TW202022975A - Substrate conveying device and coating device capable of smoothly conveying substrate to platform that is applied with buoyancy from lower side to support substrate and preventing poor conveying or damage of substrate - Google Patents

Substrate conveying device and coating device capable of smoothly conveying substrate to platform that is applied with buoyancy from lower side to support substrate and preventing poor conveying or damage of substrate Download PDF

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TW202022975A
TW202022975A TW108141888A TW108141888A TW202022975A TW 202022975 A TW202022975 A TW 202022975A TW 108141888 A TW108141888 A TW 108141888A TW 108141888 A TW108141888 A TW 108141888A TW 202022975 A TW202022975 A TW 202022975A
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substrate
conveying
roller
platform
transfer
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TW108141888A
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TWI753324B (en
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大宅宗明
鈴木啓悟
塩田明仁
黒枝篤史
富藤幸雄
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日商斯庫林集團股份有限公司
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B13/00—Machines or plants for applying liquids or other fluent materials to surfaces of objects or other work by spraying, not covered by groups B05B1/00 - B05B11/00
    • B05B13/02—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work
    • B05B13/0221—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work characterised by the means for moving or conveying the objects or other work, e.g. conveyor belts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67715—Changing the direction of the conveying path
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B13/00—Machines or plants for applying liquids or other fluent materials to surfaces of objects or other work by spraying, not covered by groups B05B1/00 - B05B11/00
    • B05B13/02—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work
    • B05B13/04—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work the spray heads being moved during spraying operation
    • B05B13/0405—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work the spray heads being moved during spraying operation with reciprocating or oscillating spray heads
    • B05B13/041—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work the spray heads being moved during spraying operation with reciprocating or oscillating spray heads with spray heads reciprocating along a straight line
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67754—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a batch of workpieces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P60/00—Technologies relating to agriculture, livestock or agroalimentary industries
    • Y02P60/20—Reduction of greenhouse gas [GHG] emissions in agriculture, e.g. CO2
    • Y02P60/21—Dinitrogen oxide [N2O], e.g. using aquaponics, hydroponics or efficiency measures

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Coating Apparatus (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The present invention provides a substrate conveying device and a coating device that may smoothly convey the substrate to a platform that is applied with buoyancy from the lower side to support the substrate and may prevent the poor conveying or damage of substrate. The substrate conveying device of the present invention may set the horizontal direction orthogonal to the substrate conveying direction as the width direction, and then the substrate supporting platform, while looking down, has an extension portion that has the edge at the most upstream side along the conveying direction at least extended to the position of the shaft of the conveying roller at the different position from the conveying roller along the width direction. The height of the upper surface of the extension portion is the same as that of the substrate supporting surface and is connected with the substrate supporting surface. The conveying rollers that are positioned at the upper position by a lifting mechanism may convey the substrates until the front end of the substrate, while looking down, reaches a further downstream position than the shaft of the conveying roller; then, the lifting mechanism may lower the conveying rollers to the lower position, so as to transfer the substrate from the conveying rollers to the substrate supporting platform.

Description

基板搬送裝置及塗布裝置Substrate conveying device and coating device

本發明是涉及一種以水準姿勢搬送基板的基板搬送裝置，特別是涉及一種將由輥搬送的基板移交至噴出氣體的平台的技術。再者，所述基板包括半導體基板、光掩模用基板、液晶顯示用基板、有機電致發光（Electroluminescence，EL）顯示用基板、等離子體顯示用基板、場發射顯示器（Field Emission Display，FED）用基板、光碟用基板、磁片用基板及磁光碟用基板等。The present invention relates to a substrate conveying device that conveys a substrate in a horizontal posture, and more particularly, to a technique for transferring a substrate conveyed by a roller to a platform where a gas is ejected. Furthermore, the substrate includes a semiconductor substrate, a photomask substrate, a liquid crystal display substrate, an organic electroluminescence (EL) display substrate, a plasma display substrate, and a field emission display (FED) Use substrates, substrates for optical disks, substrates for magnetic sheets, substrates for magneto-optical disks, etc.

在半導體裝置或液晶顯示裝置等電子零件等的製造工序中，為了實現對於基板的加工處理，大多採用以水準姿勢搬送基板的工藝。其中，存在如下者：自水準且平坦的平台的上表面噴出氣體而在自下方對基板施加浮力的狀態下支撐基板。In the manufacturing process of electronic components such as semiconductor devices and liquid crystal display devices, in order to realize processing of substrates, a process of conveying the substrates in a horizontal posture is often adopted. Among them, there is one in which gas is ejected from the upper surface of a level and flat platform to support the substrate in a state where buoyancy is applied to the substrate from below.

例如，專利文獻1中所記載的技術涉及一種對基板塗布處理液的裝置。在所述技術中，在使基板在噴出氣體的平台上上浮的狀態下，對基板進行塗布液的塗布。基板向平台的搬送是藉由與基板的下表面抵接的輥（輥子）輸送機來進行。 [現有技術文獻] [專利文獻]For example, the technique described in Patent Document 1 relates to an apparatus for applying a processing liquid to a substrate. In this technique, the substrate is coated with a coating liquid in a state where the substrate is floated on a platform where the gas is ejected. The transfer of the substrate to the platform is performed by a roller (roller) conveyor that abuts on the lower surface of the substrate. [Prior Art Literature] [Patent Literature]

[專利文獻1]日本專利第5346643號 [發明所欲解決之課題][Patent Document 1] Japanese Patent No. 5346643 [Problems to be solved by the invention]

伴隨基板的大型化及薄型化，搬送路徑中的基板的姿勢的維持成為問題。例如，在自下方局部支撐基板的情況下，存在與受到支撐的部位相比，其他部位向下方撓曲的問題。所述自下方施加浮力的方法可應對此種問題而將基板保持為平坦的狀態。然而，在將基板載置於平台時，可產生相同的問題。即，由輸送機搬送的基板的前端部有可能下垂而與平台中的搬送方向上的上游側端面碰撞。由此，產生基板的搬送延遲或損傷基板的問題。With the increase in size and thickness of the substrate, the maintenance of the posture of the substrate in the transport path becomes a problem. For example, when the substrate is partially supported from below, there is a problem that other parts are bent downward compared to the supported parts. The method of applying buoyancy from below can cope with this problem and keep the substrate in a flat state. However, when the substrate is placed on the platform, the same problem can occur. That is, the front end of the substrate conveyed by the conveyor may sag and collide with the upstream end surface in the conveying direction of the platform. As a result, there is a problem that the transport of the substrate is delayed or the substrate is damaged.

本發明是鑒於所述課題而完成的，其目的在於提供一種可順暢地進行向自下方施加浮力來支撐基板的平台搬送基板且防止基板的搬送不良或損傷的技術。The present invention was made in view of the above-mentioned problems, and its object is to provide a technique that can smoothly convey a substrate to a platform that supports the substrate by applying buoyancy from below, and prevents defective conveyance or damage of the substrate.

[解決課題之手段][Means to solve the problem]

本發明的一實施方式為一種基板搬送裝置，其以水準姿勢搬送基板，為了達成所述目的，所述基板搬送裝置包括：搬送輥，自下方支撐所述基板並且加以旋轉，由此沿水準方向搬送所述基板；基板支撐平台，具有在所述基板的搬送方向上與所述搬送輥的下游側鄰接配置的水準的平坦面即基板支撐面，接受由所述搬送部搬送的所述基板，並自所述基板支撐面噴出氣體而自下方對所述基板施加浮力並且進行支撐；以及升降機構，使所述搬送輥升降而使所述搬送輥在上部位置與下部位置之間移動，所述上部位置為所述搬送輥的上端較所述基板支撐平台的上表面更靠上方，所述下部位置為所述搬送輥的上端較所述基板支撐平台的上表面更靠下方。這裡，在將與所述搬送方向正交的水準方向定義為寬度方向時，所述基板支撐平台具有朝向所述搬送方向的上游側端部部分地延伸的延伸部，在俯視時與所述搬送輥在所述寬度方向上不同的位置，所述延伸部的所述搬送方向上的最上游側端部至少延伸至所述搬送輥的旋轉軸的位置，所述延伸部的上表面的高度與所述基板支撐面相同且與所述基板支撐面連接。並且，由所述升降機構定位於所述上部位置的所述搬送輥搬送所述基板，直至俯視時所述基板的所述搬送方向的前端部到達較所述搬送輥的旋轉軸更靠所述搬送方向的下游位置處，其後，所述升降機構使所述搬送輥下降至所述下部位置，由此將所述基板自所述搬送輥移交至所述基板支撐平台。One embodiment of the present invention is a substrate conveying device that conveys substrates in a horizontal posture. To achieve the objective, the substrate conveying device includes: a conveying roller that supports and rotates the substrate from below, thereby moving in a horizontal direction Conveying the substrate; a substrate support platform having a level flat surface that is arranged adjacent to the downstream side of the conveying roller in the conveying direction of the substrate, that is, a substrate supporting surface, and receiving the substrate conveyed by the conveying section, And ejecting gas from the substrate support surface to apply buoyancy to the substrate from below and support it; and an elevating mechanism that raises and lowers the conveying roller to move the conveying roller between an upper position and a lower position, the The upper position is that the upper end of the transfer roller is higher than the upper surface of the substrate support platform, and the lower position is that the upper end of the transfer roller is lower than the upper surface of the substrate support platform. Here, when the horizontal direction orthogonal to the conveying direction is defined as the width direction, the substrate support platform has an extension part that partially extends toward the upstream end of the conveying direction, and is connected to the conveying direction in a plan view. Rollers are at different positions in the width direction, the most upstream end of the extension in the conveying direction extends at least to the position of the rotation axis of the conveying roller, and the height of the upper surface of the extension is equal to The substrate supporting surface is the same and connected to the substrate supporting surface. Furthermore, the transfer roller positioned at the upper position by the elevating mechanism transfers the substrate until the tip of the substrate in the transfer direction in a plan view reaches closer to the rotation axis of the transfer roller At a downstream position in the conveying direction, after that, the lifting mechanism lowers the conveying roller to the lower position, thereby transferring the substrate from the conveying roller to the substrate supporting platform.

在以所述方式構成的發明中，基板自搬送基板的搬送輥向基板支撐平台的移交並非藉由向搬送方向搬送基板來實現，而是藉由搬送輥的下降來實現。具體而言，如下所述。再者，以下，只要無特別說明，則“上游”及“下游”這一用語與利用搬送輥的基板的搬送方向相關地使用。In the invention constituted as described above, the transfer of the substrate from the transfer roller that transfers the substrate to the substrate support platform is not achieved by transferring the substrate in the transfer direction, but by lowering the transfer roller. Specifically, it is as follows. In addition, in the following, unless otherwise specified, the terms "upstream" and "downstream" are used in relation to the conveying direction of the substrate by the conveying roller.

在本發明中，自下方對基板施加浮力來支撐基板的基板支撐平台具有在基板的搬送方向上至少延伸至搬送輥的旋轉軸的位置的延伸部。延伸部的上表面與基板支撐平台的基板支撐面連接，它們的高度也相同。而且，藉由定位於上部位置的搬送輥而將基板搬送至所述基板的前端部俯視時超過搬送輥的旋轉軸位置的位置處。在所述時刻點，基板的前端部移動至較延伸部的最上游側端部更靠下游側處。In the present invention, the substrate support platform that applies buoyancy to the substrate from below to support the substrate has an extension that extends at least to the position of the rotation shaft of the transfer roller in the transfer direction of the substrate. The upper surface of the extension part is connected with the substrate support surface of the substrate support platform, and their heights are also the same. Then, the substrate is transported to a position beyond the position of the rotation axis of the transport roller in a plan view of the front end portion of the substrate by the transport roller positioned at the upper position. At this point in time, the front end of the substrate moves to the downstream side of the most upstream end of the extension.

即，此時，俯視時基板與延伸部部分地重疊。但是，在所述時刻點，搬送輥處於上部位置，所述搬送輥的上端位於較基板支撐面及延伸部上表面更靠上方處。因此，被搬送輥支撐的基板的下表面也位於較支撐面及延伸部上表面更靠上方處，基板不與基板支撐平台接觸。換言之，在所述時刻點，基板的前端部位於包括延伸部的基板支撐平台的上方。That is, at this time, the substrate and the extension part partially overlap in a plan view. However, at this point in time, the transport roller is at the upper position, and the upper end of the transport roller is located above the substrate support surface and the upper surface of the extension. Therefore, the lower surface of the substrate supported by the transfer roller is also located above the support surface and the upper surface of the extension portion, and the substrate does not contact the substrate support platform. In other words, at the time point, the front end of the substrate is located above the substrate support platform including the extension.

因此，當自所述狀態使搬送輥下降時，基板的前端部搭載於與基板支撐面連接的延伸部的上表面。即，基板自搬送輥向基板支撐平台的移交可無需向搬送方向搬送基板而藉由搬送輥的下降來實現。因此，可事先防止基板的前端部與基板支撐平台或延伸部的端面接觸。 [發明的效果]Therefore, when the transport roller is lowered from the above state, the front end portion of the substrate is mounted on the upper surface of the extension portion connected to the substrate supporting surface. That is, the transfer of the substrate from the transfer roller to the substrate support platform can be achieved by the lowering of the transfer roller without the need to transfer the substrate in the transfer direction. Therefore, it is possible to prevent the front end of the substrate from contacting the end surface of the substrate support platform or the extension in advance. [Effect of invention]

如上所述，根據本發明，可順暢地執行向自下方施加浮力來支撐基板的基板支撐平台搬送基板，而不會產生因基板的前端部與平台端面接觸而引起的基板的搬送不良或損傷。As described above, according to the present invention, it is possible to smoothly transfer the substrate to the substrate support platform that supports the substrate by applying buoyancy from below, without causing defective or damaged substrate transfer due to contact between the front end of the substrate and the end surface of the platform.

圖1是示意性表示作為本發明的基板搬送裝置的一實施方式的塗布裝置的整體構成的圖。另外，圖2是自鉛垂上方觀察塗布裝置的平面圖。所述塗布裝置1為對自圖1的左手側朝向右手側以水準姿勢搬送的基板S的上表面Sf塗布塗布液的狹縫塗布機。再者，在以下的各圖中，為了明確裝置各部的配置關係，將基板S的搬送方向設為“X方向”，將自圖1的左手側朝向右手側的水準方向稱為“+X方向”，將相反方向稱為“-X方向”。另外，將與X方向正交的水準方向Y中的裝置的正面側稱為“-Y方向”，並且將裝置的背面側稱為“+Y方向”。進而，將鉛垂方向Z的上方向及下方向分別稱為“+Z方向”及“-Z方向”。FIG. 1 is a diagram schematically showing the overall configuration of a coating device as an embodiment of the substrate transport device of the present invention. In addition, FIG. 2 is a plan view of the coating device viewed from a vertical upper side. The coating device 1 is a slit coating machine that applies a coating liquid to the upper surface Sf of the substrate S conveyed in a horizontal posture from the left-hand side to the right-hand side in FIG. 1. In addition, in the following figures, in order to clarify the arrangement relationship of the various parts of the device, the conveying direction of the substrate S is referred to as the "X direction", and the horizontal direction from the left hand side to the right hand side of FIG. 1 is referred to as the "+X direction" ", the opposite direction is called "-X direction". In addition, the front side of the device in the horizontal direction Y orthogonal to the X direction is referred to as "-Y direction", and the back side of the device is referred to as "+Y direction". Furthermore, the upper direction and the lower direction of the vertical direction Z are respectively called "+Z direction" and "-Z direction".

首先，使用圖1及圖2對所述塗布裝置1的構成及動作的概要進行說明，其後，對各部分的更詳細的結構進行說明。再者，塗布裝置1的基本構成或動作原理與所述專利文獻1（日本專利第5346643號）中所記載者共通。因此，在本說明書中，關於塗布裝置1的各構成中的可應用與所述公知文獻中所記載者相同的構成者、以及可根據這些文獻的記載而容易理解結構者，省略詳細說明，並主要說明本實施方式的特徵部分。First, the outline of the configuration and operation of the coating device 1 will be described using FIG. 1 and FIG. 2, and then, the more detailed configuration of each part will be described. In addition, the basic configuration and operating principle of the coating device 1 are the same as those described in Patent Document 1 (Japanese Patent No. 5346643). Therefore, in this specification, regarding the various configurations of the coating device 1 that can be applied to the same configurations as those described in the known literature, and those that can easily understand the configuration based on the description of these literatures, detailed description is omitted, and The characteristic part of this embodiment is mainly explained.

在塗布裝置1中，沿著基板S的搬送方向Dt（+X方向）依序近接配置有輸入輸送機100、輸入移載部2、上浮平台部3、輸出移載部4、輸出輸送機110，如以下詳述般，由這些形成沿大致水準方向延伸的基板S的搬送路徑。再者，在以下的說明中，在與基板S的搬送方向Dt相關聯地表示位置關係時，有時將“基板S的搬送方向Dt上的上游”簡稱為“上游”，另外，將“基板S的搬送方向Dt上的下游”簡稱為“下游”。在所述例中，自某基準位置觀察，（-X）側相對地相當於“上游”，（+X）側相對地相當於“下游”。In the coating device 1, an input conveyor 100, an input transfer unit 2, a floating platform unit 3, an output transfer unit 4, and an output conveyor 110 are arranged in close proximity along the conveying direction Dt (+X direction) of the substrate S in this order. As described in detail below, these form a conveyance path of the substrate S extending in a substantially horizontal direction. In addition, in the following description, when the positional relationship is expressed in relation to the conveyance direction Dt of the substrate S, the "upstream in the conveyance direction Dt of the substrate S" is sometimes simply referred to as "upstream". "Downstream in the conveying direction Dt of S" is simply referred to as "downstream". In the above example, viewed from a certain reference position, the (-X) side is relatively equivalent to “upstream”, and the (+X) side is relatively equivalent to “downstream”.

作為處理對象的基板S自圖1的左手側搬入至輸入輸送機100。輸入輸送機100包括輥子輸送機101以及旋轉驅動所述輥子輸送機101的旋轉驅動機構102，藉由輥子輸送機101的旋轉而將基板S以水準姿勢向下游側即（+X）方向搬送。輸入移載部2包括：輸送機，具有多個搬送輥21；以及旋轉/升降驅動機構22，具有旋轉驅動所述輸送機的功能及使所述輸送機升降的功能。藉由使搬送輥21旋轉而進一步向（+X）方向搬送基板S。另外，藉由使搬送輥21升降而變更基板S的鉛垂方向位置。藉由以所述方式構成的輸入移載部2而將基板S自輸入輸送機100移載至上浮平台部3。The substrate S to be processed is carried in to the input conveyor 100 from the left hand side of FIG. 1. The input conveyor 100 includes a roller conveyor 101 and a rotary drive mechanism 102 that rotatably drives the roller conveyor 101, and conveys the substrate S in a horizontal posture to the downstream side, that is, in the (+X) direction by the rotation of the roller conveyor 101. The input transfer unit 2 includes: a conveyor having a plurality of conveying rollers 21; and a rotation/elevating drive mechanism 22 having a function of rotationally driving the conveyor and a function of lifting the conveyor. The substrate S is further transported in the (+X) direction by rotating the transport roller 21. In addition, the vertical position of the substrate S is changed by raising and lowering the transport roller 21. The substrate S is transferred from the input conveyor 100 to the floating platform part 3 by the input transfer part 2 configured as described above.

上浮平台部3包括沿著基板的搬送方向Dt進行了三分割的平板狀的平台。即，上浮平台部3包括入口上浮平台31、塗布平台32及出口上浮平台33，這些各平台的上表面相互形成同一平面的一部分。在入口上浮平台31及出口上浮平台33各自的上表面呈矩陣狀設置有多個噴出孔，所述噴出孔噴出自上浮控制機構35供給的壓縮空氣，藉由自所噴出的氣流施加的浮力而使基板S上浮。如此，在基板S的下表面Sb自平台上表面離開的狀態下以水準姿勢受到支撐。基板S的下表面Sb與平台上表面的距離即上浮量例如可設為10微米至500微米。The floating platform part 3 includes a flat platform divided into three along the substrate conveyance direction Dt. That is, the floating platform part 3 includes an entrance floating platform 31, a coating platform 32, and an exit floating platform 33, and the upper surfaces of these platforms form part of the same plane with each other. On the upper surface of each of the inlet floating platform 31 and the outlet floating platform 33, a plurality of ejection holes are provided in a matrix. The ejection holes eject compressed air supplied from the floating control mechanism 35, and are generated by the buoyancy applied from the ejected airflow. The substrate S is floated. In this way, the lower surface Sb of the substrate S is supported in a horizontal posture in a state where it is separated from the upper surface of the platform. The distance between the lower surface Sb of the substrate S and the upper surface of the platform, that is, the amount of floating can be set to, for example, 10 micrometers to 500 micrometers.

另一方面，在塗布平台32的上表面交替地配置有噴出壓縮空氣的噴出孔及抽吸基板S的下表面Sb與平台上表面之間的空氣的抽吸孔。藉由上浮控制機構35控制來自噴出孔的壓縮空氣的噴出量與來自抽吸孔的抽吸量而精密地控制基板S的下表面Sb與塗布平台32的上表面的距離。由此，將通過塗布平台32的上方的基板S的上表面Sf的鉛垂方向位置控制為規定值。On the other hand, on the upper surface of the coating platform 32, spray holes for spraying compressed air and suction holes for sucking air between the lower surface Sb of the substrate S and the upper surface of the platform are alternately arranged. The floating control mechanism 35 controls the ejection amount of compressed air from the ejection hole and the suction amount from the suction hole to precisely control the distance between the lower surface Sb of the substrate S and the upper surface of the coating platform 32. As a result, the vertical position of the upper surface Sf of the substrate S passing above the coating stage 32 is controlled to a predetermined value.

再者，在入口上浮平台31配設有未圖示的頂銷，在上浮平台部3設置有使所述頂銷升降的頂銷驅動機構34。另外，在入口上浮平台31的上游側端部，即，圖1中的作為左側的（-X）方向側的端部安裝有轉接板39。所述轉接板39的詳細結構及功能將在後面敘述，轉接板39是出於順暢地進行基板S自輸入移載部2向入口上浮平台31的移交的目的而設置。In addition, a top pin (not shown) is arranged on the entrance floating platform 31, and a top pin driving mechanism 34 for raising and lowering the top pin is provided on the floating platform portion 3. In addition, an adapter plate 39 is attached to the upstream end of the entrance floating platform 31, that is, the end on the (-X) direction side as the left side in FIG. 1. The detailed structure and function of the adapter plate 39 will be described later. The adapter plate 39 is provided for the purpose of smoothly transferring the substrate S from the input transfer part 2 to the entrance floating platform 31.

經由輸入移載部2而搬入至上浮平台部3的基板S藉由搬送輥21的旋轉而被施加向（+X）方向的推進力，從而搬送至入口上浮平台31上。入口上浮平台31、塗布平台32及出口上浮平台33將基板S支撐為上浮狀態，但不具有使基板S沿水準方向移動的功能。藉由配置於入口上浮平台31、塗布平台32及出口上浮平台33的下方的基板搬送部5而進行上浮平台部3中的基板S的搬送。The substrate S carried into the floating platform 3 via the input transfer unit 2 is transferred to the entrance floating platform 31 by applying a propelling force in the (+X) direction by the rotation of the transfer roller 21. The entrance floating platform 31, the coating platform 32, and the exit floating platform 33 support the substrate S in a floating state, but do not have the function of moving the substrate S in the horizontal direction. The substrate S in the floating platform section 3 is transported by the substrate transport section 5 disposed below the entrance floating platform 31, the coating platform 32, and the exit floating platform 33.

基板搬送部5包括：吸盤機構51，藉由與基板S的下表面周緣部部分地抵接而自下方支撐基板S；以及吸附/行進控制機構52。吸附/行進控制機構52具有對設置於吸盤機構51上端的吸附構件的吸附墊及吸附槽（均省略圖示）施加負壓來吸附保持基板S的功能以及使吸盤機構51沿X方向往返行進的功能。在吸盤機構51保持著基板S的狀態下，基板S的下表面Sb位於較上浮平台部3的各平台的上表面更高的位置處。因此，基板S藉由吸盤機構51而吸附保持周緣部，並且藉由自上浮平台部3施加的浮力而整體維持水準姿勢。The substrate conveying unit 5 includes a chuck mechanism 51 that supports the substrate S from below by partially contacting the peripheral edge of the lower surface of the substrate S; and a suction/advance control mechanism 52. The suction/advance control mechanism 52 has the function of applying negative pressure to the suction pad and the suction groove (all omitted) of the suction member provided on the upper end of the suction mechanism 51 to suck and hold the substrate S, and the function of causing the suction mechanism 51 to travel back and forth in the X direction Features. In a state where the chuck mechanism 51 holds the substrate S, the lower surface Sb of the substrate S is located at a higher position than the upper surface of each platform of the floating platform portion 3. Therefore, the substrate S is sucked and held by the chuck mechanism 51 to hold the peripheral edge portion, and the overall horizontal posture is maintained by the buoyancy force applied from the floating platform portion 3.

吸盤機構51保持自輸入移載部2搬入至上浮平台部3的基板S，在所述狀態下，吸盤機構51向（+X）方向移動，由此將基板S自入口上浮平台31的上方經由塗布平台32的上方搬送至出口上浮平台33的上方。所搬送的基板S被移交至配置於出口上浮平台33的（+X）側的輸出移載部4。The chuck mechanism 51 holds the substrate S carried in from the input transfer section 2 to the floating platform section 3. In this state, the chuck mechanism 51 moves in the (+X) direction, thereby passing the substrate S from above the entrance floating platform 31 The upper part of the coating platform 32 is conveyed to the upper part of the exit floating platform 33. The transferred substrate S is transferred to the output transfer unit 4 arranged on the (+X) side of the exit floating platform 33.

輸出移載部4包括：輥子輸送機41；以及旋轉/升降驅動機構42，具有旋轉驅動所述輥子輸送機41的功能及使所述輥子輸送機41升降的功能。藉由使輥子輸送機41旋轉而對基板S施加向（+X）方向的推進力，沿著搬送方向Dt進一步搬送基板S。另外，藉由使輥子輸送機41升降而變更基板S的鉛垂方向位置。然後，藉由輸出移載部4而將基板S自出口上浮平台33的上方移載至輸出輸送機110。The output transfer unit 4 includes: a roller conveyor 41; and a rotation/elevating drive mechanism 42 that has a function of rotating the roller conveyor 41 and a function of lifting the roller conveyor 41. By rotating the roller conveyor 41, a pushing force in the (+X) direction is applied to the substrate S, and the substrate S is further transported along the transport direction Dt. In addition, the vertical position of the substrate S is changed by raising and lowering the roller conveyor 41. Then, the substrate S is transferred to the output conveyor 110 from above the exit floating platform 33 by the output transfer unit 4.

輸出輸送機110包括：輥子輸送機111；以及旋轉驅動機構112，旋轉驅動所述輥子輸送機111；藉由輥子輸送機111的旋轉而進一步向（+X）方向搬送基板S，最終送出至塗布裝置1外。再者，輸入輸送機100及輸出輸送機110可設置為塗布裝置1的構成的一部分，但也可為獨立於塗布裝置1的構件。另外，例如，設置於塗布裝置1的上游側的其它單元的基板送出機構可用作輸入輸送機100。另外，設置於塗布裝置1的下游側的其它單元的基板接受機構可用作輸出輸送機110。The output conveyor 110 includes: a roller conveyor 111; and a rotation driving mechanism 112 to rotationally drive the roller conveyor 111; by the rotation of the roller conveyor 111, the substrate S is further transported in the (+X) direction, and finally sent to the coating Outside the device 1. Furthermore, the input conveyor 100 and the output conveyor 110 may be provided as a part of the configuration of the coating device 1, but may also be components independent of the coating device 1. In addition, for example, a substrate delivery mechanism of another unit provided on the upstream side of the coating device 1 may be used as the input conveyor 100. In addition, a substrate receiving mechanism of another unit provided on the downstream side of the coating device 1 can be used as the output conveyor 110.

在以所述方式搬送的基板S的搬送路徑上配置有用以對基板S的上表面Sf塗布塗布液的塗布機構7。塗布機構7包括包含為狹縫噴嘴的噴嘴71的噴嘴單元70。對於噴嘴71而言，自塗布液供給部78供給塗布液，自在噴嘴下部朝下且以Y方向為長邊方向呈狹縫狀開口的噴出口711噴出塗布液。A coating mechanism 7 for coating the upper surface Sf of the substrate S with a coating liquid is arranged on the conveyance path of the substrate S conveyed in this manner. The coating mechanism 7 includes a nozzle unit 70 including a nozzle 71 which is a slit nozzle. For the nozzle 71, the coating liquid is supplied from the coating liquid supply unit 78, and the coating liquid is ejected from the ejection port 711 that opens downward in a slit shape with the Y direction as the longitudinal direction.

噴嘴71可藉由定位機構73而在X方向及Z方向上進行移動定位。藉由定位機構73而將噴嘴71定位於塗布平台32的上方的塗布位置（在圖1中，點線所表示的位置）。自定位於塗布位置的噴嘴71噴出塗布液而塗布在與塗布平台32之間搬送而來的基板S上。如此，對基板S進行塗布液的塗布。The nozzle 71 can be moved and positioned in the X direction and the Z direction by the positioning mechanism 73. The nozzle 71 is positioned at a coating position (a position indicated by a dotted line in FIG. 1) above the coating platform 32 by the positioning mechanism 73. The coating liquid is ejected from the nozzle 71 positioned at the coating position and coated on the substrate S conveyed from the coating platform 32. In this way, the coating liquid is applied to the substrate S.

此外，在塗布裝置1中設置有用以控制裝置各部的動作的控制單元9。控制單元9包括存儲規定的控制程式或各種資料的記憶元件、藉由執行所述控制程式而使裝置各部執行規定的動作的中央處理器（Central Processing Unit，CPU）等運算元件、承擔與使用者或外部裝置的資訊交換的介面元件等。In addition, the coating apparatus 1 is provided with a control unit 9 for controlling the operation of each part of the apparatus. The control unit 9 includes a memory element that stores a prescribed control program or various data, a central processing unit (CPU) and other computing elements that make each part of the device perform prescribed actions by executing the control program. Or interface components for information exchange of external devices.

以下，一面參照圖2，一面對塗布裝置1的機械構成進一步進行說明。關於若干個機構，可藉由參照所述日本專利第5346643號的記載來理解更詳細的結構。再者，在圖2中，省略了輸入輸送機100等所具有的輥子的記載。Hereinafter, while referring to FIG. 2, the mechanical configuration of the coating device 1 will be further described. Regarding several mechanisms, a more detailed structure can be understood by referring to the description of Japanese Patent No. 5346643. In addition, in FIG. 2, the description of the rollers which the input conveyor 100 etc. have is omitted.

塗布機構7的噴嘴單元70包括噴嘴71以及使所述噴嘴71移動而定位於規定位置的定位機構73。如圖2所示，定位機構73具有架橋結構。具體而言，定位機構73具有利用自基台10向上方豎立設置的一對柱構件732、733支撐在上浮平台部3的上方沿Y方向延伸的樑構件731的Y方向兩端部的結構。在柱構件732、733上分別安裝有例如由滾珠絲杠機構構成的升降機構（省略圖示），藉由這些升降機構而樑構件731的（-Y）側及（+Y）側端部升降自如地受到支撐。藉由升降機構根據來自控制單元9的控制指令而聯動，樑構件731在保持水準姿勢的狀態下沿鉛垂方向（Z方向）移動。The nozzle unit 70 of the coating mechanism 7 includes a nozzle 71 and a positioning mechanism 73 that moves the nozzle 71 and positions it at a predetermined position. As shown in FIG. 2, the positioning mechanism 73 has a bridge structure. Specifically, the positioning mechanism 73 has a structure in which a pair of column members 732 and 733 erected upward from the base 10 are supported on both ends of the beam member 731 extending in the Y direction above the floating platform 3. The column members 732 and 733 are respectively equipped with lifting mechanisms (not shown) constituted by a ball screw mechanism, and the (-Y) side and (+Y) side ends of the beam member 731 are raised and lowered by these lifting mechanisms. Be supported freely. As the elevating mechanism is linked in accordance with the control command from the control unit 9, the beam member 731 moves in the vertical direction (Z direction) while maintaining the horizontal posture.

柱構件732、733構成為可在基台10上沿X方向移動。具體而言，在基台10的（+Y）側及（-Y）側端部上表面分別安裝有在X方向上延伸設置的一對行進導桿81L、81R。另外，在柱構件732、733的下部安裝有未圖示的滑塊，滑塊與行進導桿81L、81R卡合。由此，定位機構73在X方向上移動自如地受到支撐。定位機構73還包括由控制單元9控制的線性馬達、滾珠絲杠機構等適宜的驅動機構（省略圖示）。因此，藉由定位機構73的各部根據來自控制單元9的控制指令而動作，可實現噴嘴單元70在X方向及Z方向上的移動。The column members 732 and 733 are configured to be movable in the X direction on the base 10. Specifically, a pair of traveling guide rods 81L and 81R extending in the X direction are respectively attached to the upper surfaces of the (+Y) side and (-Y) side end portions of the base 10. In addition, a slider (not shown) is attached to the lower part of the column members 732, 733, and the slider is engaged with the traveling guide rods 81L, 81R. Thereby, the positioning mechanism 73 is movably supported in the X direction. The positioning mechanism 73 also includes an appropriate drive mechanism (not shown) such as a linear motor and a ball screw mechanism controlled by the control unit 9. Therefore, the movement of the nozzle unit 70 in the X direction and the Z direction can be realized by operating each part of the positioning mechanism 73 in accordance with the control command from the control unit 9.

在噴嘴單元70的樑構件731的中央下部以使噴出口711（圖1）朝下的方式安裝有噴嘴71。結果，定位機構73根據控制單元9的控制指令而使噴嘴單元70移動，由此噴嘴71在X方向及Z方向上移動，由此可實現與動作工藝的進行對應的向規定位置的定位。The nozzle 71 is attached to the lower center of the beam member 731 of the nozzle unit 70 so that the ejection port 711 (FIG. 1) faces downward. As a result, the positioning mechanism 73 moves the nozzle unit 70 in accordance with the control command of the control unit 9, whereby the nozzle 71 moves in the X direction and the Z direction, thereby realizing positioning to a predetermined position corresponding to the progress of the operation process.

另外，在基台10設置有一對行進導桿87L、87R。用以在上浮平台部3的上方搬送基板S的吸盤機構51與這些行進導桿87L、87R卡合而可沿X方向移動。In addition, a pair of traveling guide rods 87L and 87R are provided on the base 10. The chuck mechanism 51 for conveying the substrate S above the floating platform part 3 is engaged with these traveling guide rods 87L and 87R and can move in the X direction.

圖3是表示輸入移載部的結構的圖。如圖3的（a）所示，輸入移載部2包括包含多個搬送輥21的輸送機。更具體而言，在搬送方向Dt（X方向）及與所述搬送方向Dt正交的寬度方向（Y方向）上分別排列有多個搬送輥21。在所述例中，在X方向上排列有兩個搬送輥，且在Y方向上排列有四個搬送輥，但搬送輥的排列數並不限定於此。以下，在需要將在X方向上排列的搬送輥21加以區分的情況下，對這些中的搬送方向Dt上的上游側即（-X）方向側者（上游側搬送輥）標注符號211，對下游側即（+X）方向側者（下游側搬送輥）標注符號212。Fig. 3 is a diagram showing the structure of an input transfer unit. As shown in FIG. 3( a ), the input transfer unit 2 includes a conveyor including a plurality of conveying rollers 21. More specifically, a plurality of transport rollers 21 are respectively arranged in the transport direction Dt (X direction) and the width direction (Y direction) orthogonal to the transport direction Dt. In the above example, two conveyance rollers are arranged in the X direction and four conveyance rollers are arranged in the Y direction, but the number of conveyance rollers arranged is not limited to this. Hereinafter, when it is necessary to distinguish the conveying rollers 21 arranged in the X direction, the upstream side in the conveying direction Dt, that is, the (-X) direction side (upstream conveying rollers) of these are denoted by the symbol 211, The downstream side, that is, the (+X) direction side (the downstream side conveying roller) is denoted by the symbol 212.

搬送輥21（211、212）分別藉由旋轉/升降驅動機構22的動作而繞圖中點劃線所表示的旋轉軸沿圖中所示的箭頭Dr方向旋轉。藉由如上所述般使搬送輥21旋轉，可將自輸入輸送機100側搬送而來的基板S進一步搬送至輸入上浮平台31側。The conveyance rollers 21 (211, 212) are each rotated in the direction of the arrow Dr shown in the figure around the rotating shaft indicated by the dashed line in the figure by the operation of the rotating/lifting drive mechanism 22. By rotating the conveying roller 21 as described above, the substrate S conveyed from the input conveyor 100 side can be further conveyed to the input floating platform 31 side.

在搬送方向Dt上，在輸入上浮平台31的上游側端面31b固定有轉接板39。轉接板39具有連接部391與突出部392，所述連接部391在寬度方向（Y方向）上具有與輸入上浮平台31大致相同的長度，所述突出部392自連接部391向上游方向即（-X）方向延伸。包含連接部391及突出部392在內的轉接板39的上表面39a與入口上浮平台31的上表面31a為相同高度且形成同一平面。即，入口上浮平台31的上表面31a與轉接板39的上表面39a形成連接的單一平面。在轉接板39的上表面39a與入口上浮平台31的上表面31a同樣地設置有氣體的噴出孔，藉由所噴出的氣體，可自下方對基板S施加浮力。In the conveyance direction Dt, an adapter plate 39 is fixed to the upstream end surface 31 b of the input floating platform 31. The adapter plate 39 has a connecting portion 391 and a protruding portion 392. The connecting portion 391 has approximately the same length as the input floating platform 31 in the width direction (Y direction). The protruding portion 392 extends from the connecting portion 391 to the upstream direction. (-X) direction extension. The upper surface 39a of the adapter plate 39 including the connecting portion 391 and the protruding portion 392 and the upper surface 31a of the entrance floating platform 31 have the same height and form the same plane. That is, the upper surface 31a of the entrance floating platform 31 and the upper surface 39a of the adapter plate 39 form a single plane connected. The upper surface 39a of the adapter plate 39 is provided with gas ejection holes similarly to the upper surface 31a of the inlet floating platform 31, and the ejected gas can apply buoyancy to the substrate S from below.

突出部392在寬度方向（Y方向）上設置於與下游側的搬送輥212不同的位置處。因此，突出部392以進入在寬度方向上間隔配置的多個搬送輥212之間的方式延伸。在所述例中，於在Y方向上排列的四個搬送輥212之間的空間內設置有合計三個突出部392。換言之，轉接板39藉由將與搬送輥212的位置對應的部分切除而避免與搬送輥212的干涉，並且向上游側延伸。The protrusion 392 is provided at a position different from the conveying roller 212 on the downstream side in the width direction (Y direction). Therefore, the protrusion 392 extends so as to enter between the plurality of conveying rollers 212 arranged at intervals in the width direction. In the above example, a total of three protrusions 392 are provided in the space between the four conveying rollers 212 arranged in the Y direction. In other words, the adapter plate 39 cuts off a portion corresponding to the position of the conveying roller 212 to avoid interference with the conveying roller 212, and extends to the upstream side.

圖3的（b）是在Y方向上觀察輸入移載部2的側視圖。藉由旋轉/升降驅動機構22，搬送輥21在圖中實線所表示的上部位置與虛線所表示的下部位置之間移動。在實線所表示的上部位置，搬送輥21的上端向較轉接板39的上表面39a及入口上浮平台31的上表面31a更靠上方突出。在虛線所表示的下部位置，搬送輥21的上端退避至較點劃線所表示的轉接板39的上表面39a及入口上浮平台31的上表面31a的高度更靠下方處。Fig. 3(b) is a side view of the input transfer unit 2 viewed in the Y direction. By the rotation/elevating drive mechanism 22, the transport roller 21 moves between the upper position indicated by the solid line in the figure and the lower position indicated by the broken line. At the upper position indicated by the solid line, the upper end of the conveying roller 21 protrudes above the upper surface 39 a of the adapter plate 39 and the upper surface 31 a of the entrance floating platform 31. At the lower position indicated by the broken line, the upper end of the conveying roller 21 is retracted to a position lower than the height of the upper surface 39a of the adapter plate 39 and the upper surface 31a of the entrance floating platform 31 indicated by the dashed line.

另一方面，在X方向上，轉接板39的（更嚴格而言為突出部392的）上游側端部392a延伸至較由兩點劃線表示的下游側搬送輥212的旋轉軸的位置更靠上游側處。再者，原理上，轉接板39的上游側端部只要至少延伸至下游側搬送輥212的旋轉軸的位置處即可。On the other hand, in the X direction, the upstream end 392a of the adapter plate 39 (more strictly speaking, the protruding portion 392) extends to a position lower than the rotation axis of the downstream conveying roller 212 indicated by the two-dot chain line More on the upstream side. Furthermore, in principle, the upstream end of the adapter plate 39 only needs to extend to at least the position of the rotation axis of the downstream conveying roller 212.

再者，在所述例中，在入口上浮平台31的上游側端面31b固定有與所述入口上浮平台31分體形成的轉接板39，但取而代之，也可採用如以下般的變形例。Furthermore, in the above example, an adapter plate 39 formed separately from the entrance floating platform 31 is fixed to the upstream end surface 31b of the entrance floating platform 31, but instead, the following modified example may be adopted.

圖4是表示代替轉接板的變形例的圖。在圖4的（a）所示的變形例中，入口上浮平台131的上游側端部部分地進一步向上游側突出而成為突出部139。如上所述，突出部也可構成為與入口上浮平台一體的構件。另外，在圖4的（b）所示的變形例中，無相當於連接部的部分，僅相當於突出部的部分以其它構件239的形式固定於入口上浮平台31。藉由這些構成，也可進行以下所說明的基板S的移交。Fig. 4 is a diagram showing a modified example in place of an adapter plate. In the modification shown in FIG. 4( a ), the upstream end of the entrance floating platform 131 partially protrudes further to the upstream side to become a protrusion 139. As described above, the protrusion may also be constituted as an integral member with the floating platform of the entrance. In addition, in the modified example shown in FIG. 4( b ), there is no part corresponding to the connecting part, and only the part corresponding to the protruding part is fixed to the entrance floating platform 31 in the form of another member 239. With these configurations, the transfer of the substrate S described below can also be performed.

圖5是表示本實施方式中的基板搬送的流程的流程圖。另外，圖6是示意性表示搬送中的裝置各部的狀態的圖。在圖5中示出將作為塗布處理的對象的基板S搬入至塗布裝置1的輸入輸送機100並經由輸入移載部2而搬送至上浮平台部3為止的動作的流程。關於之後的動作，例如可應用專利文獻1中所記載的動作內容，因此這裡省略說明。FIG. 5 is a flowchart showing the flow of substrate transport in this embodiment. In addition, FIG. 6 is a diagram schematically showing the state of each part of the apparatus during transportation. FIG. 5 shows a flow of operations until the substrate S that is the target of the coating process is carried into the input conveyor 100 of the coating apparatus 1 and transferred to the floating platform 3 via the input transfer part 2. Regarding the subsequent operation, for example, the operation content described in Patent Document 1 can be applied, and therefore the description is omitted here.

搬送輥21藉由旋轉/升降驅動機構22而預先定位於上部位置（步驟S101）。當將作為處理物件的基板S自搬送機器人或前處理裝置等外部搬入至輸入輸送機100時（步驟S102），如圖6的（a）所示，藉由輥子輸送機101的旋轉而將基板S向搬送方向Dt即（+X）方向搬送（步驟S103）。The transport roller 21 is previously positioned at the upper position by the rotation/elevation drive mechanism 22 (step S101). When the substrate S as a processing object is carried into the input conveyor 100 from the outside of the transfer robot or the pre-processing device (step S102), as shown in FIG. 6(a), the substrate S is transferred by the rotation of the roller conveyor 101 S is conveyed in the conveying direction Dt (+X) direction (step S103).

當基板S到達輸入移載部2時，也可藉由搬送輥21的旋轉來搬送基板S（步驟S104）。在以所述方式繼續搬送的期間，當由未圖示的感測器檢測出所搬送的基板S的前端部Sa到達規定的“轉接位置”時（步驟S105），在所述時刻點暫時停止搬送（步驟S106）。When the board|substrate S reaches the input transfer part 2, the board|substrate S may be conveyed by the rotation of the conveyance roller 21 (step S104). While the conveyance is continued in the manner described above, when a sensor (not shown) detects that the tip portion Sa of the substrate S to be conveyed reaches a predetermined "transfer position" (step S105), it stops temporarily at the time point. Transport (step S106).

如圖6的（b）所示，“轉接位置”是基板S的前端部Sa到達較點劃線所表示的搬送輥212的旋轉軸位置更靠下游側的適當位置時的基板S的位置。此時，基板S由搬送輥21支撐下表面，而成為所述基板S的前端部Sa自搬送輥212的上端稍微向下游側突出的狀態。在搬送輥21的上端處於較輥子輸送機101的狀態更靠上方處時，基板S成為所述基板S的前端部Sa由搬送輥21向上推動的狀態。As shown in FIG. 6(b), the "transfer position" is the position of the substrate S when the front end Sa of the substrate S reaches an appropriate position on the downstream side than the position of the rotation axis of the conveying roller 212 indicated by the chain line . At this time, the lower surface of the substrate S is supported by the transport roller 21, and the front end Sa of the substrate S slightly protrudes to the downstream side from the upper end of the transport roller 212. When the upper end of the conveying roller 21 is higher than the state of the roller conveyor 101, the substrate S is in a state where the front end Sa of the substrate S is pushed up by the conveying roller 21.

另一方面，轉接板39延伸至較搬送輥212的旋轉軸位置更靠上游側處。因此，若自上方觀察，此時基板S與轉接板39成為在X方向上一部分重疊的狀態。位於上部位置的搬送輥212的上端位於較轉接板上表面39a更靠上方處，因此基板S與轉接板39不接觸，基板S的前端部Sa位於轉接板39的上方處。換言之，轉接板39的前端進入基板S的下方。On the other hand, the adapter plate 39 extends to the upstream side of the rotation axis position of the conveying roller 212. Therefore, when viewed from above, the substrate S and the interposer 39 are partially overlapped in the X direction at this time. The upper end of the conveying roller 212 at the upper position is located above the upper surface 39 a of the adapter plate, so the substrate S does not contact the adapter plate 39, and the front end Sa of the substrate S is located above the adapter plate 39. In other words, the front end of the adapter plate 39 enters below the substrate S.

搬送輥21自所述狀態下降至下部位置（步驟S107）。其結果，如圖6的（c）所示，在基板S的下表面Sb下降至轉接板39的上表面39a的高度的時刻點，利用搬送輥21的支撐結束，以後成為基板S的前端部Sa由轉接板39支撐的狀態。即，實現基板S自搬送輥21向入口上浮平台31的移交。再者，自轉接板上表面39a噴出氣體。因此，基板S並不與轉接板上表面39a抵接，而是以隔開規定間隙而自轉接板上表面39a稍微上浮的狀態受到支撐。The transport roller 21 descends from the above state to the lower position (step S107). As a result, as shown in FIG. 6(c), at the time when the lower surface Sb of the substrate S drops to the height of the upper surface 39a of the adapter plate 39, the support by the transport roller 21 ends, and it becomes the leading end of the substrate S later The state where the portion Sa is supported by the adapter plate 39. That is, the transfer of the substrate S from the transport roller 21 to the entrance floating platform 31 is realized. Furthermore, gas is ejected from the upper surface 39a of the adapter plate. Therefore, the substrate S does not abut on the interposer top surface 39a, but is supported in a state of being slightly raised from the interposer top surface 39a with a predetermined gap.

搬送輥下降後，輸入輸送機100的輥子輸送機101再次旋轉，再次開始基板S的搬送（步驟S108）。由此，如圖6的（d）所示，進一步向（+X）方向搬送基板S，前端部Sa自轉接板上表面39a向入口上浮平台上表面31a前進。然後，與專利文獻1中所記載的技術同樣地，在將基板S自輸入移載部2移交至入口上浮平台31後，藉由吸盤機構51而進行搬送。例如，可使吸盤機構51進入已下降到下部位置的搬送輥21與基板下表面Sb的間隙，從而使基板S保持於吸盤機構51。After the conveyance roller descends, the roller conveyor 101 of the input conveyor 100 rotates again, and the conveyance of the substrate S is restarted (step S108). Thereby, as shown in FIG. 6(d), the board|substrate S is further conveyed in the (+X) direction, and the front-end|tip part Sa advances from the adapter plate upper surface 39a to the entrance floating platform upper surface 31a. Then, similarly to the technique described in Patent Document 1, after the substrate S is transferred from the input transfer unit 2 to the entrance floating platform 31, it is transferred by the sucker mechanism 51. For example, the chuck mechanism 51 may enter the gap between the conveying roller 21 that has been lowered to the lower position and the lower surface Sb of the substrate, so that the substrate S is held by the chuck mechanism 51.

如上所述，在本實施方式中的基板S自輸入移載部2向上浮平台部3的移交中，並非藉由使基板S沿搬送方向Dt移動來進行移交，而是在轉接板39進入基板S的下方的狀態下，藉由使支撐基板S的搬送輥21下降來進行移交。因此，消除了在利用搬送的移交中可產生的在基板S的前端部Sa下垂的狀態下進行搬送而與平台端面接觸的問題。As described above, in the transfer of the substrate S from the input transfer portion 2 to the floating platform portion 3 in this embodiment, the transfer is not performed by moving the substrate S in the transfer direction Dt, but enters the adapter plate 39 In the state below the substrate S, the transfer is performed by lowering the transport roller 21 supporting the substrate S. Therefore, the problem that the front end portion Sa of the substrate S may be transported in a state where the front end portion Sa of the substrate S sags and contact with the end surface of the platform that can occur during the transfer by transport is eliminated.

圖7是表示搬送系統的支撐機構的圖。在塗布裝置1中，包含入口上浮平台31的上浮平台部3及塗布機構7等主要構成設置於堅固的基台10。另一方面，輸入移載部2自基台10機械性分離。具體而言，搬送輥21及使所述搬送輥21旋轉的馬達221安裝於升降框架222。升降框架222由升降機構223升降自如地支撐。升降機構223被基座部20支撐。馬達221、升降框架222及升降機構223一體地具有作為本實施方式中的旋轉/升降驅動機構22的功能。Fig. 7 is a diagram showing a support mechanism of the transport system. In the coating device 1, the floating platform portion 3 including the entrance floating platform 31 and the coating mechanism 7 are mainly configured and installed on a solid base 10. On the other hand, the input transfer part 2 is mechanically separated from the base 10. Specifically, the transport roller 21 and the motor 221 that rotates the transport roller 21 are attached to the lift frame 222. The lifting frame 222 is supported freely by the lifting mechanism 223. The lifting mechanism 223 is supported by the base part 20. The motor 221, the elevating frame 222, and the elevating mechanism 223 integrally have a function as the rotation/elevating drive mechanism 22 in this embodiment.

基座部20構成為獨立於基座10的結構物。而且，轉接板39固定於入口上浮平台31。即，轉接板39經由入口上浮平台31而由基台10支撐，且與輸入移載部2機械性分離。The base portion 20 is configured as a structure independent of the base 10. Furthermore, the adapter plate 39 is fixed to the entrance floating platform 31. That is, the adapter plate 39 is supported by the base 10 via the entrance floating platform 31 and is mechanically separated from the input transfer part 2.

假設在將轉接板39與輸入移載部2一體地支撐的情況下，轉接板39與入口上浮平台31由相互獨立的支撐機構支撐，因此有時藉由伴隨搬送輥21的旋轉或升降的振動而在轉接板39與入口上浮平台31之間產生位置偏移。特別是，伴隨長期運轉的累積位置偏移會在轉接板39與入口上浮平台31之間產生間隙，或在兩者之間產生鉛垂方向的階差。所述情況阻礙基板S的順暢的搬送而成為搬送不良或基板S的損傷的原因。Assuming that the adapter plate 39 and the input transfer part 2 are integrally supported, the adapter plate 39 and the entrance floating platform 31 are supported by mutually independent support mechanisms, so sometimes they are accompanied by the rotation or lifting of the conveying roller 21. The vibration caused by the position shift between the adapter plate 39 and the entrance floating platform 31. In particular, the accumulated positional deviation accompanying long-term operation may cause a gap between the adapter plate 39 and the entrance floating platform 31, or a vertical step difference between the two. This situation hinders the smooth conveyance of the substrate S and becomes a cause of poor conveyance or damage to the substrate S.

為了避免所述問題，在本實施方式中，藉由將轉接板39固定於入口上浮平台31或者將它們一體化等方法而使伴隨輸入移載部2的動作的振動不對轉接板39與入口上浮平台31的位置關係造成影響。由此，可避免在將基板S自轉接板39移送至入口上浮平台31時與所述階差碰撞的問題。再者，如圖4的（a）所示，在突出部與輸入上浮平台一體地形成的情況下，本質上不產生此種問題。In order to avoid this problem, in the present embodiment, by fixing the adapter plate 39 to the entrance floating platform 31 or integrating them, the vibration accompanying the movement of the input transfer portion 2 does not interfere with the adapter plate 39 and The positional relationship of the floating platform 31 on the entrance has an influence. Therefore, the problem of collision with the step difference when the substrate S is transferred from the adapter plate 39 to the entrance floating platform 31 can be avoided. Furthermore, as shown in FIG. 4(a), when the protrusion is integrally formed with the input floating platform, such a problem does not essentially occur.

圖8是表示轉接板的其他變形例的圖。圖8的（a）是表示變形例的概略構成的立體圖。另外，圖8的（b）是其側視圖，圖8的（c）是正視圖。如圖8的（a）所示，在所述變形例中，在轉接板39的各突出部392的上游側端面392a設置有自由輥395。更具體而言，自由輥395旋轉自如地安裝於支撐構件396，且支撐構件396固定於突出部392的（-X）方向側端面392a。自由輥395不與驅動源連接而自由旋轉。Fig. 8 is a diagram showing another modified example of the adapter plate. Fig. 8(a) is a perspective view showing a schematic configuration of a modification example. In addition, Fig. 8(b) is a side view thereof, and Fig. 8(c) is a front view. As shown in FIG. 8( a ), in the modification example, a free roller 395 is provided on the upstream end surface 392 a of each protrusion 392 of the adapter plate 39. More specifically, the free roller 395 is rotatably attached to the support member 396, and the support member 396 is fixed to the end surface 392 a on the (−X) direction side of the protrusion 392. The free roller 395 is not connected to a driving source and rotates freely.

如圖8的（b）所示，在側視時，自由輥395的上端配置於與點劃線所表示的轉接板39及入口上浮平台31的上表面的高度相同的高度或高於所述高度且低於兩點劃線所表示的位於上部位置的搬送輥21（212）的上端的高度的位置處。As shown in Figure 8(b), in a side view, the upper end of the free roller 395 is arranged at the same height as or higher than the height of the adapter plate 39 and the upper surface of the entrance floating platform 31 indicated by the dashed line. The height is lower than the height of the upper end of the conveying roller 21 (212) at the upper position indicated by the two-dot chain line.

如圖8的（c）所示，以所述方式構成的自由輥395自下方與由搬送輥212搬送的基板S中的在寬度方向（Y方向）上未受到利用搬送輥212的支撐的部分抵接。由此，可防止所述部分朝下撓曲而下垂至較轉接板39的上表面39a更靠下方處。As shown in FIG. 8(c), the free roller 395 configured as described above and the portion of the substrate S transported by the transport roller 212 that are not supported by the transport roller 212 in the width direction (Y direction) Abut. As a result, the part can be prevented from bending downward and sagging to a position below the upper surface 39a of the adapter plate 39.

當在基板S的下表面Sb位於較轉接板上表面39a更靠下方處的狀態進行搬送時，在所述部分，基板S的前端部會與轉接板39的端面392a碰撞。藉由利用自由輥395輔助支撐基板S，可避免此種問題。When the substrate S is transported in a state where the lower surface Sb of the substrate S is located below the upper surface 39a of the adapter plate, the front end portion of the substrate S collides with the end surface 392a of the adapter plate 39 at that portion. This problem can be avoided by using the free roller 395 to assist in supporting the substrate S.

再者，這裡，為了進行原理說明，使用相對於一個突出部392而設置一個自由輥395的例子，但也可相對於一個突出部392而在寬度方向上錯開位置地設置多個自由輥395。另外，所述自由輥395不僅可配置於突出部392的端面，而且也可視需要配置於基板搬送路徑上的適當位置。由此，可進一步減低所搬送的基板S的撓曲，從而實現穩定的搬送及自輸入移載部2向上浮平台部3的順暢的移交。In addition, here, in order to explain the principle, an example in which one free roller 395 is provided for one protrusion 392 is used, but a plurality of free rollers 395 may be provided at positions shifted in the width direction with respect to one protrusion 392. In addition, the free roller 395 may not only be arranged on the end surface of the protrusion 392, but also may be arranged at an appropriate position on the substrate conveying path as necessary. Thereby, the deflection of the substrate S to be conveyed can be further reduced, and stable conveyance and smooth transfer from the input transfer part 2 to the floating platform part 3 can be realized.

如以上所說明般，所述實施方式的塗布裝置1是包含本發明的“基板搬送裝置”的一實施方式作為構成的一部分的裝置，並且也是本發明的“塗布裝置”的一實施方式。在所述實施方式中，搬送輥21中的下游側者即下游側搬送輥212作為本發明的“搬送輥”發揮功能，另一方面，旋轉/升降驅動機構22作為本發明的“升降機構”發揮功能。另外，上浮平台部3、特別是入口上浮平台31作為本發明的“基板支撐平台”發揮功能。而且，所述入口上浮平台31的上表面31a相當於本發明的“基板支撐面”。As described above, the coating apparatus 1 of the above-mentioned embodiment is an apparatus including one embodiment of the "substrate conveying apparatus" of the present invention as a part of the configuration, and is also an embodiment of the "coating apparatus" of the present invention. In the embodiment described above, the downstream side of the conveying rollers 21, that is, the downstream conveying roller 212 functions as the "conveying roller" of the present invention, and on the other hand, the rotation/elevating drive mechanism 22 functions as the "elevating mechanism" of the present invention. Function. In addition, the floating platform portion 3, particularly the entrance floating platform 31, functions as the "substrate support platform" of the present invention. Furthermore, the upper surface 31a of the entrance floating platform 31 corresponds to the "substrate support surface" of the present invention.

另外，在所述實施方式中，轉接板39作為本發明的“延伸部”及“副平台”發揮功能。而且，基台10及基座部20分別作為本發明的“平台支撐部”及“搬送系統支撐部”發揮功能。另外，自由輥395作為本發明的“輔助輥”發揮功能。另外，輸入輸送機100及吸盤機構51均可作為本發明的“副搬送機構”發揮功能。另外，塗布平台32作為本發明的“浮力施加部”發揮功能。In addition, in the above-mentioned embodiment, the adapter plate 39 functions as the "extension portion" and the "sub-platform" of the present invention. In addition, the base 10 and the base portion 20 respectively function as the "platform support portion" and the "transport system support portion" of the present invention. In addition, the free roller 395 functions as the "auxiliary roller" of the present invention. In addition, both the input conveyor 100 and the suction cup mechanism 51 can function as the "sub-conveying mechanism" of the present invention. In addition, the coating platform 32 functions as the "buoyancy applying portion" of the present invention.

再者，本發明並不限定於所述實施方式，只要不脫離本發明的主旨，則可進行所述以外的各種變更。例如，在所述實施方式中的基板S的移交中，在基板S的前端部Sa較搬送輥212的上端稍微突出的時刻點停止搬送，藉由使搬送輥212下降來移交基板S。然而，也可進一步繼續搬送，例如在基板S的前端部Sa自轉接板39進入至入口上浮平台31的時刻點停止搬送。In addition, the present invention is not limited to the above-mentioned embodiments, and various changes other than the above can be made without departing from the gist of the present invention. For example, in the transfer of the substrate S in the above-described embodiment, the transfer is stopped at a point in time when the tip portion Sa of the substrate S slightly protrudes from the upper end of the transfer roller 212, and the substrate S is transferred by lowering the transfer roller 212. However, the transportation may be further continued, for example, the transportation is stopped at the time when the front end portion Sa of the substrate S enters from the adapter plate 39 to the entrance floating platform 31.

即便在所述情況下，也可在通過了搬送輥212的上端的基板S的前端部Sa臨近轉接板39的時刻點受到利用轉接板39的上浮支撐，因此可進行順暢的搬送。但是，在所述情況下，為了防止在寬度方向上的搬送輥間因撓曲而下垂的基板S與突出部392的端面接觸，理想的是在適當位置設置自由輥395。Even in this case, the tip portion Sa of the substrate S passing through the upper end of the conveying roller 212 can be supported by the floating support by the adapter plate 39 at a point in time when the tip portion Sa of the substrate S has passed through the upper end of the conveying roller 212, so that smooth conveyance is possible. However, in the above case, in order to prevent the substrate S that sags between the conveying rollers in the width direction from being sagged due to the deflection and contact with the end surface of the protrusion 392, it is desirable to provide the free roller 395 at an appropriate position.

另外，在所述實施方式中，轉接板39的突出部392延伸至較搬送輥212的旋轉軸稍微更靠上游側處。可進一步延長所述突出部，例如也可延伸至上游側搬送輥211的旋轉軸附近。In addition, in the above-described embodiment, the protrusion 392 of the adapter plate 39 extends slightly to the upstream side of the rotation axis of the conveying roller 212. The protruding portion may be further extended, for example, may extend to the vicinity of the rotation axis of the upstream conveying roller 211.

另外，所述實施方式的塗布裝置1設想為對例如玻璃基板或半導體基板等基板塗布抗蝕劑液的裝置，但基板的種類或所噴出的流體的種類並不限定於這些而為任意。例如，流體並不限定於液體，也可為氣體。另外，並不限定於塗布，本發明也可適用於以其他目的進行基板的搬送的基板搬送裝置。In addition, the coating apparatus 1 of the above-mentioned embodiment is assumed to be an apparatus that coats a resist liquid on a substrate such as a glass substrate or a semiconductor substrate, but the type of the substrate and the type of fluid to be discharged are not limited to these and are arbitrary. For example, the fluid is not limited to liquid, and may be gas. In addition, it is not limited to coating, and the present invention can also be applied to a substrate transport device that transports a substrate for other purposes.

以上，例示具體實施方式而進行了說明，在本發明的基板搬送裝置中，例如延伸部也可為自上表面噴出氣體而自下方對基板施加浮力的構成。根據此種構成，可在延伸部使自搬送輥移交的基板上浮的狀態下搬送至基板支撐平台。In the foregoing, specific embodiments have been exemplified and described. In the substrate transport device of the present invention, for example, the extension portion may be configured to eject gas from the upper surface and apply buoyancy to the substrate from below. According to this structure, the substrate transferred from the transfer roller can be transported to the substrate support platform in a state where the extension portion floats the substrate transferred from the transport roller.

另外，例如，升降機構可設為如下構成：在搬送輥搬送基板後，在搬送輥的旋轉停止的狀態下使搬送輥下降。根據此種構成，基板自搬送輥向延伸部的移交可僅藉由不伴隨向搬送方向的移動的搬送輥的升降來實現。因此，可確實防止基板與延伸部或基板支撐平台的端面接觸。In addition, for example, the elevating mechanism may be configured to lower the transport roller in a state where the rotation of the transport roller is stopped after the transport roller transports the substrate. According to this configuration, the transfer of the substrate from the conveyance roller to the extension portion can be realized only by the elevation of the conveyance roller without movement in the conveyance direction. Therefore, it is possible to reliably prevent the substrate from contacting the end surface of the extension portion or the substrate support platform.

另外，例如，延伸部可設為在搬送方向上與基板支撐平台的最上游側端部連結的副平台。或者，也可為基板支撐平台部分地向搬送方向的上游側延長而形成延伸部的構成。如上所述，關於延伸部，也可藉由以與基板支撐平台一體者的形式形成的構成、以及分體形成且與基板支撐平台連結的構成的任一種來實現。由此，可設為將延伸部的上表面與基板支撐平台的上表面連接而成者，可實現基板的順暢的搬送。In addition, for example, the extension portion may be a sub-platform connected to the most upstream end of the substrate support platform in the conveying direction. Alternatively, the substrate support platform may be partially extended to the upstream side in the conveying direction to form an extension. As described above, the extension portion may be realized by any of a configuration formed as an integral part of the substrate support platform and a configuration formed separately and connected to the substrate support platform. Thereby, it can be set as what connects the upper surface of an extension part and the upper surface of a board|substrate support platform, and it can implement|achieve smooth conveyance of a board|substrate.

這裡，在延伸部作為與基板支撐平***立的副平台設置的情況下，所述副平台例如可設為具有連接部與突出部的構成，所述連接部與基板支撐平台的最上游側端部鄰接設置且寬度方向上的長度與基板支撐平台大致相同，所述突出部自連接部朝向搬送方向的上游側部分地突出。根據此種構成，可將連接部的上表面與基板支撐平台的上表面視為一體，因此，實質上可作為與基板支撐平台的端部延長而形成延伸部的構成相同者發揮功能。Here, in the case where the extension portion is provided as a sub-platform independent of the substrate support platform, the sub-platform may be configured to have, for example, a connection portion and a protruding portion, and the connection portion and the most upstream end of the substrate support platform It is provided adjacently and has substantially the same length in the width direction as the substrate support platform, and the protruding portion partially protrudes from the connection portion toward the upstream side in the conveying direction. According to this configuration, the upper surface of the connecting portion and the upper surface of the substrate support platform can be regarded as one body, and therefore, it can function substantially as a configuration in which the end portion of the substrate support platform is extended to form an extension.

另外，優選的是：包括支撐基板支撐平台的平台支撐部以及作為與平台支撐部獨立的構件構成且支撐搬送輥及升降機構的搬送系統支撐部，副平台經由基板支撐平台而由平台支撐部支撐。在伴隨旋轉及升降的搬送輥及所述搬送輥的支撐部，在進行動作時產生振動。當此種振動傳遞至副平台時，有時在副平台與基板支撐平台之間產生微小的位置偏移。由此，當在兩者的上表面之間產生階差時，有阻礙基板的搬送的擔憂。為了避免所述情況，副平台優選為由獨立於搬送系統支撐部的平台支撐部支撐。In addition, it is preferable to include a platform support portion that supports the substrate support platform and a transport system support portion that is configured as a member independent of the platform support portion and supports the transport rollers and the lifting mechanism, and the sub-platform is supported by the platform support portion via the substrate support platform . The supporting portion of the conveying roller and the conveying roller accompanying the rotation and raising and lowering generates vibration during operation. When this kind of vibration is transmitted to the sub-platform, sometimes a slight positional deviation occurs between the sub-platform and the substrate support platform. Therefore, when a step difference occurs between the upper surfaces of the two, there is a concern that the transfer of the substrate may be hindered. In order to avoid this situation, the sub-platform is preferably supported by a platform supporting part independent of the supporting part of the conveying system.

另外，例如，可設為如下構成：搬送輥在寬度方向上錯開位置地設置有多個，在多個搬送輥間設置有延伸部。根據此種構成，藉由利用多個搬送輥分別支撐基板的寬度方向上的多個部位，可以接近水準的姿勢支撐基板並加以搬送。另外，藉由在這些搬送輥之間設置延伸部，可更順暢地執行基板自搬送輥向延伸部的移交。In addition, for example, a configuration may be adopted in which a plurality of conveyance rollers are provided at positions shifted in the width direction, and an extension portion is provided between the plurality of conveyance rollers. According to this configuration, by supporting a plurality of locations in the width direction of the substrate with a plurality of transport rollers, the substrate can be supported and transported in a nearly horizontal posture. In addition, by providing the extension part between these transport rollers, the transfer of the substrate from the transport roller to the extension part can be performed more smoothly.

另外，例如，可在較搬送方向上的延伸部的最上游側端部更靠上游側處設置輔助輥，所述輔助輥的上端的高度與延伸部的上表面相同或高於所述延伸部的上表面且低於定位於上部位置的搬送輥的上端。根據此種構成，藉由利用輔助輥支撐未被搬送基板的搬送輥支撐的基板下表面，可抑制基板的撓曲，從而可事先避免起因於所述撓曲而可產生的基板與延伸部的端面的碰撞。In addition, for example, an auxiliary roller may be provided on the upstream side of the most upstream end of the extension in the conveying direction, and the height of the upper end of the auxiliary roller is the same as or higher than the upper surface of the extension. The upper surface is lower than the upper end of the conveying roller positioned at the upper position. According to this configuration, by supporting the lower surface of the substrate that is not supported by the transfer roller that transfers the substrate by the auxiliary roller, the bending of the substrate can be suppressed, and the damage of the substrate and the extension portion that can be caused by the bending can be avoided in advance. The collision of the end face.

另外，例如，也可包括副搬送機構，所述副搬送機構將移交至基板支撐平台後的基板沿搬送方向搬送。根據此種構成，即便在搬送輥下降至下部位置而不再發揮相對於基板的搬送力後，也可沿搬送方向搬送基板。In addition, for example, a sub-conveying mechanism may be included that conveys the substrate transferred to the substrate support platform in the conveying direction. According to this structure, even after the conveyance roller descends to the lower position and no longer exerts the conveying force with respect to the substrate, the substrate can be conveyed in the conveying direction.

另外，本發明例如也可作為如下塗布裝置來實施，所述塗布裝置包括具有所述副搬送機構的基板搬送裝置、以及與由副搬送機構搬送的基板的上表面相向配置的、朝向基板的上表面噴出塗布液的噴嘴。根據此種構成，藉由所述理由而自噴嘴對穩定地搬送的基板供給塗布液，因此可在基板的上表面形成均質的塗布膜。In addition, the present invention can also be implemented, for example, as a coating device including a substrate transport device having the sub-transport mechanism, and an upper surface facing the substrate that is arranged opposite to the upper surface of the substrate transported by the sub-transport mechanism The nozzle sprays the coating liquid on the surface. According to this configuration, the coating liquid is supplied from the nozzle to the substrate that is stably conveyed for the above-mentioned reason, and therefore, a homogeneous coating film can be formed on the upper surface of the substrate.

例如，也可設置浮力施加部，所述浮力施加部配置於噴嘴的下方，對由副搬送機構搬送而通過與噴嘴的相向位置的基板的下表面噴出氣體，自下方對基板施加浮力。根據此種構成，對以上浮狀態支撐的基板進行塗布。因此，例如，與機械性支撐基板下表面側來進行塗布的情況相比，可將塗布時的基板維持為更平坦的狀態，從而可實現塗布膜的品質提高。在所述情況下，可使基板搬送裝置的基板支撐平台兼具作為浮力施加部的功能，另外，也可獨立於用以進行搬送的基板支撐平台地設置專門用於塗布處理的浮力施加部。 [產業上的可利用性]For example, a buoyancy application unit may be provided that is arranged below the nozzle and ejects gas to the lower surface of the substrate conveyed by the sub-conveying mechanism and passed through the position facing the nozzle to apply buoyancy to the substrate from below. According to this structure, the substrate supported in the floating state is coated. Therefore, for example, as compared with the case where the lower surface side of the substrate is mechanically supported for coating, the substrate during coating can be maintained in a flatter state, and the quality of the coating film can be improved. In this case, the substrate support platform of the substrate transport device can also function as a buoyancy application part, and it is also possible to provide a buoyancy application part dedicated to coating processing independently of the substrate support platform used for transport. [Industry availability]

本發明可適宜地適用於一邊自下方對基板施加浮力一邊進行支撐並加以搬送的基板搬送裝置。例如可適用於一面使基板以水準姿勢上浮一面對所述基板的表面塗布塗布液的塗布裝置的搬送系統。此外，本發明可適宜地適用於出於各種目的而以水準姿勢搬送基板的裝置。The present invention can be suitably applied to a substrate transfer device that supports and transfers the substrate while applying buoyancy from below. For example, it can be applied to a transfer system of a coating device that applies a coating liquid to the surface of the substrate while floating the substrate in a horizontal posture. In addition, the present invention can be suitably applied to an apparatus that conveys a substrate in a horizontal posture for various purposes.

1:塗布裝置（基板搬送裝置） 2:輸入移載部 3:上浮平台部 4:輸出移載部 5:基板搬送部 7:塗布機構 9:控制單元 10:基台（平台支撐部） 20:基座部（搬送系統支撐部） 21、211、212:搬送輥 22:旋轉/升降驅動機構（升降機構） 31、131:入口上浮平台（基板支撐平台） 31a:基板支撐面/入口上浮平台的上表面 31b:上游側端面 32:塗布平台（浮力施加部） 33:出口上浮平台 34:頂銷驅動機構 35:上浮控制機構 39:轉接板（延伸部、副平台） 39a:轉接板的上表面 41、101、111:輥子輸送機 42:旋轉/升降驅動機構 51:吸盤機構（副搬送機構） 52:吸附/行進控制機構 70:噴嘴單元 71:噴嘴 73:定位機構 78:塗布液供給部 81L、81R、87L、87R:行進導桿 100:輸入輸送機（副搬送機構） 102、112:旋轉驅動機構 110:輸出輸送機 139:突出部 221:馬達 222:升降框架 223:升降機構 239:其它構件 391:連接部 392:突出部 392a:上游側端部/端面 395:自由輥（輔助輥） 396:支撐構件 711:噴出口 731:樑構件 732、733:柱構件 Dr:箭頭 Dt:搬送方向 S:基板 S101、S102、S103、S104、S105、S106、S107、S108:步驟 Sa:基板的前端部 Sb:基板的下表面 Sf:基板的上表面1: Coating device (substrate conveying device) 2: Input transfer part 3: Floating platform 4: Output transfer part 5: PCB transport department 7: Coating mechanism 9: Control unit 10: Abutment (platform support part) 20: Base part (supporting part of conveying system) 21, 211, 212: conveying roller 22: Rotation/lifting drive mechanism (lifting mechanism) 31, 131: entrance floating platform (substrate support platform) 31a: substrate support surface/upper surface of entrance floating platform 31b: upstream end face 32: Coating platform (buoyancy application part) 33: Export floating platform 34: ejector pin drive mechanism 35: Floating control mechanism 39: Adapter plate (extension, sub-platform) 39a: The upper surface of the adapter plate 41, 101, 111: roller conveyor 42: Rotation/lifting drive mechanism 51: Suction cup mechanism (auxiliary conveying mechanism) 52: adsorption/travel control mechanism 70: nozzle unit 71: Nozzle 73: positioning mechanism 78: Coating liquid supply part 81L, 81R, 87L, 87R: travel guide 100: Input conveyor (auxiliary conveying mechanism) 102, 112: Rotary drive mechanism 110: output conveyor 139: protruding part 221: Motor 222: Lifting frame 223: Lifting Mechanism 239: other components 391: Connection 392: protruding part 392a: Upstream side end/end face 395: free roller (auxiliary roller) 396: support member 711: spout 731: beam member 732, 733: Column member Dr: Arrow Dt: conveying direction S: substrate S101, S102, S103, S104, S105, S106, S107, S108: steps Sa: The front end of the substrate Sb: The bottom surface of the substrate Sf: The upper surface of the substrate

圖1是示意性表示作為本發明的一實施方式的塗布裝置的整體構成的圖。 圖2是自鉛垂上方觀察塗布裝置的平面圖。 圖3是表示輸入移載部的結構的圖。 圖4是表示代替轉接板的變形例的圖。 圖5是表示本實施方式的基板搬送的流程的流程圖。 圖6是示意性表示搬送中的裝置各部的狀態的圖。 圖7是表示搬送系統的支撐機構的圖。 圖8是表示轉接板的其他變形例的圖。Fig. 1 is a diagram schematically showing the overall configuration of a coating device as an embodiment of the present invention. Fig. 2 is a plan view of the coating device viewed from a vertical upper side. Fig. 3 is a diagram showing the structure of an input transfer unit. Fig. 4 is a diagram showing a modified example in place of an adapter plate. FIG. 5 is a flowchart showing the flow of the substrate transport in this embodiment. Fig. 6 is a diagram schematically showing the state of each part of the device during transport. Fig. 7 is a diagram showing a support mechanism of the transport system. Fig. 8 is a diagram showing another modified example of the adapter plate.

31:入口上浮平台(基板支撐平台) 31: Entrance floating platform (substrate support platform)

31a:基板支撐面/入口上浮平台的上表面 31a: substrate support surface/upper surface of entrance floating platform

39:轉接板(延伸部、副平台) 39: adapter plate (extension, sub-platform)

39a:轉接板的上表面 39a: The upper surface of the adapter plate

101:輥子輸送機 101: Roller conveyor

211、212:搬送輥 211, 212: Conveying roller

Dt:搬送方向 Dt: conveying direction

S:基板 S: substrate

Sa:基板的前端部 Sa: The front end of the substrate

Sb:基板的下表面 Sb: The bottom surface of the substrate

Claims (12)

一種基板搬送裝置，其以水準姿勢搬送基板，且所述基板搬送裝置包括： 搬送輥，自下方支撐所述基板並且加以旋轉，由此沿水準方向搬送所述基板； 基板支撐平台，具有在所述基板的搬送方向上與所述搬送輥的下游側鄰接配置的水準的平坦面即基板支撐面，接受由搬送部搬送的所述基板，並自所述基板支撐面噴出氣體而自下方對所述基板施加浮力並且進行支撐；以及 升降機構，使所述搬送輥升降而使所述搬送輥在上部位置與下部位置之間移動，所述上部位置為所述搬送輥的上端較所述基板支撐平台的上表面更靠上方，所述下部位置為所述搬送輥的上端較所述基板支撐平台的上表面更靠下方；並且在將與所述搬送方向正交的水準方向定義為寬度方向時， 所述基板支撐平台具有朝向所述搬送方向的上游側端部部分地延伸的延伸部，在俯視時與所述搬送輥在所述寬度方向上不同的位置，所述延伸部的所述搬送方向上的最上游側端部至少延伸至所述搬送輥的旋轉軸的位置，所述延伸部的上表面的高度與所述基板支撐面相同且與所述基板支撐面連接， 由所述升降機構定位於所述上部位置的所述搬送輥搬送所述基板，直至俯視時所述基板的所述搬送方向的前端部到達較所述搬送輥的旋轉軸更靠所述搬送方向的下游位置處，其後，所述升降機構使所述搬送輥下降至所述下部位置，由此將所述基板自所述搬送輥移交至所述基板支撐平台。A substrate conveying device, which conveys a substrate in a horizontal posture, and the substrate conveying device includes: A conveying roller supports the substrate from below and rotates it, thereby conveying the substrate in a horizontal direction; The substrate support platform has a level flat surface that is arranged adjacent to the downstream side of the conveying roller in the conveying direction of the substrate, that is, a substrate support surface, and receives the substrate conveyed by the conveying section and transfers it from the substrate support surface Eject gas to apply buoyancy to and support the substrate from below; and The lifting mechanism raises and lowers the conveying roller to move the conveying roller between an upper position and a lower position, the upper position being that the upper end of the conveying roller is higher than the upper surface of the substrate support platform, so The lower position is that the upper end of the conveying roller is lower than the upper surface of the substrate support platform; and when the horizontal direction orthogonal to the conveying direction is defined as the width direction, The substrate support platform has an extension part that partially extends toward the upstream end of the conveying direction, and is at a position different from the conveying roller in the width direction in a plan view, and the conveying direction of the extension part The most upstream end of the upper part extends at least to the position of the rotation axis of the conveying roller, and the upper surface of the extension part has the same height as the substrate support surface and is connected to the substrate support surface, The transfer roller positioned at the upper position by the elevating mechanism transfers the substrate until the front end of the substrate in the transfer direction in a plan view reaches closer to the transfer direction than the rotation axis of the transfer roller Afterwards, the lifting mechanism lowers the transport roller to the lower position, thereby transferring the substrate from the transport roller to the substrate support platform. 如申請專利範圍第1項所述的基板搬送裝置，其中 所述延伸部自上表面噴出氣體而自下方對所述基板施加浮力。The substrate conveying device as described in item 1 of the scope of patent application, wherein The extension part ejects gas from the upper surface to apply buoyancy to the substrate from below. 如申請專利範圍第1項或第2項所述的基板搬送裝置，其中 在所述搬送輥搬送所述基板後，所述升降機構在所述搬送輥的旋轉停止的狀態下使所述搬送輥下降。Such as the substrate conveying device described in item 1 or item 2 of the scope of patent application, wherein After the conveyance roller conveys the substrate, the elevating mechanism lowers the conveyance roller in a state where the rotation of the conveyance roller is stopped. 如申請專利範圍第1項至第3項中任一項所述的基板搬送裝置，其中 所述延伸部為在所述搬送方向上與所述基板支撐平台的最上游側端部連結的副平台。The substrate conveying device described in any one of items 1 to 3 of the scope of the patent application, wherein The extension part is a sub-platform connected to the most upstream end of the substrate support platform in the conveying direction. 如申請專利範圍第4項所述的基板搬送裝置，其中 所述副平台具有連接部與突出部，所述連接部與所述基板支撐平台的最上游側端部鄰接設置，且所述寬度方向上的長度與所述基板支撐平台大致相同，所述突出部自所述連接部朝向所述搬送方向的上游側部分地突出。The substrate transfer device described in item 4 of the scope of patent application, wherein The sub-platform has a connecting portion and a protruding portion, the connecting portion is arranged adjacent to the most upstream end of the substrate support platform, and the length in the width direction is approximately the same as that of the substrate support platform. The portion partially protrudes from the connection portion toward the upstream side in the conveying direction. 如申請專利範圍第4項或第5項所述的基板搬送裝置，其包括： 平台支撐部，支撐所述基板支撐平台；以及 搬送系統支撐部，作為與所述平台支撐部獨立的部件構成，並支撐所述搬送輥及所述升降機構；並且 所述副平台經由所述基板支撐平台而由所述平台支撐部支撐。The substrate transport device described in item 4 or item 5 of the scope of patent application includes: A platform support part supporting the substrate support platform; and The conveying system support part is configured as a component independent of the platform support part, and supports the conveying roller and the lifting mechanism; and The sub-platform is supported by the platform support part via the substrate support platform. 如申請專利範圍第1項至第3項中任一項所述的基板搬送裝置，其中 所述基板支撐平台部分地向所述搬送方向的上游側延長而形成所述延伸部。The substrate conveying device described in any one of items 1 to 3 of the scope of the patent application, wherein The substrate support platform is partially extended to the upstream side in the conveying direction to form the extension portion. 如申請專利範圍第1項至第7項中任一項所述的基板搬送裝置，其中 所述搬送輥在所述寬度方向上錯開位置地設置有多個，在所述多個搬送輥間設置有所述延伸部。The substrate conveying device according to any one of items 1 to 7 of the scope of patent application, wherein The transport rollers are provided in a plurality of positions shifted in the width direction, and the extension portion is provided between the transport rollers. 如申請專利範圍第1項至第8項中任一項所述的基板搬送裝置，其中 在所述搬送方向上的較所述延伸部的最上游側端部更靠上游側處設置有輔助輥，所述輔助輥的上端的高度與所述延伸部的上表面相同或高於所述延伸部的上表面且低於定位於所述上部位置的所述搬送輥的上端。The substrate conveying device according to any one of items 1 to 8 of the scope of patent application, wherein An auxiliary roller is provided on the upstream side of the most upstream end of the extension in the conveying direction, and the height of the upper end of the auxiliary roller is the same as or higher than the upper surface of the extension. The upper surface of the extension part is lower than the upper end of the conveying roller positioned at the upper position. 如申請專利範圍第1項至第9項中任一項所述的基板搬送裝置，其包括副搬送機構，所述副搬送機構將移交至所述基板支撐平台後的所述基板沿所述搬送方向搬送。The substrate conveying device according to any one of items 1 to 9 of the scope of patent application includes a sub-conveying mechanism that transfers the substrate after being transferred to the substrate support platform along the conveying Direction of transport. 一種塗布裝置，包括： 根據權利要求10所述的基板搬送裝置；以及 噴嘴，與由所述副搬送機構搬送的所述基板的上表面相向配置，朝向所述基板的上表面噴出塗布液。A coating device includes: The substrate transfer device according to claim 10; and The nozzle is arranged to face the upper surface of the substrate conveyed by the sub-conveying mechanism, and sprays the coating liquid toward the upper surface of the substrate. 如申請專利範圍第11項所述的塗布裝置，其包括浮力施加部，所述浮力施加部配置於所述噴嘴的下方，對由所述副搬送機構搬送而通過與所述噴嘴的相向位置的所述基板的下表面噴出氣體，自下方對所述基板施加浮力。The coating device according to claim 11, which includes a buoyancy applying part disposed below the nozzle, and the buoyancy applying part is conveyed by the sub-conveying mechanism and passed through the position facing the nozzle Gas is ejected from the lower surface of the substrate to apply buoyancy to the substrate from below.
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