TW202035741A - Evaporation apparatus for evaporating a material and method for evaporating a material with an evaporation apparatus - Google Patents

Evaporation apparatus for evaporating a material and method for evaporating a material with an evaporation apparatus Download PDF

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TW202035741A
TW202035741A TW108143355A TW108143355A TW202035741A TW 202035741 A TW202035741 A TW 202035741A TW 108143355 A TW108143355 A TW 108143355A TW 108143355 A TW108143355 A TW 108143355A TW 202035741 A TW202035741 A TW 202035741A
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container
evaporation device
evaporation
mesh structure
material supply
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TW108143355A
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麥克 隆
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美商應用材料股份有限公司
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/26—Vacuum evaporation by resistance or inductive heating of the source
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01B—BOILING; BOILING APPARATUS ; EVAPORATION; EVAPORATION APPARATUS
    • B01B1/00—Boiling; Boiling apparatus for physical or chemical purposes ; Evaporation in general
    • B01B1/005—Evaporation for physical or chemical purposes; Evaporation apparatus therefor, e.g. evaporation of liquids for gas phase reactions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D3/00—Distillation or related exchange processes in which liquids are contacted with gaseous media, e.g. stripping
    • B01D3/10—Vacuum distillation
    • B01D3/106—Vacuum distillation with the use of a pump for creating vacuum and for removing the distillate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D5/00—Condensation of vapours; Recovering volatile solvents by condensation
    • B01D5/0057—Condensation of vapours; Recovering volatile solvents by condensation in combination with other processes
    • B01D5/006—Condensation of vapours; Recovering volatile solvents by condensation in combination with other processes with evaporation or distillation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D7/00—Sublimation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/12—Organic material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/243—Crucibles for source material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/246—Replenishment of source material

Abstract

Embodiments described herein relate to an evaporation apparatus (100) for evaporating a material, the evaporation apparatus including a container (105) for the material, and a heating assembly (110), the heating assembly including an outer heating unit (115) at least partially provided around the container, and a mesh structure (120) within the container. The outer heating unit is configured to provide a temperature gradient within the container.

Description

用以蒸發一材料之蒸發設備及使用蒸發裝置蒸發材料之方法Evaporation equipment for evaporating a material and method for evaporating material using evaporation device

本發明是有關於蒸發源、源材料的沉積以及用於沉積材料的系統、設備和方法，沉積材料例如有機材料。本發明的實施例有關於一種用於產生蒸氣流的設備，且特別是適用於在真空沉積系統中建立有機發光二極管（OLED）裝置的有機材料蒸氣流。特別地，本發明有關用於蒸發有機材料的蒸發源，例如用於製造裝置的沉積系統，特別是其中包含有機材料的裝置。The present invention relates to evaporation sources, deposition of source materials, and systems, equipment and methods for depositing materials, such as organic materials. The embodiment of the present invention relates to an apparatus for generating a vapor stream, and is particularly suitable for establishing an organic material vapor stream for an organic light emitting diode (OLED) device in a vacuum deposition system. In particular, the present invention relates to evaporation sources for evaporating organic materials, such as deposition systems for manufacturing devices, particularly devices containing organic materials.

在基板上進行層沉積的技術包括例如熱蒸發、物理氣相沉積（PVD）和化學氣相沉積（CVD）。鍍膜的基板可用於多種應用和多種技術領域。例如，鍍膜的基板可以用於有機發光二極管裝置的領域。有機發光二極管可用於製造電視屏幕、計算機監視器、行動電話、其他手持裝置及類似裝置等以顯示資訊。有機蒸發器是用於生產有機發光二極管的工具。有機發光二極管是一種特殊類型的發光二極管，其中發射層包括某些有機化合物的薄膜。有機發光二極管用於製造電視屏幕、計算機監視器，行動電話和其他手持裝置以顯示資訊。有機發光二極管也可用於一般空間照明。有機發光二極管顯示器可能具有的顏色、亮度和視角的範圍比傳統液晶顯示器（LCD）大，因為有機發光二極管像素直接發光而不需要背光。因此，有機發光二極管顯示器的能耗大大低於傳統的液晶顯示器。此外，有機發光二極管可以被製造在可撓性基板上做進一步的應用。Techniques for layer deposition on a substrate include, for example, thermal evaporation, physical vapor deposition (PVD), and chemical vapor deposition (CVD). The coated substrate can be used in a variety of applications and a variety of technical fields. For example, the coated substrate can be used in the field of organic light emitting diode devices. Organic light-emitting diodes can be used in the manufacture of TV screens, computer monitors, mobile phones, other handheld devices and similar devices to display information. Organic evaporator is a tool used to produce organic light-emitting diodes. Organic light-emitting diodes are a special type of light-emitting diodes in which the emitting layer includes a thin film of certain organic compounds. Organic light-emitting diodes are used in the manufacture of TV screens, computer monitors, mobile phones and other handheld devices to display information. Organic light-emitting diodes can also be used for general space lighting. An organic light emitting diode display may have a larger range of colors, brightness, and viewing angle than a traditional liquid crystal display (LCD) because the organic light emitting diode pixels emit light directly without a backlight. Therefore, the energy consumption of organic light emitting diode displays is much lower than that of traditional liquid crystal displays. In addition, organic light emitting diodes can be fabricated on flexible substrates for further applications.

有機發光二極管裝置，諸如有機發光二極管顯示器，可包括位於沉積在基板上的兩個電極之間的一層或多層有機材料。有機發光二極管顯示器例如可以包括以形成具有單獨可激勵像素的矩陣顯示面板的方式沉積在基板上的層。有機發光二極管通常放置在兩個玻璃面板之間，並且玻璃面板的邊緣被密封以將有機發光二極管封裝在其中。Organic light-emitting diode devices, such as organic light-emitting diode displays, may include one or more layers of organic materials between two electrodes deposited on a substrate. The organic light emitting diode display may include, for example, a layer deposited on a substrate in a manner to form a matrix display panel with individually excitable pixels. The organic light emitting diode is usually placed between two glass panels, and the edge of the glass panel is sealed to encapsulate the organic light emitting diode therein.

在有機發光二極管顯示裝置的製造中遇到許多挑戰。有機發光二極管顯示器或有機發光二極管照明應用包括多種材料的堆疊，這些材料例如在真空系統中蒸發。通常以由遮罩限定的預定圖案來沉積有機材料。為了高效率地製造有機發光二極管，兩種或多種材料例如主體和摻雜劑的共沉積或共蒸發形成混合/摻雜層是有益的。此外，還必須考慮到非常敏感的有機材料在蒸發時的幾種製程狀況。Many challenges are encountered in the manufacture of organic light emitting diode display devices. Organic light emitting diode displays or organic light emitting diode lighting applications include stacks of multiple materials, which are evaporated in a vacuum system, for example. The organic material is usually deposited in a predetermined pattern defined by a mask. In order to efficiently manufacture organic light emitting diodes, it is beneficial to co-deposit or co-evaporate two or more materials such as a host and a dopant to form a mixed/doped layer. In addition, several process conditions during the evaporation of very sensitive organic materials must also be considered.

為了蒸發待沉積的材料，可以使用坩堝。為坩堝提供熱能以加熱坩堝中的材料並蒸發固體形式的材料，例如粉末。但是，使用坩堝有幾個缺點。例如，難以確保有機材料的適當蒸發，特別是在長時間。In order to evaporate the material to be deposited, a crucible can be used. The crucible is provided with thermal energy to heat the material in the crucible and evaporate the material in solid form, such as powder. However, the use of crucibles has several disadvantages. For example, it is difficult to ensure proper evaporation of organic materials, especially over long periods of time.

在處理期間，基板可以被承載在載體上，載體用以支撐基板並與遮罩對準。來自蒸氣產生器的蒸氣或源的蒸氣通過遮罩被引導向基板，以在基板上形成圖案化的膜。通過一個或多個遮罩將一種或多種材料沉積到基板上，以形成幾乎不可見的像素，這些像素個別定位以形成諸如全色顯示器的功能裝置。During processing, the substrate can be carried on a carrier, which is used to support the substrate and align with the mask. The steam from the steam generator or the source steam is guided to the substrate through the mask to form a patterned film on the substrate. One or more materials are deposited on the substrate through one or more masks to form almost invisible pixels, which are individually positioned to form functional devices such as full-color displays.

鑑於以上所述，待沉積材料的蒸發的改善將有利於確保蒸發材料的高質量沉積，特別是在有機發光二極管裝置的製造中。In view of the above, the improvement of the evaporation of the material to be deposited will help ensure high-quality deposition of the evaporated material, especially in the manufacture of organic light emitting diode devices.

根據一方面，提供了一種用於蒸發一材料的蒸發設備。蒸發設備包括一容器以及一加熱組件。容器用於材料。加熱組件包括一外部加熱單元以及一網狀結構。外部加熱單元至少部分地設置在容器周圍。網狀結構在容器內。外部加熱單元用以在容器內提供一溫度梯度。According to one aspect, an evaporation device for evaporating a material is provided. The evaporation equipment includes a container and a heating component. The container is used for the material. The heating assembly includes an external heating unit and a mesh structure. The external heating unit is at least partially arranged around the container. The mesh structure is inside the container. The external heating unit is used to provide a temperature gradient in the container.

根據一方面，提供了一種用於蒸發一材料的蒸發設備。蒸發設備包括一容器和一加熱組件。加熱組件包括一外部加熱單元以及一網狀結構。外部加熱單元至少部分地設置在容器周圍。網狀結構在容器內。蒸發設備可更進一步包括一施力單元，其耦接至網狀結構。 根據一方面，提供了一種用於蒸發一材料的蒸發設備。蒸發設備包括一容器、一網狀結構及一蒸氣引導導管。容器用於儲存待蒸發的一固體材料。網狀結構在容器內並設置在固體材料下方。蒸氣引導導管在網狀結構下方。According to one aspect, an evaporation device for evaporating a material is provided. The evaporation equipment includes a container and a heating assembly. The heating assembly includes an external heating unit and a mesh structure. The external heating unit is at least partially arranged around the container. The mesh structure is inside the container. The evaporation device may further include a force applying unit coupled to the mesh structure. According to one aspect, an evaporation device for evaporating a material is provided. The evaporation equipment includes a container, a mesh structure and a vapor guide tube. The container is used to store a solid material to be evaporated. The net-like structure is inside the container and arranged under the solid material. The vapor guide tube is below the mesh structure.

根據一方面，提供了一種沉積設備，以在真空室內的一基板上沉積材料。沉積設備包括一真空室、設置在真空室中的根據本發明實施例所描述的一蒸發設備、以及一分配組件。分配組件與蒸發設備流體連通以將蒸發的材料引導向基底。According to one aspect, a deposition apparatus is provided to deposit material on a substrate in a vacuum chamber. The deposition apparatus includes a vacuum chamber, an evaporation apparatus described in accordance with the embodiment of the present invention, and a distribution assembly arranged in the vacuum chamber. The distribution assembly is in fluid communication with the evaporation device to direct the evaporated material to the substrate.

根據一方面，提供了一種利用一蒸發設備蒸發一材料的方法。方法包括在一容器內提供一溫度梯度，包括一加熱組件至少部分地設置在容器周圍。加熱組件包括一外部加熱單元以及一網狀結構。網狀結構在容器內。According to one aspect, a method for evaporating a material using an evaporation device is provided. The method includes providing a temperature gradient in a container, including a heating assembly at least partially disposed around the container. The heating assembly includes an external heating unit and a mesh structure. The mesh structure is inside the container.

根據一方面，提供了一種利用一蒸發設備蒸發一材料的方法。方法包括透過一容器內之一網狀結構加熱待蒸發的材料，並在網狀結構和材料之間互相提供力。According to one aspect, a method for evaporating a material using an evaporation device is provided. The method includes heating the material to be evaporated through a net structure in a container, and providing mutual force between the net structure and the material.

實施例還針對用於執行所揭露之方法的設備，並且包括用於執行每個所描述的方法的設備組件。這些方法可以透過硬體部件、透過適當軟體編成的計算機、透過兩者的任意組合或以任何其他方式來執行。此外，根據本發明的實施例更針對用於操作所描述的設備的方法。包括用於執行設備的每個功能的方法。The embodiments are also directed to devices for performing the disclosed methods, and include device components for performing each of the described methods. These methods can be executed through hardware components, through computers programmed with appropriate software, through any combination of the two, or in any other way. Furthermore, the embodiments according to the invention are more directed to methods for operating the described devices. Include methods for performing each function of the device.

現在將詳細參照本發明的各種實施例，在圖式中繪示一個或多個示例。在以下的圖式描述中，相同的圖式標號指的是相同的部件，僅用於描述關於各個實施例的差異。每個示例用於解釋本發明，並非代表對本發明做限制。此外，一實施例的一部分所繪示或描述的特徵可以使用在其他實施例上或與其他實施例結合以產生另一實施例。本案包括這樣的修改和變化。Reference will now be made in detail to various embodiments of the present invention, and one or more examples are shown in the drawings. In the following description of the drawings, the same drawing reference numerals refer to the same components, and are only used to describe the differences between the various embodiments. Each example is used to explain the present invention and does not represent a limitation to the present invention. In addition, a part of the features illustrated or described in one embodiment can be used on or combined with other embodiments to produce another embodiment. This case includes such modifications and changes.

蒸發設備可為蒸發坩堝。傳統的蒸發坩堝包括用以加熱的裝置，其設置在蒸發坩堝的外部，並且為蒸發坩堝和其中所含的材料提供高溫。這些蒸發坩堝僅允許熱能傳導較差，且需要開始和維持蒸發的（固體）材料顆粒。如果材料顆粒與加熱壁不相鄰，則可能導致蒸發不完全。The evaporation equipment may be an evaporation crucible. The conventional evaporation crucible includes a device for heating, which is arranged outside the evaporation crucible and provides high temperature for the evaporation crucible and the materials contained therein. These evaporating crucibles only allow poor heat transfer, and need to start and maintain the evaporation of (solid) material particles. If the material particles are not adjacent to the heating wall, it may cause incomplete evaporation.

為了確保待鍍膜的基板（例如待製造的有機發光二極管裝置）的高質量尤其是長壽命，沉積的有機層不含污染物且不含熱分解產物是有用的。當待蒸發的有機材料暴露於高溫或長時間暴露於其他可接受的溫度下時，會產生分解產物。In order to ensure the high quality and especially the long life of the substrate to be coated (such as the organic light emitting diode device to be manufactured), it is useful that the deposited organic layer is free of contaminants and free of thermal decomposition products. When the organic material to be evaporated is exposed to high temperature or exposed to other acceptable temperatures for a long time, decomposition products are produced.

為了達到此目的，傳統的蒸氣產生系統已經使用了具有足夠小體積的有機材料的坩堝，其設計成使得在發生顯著的熱分解之前消耗有機材料。然而，進行頻繁地中斷沉積過程以交換坩堝，導致隨後的生產率損失和操作成本增加。To achieve this goal, conventional vapor generation systems have used crucibles with sufficiently small volumes of organic materials, which are designed to consume organic materials before significant thermal decomposition occurs. However, frequent interruption of the deposition process to exchange the crucible is performed, resulting in subsequent productivity loss and increase in operating costs.

因此，有利的是提供一種蒸汽產生系統，其中與傳統的蒸汽產生系統相比，有機材料在蒸汽產生設備中暴露於較低的溫度並且在較短的時間內暴露於高溫。減少的熱暴露可讓敏感的有機材料的熱分解減少，並使有機發光二極管裝置的製造效率得以提高，尤其是使用壽命得以延長。此外，有益的是提供一種蒸汽產生系統，即使在重新填滿有機材料的情況下也能夠使蒸汽產生裝置連續運行。Therefore, it is advantageous to provide a steam generation system in which organic materials are exposed to a lower temperature in the steam generation device and to a high temperature in a shorter time than in a conventional steam generation system. The reduced heat exposure can reduce the thermal decomposition of sensitive organic materials and improve the manufacturing efficiency of the organic light emitting diode device, especially the service life. In addition, it is beneficial to provide a steam generating system that can continuously operate the steam generating device even when the organic material is refilled.

根據本發明描述的實施例，提供了一種用於蒸發材料的蒸發設備。蒸發設備包括用於材料的一容器和一加熱組件。加熱組件包括至少部分地設置在容器周圍的外部加熱單元以及容器內的網狀結構。外部加熱單元用以在容器內提供溫度梯度。According to the described embodiment of the present invention, an evaporation device for evaporating materials is provided. The evaporation device includes a container for the material and a heating assembly. The heating assembly includes an external heating unit at least partially arranged around the container and a mesh structure inside the container. The external heating unit is used to provide a temperature gradient in the container.

根據本發明描述的實施例，提供了一種用於蒸發將在沉積製程中使用的材料的蒸發設備。提供加熱組件與容器以蒸發材料。加熱組件包括外部加熱單元，以向容器提供溫度梯度。加熱單元包括網狀結構，網狀結構設置在容器內。網狀結構可包括第一表面和第二自由表面。網狀結構，即網狀結構的第一表面可與待沉積的材料的表面直接接觸。網狀結構可被加熱到允許蒸發網狀結構附近的材料的溫度。According to the described embodiments of the present invention, there is provided an evaporation apparatus for evaporating materials to be used in a deposition process. Provide heating elements and containers to evaporate materials. The heating assembly includes an external heating unit to provide a temperature gradient to the container. The heating unit includes a mesh structure, and the mesh structure is arranged in the container. The mesh structure may include a first surface and a second free surface. The network structure, that is, the first surface of the network structure can be in direct contact with the surface of the material to be deposited. The mesh structure can be heated to a temperature that allows evaporation of the material near the mesh structure.

根據本發明描述的實施例，提供了一種用於蒸發材料的蒸發設備。蒸發設備包括容器和加熱組件。加熱組件包括至少部分地設置在容器周圍的外部加熱單元以及容器內的網狀結構。蒸發設備可包括耦接至網狀結構的施力單元。施力單元可耦接到網狀結構。施力單元可向網狀結構提供力，以允許網狀結構座落於容器內的材料的表面。According to the described embodiment of the present invention, an evaporation device for evaporating materials is provided. The evaporation equipment includes a container and a heating component. The heating assembly includes an external heating unit at least partially arranged around the container and a mesh structure inside the container. The evaporation device may include a force applying unit coupled to the mesh structure. The force applying unit may be coupled to the mesh structure. The force applying unit can provide force to the mesh structure to allow the mesh structure to sit on the surface of the material in the container.

第1圖繪示根據本發明描述的實施例的蒸發設備。蒸發設備100包括容器105和加熱組件110。加熱組件包括外部加熱單元115和網狀結構120。網狀結構120可設置在容器105內。施力單元125可以耦接至網狀結構120。待蒸發的材料可設置在容器105內。容器105可為類似坩堝的設置。加熱組件110，即外部加熱單元115可向容器提供溫度。特別地，可由外部加熱單元115提供溫度梯度。由外部加熱單元提供的溫度梯度的溫度範圍可低於待沉積的材料的蒸發溫度TE 。Figure 1 shows an evaporation device according to the described embodiment of the invention. The evaporation device 100 includes a container 105 and a heating assembly 110. The heating assembly includes an external heating unit 115 and a mesh structure 120. The mesh structure 120 may be provided in the container 105. The force applying unit 125 may be coupled to the mesh structure 120. The material to be evaporated may be arranged in the container 105. The container 105 can be a crucible-like setting. The heating assembly 110, that is, the external heating unit 115, can provide temperature to the container. In particular, the temperature gradient may be provided by the external heating unit 115. Provided by the external heating unit may be a temperature range below the temperature gradient of the material to be deposited evaporating temperature T E.

根據本發明描述的實施例，外部加熱單元可提供溫度梯度。在整個發明中使用的術語“溫度梯度”可以理解為在蒸發設備的容器內建立的溫度變化。例如，容器底部的溫度可以低於容器頂部的溫度。從加熱網的位置到容器底部的溫度梯度的溫度差可以包括在20℃至300℃範圍內的溫度差。例如，外部加熱單元可以包括多個加熱器，其至少部分地設置在容器周圍，並且在容器的實質垂直方向上從容器的底部到頂部設置或從容器的頂部到底部設置。由外部加熱單元提供的溫度梯度的最大溫差可低於待蒸發和/或待沉積的材料的蒸發溫度TE ，例如至少低於50℃。According to the described embodiments of the present invention, the external heating unit can provide a temperature gradient. The term "temperature gradient" used throughout the present invention can be understood as the temperature change established in the container of the evaporation device. For example, the temperature at the bottom of the container may be lower than the temperature at the top of the container. The temperature difference of the temperature gradient from the position of the heating net to the bottom of the container may include a temperature difference in the range of 20°C to 300°C. For example, the external heating unit may include a plurality of heaters, which are at least partially disposed around the container and arranged from the bottom to the top of the container or from the top to the bottom of the container in a substantially vertical direction of the container. Provided by the external heating unit may be the maximum temperature difference is lower than the temperature gradient to be evaporated and / or evaporation temperature of the material to be deposited T E, for example, at least below 50 ℃.

有利地，由外部加熱單元提供的溫度可以低於待蒸發的材料的蒸發溫度。因此，可以防止容器中的散裝材料的熱分解。容器中的材料不含熱分解材料。因此，防止或減少了沉積在基板上的蒸發材料中之污染物的形成。Advantageously, the temperature provided by the external heating unit may be lower than the evaporation temperature of the material to be evaporated. Therefore, the thermal decomposition of the bulk material in the container can be prevented. The material in the container does not contain thermally decomposable materials. Therefore, the formation of contaminants in the evaporation material deposited on the substrate is prevented or reduced.

在整個發明中使用的術語“材料”或“待蒸發的材料”或“待沉積的材料”可以理解為適合在沉積製程中沉積於基板上的材料。此材料可以為固體材料和/或液體材料。例如，可為粉末形式的材料。粉末形式可以包括具有表面積的材料顆粒。根據一實施例，材料可以直接從固相轉變為氣相，例如材料可以在一定溫度下昇華，這取決於所使用的材料。附加地或可替代地，此材料可以是從固相轉變為液相然後轉變為氣相的材料，例如此材料可以在特定溫度下液化，然後可以在另一較高溫度下蒸發。The term "material" or "material to be evaporated" or "material to be deposited" used throughout the present invention can be understood as a material suitable for being deposited on a substrate in a deposition process. This material can be a solid material and/or a liquid material. For example, it may be a material in powder form. The powder form may include particles of material having a surface area. According to an embodiment, the material can be directly transformed from the solid phase to the gas phase, for example the material can sublime at a certain temperature, depending on the material used. Additionally or alternatively, the material may be a material that changes from a solid phase to a liquid phase and then to a gas phase, for example, the material may be liquefied at a certain temperature, and then may be evaporated at another higher temperature.

根據本發明描述的實施例，加熱組件110可以包括網狀結構120。網狀結構120可以設置在容器105內。網狀結構的溫度可以被調節。特別地，網狀結構可被加熱。網狀結構的一部分可以與待蒸發的材料直接熱接觸。由於相互作用的大表面積、蒸發的材料在至少一部分網狀結構內的滲透、以及網狀結構的加熱元件與待蒸發的材料之間的短熱路徑，直接接觸的部分可將待蒸發的材料加熱到與網狀結構相同的溫度。例如，可以將網狀結構加熱到足以允許容器中待蒸發的材料蒸發的溫度。例如，網狀結構的溫度可以根據容器中材料的蒸發溫度和/或預定的沉積速率而變化。特別地，可以在容器中的材料的表面提供網狀結構。According to the described embodiment of the present invention, the heating assembly 110 may include a mesh structure 120. The mesh structure 120 may be provided in the container 105. The temperature of the mesh structure can be adjusted. In particular, the mesh structure can be heated. A part of the network structure can be in direct thermal contact with the material to be evaporated. Due to the large surface area of the interaction, the penetration of the evaporated material in at least a part of the net structure, and the short thermal path between the heating element of the net structure and the material to be evaporated, the part in direct contact can heat the material to be evaporated To the same temperature as the mesh structure. For example, the mesh structure can be heated to a temperature sufficient to allow the material to be evaporated in the container to evaporate. For example, the temperature of the mesh structure may vary according to the evaporation temperature of the material in the container and/or the predetermined deposition rate. In particular, a net-like structure can be provided on the surface of the material in the container.

如本發明中所使用的術語“材料的表面”可以理解為容器中不與其他材料顆粒接觸的材料顆粒的最上部區域。 附加地或可替代地，“材料的表面”可以理解為與容器的內部空間接觸的材料顆粒層，此內部空間沒有材料並且面向期望的蒸氣傳輸方向。最上面的材料顆粒層可包括2至3毫米（mm）的層厚度。The term "surface of a material" as used in the present invention can be understood as the uppermost region of the material particles in the container that is not in contact with other material particles. Additionally or alternatively, "the surface of the material" can be understood as a layer of material particles in contact with the inner space of the container, which is free of material and faces the desired vapor transmission direction. The uppermost layer of material particles may include a layer thickness of 2 to 3 millimeters (mm).

因此，容器中的材料僅一小部分被加熱到高溫，即接近或處於蒸發溫度的溫度。故，在相當短的時間內提供高溫，可以減少或避免材料的分解。Therefore, only a small portion of the material in the container is heated to a high temperature, that is, a temperature close to or at the evaporation temperature. Therefore, providing high temperature in a relatively short time can reduce or avoid material decomposition.

根據本發明描述的實施例，網狀結構120可以相對於容器105的方向實質上水平地定向。網狀結構120可以是多孔網。網狀結構120可以耦接到施力單元125。施力單元125可以用以維持網狀結構的位置，即在材料的表面處。附加地或可替代地，網狀結構可以是可移動的。施力單元可以向網狀結構施加力。例如，施力單元125可將網狀結構120推向容器的底部，即推向材料的表面。施力單元可以是彈簧。According to the described embodiment of the present invention, the mesh structure 120 may be oriented substantially horizontally with respect to the direction of the container 105. The mesh structure 120 may be a porous mesh. The mesh structure 120 may be coupled to the force applying unit 125. The force applying unit 125 can be used to maintain the position of the mesh structure, that is, at the surface of the material. Additionally or alternatively, the mesh structure may be movable. The force applying unit can apply force to the mesh structure. For example, the force applying unit 125 can push the mesh structure 120 to the bottom of the container, that is, to the surface of the material. The force applying unit may be a spring.

可替代地，如圖7中之示例所示，網狀結構120和待蒸發的材料720的方向可以顛倒。在此構造中，在重力作用下，借助於或不借助施力單元，待蒸發的材料都可以保持與網狀結構接觸或對網狀結構施加力。根據一些實施例，其可與本發明描述的其他實施例結合，材料可設置在容器105中網狀結構120上方。材料的重量提供了網狀結構和材料相對於彼此的力。蒸發的材料通過一個或多個導管可被引導至分配組件。Alternatively, as shown in the example in FIG. 7, the directions of the mesh structure 120 and the material to be evaporated 720 may be reversed. In this configuration, under the action of gravity, with or without the aid of the force applying unit, the material to be evaporated can be kept in contact with the net structure or exert force on the net structure. According to some embodiments, which can be combined with other embodiments described in the present invention, the material can be arranged above the mesh structure 120 in the container 105. The weight of the material provides the mesh structure and the force of the material relative to each other. The evaporated material can be guided to the distribution assembly through one or more conduits.

通過網狀結構的小孔徑可防止待蒸發的材料掉落通過網狀結構，儘管其小孔徑大於待蒸發的材料的平均粒徑，但是仍然可以防止粉末通過。另一方面，蒸氣可自由地穿過網狀結構。在變成氣態之前，即在昇華之前，液化的材料將通過毛細力被吸入網狀結構中。The small pore size of the network structure can prevent the material to be evaporated from falling through the network structure. Although the small pore size is larger than the average particle size of the material to be evaporated, the powder can still be prevented from passing through. On the other hand, vapor can freely pass through the mesh structure. Before becoming gaseous, that is, before sublimation, the liquefied material will be sucked into the network structure by capillary force.

根據一些實施例的其他方面，其可與本發明描述的其他實施例結合，本發明描述的蒸發設備，例如相對於圖1至圖3以及在獨立項和附屬項中的特徵和細節，可以與如圖7所示的設置結合。According to other aspects of some embodiments, which can be combined with other embodiments described in the present invention, the evaporation device described in the present invention, for example, with respect to the features and details in FIGS. The settings shown in Figure 7 are combined.

術語“實質上水平的方向”或“實質上水平的”可以理解為笛卡爾坐標系在x方向上的延伸。換句話說，這些術語可以理解為相對於垂直方向成90°角±10°的延伸。術語“實質上垂直的方向”或“實質上垂直的”可以理解為笛卡爾坐標系在y方向上的延伸。換句話說，這些術語可以理解為相對於水平方向成90°角±10°的延伸。The term "substantially horizontal direction" or "substantially horizontal" can be understood as the extension of the Cartesian coordinate system in the x direction. In other words, these terms can be understood as extending at an angle of ±10° at 90° with respect to the vertical. The term "substantially vertical direction" or "substantially vertical" can be understood as the extension of the Cartesian coordinate system in the y direction. In other words, these terms can be understood as extending at an angle of ±10° with respect to the horizontal direction.

根據一實施例，可以通過磁性保持裝置將網狀結構120設置在容器內。磁性保持裝置可以位於容器的外部，其中磁力指向容器的內部和網狀結構。網狀結構在容器內的位置可以根據容器中材料的填充高度而變化。According to an embodiment, the mesh structure 120 may be arranged in the container by a magnetic holding device. The magnetic holding device may be located on the outside of the container, where the magnetic force is directed to the inside of the container and the mesh structure. The position of the mesh structure in the container can vary according to the filling height of the material in the container.

根據本發明描述的實施例，容器105可包括壁，其提供容器的內部區域和外部區域。外部加熱單元115可以設置在外部區域。外部加熱單元115用以加熱容器，以便於為待沉積的材料提供溫度梯度。例如，與遠離網格的位置相比，溫度梯度可導致在靠近網格的位置處具有更高的溫度。根據一些實施例，外部加熱單元115可以與容器105的壁接觸。根據一些實施例，其可與本發明描述的其他實施例結合，提供一屏蔽裝置112。外部加熱單元115可以鄰近或設置在屏蔽裝置112處。屏蔽裝置可以包括一個或多個，例如兩個或多個屏蔽。屏蔽裝置112用以減少容器和外部加熱單元的熱輻射，例如朝向圍繞容器的外部區域的熱輻射。根據本發明描述的實施例，容器可以至少部分地由輻射屏蔽118圍繞。例如，輻射屏蔽118可以設置在屏蔽裝置周圍。According to the described embodiment of the invention, the container 105 may include walls that provide the inner and outer areas of the container. The external heating unit 115 may be provided in an external area. The external heating unit 115 is used to heat the container so as to provide a temperature gradient for the material to be deposited. For example, a temperature gradient can result in a higher temperature at a location close to the grid compared to a location far from the grid. According to some embodiments, the external heating unit 115 may be in contact with the wall of the container 105. According to some embodiments, it can be combined with other embodiments described in the present invention to provide a shielding device 112. The external heating unit 115 may be adjacent to or provided at the shielding device 112. The shielding device may include one or more, for example, two or more shields. The shielding device 112 is used to reduce the heat radiation of the container and the external heating unit, for example, the heat radiation toward the outer area surrounding the container. According to the described embodiment of the invention, the container may be at least partially surrounded by a radiation shield 118. For example, the radiation shield 118 may be provided around the shielding device.

根據一些實施例，其可與本發明描述的任何其他實施例結合，可以將真空施加至蒸發設備。例如，蒸發設備可以設置在真空室中。真空產生模組，例如一個或多個真空泵，可以設置在真空室，以在真空室中產生真空狀態。可以根據執行的製程來調整真空狀態。According to some embodiments, which can be combined with any other embodiments described in the present invention, a vacuum can be applied to the evaporation device. For example, the evaporation device may be provided in a vacuum chamber. A vacuum generating module, such as one or more vacuum pumps, may be arranged in the vacuum chamber to generate a vacuum state in the vacuum chamber. The vacuum state can be adjusted according to the executed process.

有利地，本發明提供的蒸發設備可改善待沉積的材料的蒸發。特別地，可以在容器中的材料的表面處提供材料的蒸發。在大量材料的表面處具有蒸發的材料將有利於蒸氣向分配組件的逸出。進一步有利地，由於過度的溫度暴露或由於長時間的溫度暴露，可以防止在容器內部的材料的分解。因此，減少了材料的總需求，同時增加了材料的蒸發效率。因此，降低了製造成本以及降低了蒸發能量。Advantageously, the evaporation device provided by the present invention can improve the evaporation of the material to be deposited. In particular, evaporation of the material can be provided at the surface of the material in the container. Having evaporated material at the surface of the bulk material will facilitate the escape of vapor to the distribution assembly. Further advantageously, due to excessive temperature exposure or due to long temperature exposure, the decomposition of the material inside the container can be prevented. Therefore, the total demand for materials is reduced while increasing the evaporation efficiency of the materials. Therefore, the manufacturing cost is reduced and the evaporation energy is reduced.

第2圖繪示了根據本發明描述的實施例的蒸發設備的部分放大圖。根據本發明描述的實施例，網狀結構120可以是導熱的。例如，網狀結構可以由導熱材料製成。網狀結構120可以由包括低熱質量的材料製成。例如，網狀結構120可以由碳製成，更具體地由玻璃碳製成。附加地或可替代地，網狀結構120可以包括鍍膜表面。鍍膜表面可以是碳化矽塗層。塗層厚度可以在1微米（μm）至30微米的範圍內，特別是5微米至20微米，更特別地10微米至15微米。提供低熱質量的網狀結構的材料能夠實現網狀結構的快速加熱和快速冷卻。Figure 2 illustrates a partially enlarged view of the evaporation device according to the described embodiment of the present invention. According to the described embodiment of the present invention, the mesh structure 120 may be thermally conductive. For example, the mesh structure can be made of a thermally conductive material. The mesh structure 120 may be made of a material including a low thermal mass. For example, the mesh structure 120 may be made of carbon, more specifically, glassy carbon. Additionally or alternatively, the mesh structure 120 may include a coated surface. The coating surface can be a silicon carbide coating. The coating thickness can be in the range of 1 micrometer (μm) to 30 micrometers, particularly 5 micrometers to 20 micrometers, more particularly 10 micrometers to 15 micrometers. The material that provides the mesh structure of low thermal mass can realize rapid heating and rapid cooling of the mesh structure.

根據本發明描述的實施例，網狀結構可以是多孔的。 換句話說，網狀結構可以包括開口以允許蒸發的材料逸出。網狀結構的開口區域可以在50％至99％的範圍內，特別是在70％至99％的範圍內，更特別地在90％至99％的範圍內。如本發明所使用的術語“開口區域”可以理解為網狀結構的多孔區域。例如，網狀結構可以包括97％的開口區域。According to the described embodiments of the present invention, the network structure may be porous. In other words, the mesh structure may include openings to allow evaporated material to escape. The open area of the mesh structure may be in the range of 50% to 99%, particularly in the range of 70% to 99%, more particularly in the range of 90% to 99%. The term "open area" as used in the present invention can be understood as a porous area with a network structure. For example, the mesh structure may include 97% of the open area.

根據實施例，蒸發設備可以包括冷卻網122。特別地，容器105可以包括冷卻網122。冷卻網122可以設置於網狀結構120附近。冷卻網可以特別地由熱導率> 20 W / m°K的材料製成。特別地，當材料在蒸發之前液化時，蒸發設備可以包括冷卻網。冷卻網可以實質上水平地設置在容器105中的網狀結構120附近。例如，可以將冷卻網設置在網狀結構120和容器105的底部之間。特別地，冷卻網可被間隔開，離網狀結構120約0.1毫米至10公分（cm）的範圍內，特別是在約1毫米至5公分的範圍內，更特別地在約2毫米至1公分的範圍內。According to an embodiment, the evaporation device may include a cooling net 122. In particular, the container 105 may include a cooling net 122. The cooling net 122 may be arranged near the net structure 120. The cooling net can in particular be made of a material with a thermal conductivity> 20 W/m°K. In particular, when the material is liquefied before evaporation, the evaporation device may include a cooling net. The cooling net may be arranged substantially horizontally near the net structure 120 in the container 105. For example, a cooling net may be provided between the net structure 120 and the bottom of the container 105. In particular, the cooling nets may be spaced apart from the net-like structure 120 in the range of about 0.1 mm to 10 centimeters (cm), particularly in the range of about 1 mm to 5 cm, more particularly in the range of about 2 mm to 1 mm. Within centimeters.

蒸發設備可以包括例如溫度測量單元。例如溫度感測器，用以測量網狀結構120和/或冷卻網122處的待蒸發的材料的溫度。The evaporation device may include, for example, a temperature measurement unit. For example, a temperature sensor is used to measure the temperature of the material to be evaporated at the mesh structure 120 and/or the cooling mesh 122.

有利地，溫度測量單元允許對在網狀結構處待蒸發的材料進行精確的溫度測量，因網狀結構提供與材料表面的緊密熱接觸，使得材料被快速加熱。另外，網狀結構允許連續地傳遞維持蒸發所需的蒸發能量潛熱，以克服在真空中待蒸發的材料之非常低的導熱率。Advantageously, the temperature measurement unit allows accurate temperature measurement of the material to be evaporated at the mesh structure, since the mesh structure provides close thermal contact with the surface of the material, so that the material is rapidly heated. In addition, the mesh structure allows the continuous transfer of the latent heat of evaporation energy required to maintain the evaporation to overcome the very low thermal conductivity of the material to be evaporated in vacuum.

由於蒸發的材料和/或液化的材料可以在位於網和冷卻網之間的冷卻材料中固化，因此可以防止被引導到容器或液化材料中的蒸氣分子軌跡在冷卻網結構上冷凝。冷卻網和網狀結構之間的冷卻固化材料可以做為冷卻網的消耗性屏蔽，以使得冷凝物永遠不會聚集在冷卻網上。Since the evaporated material and/or liquefied material can be solidified in the cooling material located between the net and the cooling net, it is possible to prevent the vapor molecular trajectory guided into the container or the liquefied material from condensing on the cooling net structure. The cooling solidified material between the cooling net and the mesh structure can be used as a consumable shield for the cooling net, so that condensate will never collect on the cooling net.

根據一些實施例，網狀結構和冷卻網可以提供條件，其中僅網狀結構的自由表面上的有機材料的薄部分暴露於足以蒸發的溫度。有利地，可在材料和網狀結構之間建立擴大的相互作用的表面積。例如，當網狀結構由玻璃碳泡沫製成時，每立方厘米泡沫體積可以有65平方公分（cm2 ）的表面積。有機材料的薄部分可以至少部分地滲透到網狀結構中，特別是當有機材料在昇華之前液化並且可以通過毛細作用輸送到泡沫結構中時。因此，加熱的網狀結構與有機材料之間的相互作用的表面面積遠大於有機材料的自由表面面積。擴大的相互作用的表面面積與網狀結構> 90％的開口面積結合，可以針對網狀結構的給定溫度優化蒸發速率，並且可以允許大多數產生的蒸氣分子向分配組件自由逸出。因此，透過在有機材料的自由表面處的較薄材料深度以及網狀結構，蒸發的材料可以具有相對不受阻礙的逸出路徑。According to some embodiments, the net structure and the cooling net may provide conditions in which only the thin portion of the organic material on the free surface of the net structure is exposed to a temperature sufficient for evaporation. Advantageously, an enlarged interaction surface area can be established between the material and the network structure. For example, when the network structure is made of glassy carbon foam, there can be 65 square centimeters (cm 2 ) of surface area per cubic centimeter of foam volume. The thin portion of the organic material can at least partially penetrate into the network structure, especially when the organic material is liquefied before sublimation and can be transported into the foam structure by capillary action. Therefore, the surface area of the interaction between the heated network structure and the organic material is much larger than the free surface area of the organic material. The expanded interaction surface area combined with the opening area of the mesh structure> 90% can optimize the evaporation rate for a given temperature of the mesh structure and allow most of the generated vapor molecules to escape freely to the distribution assembly. Therefore, through the thinner material depth and network structure at the free surface of the organic material, the evaporated material can have a relatively unimpeded escape path.

進一步有利的是，容器的質量和材料的質量與設備的產熱和蒸發部件分離。這種分離允許通過傳遞或中斷向網狀結構傳遞能量而在數秒內引發和中斷蒸發。容器的質量和大部分材料的質量不處於高溫(即不處於蒸發溫度)。蒸發的中斷不受容器溫度降低和容器內粉末溫度降低的限制。由於使材料蒸發的網的質量較小，因此網的溫度可以相對快地降低至低於蒸發溫度。這具有以下優點：提高了材料利用效率，並且減少了清潔和更換蒸發設備的部件所需的時間。It is further advantageous that the quality of the container and the quality of the material are separated from the heat generation and evaporation parts of the device. This separation allows the initiation and interruption of evaporation within seconds by transferring or interrupting the transfer of energy to the mesh structure. The mass of the container and the mass of most materials are not at high temperature (that is, not at the evaporation temperature). The interruption of evaporation is not limited by the decrease in the temperature of the container and the decrease in the temperature of the powder in the container. Since the quality of the web that evaporates the material is small, the temperature of the web can be lowered relatively quickly to below the evaporation temperature. This has the following advantages: it improves material utilization efficiency and reduces the time required to clean and replace parts of the evaporation equipment.

根據本發明描述的實施例，蒸發設備可以包括過渡區域，以將容器105與分配組件260連接。過渡區域或分配組件可包括內部輻射屏蔽152。分配組件可以被加熱至高於蒸發溫度，以防止蒸發的材料凝結在分配組件的壁上。例如，分配組件的溫度可以高於容器的溫度。內部輻射屏蔽可用以使從分配組件到容器內部的熱輻射或設置在容器內部的材料（即蒸發設備內部的材料）的熱輻射最小化。According to the described embodiment of the present invention, the evaporation device may include a transition area to connect the container 105 with the dispensing assembly 260. The transition area or distribution component may include an internal radiation shield 152. The distribution assembly can be heated above the evaporation temperature to prevent the evaporated material from condensing on the walls of the distribution assembly. For example, the temperature of the dispensing assembly may be higher than the temperature of the container. The internal radiation shielding can be used to minimize the heat radiation from the dispensing assembly to the inside of the container or the heat radiation of the material provided inside the container (ie, the material inside the evaporation device).

有利地，內部輻射屏蔽152防止由分配組件產生的熱進入蒸發設備。如此一來，防止了長時間溫度高於蒸發溫度。 因此，可以有效地防止或避免待蒸發的材料分解。Advantageously, the internal radiation shield 152 prevents heat generated by the distribution assembly from entering the evaporation device. In this way, the temperature is prevented from being higher than the evaporation temperature for a long time. Therefore, the decomposition of the material to be evaporated can be effectively prevented or avoided.

第3圖繪示了根據本發明描述的實施例的蒸發設備。蒸發設備可包括容器105和加熱組件110。加熱組件可以包括外部加熱單元115和網狀結構120。蒸發設備可包括施力單元125。蒸發設備可連接至分配組件260。分配組件可包括內部輻射屏蔽152。蒸發設備可包括材料供給系統130。Figure 3 illustrates the evaporation device according to the described embodiment of the invention. The evaporation device may include a container 105 and a heating assembly 110. The heating assembly may include an external heating unit 115 and a mesh structure 120. The evaporation device may include a force applying unit 125. The evaporation device may be connected to the distribution assembly 260. The distribution assembly may include an internal radiation shield 152. The evaporation device may include a material supply system 130.

根據實施例，材料供給系統可以與容器105協作以在容器中保持基本恆定的填充高度。因此，容器中的材料填充高度可以保持不變以維持恆定的容器幾何。有利地，這可以導致更穩定的製造條件。根據實施例，材料供給裝置136可以包括恆力加載元件。恆力加載元件可用以在恆定力下保持網狀結構120與材料表面接觸。材料供給裝置可以在材料供給出口處連接到容器。此外，材料供給系統可允許增加維護期間的蒸發時間。According to an embodiment, the material supply system may cooperate with the container 105 to maintain a substantially constant filling height in the container. Therefore, the filling height of the material in the container can be kept constant to maintain a constant container geometry. Advantageously, this can lead to more stable manufacturing conditions. According to an embodiment, the material supply device 136 may include a constant force loading element. The constant force loading element can be used to keep the mesh structure 120 in contact with the surface of the material under a constant force. The material supply device may be connected to the container at the material supply outlet. In addition, the material supply system may allow for increased evaporation time during maintenance.

材料供給系統，特別是材料供給裝置可提供材料從材料儲存器到容器的材料供給速率。例如，材料供給裝置通過指向容器的力作用在材料上來推進材料，而產生供給速率或供給速度。供給速率或供給速度可根據容器中材料的填充高度來調整。例如，控制器可調節供給速度。The material supply system, especially the material supply device, can provide the material supply rate from the material storage to the container. For example, the material supply device pushes the material by a force directed to the container acting on the material, thereby generating a supply rate or a supply speed. The feed rate or feed rate can be adjusted according to the filling height of the material in the container. For example, the controller can adjust the feed rate.

根據實施例，材料供給裝置136的材料供給出口的橫截面面積可以小於容器105的橫截面面積。這對於補償供給速率或供給速度的變化是有益的。進一步有利地，即使材料供給速率有變化，材料填充高度的變化也可以最小化。材料供給出口可被稱為來自材料供給系統的導管的出口，此導管連接到容器。According to an embodiment, the cross-sectional area of the material supply outlet of the material supply device 136 may be smaller than the cross-sectional area of the container 105. This is useful for compensating for changes in the supply rate or supply speed. Further advantageously, even if there is a change in the material supply rate, the change in the material filling height can be minimized. The material supply outlet may be referred to as the outlet from the conduit of the material supply system, which conduit is connected to the container.

根據實施例，材料供給系統130可以連續地向容器提供材料。材料供給系統130可包括材料儲存器132和材料供給裝置136。材料供給系統130，例如材料供給裝置136可連接到容器105。例如，材料供給裝置136可將材料儲存器132連接到容器105。材料供給系統130可將待蒸發的材料提供到容器105。材料供給系統可以與容器105一起設置在真空室內或設置在真空室外。According to an embodiment, the material supply system 130 may continuously supply materials to the container. The material supply system 130 may include a material storage 132 and a material supply device 136. A material supply system 130 such as a material supply device 136 may be connected to the container 105. For example, the material supply device 136 may connect the material reservoir 132 to the container 105. The material supply system 130 may supply the material to be evaporated to the container 105. The material supply system may be installed in the vacuum chamber together with the container 105 or outside the vacuum chamber.

有利地，材料供給系統位於真空室外部的一部分可易於重新填充材料儲存器。材料供給系統中的材料可保持在真空狀態下，並且可在不中斷容器中的蒸發或不中斷沉積製程的情況下完成重新填充程序。Advantageously, a part of the material supply system located outside the vacuum chamber can easily refill the material reservoir. The material in the material supply system can be kept in a vacuum state, and the refilling process can be completed without interrupting the evaporation in the container or the deposition process.

根據本發明描述的實施例，蒸發設備可以是連續系統。如本發明所使用的“連續系統”可以被理解為可以確保材料連續供應的系統，這意味著可以將材料供給到發生材料蒸發的容器中。此外，可以理解的是，連續系統也可包括材料供給系統的重新填充。附加地或可替代地，“連續系統”可以被理解為蒸發材料的系統，其中材料為例如長時間沉積在基板上且不被中斷的材料。According to the described embodiment of the present invention, the evaporation device may be a continuous system. A "continuous system" as used in the present invention can be understood as a system that can ensure continuous supply of materials, which means that materials can be supplied into a container where evaporation of materials occurs. In addition, it is understood that the continuous system may also include refilling of the material supply system. Additionally or alternatively, a "continuous system" may be understood as a system that evaporates material, where the material is, for example, a material that is deposited on a substrate for a long time without being interrupted.

根據本發明描述的實施例，蒸發設備可以是連續且可再填充的蒸氣產生系統，其中僅網狀結構的自由表面處的有機材料粉末的薄截面暴露於蒸發能量，同時大部分粉末的溫度保持在遠低於有效蒸發溫度。According to the described embodiments of the present invention, the evaporation device may be a continuous and refillable vapor generation system, in which only the thin section of the organic material powder at the free surface of the network structure is exposed to the evaporation energy, while the temperature of most of the powder is maintained At much lower than the effective evaporation temperature.

鑑於以上所述，蒸發設備與網狀結構的組合僅在蒸發之前不久才將材料的溫度升高至蒸發溫度，且/或在容器和材料供給系統中使材料處於相對較低的溫度下，以允許長時間蒸發。材料可被送入系統，並且由於低溫，系統中的材料分解減少。In view of the above, the combination of the evaporation equipment and the mesh structure raises the temperature of the material to the evaporation temperature only shortly before evaporation, and/or keeps the material at a relatively low temperature in the container and material supply system to Allow a long time to evaporate. Material can be fed into the system, and due to the low temperature, the decomposition of the material in the system is reduced.

根據本發明描述的實施例，材料儲存器132可包括材料供給入口134，用以連續從材料儲存器向材料供給裝置提供材料。材料儲存器132可透過篩分元件137與材料供給入口134分開。材料供給入口134可連接到材料供給裝置136。材料供給入口134可為材料儲存器132的漏斗形部分。漏斗形有利於將材料提供給材料供給裝置。According to the described embodiment of the present invention, the material storage 132 may include a material supply inlet 134 for continuously supplying materials from the material storage to the material supply device. The material storage 132 can be separated from the material supply inlet 134 through the screening element 137. The material supply inlet 134 may be connected to the material supply device 136. The material supply inlet 134 may be a funnel-shaped part of the material storage 132. The funnel shape facilitates the supply of material to the material supply device.

根據本發明描述的實施例，篩分元件137可以是具有孔徑的篩子，此孔徑允許材料儲存器中的材料通過篩分元件137。特別地，篩分元件137可以與固體材料結合使用，更特別地，與固體材料顆粒結合使用。篩分元件可用以允許在材料供給入口處之物料的填充高度恆定。有利地，篩分元件137可調節從材料儲存器流到材料儲存器的材料供給入口的材料的量。篩分元件可以控制材料的供給，其材料接著經由材料供給裝置136輸送到容器105。進一步有利地，輸送和再填充材料供給系統的製程彼此分離。這允許再填充和儲存材料獨立於供給材料。進一步有利地，即使在短期和/或長期的基礎上，材料儲存器的再填充速率與容器中的蒸發速率不完全匹配，篩分元件也可以使製造條件基本保持恆定。According to the described embodiment of the present invention, the sieving element 137 may be a sieve having an aperture that allows the material in the material reservoir to pass through the sieving element 137. In particular, the sieving element 137 may be used in combination with solid materials, and more particularly, in combination with solid material particles. The screening element can be used to allow a constant filling height of the material at the material supply inlet. Advantageously, the screening element 137 can adjust the amount of material flowing from the material storage to the material supply inlet of the material storage. The sieving element can control the supply of material, which is then transported to the container 105 via the material supply device 136. It is further advantageous that the processes of the conveying and refilling material supply system are separated from each other. This allows refilling and storing materials independent of supply materials. Further advantageously, even if on a short-term and/or long-term basis, the refill rate of the material reservoir does not exactly match the evaporation rate in the container, the screening element can keep the manufacturing conditions substantially constant.

根據實施例，材料供給系統可包括再填充部138。再填充部138可連接到材料儲存器132。材料供給系統可包括安全閥140。安全閥可在再填充構造和儲存構造之間操作。安全閥140可連接再填充部138和材料儲存器132。According to an embodiment, the material supply system may include a refill part 138. The refill 138 may be connected to the material reservoir 132. The material supply system may include a safety valve 140. The safety valve can be operated between a refill configuration and a storage configuration. The safety valve 140 may connect the refilling part 138 and the material storage 132.

根據本發明描述的實施例，安全閥140可為分流蝶閥。安全閥可包括第一段和第二段。第一段可設置有材料儲存器。安全閥的第二段可以是可移動的。第一段可包括密封單元的第一部分，而第二段可包括在安全閥內的密封單元的第二部分。當第一段和第二段彼此接觸時，安全閥可以處於開啟位置。特別地，當密封單元的第一部分和第二部分結合在一起並且圍繞密封單元的軸旋轉時，安全閥可以處於開啟位置。當第一段和第二段彼此間隔開時或者當密封單元的第一部分和第二部分彼此間隔開時，安全閥可以處於關閉位置。According to the described embodiment of the present invention, the safety valve 140 may be a diverting butterfly valve. The safety valve may include a first section and a second section. The first section can be provided with material storage. The second section of the safety valve can be movable. The first section may include the first part of the sealing unit, and the second section may include the second part of the sealing unit within the safety valve. When the first section and the second section are in contact with each other, the safety valve may be in an open position. In particular, when the first part and the second part of the sealing unit are combined and rotated around the axis of the sealing unit, the safety valve may be in the open position. When the first section and the second section are spaced apart from each other or when the first part and the second part of the sealing unit are spaced apart from each other, the safety valve may be in the closed position.

根據本發明描述的實施例，以及在重新填充材料儲存器期間，可以將材料提供至再填充部138。安全閥可處於關閉位置。材料可能到達安全閥的第一段。在提供材料後，可關閉再填充部。再填充部可為真空。安全閥的第一段可朝安全閥的第二段移動，並且可以與安全閥的第二段匯集在一起。這允許安全閥的密封單元的第一部分和第二部分被接合。密封單元可以繞著軸移動。密封單元的軸可以垂直於安全閥的對稱軸。例如，密封單元在1至90°的範圍內繞軸旋轉，特別是在45至90°的範圍內旋轉。當密封單元旋轉時，在再填充部中提供的材料可以輸送到材料儲存器，即材料儲存器的儲存部分。According to the described embodiment of the present invention, and during the refilling of the material reservoir, the material may be provided to the refill 138. The safety valve can be in the closed position. The material may reach the first section of the safety valve. After the material is provided, the refill section can be closed. The refill part may be a vacuum. The first section of the safety valve can move toward the second section of the safety valve and can be combined with the second section of the safety valve. This allows the first part and the second part of the sealing unit of the safety valve to be engaged. The sealing unit can move around the shaft. The axis of the sealing unit may be perpendicular to the symmetry axis of the safety valve. For example, the sealing unit rotates around the axis in the range of 1 to 90°, particularly in the range of 45 to 90°. When the sealing unit rotates, the material provided in the refilling part can be transported to the material storage, that is, the storage part of the material storage.

有利地，這種安全閥允許再填充材料供給系統而無需中斷材料供給系統的真空。進一步有利地，材料供給系統獨立於容器，但是允許將材料連續地供給到容器，並允許在不中斷沉積製程的情況下再填充材料儲器。Advantageously, such a safety valve allows the material supply system to be refilled without interrupting the vacuum of the material supply system. Further advantageously, the material supply system is independent of the container, but allows the material to be continuously supplied to the container and allows the material reservoir to be refilled without interrupting the deposition process.

進一步有利的是，本發明提供的蒸發設備允許連續沉積製程，其中此沉積製程的停止（例如用以維護）是多餘的，因為蒸發和供給材料是相互分離的。即使必須停止此過程，本發明提供的蒸發設備具有在幾秒鐘內停止蒸發的同時減少或防止材料損失的優點。由於僅將網狀結構加熱到允許材料蒸發的溫度，因此可以通過僅將網狀結構的溫度下調至不足以蒸發材料的溫度來中斷蒸發過程。It is further advantageous that the evaporation device provided by the present invention allows a continuous deposition process, where the stopping of the deposition process (for example, for maintenance) is superfluous because the evaporation and supply materials are separated from each other. Even if this process must be stopped, the evaporation device provided by the present invention has the advantage of reducing or preventing material loss while stopping the evaporation within a few seconds. Since the net-like structure is only heated to a temperature that allows the material to evaporate, the evaporation process can be interrupted by only lowering the temperature of the net-like structure to a temperature insufficient to evaporate the material.

第4圖繪示根據本發明描述之實施例的沉積組件。沉積組件200可包括蒸發設備100，特別是如關於第1圖至第3圖所描述的蒸發設備。蒸發設備用以蒸發待沉積在基板上的材料。此外，沉積組件200包括分配組件260，其可為細長管。分配組件可包括一個或多個出口。例如，一個或多個出口可以是噴嘴。通常，噴嘴用以將蒸發材料的羽流引向基板。分配組件260可與蒸發設備100流體連通。分配組件可包括三個側壁。Figure 4 shows a deposition assembly according to the described embodiment of the invention. The deposition assembly 200 may include an evaporation device 100, particularly the evaporation device as described with respect to FIGS. 1 to 3. The evaporation equipment is used to evaporate the material to be deposited on the substrate. In addition, the deposition assembly 200 includes a distribution assembly 260, which may be an elongated tube. The dispensing assembly may include one or more outlets. For example, one or more outlets may be nozzles. Generally, the nozzle is used to direct the plume of evaporated material to the substrate. The distribution assembly 260 may be in fluid communication with the evaporation device 100. The distribution assembly may include three side walls.

如第4途中之示例所示，分配組件260可設計成三角形。在兩個或更多個分配組件彼此相鄰設置的情況下，有利於分配組件的形成三角形形狀。特別地，分配組件260的三角形形狀使得相鄰的分配組件的出口彼此盡可能靠近。這可改善來自不同分配組件的不同材料的混合情況，例如兩種、三種甚至更多種不同材料的共同蒸發的情況。根據實施例，分配組件可具有另一形狀，諸如圓形、橢圓形或其他多邊形。As shown in the example in the fourth way, the distribution component 260 can be designed as a triangle. In the case where two or more distribution components are arranged adjacent to each other, it is advantageous for the distribution components to form a triangular shape. In particular, the triangular shape of the distribution assembly 260 makes the outlets of adjacent distribution assemblies as close as possible to each other. This can improve the mixing of different materials from different distribution components, such as the co-evaporation of two, three or more different materials. According to an embodiment, the dispensing assembly may have another shape, such as a circular shape, an oval shape, or other polygonal shapes.

根據實施例，可以提供加熱單元263以加熱分配組件。 加熱單元可以被安裝或附接到分配組件的三個側壁的全部或僅一部分。加熱單元263可以類似於蒸發設備的外部加熱單元115。加熱單元可向分配組件260提供恆定溫度，此恆定溫度高於提供給蒸發設備100的最高溫度。According to an embodiment, a heating unit 263 may be provided to heat the distribution assembly. The heating unit may be installed or attached to all or only a part of the three side walls of the distribution assembly. The heating unit 263 may be similar to the external heating unit 115 of the evaporation apparatus. The heating unit may provide a constant temperature to the distribution assembly 260, which is higher than the highest temperature provided to the evaporation device 100.

因此，分配組件260可以被加熱到一定溫度，使得由蒸發設備提供的蒸發材料不會在分配組件260的壁的內部冷凝。根據實施例，沉積組件200，尤其是分配組件260可包括如關於第2圖和第3圖所描述的內部輻射屏蔽。Therefore, the distribution assembly 260 may be heated to a certain temperature, so that the evaporation material provided by the evaporation device does not condense inside the wall of the distribution assembly 260. According to an embodiment, the deposition assembly 200, especially the distribution assembly 260, may include an internal radiation shield as described in relation to FIGS. 2 and 3.

如第4圖中之示例所示，沉積組件200可包括屏蔽裝置266，特別是整形器屏蔽裝置，以限制提供給基板的蒸發材料的分配錐。特別地，屏蔽裝置可用以減少朝向沉積區域的熱輻射。此外，屏蔽裝置可通過冷卻裝置267冷卻。例如，冷卻元件267可安裝到屏蔽裝置266的背面，並且可包括一個或多個冷卻通道或用於提供冷卻流體的導管。As shown in the example in Figure 4, the deposition assembly 200 may include a shielding device 266, in particular a shaper shielding device, to limit the distribution cone of the evaporated material provided to the substrate. In particular, the shielding device can be used to reduce heat radiation towards the deposition area. In addition, the shielding device can be cooled by the cooling device 267. For example, the cooling element 267 may be mounted to the back of the shielding device 266, and may include one or more cooling channels or conduits for supplying cooling fluid.

因此，分配組件可為線性分配蓮蓬頭，例如其中設置有多個開口（或細長的狹縫）。此外，分配組件通常可以具有外殼、中空空間或管道，在其中提供或引導蒸發的材料，例如從蒸發坩堝引導至基板。根據一些實施例，其可以與本發明描述的任何其他實施例結合，分配組件的長度可以至少對應於待沉積的基板的高度。特別地，分配組件的長度可以比待沉積的基板的高度長至少10％或甚至20％。例如，分配組件的長度可以是1.3公尺（m）或以上，例如2.5公尺或以上。因此，可以在基板的上端和/或基板的下端提供均勻的沉積。根據另一種配置，分配組件可包括一個或多個可沿垂直軸設置的點源。Therefore, the distribution assembly may be a linear distribution showerhead, for example, a plurality of openings (or elongated slits) are provided therein. In addition, the distribution assembly may generally have a housing, a hollow space or a pipe in which the evaporated material is provided or guided, for example from an evaporation crucible to the substrate. According to some embodiments, which may be combined with any other embodiments described in the present invention, the length of the distribution assembly may at least correspond to the height of the substrate to be deposited. In particular, the length of the distribution assembly may be at least 10% or even 20% longer than the height of the substrate to be deposited. For example, the length of the dispensing assembly may be 1.3 meters (m) or more, such as 2.5 meters or more. Therefore, uniform deposition can be provided at the upper end of the substrate and/or the lower end of the substrate. According to another configuration, the distribution assembly can include one or more point sources that can be positioned along a vertical axis.

根據本發明描述的實施例，多個沉積組件可被組合。 例如，組合兩個或更多個沉積組件。多個沉積組件可包括根據本發明任何實施例所描述的多個蒸發設備。例如，多個沉積組件可包括兩個、三個、四個或更多個蒸發設備，每個蒸發設備可以連接至分配組件。例如，三個對齊的蒸發設備可連接到三個分配組件。According to the described embodiments of the present invention, a plurality of deposition components may be combined. For example, combining two or more deposition components. The plurality of deposition assemblies may include a plurality of evaporation devices described according to any embodiment of the present invention. For example, the plurality of deposition assemblies may include two, three, four or more evaporation devices, and each evaporation device may be connected to the distribution assembly. For example, three aligned evaporation devices can be connected to three distribution assemblies.

第5圖繪示根據本發明描述之實施例的沉積設備。沉積設備500可用以沉積在基板10上蒸發的材料。沉積設備500包括沉積室570，特別是真空沉積室。在如第5圖所示的沉積設備500的實施例中，沉積設備500包括根據本發明任何實施例所描述的在真空沉積室中之沉積或沉積組件200，和用於沉積蒸發的沉積材料的分配組件220。另外，沉積組件可包括如本發明實施例中所描述的蒸發設備100和分配組件220。分配組件220可進一步包括加熱單元。Figure 5 shows a deposition apparatus according to the described embodiment of the invention. The deposition device 500 may be used to deposit the evaporated material on the substrate 10. The deposition apparatus 500 includes a deposition chamber 570, particularly a vacuum deposition chamber. In the embodiment of the deposition apparatus 500 shown in FIG. 5, the deposition apparatus 500 includes a deposition or deposition assembly 200 in a vacuum deposition chamber described in any embodiment of the present invention, and a deposition material for depositing evaporated Assignment component 220. In addition, the deposition assembly may include the evaporation apparatus 100 and the distribution assembly 220 as described in the embodiment of the present invention. The distribution assembly 220 may further include a heating unit.

本發明所述的實施例，特別有關於有機材料的沉積，例如用於在大面積基板上製造有機發光二極管顯示器。根據一些實施例，大面積的基板或支撐一個或多個基板的載體的尺寸可以為0.5平方公尺（m2 ）或更大，特別是1平方公尺或更大。例如，沉積設備可適於處理大面積基板，例如GEN 5的基板，其對應於約1.4平方公尺的基板（1.1m×1.3m），GEN 7.5，其對應於約4.29平方公尺的基板（1.95m×2.2m），GEN 8.5，其對應於約5.7平方公尺的基板（2.2m×2.5m），或甚至GEN 10，其對應於約8.7平方公尺的基板（2.85m×3.05m）。甚至更大的生產，例如GEN 11和GEN 12以及相應的基板面積也可以類似地實現。例如，對於有機發光二極管顯示器的製造，可以通過用於蒸發材料的設備來蒸發並鍍膜包括GEN 6在內的上述基板的生產的一半尺寸。上述之基板的一半尺寸是由某些製程在整個基板尺寸上運行而產生，而後續製程在先前處理過的一半基板上執行。The embodiments of the present invention are particularly related to the deposition of organic materials, for example, for manufacturing an organic light-emitting diode display on a large-area substrate. According to some embodiments, the size of a large-area substrate or a carrier supporting one or more substrates may be 0.5 square meters (m 2 ) or more, particularly 1 square meter or more. For example, the deposition equipment may be suitable for processing large-area substrates, such as GEN 5 substrates, which correspond to approximately 1.4 square meters of substrates (1.1 m×1.3 m), and GEN 7.5, which corresponds to approximately 4.29 square meters of substrates ( 1.95m×2.2m), GEN 8.5, which corresponds to a substrate of about 5.7 square meters (2.2m×2.5m), or even GEN 10, which corresponds to a substrate of about 8.7 square meters (2.85m×3.05m) . Even larger productions such as GEN 11 and GEN 12 and the corresponding substrate area can be similarly achieved. For example, for the manufacture of organic light emitting diode displays, a device for evaporating materials can be used to evaporate and coat half the size of the production of the above-mentioned substrates including GEN6. The above-mentioned half of the size of the substrate is generated by certain processes running on the entire substrate size, and subsequent processes are performed on half of the substrate that has been previously processed.

根據本發明的實施例，其可以與本發明描述的其他實施例結合，基板的厚度可以為0.1毫米（mm）至1.8毫米，並且基板的保持裝置可以適合於這種基板的厚度。基板厚度可以為大約0.9毫米或以下，例如0.5毫米或0.3毫米，並且保持裝置適於這種基板厚度。通常，基板可以由適合於材料沉積的材料製成。例如，基板可以由選自以下的材料製成：玻璃（例如鈉鈣玻璃、硼矽酸鹽玻璃等）、金屬、聚合物、陶瓷、複合材料、碳纖維材料或任何其他材料或其可被沉積製程所鍍膜之材料的組合。According to an embodiment of the present invention, which can be combined with other embodiments described in the present invention, the thickness of the substrate may be 0.1 millimeters (mm) to 1.8 millimeters, and the substrate holding device may be suitable for the thickness of such a substrate. The substrate thickness may be about 0.9 mm or less, such as 0.5 mm or 0.3 mm, and the holding device is suitable for such substrate thickness. Generally, the substrate can be made of a material suitable for material deposition. For example, the substrate can be made of a material selected from the group consisting of glass (such as soda lime glass, borosilicate glass, etc.), metal, polymer, ceramic, composite material, carbon fiber material, or any other material or its deposition process The combination of materials to be coated.

根據本發明描述的實施例，可以以預定的圖案將材料沉積在基板上，例如通過使用遮罩諸如具有多個開口的精細金屬遮罩（Fine Metal Mask; FMM）。可以在基板上沉積多個像素。蒸發材料的其他示例包括以下一種或多種：銦錫氧化物（ITO）、非親型二型（四分子） （NPD）、羥基喹啉鋁（Alq3）、喹吖酮（Quinacridone）和金屬，例如銀或鎂。According to the described embodiments of the present invention, a material can be deposited on a substrate in a predetermined pattern, for example, by using a mask such as a fine metal mask (Fine Metal Mask; FMM) having multiple openings. Multiple pixels can be deposited on the substrate. Other examples of evaporation materials include one or more of the following: indium tin oxide (ITO), non-philic type 2 (quad) (NPD), aluminum quinolate (Alq3), quinacridone and metals, such as Silver or magnesium.

根據一些實施例，其可與本發明描述的任何其他實施例結合，沉積室可以是真空沉積室。在本發明中，本文所述之“真空沉積室”可以理解為用以於真空沉積的室。本文所述之術語“真空”可以理解為具有小於例如10毫巴（mbar）的真空壓力的技術真空。通常，本文所述的真空室中的壓力可以在10-5 毫巴與約10-8 毫巴之間，更通常在10-5 毫巴與10-7 毫巴之間，甚至更通常在約10-6 毫巴與約10-7 毫巴之間。According to some embodiments, which may be combined with any other embodiments described in the present invention, the deposition chamber may be a vacuum deposition chamber. In the present invention, the "vacuum deposition chamber" described herein can be understood as a chamber used for vacuum deposition. The term "vacuum" described herein can be understood as a technical vacuum having a vacuum pressure of less than, for example, 10 millibars (mbar). Generally, the pressure in the vacuum chamber described herein can be between 10 -5 mbar and about 10 -8 mbar, more usually between 10 -5 mbar and 10 -7 mbar, and even more usually between about Between 10 -6 mbar and about 10 -7 mbar.

根據一些實施例，真空室中的壓力可以被認為是真空室內的蒸發材料的分壓或總壓力（當在真空室中僅有蒸發材料做為成分待沉積時，此分壓或總壓力可以大致相同）。在一些實施例中，真空室中的總壓力可以在約10-4 毫巴至約10-7 毫巴的範圍內，特別是在真空室中除了蒸發材料之外還存在第二成分的情況下（例如氣體或類似物）。According to some embodiments, the pressure in the vacuum chamber can be considered as the partial pressure or total pressure of the evaporation material in the vacuum chamber (when only the evaporation material is to be deposited in the vacuum chamber, the partial pressure or total pressure can be approximately the same). In some embodiments, the total pressure in the vacuum chamber may be in the range of about 10 -4 mbar to about 10 -7 mbar, especially when there is a second component in the vacuum chamber in addition to the vaporized material (For example, gas or similar).

如第5圖中之示例所示，沉積組件200可設置在軌道或線性引導件564上。線性引導件564可用於沉積組件200的平移運動。此外，可設置用於沉積組件200的平移運動的驅動器。特別地，可以在真空沉積室中設置用於非接觸運輸材料沉積佈置源的運輸設備。As shown in the example in FIG. 5, the deposition assembly 200 can be disposed on a track or a linear guide 564. The linear guide 564 may be used for the translational movement of the deposition assembly 200. In addition, a driver for the translational movement of the deposition assembly 200 may be provided. In particular, a transportation device for non-contact transportation of the material deposition arrangement source may be provided in the vacuum deposition chamber.

如第5圖之示例所示，沉積室570可具有閘閥565，真空沉積室可通過閘閥565連接到相鄰的路由模組或相鄰的服務模組。通常，路由模組用以將基板傳輸到另一真空沉積設備以進行進一步處理，而服務模組用以維護沉積源。特別地，閘閥允許真空密封至相鄰真空室，例如相鄰的路由模組或相鄰的服務模組，且可被打開或關閉，以將基板和/或遮罩移入或移出真空沉積設備。As shown in the example in FIG. 5, the deposition chamber 570 may have a gate valve 565, and the vacuum deposition chamber may be connected to an adjacent routing module or an adjacent service module through the gate valve 565. Generally, the routing module is used to transfer the substrate to another vacuum deposition equipment for further processing, and the service module is used to maintain the deposition source. In particular, the gate valve allows vacuum sealing to an adjacent vacuum chamber, such as an adjacent routing module or an adjacent service module, and can be opened or closed to move the substrate and/or mask into or out of the vacuum deposition equipment.

根據一些實施例，其可與本發明描述的任何其他實施例結合，可以在沉積設備中處理基板。特別地，兩個基板，例如第一基板和第二基板，可以支撐在沉積室570內之對應的輸送軌道上。此外，可以在其上設置提供遮罩563的兩個軌道。特別地，用於基板載體和/或遮罩載體的運輸軌道可以設置於另一傳輸設備，此另一傳輸設備用於載體的非接觸式運輸。According to some embodiments, which can be combined with any other embodiments described in the present invention, the substrate can be processed in a deposition apparatus. In particular, two substrates, such as the first substrate and the second substrate, may be supported on corresponding transport tracks in the deposition chamber 570. In addition, two tracks on which the mask 563 is provided may be provided. In particular, the transport track for the substrate carrier and/or the mask carrier may be provided on another transport device, which is used for non-contact transport of the carrier.

通常，將材料沉積在基板上可以包括通過相應的遮罩來遮罩基板（例如通過邊緣排除遮罩或陰影遮罩）。根據典型的實施例，遮罩設置在遮罩框架中，例如與第一基板對應的第一遮罩和與第二基板對應的第二遮罩，以將各個遮罩保持在預定位置。Generally, depositing the material on the substrate may include masking the substrate by a corresponding mask (for example, by edge exclusion mask or shadow mask). According to typical embodiments, the masks are provided in a mask frame, such as a first mask corresponding to the first substrate and a second mask corresponding to the second substrate, to maintain the respective masks at predetermined positions.

如第5圖所示，線性引導件564提供沉積組件200平移運動的方向。在沉積組件200的兩側可提供遮罩563，例如可以提供用於遮罩第一基板的第一遮罩和用於遮罩第二基板的第二遮罩。遮罩可以實質上平行於沉積組件200平移運動的方向延伸。此外，在沉積源的相對側的基板也可以實質上平行於平移運動的方向延伸。As shown in FIG. 5, the linear guide 564 provides the direction of the translational movement of the deposition assembly 200. Masks 563 may be provided on both sides of the deposition assembly 200, for example, a first mask for masking the first substrate and a second mask for masking the second substrate may be provided. The mask may extend substantially parallel to the direction of the translational movement of the deposition assembly 200. In addition, the substrate on the opposite side of the deposition source may also extend substantially parallel to the direction of the translational movement.

參照第5圖，組件支撐件561用於沉積組件200沿線性引導件564的平移運動。通常，組件支撐件561支撐設置在坩堝組件上方之蒸發設備100和分配組件220，如第5圖所示。因此，在蒸發設備中產生的蒸發的材料可以向上移動並移出分配組件的一個或多個出口。因此，如本發明所述，分配組件用以從分配組件220向基板10提供蒸發的材料，特別是蒸發的有機材料的羽流。Referring to FIG. 5, the assembly support 561 is used for the translational movement of the deposition assembly 200 along the linear guide 564. Generally, the assembly support 561 supports the evaporation device 100 and the distribution assembly 220 that are arranged above the crucible assembly, as shown in FIG. 5. Therefore, the evaporated material produced in the evaporation device can move upward and out of one or more outlets of the distribution assembly. Therefore, as described in the present invention, the distribution assembly is used to provide evaporated material, particularly a plume of evaporated organic material, from the distribution assembly 220 to the substrate 10.

第6圖繪示根據本發明描述的實施例之利用蒸發設備蒸發材料的方法600的流程圖。步驟610包括在容器105內提供溫度梯度。容器包括至少部分地設置在容器周圍的加熱組件110。加熱組件110包括外部加熱單元115和在容器105內的網狀結構120。根據本發明所述之任何實施例，可提供容器105、加熱組件110、加熱單元115和網狀結構120。FIG. 6 shows a flowchart of a method 600 for evaporating materials using an evaporation device according to an embodiment described in the present invention. Step 610 includes providing a temperature gradient within the container 105. The container includes a heating assembly 110 at least partially disposed around the container. The heating assembly 110 includes an external heating unit 115 and a mesh structure 120 in the container 105. According to any embodiment of the present invention, the container 105, the heating assembly 110, the heating unit 115 and the mesh structure 120 can be provided.

根據一些實施例，容器可以提供待沉積在基板上的材料。材料可被儲存在容器中並在容器內的網狀結構處蒸發。網狀結構可被加熱到待沉積的材料的蒸發溫度TE 。加熱單元可以提供溫度梯度，此溫度梯度包括低於待沉積的材料的蒸發溫度TE 的溫度範圍。這允許並行儲存材料和蒸發材料。According to some embodiments, the container may provide the material to be deposited on the substrate. The material can be stored in the container and evaporate at the mesh structure inside the container. The mesh structure may be heated to a material to be deposited in the evaporation temperature T E. The heating unit may provide a temperature gradient, the temperature gradient comprises a temperature range lower than the evaporation temperature of the material to be deposited T E. This allows parallel storage of material and evaporation of material.

步驟620可包括經由耦接到材料供給系統130的材料供給裝置136來供給材料。根據本發明所述的實施例，可提供材料供給系統。Step 620 may include supplying material via a material supply device 136 coupled to the material supply system 130. According to the embodiments of the present invention, a material supply system can be provided.

根據一些實施例，材料供給系統可向容器提供新鮮的材料以在網狀結構處蒸發材料。材料供給系統可用以儲存材料同時供給材料到容器。另外，材料供給系統可以允許易於再填充而不干擾供給和/或沉積製程。According to some embodiments, the material supply system may provide fresh material to the container to evaporate the material at the mesh structure. The material supply system can be used to store materials while supplying materials to the container. In addition, the material supply system may allow easy refilling without disturbing the supply and/or deposition process.

儘管前述內容係針對一些實施例，但是在不脫離基本範圍的情況下可以設計其他和進一步的實施例，並且此範圍由所附之申請專利範圍決定。Although the foregoing content is directed to some embodiments, other and further embodiments can be designed without departing from the basic scope, and the scope is determined by the scope of the attached patent application.

特別地，此書面描述使用示例（包括最佳模式）來揭露本發明，並且使本領域的任何技術人員能夠實踐所描述的標的，包括製造和使用任何裝置或系統以及執行任何結合的方法。儘管以上已經揭露了各種特定實施例，但是上述實施例的相互非排他的特徵可以彼此組合。本發明之專利範圍由申請專利範圍所界定為準，並且如果申請專利範圍中具有與申請專利範圍字面語言無異的結構要素，或者如果申請專利範圍中包括與申請專利範圍的字面語言無實質差異的同等結構要素，則其他示例也應包含在申請專利範圍的範圍內。In particular, this written description uses examples (including the best mode) to disclose the present invention, and enables any person skilled in the art to practice the described subject matter, including manufacturing and using any device or system and performing any combined method. Although various specific embodiments have been disclosed above, the mutually non-exclusive features of the above embodiments can be combined with each other. The patent scope of the present invention is defined by the scope of the patent application, and if there are structural elements in the scope of the patent application that are the same as the literal language of the scope of the patent application, or if the scope of the patent application includes the literal language in the scope of the patent application, there is no substantial difference Other examples should also be included in the scope of the patent application.

綜上所述，雖然本發明已以實施例揭露如上，然其並非用以限定本發明。本發明所屬技術領域中具有通常知識者，在不脫離本發明之精神和範圍內，當可作各種之更動與潤飾。因此，本發明之保護範圍當視後附之申請專利範圍所界定者為準。In summary, although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention. Those who have ordinary knowledge in the technical field to which the present invention belongs can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention shall be subject to those defined by the attached patent application scope.

10:基板 100:蒸發設備 105:容器 110:加熱組件 112,266:屏蔽裝置 115:外部加熱單元 118:輻射屏蔽 120:網狀結構 122:冷卻網 125:施力單元 130:材料供給系統 132:材料儲存器 134:材料供給入口 136:材料供給裝置 137:篩分元件 138:再填充部 140:安全閥 152:內部輻射屏蔽 200:沉積組件 220,260:分配組件 263:加熱單元 267:冷卻裝置 500:沉積設備 561:組件支撐件 563:遮罩 565:閘閥 570:沉積室 600:方法 610,620:步驟 720:材料10: substrate 100: Evaporation equipment 105: container 110: Heating component 112,266: shielding device 115: External heating unit 118: Radiation shielding 120: Mesh structure 122: Cooling Net 125: force unit 130: Material Supply System 132: Material Storage 134: Material Supply Entrance 136: Material Supply Device 137: Screening element 138: Refill Department 140: safety valve 152: Internal radiation shielding 200: deposition component 220, 260: distribution components 263: heating unit 267: cooling device 500: deposition equipment 561: component support 563: Mask 565: Gate Valve 570: Deposition Chamber 600: method 610,620: steps 720: Material

為了對本發明之上述及其他方面有更佳的瞭解，下文特舉實施例，並配合所附圖式詳細說明如下： 第1圖繪示根據本發明描述的實施例的蒸發設備。 第2圖繪示根據本發明描述的實施例的蒸發設備的部分放大圖。 第3圖繪示根據本發明描述的實施例的蒸發設備。 第4圖繪示根據本發明描述的實施例的沉積組件。 第5圖繪示根據本發明描述的實施例的沉積設備。 第6圖繪示根據本發明描述的實施例的方法流程圖。 第7圖繪示根據本發明描述的實施例的沉積設備。In order to have a better understanding of the above and other aspects of the present invention, the following specific examples are given in conjunction with the accompanying drawings to describe in detail as follows: Figure 1 shows an evaporation device according to the described embodiment of the invention. Figure 2 shows a partially enlarged view of the evaporation device according to the described embodiment of the present invention. Figure 3 shows an evaporation device according to the described embodiment of the invention. Figure 4 shows a deposition assembly according to the described embodiment of the invention. Figure 5 shows a deposition apparatus according to the described embodiment of the invention. Figure 6 shows a flowchart of the method according to the described embodiment of the invention. Figure 7 shows a deposition apparatus according to the described embodiment of the invention.

100:蒸發設備 100: Evaporation equipment

105:容器 105: container

110:加熱組件 110: Heating component

112:屏蔽裝置 112: shielding device

115:外部加熱單元 115: External heating unit

120:網狀結構 120: Mesh structure

125:施力單元 125: force unit

Claims (20)

一種用於蒸發一材料的蒸發設備（100），該蒸發設備包括： 一容器（105），用於該材料；以及 一加熱組件（110），包括： 一外部加熱單元（115），至少部分地設置在該容器周圍；以及 一網狀結構（120），在該容器內； 該外部加熱單元用以在該容器內提供一溫度梯度。An evaporation device (100) for evaporating a material, the evaporation device includes: A container (105) for the material; and A heating assembly (110), including: An external heating unit (115), at least partially arranged around the container; and A net structure (120) in the container; The external heating unit is used to provide a temperature gradient in the container. 一種用於蒸發一材料的蒸發設備（100），該蒸發設備包括： 一容器（105）； 一加熱組件（110），包括： 一外部加熱單元（115），至少部分地設置在該容器周圍； 一網狀結構（120），在該容器內； 該蒸發設備更包括： 一施力單元（125），耦接到該網狀結構。An evaporation device (100) for evaporating a material, the evaporation device includes: A container (105); A heating assembly (110), including: An external heating unit (115), at least partially arranged around the container; A net structure (120) in the container; The evaporation equipment further includes: A force applying unit (125) is coupled to the mesh structure. 如請求項2所述之蒸發設備（100），其中該施力單元（125）用以向該網狀結構（120）施加力。The evaporation device (100) according to claim 2, wherein the force applying unit (125) is used to apply force to the mesh structure (120). 一種用於蒸發一材料的蒸發設備（100），該蒸發設備包括： 一容器（105），用於儲存待蒸發的一固體材料； 一網狀結構（120），在該容器內並設置在該固體材料下方；以及 一蒸氣引導導管，在該網狀結構下方。An evaporation device (100) for evaporating a material, the evaporation device includes: A container (105) for storing a solid material to be evaporated; A net-like structure (120) arranged in the container and under the solid material; and A vapor guide tube is under the mesh structure. 如請求項1或4所述之蒸發設備（100），其中該網狀結構是可移動的。The evaporation device (100) according to claim 1 or 4, wherein the mesh structure is movable. 如請求項1至4中任一項所述之蒸發設備（100），其中該網狀結構（120）由碳或類玻璃碳製成。The evaporation device (100) according to any one of claims 1 to 4, wherein the network structure (120) is made of carbon or glass-like carbon. 如請求項1至4中任一項所述之蒸發設備（100），其中該蒸發設備包括一冷卻網（122），該冷卻網被設置為與該網狀結構（120）相鄰。The evaporation device (100) according to any one of claims 1 to 4, wherein the evaporation device includes a cooling net (122), and the cooling net is arranged adjacent to the mesh structure (120). 如請求項1至4中任一項所述之蒸發設備（100），其中該網狀結構被設置為與該材料的一表面直接接觸。The evaporation device (100) according to any one of claims 1 to 4, wherein the mesh structure is arranged to be in direct contact with a surface of the material. 如請求項1至4中任一項所述之蒸發設備（100），其中該蒸發設備包括一材料供給系統（130），以將該材料提供給該容器（105）。The evaporation device (100) according to any one of claims 1 to 4, wherein the evaporation device includes a material supply system (130) to supply the material to the container (105). 如請求項9所述之蒸發設備（100），其中該材料供給系統（130）包括一材料儲存器（132）以及一材料供給裝置（136），該材料供給裝置將該容器（105）及該材料儲存器（132）連接。The evaporation device (100) according to claim 9, wherein the material supply system (130) includes a material storage (132) and a material supply device (136), and the material supply device includes the container (105) and the The material storage (132) is connected. 如請求項9所述之蒸發設備（100），其中該材料供給裝置（136）的一材料供給出口的橫截面面積小於該容器（105）的橫截面面積。The evaporation device (100) according to claim 9, wherein the cross-sectional area of a material supply outlet of the material supply device (136) is smaller than the cross-sectional area of the container (105). 如請求項9所述之蒸發設備（100），其中該材料供給系統（130）包括一材料供給入口（134），該材料儲存器（132）透過一篩分元件（137）與該材料供給入口（134）分開。The evaporation device (100) according to claim 9, wherein the material supply system (130) includes a material supply inlet (134), and the material storage (132) penetrates a screening element (137) and the material supply inlet (134) Separate. 如請求項9所述之蒸發設備（100），其中該材料供給系統（130）包括一再填充部（138）和一安全閥（140），該安全閥可操作於再填充構造和儲存構造之間。The evaporation device (100) according to claim 9, wherein the material supply system (130) includes a refilling part (138) and a safety valve (140), the safety valve being operable between the refilling configuration and the storage configuration . 如請求項9所述之蒸發設備（100），其中該材料供給系統與該容器配合以在該容器中保持基本恆定的填充高度。The evaporation device (100) according to claim 9, wherein the material supply system cooperates with the container to maintain a substantially constant filling height in the container. 如請求項1至4中任一項所述之蒸發設備（100），其中該蒸發設備包括一過渡區域，用於將該容器（105）與一分配組件（260）連接，該過渡區域或該分配組件包括一內部輻射屏蔽 （152）。The evaporation device (100) according to any one of claims 1 to 4, wherein the evaporation device includes a transition area for connecting the container (105) with a distribution assembly (260), the transition area or the The distribution assembly includes an internal radiation shield (152). 一種用於在真空室中的一基板上沉積材料的沉積設備，該沉積設備包括： 一真空室； 根據請求項1至15中任一項所述的一蒸發設備（100），設置在該真空室中；以及 一分配組件（260），與該蒸發設備流體連通，以將蒸發的材料引導向該基板。A deposition device for depositing materials on a substrate in a vacuum chamber, the deposition device comprising: A vacuum chamber; An evaporation device (100) according to any one of claims 1 to 15 is arranged in the vacuum chamber; and A distribution assembly (260) is in fluid communication with the evaporation device to guide the evaporated material to the substrate. 一種利用一蒸發設備蒸發一材料的方（600），該方法包括： 在一容器（105）內提供一溫度梯度，包括一加熱組件（110）至少部分地設置在該容器周圍，該加熱組件（110）包括一外部加熱單元（115）以及一網狀結構（120），該網狀結構在該容器內。A method (600) for evaporating a material using an evaporation device, the method comprising: A temperature gradient is provided in a container (105), including a heating component (110) at least partially arranged around the container, the heating component (110) includes an external heating unit (115) and a mesh structure (120) , The mesh structure is in the container. 如請求項17所述之方法（600），該方法更包括以下至少之一： 經由耦接到一材料供給系統（130）的一材料供給裝置（136）供給一材料；以及 該溫度梯度的一溫度範圍低於該材料的一蒸發溫度TE 。According to the method (600) of claim 17, the method further includes at least one of the following: supplying a material via a material supply device (136) coupled to a material supply system (130); and a temperature gradient a temperature range below the evaporation temperature of the material T E. 如請求項17所述之方法（600），其中該網狀結構與該材料的一表面直接接觸。The method (600) according to claim 17, wherein the mesh structure is in direct contact with a surface of the material. 如請求項17所述之方法（600），該方法更包括： 設置一冷卻網相鄰該網狀結構。According to the method (600) described in claim 17, the method further includes: A cooling net is arranged adjacent to the net structure.
TW108143355A 2018-12-04 2019-11-28 Evaporation apparatus for evaporating a material and method for evaporating a material with an evaporation apparatus TW202035741A (en)

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