TWI784164B - Processing method and processing device - Google Patents

Processing method and processing device Download PDF

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TWI784164B
TWI784164B TW108115006A TW108115006A TWI784164B TW I784164 B TWI784164 B TW I784164B TW 108115006 A TW108115006 A TW 108115006A TW 108115006 A TW108115006 A TW 108115006A TW I784164 B TWI784164 B TW I784164B
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processed
substrate
aforementioned
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processing
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TW202000350A (en
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山口友之
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日商住友重機械工業股份有限公司
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B23K26/0608—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams in the same heat affected zone [HAZ]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laser Beam Processing (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)

Abstract

本發明提供一種能夠減小預定之被加工點的位置與實際加工之位置之間的偏差的加工方法。 基板的被加工面被區分成複數個單位區域，對應於單位區域各個設置有對準標記。在單位區域的內部定義有複數個被加工點的位置。當進行單位區域各個的內部的前述被加工點的加工時，單位區域的加工之每一個，是檢測對應於接下來待加工的單位區域之對準標記的位置，根據檢測結果進行被加工點的加工。The present invention provides a machining method capable of reducing the deviation between a predetermined position of a machined point and an actual machined position. The surface to be processed of the substrate is divided into a plurality of unit areas, and alignment marks are respectively provided corresponding to the unit areas. Inside the unit area, a plurality of positions to be processed are defined. When performing the processing of the aforementioned processed points inside each unit area, each of the processing of the unit area is to detect the position of the alignment mark corresponding to the next unit area to be processed, and perform the processing of the processed point according to the detection result. processing.

Description

加工方法及加工裝置Processing method and processing device

本申請主張基於2018年6月11日申請之日本專利申請第2018-111015號的優先權。該日本申請的全部內容藉由參閱援用於本說明書中。 本發明係有關一種加工方法及加工裝置。This application claims priority based on Japanese Patent Application No. 2018-111015 filed on June 11, 2018. The entire content of this Japanese application is incorporated in this specification by reference. The invention relates to a processing method and a processing device.

以往，使用雷射光束對基板進行鑽孔加工時，在加工前是對每個基板測定形成於規定位置之對準標記的位置(專利文獻1)。根據對準標記的位置的測定結果檢測基板的位置，將雷射光束入射到預定之被加工點。藉此，以對準標記為基準，能夠進行預定位置之被加工點的雷射加工、例如鑽孔加工。 [先前技術文獻] [專利文獻]Conventionally, when drilling a substrate using a laser beam, the position of an alignment mark formed at a predetermined position is measured for each substrate before processing (Patent Document 1). The position of the substrate is detected based on the measurement result of the position of the alignment mark, and the laser beam is incident on a predetermined point to be processed. Thereby, laser processing, for example, drilling processing, can be performed on a point to be processed at a predetermined position using the alignment mark as a reference. [Prior Art Literature] [Patent Document]

專利文獻1：國際公開第2013/114593號Patent Document 1: International Publication No. 2013/114593

[發明所欲解決之問題][Problem to be solved by the invention]

依本申請的發明人之評價實驗得知，即使準確地檢測(測定)對準標記的位置，根據檢測結果將雷射光束入射到被加工點，實際上藉由雷射光束的入射而加工後之點仍可能會偏離作為目標之被加工點。本發明的目的在於，提供一種能夠減小預定之被加工點的位置與實際加工之位置之間的偏差之加工方法及加工裝置。 [解決問題之技術手段]According to the evaluation experiment conducted by the inventors of the present application, even if the position of the alignment mark is accurately detected (measured), and the laser beam is incident on the point to be processed according to the detection result, it is actually processed by the incident laser beam. The point may still deviate from the target point to be processed. An object of the present invention is to provide a machining method and a machining apparatus capable of reducing the deviation between a predetermined position of a machined point and an actual machined position. [Technical means to solve the problem]

依本發明的一個觀點，提供一種加工方法，其包括以下製程：進行基板之複數個單位區域各個的內部的被加工點的加工，前述基板之被加工面被區分成複數個前述單位區域，對應於前述單位區域各個設置有對準標記，在前述單位區域的內部定義有複數個被加工點的位置， 前述單位區域的加工之每一個，是檢測對應於接下來待加工的前述單位區域之前述對準標記的位置，根據檢測結果進行前述被加工點的加工。According to one aspect of the present invention, a processing method is provided, which includes the following process: processing the processed points inside each of the plurality of unit areas of the substrate, the processed surface of the substrate is divided into a plurality of the aforementioned unit areas, corresponding to Each of the aforementioned unit areas is provided with an alignment mark, and the positions of a plurality of processed points are defined inside the aforementioned unit area, Each of the processing of the aforementioned unit area is to detect the position of the aforementioned alignment mark corresponding to the aforementioned unit area to be processed next, and to process the aforementioned processed point according to the detection result.

依本發明的其他觀點，提供一種加工裝置，其具有： 雷射光源，輸出雷射光束； 光束掃描器，將從前述雷射光源輸出之雷射光束入射到基板的表面，並且使入射位置在前述基板的表面上移動； 感測器，偵知設置於前述基板上之對準標記；以及 控制裝置，被加工面被區分成複數個單位區域，並且儲存有前述被加工面的複數個被加工點的位置，前述單位區域的加工之每一個，是依據前述感測器的偵知結果檢測與接下來待加工的前述單位區域對應之前述對準標記的位置，根據檢測結果控制前述光束掃描器而使雷射光束依序入射到前述被加工點。According to other aspects of the present invention, a processing device is provided, which has: Laser light source, output laser beam; a beam scanner, incident on the surface of the substrate with the laser beam output from the aforementioned laser light source, and moving the incident position on the surface of the aforementioned substrate; a sensor for detecting the alignment mark provided on the aforementioned substrate; and In the control device, the surface to be processed is divided into a plurality of unit areas, and the positions of the plurality of processed points on the surface to be processed are stored. Each of the processing of the aforementioned unit areas is detected based on the detection results of the aforementioned sensors. The position of the alignment mark corresponding to the unit area to be processed next is controlled according to the detection result by controlling the beam scanner so that the laser beam is sequentially incident on the points to be processed.

依本發明的另一觀點，提供一種加工方法，其交替重複複數次以下製程： 檢測基板的至少一部分的對準標記的位置，在前述基板設置有複數個前述對準標記且定義有待加工的複數個被加工點的位置， 根據前述對準標記的位置的檢測結果，依序進行前述複數個被加工點中之一部分的被加工點的加工。According to another aspect of the present invention, a processing method is provided, which alternately repeats the following processes for multiple times: detecting the position of the alignment mark of at least a part of the substrate, where the aforementioned substrate is provided with a plurality of the aforementioned alignment marks and defines a plurality of processed points to be processed, According to the detection result of the position of the said alignment mark, the processing of some to-be-processed points among the said several to-be-processed points is performed sequentially.

依本發明的另一觀點，提供一種加工裝置，其具有： 雷射光源，輸出雷射光束； 光束掃描器，將從前述雷射光源輸出之雷射光束入射到基板的被加工面，並且使入射位置在前述基板的表面上移動； 感測器，偵知設置於前述基板上之複數個對準標記各個；以及 控制裝置，儲存前述被加工面的複數個被加工點的位置，根據前述感測器的偵知結果控制前述雷射光源及前述光束掃描器， 前述控制裝置交替重複複數次以下處理： 根據前述感測器的偵知結果檢測至少一部分的前述對準標記的位置， 根據前述對準標記的位置的檢測結果控制前述雷射光源及前述光束掃描器，依序進行前述複數個被加工點中之一部分的被加工點的加工。 [發明之效果]According to another aspect of the present invention, a processing device is provided, which has: Laser light source, output laser beam; a beam scanner, which injects the laser beam output from the aforementioned laser light source onto the processed surface of the substrate, and moves the incident position on the surface of the aforementioned substrate; a sensor for detecting each of the plurality of alignment marks disposed on the aforementioned substrate; and The control device stores the positions of the plurality of processed points on the processed surface, controls the laser light source and the beam scanner according to the detection results of the sensors, The aforementioned control device alternately repeats the following processing multiple times: detecting the position of at least a part of the alignment mark according to the detection result of the aforementioned sensor, The laser light source and the beam scanner are controlled according to the detection result of the position of the alignment mark to sequentially process one part of the plurality of processed points. [Effect of Invention]

能夠減小預定之被加工點的位置與實際加工之位置之間的偏差。The deviation between the predetermined position of the processed point and the actual processed position can be reduced.

參閱圖1～圖3，對基於實施例之加工方法及加工裝置進行說明。 圖1係基於實施例之雷射加工裝置的概要圖。雷射光源10輸出脈衝雷射光束。作為雷射光源10，例如能夠使用二氧化碳雷射振盪器。從雷射光源10輸出之脈衝雷射光束經由聲光元件(AOM)11、反射鏡12、光束掃描器13及聚光透鏡14入射到保持於載台17之加工對象的基板30。Referring to FIGS. 1 to 3 , the processing method and processing device based on the embodiment will be described. FIG. 1 is a schematic diagram of a laser processing device based on an embodiment. The laser light source 10 outputs pulsed laser beams. As the laser light source 10, for example, a carbon dioxide laser oscillator can be used. The pulsed laser beam output from the laser light source 10 enters the substrate 30 to be processed held on the stage 17 through an acousto-optic device (AOM) 11 , a mirror 12 , a beam scanner 13 and a condenser lens 14 .

AOM11依據來自控制裝置20的指令，從雷射光源10所輸出之脈衝雷射光束的雷射脈衝截取用於加工之一部分。所截取之雷射脈衝朝向作為加工對象物之基板30，其餘的脈衝雷射光束入射到光束阻尼器15。According to the instructions from the control device 20 , the AOM 11 intercepts a part of the laser pulses of the pulsed laser beam output from the laser light source 10 for processing. The intercepted laser pulses are directed toward the substrate 30 which is the object to be processed, and the remaining pulsed laser beams enter the beam damper 15 .

光束掃描器13接收來自控制裝置20的指令，藉由沿二維方向掃描雷射光束，讓基板30的表面上的脈衝雷射光束的入射位置移動。作為光束掃描器13，例如能夠使用具有一對電流計鏡之電流計掃描器。The beam scanner 13 receives an instruction from the control device 20 to move the incident position of the pulsed laser beam on the surface of the substrate 30 by scanning the laser beam in a two-dimensional direction. As the beam scanner 13, for example, a galvanometer scanner having a pair of galvanometer mirrors can be used.

聚光透鏡14將藉由光束掃描器13掃描之脈衝雷射光束聚光到基板30的表面(被加工面)。作為聚光透鏡14，例如能夠使用fθ透鏡。The condensing lens 14 condenses the pulsed laser beam scanned by the beam scanner 13 onto the surface of the substrate 30 (surface to be processed). As the condenser lens 14, for example, an fθ lens can be used.

在載台17的上方配置有感測器16。感測器16偵知保持於載台17之基板30上所設置之對準標記。例如，作為感測器16是使用攝像裝置。攝像裝置拍攝基板30的被加工面，生成圖像資料。藉由攝像裝置生成之圖像資料被載入控制裝置20。A sensor 16 is arranged above the stage 17 . The sensor 16 detects the alignment marks provided on the substrate 30 held on the stage 17 . For example, an imaging device is used as the sensor 16 . The imaging device images the surface to be processed of the substrate 30 to generate image data. Image data generated by the camera device is loaded into the control device 20 .

載台17接收來自控制裝置20的指令，使基板30向平行於其被加工面之二維方向移動。作為載台17，例如能夠使用XY載台。移動基板30，將設置於基板30上之對準標記配置於感測器16的可偵知範圍內，使感測器16能夠偵知對準標記。The stage 17 receives an instruction from the control device 20 to move the substrate 30 in a two-dimensional direction parallel to the surface to be processed. As the stage 17, for example, an XY stage can be used. The substrate 30 is moved, and the alignment marks disposed on the substrate 30 are arranged within the detectable range of the sensor 16 , so that the sensor 16 can detect the alignment marks.

控制裝置20包括儲存裝置21。儲存裝置21中儲存有：定義於基板30的被加工面之複數個被加工點的位置。控制裝置20具有根據感測器16的偵知結果檢測設置於基板30上之對準標記的位置之功能。例如，控制裝置20藉由對從感測器16獲取之圖像資料進行圖像解析來檢測對準標記的位置。進而，控制裝置根據對準標記的位置的檢測結果，控制光束掃描器13以使雷射光束入射到被加工點。The control device 20 includes a storage device 21 . The storage device 21 stores the positions of a plurality of processed points defined on the processed surface of the substrate 30 . The control device 20 has a function of detecting the position of the alignment mark provided on the substrate 30 according to the detection result of the sensor 16 . For example, the control device 20 detects the position of the alignment mark by analyzing the image data obtained from the sensor 16 . Furthermore, the control device controls the beam scanner 13 so that the laser beam enters the point to be processed based on the detection result of the position of the alignment mark.

有時可根據需要，在從雷射光源10到基板30的脈衝雷射光束的光路中配置透鏡系統、光圈等。Sometimes, a lens system, an aperture, etc. may be arranged in the optical path of the pulsed laser beam from the laser light source 10 to the substrate 30 as required.

圖2係加工對象的基板30的俯視圖。基板30的被加工面被區分為複數個單位區域32。在此，所謂“區分”係指在進行加工時將單位區域32作為一個整體來處理，並不意味著外觀上能夠識別單位區域32。圖2中，作為一例，以2行3列的矩陣狀配置有6個單位區域32，示出每一個單位區域32的形狀為長方形之例子。作為其他例子，單位區域32的個數可以為不是6個。複數個單位區域32的配置可以不是矩陣狀。並且，每一個單位區域32的形狀可以不是長方形。FIG. 2 is a plan view of a substrate 30 to be processed. The surface to be processed of the substrate 30 is divided into a plurality of unit regions 32 . Here, "distinguishing" refers to treating the unit area 32 as a whole during processing, and does not mean that the unit area 32 can be identified externally. In FIG. 2 , as an example, six unit regions 32 are arranged in a matrix of 2 rows and 3 columns, and an example in which each unit region 32 has a rectangular shape is shown. As another example, the number of unit areas 32 may be other than six. The arrangement of the plurality of unit areas 32 does not need to be in a matrix. Also, the shape of each unit area 32 may not be a rectangle.

對應於單位區域32各個，在單位區域32的內部設置有複數個對準標記31。圖2中，作為一例，示出在每一個單位區域32的四個角的稍微內側分別配置有對準標記31之例子。對準標記31宜配置成，能夠界定以載台17作為基準之單位區域32的位置、及以垂直於被加工面之軸為中心之旋轉方向的姿勢。進而，宜配置成能夠測定單位區域32的應變。A plurality of alignment marks 31 are provided inside the unit area 32 corresponding to each unit area 32 . In FIG. 2 , as an example, an example in which alignment marks 31 are arranged slightly inside the four corners of each unit area 32 is shown. The alignment mark 31 is preferably disposed so as to be able to define the position of the unit area 32 with the stage 17 as a reference and the posture of the rotation direction centered on the axis perpendicular to the surface to be processed. Furthermore, it is preferable to arrange so that the strain of the unit area 32 can be measured.

在單位區域32各個的內部預先定義有複數個被加工點33的位置。定義複數個被加工點33的位置之資訊儲存於控制裝置20的儲存裝置21。在加工前，無法在外觀上識別被加工點33。The positions of a plurality of to-be-processed points 33 are defined in advance in each of the unit areas 32 . Information defining the positions of the plurality of processed points 33 is stored in the storage device 21 of the control device 20 . Before processing, the processed point 33 cannot be recognized externally.

圖3係基於本實施例之加工方法的流程圖。首先，控制裝置20檢測與接下來待加工的一個單位區域32(圖2)對應之對準標記31的位置(步驟SA1)。以下，對檢測對準標記31的位置之順序進行說明。控制裝置20控制載台17，使與接下來待加工的單位區域32對應之一個對準標記31移動到感測器16(圖1)的可偵知範圍內。控制裝置20進行由感測器16獲得之圖像資料的解析來檢測對準標記31的位置。同樣地檢測其餘的複數個對準標記31的位置。Fig. 3 is a flow chart of the processing method based on this embodiment. First, the control device 20 detects the position of the alignment mark 31 corresponding to one unit area 32 ( FIG. 2 ) to be processed next (step SA1 ). Hereinafter, the procedure for detecting the position of the alignment mark 31 will be described. The control device 20 controls the stage 17 to move an alignment mark 31 corresponding to a unit area 32 to be processed to within the detectable range of the sensor 16 ( FIG. 1 ). The control device 20 analyzes the image data obtained by the sensor 16 to detect the position of the alignment mark 31 . The positions of the remaining plurality of alignment marks 31 are detected similarly.

控制裝置20根據對準標記31的位置的檢測結果控制雷射光源10、AOM11及光束掃描器13。藉此，使雷射光束依序入射到與檢測有位置之對準標記31對應之單位區域32內的複數個被加工點33，進行單位區域32內的所有被加工點33的加工(步驟SA2)。The control device 20 controls the laser light source 10 , the AOM 11 and the beam scanner 13 according to the detection result of the position of the alignment mark 31 . In this way, the laser beam is sequentially incident on a plurality of processed points 33 in the unit area 32 corresponding to the detected alignment mark 31, and all the processed points 33 in the unit area 32 are processed (step SA2 ).

控制裝置20重複執行步驟SA1及步驟SA2，直到完成所有單位區域32內的所有被加工點33的加工(步驟SA3)。The control device 20 repeatedly executes step SA1 and step SA2 until the processing of all the points to be processed 33 in all the unit areas 32 is completed (step SA3 ).

接著，對本實施例的優異的效果進行說明。 依本申請發明人所進行之評價實驗判明了，若在基板30(圖2)的被加工點33藉由雷射光束的入射形成貫通孔，則在基板30上可能發生應變。尤其了解到，當基板30的厚度為0.04mm以下時，容易產生基板30變形之現象。以往，是在進行基板30的加工之前檢測對準標記31的位置，並根據其檢測結果進行所有單位區域32的加工。若隨著加工的進展在基板30發生應變，在發生應變之後進行加工之被加工點33中，待加工的本來的被加工點33的位置與雷射光束所入射之位置會偏離。在提出本申請時尚不知道這種現象。Next, the excellent effects of this embodiment will be described. According to evaluation experiments conducted by the inventors of the present application, it has been found that if a through hole is formed at the processed point 33 of the substrate 30 ( FIG. 2 ) by incident laser beams, strain may occur on the substrate 30 . In particular, it is understood that when the thickness of the substrate 30 is less than 0.04 mm, deformation of the substrate 30 is likely to occur. Conventionally, the positions of the alignment marks 31 are detected before processing the substrate 30, and all the unit regions 32 are processed based on the detection results. If the substrate 30 is strained as the processing progresses, the position of the original processed point 33 to be processed will deviate from the incident position of the laser beam in the processed point 33 processed after the strain has occurred. This phenomenon was not known at the time of filing the present application.

在本實施例中，單位區域32的加工之每一個，是在加工前檢測與接下來待加工的單位區域32對應之對準標記31的位置。即使因一個單位區域32的加工而在基板30發生應變，在即將進行接下來待加工的單位區域32的加工之前，檢測出發生應變之後的基板30的對準標記31的位置。由於根據該對準標記31的位置的檢測結果進行被加工點33的加工，因此能夠減輕基板30的應變的影響。其結果，能夠減小基板30的被加工面內的本來的被加工點33的位置與實際的加工位置的偏差。In this embodiment, each of the processing of the unit area 32 is to detect the position of the alignment mark 31 corresponding to the next unit area 32 to be processed before processing. Even if the substrate 30 is strained by processing one unit region 32 , the position of the alignment mark 31 on the substrate 30 after the strain is detected immediately before processing the next unit region 32 to be processed. Since the processing of the to-be-processed point 33 is performed based on the detection result of the position of the alignment mark 31, the influence of the strain of the board|substrate 30 can be alleviated. As a result, it is possible to reduce the deviation between the original position of the processed point 33 on the processed surface of the substrate 30 and the actual processed position.

接著，對用於減輕應變的影響的一例進行說明。例如，控制裝置20根據發生應變之後的基板30的對準標記31的位置的檢測結果獲取與基板30的應變相關之資訊(應變資訊)。控制裝置20根據基板30的應變資訊，將利用儲存於儲存裝置21之被加工點33的位置資訊所界定之位置修正，並將雷射光束入射到修正後的被加工點33的位置。藉此，能夠將雷射光束入射到待加工的本來的位置，能夠提高加工的位置精度。Next, an example for reducing the influence of strain will be described. For example, the control device 20 acquires information (strain information) related to the strain of the substrate 30 based on the detection result of the position of the alignment mark 31 of the substrate 30 after the strain has occurred. The control device 20 corrects the position defined by the position information of the processed point 33 stored in the storage device 21 according to the strain information of the substrate 30 , and injects the laser beam into the corrected position of the processed point 33 . Thereby, the laser beam can be incident on the original position to be processed, and the positional accuracy of processing can be improved.

尤其，當進行在基板30上形成貫通孔之加工時，若形成了貫通孔，真空夾頭的吸引力會降低，因此基板30上容易發生應變。並且，當基板30的厚度為0.04mm以下時，基板上容易發生應變。因此，當進行在厚度0.04mm以下的基板上形成貫通孔之加工時，可獲得本實施例的顯著的效果。In particular, when processing to form a through-hole on the substrate 30 , if the through-hole is formed, the suction force of the vacuum chuck is lowered, so that strain easily occurs on the substrate 30 . Also, when the thickness of the substrate 30 is 0.04 mm or less, strain tends to occur on the substrate. Therefore, when the process of forming a through-hole is performed on a substrate having a thickness of 0.04 mm or less, the remarkable effect of this embodiment can be obtained.

接著，參閱圖4及圖5，對光束掃描器13(圖1)的可掃描範圍與單位區域32的大小的關係進行說明。 圖4係表示光束掃描器13的可掃描範圍35與單位區域32的大小的關係的一例之圖。光束掃描器13無需讓基板30移動便能夠將雷射光束入射到可掃描範圍35的內部的任意點。在圖4所示之例子中，至少一個單位區域32位於可掃描範圍35的內部。此時，在圖3的步驟SA2中，在進行一個單位區域32內的被加工點33的加工時，無需移動載台17而在使基板30靜止之狀態下進行加工。若一個單位區域32的加工結束，只要在步驟SA1中檢測對準標記31的位置時移動載台17即可。Next, referring to FIGS. 4 and 5 , the relationship between the scannable range of the beam scanner 13 ( FIG. 1 ) and the size of the unit area 32 will be described. FIG. 4 is a diagram showing an example of the relationship between the scannable range 35 of the beam scanner 13 and the size of the unit area 32 . The beam scanner 13 can inject a laser beam to an arbitrary point inside the scannable range 35 without moving the substrate 30 . In the example shown in FIG. 4 , at least one unit area 32 is located inside the scannable range 35 . At this time, in step SA2 of FIG. 3 , when processing the point 33 to be processed in one unit area 32 , the processing is performed with the substrate 30 stationary without moving the stage 17 . When the processing of one unit area 32 is completed, it is only necessary to move the stage 17 when detecting the position of the alignment mark 31 in step SA1.

圖5係表示光束掃描器13的可掃描範圍35與單位區域32的大小的關係的其他例子之圖。在圖5所示之例子中，單位區域32大於可掃描範圍35。此時，在圖3的步驟SA2中，進行一個單位區域32內的被加工點33的加工時，進行可掃描範圍35內的被加工點33的加工。然後，移動載台17，將加工中的單位區域32內的未加工的被加工點33所分佈之區域配置於可掃描範圍35內即可。FIG. 5 is a diagram showing another example of the relationship between the scannable range 35 of the beam scanner 13 and the size of the unit area 32 . In the example shown in FIG. 5 , the unit area 32 is larger than the scannable range 35 . At this time, in step SA2 of FIG. 3 , when machining the to-be-processed point 33 within one unit area 32 , the machining of the to-be-processed point 33 within the scannable range 35 is performed. Then, the stage 17 may be moved so that the area where the unprocessed to-be-processed points 33 are distributed in the unit area 32 being processed may be arranged within the scannable range 35 .

圖1～圖3所示之實施例能夠應用於可掃描範圍35大於單位區域32之情況及單位區域32大於可掃描範圍35之情況中的任一者。The embodiments shown in FIGS. 1 to 3 can be applied to any one of the case where the scannable range 35 is larger than the unit area 32 and the case where the unit area 32 is larger than the scannable range 35 .

接著，參考圖6對其他實施例進行說明。 圖6係藉由基於其他實施例之加工方法進行加工之基板30的俯視圖。在圖2所示之實施例中，與單位區域32各個對應之複數個對準標記31配置於該單位區域32的內部。在圖6所示之實施例中，一部分的對準標記31配置於相鄰之單位區域32的假想邊界線上。亦即，在複數個單位區域32共用一個對準標記31。如本實施例那樣，可以將一個對準標記31與複數個單位區域32建立對應關聯。Next, another embodiment will be described with reference to FIG. 6 . FIG. 6 is a top view of a substrate 30 processed by a processing method based on another embodiment. In the embodiment shown in FIG. 2 , a plurality of alignment marks 31 corresponding to each unit area 32 are arranged inside the unit area 32 . In the embodiment shown in FIG. 6 , a part of the alignment marks 31 are arranged on the imaginary boundary lines of adjacent unit regions 32 . That is, one alignment mark 31 is shared by a plurality of unit areas 32 . As in the present embodiment, one alignment mark 31 can be associated with a plurality of unit regions 32 .

接著，參閱圖7及圖8，對另一實施例進一步進行說明。以下，關於與圖1～圖3所示之實施例共通的結構省略說明。 圖7係在基於本實施例之加工方法中成為加工對象之基板30的俯視圖。在圖2所示之實施例中，基板30的被加工面被區分成複數個單位區域32。在圖7所示之實施例中，被加工面並未區分成單位區域32，複數個對準標記31配置於基板30的被加工面內。Next, another embodiment will be further described with reference to FIG. 7 and FIG. 8 . Hereinafter, the description of the common structure with the embodiment shown in FIGS. 1 to 3 is omitted. FIG. 7 is a plan view of a substrate 30 to be processed in the processing method according to this embodiment. In the embodiment shown in FIG. 2 , the processed surface of the substrate 30 is divided into a plurality of unit regions 32 . In the embodiment shown in FIG. 7 , the surface to be processed is not divided into unit areas 32 , and a plurality of alignment marks 31 are arranged on the surface to be processed of the substrate 30 .

圖8係基於本實施例之加工方法的流程圖。首先，控制裝置20檢測至少一部分的對準標記31的位置(步驟SB1)。根據對準標記31的位置之剛才的檢測結果，進行接下來待加工的被加工點33的加工(步驟SB2)。若一個被加工點33的加工結束，則判定所有被加工點33的加工是否結束(步驟SB3)。當還有未加工的被加工點33時，判定控制裝置20是否進行對準標記31的位置的再檢測(步驟SB4)。例如，可在從剛剛進行對準標記31的位置的檢測之時點起進行了既定個數的被加工點33的加工時，進行再檢測。並且， 可在從剛剛進行對準標記31的位置的檢測之時點起經過了既定時間時，進行再檢測。Fig. 8 is a flow chart of the processing method based on this embodiment. First, the control device 20 detects the position of at least a part of the alignment mark 31 (step SB1). According to the detection result of the position of the alignment mark 31 just now, the processing of the to-be-processed point 33 to be processed next is performed (step SB2). When the machining of one to-be-processed point 33 is completed, it is judged whether the machining of all the to-be-processed points 33 is finished (step SB3). When there are still unprocessed points 33 to be processed, it is determined whether or not the control device 20 re-detects the position of the alignment mark 31 (step SB4). For example, re-detection may be performed when a predetermined number of points to be processed 33 have been processed from the point immediately after detection of the position of the alignment mark 31 . In addition, re-detection may be performed when a predetermined time has elapsed from the moment when the position of the alignment mark 31 was detected.

當不進行對準標記31的位置的再檢測時，根據對準標記31的位置之剛才的檢測結果，進行接下來待加工的被加工點33的加工(步驟SB2)。當進行對準標記31的位置的再檢測時，檢測至少一部分的對準標記31的位置(步驟SB1)。然後，進行接下來待加工的被加工點33的加工(步驟SB2)。此時檢測位置之一部分的對準標記31，並非限定於與之前檢測位置之一部分的對準標記31相同者。通常，所檢測之對準標記31的至少一個與之前所檢測之對準標記31不同。When the re-detection of the position of the alignment mark 31 is not performed, the processing of the point to be processed 33 to be processed next is performed based on the detection result of the position of the alignment mark 31 just now (step SB2). When re-detecting the position of the alignment mark 31, the position of at least a part of the alignment mark 31 is detected (step SB1). Then, machining of the point to be machined 33 to be machined next is performed (step SB2). At this time, the alignment mark 31 at a part of the detection position is not limited to be the same as the alignment mark 31 at a part of the detection position before. Typically, at least one of the detected alignment marks 31 is different from the previously detected alignment marks 31 .

交替重複複數次被加工點33的加工及對準標記31的位置的再檢測的處理，直至所有被加工點33的加工結束。The processing of processing the points 33 to be processed and re-detecting the positions of the alignment marks 31 is repeated alternately a plurality of times until the processing of all the points 33 to be processed is completed.

在步驟SB1中，在檢測至少一部分的對準標記31的位置之處理中，宜以能夠界定基板30的位置及以垂直於被加工面之軸為中心之旋轉方向的姿勢的方式選擇待檢測位置之對準標記31。此外，宜以能夠測定基板30的應變的方式選擇檢測對象的對準標記31。並且，宜選擇接近接下來待加工的被加工點33之位置的對準標記31。例如，宜以接近接下來待加工的被加工點33之順序將複數個、例如4個對準標記31的位置依序檢測。In step SB1, in the process of detecting the position of at least a part of the alignment mark 31, it is preferable to select the position to be detected in such a manner that the position of the substrate 30 and the posture of the rotation direction centered on the axis perpendicular to the processed surface can be defined. The alignment mark 31. In addition, it is preferable to select the alignment mark 31 to be detected so that the strain of the substrate 30 can be measured. Also, it is preferable to select the alignment mark 31 close to the position of the next processed point 33 to be processed. For example, it is preferable to sequentially detect the positions of a plurality of, for example, four alignment marks 31 in the order close to the processed point 33 to be processed next.

如上所述，在本實施例中，在依序進行複數個被加工點33的加工之期間中，檢測至少一部分的對準標記31的位置。對於檢測對準標記31的位置之後進行加工之被加工點33，根據加工中途之剛才的檢測結果來進行加工。As described above, in this embodiment, the positions of at least a part of the alignment marks 31 are detected while the processing of the plurality of points to be processed 33 is performed sequentially. The point to be processed 33 that is processed after detecting the position of the alignment mark 31 is processed based on the detection result just before the processing.

接著，對圖7及圖8所示之實施例的優異效果進行說明。在本實施例中，在依序加工複數個被加工點33之期間中檢測至少一部分的對準標記31的位置。在之後的加工，根據剛剛檢測之對準標記31的位置的檢測結果進行被加工點33的加工。如此，與在加工之前僅檢測一次對準標記31的位置之方法相比，在基板30的應變變大之前，能夠考慮到應變修正被加工點33的位置。其結果，能夠減小本來待加工的被加工點33的位置與實際加工之位置之間的偏差。Next, the excellent effect of the embodiment shown in FIGS. 7 and 8 will be described. In this embodiment, the positions of at least a part of the alignment marks 31 are detected during the sequential processing of the plurality of points 33 to be processed. In the subsequent processing, the processing of the point 33 to be processed is performed based on the detection result of the position of the alignment mark 31 detected just now. In this way, compared to the method of detecting the position of the alignment mark 31 only once before processing, the position of the processed point 33 can be corrected in consideration of the strain before the strain of the substrate 30 becomes large. As a result, it is possible to reduce the deviation between the position of the processed point 33 to be processed originally and the position actually processed.

為了減小位置偏差，作為檢測位置之一部分的對準標記31，宜以接近接下來待加工的被加工點33之順序將複數個對準標記31依序採用。為了獲取與基板30的應變相關之資訊，檢測位置之對準標記31的個數設為4個以上為較佳。In order to reduce the position deviation, the alignment marks 31 as a part of the detection position should be sequentially adopted in the order of approaching the next processed point 33 to be processed. In order to obtain information on the strain of the substrate 30, it is preferable to set the number of alignment marks 31 for detection positions to four or more.

接著，參閱圖9A～圖9D，對基於另一實施例之加工方法進一步進行說明。 圖9A係加工前的基板30的剖面圖。基板30保持於載台17上。基板30係在由樹脂構成之芯層40的兩面分別貼合銅箔41、42而成之覆銅積層板。將其中一個銅箔41的表面稱為上表面，將另一銅箔42的表面稱為下表面。基板30上設置有：由從下表面到達上表面之貫通孔所構成之對準標記31。在基板30的上表面及下表面預先設定有複數個被加工點33的位置。上表面的被加工點33的位置與下表面的被加工點33的位置，關於基板30的面內為相同，被加工點33的位置儲存於控制裝置20的儲存裝置21。Next, referring to FIG. 9A to FIG. 9D , the processing method based on another embodiment will be further described. FIG. 9A is a cross-sectional view of the substrate 30 before processing. The substrate 30 is held on the stage 17 . The substrate 30 is a copper-clad laminate in which copper foils 41 and 42 are bonded on both sides of a core layer 40 made of resin. The surface of one copper foil 41 is called an upper surface, and the surface of the other copper foil 42 is called a lower surface. The substrate 30 is provided with an alignment mark 31 formed of a through hole extending from the lower surface to the upper surface. The positions of a plurality of processing points 33 are preset on the upper surface and the lower surface of the substrate 30 . The position of the processed point 33 on the upper surface and the position of the processed point 33 on the lower surface are the same with respect to the in-plane of the substrate 30 , and the position of the processed point 33 is stored in the storage device 21 of the control device 20 .

圖9B係進行基板30的上表面的加工之後的基板30的剖面圖。控制裝置20檢測對準標記31的位置，根據檢測結果將雷射光束依序入射到被加工點33(圖9A)。藉此，在被加工點33形成凹部45。凹部45貫穿銅箔41到達芯層40的中途。9B is a cross-sectional view of the substrate 30 after the upper surface of the substrate 30 has been processed. The control device 20 detects the positions of the alignment marks 31, and sequentially injects the laser beams onto the processed points 33 according to the detection results (FIG. 9A). Thereby, the recessed part 45 is formed in the to-be-processed point 33. As shown in FIG. The concave portion 45 penetrates the copper foil 41 halfway to the core layer 40 .

圖9C係使基板30的正背面反轉之後的基板30的剖面圖。上面側的銅箔41密合於載台17，下面側的銅箔42的表面朝向上方。控制裝置20在該狀態下檢測一部分的對準標記31的位置。FIG. 9C is a cross-sectional view of the substrate 30 after the front and back of the substrate 30 are reversed. The copper foil 41 on the upper surface is in close contact with the stage 17 , and the surface of the copper foil 42 on the lower surface faces upward. The control device 20 detects the position of some alignment marks 31 in this state.

圖9D係進行基板30的下表面的加工之後的基板30的剖面圖。控制裝置20將雷射光束依序入射到基板30的下表面的複數個被加工點33(圖9A)。此時，採用基於圖3或圖8所示之實施例的加工方法。藉由在下表面的被加工點33形成凹部，與形成於上表面之凹部45(圖9B)相連而形成貫通孔46。FIG. 9D is a cross-sectional view of the substrate 30 after processing the lower surface of the substrate 30 . The control device 20 sequentially irradiates the laser beams to a plurality of processing points 33 on the lower surface of the substrate 30 ( FIG. 9A ). At this time, the processing method based on the embodiment shown in FIG. 3 or FIG. 8 is adopted. A through-hole 46 is formed by forming a recessed portion at the processed point 33 on the lower surface and connecting with the recessed portion 45 ( FIG. 9B ) formed on the upper surface.

接著，對圖9A～圖9D所示之實施例的優異的效果進行說明。 在本實施例中，即使在基板30形成了貫通孔46(圖9D)而在基板30發生應變之情況下，亦能夠減小入射雷射光束之位置與本來的被加工點33的位置之間的偏差。因此，能將形成於上表面之凹部45(圖9B)及形成於下表面之凹部相連而形成貫通孔46(圖9D)。Next, the excellent effect of the embodiment shown in FIGS. 9A to 9D will be described. In this embodiment, even when the substrate 30 has a through hole 46 ( FIG. 9D ) and the substrate 30 is strained, the gap between the position of the incident laser beam and the original position of the processed point 33 can be reduced. deviation. Therefore, the through hole 46 ( FIG. 9D ) can be formed by connecting the concave portion 45 formed on the upper surface ( FIG. 9B ) and the concave portion formed on the lower surface.

接著，對本實施例的變形例進行說明。在本實施例中，在基板30的上表面的被加工點33(圖9B)的加工中，沒有採用基於圖3或圖8所示之實施例之加工方法。這是因為，上表面的加工中沒有形成貫通孔，基板30的應變應不會變大。當假定上表面的加工時也會使基板30的應變變大的情況，上表面的加工時也宜採用基於圖3或圖8所示之實施例之加工方法。藉此，能夠進一步減小形成於上表面之凹部45(圖9B)與形成於下表面之凹部之間的位置偏離。Next, a modified example of the present embodiment will be described. In this embodiment, the processing method based on the embodiment shown in FIG. 3 or FIG. 8 is not used in the processing of the processing point 33 ( FIG. 9B ) on the upper surface of the substrate 30 . This is because no through-hole is formed during the processing of the upper surface, and the strain on the substrate 30 should not be increased. Assuming that the processing of the upper surface will also increase the strain of the substrate 30, the processing method based on the embodiment shown in FIG. 3 or FIG. 8 is also suitable for processing the upper surface. Thereby, the positional deviation between the recessed part 45 (FIG. 9B) formed in the upper surface and the recessed part formed in the lower surface can be further reduced.

在本實施例中，首先在基板30的上表面形成凹部，然後使基板30的正背面反轉而在下面形成凹部，藉此使來自上表面的凹部與來自下表面的凹部相連而形成貫通孔。也可以藉由來自基板30的一側的雷射光束的入射而一口氣地形成貫通孔。此時，形成貫通孔時，宜採用基於圖3或圖8所示之實施例之加工方法。In this embodiment, firstly, a concave portion is formed on the upper surface of the substrate 30, and then the front and back of the substrate 30 are reversed to form a concave portion on the lower surface, whereby the concave portion from the upper surface is connected to the concave portion from the lower surface to form a through hole. . The through-holes may also be formed in one go by incident of a laser beam from one side of the substrate 30 . At this time, when forming the through hole, it is preferable to adopt the processing method based on the embodiment shown in FIG. 3 or FIG. 8 .

上述各實施例為例示，當然能夠進行不同的實施例中所示之結構的局部置換或組合。針對基於複數個實施例的相同的結構的相同的作用效果，並未在每個實施例中依序提及。此外，本發明並不限制於上述實施例。本領域的技術人員應當清楚例如能夠進行各種變更、改良、組合等。The above-mentioned embodiments are examples, and it is of course possible to partially replace or combine the structures shown in different embodiments. The same function and effect of the same structure based on the plurality of embodiments are not mentioned sequentially in each embodiment. In addition, the present invention is not limited to the above-described embodiments. It should be clear to those skilled in the art that various changes, improvements, combinations, etc. can be made, for example.

10‧‧‧雷射光源 11‧‧‧聲光元件(AOM) 12‧‧‧反射鏡 13‧‧‧光束掃描器 14‧‧‧聚光透鏡 15‧‧‧光束阻尼器 16‧‧‧感測器 17‧‧‧載台 20‧‧‧控制裝置 21‧‧‧儲存裝置 30‧‧‧基板 31‧‧‧對準標記 32‧‧‧單位區域 33‧‧‧被加工點 35‧‧‧光束掃描器的可掃描範圍 40‧‧‧芯層 41、42‧‧‧銅箔 45‧‧‧凹部 46‧‧‧貫通孔10‧‧‧Laser light source 11‧‧‧Acousto-optic components (AOM) 12‧‧‧reflector 13‧‧‧Beam Scanner 14‧‧‧condensing lens 15‧‧‧Beam damper 16‧‧‧Sensor 17‧‧‧carrier 20‧‧‧control device 21‧‧‧Storage device 30‧‧‧substrate 31‧‧‧Alignment mark 32‧‧‧unit area 33‧‧‧processed point 35‧‧‧Scanning range of beam scanner 40‧‧‧core layer 41, 42‧‧‧copper foil 45‧‧‧Concave 46‧‧‧through hole

圖1係基於實施例之雷射加工裝置的概要圖。 圖2係加工對象的基板的俯視圖。 圖3係基於實施例之加工方法的流程圖。 圖4係表示光束掃描器的可掃描範圍與單位區域的大小的關係的一例之圖。 圖5係表示光束掃描器的可掃描範圍與單位區域的大小的關係的另一例之圖。 圖6係藉由基於其他實施例之加工方法進行加工之基板的俯視圖。 圖7係在基於另一實施例之加工方法中成為加工對象之基板的俯視圖。 圖8係基於進行圖7所示之基板的加工之實施例之加工方法的流程圖。 圖9A係基於另一實施例之加工方法的加工前的基板的剖面圖，圖9B係進行基板的上表面的加工之後的基板的剖面圖，圖9C係使基板的正背面反轉之後的基板的剖面圖，圖9D係進行基板的下表面的加工之後的基板的剖面圖。FIG. 1 is a schematic diagram of a laser processing device based on an embodiment. FIG. 2 is a plan view of a substrate to be processed. Fig. 3 is a flow chart of the processing method based on the embodiment. FIG. 4 is a diagram showing an example of the relationship between the scannable range of the beam scanner and the size of the unit area. FIG. 5 is a diagram showing another example of the relationship between the scannable range of the beam scanner and the size of the unit area. FIG. 6 is a top view of a substrate processed by a processing method based on another embodiment. Fig. 7 is a plan view of a substrate to be processed in a processing method according to another embodiment. FIG. 8 is a flowchart of a processing method based on an embodiment of processing the substrate shown in FIG. 7 . 9A is a cross-sectional view of a substrate before processing based on another embodiment of the processing method, FIG. 9B is a cross-sectional view of the substrate after the upper surface of the substrate is processed, and FIG. 9C is the substrate after the front and back of the substrate are reversed. 9D is a cross-sectional view of the substrate after processing the lower surface of the substrate.

Claims (6)

一種加工方法，其包括以下製程：進行基板之複數個單位區域各個的內部的被加工點的加工，前述基板之被加工面被區分成複數個前述單位區域，對應於前述單位區域各個設置有複數個對準標記，在前述單位區域的內部定義有複數個被加工點的位置，前述單位區域的加工之每一個，是檢測對應於接下來待加工的一個單位區域之前述複數個對準標記的位置，根據檢測結果修正前述複數個被加工點各個之被定義的位置，使雷射光束入射到修正後的位置。 A processing method, which includes the following process: processing points to be processed inside each of a plurality of unit areas of a substrate, the surface of the substrate to be processed is divided into a plurality of the aforementioned unit areas, and a plurality of alignment marks, the positions of a plurality of processed points are defined inside the aforementioned unit area, each of the processing of the aforementioned unit area is to detect the aforementioned plurality of alignment marks corresponding to a unit area to be processed next The positions are corrected according to the detection results to the defined positions of each of the plurality of points to be processed, and the laser beams are incident on the corrected positions. 如請求項1所述之加工方法，其中，檢測前述對準標記的位置之後，根據前述對準標記的位置的檢測結果求出表示前述基板的應變之應變資訊，根據前述應變資訊修正前述被加工點的位置，當進行前述被加工點的加工時，使雷射光束入射到修正後的前述被加工點的位置。 The processing method according to claim 1, wherein after the position of the alignment mark is detected, strain information indicating the strain of the substrate is obtained based on the detection result of the position of the alignment mark, and the processed is corrected based on the strain information When the position of the point is to be processed, the laser beam is made incident on the corrected position of the point to be processed. 一種加工裝置，其具有：雷射光源，輸出雷射光束；光束掃描器，將從前述雷射光源輸出之雷射光束入射到基板的表面，並且使入射位置在前述基板的表面上移動； 感測器，偵知設置於前述基板之複數個對準標記；以及控制裝置，被加工面被區分成複數個單位區域，並且儲存有前述被加工面的複數個被加工點的位置，前述單位區域的加工之每一個，是依據前述感測器的偵知結果檢測與接下來待加工的一個單位區域對應之前述複數個對準標記的位置，根據檢測結果修正前述一個單位區域之前述複數個被加工點各個之被定義的位置，以使雷射光束依序入射到修正後的位置的方式控制前述光束掃描器。 A processing device, which has: a laser light source, which outputs a laser beam; a beam scanner, which injects the laser beam output from the aforementioned laser light source onto the surface of a substrate, and moves the incident position on the surface of the aforementioned substrate; A sensor for detecting a plurality of alignment marks provided on the aforementioned substrate; and a control device for dividing the processed surface into a plurality of unit areas and storing the positions of the plurality of processed points on the aforementioned processed surface, the aforementioned unit Each of the processing of the area is to detect the positions of the aforementioned plurality of alignment marks corresponding to the next unit area to be processed according to the detection results of the aforementioned sensors, and correct the aforementioned plurality of alignment marks in the aforementioned unit area according to the detection results. The defined positions of the points to be processed control the beam scanner in such a way that the laser beams are sequentially incident on the corrected positions. 一種加工方法，其交替重複複數次以下製程：檢測基板的至少一部分的複數個對準標記的位置，在前述基板設置有複數個前述對準標記且定義有待加工的複數個被加工點的位置，根據前述對準標記的位置的檢測結果修正前述複數個被加工點中之一部分的複數個被加工點各個之被定義的位置，使雷射光束依序入射到修正後的位置。 A processing method, which alternately repeats the following process a plurality of times: detecting the positions of a plurality of alignment marks on at least a part of a substrate, setting a plurality of alignment marks on the aforementioned substrate and defining a plurality of processed points to be processed, Correcting the defined positions of each of the plurality of processed points of one of the plurality of processed points according to the detection result of the position of the alignment mark, so that the laser beams are sequentially incident on the corrected positions. 如請求項4所述之加工方法，其中，檢測前述對準標記的位置之後，根據前述對準標記的位置的檢測結果求出表示前述基板的應變之應變資訊，根據前述應變資訊修正前述被加工點的位置，當進行前述被加工點的加工時，使雷射光束入射到修正後的前述被加工點的位置。 The processing method according to claim 4, wherein after the position of the alignment mark is detected, strain information indicating the strain of the substrate is obtained based on the detection result of the position of the alignment mark, and the processed is corrected based on the strain information When the position of the point is to be processed, the laser beam is made incident on the corrected position of the point to be processed. 一種加工裝置，其具有：雷射光源，輸出雷射光束；光束掃描器，將從前述雷射光源輸出之雷射光束入射到基板的被加工面，並且使入射位置在前述基板的表面上移動；感測器，偵知設置於前述基板上之複數個對準標記各個；以及控制裝置，儲存前述被加工面的複數個被加工點各個的位置，根據前述感測器的偵知結果控制前述雷射光源及前述光束掃描器，前述控制裝置交替重複複數次以下處理：根據前述感測器的偵知結果檢測至少一部分的前述複數個對準標記的位置，根據前述對準標記的位置的檢測結果修正前述複數個被加工點中之一部分的複數個被加工點各個之被定義的位置，以使雷射光束依序入射到修正後的位置的方式控制前述雷射光源及前述光束掃描器。 A processing device comprising: a laser light source that outputs a laser beam; a beam scanner that injects the laser beam output from the laser light source onto a processed surface of a substrate and moves the incident position on the surface of the substrate a sensor for detecting each of the plurality of alignment marks provided on the aforementioned substrate; and a control device for storing the positions of each of the plurality of processed points on the aforementioned processed surface, and controlling the aforementioned sensor according to the detection results of the aforementioned sensor The laser light source, the aforementioned beam scanner, and the aforementioned control device alternately repeat the following processing multiple times: detecting the positions of at least a part of the plurality of alignment marks based on the detection results of the aforementioned sensors; As a result, the defined positions of one of the plurality of processed points are corrected, and the laser light source and the beam scanner are controlled so that the laser beams sequentially enter the corrected positions.
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