷射光束的範圍的大小幾乎相等。將複數個掃描區域45配置成使基板40上之所有被加工點41包含於任一掃描區域45內。有複數個掃描區域45的一部分重疊的情況，亦有在未分布被加工點41的區域未配置掃描區域45的情況。A plurality of scanning areas 45 are defined on the surface of the substrate 40. The shape of each scanning area 45 is a square, and its size is almost the same as the range in which the pulsed laser beam can be scanned by operating the beam scanners 16A and 16B (FIG. 1) respectively. The plurality of scanning areas 45 are arranged so that all the processed points 41 on the substrate 40 are included in any scanning area 45. There are cases where a part of a plurality of scanning areas 45 overlap, and there are cases where the scanning area 45 is not arranged in an area where the processed points 41 are not distributed.

使1個掃描區域45移動至聚光透鏡17A、17B(圖1)中1個聚光透鏡的正下方，並依序向該掃描區域45內的複數個被加工點41射入脈衝雷射光束，藉此進行該掃描區域45的加工。若1個掃描區域45的加工結束，則使移動機構30(圖1)進行動作而使接著要加工的掃描區域45移動至聚光透鏡17A、17B中1個聚光透鏡的正下方。圖2A中，用箭頭表示掃描區域45的加工順序。Move one scanning area 45 to directly below one of the condenser lenses 17A and 17B (Figure 1), and sequentially inject pulsed laser beams into the plurality of processed points 41 in the scanning area 45 , Thereby processing the scanning area 45. When the processing of one scanning area 45 is completed, the moving mechanism 30 (FIG. 1) is operated to move the scanning area 45 to be processed next to just below one of the condenser lenses 17A and 17B. In FIG. 2A, the processing sequence of the scanning area 45 is indicated by arrows.

圖2B係表示複數個被加工點41的加工順序的一例的圖。複數個被加工點41上標有編號。使光束掃描器16A、16B(圖1)進行動作，並按編號順序向複數個被加工點41射入脈衝雷射光束，藉此進行1個掃描區域45的加工。圖2B中，用箭頭表示複數個被加工點41的加工順序。被加工點41的加工順序例如以使脈衝雷射光束的入射位置的移動路徑變最短的方式確定。加工順序的決定例如能夠適用解開巡迴推銷員問題的算法。FIG. 2B is a diagram showing an example of the processing sequence of a plurality of to-be-processed points 41. The multiple processed points 41 are marked with serial numbers. The beam scanners 16A and 16B (FIG. 1) are operated, and a pulsed laser beam is incident on a plurality of processed points 41 in the order of the numbers, thereby processing one scanning area 45. In FIG. 2B, the processing sequence of a plurality of processed points 41 is indicated by arrows. The processing order of the processed point 41 is determined, for example, so that the movement path of the incident position of the pulsed laser beam becomes the shortest. For the determination of the processing order, for example, an algorithm for solving the traveling salesman problem can be applied.

將存在於1個掃描區域45內並且以相同條件加工的複數個被加工點41的集合稱為“分區”。按分區對複數個被加工點41標出了上述編號。將順次向1個分區的所有被加工點41以相同的照射條件分別射入1次脈衝雷射光束的加工稱為“掃描”。將加工1個分區的被加工點41時的照射條件數稱為“循環數”。A collection of a plurality of processed points 41 existing in one scanning area 45 and processed under the same conditions is referred to as a “partition”. The above-mentioned numbers are marked for a plurality of processed points 41 according to partitions. The processing in which a pulsed laser beam is injected into all the processed points 41 of one zone sequentially under the same irradiation conditions is called "scanning". The number of irradiation conditions when processing the processed point 41 of one partition is referred to as the "number of cycles".

可以將相同條件加工的複數個被加工點41的全部包含於1個分區中，亦可以將相同條件加工的複數個被加工點41中的任意一部分的被加工點41包含於1個分區中。All of the plurality of processed points 41 processed under the same conditions may be included in one partition, or any part of the processed points 41 of the plural processed points 41 processed under the same conditions may be included in one partition.

例如，在以1個照射條件進行1次掃描的加工中，向每個被加工點41射入1次脈衝雷射光束。在以相同的照射條件進行2次掃描時，向1個被加工點41射入總計2次雷射脈衝。在循環數為2次的加工中，進行第1照射條件下的掃描及與第1照射條件不同的第2照射條件下的掃描。在第1照射條件及第2照射條件下，所使用的脈衝雷射光束的脈衝寬度不同。例如，在第1循環中進行2次掃描、在第2循環中進行1次掃描的加工中，向每個被加工點41以第1照射條件射入2次脈衝雷射光束、以第2照射條件射入1次脈衝雷射光束。For example, in processing that performs one scan under one irradiation condition, a pulsed laser beam is incident on each point 41 to be processed. When performing two scans under the same irradiation conditions, a total of two laser pulses are injected to one point 41 to be processed. In the processing with the number of cycles of 2 times, scanning under the first irradiation condition and scanning under the second irradiation condition different from the first irradiation condition are performed. Under the first irradiation condition and the second irradiation condition, the pulse width of the pulsed laser beam used is different. For example, in the processing of performing two scans in the first cycle and performing one scan in the second cycle, each processed point 41 is injected with a pulsed laser beam twice under the first irradiation condition, and the second irradiation is performed. The condition is to inject a pulsed laser beam once.

在將掃描區域45中所包含的複數個被加工點41的一部分包含於1個分區中時，藉由其他掃描加工不包含於該分區的其他複數個被加工點41。關於1個分區中所包含的複數個被加工點41的組合，可以設為在複數個基板40(圖4A)中相同，亦可以設為按每個基板40不同。When a part of the plurality of processed points 41 included in the scanning area 45 is included in one partition, other plural processed points 41 that are not included in the partition are processed by other scanning. The combination of the plurality of processed points 41 included in one partition may be the same in the plurality of substrates 40 (FIG. 4A ), or may be different for each substrate 40.

圖3係表示基於實施例的雷射加工方法的順序的流程圖。以下，對用在第1路徑15A(圖1)中傳播的脈衝雷射光束進行加工的情況進行說明。使用在第2路徑15B中傳播的脈衝雷射光束進行的加工順序亦與使用在第1路徑15A中傳播的脈衝雷射光束進行的加工順序相同。Fig. 3 is a flowchart showing the procedure of the laser processing method based on the embodiment. Hereinafter, the case of processing with the pulsed laser beam propagating through the first path 15A (FIG. 1) will be described. The processing sequence performed using the pulse laser beam propagating in the second path 15B is also the same as the processing sequence performed using the pulse laser beam propagating in the first path 15A.

將基板40支撐於移動機構30(圖1)，並開始為了將首先要加工的未加工的掃描區域45配置於聚光透鏡17A的正下方的可加工位置而進行的基板40的移動(步驟S1)。在該移動中，控制裝置20藉由使基板40向雷射光學系統10的光束掃描器16A移動，將未加工的掃描區域45配置於可加工位置。在結束了至少1個掃描區域45的加工時，開始為了將接著要加工的未加工的掃描區域45配置於聚光透鏡17A的正下方的可加工位置的基板40的移動。The substrate 40 is supported by the moving mechanism 30 (FIG. 1), and the substrate 40 is moved to arrange the unprocessed scan area 45 to be processed first at a processable position directly below the condenser lens 17A (step S1) ). In this movement, the control device 20 moves the substrate 40 to the beam scanner 16A of the laser optical system 10 to arrange the unprocessed scanning area 45 at a processable position. When the processing of at least one scan area 45 is completed, the movement of the substrate 40 for arranging the unprocessed scan area 45 to be processed next at a workable position directly below the condenser lens 17A is started.

控制裝置20在移動基板40的期間，從雷射振盪器11輸出脈衝雷射光束，控制光束掃描器16A而掃描脈衝雷射光束，進行接著要加工的未加工的掃描區域45(圖2A)內的被加工點41的加工(步驟S2)。本說明書中，將一邊移動基板40一邊掃描脈衝雷射光束的加工稱為“移動加工”。During the movement of the substrate 40, the control device 20 outputs a pulsed laser beam from the laser oscillator 11, controls the beam scanner 16A to scan the pulsed laser beam, and performs subsequent processing within the unprocessed scanning area 45 (FIG. 2A) The processed point 41 is processed (step S2). In this specification, the processing of scanning the pulsed laser beam while moving the substrate 40 is referred to as "moving processing".

接著，對進行移動加工時的光束掃描器16A的控制進行說明。在能夠用光束掃描器16A掃描脈衝雷射光束進行加工的可加工範圍設定了原點(基準點)。相對於光束掃描器16A(更具體而言，光束掃描器16A上之脈衝雷射光束的入射位置中的光束路徑)或聚光透鏡17A固定了該原點。控制裝置20能夠藉由控制光束掃描器16A向可加工範圍的指定的位置射入脈衝雷射光束。Next, the control of the beam scanner 16A at the time of moving processing will be described. The origin (reference point) is set in the processing range that can be processed by scanning the pulse laser beam with the beam scanner 16A. The origin is fixed with respect to the beam scanner 16A (more specifically, the beam path in the incident position of the pulsed laser beam on the beam scanner 16A) or the condenser lens 17A. The control device 20 can control the beam scanner 16A to inject a pulsed laser beam to a specified position in the processable range.

掃描區域45內的被加工點41的位置被定義為相對於設在基板40上之對準標記42(圖2A)的相對位置。控制裝置20藉由在將基板40搭載於可動工作台31上來進行固定之狀態下檢測對準標記42(圖2A)的位置，獲取相對於可動工作台31的基板40的相對位置資訊。控制裝置20根據相對於可動工作台31的基板40的相對位置資訊及相對於基板40的對準標記42進行定義的被加工點41的位置資訊，確定相對於可動工作台31的被加工點41的相對位置。The position of the processed point 41 in the scanning area 45 is defined as the relative position with respect to the alignment mark 42 (FIG. 2A) provided on the substrate 40. The control device 20 detects the position of the alignment mark 42 (FIG. 2A) in a state where the substrate 40 is mounted on the movable table 31 and fixed to obtain relative position information of the substrate 40 with respect to the movable table 31. The control device 20 determines the processed point 41 with respect to the movable table 31 based on the relative position information of the substrate 40 with respect to the movable table 31 and the position information of the processed point 41 defined by the alignment mark 42 with respect to the substrate 40 Relative position.

移動加工中，可動工作台31及基板40相對於可加工範圍的原點進行移動。控制裝置20根據在使脈衝雷射光束射入基板40的時點的相對於可加工範圍的原點的可動工作台31的位置及相對於可動工作台31的被加工點41的相對位置資訊，計算相對於可加工範圍的原點的被加工點41的相對位置。根據該計算結果，控制裝置20控制光束掃描器16A，藉此能夠向要加工的被加工點41射入脈衝雷射光束。另外，在脈衝雷射光束的1個脈衝進行射入之期間中，基板40亦進行移動。因此，控制裝置20在1個脈衝的射入期間中，亦根據被加工點41的位置變化控制光束掃描器16A而移動脈衝雷射光束的入射位置。In the moving processing, the movable table 31 and the substrate 40 move with respect to the origin of the processing range. The control device 20 calculates based on the position of the movable table 31 with respect to the origin of the processing range at the time when the pulsed laser beam is incident on the substrate 40 and the relative position information of the processed point 41 with respect to the movable table 31 The relative position of the processed point 41 with respect to the origin of the processable range. Based on the calculation result, the control device 20 controls the beam scanner 16A, thereby being able to inject a pulsed laser beam to the processed point 41 to be processed. In addition, during the period in which one pulse of the pulsed laser beam is incident, the substrate 40 also moves. Therefore, the control device 20 also controls the beam scanner 16A to move the incident position of the pulsed laser beam in accordance with the change in the position of the processed point 41 during the incident period of one pulse.

如上所述，在移動加工中，控制裝置20考慮藉由移動機構30進行的基板40的移動，決定基於光束掃描器16A的脈衝雷射光束的入射位置。在決定脈衝雷射光束的入射位置時考慮基板40的移動之控制可稱為使基板40的移動與脈衝雷射光束的掃描同步的控制。移動加工中，對1個掃描區域45進行1次掃描量的加工。As described above, in the moving process, the control device 20 considers the movement of the substrate 40 by the moving mechanism 30 to determine the incident position of the pulsed laser beam by the beam scanner 16A. The control that considers the movement of the substrate 40 when determining the incident position of the pulsed laser beam can be referred to as control that synchronizes the movement of the substrate 40 with the scanning of the pulsed laser beam. During the movement processing, one scan area 45 is processed for one scan.

若接著要加工的未加工的掃描區域45移動至可加工範圍，則控制裝置20使基板40的移動停止(步驟S3)。在使基板40的移動停止之後，控制裝置20在使基板40靜止之狀態下，從雷射振盪器11輸出脈衝雷射光束，並控制光束掃描器16A掃描脈衝雷射光束，藉此進行配置於可加工範圍的掃描區域45內的複數個被加工點41的加工(步驟S4)。本說明書中，將在使基板40靜止之狀態下進行的加工稱為“靜止加工”。關於靜止加工時的複數個被加工點41的加工順序，例如使用解開巡迴推銷員問題的算法，以使脈衝雷射光束的入射位置的移動距離變最短的方式確定。If the unprocessed scan area 45 to be processed next moves to the processable range, the control device 20 stops the movement of the substrate 40 (step S3). After stopping the movement of the substrate 40, the control device 20 outputs a pulsed laser beam from the laser oscillator 11 in a state where the substrate 40 is stationary, and controls the beam scanner 16A to scan the pulsed laser beam, thereby being arranged in A plurality of processed points 41 in the scan area 45 of the processing range are processed (step S4). In this specification, processing performed in a state where the substrate 40 is stationary is referred to as "stationary processing". Regarding the processing order of the plurality of processed points 41 during stationary processing, for example, an algorithm that solves the traveling salesman problem is used to determine the movement distance of the incident position of the pulse laser beam to be the shortest.

控制裝置20重複步驟S1至步驟S4為止的順序至所有掃描區域45的加工結束(步驟S5)。The control device 20 repeats the sequence from step S1 to step S4 until the processing of all the scan areas 45 is completed (step S5).

接著，參照圖4A～圖4D對移動加工中被加工的被加工點41的順序進行說明。移動加工中的複數個被加工點41的加工順序與靜止加工時的加工順序不同。Next, the order of the processed point 41 to be processed in the movement processing will be described with reference to FIGS. 4A to 4D. The processing sequence of the plural to-be-processed points 41 in the moving processing is different from the processing sequence in the stationary processing.

圖4A～圖4D係表示移動加工的開始時點至結束時點為止的可加工範圍46與掃描區域45A、45B的相對位置關係的圖。如圖4A所示，1個掃描區域45A配置於可加工範圍46內，接著要加工的未加工的掃描區域45B配置於可加工範圍46的外側。若配置於可加工範圍46的掃描區域45A的加工結束，則開始移動加工。另外，在進行加工順序為第1的掃描區域45的移動加工時，在可加工範圍46內配置了哪一個掃描區域45是不確定的。此時，在基板40的對準結束之後，開始加工順序為第1的掃描區域45的移動加工。4A to 4D are diagrams showing the relative positional relationship between the machinable range 46 and the scan areas 45A and 45B from the start point to the end point of the movement process. As shown in FIG. 4A, one scanning area 45A is arranged in the machinable range 46, and the unprocessed scanning area 45B to be processed next is arranged outside the machinable range 46. When the processing of the scanning area 45A arranged in the machinable range 46 is completed, the movement processing is started. In addition, when performing the movement processing of the scanning area 45 whose processing order is the first, it is uncertain which scanning area 45 is arranged in the workable range 46. At this time, after the alignment of the substrate 40 is completed, the movement processing of the scanning area 45 whose processing order is the first is started.

如圖4B所示，控制裝置20使可加工範圍46向接著要加工的掃描區域45B進行相對移動。另外，實際上可加工範圍46被固定，藉由使基板40(圖2A)向可加工範圍46移動，使掃描區域45B向可加工範圍46移動。圖4B中，用虛線表示移動前的可加工範圍的位置。As shown in FIG. 4B, the control device 20 relatively moves the machinable range 46 to the scanning area 45B to be processed next. In addition, the machinable range 46 is actually fixed, and by moving the substrate 40 (FIG. 2A) to the machinable range 46, the scanning area 45B is moved to the machinable range 46. In FIG. 4B, the position of the workable range before the movement is indicated by a dotted line.

若從移動開始經過一定時間，則接著要加工的掃描區域45B的一部分區域與可加工範圍46重疊。控制裝置20依序向掃描區域45B內的複數個被加工點41中與可加工範圍46重疊的區域的被加工點41射入脈衝雷射光束。若時間進一步流逝，則如圖4C及圖4D所示，隨著時間的流逝與可加工範圍46重疊的掃描區域45B內的區域擴大。控制裝置20依序向掃描區域45B內的複數個被加工點41中新進入到可加工範圍46的被加工點41射入脈衝雷射光束。圖4C及圖4D中，用實心的黑圓點記號表示已加工的被加工點41，並用空心的圓點記號表示新進入到可加工範圍46的被加工點41。If a certain period of time has passed from the start of the movement, a part of the scanning area 45B to be processed next overlaps with the machinable range 46. The control device 20 sequentially injects a pulsed laser beam to the processed point 41 in the area overlapping the processable range 46 among the plurality of processed points 41 in the scanning area 45B. If time further elapses, as shown in FIGS. 4C and 4D, the area in the scan area 45B overlapping with the machinable range 46 expands with the elapse of time. The control device 20 sequentially injects a pulsed laser beam into the processed point 41 of the plurality of processed points 41 in the scanning area 45B that has newly entered the processable range 46. In FIGS. 4C and 4D, the processed point 41 that has been processed is represented by a solid black dot mark, and the processed point 41 that has newly entered the processable range 46 is represented by a hollow dot mark.

新進入到可加工範圍46的複數個被加工點41的檢測例如以一定的時間刻度寬進行。或者，亦可以設為當前時間點在可加工範圍46內被檢測的所有被加工點41的加工結束之後，檢測新進入的複數個被加工點41。The detection of the plurality of processed points 41 newly entering the processable range 46 is performed, for example, with a certain time scale width. Alternatively, it can also be set that after the processing of all the processed points 41 detected within the processable range 46 at the current time point is completed, a plurality of newly entered processed points 41 are detected.

接著，參照圖5A對採用基於本實施例的雷射加工方法時的基板移動與雷射加工的時間關係進行說明。Next, the time relationship between the movement of the substrate and the laser processing when the laser processing method based on this embodiment is used will be described with reference to FIG. 5A.

圖5A係表示採用基於本實施例的雷射加工方法時的基板移動與雷射加工的時間關係的時序圖。圖5A所示的例中，在1個掃描區域45中，以第1加工條件(第1循環)進行1次掃描，以第2加工條件(第2循環)進行2次掃描。FIG. 5A is a timing chart showing the time relationship between substrate movement and laser processing when the laser processing method based on this embodiment is used. In the example shown in FIG. 5A, in one scan area 45, one scan is performed under the first processing condition (first cycle), and two scans are performed under the second processing condition (second cycle).

在一邊進行基板40(圖2A)的移動，一邊進行第i掃描區域45(i)的第1循環的第1次掃描時，進行掃描區域45(i)的移動加工。該1次掃描所需的時間與基板40的移動時間幾乎相等。第2循環中的第1次及第2次掃描係在使基板40靜止之狀態下進行。若對掃描區域45(i)的第2循環的2次掃描結束，則對接著要加工的掃描區域45(i+1)進行移動加工。When the first scan of the first cycle of the i-th scan area 45(i) is performed while the substrate 40 (FIG. 2A) is being moved, the movement processing of the scan area 45(i) is performed. The time required for this one scan is almost equal to the movement time of the substrate 40. The first and second scans in the second cycle are performed in a state where the substrate 40 is stationary. When the second scan of the second cycle of the scanning area 45(i) ends, the scanning area 45(i+1) to be processed next is moved and processed.

在掃描區域45(i)及掃描區域45(i+1)中，被加工點41的個數或分布不同時，掃描區域45(i)的第1循環的第1次掃描所需的時間與掃描區域45(i+1)的第1循環的第1次掃描所需的時間不同。控制裝置20根據移動加工中進行的1次掃描所需的時間而改變基板40的移動開始至結束為止的時間。例如，藉由調整基板40的移動速度，將基板40的移動開始至結束為止的時間設為與移動加工中進行的1次掃描所需的時間幾乎相等。When the number or distribution of the processed points 41 are different in the scanning area 45(i) and the scanning area 45(i+1), the time required for the first scan of the first cycle of the scanning area 45(i) is the same as The time required for the first scan of the first cycle of the scan area 45(i+1) is different. The control device 20 changes the time from the start to the end of the movement of the substrate 40 in accordance with the time required for one scan performed in the movement processing. For example, by adjusting the moving speed of the substrate 40, the time from the start to the end of the movement of the substrate 40 is made almost equal to the time required for one scan in the moving process.

接著，對上述實施例的優異的效果進行說明。在上述實施例中，除以分步重複方式採用的靜止加工之外，還在基板40的移動時進行加工(移動加工)。因此，能夠縮短加工時間。又，在未分布被加工點41的區域不配置掃描區域45。因此，未配置被加工點41的區域與藉由能夠以一定速度加工的範圍46(圖4A～圖4D)時相比，亦能夠縮短加工時間。Next, the excellent effects of the above-mentioned embodiment will be described. In the above-described embodiment, in addition to the stationary processing adopted in the step-and-repeat manner, processing (moving processing) is also performed when the substrate 40 is moved. Therefore, the processing time can be shortened. In addition, the scanning area 45 is not arranged in an area where the processed points 41 are not distributed. Therefore, the area where the processed point 41 is not arranged can also shorten the processing time compared to the range 46 (FIG. 4A to FIG. 4D) that can be processed at a constant speed.

接著，參照圖5B及圖5C對上述實施例的變形例進行說明。圖5B及圖5C係表示基於變形例的油墨塗佈方法中的基板移動與雷射加工的時間關係的時序圖。Next, a modification of the above-mentioned embodiment will be described with reference to FIGS. 5B and 5C. 5B and 5C are timing charts showing the time relationship between the movement of the substrate and the laser processing in the ink application method based on the modification.

圖5B所示的變形例中，對所有掃描區域45將基板40的移動速度設為相同。例如與複數個掃描區域45各自的1次掃描所需的時間中最短的時間對應地設定該移動速度。例如，與掃描區域45(i)的1次掃描所需的時間對應地設定基板40的移動速度。此時，在除掃描區域45(i)以外的掃描區域45(i+1)等中，基板40的移動時間比1次掃描所需的時間短。其結果，即使基板40的移動結束，移動加工中的掃描亦不會結束。此時，在基板40的移動結束的時間點以後的期間T，在使基板40靜止之狀態下加工未加工的被加工點41。In the modified example shown in FIG. 5B, the moving speed of the substrate 40 is set to be the same for all the scanning areas 45. For example, the moving speed is set corresponding to the shortest time required for one scan of each of the plurality of scan areas 45. For example, the moving speed of the substrate 40 is set in accordance with the time required for one scan of the scanning area 45(i). At this time, in the scanning area 45(i+1) etc. other than the scanning area 45(i), the movement time of the substrate 40 is shorter than the time required for one scan. As a result, even if the movement of the substrate 40 ends, the scanning during the movement processing will not end. At this time, in the period T after the time point when the movement of the substrate 40 ends, the unprocessed point 41 to be processed is processed while the substrate 40 is stationary.

圖5C所示的變形例中，在藉由複數次掃描加工1個掃描區域45時，在最後的掃描中適用移動加工。例如，在掃描區域45(i-1)及45(i)的加工中，在第2循環的第2次掃描中採用移動加工。如此，關於移動加工，只要在開始移動前進行了靜止加工的掃描區域45或在移動後進行靜止加工的掃描區域45中至少1個掃描區域移動雷射光束的入射位置而進行加工即可。In the modified example shown in FIG. 5C, when one scan area 45 is processed by multiple scans, the movement processing is applied to the last scan. For example, in the processing of the scan areas 45(i-1) and 45(i), the movement processing is adopted in the second scan of the second cycle. In this way, as for the moving processing, at least one of the scanning area 45 subjected to the static processing before the start of the movement or the scanning area 45 subjected to the static processing after the movement may be processed by moving the incident position of the laser beam.

接著，對上述實施例的其他變形例進行說明。圖5A～圖5C中，對1個掃描區域45以第1循環的條件進行1次掃描、以第2循環的條件進行2次掃描，但是在對1個掃描區域45進行至少2次掃描時能夠適用上述實施例。例如，可以在掃描區域45的靜止加工中分別進行至少1次掃描，在移動加工中分別進行1次掃描。Next, other modified examples of the above-mentioned embodiment will be described. In FIGS. 5A to 5C, one scan area 45 is scanned once under the conditions of the first cycle and two scans are performed under the conditions of the second cycle. However, it is possible to scan one scan area 45 at least two times. The above embodiments apply. For example, each scan may be performed at least once in the static processing of the scanning area 45, and each scan may be performed once in the moving processing.

在上述實施例中，在進行加工順序為第1的掃描區域45的加工時的第1次掃描中適用了移動加工，但對於加工順序為第1的掃描區域45，可以在所有掃描中適用靜止加工。只要在加工順序為第2以後的每個掃描區域45的第1次掃描中適用移動加工即可。In the above embodiment, moving processing is applied in the first scan when processing the scanning area 45 with the first processing order. However, for the scanning area 45 with the first processing order, stationary can be applied to all scans. Processing. It is only necessary to apply the movement processing to the first scan of each scan area 45 in the processing order of the second and subsequent times.

在上述實施例中，在1次掃描中向複數個被加工點41(圖2A、圖2B)分別射入1次雷射光束，但亦可以向複數個被加工點41分別射入複數次雷射光束，例如2次或3次。此時，在向1個被加工點41射入複數發雷射脈衝的期間，不掃描雷射光束而使光束路徑固定。如此，只要在1次掃描中向複數個被加工點41(圖2A、圖2B)分別射入至少1次雷射光束即可。In the above-mentioned embodiment, a laser beam is injected into a plurality of processed points 41 (FIG. 2A, FIG. 2B) in one scan, but it is also possible to inject a plurality of laser beams into a plurality of processed points 41, respectively. Shoot the beam, for example, 2 or 3 times. At this time, while a plurality of laser pulses are incident on one point 41 to be processed, the laser beam is not scanned and the beam path is fixed. In this way, it is only necessary to inject the laser beams into the plurality of processed points 41 (FIG. 2A and FIG. 2B) at least once in one scan.

上述實施例及變形例只是例示，能夠進行實施例及變形例中所示的構造的一部分替換或組合是理所當然的。針對實施例及變形例的相同的構造帶來的相同的作用效果並不按每個實施例及變形例逐一提及。而且，本發明並不限於上述實施例及變形例。例如，可進行各種變更、改善、組合等對於本領域的技術人員來說是顯而易見的。The above-mentioned embodiments and modification examples are merely examples, and it is of course possible that part of the configurations shown in the embodiments and modification examples can be replaced or combined. The same action and effect brought about by the same structure of the embodiment and the modification are not mentioned for each embodiment and the modification. Furthermore, the present invention is not limited to the above-mentioned embodiments and modifications. For example, it is obvious to those skilled in the art that various changes, improvements, combinations, etc. can be made.

10:雷射光學系統 11:雷射振盪器 12:導光光學系統 13:孔徑 14:聲光元件(AOD) 15A:第1路徑 15B:第2路徑 16A,16B:光束掃描器 17A,17B:聚光透鏡 18:折返鏡 19:光束阻尼器 20:控制裝置 30:移動機構 31:可動工作台 40:基板 41:被加工點 42:對準標記 45:掃描區域 45A:已加工的掃描區域 45B:接著要加工的未加工的掃描區域 46:可加工範圍10: Laser optical system 11: Laser oscillator 12: Light guide optical system 13: Aperture 14: Acousto-optic components (AOD) 15A: 1st path 15B: 2nd path 16A, 16B: beam scanner 17A, 17B: Condenser lens 18: Folding mirror 19: beam damper 20: control device 30: mobile agency 31: Movable table 40: substrate 41: processed point 42: Alignment mark 45: Scanning area 45A: Processed scanning area 45B: Unprocessed scanning area to be processed next 46: Machinable range

[圖1]係基於實施例的雷射加工裝置的概略圖。 [圖2]中，圖2A係表示在基板表面定義的複數個被加工點的分布的一例的圖，圖2B係表示複數個被加工點的加工順序的一例的圖。 [圖3]係表示基於實施例的雷射加工方法的順序的流程圖。 [圖4]中，圖4A～圖4D係表示移動加工的開始時間點至結束時間點為止的可加工範圍與掃描區域的相對位置關係的圖。 [圖5]中，圖5A係表示採用基於本實施例的雷射加工方法時的基板移動與雷射加工的時間關係的時序圖，圖5B及圖5C係表示採用基於變形例的雷射加工方法時的基板移動與雷射加工的時間關係的時序圖。[Fig. 1] A schematic diagram of a laser processing apparatus based on an embodiment. In [FIG. 2], FIG. 2A is a diagram showing an example of the distribution of a plurality of processed points defined on the surface of a substrate, and FIG. 2B is a diagram showing an example of a processing sequence of a plurality of processed points. Fig. 3 is a flowchart showing the procedure of the laser processing method based on the embodiment. In [FIG. 4], FIGS. 4A to 4D are diagrams showing the relative positional relationship between the workable range and the scanning area from the start time point to the end time point of the movement processing. In [FIG. 5], FIG. 5A shows a timing chart of the time relationship between substrate movement and laser processing when the laser processing method based on this embodiment is used, and FIG. 5B and FIG. 5C show the laser processing based on a modified example. The timing chart of the time relationship between substrate movement and laser processing during the method.

Claims

一種控制裝置，其係控制基於被光束掃描器掃描之雷射光束的加工，前述控制裝置，具有：藉由在固定前述光束掃描器與基板的相對位置之狀態下掃描雷射光束,在前述基板表面的一部分區域移動雷射光束的入射位置而進行靜止加工之功能；向前述光束掃描器移動前述基板而使得能夠向前述基板表面的接著要加工的區域射入雷射光束之功能；及藉由在向前述光束掃描器移動前述基板的期間掃描雷射光束，在開始移動前進行了前述靜止加工的區域或移動後進行前述靜止加工的區域中的至少1個區域移動雷射光束的入射位置而進行移動加工之功能。A control device that controls processing based on a laser beam scanned by a beam scanner. The aforementioned control device has: By scanning the laser beam with the relative position of the beam scanner and the substrate fixed, moving the incident position of the laser beam on a part of the surface of the substrate to perform static processing; The function of moving the substrate to the beam scanner so that the laser beam can be injected into the area to be processed next on the surface of the substrate; and By scanning the laser beam while moving the substrate to the beam scanner, at least one of the area where the static processing is performed before starting the movement or the area where the static processing is performed after the movement moves the incidence of the laser beam Position and move processing function.

如請求項1記載之控制裝置，其中前述控制裝置中儲存有前述基板表面上之要形成孔的複數個被加工點的位置，在前述靜止加工及前述移動加工中，依序向前述複數個被加工點射入雷射光束進行鑽孔加工。Such as the control device described in claim 1, where The control device stores the positions of a plurality of processed points on the surface of the substrate where holes are to be formed, In the aforementioned stationary processing and the aforementioned moving processing, a laser beam is sequentially injected into the plurality of processed points to perform drilling processing.

如請求項2記載之控制裝置，其中在將前述基板表面中藉由1次前述靜止加工進行加工的範圍定義為掃描區域時，對每個掃描區域執行複數次如下掃描：依序向1個掃描區域中所包含的前述複數個被加工點分別射入至少1次雷射光束，在前述靜止加工中分別進行至少1次掃描，並在前述移動加工中分別進行1次掃描。Such as the control device described in claim 2, where When the range of the substrate surface that is processed by the one-time static processing is defined as the scanning area, Perform multiple scans for each scanning area as follows: sequentially inject a laser beam at least once to the aforementioned multiple processed points contained in one scanning area, respectively, Each scan is performed at least once in the aforementioned static processing, and each scan is performed once in the aforementioned moving processing.

如請求項3記載之控制裝置，其中根據在前述移動加工中進行的1次掃描所需的時間改變相對於前述光束掃描器的前述基板的移動開始至結束為止的時間。Such as the control device described in claim 3, where The time from the start to the end of the movement of the substrate with respect to the beam scanner is changed according to the time required for one scan performed in the movement processing.

一種雷射加工裝置，其係具有：光束掃描器，掃描雷射光束；移動機構，在被前述光束掃描器掃描之雷射光束所射入之位置向前述光束掃描器移動基板；及控制裝置，控制前述光束掃描器及前述移動機構，前述控制裝置，具有：藉由在固定前述光束掃描器與前述基板的相對位置之狀態下掃描雷射光束,在前述基板表面的一部分區域移動雷射光束的入射位置而進行靜止加工之功能；向前述光束掃描器移動前述基板而使得能夠向前述基板表面的接著要加工的區域射入雷射光束之功能；及藉由在向前述光束掃描器移動前述基板的期間使前述光束掃描器進行動作，在開始移動前進行了前述靜止加工的區域或移動後進行前述靜止加工的區域中的至少1個區域移動雷射光束的入射位置而進行移動加工之功能。A laser processing device, which has: Beam scanner, scanning the laser beam; The moving mechanism moves the substrate toward the beam scanner at the position where the laser beam scanned by the beam scanner is incident; and The control device controls the aforementioned beam scanner and the aforementioned moving mechanism, The aforementioned control device has: By scanning the laser beam with the relative position of the beam scanner and the substrate fixed, moving the incident position of the laser beam on a part of the surface of the substrate to perform static processing; The function of moving the substrate to the beam scanner so that the laser beam can be injected into the area to be processed next on the surface of the substrate; and By operating the beam scanner while the substrate is being moved to the beam scanner, at least one of the area where the static processing is performed before the start of the movement or the area where the static processing is performed after the movement is moved. The function of moving and processing the incident position of the beam.

如請求項5記載之雷射加工裝置，其中前述控制裝置中儲存有前述基板表面上之要形成孔的複數個被加工點的位置，前述控制裝置在前述靜止加工及前述移動加工中，依序向前述複數個被加工點入射雷射光束而進行鑽孔加工。Such as the laser processing device described in claim 5, where The control device stores the positions of a plurality of processed points on the surface of the substrate where holes are to be formed, In the stationary processing and the moving processing, the control device sequentially enters the laser beams on the plurality of processed points to perform drilling processing.

如請求項6記載之雷射加工裝置，其中將前述基板表面中藉由1次前述靜止加工進行加工的範圍定義為掃描區域，在前述控制裝置中，對每個掃描區域執行複數次如下掃描：依序向1個掃描區域中所包含的前述複數個被加工點分別射入至少1次雷射光束，在前述靜止加工中分別進行至少1次掃描，並在前述移動加工中分別進行1次掃描。Such as the laser processing device described in claim 6, where Define the range of the substrate surface that is processed by the one-time static processing as the scanning area, In the aforementioned control device, Perform multiple scans for each scanning area as follows: sequentially inject a laser beam at least once to the aforementioned multiple processed points contained in one scanning area, respectively, Each scan is performed at least once in the aforementioned static processing, and each scan is performed once in the aforementioned moving processing.

如請求項7記載之雷射加工裝置，其中前述控制裝置根據在前述移動加工中進行的1次掃描所需的時間改變相對於前述光束掃描器的前述基板的移動開始至結束為止的時間。Such as the laser processing device described in claim 7, where The control device changes the time from the start to the end of the movement of the substrate with respect to the beam scanner in accordance with the time required for one scan performed in the movement processing.

一種雷射加工方法，其係交替地執行如下製程：藉由在相對於掃描雷射光束的光束掃描器固定基板的位置之狀態下，利用前述光束掃描器掃描雷射光束並向前述基板射入雷射光束來進行靜止加工；及藉由一邊向前述光束掃描器相對移動前述基板，一邊利用前述光束掃描器掃描雷射光束並向前述基板射入雷射光束來進行移動加工。A laser processing method, which alternately executes the following processes: By using the beam scanner to scan the laser beam and inject the laser beam onto the substrate to perform static processing while fixing the position of the substrate relative to the beam scanner that scans the laser beam; and While the substrate is relatively moved to the beam scanner, the laser beam is scanned by the beam scanner and the laser beam is incident on the substrate to perform movement processing.

如請求項9記載之雷射加工方法，其中在前述基板表面定義要形成孔的複數個被加工點的位置，在前述靜止加工及前述移動加工中，依序向前述複數個被加工點射入雷射光束進行鑽孔加工。Such as the laser processing method described in claim 9, where Define the positions of a plurality of processed points to be formed holes on the surface of the aforementioned substrate, In the aforementioned stationary processing and the aforementioned moving processing, a laser beam is sequentially injected into the plurality of processed points to perform drilling processing.

如請求項10記載之雷射加工方法，其中在將前述基板表面中藉由1次前述靜止加工進行加工的範圍定義為掃描區域時，對每個掃描區域執行複數次如下掃描：依序向1個掃描區域中所包含的前述複數個被加工點分別射入至少1次雷射光束，在前述靜止加工中分別進行至少1次掃描，並在前述移動加工中分別進行1次掃描。Such as the laser processing method described in claim 10, where When the range of the substrate surface that is processed by the one-time static processing is defined as the scanning area, Perform multiple scans for each scanning area as follows: sequentially inject a laser beam at least once to the aforementioned multiple processed points contained in one scanning area, respectively, Each scan is performed at least once in the aforementioned static processing, and each scan is performed once in the aforementioned moving processing.

如請求項11記載之雷射加工方法，其中在向前述光束掃描器移動前述基板時的移動開始至結束為止的時間根據前述移動加工中進行的1次掃描所需的時間而不同。Such as the laser processing method described in claim 11, where The time from the start to the end of the movement when the substrate is moved to the beam scanner differs depending on the time required for one scan in the movement processing.