TW202124886A - Heating cooker - Google Patents
Heating cooker Download PDFInfo
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- TW202124886A TW202124886A TW109128659A TW109128659A TW202124886A TW 202124886 A TW202124886 A TW 202124886A TW 109128659 A TW109128659 A TW 109128659A TW 109128659 A TW109128659 A TW 109128659A TW 202124886 A TW202124886 A TW 202124886A
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- fan
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- communication device
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- door
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24C—DOMESTIC STOVES OR RANGES ; DETAILS OF DOMESTIC STOVES OR RANGES, OF GENERAL APPLICATION
- F24C7/00—Stoves or ranges heated by electric energy
- F24C7/002—Stoves
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24C—DOMESTIC STOVES OR RANGES ; DETAILS OF DOMESTIC STOVES OR RANGES, OF GENERAL APPLICATION
- F24C15/00—Details
- F24C15/02—Doors specially adapted for stoves or ranges
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24C—DOMESTIC STOVES OR RANGES ; DETAILS OF DOMESTIC STOVES OR RANGES, OF GENERAL APPLICATION
- F24C7/00—Stoves or ranges heated by electric energy
- F24C7/08—Arrangement or mounting of control or safety devices
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B6/00—Heating by electric, magnetic or electromagnetic fields
- H05B6/64—Heating using microwaves
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B6/00—Heating by electric, magnetic or electromagnetic fields
- H05B6/64—Heating using microwaves
- H05B6/76—Prevention of microwave leakage, e.g. door sealings
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- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Electric Ovens (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
本揭示是有關於一種將食品等被加熱物加熱之加熱調理器。This disclosure relates to a heating conditioner that heats food and other objects to be heated.
一般而言,用以操作加熱調理器的操作部是配置於覆蓋加熱室的門上。為了使操作部不受加熱室之熱的影響,而在門形成冷卻風之流路(例如,參照日本專利第5899452號公報)。Generally speaking, the operating part for operating the heating conditioner is arranged on the door covering the heating chamber. In order to prevent the operation part from being affected by the heat of the heating chamber, a cooling air flow path is formed in the door (for example, refer to Japanese Patent No. 5895452).
在專利文獻1中,記載了如下的內容:藉由配置於有冷卻風流動之流路的風扇,來提升冷卻能力。風扇是配置成吸氣口與排氣口成為與門之高度方向大致垂直,並從其下方吸入外部空氣後朝上方吐出。In
上述以往技術中,風扇是與門之高度方向大致垂直而配置。因此,必須在門內確保相當於風扇之厚度的量的空間。這成為在設定門之高度上的制約,且是加熱調理器難以小型化的要因。In the above-mentioned prior art, the fan is arranged substantially perpendicular to the height direction of the door. Therefore, it is necessary to ensure a space equivalent to the thickness of the fan in the door. This becomes a restriction on setting the height of the door, and is the main reason why it is difficult to miniaturize the heating conditioner.
本揭示是解決上述以往之課題者,目的在於提供一種小型之加熱調理器。The present disclosure is to solve the aforementioned problems in the past, and aims to provide a small-sized heating conditioner.
本揭示之一態樣之加熱調理器具備:加熱室,具有配置於前面的開口;及門,覆蓋加熱室的開口。A heating conditioner of one aspect of the present disclosure includes: a heating chamber having an opening arranged in the front; and a door covering the opening of the heating chamber.
門具備:外框、顯示部、操作部、電波洩漏防止板、基板、通訊裝置、吸氣口、風扇、第1風路、及第2風路。The door is equipped with: an outer frame, a display unit, an operation unit, an electric wave leakage prevention board, a substrate, a communication device, an air inlet, a fan, a first air path, and a second air path.
顯示部與操作部是配置於外框之前面。電波洩漏防止板是安裝於外框之金屬製的構件。基板是控制顯示部與操作部。通訊裝置是進行與外部的通訊。吸氣口是為了引入外部空氣而配置。風扇是將從吸氣口引入之空氣送出。第1風路是從風扇至基板的風路。第2風路是從風扇至通訊裝置與電波洩漏防止板之間的空間的風路。The display unit and the operation unit are arranged on the front surface of the outer frame. The radio wave leakage prevention plate is a metal member attached to the outer frame. The substrate is the control display unit and the operation unit. The communication device communicates with the outside. The suction port is configured to introduce outside air. The fan sends out the air introduced from the suction port. The first air path is the air path from the fan to the base plate. The second air path is an air path from the fan to the space between the communication device and the electric wave leakage prevention plate.
根據本揭示之技術,可以提供一種小型之加熱調理器。又,可以適當地冷卻基板或通訊裝置,並提升動作的信賴性。According to the technology of the present disclosure, a small heating conditioner can be provided. In addition, it is possible to appropriately cool the substrate or the communication device, and improve the reliability of the operation.
用以實施發明之形態The form used to implement the invention
本揭示之第1態樣之加熱調理器具備:加熱室,具有配置於前面的開口;及門,覆蓋加熱室的開口。The heating conditioner of the first aspect of the present disclosure includes: a heating chamber having an opening arranged in the front; and a door covering the opening of the heating chamber.
門具備:外框、顯示部、操作部、電波洩漏防止板、基板、通訊裝置、吸氣口、風扇、第1風路、及第2風路。The door is equipped with: an outer frame, a display unit, an operation unit, an electric wave leakage prevention board, a substrate, a communication device, an air inlet, a fan, a first air path, and a second air path.
顯示部與操作部配置於外框之前面。電波洩漏防止板是安裝於外框之金屬製的構件。基板控制顯示部與操作部。通訊裝置進行與外部的通訊。吸氣口是為了引入外部空氣而配置。風扇將從吸氣口引入之空氣送出。第1風路是從風扇至基板的風路。第2風路是從風扇至通訊裝置與電波洩漏防止板之間的空間的風路。The display unit and the operation unit are arranged on the front surface of the outer frame. The radio wave leakage prevention plate is a metal member attached to the outer frame. The substrate controls the display unit and the operation unit. The communication device communicates with the outside. The suction port is configured to introduce outside air. The fan sends out the air introduced from the suction port. The first air path is the air path from the fan to the base plate. The second air path is an air path from the fan to the space between the communication device and the electric wave leakage prevention plate.
根據本態樣,可以提供一種小型之加熱調理器。又,可以適當地冷卻基板或通訊裝置,並提升動作的信賴性。According to this aspect, a small heating conditioner can be provided. In addition, it is possible to appropriately cool the substrate or the communication device, and improve the reliability of the operation.
本揭示之第2態樣之加熱調理器中,在第1態樣中,門更具備:第1區隔件,將風扇與通訊裝置隔開。根據本態樣,可以適當地冷卻通訊裝置,並提升動作的信賴性。In the heating conditioner of the second aspect of the present disclosure, in the first aspect, the door is further provided with: a first zone partition to separate the fan from the communication device. According to this aspect, the communication device can be appropriately cooled, and the reliability of the operation can be improved.
本揭示之第3態樣之加熱調理器中,在第2態樣中,門更具備:第2區隔件,將通訊裝置與空間隔開。根據本態樣,可以適當地冷卻通訊裝置,並提升動作的信賴性。In the heating conditioner of the third aspect of the present disclosure, in the second aspect, the door is further provided with: a second partition, which separates the communication device from the space. According to this aspect, the communication device can be appropriately cooled, and the reliability of the operation can be improved.
本揭示之第4態樣之加熱調理器中,在第3態樣中,門更具備:風扇收納部、通訊裝置收納部、及風扇殼體。風扇收納部是收納風扇。通訊裝置收納部是收納通訊裝置。風扇殼體是形成第1風路、第2風路、第1區隔件、及第2區隔件。根據本態樣,可以減低製造成本。In the heating conditioner of the fourth aspect of the present disclosure, in the third aspect, the door is further provided with: a fan storage portion, a communication device storage portion, and a fan housing. The fan accommodating part accommodates a fan. The communication device storage section stores the communication device. The fan case forms a first air path, a second air path, a first zone partition, and a second zone partition. According to this aspect, the manufacturing cost can be reduced.
本揭示之第5態樣之加熱調理器中,在第4態樣中,第1風路形成於風扇殼體之前側,且第2風路形成於風扇殼體之後側。根據本態樣,可以適當地冷卻基板或通訊裝置,並提升動作的信賴性。In the heating conditioner of the fifth aspect of the present disclosure, in the fourth aspect, the first air path is formed on the front side of the fan housing, and the second air path is formed on the back side of the fan housing. According to this aspect, the substrate or the communication device can be appropriately cooled, and the reliability of the operation can be improved.
本揭示之第6態樣之加熱調理器中,在第5態樣中,第2風路包含:第1貫通孔,在風扇的附近從風扇殼體之前側貫通至後側。根據本態樣,可以適當地冷卻通訊裝置,並提升動作的信賴性。In the heating conditioner of the sixth aspect of the present disclosure, in the fifth aspect, the second air path includes a first through hole, which penetrates from the front side to the rear side of the fan housing in the vicinity of the fan. According to this aspect, the communication device can be appropriately cooled, and the reliability of the operation can be improved.
本揭示之第7態樣之加熱調理器中,在第6態樣中,風扇殼體在風扇收納部與第1風路之間具備:連接風路,具有從風扇收納部的開口朝向第1風路圓滑縮窄的形狀。根據本態樣,可以適當地冷卻基板或通訊裝置,並提升動作的信賴性。In the heating conditioner of the seventh aspect of the present disclosure, in the sixth aspect, the fan housing is provided between the fan housing part and the first air path: a connecting air path, which has an opening from the fan housing part toward the first The wind path has a sleek and narrow shape. According to this aspect, the substrate or the communication device can be appropriately cooled, and the reliability of the operation can be improved.
本揭示之第8態樣之加熱調理器中,在第7態樣中,第1貫通孔配置於連接風路。根據本態樣,可以適當地冷卻通訊裝置,並提升動作的信賴性。In the heating conditioner of the eighth aspect of the present disclosure, in the seventh aspect, the first through hole is arranged in the connecting air duct. According to this aspect, the communication device can be appropriately cooled, and the reliability of the operation can be improved.
本揭示之第9態樣之加熱調理器中,在第8態樣中,第1貫通孔具有至少一部分沿著連接風路之側壁的形狀。根據本態樣,可以減低製造成本。In the heating conditioner of the ninth aspect of the present disclosure, in the eighth aspect, the first through hole has a shape that at least a part is along the side wall connecting the air passage. According to this aspect, the manufacturing cost can be reduced.
本揭示之第10態樣之加熱調理器中,在第4至第9態樣之任一態樣中,風扇殼體在第1風路之上方具備:排氣口,用以將從風扇送出之空氣排氣。根據本態樣,可以適當地冷卻基板,並提升動作的信賴性。In the heating conditioner of the tenth aspect of the present disclosure, in any of the fourth to ninth aspects, the fan housing is provided above the first air path: an exhaust port for sending out the fan The air exhaust. According to this aspect, the substrate can be cooled appropriately and the reliability of the operation can be improved.
本揭示之第11態樣之加熱調理器中,在第10態樣中,第2風路包含:第2貫通孔,在排氣口的附近從風扇殼體之後側貫通至前側。根據本態樣,可以適當地冷卻基板或通訊裝置,並提升動作的信賴性。In the heating conditioner of the eleventh aspect of the present disclosure, in the tenth aspect, the second air path includes a second through hole, which penetrates from the rear side to the front side of the fan case in the vicinity of the exhaust port. According to this aspect, the substrate or the communication device can be appropriately cooled, and the reliability of the operation can be improved.
本揭示之第12態樣之加熱調理器中,在第1至第11態樣之任一態樣中,吸氣口設置於門之下部,門具備:引導件,設置於門之前側,並構成為將外部空氣引導至吸氣口,引導件之下端是形成為面向於比正下方更前方。根據本態樣,可以適當地冷卻基板或通訊裝置,並提升動作的信賴性。In the heating conditioner of the twelfth aspect of the present disclosure, in any one of the first to eleventh aspects, the suction port is provided at the lower part of the door, and the door is provided with a guide, which is provided on the front side of the door, and It is configured to guide outside air to the suction port, and the lower end of the guide is formed to face forward than directly below. According to this aspect, the substrate or the communication device can be appropriately cooled, and the reliability of the operation can be improved.
以下,針對本揭示之實施形態,一邊參照圖式一邊進行說明。Hereinafter, the embodiments of the present disclosure will be described with reference to the drawings.
圖1及圖2是顯示本實施形態之加熱調理器1的外觀。圖1是將門7關閉後的狀態下的加熱調理器1的前方立體圖。圖2是將門7開啟後的狀態下的加熱調理器1的前方立體圖。Fig. 1 and Fig. 2 show the appearance of the
如圖1及圖2所示,加熱調理器1具備:箱體3、加熱室5、及門7。加熱室5具有:上壁5a、側壁5b、側壁5c、後壁5d、及底壁5e,並且是配置於箱體3內的空間。門7是覆蓋開口3b,前述開口3b是配置於成為箱體3之前面的前框3a。As shown in FIGS. 1 and 2, the
加熱室5具有:微波放射口,用以將藉由磁控管(magnetron)等之微波振盪器所產生的微波放射至加熱室5內。藉由已從微波放射口放射的微波,載置於加熱室5內的食品等被加熱物便會被加熱。The
在加熱室5的後壁5d與背板之間配置有熱源即對流加熱器與循環風扇。在加熱室5的後壁5d配置有吸氣口與排氣口。Between the
當循環風扇被旋轉驅動時,加熱室5內之空氣會從吸氣口被吸引,並藉由對流加熱器加熱後從排氣口再次送回加熱室5內。藉此,被加熱物便會被均勻地加熱。在底壁5e之下方之前部配置有吸氣口,前述吸氣口是用以將外部空氣引入箱體3內。When the circulating fan is driven to rotate, the air in the
在底壁5e之下方配置有貯存水的水槽,前述水是用以生成送入加熱室5之蒸氣。貯存於水槽的水會供給至蒸氣產生部(未圖示)而成為蒸氣。該蒸氣是透過將蒸氣產生部與加熱室5連接的蒸氣管而供給至加熱室5。在底壁5e與水槽之間配置有控制部(未圖示)。控制部具備控制加熱室5中之加熱等的微電腦等電子零件。A water tank for storing water is arranged below the
門7在開口3b之下方藉由水平的旋轉軸而可開閉地樞軸支撐於箱體3。在門7的外框13之上部安裝有把手7a。當使用者拉動把手7a而使門7旋動至門7成為水平為止,加熱室5之前面便被開放。當使用者推動把手7a而使門7旋動至門7成為垂直為止,加熱室5之前面便被閉鎖。The
在門7的外框13之前面之右側配置有顯示部9與操作部11。顯示部9是用以顯示選單等之例如液晶畫面。在門7內配置有進行與外部裝置的通訊的通訊裝置40。顯示部9也會顯示透過通訊裝置40而從外部裝置取得之食譜等資訊等。操作部11是以例如按鈕或刻度盤所構成,並從使用者接受對加熱調理器1的指示。On the right side of the front face of the
圖3是門7的分解立體圖。在圖3中,加熱調理器1之前側及後側分別對應圖3中之左側及右側。FIG. 3 is an exploded perspective view of the
如圖3所示,門7自前方起依序具備:外框13、風扇殼體(Fan case)19、第1金屬板21、第2金屬板23、電波洩漏防止板25、及內框27。在外框13之後面配置有顯示部9、操作部11、基板15、及風扇(Fan)17。As shown in FIG. 3, the
在基板15配置有控制顯示部9及操作部11之微電腦等電子零件。Electronic components such as a microcomputer for controlling the
風扇17將從吸氣口14及49引入之外部空氣送出,來冷卻受到來自加熱室5之熱的基板15、通訊裝置40等電氣零件。風扇17配置於比電波洩漏防止板25更前方。通訊裝置40是鄰接風扇17而配置。通訊裝置40藉由任意的通訊方式來進行與外部裝置的通訊。通訊裝置40藉由例如無線LAN來進行與外部裝置的通訊。The
風扇殼體19是配置於外框13之後面,以覆蓋基板15及風扇17之後方。在風扇殼體19與風扇殼體19之前方的基板15之間的空間中,形成有第1風路。第1風路29是從風扇17至基板15的風路。亦即,風扇殼體19之一部分形成第1風路29。The
在風扇殼體19與風扇殼體19之後方的第1金屬板21之間的空間中,形成有第2風路31。第2風路31是從風扇17至通訊裝置40與電波洩漏防止板25之間的空間的風路。亦即,風扇殼體19之另外一部分形成第2風路31。A
第1金屬板21是夾著風扇殼體19而配置於基板15之後方,並將來自加熱室5之熱隔熱。第2金屬板23是配置成覆蓋第1金屬板21之後面,並將來自加熱室5之熱隔熱。The
電波洩漏防止板25是用以防止電波從加熱室5之內部通過門7朝外部洩漏之金屬製的板。電波洩漏防止板25是安裝於外框13之後面以覆蓋第2金屬板23之後面。內框27是與外框13一起保持電波洩漏防止板25。The electric wave
圖4是將門7的外框13拆卸後的狀態下的加熱調理器1的前方立體圖。如圖4所示,電波洩漏防止板25是配置於與加熱室5的開口緊鄰之外側。因此,當加熱室5之內部被加熱而成為高溫時,電波洩漏防止板25也會成為高溫。4 is a front perspective view of the
如圖3所示,通訊裝置40是位於外框13之下部,亦即電波洩漏防止板25之下部的附近。因此,加熱調理器1必須作成為用以將電波洩漏防止板25與通訊裝置40之間斷熱,並且將通訊裝置40冷卻的構成。即便電波洩漏防止板25因加熱室5之內部之熱而成為高溫,該構成仍可防止通訊裝置40的溫度超過動作溫度範圍。As shown in FIG. 3, the
圖5是將內框27及電波洩漏防止板25拆卸後的狀態下的門7之一部分的後方立體圖。如圖3及圖5所示,外框13之左側配置有第2金屬板23。第2金屬板23位於基板15之後方,並且在前後方向上配置於加熱室5與第1金屬板21之間。FIG. 5 is a rear perspective view of a part of the
圖6是從圖5所示的狀態更進一步地將第2金屬板23拆卸後的狀態下的門7之一部分的後方立體圖。如圖3及圖6所示,第1金屬板21位於基板15之後方,並且在前後方向上配置於第2金屬板23與風扇殼體19之間。FIG. 6 is a rear perspective view of a part of the
圖7是從圖6所示的狀態更進一步地將第1金屬板21拆卸後的狀態下的門7之一部分的後方立體圖。如圖3及圖7所示,風扇殼體19位於基板15之後方,並且在前後方向上配置於基板15與第1金屬板21之間。FIG. 7 is a rear perspective view of a part of the
風扇殼體19在其下部具備:風扇收納部41、及通訊裝置收納部42。風扇收納部41及通訊裝置收納部42分別將風扇17及通訊裝置40收納於風扇殼體19之前側。在風扇收納部41之下部配置有用以引入外部空氣的吸氣口49。The
位於風扇17及通訊裝置40之後方的風扇殼體19的部分是隔開風扇17及通訊裝置40之後側的空間、及風扇殼體19與第1金屬板21之間的空間。亦即,風扇殼體19之一部分作為第2區隔件而發揮功能。在圖5~圖8中,加熱調理器1之前側及後側分別對應該等圖式中之遠側及近側。針對圖8將於後敘述。The part of the
在風扇殼體19之上半部中,形成有在上下方向上排列的二個貫通孔19a。二個貫通孔19a各自為例如在上下方向上延伸之細長的孔。在貫通孔19a之後側,配置有在前側與背面視角下之左側開口的蓋體19c。In the upper half of the
蓋體19c會改變通過貫通孔19a並從風扇殼體19之前側朝向後側流動的冷卻風之方向。其結果,已通過貫通孔19a的冷卻風會沿著風扇殼體19之後面而在背面視角下流向左方向。The
在風扇殼體19之下半部中,形成有作為第1貫通孔而發揮功能的貫通孔43。貫通孔43是例如三角形的孔。在貫通孔43之上方形成有從風扇殼體19向後方突出的壁44。In the lower half of the
壁44是配置於風扇殼體19之後面且在水平方向上延伸之細長的板。壁44會改變通過貫通孔43並從風扇殼體19之前側朝向後側流動的冷卻風之方向。其結果,已通過貫通孔43的冷卻風會沿著風扇殼體19之後面而流向下方向。The
背面視角下,在風扇殼體19之下部之左側,形成有從風扇殼體19向後方突出的壁19d。壁19d是配置於風扇殼體19之後面且在鉛直方向上延伸之細長的板。壁19d會改變在背面視角下從蓋體19c朝向左側流動的冷卻風之方向。其結果,該冷卻風在背面視角下會流向右方向。When viewed from the back, on the left side of the lower part of the
在風扇殼體19之上部中,形成有作為第2貫通孔而發揮功能的貫通孔19b。在風扇殼體19之上端形成有排氣口45。沿著風扇殼體19之後面而流向上方的冷卻風會通過貫通孔19b而回到風扇殼體19之前側,並從排氣口45排氣。In the upper part of the
圖8是從圖7所示的狀態更進一步地將風扇殼體19拆卸後的狀態下的門7之一部分的後方立體圖。如圖3及圖8所示,基板15、顯示部9、風扇17、及通訊裝置40位於外框13之後方,並在前後方向上配置於外框13與風扇殼體19之間。FIG. 8 is a rear perspective view of a part of the
風扇17的吸入口17a是朝向已關閉的狀態下的門7之前後方向。風扇17的吐出口17b是朝向已關閉的狀態下的門7之上方向。因此,風扇17會在已關閉的狀態下的門7之前後方向上吸入空氣。The
亦即,風扇17之吸入方向是與風扇殼體19的吸氣口49所朝向之方向交錯為例如直角。風扇17會在與風扇17吸入空氣之方向交錯為例如直角之方向上吐出空氣。因此,風扇17的扇葉的旋轉軸會朝向前後方向。作為風扇17可以使用例如多翼式風扇(sirocco fan)。That is, the suction direction of the
圖9是風扇殼體19的前方立體圖。圖10是風扇17及通訊裝置40已收納於風扇殼體19的狀態下的風扇殼體19的前方立體圖。在圖9~圖11中,加熱調理器1之前側及後側分別對應該等圖式中之遠側及近側。針對圖11將於後敘述。FIG. 9 is a front perspective view of the
如圖9及圖10所示,風扇17是配置成與通訊裝置40鄰接。風扇殼體19具有位於風扇17與通訊裝置40之間且形成在風扇殼體19之後面的分隔壁46。分隔壁46是一體地形成於風扇殼體19。分隔壁46是作為將風扇17與通訊裝置40隔開的第1區隔件而發揮作用。As shown in FIGS. 9 and 10, the
從風扇17送出之空氣會從配置於風扇殼體19之下部的吸氣口49被引入。在加熱調理器1的底壁5e之下方之前部,配置有用以將已在加熱室5中被加熱之空氣排氣至外部的排氣口。因此,當在加熱室5中加熱被加熱物時,會有從吸氣口49引入之外部空氣的溫度超過通訊裝置40所容許之動作溫度範圍的可能性。The air sent from the
分隔壁46會防止從風扇17送出之空氣被直接吹附於通訊裝置40。藉此,即便從風扇17送出之空氣的溫度超過通訊裝置40所容許之動作溫度範圍,仍可抑制通訊裝置40因從風扇17送出之高溫之空氣而被加熱的情形。The
分隔壁46可以區隔風扇收納部41與通訊裝置收納部42之間的空間整體,亦可區隔該空間之一部分。例如,分隔壁46亦可具有用以使配線通過的孔,前述配線是將風扇17或通訊裝置40連接至基板15或電源電路(未圖示)。The
正面視角下,在風扇殼體19之左端配置有向前方突出的壁19e。正面視角下,在風扇殼體19的風扇收納部41之上方之左側,向前方突出的壁19g是平行於壁19e而配置。藉由壁19e與壁19g而形成溝19m。在溝19m之上部配置有貫通孔19a。在壁19g配置有孔19h。In a front view, a
在風扇收納部41之上部的開口與溝19m之間,藉由壁19e與壁47而形成有連接風路48。在連接風路48上配置有貫通孔43。Between the opening on the upper portion of the
圖11是用以說明形成於風扇殼體19之前面的風路的圖。如圖11所示,已從吸氣口49引入之空氣會從風扇17被送出至連接風路48。在連接風路48中,已被送出至連接風路48之空氣之一部分會通過貫通孔43而流向風扇殼體19之後側。剩餘之空氣會在壁19e與壁19g之間的溝19m中流向上方。FIG. 11 is a diagram for explaining the air passage formed on the front surface of the
在溝19m中流動之空氣之一部分會從孔19h朝向基板15流動。亦即,從風扇17至基板15的第1風路29包含:連接風路48、溝19m之下部、及孔19h。通過第1風路29,從風扇17送出之外部空氣可以將基板15冷卻。藉此,可以提升基板15之動作的信賴性。A part of the air flowing in the
第1風路29是作為單一方向的風路而形成。因此,可以降低第1風路29中之壓力損失。已被加熱之空氣會朝向配置於風扇殼體19之上端的排氣口45而在第1風路29內流動。藉此,可以更加降低壓力損失。其結果,可確保在第1風路29中流動之冷卻風的風量,並提升基板15的冷卻效率。The
孔19h是配置於比通訊裝置收納部42更上方。因此,當從孔19h朝向基板15流入之空氣比存在於風扇殼體19之前方的空間之空氣更高溫時,便不會流動至通訊裝置收納部42那一邊,而會上升至基板15那一邊。藉此,可以抑制通訊裝置40因高溫之空氣而被加熱的情形。The
在孔19h中,未流向基板15那一邊之空氣會在溝19m中更流向上方,然後從貫通孔19a流向風扇殼體19之後側。In the
由於省空間化,溝19m具有比風扇17的開口之寬度更狹窄之寬度。因此,在溝19m與風扇17之間配置有連接風路48,前述連接風路48具有從風扇17的開口朝向溝19m圓滑縮窄的形狀。正面視角下,從風扇收納部41之左側的壁之上端朝向右方向形成有曲面狀的壁19e。正面視角下,從風扇收納部41之右側的分隔壁46之上端朝向左方向形成有平面狀的壁47。Due to the space saving, the
藉由壁19e與壁47而形成有連接風路48。傾斜配置壁47,以使壁47與分隔壁46所構成的角度成為比直角更大。藉此,可以抑制空氣滯留在風扇17與溝19m之間的空間。其結果,可以抑制風扇17周圍之空氣成為高溫,並抑制鄰接的通訊裝置40成為高溫。A connecting
貫通孔43是在連接風路48中沿著壁47而配置。壁47是如前述地傾斜配置。因此,貫通孔43具有三角形的形狀,前述三角形具有沿著壁47傾斜的邊。藉此,可以在連接風路48配置貫通孔43而有效地利用空間。然而,貫通孔43亦可具有任意的形狀。The through
圖12是用以說明形成於風扇殼體19之後面的風路的圖。如圖12所示,已通過貫通孔43之空氣會藉由壁44而朝向通訊裝置收納部42流動。亦即,從風扇17至通訊裝置40與第1金屬板21之間的空間的第2風路31包含:連接風路48、貫通孔43、及壁44。FIG. 12 is a diagram for explaining the air passage formed on the rear surface of the
藉此,可以透過風扇殼體19間接地藉由從風扇17送出之外部空氣來冷卻通訊裝置40。其結果,可以提升通訊裝置40之動作的信賴性。Thereby, the
藉由將貫通孔43配置於與風扇17緊鄰之上方的連接風路48,冷卻風會變得容易流向配置於更下部的通訊裝置收納部42。藉此,可以提升通訊裝置40的冷卻效率。By arranging the through
已通過貫通孔43之空氣會從壁44與壁19d之間流向上方。已通過貫通孔19a之空氣會在第3風路33中流動,前述第3風路33是通過基板15與第1金屬板21之間的空間的風路。藉此,可以透過風扇殼體19間接地藉由從風扇17送出之外部空氣來冷卻基板15。其結果,可以提升基板15之動作的信賴性。The air that has passed through the through
沿著風扇殼體19之後面而流向上方之空氣會通過貫通孔19b而回到風扇殼體19之前側,並從排氣口45排氣。The air flowing upward along the rear surface of the
已通過到達風扇殼體19之後面的風路的冷卻風會在風扇殼體19之後面與第1金屬板21之間的空間中流動。藉此,可以冷卻第1金屬板21。同時,該冷卻風會在風扇殼體19與第1金屬板21之間形成空氣幕(Air curtain)。藉此,可以減低對風扇殼體19的傳熱。The cooling air that has passed through the air path reaching the rear of the
即便在第1金屬板21與風扇殼體19之間的空間中所存在之空氣因第1金屬板21之熱而被加熱的情況下,仍可通過第2風路31及第3風路33來將該空氣迅速地從排氣口45排氣。其結果,可以抑制熱積存於第1金屬板21與風扇殼體19之間的空間,並提升基板15及通訊裝置40的冷卻效率。Even if the air existing in the space between the
圖13A~圖13C是用以針對外框13的吸氣口14進行說明的圖。圖13A是外框13、風扇殼體19、及電波洩漏防止板25的後面圖。圖13B是沿著圖13A之13B-13B線的截面圖。圖13C是沿著圖13A之13B-13B線的截面的立體圖。13A to 13C are diagrams for explaining the
如圖13A~圖13B所示,正如前述,在風扇殼體19之下端配置有吸氣口49。吸氣口14是配置於外框13之下表面的吸氣口49的附近。在吸氣口14之周邊,會有已從加熱室5被排氣的高溫之空氣存在的情況。尤其是,從離加熱室5更近的吸氣口14之正下方起之後側之空氣,會有溫度比吸氣口14之前側之空氣更高的可能性。As shown in FIGS. 13A to 13B, as mentioned above, an
本實施形態中,在吸氣口14之周圍配置有用以將外部空氣引導至吸氣口14的引導件(Guide)50。引導件50是形成為面向前側而非正下方。藉此,可以將存在於吸氣口14之前側而非正下方的更接近室溫之空氣從吸氣口14吸入。In this embodiment, a
其結果,可以提升冷卻風所帶來的冷卻效率。藉由作成為不將高溫之空氣送風,而可以抑制將通訊裝置40、基板15等電氣零件加熱的情形。As a result, the cooling efficiency by the cooling air can be improved. By not blowing high-temperature air, it is possible to suppress heating of electrical components such as the
圖14是外框13與風扇殼體19的後面立體圖。如圖14所示,正如前述,在風扇殼體19之上端配置有排氣口45。已通過風扇殼體19之前面側的第1風路29之空氣會直接從排氣口45排氣。FIG. 14 is a rear perspective view of the
已通過風扇殼體19之後面側的第2風路31及第3風路33之空氣會從貫通孔19b回到風扇殼體19之前面。該空氣會與已通過第1風路29之空氣一起從排氣口45排氣。排氣口45之上方被框51覆蓋。因此,即便水分侵入外框13內,仍可保護基板15及通訊裝置40不受潮。The air that has passed through the
圖15是風扇殼體19的風扇收納部41之周邊的放大圖。如圖15所示,風扇17具備:固定部54a、及固定部54b。固定部54a、54b具有孔,前述孔是在將風扇17安裝於風扇收納部41時,為了定位而以插銷將風扇17固定用的孔。藉由在該孔中***已形成於外框13或風扇殼體19的插銷,風扇17便可安裝於風扇收納部41。FIG. 15 is an enlarged view of the periphery of the
若僅以插銷固定,在風扇17作動時會有因振動而產生聲響的情況。本實施形態中,押壓部53a與押壓部53b是配置於風扇殼體19。押壓部53a與押壓部53b是在風扇殼體19的風扇收納部41的附近將風扇17壓接於外框13。If it is only fixed with a plug, when the
在風扇殼體19與外框13兩邊配置有螺孔52a與螺孔52b。螺孔52a、52b是作為鎖緊部而發揮功能,前述鎖緊部是用以在押壓部53a、53b的附近將風扇殼體19與外框13鎖緊。A
將風扇17固定於風扇收納部41後,將螺絲***螺孔52a、52b並鎖緊。藉此,可以藉由押壓部53a、53b將風扇17以適當之強度壓接於外框13。其結果,可以抑制風扇17動作時,風扇17及風扇收納部41振動而產生振動音的情形。After the
押壓部53a、53b、或螺孔52a、52b是配置於固定部54a、54b的附近。固定部54a、54b是安裝風扇17時用以固定風扇17的構件。The
固定部54a、54b具有假定了在其附近施加某種程度的壓力的強度。因此,只要在固定部54a、54b的附近將風扇17壓接於外框13,便可不對風扇17的動作造成影響並抑制風扇17的振動。The fixing
螺孔52a、52b與配置於風扇殼體19之其他位置的其他螺孔52c具有相同的直徑。藉此,可以減少在組裝風扇殼體19時所使用之螺絲的種類,而可以減低製造成本。The screw holes 52 a and 52 b have the same diameter as other screw holes 52 c arranged in other positions of the
根據本實施形態,是將風扇17之一部分配置於電波洩漏防止板25之內側。藉此,可以縮短門7之高度,而可以實現加熱調理器1的小型化。藉由將基板15及通訊裝置40配置於門7內,可以在加熱室5內確保寬廣的空間,並使加熱調理器1小型化。According to this embodiment, a part of the
本實施形態中,是針對使用微波、加熱器、蒸氣來將被加熱物加熱之加熱調理器進行了說明。然而,本揭示之技術可適用於任意方式之加熱調理器。In this embodiment, the heating conditioner that uses microwaves, heaters, and steam to heat the object to be heated has been described. However, the technology of the present disclosure can be applied to any heating conditioner.
1:加熱調理器
3:箱體
3a:前框
3b:開口
5:加熱室
5a:上壁
5b,5c:側壁
5d:後壁
5e:底壁
7:門
7a:把手
9:顯示部
11:操作部
13:外框
14,49:吸氣口
15:基板
17:風扇
17a:吸入口
17b:吐出口
19:風扇殼體
19a,19b,43:貫通孔
19c:蓋體
19d,19e,19g,44,47:壁
19h:孔
19m:溝
21:第1金屬板
23:第2金屬板
25:電波洩漏防止板
27:內框
29:第1風路
31:第2風路
33:第3風路
40:通訊裝置
41:風扇收納部
42:通訊裝置收納部
45:排氣口
46:分隔壁
48:連接風路
50:引導件
51:框
52a,52b,52c:螺孔
53a,53b:押壓部
54a,54b:固定部1: Heating conditioner
3:
圖1是顯示本揭示之實施形態之加熱調理器的外觀的圖。Fig. 1 is a diagram showing the appearance of a heating conditioner according to an embodiment of the present disclosure.
圖2是顯示本實施形態之加熱調理器的外觀的圖。Fig. 2 is a diagram showing the appearance of the heating conditioner of the present embodiment.
圖3是門的分解立體圖。Fig. 3 is an exploded perspective view of the door.
圖4是將門的外框拆卸後的狀態下的加熱調理器的前方立體圖。Fig. 4 is a front perspective view of the heating conditioner in a state where the outer frame of the door is removed.
圖5是將內框及電波洩漏防止板拆卸後的狀態下的門之一部分的後方立體圖。Fig. 5 is a rear perspective view of a part of the door in a state where the inner frame and the radio wave leakage prevention plate are removed.
圖6是從圖5更進一步地將第2金屬板拆卸後的狀態下的門之一部分的後方立體圖。Fig. 6 is a rear perspective view of a part of the door in a state where the second metal plate is further removed from Fig. 5.
圖7是從圖6更進一步地將第1金屬板拆卸後的狀態下的門之一部分的後方立體圖。Fig. 7 is a rear perspective view of a part of the door in a state where the first metal plate is further removed from Fig. 6.
圖8是從圖7更進一步地將風扇殼體拆卸後的狀態下的門之一部分的後方立體圖。Fig. 8 is a rear perspective view of a part of the door in a state where the fan case is further removed from Fig. 7.
圖9是風扇殼體的前方立體圖。Fig. 9 is a front perspective view of the fan housing.
圖10是風扇及通訊裝置已收納於風扇殼體的狀態下的風扇殼體的前方立體圖。Fig. 10 is a front perspective view of the fan housing in a state where the fan and the communication device have been housed in the fan housing.
圖11是用以說明形成於風扇殼體之前面的風路的圖。Fig. 11 is a diagram for explaining the air passage formed on the front surface of the fan case.
圖12是用以說明形成於風扇殼體之後面的風路的圖。Fig. 12 is a diagram for explaining the air passage formed on the rear surface of the fan case.
圖13A是外框、風扇殼體、及電波洩漏防止板的後面圖。Fig. 13A is a rear view of the outer frame, the fan case, and the electric wave leakage prevention plate.
圖13B是沿著圖13A之13B-13B線的截面圖。Fig. 13B is a cross-sectional view taken along
圖13C是沿著圖13A之13B-13B線的截面的立體圖。Fig. 13C is a perspective view of a cross section taken along
圖14是外框與風扇殼體的後面立體圖。Fig. 14 is a rear perspective view of the outer frame and the fan housing.
圖15是風扇殼體的風扇收納部之周邊的放大圖。Fig. 15 is an enlarged view of the periphery of the fan housing portion of the fan case.
1:加熱調理器 1: Heating conditioner
3:箱體 3: cabinet
7:門 7: Door
7a:把手 7a: handle
9:顯示部 9: Display
11:操作部 11: Operation Department
13:外框 13: Outer frame
Claims (12)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019-166168 | 2019-09-12 | ||
JP2019166168A JP7253723B2 (en) | 2019-09-12 | 2019-09-12 | heating cooker |
Publications (1)
Publication Number | Publication Date |
---|---|
TW202124886A true TW202124886A (en) | 2021-07-01 |
Family
ID=74863003
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW109128659A TW202124886A (en) | 2019-09-12 | 2020-08-21 | Heating cooker |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP7253723B2 (en) |
CN (1) | CN112484097A (en) |
TW (1) | TW202124886A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP4174387A1 (en) * | 2021-10-28 | 2023-05-03 | LG Electronics Inc. | Cooking appliance |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20230061236A (en) * | 2021-10-28 | 2023-05-08 | 엘지전자 주식회사 | Electronic range |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2015129449A1 (en) * | 2014-02-27 | 2015-09-03 | シャープ株式会社 | Cooker |
JP6850126B2 (en) * | 2016-12-28 | 2021-03-31 | シャープ株式会社 | Cooker |
JP6906199B2 (en) * | 2018-02-28 | 2021-07-21 | パナソニックIpマネジメント株式会社 | Cooker |
JP6674528B2 (en) * | 2018-12-28 | 2020-04-01 | シャープ株式会社 | Cooker |
-
2019
- 2019-09-12 JP JP2019166168A patent/JP7253723B2/en active Active
-
2020
- 2020-08-21 TW TW109128659A patent/TW202124886A/en unknown
- 2020-09-08 CN CN202010934583.0A patent/CN112484097A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP4174387A1 (en) * | 2021-10-28 | 2023-05-03 | LG Electronics Inc. | Cooking appliance |
Also Published As
Publication number | Publication date |
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CN112484097A (en) | 2021-03-12 |
JP7253723B2 (en) | 2023-04-07 |
JP2021042912A (en) | 2021-03-18 |
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