TW201940021A - Electromagnetic wave shield film and shield printed circuit board enables the connection portion of the ground component to easily penetrate through the insulation layer of the electromagnetic wave shield film while pressing the ground component - Google Patents

Abstract

The issue of the invention is to provide an electromagnetic wave shield film. While configuring a ground component on the electromagnetic wave shield film, a connection portion of the ground component easily touches the shield layer of the electromagnetic wave shield film. The the electromagnetic wave shield film of the invention is characterized by comprising an adhesive layer, a shield layer stacked on the adhesive layer, and an insulation layer stacked on the shield layer. The elastic modulus of the adhesive layer is 80~1500MPa.

Description

電磁波屏蔽膜及屏蔽印刷配線板Electromagnetic wave shielding film and shielding printed wiring board

發明領域
本發明是有關於電磁波屏蔽膜及屏蔽印刷配線板。FIELD OF THE INVENTION The present invention relates to an electromagnetic wave shielding film and a shielded printed wiring board.

背景技術
在急速發展小型化、高機能化的行動電話、視訊攝影機、筆記型電腦等電子儀器中，為了將電路組裝入複雜的機構中，大多會使用可撓性印刷配線板。再者，活用其優異之可撓性，亦會利用在像是印刷頭這種可動部與控制部之連接。於該等電子儀器中，必須要有電磁波屏蔽措施，至於裝置內所使用之可撓性印刷配線板，亦開始使用已施以電磁波屏蔽措施的可撓性印刷配線板(以下亦記載為「屏蔽印刷配線板」)。2. Description of the Related Art In the rapid development of miniaturized and highly functional electronic devices such as mobile phones, video cameras, and notebook computers, flexible printed wiring boards are often used to assemble circuits into complex mechanisms. In addition, the excellent flexibility is used to connect the movable part and the control part such as a print head. In these electronic devices, electromagnetic wave shielding measures must be taken. As for the flexible printed wiring boards used in the devices, flexible printed wiring boards (hereinafter also referred to as "shielding" Printed wiring board ").

一般的屏蔽印刷配線板通常由基體膜與電磁波屏蔽膜所構成，前述基體膜係於基底膜上依序設置印刷電路與絕緣膜而成，前述電磁波屏蔽膜則由接著劑層、積層於上述接著劑層之屏蔽層及積層於上述接著劑層之絕緣層所構成，並以上述接著劑層與上述基體膜相接之方式積層於上述基體膜。印刷電路中含有接地電路，接地電路為了能接地而與電子儀器之框體電連接。
如上述，於屏蔽印刷配線板之基體膜中，在含接地電路之印刷電路上設置有絕緣膜。又，基體膜受屏蔽膜所被覆，該屏蔽膜具有絕緣層。
故，為了將接地電路與電子儀器之框體電連接，必須事先在絕緣膜及屏蔽膜之一部分開孔。
這在設計印刷電路上會成為妨礙自由度的主要原因。A general shielded printed wiring board is generally composed of a base film and an electromagnetic wave shielding film. The base film is formed by sequentially printing a circuit and an insulating film on the base film. The electromagnetic wave shielding film is composed of an adhesive layer and a laminated layer on the above-mentioned The shielding layer of the adhesive layer and the insulating layer laminated on the adhesive layer are laminated on the substrate film such that the adhesive layer is in contact with the substrate film. The printed circuit includes a ground circuit, and the ground circuit is electrically connected to the frame of the electronic device in order to be able to ground.
As described above, in the base film of the shield printed wiring board, an insulating film is provided on the printed circuit including the ground circuit. The base film is covered with a shielding film having an insulating layer.
Therefore, in order to electrically connect the ground circuit to the frame of the electronic instrument, a hole must be made in part of the insulating film and the shielding film in advance.
This can be a major hindrance to freedom in designing printed circuits.

於專利文獻1中揭示有一種屏蔽膜，其係於分離膜單面塗佈形成覆蓋膜，且於前述覆蓋膜表面設置由金屬薄膜層與接著劑層所構成的屏蔽層，並具有接地構件，該接地構件形成為於一端側具有被按壓至前述覆蓋膜上並穿過前述覆蓋膜而與前述屏蔽層連接的突起(連接部)，另一端側則露出而可與其附近之接地部連接。
在製作專利文獻1中記載的屏蔽膜時，會以接地構件之突起(連接部)貫穿覆蓋膜之方式將接地構件按壓至覆蓋膜。故，接地構件可配置於屏蔽膜的任何位置。
若使用此種接地構件來製造屏蔽印刷配線板，則可於任何位置將接地電路與電子儀器之框體電連接。Patent Document 1 discloses a shielding film, which is formed by coating a cover film on one side of a separation film, and providing a shielding layer composed of a metal thin film layer and an adhesive layer on the surface of the cover film, and having a grounding member. The grounding member is formed with a protrusion (connection portion) that is pressed onto the cover film and passes through the cover film to connect with the shield layer at one end side, and the other end side is exposed to be connectable to a ground portion in the vicinity thereof.
When the shielding film described in Patent Document 1 is produced, the ground member is pressed against the cover film so that the projection (connection portion) of the ground member penetrates the cover film. Therefore, the grounding member can be arranged at any position of the shielding film.
If such a grounding member is used to manufacture a shielded printed wiring board, the grounding circuit can be electrically connected to the frame of the electronic instrument at any position.

先前技術文獻
專利文獻
專利文獻1：日本特許第4201548號Prior Art Literature Patent Literature Patent Literature 1: Japanese Patent No. 4201548

發明概要
發明欲解決之課題
當製造專利文獻1中記載的屏蔽印刷配線板時，會以接地構件之突起(連接部)貫穿覆蓋膜之方式將接地構件按壓至覆蓋膜。
此時，會有接地構件之突起(連接部)無法充分貫穿覆蓋膜而接地構件之突起(連接部)無法與屏蔽膜之屏蔽層充分接觸之情形。
當接地構件之突起(連接部)無法與屏蔽膜之屏蔽層充分接觸時，電阻值會上升。SUMMARY OF THE INVENTION Problems to be Solved by the Invention When the shield printed wiring board described in Patent Document 1 is manufactured, the ground member is pressed against the cover film so that the projection (connection portion) of the ground member penetrates the cover film.
At this time, the protrusion (connection portion) of the ground member may not sufficiently penetrate the cover film, and the protrusion (connection portion) of the ground member may not sufficiently contact the shielding layer of the shielding film.
When the protrusion (connection portion) of the ground member cannot sufficiently contact the shielding layer of the shielding film, the resistance value increases.

本發明是有鑑於上述問題而成的發明，本發明之目的在提供一種電磁波屏蔽膜，在將接地構件配置於電磁波屏蔽膜上時，接地構件之連接部容易接觸與電磁波屏蔽膜之屏蔽層。The present invention is made in view of the above-mentioned problems, and an object of the present invention is to provide an electromagnetic wave shielding film. When a ground member is disposed on the electromagnetic wave shielding film, the connection portion of the ground member easily contacts the shielding layer of the electromagnetic wave shielding film.

用以解決課題之手段
本發明之發明人等發現，在以接地構件之連接部貫穿電磁波屏蔽膜之絕緣層之方式將接地構件按壓至電磁波屏蔽膜上時，電磁波屏蔽膜之接著劑層之彈性模數會影響電磁波屏蔽膜之絕緣層的貫穿容易度，遂而完成本發明。
即，本發明之電磁波屏蔽膜特徵在於係由接著劑層、屏蔽層及絕緣層所構成，該屏蔽層積層於上述接著劑層；該絕緣層積層於上述屏蔽層，且上述接著劑層之彈性模數為80~1500MPa。Means for solving the problem The inventors of the present invention have found that when the ground member is pressed onto the electromagnetic wave shielding film in such a manner that the connection portion of the ground member penetrates the insulating layer of the electromagnetic wave shielding film, the elasticity of the adhesive layer of the electromagnetic wave shielding film The modulus will affect the ease of penetration of the insulating layer of the electromagnetic wave shielding film, and thus the present invention is completed.
That is, the electromagnetic wave shielding film of the present invention is characterized by being composed of an adhesive layer, a shielding layer, and an insulating layer. The shielding layer is laminated on the adhesive layer. The insulating layer is laminated on the shielding layer. The modulus is 80 ~ 1500MPa.

若接著劑層之彈性模數為80~1500MPa，則接著劑層構成適度之硬度，因此，在將接地構件按壓至電磁波屏蔽膜上時，接地構件之連接部容易貫穿電磁波屏蔽膜之絕緣層。
若接著劑層之彈性模數小於80MPa，則接著劑層過軟，在將接地構件按壓至電磁波屏蔽膜時，電磁波屏蔽膜之接著劑層會吸收壓力。故，接地構件之連接部不易貫穿電磁波屏蔽膜之絕緣層。
若接著劑層之彈性模數大於1500MPa，則接著劑層過硬，會失去電磁波屏蔽膜整體之柔軟性。If the elastic modulus of the adhesive layer is 80 to 1500 MPa, the adhesive layer constitutes moderate hardness. Therefore, when the ground member is pressed onto the electromagnetic wave shielding film, the connection portion of the ground member easily penetrates the insulating layer of the electromagnetic wave shielding film.
If the elastic modulus of the adhesive layer is less than 80 MPa, the adhesive layer is too soft. When the grounding member is pressed against the electromagnetic wave shielding film, the adhesive layer of the electromagnetic wave shielding film will absorb pressure. Therefore, it is difficult for the connection portion of the grounding member to penetrate the insulating layer of the electromagnetic wave shielding film.
If the elastic modulus of the adhesive layer is more than 1500 MPa, the adhesive layer is too hard, and the flexibility of the entire electromagnetic wave shielding film will be lost.

於本發明之電磁波屏蔽膜中，接著劑層之斷裂伸度宜為310%以下。
若接著劑層之斷裂伸度大於310%，則接著劑層變得過軟，在將接地構件按壓至電磁波屏蔽膜時，電磁波屏蔽膜之接著劑層容易吸收壓力。故，接地構件之連接部不易貫穿電磁波屏蔽膜之絕緣層。In the electromagnetic wave shielding film of the present invention, the fracture elongation of the adhesive layer is preferably 310% or less.
If the breaking elongation of the adhesive layer is more than 310%, the adhesive layer becomes too soft. When the grounding member is pressed against the electromagnetic wave shielding film, the adhesive layer of the electromagnetic wave shielding film easily absorbs pressure. Therefore, it is difficult for the connection portion of the grounding member to penetrate the insulating layer of the electromagnetic wave shielding film.

於本發明之電磁波屏蔽膜中，上述接著劑層可為導電性接著劑層。
通常於印刷配線板的電子電路也會設置接地電路。當本發明之電磁波屏蔽膜之接著劑層為導電性接著劑層時，藉由以使電磁波屏蔽膜之接著劑層接觸接地電路之方式將電磁波屏蔽膜配置於印刷配線板，可將該等電連接。
又，於本發明之電磁波屏蔽膜會配置接地構件。再者，接地構件會與外部接地連接。
故，藉由將本發明之電磁波屏蔽膜之接著劑層做成導電性接著劑層，可透過本發明之電磁波屏蔽膜及接地構件，將印刷配線板之接地電路電連接於外部接地。In the electromagnetic wave shielding film of the present invention, the adhesive layer may be a conductive adhesive layer.
A ground circuit is usually provided in an electronic circuit of a printed wiring board. When the adhesive layer of the electromagnetic wave shielding film of the present invention is a conductive adhesive layer, by disposing the electromagnetic wave shielding film on a printed wiring board in such a way that the adhesive layer of the electromagnetic wave shielding film contacts a ground circuit, the electric waves can be electrically charged. connection.
A grounding member is disposed in the electromagnetic wave shielding film of the present invention. Furthermore, the grounding member is connected to the external ground.
Therefore, by making the adhesive layer of the electromagnetic wave shielding film of the present invention a conductive adhesive layer, the ground circuit of the printed wiring board can be electrically connected to the external ground through the electromagnetic wave shielding film and the grounding member of the present invention.

本發明之屏蔽印刷配線板之特徵在於具備：基體膜，其包含基底膜及形成於上述基底膜上的印刷電路；上述本發明之電磁波屏蔽膜，其積層於上述基體膜上；及接地構件，其具有用以將上述電磁波屏蔽膜之屏蔽層與外部接地連接的連接部；上述電磁波屏蔽膜係以上述電磁波屏蔽膜之接著劑層接觸上述基體膜之方式積層於上述基體膜上，且上述接地構件之連接部貫穿上述電磁波屏蔽膜之絕緣層而接觸上述電磁波屏蔽膜之屏蔽層。The shielded printed wiring board of the present invention includes a base film including a base film and a printed circuit formed on the base film; the electromagnetic wave shielding film of the present invention laminated on the base film; and a grounding member, The electromagnetic wave shielding film is provided with a connecting portion for connecting the shielding layer of the electromagnetic wave shielding film to an external ground; the electromagnetic wave shielding film is laminated on the base film such that the adhesive layer of the electromagnetic wave shielding film contacts the base film, and the ground is The connection portion of the member penetrates the insulating layer of the electromagnetic wave shielding film and contacts the shielding layer of the electromagnetic wave shielding film.

於本發明之屏蔽印刷配線板中使用上述本發明之電磁波屏蔽膜。
故，接地構件之連接部貫穿電磁波屏蔽膜之絕緣層而與電磁波屏蔽膜之屏蔽層充分接觸。
因此，於本發明之屏蔽印刷配線板中，接地構件之連接部與電磁波屏蔽膜之屏蔽層充分地電連接。The above-mentioned electromagnetic wave shielding film of the present invention is used in a shielded printed wiring board of the present invention.
Therefore, the connection portion of the grounding member penetrates the insulating layer of the electromagnetic wave shielding film and makes full contact with the shielding layer of the electromagnetic wave shielding film.
Therefore, in the shield printed wiring board of the present invention, the connection portion of the ground member and the shielding layer of the electromagnetic wave shielding film are sufficiently electrically connected.

於本發明之屏蔽印刷配線板中，上述接地構件可由金屬箔及導電性填料所構成，且該導電性填料為藉接著性樹脂固定於上述金屬箔之連接部。
又，上述接地構件亦可由金屬箔及導電性突起所構成，且該導電性突起為形成於上述金屬箔之連接部。
又，上述接地構件亦可彎折金屬箔而構成，且該金屬箔之凸折部為上述連接部。
雖接地構件為此種構造，在將接地構件配置於電磁波屏蔽膜上時，接地構件之連接部仍可貫穿電磁波屏蔽膜之絕緣層。
故，於本發明之屏蔽印刷配線板中，接地構件之連接部與電磁波屏蔽膜之屏蔽層充分接觸。In the shielded printed wiring board of the present invention, the ground member may be composed of a metal foil and a conductive filler, and the conductive filler is a connection portion fixed to the metal foil by an adhesive resin.
The ground member may be formed of a metal foil and a conductive protrusion, and the conductive protrusion may be a connection portion formed on the metal foil.
The ground member may be configured by bending a metal foil, and the convex portion of the metal foil is the connection portion.
Although the grounding member has such a structure, when the grounding member is disposed on the electromagnetic wave shielding film, the connection portion of the grounding member can still penetrate the insulating layer of the electromagnetic wave shielding film.
Therefore, in the shielded printed wiring board of the present invention, the connection portion of the ground member and the shielding layer of the electromagnetic wave shielding film are sufficiently in contact.

發明效果
於本發明之電磁波屏蔽膜中，接著劑層之彈性模數為80~1500MPa。
若接著劑層之彈性模數為80~1500MPa，則接著劑層會有適度之硬度，因此，在將接地構件按壓至電磁波屏蔽膜上時，接地構件之連接部容易貫穿電磁波屏蔽膜之絕緣層。Advantageous Effects of Invention In the electromagnetic wave shielding film of the present invention, the elastic modulus of the adhesive layer is 80 to 1500 MPa.
If the elastic modulus of the adhesive layer is 80 to 1500 MPa, the adhesive layer will have a moderate hardness. Therefore, when the ground member is pressed onto the electromagnetic wave shielding film, the connection portion of the ground member easily penetrates the insulating layer of the electromagnetic wave shielding film .

用以實施發明之形態
以下，具體說明本發明之電磁波屏蔽膜。然而，本發明並不限於以下實施形態，在未變更本發明要旨的範圍內，可適當地變更而應用。Embodiments for Carrying Out the Invention Hereinafter, the electromagnetic wave shielding film of the present invention will be specifically described. However, the present invention is not limited to the following embodiments, and may be appropriately modified and applied without departing from the scope of the present invention.

圖1示意顯示本發明之電磁波屏蔽膜之一例的截面圖。
圖1所示之電磁波屏蔽膜10係由接著劑層11、積層於接著劑層11之屏蔽層12及積層於屏蔽層12之絕緣層13所構成。
又，接著劑層11之彈性模數為80~1500MPa。FIG. 1 is a cross-sectional view schematically showing an example of an electromagnetic wave shielding film of the present invention.
The electromagnetic wave shielding film 10 shown in FIG. 1 is composed of an adhesive layer 11, a shielding layer 12 laminated on the adhesive layer 11, and an insulating layer 13 laminated on the shielding layer 12.
The elastic modulus of the adhesive layer 11 is 80 to 1500 MPa.

又，電磁波屏蔽膜10會用於製造屏蔽印刷配線板。
在此，說明使用電磁波屏蔽膜10的屏蔽印刷配線板。The electromagnetic wave shielding film 10 is used for manufacturing a shielded printed wiring board.
Here, a shielded printed wiring board using the electromagnetic wave shielding film 10 will be described.

圖2為示意顯示使用本發明之電磁波屏蔽膜的屏蔽印刷配線板之一例的截面圖。
如圖2所示，屏蔽印刷配線板1具備：基體膜20，其由基底膜21、形成於基底膜21上的印刷電路22及以覆蓋印刷電路22之方式形成的覆蓋層23所構成；電磁波屏蔽膜10，其積層於基體膜20上；及接地構件30，其用以將電磁波屏蔽膜10之屏蔽層12與外部接地GND連接。2 is a cross-sectional view schematically showing an example of a shielded printed wiring board using the electromagnetic wave shielding film of the present invention.
As shown in FIG. 2, the shielded printed wiring board 1 includes a base film 20 composed of a base film 21, a printed circuit 22 formed on the base film 21, and a cover layer 23 formed to cover the printed circuit 22; electromagnetic waves The shielding film 10 is laminated on the base film 20; and a grounding member 30 is used to connect the shielding layer 12 of the electromagnetic wave shielding film 10 to the external ground GND.

於屏蔽印刷配線板1中，電磁波屏蔽膜10係以電磁波屏蔽膜10之接著劑層11接觸基體膜20之方式積層於基體膜20上。In the shield printed wiring board 1, the electromagnetic wave shielding film 10 is laminated on the base film 20 such that the adhesive layer 11 of the electromagnetic wave shielding film 10 contacts the base film 20.

接地構件30由金屬箔31及導電性填料33所構成，且前述導電性填料33藉由接著性樹脂32固定於金屬箔31。The ground member 30 includes a metal foil 31 and a conductive filler 33. The conductive filler 33 is fixed to the metal foil 31 by an adhesive resin 32.

又，接地構件30之導電性填料33貫穿電磁波屏蔽膜10之絕緣層13而接觸電磁波屏蔽膜10之屏蔽層12。
故，於屏蔽印刷配線板1中，接地構件30之導電性填料33與電磁波屏蔽膜10之屏蔽層12電連接。
即，導電性填料33具有作為連接電磁波屏蔽膜10與接地構件30之連接部的機能。The conductive filler 33 of the ground member 30 penetrates the insulating layer 13 of the electromagnetic wave shielding film 10 and contacts the shielding layer 12 of the electromagnetic wave shielding film 10.
Therefore, in the shield printed wiring board 1, the conductive filler 33 of the ground member 30 is electrically connected to the shielding layer 12 of the electromagnetic wave shielding film 10.
That is, the conductive filler 33 has a function as a connection portion between the electromagnetic wave shielding film 10 and the ground member 30.

於製造此種屏蔽印刷配線板1時，在將電磁波屏蔽膜10積層於基體膜20後，以接地構件30之導電性填料33貫穿電磁波屏蔽膜10之絕緣層13之方式，將接地構件30按壓至電磁波屏蔽膜10。When manufacturing such a shielded printed wiring board 1, after the electromagnetic wave shielding film 10 is laminated on the base film 20, the grounding member 30 is pressed by the conductive filler 33 of the grounding member 30 penetrating the insulating layer 13 of the electromagnetic wave shielding film 10. To the electromagnetic wave shielding film 10.

如上述，電磁波屏蔽膜10之接著劑層11之彈性模數為80~1500MPa。
故，電磁波屏蔽膜10之接著劑層11構成適度之硬度，因此，在將接地構件30按壓至電磁波屏蔽膜10時，接地構件30之導電性填料33容易貫穿電磁波屏蔽膜10之絕緣層13。
又，若電磁波屏蔽膜之接著劑層之彈性模數小於80MPa，則接著劑層過軟，在將接地構件按壓至電磁波屏蔽膜上時，電磁波屏蔽膜之接著劑層會吸收壓力。故，接地構件之連接部不易貫穿電磁波屏蔽膜之絕緣層。
若接著劑層之彈性模數大於1500MPa，則接著劑層過硬，會失去電磁波屏蔽膜整體之柔軟性。As described above, the elastic modulus of the adhesive layer 11 of the electromagnetic wave shielding film 10 is 80 to 1500 MPa.
Therefore, the adhesive layer 11 of the electromagnetic wave shielding film 10 constitutes moderate hardness. Therefore, when the ground member 30 is pressed against the electromagnetic wave shielding film 10, the conductive filler 33 of the ground member 30 easily penetrates the insulating layer 13 of the electromagnetic wave shielding film 10.
In addition, if the elastic modulus of the adhesive layer of the electromagnetic wave shielding film is less than 80 MPa, the adhesive layer is too soft. When the grounding member is pressed onto the electromagnetic wave shielding film, the adhesive layer of the electromagnetic wave shielding film will absorb pressure. Therefore, it is difficult for the connection portion of the grounding member to penetrate the insulating layer of the electromagnetic wave shielding film.
If the elastic modulus of the adhesive layer is more than 1500 MPa, the adhesive layer is too hard, and the flexibility of the entire electromagnetic wave shielding film will be lost.

另，於電磁波屏蔽膜10中，接著劑層11之彈性模數宜為60~1100MPa，且以100~700MPa更佳。In addition, in the electromagnetic wave shielding film 10, the elastic modulus of the adhesive layer 11 is preferably 60 to 1100 MPa, and more preferably 100 to 700 MPa.

於電磁波屏蔽膜10中，接著劑層11之斷裂伸度宜為310%以下，且以10~310%更佳，尤以50~310%為佳。
若接著劑層之斷裂伸度大於310%，則接著劑層變得過軟，在將接地構件按壓至電磁波屏蔽膜上時，電磁波屏蔽膜之接著劑層容易吸收壓力。故，接地構件之連接部不易貫穿電磁波屏蔽膜之絕緣層。In the electromagnetic wave shielding film 10, the fracture elongation of the adhesive layer 11 is preferably 310% or less, and more preferably 10 to 310%, and more preferably 50 to 310%.
If the breaking elongation of the adhesive layer is more than 310%, the adhesive layer becomes too soft. When the grounding member is pressed on the electromagnetic wave shielding film, the adhesive layer of the electromagnetic wave shielding film easily absorbs pressure. Therefore, it is difficult for the connection portion of the grounding member to penetrate the insulating layer of the electromagnetic wave shielding film.

於電磁波屏蔽膜10中，接著劑層11可由熱硬化性樹脂構成，亦可由熱塑性樹脂構成。
熱硬化性樹脂例如可列舉：酚系樹脂、環氧系樹脂、胺甲酸乙酯系樹脂、三聚氰胺系樹脂、聚醯胺系樹脂及醇酸系樹脂等。
又，熱塑性樹脂例如可列舉：苯乙烯系樹脂、醋酸乙烯酯系樹脂、聚酯系樹脂、聚乙烯系樹脂、聚丙烯系樹脂、醯亞胺系樹脂及丙烯酸系樹脂。
又，環氧系樹脂更宜為醯胺改質環氧樹脂。
該等樹脂適合作為構成接著劑層的樹脂。In the electromagnetic wave shielding film 10, the adhesive layer 11 may be made of a thermosetting resin or a thermoplastic resin.
Examples of the thermosetting resin include a phenol-based resin, an epoxy-based resin, a urethane-based resin, a melamine-based resin, a polyamide-based resin, and an alkyd-based resin.
Examples of the thermoplastic resin include a styrene-based resin, a vinyl acetate-based resin, a polyester-based resin, a polyethylene-based resin, a polypropylene-based resin, a fluorene-based resin, and an acrylic resin.
The epoxy-based resin is more preferably a modified amine modified epoxy resin.
These resins are suitable as a resin constituting the adhesive layer.

電磁波屏蔽膜10之接著劑層11之厚度並無特殊限制，宜為1~50μm，且以3~30μm更佳。
若接著劑層之厚度小於1μm，則構成接著劑層的樹脂量少，因此，不易獲得充分之接著性能。又，會變得容易破損。
若接著劑層之厚度大於50μm，則電磁波屏蔽膜整體變厚，容易失去柔軟性。The thickness of the adhesive layer 11 of the electromagnetic wave shielding film 10 is not particularly limited, and is preferably 1 to 50 μm, and more preferably 3 to 30 μm.
If the thickness of the adhesive layer is less than 1 μm, the amount of resin constituting the adhesive layer is small, and therefore it is difficult to obtain sufficient adhesive performance. In addition, it may be easily damaged.
If the thickness of the adhesive layer is more than 50 μm, the entire electromagnetic wave shielding film becomes thick, and the flexibility is easily lost.

於電磁波屏蔽膜10中，接著劑層11亦可為導電性接著劑層。
通常於印刷配線板的電子電路亦設置有接地電路。當電磁波屏蔽膜10之接著劑層11為導電性接著劑層時，藉由以使電磁波屏蔽膜10之接著劑層11接觸接地電路之方式將電磁波屏蔽膜10配置於印刷配線板，可將該等電連接。
又，如上述，於電磁波屏蔽膜10配置有接地構件30。再者，接地構件30會與外部接地GND連接。
故，藉由將電磁波屏蔽膜10之接著劑層11設為導電性接著劑層，可透過電磁波屏蔽膜10及接地構件30，將印刷配線板之接地電路電連接於外部接地GND。In the electromagnetic wave shielding film 10, the adhesive layer 11 may be a conductive adhesive layer.
A ground circuit is also generally provided in an electronic circuit of a printed wiring board. When the adhesive layer 11 of the electromagnetic wave shielding film 10 is a conductive adhesive layer, the electromagnetic wave shielding film 10 can be placed on a printed wiring board so that the electromagnetic wave shielding film 10 has the adhesive layer 11 in contact with a ground circuit. Waiting for electrical connection.
As described above, the ground member 30 is disposed on the electromagnetic wave shielding film 10. The ground member 30 is connected to the external ground GND.
Therefore, by setting the adhesive layer 11 of the electromagnetic wave shielding film 10 as a conductive adhesive layer, the ground circuit of the printed wiring board can be electrically connected to the external ground GND through the electromagnetic wave shielding film 10 and the ground member 30.

當電磁波屏蔽膜10之接著劑層11為導電性接著劑層時，接著劑層11亦可由導電性粒子與接著性樹脂組成物構成。When the adhesive layer 11 of the electromagnetic wave shielding film 10 is a conductive adhesive layer, the adhesive layer 11 may be composed of conductive particles and an adhesive resin composition.

導電性粒子並無特殊限制，可為金屬微粒子、奈米碳管、碳纖維、金屬纖維等。The conductive particles are not particularly limited, and may be metal fine particles, nano carbon tubes, carbon fibers, metal fibers, and the like.

當導電性粒子為金屬微粒子時，金屬微粒子並無特殊限制，可為銀粉、銅粉、鎳粉、焊粉、鋁粉、對銅粉施以鍍銀的銀包銅粉、以金屬被覆高分子微粒子或玻璃珠等的微粒子等。
於該等之中，若由經濟性之觀點來看，則宜為可廉價地取得的銅粉或銀包銅粉。When the conductive particles are metal fine particles, the metal fine particles are not particularly limited, and may be silver powder, copper powder, nickel powder, solder powder, aluminum powder, silver-coated copper powder coated with silver on copper powder, and polymer coated with metal. Fine particles such as fine particles and glass beads.
Among these, from the viewpoint of economy, it is preferable to use copper powder or silver-clad copper powder which can be obtained inexpensively.

導電性粒子之平均粒徑並無特殊限制，宜為0.5~15.0μm。若導電性粒子之平均粒徑為0.5μm以上，則導電性接著劑層之導電性會變得良好。若導電性粒子之平均粒徑為15.0μm以下，則可減薄導電性接著劑層。The average particle diameter of the conductive particles is not particularly limited, but is preferably 0.5 to 15.0 μm. When the average particle diameter of a conductive particle is 0.5 micrometer or more, the electroconductivity of a conductive adhesive layer will become favorable. When the average particle diameter of the conductive particles is 15.0 μm or less, the conductive adhesive layer can be thinned.

導電性粒子之形狀並無特殊限制，可適當地選自於球狀、扁平狀、鱗片狀、枝晶狀、棒狀、纖維狀等。The shape of the conductive particles is not particularly limited, and may be appropriately selected from the group consisting of spherical, flat, scaly, dendritic, rod-shaped, and fibrous.

導電性粒子之摻合量並無特殊限制，宜為15~80質量%，且以15~60質量%更佳。The blending amount of the conductive particles is not particularly limited, and is preferably 15 to 80% by mass, and more preferably 15 to 60% by mass.

接著性樹脂組成物之材料並無特殊限制，可使用苯乙烯系樹脂組成物、醋酸乙烯酯系樹脂組成物、聚酯系樹脂組成物、聚乙烯系樹脂組成物、聚丙烯系樹脂組成物、醯亞胺系樹脂組成物、醯胺系樹脂組成物、丙烯酸系樹脂組成物等熱塑性樹脂組成物；或是酚系樹脂組成物、環氧系樹脂組成物、胺甲酸乙酯系樹脂組成物、三聚氰胺系樹脂組成物、醇酸系樹脂組成物等熱硬化性樹脂組成物等。
接著性樹脂組成物之材料可為該等之單獨1種，亦可為2種以上之組合。The material of the adhesive resin composition is not particularly limited, and a styrene resin composition, a vinyl acetate resin composition, a polyester resin composition, a polyethylene resin composition, a polypropylene resin composition, Thermoplastic resin composition such as fluorene resin composition, amine resin composition, acrylic resin composition; or phenol resin composition, epoxy resin composition, urethane resin composition, Thermosetting resin compositions such as a melamine resin composition and an alkyd resin composition.
The material of the adhesive resin composition may be one of these alone or a combination of two or more thereof.

又，當接著劑層11為導電性接著劑層時，宜具有各向異性導電性。
若接著劑層11具有各向異性導電性，則相較於具有各向同性導電性之情形，藉由印刷配線板之信號電路傳輸的高頻信號之傳輸特性會提升。When the adhesive layer 11 is a conductive adhesive layer, it is preferable to have anisotropic conductivity.
If the adhesive layer 11 has anisotropic conductivity, the transmission characteristics of high-frequency signals transmitted through the signal circuit of the printed wiring board will be improved compared to the case of having isotropic conductivity.

又，電磁波屏蔽膜10之接著劑層11可以視需要而含有阻燃劑、阻燃助劑、硬化促進劑、黏著性賦予劑、抗氧化劑、顏料、染料、塑化劑、紫外線吸收劑、消泡劑、調平劑、填充材、黏度調節劑等。
藉由於電磁波屏蔽膜10之接著劑層11中加入該等物質，亦可調節彈性模數及斷裂伸度。In addition, the adhesive layer 11 of the electromagnetic wave shielding film 10 may contain a flame retardant, a flame retardant auxiliary, a hardening accelerator, an adhesiveness imparting agent, an antioxidant, a pigment, a dye, a plasticizer, an ultraviolet absorber, and a consumer as needed. Foaming agent, leveling agent, filling material, viscosity adjusting agent, etc.
By adding these substances to the adhesive layer 11 of the electromagnetic wave shielding film 10, the elastic modulus and the elongation at break can also be adjusted.

阻燃劑可舉例如：有機磷系阻燃劑、氮化合物系阻燃劑、溴化合物系阻燃劑、銻系阻燃劑、金屬氫氧化物、氯化合物系阻燃劑、硼化合物系阻燃劑等。Examples of the flame retardant include: organic phosphorus flame retardant, nitrogen compound flame retardant, bromine compound flame retardant, antimony flame retardant, metal hydroxide, chlorine compound flame retardant, boron compound flame retardant. Fuel and so on.

阻燃助劑可舉例如氮系阻燃助劑。Examples of the flame retardant auxiliary include a nitrogen-based flame retardant auxiliary.

為了令導電性接著劑層之彈性模數為預定範圍內，亦可使用各種化合物。
此種化合物可使用具有高於接著性樹脂組成物之彈性模數的填充材。
作為填充材之例子，可使用氮系化合物、二氧化矽系化合物、有機磷系化合物等，理想的是使用氮系化合物。
又，此種化合物除了具有作為填充材之機能外，亦可具有阻燃劑或阻燃助劑等其他機能。
若使用具有作為填充材之機能及作為阻燃劑或阻燃助劑之機能的氮系化合物，則可兼顧阻燃性之賦予及彈性模數之調整。
此種氮系化合物例如可使用公知氮化合物系阻燃劑。In order to make the elastic modulus of the conductive adhesive layer within a predetermined range, various compounds may be used.
As such a compound, a filler having an elastic modulus higher than that of the adhesive resin composition can be used.
Examples of the filler include a nitrogen-based compound, a silicon dioxide-based compound, an organic phosphorus-based compound, and the like, and a nitrogen-based compound is preferably used.
In addition, such a compound may have other functions such as a flame retardant or a flame retardant auxiliary in addition to its function as a filler.
When a nitrogen-based compound having a function as a filler and a function as a flame retardant or a flame retardant auxiliary is used, both the provision of flame retardancy and the adjustment of the elastic modulus can be taken into consideration.
As such a nitrogen-based compound, for example, a known nitrogen compound-based flame retardant can be used.

具有作為填充材之機能的化合物宜為粒子狀。
此時，該粒子之彈性模數宜為50~2000MPa，平均粒徑宜為0.5~30μm。
具有作為填充材之機能的化合物之摻合量相對於接著性樹脂組成物100質量份宜為10~300質量份。The compound having a function as a filler is preferably particulate.
At this time, the elastic modulus of the particles should be 50 to 2000 MPa, and the average particle diameter should be 0.5 to 30 μm.
The compounding amount of the compound having a function as a filler is preferably 10 to 300 parts by mass relative to 100 parts by mass of the adhesive resin composition.

電磁波屏蔽膜10之屏蔽層12只要是具有電磁波屏蔽性，則可由任何材料構成，例如可由金屬層構成。As long as the shielding layer 12 of the electromagnetic wave shielding film 10 has electromagnetic wave shielding properties, it can be made of any material, for example, a metal layer.

屏蔽層12可包含由金、銀、銅、鋁、鎳、錫、鈀、鉻、鈦、鋅等材料所構成的層體，理想的是包含銅層。
若由導電性及經濟性之觀點來看，則銅對於屏蔽層12而言屬於適合之材料。
另，屏蔽層12亦可包含由上述金屬之合金所構成的層體。The shielding layer 12 may include a layer body made of a material such as gold, silver, copper, aluminum, nickel, tin, palladium, chromium, titanium, and zinc, and preferably includes a copper layer.
From the viewpoints of conductivity and economy, copper is a suitable material for the shielding layer 12.
The shielding layer 12 may include a layer body made of an alloy of the above-mentioned metals.

屏蔽層12之厚度宜為0.01~10μm。
若屏蔽層之厚度小於0.01μm，則不易獲得充分之屏蔽效果。
若屏蔽層之厚度大於10μm，則會變得不易彎曲。The thickness of the shielding layer 12 is preferably 0.01 to 10 μm.
If the thickness of the shielding layer is less than 0.01 μm, it is difficult to obtain a sufficient shielding effect.
If the thickness of the shielding layer is more than 10 μm, it becomes difficult to bend.

電磁波屏蔽膜10之絕緣層13只要是具有充分之絕緣性，且可保護接著劑層11及屏蔽層12，則無特殊限制，例如宜由熱塑性樹脂組成物、熱硬化性樹脂組成物、活性能量線硬化性組成物等構成。
上述熱塑性樹脂組成物並無特殊限制，可舉例如：苯乙烯系樹脂組成物、醋酸乙烯酯系樹脂組成物、聚酯系樹脂組成物、聚乙烯系樹脂組成物、聚丙烯系樹脂組成物、醯亞胺系樹脂組成物、丙烯酸系樹脂組成物等。The insulating layer 13 of the electromagnetic wave shielding film 10 is not particularly limited as long as it has sufficient insulation and can protect the adhesive layer 11 and the shielding layer 12, for example, it is preferably composed of a thermoplastic resin composition, a thermosetting resin composition, and active energy. It consists of a linear curable composition.
The thermoplastic resin composition is not particularly limited, and examples thereof include a styrene resin composition, a vinyl acetate resin composition, a polyester resin composition, a polyethylene resin composition, a polypropylene resin composition,醯 imine resin composition, acrylic resin composition, etc.

上述熱硬化性樹脂組成物並無特殊限制，可舉例如：酚系樹脂組成物、環氧系樹脂組成物、胺甲酸乙酯系樹脂組成物、三聚氰胺系樹脂組成物、醇酸系樹脂組成物等。The thermosetting resin composition is not particularly limited, and examples thereof include a phenol resin composition, an epoxy resin composition, a urethane resin composition, a melamine resin composition, and an alkyd resin composition. Wait.

上述活性能量線硬化性組成物並無特殊限制，例如可舉例：於分子中具有至少2個(甲基)丙烯醯氧基的聚合性化合物等。The active energy ray-curable composition is not particularly limited, and examples thereof include polymerizable compounds having at least two (meth) acryloxy groups in a molecule.

絕緣層13可由1種單獨之材料構成，亦可由2種以上之材料構成。The insulating layer 13 may be composed of a single material or may be composed of two or more materials.

於絕緣層13中，視需要亦可含有硬化促進劑、黏著性賦予劑、抗氧化劑、顏料、染料、塑化劑、紫外線吸收劑、消泡劑、調平劑、填充材、阻燃劑、黏度調節劑、抗結塊劑等。The insulating layer 13 may contain a hardening accelerator, an adhesion-imparting agent, an antioxidant, a pigment, a dye, a plasticizer, an ultraviolet absorber, a defoamer, a leveling agent, a filler, a flame retardant, Viscosity modifier, anti-caking agent, etc.

絕緣層13之厚度並無特殊限制，可以視需要適當地設定，理想的是1~15μm，且以3~10μm更佳。
若絕緣層之厚度小於1μm，則由於會過薄，因此，不易充分保護接著劑層及屏蔽層。
若絕緣層之厚度大於15μm，則由於會過厚，因此，接地構件之導電性填料不易貫穿電磁波屏蔽膜之絕緣層。The thickness of the insulating layer 13 is not particularly limited, and can be appropriately set as needed, and is preferably 1 to 15 μm, and more preferably 3 to 10 μm.
If the thickness of the insulating layer is less than 1 μm, it will be too thin, so it is difficult to sufficiently protect the adhesive layer and the shielding layer.
If the thickness of the insulating layer is greater than 15 μm, it will be too thick, so that the conductive filler of the ground member cannot easily penetrate the insulating layer of the electromagnetic wave shielding film.

於電磁波屏蔽膜10中，亦可於屏蔽層12與絕緣層13間形成底塗層。
底塗層之材料可舉例如：胺甲酸乙酯樹脂、丙烯酸樹脂、以胺甲酸乙酯樹脂為殼且以丙烯酸樹脂為核的核-殼型複合樹脂、環氧樹脂、醯亞胺樹脂、醯胺樹脂、三聚氰胺樹脂、酚樹脂、脲甲醛樹脂、使苯酚等阻斷劑對聚異氰酸酯反應而得之封閉異氰酸酯、聚乙烯醇、聚乙烯氫吡咯酮等。In the electromagnetic wave shielding film 10, an undercoat layer may be formed between the shielding layer 12 and the insulating layer 13.
The material of the undercoat layer may be, for example, urethane resin, acrylic resin, core-shell composite resin with urethane resin as the shell and acrylic resin as the core, epoxy resin, fluorene imine resin, fluorene Amine resin, melamine resin, phenol resin, urea-formaldehyde resin, blocked isocyanate, polyvinyl alcohol, polyvinyl hydrogen pyrrolidone, etc., obtained by reacting a blocking agent such as phenol to polyisocyanate.

使用本發明之電磁波屏蔽膜的屏蔽印刷配線板亦為本發明之屏蔽印刷配線板。
即，上述屏蔽印刷配線板1為本發明之屏蔽印刷配線板。The shielded printed wiring board using the electromagnetic wave shielding film of the present invention is also a shielded printed wiring board of the present invention.
That is, the shielded printed wiring board 1 is a shielded printed wiring board of the present invention.

說明構成屏蔽印刷配線板1的基體膜20。The base film 20 constituting the shield printed wiring board 1 will be described.

構成基體膜20的基底膜21及覆蓋層23之材料並無特殊限制，宜由工程塑膠構成。此種工程塑膠例如可列舉：聚對苯二甲酸乙二酯、聚丙烯、交聯聚乙烯、聚酯、聚苯并咪唑、聚醯亞胺、聚醯亞胺醯胺、聚醚醯亞胺、聚伸苯硫等樹脂。
又，於該等工程塑膠中，當要求阻燃性時，宜為聚伸苯硫膜，當要求耐熱性時，則宜為聚醯亞胺膜。另，基底膜21之厚度宜為10~40μm。又，覆蓋層23之厚度宜為10~30μm。The materials of the base film 21 and the cover layer 23 constituting the base film 20 are not particularly limited, and should be made of engineering plastics. Examples of such engineering plastics include polyethylene terephthalate, polypropylene, cross-linked polyethylene, polyester, polybenzimidazole, polyimide, polyimide, imide, and polyetherimide. , Polyphenylene sulfide and other resins.
In addition, in these engineering plastics, when flame retardancy is required, a polyphenylene sulfide film is preferable, and when heat resistance is required, a polyimide film is preferable. In addition, the thickness of the base film 21 is preferably 10 to 40 μm. The thickness of the cover layer 23 is preferably 10 to 30 μm.

構成基體膜20的印刷電路22並無特殊限制，可藉由將導電性材料進行蝕刻處理等來形成。
導電材料可舉例如：銅、鎳、銀、金等。The printed circuit 22 constituting the base film 20 is not particularly limited, and can be formed by performing an etching process or the like on a conductive material.
Examples of the conductive material include copper, nickel, silver, and gold.

其次，說明構成屏蔽印刷配線板1的接地構件30。Next, the ground member 30 constituting the shield printed wiring board 1 will be described.

接地構件30之導電性填料33宜包含選自於由銅粉、銀粉、鎳粉、銀包銅粉、金包銅粉、銀包鎳粉、金包鎳粉及於樹脂被覆金屬粉的粒子所構成群組中之至少1種。
該等粒子之導電性優異。The conductive filler 33 of the ground member 30 preferably contains particles selected from the group consisting of copper powder, silver powder, nickel powder, silver-coated copper powder, gold-coated copper powder, silver-coated nickel powder, gold-coated nickel powder, and resin-coated metal powder. Make up at least one of the groups.
These particles are excellent in electrical conductivity.

於接地構件30中，導電性填料33之平均粒徑宜為1~200μm。
若導電性填料之平均粒徑小於1μm，則由於導電性填料小，因此，不易貫通電磁波屏蔽膜之絕緣層。
若導電性填料之平均粒徑大於200μm，則由於導電性填料變大，因此，為了貫穿電磁波屏蔽膜之絕緣層而必須有強大之壓力。In the ground member 30, the average particle diameter of the conductive filler 33 is preferably 1 to 200 μm.
If the average particle diameter of the conductive filler is less than 1 μm, the conductive filler is small, and therefore it is difficult to penetrate the insulating layer of the electromagnetic wave shielding film.
If the average particle diameter of the conductive filler is larger than 200 μm, the conductive filler becomes large, and therefore, a strong pressure must be applied to penetrate the insulating layer of the electromagnetic wave shielding film.

於接地構件30中，接著性樹脂32之材料並無特殊限制，可使用苯乙烯系樹脂組成物、醋酸乙烯酯系樹脂組成物、聚酯系樹脂組成物、聚乙烯系樹脂組成物、聚丙烯系樹脂組成物、醯亞胺系樹脂組成物、醯胺系樹脂組成物、丙烯酸系樹脂組成物等熱塑性樹脂組成物；或是酚系樹脂組成物、環氧系樹脂組成物、胺甲酸乙酯系樹脂組成物、三聚氰胺系樹脂組成物、醇酸系樹脂組成物等熱硬化性樹脂組成物等。
接著性樹脂之材料可為該等之單獨1種，亦可為2種以上之組合。In the ground member 30, the material of the adhesive resin 32 is not particularly limited, and a styrene resin composition, a vinyl acetate resin composition, a polyester resin composition, a polyethylene resin composition, and polypropylene can be used. Thermoplastic resin composition such as resin composition, ammonium resin composition, amidine resin composition, acrylic resin composition; or phenol resin composition, epoxy resin composition, urethane Thermosetting resin composition such as a resin composition, a melamine resin composition, and an alkyd resin composition.
The material of the adhesive resin may be one of these alone or a combination of two or more of them.

於接地構件30中，金屬箔31只要是由具有導電性之金屬構成，則無特殊限制，例如宜包含選自於由銅、鋁、銀、金、鎳、鉻、鈦、鋅及不鏽鋼所構成群組中之至少1種。
該等材料之導電性優異。In the ground member 30, the metal foil 31 is not particularly limited as long as it is made of a conductive metal. For example, the metal foil 31 is preferably selected from the group consisting of copper, aluminum, silver, gold, nickel, chromium, titanium, zinc, and stainless steel. At least one of the groups.
These materials have excellent electrical conductivity.

又，於本發明之屏蔽印刷配線板中，接地構件亦可為以下構造。
圖3為示意顯示本發明之屏蔽印刷配線板之另一例的截面圖。
圖4為示意顯示本發明之屏蔽印刷配線板之另一例的截面圖。In the shield printed wiring board of the present invention, the grounding member may have the following structure.
FIG. 3 is a cross-sectional view schematically showing another example of a shielded printed wiring board of the present invention.
FIG. 4 is a cross-sectional view schematically showing another example of a shielded printed wiring board of the present invention.

圖3所示之屏蔽印刷配線板101除了接地構件30被接地構件130取代外，屬於與上述屏蔽印刷配線板1相同的構造。The shielded printed wiring board 101 shown in FIG. 3 has the same structure as that of the shielded printed wiring board 1 except that the grounding member 30 is replaced by the grounding member 130.

於圖3所示之屏蔽印刷配線板101中，接地構件130由金屬箔131及導電性突起134所構成，且該導電性突起134形成於金屬箔131。
於屏蔽印刷配線板101中，接地構件130之導電性突起134貫穿電磁波屏蔽膜10之絕緣層13而接觸電磁波屏蔽膜10之屏蔽層12。
故，於屏蔽印刷配線板101中，接地構件130之導電性突起134與電磁波屏蔽膜10之屏蔽層12電連接。
即，導電性突起134具有作為連接電磁波屏蔽膜10與接地構件130之連接部的機能。In the shield printed wiring board 101 shown in FIG. 3, the ground member 130 is composed of a metal foil 131 and a conductive protrusion 134, and the conductive protrusion 134 is formed on the metal foil 131.
In the shield printed wiring board 101, the conductive protrusion 134 of the ground member 130 penetrates the insulating layer 13 of the electromagnetic wave shielding film 10 and contacts the shielding layer 12 of the electromagnetic wave shielding film 10.
Therefore, in the shield printed wiring board 101, the conductive protrusion 134 of the ground member 130 is electrically connected to the shielding layer 12 of the electromagnetic wave shielding film 10.
That is, the conductive protrusion 134 has a function as a connection portion that connects the electromagnetic wave shielding film 10 and the ground member 130.

於接地構件130中，導電性突起134可與金屬箔131一體化，亦可藉由接著性樹脂等接著於金屬箔131。In the ground member 130, the conductive protrusion 134 may be integrated with the metal foil 131, or may be bonded to the metal foil 131 by an adhesive resin or the like.

於接地構件130中，金屬箔131只要是由具有導電性之金屬構成，則無特殊限制，例如宜包含選自於由銅、鋁、銀、金、鎳、鉻、鈦、鋅及不鏽鋼所構成群組中之至少1種。
該等材料之導電性優異。In the grounding member 130, the metal foil 131 is not particularly limited as long as it is made of a conductive metal. For example, the metal foil 131 may be selected from the group consisting of copper, aluminum, silver, gold, nickel, chromium, titanium, zinc, and stainless steel. At least one of the groups.
These materials have excellent electrical conductivity.

於接地構件130中，導電性突起134之材料並無特殊限制，例如宜包含選自於由銅、鋁、銀、金、鎳、鉻、鈦、鋅及不鏽鋼所構成群組中之至少1種。
又，金屬箔131與導電性突起134宜由相同材料構成。In the ground member 130, the material of the conductive protrusion 134 is not particularly limited, and for example, it is preferable to include at least one selected from the group consisting of copper, aluminum, silver, gold, nickel, chromium, titanium, zinc, and stainless steel. .
The metal foil 131 and the conductive protrusion 134 are preferably made of the same material.

於接地構件130中，導電性突起134可為柱狀，例如可為圓柱、橢圓柱、三角柱、四角柱、五角柱、六角柱、八角柱等。
若導電性突起134為柱狀，則容易貫穿電磁波屏蔽膜10之絕緣層13。In the grounding member 130, the conductive protrusion 134 may be a columnar shape, for example, it may be a cylinder, an elliptical column, a triangular column, a quadrangular column, a pentagonal column, a hexagonal column, or an octagonal column.
When the conductive protrusion 134 is columnar, it is easy to penetrate the insulating layer 13 of the electromagnetic wave shielding film 10.

於接地構件130中，導電性突起134之底面面積宜為1.0~1.0×10⁶ μm² 。
若導電性突起之底面面積小於1.0μm² ，則導電性突起之強度減弱，導電性突起容易折斷。
若導電性突起之底面面積大於1.0×10⁶ μm² ，則由於導電性突起過粗，因此，不易貫穿電磁波屏蔽膜之絕緣層。In the grounding member 130, the area of the bottom surface of the conductive protrusion 134 is preferably 1.0 to 1.0 × 10 ⁶ μm ² .
When the area of the bottom surface of the conductive protrusion is less than 1.0 μm ² , the strength of the conductive protrusion is weakened, and the conductive protrusion is easily broken.
If the area of the bottom surface of the conductive protrusion is greater than 1.0 × 10 ⁶ μm ² , the conductive protrusion is too thick, and therefore it is difficult to penetrate the insulating layer of the electromagnetic wave shielding film.

於接地構件130中，導電性突起134彼此之間距宜為1~1000μm。
導電性突起彼此之間距小於1μm的接地構件在技術上是難以製作的。
若導電性突起彼此之間距大於1000μm，則密度會減低，接地構件之導電性突起與電磁波屏蔽膜之屏蔽層的總接觸面積減小。故，電阻變得容易提高。In the ground member 130, the distance between the conductive protrusions 134 is preferably 1 to 1000 μm.
It is technically difficult to produce a ground member having a distance between conductive protrusions of less than 1 μm.
If the distance between the conductive protrusions is more than 1000 μm, the density will decrease, and the total contact area between the conductive protrusions of the ground member and the shielding layer of the electromagnetic wave shielding film will decrease. Therefore, the resistance becomes easy to increase.

於接地構件130中，導電性突起134之高度只要能貫穿電磁波屏蔽膜10之絕緣層13，則無特殊限制，宜為3~20μm。In the ground member 130, the height of the conductive protrusion 134 is not particularly limited as long as it can penetrate the insulating layer 13 of the electromagnetic wave shielding film 10, and is preferably 3 to 20 μm.

圖4所示之屏蔽印刷配線板201除了接地構件30被接地構件230取代外，屬於與上述屏蔽印刷配線板1相同的構造。The shielded printed wiring board 201 shown in FIG. 4 has the same structure as that of the shielded printed wiring board 1 except that the grounding member 30 is replaced by the grounding member 230.

於圖4所示之屏蔽印刷配線板201中，接地構件230係彎折金屬箔231而構成。又，於金屬箔231形成有凸折部235。
於屏蔽印刷配線板201中，接地構件230之凸折部235貫穿電磁波屏蔽膜10之絕緣層13而接觸電磁波屏蔽膜10之屏蔽層12。
故，於屏蔽印刷配線板201中，接地構件230之凸折部235與電磁波屏蔽膜10之屏蔽層12電連接。
即，凸折部235具有作為連接電磁波屏蔽膜10與接地構件230之連接部的機能。In the shielded printed wiring board 201 shown in FIG. 4, the ground member 230 is configured by bending a metal foil 231. Further, a convex folded portion 235 is formed on the metal foil 231.
In the shield printed wiring board 201, the convex folded portion 235 of the ground member 230 penetrates the insulating layer 13 of the electromagnetic wave shielding film 10 and contacts the shielding layer 12 of the electromagnetic wave shielding film 10.
Therefore, in the shield printed wiring board 201, the convex folded portion 235 of the ground member 230 is electrically connected to the shielding layer 12 of the electromagnetic wave shielding film 10.
That is, the convex folded portion 235 has a function as a connection portion that connects the electromagnetic wave shielding film 10 and the ground member 230.

於接地構件230中，金屬箔231只要是由具有導電性之金屬構成，則無特殊限制，例如宜包含選自於由銅、鋁、銀、金、鎳、鉻、鈦、鋅及不鏽鋼所構成群組中之至少1種。
該等材料之導電性優異。In the ground member 230, the metal foil 231 is not particularly limited as long as it is made of a conductive metal. For example, the metal foil 231 may be selected from the group consisting of copper, aluminum, silver, gold, nickel, chromium, titanium, zinc, and stainless steel. At least one of the groups.
These materials have excellent electrical conductivity.

於接地構件230中，凸折部235之高度只要能貫穿電磁波屏蔽膜10之絕緣層13，則無特殊限制，宜為3~20μm。In the grounding member 230, the height of the convex folded portion 235 is not particularly limited as long as it can penetrate the insulating layer 13 of the electromagnetic wave shielding film 10, and is preferably 3 to 20 μm.

實施例
以下顯示更具體說明本發明的實施例，惟本發明並不限於該等實施例。
另，於以下實施例之說明中，「份」意味著質量份。Examples The following shows examples of the present invention in more detail, but the present invention is not limited to these examples.
In the description of the following examples, "parts" means mass parts.

(實施例1)
首先，準備已於單面施行剝離處理的聚對苯二甲酸乙二酯膜作為第1剝離膜。
其次，於第1剝離膜之剝離處理面塗覆環氧樹脂，並使用電烘箱，於100℃下加熱2分鐘，製作出厚度5μm之絕緣層。
然後，藉由無電鍍敷，於絕緣層上形成2μm之銅層。該銅層構成屏蔽層。(Example 1)
First, a polyethylene terephthalate film that has been subjected to a release treatment on one side is prepared as a first release film.
Next, an epoxy resin was coated on the peeling treatment surface of the first peeling film, and then heated at 100 ° C. for 2 minutes using an electric oven to produce an insulating layer having a thickness of 5 μm.
Then, a 2 μm copper layer was formed on the insulating layer by electroless plating. This copper layer constitutes a shielding layer.

其次，混合醯胺改質環氧樹脂100.0份、枝晶狀銀包銅粉(平均粒徑D₅₀ ：13μm)49.6份及有機磷系阻燃劑56.2份，製作出接著劑層用組成物。
其次，準備已於單面施行剝離處理的聚對苯二甲酸乙二酯膜作為第2剝離膜。
又，於第2剝離膜之剝離處理面塗覆接著劑層用組成物，並使用電烘箱，於100℃下加熱2分鐘，製作出厚度15μm之接著劑層。Next, 100.0 parts of ammonium modified epoxy resin, 49.6 parts of dendritic silver-clad copper powder (average particle diameter D ₅₀ : 13 μm) and 56.2 parts of an organic phosphorus-based flame retardant were mixed to prepare a composition for an adhesive layer.
Next, a polyethylene terephthalate film that has been subjected to a release treatment on one side is prepared as a second release film.
In addition, the composition for an adhesive layer was coated on the release-treated surface of the second release film, and heated at 100 ° C. for 2 minutes using an electric oven to produce an adhesive layer having a thickness of 15 μm.

其次，將形成於第1剝離膜的絕緣層與形成於第2剝離膜的接著劑層貼合，製造出實施例1之電磁波屏蔽膜。Next, the insulating layer formed on the first release film and the adhesive layer formed on the second release film were laminated to produce the electromagnetic wave shielding film of Example 1.

(實施例2~4)及(比較例1)
除了將接著劑層用組成物變更為表1所示組成者外，與實施例1相同，製造出實施例2~4及比較例1之電磁波屏蔽膜。
另，表1中接著劑層之組成之數值表示質量份。
另，接著劑層用組成物中所含三聚氰酸三聚氰胺(melamine cyanurate)具有作為阻燃助劑及調整彈性模數的填充材之機能。(Examples 2 to 4) and (Comparative Example 1)
Except that the composition for the adhesive layer was changed to the composition shown in Table 1, the electromagnetic wave shielding films of Examples 2 to 4 and Comparative Example 1 were produced in the same manner as in Example 1.
In addition, the numerical value of the composition of the adhesive layer in Table 1 shows a mass part.
In addition, melamine cyanurate contained in the composition for an adhesive layer has a function as a flame retardant auxiliary and a filler for adjusting the elastic modulus.

[表1]
[Table 1]

(接著劑層之彈性模數及斷裂伸度之測定)
藉由以下方法，測定各實施例及各比較例的電磁波屏蔽膜之接著劑層之彈性模數(MPa)及斷裂伸度(%)。
將用以形成電磁波屏蔽膜之接著劑層的接著劑層用組成物塗佈於脫模膜，並剝離脫模膜而製作出試驗用接著劑層。
自試驗用接著劑層製作啞鈴狀試驗片(100mm×10mm，標線間20mm)，並使用拉伸試驗機(AGS-X50S，島津製作所製造)，測定彈性模數及斷裂伸度。
測定條件設為拉伸速度：50mm/min、荷重元：50N。
彈性模數由應力(2~3MPa)與斷裂伸度之傾斜度算出。
表1中顯示結果。(Measurement of the elastic modulus and elongation at break of the adhesive layer)
The elastic modulus (MPa) and elongation at break (%) of the adhesive layer of the electromagnetic wave shielding film of each example and each comparative example were measured by the following methods.
A composition for an adhesive layer for forming an adhesive layer of an electromagnetic wave shielding film was applied to a release film, and the release film was peeled to produce a test adhesive layer.
A dumbbell-shaped test piece (100 mm × 10 mm, 20 mm between graticules) was prepared from the adhesive layer for the test, and a tensile tester (AGS-X50S, manufactured by Shimadzu Corporation) was used to measure the elastic modulus and elongation at break.
The measurement conditions were a tensile speed: 50 mm / min, and a load cell: 50 N.
The elastic modulus is calculated from the inclination of stress (2 ~ 3MPa) and elongation at break.
The results are shown in Table 1.

(屏蔽印刷配線板之製造)
使用各實施例及各比較例之電磁波屏蔽膜，藉由以下方法製造出屏蔽印刷配線板。(Manufacture of shielded printed wiring board)
Using the electromagnetic wave shielding films of the respective examples and comparative examples, a shielded printed wiring board was manufactured by the following method.

準備基體膜，該基體膜係於基底膜上依序設置含接地電路之印刷電路與覆蓋層而成。
於基體膜中，基底膜由聚醯亞胺樹脂(長5mm、寬10mm、厚度：12μm)構成，接地電路及印刷電路由銅構成，覆蓋層則由聚醯亞胺樹脂(厚度：12μm)構成。
另，於覆蓋層形成有用以使印刷電路之一部分露出的孔部。
又，準備由金屬箔及導電性填料所構成的接地構件，該導電性填料藉由接著性樹脂固定於金屬箔。
於接地構件中，金屬箔為銅箔(厚度：6μm)，接著性樹脂為6μm，導電性填料為銀包銅粒子(平均粒徑：10~15μm)。A base film is prepared. The base film is formed by sequentially placing a printed circuit including a ground circuit and a cover layer on the base film.
In the base film, the base film is made of polyimide resin (length 5mm, width 10mm, thickness: 12 μm), the ground circuit and printed circuit are made of copper, and the cover layer is made of polyimide resin (thickness: 12 μm). .
In addition, a hole portion is formed in the cover layer to expose a part of the printed circuit.
Further, a grounding member composed of a metal foil and a conductive filler is prepared, and the conductive filler is fixed to the metal foil by an adhesive resin.
In the ground member, the metal foil is a copper foil (thickness: 6 μm), the adhesive resin is 6 μm, and the conductive filler is silver-clad copper particles (average particle diameter: 10 to 15 μm).

其次，以各電磁波屏蔽膜之接著劑層接在基體膜之方式，將電磁波屏蔽膜配置於基體膜上。
然後，於170℃、3MPa、預壓60秒、主壓180秒之條件下，將各電磁波屏蔽膜熱壓接於基體膜上。
然後，於150℃、1小時之條件下進行乾燥。Next, the electromagnetic wave shielding film is arranged on the base film such that the adhesive layer of each electromagnetic wave shielding film is connected to the base film.
Then, each electromagnetic wave shielding film was thermocompression-bonded to the base film under the conditions of 170 ° C., 3 MPa, a preload of 60 seconds, and a main pressure of 180 seconds.
Then, it dried at 150 degreeC for 1 hour.

其次，以1cm間隔，將2個接地構件配置於各電磁波屏蔽膜上。
然後，於170℃、3MPa、預壓7秒、主壓43秒之條件下，將接地構件暫時固定於電磁波屏蔽膜後，於170℃、3MPa、15分之條件下進行熱壓接。藉此，接地構件之導電性填料會貫穿電磁波屏蔽膜之絕緣層而接觸電磁波屏蔽膜之屏蔽層。
然後，藉由於150℃、1小時之條件下進行乾燥，製作出屏蔽印刷配線板。Next, two ground members were placed on each electromagnetic wave shielding film at a 1 cm interval.
Then, the ground member was temporarily fixed to the electromagnetic wave shielding film under conditions of 170 ° C., 3 MPa, 7 seconds of preload, and 43 seconds of main pressure, and then subjected to thermocompression bonding at 170 ° C., 3 MPa, and 15 minutes. Thereby, the conductive filler of the ground member penetrates the insulating layer of the electromagnetic wave shielding film and contacts the shielding layer of the electromagnetic wave shielding film.
Then, it dried at 150 degreeC for 1 hour, and produced the shield printed wiring board.

依此種方法，針對各電磁波屏蔽膜製作4個屏蔽印刷配線板，並測定各屏蔽印刷配線板之2個接地構件間的電阻值。表1中顯示所獲得電阻值之平均值。
當2個接地構件間的電阻值低時，意味著接地構件之導電性填料與電磁波屏蔽膜之屏蔽層充分接觸。
反之，當2個接地構件間的電阻值高時，則意味著接地構件之導電性填料與電磁波屏蔽膜之屏蔽層並未充分接觸。In this way, four shielded printed wiring boards were prepared for each electromagnetic wave shielding film, and the resistance value between the two ground members of each shielded printed wiring board was measured. Table 1 shows the average value of the obtained resistance values.
When the resistance value between the two ground members is low, it means that the conductive filler of the ground member is in full contact with the shielding layer of the electromagnetic wave shielding film.
Conversely, when the resistance value between the two ground members is high, it means that the conductive filler of the ground member and the shielding layer of the electromagnetic wave shielding film are not sufficiently contacted.

如表1所示，於使用接著劑層之彈性模數為80~1500MPa的各實施例之電磁波屏蔽膜的屏蔽印刷配線板中，接地構件間的電阻值低。即，接地構件之導電性填料與電磁波屏蔽膜之屏蔽層已充分接觸。As shown in Table 1, in the shielded printed wiring board using the electromagnetic wave shielding film of each example having an elastic modulus of 80 to 1500 MPa, the resistance value between the ground members was low. That is, the conductive filler of the ground member and the shielding layer of the electromagnetic wave shielding film have sufficiently contacted.

1、101、201‧‧‧屏蔽印刷配線板1, 101, 201‧‧‧shielded printed wiring board

10‧‧‧電磁波屏蔽膜 10‧‧‧ electromagnetic shielding film

11‧‧‧接著劑層 11‧‧‧ Adhesive layer

12‧‧‧屏蔽層 12‧‧‧shield

13‧‧‧絕緣層 13‧‧‧ Insulation

20‧‧‧基體膜 20‧‧‧ substrate film

21‧‧‧基底膜 21‧‧‧ basement membrane

22‧‧‧印刷電路 22‧‧‧Printed Circuit

23‧‧‧覆蓋層 23‧‧‧ Overlay

30、130、230‧‧‧接地構件 30, 130, 230‧‧‧ grounding members

31、131、231‧‧‧金屬箔 31, 131, 231‧‧‧ metal foil

32‧‧‧接著性樹脂 32‧‧‧ Adhesive resin

33‧‧‧導電性填料 33‧‧‧Conductive filler

134‧‧‧導電性突起 134‧‧‧ conductive protrusion

235‧‧‧凸折部 235‧‧‧ convex fold

GND‧‧‧外部接地 GND‧‧‧External ground

圖1為示意顯示本發明之電磁波屏蔽膜之一例的截面圖。FIG. 1 is a cross-sectional view schematically showing an example of an electromagnetic wave shielding film of the present invention.

圖2為示意顯示使用本發明之電磁波屏蔽膜的屏蔽印刷配線板之一例的截面圖。 2 is a cross-sectional view schematically showing an example of a shielded printed wiring board using the electromagnetic wave shielding film of the present invention.

圖3為示意顯示本發明之屏蔽印刷配線板之另一例截的面圖。 Fig. 3 is a sectional view schematically showing another example of a shielded printed wiring board of the present invention.

圖4為示意顯示本發明之屏蔽印刷配線板之另一例的截面圖。 FIG. 4 is a cross-sectional view schematically showing another example of a shielded printed wiring board of the present invention.

Claims (7)

一種電磁波屏蔽膜，其特徵在於係由下列各層所構成： 接著劑層； 屏蔽層，其積層於前述接著劑層；及 絕緣層，其積層於前述屏蔽層； 並且，前述接著劑層之彈性模數為80~1500MPa。An electromagnetic wave shielding film characterized by being composed of the following layers: Adhesive layer A shielding layer laminated on the aforementioned adhesive layer; and An insulating layer laminated on the aforementioned shielding layer; The elastic modulus of the adhesive layer is 80 to 1500 MPa. 如請求項1之電磁波屏蔽膜，其中前述接著劑層之斷裂伸度為310%以下。For example, the electromagnetic wave shielding film of claim 1, wherein the breaking elongation of the aforementioned adhesive layer is 310% or less. 如請求項1或2之電磁波屏蔽膜，其中前述接著劑層為導電性接著劑層。The electromagnetic wave shielding film according to claim 1 or 2, wherein the aforementioned adhesive layer is a conductive adhesive layer. 一種屏蔽印刷配線板，其特徵在於具備： 基體膜，其包含基底膜及形成於前述基底膜上的印刷電路； 如請求項1至3中任一項之電磁波屏蔽膜，其積層於前述基體膜上；及 接地構件，其具有用以將前述電磁波屏蔽膜之屏蔽層與外部接地連接的連接部； 前述電磁波屏蔽膜係以前述電磁波屏蔽膜之接著劑層接觸前述基體膜之方式積層於前述基體膜上， 前述接地構件之連接部貫穿前述電磁波屏蔽膜之絕緣層而接觸前述電磁波屏蔽膜之屏蔽層。A shielded printed wiring board, comprising: A base film including a base film and a printed circuit formed on the base film; The electromagnetic wave shielding film according to any one of claims 1 to 3, which is laminated on the aforementioned base film; and A grounding member having a connection portion for connecting the shielding layer of the electromagnetic wave shielding film to an external ground; The electromagnetic wave shielding film is laminated on the base film such that the adhesive layer of the electromagnetic wave shielding film contacts the base film, The connection portion of the grounding member penetrates the insulating layer of the electromagnetic wave shielding film and contacts the shielding layer of the electromagnetic wave shielding film. 如請求項4之屏蔽印刷配線板，其中前述接地構件由金屬箔及導電性填料所構成，且前述導電性填料為藉接著性樹脂固定於前述金屬箔之前述連接部。The shielded printed wiring board according to claim 4, wherein the ground member is composed of a metal foil and a conductive filler, and the conductive filler is fixed to the connection portion of the metal foil by an adhesive resin. 如請求項4之屏蔽印刷配線板，其中前述接地構件由金屬箔及導電性突起所構成，且前述導電性突起為形成於前述金屬箔之前述連接部。The shielded printed wiring board according to claim 4, wherein the ground member is composed of a metal foil and a conductive protrusion, and the conductive protrusion is the connection portion formed on the metal foil. 如請求項4之屏蔽印刷配線板，其中前述接地構件係彎折金屬箔而構成，且前述金屬箔之凸折部為前述連接部。The shielded printed wiring board according to claim 4, wherein the ground member is formed by bending a metal foil, and the convex portion of the metal foil is the connection portion.