TW202041580A - Heat conduction sheet, equip method of thereof and manufacture method of electronic component - Google Patents
Heat conduction sheet, equip method of thereof and manufacture method of electronic component Download PDFInfo
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- TW202041580A TW202041580A TW109103659A TW109103659A TW202041580A TW 202041580 A TW202041580 A TW 202041580A TW 109103659 A TW109103659 A TW 109103659A TW 109103659 A TW109103659 A TW 109103659A TW 202041580 A TW202041580 A TW 202041580A
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
Abstract
Description
本技術係關於一種貼附於電子零件等而提昇其散熱性之熱傳導片材、熱傳導片材之安裝方法及電子機器之製造方法。This technology relates to a heat-conducting sheet that is attached to electronic parts to improve heat dissipation, a method of mounting the heat-conducting sheet, and a method of manufacturing electronic equipment.
先前，於搭載於個人電腦等各種電氣設備或其他設備之半導體元件中，因驅動而產生熱，若產生之熱累積，則會對半導體元件之驅動或周邊設備產生不良影響，故使用各種冷卻方法。作為半導體元件等電子零件之冷卻方法，已知有：於該設備安裝風扇而將設備殼體內之空氣冷卻之方式、或於該應冷卻之半導體元件安裝散熱片或散熱板等散熱器之方法等。Previously, in semiconductor components mounted in various electrical equipment such as personal computers or other equipment, heat was generated by driving. If the generated heat accumulates, it will have an adverse effect on the driving of the semiconductor components or peripheral equipment, so various cooling methods are used. . As a cooling method for electronic parts such as semiconductor components, there are known: a method of installing a fan in the device to cool the air in the device casing, or a method of installing a heat sink such as a heat sink or a heat sink on the semiconductor component to be cooled, etc. .
於在半導體元件安裝散熱器進行冷卻之情形時，為了高效率地釋放半導體元件之熱，於半導體元件與散熱器之間設置有熱傳導片材。作為熱傳導片材，廣泛使用有於矽酮樹脂中分散含有碳纖維等熱傳導性填料等填充劑而成者(參照專利文獻1)。該等熱傳導性填料具有熱傳導之各向異性，例如於使用碳纖維作為熱傳導性填料之情形時，已知於纖維方向上具有約600 W/m・K～1200 W/m・K之熱傳導率，於使用氮化硼之情形時，於面方向上具有約110 W/m・K之熱傳導率，於與面方向垂直之方向上具有約2 W/m・K之熱傳導率，且具有各向異性。 [先前技術文獻] [專利文獻]When a heat sink is installed on a semiconductor element for cooling, in order to efficiently release the heat of the semiconductor element, a heat conductive sheet is arranged between the semiconductor element and the heat sink. As the thermally conductive sheet, a silicone resin in which a filler such as a thermally conductive filler such as carbon fiber is dispersed and contained in a silicone resin is widely used (see Patent Document 1). These thermally conductive fillers have anisotropy of thermal conductivity. For example, when carbon fiber is used as the thermally conductive filler, it is known to have a thermal conductivity of about 600 W/m·K to 1200 W/m·K in the fiber direction. When using boron nitride, it has a thermal conductivity of about 110 W/m·K in the plane direction and a thermal conductivity of about 2 W/m·K in the direction perpendicular to the plane direction, and has anisotropy. [Prior Technical Literature] [Patent Literature]
[專利文獻1]日本專利特開2014-031501號公報 [專利文獻2]日本專利特開2017-175080號公報[Patent Document 1] Japanese Patent Laid-Open No. 2014-031501 [Patent Document 2] Japanese Patent Laid-Open No. 2017-175080
[發明所欲解決之問題][The problem to be solved by the invention]
此處，個人電腦之CPU(Central Processing Unit，中央處理單元)等電子零件伴隨著其高速化、高性能化，其散熱量具有逐年增大之傾向。然而，相反地處理器等之晶片尺寸由於微細矽電路技術之進步而成為與先前同等之尺寸或更小之尺寸，每單位面積之熱流速變高。因此，為了避開因其溫度上升所致之異常等，要求將CPU等電子零件更有效率地散熱、冷卻。Here, as electronic components such as the CPU (Central Processing Unit) of personal computers increase their speed and performance, their heat dissipation tends to increase year by year. However, on the contrary, the chip size of a processor and the like has become the same size or smaller due to advances in micro-silicon circuit technology, and the heat flow rate per unit area has increased. Therefore, in order to avoid abnormalities caused by its temperature rise, it is required to more efficiently dissipate heat and cool electronic components such as CPUs.
為了提昇熱傳導片材之散熱特性，要求降低表示熱之難傳導性之指標即熱阻。為了降低熱阻，提昇對作為發熱體之電子零件或散熱器等散熱零件之密接性、或使熱傳導片材變薄而降低熱阻較為有效。In order to improve the heat dissipation characteristics of the thermally conductive sheet, it is required to reduce the thermal resistance, which is an index indicating the difficult conductivity of heat. In order to reduce the thermal resistance, it is more effective to improve the adhesion to the electronic parts as a heating element or the heat dissipating parts such as radiators, or to make the heat conductive sheet thinner to reduce the thermal resistance.
於將熱傳導性成形體切成薄片而製成熱傳導片材之情形時，切片所得之片材表面具有凹凸，缺乏與電子零件之密接性。若缺乏密接性，則於安裝步驟中會因不密接於零件而產生自零件掉落等異常，又，由於與作為發熱體之電子零件或散熱器等散熱體之密接性較差，故含有空氣，存在無法充分降低熱阻等問題。When a thermally conductive molded body is cut into thin slices to make a thermally conductive sheet, the surface of the sliced sheet has unevenness and lacks adhesion to electronic parts. If the adhesiveness is lacking, abnormalities such as dropping from the part due to the inadherence to the part during the installation step. In addition, due to the poor adhesiveness with the electronic parts as the heating element or the heat sink such as the radiator, it contains air. There are problems such as inability to sufficiently reduce thermal resistance.
針對此種問題，亦提出有如下技術：藉由將對熱傳導性成形體進行切片製作而成之熱傳導片材以剝離膜夾持並加壓，而使片材表面平滑化，並且使構成片材本體之高分子基質成分之未硬化成分滲出至表面而改善熱傳導片材與電子零件之密接性(專利文獻2)。In response to this problem, the following technology has also been proposed: a thermally conductive sheet produced by slicing a thermally conductive molded body is sandwiched by a release film and pressed to smooth the surface of the sheet and make the constituent sheet The unhardened component of the polymer matrix component of the main body oozes to the surface to improve the adhesion between the thermal conductive sheet and the electronic component (Patent Document 2).
另一方面，於較薄且柔軟之片材本體中，若高分子基質成分之未硬化成分滲出至片材表面，則於將熱傳導片材安裝至半導體裝置等電子零件時，難以自片材本體將剝離膜剝離，有損作業性。即，於使用熱傳導片材時，需要自片材本體將剝離膜剝離，但若於將一剝離膜剝離時，以片材本體附著於該一剝離膜上之狀態自另一剝離膜剝離，則會損及作業性。On the other hand, in a thin and flexible sheet body, if the unhardened component of the polymer matrix component oozes out to the surface of the sheet, it will be difficult to install the thermally conductive sheet to electronic parts such as semiconductor devices. Peeling the release film will impair workability. That is, when a thermally conductive sheet is used, the release film needs to be peeled off from the main body of the sheet, but if one release film is peeled off, the main body of the sheet is peeled off from the other release film while the main body is attached to the one release film. Will impair workability.
因此，本技術之目的在於提供一種可容易地自於片材表面具有黏性之片材本體將剝離膜剝離，從而提昇作業性之熱傳導片材、該熱傳導片材之安裝方法、及電子機器之製造方法。 [解決問題之技術手段]Therefore, the purpose of the present technology is to provide a heat-conducting sheet that can easily peel off the peeling film from a sheet body with adhesive on the surface of the sheet, thereby improving workability, a method of mounting the heat-conducting sheet, and an electronic device Manufacturing method. [Technical means to solve the problem]
為了解決上述問題，本技術之熱傳導片材具有：片材本體，其於表面具有黏性；第1剝離膜，其貼附於上述片材本體之一面；及第2剝離膜，其貼附於上述片材本體之與上述一面相反側之另一面；且上述第1剝離膜與上述第2剝離膜自上述片材本體剝離之強度不同。In order to solve the above problems, the thermally conductive sheet of the present technology has: a sheet body, which has adhesiveness on the surface; a first release film, which is attached to one side of the above-mentioned sheet body; and a second release film, which is attached to The other surface of the sheet body on the opposite side to the one surface; and the first release film and the second release film have different peel strengths from the sheet body.
又，本技術之熱傳導片材之安裝方法具有如下步驟：準備熱傳導片材，該熱傳導片材於片材本體之一面貼附有第1剝離膜，於上述片材本體之與上述一面相反側之另一面貼附有第2剝離膜；自上述片材本體之上述另一面側施加磁力，將上述第1剝離膜剝離；將上述片材本體之上述一面貼附於電子零件；以及將上述第2剝離膜剝離。In addition, the mounting method of the thermally conductive sheet of the present technology has the following steps: prepare a thermally conductive sheet, the thermally conductive sheet is attached to one side of the sheet body with a first release film, on the side of the sheet body opposite to the above-mentioned side A second release film is attached to the other side; a magnetic force is applied from the other side of the sheet body to peel off the first release film; the one side of the sheet body is attached to an electronic component; and the second The peeling film peeled off.
又，本技術之電子機器之製造方法係具有貼附有熱傳導片材之電子零件之電子機器之製造方法，且具有如下步驟：準備熱傳導片材，該熱傳導片材於片材本體之一面貼附有第1剝離膜，於上述片材本體之與上述一面相反側之另一面貼附有第2剝離膜；自上述片材本體之上述另一面施加磁力，將上述第1剝離膜剝離；將上述片材本體之上述一面貼附於電子零件；以及將上述第2剝離膜剝離。 [發明之效果]In addition, the manufacturing method of the electronic device of the present technology is a method of manufacturing an electronic device having electronic parts attached with a thermally conductive sheet, and has the following steps: preparing a thermally conductive sheet, and attaching the thermally conductive sheet to one side of the sheet body There is a first release film, and a second release film is attached to the other side of the sheet body on the opposite side to the one side; a magnetic force is applied from the other side of the sheet body to peel off the first release film; The one side of the sheet body is attached to the electronic component; and the second release film is peeled off. [Effects of Invention]
根據本技術，熱傳導片材藉由從自片材本體剝離之強度較小之剝離膜剝離，片材本體不會附著於該剝離膜而剝落，且不會損及作業性。According to the present technology, the thermally conductive sheet is peeled from the peeling film with less strength peeled from the sheet body, and the sheet body is not attached to the peeling film and peeled off, and workability is not impaired.
以下，一面參照圖式一面對適用本技術之熱傳導片材、熱傳導片材之安裝方法、及電子機器之製造方法進行詳細說明。再者，當然本技術並不僅限於以下之實施形態，於不脫離本技術主旨之範圍內，能夠進行各種變更。又，圖式係模式性者，各尺寸之比率等有時與實際不同。具體尺寸等應參照以下說明進行判斷。又，當然圖式相互間亦包含相互之尺寸之關係或比率不同之部分。Hereinafter, with reference to the drawings, a detailed description will be given on the heat-conducting sheet, the mounting method of the heat-conducting sheet, and the manufacturing method of electronic equipment to which this technology is applied. Furthermore, of course, the present technology is not limited to the following embodiments, and various changes can be made without departing from the spirit of the present technology. In addition, if the diagram is a model, the ratio of each size may be different from the actual one. The specific dimensions, etc. should be judged with reference to the following description. Furthermore, of course, the drawings also include parts with different sizes or ratios.
適用本技術之熱傳導片材之特徵在於，具有：片材本體，其於表面具有黏性；第1剝離膜，其貼附於上述片材本體之一面；及第2剝離膜，其貼附於上述片材本體之與上述一面相反側之另一面；且上述第1剝離膜與第2剝離膜自上述片材本體剝離之強度不同。The heat-conducting sheet applicable to this technology is characterized by having: a sheet body, which has adhesiveness on the surface; a first release film, which is attached to one side of the above-mentioned sheet body; and a second release film, which is attached to The other side of the sheet body on the opposite side to the one side; and the first release film and the second release film have different peel strengths from the sheet body.
藉此，熱傳導片材藉由從自片材本體剝離之強度較小之剝離膜剝離，片材本體不會附著於該剝離膜而剝落，且不會損及作業性。As a result, the thermally conductive sheet is peeled from the peeling film with lower strength peeled from the sheet body, and the sheet body is not attached to the peeling film and peeled off, and workability is not impaired.
又，剝離膜自片材本體剝離之強度亦根據剝離膜之厚度或材質而不同。因此，貼附於片材本體之第1、第2剝離膜藉由分別使厚度及/或材質不同，可使自片材本體剝離之強度不同。In addition, the peel strength of the peeling film from the sheet body also differs according to the thickness or material of the peeling film. Therefore, the first and second release films attached to the sheet body can have different strengths of peeling from the sheet body by making the thickness and/or material different.
作為第1、第2剝離膜之材質，可較佳地使用塑膠膜，可例示聚對苯二甲酸乙二酯膜或聚乙烯膜等。第1、第2剝離膜可以相同材質且不同厚度形成，亦可以不同材質且相同或不同之厚度形成。又，第1、第2剝離膜亦可為了容易地自片材本體剝離而實施剝離處理或壓紋加工中之任一者或兩者。藉由上述處理或加工亦能夠調整自片材本體剝離之強度。作為此種第1、第2剝離膜，例如可例示：經壓紋加工之聚乙烯膜、經蠟處理之PET(Polyethylene Terephthalate，聚對苯二甲酸乙二酯)膜、或經氟處理之PET膜等。As the material of the first and second release films, a plastic film can be preferably used, and a polyethylene terephthalate film or a polyethylene film can be exemplified. The first and second release films may be formed of the same material and different thicknesses, or may be formed of different materials and the same or different thicknesses. In addition, the first and second release films may be subjected to either or both of release treatment and embossing in order to be easily released from the sheet body. The strength of peeling from the sheet body can also be adjusted by the above treatment or processing. Examples of such first and second release films include: embossed polyethylene film, wax-treated PET (Polyethylene Terephthalate, polyethylene terephthalate) film, or fluorine-treated PET Film etc.
再者，第1、第2剝離膜自片材本體剝離之強度可根據與表現於片材本體之黏性之關係適當設定，但進行180度剝離時之剝離強度較佳設為0.01～0.1 N。又，第1、第2剝離膜進行180度剝離時之屈曲半徑(R)係根據膜之厚度或材質而適當設定，但較佳設為例如10 mm以下。Furthermore, the peel strength of the first and second peeling films from the sheet body can be appropriately set according to the relationship with the viscosity expressed on the sheet body, but the peel strength when peeling at 180 degrees is preferably set to 0.01～0.1 N . In addition, the flexion radius (R) when the first and second release films are peeled at 180 degrees is appropriately set according to the thickness or material of the film, but it is preferably set to 10 mm or less, for example.
作為片材本體，可較佳地使用至少包含高分子基質成分及纖維狀熱傳導性填充劑之熱傳導性樹脂組合物硬化而成者，又，作為高分子基質成分，可較佳地使用矽酮凝膠。As the main body of the sheet material, a thermally conductive resin composition containing at least a polymer matrix component and a fibrous thermal conductive filler can be preferably used, and as the polymer matrix component, a silicone coagulation can be preferably used. glue.
進而，片材本體較佳為包含磁性粉。如下所述，藉由含有磁性粉，熱傳導片材可施加磁力並僅將剝離膜剝離，亦可從自片材本體剝離之強度較大之剝離膜剝離。Furthermore, the sheet body preferably contains magnetic powder. As described below, by containing the magnetic powder, the thermally conductive sheet can apply a magnetic force and only peel off the release film, and can also be peeled off from the release film with a high peel strength from the main body of the sheet.
又，片材本體較佳為蕭氏OO硬度為50以下，且厚度為0.5 mm以下。熱傳導片材藉由具有蕭氏OO硬度為50以下之柔軟性，可提高與電子零件或散熱器等散熱構件之密接性，又，藉由使厚度薄至0.5 mm以下，可提高熱傳導率。In addition, the sheet body preferably has a Shore OO hardness of 50 or less and a thickness of 0.5 mm or less. The thermal conductive sheet has flexibility with a Shore OO hardness of 50 or less, which can improve the adhesion to heat dissipation components such as electronic parts or heat sinks. In addition, by making the thickness thinner to 0.5 mm or less, the thermal conductivity can be improved.
適用本技術之熱傳導片材之安裝步驟係從自片材本體剝離之強度較小之剝離膜、例如第2剝離膜剝離。藉此，不存在片材本體全部附著於第2剝離膜而自第1剝離膜剝離之情況，以支持於第1剝離膜之狀態使片材本體之另一面露出。熱傳導片材將露出之片材本體之另一面貼附於半導體裝置等電子零件或散熱器等散熱構件，其後，將第1剝離膜自片材本體之一面剝離。The mounting step of the thermally conductive sheet to which this technology is applied is to peel off a peeling film with a low strength, such as a second peeling film, which is peeled from the sheet body. Thereby, there is no case where the sheet body is completely attached to the second release film and peeled from the first release film, and the other side of the sheet body is exposed while being supported by the first release film. The thermally conductive sheet attaches the other side of the exposed sheet body to electronic parts such as semiconductor devices or heat dissipation members such as heat sinks, and then peels off the first peeling film from one surface of the sheet body.
此處，適用本技術之熱傳導片材之安裝步驟亦可自片材本體之另一面側施加磁力，而自剝離強度為第2剝離膜以上之第1剝離膜剝離。藉由自貼附有第2剝離膜之片材本體之另一面側施加磁力，將片材本體向第2剝離膜側牽引。因此，於將自片材本體剝離之強度為第2剝離膜以上之第1剝離膜剝離之情形時，亦可於不致有片材本體全部附著於第1剝離膜而自第2剝離膜剝離之情況下，以支持於第2剝離膜之狀態使片材本體之一面露出。Here, in the mounting step of the thermally conductive sheet to which this technology is applied, a magnetic force may be applied from the other side of the sheet body, and the peeling strength may be peeled from the first peeling film whose peel strength is higher than the second peeling film. By applying a magnetic force from the other side of the sheet body to which the second release film is attached, the sheet body is pulled to the second release film side. Therefore, when the first release film whose peel strength from the sheet body is higher than the second release film is peeled, it is also possible to prevent all the sheet body from being attached to the first release film and peeling from the second release film. In this case, one surface of the sheet body is exposed while being supported by the second release film.
熱傳導片材將露出之片材本體之一面貼附於半導體裝置等電子零件或散熱器等散熱構件，其後，將第2剝離膜自片材本體之另一面剝離。The heat conduction sheet attaches one surface of the exposed sheet body to electronic parts such as semiconductor devices or heat dissipation members such as heat sinks, and then peels off the second release film from the other surface of the sheet body.
又，熱傳導片材較佳為於片材本體中含有磁性粉。藉由片材本體中含有磁性粉，於自片材本體之另一面側經由第2剝離膜施加磁場時，可更確實地將片材本體向第2剝離膜側牽引，而僅將第1剝離膜自片材本體剝離。In addition, the thermally conductive sheet preferably contains magnetic powder in the sheet body. By containing magnetic powder in the main body of the sheet, when a magnetic field is applied from the other side of the main body through the second release film, the main body of the sheet can be pulled to the second release film side more reliably, and only the first release The film is peeled from the sheet body.
[熱傳導片材之構成例]
圖1中示出適用本技術之熱傳導片材之構成例。圖1所示之熱傳導片材1具有片材本體2，該片材本體2係使至少包含高分子基質成分及纖維狀熱傳導性填充劑之黏合劑樹脂硬化而成。片材本體2之一面2a貼合有第1剝離膜3，片材本體2之另一面2b貼合有第2剝離膜4。又，片材本體2於第1、第2剝離膜3、4與片材本體2之間，藉由自片材本體2滲出之高分子基質成分之未硬化成分而形成有樹脂被覆層5。[Example of composition of thermal conductive sheet]
Fig. 1 shows a configuration example of a thermally conductive sheet to which this technique is applied. The thermally
熱傳導片材1藉由在一面2a及另一面2b形成樹脂被覆層5而具有黏性(黏著性)，使用時藉由將第1、第2剝離膜3、4剝離而能夠將片材本體2貼附於特定位置。此時，如上所述，熱傳導片材1之第1、第2剝離膜3、4之剝離性提昇，作業性、操作性優異。又，熱傳導片材1之修正電子零件與散熱構件組裝時之位置偏移、暫時組裝後因某些緣故而解體且能夠再次組裝等再加工性亦優異。The thermally
[高分子基質成分]
構成片材本體2之高分子基質成分係成為熱傳導片材1之基材之高分子成分。其種類並未特別限定，可適當選擇公知之高分子基質成分。例如，作為高分子基質成分之一，可列舉熱固性聚合物。[High polymer matrix component]
The polymer matrix component constituting the
作為上述熱固性聚合物，例如可列舉：交聯橡膠、環氧樹脂、聚醯亞胺樹脂、雙馬來醯亞胺樹脂、苯并環丁烯樹脂、酚系樹脂、不飽和聚酯、鄰苯二甲酸二烯丙酯樹脂、矽酮樹脂、聚胺酯、聚醯亞胺矽酮、熱固型聚苯醚、熱固型改性聚苯醚等。其等可單獨使用1種，亦可併用2種以上。Examples of the above-mentioned thermosetting polymer include: crosslinked rubber, epoxy resin, polyimide resin, bismaleimide resin, benzocyclobutene resin, phenol resin, unsaturated polyester, o-phthalene Diallyl dicarboxylate resin, silicone resin, polyurethane, polyimide silicone, thermosetting polyphenylene ether, thermosetting modified polyphenylene ether, etc. These may be used individually by 1 type, and may use 2 or more types together.
再者，作為上述交聯橡膠，例如可列舉：天然橡膠、丁二烯橡膠、異戊二烯橡膠、腈橡膠、氫化腈橡膠、氯丁二烯橡膠、乙丙橡膠、氯化聚乙烯、氯磺化聚乙烯、丁基橡膠、鹵化丁基橡膠、氟橡膠、聚胺酯橡膠、丙烯酸橡膠、聚異丁烯橡膠、矽酮橡膠等。其等可單獨使用1種，亦可併用2種以上。Furthermore, as the above-mentioned crosslinked rubber, for example, natural rubber, butadiene rubber, isoprene rubber, nitrile rubber, hydrogenated nitrile rubber, chloroprene rubber, ethylene propylene rubber, chlorinated polyethylene, chlorine Sulfonated polyethylene, butyl rubber, halogenated butyl rubber, fluorine rubber, polyurethane rubber, acrylic rubber, polyisobutylene rubber, silicone rubber, etc. These may be used individually by 1 type, and may use 2 or more types together.
又，於該等熱固性聚合物中，就成形加工性及耐候性優異，並且對電子零件之密接性及追隨性之方面而言，較佳為使用矽酮樹脂。作為上述矽酮樹脂，未特別限制，可根據目的適當選擇矽酮樹脂之種類。Furthermore, among these thermosetting polymers, it is preferable to use a silicone resin in terms of excellent molding processability and weather resistance, and adhesion and followability to electronic parts. The silicone resin is not particularly limited, and the type of silicone resin can be appropriately selected according to the purpose.
就獲得上述成形加工性、耐候性、密接性等之觀點而言，作為上述矽酮樹脂，較佳為包含液狀矽酮凝膠之主劑及硬化劑之矽酮樹脂。作為此種矽酮樹脂，例如可列舉：加成反應型液狀矽酮樹脂、將過氧化物用於硫化之熱硫化型銑削型矽酮樹脂等。於其等之中，作為電子機器之散熱構件，由於要求電子零件之發熱面與散熱器面之密接性，故特佳為加成反應型液狀矽酮樹脂。From the viewpoint of obtaining the molding processability, weather resistance, adhesiveness, etc., the silicone resin is preferably a silicone resin containing a main agent of a liquid silicone gel and a curing agent. Examples of such silicone resins include addition reaction type liquid silicone resins, thermal vulcanization milling type silicone resins in which peroxide is used for vulcanization, and the like. Among them, as the heat dissipation member of electronic equipment, since it requires the adhesion between the heating surface of the electronic part and the surface of the radiator, the addition reaction type liquid silicone resin is particularly preferred.
作為上述加成反應型液狀矽酮樹脂，較佳為使用以具有乙烯基之聚有機矽氧烷作為主劑、以具有Si-H基之聚有機矽氧烷作為硬化劑之2液性之加成反應型矽酮樹脂。As the above-mentioned addition reaction type liquid silicone resin, it is preferable to use a two-component type consisting of polyorganosiloxane having a vinyl group as the main agent and polyorganosiloxane having a Si-H group as a curing agent. Addition reaction type silicone resin.
此處，液狀矽酮成分具有成為主劑之矽酮A液成分及包含硬化劑之矽酮B液成分，矽酮A液成分與矽酮B液成分以特定之比率調配。矽酮A液成分與矽酮B液成分之調配比率可適當調整，但較佳設為可賦予片材本體2柔軟性，並且於片材本體2之兩面2a、2b與第1、第2剝離膜之間滲出高分子基質成分之未硬化成分，可形成樹脂被覆層5之調配比率。Here, the liquid silicone component has a silicone fluid A component as a main agent and a silicone fluid B component containing a hardener, and the silicone fluid A component and the silicone fluid B component are blended at a specific ratio. The mixing ratio of the components of the silicone liquid A and the silicone liquid B can be adjusted appropriately, but it is preferably set to impart flexibility to the
又，熱傳導片材1中之上述高分子基質成分之含量未特別限制，可根據目的適當選擇，但就確保片材之成形加工性、或片材之密接性等之觀點而言，較佳為15體積%～50體積%左右，更佳為20體積%～45體積%。In addition, the content of the above-mentioned polymer matrix component in the thermally
[纖維狀熱傳導性填充劑]
熱傳導片材1中所含之纖維狀熱傳導性填充劑係用以提昇片材之熱傳導性之成分。關於熱傳導性填充劑之種類，只要為熱傳導性較高之纖維狀材料則無特別限定，但就可獲得更高之熱傳導性之方面而言，較佳為使用碳纖維。[Fibrous Thermal Conductive Filler]
The fibrous thermally conductive filler contained in the thermally
再者，關於熱傳導性填充劑，可單獨使用一種，亦可混合使用兩種以上。又，於使用兩種以上熱傳導性填充劑之情形時，可均為纖維狀熱傳導性填充劑，亦可混合使用纖維狀熱傳導性填充劑與其他形狀之熱傳導性填充劑。作為其他形狀之熱傳導性填充劑，可列舉：銀、銅、鋁等金屬；氧化鋁、氮化鋁、碳化矽、石墨等陶瓷等。In addition, regarding the thermally conductive filler, one kind may be used alone, or two or more kinds may be mixed and used. In addition, when two or more thermally conductive fillers are used, all of them may be fibrous thermally conductive fillers, or a mixture of fibrous thermally conductive fillers and thermally conductive fillers of other shapes may be used. Examples of thermally conductive fillers of other shapes include metals such as silver, copper, and aluminum; ceramics such as alumina, aluminum nitride, silicon carbide, and graphite.
關於上述碳纖維之種類，並未特別限制，可根據目的適當選擇。例如，可使用將瀝青系、PAN(Polyacrylonitrile，聚丙烯腈)系、PBO(Poly-p-phenylene benzoxazole，聚對苯撐苯并二噁唑)纖維石墨化而成者；利用電弧放電法、雷射蒸發法、CVD法(Chemical Vapor Deposition，化學氣相沈積法)、CCVD法(Catalyst Chemical Vapor Deposition，觸媒化學氣相沈積法)等合成者。其等之中，就獲得較高之熱傳導性之方面而言，更佳為將PBO纖維石墨化而成之碳纖維、瀝青系碳纖維。There are no particular restrictions on the type of the aforementioned carbon fiber, and it can be appropriately selected according to the purpose. For example, pitch-based, PAN (Polyacrylonitrile), PBO (Poly-p-phenylene benzoxazole, poly-p-phenylene benzoxazole) fiber graphitized can be used; arc discharge method, lightning Synthesizers such as jet evaporation, CVD (Chemical Vapor Deposition), and CCVD (Catalyst Chemical Vapor Deposition). Among them, in terms of obtaining higher thermal conductivity, carbon fiber and pitch-based carbon fiber obtained by graphitizing PBO fiber are more preferable.
又，上述碳纖維可根據需要對其一部分或全部進行表面處理而使用。作為上述表面處理，例如可列舉：氧化處理、氮化處理、硝化、磺化、或者於利用該等處理導入至表面之官能基或碳纖維之表面附著或結合金屬、金屬化合物、有機化合物等之處理等。作為上述官能基，例如可列舉：羥基、羧基、羰基、硝基、胺基等。In addition, the above-mentioned carbon fiber can be used by surface-treating a part or all of it as needed. Examples of the above-mentioned surface treatment include oxidation treatment, nitridation treatment, nitrification, sulfonation, or treatment of attaching or bonding metals, metal compounds, organic compounds, etc. to the surface of functional groups or carbon fibers introduced into the surface by these treatments. Wait. As said functional group, a hydroxyl group, a carboxyl group, a carbonyl group, a nitro group, an amino group, etc. are mentioned, for example.
進而，關於上述碳纖維之平均纖維長度(平均長軸長度)，亦並未特別限制，可適當選擇，但就確實地獲得較高之熱傳導性之方面而言，較佳為50 μm～300 μm之範圍，更佳為75 μm～275 μm之範圍，特佳為90 μm～250 μm之範圍。Furthermore, the average fiber length (average major axis length) of the above-mentioned carbon fiber is not particularly limited, and can be selected appropriately, but in terms of reliably obtaining high thermal conductivity, it is preferably 50 μm to 300 μm. The range is more preferably 75 μm to 275 μm, particularly preferably 90 μm to 250 μm.
進而，又，關於上述碳纖維之平均纖維直徑(平均短軸長度)，亦並未特別限制，可適當選擇，但就確實地獲得較高之熱傳導性之方面而言，較佳為4 μm～20 μm之範圍，更佳為5 μm～14 μm之範圍。Furthermore, the average fiber diameter (average minor axis length) of the above-mentioned carbon fiber is not particularly limited, and can be selected appropriately, but in terms of reliably obtaining high thermal conductivity, it is preferably 4 μm to 20 The range of μm is more preferably the range of 5 μm to 14 μm.
關於上述碳纖維之縱橫比(平均長軸長度/平均短軸長度)，就確實地獲得較高之熱傳導性之方面而言，較佳為8以上，更佳為9～30。若上述縱橫比未達8，則由於碳纖維之纖維長度(長軸長度)較短，故有熱傳導率降低之虞，另一方面，若超過30，則於熱傳導片材1中之分散性降低，故有無法獲得充分之熱傳導率之虞。Regarding the aspect ratio (average major axis length/average minor axis length) of the above-mentioned carbon fiber, it is preferably 8 or more, more preferably 9-30 in terms of reliably obtaining high thermal conductivity. If the aspect ratio is less than 8, the fiber length (major axis length) of the carbon fiber is short, so the thermal conductivity may decrease. On the other hand, if it exceeds 30, the dispersibility in the thermal
此處，上述碳纖維之平均長軸長度、及平均短軸長度可利用例如顯微鏡、掃描式電子顯微鏡(SEM，Scanning Electron Microscope)等測定，自複數個樣本運算平均值。Here, the average long axis length and average short axis length of the carbon fiber can be measured with a microscope, a scanning electron microscope (SEM, Scanning Electron Microscope), etc., and the average value is calculated from a plurality of samples.
又，作為熱傳導片材1中之上述纖維狀熱傳導性填充劑之含量，未特別限制，可根據目的適當選擇，但較佳為4體積%～40體積%，更佳為5體積%～35體積%。若上述含量未達4體積%，則有難以獲得足夠低之熱阻之虞，若超過40體積%，則有對熱傳導片材1之成型性及上述纖維狀熱傳導性填充劑之定向性帶來影響之虞。又，熱傳導片材1中之包含纖維狀熱傳導性填充劑之熱傳導性填充劑之含量較佳為15體積%～75體積%。In addition, the content of the fibrous thermally conductive filler in the thermally
再者，纖維狀熱傳導性填充劑露出至片材本體2之兩面2a、2b，與電子零件等熱源或散熱器等散熱構件熱接觸。熱傳導片材1於露出至片材本體2之兩面2a、2b之纖維狀熱傳導性填充劑由高分子基質成分之未硬化成分被覆之情形時，搭載於電子零件等時可降低纖維狀熱傳導性填充劑與電子零件等之接觸熱阻。Furthermore, the fibrous thermally conductive filler is exposed on both
[無機物填料]
熱傳導片材1亦可進而含有無機物填料作為熱傳導性填充劑。藉由含有無機物填料，可更加提高熱傳導片材1之熱傳導性，並提昇片材之強度。作為上述無機物填料，對形狀、材質、平均粒徑等並無特別限制，可根據目的適當選擇。作為上述形狀，例如可列舉：球狀、橢圓球狀、塊狀、粒狀、扁平狀、針狀等。其等之中，球狀、橢圓形就填充性之方面而言較佳，特佳為球狀。[Inorganic Filler]
The thermally
作為上述無機物填料之材料，例如可列舉：氮化鋁(aluminum nitride：AlN)、二氧化矽、氧化鋁(alumina)、氮化硼、二氧化鈦、玻璃、氧化鋅、碳化矽、矽(Silicon)、氧化矽、金屬粒子等。其等可單獨使用一種，亦可併用兩種以上。其等之中，較佳為氧化鋁、氮化硼、氮化鋁、氧化鋅、二氧化矽，就熱傳導率之方面而言，特佳為氧化鋁、氮化鋁。As the material of the above-mentioned inorganic filler, for example, aluminum nitride (AlN), silicon dioxide, aluminum oxide (alumina), boron nitride, titanium dioxide, glass, zinc oxide, silicon carbide, silicon (Silicon), Silicon oxide, metal particles, etc. These may be used individually by 1 type, and may use 2 or more types together. Among them, aluminum oxide, boron nitride, aluminum nitride, zinc oxide, and silicon dioxide are preferred. In terms of thermal conductivity, aluminum oxide and aluminum nitride are particularly preferred.
又，上述無機物填料可使用被實施了表面處理者。若作為上述表面處理以偶合劑處理上述無機物填料，則上述無機物填料之分散性提昇，熱傳導片材1之柔軟性提昇。In addition, as the above-mentioned inorganic filler, one that has been surface-treated can be used. If the above-mentioned inorganic filler is treated with a coupling agent as the above-mentioned surface treatment, the dispersibility of the above-mentioned inorganic filler is improved, and the flexibility of the thermal
關於上述無機物填料之平均粒徑，可根據無機物之種類等適當選擇。於上述無機物填料係氧化鋁之情形時，其平均粒徑較佳為1 μm～10 μm，更佳為1 μm～5 μm，特佳為4 μm～5 μm。若上述平均粒徑未達1 μm，則有黏度變大、不易混合之虞。另一方面，若上述平均粒徑超過10 μm，則有熱傳導片材1之熱阻變大之虞。Regarding the average particle size of the above-mentioned inorganic filler, it can be appropriately selected according to the kind of inorganic substance and the like. In the case of the above-mentioned inorganic filler type alumina, the average particle size is preferably 1 μm to 10 μm, more preferably 1 μm to 5 μm, and particularly preferably 4 μm to 5 μm. If the above-mentioned average particle size is less than 1 μm, the viscosity may increase and mixing may be difficult. On the other hand, if the average particle size exceeds 10 μm, the thermal resistance of the thermal
進而，於上述無機物填料係氮化鋁之情形時，其平均粒徑較佳為0.3 μm～6.0 μm，更佳為0.3 μm～2.0 μm，特佳為0.5 μm～1.5 μm。若上述平均粒徑未達0.3 μm，則有黏度變大、不易混合之虞，若超過6.0 μm，則有熱傳導片材1之熱阻變大之虞。Furthermore, in the case of the above-mentioned inorganic filler-based aluminum nitride, the average particle size is preferably 0.3 μm to 6.0 μm, more preferably 0.3 μm to 2.0 μm, particularly preferably 0.5 μm to 1.5 μm. If the above-mentioned average particle size is less than 0.3 μm, the viscosity may increase and mixing is difficult, and if it exceeds 6.0 μm, the thermal resistance of the thermal
再者，上述無機物填料之平均粒徑例如可利用粒度分佈計、掃描式電子顯微鏡(SEM)進行測定。In addition, the average particle size of the above-mentioned inorganic filler can be measured by, for example, a particle size distribution meter or a scanning electron microscope (SEM).
[其他成分]
熱傳導片材1除了包含上述高分子基質成分及纖維狀熱傳導性填充劑、以及適當含有之無機物填料以外，還可根據目的適當包含其他成分。作為其他成分，例如可列舉：磁性粉、觸變性賦予劑、分散劑、硬化促進劑、延遲劑、微黏著賦予劑、塑化劑、阻燃劑、抗氧化劑、穩定劑、著色劑等。[Other ingredients]
The thermally
[磁性粉]
熱傳導片材1藉由含有磁性粉，如下所述，於自片材本體2之另一面2b側施加磁場時，可更確實地將片材本體2向第2剝離膜4側牽引，僅將第1剝離膜3自片材本體2剝離。又，熱傳導片材1亦可藉由調整磁性粉之含量，而對熱傳導片材1賦予電磁波吸收性能。[Magnetic powder]
Since the thermally
關於上述磁性粉之種類，除具有磁性以外，並未特別限定，可適當選擇公知之磁性粉。例如可使用非晶質金屬粉、或結晶質金屬粉末。作為非晶質金屬粉，例如可列舉：Fe-Si-B-Cr系、Fe-Si-B系、Co-Si-B系、Co-Zr系、Co-Nb系、Co-Ta系者等，作為結晶質金屬粉，例如可列舉：純鐵、Fe系、Co系、Ni系、Fe-Ni系、Fe-Co系、Fe-Al系、Fe-Si系、Fe-Si-Al系、Fe-Ni-Si-Al系者等。進而，作為上述結晶質金屬粉，亦可使用向結晶質金屬粉中添加微量之N(氮)、C(碳)、O(氧)、B(硼)等使其微細化而成之微結晶質金屬粉。The type of the above-mentioned magnetic powder is not particularly limited except that it has magnetism, and a known magnetic powder can be appropriately selected. For example, amorphous metal powder or crystalline metal powder can be used. Examples of amorphous metal powders include Fe-Si-B-Cr series, Fe-Si-B series, Co-Si-B series, Co-Zr series, Co-Nb series, Co-Ta series, etc. As the crystalline metal powder, for example, pure iron, Fe-based, Co-based, Ni-based, Fe-Ni-based, Fe-Co, Fe-Al, Fe-Si, Fe-Si-Al, Fe-Ni-Si-Al series etc. Furthermore, as the above-mentioned crystalline metal powder, microcrystals obtained by adding a small amount of N (nitrogen), C (carbon), O (oxygen), B (boron), etc., to the crystalline metal powder to be refined can also be used. Quality metal powder.
再者，關於上述磁性金屬粉，亦可使用將材料不同者、或平均粒徑不同者混合兩種以上而成者。In addition, with regard to the above-mentioned magnetic metal powder, a mixture of two or more different materials or different average particle diameters may also be used.
又，關於上述磁性金屬粉，較佳為調整球狀、扁平狀等形狀。例如，於提高填充性之情形時，較佳為使用粒徑為數μm～數十μm且為球狀之磁性金屬粉。此種磁性金屬粉末可利用例如霧化法、或將金屬羰基化合物熱分解之方法而製造。霧化法係如下方法：具有容易製作球狀粉末之優點，使熔融金屬自噴嘴流出，向流出之熔融金屬噴附空氣、水、惰性氣體等噴流製成液滴，使其凝固而製作粉末。於利用霧化法製造非晶質磁性金屬粉末時，為了使熔融金屬不結晶化，較佳為將冷卻速度設為1×106 (K/s)左右。Moreover, it is preferable to adjust the shape of a spherical shape, a flat shape, etc. about the said magnetic metal powder. For example, in the case of improving fillability, it is preferable to use spherical magnetic metal powder having a particle size of several μm to several tens of μm. Such magnetic metal powder can be produced by, for example, an atomization method or a method of thermally decomposing the metal carbonyl compound. The atomization method is the following method: it has the advantage of making spherical powder easy to make molten metal flow out of the nozzle, spray air, water, inert gas and other jets on the molten metal flowing out to form droplets, and solidify to produce powder. When manufacturing the amorphous magnetic metal powder by the atomization method, in order to prevent the molten metal from crystallizing, it is preferable to set the cooling rate to about 1×10 6 (K/s).
於利用上述霧化法製造非晶質合金粉之情形時，可使非晶質合金粉之表面成為平滑之狀態。若將如此表面凹凸較少、比表面積較小之非晶質合金粉用作磁性金屬粉，則可提高對於高分子基質成分之填充性。進而，藉由進行耦合處理可進一步提昇填充性。When the amorphous alloy powder is produced by the above-mentioned atomization method, the surface of the amorphous alloy powder can be made into a smooth state. If such an amorphous alloy powder with less surface unevenness and a smaller specific surface area is used as the magnetic metal powder, the filling property for the polymer matrix component can be improved. Furthermore, the filling property can be further improved by performing coupling processing.
[熱傳導片材之製造方法]
繼而，對熱傳導片材1之製造步驟進行說明。適用本技術之熱傳導片材1之製造步驟具有：使高分子基質成分中含有纖維狀熱傳導性填充劑等之熱傳導性樹脂組合物成型為特定形狀並硬化，而形成熱傳導性成形體之步驟(步驟A)；將上述熱傳導性成形體切片成片狀，形成成形體片材之步驟(步驟B)；及藉由將成形體片材以第1、第2剝離膜夾持並加壓，而使成形體片材表面平滑化並且形成樹脂被覆層5之步驟(步驟C)。[Manufacturing method of thermal conductive sheet]
Next, the manufacturing process of the heat
[步驟A] 於該步驟A中，調配上述高分子基質成分及纖維狀熱傳導性填充劑、適當含有之無機物填料、磁性粉及其他成分，製備熱傳導性樹脂組合物。再者，關於調配、製備各成分之順序並未特別限定，例如，藉由向高分子基質成分中添加纖維狀熱傳導性填充劑，且適當添加無機物填料、磁性粉及其他成分並混合，而進行熱傳導性樹脂組合物之製備。[Step A] In this step A, the above-mentioned polymer matrix component and fibrous thermally conductive filler, suitably contained inorganic filler, magnetic powder and other components are prepared to prepare a thermally conductive resin composition. Furthermore, the order of compounding and preparing each component is not particularly limited. For example, it is performed by adding a fibrous thermal conductive filler to the polymer matrix component, and appropriately adding and mixing inorganic fillers, magnetic powder, and other components. Preparation of thermally conductive resin composition.
繼而，使碳纖維等纖維狀熱傳導性填充劑定向為一方向。該填充劑之定向方法只要係可定向為一方向之方法，則不特別限定。例如，藉由將上述熱傳導性樹脂組合物於高剪力下擠出或壓入至中空狀之模具內，可相對較容易地使纖維狀熱傳導性填充劑定向為一方向，上述纖維狀熱傳導性填充劑之定向相同(±10°以內)。Then, fibrous thermal conductive fillers such as carbon fibers are oriented in one direction. The orientation method of the filler is not particularly limited as long as it can be oriented in one direction. For example, by extruding or pressing the above-mentioned thermally conductive resin composition into a hollow mold under high shear, the fibrous thermally conductive filler can be oriented in one direction relatively easily. The orientation of the filler is the same (within ±10°).
作為上述將上述熱傳導性樹脂組合物於高剪力下擠出或壓入至中空狀之模具內之方法，具體而言，可列舉擠出成型法或模具成型法。於上述擠出成型法中，將上述熱傳導性樹脂組合物自模具擠出時，或者於上述模具成型法中，將上述熱傳導性樹脂組合物向模具壓入時，上述熱傳導性樹脂組合物流動，纖維狀熱傳導性填充劑沿其流動方向定向。此時，若於模具之前端安裝狹縫，則纖維狀熱傳導性填充劑更容易定向。As the method of extruding or pressing the above-mentioned thermally conductive resin composition into a hollow mold under high shearing force, specifically, an extrusion molding method or a die molding method can be cited. In the extrusion molding method, when the thermally conductive resin composition is extruded from a die, or in the mold molding method, when the thermally conductive resin composition is pressed into the die, the thermally conductive resin composition flows, The fibrous thermally conductive filler is oriented along its flow direction. At this time, if a slit is installed at the front end of the mold, the fibrous thermal conductive filler is more easily oriented.
被擠出或壓入至中空狀之模具內之上述熱傳導性樹脂組合物成型為與該模具之形狀、大小對應之塊狀，藉由維持著纖維狀熱傳導性填充劑之定向狀態使上述高分子基質成分硬化，而形成熱傳導性成形體。熱傳導性成形體係指成為切斷為特定尺寸而獲得之熱傳導片材1之來源之片材切出用母材(成形體)。The thermally conductive resin composition extruded or pressed into a hollow mold is molded into a block corresponding to the shape and size of the mold, and the orientation of the fibrous thermally conductive filler is maintained to make the polymer The matrix component hardens to form a thermally conductive molded body. The thermally conductive forming system refers to a base material (formed body) for sheet cutting that becomes the source of the thermally
中空狀之模具及熱傳導性成形體之大小及形狀可根據所要求之熱傳導片材1之大小、形狀而決定，例如可列舉剖面之縱向大小為0.5 cm～15 cm、橫向大小為0.5 cm～15 cm之長方體。長方體之長度根據需要決定即可。The size and shape of the hollow mold and the thermally conductive molded body can be determined according to the required size and shape of the thermally
關於使上述高分子基質成分硬化之方法或條件，可根據高分子基質成分之種類而改變。例如，於上述高分子基質成分為熱硬化樹脂之情形時，可調整熱硬化時之硬化溫度。進而，於該熱固性樹脂係含有液狀矽酮凝膠之主劑及硬化劑者之情形時，較佳為以80℃～120℃之硬化溫度進行硬化。又，作為熱硬化時之硬化時間，並未特別限制，可設為1小時～10小時。The method or conditions for hardening the above-mentioned polymer matrix component can be changed according to the type of the polymer matrix component. For example, when the aforementioned polymer matrix component is a thermosetting resin, the curing temperature during thermosetting can be adjusted. Furthermore, when the thermosetting resin contains a liquid silicone gel main agent and a curing agent, it is preferably cured at a curing temperature of 80°C to 120°C. In addition, the curing time at the time of thermal curing is not particularly limited, and it can be set to 1 hour to 10 hours.
[步驟B]
如圖2所示，於將熱傳導性成形體6切片為片狀，而形成成形體片材7之步驟B中，以相對於已定向之纖維狀熱傳導性填充劑之長軸方向成為0°～90°之角度之方式，將熱傳導性成形體6切斷為片狀。藉此，纖維狀熱傳導性填充劑可於片材本體2之厚度方向上定向。[Step B]
As shown in FIG. 2, in the step B of slicing the thermally conductive molded
又，關於熱傳導性成形體6之切斷，使用切片裝置進行。關於切片裝置，只要為能夠切斷上述熱傳導性成形體6之機構則不特別限定，可適當使用公知之切片裝置。例如，可使用超音波切割器、鉋子(刨)等。In addition, the cutting of the thermally conductive molded
熱傳導性成形體6之切片厚度成為熱傳導片材1之片材本體2之厚度，可根據熱傳導片材1之用途適當設定，例如為0.5～3.0 mm。The slice thickness of the thermally conductive molded
再者，於步驟B中，亦可藉由對自熱傳導性成形體6切下之成形體片材7切出切口，而小片化成複數個成形體片材7。Furthermore, in step B, the formed
[步驟C]
於步驟C中，藉由將第1剝離膜3貼附於成形體片材7之一面，將第2剝離膜4貼附於成形體片材7之另一面並加壓，可使片材表面平滑化並且使高分子基質成分之未硬化成分滲出，藉此，可於片材表面與第1、第2剝離膜3、4之間形成樹脂被覆層5。藉此，熱傳導片材1可使片材表面之凹凸減少，並且使露出之纖維狀熱傳導性填充劑被覆，提昇與熱源或散熱構件之密接性，緩解輕負載時之界面接觸阻力，提昇熱傳導效率。[Step C]
In step C, by attaching the
關於上述加壓，例如可使用包括平板及表面平坦之加壓頭之一對加壓裝置進行。又，亦可使用夾送輥進行加壓。Regarding the above-mentioned pressing, for example, a pressing device including a flat plate and a pressing head having a flat surface may be used. In addition, a pinch roller can also be used for pressure.
作為上述加壓時之壓力，並未特別限制，可根據目的適當選擇，但若過低則有熱阻與不加壓之情形時無變化之傾向，若過高則有片材延伸之傾向，故較佳設為0.1 MPa～100 MPa之壓力範圍，更佳設為0.5 MPa～95 MPa之壓力範圍。The pressure at the time of pressurization is not particularly limited and can be appropriately selected according to the purpose. However, if it is too low, the thermal resistance tends to not change when it is not pressurized, and if it is too high, the sheet tends to stretch. Therefore, it is preferably set to a pressure range of 0.1 MPa to 100 MPa, and more preferably set to a pressure range of 0.5 MPa to 95 MPa.
作為貼附於成形體片材7之兩面之第1、第2剝離膜3、4，例如可使用PET膜或聚乙烯膜等塑膠膜。於此情形時，可對第1、第2剝離膜3、4之向成形體片材7表面之貼附面實施蠟處理或氟處理等剝離處理。又，亦可對第1、第2剝離膜3、4實施壓紋加工。As the first and
又，第1、第2剝離膜3、4藉由使厚度及/或材質不同，而形成為自片材本體2剝離之強度(N)不同。例如，於30 mm×30 mm之熱傳導片材1中，使用被實施了蠟處理之厚度25 μm之PET膜作為第1剝離膜3、使用經壓紋處理之厚度80 μm之聚乙烯膜作為第2剝離膜4之情形時，於拉伸、壓縮試驗機中，若以荷重元：50(N)、速度：300 mm/min之條件進行180度剝離試驗，則關於自片材本體2剝離之強度(N)，第1剝離膜3為0.03(N)(屈曲半徑3 mm)，第2剝離膜4為0.05(N)(屈曲半徑0.5 mm以下)。In addition, the first and
[熱傳導片材之安裝步驟]
於實際使用時，熱傳導片材1例如安裝於半導體裝置等電子零件、或散熱器等各種散熱構件。此時，熱傳導片材1從自片材本體2剝離之強度較小之剝離膜、例如以上述例而言為第1剝離膜3剝離。藉此，不存在片材本體2之全部附著於第1剝離膜3而自第2剝離膜4剝離之情況，能以支持於第2剝離膜4之狀態使片材本體2之一面2a露出。熱傳導片材1將樹脂被覆層5露出之片材本體2之一面2a貼附於半導體裝置等電子零件或散熱器等散熱構件，其後，將第2剝離膜4自片材本體2之另一面2b剝離。[Installation steps of thermal conductive sheet]
In actual use, the thermally
此處，適用本技術之熱傳導片材1之安裝步驟與上述例相反，於第1剝離膜3之剝離強度(N)為第2剝離膜4之剝離強度(N)以上之情形時，亦可自片材本體2之另一面側2b施加磁力，自第1剝離膜3進行剝離。藉由自貼附有第2剝離膜3之片材本體2之另一面2b側施加磁力，而將片材本體2向第2剝離膜4側牽引。因此，熱傳導片材1於將剝離強度為第2剝離膜4以上之第1剝離膜3剝離之情形時，亦不存在片材本體2之全部附著於第1剝離膜3而自第2剝離膜4剝離之情況，能以支持於第2剝離膜4之狀態使片材本體2之一面2a露出。Here, the installation procedure of the thermally
作為自片材本體2之另一面2b側施加磁力之方法，例如可列舉：如圖3所示般使磁體8密接於第2剝離膜4之方法、或將熱傳導片材1朝向第2剝離膜4側載置於內置有產生磁場之線圈之支持台上等方法。As a method of applying magnetic force from the
此時，熱傳導片材1較佳為於片材本體2中含有磁性粉。藉由片材本體2中含有磁性粉，於自片材本體2之另一面2b側施加磁場時，可更確實地使片材本體2向第2剝離膜4側磁吸附，僅將第1剝離膜3自片材本體2剝離。At this time, the thermally
熱傳導片材1將樹脂被覆層5露出之片材本體2之一面2a貼附於半導體裝置等電子零件或散熱器等散熱構件，其後，將第2剝離膜4自片材本體2之另一面2b剝離。The thermally
例如，如圖4所示，熱傳導片材1被安裝至內置於各種電子機器中之半導體裝置50，夾持於熱源與散熱構件之間。圖4所示之半導體裝置50至少具有電子零件51、熱散播器52、及熱傳導片材1，熱傳導片材1夾持於熱散播器52與電子零件51之間。藉由使用熱傳導片材1，半導體裝置50會具有較高之散熱性，又，與片材本體2中之磁性粉含量相應地電磁波抑制效果亦優異。For example, as shown in FIG. 4, the thermally
作為電子零件51，並未特別限制，可根據目的適當選擇，例如可列舉：CPU、MPU(Microprocessing Unit，微處理裝置)、圖形運算元件、影像感測器等各種半導體元件；天線元件；電池等。熱散播器52只要係將電子零件51產生之熱進行散熱之構件則不特別限制，可根據目的適當選擇。熱傳導片材1夾持於熱散播器52與電子零件51之間。又，熱傳導片材1藉由夾持於熱散播器52與散熱器53之間，與熱散播器52一併構成將電子零件51之熱進行散熱之散熱構件。The
熱傳導片材1之安裝位置並不限於熱散播器52與電子零件51之間、或熱散播器52與散熱器53之間，當然可根據電子機器或半導體裝置之構成適當選擇。又，作為散熱構件，除熱散播器52或散熱器53以外，只要為可傳導自熱源產生之熱並將其放散至外部者即可，例如可列舉：散熱器、冷卻器、晶片座、印刷基板、冷卻風扇、珀爾帖元件、熱管、金屬外罩、殼體等。
[實施例]The installation position of the heat
[第1實施例][First Embodiment]
繼而，對本技術之第1實施例進行說明。於第1實施例中，於2液性之加成反應型液狀矽酮中混合磁性粉47 vol%、作為纖維狀填料之平均纖維長度200 μm之瀝青系碳纖維18.5 vol%，製備矽酮組合物。2液性之加成反應型液狀矽酮樹脂係使用以有機聚矽氧烷作為主成分者，以成為主劑之矽酮A劑與包含硬化劑之B劑之調配比成為18.7 vol%：15.3 vol%之方式調配。以沿著中空四角柱狀模具(50 mm×50 mm)之內壁之方式貼附經剝離處理之膜之過程中將所獲得之矽酮組合物擠出成形，成型50 mm見方之矽酮成型體後於烘箱中以100℃加熱6小時而製成矽酮硬化物。自中空四角柱狀模具取出矽酮硬化物(熱傳導性成形體)後將經剝離處理之膜剝落，以厚度成為0.5 mm之方式以切片機切斷為片狀。將切片所獲得之成形體片材排列15片，夾於厚度50 μm之第1、第2剝離膜中，於壓力0.5MPa、溫度87℃、時間3分鐘之條件下進行加壓，而獲得形成有樹脂被覆層之熱傳導片材。所獲得之熱傳導片材之片材本體之蕭氏硬度(shoreOO)為45。將片材本體兩面之剝離膜剝離後，確認具有因滲油而產生之黏性。Next, the first embodiment of the present technology will be described. In the first example, 47 vol% of magnetic powder and 18.5 vol% of pitch-based carbon fiber with an average fiber length of 200 μm as a fibrous filler were mixed with a 2-component addition reaction type liquid silicone to prepare a silicone combination Things. 2-component addition reaction type liquid silicone resin uses organopolysiloxane as the main component, and the mixing ratio of silicone A as the main agent and B agent containing hardener is 18.7 vol%: 15.3 vol% deployment. In the process of attaching the peeled film along the inner wall of a hollow quadrangular cylindrical mold (50 mm×50 mm), the obtained silicone composition is extruded and molded into a 50 mm square silicone molding After the body is heated in an oven at 100°C for 6 hours, a cured silicone product is made. Take out the cured silicone (thermally conductive molded body) from the hollow quadrangular cylindrical mold, peel off the peeled film, and cut it into pieces with a slicer so that the thickness becomes 0.5 mm. Arrange 15 pieces of the formed sheet obtained by slicing, sandwich the first and second release films with a thickness of 50 μm, and apply pressure under the conditions of a pressure of 0.5 MPa, a temperature of 87° C., and a time of 3 minutes to obtain a formation Thermal conductive sheet with resin coating. The ShoreOO hardness of the sheet body of the obtained heat conductive sheet was 45. After peeling off the peeling film on both sides of the sheet body, it was confirmed that it had viscosity due to oil leakage.
於第1實施例中，將第1剝離膜自所獲得之熱傳導片材之片材本體剝離，確認、評估了作業性。再者，其後，於使片材本體密接於鋁板後，亦確認了剝落第2剝離膜時之作業性。評估係將僅剝離膜自片材本體剝離之情形評估為良好(○)，將於剝離之剝離膜上附著有片材本體之一部分之情形評估為普通(△)，將於剝離之剝離膜上附著有片材本體之全部之情形評估為不良(×)。In the first example, the first release film was peeled from the sheet body of the obtained thermally conductive sheet, and the workability was confirmed and evaluated. Furthermore, after the sheet body was adhered to the aluminum plate, the workability when peeling off the second release film was also confirmed. In the evaluation system, only the peeling of the peeling film from the sheet body was evaluated as good (○), and the peeled peeling film with a part of the sheet body attached to it was evaluated as normal (△), and the peeled peeling film was evaluated The case where all of the sheet body was attached was evaluated as bad (×).
針對貼附有表1所示之剝離膜之熱傳導片材，於拉伸、壓縮試驗機((股)島津製作所製造之精密萬能試驗機AGS-50NX)中，於荷重元：50(N)、速度：300 mm/min之條件下進行剝離膜之180度剝離試驗，測定了剝離強度(N)及屈曲半徑(R)。For the thermal conductive sheet with the peeling film shown in Table 1, in the tensile and compression testing machine (the precision universal testing machine AGS-50NX manufactured by Shimadzu Corporation), the load element: 50 (N), Speed: A 180-degree peel test of the peeling film was performed under the condition of 300 mm/min, and the peel strength (N) and flexion radius (R) were measured.
[表1]
[實施例1] 於實施例1中，使用以蠟進行了剝離處理之厚度25 μm之PET膜(剝離強度：0.03 N)作為第1剝離膜，使用經壓紋處理之厚度80 μm之聚乙烯膜(剝離強度：0.05 N)作為第2剝離膜。[Example 1] In Example 1, a PET film with a thickness of 25 μm (peel strength: 0.03 N) that was peeled off with wax was used as the first peeling film, and a polyethylene film with a thickness of 80 µm that was embossed was used (peel strength: 0.05 N) As the second release film.
[實施例2] 於實施例2中，使用經壓紋處理之厚度300 μm之聚乙烯膜(剝離強度：0.015 N)作為第1剝離膜，使用以蠟進行了剝離處理之厚度25 μm之PET膜(剝離強度：0.03 N)作為第2剝離膜。[Example 2] In Example 2, an embossed polyethylene film with a thickness of 300 μm (peel strength: 0.015 N) was used as the first release film, and a PET film with a thickness of 25 μm that was peeled off with wax (peel strength: 0.03 N) as the second release film.
[實施例3] 於實施例3中，使用以蠟進行了剝離處理之厚度25 μm之PET膜(剝離強度：0.03 N)作為第1剝離膜，使用以蠟進行了剝離處理之厚度50 μm之PET膜(剝離強度：0.06 N)作為第2剝離膜。[Example 3] In Example 3, a 25 μm thick PET film (peel strength: 0.03 N) that was peeled off with wax was used as the first peeling film, and a 50 µm thick PET film that was peeled off with wax (peel strength : 0.06 N) as the second release film.
[實施例4] 於實施例4中，使用經壓紋處理之厚度300 μm之聚乙烯膜(剝離強度：0.015 N)作為第1剝離膜，使用以蠟進行了剝離處理之厚度50 μm之PET膜(剝離強度：0.06 N)作為第2剝離膜。[Example 4] In Example 4, an embossed polyethylene film with a thickness of 300 μm (peel strength: 0.015 N) was used as the first release film, and a PET film with a thickness of 50 μm that was peeled off with wax (peel strength: 0.06 N) as the second release film.
[比較例1] 於比較例1中，使用以蠟進行了剝離處理之厚度50 μm之PET膜(剝離強度：0.06 N)作為第1剝離膜，使用以蠟進行了剝離處理之厚度50 μm之PET膜(剝離強度：0.06 N)作為第2剝離膜。[Comparative Example 1] In Comparative Example 1, a PET film with a thickness of 50 μm (peel strength: 0.06 N) that was peeled off with wax was used as the first peeling film, and a PET film with a thickness of 50 µm that was peeled off with wax was used (peel strength). : 0.06 N) as the second release film.
[比較例2] 於比較例2中，使用以蠟進行了剝離處理之厚度50 μm之PET膜(剝離強度：0.06 N)作為第1剝離膜，使用以蠟進行了剝離處理之厚度25 μm之PET膜(剝離強度：0.03 N)作為第2剝離膜。[Comparative Example 2] In Comparative Example 2, a PET film with a thickness of 50 μm (peel strength: 0.06 N) that was peeled off with wax was used as the first peeling film, and a PET film with a thickness of 25 µm that was peeled off with wax was used (peel strength). : 0.03 N) as the second release film.
[表2]
如表2所示，於實施例1～實施例4中，由於第1剝離膜自片材本體剝離之強度較第2剝離膜自片材本體剝離之強度小，故不存在片材本體附著於第1剝離膜而片材本體自第2剝離膜剝離之情況。即，可僅將第1剝離膜剝離，可實現良好之作業性。As shown in Table 2, in Examples 1 to 4, since the peeling strength of the first peeling film from the sheet body is lower than the peeling strength of the second peeling film from the sheet body, there is no sheet body attached to the When the first peeling film is peeled from the second peeling film. That is, only the first release film can be peeled off, and good workability can be achieved.
再者，雖亦存在於將第2剝離膜自貼附於鋁板之片材本體剝離時片材本體自鋁板剝離之實施例，但其等在第1剝離膜之剝離性上並無問題，又，第2剝離膜之剝離性取決於片材本體對鋁板之黏性與第2剝離膜之剝離強度之關係，熱傳導片材向鋁板之貼附作業中之作業性良好。Furthermore, although there are also examples in which the sheet body is peeled from the aluminum plate when the second peeling film is peeled from the sheet body attached to the aluminum plate, there is no problem in the peelability of the first peeling film. , The peelability of the second peeling film depends on the relationship between the adhesiveness of the sheet body to the aluminum plate and the peeling strength of the second peeling film. The workability of the heat-conducting sheet attached to the aluminum plate is good.
另一方面，比較例1中，由於第1剝離膜及第2剝離膜自片材本體剝離之強度相同，故剝離之第1剝離膜上附著有片材本體之一部分。又，比較例2中，由於第1剝離膜自片材本體剝離之強度較第2剝離膜自片材本體剝離之強度大，故剝離之第1剝離膜上附著有片材本體之全部。On the other hand, in Comparative Example 1, since the peeling strength of the first peeling film and the second peeling film from the sheet body was the same, a part of the sheet body was attached to the peeled first peeling film. Furthermore, in Comparative Example 2, since the peeling strength of the first peeling film from the sheet body is greater than the peeling strength of the second peeling film from the sheet body, the entire sheet body is attached to the peeled first peeling film.
[第2實施例] 繼而，對本技術之第2實施例進行說明。於第2實施例中，於第1實施例中所使用之熱傳導片材中，藉由使磁體密接於第2剝離膜，而一面自片材本體之另一面側施加磁力一面將第1剝離膜剝離，並確認、評估作業性。再者，於使露出之片材本體之一面密接於鋁板後，確認了剝落第2剝離膜時之作業性。評估係將僅剝離膜自片材本體剝離之情形評估為良好(○)，將於剝離之剝離膜上附著有片材本體之一部分之情形評估為普通(△)，將於剝離之剝離膜上附著有片材本體之全部之情形評估為不良(×)。[Second embodiment] Next, the second embodiment of the present technology will be described. In the second embodiment, in the thermally conductive sheet used in the first embodiment, the first release film is applied by applying a magnetic force from the other side of the sheet body while the magnet is in close contact with the second release film. Peel, confirm and evaluate workability. Furthermore, after contacting one surface of the exposed sheet body to the aluminum plate, the workability when peeling off the second release film was confirmed. In the evaluation system, only the peeling of the peeling film from the sheet body was evaluated as good (○), and the peeled peeling film with a part of the sheet body attached to it was evaluated as normal (△), and the peeled peeling film was evaluated The case where all of the sheet body was attached was evaluated as bad (×).
[實施例5] 於實施例5中，使用以蠟進行了剝離處理之厚度50 μm之PET膜(剝離強度：0.06 N)作為第1剝離膜，使用經壓紋處理之厚度300 μm之聚乙烯膜(剝離強度：0.015 N)作為第2剝離膜。[Example 5] In Example 5, a PET film with a thickness of 50 μm (peel strength: 0.06 N) that was peeled off with wax was used as the first peeling film, and a polyethylene film with a thickness of 300 µm that was embossed was used (peel strength: 0.015 N) as the second release film.
[比較例3] 於比較例3中，使用以蠟進行了剝離處理之厚度50 μm之PET膜(剝離強度：0.06 N)作為第1剝離膜，使用經壓紋處理之厚度300 μm之聚乙烯膜(剝離強度：0.015 N)作為第2剝離膜。[Comparative Example 3] In Comparative Example 3, a PET film with a thickness of 50 μm (peel strength: 0.06 N) that was peeled off with wax was used as the first peeling film, and a polyethylene film with a thickness of 300 µm that was embossed was used (peel strength: 0.015 N) as the second release film.
又，於比較例3中，不自片材本體之另一面側施加磁力而將第1剝離膜剝離。Moreover, in Comparative Example 3, the first release film was peeled without applying magnetic force from the other surface side of the sheet body.
[表3]
如表3所示，於實施例5中，由於藉由使磁體密接於第2剝離膜而一面自片材本體之另一面側施加磁力一面將第1剝離膜剝離，故儘管第1剝離膜之剝離強度較第2剝離膜之剝離強度大，仍可僅將第1剝離膜剝離。As shown in Table 3, in Example 5, the first release film was peeled off while applying a magnetic force from the other side of the sheet body by attaching a magnet to the second release film. The peeling strength is higher than that of the second peeling film, and it is still possible to peel only the first peeling film.
另一方面，比較例3中，由於並未自片材本體之另一面側施加磁力而剝離了第1剝離膜，故片材本體自第2剝離膜剝離，於第1剝離膜上附著有片材本體之全部。On the other hand, in Comparative Example 3, since the first release film was not peeled off by applying magnetic force from the other side of the sheet body, the sheet body was peeled from the second release film, and the sheet was attached to the first release film. All of the material body.
1:熱傳導片材
2:片材本體
2a:一面
2b:另一面
3:第1剝離膜
4:第2剝離膜
5:樹脂被覆層
6:熱傳導性成形體
7:成形體片材
8:磁體
50:半導體裝置
51:電子零件
52:熱散播器
53:散熱器1: Thermal conductive sheet
2:
圖1係表示適用本技術之熱傳導片材之剖視圖。 圖2係表示將熱傳導性成形體切片之步驟之一例之立體圖。 圖3係表示自熱傳導片材之一表面去除第1剝離膜之步驟之剖視圖。 圖4係表示半導體裝置之一例之剖視圖。Fig. 1 is a cross-sectional view of a heat conductive sheet to which this technology is applied. Fig. 2 is a perspective view showing an example of a step of slicing a thermally conductive molded body. Fig. 3 is a cross-sectional view showing the step of removing the first release film from one surface of the thermally conductive sheet. Fig. 4 is a cross-sectional view showing an example of a semiconductor device.
1:熱傳導片材 1: Thermal conductive sheet
2:片材本體 2: Sheet body
2a:一面 2a: one side
2b:另一面 2b: the other side
3:第1剝離膜 3: The first release film
4:第2剝離膜 4: The second release film
5:樹脂被覆層 5: Resin coating
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