TW202040762A - Pre-molded air cavity module and manufacturing method thereof - Google Patents

Pre-molded air cavity module and manufacturing method thereof Download PDF

Info

Publication number
TW202040762A
TW202040762A TW108113098A TW108113098A TW202040762A TW 202040762 A TW202040762 A TW 202040762A TW 108113098 A TW108113098 A TW 108113098A TW 108113098 A TW108113098 A TW 108113098A TW 202040762 A TW202040762 A TW 202040762A
Authority
TW
Taiwan
Prior art keywords
conductive support
conductive
chamber cup
air chamber
packaging structure
Prior art date
Application number
TW108113098A
Other languages
Chinese (zh)
Other versions
TWI690032B (en
Inventor
曾雲甲
Original Assignee
健策精密工業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 健策精密工業股份有限公司 filed Critical 健策精密工業股份有限公司
Priority to TW108113098A priority Critical patent/TWI690032B/en
Application granted granted Critical
Publication of TWI690032B publication Critical patent/TWI690032B/en
Publication of TW202040762A publication Critical patent/TW202040762A/en

Links

Images

Abstract

A pre-molded air cavity module includes a heat sink, a package structure, and a plurality of conductive sheets. The package structure surrounds the heat sink to define an accommodating space. The package structure has a plurality of slits, an upper portion, a lower portion, and an outer sidewall that faces away from the accommodating space. The slit is located between the upper portion and the lower portion of the package structure, and the lower portion extends toward the accommodating space and onto the upper surface of the heat sink. The conductive sheets are respectively located in the slits and have opposite first ends and second ends. The first ends of the conductive sheets are located on the lower portion of the package structure and in the containing space, and the second ends of the conductive sheets extend outward from the outer sidewall.

Description

預成型氣室杯體模組及其製造方法 Preformed air chamber cup body module and manufacturing method thereof

本揭露是有關於一種預成型氣室杯體模組及一種預成型氣室杯體模組的製造方法。 The disclosure relates to a preformed air chamber cup module and a manufacturing method of the preformed air chamber cup module.

隨著半導體產業的蓬勃發展，高功率電子元件普遍應用於許多電子裝置中。功率半導體模組由於具有高功率、高壓、高能量及高頻率等特性，因此廣泛地應用於功率半導體積體電路中，是一種常見的功率半導體驅動元件。 With the vigorous development of the semiconductor industry, high-power electronic components are commonly used in many electronic devices. Power semiconductor modules are widely used in power semiconductor integrated circuits due to their high power, high voltage, high energy, and high frequency characteristics, and are a common power semiconductor drive element.

然而，在功率半導體模組中的氣室杯體模組多以陶瓷板堆疊的方式形成，而堆疊時產生於陶瓷板之間的間隙則使用絕緣的黏著劑進行填充。以這種方式製造氣室杯體模組常須付出大量的製程時間與成本，不利於生產。 However, the gas cell cup module in the power semiconductor module is mostly formed by stacking ceramic plates, and the gaps between the ceramic plates generated during the stacking are filled with insulating adhesive. Manufacturing the air chamber cup module in this way often requires a lot of process time and cost, which is not conducive to production.

本揭露之一技術態樣為一種預成型氣室杯體模組。 One technical aspect of this disclosure is a preformed air chamber cup module.

根據本揭露一實施方式，一種預成型氣室杯體模組包含均熱片、封裝結構以及複數個導電片。封裝結構圍繞均 熱片而定義出容置空間。封裝結構具有複數個縫隙、上部分、下部分與背對容置空間的外側壁。縫隙位於上部分與下部分之間，且下部分往容置空間延伸至均熱片的上表面。導電片分別位於縫隙中，且具有相對的第一端與第二端。第一端位於封裝結構的下部分上與容置空間中，且第二端從外側壁延伸而出。 According to one embodiment of the present disclosure, a preformed air chamber cup module includes a heat spreader, a packaging structure, and a plurality of conductive sheets. Package structure around The hot plate defines the accommodating space. The packaging structure has a plurality of gaps, an upper part, a lower part, and an outer side wall facing away from the accommodating space. The gap is located between the upper part and the lower part, and the lower part extends from the accommodating space to the upper surface of the heat spreader. The conductive sheets are respectively located in the gaps and have opposite first and second ends. The first end is located on the lower part of the packaging structure and in the accommodating space, and the second end extends from the outer side wall.

在本揭露一實施方式中，封裝結構的上部分具有朝向容置空間的第一內側壁，且封裝結構的下部分具有朝向容置空間的第二內側壁，且第二內側壁凸出第一內側壁。 In an embodiment of the present disclosure, the upper part of the packaging structure has a first inner side wall facing the accommodating space, and the lower part of the packaging structure has a second inner side wall facing the accommodating space, and the second inner side wall protrudes from the first inner side wall. Inner wall.

在本揭露一實施方式中，導電片的第一端凸出封裝結構的上部分的第一內側壁。 In an embodiment of the present disclosure, the first end of the conductive sheet protrudes from the first inner side wall of the upper part of the packaging structure.

在本揭露一實施方式中，導電片的第一端具有複數個側壁，且第一端的側壁與封裝結構的下部分的第二內側壁大致切齊。 In an embodiment of the present disclosure, the first end of the conductive sheet has a plurality of side walls, and the side walls of the first end are substantially aligned with the second inner side walls of the lower part of the packaging structure.

在本揭露一實施方式中，封裝結構的上部分與下部分共同呈階梯狀。 In an embodiment of the present disclosure, the upper part and the lower part of the package structure are both stepped.

本揭露之一技術態樣為一種預成型氣室杯體模組的製造方法。 One technical aspect of this disclosure is a manufacturing method of a preformed air chamber cup module.

根據本揭露一實施方式，一種預成型氣室杯體模組的製造方法包含：沖壓金屬材料以形成導電支架，使得導電支架具有複數個鏤空區域及複數個開口，其中開口分別延伸至鏤空區域；設置導電支架於複數個均熱片上方，使得均熱片分別由導電支架的鏤空區域裸露，其中導電支架與均熱片之間有複數個間隙；使用模具將封裝材料熱壓合成型於導電支架上、間隙中、均熱片上方的開口中、以及均熱片周圍，以形成封裝 結構；沿著相鄰的封裝結構之間切割導電支架，以形成複數個導電片。 According to an embodiment of the present disclosure, a method for manufacturing a preformed air chamber cup module includes: stamping a metal material to form a conductive support, so that the conductive support has a plurality of hollow areas and a plurality of openings, wherein the openings respectively extend to the hollow areas; Set the conductive support above the plurality of heat equalizing plates, so that the equalizing plates are respectively exposed from the hollow area of the conductive support, and there are a plurality of gaps between the conductive support and the equalizing plate; use a mold to heat the packaging material into the conductive support Above, in the gap, in the opening above the heat spreader, and around the heat spreader to form a package Structure; Cut the conductive support between adjacent package structures to form a plurality of conductive sheets.

在本揭露一實施方式中，更包含形成導電層於鏤空區域中的均熱片上。 In an embodiment of the present disclosure, it further includes forming a conductive layer on the heat spreader in the hollow area.

在本揭露一實施方式中，更包含以沖壓方式形成均熱片。 In an embodiment of the present disclosure, it further includes forming the heat spreader by stamping.

在本揭露一實施方式中，使用模具將封裝材料熱壓合成型於導電支架上、間隙中、均熱片上方的開口中、以及均熱片周圍包含：於模具內使用封裝材料轉送模製(Transfer molding)成型封裝結構；移除模具。 In an embodiment of the present disclosure, using a mold to heat-press and form the packaging material on the conductive support, in the gap, in the opening above the heat spreader, and around the heat spreader includes: using the packaging material in the mold to transfer and mold ( Transfer molding) molding the package structure; removing the mold.

在本揭露一實施方式中，沿著相鄰的封裝結構之間切割導電支架是以沿開口的寬度方向執行。 In an embodiment of the present disclosure, cutting the conductive support between adjacent package structures is performed along the width direction of the opening.

根據本揭露上述實施方式，在製造預成型氣室杯體模組的過程中，在形成具有鏤空區域的導電支架與均熱片後，可將導電支架設置於均熱片上方，使得均熱片位於導電支架的鏤空區域中。隨後，使用模具將封裝材料熱壓合以形成封裝結構，而所形成的封裝結構除了可形成於導電支架上、均熱片上方的開口中、以及均熱片周圍之外，還可直接填充於導電支架與均熱片之間的間隙中。利用這樣的方式，可簡化製程並降低生產時間與成本。此外，預成型氣室杯體模組的導電片與均熱片藉由封裝結構的下部分而彼此絕緣，使得導電片與均熱片之間有一段差而彼此不會電性連接。 According to the above-mentioned embodiments of the present disclosure, in the process of manufacturing the preformed air chamber cup module, after the conductive support and the heat spreading sheet with the hollow area are formed, the conductive support can be arranged above the heat spreading sheet so that the heat spreading sheet Located in the hollow area of the conductive support. Subsequently, a mold is used to heat-compress the packaging material to form a packaging structure, and the formed packaging structure can be formed on the conductive support, in the opening above the heat spreader, and around the heat spreader, and can also be directly filled in In the gap between the conductive support and the heat spreader. In this way, the manufacturing process can be simplified and the production time and cost can be reduced. In addition, the conductive sheet and the heat equalizing sheet of the preformed air chamber cup module are insulated from each other by the lower part of the packaging structure, so that there is a difference between the conductive sheet and the heat equalizing sheet and will not be electrically connected to each other.

100‧‧‧預成型氣室杯體模組 100‧‧‧Preformed air chamber cup module

110‧‧‧均熱片 110‧‧‧Hot film

111‧‧‧上表面 111‧‧‧Upper surface

120‧‧‧封裝結構 120‧‧‧Packaging structure

121‧‧‧縫隙 121‧‧‧Gap

122‧‧‧上部分 122‧‧‧Part 1

123‧‧‧外側壁 123‧‧‧Outer wall

124‧‧‧下部分 124‧‧‧The next part

125‧‧‧第一內側壁 125‧‧‧First inner wall

127‧‧‧第二內側壁 127‧‧‧Second inner wall

130‧‧‧導電片 130‧‧‧Conductive sheet

132‧‧‧第一端 132‧‧‧First end

134‧‧‧第二端 134‧‧‧Second end

140‧‧‧容置空間 140‧‧‧Accommodation space

210‧‧‧導電支架 210‧‧‧Conductive bracket

212‧‧‧鏤空區域 212‧‧‧Knockout area

214‧‧‧開口 214‧‧‧Open

220‧‧‧導電層 220‧‧‧Conductive layer

2-2、6-6、8-8、L-L‧‧‧線段 2-2, 6-6, 8-8, L-L‧‧‧Line segment

a‧‧‧寬度 a‧‧‧Width

d‧‧‧間距 d‧‧‧Pitch

w‧‧‧間隙 w‧‧‧Gap

S1~S4‧‧‧步驟 S1~S4‧‧‧Step

第1圖繪示根據本揭露一實施方式之預成型氣室杯體模組的立體圖。 FIG. 1 is a perspective view of a preformed air chamber cup module according to an embodiment of the present disclosure.

第2圖繪示第1圖之預成型氣室杯體模組沿線段2-2的剖面圖。 Figure 2 shows a cross-sectional view of the preformed air chamber cup module of Figure 1 along line 2-2.

第3圖繪示根據本揭露一實施方式之預成型氣室杯體模組的製造方法的流程圖。 FIG. 3 shows a flowchart of a manufacturing method of a preformed air chamber cup module according to an embodiment of the present disclosure.

第4圖繪示根據本揭露一實施方式之導電支架的上視圖。 FIG. 4 shows a top view of a conductive support according to an embodiment of the present disclosure.

第5圖繪示第4圖之導電支架設置於均熱片上方後的上視圖。 Fig. 5 shows a top view of the conductive support of Fig. 4 after being arranged above the heat equalizing plate.

第6圖繪示第5圖之導電支架與均熱片沿線段6-6的剖面圖。 Fig. 6 shows a cross-sectional view of the conductive support and the heat spreader of Fig. 5 along line 6-6.

第7圖繪示第5圖之導電支架與均熱片形成封裝結構後的上視圖。 Fig. 7 is a top view of the conductive support and the heat spreader of Fig. 5 after forming a package structure.

第8圖繪示第7圖之導電支架、均熱片與封裝結構沿線段7-7的剖面圖。 Fig. 8 shows a cross-sectional view of the conductive support, heat spreader, and packaging structure of Fig. 7 along line 7-7.

以下將以圖式揭露本揭露之複數個實施方式，為明確說明起見，許多實務上的細節將在以下敘述中一併說明。然而，應瞭解到，這些實務上的細節不應用以限制本揭露。也就是說，在本揭露部分實施方式中，這些實務上的細節是非必要的。此外，為簡化圖式起見，一些習知慣用的結構與元件在圖式中將以簡單示意的方式繪示之。 Hereinafter, a plurality of implementation manners of the present disclosure will be disclosed in schematic form. For the sake of clarity, many practical details will be described in the following description. However, it should be understood that these practical details should not be used to limit this disclosure. In other words, in some implementations of this disclosure, these practical details are unnecessary. In addition, in order to simplify the drawings, some conventionally used structures and elements will be shown in a simple schematic manner in the drawings.

第1圖繪示根據本揭露一實施方式之預成型氣室杯體模組100的立體圖。第2圖繪示第1圖之預成型氣室杯體模組100沿線段2-2的剖面圖。同時參閱第1圖與第2圖，預成型氣室杯體模組100包含均熱片110、封裝結構120以及複數個導電片130。封裝結構120圍繞均熱片110而定義出容置空間140。封裝結構120具有複數個縫隙121、上部分122、下部分124與背對容置空間140的外側壁123。縫隙121位於上部分122與下部分124之間，且下部分124往容置空間140延伸至均熱片110的上表面111。導電片130分別位於縫隙121中，且具有相對的第一端132與第二端134。第一端132位於封裝結構120的下部分124上與容置空間140中，且第二端134從外側壁123延伸而出。 FIG. 1 is a perspective view of a preformed air chamber cup module 100 according to an embodiment of the present disclosure. FIG. 2 shows a cross-sectional view of the preformed air chamber cup module 100 of FIG. 1 along the line 2-2. Referring to FIGS. 1 and 2 at the same time, the preformed air chamber cup module 100 includes a heat equalizing sheet 110, a packaging structure 120 and a plurality of conductive sheets 130. The packaging structure 120 defines a accommodating space 140 around the heat equalizing sheet 110. The packaging structure 120 has a plurality of slits 121, an upper portion 122, a lower portion 124 and an outer sidewall 123 facing away from the accommodating space 140. The gap 121 is located between the upper part 122 and the lower part 124, and the lower part 124 extends to the accommodating space 140 to the upper surface 111 of the heat equalizing plate 110. The conductive sheets 130 are respectively located in the gap 121 and have a first end 132 and a second end 134 opposite to each other. The first end 132 is located on the lower portion 124 of the packaging structure 120 and in the accommodating space 140, and the second end 134 extends from the outer side wall 123.

在本實施方式中，均熱片110的材質可包含金屬(例如銅)，因此具有導電性質，但並不以金屬(例如銅)為限。在其他實施方式中，均熱片111的材質可包含陶瓷。 In this embodiment, the material of the heat spreader 110 may include metal (for example, copper), so it has conductive properties, but it is not limited to metal (for example, copper). In other embodiments, the material of the heat equalizing sheet 111 may include ceramics.

在本實施方式中，導電片130的材質可包含金屬(例如銅)。封裝結構120的材質可包含環氧壓模樹脂(Epoxy molding compound)，因此為不具有導電性質的絕緣體，且封裝結構120可為黑色，具有遮光效果，但並不用以限制本揭露。在本實施方式中，由於封裝結構120的下部分124往容置空間140延伸至均熱片110的上表面111，且導電片130的第一端132位於封裝結構120的下部分124上，因此導電片130與具有導電性質的均熱片110之間可透過封裝結構120的下部分124而彼此絕緣，使得導電片130與均熱片110之間有一段差而 彼此不會電性連接。 In this embodiment, the material of the conductive sheet 130 may include metal (for example, copper). The material of the packaging structure 120 may include epoxy molding compound, so it is an insulator that does not have conductive properties, and the packaging structure 120 may be black with a light-shielding effect, but it is not intended to limit the disclosure. In this embodiment, since the lower portion 124 of the package structure 120 extends to the accommodating space 140 to the upper surface 111 of the heat equalizing sheet 110, and the first end 132 of the conductive sheet 130 is located on the lower portion 124 of the package structure 120, The conductive sheet 130 and the heat equalizing sheet 110 can be insulated from each other through the lower part 124 of the packaging structure 120, so that there is a difference between the conductive sheet 130 and the heat equalizing sheet 110. They will not be electrically connected.

此外，由於在本實施方式中的預成型氣室杯體模組100可應用於功率半導體模組中，而包含環氧壓模樹脂的封裝結構120具有良好的耐熱性及黏合性，因此符合功率半導體模組所需之氣室杯體模組在性能上的需求。此外，與傳統陶瓷材料相較，使用環氧壓模樹脂作為封裝結構120的材料還可有效降低成本。 In addition, since the preformed air cell cup module 100 in this embodiment can be applied to a power semiconductor module, and the package structure 120 containing epoxy compression molding resin has good heat resistance and adhesion, it meets power requirements. The performance requirements of the gas chamber cup module required by the semiconductor module. In addition, compared with traditional ceramic materials, using epoxy compression molding resin as the material of the package structure 120 can also effectively reduce the cost.

在本實施方式中，封裝結構120的上部分122具有朝向容置空間140的第一內側壁125，且封裝結構120的下部分124具有朝向容置空間140的第二內側壁127，且第二內側壁127凸出第一內側壁125。此外，導電片130的第一端132位於封裝結構120的下部分124上，且凸出封裝結構120之上部分122的第一內側壁125。此外，導電片130的第一端132具有側壁133，且側壁133與封裝結構120之下部分124的第二內側壁127大致切齊。綜上所述，封裝結構120的上部分122、下部分124與導電片130的第一端132共同呈現階梯狀，如第1圖與第2圖所示。 In this embodiment, the upper part 122 of the packaging structure 120 has a first inner sidewall 125 facing the accommodating space 140, and the lower part 124 of the packaging structure 120 has a second inner sidewall 127 facing the accommodating space 140, and the second The inner side wall 127 protrudes from the first inner side wall 125. In addition, the first end 132 of the conductive sheet 130 is located on the lower portion 124 of the packaging structure 120 and protrudes from the first inner side wall 125 of the upper portion 122 of the packaging structure 120. In addition, the first end 132 of the conductive sheet 130 has a side wall 133, and the side wall 133 is substantially flush with the second inner side wall 127 of the lower portion 124 of the packaging structure 120. In summary, the upper portion 122 and the lower portion 124 of the package structure 120 and the first end 132 of the conductive sheet 130 jointly present a step shape, as shown in FIG. 1 and FIG. 2.

參閱第1圖，位於預成型氣室杯體模組100兩側的導電片130沿著預成型氣室杯體模組100的長度方向彼此對稱。位於同一側的導電片130除了彼此大致平行排列外，每一個導電片130與相鄰的導電片130在水平方向相隔間距d。在本實施方式中，位於同一側之導電片130的數量可為一個或多個，但並不用以限制本揭露，可依設計者的需求而定。 Referring to FIG. 1, the conductive sheets 130 located on both sides of the preformed air chamber cup module 100 are symmetrical to each other along the length direction of the preformed air chamber cup module 100. Except that the conductive sheets 130 on the same side are arranged substantially parallel to each other, each conductive sheet 130 is separated from the adjacent conductive sheet 130 by a distance d in the horizontal direction. In this embodiment, the number of conductive sheets 130 on the same side can be one or more, but it is not used to limit the disclosure, and can be determined according to the needs of the designer.

在本實施方式中，預成型氣室杯體模組100可進 一步包含位於容置空間140中之均熱片110上方的電子元件(例如發光二極體晶片、半導體晶片或積體電路晶片)，且電子元件的數量可為一個或多個，但並不用以限制本揭露，可依設計者的需求而定。電子元件可電性連接至導電片130的第一端132，並透過導電片130的第二端134進一步電性連接至外部電路。此外，在本實施方式中，預成型氣室杯體模組100可進一步包含覆蓋於預成型氣室杯體模組100上方的蓋體，蓋體可為多種形狀，但並不用以限制本揭露。蓋體可防止水氣進入預成型氣室杯體模組100中，並可保護位於容置空間140中的電子元件。 In this embodiment, the preformed air chamber cup module 100 can enter One step includes electronic components (such as light-emitting diode chips, semiconductor chips, or integrated circuit chips) above the heat spreader 110 in the accommodating space 140, and the number of electronic components can be one or more, but not used Limiting the disclosure can be determined according to the needs of the designer. The electronic component can be electrically connected to the first end 132 of the conductive sheet 130 and further electrically connected to an external circuit through the second end 134 of the conductive sheet 130. In addition, in this embodiment, the pre-formed air-chamber cup module 100 may further include a cover covering the top of the pre-formed air-chamber cup module 100. The cover may have various shapes, but it is not intended to limit the disclosure. . The cover can prevent moisture from entering the preformed air chamber cup module 100 and can protect the electronic components located in the accommodating space 140.

在本實施方式中，預成型氣室杯體模組100可進一步包含位於容置空間140中的均熱片110之上表面111上的導電層220，如第2圖所示。導電層220的材料可包含金屬(例如銅)，但並不用以限制本揭露。 In this embodiment, the preformed air chamber cup module 100 may further include a conductive layer 220 on the upper surface 111 of the heat equalizing sheet 110 in the accommodating space 140, as shown in FIG. The material of the conductive layer 220 may include metal (for example, copper), but it is not used to limit the disclosure.

應瞭解到，已敘述過的元件連接關係、材料與功效將不再重複贅述，合先敘明。在以下敘述中，將說明預成型氣室杯體模組100的製造方法。 It should be understood that the connection relationships, materials, and effects of the components that have been described will not be repeated, and will be described first. In the following description, a method of manufacturing the preformed air cell cup module 100 will be explained.

第3圖繪示根據本揭露一實施方式之預成型氣室杯體模組100的製造方法的流程圖。預成型氣室杯體模組100的製造方法包含下列步驟。首先在步驟S1中，沖壓金屬材料以形成導電支架，使得導電支架具有複數個鏤空區域及複數個開口，其中開口分別延伸至鏤空區域。接著在步驟S2中，設置導電支架於複數個均熱片上方，使得均熱片分別由導電支架的鏤空區域裸露，其中導電支架與均熱片之間有複數個間隙。 之後在步驟S3中，使用模具將封裝材料熱壓合成型於導電支架上、間隙中、均熱片上方的開口中、以及均熱片周圍，以形成複數個封裝結構。接著在步驟S4中，沿著相鄰的封裝結構之間切割導電支架，以形成複數個導電片。在以下敘述中，將進一步說明上述各步驟。 FIG. 3 is a flowchart of a manufacturing method of the preformed air chamber cup module 100 according to an embodiment of the present disclosure. The manufacturing method of the preformed air chamber cup module 100 includes the following steps. First, in step S1, a metal material is stamped to form a conductive support, so that the conductive support has a plurality of hollow areas and a plurality of openings, wherein the openings respectively extend to the hollow areas. Next, in step S2, a conductive support is arranged above the plurality of heat equalizing plates, so that the equalizing plates are respectively exposed from the hollow areas of the conductive support, wherein there are a plurality of gaps between the conductive support and the equalizing plates. Then, in step S3, a mold is used to heat-compress the packaging material on the conductive support, in the gap, in the opening above the heat spreader, and around the heat spreader to form a plurality of packaging structures. Next, in step S4, the conductive support is cut between adjacent package structures to form a plurality of conductive sheets. In the following description, the above steps will be further explained.

第4圖繪示根據本揭露一實施方式之導電支架210的上視圖。在製作第1圖的預成型氣室杯體模組100時，可先沖壓金屬材料以形成長方形的導電支架210，使得導電支架210具有鏤空區域212及開口214。在本實施方式中，鏤空區域212沿著導電支架210的長度方向排列，且鏤空區域212的數量可依設計者的需求而定。開口214分別位於鏤空區域212的兩側且延伸至鏤空區域212，因此開口214與鏤空區域212連通。在本實施方式中，位於鏤空區域212兩側的開口214沿著鏤空區域212的長度方向彼此對稱，且位於鏤空區域212同一側的開口214彼此大致平行排列。此外，開口214為長方形且具有寬度a，且寬度a與第1圖中所示之兩相鄰導電片130之間的間距d相同。在本實施方式中，開口214的數量與寬度a可依設計者的需求而定。 FIG. 4 shows a top view of a conductive support 210 according to an embodiment of the disclosure. When manufacturing the preformed air chamber cup module 100 of FIG. 1, a metal material can be stamped to form a rectangular conductive support 210, so that the conductive support 210 has a hollow area 212 and an opening 214. In this embodiment, the hollow areas 212 are arranged along the length direction of the conductive support 210, and the number of the hollow areas 212 can be determined according to the needs of the designer. The openings 214 are respectively located on both sides of the hollowed-out area 212 and extend to the hollowed-out area 212, so the openings 214 are connected to the hollowed-out area 212. In this embodiment, the openings 214 located on both sides of the hollow area 212 are symmetrical to each other along the length direction of the hollow area 212, and the openings 214 located on the same side of the hollow area 212 are arranged substantially parallel to each other. In addition, the opening 214 is rectangular and has a width a, and the width a is the same as the distance d between two adjacent conductive sheets 130 shown in FIG. 1. In this embodiment, the number and width a of the openings 214 can be determined according to the needs of the designer.

第5圖繪示第4圖之導電支架210設置於均熱片110上方後的上視圖。第6圖繪示第5圖之導電支架210與均熱片110沿線段6-6的剖面圖。同時參閱第5圖與第6圖，在形成具有鏤空區域212及開口214的導電支架210後，將導電支架210設置於均熱片110上方以形成導電支架210與均熱片110之間的高低段差，並使得均熱片110分別由導電支架210的鏤 空區域212裸露。此外，如第6圖所示，導電支架210與均熱片110之間在垂直方向具有間隙w(即導電支架210與均熱片110的疊層絕緣懸浮間隙)。在本實施方式中，形成均熱片110的方式是以沖壓金屬材料(例如銅)的方式執行，但並不用以限制本揭露。 FIG. 5 shows a top view of the conductive support 210 of FIG. 4 after being disposed above the heat equalizing plate 110. FIG. 6 shows a cross-sectional view of the conductive support 210 and the heat spreader 110 of FIG. 5 along the line 6-6. Referring to FIGS. 5 and 6 at the same time, after the conductive support 210 with the hollow area 212 and the opening 214 is formed, the conductive support 210 is arranged above the heat equalizing plate 110 to form a height between the conductive support 210 and the equalizing plate 110 And make the heat spreading sheet 110 be respectively hollowed out by the conductive support 210 The empty area 212 is exposed. In addition, as shown in FIG. 6, there is a gap w between the conductive support 210 and the heat equalizing plate 110 in the vertical direction (ie, the laminated insulating suspension gap between the conductive support 210 and the equalizing plate 110). In this embodiment, the method of forming the heat spreader 110 is performed by stamping a metal material (such as copper), but it is not intended to limit the disclosure.

第7圖繪示第5圖之導電支架210與均熱片110形成封裝結構120後的上視圖。第8圖繪示第7圖之導電支架210、均熱片110與封裝結構120沿線段8-8的剖面圖。在將導電支架210設置於均熱片110上方後，使用模具將封裝材料熱壓合成型於導電支架210上、間隙w(即導電支架210與均熱片110之間的高低段差所產生的疊層絕緣懸浮間隙)中、以及均熱片110周圍。在移除模具後便可形成封裝結構120。在本實施方式中，封裝結構120的形成是以轉送模製(Transfer molding)成型的方式執行，且封裝材料可為熱固性環氧壓模樹脂(Epoxy molding compound)，但均不用以限制本揭露。形成於間隙w中的封裝結構120可將導電支架210與均熱片110電性絕緣，且可讓導電支架210與均熱片110之間有一段差而彼此不會電性連接。 FIG. 7 is a top view of the conductive support 210 and the heat spreading sheet 110 of FIG. 5 after forming the package structure 120. FIG. 8 shows a cross-sectional view of the conductive support 210, the heat spreader 110, and the packaging structure 120 of FIG. 7 along the line 8-8. After the conductive support 210 is set above the heat equalizing sheet 110, the encapsulating material is heat-compressed and formed on the conductive support 210 using a mold, and the gap w (that is, the stack caused by the height difference between the conductive support 210 and the heat equalizing sheet 110) Layer insulation floating gap) and around the heat spreader 110. After removing the mold, the package structure 120 can be formed. In this embodiment, the formation of the packaging structure 120 is performed by transfer molding, and the packaging material can be a thermosetting epoxy molding compound, but it is not necessary to limit the disclosure. The packaging structure 120 formed in the gap w can electrically insulate the conductive support 210 and the heat equalizing sheet 110, and can make a difference between the conductive support 210 and the heat equalizing sheet 110 without being electrically connected to each other.

在製造預成型氣室杯體模組100的過程中，將導電支架210設置於均熱片110上方，隨後使用模具將封裝材料轉送模製成型以形成封裝結構120，而所形成的封裝結構120可直接填充於導電支架210與均熱片110之間的間隙w中。利用這樣的方式形成包含環氧壓模樹脂的封裝結構120，可簡化製程並降低生產時間與成本。 In the process of manufacturing the preformed air chamber cup module 100, the conductive support 210 is set above the heat spreader 110, and then the packaging material is transferred and molded by a mold to form the packaging structure 120, and the resulting packaging structure 120 can be directly filled in the gap w between the conductive support 210 and the heat spreader 110. Using this method to form the packaging structure 120 containing epoxy compression molding resin can simplify the manufacturing process and reduce production time and cost.

在使用模具形成封裝結構120後，可利用如雷射的物理蝕刻方式將殘留在位於鏤空區域212中的均熱片110之上表面111多餘的封裝材料去除，但並不用以限制本揭露。在後續製程中，可在鏤空區域212中的均熱片110之上表面111上形成導電層220(參閱的2圖)。在本實施方式中，導電層220的形成是以電鍍的方式執行，且導電層220的材質可為銅，但均不用以限制本揭露。 After using a mold to form the packaging structure 120, a physical etching method such as a laser can be used to remove the excess packaging material remaining on the upper surface 111 of the heat spreader 110 in the hollow area 212, but this is not intended to limit the disclosure. In the subsequent manufacturing process, a conductive layer 220 may be formed on the upper surface 111 of the heat spreading sheet 110 in the hollow area 212 (refer to FIG. 2). In this embodiment, the formation of the conductive layer 220 is performed by electroplating, and the material of the conductive layer 220 may be copper, but it is not necessary to limit the disclosure.

參閱第7圖，在去除多餘的封裝材料後，可沿著相鄰的封裝結構120之間沿線段L-L切割導電支架210，也就是沿著開口214的寬度a方向執行切割。使用這樣的切割方式，可在切割完成後形成多個如第1圖所示的具有導電片130的預成型氣室杯體模組100。 Referring to FIG. 7, after removing the excess packaging material, the conductive support 210 can be cut along the line segment L-L between adjacent packaging structures 120, that is, cutting is performed along the width a direction of the opening 214. Using this cutting method, a plurality of preformed air chamber cup modules 100 with conductive sheets 130 as shown in FIG. 1 can be formed after the cutting is completed.

回到第1圖與第2圖，在得到切割後的預成型氣室杯體模組100後，可在容置空間140中設置電子元件(例如發光二極體晶片、半導體晶片或積體電路晶片)，且電子元件的數量可為一個或多個，但並不用以限制本揭露，可依設計者的需求而定。另外，還可透過打線(Wire bonding)將電子元件電性連接至導電片130的第一端132，並透過導電片130的第二端134進一步電性連接至外部電路。此外，可使用蓋體覆蓋於預成型氣室杯體模組100上方，使得蓋體覆蓋容置空間140以保護其下方的電子元件，且蓋體的底面可接觸封裝結構120之上部分122的頂面。 Returning to Figures 1 and 2, after the cut preformed gas chamber cup module 100 is obtained, electronic components (such as light-emitting diode chips, semiconductor chips or integrated circuits) can be placed in the accommodating space 140 Chips), and the number of electronic components can be one or more, but it is not used to limit the disclosure and can be determined according to the needs of the designer. In addition, the electronic component can also be electrically connected to the first end 132 of the conductive sheet 130 through wire bonding, and further electrically connected to an external circuit through the second end 134 of the conductive sheet 130. In addition, a cover can be used to cover the preformed air chamber cup module 100 so that the cover covers the accommodating space 140 to protect the electronic components below it, and the bottom surface of the cover can contact the upper part 122 of the packaging structure 120 Top surface.

雖然本揭露已以實施方式揭露如上，然其並非用以限定本揭露，任何熟習此技藝者，在不脫離本揭露之精神和 範圍內，當可作各種之更動與潤飾，因此本揭露之保護範圍當視後附之申請專利範圍所界定者為準。 Although this disclosure has been disclosed as above in the implementation manner, it is not intended to limit the disclosure. Anyone who is familiar with this technique will not depart from the spirit and spirit of this disclosure. Within the scope, various changes and modifications can be made. Therefore, the protection scope of this disclosure shall be subject to the scope of the attached patent application.

100‧‧‧預成型氣室杯體模組 100‧‧‧Preformed air chamber cup module

120‧‧‧封裝結構 120‧‧‧Packaging structure

130‧‧‧導電片 130‧‧‧Conductive sheet

140‧‧‧容置空間 140‧‧‧Accommodation space

220‧‧‧導電層 220‧‧‧Conductive layer

2-2‧‧‧線段 2-2‧‧‧Line segment

d‧‧‧間距 d‧‧‧Pitch

Claims (10)

一種預成型氣室杯體模組，包含：一均熱片；一封裝結構，圍繞該均熱片而定義出一容置空間，其中該封裝結構具有複數個縫隙、一上部分、一下部分與背對該容置空間的一外側壁，該些縫隙位於該上部分與該下部分之間，且該下部分往該容置空間延伸至該均熱片的一上表面；以及複數個導電片，分別位於該些縫隙中，每一該些導電片具有相對的一第一端與一第二端，該第一端位於該封裝結構的該下部分上與該容置空間中，該第二端從該外側壁延伸而出。 A preformed air chamber cup body module includes: a heat equalizing sheet; a packaging structure defining an accommodating space around the heat equalizing sheet, wherein the packaging structure has a plurality of gaps, an upper part, a lower part and Back on an outer side wall of the accommodating space, the gaps are located between the upper part and the lower part, and the lower part extends from the accommodating space to an upper surface of the heat equalizing plate; and a plurality of conductive plates , Respectively located in the gaps, each of the conductive sheets has a first end and a second end opposite to each other, the first end is located on the lower part of the packaging structure and in the accommodating space, the second The ends extend from the outer side wall. 如請求項1所述的預成型氣室杯體模組，其中該封裝結構的該上部分具有朝向該容置空間的一第一內側壁，且該封裝結構的該下部分具有朝向該容置空間的一第二內側壁，且該第二內側壁凸出該第一內側壁。 The preformed air chamber cup module according to claim 1, wherein the upper part of the packaging structure has a first inner side wall facing the accommodating space, and the lower part of the packaging structure has a first inner side wall facing the accommodating space A second inner side wall of the space, and the second inner side wall protrudes from the first inner side wall. 如請求項2所述的預成型氣室杯體模組，其中該些導電片的該些第一端凸出該封裝結構的該上部分的該第一內側壁。 The preformed air chamber cup module according to claim 2, wherein the first ends of the conductive sheets protrude from the first inner side wall of the upper part of the packaging structure. 如請求項2所述的預成型氣室杯體模組，其中該些導電片的該些第一端具有複數個側壁，且該些第一端的該些側壁與該封裝結構的該下部分的該第二內側壁大致切 齊。 The preformed air chamber cup module according to claim 2, wherein the first ends of the conductive sheets have a plurality of side walls, and the side walls of the first ends and the lower part of the packaging structure The second inner wall is roughly cut Qi. 如請求項1所述的預成型氣室杯體模組，其中該封裝結構的該上部分與該下部分共同呈階梯狀。 The preformed air chamber cup module according to claim 1, wherein the upper part and the lower part of the packaging structure are stepped together. 一種預成型氣室杯體模組的製造方法，包含：沖壓一金屬材料以形成一導電支架，使得該導電支架具有複數個鏤空區域及複數個開口，其中該些開口分別延伸至該些鏤空區域；設置該導電支架於複數個均熱片上方，使得該些均熱片分別由該導電支架的該些鏤空區域裸露，其中該導電支架與每一該些均熱片之間有複數個間隙；使用一模具將一封裝材料熱壓合成型於該導電支架上、該些間隙中、該些均熱片上方的該些開口中、以及該些均熱片周圍，以形成複數個封裝結構；以及沿著相鄰的每一該些封裝結構之間切割該導電支架，以形成複數個導電片。 A method for manufacturing a preformed air chamber cup body module includes: stamping a metal material to form a conductive support, so that the conductive support has a plurality of hollow areas and a plurality of openings, wherein the openings respectively extend to the hollow areas ; Set the conductive support above a plurality of heat equalizing plates, so that these equalizing plates are exposed by the hollow areas of the conductive support, wherein there are a plurality of gaps between the conductive support and each of the equalizing plates; Using a mold to heat-compress a packaging material on the conductive support, in the gaps, in the openings above the heat equalizing plates, and around the heat equalizing plates to form a plurality of packaging structures; and The conductive support is cut between each of the adjacent packaging structures to form a plurality of conductive sheets. 如請求項6所述的預成型氣室杯體模組的製造方法，更包含：形成一導電層於該些鏤空區域中的該些均熱片上。 The manufacturing method of the preformed gas chamber cup module according to claim 6, further comprising: forming a conductive layer on the heat equalizing sheets in the hollow regions. 如請求項6所述的預成型氣室杯體模組的製造方法，更包含：以沖壓方式形成該些均熱片。 The manufacturing method of the preformed air chamber cup module according to claim 6, further comprising: forming the heat equalizing fins by stamping. 如請求項6所述的預成型氣室杯體模組的製造方法，其中使用該模具將該封裝材料熱壓合成型於該導電支架上、該些間隙中、該些均熱片上方的該些開口中、以及該些均熱片周圍包含：於該模具內使用該封裝材料轉送模製(Transfer molding)成型該些封裝結構；以及移除該模具。 The method for manufacturing a preformed gas chamber cup module according to claim 6, wherein the mold is used to heat-press and form the packaging material on the conductive support, in the gaps, and above the heat equalizing plates The openings and the surroundings of the heat equalizing plates include: forming the packaging structures in the mold by transfer molding using the packaging material; and removing the mold. 如請求項6所述的預成型氣室杯體模組的製造方法，其中沿著相鄰的每一該些封裝結構之間切割該導電支架是以沿該些開口的寬度方向執行。 The manufacturing method of the preformed air chamber cup module according to claim 6, wherein the cutting of the conductive support between each of the adjacent packaging structures is performed along the width direction of the openings.
TW108113098A 2019-04-15 2019-04-15 Pre-molded air cavity module and manufacturing method thereof TWI690032B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW108113098A TWI690032B (en) 2019-04-15 2019-04-15 Pre-molded air cavity module and manufacturing method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW108113098A TWI690032B (en) 2019-04-15 2019-04-15 Pre-molded air cavity module and manufacturing method thereof

Publications (2)

Publication Number Publication Date
TWI690032B TWI690032B (en) 2020-04-01
TW202040762A true TW202040762A (en) 2020-11-01

Family

ID=71134193

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108113098A TWI690032B (en) 2019-04-15 2019-04-15 Pre-molded air cavity module and manufacturing method thereof

Country Status (1)

Country Link
TW (1) TWI690032B (en)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWM403110U (en) * 2010-12-07 2011-05-01 Jentech Precision Industrial Co Ltd Structure of light emitted diode package
US9590129B2 (en) * 2014-11-19 2017-03-07 Analog Devices Global Optical sensor module
TWI648886B (en) * 2018-05-09 2019-01-21 相豐科技股份有限公司 Light-emitting diode structure

Also Published As

Publication number Publication date
TWI690032B (en) 2020-04-01

Similar Documents

Publication Publication Date Title
KR101237669B1 (en) Structure having an integrated circuit on another integrated circuit with an intervening bent adhesive element
KR100765604B1 (en) Circuit device and manufacturing method thereof
US10204882B2 (en) Stacked package module having an exposed heat sink surface from the packaging
US10720373B2 (en) Semiconductor power device with corresponding package and related manufacturing process
US10879222B2 (en) Power chip integration module, manufacturing method thereof, and double-sided cooling power module package
TW201631717A (en) Encapsulation module of power conversion circuit and manufacturing method thereof
US20080073759A1 (en) Semiconductor package
TW202137423A (en) Power module having interconnected base plate with molded metal and method of making the same
JP4549171B2 (en) Hybrid integrated circuit device
US10964627B2 (en) Integrated electronic device having a dissipative package, in particular dual side cooling package
JP2016157786A (en) Heat radiation structure
TWI690032B (en) Pre-molded air cavity module and manufacturing method thereof
US10461044B2 (en) Wafer level fan-out package and method of manufacturing the same
US20210151368A1 (en) Flat no-lead package with surface mounted structure
KR102016019B1 (en) High thermal conductivity semiconductor package
KR100711255B1 (en) A chip package and manufacturing method thereof
CN219759566U (en) Insulating substrate and power device
TWI784778B (en) Diode package structure and method of manufacturing the same
KR101640126B1 (en) Semiconductor package manufacturing method
CN112930589B (en) Substrate structure and manufacturing and packaging method thereof
CN112786460B (en) Chip packaging method and chip packaging module
KR102502239B1 (en) Semiconductor Chip, Printed Circuit Board, Multi-chip Package Including The Same, and Method of Manufacturing The Multi-chip Package
JP2024504838A (en) Metal substrate structure, method for manufacturing metal substrate structure for semiconductor power module, and semiconductor power module
JP2024515109A (en) Semiconductor power module and methods for manufacturing a semiconductor power module and a semiconductor power device
CN112930589A (en) Substrate structure and manufacturing and packaging method thereof