TW202010703A - Flexible circuit tape - Google Patents
Flexible circuit tape Download PDFInfo
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- TW202010703A TW202010703A TW107130913A TW107130913A TW202010703A TW 202010703 A TW202010703 A TW 202010703A TW 107130913 A TW107130913 A TW 107130913A TW 107130913 A TW107130913 A TW 107130913A TW 202010703 A TW202010703 A TW 202010703A
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- Prior art keywords
- layer
- circuit board
- flexible
- area
- flexible circuit
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Wire Bonding (AREA)
Abstract
Description
本發明是關於一種撓性電路板捲帶,其用以防止該撓性電路板捲帶在捲收過程中或捲收後,該撓性電路板捲帶的一撓性載板產生相互黏附的情形。The invention relates to a flexible circuit board reel, which is used to prevent a flexible carrier board of the flexible circuit board reel from adhering to each other during or after winding of the flexible circuit board reel situation.
習知的一種撓性電路板捲帶會以一捲輪(reel)捲收,以利進行下一個製程(如進行結合複數個晶片製程及切割製程),然由於該撓性電路板捲帶在捲收過程或捲收後,該撓性電路板捲帶的一撓性載板上會因該撓性電路板捲帶被捲收,而造成上下堆疊的該撓性載板相互黏附,導致該撓性電路板捲帶不易被捲收或捲收歪斜的情形,進而使得該撓性電路板捲帶相互磨損或造成該撓性電路板捲帶彎折。A conventional flexible circuit board reel will be wound by a reel to facilitate the next process (such as combining multiple wafer processes and cutting processes), but because the flexible circuit board is reeled in After the winding process or winding, a flexible carrier board of the flexible circuit board reel will be retracted due to the flexible circuit board reel, which causes the flexible carrier boards stacked on top of each other to adhere to each other, resulting in the The situation that the flexible circuit board reel is not easy to be wound or slanted, which further causes the flexible circuit board reel to wear each other or cause the flexible circuit board reel to bend.
本發明的一種撓性電路板捲帶,其主要目的用以避免該撓性電路板捲帶被捲收時,該撓性電路板捲帶的一撓性載板發生相互黏附的情形。The flexible circuit board reel of the present invention has the main purpose of preventing the flexible carrier board of the flexible circuit board reel from adhering to each other when the flexible circuit board reel is retracted.
本發明的一種撓性電路板捲帶包含一撓性載板、一線路層、一立體結構層及一防焊層,該撓性載板為一能被捲收的帶狀載板,該撓性載板具有一上表面,該上表面具有一線路設置區及至少一待移除區,該線路層設置於該上表面的該線路設置區,該線路層具有至少一導接端,該立體結構層設置於該上表面的該待移除區,該防焊層覆蓋該撓性載板及該線路層,該防焊層具有至少一開口,該開口顯露出該導接端,且該防焊層顯露出該立體結構層,當該撓性載板被捲收時,該立體結構層用以間隔上下堆疊的該撓性載板。A flexible circuit board reel of the present invention includes a flexible carrier board, a circuit layer, a three-dimensional structure layer and a solder mask layer. The flexible carrier board is a strip-shaped carrier board that can be rolled up. The sexual carrier has an upper surface, the upper surface has a circuit setting area and at least one area to be removed, the circuit layer is disposed on the circuit setting area on the upper surface, the circuit layer has at least one lead terminal, the three-dimensional The structural layer is disposed on the area to be removed on the upper surface, the solder mask layer covers the flexible carrier board and the circuit layer, the solder mask layer has at least one opening, the opening exposes the lead terminal, and the The solder layer exposes the three-dimensional structure layer. When the flexible carrier board is rolled up, the three-dimensional structure layer is used to space the flexible carrier boards stacked up and down.
當本發明的該撓性電路板捲帶被捲收時,該撓性載板會形成螺旋狀上下堆疊,由於該撓性載板的該上表面的該待移除區設置有該立體結構層,藉由該立體結構層間隔該撓性電路板捲帶被捲收時上下堆疊的該撓性載板,使得上下堆疊的該撓性載板不會相互黏附,以避免該撓性電路板捲帶發生不易被捲收、捲收歪斜、磨損及的彎折情形。When the flexible circuit board reel of the present invention is wound up, the flexible carrier board is formed into a spiral shape and stacked up and down, because the area to be removed on the upper surface of the flexible carrier board is provided with the three-dimensional structure layer , By the three-dimensional structure layer separating the flexible carrier boards stacked up and down when the flexible circuit board roll is wound, so that the flexible carrier boards stacked up and down will not adhere to each other, to avoid the flexible circuit board roll The belt is not easily retracted, skewing, worn or bent.
請參閱第1及2圖,本發明的一種撓性電路板捲帶100,其包含有複數個撓性電路板單元100a,在進行結合複數個晶片製程及切割單離各該撓性電路板單元100a製程前,會以一捲輪(reel)200捲收,以利儲存或進行下一個製程(如烘烤、結合晶片及切割等製程),本發明的目的在於在捲收該撓性電路板捲帶100時,避免該撓性電路板捲帶100的一撓性載板110相互黏附,而導致該撓性電路板捲帶100發生不易被捲收、捲收歪斜、磨損及彎折的情形。Please refer to FIG. 1 and FIG. 2, a flexible
請參閱第2及3圖,該撓性電路板捲帶100包含一撓性載板110、一線路層120、一立體結構層130及一防焊層140,該撓性載板110為一能被捲收的帶狀載板,該撓性載板110材料選自於聚醯亞胺(Polyimide,PI)或聚醯亞胺酸鹽(Polyamic acid,PAA),但不以此為限,該撓性載板110具有一上表面111及一下表面112,該上表面111具有一線路設置區111a及至少一待移除區111b,該待移除區111b具有一第二面積,在本實施例中,該待移除區111b具有一長度X2,該長度X2不小於8mm,該待移除區111b具有一寬度Y2,該寬度Y2不小於3mm。Please refer to FIG. 2 and FIG. 3, the flexible
請參閱第2及3圖,該線路層120設置於該上表面111的該線路設置區111a,該線路層120包含複數個線路120a,該線路層120具有至少一導接端121,該導接端121用以電性連接一晶片或其他電子元件。Please refer to FIGS. 2 and 3, the
請參閱第2及3圖,該立體結構層130設置於該上表面111的該待移除區111b,在本實施例中,當對該撓性電路板捲帶100進行一切割步驟時,該立體結構層130及該待移除區111b是被移除,請參閱第4A至4C圖,該立體結構層130選自於各種幾何圖形的立體構造。Referring to FIGS. 2 and 3, the three-dimensional
請參閱第2及3圖,該立體結構層130具有一第一側壁131,在本實施例中,該立體結構層130不與該線路層120電性連接,該立體結構層130與該線路層120為相同材質,較佳地,該立體結構層130的一厚度與該線路層120的一厚度相同,且該線路層120及該立體結構層130經由蝕刻一金屬板所形成,該立體結構層130具有一底面132,該底面132朝向該撓性載板110的該上表面111,該底面的一長度X1不小於0.5mm,該底面132的一寬度Y1不小於0.5mm,且該底面132的一第一面積不小於0.5mm2
,較佳地,該第一面積的計算公式為該第二面積乘以一係數,且該係數不小於0.012。Please refer to FIGS. 2 and 3, the three-
請參閱第2及3圖,該防焊層140覆蓋該撓性載板110及該線路層120,該防焊層140具有至少一開口141,該開口141顯露出該導接端121,且該防焊層140顯露出該立體結構層120,在本實施例中,該防焊層140具有一第二側壁142,較佳地,該立體結構層130的該第一側壁131與該防焊層140的該第二側壁142之間具有一間隙G。Please refer to FIGS. 2 and 3, the
請參閱第1、3及5圖,當該撓性載板110被捲收時,以該立體結構層130間隔上下堆疊的該撓性載板110,且由於該立體結構層130的該第一側壁131與該防焊層140的該第二側壁142之間具有該間隙G,使得被捲收成螺旋狀的該撓性載板110不會相互黏附,以避免該撓性電路板捲帶100被捲收時發生不易被捲收、捲收歪斜、磨損及的彎折情形。Please refer to FIGS. 1, 3 and 5, when the
本發明之保護範圍當視後附之申請專利範圍所界定者為準,任何熟知此項技藝者,在不脫離本發明之精神和範圍內所作之任何變化與修改,均屬於本發明之保護範圍。The scope of protection of the present invention shall be subject to the scope defined in the attached patent application. Any changes and modifications made by those who are familiar with this skill without departing from the spirit and scope of the present invention shall fall within the scope of protection of the present invention. .
100:撓性電路板捲帶110:撓性載板111:上表面111a:線路設置區111b:待移除區112:下表面120:線路層120a:線路121:導接端130:立體結構層131:第一側壁132:底面140:防焊層141:開口142:第二側壁200:捲輪X1:長度Y1:寬度X2:長度Y2:寬度G:間隙100: Flexible circuit board reel 110: Flexible carrier 111:
第1圖:本發明的撓性電路板捲帶捲收於捲輪的示意圖。 第2圖:本發明的撓性電路板捲帶的局部上視圖。 第3圖:本發明的撓性電路板捲帶的剖視圖。 第4A至4C圖:本發明的立體結構層的示意圖。 第5圖:本發明的撓性電路板捲帶被捲收後的局部剖視圖。Fig. 1: Schematic diagram of the flexible circuit board tape of the present invention wound up on a reel. Fig. 2: Partial top view of the flexible circuit board reel of the present invention. Figure 3: Cross-sectional view of the flexible circuit board reel of the present invention. 4A to 4C: schematic diagrams of the three-dimensional structure layer of the present invention. Fig. 5: A partial cross-sectional view of the flexible circuit board tape of the present invention after being wound up.
100:撓性電路板捲帶 100: flexible circuit board reel
110:撓性載板 110: Flexible carrier board
111a:線路設置區 111a: Line setting area
111b:待移除區 111b: Area to be removed
120:線路層 120: line layer
120a:線路 120a: line
121:導接端 121: Leading end
130:立體結構層 130: Three-dimensional structure layer
140:防焊層 140: solder mask
141:開口 141: opening
X1:長度 X1: Length
Y1:寬度 Y1: width
X2:長度 X2: Length
Y2:寬度 Y2: width
Claims (10)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW107130913A TWI660901B (en) | 2018-09-04 | 2018-09-04 | Flexible circuit tape |
CN201811169016.XA CN110876228A (en) | 2018-09-04 | 2018-10-08 | Flexible circuit board tape |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW107130913A TWI660901B (en) | 2018-09-04 | 2018-09-04 | Flexible circuit tape |
Publications (2)
Publication Number | Publication Date |
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TWI660901B TWI660901B (en) | 2019-06-01 |
TW202010703A true TW202010703A (en) | 2020-03-16 |
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ID=67764314
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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TW107130913A TWI660901B (en) | 2018-09-04 | 2018-09-04 | Flexible circuit tape |
Country Status (2)
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CN (1) | CN110876228A (en) |
TW (1) | TWI660901B (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI737257B (en) * | 2020-04-13 | 2021-08-21 | 頎邦科技股份有限公司 | Roll-up circuit board |
TWI738504B (en) * | 2020-09-11 | 2021-09-01 | 頎邦科技股份有限公司 | Circuit board tape and joining method thereof |
TWI741956B (en) * | 2020-04-13 | 2021-10-01 | 頎邦科技股份有限公司 | Roll-up circuit board |
TWI744197B (en) * | 2020-04-13 | 2021-10-21 | 頎邦科技股份有限公司 | Roll-up circuit board |
TWI763334B (en) * | 2020-04-13 | 2022-05-01 | 頎邦科技股份有限公司 | Roll-up circuit board |
TWI763333B (en) * | 2020-04-13 | 2022-05-01 | 頎邦科技股份有限公司 | Roll-up circuit board |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3407947B2 (en) * | 1993-09-30 | 2003-05-19 | 富士機械製造株式会社 | Tape film winding device for electronic parts |
JP2000272658A (en) * | 1999-03-23 | 2000-10-03 | Toshiba Corp | Carrier tape and packaging apparatus |
US6572387B2 (en) * | 1999-09-24 | 2003-06-03 | Staktek Group, L.P. | Flexible circuit connector for stacked chip module |
JP3638276B2 (en) * | 2002-12-24 | 2005-04-13 | 三井金属鉱業株式会社 | Film carrier tape for mounting electronic components |
JP4808468B2 (en) * | 2005-11-04 | 2011-11-02 | 日本メクトロン株式会社 | Hybrid multilayer circuit board and manufacturing method thereof |
CN101359652B (en) * | 2007-08-02 | 2011-05-04 | 宏茂微电子(上海)有限公司 | Coil type chip encapsulation construction |
TWI523590B (en) * | 2012-05-30 | 2016-02-21 | 旗勝科技股份有限公司 | Structure of a tape roll connecting double sided flexible substrate sheets |
TWI510150B (en) * | 2014-05-30 | 2015-11-21 | Chipmos Technologies Inc | Flexible circuit board |
-
2018
- 2018-09-04 TW TW107130913A patent/TWI660901B/en active
- 2018-10-08 CN CN201811169016.XA patent/CN110876228A/en active Pending
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI737257B (en) * | 2020-04-13 | 2021-08-21 | 頎邦科技股份有限公司 | Roll-up circuit board |
TWI741956B (en) * | 2020-04-13 | 2021-10-01 | 頎邦科技股份有限公司 | Roll-up circuit board |
TWI744197B (en) * | 2020-04-13 | 2021-10-21 | 頎邦科技股份有限公司 | Roll-up circuit board |
TWI763334B (en) * | 2020-04-13 | 2022-05-01 | 頎邦科技股份有限公司 | Roll-up circuit board |
TWI763333B (en) * | 2020-04-13 | 2022-05-01 | 頎邦科技股份有限公司 | Roll-up circuit board |
TWI738504B (en) * | 2020-09-11 | 2021-09-01 | 頎邦科技股份有限公司 | Circuit board tape and joining method thereof |
US11602047B2 (en) | 2020-09-11 | 2023-03-07 | Chipbond Technology Corporation | Circuit board tape and joining method thereof |
Also Published As
Publication number | Publication date |
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CN110876228A (en) | 2020-03-10 |
TWI660901B (en) | 2019-06-01 |
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