TW202027909A - Cutting device to sense the debris generated in the incision with good accuracy - Google Patents
Cutting device to sense the debris generated in the incision with good accuracy Download PDFInfo
- Publication number
- TW202027909A TW202027909A TW109100547A TW109100547A TW202027909A TW 202027909 A TW202027909 A TW 202027909A TW 109100547 A TW109100547 A TW 109100547A TW 109100547 A TW109100547 A TW 109100547A TW 202027909 A TW202027909 A TW 202027909A
- Authority
- TW
- Taiwan
- Prior art keywords
- cutting
- workpiece
- elastic wave
- value
- wave signal
- Prior art date
Links
Images
Landscapes
- Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
- Dicing (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
Description
本發明係關於將被加工物切削加工的切削裝置。The present invention relates to a cutting device for cutting a workpiece.
以切削刀切削被保持在吸盤平台的被加工物的切削裝置係一邊對切削刀供給切削水,一邊使切削刀與被加工物相接觸來將被加工物進行切削加工。在切削加工中,因發生切削刀的阻塞、或鈍化、缺口等,或因切削進給速度的設定錯誤等,切削刀比平常振動更大而有在被加工物的表面發生碎屑的可能性。A cutting device that cuts a workpiece held on a suction table with a cutting blade provides cutting water to the cutting blade while bringing the cutting blade into contact with the workpiece to cut the workpiece. In the cutting process, due to blockage, dullness, chipping, etc. of the cutting tool, or the setting error of the cutting feed rate, the cutting tool vibrates more than usual, which may cause chipping on the surface of the workpiece. .
因此,為感測所發生的碎屑,如專利文獻1及專利文獻2所揭示,有一種手法係在切削加工中以AE感測器感測切削刀的振動,若切削刀的振動的大小(AE值)超過臨限值,即判斷在被加工物發生碎屑。
[先前技術文獻]
[專利文獻]Therefore, in order to sense the generated chips, as disclosed in
[專利文獻1]日本特開2015-170745號公報 [專利文獻2]日本特開2018-117092號公報[Patent Document 1] JP 2015-170745 A [Patent Document 2] Japanese Patent Application Publication No. 2018-117092
(發明所欲解決之課題)(The problem to be solved by the invention)
但是,在藉由以上所示之專利文獻1及專利文獻2所示之發明所為之切削刀的振動的感測中,當感測到被認為在切削刀等發生異常的振動時,有在藉由電子顯微鏡等觀察切口時未發現碎屑的情形。在該情形下,判斷發生碎屑的切削刀的振動的大小的臨限值被設定為過小,雖然實際上並未發生碎屑,而誤感測為發生碎屑。另一方面,若提高判斷發生碎屑的切削刀的振動的大小的臨限值,這次變成即使發生碎屑亦無法感測。如上所示,在根據所感測到的切削刀的振動的大小來判斷是否發生碎屑的過程中,在供振動感測用的手段或振動的臨限值的適當選擇方式發生問題。本發明應解決的課題在感測切削刀的振動,以更正確地感測在切口所發生的碎屑。
(解決課題之手段)However, in the detection of the vibration of the cutting tool by the inventions shown in
本發明係一種切削裝置,其係具備:保持被加工物的保持手段;具備有將被保持在該保持手段的被加工物切削的切削刀的切削手段;對該切削刀供給切削水的切削水供給手段;使該切削刀與該保持手段相對以切削進給方向移動的切削進給手段;被配設在該切削手段或該保持手段且感測藉由切削加工而由該切削刀所發生的彈性波的AE感測器;及控制手段的切削裝置,該控制手段係:以該AE感測器感測該切削刀將被加工物切削加工時所發生之包含複數頻率成分的彈性波,將該AE感測器所感測到的彈性波訊號進行傅立葉轉換,特定會由該切削刀發生的彈性波訊號的頻帶,在該特定的該頻帶中,將該彈性波訊號進行傅立葉轉換後的值一超過預先設定的第一臨限值,即判斷在該切削刀切削被加工物的切口發生碎屑且在切削加工有異常。The present invention is a cutting device comprising: holding means for holding a workpiece; cutting means provided with a cutting blade for cutting the workpiece held by the holding means; and cutting water for supplying cutting water to the cutting blade Feeding means; cutting and feeding means that move the cutting blade and the holding means in the cutting feed direction; it is arranged on the cutting means or the holding means and senses what happens to the cutting tool by cutting An AE sensor for elastic waves; and a cutting device for a control means. The control means is: the AE sensor is used to sense the elastic waves containing complex frequency components that are generated when the cutting tool cuts the workpiece. The elastic wave signal sensed by the AE sensor is Fourier transformed to specify the frequency band of the elastic wave signal generated by the cutter. In the specific frequency band, the elastic wave signal is Fourier transformed to a value Exceeding the preset first threshold value, that is, it is judged that chipping occurs in the cut of the workpiece by the cutting tool and there is an abnormality in the cutting process.
上述切削裝置所具備的該控制手段較佳為按每個該頻帶求出將該彈性波訊號進行傅立葉轉換後的值的平均值,由預定的時間內的複數該平均值求出特徵量,該特徵量一超過預先設定的第二臨限值,即判斷在該切削刀切削被加工物的切口發生碎屑且在切削加工有異常。The control means included in the above-mentioned cutting device preferably obtains the average value of the value obtained by Fourier transforming the elastic wave signal for each frequency band, and obtains the characteristic value from the average value of the complex number within a predetermined time, the Once the characteristic quantity exceeds the preset second threshold value, it is determined that chipping occurs in the cut of the workpiece by the cutting tool and there is an abnormality in the cutting process.
上述切削裝置所具備的該控制手段較佳為該特徵量超過預先設定的第三臨限值的次數一超過預先設定的次數,即判斷在該切削刀切削被加工物的切口發生碎屑且在切削加工有異常。 (發明之效果)The control means included in the cutting device is preferably such that the number of times that the characteristic quantity exceeds the preset third threshold value exceeds the preset number of times, that is, it is determined that chipping occurs in the incision of the cutting tool to cut the workpiece and There is an abnormality in the cutting process. (Effect of Invention)
藉由AE感測器來感測因伴隨切削加工而在切削刀施加負荷所發生的彈性波,將所感測到的彈性波訊號進行傅立葉轉換,依每個頻帶之經傅立葉轉換後的AE值是否超過預先設定的彈性波的AE值的臨限值,可判斷感測碎屑發生且在切削加工有異常。藉此,控制切削裝置來進行中斷切削等適當處置,可防止發生不良晶片。The AE sensor is used to sense the elastic wave generated by the load applied to the cutting tool along with the cutting process, and the sensed elastic wave signal is Fourier-transformed, and whether the Fourier-transformed AE value of each frequency band is Exceeding the preset threshold value of the elastic wave AE value, it can be judged that the sensing chip occurs and there is an abnormality in the cutting process. By this, the cutting device is controlled to perform appropriate measures such as interruption of cutting, and the occurrence of defective wafers can be prevented.
1 切削裝置的構成1 Composition of cutting device
切削裝置1係如圖1所示,使切削手段40所具備的切削刀43切入至在保持手段15所被保持的被加工物W的表面Wa,將被加工物W進行切削加工的切削裝置。圖1所示之切削裝置1係具備二個切削手段40的雙切割器,惟切削裝置並非為限定於此者,亦可為具備一個切削手段的切削裝置。在藉由形成在半導體晶圓等亦即被加工物W的表面Wa的分割預定線L予以區劃的區域係配備有各個元件D,藉由沿著分割預定線L使切削刀43切入,可將被加工物W分割成各個元件D。在被加工物W的背面Wb係貼附有貼附膠帶T,藉由被貼附在被加工物W的貼附膠帶T的端部被貼附在環狀框架F,被加工物W被支持在框架F。在切削裝置1係配備有:基座10、及基座10上立設在-X側的門型立柱13。As shown in FIG. 1, the
在基座10之上的中央係配備有:圓形的板狀平台亦即保持手段15、由下圍繞保持手段15的蓋件11、及連結於蓋件11的蛇腹蓋件12。保持手段15係具備:吸引部150、及支持吸引部150的框體151,吸引部150的上面係成為載置被加工物W的保持面150a。在保持手段15的下方係配設有吸引手段80,保持面150a與吸引手段80相連接。在被加工物W被載置於保持面150a的狀態下,將藉由吸引手段80所生出的吸引力傳達至吸引部150,藉此可在保持面150a吸引保持被加工物W。The center above the
此外,在鄰接保持手段15的位置係由四方包圍保持手段15而配設有四個夾具17,在保持面150a載置被支持在環狀框架F的狀態的被加工物W,而使用四個夾具17由四方夾持框架F,藉此可將被加工物W固定在保持手段15。此外,在保持手段15的下側係連接有有底筒狀的外殼83,在外殼83的內部係配設有使保持手段15繞著Z軸方向的旋轉軸82旋轉的旋轉手段81。In addition, four
在基座10的內部係配備有收容保持被加工物W的未圖示的匣盒的匣盒收容區20。匣盒收容區20的上面係成為載台22,載置有保持被加工物W的匣盒的狀態的載台22藉由匣盒升降手段21而升降移動,來調整匣盒的高度位置。The inside of the
在基座10之上夾著保持手段15而與匣盒升降手段21相對向的位置係配設有洗淨手段24。在洗淨手段24係配備有:旋轉器平台25、及洗淨水噴嘴26。藉由未圖示的升降手段,使保持有被加工物W的旋轉器平台25降下至基座10的內部,可一邊藉由未圖示的旋轉手段使旋轉器平台25旋轉,一邊由洗淨水噴嘴26噴附洗淨水,藉此將被加工物W洗淨。此外,在將被加工物W洗淨後,停止洗淨水的噴射,接著使被加工物W旋轉,藉此,附著在表面Wa的水滴朝向表面Wa的外側噴飛。藉此可使被加工物W的表面Wa乾燥。On the
在基座10的內部係配設有切削進給手段18。切削進給手段18係具備:具有X軸方向的旋轉軸184的滾珠螺桿180;與滾珠螺桿180平行配設的一對導軌181;連接於滾珠螺桿180的一端的馬達182;及內部的螺帽構造螺合在滾珠螺桿180且底部滑接於導軌181的可動板183。此外,可動板183係透過外殼83來支持保持手段15。形成為若藉由馬達182被驅動而滾珠螺桿180繞X軸方向的旋轉軸184旋轉時,可動板183被導軌181導引而以X軸方向亦即切削進給方向移動,伴隨此,透過外殼83而被支持在可動板183的保持手段15連同可動板183一起以X軸方向移動的構成。其中,當保持手段15以X軸方向移動時,圍繞保持手段15的蓋件11以X軸方向與保持手段15一體移動,若蓋件11以X軸方向移動,蛇腹蓋件12即作伸縮。A cutting and feeding means 18 is arranged inside the
在門型立柱13的左右側壁係分別配設有二個切削手段40。二個切削手段40係同樣構成,對其構成要素係標註相同符號。Two cutting means 40 are respectively arranged on the left and right side walls of the door-
在切削手段40係配備有:切削刀43、支持切削刀43的心軸42、及收容心軸42的四角筒狀的心軸殼體41。在心軸殼體41係安裝有刀蓋45。在刀蓋45的中央部係配備有用以安裝切削刀43的開口部,覆蓋由切削刀43的外周緣的上方至側方的區域。此外,在刀蓋45的下部係可上下動地安裝有具備有當將被加工物W切削時,對切削刀43、或被加工物W與切削刀43相接觸的部分供給切削水的噴嘴的切削水供給手段46,切削加工時,由未圖示的切削水供給源對切削水供給手段46給水,一邊由切削水供給手段46對切削刀43、或被加工物W與切削刀43相接觸的部分供給切削水一邊切削被加工物W。The cutting means 40 is equipped with a
如圖2及圖3所示,在心軸殼體41的前端面41a係安裝有覆蓋心軸42的前端側的蓋件構件47。在蓋件構件47係配設有一對托架48,在使心軸42的前端部分由蓋件構件47的開口49突出的狀態下,蓋件構件47透過托架48而螺止於心軸殼體41,蓋件構件47與心軸42相連結。As shown in FIGS. 2 and 3, a
刀架座51係具備有:圓板狀的凸緣部56、及形成在凸緣部56的表面56a(-Y方向側)的軸套部53。在凸緣部56的背面56b(+Y方向側),係如圖3所示,形成有被裝設在心軸42的前端的嵌合孔52。在軸套部53係形成有圓形凹部54,且在圓形凹部54的底面係形成有與嵌合孔52相連的貫穿孔55。在心軸42的前端面42a由刀架座51的貫穿孔55露出的狀態下,心軸42被嵌入在刀架座51,固定螺栓59透過墊圈58而被緊固在心軸42的前端面42a的螺孔44,藉此刀架座51被固定在心軸42。The
切削刀43係具備有:圓形的輪轂基台61、及環狀配設在輪轂基台61的外周緣的切刀62的輪轂型刀,在輪轂基台61的圓的內側係形成有***孔63。該***孔63被壓入在軸套部53,軸套部53由輪轂基台61突出。接著,在形成在軸套部53的突出部分的公螺旋部57緊固固定螺帽65而在刀架座51固定切削刀43。The
切刀62係在金屬或樹脂等結合材混合鑽石或CBN等砥粒而形成為預定厚度。其中,切削刀43亦可使用僅藉由切刀62所構成的墊圈型刀。The
如圖3所示,在刀架座51的凸緣部56係配設有AE感測器71。AE感測器71係具有壓電元件,可將切削加工時由切削刀43發生而傳至刀架座51的彈性波,轉換成電性檢測訊號亦即彈性波訊號來進行輸出。As shown in FIG. 3, the
在刀架座51與蓋件構件47的交界區域,在刀架座51側係在AE感測器71連接有第1線圈手段73,此外,在蓋件構件47側係在第1線圈手段73連接有第2線圈手段74。若藉由AE感測器71來感測彈性波,由AE感測器,彈性波訊號被傳送至第1線圈手段73,此外,由第1線圈手段73藉由磁性的相互感應作用而被傳達至第2線圈手段74。In the boundary area between the
在與第1線圈手段73磁性耦合的第2線圈手段74係連接有控制手段75。在控制手段75係配備有:將以AE感測器71所檢測到的時間軸波形進行頻率解析的解析手段76;及由頻率解析的結果,判斷是否形成有碎屑的判斷手段77。以AE感測器71所檢測到的彈性波訊號透過第1線圈手段73及第2線圈手段74而被傳達至控制手段75之後,其時間軸波形在解析手段76被傅立葉轉換而被轉換成頻率軸波形。The control means 75 is connected to the second coil means 74 magnetically coupled to the first coil means 73. The control means 75 is equipped with: analysis means 76 for frequency analysis of the time axis waveform detected by the
此外,在控制手段75係配備有若藉由判斷手段77被判斷出發生碎屑時即對操作人員等報知該要旨的報知手段78。In addition, the control means 75 is equipped with a notification means 78 for notifying the operator or the like of the fact when it is determined that debris has occurred by the determination means 77.
如圖1所示,在門型立柱13係配備有使上述構成的二個切削手段40分別以Y軸方向及Z軸方向移動的分級進給手段30及切入進給手段35。As shown in FIG. 1, the gate-shaped
在分級進給手段30係配備有:具有Y軸方向的軸心的滾珠螺桿33、使滾珠螺桿33繞著與Y軸呈平行的旋轉軸330旋動的馬達34、與滾珠螺桿33平行配設的導軌31、及側部的螺帽螺合於滾珠螺桿33而滑接於導軌31的可動板32。形成為若藉由馬達34予以驅動,而滾珠螺桿33繞著旋轉軸330旋轉時,伴隨此,可動板32被導軌31導引而以Y軸方向移動的構成。The classifying feeding means 30 is equipped with a
此外,在切入進給手段35係具備有:具有Z軸方向的軸心的滾珠螺桿38、使滾珠螺桿38繞著與Z軸呈平行的旋轉軸380旋動的馬達39、與滾珠螺桿38平行配設的導軌36、及側部的螺帽螺合於滾珠螺桿38而滑接於導軌36的支持構件37。形成為若藉由馬達39予以驅動而滾珠螺桿38旋轉時,支持構件37被導軌36導引而以Z軸方向移動。In addition, the cutting and feeding means 35 is provided with a
在支持構件37的下端係連結有心軸殼體41,若支持構件37以Y軸方向及Z軸方向移動,伴隨此,切削手段40相同地以Y軸方向及Z軸方向移動。A
在心軸殼體41的側面係配設有對準手段9。對準手段9係具備有對被加工物W攝像的攝影機90,攝影機90係例如具備有:對被加工物W照射光的光照射部、捕捉來自被加工物W的反射光的光學系、及輸出對應反射光的電訊號的攝像元件(CCD)。對準手段9係可根據藉由攝影機90所取得的畫像,來檢測被加工物W應切削的分割預定線L。對準手段9與切削手段40係形成為一體而構成,兩者係連動朝Y軸方向及Z軸方向移動。
2 切削裝置的動作An alignment means 9 is arranged on the side surface of the
(切削加工)
說明當藉由上述切削裝置1將被加工物W切削加工時的切削裝置1的動作。其中,在被加工物W係貼附有貼附膠帶T,在該狀態下,貼附膠帶T被把持在環狀框架F,藉此被加工物W藉由框架F予以固定。(Cutting)
The operation of the
首先,在匣盒收容區20,藉由匣盒升降手段21使載台22上升,且將載置有被固定在框架F的被加工物W的匣盒定位在基座10的上方後,藉由未圖示的臂等來把持環狀框架F而載置於保持手段15的保持面150a之上,使藉由吸引手段80所生出的吸引力傳達至保持面150a而在保持面150a之上吸引保持被加工物W。接著,以四個夾具17由四方夾持框架F來進行固定。First, in the
之後,藉由切削進給手段18的馬達182的驅動力,使滾珠螺桿180繞旋轉軸184旋轉,藉此,沿著導軌181使可動板183及被支持在可動板183的保持手段15以-X方向移動,且將被吸引保持在保持手段15的被加工物W定位在對準手段9的下方。在將被加工物W定位在對準手段9的下方之後,藉由攝影機90對被加工物W的表面Wa進行攝像。對藉由攝影機90被攝像到的被加工物W的表面Wa的畫像,進行藉由對準手段9所為之圖案匹配等畫像處理,檢測應使二個切削刀43切入的分割預定線L。After that, the
伴隨藉由對準手段9檢測分割預定線L,切削手段40藉由分級進給手段30而以Y軸方向予以驅動,進行應切削的分割預定線L與切削刀43的Y軸方向的對位。在分割預定線L與切削刀43的Y軸方向的對位中,根據上述圖案匹配結果,藉由分級進給手段30的馬達34而使滾珠螺桿33繞著旋轉軸330旋轉,伴隨此,可動板32沿著導軌31而以Y軸方向移動,連接於可動板32的支持構件37及被支持在支持構件37的切削手段40以Y軸方向移動。Along with the detection of the planned dividing line L by the aligning
Y軸方向的對位完成後,藉由未圖示的馬達,使切削手段40的心軸42旋動,且使連接於心軸42的切削刀43旋轉。在切削刀43正在旋轉的狀態下,藉由切入進給手段35的馬達39使滾珠螺桿38驅動而使滾珠螺桿38繞著旋轉軸380旋轉,使切削刀43以Z軸方向降下。藉此,切削刀43被定位在用以開始切削加工的高度位置。After the alignment in the Y-axis direction is completed, the
如上所述,將切削刀43定位在應切入的分割預定線L的位置,此外,在定位在用以開始切削加工的高度位置之後,開始切削加工。此時,保持被加工物W的保持手段15以預定的切削進給速度另外以-X方向被送出,藉此,保持手段15與切削刀43相對以預定速度以切削進給方向(X軸方向)移動,且切削刀43一邊高速旋轉一邊切入至被加工物W被檢測到的分割預定線L,且切削該分割預定線L。As described above, the
接著,以相鄰的分割預定線L的間隔,將切削手段40以Y軸方向分級進給,藉由進行同樣的切削,切削切削完畢的分割預定線L之鄰的分割預定線L。如上所示,藉由反覆進行分級進給與切削,同方向的分割預定線L全部被切削。接著,藉由旋轉手段81使保持手段15旋轉90度之後,進行同樣的切削,以縱橫切削所有分割預定線L,可將被加工物W分割成各個晶片。
其中,切削加工係使用如下所述之加工條件。
切削刀:砥粒直徑 #2000~#3000
切削刀寬(切口寬度):20~30μm
被加工物材質:矽
切削進給速度:50~100mm/sec
心軸旋轉數:20000旋轉/分鐘~30000旋轉/分鐘Next, the cutting means 40 is fed stepwise in the Y-axis direction at intervals between adjacent planned dividing lines L, and the same cutting is performed to cut the planned dividing line L adjacent to the cut planned dividing line L. As shown above, by repeatedly performing stepped feeding and cutting, all the planned dividing lines L in the same direction are cut. Next, after the holding means 15 is rotated by 90 degrees by the rotating
(碎屑檢測)
如上所述使切削裝置1作動而將被加工物W切削加工的期間,藉由被安裝在切削手段40的刀架座51的AE感測器71,感測切削中所發生之包含複數頻率成分的彈性波,將被感測到的彈性波以磁性傳達至第1線圈手段73及第2線圈手段74,形成為電訊號而傳送至控制手段75。在控制手段75中,係取得例如圖4所示之資訊。在圖4中,將橫軸設為時間(t),將縱軸設為切削加工時AE感測器71所感測的彈性波訊號的值亦即AE值(V),描繪出表示彈性波的AE值的時間變化的資料亦即時間特性資料的時間軸波形的圖表。(Debris detection)
During the cutting process of the workpiece W by operating the
對該彈性波訊號的時間特性資料,使用解析手段76,將取樣時間To設為例如1毫秒來進行傅立葉轉換(例如FFT)。藉此,取得按每個頻率予以分解的彈性波訊號的頻譜亦即頻率特性資料。圖5係將橫軸設為頻率(f),將縱軸設為按每個頻率予以分解的彈性波的頻譜的大小(強度),將彈性波訊號的頻率特性資料進行標繪的頻率軸波形的圖表。For the time characteristic data of the elastic wave signal, the analysis means 76 is used to perform Fourier transformation (for example, FFT) by setting the sampling time To to, for example, 1 millisecond. In this way, the frequency characteristic data, which is the frequency spectrum of the elastic wave signal decomposed for each frequency, is obtained. Figure 5 is the frequency axis waveform where the horizontal axis is set to frequency (f), the vertical axis is set to the size (intensity) of the elastic wave spectrum decomposed for each frequency, and the frequency characteristic data of the elastic wave signal is plotted. Chart.
在切削加工中因切削刀43與被加工物W接觸所發生的彈性波的頻帶已知為200kHz至600kHz的特定的頻帶。其中,小於200kHz的頻率的振動係因由切削水供給手段46所被供給的切削水的聲音或驅動部的聲音等所致者,大於600kHz的頻率的振動係因馬達驅動器等的雜訊所致者。因此,在解析手段76中,如圖5所示,特定被轉換成頻率軸波形的彈性波訊號的200kHz至600kHz的頻帶,在判斷手段77判斷200kHz至600kHz的頻帶中的傅立葉轉換後的AE值是否超過預先設定的第一臨限值,藉此判斷是否發生碎屑。The frequency band of the elastic wave generated by the contact between the cutting
第一臨限值係例如由過去的加工經驗來決定。以第一臨限值的決定方法而言,例如,將未決定第一臨限值的狀態的被加工物W的全部分割預定線L進行切削加工,在切削加工中的全部時間,以AE感測器71感測切削加工時所發生的彈性波。以AE感測器71所感測到的彈性波訊號係透過第1線圈手段73及第2線圈手段74而被傳達至控制手段75。The first threshold value is determined by, for example, past processing experience. In terms of the method of determining the first threshold value, for example, cutting all the planned dividing lines L of the workpiece W in a state where the first threshold value has not been determined, and the entire time during the cutting process is expressed as AE The
另一方面,將形成在被加工物W的切口的樣子,藉由例如對準手段9的攝影機90進行攝像,來進行切口檢查。切口檢查的結果,當在被加工物W的表面Wa檢測到碎屑時,根據所被攝像到的畫像,調查已發生碎屑的分割預定線L的位置。此時,在切削裝置1中,藉由對照以攝影機90被攝像到的被加工物W的表面Wa的畫像、與切削進給速度及分割預定線L的全長等,可特定從切削開始測量而分割預定線L的什麼位置在什麼時間被切削。特定切削加工時發生碎屑的位置及發生碎屑的時間,例如,將包含該碎屑發生時間的1毫秒作為取樣時間,將彈性波的時間軸波形藉由解析手段76而傅立葉轉換成頻率軸波形,由所取得的頻率軸波形所包含的頻帶200kHz至600kHz中的彈性波訊號的AE值,特定削屑(chipping)時由切削刀43所發生的彈性波訊號的傅立葉轉換後的AE值(峰值等)。接著,將比該傅立葉轉換後的AE值為稍低的值設定為第一臨限值。On the other hand, the state of the cut formed in the workpiece W is imaged by, for example, a
因切削加工而在切削刀43發生的彈性波訊號一超過如上所述所設定的第一臨限值,判斷手段77即判斷在切削刀43切削被加工物W的切口發生碎屑且在切削加工有異常。在圖5中,係描繪出切削加工時的某時間的彈性波的頻率軸波形,在圖表內的400kHz附近的位置P1,傅立葉轉換後的AE值超過第一臨限值S1,接收此,判斷手段77判斷在被加工物W係發生碎屑而在切削加工有異常。When the elastic wave signal generated on the
若藉由判斷手段77而判斷出在被加工物W發生碎屑時,報知手段78對操作人員等報知碎屑發生,催促維護作業等。If it is determined by the judgment means 77 that debris has occurred in the workpiece W, the notification means 78 informs the operator or the like of the occurrence of debris, and prompts maintenance work and the like.
其中,將由切削刀43所發生的彈性波的頻帶亦即200kHz至600kHz頻帶,分割成200kHz至300kHz、300kHz至400kHz、400kHz至500kHz、500kHz至600kHz的四個,使用上述方法,設定各個頻帶中的第一臨限值,且解析各個彈性波訊號,藉此可進行精度更高的碎屑檢測。此時,亦可按經區分的四個頻帶,將第一臨限值設定為不同的值。Among them, the frequency band of the elastic wave generated by the
如上所述,使用切削裝置1所具備的解析手段76進行傅立葉轉換,藉此在所發生的彈性波訊號之中,特定由切削刀43所發生的彈性波的彈性波訊號,藉由比較該彈性波訊號的傅立葉轉換後的AE值與所設定的第一臨限值,可精度更佳地判斷是否發生碎屑。As described above, the Fourier transform is performed using the analysis means 76 included in the
(使用統計學上的特徵量的碎屑檢測) 以在藉由彈性波訊號所為之碎屑檢測中,按每個頻帶求出傅立葉轉換後的AE值的平均值,且由預定時間內的複數平均值求出特徵量,根據特徵量來判斷是否發生碎屑的構成為宜。(Debris detection using statistical feature quantities) In the detection of debris by the elastic wave signal, the average value of the Fourier transformed AE value is obtained for each frequency band, and the feature value is obtained from the complex average value within a predetermined time, and the feature value is used to determine whether The formation of debris is appropriate.
上述特徵量係例如定義如下。被加工物W的切削加工時,藉由AE感測器71來感測由切削開始至結束的全部彈性波,形成為彈性波訊號而傳達至控制手段75。該彈性波訊號之中,對在切削加工中切削刀43所切入的最初1線份的分割預定線L的時間特性資料,將取樣時間設為1毫秒,針對各個時間區分,進行傅立葉轉換。在圖6中,以一例而言,描繪出由切削刀所發生的彈性波的頻帶之中的200kHz至300kHz的頻帶中的頻率軸波形。之後,算出1線份的按每1毫秒所區劃的各個時間區分中的各頻帶(在圖6之例中係200kHz至300kHz)中的傅立葉轉換後的AE值的頻率平均值。若將如上所示所取得的1線份的複數傅立葉轉換後的AE值的頻率平均值,描繪在將橫軸設為時間(t)、將縱軸設為傅立葉轉換後的AE值的頻譜大小(強度)的圖表上時,描繪如圖7所示之傅立葉轉換後的AE值的頻率平均值的時間軸波形。圖7的圖表的左右部分的傾斜係表示以切削刀43切斷膠帶時傅立葉轉換較大後的AE值變化的樣子,圖表中為中央較為平坦的部分係表示正在切削被加工物W時的傅立葉轉換後的AE值。將圖7的圖表的中央部分中的橫軸方向的長度,亦即被加工物W的分割預定線L進行1線切削的時間設為預定的時間T1,將預定的時間T1內的傅立葉轉換後的AE值的頻率平均值的最大值與中間值的差設定為特徵量。The above-mentioned characteristic quantity system is defined as follows, for example. During the cutting of the workpiece W, the
每逢1線份的分割預定線L被切削加工,即在解析手段76算出如上所述所設定的特徵量,對全線進行該操作。所算出的特徵量一超過第二臨限值,在判斷手段77判斷在切削刀43切削被加工物W的切口發生碎屑而在切削加工有異常。Every time the planned dividing line L of one line is cut, the analysis means 76 calculates the feature quantity set as described above, and this operation is performed on the entire line. When the calculated feature amount exceeds the second threshold value, the judgment means 77 judges that chipping occurs in the cut of the workpiece W by the
但是,第二臨限值係與第一臨限值相同地,根據在藉由攝影機90所得之分割預定線L的畫像中所發現的碎屑位置、及由碎屑位置或切削進給速度或分割預定線L的全長等所導出的碎屑時間予以設定。例如,一邊對全部分割預定線L進行切削加工,一邊以AE感測器71感測在切削加工中由切削刀43所發生的彈性波,且形成為彈性波訊號而傳達至控制手段75。另一方面,與第一臨限值設定時同樣地,藉由對準手段9的攝影機90等來調查切削後的切口的樣子。切口檢查之際發現碎屑時,根據所被攝像到的畫像,導出檢測到碎屑的位置及時間。接著,對包含該碎屑位置的1線份的彈性波訊號,將取樣時間設為1毫秒而進行傅立葉轉換,算出200kHz至300kHz的頻帶中的傅立葉轉換後的AE值的頻率平均值。算出1線份之包含碎屑位置的分割預定線L的彈性波訊號的頻率平均值之後,算出預定的時間T1內的頻率平均值的最大值與中間值的差,且設為第二臨限值。However, the second threshold value is the same as the first threshold value, based on the chip position found in the image of the planned dividing line L obtained by the
由切削加工時以AE感測器71予以感測而被傳達至控制手段75的彈性波訊號所算出的特徵量超過如上所述所設定的第二臨限值S2時,判斷手段77判斷在切削刀43切削被加工物W的切口發生碎屑且在切削加工有異常。在圖8中係描繪出將橫軸設為表示線的位置的線編號(n)、將縱軸設為特徵量而在切削加工時所取得的特徵量。在圖8的圖表的P2中,特徵量超過第二臨限值S2,接收此而藉由判斷手段77判斷發生碎屑。When the characteristic quantity calculated from the elastic wave signal sensed by the
在依預定的時間T1內的傅立葉轉換後的AE值的頻率平均值的最大值與中間值的差來設定特徵量的背景中,係有彈性波訊號的頻率平均值的最大值與中間值的差愈大,將1線份的彈性波訊號進行傅立葉轉換時的每個取樣區分的頻率特性資料的不均愈大,且頻率特性資料的不均愈大,切削刀43等愈有一些異常,而在被加工物W發生碎屑的可能性愈大的情形。1線份的彈性波訊號中的預定的時間內所包含的傅立葉轉換後的AE值的頻率平均值的最大值與中間值的差成為超過第二臨限值的值時,在切削刀43在1線份的切削加工中所發生的彈性波的彈性波訊號的資料的不均大,判斷發生碎屑。In the background of setting the feature quantity according to the difference between the maximum value of the frequency average value of the Fourier transformed AE value and the median value within the predetermined time T1, there is the difference between the maximum value and the median value of the frequency average value of the elastic wave signal The greater the difference, the greater the frequency characteristic data unevenness of each sampling segment when the one-line elastic wave signal is Fourier transformed, and the greater the frequency characteristic data unevenness, the more abnormal the
此外,亦可將特徵量定義為若圖7所示之預定的時間T1內的1線份的頻率平均值的資料有N個,由第{3(N+1)/4}大的值,扣掉第{(N+1)/4}大的值後的值亦即所謂四分位範圍(Interquartile Range)。In addition, the feature value can also be defined as if there are N pieces of data of the frequency average value of 1 line in the predetermined time T1 shown in FIG. 7, the value is greater than {3(N+1)/4}, The value after subtracting the largest value of {(N+1)/4} is the so-called Interquartile Range.
若如上所述將特徵量定義為四分位範圍,第2臨限值亦被設定為四分位範圍。當設定將特徵量定義為四分位範圍時的第2臨限值時,首先,使切削全部分割預定線L時的彈性波訊號的時間特性資料傳達至控制手段75。另一方面,根據切削加工時藉由圖1所示之攝影機90被攝像到的被加工物W的表面Wa的畫像,特定因切削加工所發生的碎屑的位置,另外導出發生碎屑的時間。接著,將分割預定線L之中發生碎屑的1線的彈性波訊號的時間特性資料,將取樣時間設為1毫秒,藉由解析手段76進行傅立葉轉換,而取得彈性波訊號的頻率特性資料,且算出1線份的各頻帶,例如200kHz至300kHz的頻帶中的傅立葉轉換後的AE值的頻率平均值。之後,在發生碎屑的1線份的頻率平均值的資料之中,由預定的時間T1內所包含的N個者之中,特定第{3(N+1)/4}大的值與第{(N+1)/4}大的值,將該等扣除後的值(四分位範圍)設為第2臨限值。切削加工時特徵量超過所設定的第二臨限值時,藉由判斷手段77判斷在被切削刀43所切削的被加工物W的切口發生碎屑且在切削加工有異常。If the feature quantity is defined as the interquartile range as described above, the second threshold value is also set as the interquartile range. When setting the second threshold value when the feature quantity is defined as the interquartile range, first, the time characteristic data of the elastic wave signal when all the planned dividing lines L are cut is transmitted to the control means 75. On the other hand, based on the image of the surface Wa of the workpiece W captured by the
在將特徵量設定為四分位範圍的情形下,亦如上所述,與將特徵量設定為扣掉頻率平均值的最大值與中間值後的值的情形同樣地,藉由比較資料的不均的大小來判斷是否發生碎屑。亦即,表示由切削加工時所發生的彈性波的彈性波訊號所算出的預定的時間內所包含的頻率平均值的四分位範圍愈大,將1線份的彈性波訊號進行傅立葉轉換時的每個取樣區分的頻率特性資料的不均愈大,若四分位範圍超過第二臨限值,即判斷在被加工物W發生碎屑。In the case where the feature quantity is set to the interquartile range, as described above, as in the case where the feature quantity is set to the value after subtracting the maximum value and the median value of the frequency average value, the difference of the data is compared. The average size to determine whether debris occurs. That is, the larger the quartile range of the frequency average value included in the predetermined time calculated from the elastic wave signal of the elastic wave generated during cutting, the Fourier transform of the elastic wave signal of 1 line The greater the unevenness of the frequency characteristic data of each sampling division, if the quartile range exceeds the second threshold, it is judged that debris occurs in the workpiece W.
此外,亦可為設定第三臨限值,上述特徵量超過第三臨限值的次數一超過預先設定的次數,即判斷在切削刀43切削被加工物W的切口發生碎屑且在切削加工有異常的構成。但是,第三臨限值亦可為與第二臨限值為相同的值,亦可為不同的值。In addition, it is also possible to set the third threshold value. Once the number of times the feature quantity exceeds the third threshold value exceeds the preset number of times, it is determined that chipping occurs in the incision of the workpiece W by the cutting
例如,若將上述設定次數設定為3次,特徵量第3次超過第三臨限值時,判斷在被加工物W係發生碎屑。在圖8的圖表中,在P3附近第3次超過第三臨限值S3,此時藉由判斷手段77判斷已發生碎屑。若藉由判斷手段77判斷已發生碎屑,藉由報知手段78對操作人員等報知該要旨。For example, if the above-mentioned set number of times is set to 3 times, and the feature quantity exceeds the third threshold value for the third time, it is determined that chipping occurs in the workpiece W system. In the graph of FIG. 8, the third threshold S3 is exceeded for the third time near P3. At this time, it is determined by the determination means 77 that debris has occurred. If it is determined by the judging means 77 that debris has occurred, the notification means 78 is used to notify the operator or the like of the summary.
藉由使用如上所述所設定的特徵量,可精度更佳地判斷是否發生碎屑。By using the feature amount set as described above, it is possible to more accurately determine whether chipping occurs.
1:切削裝置 10:基座 11:蓋件 12:蛇腹蓋件 13:門型立柱 15:保持手段 150:吸引部 150a:保持面 151:框體 17:夾具 18:切削進給手段 180:滾珠螺桿 181:導軌 182:馬達 183:可動板 184:旋轉軸 20:匣盒收容區 21:匣盒升降手段 22:載台 24:洗淨手段 25:旋轉器平台 26:洗淨水噴嘴 30:分級進給手段 32:可動板 31:導軌 33:滾珠螺桿 330:旋轉軸 34:馬達 35:切削進給手段 36:導軌 37:支持構件 38:滾珠螺桿 380:旋轉軸 39:馬達 40:切削手段 41:心軸殼體 41a:心軸殼體的前端面 42:心軸 43:切削刀 44:螺孔 45:刀蓋 46:切削水供給手段 47:蓋件構件 48:托架 49:開口 51:刀架座 52:嵌合孔 53:軸套部 54:圓形凹部 55:貫穿孔 56:凸緣部 56a:凸緣部56的表面 56b:凸緣部56的背面 57:公螺旋部 58:墊圈 59:固定螺栓 61:輪轂基台 62:切刀 63:***孔 65:固定螺帽 71:AE感測器 73:第1線圈手段 74:第2線圈手段 75:控制手段 76:解析手段 77:判斷手段 78:報知手段 80:吸引手段 81:旋轉手段 82:旋轉軸 83:外殼 9:對準手段 90:攝影機 D:元件 L:分割預定線 W:被加工物 Wa:被加工物的表面 Wb:被加工物的背面 T:貼附膠帶 F:框架 S1:第一臨限值 S2:第二臨限值 S3:第三臨限值 P1:超過第一臨限值的點 P2:超過第二臨限值的點 P3:第三次超過第三臨限值的點 To:取樣時間 T1:預定的時間1: Cutting device 10: Pedestal 11: cover 12: Snake belly cover 13: Door type column 15: Keep the means 150: Attraction Department 150a: keep face 151: Frame 17: Fixture 18: Cutting feed means 180: Ball screw 181: Rail 182: Motor 183: movable plate 184: Rotation axis 20: Box storage area 21: Box lifting means 22: Stage 24: Washing means 25: Rotator platform 26: Washing water nozzle 30: Grading feed method 32: movable plate 31: Rail 33: Ball screw 330: Rotation axis 34: Motor 35: Cutting feed means 36: Rail 37: Supporting member 38: Ball screw 380: Rotation axis 39: Motor 40: Cutting means 41: Mandrel shell 41a: The front face of the spindle housing 42: Mandrel 43: Cutter 44: screw hole 45: knife cover 46: Cutting water supply means 47: cover member 48: bracket 49: opening 51: Tool holder seat 52: Fitting hole 53: Bushing 54: round recess 55: Through hole 56: Flange 56a: Surface of flange 56 56b: Back of flange 56 57: Male Spiral 58: Washer 59: fixing bolt 61: Hub abutment 62: Cutter 63: Insert hole 65: fixed nut 71: AE sensor 73: The first coil means 74: The second coil means 75: Control 76: Analysis 77: Judgment 78: Report 80: Attraction 81: Rotating means 82: Rotation axis 83: shell 9: Alignment means 90: Camera D: Components L: Split planned line W: to be processed Wa: The surface of the workpiece Wb: The back of the processed object T: Attach tape F: Frame S1: The first threshold S2: second threshold S3: The third threshold P1: The point exceeding the first threshold P2: The point exceeding the second threshold P3: The point where the third threshold is exceeded for the third time To: sampling time T1: scheduled time
[圖1]係表示切削裝置全體的斜視圖。 [圖2係表示構成切削手段的要素的斜視圖。 [圖3]係表示切削手段的剖面圖。 [圖4]係表示彈性波訊號的時間軸波形的圖表。 [圖5]係表示彈性波訊號的頻率軸波形的圖表。 [圖6]係表示彈性波訊號的頻率軸波形之中,200kHz至300kHz的頻帶的傅立葉轉換後的AE值的圖表。 [圖7]係表示在經彈性波訊號傅立葉轉換所得的頻率特性資料之中,200kHz至300kHz的頻帶的傅立葉轉換後的AE值的頻率平均值的變化的圖表。 [圖8]係標繪特徵量(由預定的時間內的傅立葉轉換後的AE值的頻率平均值的最大值扣掉中間值後的值、或該頻率平均值的四分位範圍)的圖表,用以判斷特徵量是否超過第2臨限值及第3臨限值的圖表。[Fig. 1] A perspective view showing the entire cutting device. [Fig. 2 is a perspective view showing the elements constituting the cutting means. [Fig. 3] A cross-sectional view showing the cutting means. [Figure 4] is a graph showing the time-axis waveform of the elastic wave signal. [Figure 5] is a graph showing the frequency axis waveform of the elastic wave signal. Fig. 6 is a graph showing the AE value after Fourier transform in the frequency band of 200 kHz to 300 kHz among the frequency axis waveforms of the elastic wave signal. Fig. 7 is a graph showing the change in the frequency average value of the AE value after the Fourier conversion of the frequency band from 200 kHz to 300 kHz among the frequency characteristic data obtained by the Fourier conversion of the elastic wave signal. [Fig. 8] A graph of the characteristic quantity (the value obtained by subtracting the median value from the maximum value of the frequency average value of the Fourier transformed AE value within a predetermined period of time, or the interquartile range of the frequency average value) , Used to judge whether the characteristic quantity exceeds the 2nd threshold and the 3rd threshold.
1:切削裝置 1: Cutting device
9:對準手段 9: Alignment means
10:基座 10: Pedestal
11:蓋件 11: cover
12:蛇腹蓋件 12: Snake belly cover
13:門型立柱 13: Door type column
15:保持手段 15: Keep the means
17:夾具 17: Fixture
18:切削進給手段 18: Cutting feed means
20:匣盒收容區 20: Box storage area
21:匣盒升降手段 21: Box lifting means
22:載台 22: Stage
24:洗淨手段 24: Washing means
25:旋轉器平台 25: Rotator platform
26:洗淨水噴嘴 26: Washing water nozzle
30:分級進給手段 30: Grading feed method
31:導軌 31: Rail
32:可動板 32: movable plate
33:滾珠螺桿 33: Ball screw
34:馬達 34: Motor
35:切削進給手段 35: Cutting feed means
36:導軌 36: Rail
37:支持構件 37: Supporting member
38:滾珠螺桿 38: Ball screw
39:馬達 39: Motor
40:切削手段 40: Cutting means
41:心軸殼體 41: Mandrel shell
42:心軸 42: Mandrel
43:切削刀 43: Cutter
45:刀蓋 45: knife cover
46:切削水供給手段 46: Cutting water supply means
75:控制手段 75: Control
80:吸引手段 80: Attraction
81:旋轉手段 81: Rotating means
82:旋轉軸 82: Rotation axis
83:外殼 83: shell
90:攝影機 90: Camera
150:吸引部 150: Attraction Department
150a:保持面 150a: keep face
151:框體 151: Frame
180:滾珠螺桿 180: Ball screw
181:導軌 181: Rail
182:馬達 182: Motor
183:可動板 183: movable plate
184:旋轉軸 184: Rotation axis
330:旋轉軸 330: Rotation axis
380:旋轉軸 380: Rotation axis
D:元件 D: Components
F:框架 F: Frame
L:分割預定線 L: Split planned line
T:貼附膠帶 T: Attach tape
W:被加工物 W: to be processed
Wa:被加工物的表面 Wa: The surface of the workpiece
Wb:被加工物的背面 Wb: The back of the processed object
Claims (3)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019-001782 | 2019-01-09 | ||
JP2019001782 | 2019-01-09 | ||
JP2019-003409 | 2019-01-11 | ||
JP2019003409A JP2020113641A (en) | 2019-01-09 | 2019-01-11 | Cutting device |
Publications (1)
Publication Number | Publication Date |
---|---|
TW202027909A true TW202027909A (en) | 2020-08-01 |
Family
ID=71667276
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW109100547A TW202027909A (en) | 2019-01-09 | 2020-01-08 | Cutting device to sense the debris generated in the incision with good accuracy |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP2020113641A (en) |
TW (1) | TW202027909A (en) |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1977857A1 (en) * | 2006-01-12 | 2008-10-08 | Tokyo Seimitsu Co.,Ltd. | Working system, contact detecting method, and ae contact detecting device |
JP5479855B2 (en) * | 2009-11-10 | 2014-04-23 | アピックヤマダ株式会社 | Cutting apparatus and cutting method |
JP6223239B2 (en) * | 2014-03-07 | 2017-11-01 | 株式会社ディスコ | Cutting equipment |
JP6846657B2 (en) * | 2017-01-20 | 2021-03-24 | 株式会社ディスコ | Cutting equipment |
JP6901906B2 (en) * | 2017-05-12 | 2021-07-14 | 株式会社ディスコ | Cutting equipment |
-
2019
- 2019-01-11 JP JP2019003409A patent/JP2020113641A/en active Pending
-
2020
- 2020-01-08 TW TW109100547A patent/TW202027909A/en unknown
Also Published As
Publication number | Publication date |
---|---|
JP2020113641A (en) | 2020-07-27 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR102446758B1 (en) | Machining system | |
JP6846657B2 (en) | Cutting equipment | |
US10150198B2 (en) | Method for inspecting cutting blade | |
US10121672B2 (en) | Cutting method for cutting processing-target object and cutting apparatus that cuts processing-target object | |
TWI672192B (en) | Processing device | |
KR102388222B1 (en) | Cutting apparatus | |
JP6866217B2 (en) | Cutting equipment | |
TWI772361B (en) | Cutting method of workpiece | |
JP6125867B2 (en) | Cutting method | |
TWI760478B (en) | Cutting device | |
JP7379064B2 (en) | cutting equipment | |
TW202027909A (en) | Cutting device to sense the debris generated in the incision with good accuracy | |
US20180333895A1 (en) | Cutting blade detecting mechanism for cutting apparatus | |
JP5815422B2 (en) | Grinding equipment | |
TW201816863A (en) | Method of detecting spot shape of pulsed laser beam | |
JP6699930B2 (en) | Cutting equipment | |
JP6689534B2 (en) | Mounting flange end face correction method and cutting device | |
JP6489429B2 (en) | Wafer chuck clogging inspection apparatus and inspection method | |
US20220266419A1 (en) | Grinding method and grinding apparatus | |
JP2023143278A (en) | Dicing device | |
JP2024054363A (en) | Workpiece processing apparatus and workpiece processing method | |
JP2024080255A (en) | Method for detecting the height of the transfer arm | |
JP2002039728A (en) | Method for recognizing mounting state of plate body on machine tool | |
JP2023102923A (en) | Grinding device | |
TW202106441A (en) | Method for detecting location of cutting unit and cutting apparatus capable of appropriately carrying out a step of setting up a height of a cutting blade |