TW201935703A - Optical sensor and the manufacturing method thereof - Google Patents

Optical sensor and the manufacturing method thereof Download PDF

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TW201935703A
TW201935703A TW107103976A TW107103976A TW201935703A TW 201935703 A TW201935703 A TW 201935703A TW 107103976 A TW107103976 A TW 107103976A TW 107103976 A TW107103976 A TW 107103976A TW 201935703 A TW201935703 A TW 201935703A
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optical sensor
light
layer
shielding layer
sensor according
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TW107103976A
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TWI667802B (en
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曾漢良
李新輝
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世界先進積體電路股份有限公司
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    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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Abstract

An optical sensor is provided, including an image sensing array, a collimator layer and a light shielding layer. The image sensor array includes a plurality of pixels. The collimator layer is disposed on the image sensor array and includes a plurality of openings corresponding to the pixels, and the collimator layer includes a first surface facing the image sensor array and a second surface opposite to the first surface. A light shielding layer is disposed on sidewalls of the openings.

Description

光學感測器及其製造方法 Optical sensor and manufacturing method thereof

本發明係關於一種光學感測器及其製造方法，且特別關於一種具有準直器的光學感測器及其製造方法。 The invention relates to an optical sensor and a manufacturing method thereof, and more particularly, to an optical sensor with a collimator and a manufacturing method thereof.

現今的行動電子裝置(例如手機、平板電腦、筆記型電腦等)通常配備有使用者辨識系統，用以保護個人資料安全。由於每個人的指紋皆不同，因此指紋感測器是一種常見並可靠的使用者辨識系統。 Today's mobile electronic devices (eg, mobile phones, tablets, laptops, etc.) are often equipped with a user identification system to protect personal data. Since each person's fingerprint is different, a fingerprint sensor is a common and reliable user identification system.

市面上的指紋感測器常使用光學技術以感測使用者的指紋，這種基於光學技術的指紋感測器通常使用準直器(collimator)來使入射到感測器的光線平行前進。然而，目前所採用的準直器雖然大致符合需求，但是它們並非在所有方面都令人滿意。 Fingerprint sensors on the market often use optical technology to sense the user's fingerprint. Such optical technology-based fingerprint sensors usually use collimators to make the light incident on the sensor go in parallel. However, although the collimators currently in use are generally satisfactory, they are not satisfactory in all respects.

本發明實施例提供一種光學感測器，包括影像感測陣列、準直器層以及遮光層；影像感測陣列包括複數像素；準直器層設置在影像感測陣列上，包括對應像素之複數開口以及朝向影像感測陣列的第一面及與第一面相反之第二面；遮光層設置在開口之側壁。 An embodiment of the present invention provides an optical sensor including an image sensing array, a collimator layer, and a light shielding layer. The image sensing array includes a plurality of pixels. The collimator layer is disposed on the image sensing array and includes a plurality of corresponding pixels. The opening and a first surface facing the image sensing array and a second surface opposite to the first surface; the light shielding layer is disposed on a side wall of the opening.

本發明實施例亦提供一種製造光學感測器的方 法，包括：提供影像感測陣列，影像感測陣列包括像素；在影像感測陣列上形成準直器層，其中準直器層包括對應像素之開口；以及在開口之側壁設置遮光層。 Embodiments of the present invention also provide a method for manufacturing an optical sensor. The method includes: providing an image sensing array including pixels; forming a collimator layer on the image sensing array, wherein the collimator layer includes an opening corresponding to the pixel; and providing a light shielding layer on a sidewall of the opening.

本發明實施例另提供一種製造光學感測器的方法，包括：提供基板；在基板之正面形成凹槽；在凹槽之側壁及底部設置第一遮光層；將基板倒置接合至影像感測陣列，使凹槽朝向影像感測陣列之像素對應設置；以及從基板之背面薄化基板，直到去除凹槽之底部之第一遮光層。 An embodiment of the present invention further provides a method for manufacturing an optical sensor, including: providing a substrate; forming a groove on a front surface of the substrate; providing a first light-shielding layer on a side wall and a bottom of the groove; and bonding the substrate upside down to the image sensing array With the grooves facing the pixels of the image sensing array correspondingly; and thinning the substrate from the back surface of the substrate until the first light-shielding layer at the bottom of the groove is removed.

100‧‧‧光學感測裝置 100‧‧‧ optical sensing device

102‧‧‧目標 102‧‧‧ goals

104‧‧‧蓋板層 104‧‧‧ Cover layer

104A‧‧‧上表面 104A‧‧‧ Top surface

106‧‧‧光學感測器 106‧‧‧optical sensor

200、300、400、500、600、700、800、900、1000、1100‧‧‧光學感測器 200, 300, 400, 500, 600, 700, 800, 900, 1000, 1100‧‧‧ optical sensors

202、302、402、502、602、702、802、902、1002、1102‧‧‧準直器層 202, 302, 402, 502, 602, 702, 802, 902, 1002, 1102‧‧‧collimator layer

204、304、404、504、604、704、804、904、1004、1104‧‧‧圖像感測陣列 204, 304, 404, 504, 604, 704, 804, 904, 1004, 1104‧‧‧ image sensing array

206、306、406、506、606、706、806、906、1006A‧‧‧遮光層 206, 306, 406, 506, 606, 706, 806, 906, 1006A‧‧‧

208、308、408、508、608、708、808、908、1008、1108‧‧‧像素 208, 308, 408, 508, 608, 708, 808, 908, 1008, 1108‧‧‧ pixels

210、310、410、510、610、710、810、910、1010‧‧‧開口 210, 310, 410, 510, 610, 710, 810, 910, 1010‧‧‧ opening

212、212’、312、312’、412、412’‧‧‧光線 212, 212 ’, 312, 312’, 412, 412’‧‧‧light

814、1014‧‧‧透明材料 814, 1014 ‧‧‧ transparent materials

916、918‧‧‧濾光層 916, 918‧‧‧ Filter

1006A‧‧‧底部遮光層 1006A‧‧‧ bottom shading layer

1006B‧‧‧遮光材料層 1006B‧‧‧Light-shielding material layer

1106A‧‧‧第一遮光層 1106A‧‧‧First light-shielding layer

1106B‧‧‧第二遮光層 1106B‧‧‧Second light-shielding layer

1120‧‧‧基板 1120‧‧‧ substrate

1120A‧‧‧正面 1120A‧‧‧Front

1120B‧‧‧背面 1120B‧‧‧Back

1122‧‧‧凹槽 1122‧‧‧Groove

D‧‧‧直徑 D‧‧‧ diameter

T‧‧‧厚度 T‧‧‧thickness

以下將配合所附圖式詳述本發明之實施例。應注意的是，依據在業界的標準做法，各種特徵並未按照比例繪示且僅用以說明例示。事實上，可能任意地放大或縮小元件的尺寸，以清楚地表現出本發明的特徵。 Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. It should be noted that, in accordance with standard practices in the industry, various features are not drawn to scale and are used for illustration only. In fact, it is possible to arbitrarily enlarge or reduce the size of the element to clearly show the features of the present invention.

第1圖係根據本發明一實施例繪示之光學感測裝置對目標成像的範例。 FIG. 1 is an example of imaging an object by an optical sensing device according to an embodiment of the present invention.

第2圖是一光學感測器的示意圖。 FIG. 2 is a schematic diagram of an optical sensor.

第3圖是一光學感測器的示意圖。 FIG. 3 is a schematic diagram of an optical sensor.

第4圖是根據本發明一實施例繪示之光學感測器的示意圖。 FIG. 4 is a schematic diagram of an optical sensor according to an embodiment of the present invention.

第5圖是根據本發明另一實施例繪示之光學感測器的示意圖。 FIG. 5 is a schematic diagram of an optical sensor according to another embodiment of the present invention.

第6圖是根據本發明又一實施例繪示之光學感測器的示意圖。 FIG. 6 is a schematic diagram of an optical sensor according to another embodiment of the present invention.

第7圖是根據本發明又再一實施例繪示之光學感測器的示意圖。 FIG. 7 is a schematic diagram of an optical sensor according to yet another embodiment of the present invention.

第8圖是根據本發明另一實施例繪示之光學感測器的示意圖。 FIG. 8 is a schematic diagram of an optical sensor according to another embodiment of the present invention.

第9A、9B及9C圖是根據本發明又一實施例繪示之光學感測器的示意圖。 9A, 9B, and 9C are schematic diagrams of an optical sensor according to another embodiment of the present invention.

第10A-10E圖為用以說明本發明一實施例之製造光學感測器的方法之一系列剖面圖。 10A-10E are a series of cross-sectional views illustrating a method for manufacturing an optical sensor according to an embodiment of the present invention.

第11A-11H圖為用以說明本發明另一實施例之製造光學感測器的方法之一系列剖面圖。 11A-11H are a series of cross-sectional views illustrating a method for manufacturing an optical sensor according to another embodiment of the present invention.

以下公開許多不同的實施方法或是例子來實行所提供之標的之不同特徵，以下描述具體的元件及其排列的實施例以闡述本發明。當然這些實施例僅用以例示，且不該以此限定本發明的範圍。舉例來說，在說明書中提到第一特徵形成於第二特徵之上，其包括第一特徵與第二特徵是直接接觸的實施例，另外也包括於第一特徵與第二特徵之間另外有其他特徵的實施例，亦即，第一特徵與第二特徵並非直接接觸。此外，在不同實施例中可能使用重複的標號或標示，這些重複僅為了簡單清楚地敘述本發明，不代表所討論的不同實施例及/或結構之間有特定的關係。 A number of different implementation methods or examples are disclosed below to implement the different features of the provided subject matter, and specific embodiments and arrangements thereof are described below to illustrate the present invention. Of course, these embodiments are only for illustration, and the scope of the present invention should not be limited by this. For example, it is mentioned in the description that the first feature is formed on the second feature, which includes the embodiment in which the first feature and the second feature are in direct contact, and also includes between the first feature and the second feature. Embodiments with other features, that is, the first feature and the second feature are not in direct contact. In addition, repetitive numbers or signs may be used in different embodiments, and these repetitions are merely for a simple and clear description of the present invention, and do not represent a specific relationship between the different embodiments and / or structures discussed.

此外，其中可能用到與空間相關用詞，例如”上”、”下”、“下方”及類似的用詞，這些空間相關用詞係為了便於描述圖示中一個(些)元件或特徵與另一個(些)元件或特 徵之間的關係，這些空間相關用詞包括使用中或操作中的裝置之不同方位，以及圖式中所描述的方位。當裝置被轉向不同方位時(旋轉90度或其他方位)，則其中所使用的空間相關形容詞也將依轉向後的方位來解釋。 In addition, space-related terms such as "up", "down", "below" and similar terms may be used. These space-related terms are used to facilitate the description of one or more elements or features in the illustration. Another element (s) or feature These spatially related terms include the different orientations of the device in use or operation, as well as the orientations described in the drawings. When the device is turned to a different orientation (rotated 90 degrees or other orientation), the spatially related adjectives used in it will also be interpreted in terms of the orientation after turning.

根據一些實施例，第1圖繪示出光學感測裝置100對目標102(例如指紋)成像的範例。光學感測裝置100包括蓋板層104及在蓋板層104下的光學感測器106。蓋板層104保護光學感測裝置100的其他元件，如其下的光學感測器106。蓋板層104的材料可包括透明材料(例如玻璃或透明聚合物等)，以允許光線通過。當目標102接觸蓋板層104的上表面104A時，目標102將光源(未繪示)發出的光反射到光學感測器106上以讀取。目標102具有各種輪廓特徵，例如凸部與凹部(未繪示)。因此，當目標102接觸蓋板層104的上表面104A，目標102的凸部與蓋板層104的上表面104A接觸，而目標102的凹部不與蓋板層104的上表面104A接觸，亦即在102的凹部與蓋板層104的上表面104A間有一氣隙。因此，在目標102的凸部與凹部下方的像素所接受到的光線強度將會不同，從而可藉此對目標102的輪廓特徵進行識別。 According to some embodiments, FIG. 1 illustrates an example in which the optical sensing device 100 images a target 102 (eg, a fingerprint). The optical sensing device 100 includes a cover layer 104 and an optical sensor 106 under the cover layer 104. The cover layer 104 protects other elements of the optical sensing device 100, such as the optical sensor 106 below it. The material of the cover layer 104 may include a transparent material (such as glass or transparent polymer, etc.) to allow light to pass through. When the target 102 contacts the upper surface 104A of the cover layer 104, the target 102 reflects light emitted from a light source (not shown) onto the optical sensor 106 for reading. The target 102 has various contour features, such as convex portions and concave portions (not shown). Therefore, when the target 102 contacts the upper surface 104A of the cover layer 104, the convex portion of the target 102 contacts the upper surface 104A of the cover layer 104, and the concave portion of the target 102 does not contact the upper surface 104A of the cover layer 104, that is, There is an air gap between the recessed portion of 102 and the upper surface 104A of the cover layer 104. Therefore, the light intensity received by the pixels below the convex portion and the concave portion of the target 102 will be different, so that the contour features of the target 102 can be identified by this.

請參閱第2圖，在一些實施例中，光學感測器200包括準直器層202、準直器層202下的圖像感測陣列20，其中準直器層202是設置為層狀的準直器。圖像感測陣列204另有複數個像素208與準直器層202中的開口210對應設置，使得入射光212可通過準直器層202的開口210入射到像素208上。 Please refer to FIG. 2. In some embodiments, the optical sensor 200 includes a collimator layer 202 and an image sensing array 20 under the collimator layer 202, wherein the collimator layer 202 is arranged in a layered manner. Collimator. The image sensing array 204 further includes a plurality of pixels 208 corresponding to the openings 210 in the collimator layer 202, so that the incident light 212 can be incident on the pixels 208 through the openings 210 in the collimator layer 202.

準直器層202係由有序排列且可吸收入射光的結 構所形成，在這些結構間具有開口210，用以僅允許垂直圖像感測陣列204的入射光212通過，而不垂直於垂直圖像感測陣列204的入射光會被大抵反射阻擋，進而降低抵達像素208上的散射光線，以窄化或聚焦入射光。因此，可改善像素208所感測到的圖像模糊的問題。 The collimator layer 202 is composed of an orderly arranged junction that can absorb incident light. The structure is formed with openings 210 between these structures to allow only the incident light 212 of the vertical image sensing array 204 to pass through, and the incident light that is not perpendicular to the vertical image sensing array 204 will be largely blocked by reflection. The scattered light reaching the pixels 208 is reduced to narrow or focus the incident light. Therefore, the problem of blurred images sensed by the pixels 208 can be improved.

然而，如第2圖所示，某些不垂直圖像感測陣列204的入射光212’會被開口210的側壁反射，從而抵達像素208(如虛線箭頭所示)。這種被開口210的側壁反射的非垂直圖像感測陣列204的入射光212’會造成圖像感測的誤差。此外，在製造此種光學感測器時，製程中的異物容易進入開口210中擋住像素208，從而使像素208無法有效地感測入射光。因此有必要對此種準直器層進行改良。 However, as shown in FIG. 2, the incident light 212 ′ of some non-vertical image sensing array 204 is reflected by the side wall of the opening 210 and reaches the pixel 208 (as shown by the dotted arrow). The incident light 212 'of the non-vertical image sensing array 204 reflected by the side wall of the opening 210 causes an error in image sensing. In addition, when manufacturing such an optical sensor, foreign matter in the process easily enters the opening 210 to block the pixel 208, so that the pixel 208 cannot effectively sense incident light. Therefore, it is necessary to improve this collimator layer.

請參閱第3圖，在一些實施例中，光學感測器300包括準直器層302、準直器層302下的圖像感測陣列304。圖像感測陣列304另有複數個像素308與準直器層302中的開口310對應設置。此外，準直器層302中更包括複數平行於圖像感測陣列304表面的遮光層306。 Referring to FIG. 3, in some embodiments, the optical sensor 300 includes a collimator layer 302 and an image sensing array 304 under the collimator layer 302. The image sensing array 304 is further provided with a plurality of pixels 308 corresponding to the openings 310 in the collimator layer 302. In addition, the collimator layer 302 further includes a plurality of light shielding layers 306 parallel to the surface of the image sensing array 304.

如第3圖所示，遮光層306可進一步阻擋不垂直像素308的入射光312’，以確保僅有垂直像素308的入射光312入射到像素308上。舉例來說，遮光層306可吸收入射到開口310中不垂直像素308的入射光312’，使其不會被開口310的側壁反射而抵達像素308上。然而，在準直器層302中設置多層的遮光層306需使用較複雜的製程。舉例來說，為了製成具有多層結構的準直器層302，需要使用多道沉積製程，從而增加製造成 本。此外，由於準直器層302與遮光層306材料的熱膨脹係數不同，因此當溫度變化時，準直器層302與遮光層306的熱膨脹程度會不同，故溫度改變時會導致光學感測器300翹曲，進而造成良率下降。因此，仍有必要對此種光學感測器進行進一步的改良。 As shown in FIG. 3, the light shielding layer 306 can further block the incident light 312 ′ of the non-vertical pixels 308 to ensure that only the incident light 312 of the vertical pixels 308 is incident on the pixels 308. For example, the light-shielding layer 306 can absorb the incident light 312 'incident on the non-vertical pixels 308 in the opening 310, so that it will not be reflected by the sidewall of the opening 310 and reach the pixel 308. However, providing a plurality of light-shielding layers 306 in the collimator layer 302 requires a more complicated process. For example, in order to make a collimator layer 302 with a multilayer structure, multiple deposition processes are required, thereby increasing the manufacturing cost. this. In addition, since the thermal expansion coefficients of the materials of the collimator layer 302 and the light-shielding layer 306 are different, when the temperature changes, the degree of thermal expansion of the collimator layer 302 and the light-shielding layer 306 will be different, so the temperature change will cause the optical sensor 300 Warpage, which in turn reduces yield. Therefore, it is still necessary to further improve this optical sensor.

第4圖是根據本發明一實施例繪示之光學感測器400的示意圖。光學感測器400包括準直器層402、準直器層402下的圖像感測陣列404。圖像感測陣列404另有複數個像素408與準直器層402中的開口410對應設置。在一些實施例中，準直器層的厚度T介於1-500μm的範圍內，且開口410之直徑D為1-100μm。如第4圖所示，開口410的側壁上設置有遮光層406，以降低圖像感測的誤差。 FIG. 4 is a schematic diagram of an optical sensor 400 according to an embodiment of the present invention. The optical sensor 400 includes a collimator layer 402 and an image sensing array 404 under the collimator layer 402. The image sensing array 404 is further provided with a plurality of pixels 408 corresponding to the openings 410 in the collimator layer 402. In some embodiments, the thickness T of the collimator layer is in the range of 1-500 μm, and the diameter D of the opening 410 is 1-100 μm. As shown in FIG. 4, a light shielding layer 406 is disposed on a sidewall of the opening 410 to reduce an error in image sensing.

在一些實施例中，遮光層406包括例如聚碳酸酯、聚對苯二甲酸乙二酯、聚醯亞胺、碳黑、無機絕緣或金屬材料、矽等或其組合，且遮光層406在200-1100nm波長範圍下之光吸收率大於99%。因此，當光線412及412’皆入射到開口410內時，不垂直像素408的光線412’會被遮光層406吸收，僅有垂直像素408的光線412可入射到像素408上。與第2圖的光學感測器200相比，光學感測器400在開口410的側壁上具有遮光層406，因而可吸收不垂直像素408的的入射光412’，進而可防止偵測圖像時的失真問題。與第3圖的遮光層306相比，僅需簡單的製程便可在開口410中設置遮光層406，因而可降低製造成本。再者，由於僅在準直器層402的表面而非內部設置遮光層406，因兩者之熱膨脹係數不同所導致的翹曲問題亦可得到改善。 In some embodiments, the light-shielding layer 406 includes, for example, polycarbonate, polyethylene terephthalate, polyimide, carbon black, an inorganic insulating or metallic material, silicon, or the like, or a combination thereof, and the light-shielding layer 406 is 200 nm. The light absorption in the -1100nm wavelength range is greater than 99%. Therefore, when both the light rays 412 and 412 'are incident into the opening 410, the light rays 412' of the non-vertical pixels 408 are absorbed by the light shielding layer 406, and only the light rays 412 of the vertical pixels 408 can be incident on the pixels 408. Compared with the optical sensor 200 in FIG. 2, the optical sensor 400 has a light-shielding layer 406 on the side wall of the opening 410, so it can absorb the incident light 412 ′ of the non-vertical pixels 408, thereby preventing the detection image. Distortion problem. Compared with the light-shielding layer 306 in FIG. 3, the light-shielding layer 406 can be provided in the opening 410 with a simple process, so that the manufacturing cost can be reduced. Furthermore, since the light-shielding layer 406 is provided only on the surface of the collimator layer 402 and not inside, the warpage problem caused by the difference in thermal expansion coefficient between the two can also be improved.

第5圖是根據本發明另一實施例繪示之光學感測器500的示意圖。光學感測器500包括準直器層502、準直器層502下的圖像感測陣列504。圖像感測陣列504另有複數個像素508與準直器層502中的開口510對應設置。此外，在圖像感測陣列504的背面與準直器層502之間及在開口510的側壁上設置有遮光層506。 FIG. 5 is a schematic diagram of an optical sensor 500 according to another embodiment of the present invention. The optical sensor 500 includes a collimator layer 502 and an image sensing array 504 under the collimator layer 502. The image sensing array 504 has a plurality of pixels 508 corresponding to the openings 510 in the collimator layer 502. In addition, a light-shielding layer 506 is provided between the back surface of the image sensing array 504 and the collimator layer 502 and on the sidewall of the opening 510.

光學感測器500與第4圖的光學感測器400不同的是，遮光層506更設置在圖像感測陣列504及準直器層502之間。藉由此種配置方法，由於更設置了額外的遮光層506，可進一步吸收不想要的入射光，從而僅允許垂直於像素508的入射光入射到像素508上，進而防止感測圖像時失真的問題。 The optical sensor 500 is different from the optical sensor 400 in FIG. 4 in that the light shielding layer 506 is further disposed between the image sensing array 504 and the collimator layer 502. With this configuration method, since an additional light shielding layer 506 is further provided, unwanted incident light can be further absorbed, so that only incident light perpendicular to the pixel 508 can be incident on the pixel 508, thereby preventing distortion when sensing an image The problem.

第6圖是根據本發明又一實施例繪示之光學感測器600的示意圖。光學感測器600包括準直器層602、準直器層602下的圖像感測陣列604。圖像感測陣列604另有複數個像素608與準直器層602中的開口610對應設置。此外，開口610的側壁上與準直器層602上表面上設置有遮光層606。 FIG. 6 is a schematic diagram of an optical sensor 600 according to another embodiment of the present invention. The optical sensor 600 includes a collimator layer 602 and an image sensing array 604 under the collimator layer 602. The image sensing array 604 is further provided with a plurality of pixels 608 corresponding to the openings 610 in the collimator layer 602. In addition, a light shielding layer 606 is disposed on the sidewall of the opening 610 and on the upper surface of the collimator layer 602.

光學感測器600與第4圖的光學感測器400不同的是，遮光層606更設置在準直器層602的上表面上。藉由在準直器層602的上表面上設置額外的遮光層606，可進一步吸收不想要的入射光，而僅允許垂直於像素608的入射光入射到像素608上，以防止感測圖像時失真。 The optical sensor 600 is different from the optical sensor 400 in FIG. 4 in that the light shielding layer 606 is further disposed on the upper surface of the collimator layer 602. By providing an additional light-shielding layer 606 on the upper surface of the collimator layer 602, unwanted incident light can be further absorbed, and only incident light perpendicular to the pixel 608 is allowed to be incident on the pixel 608 to prevent a sensed image Time distortion.

第7圖是根據本發明又再一實施例繪示之光學感測器700的示意圖。光學感測器700包括準直器層702、準直器層702下的圖像感測陣列704。圖像感測陣列704另有複數個像 素708與準直器層702中的開口710對應設置。此外，開口710的側壁上、準直器層702及圖像感測陣列704間與準直器層702的上表面上設置有遮光層706。 FIG. 7 is a schematic diagram of an optical sensor 700 according to yet another embodiment of the present invention. The optical sensor 700 includes a collimator layer 702 and an image sensing array 704 under the collimator layer 702. Image sensing array 704 has multiple images The element 708 is provided corresponding to the opening 710 in the collimator layer 702. In addition, a light shielding layer 706 is disposed on the sidewall of the opening 710, between the collimator layer 702 and the image sensing array 704, and on the upper surface of the collimator layer 702.

光學感測器700與第4圖的光學感測器400不同的是，在剖面圖中遮光層706包圍準直器層702，如第7圖所示。藉由這種配置方法，可進一步吸收不想要的入射光，從而僅允許垂直於像素708的入射光入射到像素708上，以防止感測圖像時失真的問題。 The optical sensor 700 is different from the optical sensor 400 in FIG. 4 in that the light shielding layer 706 surrounds the collimator layer 702 in a cross-sectional view, as shown in FIG. 7. With this configuration method, unwanted incident light can be further absorbed, so that only incident light perpendicular to the pixel 708 is allowed to be incident on the pixel 708 to prevent distortion when sensing an image.

第8圖是根據本發明另一實施例繪示之光學感測器800的示意圖。光學感測器800包括準直器層802、準直器層802下的圖像感測陣列804。圖像感測陣列804另有複數個像素808與準直器層802中的開口810對應設置。除此之外，在開口810的側壁上設置有遮光層806，且在開口810中填充有透明材料814。透明材料814可包括玻璃或透明樹脂，例如聚對苯二甲酸乙二酯(polyethylene terephthalate，PET)、聚萘二甲酸乙二醇酯(polyethylene naphthalate，PEN)、壓克力樹酯、環氧樹酯等材料或其組合，且透明材料814在200-1100nm波長下之光穿透率係大於70%，從而允許入射光線穿過透明材料814而抵達像素808。藉由在開口810中填充透明材料814，可防止在製造光學感測器800時有異物進入開口810中，造成像素808被異物阻擋，從而失去感測入射光線的功能，因而可增加良率。 FIG. 8 is a schematic diagram of an optical sensor 800 according to another embodiment of the present invention. The optical sensor 800 includes a collimator layer 802 and an image sensing array 804 under the collimator layer 802. The image sensing array 804 has a plurality of pixels 808 corresponding to the openings 810 in the collimator layer 802. In addition, a light shielding layer 806 is provided on a sidewall of the opening 810, and a transparent material 814 is filled in the opening 810. The transparent material 814 may include glass or transparent resin, such as polyethylene terephthalate (PET), polyethylene naphthalate (PEN), acrylic resin, epoxy resin Materials such as esters or combinations thereof, and the light transmittance of the transparent material 814 at a wavelength of 200-1100 nm is greater than 70%, thereby allowing incident light to pass through the transparent material 814 and reach the pixels 808. By filling the opening 810 with a transparent material 814, foreign matter can be prevented from entering the opening 810 when the optical sensor 800 is manufactured, causing the pixels 808 to be blocked by the foreign matter, thereby losing the function of sensing incident light, and thus increasing the yield.

本發明實施例之光學感測器可更設置有濾光層，其用以過濾光源，使得僅有特定波長的光可通過，進而防止在感測圖像時來自其他波長光線的干擾，使得所得的影像更加清 晰。濾光層的材料可為光阻材料，並且可藉由各種不同的光阻材料，進而阻擋各種不同波段的光線射入。舉例來說，若入射光為可見光，則濾光層可為半透明層以允許足夠的光通過濾光層並到達像素上。如第9A圖所示，可將濾光層916設置在準直器層402的下表面下；或者亦可將濾光層918設置在準直器層402的上表面上，如第9B圖所示；也可在準直器層402的上表面及下表面同時設置濾光層916及918，如第9C圖所示，端看設計需求。此外，取決於設計需求，在第5-8圖之實施例中，亦可以相同的方式在準直器層的上表面或下表面上設置濾光層，進而達成相同或相似的效果。 The optical sensor according to the embodiment of the present invention may further be provided with a filter layer for filtering the light source so that only a specific wavelength of light can pass through, thereby preventing interference from light of other wavelengths when sensing an image, so that the obtained Clearer images Clear. The material of the filter layer may be a photoresist material, and a variety of different photoresist materials may be used to block light from different wavelengths. For example, if the incident light is visible light, the filter layer may be a translucent layer to allow sufficient light to pass through the filter layer and reach the pixels. As shown in FIG. 9A, the filter layer 916 may be disposed under the lower surface of the collimator layer 402; or the filter layer 918 may be disposed on the upper surface of the collimator layer 402, as shown in FIG. 9B. It is also possible to provide filter layers 916 and 918 on the upper and lower surfaces of the collimator layer 402 at the same time, as shown in FIG. 9C, depending on the design requirements. In addition, depending on the design requirements, in the embodiment of FIGS. 5-8, a filter layer can also be provided on the upper surface or the lower surface of the collimator layer in the same manner, thereby achieving the same or similar effects.

在第4圖到第9圖的實施例中，上述遮光層的層數雖然繪示為一層，但本發明並非以此為限。舉例來說，在上述實施例中可視設計上的需求包括一層以上相同或不同材料的遮光層(如2-5層)，進而可達到更好的遮光效果。 In the embodiments of FIGS. 4 to 9, although the number of the light-shielding layers is shown as one layer, the present invention is not limited thereto. For example, in the above embodiments, the visual design requirements include more than one light-shielding layer (such as 2-5 layers) of the same or different materials, so as to achieve a better light-shielding effect.

第10A-10E圖為一系列剖面圖，用以說明本發明一實施例之製造光學感測器1000的方法。在第10A圖中，提供一圖像感測陣列1004，在其上具有間隔設置的複數像素1008。隨後，在像素1008之間設置底部遮光層1006A，但並未設置在像素1008上。 10A-10E are a series of cross-sectional views for explaining a method of manufacturing the optical sensor 1000 according to an embodiment of the present invention. In FIG. 10A, an image sensing array 1004 is provided with a plurality of pixels 1008 arranged at intervals thereon. Subsequently, a bottom light-shielding layer 1006A is provided between the pixels 1008, but is not provided on the pixels 1008.

設置底部遮光層1006A的方法包括在圖像感測陣列1004上利用如化學氣相沉積、物理氣相沉積或旋轉塗佈等製程沉積一遮光材料。隨後，再以微影與蝕刻製程以圖案化像素上的遮光材料，使得底部遮光層1006A僅位在像素1008間，而不是位在像素1008上。上述蝕刻製程例如反應離子蝕刻 (reactive ion etch，RIE)、中性束蝕刻(neutral beam etch，NBE)等或其組合，且上述蝕刻製程可以是非等向性的(anisotropic)。上述遮光材料可使用例如與遮光層406相同的材料。 The method of setting the bottom light-shielding layer 1006A includes depositing a light-shielding material on the image sensing array 1004 by a process such as chemical vapor deposition, physical vapor deposition, or spin coating. Subsequently, a lithography and etching process is used to pattern the light-shielding material on the pixels, so that the bottom light-shielding layer 1006A is located only between the pixels 1008, rather than on the pixels 1008. The above-mentioned etching process such as reactive ion etching (reactive ion etch, RIE), neutral beam etch (NBE), etc., or a combination thereof, and the above-mentioned etching process may be anisotropic. As the light-shielding material, for example, the same material as the light-shielding layer 406 can be used.

在第10B圖中，在圖像感測陣列1004上沉積準直器層的材料(例如矽或金屬材料(例如銅、鎳或金屬合金等))，並且藉由微影及蝕刻製程在對應像素1008處形成開口1010，從而形成準直器層1002。 In FIG. 10B, a material (such as silicon or a metal material (such as copper, nickel, or a metal alloy)) of a collimator layer is deposited on the image sensing array 1004, and the corresponding pixels are formed by a lithography and etching process. An opening 1010 is formed at 1008, thereby forming a collimator layer 1002.

在第10C圖中，在準直器層1002及圖像感測陣列1004上順應性地沉積一遮光材料1006B，其覆蓋準直器層1002、像素1008及開口1010的側壁。遮光材料1006B的材料及製程可與沉積底部遮光層1006A相似或相同。 In FIG. 10C, a light-shielding material 1006B is conformably deposited on the collimator layer 1002 and the image sensing array 1004, and covers the side walls of the collimator layer 1002, the pixels 1008, and the opening 1010. The material and process of the light shielding material 1006B may be similar to or the same as that of the bottom light shielding layer 1006A.

在第10D圖中，藉由回蝕刻製程去除在準直器層1002上表面上及像素1008上的遮光材料1006B，僅留下在側壁上的遮光材料1006B。上述回蝕刻製程例如可為氣體團簇離子束製程(Gas cluster ion beam process)等適合的回蝕刻製程。在回蝕刻製程之後，底部遮光層1006A及遮光材料1006B共同構成一遮光層1006。 In FIG. 10D, the light shielding material 1006B on the upper surface of the collimator layer 1002 and the pixel 1008 is removed by an etch-back process, and only the light shielding material 1006B on the sidewall is left. The etch-back process may be, for example, a suitable etch-back process such as a gas cluster ion beam process. After the etch-back process, the bottom light-shielding layer 1006A and the light-shielding material 1006B together constitute a light-shielding layer 1006.

在第10E圖中，在開口1010中藉由合適的沉積製程填充入透明材料1014，從而形成光學感測器1000。藉由在開口1010中填充透明材料1014，可防止在隨後的製程中任何異物進入開口1010中，進而防止像素1008被異物阻擋而無法有效地感測光線。透明材料1014的材料可與透明材料814相同，於此不再贅述。 In FIG. 10E, a transparent material 1014 is filled in the opening 1010 by a suitable deposition process, thereby forming an optical sensor 1000. By filling the opening 1010 with a transparent material 1014, any foreign matter can be prevented from entering the opening 1010 in a subsequent process, thereby preventing the pixel 1008 from being blocked by the foreign matter and unable to effectively sense light. The material of the transparent material 1014 may be the same as that of the transparent material 814, and details are not described herein again.

應注意的是，上述步驟僅為示例性的，而非用於限制本發明。可更改、省略或增加上述步驟。舉例來說，可省略第10E圖的步驟，且在第10A圖中不設置底部遮光層1006A，從而可得到如同第4圖的光學感測器400的結構。 It should be noted that the above steps are only exemplary and are not intended to limit the present invention. These steps can be changed, omitted, or added. For example, the steps in FIG. 10E can be omitted, and the bottom light-shielding layer 1006A is not provided in FIG. 10A, so that the structure of the optical sensor 400 as shown in FIG. 4 can be obtained.

第11A-11H圖為一系列剖面圖，用以說明本發明另一實施例之製造光學感測器1100的方法。在第11A圖中，提供基板1120。基板1120在後續製程中係作為準直器層，且基板1120的材料可包括例如矽、金屬材料及其他非金屬材料，且基板包括正面1120A及背面1120B。在第11B圖中，在基板1120的正面1120A上藉由微影與蝕刻製程以形成複數凹槽1122。在第11C圖中，在基板1120的正面1120A上及凹槽1122中沉積形成第一遮光層1106A。第一遮光層1106A的材料和沉積方法可與遮光層406相同。 11A-11H are a series of cross-sectional views illustrating a method for manufacturing an optical sensor 1100 according to another embodiment of the present invention. In FIG. 11A, a substrate 1120 is provided. The substrate 1120 is used as a collimator layer in subsequent processes, and the material of the substrate 1120 may include, for example, silicon, metal materials, and other non-metal materials, and the substrate includes a front surface 1120A and a back surface 1120B. In FIG. 11B, a plurality of grooves 1122 are formed on the front surface 1120A of the substrate 1120 by a lithography and etching process. In FIG. 11C, a first light-shielding layer 1106A is deposited and deposited on the front surface 1120A of the substrate 1120 and in the groove 1122. The material and deposition method of the first light-shielding layer 1106A may be the same as those of the light-shielding layer 406.

在第11D圖中，在凹槽1122中填充透明材料1114。在第11E圖中，平坦化基板1120，使得在基板1120表面的第一遮光層1106A被去除，且使得基板1120與透明材料共同具有一平坦頂面。上述平坦化操作可以包括化學機械拋光及/或回蝕刻製程。透明材料1114的材料可與透明材料814相同，於此不再贅述。 In FIG. 11D, the groove 1122 is filled with a transparent material 1114. In FIG. 11E, the substrate 1120 is planarized so that the first light-shielding layer 1106A on the surface of the substrate 1120 is removed, and the substrate 1120 and the transparent material have a flat top surface in common. The planarization operation may include a chemical mechanical polishing and / or an etch-back process. The material of the transparent material 1114 may be the same as that of the transparent material 814, and details are not described herein again.

在第11F圖中，將基板1120倒置接合到影像感測陣列1104上。其中影像感測陣列1104上具有複數對應透明材料1114位置所設置的像素1108。在第11G圖中，從基板1120的背面1120B平坦化基板1120，直到露出透明材料1114。平坦化基板1120的方法可與第11E圖之平坦化方法相同。平坦化後的基 板1120作為準直器層1102。因此，形成了光學感測器1000。 In FIG. 11F, the substrate 1120 is bonded to the image sensing array 1104 upside down. The image sensing array 1104 has a plurality of pixels 1108 disposed corresponding to the positions of the transparent materials 1114. In FIG. 11G, the substrate 1120 is planarized from the back surface 1120B of the substrate 1120 until the transparent material 1114 is exposed. The method of planarizing the substrate 1120 may be the same as that of FIG. 11E. Flattened base The plate 1120 serves as a collimator layer 1102. Therefore, the optical sensor 1000 is formed.

應注意的是，上述步驟僅為示例性的，而非用於限制本發明。可更改、省略或增加上述步驟。舉例來說，如第11H圖所示，可在基板1120的背面1120B設置第二遮光層1106B，以進一步阻擋來自外界的光線，進而防止不垂直像素1108的光線到達像素1108上。 It should be noted that the above steps are only exemplary and are not intended to limit the present invention. These steps can be changed, omitted, or added. For example, as shown in FIG. 11H, a second light-shielding layer 1106B may be disposed on the back surface 1120B of the substrate 1120 to further block light from the outside, and thus prevent light from not perpendicular to the pixel 1108 from reaching the pixel 1108.

綜上所述，本發明提供一種具有準直器的光學感測器，在準直器上具有可吸收特定波長光線的遮光層。若入射光不垂直準直器，則其會被準直器阻擋或被遮光層吸收。因此，可確保入射到光學感測器中的像素的光線皆是垂直的，可防止像素因接收到不垂直的入射光而造成影像模糊的問題。此外，本發明使用簡單方式設置遮光層，可減少製程所需時間，達到降低成本的目的。再者，本發明藉由在準直器的開口中設置透明材料，可防止製造時的灰塵碎屑等進入上述開口中。 In summary, the present invention provides an optical sensor having a collimator, and the collimator has a light-shielding layer capable of absorbing light of a specific wavelength. If the incident light is not perpendicular to the collimator, it will be blocked by the collimator or absorbed by the light-shielding layer. Therefore, it is ensured that the light rays incident on the pixels in the optical sensor are all vertical, and the problem of image blur caused by the pixels receiving the non-vertical incident light can be prevented. In addition, in the present invention, the light-shielding layer is arranged in a simple manner, which can reduce the time required for the manufacturing process and achieve the purpose of reducing costs. Furthermore, by providing a transparent material in the opening of the collimator, the present invention can prevent dust, debris, and the like from entering the opening during manufacturing.

上述內容概述許多實施例的特徵，因此任何所屬技術領域中具有通常知識者，可更加理解本發明之各面向。任何所屬技術領域中具有通常知識者，可能無困難地以本發明為基礎，設計或修改其他製程及結構，以達到與本發明實施例相同的目的及/或得到相同的優點。任何所屬技術領域中具有通常知識者也應了解，在不脫離本發明之精神和範圍內做不同改變、代替及修改，如此等效的創造並沒有超出本發明的精神及範圍。 The foregoing outlines the features of many embodiments, so that those with ordinary knowledge in the relevant technical field may better understand the aspects of the present invention. Any person with ordinary knowledge in the technical field may design or modify other processes and structures based on the present invention without difficulty to achieve the same purpose and / or obtain the same advantages as the embodiments of the present invention. Any person with ordinary knowledge in the technical field should also understand that different changes, substitutions, and modifications can be made without departing from the spirit and scope of the present invention. Such an equivalent creation does not exceed the spirit and scope of the present invention.

Claims (19)

一種光學感測器，包括：一影像感測陣列，包括複數像素；一準直器層，設置在該影像感測陣列上，包括對應該些像素之複數開口，且該準直器層包括朝向該影像感測陣列的一第一面及與該第一面相反之一第二面；以及一遮光層，設置在該些開口之側壁。 An optical sensor includes: an image sensing array including a plurality of pixels; a collimator layer disposed on the image sensing array and including a plurality of openings corresponding to the pixels; and the collimator layer including an orientation A first side of the image sensing array and a second side opposite to the first side; and a light-shielding layer disposed on sidewalls of the openings. 如申請專利範圍第1項所述之光學感測器，其中該遮光層更設置在該準直器層之該第一面及/或該第二面上。 The optical sensor according to item 1 of the patent application scope, wherein the light shielding layer is further disposed on the first surface and / or the second surface of the collimator layer. 如申請專利範圍第1-2項中任一項所述之光學感測器，其中該遮光層之材料包括不透明樹脂或深色樹脂。 The optical sensor as described in any one of claims 1-2, wherein the material of the light-shielding layer includes an opaque resin or a dark resin. 如申請專利範圍第1-2項中任一項所述之光學感測器，其中該遮光層在200-1100nm波長下之光吸收率大於99%。 The optical sensor according to any one of claims 1-2 of the application, wherein the light absorption of the light-shielding layer at a wavelength of 200-1100 nm is greater than 99%. 如申請專利範圍第1-2項任一項所述之光學感測器，其中該遮光層具有多層結構。 The optical sensor according to any one of claims 1-2, wherein the light shielding layer has a multilayer structure. 如申請專利範圍第1項所述之光學感測器，更包括一濾光層，設置在該準直器層之該第一面上及/或在該第二面上。 The optical sensor according to item 1 of the patent application scope further includes a filter layer disposed on the first surface of the collimator layer and / or on the second surface. 如申請專利範圍第1項所述之光學感測器，其中該些開口之直徑為1-100μm。 The optical sensor according to item 1 of the patent application scope, wherein the diameters of the openings are 1-100 μm. 如申請專利範圍第1項所述之光學感測器，其中該準直器層之厚度為1-500μm。 The optical sensor according to item 1 of the patent application scope, wherein the thickness of the collimator layer is 1-500 μm. 如申請專利範圍第1項所述之光學感測器，更包括一透明材料，設置在該些開口中。 The optical sensor according to item 1 of the patent application scope further includes a transparent material disposed in the openings. 如申請專利範圍第9項所述之光學感測器，其中該透明材 料在200-1100nm波長下之光穿透率大於70%。 The optical sensor according to item 9 of the scope of patent application, wherein the transparent material The light transmittance of the material at a wavelength of 200-1100nm is greater than 70%. 如申請專利範圍第9項所述之光學感測器，其中該透明材料包括樹脂或玻璃。 The optical sensor according to item 9 of the application, wherein the transparent material includes resin or glass. 一種製造光學感測器的方法，包括：提供一影像感測陣列，該影像感測陣列包括複數像素；在該影像感測陣列上形成一準直器層，其中該準直器層包括對應該些像素之複數開口；以及在該些開口之側壁設置一遮光層。 A method for manufacturing an optical sensor includes: providing an image sensing array including a plurality of pixels; forming a collimator layer on the image sensing array, wherein the collimator layer includes a corresponding A plurality of openings of the pixels; and a light shielding layer is disposed on a sidewall of the openings. 如申請專利範圍第12項所述之製造光學感測器的方法，更包括在形成該準直器層之前，在該些像素之間設置一底部遮光層。 The method for manufacturing an optical sensor according to item 12 of the scope of patent application, further comprising, before forming the collimator layer, providing a bottom light shielding layer between the pixels. 如申請專利範圍第12或13項所述之製造光學感測器的方法，更包括在設置該遮光層後，在該些開口中填充一透明材料。 The method for manufacturing an optical sensor according to item 12 or 13 of the scope of patent application, further comprising filling a transparent material in the openings after the light shielding layer is provided. 如申請專利範圍第12項所述之製造光學感測器的方法，其中設置該遮光層包括：在該準直器層之上表面及該些開口之底部及側壁順應性地沉積一遮光材料；以及蝕刻去除該準直器層上表面及該些開口之底部之該遮光材料，以形成該遮光層。 The method for manufacturing an optical sensor according to item 12 of the scope of patent application, wherein setting the light-shielding layer comprises: compliantly depositing a light-shielding material on an upper surface of the collimator layer and bottoms and sidewalls of the openings; And etching to remove the light shielding material on the upper surface of the collimator layer and the bottom of the openings to form the light shielding layer. 一種製造光學感測器的方法，包括：提供一基板；在該基板之正面形成複數凹槽；在該些凹槽之側壁及底部設置一第一遮光層； 將該基板倒置接合至一影像感測陣列，使該些凹槽朝向該影像感測陣列之複數像素對應設置；以及從該基板之背面薄化該基板，直到去除該些凹槽之底部之該第一遮光層。 A method for manufacturing an optical sensor includes: providing a substrate; forming a plurality of grooves on a front surface of the substrate; and providing a first light shielding layer on a side wall and a bottom of the grooves; The substrate is inverted and bonded to an image sensing array, and the grooves are arranged correspondingly to a plurality of pixels of the image sensing array; and the substrate is thinned from the back surface of the substrate until the bottom of the grooves is removed. First light-shielding layer. 如申請專利範圍第16項所述之製造光學感測器的方法，其中設置該第一遮光層更包括在該基板之表面設置該第一遮光層。 The method for manufacturing an optical sensor according to item 16 of the patent application scope, wherein disposing the first light-shielding layer further includes disposing the first light-shielding layer on a surface of the substrate. 如申請專利範圍第16項所述之製造光學感測器的方法，其中在該些凹槽側壁及底部設置該第一遮光層之後、及在將該基板倒置接合至該影像感測陣列之前，更包括在該些凹槽中填充一透明材料，且薄化該基板更包括露出該透明材料。 The method for manufacturing an optical sensor according to item 16 of the scope of patent application, wherein after the first light-shielding layer is disposed on the sidewalls and the bottom of the grooves, and before the substrate is bonded to the image sensing array by inversion, It further includes filling a transparent material in the grooves, and thinning the substrate further includes exposing the transparent material. 如申請專利範圍第16-18項中任一項所述之製造光學感測器的方法，更包括在薄化該基板後，在該基板之背面設置一第二遮光層。 The method for manufacturing an optical sensor according to any one of claims 16 to 18 of the scope of patent application, further comprising, after thinning the substrate, providing a second light shielding layer on the back surface of the substrate.
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