TW202130766A - 黏接薄膜、疊層體、以及印刷配線板 - Google Patents

黏接薄膜、疊層體、以及印刷配線板 Download PDF

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Publication number
TW202130766A
TW202130766A TW109141231A TW109141231A TW202130766A TW 202130766 A TW202130766 A TW 202130766A TW 109141231 A TW109141231 A TW 109141231A TW 109141231 A TW109141231 A TW 109141231A TW 202130766 A TW202130766 A TW 202130766A
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TW
Taiwan
Prior art keywords
adhesive film
mass
less
parts
group
Prior art date
Application number
TW109141231A
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English (en)
Chinese (zh)
Inventor
小栁英之
薗田遼
入澤隼人
川楠哲生
Original Assignee
日商東洋紡股份有限公司
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Publication of TW202130766A publication Critical patent/TW202130766A/zh

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
    • C09J123/26—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers modified by chemical after-treatment
    • C09J123/30—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers modified by chemical after-treatment by oxidation
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C08L71/12—Polyphenylene oxides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
    • C09J123/26—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers modified by chemical after-treatment
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J171/00—Adhesives based on polyethers obtained by reactions forming an ether link in the main chain; Adhesives based on derivatives of such polymers
    • C09J171/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C09J171/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C09J171/12—Polyphenylene oxides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Laminated Bodies (AREA)
TW109141231A 2019-11-28 2020-11-25 黏接薄膜、疊層體、以及印刷配線板 TW202130766A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019-215101 2019-11-28
JP2019215101 2019-11-28

Publications (1)

Publication Number Publication Date
TW202130766A true TW202130766A (zh) 2021-08-16

Family

ID=76130513

Family Applications (1)

Application Number Title Priority Date Filing Date
TW109141231A TW202130766A (zh) 2019-11-28 2020-11-25 黏接薄膜、疊層體、以及印刷配線板

Country Status (5)

Country Link
JP (1) JP6919776B1 (ko)
KR (1) KR20220104685A (ko)
CN (1) CN114555740B (ko)
TW (1) TW202130766A (ko)
WO (1) WO2021106847A1 (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN118043416A (zh) * 2021-09-30 2024-05-14 琳得科株式会社 固化性粘接片

Family Cites Families (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60197781A (ja) * 1984-03-19 1985-10-07 Sumitomo Bakelite Co Ltd フレキシブル印刷回路用基板
DE69713661T2 (de) * 1996-04-11 2003-02-13 Mitsui Chemicals Inc Mehrschichtfolie und Verpackunsgmaterial
US6387990B1 (en) * 1999-09-10 2002-05-14 General Electric Company Curable epoxy resin compositions with brominated triazine flame retardants
US6906120B1 (en) * 2000-06-20 2005-06-14 General Electric Poly(arylene ether) adhesive compositions
US20020072585A1 (en) * 2000-10-17 2002-06-13 Industrial Technology Research Institute PPE derivatives and resin composition having the same
JP2003292767A (ja) * 2002-04-08 2003-10-15 Asahi Kasei Corp 高分子ワニス
JP2004137411A (ja) * 2002-10-18 2004-05-13 Sumitomo Bakelite Co Ltd 半導体用接着フィルム、半導体装置、及び半導体装置の製造方法
JP4411876B2 (ja) * 2003-06-23 2010-02-10 東レ株式会社 半導体装置用接着剤組成物およびそれを用いた接着剤シート及びカバーレイフィルム並びに銅張りポリイミドフィルム
JP4658735B2 (ja) * 2005-08-18 2011-03-23 信越化学工業株式会社 接着剤組成物及び接着フィルム
JP4872295B2 (ja) * 2005-09-30 2012-02-08 Ｄｉｃ株式会社 湿気硬化型ポリウレタンホットメルト接着剤
JP2008248141A (ja) * 2007-03-30 2008-10-16 Nippon Steel Chem Co Ltd 難燃硬化性樹脂組成物
JP2010275374A (ja) * 2009-05-26 2010-12-09 Panasonic Electric Works Co Ltd フレキシブルプリント配線板用樹脂組成物、樹脂フィルム、プリプレグ、樹脂付き金属箔、フレキシブルプリント配線板
JP2012116954A (ja) * 2010-12-01 2012-06-21 Hitachi Cable Ltd 接着剤組成物、それを用いた接着フィルムおよび配線フィルム
JP5943461B2 (ja) * 2012-02-21 2016-07-05 株式会社Adeka ポリイミド用絶縁接着剤
JP6022893B2 (ja) * 2012-10-24 2016-11-09 ナミックス株式会社 カバーレイフィルム、及びそれを用いたフレキシブルプリント配線板、並びにそれらの製造方法
WO2014148155A1 (ja) * 2013-03-22 2014-09-25 ナミックス株式会社 樹脂組成物、ならびに、それによる接着フィルム、カバーレイフィルム、層間接着剤
WO2015033703A1 (ja) * 2013-09-03 2015-03-12 東洋紡株式会社 ポリオレフィン系接着剤組成物
JP5743042B1 (ja) * 2013-09-26 2015-07-01 東洋紡株式会社 ポリウレタン樹脂組成物およびこれを用いた接着剤組成物、積層体、プリント配線板
EP3156469B1 (en) * 2014-06-11 2020-10-28 Toyobo Co., Ltd. Polyolefin-based adhesive composition
CN106459704B (zh) * 2014-08-27 2020-08-25 东洋纺株式会社 低介电性粘合剂组合物
CN107075335B (zh) * 2014-09-24 2020-02-14 东亚合成株式会社 粘接剂组合物和使用了其的带有粘接剂层的层叠体
JP6458985B2 (ja) * 2014-10-22 2019-01-30 ナミックス株式会社 樹脂組成物、それを用いた絶縁フィルムおよび半導体装置
CN107109182B (zh) * 2015-05-15 2019-06-07 东洋纺株式会社 含有低介电粘合剂层的层叠体
JP6724916B2 (ja) * 2015-07-03 2020-07-15 東洋紡株式会社 ポリオレフィン系自動車構造パネル用接着剤組成物
JP2017031276A (ja) * 2015-07-30 2017-02-09 パナソニックＩｐマネジメント株式会社 熱硬化性樹脂組成物、並びに、それを用いた樹脂ワニス、樹脂付金属箔、樹脂フィルム、金属張積層板及びプリント配線板
JP6074698B1 (ja) * 2015-07-31 2017-02-08 東洋インキＳｃホールディングス株式会社 熱硬化性接着シート、およびその利用
JP6705456B2 (ja) * 2015-08-19 2020-06-03 東洋紡株式会社 低誘電接着剤組成物
JP6829200B2 (ja) * 2015-08-25 2021-02-10 三井金属鉱業株式会社 樹脂層付金属箔、金属張積層板、及びプリント配線板の製造方法
JP6791163B2 (ja) * 2015-11-02 2020-11-25 東洋紡株式会社 低誘電難燃性接着剤組成物
CN106190004B (zh) * 2016-07-20 2020-05-15 律胜科技（苏州）有限公司 一种具有高频特性的接着剂组合物及其用途
KR102340014B1 (ko) * 2016-08-09 2021-12-16 도요보 가부시키가이샤 저유전 접착제층을 함유하는 적층체
JP6553312B2 (ja) * 2017-01-10 2019-07-31 住友精化株式会社 エポキシ樹脂組成物
KR102468900B1 (ko) * 2017-05-31 2022-11-18 린텍 가부시키가이샤 시트상 접착제, 가스 배리어성 적층체, 및 봉지체
JP7106819B2 (ja) * 2017-06-22 2022-07-27 昭和電工マテリアルズ株式会社 樹脂ワニス、樹脂組成物、プリプレグ、積層板、多層プリント配線板及び樹脂ワニスの保存方法
CN107880530B (zh) * 2017-12-25 2020-10-27 广东生益科技股份有限公司 无卤树脂组合物和覆盖膜及其制备方法
JP2019127501A (ja) * 2018-01-22 2019-08-01 藤森工業株式会社 熱硬化性接着剤組成物、接着フィルム、カバーレイフィルム及びフレキシブルプリント配線板

Also Published As

Publication number Publication date
JP6919776B1 (ja) 2021-08-18
JPWO2021106847A1 (ja) 2021-12-02
KR20220104685A (ko) 2022-07-26
CN114555740A (zh) 2022-05-27
WO2021106847A1 (ja) 2021-06-03
CN114555740B (zh) 2024-01-05

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