TW202039670A - Resin composition - Google Patents

Abstract

A resin composition which contains a thermoplastic resin and/or a thermosetting resin, and a glass component that is dispersed in the thermoplastic resin and/or the thermosetting resin, and which is configured such that the calcium content contained in the resin composition is 0-27% by mass relative to 100% by mass of the metal content contained in the resin composition, or the calcium content contained in the glass component is 0-27% by mass relative to 100% by mass of the metal content contained in the glass component as determined by ICP analysis of the residue of the resin composition after ashing.

Description

樹脂組成物Resin composition

本發明係有關樹脂組成物者。 本申請案係基於2019年2月5日向日本提出申請之申請號2019-019007號主張優先權，基於2019年10月18日向日本提出申請之申請號2019-191071號主張優先權，其內容援用於本文。The present invention relates to a resin composition. This application claims priority based on the application number 2019-019007 filed in Japan on February 5, 2019, and claims priority based on the application number 2019-191071 filed in Japan on October 18, 2019. The content is cited This article.

共振器、濾波器、天線、電路基板及層合電路元件基板等之介電體裝置之領域中，隨著近幾年之資訊量增大、通訊技術之高度化及利用頻帶之枯竭化，已進展利用高頻帶(釐米波~微波)。In the field of dielectric devices such as resonators, filters, antennas, circuit substrates, and laminated circuit element substrates, with the increase in the amount of information in recent years, the advancement of communication technology, and the depletion of utilization bands, Advances in the use of high frequency bands (centimeter wave ~ microwave).

一般，無機材料雖有介電損失較低之傾向，但有難以實現相對介電常數之降低的問題。相反地，有機材料大多存在相對介電常數較低者。因此，提案有藉由於樹脂系有機材料中分散無機材料粒子之氧化鎂微粒子而構成之介電體用材料(專利文獻1)。 [先前技術文獻] [專利文獻]In general, although inorganic materials tend to have a low dielectric loss, they have the problem that it is difficult to reduce the relative dielectric constant. Conversely, most organic materials have relatively low dielectric constants. Therefore, a material for a dielectric body composed of magnesium oxide fine particles in which inorganic material particles are dispersed in a resin-based organic material has been proposed (Patent Document 1). [Prior Technical Literature] [Patent Literature]

[專利文獻1] 日本特開2014-24916號公報[Patent Document 1] JP 2014-24916 A

[發明欲解決之課題][The problem to be solved by the invention]

然而，若相對介電常數及介電正切之介電特性減小，則損及機械強度，並未發現滿足介電特性及機械強度兩者之材料。However, if the relative dielectric constant and the dielectric properties of the dielectric tangent decrease, the mechanical strength will be impaired, and no material that satisfies both the dielectric properties and the mechanical strength has been found.

本發明係鑑於如上述情況而完成者，目的在於提供機械強度優異，相對介電常數小，且介電正切小之樹脂組成物。 [用以解決課題之手段]The present invention was made in view of the above-mentioned circumstances, and its object is to provide a resin composition having excellent mechanical strength, a small relative permittivity, and a small dielectric tangent. [Means to solve the problem]

為了解決上述課題，本發明採用以下構成。In order to solve the above-mentioned problems, the present invention adopts the following configuration.

[1] 一種樹脂組成物，其包含熱塑性樹脂及/或熱硬化性樹脂、及分散於前述熱塑性樹脂及/或前述熱硬化性樹脂中之玻璃成分， 前述樹脂組成物灰化後之殘渣成分以ICP分析時，相對於前述樹脂組成物所含之金屬成分100質量%，前述樹脂組成物所含之鈣含量為0~27質量%。[1] A resin composition comprising a thermoplastic resin and/or a thermosetting resin, and a glass component dispersed in the thermoplastic resin and/or the thermosetting resin, When the residue component after ashing of the resin composition is analyzed by ICP, the calcium content of the resin composition is 0-27% by mass relative to 100% by mass of the metal component contained in the resin composition.

[2] 如前述[1]之樹脂組成物，其中前述樹脂組成物灰化後之殘渣成分以ICP分析時，相對於前述樹脂組成物所含之金屬成分100質量%，前述樹脂組成物所含之矽含量為51質量%以上。[2] The resin composition of the aforementioned [1], wherein when the residue of the resin composition after ashing is analyzed by ICP, relative to 100% by mass of the metal component contained in the resin composition, the resin composition contains The silicon content is more than 51% by mass.

[3] 一種樹脂組成物，其包含熱塑性樹脂及/或熱硬化性樹脂、及分散於前述熱塑性樹脂及/或前述熱硬化性樹脂中之玻璃成分， 相對於前述玻璃成分所含之金屬成分100質量%，前述玻璃成分所含之鈣含量為0~27質量%。[3] A resin composition comprising a thermoplastic resin and/or a thermosetting resin, and a glass component dispersed in the thermoplastic resin and/or the thermosetting resin, The content of calcium contained in the glass component is 0-27% by mass relative to 100% by mass of the metal component contained in the glass component.

[4] 如前述[3]之樹脂組成物，其中相對於前述玻璃成分所含之金屬成分100質量%，前述玻璃成分所含之矽含量為51質量%以上。[4] The resin composition of [3] above, wherein the silicon content in the glass component is 51% by mass or more relative to 100% by mass of the metal component contained in the glass component.

[5] 如前述[1]至[4]中任一項之樹脂組成物，其中於1GHz之頻率及25℃之溫度下之前述樹脂組成物之相對介電常數ε_r 為3.4以下。[5] The resin composition according to any one of [1] to [4], wherein the relative permittivity ε _r of the resin composition at a frequency of 1 GHz and a temperature of 25° C. is 3.4 or less.

[6] 如前述[5]之樹脂組成物，其中於1GHz之頻率及25℃之溫度下之前述樹脂組成物之介電正切tanδ為5.5×10^-3 以下。[6] The resin composition of [5], wherein the dielectric tangent tanδ of the resin composition at a frequency of 1 GHz and a temperature of 25° C. is 5.5×10 ^-3 or less.

[7] 如前述[5]或[6]之樹脂組成物，其中前述樹脂組成物之熱擴散率為0.14mm² /s以上。 [發明效果][7] The resin composition of the aforementioned [5] or [6], wherein the thermal diffusivity of the aforementioned resin composition is 0.14 mm ² /s or more. [Invention Effect]

依據本發明，可提供機械強度優異，相對介電常數小，且介電正切小之樹脂組成物。According to the present invention, it is possible to provide a resin composition having excellent mechanical strength, a small relative permittivity, and a small dielectric tangent.

＜樹脂組成物＞ 本實施形態之樹脂組成物包含熱塑性樹脂及/或熱硬化性樹脂、及分散於前述熱塑性樹脂及/或前述熱硬化性樹脂中之玻璃成分。＜Resin composition＞ The resin composition of this embodiment contains a thermoplastic resin and/or a thermosetting resin, and a glass component dispersed in the thermoplastic resin and/or the thermosetting resin.

本實施形態之樹脂組成物可藉由混合熱塑性樹脂及/或熱硬化性樹脂與玻璃成分，使前述玻璃成分分散於前述熱塑性樹脂及/或前述熱硬化性樹脂中而獲得。The resin composition of this embodiment can be obtained by mixing a thermoplastic resin and/or a thermosetting resin with a glass component, and dispersing the glass component in the thermoplastic resin and/or the thermosetting resin.

本實施形態之樹脂組成物於將前述樹脂組成物灰化後之殘渣成分以ICP分析時，相對於前述樹脂組成物所含之金屬成分100質量%，前述樹脂組成物所含之鈣含量為0~27質量%。相對於前述樹脂組成物所含之金屬成分100質量%，前述樹脂組成物所含之鈣含量較佳為0~20質量%，更佳為0~15質量%，特佳為0~10質量%。相對於前述樹脂組成物所含之金屬成分100質量%，前述樹脂組成物所含之鈣含量可為0.2質量%以上，可為0.4質量%以上，亦可為1.0質量%以上。亦即相對於前述樹脂組成物所含之金屬成分100質量%，前述樹脂組成物所含之鈣含量可為0.2~20質量%，可為0.4~15質量%，亦可為1.0~10質量%。藉由使前述樹脂組成物所含之鈣含量為上述範圍，本實施形態之樹脂組成物可成為相對介電常數小，且介電正切小者，與包含同樣形態之玻璃成分者相比，機械強度亦可維持同程度。In the resin composition of the present embodiment, when the residue composition of the resin composition after ashing is analyzed by ICP, the content of calcium in the resin composition is 0 relative to 100% by mass of the metal component contained in the resin composition. ~27% by mass. The content of calcium contained in the resin composition is preferably 0-20% by mass, more preferably 0-15% by mass, and particularly preferably 0-10% by mass, relative to 100% by mass of the metal component contained in the aforementioned resin composition . The content of calcium contained in the resin composition may be 0.2% by mass or more, 0.4% by mass or more, or 1.0% by mass or more relative to 100% by mass of the metal components contained in the resin composition. That is, relative to 100% by mass of the metal components contained in the resin composition, the calcium content in the resin composition may be 0.2-20% by mass, 0.4-15% by mass, or 1.0-10% by mass. . By setting the calcium content contained in the aforementioned resin composition within the above-mentioned range, the resin composition of this embodiment can have a small relative permittivity and a small dielectric tangent. Compared with a glass component of the same form, the resin composition has a mechanical The intensity can also be maintained at the same level.

本說明書中，所謂金屬成分係指金屬元素之成分，此處，硼、矽、鍺、砷、銻、碲、硒、釙及砈之半金屬亦包含於金屬元素。作為玻璃成分之金屬成分，亦可分析Al、Ba、Ca、Si、Ti、Cd、Co、Cr、Cu、Fe、K、Li、Mg、Mn、Mo、Na、Ni、P、Pb、Sb、V及Zn。In this specification, the so-called metallic component refers to the component of the metallic element. Here, the semi-metals of boron, silicon, germanium, arsenic, antimony, tellurium, selenium, polonium, and pallium are also included in the metallic element. As the metal component of the glass component, it can also analyze Al, Ba, Ca, Si, Ti, Cd, Co, Cr, Cu, Fe, K, Li, Mg, Mn, Mo, Na, Ni, P, Pb, Sb, V and Zn.

本實施形態之樹脂組成物於將前述樹脂組成物灰化後之殘渣成分以ICP分析時，相對於前述樹脂組成物所含之Al、Ca、Si、K、Li、Mg、Na及Zn之合計含量100質量%，前述樹脂組成物所含之鈣含量較佳為0~27質量%，更佳為0~20質量%，又更佳為0~15質量%，特佳為0~10質量%。相對於前述樹脂組成物所含之Al、Ca、Si、K、Li、Mg、Na及Zn之合計含量100質量%，前述樹脂組成物所含之鈣含量可為0.2質量%以上，可為0.4質量%以上，亦可為1.0質量%以上。亦即相對於前述樹脂組成物所含之Al、Ca、Si、K、Li、Mg、Na及Zn之合計含量100質量%，前述樹脂組成物所含之鈣含量可為0.2~20質量%，可為0.4~15質量%，亦可為1.0~10質量%。In the resin composition of this embodiment, when the composition of the residue after ashing of the resin composition is analyzed by ICP, relative to the total of Al, Ca, Si, K, Li, Mg, Na, and Zn contained in the resin composition The content is 100% by mass, and the calcium content contained in the aforementioned resin composition is preferably 0-27% by mass, more preferably 0-20% by mass, still more preferably 0-15% by mass, particularly preferably 0-10% by mass . With respect to the total content of Al, Ca, Si, K, Li, Mg, Na, and Zn contained in the aforementioned resin composition of 100% by mass, the content of calcium contained in the aforementioned resin composition may be 0.2% by mass or more, and may be 0.4 The mass% or more may be 1.0 mass% or more. That is, relative to 100% by mass of the total content of Al, Ca, Si, K, Li, Mg, Na, and Zn contained in the aforementioned resin composition, the content of calcium contained in the aforementioned resin composition may be 0.2-20% by mass, It may be 0.4 to 15% by mass, or 1.0 to 10% by mass.

本實施形態之樹脂組成物，相對於前述玻璃成分所含之金屬成分100質量%，前述玻璃成分所含之鈣含量為0~27質量%，較佳為0~20質量%，更佳為0~15質量%，特佳為0~10質量%。相對於前述玻璃成分所含之金屬成分100質量%，前述玻璃成分所含之鈣含量可為0.2質量%以上，可為0.4質量%以上，亦可為1.0質量%以上。亦即相對於前述玻璃成分所含之金屬成分100質量%，前述玻璃成分所含之鈣含量可為0.2~20質量%，可為0.4~15質量%，亦可為1.0~10質量%。藉由使前述玻璃成分所含之鈣含量為前述範圍，本實施形態之樹脂組成物可成為相對介電常數小，且介電正切小者，與包含同樣形態之玻璃成分者相比，機械強度亦可維持同程度。The resin composition of the present embodiment has a calcium content of 0-27% by mass, preferably 0-20% by mass, and more preferably 0, relative to 100% by mass of the metal component contained in the aforementioned glass component. ~15% by mass, particularly preferably 0-10% by mass. The calcium content contained in the glass component may be 0.2% by mass or more, 0.4% by mass or more, or 1.0% by mass or more relative to 100% by mass of the metal component contained in the glass component. That is, relative to 100% by mass of the metal component in the glass component, the calcium content in the glass component may be 0.2-20% by mass, 0.4-15% by mass, or 1.0-10% by mass. By setting the calcium content contained in the glass component in the above range, the resin composition of this embodiment can have a small relative permittivity and a small dielectric tangent. Compared with a glass component of the same form, the resin composition has mechanical strength Can also maintain the same degree.

本實施形態之樹脂組成物，相對於前述玻璃成分所含之Al、Ca、Si、K、Li、Mg、Na及Zn之合計含量100質量%，前述玻璃成分所含之鈣含量較佳為0~27質量%，更佳為0~20質量%，又更佳為0~15質量%，特佳為0~10質量%。相對於前述玻璃成分所含之金屬成分100質量%，前述玻璃成分所含之鈣含量可為0.2質量%以上，可為0.4質量%以上，亦可為1.0質量%以上。亦即相對於前述玻璃成分所含之金屬成分100質量%，前述玻璃成分所含之鈣含量可為0.2~20質量%，可為0.4~15質量%，亦可為1.0~10質量%。藉由使前述玻璃成分所含之鈣含量為前述範圍，本實施形態之樹脂組成物可成為相對介電常數小，且介電正切小者，與包含同樣形態之玻璃成分者相比，機械強度亦可維持同程度。In the resin composition of this embodiment, the total content of Al, Ca, Si, K, Li, Mg, Na, and Zn contained in the aforementioned glass component is 100% by mass, and the content of calcium contained in the aforementioned glass component is preferably zero. ~27% by mass, more preferably 0-20% by mass, still more preferably 0-15% by mass, particularly preferably 0-10% by mass. The calcium content contained in the glass component may be 0.2% by mass or more, 0.4% by mass or more, or 1.0% by mass or more relative to 100% by mass of the metal component contained in the glass component. That is, relative to 100% by mass of the metal component in the glass component, the calcium content in the glass component may be 0.2-20% by mass, 0.4-15% by mass, or 1.0-10% by mass. By setting the calcium content contained in the glass component in the above range, the resin composition of this embodiment can have a small relative permittivity and a small dielectric tangent. Compared with a glass component of the same form, the resin composition has mechanical strength Can also maintain the same degree.

本實施形態之樹脂組成物於將前述樹脂組成物灰化後之殘渣成分以ICP分析時，相對於前述樹脂組成物所含之金屬成分100質量%，前述樹脂組成物所含之矽含量較佳為51質量%以上，更佳為55質量%以上，特佳為60質量%以上。藉由使前述樹脂組成物所含之矽含量為前述範圍，本實施形態之樹脂組成物可成為相對介電常數小，且介電正切小者，與包含同樣形態之玻璃成分者相比，機械強度亦可維持同程度。In the resin composition of the present embodiment, when the residue composition of the resin composition after ashing is analyzed by ICP, the silicon content of the resin composition is better than 100% by mass of the metal component contained in the resin composition It is 51% by mass or more, more preferably 55% by mass or more, and particularly preferably 60% by mass or more. By setting the silicon content of the aforementioned resin composition within the aforementioned range, the resin composition of this embodiment can have a low relative dielectric constant and a small dielectric tangent. Compared with a glass component of the same form, the resin composition of the present embodiment can be mechanically The intensity can also be maintained at the same level.

進而，本實施形態之樹脂組成物於將前述樹脂組成物灰化後之殘渣成分以ICP分析時，相對於前述樹脂組成物所含之金屬成分100質量%，前述樹脂組成物所含之矽含量較佳為62質量%以上，更佳為65質量%以上，特佳為70質量%以上。藉由使前述樹脂組成物所含之矽含量為前述範圍，本實施形態之樹脂組成物可成為相對介電常數小，介電正切小，且熱擴散率大者，與包含同樣形態之玻璃成分者相比，機械強度亦可維持同程度。Furthermore, in the resin composition of the present embodiment, when the residue component after ashing of the resin composition is analyzed by ICP, the silicon content of the resin composition is relative to 100% by mass of the metal component contained in the resin composition It is preferably 62% by mass or more, more preferably 65% by mass or more, and particularly preferably 70% by mass or more. By setting the silicon content of the aforementioned resin composition within the aforementioned range, the resin composition of this embodiment can have a small relative permittivity, a small dielectric tangent, and a large thermal diffusivity, which is equivalent to a glass component containing the same form Compared with others, the mechanical strength can be maintained at the same level.

本實施形態之樹脂組成物於將前述樹脂組成物灰化後之殘渣成分以ICP分析時，相對於前述樹脂組成物所含之金屬成分100質量%，前述樹脂組成物所含之矽含量可為100質量%以下，可為99.8質量%以下，亦可為99.5質量%以下。 本實施形態之樹脂組成物於將前述樹脂組成物灰化後之殘渣成分以ICP分析時，相對於前述樹脂組成物所含之金屬成分100質量%，前述樹脂組成物所含之矽含量可為51質量%以上100質量%以下，可為55質量%以上99.8質量%以下，可為60質量%以上99.5質量%以下，可為62質量%以上100質量%以下，可為65質量%以上99.8質量%以下，可為70質量%以上99.5質量%以下。In the resin composition of the present embodiment, when the residue composition of the resin composition after ashing is analyzed by ICP, the content of silicon contained in the resin composition may be 100% by mass relative to the metal component contained in the resin composition 100% by mass or less, may be 99.8% by mass or less, or may be 99.5% by mass or less. In the resin composition of the present embodiment, when the residue composition of the resin composition after ashing is analyzed by ICP, the content of silicon contained in the resin composition may be 100% by mass relative to the metal component contained in the resin composition 51% by mass or more and 100% by mass or less, 55% by mass or more and 99.8% by mass or less, 60% by mass or more and 99.5% by mass or less, 62% by mass or more and 100% by mass or less, and 65% by mass or more and 99.8% by mass % Or less, and may be 70% by mass or more and 99.5% by mass or less.

本實施形態之樹脂組成物於將前述樹脂組成物灰化後之殘渣成分以ICP分析時，相對於前述樹脂組成物所含之Al、Ca、Si、K、Li、Mg、Na及Zn之合計含量100質量%，前述樹脂組成物所含之矽含量較佳為51質量%以上，更佳為55質量%以上，特佳為60質量%以上。In the resin composition of this embodiment, when the composition of the residue after ashing of the resin composition is analyzed by ICP, relative to the total of Al, Ca, Si, K, Li, Mg, Na, and Zn contained in the resin composition The content is 100% by mass, and the silicon content contained in the aforementioned resin composition is preferably 51% by mass or more, more preferably 55% by mass or more, and particularly preferably 60% by mass or more.

進而，本實施形態之樹脂組成物於將前述樹脂組成物灰化後之殘渣成分以ICP分析時，相對於前述樹脂組成物所含之Al、Ca、Si、K、Li、Mg、Na及Zn之合計含量100質量%，前述樹脂組成物所含之矽含量較佳為62質量%以上，更佳為65質量%以上，特佳為70質量%以上。Furthermore, in the resin composition of the present embodiment, when the composition of the residue after ashing of the resin composition is analyzed by ICP, it is compared with Al, Ca, Si, K, Li, Mg, Na, and Zn contained in the resin composition. The total content is 100% by mass, and the silicon content contained in the aforementioned resin composition is preferably 62% by mass or more, more preferably 65% by mass or more, and particularly preferably 70% by mass or more.

本實施形態之樹脂組成物於將前述樹脂組成物灰化後之殘渣成分以ICP分析時，相對於前述樹脂組成物所含之Al、Ca、Si、K、Li、Mg、Na及Zn之合計含量100質量%，前述樹脂組成物所含之矽含量可為100質量%以下，可為99.8質量%以下，亦可為99.5質量%以下。 本實施形態之樹脂組成物於將前述樹脂組成物灰化後之殘渣成分以ICP分析時，相對於前述樹脂組成物所含之Al、Ca、Si、K、Li、Mg、Na及Zn之合計含量100質量%，前述樹脂組成物所含之矽含量可為51質量%以上100質量%以下，可為55質量%以上99.8質量%以下，可為60質量%以上99.5質量%以下，可為62質量%以上100質量%以下，可為65質量%以上99.8質量%以下，可為70質量%以上99.5質量%以下。In the resin composition of this embodiment, when the composition of the residue after ashing of the resin composition is analyzed by ICP, relative to the total of Al, Ca, Si, K, Li, Mg, Na, and Zn contained in the resin composition The content is 100% by mass, and the silicon content in the aforementioned resin composition may be 100% by mass or less, may be 99.8% by mass or less, or may be 99.5% by mass or less. In the resin composition of this embodiment, when the composition of the residue after ashing of the resin composition is analyzed by ICP, relative to the total of Al, Ca, Si, K, Li, Mg, Na, and Zn contained in the resin composition The content is 100% by mass. The silicon content contained in the aforementioned resin composition can be 51% by mass or more and 100% by mass or less, can be 55% by mass or more and 99.8% by mass or less, can be 60% by mass or more and 99.5% by mass or less, and can be 62 Mass% or more and 100 mass% or less, may be 65% by mass or more and 99.8% by mass or less, and may be 70% by mass or more and 99.5% by mass or less.

本實施形態之樹脂組成物，相對於前述玻璃成分所含之金屬成分100質量%，前述玻璃成分所含之矽含量較佳為51質量%以上，更佳為55質量%以上，特佳為60質量%以上。藉由使前述玻璃成分所含之矽含量為前述範圍，本實施形態之樹脂組成物可成為相對介電常數小，且介電正切小者，與包含同樣形態之玻璃成分者相比，機械強度亦可維持同程度。In the resin composition of the present embodiment, the silicon content of the glass component is preferably 51% by mass or more, more preferably 55% by mass or more, and particularly preferably 60% by mass relative to 100% by mass of the metal component contained in the glass component. Above mass%. By setting the silicon content of the glass component in the aforementioned range, the resin composition of this embodiment can have a low relative permittivity and a small dielectric tangent. Compared with the glass component of the same form, the resin composition has mechanical strength Can also maintain the same degree.

進而本實施形態之樹脂組成物，相對於前述玻璃成分所含之金屬成分100質量%，前述玻璃成分所含之矽含量較佳為62質量%以上，更佳為65質量%以上，特佳為70質量%以上。 藉由使前述玻璃成分所含之矽含量為前述範圍，本實施形態之樹脂組成物可成為相對介電常數小，介電正切小，且熱擴散率大者，與包含同樣形態之玻璃成分者相比，機械強度亦可維持同程度。Furthermore, in the resin composition of the present embodiment, the content of silicon contained in the glass component is preferably 62% by mass or more, more preferably 65% by mass or more, with respect to 100% by mass of the metal component contained in the glass component. 70% by mass or more. By setting the silicon content contained in the glass component within the aforementioned range, the resin composition of this embodiment can have a low relative permittivity, a small dielectric tangent, and a large thermal diffusivity, as well as those containing glass components of the same form In comparison, the mechanical strength can be maintained at the same level.

本實施形態之樹脂組成物，相對於前述玻璃成分所含之金屬成分100質量%，前述玻璃成分所含之矽含量可為100質量%以下，可為99.8質量%以下，亦可為99.5質量%以下。 本實施形態之樹脂組成物，相對於前述玻璃成分所含之金屬成分100質量%，前述玻璃成分所含之矽含量可為51質量%以上100質量%以下，可為55質量%以上99.8質量%以下，可為60質量%以上99.5質量%以下，可為62質量%以上100質量%以下，可為65質量%以上99.8質量%以下，可為70質量%以上99.5質量%以下。In the resin composition of this embodiment, with respect to 100% by mass of the metal component contained in the aforementioned glass component, the silicon content in the aforementioned glass component may be 100% by mass or less, 99.8% by mass or less, or 99.5% by mass the following. In the resin composition of this embodiment, the silicon content of the glass component can be 51% by mass to 100% by mass, and can be 55% by mass to 99.8% by mass relative to 100% by mass of the metal component in the glass component. Hereinafter, it may be 60% by mass or more and 99.5% by mass or less, 62% by mass or more and 100% by mass or less, 65% by mass or more and 99.8% by mass or less, and 70% by mass or more and 99.5% by mass or less.

本實施形態之樹脂組成物，相對於前述玻璃成分所含之Al、Ca、Si、K、Li、Mg、Na及Zn之合計含量100質量%，前述玻璃成分所含之矽含量較佳為51質量%以上，更佳為55質量%以上，特佳為60質量%以上。In the resin composition of this embodiment, the total content of Al, Ca, Si, K, Li, Mg, Na, and Zn contained in the aforementioned glass component is 100% by mass, and the content of silicon contained in the aforementioned glass component is preferably 51%. % By mass or more, more preferably 55% by mass or more, particularly preferably 60% by mass or more.

進而本實施形態之樹脂組成物，相對於前述玻璃成分所含之Al、Ca、Si、K、Li、Mg、Na及Zn之合計含量100質量%，前述玻璃成分所含之矽含量較佳為62質量%以上，更佳為65質量%以上，特佳為70質量%以上。Furthermore, in the resin composition of this embodiment, the total content of Al, Ca, Si, K, Li, Mg, Na, and Zn contained in the aforementioned glass component is 100% by mass, and the content of silicon contained in the aforementioned glass component is preferably 62% by mass or more, more preferably 65% by mass or more, particularly preferably 70% by mass or more.

本實施形態之樹脂組成物，相對於前述玻璃成分所含之Al、Ca、Si、K、Li、Mg、Na及Zn之合計含量100質量%，前述玻璃成分所含之矽含量可為99.8質量%以下，可為55質量%以下，亦可為99.5質量%以下。 本實施形態之樹脂組成物，相對於前述玻璃成分所含之Al、Ca、Si、K、Li、Mg、Na及Zn之合計含量100質量%，前述玻璃成分所含之矽含量可為51質量%以上100質量%以下，可為55質量%以上99.8質量%以下，可為60質量%以上99.5質量%以下，可為62質量%以上100質量%以下，可為65質量%以上99.8質量%以下，可為70質量%以上99.5質量%以下。In the resin composition of this embodiment, the total content of Al, Ca, Si, K, Li, Mg, Na, and Zn contained in the glass component is 100% by mass, and the silicon content in the glass component can be 99.8 mass% % Or less, may be 55% by mass or less, or may be 99.5% by mass or less. In the resin composition of this embodiment, the total content of Al, Ca, Si, K, Li, Mg, Na, and Zn contained in the glass component is 100% by mass, and the silicon content in the glass component can be 51 mass% % Or more and 100 mass% or less, can be 55% by mass or more and 99.8% by mass or less, can be 60% by mass or more and 99.5% by mass or less, can be 62% or more and 100% by mass or less, can be 65% by mass or more and 99.8% by mass or less , Can be 70% by mass or more and 99.5% by mass or less.

本實施形態之樹脂組成物於1GHz之頻率及25℃之溫度下之前述樹脂組成物之相對介電常數ε_r 較佳為3.4以下，更佳為3.35以下，特佳為3.3以下。藉由使前述樹脂組成物之相對介電常數ε_r 為前述上限值以下，可成為於共振器、濾波器、天線、電路基板及層合電路元件基板等之介電體裝置領域中，亦可利用於高頻帶區域之介電體用材料。 作為使前述樹脂組成物之相對介電常數ε_r 之下限值並未特別限定，可為2.0以上，可為2.5以上，可為3.0以上。 亦即前述樹脂組成物之相對介電常數ε_r 較佳為2.0以上3.4以下，更佳為2.5以上3.35以下，特佳為3.0以上3.3以下。 樹脂組成物於1GHz之頻率及25℃之溫度下之相對介電常數ε_r 可藉由自對象的樹脂組成物製作平板狀之試驗片，使用市售之阻抗分析儀藉實施例記載之方法測定。The relative permittivity ε _r of the resin composition of the resin composition of the present embodiment at a frequency of 1 GHz and a temperature of 25° C. is preferably 3.4 or less, more preferably 3.35 or less, and particularly preferably 3.3 or less. By making the relative permittivity ε _r of the resin composition below the upper limit, it can be used in the field of dielectric devices such as resonators, filters, antennas, circuit boards, and laminated circuit element substrates. Dielectric materials that can be used in the high-frequency region. The lower limit of the relative permittivity ε _r of the resin composition is not particularly limited, and it may be 2.0 or more, 2.5 or more, and 3.0 or more. That is, the relative dielectric constant ε _{r of the} aforementioned resin composition is preferably 2.0 or more and 3.4 or less, more preferably 2.5 or more and 3.35 or less, and particularly preferably 3.0 or more and 3.3 or less. The relative permittivity ε _{r of the} resin composition at a frequency of 1 GHz and a temperature of 25° C. can be measured by making a flat test piece from the resin composition of the subject and using a commercially available impedance analyzer by the method described in the examples .

本實施形態之樹脂組成物於1GHz之頻率及25℃之溫度下之前述樹脂組成物之介電正切tanδ較佳為5.5×10^-3 以下，更佳為5.0×10^-3 以下，特佳為4.8×10^-3 以下。 藉由使前述樹脂組成物之介電正切tanδ為前述上限值以下，於使用作為各種介電體裝置之介電體用材料時，可將介電損失、傳送損失抑制為較低。 作為前述樹脂組成物之介電正切tanδ之下限值並未特別限定，但可為4.0×10^-3 以上，可為4.3×10^-3 以上，亦可為4.5×10^-3 以上。 亦即前述樹脂組成物之介電正切tanδ較佳為4.0×10^-3 以上5.5×10^-3 以下，更佳為4.3×10^-3 以上5.0×10^-3 以下，特佳為4.5×10^-3 以上4.8×10^-3 以下。 樹脂組成物於1GHz之頻率及25℃之溫度下之介電正切tanδ可藉由自對象的樹脂組成物製作平板狀之試驗片，使用市售之阻抗分析儀藉實施例記載之方法測定。The dielectric tangent tanδ of the resin composition of the present embodiment at a frequency of 1GHz and a temperature of 25°C is preferably 5.5×10 ^-3 or less, more preferably 5.0×10 ^-3 or less, and particularly preferably 4.8×10 ^-3 or less. By making the dielectric tangent tanδ of the resin composition below the above upper limit value, when using as a dielectric material for various dielectric devices, the dielectric loss and transmission loss can be suppressed to a low level. The lower limit of the dielectric tangent tan δ of the aforementioned resin composition is not particularly limited, but it may be 4.0×10 ^-3 or more, 4.3×10 ^-3 or more, or 4.5×10 ^-3 or more. I.e., the composition of the resin dielectric tangent tanδ is preferably more than 4.0 × 10 ^-3 5.5 × 10 ^-3 or less, more preferably more than 4.3 × 10 ^-3 5.0 × 10 ^-3 or less, and particularly preferably 4.5 × 10 ^{- 3} above 4.8×10 ^-3 below. The dielectric tangent tanδ of the resin composition at a frequency of 1 GHz and a temperature of 25° C. can be measured by making a flat test piece from the target resin composition and using a commercially available impedance analyzer by the method described in the examples.

本實施形態之樹脂組成物之熱擴散率較佳為0.14mm² /s以上，更佳為0.15mm² /s以上，特佳為0.16mm² /s以上。藉由使前述樹脂組成物之熱擴散率為前述下限值以上，於使用作為各種介電體裝置之介電體用材料時，容易散熱，可將溫度上升抑制為較低。 作為前述樹脂組成物之熱擴散率之上限值並未特別限定，可為0.25mm² /s以下，可為0.20mm² /s以下，可為0.18mm² /s以下。 亦即前述樹脂組成物之熱擴散率較佳為0.14mm² /s以上0.25mm² /s以下，更佳為0.15mm² /s以上0.20mm² /s以下，特佳為0.16mm² /s以上0.18mm² /s以下。 樹脂組成物之熱擴散率可藉由自對象的樹脂組成物製作薄片狀之試驗片，使用市售之熱擴散率計藉實施例記載之方法測定。The thermal diffusivity of the composition aspect of this embodiment the resin is preferably 0.14mm ² / s or more, more preferably 0.15mm ² / s or more, particularly preferably 0.16mm ² / s or more. By making the thermal diffusivity of the resin composition equal to or higher than the aforementioned lower limit, it is easy to dissipate heat when used as a dielectric material for various dielectric devices, and the temperature rise can be suppressed to a low level. The upper limit of the thermal diffusivity of the aforementioned resin composition is not particularly limited, and it may be 0.25 mm ² /s or less, 0.20 mm ² /s or less, or 0.18 mm ² /s or less. I.e. the thermal diffusivity of the resin composition is preferably 0.14mm ² / s or more 0.25mm ² / s or less, more preferably 0.15mm ² / s or more 0.20mm ² / s or less, particularly preferably 0.16mm ² / s Above 0.18mm ² /s or less. The thermal diffusivity of the resin composition can be measured by making a thin test piece from the target resin composition and using a commercially available thermal diffusivity meter by the method described in the examples.

(熱塑性樹脂及/或熱硬化性樹脂) 作為本實施形態之樹脂組成物基質樹脂，可為熱塑性樹脂，亦可為熱硬化性樹脂，亦可為熱塑性樹脂與熱硬化性樹脂之混合物。(Thermoplastic resin and/or thermosetting resin) The matrix resin of the resin composition of this embodiment may be a thermoplastic resin, a thermosetting resin, or a mixture of a thermoplastic resin and a thermosetting resin.

・熱塑性樹脂 作為熱塑性樹脂可為廣泛使用之塑膠，可為工程塑膠，可為超級工程塑膠。 具體可較佳地使用聚乙烯(PE)、高密度聚乙烯(HDPE)、中密度聚乙烯(MDPE)、低密度聚乙烯(LDPE)、聚丙烯(PP)、聚氯乙烯(PVC)、聚偏氯乙烯、聚苯乙烯(PS)、聚乙酸乙烯酯(PVAc)、聚胺基甲酸酯(PUR)、聚四氟乙烯(PTFE)、ABS樹脂(丙烯腈丁二烯苯乙烯樹脂)、AS樹脂、丙烯酸樹脂(PMMA)等之廣泛使用塑膠； 聚醯胺(PA)、聚縮醛(POM)、聚碳酸酯(PC)、改質聚苯醚(m-PPE、改質PPE、PPO)、聚對苯二甲酸乙二酯(PET)、聚對苯二甲酸丁二酯(PBT)、環狀聚烯烴(COP)等之工程塑膠； 聚苯硫醚(PPS)、聚四氟乙烯(PTFE)、聚碸(PSF)、聚醚碸(PES)、非晶聚丙烯酸酯(PAR)、液晶聚合物(LCP)、聚醚醚酮(PEEK)、熱塑性聚醯亞胺(PI)、聚醯胺醯亞胺(PAI)等之超級工程塑膠。・Thermoplastic resin As a thermoplastic resin, it can be a widely used plastic, engineering plastic, or super engineering plastic. Specifically, polyethylene (PE), high density polyethylene (HDPE), medium density polyethylene (MDPE), low density polyethylene (LDPE), polypropylene (PP), polyvinyl chloride (PVC), poly Vinylidene chloride, polystyrene (PS), polyvinyl acetate (PVAc), polyurethane (PUR), polytetrafluoroethylene (PTFE), ABS resin (acrylonitrile butadiene styrene resin), Widely used plastics such as AS resin and acrylic resin (PMMA); Polyamide (PA), polyacetal (POM), polycarbonate (PC), modified polyphenylene ether (m-PPE, modified PPE, PPO), polyethylene terephthalate (PET), Engineering plastics such as polybutylene terephthalate (PBT) and cyclic polyolefin (COP); Polyphenylene sulfide (PPS), polytetrafluoroethylene (PTFE), polysulfide (PSF), polyether sulfide (PES), amorphous polyacrylate (PAR), liquid crystal polymer (LCP), polyether ether ketone ( PEEK), thermoplastic polyimide (PI), polyimide imide (PAI) and other super engineering plastics.

該等中，特佳為液晶聚合物(LCP)。液晶聚合物(LCP)於熔融狀態顯示液晶性，包含液晶聚合物(LCP)之樹脂組成物較佳於熔融狀態亦顯示液晶性，較佳為於450℃以下之溫度熔融者。Among them, liquid crystal polymer (LCP) is particularly preferred. Liquid crystal polymer (LCP) exhibits liquid crystallinity in a molten state, and a resin composition containing liquid crystal polymer (LCP) preferably exhibits liquid crystallinity in a molten state, preferably one that melts at a temperature below 450°C.

作為本實施形態使用之液晶聚合物(LCP)可為液晶聚酯、可為液晶聚酯醯胺，可為液晶聚酯醚，可為液晶聚酯碳酸酯，可為液晶聚酯醯亞胺。作為本實施形態使用之液晶聚合物(LCP)較佳為液晶聚酯，特佳為僅使用芳香族化合物作為原料單體之全芳香族液晶聚酯。The liquid crystal polymer (LCP) used in this embodiment may be a liquid crystal polyester, a liquid crystal polyester amide, a liquid crystal polyester ether, a liquid crystal polyester carbonate, or a liquid crystal polyester imide. The liquid crystal polymer (LCP) used in this embodiment is preferably a liquid crystal polyester, and particularly preferably a wholly aromatic liquid crystal polyester using only an aromatic compound as a raw material monomer.

作為本實施形態使用之液晶聚酯之典型例，舉例為芳香族羥基羧酸、芳香族二羧酸與選自芳香族二醇、芳香族羥基胺及芳香族二胺所成之群中之至少一種化合物聚合(聚縮合)者；複數種芳香族羥基羧酸聚合者；芳香族二羧酸與選自芳香族二醇、芳香族羥基胺及芳香族二胺所成之群中之至少一種化合物聚合者；以及聚對苯二甲酸乙二酯等之聚酯與芳香族羥基羧酸聚合者。此處，芳香族羥基羧酸、芳香族二羧酸、芳香族二醇、芳香族羥基胺及芳香族二胺亦可分別獨立代替其一部分或全部而使用可進行該聚合之衍生物。As a typical example of the liquid crystal polyester used in this embodiment, for example, aromatic hydroxycarboxylic acid, aromatic dicarboxylic acid, and at least one selected from the group consisting of aromatic diol, aromatic hydroxyamine and aromatic diamine One compound polymerization (polycondensation); multiple aromatic hydroxycarboxylic acid polymerization; aromatic dicarboxylic acid and at least one compound selected from the group consisting of aromatic diols, aromatic hydroxyamines and aromatic diamines Polymerizer; and polymerizer of polyester and aromatic hydroxycarboxylic acid such as polyethylene terephthalate. Here, an aromatic hydroxycarboxylic acid, an aromatic dicarboxylic acid, an aromatic diol, an aromatic hydroxyamine, and an aromatic diamine may be substituted independently for a part or all of them, and derivatives capable of the polymerization may be used.

作為如芳香族羥基羧酸及芳香族二羧酸之具有羧基之化合物的可聚合衍生物之例，舉例為羧基轉換為烷氧羰基或芳氧羰基者(酯)、羧基轉換為鹵甲醯基者(酸鹵化物)及羧基轉換為醯氧羰基者(酸酐)。如芳香族羥基羧酸、芳香族二醇及芳香族羥基胺之具有羥基之化合物的可聚合衍生物之例，舉例為羥基經醯化而轉換為醯氧基者(醯化物)。如芳香族羥基胺及芳香族二胺之具有胺基之化合物的可聚合衍生物之例，舉例為胺基經醯化而轉換為醯基胺基者(醯化物)。Examples of polymerizable derivatives of compounds having carboxyl groups such as aromatic hydroxycarboxylic acids and aromatic dicarboxylic acids include those in which the carboxyl group is converted to an alkoxycarbonyl group or aryloxycarbonyl group (ester), and the carboxyl group is converted to a haloformyl group. Those (acid halide) and carboxyl group converted to oxycarbonyl group (acid anhydride). Examples of polymerizable derivatives of compounds having hydroxyl groups, such as aromatic hydroxycarboxylic acids, aromatic diols, and aromatic hydroxylamines, are those in which the hydroxyl group is converted into an oxy group by acylation (an acylate). Examples of polymerizable derivatives of compounds having amine groups, such as aromatic hydroxylamines and aromatic diamines, are those in which the amine group is converted into an acylated amino group (an acylate) by acylation.

本實施形態使用之液晶聚酯較佳具有以下述式(1)表示之重複單位(以下有時稱為「重複單位(1)」)，更佳具有重複單位(1)、以下述式(2)表示之重複單位(以下有時稱為「重複單位(2)」)及以下述式(3)表示之重複單位(以下有時稱為「重複單位(3)」)。The liquid crystal polyester used in this embodiment preferably has a repeating unit represented by the following formula (1) (hereinafter sometimes referred to as "repeating unit (1)"), and more preferably has a repeating unit (1), which is represented by the following formula (2) ) Represents the repeating unit (hereinafter sometimes referred to as "repeating unit (2)") and the repeating unit represented by the following formula (3) (hereinafter sometimes referred to as "repeating unit (3)").

(1) -O-Ar¹ -CO- (2) -CO-Ar² -CO- (3) -X-Ar³ -Y- (式(1)~式(3)中，Ar¹ 表示伸苯基、伸萘基或伸聯苯基；Ar² 及Ar³ 分別獨立表示伸苯基、伸萘基、伸聯苯基或以下述式(4)表示之基；X及Y分別獨立表示氧原子或亞胺基；Ar¹ 、Ar² 或Ar³ 表示之前述基中之氫原子可分別獨立經鹵原子、烷基或芳基取代)。 (4) -Ar⁴ -Z-Ar⁵ - (式4中，Ar⁴ 及Ar⁵ 分別獨立表示伸苯基或伸萘基；Z表示氧原子、硫原子、羰基、磺醯基或亞烷基)。(1) -O-Ar ¹ -CO- (2) -CO-Ar ² -CO- (3) -X-Ar ³ -Y- (In formula (1) ~ formula (3), Ar ¹ represents benzene elongation Phenylene group, naphthylene group or biphenylene group; Ar ² and Ar ³ each independently represent a phenylene group, naphthylene group, biphenylene group or a group represented by the following formula (4); X and Y each independently represent an oxygen atom Or imino group; the hydrogen atoms in the aforementioned groups represented by Ar ¹ , Ar ² or Ar ³ may be independently substituted with halogen atoms, alkyl groups or aryl groups). (4) -Ar ⁴ -Z-Ar ^5- (In formula 4, Ar ⁴ and Ar ⁵ each independently represent a phenylene group or a naphthylene group; Z represents an oxygen atom, a sulfur atom, a carbonyl group, a sulfonyl group, or an alkylene group ).

本實施形態使用之液晶聚酯包含以重複單位(1)、重複單位(2)或重複單位(3)表示之重複單位，較佳 相對於重複單位(1)、重複單位(2)或重複單位(3)之合計量，重複單位(1)之含量為30莫耳%以上100莫耳%以下， 相對於重複單位(1)、重複單位(2)或重複單位(3)之合計量，重複單位(2)之含量為0莫耳%以上35莫耳%以下， 相對於重複單位(1)、重複單位(2)或重複單位(3)之合計量，重複單位(3)之含量為0莫耳%以上35莫耳%以下。The liquid crystal polyester used in this embodiment includes a repeating unit represented by a repeating unit (1), a repeating unit (2) or a repeating unit (3), preferably Relative to the total amount of repeating unit (1), repeating unit (2) or repeating unit (3), the content of repeating unit (1) is 30 mol% or more and 100 mol% or less, Relative to the total amount of repeating unit (1), repeating unit (2) or repeating unit (3), the content of repeating unit (2) is 0 mol% to 35 mol%, With respect to the total amount of the repeating unit (1), repeating unit (2) or repeating unit (3), the content of repeating unit (3) is 0 mol% or more and 35 mol% or less.

作為前述鹵原子舉例為氟原子、氯原子、溴原子及碘原子。作為前述烷基之例舉例為甲基、乙基、正丙基、異丙基、正丁基、異丁基、第二丁基、第三丁基、正己基、2-乙基己基、正辛基及正癸基，其碳數較佳為1~10。作為前述芳基之例舉例為如苯基、鄰-甲苯基、間-甲苯基、對-甲苯基、1-萘基及2-萘基，其碳數較佳為6~20。前述氫原子經該等基取代之情況，其數於Ar¹ 、Ar² 或Ar³ 表示之每個前述基中，相互獨立較佳為2個以下，更佳為1個以下。Examples of the aforementioned halogen atom include a fluorine atom, a chlorine atom, a bromine atom, and an iodine atom. Examples of the aforementioned alkyl groups are methyl, ethyl, n-propyl, isopropyl, n-butyl, isobutyl, second butyl, tertiary butyl, n-hexyl, 2-ethylhexyl, n- The carbon number of octyl and n-decyl is preferably 1-10. Examples of the aforementioned aryl group include phenyl, o-tolyl, m-tolyl, p-tolyl, 1-naphthyl and 2-naphthyl, and the carbon number is preferably 6-20. When the aforementioned hydrogen atoms are substituted with these groups, the number of the aforementioned groups represented by Ar ¹ , Ar ² or Ar ³ is preferably 2 or less independently of each other, and more preferably 1 or less.

作為前述亞烷基之例舉例為亞甲基、亞乙基、亞異丙基、亞正丁基及2-乙基亞己基等，其碳數通常為1~10。Examples of the aforementioned alkylene group include methylene group, ethylene group, isopropylidene group, n-butylene group, 2-ethylhexylene group, and the like, and the carbon number is usually 1-10.

重複單位(1)係源自特定芳香族羥基羧酸之重複單位。作為重複單位(1)，較佳係Ar¹ 為對-伸苯基者(例如源自對-羥基苯甲酸之重複單位)及Ar¹ 為2,6-伸萘基者(例如源自6-羥基-2-萘甲酸之重複單位)。 又，本說明書中所謂「源自」意指為使原料單體聚合而使有助於聚合之官能基的化學構造產生變化，其他構造未產生變化。The repeating unit (1) is a repeating unit derived from a specific aromatic hydroxycarboxylic acid. As the repeating unit (1), preferably Ar ¹ is a p-phenylene group (for example, a repeating unit derived from p-hydroxybenzoic acid) and Ar ¹ is a 2,6-naphthylene group (for example, a repeating unit derived from 6- The repeating unit of hydroxy-2-naphthoic acid). In addition, the term "derived from" in this specification means that the chemical structure of the functional group that contributes to the polymerization is changed in order to polymerize the raw material monomer, and the other structures are not changed.

重複單位(2)係源自特定芳香族二羧酸之重複單位。作為重複單位(2)較佳係Ar² 為對-伸苯基者(例如源自對苯二甲酸之重複單位)、Ar² 為間-伸苯基者(例如源自間苯二甲酸之重複單位)、Ar² 為2,6-伸萘基者(例如源自2,6-萘二羧酸之重複單位)及Ar² 為二苯醚-4,4’-二基者(例如源自二苯基醚-4,4’-二羧酸之重複單位)。The repeating unit (2) is a repeating unit derived from a specific aromatic dicarboxylic acid. As the repeating unit (2), Ar ² is preferably p-phenylene (e.g., repeating unit derived from terephthalic acid), and Ar ² is meta-phenylene (e.g., repeating unit derived from isophthalic acid). Unit), Ar ² is 2,6-naphthylene (for example, a repeating unit derived from 2,6-naphthalenedicarboxylic acid) and Ar ² is diphenyl ether-4,4'-diyl (for example, derived from The repeating unit of diphenyl ether-4,4'-dicarboxylic acid).

重複單位(3)係源自特定芳香族二醇、芳香族羥基胺或芳香族二胺之重複單位。作為重複單位(3)較好係Ar³ 為對-伸苯基者(例如源自對苯二酚、對-胺基苯酚或對-苯二胺之重複單位)及Ar³ 為4,4’-伸聯苯基者(例如源自4,4’-二羥基聯苯、4-胺基-4’-羥基聯苯或4,4’-二胺基聯苯之重複單位)。The repeating unit (3) is a repeating unit derived from a specific aromatic diol, aromatic hydroxylamine or aromatic diamine. As the repeating unit (3), Ar ³ is preferably p-phenylene (for example, a repeating unit derived from hydroquinone, p-aminophenol or p-phenylenediamine) and Ar ³ is 4,4' -Biphenylene (for example, a repeating unit derived from 4,4'-dihydroxybiphenyl, 4-amino-4'-hydroxybiphenyl or 4,4'-diaminobiphenyl).

重複單位(1)之含量，相對於全部重複單位之合計量(藉由將構成液晶聚酯樹脂之各重複單位之質量除以該各重複單位之式量，而求出各重複單位之物質量相當量(莫耳)，將該等合計之值)，較佳為30莫耳%以上，更佳為30莫耳%以上80莫耳%以下，又更佳為40莫耳%以上70莫耳%以下，最佳45莫耳%以上65莫耳%以下。The content of the repeating unit (1) is relative to the total amount of all repeating units (by dividing the mass of each repeating unit constituting the liquid crystal polyester resin by the formula weight of each repeating unit, the substance mass of each repeating unit is obtained The equivalent amount (mole), the total value of the above), is preferably 30 mol% or more, more preferably 30 mol% or more and 80 mol% or less, and still more preferably 40 mol% or more and 70 mol% % Or less, best 45 mol% or more and 65 mol% or less.

重複單位(2)之含量，相對於全部重複單位之合計量，較佳為35莫耳%以下，更佳為10莫耳%以上35莫耳%以下，又更佳為15莫耳%以上30莫耳%以下，最佳17.5莫耳%以上27.5莫耳%以下。The content of the repeating unit (2), relative to the total amount of all repeating units, is preferably 35 mol% or less, more preferably 10 mol% or more and 35 mol% or less, and still more preferably 15 mol% or more and 30 Mole% or less, best 17.5 mole% or more and 27.5 mole% or less.

重複單位(3)之含量，相對於全部重複單位之合計量，較佳為35莫耳%以下，更佳為10莫耳%以上35莫耳%以下，又更佳為15莫耳%以上30莫耳%以下，最佳17.5莫耳%以上27.5莫耳%以下。The content of the repeating unit (3), relative to the total amount of all repeating units, is preferably 35 mol% or less, more preferably 10 mol% or more and 35 mol% or less, and still more preferably 15 mol% or more and 30 Mole% or less, best 17.5 mole% or more and 27.5 mole% or less.

重複單位(1)之含量越多，越容易提高熔融流動性或耐熱性或強度/剛性，若過多，則熔融溫度或熔融黏度易變高，成形所需之溫度易變高。The more the content of the repeating unit (1), the easier it is to improve the melt fluidity or heat resistance or the strength/rigidity. If it is too much, the melting temperature or melt viscosity will easily become higher, and the temperature required for forming will become higher.

重複單位(2)之含量與重複單位(3)之含量之比例以[重複單位(2)之含量]/[重複單位(3)之含量](莫耳/莫耳)表示，通常為0.9/1~1/0.9，較佳為0.95/1~1/0.95，更佳為0.98/1~1/0.98。The ratio of the content of the repeating unit (2) to the content of the repeating unit (3) is expressed by [the content of the repeating unit (2)]/[the content of the repeating unit (3)] (mole/mole), usually 0.9/ 1~1/0.9, preferably 0.95/1~1/0.95, more preferably 0.98/1~1/0.98.

又，本實施形態使用之液晶聚酯中，重複單位(1)~(3)可分別獨立具有2種以上。且，液晶聚酯亦可含有重複單位(1)~(3)以外之重複單位，但其含量，相對於全部重複單位合計量，較佳為10莫耳%以下，更佳為5莫耳%以下。In addition, in the liquid crystal polyester used in this embodiment, the repeating units (1) to (3) may each independently have two or more types. In addition, the liquid crystal polyester may also contain repeating units other than repeating units (1) to (3), but the content is preferably 10 mol% or less, and more preferably 5 mol% relative to the total amount of all repeating units. the following.

本實施形態使用之液晶聚酯具有X及Y分別為氧原子者作為重複單位(3)，亦即具有源自特定芳香族二醇之重複單位，其由於熔融黏度易變低故而較佳，更佳僅具有X及Y分別為氧原子者作為重複單位(3)。The liquid crystal polyester used in this embodiment has X and Y each being an oxygen atom as the repeating unit (3), that is, it has a repeating unit derived from a specific aromatic diol, which is preferred because its melt viscosity tends to become low. Preferably, only those with X and Y each being an oxygen atom are used as the repeating unit (3).

本實施形態使用之液晶聚酯較佳藉由使與構成其之重複單位對應之原料單體熔融聚合，並使所得聚合物(以下有時稱為「預聚物」)進行固相聚合而製造。藉此，可操作性良好地製造耐熱性、強度/剛性高的高分子量液晶聚酯。熔融聚合可在觸媒存在下進行，作為該觸媒之例舉例為乙酸鎂、乙酸亞錫、四丁基鈦酸酯、乙酸鉛、乙酸鈉、乙酸鉀、三氧化銻等之金屬化合物，或4-(二甲胺基)吡啶、1-甲基咪唑等之含氮雜環式化合物，較佳使用含氮雜環式化合物。The liquid crystal polyester used in this embodiment is preferably produced by melt-polymerizing raw material monomers corresponding to the repeating unit constituting it, and solid-phase polymerization of the resulting polymer (hereinafter sometimes referred to as "prepolymer") . Thereby, high-molecular-weight liquid crystal polyester with high heat resistance and high strength/rigidity can be produced with good operability. Melt polymerization can be carried out in the presence of a catalyst. Examples of the catalyst include metal compounds such as magnesium acetate, stannous acetate, tetrabutyl titanate, lead acetate, sodium acetate, potassium acetate, and antimony trioxide, or Nitrogen-containing heterocyclic compounds such as 4-(dimethylamino)pyridine and 1-methylimidazole are preferably nitrogen-containing heterocyclic compounds.

本實施形態使用之液晶聚酯之流動起始溫度較佳為280℃以上，更佳為280℃以上400℃以下，又更佳為280℃以上380℃以下。本實施形態使用之液晶聚酯之流動起始溫度越高，有液晶聚酯之耐熱性及強度以及剛性提高之傾向。另一方面，液晶聚酯之流動起始溫度超過400℃時，有液晶聚酯之熔融溫度或熔融黏度變高之傾向。因此有液晶聚酯之成形所需之溫度變高之傾向。The flow initiation temperature of the liquid crystal polyester used in this embodiment is preferably 280°C or higher, more preferably 280°C or higher and 400°C or lower, and still more preferably 280°C or higher and 380°C or lower. The higher the flow initiation temperature of the liquid crystal polyester used in this embodiment, the higher the heat resistance, strength, and rigidity of the liquid crystal polyester. On the other hand, when the flow start temperature of the liquid crystal polyester exceeds 400°C, the melting temperature or melt viscosity of the liquid crystal polyester tends to increase. Therefore, the temperature required for the formation of liquid crystal polyester tends to become higher.

本說明書中，液晶聚酯之流動起始溫度亦稱為流體溫度或流動溫度，係成為液晶聚酯之分子量標準之溫度(參考小出直之編，「液晶聚酯-合成．成形．應用」，CMC股份有限公司，1987年6月5日，第95頁)。流動起始溫度係使用毛細管黏度計，於9.8MPa(100kg/cm² )之荷重下，邊以4℃/分鐘之速度升溫，邊使液晶聚酯熔融，自內徑1mm及長度10mm之噴嘴擠出時，顯示4800Pa．s(48000泊)之黏度的溫度。In this specification, the flow starting temperature of liquid crystal polyester is also called fluid temperature or flow temperature, which is the temperature that becomes the molecular weight standard of liquid crystal polyester (refer to Nao no Koide, "Liquid Crystal Polyester-Synthesis, Forming, Application", CMC Corporation, June 5, 1987, p. 95). The flow starting temperature is using a capillary viscometer. Under a load of 9.8MPa (100kg/cm ² ), the liquid crystal polyester is heated at a rate of 4°C/min, and the liquid crystal polyester is squeezed from a nozzle with an inner diameter of 1mm and a length of 10mm. When it is out, it displays 4800Pa. s (48000 poise) viscosity temperature.

前述液晶聚酯相對於前述熱塑性樹脂100質量%之含有比例，較佳為80質量%以上100質量%以下。作為前述熱塑性樹脂中所含之液晶聚酯以外之樹脂之例舉例為聚丙烯、聚醯胺、液晶聚酯以外之聚酯、聚碸、聚苯硫醚、聚醚酮、聚碳酸酯、聚苯醚、聚醚醯亞胺等之液晶聚酯以外之熱塑性樹脂。The content ratio of the liquid crystal polyester to 100% by mass of the thermoplastic resin is preferably 80% by mass or more and 100% by mass or less. Examples of resins other than liquid crystal polyester contained in the aforementioned thermoplastic resin are polypropylene, polyamide, polyester other than liquid crystal polyester, polysulfide, polyphenylene sulfide, polyetherketone, polycarbonate, poly Thermoplastic resins other than liquid crystal polyesters such as phenyl ether and polyether imide.

・熱硬化性樹脂 作為熱硬化性樹脂，可舉例為酚樹脂、脲樹脂、三聚氰胺樹脂、不飽和聚酯樹脂、環氧樹脂、矽樹脂等。 作為本實施形態之樹脂組成物之基質樹脂，可單獨使用熱硬化性樹脂，亦可作為與熱塑性樹脂之混合物使用。・Thermosetting resin Examples of thermosetting resins include phenol resins, urea resins, melamine resins, unsaturated polyester resins, epoxy resins, and silicone resins. As the matrix resin of the resin composition of this embodiment, a thermosetting resin may be used alone or as a mixture with a thermoplastic resin.

(玻璃成分) 本實施形態之樹脂組成物中，玻璃成分係分散於熱塑性樹脂及/或熱硬化性樹脂之基質樹脂中，可調整前述樹脂組成物之介電特性、熱擴散率、機械強度。(Glass composition) In the resin composition of this embodiment, the glass component is dispersed in the matrix resin of the thermoplastic resin and/or thermosetting resin, and the dielectric properties, thermal diffusivity, and mechanical strength of the resin composition can be adjusted.

作為本實施形態之樹脂組成物所用之玻璃成分可使用纖維狀玻璃填料、片狀玻璃填料、玻璃珠、玻璃中空球等之作為包含玻璃成分之填料而習知者，較佳為纖維狀玻璃填料或片狀玻璃填料。As the glass component used in the resin composition of this embodiment, fibrous glass fillers, flake glass fillers, glass beads, glass hollow spheres, etc., which are known as fillers containing glass components, are preferably used. Or flake glass filler.

纖維狀玻璃填料之重量平均纖維長較佳為30μm以上，更佳為50μm以上，特佳為80μm以上。藉由纖維狀玻璃填料之重量平均纖維長為前述下限值以上，可成為機械強度適當者。纖維狀玻璃填料之數平均纖維長較佳為30μm以上，更佳為50μm以上，特佳為60μm以上。藉由纖維狀玻璃填料之數平均纖維長為前述下限值以上，可成為機械強度適當者。The weight average fiber length of the fibrous glass filler is preferably 30 μm or more, more preferably 50 μm or more, and particularly preferably 80 μm or more. When the weight-average fiber length of the fibrous glass filler is more than the aforementioned lower limit, the mechanical strength can be appropriate. The number average fiber length of the fibrous glass filler is preferably 30 μm or more, more preferably 50 μm or more, particularly preferably 60 μm or more. When the number-average fiber length of the fibrous glass filler is greater than or equal to the aforementioned lower limit, the mechanical strength can be appropriate.

纖維狀玻璃填料之重量平均纖維長較佳為300μm以下，更佳為150μm以下，特佳為100μm以下。藉由纖維狀玻璃填料之重量平均纖維長為前述上限值以下，變得易於成形。 纖維狀玻璃填料之數平均纖維長較佳為300μm以下，更佳為150μm以下，特佳為90μm以下。藉由纖維狀玻璃填料之數平均纖維長為前述上限值以下，變得易於成形。The weight average fiber length of the fibrous glass filler is preferably 300 μm or less, more preferably 150 μm or less, and particularly preferably 100 μm or less. When the weight average fiber length of the fibrous glass filler is less than the aforementioned upper limit, it becomes easy to shape. The number average fiber length of the fibrous glass filler is preferably 300 μm or less, more preferably 150 μm or less, particularly preferably 90 μm or less. When the number average fiber length of the fibrous glass filler is less than or equal to the aforementioned upper limit, it becomes easy to shape.

纖維狀玻璃填料之重量平均纖維長較佳為30μm以上300μm以下，更佳為50μm以上150μm以下，特佳為80μm以上100μm以下。 纖維狀玻璃填料之數平均纖維長較佳為30μm以上300μm以下，更佳為50μm以上150μm以下，特佳為60μm以上90μm以下。The weight average fiber length of the fibrous glass filler is preferably 30 μm or more and 300 μm or less, more preferably 50 μm or more and 150 μm or less, and particularly preferably 80 μm or more and 100 μm or less. The number average fiber length of the fibrous glass filler is preferably 30 μm or more and 300 μm or less, more preferably 50 μm or more and 150 μm or less, and particularly preferably 60 μm or more and 90 μm or less.

纖維狀玻璃填料之數平均纖維徑並未特別限定，但較佳為1~40μm，更佳為3~30μm，又更佳為5~20μm，特佳為8~15μm。The number-average fiber diameter of the fibrous glass filler is not particularly limited, but is preferably 1 to 40 μm, more preferably 3 to 30 μm, still more preferably 5 to 20 μm, particularly preferably 8 to 15 μm.

纖維狀玻璃填料之數平均纖維徑係採用以掃描型電子顯微鏡(1000倍)觀察纖維狀玻璃填料，針對50根纖維狀玻璃填料測量纖維徑所得之值的數平均值。The number average fiber diameter of the fibrous glass filler is the number average of the value obtained by observing the fibrous glass filler with a scanning electron microscope (1000 times) and measuring the fiber diameter of 50 fibrous glass fillers.

纖維狀玻璃填料之數平均纖維徑若為前述較佳範圍之下限值以上，則纖維狀玻璃填料於樹脂組成物中容易分散。且樹脂組成物製造時纖維狀玻璃填料容易處理。另一方面，若為前述較佳範圍之上限值以下，則纖維狀玻璃填料所致之樹脂組成物之機械強化可效率良好地進行。If the number average fiber diameter of the fibrous glass filler is more than the lower limit of the aforementioned preferable range, the fibrous glass filler is easily dispersed in the resin composition. In addition, the fibrous glass filler is easy to handle during the production of the resin composition. On the other hand, if it is less than the upper limit of the aforementioned preferable range, the mechanical strengthening of the resin composition by the fibrous glass filler can be efficiently performed.

作為纖維狀玻璃填料，較佳為切碎玻璃纖維或磨碎玻璃纖維。切碎玻璃纖維係將玻璃條切斷者，例如切斷長3~6mm，纖維徑9~13μm者，係由CENTRAL玻璃股份有限公司所銷售。磨碎玻璃纖維係將玻璃纖維粉碎者，具有切碎玻璃纖維與粉狀玻璃之中間性質。例如平均纖維長30~150μm，纖維徑6~13μm者，係由CENTRAL玻璃股份有限公司所銷售。As the fibrous glass filler, chopped glass fibers or ground glass fibers are preferred. Shredded glass fibers are those that cut glass strips, such as those with a length of 3~6mm and a fiber diameter of 9~13μm, which are sold by CENTRAL Glass Co., Ltd. Ground glass fiber is a kind of pulverized glass fiber, which has the intermediate properties of chopped glass fiber and powdered glass. For example, those with an average fiber length of 30~150μm and a fiber diameter of 6~13μm are sold by CENTRAL Glass Co., Ltd.

作為片狀玻璃填料之平均粒徑較佳為30μm以上，更佳為50μm以上，特佳為80μm以上。藉由使片狀玻璃填料之平均粒徑為前述下限值以上，可成為機械強度適當者。The average particle size of the glass flake filler is preferably 30 μm or more, more preferably 50 μm or more, and particularly preferably 80 μm or more. By setting the average particle size of the glass flake filler to be at least the aforementioned lower limit value, it can be the one having appropriate mechanical strength.

作為片狀玻璃填料之平均粒徑較佳為300μm以下，更佳為200μm以下，特佳為150μm以下。藉由使片狀玻璃填料之平均粒徑為前述上限值以下，變得易成形。 片狀玻璃填料之平均粒徑較佳為30μm以上300μm以下，更佳為50μm以上200μm以下，特佳為80μm以上150μm以下。The average particle size of the glass flake filler is preferably 300 μm or less, more preferably 200 μm or less, and particularly preferably 150 μm or less. By making the average particle size of the flake glass filler to be less than or equal to the aforementioned upper limit, it becomes easy to form. The average particle size of the glass flake filler is preferably 30 μm or more and 300 μm or less, more preferably 50 μm or more and 200 μm or less, and particularly preferably 80 μm or more and 150 μm or less.

作為片狀玻璃填料之平均厚度較佳為0.2μm以上，更佳為0.5μm以上，特佳為1.0μm以上。藉由片狀玻璃填料之平均厚度為前述下限值以上，則可成為機械強度適當者。The average thickness of the glass flake filler is preferably 0.2 μm or more, more preferably 0.5 μm or more, and particularly preferably 1.0 μm or more. When the average thickness of the sheet-shaped glass filler is more than the aforementioned lower limit, the mechanical strength can be appropriate.

片狀玻璃填料之平均厚度較佳為30μm以下，更佳為20μm以下，特佳為10μm以下。藉由片狀玻璃填料之平均厚度為前述上限值以下，則變得易成形。 作為片狀玻璃填料之平均厚度較佳為0.2μm以上30μm以下，更佳為0.5μm以上20μm以下，特佳為1.0μm以上10μm以下。The average thickness of the flake glass filler is preferably 30 μm or less, more preferably 20 μm or less, and particularly preferably 10 μm or less. When the average thickness of the sheet glass filler is below the aforementioned upper limit value, it becomes easy to form. The average thickness of the glass flake filler is preferably 0.2 μm or more and 30 μm or less, more preferably 0.5 μm or more and 20 μm or less, and particularly preferably 1.0 μm or more and 10 μm or less.

作為片狀玻璃填料，例如作為玻璃片，平均厚度為2~5μm，粒徑為10~4000μm者，作為細片，平均厚度為0.4~2.0μm，粒徑為10~4000μm者，由日本板玻璃股份有限公司銷售。玻璃片中使用之玻璃有C玻璃、E玻璃等之玻璃組成。 C玻璃包含鹼成分，具有高耐酸性。E玻璃由於幾乎不含鹼，顧於樹脂內之安定性高。As a flake glass filler, for example, as a glass flake with an average thickness of 2~5μm and a particle size of 10~4000μm, as a fine flake, an average thickness of 0.4~2.0μm and a particle size of 10~4000μm, made of Japanese plate glass Sales by a company limited by shares. The glass used in the glass sheet consists of glass such as C glass and E glass. C glass contains alkali components and has high acid resistance. Since E glass contains almost no alkali, it has high stability in the resin.

作為玻璃成分，舉例為E玻璃(亦即無鹼玻璃)、S玻璃或T玻璃(亦即高強度、高彈性玻璃)、C-玻璃(亦即有利於耐酸用途之玻璃)、D-玻璃(亦即低介電率玻璃)、ECR玻璃(亦即不含B₂ O₃ 、F₂ 之E玻璃替代玻璃)、AR-玻璃(亦即有利於耐鹼用途之玻璃)等之FRP強化材用之玻璃纖維。As glass components, for example, E glass (that is, alkali-free glass), S glass or T glass (that is, high-strength, high-elasticity glass), C-glass (that is, glass that is good for acid resistance), D-glass ( It is used for FRP reinforced materials such as low dielectric glass), ECR glass (that is, E glass instead of glass without B ₂ O ₃ and F ₂ ), AR-glass (that is, glass that is beneficial to alkali resistance), etc. The glass fiber.

作為玻璃成分之相對介電常數ε_r ，較佳使用低介電率者，於1GHz之頻率及25℃之溫度下之玻璃成分的相對介電常數ε_r 較佳為4.80以下，更佳4.30以下，特佳4.00以下。可使用玻璃成分之相對介電常數ε_r 為3.00以上者，可使用3.10以上者，可使用3.15以上者。As the relative dielectric constant ε _r of the glass component, using a low dielectric constant preferably by at 1GHz and the frequency relative permittivity ε _r of the glass component at the temperature 25 ℃ is preferably 4.80 or less, more preferably 4.30 or less , Very good below 4.00. It is possible to use glass components whose relative permittivity ε _r is 3.00 or higher, 3.10 or higher, and 3.15 or higher.

本實施形態之樹脂組成物中，玻璃成分之含量，相對於前述樹脂組成物100質量%，較佳為1~60質量%，更佳為10~50質量%，特佳為20~40質量%。 玻璃成分之含量若為前述較佳範圍之下限值以上，則前述熱塑性樹脂及/或前述熱硬化性樹脂與玻璃成分之密著性容易提高。另一方面，若為前述較佳範圍之上限值以下，玻璃成分之分散變容易。In the resin composition of this embodiment, the content of the glass component is preferably 1-60% by mass, more preferably 10-50% by mass, and particularly preferably 20-40% by mass relative to 100% by mass of the aforementioned resin composition . If the content of the glass component is more than the lower limit of the aforementioned preferable range, the adhesion between the thermoplastic resin and/or the thermosetting resin and the glass component is likely to be improved. On the other hand, if it is less than the upper limit of the aforementioned preferred range, the dispersion of the glass component becomes easier.

＜其他成分＞ 本實施形態之樹脂組成物作為原料，除了前述熱塑性樹脂及/或前述熱硬化性樹脂以及前述玻璃成分以外，可根據需要含有1種以上之填充材、添加劑等之其他成分。樹脂組成物含有熱硬化性樹脂時，樹脂組成物亦可包含溶劑。＜Other ingredients＞ As a raw material, the resin composition of the present embodiment may contain one or more other components such as fillers and additives in addition to the thermoplastic resin and/or the thermosetting resin and the glass component as required. When the resin composition contains a thermosetting resin, the resin composition may contain a solvent.

作為填充材除了板狀填充材、球狀填充材以外，可為粒狀填充材。且，填充材可為無機填充材，亦可為有機填充材。As the filler, in addition to a plate-shaped filler and a spherical filler, a granular filler may be used. In addition, the filler may be an inorganic filler or an organic filler.

作為板狀無機填充材之例舉例為滑石、雲母、石墨、矽灰石、硫酸鋇、碳酸鈣。雲母可為白雲母，可為金雲母，可為氟金雲母，亦可為四矽雲母。Examples of plate-shaped inorganic fillers include talc, mica, graphite, wollastonite, barium sulfate, and calcium carbonate. The mica can be muscovite, phlogopite, fluorophlogopite, or tetrasilica mica.

作為粒狀無機填充材之例舉例為氧化矽、氧化鋁、氧化鈦、氮化硼、碳化矽、碳酸鈣。Examples of granular inorganic fillers include silicon oxide, aluminum oxide, titanium oxide, boron nitride, silicon carbide, and calcium carbonate.

作為添加劑之例可舉例為抗氧化劑、熱安定劑、紫外線吸收劑、抗靜電劑、界面活性劑、難燃劑及著色劑。Examples of additives include antioxidants, heat stabilizers, ultraviolet absorbers, antistatic agents, surfactants, flame retardants, and coloring agents.

(樹脂組成物之製造方法) 本實施形態之包含熱塑性樹脂之樹脂組成物可例如將熱塑性樹脂與玻璃成分以及根據需要之其他成分混合，以雙軸擠出機邊脫氣邊熔融混練，所得熱塑性樹脂之熔融物及玻璃成分之混合物經由圓形噴嘴(噴出口)擠出為線股狀，其次，以線股切割機切粒，可作成樹脂組成物顆粒。(Manufacturing method of resin composition) For the resin composition containing the thermoplastic resin of this embodiment, the thermoplastic resin can be mixed with the glass component and other components as required, and then melted and kneaded in a twin-screw extruder while degassing. The resulting melt of the thermoplastic resin and the glass component The mixture is extruded into strands through a circular nozzle (jet port), and then cut into pellets with a strand cutter to form resin composition pellets.

且，例如藉由將熱硬化樹脂與玻璃成分以及根據需要之其他成分混合，可獲得本實施形態之包含熱硬化性樹脂之樹脂組成物。And, for example, by mixing a thermosetting resin with a glass component and other components as needed, the resin composition containing the thermosetting resin of this embodiment can be obtained.

(成形體) 本實施形態之樹脂組成物可藉由習知成形方法獲得成形體。作為由包含熱塑性樹脂之樹脂組成物成形成形體之方法，較佳為熔融成形法，作為其例，舉例為射出成形法，T模嘴法或吹脹法等之擠出成形法，壓縮成形法，吹塑成形法，真空成形法及加壓成形法等。其中較佳為射出成形法。作為由包含熱硬化性樹脂之樹脂組成物成形成形體之方法，舉例為射出成形法及加壓成形。其中較佳為射出成形法。(Formed body) The resin composition of this embodiment can be formed into a molded body by a conventional molding method. As a method of forming a molded body from a resin composition containing a thermoplastic resin, a melt molding method is preferred. Examples thereof include an injection molding method, an extrusion molding method such as a T-die method or an inflation method, and a compression molding method , Blow molding method, vacuum molding method and pressure molding method. Among them, the injection molding method is preferred. As a method of molding a molded body from a resin composition containing a thermosetting resin, injection molding and pressure molding are exemplified. Among them, the injection molding method is preferred.

例如將包含熱塑性樹脂之樹脂組成物作為成形材料，藉由射出成形法成形時，係使用習知射出成形機，使樹脂組成物熔融，將熔融之包含熱塑性樹脂之樹脂組成物射出至模具內而成形。 作為習知之射出成形機舉例為例如SODICK股份有限公司製之TR450EH3、日精樹脂工業公司製之油壓式橫型成形機PS40E5ASE型等。For example, when a resin composition containing a thermoplastic resin is used as a molding material, when it is molded by an injection molding method, a conventional injection molding machine is used to melt the resin composition and inject the molten resin composition containing the thermoplastic resin into the mold. Shaped. Examples of conventional injection molding machines include, for example, TR450EH3 manufactured by SODICK Co., Ltd., and a hydraulic horizontal molding machine PS40E5ASE manufactured by Nissei Plastic Industries, Ltd., etc.

射出成形機之汽缸溫度係對應於熱塑性樹脂種類而適當決定，較佳設定為比所用熱塑性樹脂之流動起始溫度高10~80℃之溫度，例如為300~400℃。The cylinder temperature of the injection molding machine is appropriately determined according to the type of thermoplastic resin, and is preferably set to a temperature that is 10~80°C higher than the flow starting temperature of the thermoplastic resin used, for example, 300~400°C.

模具之溫度，基於包含熱塑性樹脂之樹脂組成物的冷卻速度與生產性之方面，較佳設定為室溫(例如23℃)至180℃之範圍。The temperature of the mold is preferably set in the range of room temperature (for example, 23°C) to 180°C based on the cooling rate and productivity of the resin composition containing the thermoplastic resin.

例如將包含熱硬化性樹脂之樹脂組成物作為成形材料，藉由射出成形法成形時，係使用習知射出成形機，將成形材料投入模具內之後，將模具溫度加溫至150℃左右。成形材料硬化後，可自模具取出成形體。For example, when a resin composition containing a thermosetting resin is used as a molding material and molded by an injection molding method, a conventional injection molding machine is used to put the molding material into the mold, and then the mold temperature is heated to about 150°C. After the molding material is hardened, the molded body can be taken out from the mold.

又，本實施形態之成形體可適用於共振器、濾波器、天線、電路基板及層合電路元件基板等之介電體裝置等之用途。 [實施例]In addition, the molded body of the present embodiment can be applied to applications such as dielectric devices such as resonators, filters, antennas, circuit boards, and laminated circuit element boards. [Example]

以下藉由具體實施例，針對本發明更詳細說明。但本發明不受以下所示實施例之任何限定。Hereinafter, the present invention will be described in more detail with specific embodiments. However, the present invention is not limited at all by the examples shown below.

＜玻璃填料＞ 準備如下表1所示之玻璃填料(A)~(F)。＜Glass filler＞ Prepare the glass fillers (A)~(F) shown in Table 1 below.

＜原料之纖維狀玻璃填料之數平均纖維長＞ 原料之玻璃填料(A)及(B)為表1中記載之組成的纖維狀玻璃填料(磨碎玻璃纖維)。 採取原料之纖維狀玻璃填料中之1.0g，以甲醇分散並以展開於載玻片上之狀態拍攝顯微鏡照片，自該照片直接讀取纖維狀玻璃填料之形狀，算出其平均值，求出纖維狀玻璃填料之數平均纖維長。又算出平均值時總體參數設為400以上。結果示於表1。＜Number average fiber length of raw material fibrous glass filler＞ The glass fillers (A) and (B) of the raw materials are fibrous glass fillers (ground glass fibers) of the composition described in Table 1. Take 1.0g of the fibrous glass filler of the raw material, disperse it with methanol and take a micrograph in the state of spreading on the glass slide, read the shape of the fibrous glass filler directly from the photograph, calculate the average value, and obtain the fibrous shape The number of glass fillers average fiber length. When calculating the average value, the overall parameter is set to 400 or more. The results are shown in Table 1.

＜原料之片狀玻璃填料之平均厚度與平均粒徑＞ 原料之玻璃填料(C)~(F)為表1中記載之組成的片狀玻璃填料。 以SEM以倍率1000倍觀察原料之片狀玻璃填料，分別測定自SEM圖像隨機選擇之100個片狀玻璃填料之厚度與數平均粒徑，算出100個測定值之平均值，求出原料之片狀玻璃填料之平均厚度與平均粒徑。結果示於表1。＜Average thickness and average particle size of raw material flake glass filler＞ The glass fillers (C) to (F) of the raw materials are sheet glass fillers with the composition described in Table 1. Observe the raw material flake glass filler by SEM at a magnification of 1000 times, measure the thickness and number average particle size of 100 flake glass filler randomly selected from the SEM image, calculate the average of the 100 measured values, and obtain the raw material The average thickness and average particle size of the flake glass filler. The results are shown in Table 1.

混合20質量份之玻璃填料(D)及10質量份之玻璃填料(F)，準備如下表2所示之玻璃填料(G)。 混合15質量份之玻璃填料(D)及15質量份之玻璃填料(F)，準備如下表2所示之玻璃填料(H)。 混合7.5質量份之玻璃填料(D)及22.5質量份之玻璃填料(F)，準備如下表2所示之玻璃填料(I)。20 parts by mass of the glass filler (D) and 10 parts by mass of the glass filler (F) were mixed to prepare the glass filler (G) shown in Table 2 below. 15 parts by mass of glass filler (D) and 15 parts by mass of glass filler (F) were mixed to prepare glass filler (H) shown in Table 2 below. Mix 7.5 parts by mass of glass filler (D) and 22.5 parts by mass of glass filler (F) to prepare glass filler (I) as shown in Table 2 below.

＜聚合物之製造＞ (1)熔融聚合 於具備攪拌裝置、扭矩傳感器、氮氣導入管、溫度計及回流冷卻器之反應器中，饋入對-羥基苯甲酸(994.5g，7.20莫耳)與對苯二甲酸(272.1g，1.64莫耳)、間苯二甲酸(126.6g，0.76莫耳)、4,4’-二羥基聯苯(446.9g，2.40莫耳)及乙酸酐1347.6g(13.20莫耳)。反應器內氣體以氮氣充分置換後，添加1-甲基咪唑0.18g，於氮氣氣流下邊攪拌邊以30分鐘自室溫升溫至150℃，於150℃回流30分鐘。 其次，添加1-甲基咪唑2.40g後，邊餾除副生乙酸與未反應之乙酸酐，邊以2小時50分鐘自150℃升溫至320℃，於確認扭矩上升之時點結束反應，自反應器取出內容物之預聚物，將其冷卻至室溫。＜Manufacture of polymer＞ (1) Melt polymerization In a reactor equipped with a stirring device, a torque sensor, a nitrogen inlet pipe, a thermometer and a reflux cooler, feed p-hydroxybenzoic acid (994.5g, 7.20 mol) and terephthalic acid (272.1g, 1.64 mol) , Isophthalic acid (126.6g, 0.76mole), 4,4'-dihydroxybiphenyl (446.9g, 2.40mole) and acetic anhydride 1347.6g (13.20mole). After the gas in the reactor was sufficiently replaced with nitrogen, 0.18 g of 1-methylimidazole was added, and the mixture was heated from room temperature to 150°C for 30 minutes while stirring under nitrogen flow, and refluxed at 150°C for 30 minutes. Next, after adding 2.40g of 1-methylimidazole, while distilling off the byproduct acetic acid and unreacted acetic anhydride, the temperature was increased from 150°C to 320°C in 2 hours and 50 minutes, and the reaction was terminated when the torque was confirmed to increase. Take out the prepolymer of the contents and cool it to room temperature.

(2)固相聚合 其次，使用粉碎機粉碎該預聚物，所得粉碎物於氮氣環境下，以1小時自室溫升溫至250℃，以5小時自250℃升溫至280℃，於280℃保持3小時，藉此進行固相聚合。所得固相聚合物冷卻至室溫，獲得液晶聚酯(1)。(2) Solid phase polymerization Next, use a pulverizer to pulverize the prepolymer, and the resulting pulverized product is heated from room temperature to 250°C in 1 hour, from 250°C to 280°C in 5 hours, and kept at 280°C for 3 hours under a nitrogen atmosphere. Solid phase polymerization. The obtained solid phase polymer was cooled to room temperature to obtain a liquid crystal polyester (1).

液晶聚酯(1)中，相對於全部重複單位之合計的比例，分子中Ar¹ 為1,4-伸苯基之重複單位(u12)含有60莫耳%，Ar² 為1,4-伸苯基之重複單位(u22)含有13.65莫耳%，Ar² 為1,3-伸苯基之重複單位(u23)含有6.35莫耳%，及Ar³ 為4,4’-伸聯苯基之重複單位(u32)含有20莫耳%，其流動起始溫度為312℃。In the liquid crystal polyester (1), in the ratio of the total of all repeating units, the repeating unit (u12) in which Ar ¹ is 1,4-phenylene in the molecule contains 60 mol%, and Ar ² is 1,4-phenylene. The repeating unit of phenyl (u22) contains 13.65 mol%, Ar ² is the repeating unit of 1,3-phenylene (u23) containing 6.35 mol%, and Ar ³ is 4,4'-biphenylene The repeating unit (u32) contains 20 mol% and its flow starting temperature is 312°C.

[比較例1] ＜顆粒之製造＞ 液晶聚酯(1)於120℃乾燥5小時後，將70質量份液晶聚酯(1)及30質量份玻璃填料(A)供於附真空排氣口之雙軸擠出機(池貝鐵工(股)公司製「PCM-30」)，使用水封式真空泵(神港精機(股)公司製「SW-25S」)邊於真空排氣口脫氣，邊以汽缸溫度340℃及螺桿旋轉數150rpm之條件熔融混練，經由直徑3mm之圓形噴嘴(噴出口)噴出為線股狀。其次，該噴出之混練物沉入水溫30℃之水浴中15秒後，以線股切割機(田邊塑膠機械(股)公司製)切成顆粒，獲得比較例1之樹脂組成物顆粒(1)(顆粒狀之液晶聚酯樹脂組成物(1))。[Comparative Example 1] ＜Manufacture of pellets＞ After the liquid crystal polyester (1) was dried at 120°C for 5 hours, 70 parts by mass of the liquid crystal polyester (1) and 30 parts by mass of glass filler (A) were supplied to a twin-screw extruder with a vacuum exhaust port (Ikegai Iron Works) (Stock) Company’s "PCM-30"), using a water-sealed vacuum pump (Shinko Seiki Co., Ltd.’s "SW-25S") while degassing at the vacuum exhaust port, the cylinder temperature is 340℃ and the screw rotates It was melted and kneaded at a few 150 rpm, and sprayed into a strand through a circular nozzle (jet port) with a diameter of 3 mm. Next, the sprayed mixture was sunk in a water bath with a water temperature of 30°C for 15 seconds, and then cut into pellets with a strand cutter (manufactured by Tanabe Plastic Machinery Co., Ltd.) to obtain the resin composition pellets of Comparative Example 1 (1 ) (Particulate liquid crystal polyester resin composition (1)).

[實施例1] ＜顆粒之製造＞ 比較例1中，除了30質量份玻璃填料(A)變更為30質量份玻璃填料(B)以外，與比較例1同樣，獲得實施例1之樹脂組成物顆粒(2)(顆粒狀之液晶聚酯樹脂組成物(2))。[Example 1] ＜Manufacture of pellets＞ In Comparative Example 1, except that 30 parts by mass of the glass filler (A) was changed to 30 parts by mass of the glass filler (B), as in Comparative Example 1, the resin composition particles (2) of Example 1 (particulate liquid crystal polymer Ester resin composition (2)).

[比較例2] ＜顆粒之製造＞ 比較例1中，除了30質量份玻璃填料(A)變更為30質量份玻璃填料(C)以外，與比較例1同樣，獲得比較例2之樹脂組成物顆粒(3)(顆粒狀之液晶聚酯樹脂組成物(3))。[Comparative Example 2] ＜Manufacture of pellets＞ In Comparative Example 1, except that 30 parts by mass of the glass filler (A) was changed to 30 parts by mass of the glass filler (C), as in Comparative Example 1, the resin composition particles (3) of Comparative Example 2 (particulate liquid crystal polymer Ester resin composition (3)).

[比較例3] ＜顆粒之製造＞ 比較例1中，除了30質量份玻璃填料(A)變更為30質量份玻璃填料(D)以外，與比較例1同樣，獲得比較例3之樹脂組成物顆粒(4)(顆粒狀之液晶聚酯樹脂組成物(4))。[Comparative Example 3] ＜Manufacture of pellets＞ In Comparative Example 1, except that 30 parts by mass of the glass filler (A) was changed to 30 parts by mass of the glass filler (D), as in Comparative Example 1, the resin composition particles (4) of Comparative Example 3 (particulate liquid crystal polymer Ester resin composition (4)).

[實施例2] ＜顆粒之製造＞ 比較例1中，除了30質量份玻璃填料(A)變更為30質量份玻璃填料(E)以外，與比較例1同樣，獲得實施例2之樹脂組成物顆粒(5)(顆粒狀之液晶聚酯樹脂組成物(5))。[Example 2] ＜Manufacture of pellets＞ In Comparative Example 1, except that 30 parts by mass of the glass filler (A) was changed to 30 parts by mass of the glass filler (E), in the same manner as in Comparative Example 1, the resin composition particles (5) (particulate liquid crystal polymer) of Example 2 were obtained. Ester resin composition (5)).

[實施例3] ＜顆粒之製造＞ 比較例1中，除了30質量份玻璃填料(A)變更為30質量份玻璃填料(F)以外，與比較例1同樣，獲得實施例3之樹脂組成物顆粒(6)(顆粒狀之液晶聚酯樹脂組成物(6))。[Example 3] ＜Manufacture of pellets＞ In Comparative Example 1, except that 30 parts by mass of the glass filler (A) was changed to 30 parts by mass of the glass filler (F), in the same manner as in Comparative Example 1, the resin composition particles (6) (particulate liquid crystal polymer) of Example 3 were obtained. Ester resin composition (6)).

[實施例4] ＜顆粒之製造＞ 比較例1中，除了30質量份玻璃填料(A)變更為30質量份玻璃填料(G)以外，與比較例1同樣，獲得實施例4之樹脂組成物顆粒(7)(顆粒狀之液晶聚酯樹脂組成物(7))。[Example 4] ＜Manufacture of pellets＞ In Comparative Example 1, except that 30 parts by mass of the glass filler (A) was changed to 30 parts by mass of the glass filler (G), in the same manner as in Comparative Example 1, the resin composition particles (7) (particulate liquid crystal polymer) of Example 4 were obtained. Ester resin composition (7)).

[實施例5] ＜顆粒之製造＞ 比較例1中，除了30質量份玻璃填料(A)變更為30質量份玻璃填料(H)以外，與比較例1同樣，獲得實施例5之樹脂組成物顆粒(8)(顆粒狀之液晶聚酯樹脂組成物(8))。[Example 5] ＜Manufacture of pellets＞ In Comparative Example 1, except that 30 parts by mass of the glass filler (A) was changed to 30 parts by mass of the glass filler (H), as in Comparative Example 1, the resin composition particles (8) of Example 5 (particulate liquid crystal polymer Ester resin composition (8)).

[實施例6] ＜顆粒之製造＞ 比較例1中，除了30質量份玻璃填料(A)變更為30質量份玻璃填料(I)以外，與比較例1同樣，獲得實施例6之樹脂組成物顆粒(9)(顆粒狀之液晶聚酯樹脂組成物(9))。[Example 6] ＜Manufacture of pellets＞ In Comparative Example 1, except that 30 parts by mass of the glass filler (A) was changed to 30 parts by mass of the glass filler (I), in the same manner as in Comparative Example 1, the resin composition particles (9) of Example 6 (particulate liquid crystal polymer Ester resin composition (9)).

＜ICP分析/試驗項目＞ 將Al、Ba、Ca、Si、Ti、Cd、Co、Cr、Cu、Fe、K、Li、Mg、Mn、Mo、Na、Ni、P、Pb、Sb、V、Zn之合計22種元素作為試驗項目。＜ICP analysis/test item＞ A total of 22 elements of Al, Ba, Ca, Si, Ti, Cd, Co, Cr, Cu, Fe, K, Li, Mg, Mn, Mo, Na, Ni, P, Pb, Sb, V, and Zn are used as Pilot projects.

＜ICP分析/試驗方法＞ (試料加熱處理) 將各實施例及比較例所得之樹脂組成物顆粒之對象試料於600℃加熱處理6小時，作為分析供試料。＜ICP Analysis/Test Method＞ (Sample heating treatment) The target samples of the resin composition pellets obtained in the respective Examples and Comparative Examples were heat-treated at 600°C for 6 hours, and used as samples for analysis.

(Al、Ba、Ca、Si、Ti) 分析供試料以氫氟酸、硝酸等之酸加熱、溶解後，以碳酸鈉進行鹼熔融，以鹽酸調整至特定濃度者作為供試液，以感應耦合電漿發光分析法(ICP-AES)進行測定。分析/試驗結果示於表3及表4。Ba未達檢測極限(0.2質量%)。(Al, Ba, Ca, Si, Ti) After the analysis sample is heated and dissolved with acid such as hydrofluoric acid and nitric acid, it is alkali-melted with sodium carbonate, adjusted to a specific concentration with hydrochloric acid as the test solution, and measured by inductively coupled plasma emission analysis (ICP-AES) . The analysis/test results are shown in Table 3 and Table 4. Ba did not reach the detection limit (0.2% by mass).

(其他17個項目(Cd、Co、Cr、Cu、Fe、K、Li、Mg、Mn、Mo、Na、Ni、P、Pb、Sb、V、Zn)) 分析供試料以氫氟酸、硝酸等之酸加熱、溶解，調整至特定濃度者作為供試液，以感應耦合電漿發光分析法(ICP-AES)進行測定。分析/試驗結果示於表3及表4。Cd、Co、Cr、Cu、Mn、Mo、Ni、P、Pb、Sb及V均未達檢測極限(0.2質量%)。(17 other items (Cd, Co, Cr, Cu, Fe, K, Li, Mg, Mn, Mo, Na, Ni, P, Pb, Sb, V, Zn)) The sample for analysis is heated and dissolved with acids such as hydrofluoric acid and nitric acid, adjusted to a specific concentration as the test solution, and measured by inductively coupled plasma emission analysis (ICP-AES). The analysis/test results are shown in Table 3 and Table 4. Cd, Co, Cr, Cu, Mn, Mo, Ni, P, Pb, Sb, and V did not reach the detection limit (0.2% by mass).

(相對介電常數及介電正切之測定) 將各實施例及比較例所得之樹脂組成物顆粒於120℃真空乾燥5小時，供於PNX-40-5A(日精樹脂工業公司製)，以汽缸溫度：350℃之成形條件，製作64mm見方、厚1.0mm之平板。對所得平板藉以下條件測定1GHz下之相對介電常數及介電正切。 測定方法：電容法(裝置：阻抗分析儀(Agilent公司製，型號：E4991A)) 電極型式：16453A 測定環境：23℃，50%RH 施加電壓：1V(Measurement of relative dielectric constant and dielectric tangent) The resin composition pellets obtained in each of the Examples and Comparative Examples were vacuum dried at 120°C for 5 hours, and supplied to PNX-40-5A (manufactured by Nissei Plastics Industry Co., Ltd.). The cylinder temperature: 350°C was used to form a 64mm square, Flat plate with thickness of 1.0mm. The relative dielectric constant and dielectric tangent at 1 GHz were measured for the obtained plate under the following conditions. Measurement method: capacitance method (device: impedance analyzer (manufactured by Agilent, model: E4991A)) Electrode type: 16453A Measurement environment: 23℃, 50%RH Applied voltage: 1V

(熱擴散率之測定) 將各實施例及比較例所得之樹脂組成物顆粒於120℃真空乾燥5小時，供於PNX-40-5A(日精樹脂工業公司製)，以汽缸溫度：350℃之成形條件，成形64mm見方、厚1.0mm之薄片，切出10mm×10mm×1.0mm作成試驗片。對該試驗片，使用熱擴散率計NanoFlash LFA457(BRUKER AXS公司製)，藉由雷射閃光法，測定熱擴散率。(Measurement of thermal diffusivity) The resin composition pellets obtained in each of the Examples and Comparative Examples were vacuum dried at 120°C for 5 hours, and supplied to PNX-40-5A (manufactured by Nissei Plastics Industry Co., Ltd.). The cylinder temperature: 350°C was used to form a 64mm square. Thin slices with a thickness of 1.0mm are cut out to make test pieces of 10mm×10mm×1.0mm. For this test piece, using a thermal diffusivity meter NanoFlash LFA457 (manufactured by BRUKER AXS), the thermal diffusivity was measured by the laser flash method.

(拉伸試驗) 將各實施例及比較例所得之樹脂組成物顆粒於120℃真空乾燥5小時，供於PNX-40-5A(日精樹脂工業公司製)，以汽缸溫度：350℃之成形條件，射出成形ASTM4號啞鈴試驗片。針對該試驗片各5個樣本依據ASTM D638，使用拉伸試驗機Tensilon RTG-1250(A&D公司製)，以夾頭速度10mm/min進行拉伸試驗，測定拉伸強度及此時之伸長率，求出該等平均值。結果示於表3及表4。(Stretching test) The resin composition pellets obtained in each of the Examples and Comparative Examples were vacuum dried at 120°C for 5 hours, and supplied to PNX-40-5A (manufactured by Nissei Plastic Industries Co., Ltd.). The cylinder temperature: 350°C was used for injection molding ASTM No. 4 Dumbbell test piece. For each of the 5 specimens of the test piece, a tensile test was performed using a tensile testing machine Tensilon RTG-1250 (manufactured by A&D) at a chuck speed of 10 mm/min in accordance with ASTM D638, and the tensile strength and elongation at this time were measured. Find these averages. The results are shown in Table 3 and Table 4.

＜樹脂組成物中之纖維狀玻璃填料之重量平均纖維長及數平均纖維長＞ 由比較例1及實施例1所得之樹脂組成物顆粒中，分別採取1.0g至坩鍋中，於電爐內於600℃處理4小時予以灰化。其殘渣以甲醇分散且於載玻片上展開之狀態拍攝顯微鏡照片，自該照片直接讀取纖維狀玻璃填料之形狀，算出其平均值，求出樹脂組成物中纖維狀玻璃填料之重量平均纖維長及數平均纖維長。又算出平均值時總體參數設為400以上。自纖維狀玻璃填料之比重算出對於各纖維長之重量，以400以上之總體參數的試料總重量作為分母，算出重量平均纖維長。結果示於表3。＜Weight average fiber length and number average fiber length of fibrous glass filler in resin composition＞ Of the resin composition particles obtained in Comparative Example 1 and Example 1, 1.0 g was respectively taken into a crucible, and treated in an electric furnace at 600° C. for 4 hours to be ashed. The residue was dispersed in methanol and spread on a glass slide to take a micrograph, read the shape of the fibrous glass filler directly from the photograph, calculate the average value, and obtain the weight average fiber length of the fibrous glass filler in the resin composition And the average fiber length. When calculating the average value, the overall parameter is set to 400 or more. Calculate the weight of each fiber length from the specific gravity of the fibrous glass filler, and use the total weight of the sample with an overall parameter of 400 or more as the denominator to calculate the weight average fiber length. The results are shown in Table 3.

＜樹脂組成物中之片狀玻璃填料之平均厚度與平均粒徑＞ 由比較例2、3及實施例2~6所得之樹脂組成物顆粒中，分別採取1.0g至坩鍋中，於電爐內於600℃處理4小時予以灰化，其殘渣以甲醇分散且於載玻片上展開之狀態以SEM以倍率1000倍觀察，直接讀取自SEM圖像隨機選擇之100個片狀玻璃填料形狀，算出最大Feret徑之數平均值，求出樹脂組成物中之片狀玻璃填料之數平均粒徑。且算出厚度之數平均值，求出樹脂組成物中之片狀玻璃填料之平均厚度。又算出平均值時總體參數設為400以上。結果示於表3及表4。＜Average thickness and average particle size of flake glass filler in resin composition＞ From the resin composition particles obtained in Comparative Examples 2, 3 and Examples 2 to 6, 1.0 g was respectively taken into a crucible, and treated in an electric furnace at 600°C for 4 hours to be ashed. The residue was dispersed with methanol and placed in a crucible. The unfolded state of the glass slide is observed by SEM at a magnification of 1000 times, and 100 pieces of glass filler shapes randomly selected from the SEM image are directly read, and the average value of the maximum Feret diameter is calculated, and the glass in the resin composition is calculated The number average particle size of the filler. The average thickness of the thickness is calculated, and the average thickness of the flake glass filler in the resin composition is calculated. When calculating the average value, the overall parameter is set to 400 or more. The results are shown in Table 3 and Table 4.

由表3及表4之結果，應用本發明之實施例1之液晶聚酯樹脂組成物與比較例1之液晶聚酯樹脂組成物相比，可為相對介電常數較小，介電正切較小，且熱擴散率較大者。機械強度亦為同等程度。 應用本發明之實施例2之液晶聚酯樹脂組成物與比較例2~3之液晶聚酯樹脂組成物相比，亦可為相對介電常數較小且介電正切較小者。機械強度亦為同等程度。 應用本發明之實施例3、4~6之液晶聚酯樹脂組成物與比較例2~3之液晶聚酯樹脂組成物相比，亦可為相對介電常數較小，介電正切較小，且熱擴散率較大者。機械強度亦為同等程度。According to the results of Table 3 and Table 4, the liquid crystal polyester resin composition of Example 1 of the present invention can have a lower relative dielectric constant and a higher dielectric tangent than the liquid crystal polyester resin composition of Comparative Example 1. Smaller and larger thermal diffusivity. The mechanical strength is also the same. Compared with the liquid crystal polyester resin composition of Comparative Examples 2 to 3, the liquid crystal polyester resin composition of Example 2 to which the present invention is applied may have a smaller relative dielectric constant and a smaller dielectric tangent. The mechanical strength is also the same. Compared with the liquid crystal polyester resin compositions of Comparative Examples 2 to 3, the liquid crystal polyester resin compositions of Examples 3 and 4 to 6 to which the present invention is applied can also have a smaller relative dielectric constant and a smaller dielectric tangent. And the thermal diffusivity is greater. The mechanical strength is also the same.

Claims (7)

一種樹脂組成物，其包含熱塑性樹脂及/或熱硬化性樹脂、及分散於前述熱塑性樹脂及/或前述熱硬化性樹脂中之玻璃成分， 前述樹脂組成物灰化後之殘渣成分以ICP分析時，相對於前述樹脂組成物所含之金屬成分100質量%，前述樹脂組成物所含之鈣含量為0~27質量%。A resin composition comprising a thermoplastic resin and/or a thermosetting resin, and a glass component dispersed in the thermoplastic resin and/or the thermosetting resin, When the residue component after ashing of the resin composition is analyzed by ICP, the calcium content of the resin composition is 0-27% by mass relative to 100% by mass of the metal component contained in the resin composition. 如請求項1之樹脂組成物，其中前述樹脂組成物灰化後之殘渣成分以ICP分析時，相對於前述樹脂組成物所含之金屬成分100質量%，前述樹脂組成物所含之矽含量為51質量%以上。Such as the resin composition of claim 1, wherein when the residue composition of the resin composition after ashing is analyzed by ICP, the content of silicon in the resin composition is 100% by mass relative to the metal component contained in the resin composition 51% by mass or more. 一種樹脂組成物，其包含熱塑性樹脂及/或熱硬化性樹脂、及分散於前述熱塑性樹脂及/或前述熱硬化性樹脂中之玻璃成分， 相對於前述玻璃成分所含之金屬成分100質量%，前述玻璃成分所含之鈣含量為0~27質量%。A resin composition comprising a thermoplastic resin and/or a thermosetting resin, and a glass component dispersed in the thermoplastic resin and/or the thermosetting resin, The content of calcium contained in the glass component is 0-27% by mass relative to 100% by mass of the metal component contained in the glass component. 如請求項3之樹脂組成物，其中相對於前述玻璃成分所含之金屬成分100質量%，前述玻璃成分所含之矽含量為51質量%以上。The resin composition of claim 3, wherein the silicon content in the glass component is 51% by mass or more relative to 100% by mass of the metal component contained in the glass component. 如請求項1至4中任一項之樹脂組成物，其中於1GHz之頻率及25℃之溫度下之前述樹脂組成物之相對介電常數ε_r 為3.4以下。The resin composition according to any one of claims 1 to 4, wherein the relative dielectric constant ε _r of the aforementioned resin composition at a frequency of 1 GHz and a temperature of 25° C. is 3.4 or less. 如請求項5之樹脂組成物，其中於1GHz之頻率及25℃之溫度下之前述樹脂組成物之介電正切tanδ為5.5×10^-3 以下。The resin composition of claim 5, wherein the dielectric tangent tanδ of the aforementioned resin composition at a frequency of 1 GHz and a temperature of 25° C. is 5.5×10 ^-3 or less. 如請求項5或6之樹脂組成物，其中前述樹脂組成物之熱擴散率為0.14mm² /s以上。The resin composition of claim 5 or 6, wherein the thermal diffusivity of the aforementioned resin composition is 0.14 mm ² /s or more.