TW201924502A - Chemical deposition method and apparatus for piece-by-piece continuously producing by carrier including a carrier and a deposition reaction tank - Google Patents
Chemical deposition method and apparatus for piece-by-piece continuously producing by carrier including a carrier and a deposition reaction tank Download PDFInfo
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Abstract
Description
本發明為一種電路板之化學沉積方法的技術領域，尤其指一種採逐片連續生產的化學沉積方法及設備。The invention relates to the technical field of a chemical deposition method of a circuit board, in particular to a chemical deposition method and equipment for continuous production of a piece by piece.
在習用化學鎳金製程中，是利用單一吊籃將複數片電路板為一組，將所述電路板依序上升、下降及移動至各化學溶液槽或各類槽室內進行相關作業，以滿足大量生產的需。其具體流程為上料→清潔→水洗→微蝕→水洗→酸洗→水洗→預浸→活化→水洗→化學沉鎳→水洗→化學沉金→水洗→烘乾→下料。所採用的生產設備，如圖1所示，複個反應槽室呈直線狀依序排形成一生產線，包括：清潔槽101及數水洗槽102、微蝕槽103及數水洗槽104、酸洗槽105及數水洗槽106、預浸槽107、交換位槽108、活化槽109、數化學沉鎳槽110及數水洗槽111、數化學沉金槽112及數水洗槽113、最後至乾燥槽114。生產作業方式是將複數片(例如20~60片)電路板為一組，呈垂直狀插置於吊籃115內，本實施例是利用兩台龍門式天車116、117，帶動吊籃115垂直升降且而於前述反應槽室依序移動。當吊籃115由龍門式天車116依序移動至交換位槽108後，將由龍門式天車117接手移動至後續反應槽室內作業。In the conventional chemical nickel gold process, a plurality of circuit boards are grouped by a single hanging basket, and the circuit boards are sequentially raised, lowered, and moved to various chemical solution tanks or various tanks to perform related operations to meet the requirements. The need for mass production. The specific process is feeding→cleaning→water washing→micro-etching→water washing→acid washing→water washing→pre-dip→activation→water washing→chemical nickel deposition→water washing→chemical immersion gold→water washing→drying→cutting. The production equipment used, as shown in FIG. 1 , the multiple reaction tank chambers are arranged in a straight line to form a production line, including: cleaning tank 101 and several water washing tanks 102, micro-etching tanks 103 and several water washing tanks 104, pickling The tank 105 and the number of water washing tanks 106, the prepreg tank 107, the exchange tank 108, the activation tank 109, the number of chemical nickel sink tanks 110 and the number of water washing tanks 111, the number of chemical gold sink tanks 112 and the number of water washing tanks 113, and finally to the drying tank 114. The production operation mode is to insert a plurality of pieces (for example, 20 to 60 pieces) of circuit boards into a basket 115 in a vertical manner. In this embodiment, two gantry cranes 116 and 117 are used to drive the basket 115. Vertically moving up and down in the aforementioned reaction tank chamber. When the gondola 115 is sequentially moved by the gantry crane 116 to the exchange slot 108, it will be moved by the gantry crane 117 to the subsequent reaction tank indoor operation.
在前述生產設備中，每組吊籃115的複數片電路板皆需下降至各槽室內，完成相關作業後上升，之後再移動至下一個槽室，因體積龐大，負載重量極重，一個人無法搬動，需要較大的機構作動空間，因此機台縱向高度高(可達4米)，寛度達2米(若含操作人員的作動平台，寛度可達4米)。雖然整條生產線可設計一機殼封閉，但龐大的生產線並無法有效的封閉，若產線發生小故障，也必須打開操作視窗加以排除，過程中容易讓製程中有害氣體飄散，影響操作者的健康。In the foregoing production equipment, the plurality of circuit boards of each set of the hanging baskets 115 need to be lowered into the respective tanks, and after the relevant operations are completed, they are raised, and then moved to the next tank chamber. Due to the large volume, the load is extremely heavy, and one cannot Moving, requires a large mechanism to operate the space, so the machine has a high vertical height (up to 4 meters) and a twist of 2 meters (if the operator's operating platform, the twist can reach 4 meters). Although the entire production line can be designed with a casing closed, the huge production line cannot be effectively closed. If the production line has a small fault, it must be opened by operating the window to eliminate the harmful gas in the process, which affects the operator. health.
再者，每個槽室皆必須容納吊籃垂直放入，並且讓液體完全浸泡電路板，相對地所需容量大，基本上每個槽所需液體可達500升，故製程中各種反應槽液的需求量大，槽體尺寸大造價也高。另外生產後的大量廢液處理也是一個成本負擔。Furthermore, each of the troughs must accommodate the vertical placement of the basket and allow the liquid to completely immerse the circuit board. The relatively required capacity is relatively large, and the liquid required for each tank can be up to 500 liters, so various reaction tanks in the process. The demand for liquid is large, and the size of the tank is also high. In addition, a large amount of waste liquid treatment after production is also a cost burden.
在後段製程中由於仍然是採用容納直立式複數片電路板的吊籃來移動，經水洗後的乾燥作業中，容易使電路板表面殘留乾燥後的水漬，影響電路板品質，因此電路板仍須再進行一次後處理，即單獨將每片電路板水平輸送，進行水洗、吹乾、烘乾等作業，而增加額外的生產成本。綜合以上所述習用方式存在著許多缺點，極需改善。In the latter part of the process, because the basket is still moved by the vertical multi-chip circuit board, in the drying operation after washing, it is easy to leave the surface water on the surface of the circuit board after drying, which affects the quality of the circuit board, so the circuit board is still A further post-processing is required, that is, each board is transported horizontally separately for washing, drying, drying, etc., and additional production costs are added. There are many shortcomings in the above-mentioned conventional methods, which are in great need of improvement.
因此本發明人思考是否能針對習用製程加以分析及改善，期待提出較佳及創新的方式，分析習用製程，其可分為三個大部份：前處理、沉積製程、以及後處理，前處理包括：清潔→水洗→微蝕→水洗→酸洗→水洗。沉積製程包括：預浸→活化→水洗→化學沉鎳→水洗→化學沉金→水洗。後處理包括：水洗→烘乾。為此本發明人思考改變習用以吊籃一次吊掛大量電路板的生產模式，本發明改採逐片移動生產的模式，其中在前處理及後處理作業中，該電路板皆採水平逐片漸進式移動，在沉積製程中，電路板則包括水平逐片漸進式移動及直立式逐片漸進式移動。在前處理及後處理皆有相關的設備可以採用，但本發明改良後之沉積製程並無相關設備可以採用，因為沉積反應所需時間較長，例如沉積鎳需20~30分、沉積金需10分鐘以上，若採用水平漸進式移動，所需的槽體長度尺寸將非常巨大，化學反應液所需量也非常多，成本太高根本無法導入生產，因此本發明針對沉積製程開發一組運用載具採用逐片連續生產的化學沉積設備及方法，採用直立式逐片漸進式移動，使本發明之此製程能順利運行。Therefore, the inventors thought about whether it is possible to analyze and improve the conventional process, and expect a better and innovative way to analyze the conventional process, which can be divided into three major parts: pre-processing, deposition process, and post-processing, pre-processing. Including: cleaning → washing → micro-etching → washing → pickling → washing. The deposition process includes: prepreg→activation→water washing→chemical nickel deposition→water washing→chemical immersion gold→water washing. Post-treatment includes: washing → drying. To this end, the inventors thought about changing the production mode in which the hanging basket was used to hang a large number of circuit boards at one time. The present invention adopts a mode of moving piece by piece mobile production, in which the boards are horizontally sliced in the pre-processing and post-processing operations. Progressive movement, in the deposition process, the board includes horizontal piece by piece progressive movement and upright piece by piece progressive movement. There are related equipments for both pre-treatment and post-treatment. However, there is no related equipment for the improved deposition process of the present invention, because the deposition reaction takes a long time, for example, 20 to 30 minutes for depositing nickel, and the deposition gold is required. For more than 10 minutes, if the horizontal progressive movement is used, the required tank length will be very large, the amount of chemical reaction liquid is also very large, and the cost is too high to be imported into production. Therefore, the present invention develops a set of applications for the deposition process. The carrier adopts a chemical deposition apparatus and method for continuous production piece by piece, and uses the vertical type progressive moving piece by piece to make the process of the invention run smoothly.
本發明之主要目的是提供一種化學沉積方法及設備，主要於化學沉積生產作業中，由載具承載電路板採用垂直式逐片生產模式於沉積槽內移動，由初始位置移動至最終位置的停留時間，完成沉積反應槽內金屬沉積於電路板的作業。The main object of the present invention is to provide a chemical deposition method and apparatus, mainly in a chemical deposition production operation, in which a carrier-carrying circuit board is moved in a deposition tank by a vertical piece-by-piece production mode, and moves from an initial position to a final position. Time, the completion of the deposition of metal in the deposition tank on the circuit board.
本發明之次要目的是提供一種運用載具採逐片生產的化學沉積方法及設備，此方式能廣泛應用於化學沉積鎳、化學沉積金、化學沉積銅、化學沉積鍚或化學沉積銀等作業。A secondary object of the present invention is to provide a chemical deposition method and apparatus for producing a sheet by using a carrier, which can be widely applied to operations such as chemical deposition of nickel, chemical deposition of gold, chemical deposition of copper, chemical deposition of tantalum or chemical deposition of silver. .
為達上述目的，本發明提供一種運用載具逐片生產的化學沉積的方法，其步驟包括：使用載具將至少一電路板採直立式承載著；該載具將該電路板移入一沉積反應槽內進行化學沉積反應，該沉積反應槽內依序設有初始位置、數個中繼位置、以及最終位置；由移動機構帶動該載具依序由該初始位置、數個該中繼位置、移動至該最終位置，利用該電路板於沉積反應槽內等留預定時間，完成該沉積反應槽內金屬沉積於該電路板的作業。To achieve the above object, the present invention provides a method of chemical deposition using a carrier by piece, the steps comprising: using a carrier to carry at least one circuit board upright; the carrier moves the circuit board into a deposition reaction a chemical deposition reaction is performed in the tank, wherein the deposition reaction tank is sequentially provided with an initial position, a plurality of relay positions, and a final position; the moving mechanism drives the vehicle sequentially from the initial position, a plurality of the relay positions, Moving to the final position, the circuit board is used in the deposition reaction tank for a predetermined time to complete the deposition of metal in the deposition reaction tank on the circuit board.
再者，本發明運用載具逐片生產的化學沉積設備，包括：沉積反應槽、複數個載具、移動機構及兩組撥動機構，該沉積反應槽是於兩個槽壁頂面各設有一排位置相對的齒條，該齒條是由複數個單向斜齒所構成；該載具包括一橫桿及兩承架，該兩承架呈對稱狀固定於該橫桿，該兩承架於另一側具有一開口，由此開口放入電路板，該載具是由該橫桿兩側架設於位置相對的兩個該單向斜齒內；該移動機構安裝於該沉積反應槽外壁，負責帶動兩組撥動機構同步產生往復移動，且每次僅移動一個該單向斜齒的距離；每一組撥動機構包括複數個可被轉動的撥動件，該橫桿的兩側位置分別有一個該撥動件與之對應，當該移動機構帶動該撥動機構向前移動時，該撥動件會推動該橫桿沿著該單向斜齒的斜面緩慢上升至最高點後，掉落下一級的該單向斜齒內，當該移動機構帶動該撥動機構向後移動時，該撥動件可被旋轉而解除與橫桿接觸的狀態。Furthermore, the present invention utilizes a chemical deposition apparatus produced by a carrier piece by piece, comprising: a deposition reaction tank, a plurality of carriers, a moving mechanism, and two sets of shifting mechanisms, the deposition reaction tanks being disposed on the top surfaces of the two tank walls. a row of opposite racks, the rack is composed of a plurality of one-way helical teeth; the carrier comprises a cross bar and two brackets, the two brackets are symmetrically fixed to the cross bar, the two bearings The shelf has an opening on the other side, and the opening is placed in the circuit board, the carrier is erected on two sides of the crossbar in opposite positions; the moving mechanism is mounted on the deposition reaction tank The outer wall is responsible for driving the two sets of shifting mechanisms to synchronously generate a reciprocating movement, and moving only one distance of the one-way helical teeth at a time; each set of the dialing mechanism includes a plurality of dial members that can be rotated, and two of the crossbars The side position has a corresponding one of the dialing members. When the moving mechanism drives the toggle mechanism to move forward, the dialing member pushes the crossbar to slowly rise to the highest point along the inclined surface of the one-way helical tooth. After dropping the next one of the one-way helical teeth, when the movement When configured to drive the toggle mechanism moves backward, the toggle member can be rotated to release contact with the cross bar.
本發明為一種運用載具逐片連續生產的化學沉積方法及設備，不同於以往採用吊籃式一次承載20~60幾片電路板的生產模式，主要是採用逐片電路板以漸進式移動進行化學沉積作業，在預浸、活化作業中，電路板採水平逐片漸進式移動，在後續化學沉積反應中則採用直立式逐片漸進式移動。此設計不僅能大幅使整體設備尺寸縮小，讓設備造價成本降低，生產速度快，且能持維良好的生產品質。The invention relates to a chemical deposition method and a device for continuously producing one by one by using a carrier. Different from the previous production mode of using a basket type to carry 20 to 60 pieces of circuit boards at a time, the method mainly adopts a piece-by-chip circuit board to carry out progressive movement. In the chemical deposition operation, in the pre-dip and activation operations, the board adopts the progressive movement of the board level by piece, and in the subsequent chemical deposition reaction, the vertical type-by-piece progressive movement is adopted. This design not only greatly reduces the size of the overall equipment, but also reduces the cost of equipment, speeds up production, and maintains a good production quality.
另外，本發明運用載具逐片連續生產的化學沉積設備，是利用該載具承載著電路板於化學沉積槽內逐片移動，載具每一次沿原本的單向斜齒移動後掉落至次一級單向斜齒所產生的振動，可讓因沉積反應而附著於電路板表面的氣泡分離，本發明多達數10次以上的振動，能有效地消除氣泡附著情形，另外不斷地振動也能增加反應液與電路板接觸，增加沉積速率，藉此維持著生產品質，又能滿足運用載具逐片生產的目的。In addition, the present invention uses a carrier to continuously produce a chemical deposition device piece by piece, which uses the carrier to carry a circuit board to move piece by piece in a chemical deposition tank, and the carrier moves to the original one-way helical tooth and then falls to The vibration generated by the one-stage one-way helical tooth can separate the air bubbles attached to the surface of the circuit board due to the deposition reaction. The vibration of the present invention is up to several times or more, and the bubble adhesion can be effectively eliminated, and the vibration is continuously vibrated. It can increase the contact between the reaction solution and the circuit board, increase the deposition rate, thereby maintaining the production quality, and satisfying the purpose of using the carrier to be produced piece by piece.
以下配合圖式及元件符號對本發明的實施方式做更詳細的說明，俾使熟習該項技藝者在研讀本說明書後能據以實施。The embodiments of the present invention will be described in more detail below with reference to the drawings and the <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt;
首先針對本發明於沉積製程中所開發的設備作一說明。此設備是運用於化學鎳鈀金沉積製程，該設備是安裝於電路板皆採水平逐片漸進式移動的前處理及後處理設備之間。本發明的設計精神為採逐片移動生產的模式，完成電路板沉積作業。First, an explanation will be given of the apparatus developed in the deposition process of the present invention. This equipment is used in the chemical nickel-palladium-gold deposition process, which is installed between the pre-processing and post-processing equipment on the board that is moving horizontally and progressively. The design spirit of the present invention is to adopt a mode of moving production by piece to complete the circuit board deposition operation.
如圖2A所示，本發明之沉積製程設備包括依序串聯排列的預浸槽20、活化槽21、翻轉機構22、化學沉鎳槽23、數個水槽24、化學沉金槽25、以及回收水洗槽26及輸送機構27。複數個載具A，該載具A負責承載一電路板進行相關化學沉積作業。另外還包括第一移載機構281、第二移載機構282，以及回收循環移載機構283，此類移載機構負責移動該載具A至相關的作業槽中。在本圖中該移動相關機構皆未繪出，僅用示意的方塊表示。另外請參閱圖2B、圖2C所示，為電路板B於各槽室內作業中的狀態，其中在預浸槽20及活化槽21呈水平漸進式移動，之後在翻轉機構22則會由水平狀態調整為垂直狀態。之後於化學沉鎳槽23、數水槽24、化學沉金槽25、以及回收水洗槽26皆為垂直狀態，最後沉積完成電路板B又會呈水平狀態由輸送機構27輸送至後處理設備中。As shown in FIG. 2A, the deposition process apparatus of the present invention comprises a pre-dip tank 20 arranged in series, an activation tank 21, a turning mechanism 22, a chemical nickel sink tank 23, a plurality of water tanks 24, a chemical gold sink tank 25, and recycling. The washing tank 26 and the conveying mechanism 27. A plurality of carriers A, which are responsible for carrying a circuit board for related chemical deposition operations. Also included is a first transfer mechanism 281, a second transfer mechanism 282, and a recycle cycle transfer mechanism 283 that is responsible for moving the carrier A into the associated work slot. In the figure, the mobile related mechanisms are not shown, and are only indicated by schematic squares. 2B and FIG. 2C, the state in which the circuit board B is operated in each of the slots, wherein the prepreg 20 and the activation tank 21 are horizontally progressively moved, and then the inversion mechanism 22 is in a horizontal state. Adjust to vertical. Thereafter, the chemical nickel sinking tank 23, the number of water tanks 24, the chemical gold sinking tank 25, and the recovery water washing tank 26 are all in a vertical state, and finally the deposited circuit board B is again conveyed by the conveying mechanism 27 to the post-processing apparatus in a horizontal state.
如圖3所示，為本發明所開發之沉積製程設備運作的流程圖。請配合參閱圖2A及圖2B所示，此設備運用方法之步驟如下：As shown in FIG. 3, it is a flow chart of the operation of the deposition process equipment developed by the present invention. Please refer to FIG. 2A and FIG. 2B, the steps of the device operation method are as follows:
步驟301：逐片電路板B利用輸送滾輪採水平方式依序進入該預浸槽20，進行反應前的預浸處理。Step 301: The chip-by-chip board B enters the prepreg tank 20 in a horizontal manner by using a transport roller, and performs pre-dip processing before the reaction.
步驟302：逐片電路板B利用輸送滾輪採水平方式依序進入該活化槽21內，使電路板上的祼銅表面先行置換著一層極薄鈀金屬。Step 302: The circuit board B is sequentially introduced into the activation tank 21 by using a conveying roller in a horizontal manner, so that the surface of the beryllium copper on the circuit board is first replaced with a layer of extremely thin palladium metal.
步驟303：電路板B移動至翻轉機構22，經翻轉機構22的旋轉夾持單元221將電路板B送入載具A內；此機構是用以將原本採水平移動的電路板B改為垂直式，以便進行後續的化學沉積作業。Step 303: The circuit board B is moved to the reversing mechanism 22, and the circuit board B is sent into the carrier A through the rotating clamping unit 221 of the inverting mechanism 22; the mechanism is used to change the circuit board B that has been horizontally moved to be vertical. For subsequent chemical deposition operations.
步驟304：載具A承載電路板B進入化學沉鎳槽23，由左邊的初始位置移動至中間的數個中繼位置，最後至最右邊的最終位置，所停留的時間會使得電路板B的銅表面沉積一層鎳。其中在槽內的移動方式採漸進式，即一次僅移動一小距離，須移動複數次才能由初始位置移動至最終位置。Step 304: The carrier A carrying circuit board B enters the chemical nickel sinking groove 23, and moves from the initial position on the left side to the plurality of relay positions in the middle, and finally to the final position on the rightmost side, and the time of staying makes the circuit board B A layer of nickel is deposited on the copper surface. The movement mode in the slot adopts a progressive mode, that is, only moves a small distance at a time, and has to be moved a plurality of times to move from the initial position to the final position.
步驟305：由第一移載機構281將載具A上升移出化學沉鎳槽23，向右移動一距離後下降移入水洗槽24。於水洗槽24內進行電路板的清洗作業。參閱圖2A，水洗槽24包括數個槽，左側具有數個水洗室241及右側為一個滴乾室242。在實際的運作模式中，第一移載機構281一次會吊起5個載具A，上升後僅移動一個槽室的距離後就下降，使載具A進入水洗槽24的第一個作業室內，之後依序重複移動，在本實施例中，第一移載機構281需作動5次載具A才會進入化學沉金槽25。Step 305: The carrier A is lifted up and out of the chemical nickel sink 23 by the first transfer mechanism 281, moved to the right by a distance, and then moved into the water washing tank 24. The circuit board is cleaned in the washing tank 24. Referring to Figure 2A, the water wash tank 24 includes a plurality of tanks, a plurality of water wash chambers 241 on the left side and a drip chamber 242 on the right side. In the actual operation mode, the first transfer mechanism 281 hoists five carriers A at a time, and then moves down only after moving the distance of one of the chambers, so that the carrier A enters the first working chamber of the washing tank 24. Then, the movement is repeated in sequence. In this embodiment, the first transfer mechanism 281 needs to operate the carrier A five times to enter the chemical sinking tank 25.
步驟306：由第一移載機構281將水洗槽24內的載具A移動至該化學沉金槽25內，由左邊初始位置移動至中間的數個中繼位置，最後至右邊最終位置，所停留的時間會使得該電路板的銅表面沉積一層金。其中移動方式採漸進式，即一次僅移動小距離，須移動複數次才能由初始位置移動至最終位置。Step 306: The carrier A in the water washing tank 24 is moved into the chemical immersion gold tank 25 by the first transfer mechanism 281, and moves from the left initial position to the intermediate relay positions, and finally to the right final position. The residence time will cause a layer of gold to deposit on the copper surface of the board. The moving mode adopts the progressive mode, that is, only moves a small distance at a time, and has to be moved a plurality of times to move from the initial position to the final position.
步驟307：由第二移載機構282將載具A上升移出化學沉金槽25，向右移動一距離後下降移入回收水洗槽26，以清洗及回收電路板表面帶出的反應金液，回收水洗槽26也包括多個槽。第二移載機構282的作動方式也與前述第一移載機構281相同。Step 307: The carrier A is moved up and out of the chemical immersion tank 25 by the second transfer mechanism 282, moved to the right by a distance, and then moved into the recovery washing tank 26 to clean and recover the reaction gold liquid brought out from the surface of the circuit board, and recovered. The water wash tank 26 also includes a plurality of slots. The second transfer mechanism 282 is also operated in the same manner as the first transfer mechanism 281 described above.
步驟308：載具A最後由第二移載機構282移近輸送機構27，使電路板B由垂直狀改為水平狀逐片移動至下一道作業。之後就會於後處理設備進行水洗及烘乾作業。清空後的載具A會經由回收循環移載機構283移動至化學沉鎳槽23處，以進行下一次的處理。Step 308: The carrier A is finally moved closer to the transport mechanism 27 by the second transfer mechanism 282, so that the circuit board B is changed from vertical to horizontal and moved to the next operation piece by piece. The post-processing equipment is then washed and dried. The emptied carrier A is moved to the chemical immersion nickel tank 23 via the recovery cycle transfer mechanism 283 for the next processing.
藉由本發明所開發的沉積製程設備及運作方法，能大幅使整體設備尺寸縮小，設備造價成本降低，相對所需安裝的工廠面積減少，整體而言能減少設備投資金額。另外生產過程中也能減少用水量、化學反應液使用量及用電量，降低生產成本，使產品更具市場競爭力。另外設備也能更有效地封閉，減少生產過中有害氣體外洩，進而提供更安全的工作環境。The deposition process equipment and operation method developed by the invention can greatly reduce the size of the overall equipment, reduce the cost of equipment, and reduce the factory area required for installation, thereby reducing the investment amount of the equipment as a whole. In addition, the production process can also reduce water consumption, chemical reaction liquid usage and electricity consumption, reduce production costs, and make products more competitive in the market. In addition, the equipment can be more effectively closed, reducing the leakage of harmful gases in production, thereby providing a safer working environment.
在上述設備中，該化學沉鎳槽23及化學沉金槽25是運用載具逐片連續生產的化學沉積方法，不同於以往採吊籃式一次承載20~60幾片電路板的生產模式，為此本發明設計了一種運用載具逐片連續生產的化學沉積設備及方法，使之能運用於該化學沉鎳槽23及化學沉金槽25的沉積作業。In the above device, the chemical nickel sinking tank 23 and the chemical gold sinking tank 25 are chemical deposition methods which are continuously produced piece by piece by means of a carrier, and are different from the production mode of carrying a basket of 20 to 60 pieces of circuit boards at a time. To this end, the present invention has devised a chemical deposition apparatus and method for continuously producing a carrier piece by piece, which can be applied to the deposition operation of the chemical nickel sink 23 and the chemical gold sink 25 .
如圖4所示，本發明運用載具逐片生產的化學沉積方法之流程圖。其步驟包括： 如步驟401，使用載具將至少一電路板採直立式承載著； 如步驟402，該載具將該電路板移入一沉積反應槽內進行化學沉積反應，該沉積反應槽依序設有初始位置、數個中繼位置、以及最終位置； 如步驟403，由移動機構推動該載具依序由該初始位置、數個該中繼位置、移動至該最終位置，過程中利用該電路板於該沉積反應槽內等留時間，完成該沉積反應槽內金屬沉積於該電路板的作業。As shown in Fig. 4, the present invention uses a flow chart of a chemical deposition method in which a carrier is produced piece by piece. The steps include: in step 401, using the carrier to carry at least one circuit board in a vertical position; as in step 402, the carrier moves the circuit board into a deposition reaction tank for chemical deposition reaction, and the deposition reaction tank is sequentially Providing an initial position, a plurality of relay positions, and a final position; and in step 403, the moving mechanism drives the carrier to sequentially move from the initial position, the plurality of relay positions, to the final position, and utilize the The circuit board waits for the time in the deposition reaction tank to complete the deposition of metal in the deposition reaction tank on the circuit board.
另外該移動機構帶動該載具移動至兩相鄰位置時，由前一級位置的最底點移動至最高點後，再垂直掉落於次一級位置，前述兩相鄰位置包括由該初始位置與中繼位置、兩相鄰的中繼位置、以及該中繼位置至該最終位置。此目的是為了產生振動，消除電路板表面可能附著的氣泡，該氣體是因沉積反應所生成。另外振動也能增加反應液與電路板接觸，增加沉積速率。In addition, when the moving mechanism drives the carrier to move to two adjacent positions, the bottommost point of the previous stage position moves to the highest point, and then vertically falls to the next level position, wherein the two adjacent positions include the initial position and A relay location, two adjacent relay locations, and the relay location to the final location. The purpose is to generate vibrations that eliminate bubbles that may adhere to the surface of the board that are generated by the deposition reaction. In addition, vibration can also increase the contact of the reaction solution with the circuit board and increase the deposition rate.
上述運用載具逐片連續生產的化學沉積方法，可以設計許多具體的設備達到此目的，本實施例就其中一種設備作說明：如圖5及圖6所示，為本發明運用載具逐片連續生產的化學沉積設備之立體圖及分解圖。本發明包括：一沉積反應槽40、複數個載具50、一移動機構60及兩組撥動機構70。The above-mentioned chemical deposition method using the carrier-by-piece continuous production can design a plurality of specific devices to achieve the purpose. This embodiment describes one of the devices: as shown in FIG. 5 and FIG. 6, the carrier is used for the present invention. A perspective view and an exploded view of a continuously produced chemical deposition apparatus. The invention comprises a deposition reaction tank 40, a plurality of carriers 50, a moving mechanism 60 and two sets of shifting mechanisms 70.
該沉積反應槽40為一長方型開口向上的槽體，於長邊的兩個槽壁41頂面各設有一排位置相對的齒條42，該齒條42是由複數個單向斜齒421所構成。The deposition reaction tank 40 is a rectangular parallel-shaped groove body, and a row of oppositely positioned racks 42 are disposed on the top surfaces of the two groove walls 41 on the long sides, and the rack 42 is composed of a plurality of one-way helical teeth. 421 is composed.
如圖6所示，該載具50包括一橫桿51及兩承架52，該兩承架52呈對稱狀固定於該橫桿51，該承架52局部彎曲呈鈎狀，該兩承架52於另一側具有一開口53，該開口53可供放入電路板。在實際的作業中，該載具50是由該橫桿51兩側架設於位置相對的兩個該單向斜齒421上(如圖5)。該載具50進一步包括有數個連接桿54，該連接桿54橫向結合於兩承架52之間，以維持整體的剛性。另外該載具50還包括一保持桿55，該保持桿55結合於該兩承架52的最底部位置，該保持桿55兩端各設有垂直狀的保持片551。兩個該保持片551之間的距離，恰好為電路板最大尺寸的寬度。As shown in FIG. 6, the carrier 50 includes a crossbar 51 and two brackets 52. The two brackets 52 are symmetrically fixed to the crossbar 51. The bracket 52 is partially bent and has a hook shape. 52 has an opening 53 on the other side that can be placed in the circuit board. In actual operation, the carrier 50 is mounted on the two unidirectional helical teeth 421 opposite to each other by the two sides of the crossbar 51 (see FIG. 5). The carrier 50 further includes a plurality of connecting rods 54 that are laterally coupled between the two brackets 52 to maintain overall rigidity. In addition, the carrier 50 further includes a holding rod 55 coupled to the bottommost position of the two brackets 52. Each of the holding rods 55 is provided with a vertical retaining piece 551 at each end. The distance between the two holding pieces 551 is exactly the width of the largest dimension of the board.
該移動機構60是安裝於該沉積反應槽40外壁，負責帶動兩組撥動機構70同步產生往復移動，且每次僅移動一個該單向斜齒421的距離。該移動機構60包括軌道架61、框架62及第一動力件63。該軌道架61環設且固定於該沉積反應槽40外壁，即固定於兩側該槽壁41上。該軌道架61上另固定著兩組軌道611，該兩組軌道611位置分別位於該沉積反應槽40兩側長邊外壁處。該框架62呈長方型框體，尺寸大於該沉積反應槽40尺寸，組裝狀態是套置於該沉積反應槽40外圍。請一併參閱圖8，該框架62底部設有數個導輪621，該導輪621能在該軌道611上運行。該第一動力件63固定於該軌道架61，另設有可伸縮的作動桿631與該框架62結合，在本實施例中第一動力件63為氣壓缸、油壓缸、電動伸縮桿等其中一種機構。在該第一動力件63作動時，該作動桿631伸出或縮回，進而帶動該框架62產生線性的往復移動。The moving mechanism 60 is mounted on the outer wall of the deposition reaction tank 40, and is responsible for driving the two sets of the dialing mechanism 70 to synchronously generate reciprocating movement, and only one distance of the one-way helical teeth 421 is moved at a time. The moving mechanism 60 includes a rail frame 61, a frame 62, and a first power member 63. The rail frame 61 is looped and fixed to the outer wall of the deposition reaction tank 40, that is, fixed to the groove wall 41 on both sides. Two sets of rails 611 are fixed on the rail frame 61, and the two sets of rails 611 are respectively located at the outer edges of the long sides of the deposition reaction tank 40. The frame 62 is a rectangular frame having a size larger than the size of the deposition reaction tank 40, and is assembled to be placed around the periphery of the deposition reaction tank 40. Referring to FIG. 8 together, a plurality of guide wheels 621 are disposed at the bottom of the frame 62, and the guide wheels 621 can run on the track 611. The first power member 63 is fixed to the rail frame 61, and a retractable actuating lever 631 is further coupled with the frame 62. In the embodiment, the first power member 63 is a pneumatic cylinder, a hydraulic cylinder, an electric telescopic rod, and the like. One of the institutions. When the first power member 63 is actuated, the actuating lever 631 is extended or retracted, thereby driving the frame 62 to generate linear reciprocating movement.
兩組撥動機構70，分別位於該框架62的兩個長邊外壁。每一組該撥動機構70包括複數個撥動件71、連動片72、第二動力件73，每個該撥動件71具有上樞接點711及下樞接點712，該上樞接點711安裝樞接於框架62外壁，該下樞接點712安裝樞接於該連動片72，該連動片72受該第二動力件73驅動而能產生往復運動。在本實施例中第二動力件73為氣壓缸、油壓缸、電動伸縮桿等其中一種機構。如圖5所示，該載具50的橫桿51兩端會延伸出該沉積反應槽40外，並分別有一個撥動件71與之對應。該撥動件71受該移動機構60所驅動，每次利用該撥動件71推動該載具50的橫桿51，使橫桿51由所在處的單向斜齒421向後一級的單向斜齒421移動。Two sets of toggle mechanisms 70 are located on the outer walls of the two long sides of the frame 62, respectively. Each of the dialing mechanisms 70 includes a plurality of dialing members 71, a linking piece 72, and a second power unit 73. Each of the dialing members 71 has an upper pivoting point 711 and a lower pivoting point 712. The point 711 is pivotally connected to the outer wall of the frame 62. The lower pivot point 712 is pivotally connected to the linkage piece 72. The linkage piece 72 is driven by the second power piece 73 to generate a reciprocating motion. In the embodiment, the second power member 73 is one of a pneumatic cylinder, a hydraulic cylinder, an electric telescopic rod, and the like. As shown in FIG. 5, the two ends of the crossbar 51 of the carrier 50 extend outside the deposition reaction tank 40, and a toggle member 71 corresponds to each. The toggle member 71 is driven by the moving mechanism 60, and the crossbar 51 of the carrier 50 is pushed by the toggle member 71 each time, so that the crossbar 51 is unidirectionally inclined from the one-way oblique tooth 421 where it is located. The teeth 421 move.
接著就實際的作動方式作一說明：Then make a description of the actual action:
如圖9所示，為了方便解說，僅提供本設備左前半部結構放大圖，複數個該載具50也未沒有全部都放置於該沉積反應槽40。在作業的初期，如先前段落所述，會先將該電路板放入該載具50的承架52內，並將該載具50放入該沉積反應槽40內，該橫桿51左右兩區段分於位於相對的單向斜齒421上，另外與之相對的兩個該撥動件71位置對應該橫桿51兩端。在本實施例中，最左邊的單向斜齒421處，即為該載具50於該沉積反應槽40的初始位置。後續各齒即為中繼位置。As shown in FIG. 9, for convenience of explanation, only an enlarged view of the left front half of the apparatus is provided, and not all of the plurality of carriers 50 are placed in the deposition reaction tank 40. At the beginning of the operation, as described in the previous paragraph, the circuit board is first placed in the carrier 52 of the carrier 50, and the carrier 50 is placed in the deposition reaction tank 40, and the crossbar 51 is left and right. The segments are located on opposite one-way helical teeth 421, and the two opposite sliders 71 are opposite the ends of the crossbar 51. In the present embodiment, the leftmost one-way helical tooth 421 is the initial position of the carrier 50 in the deposition reaction tank 40. Subsequent teeth are relay positions.
如圖10所示，該移動機構60之第一動力件63作動，該作動桿631伸長，使得該框架62向右側方向平移。帶動樞接於該框架62之該撥動件71向右撥動。使該橫桿51沿著該單向斜齒421最低點向最高點移動。As shown in Fig. 10, the first power member 63 of the moving mechanism 60 is actuated, and the actuating lever 631 is extended to cause the frame 62 to translate in the right direction. The toggle member 71 pivotally connected to the frame 62 is pushed to the right. The crossbar 51 is moved to the highest point along the lowest point of the one-way helical tooth 421.
如圖11所示，在該橫桿51由先一級單向斜齒421掉落於次一級的單向斜齒421後。該第二動力件73作動，使該連動片72向右移動，因樞接關係，該撥動件71頂端會大幅向左偏移，最使該撥動件71頂面的最高位置低於該單向斜齒421的最低位置。As shown in FIG. 11, the crossbar 51 is dropped by the first-stage one-way helical teeth 421 to the one-way helical teeth 421 of the next stage. The second power member 73 is actuated to move the linkage piece 72 to the right. Due to the pivotal relationship, the tip end of the dial member 71 is largely shifted to the left, so that the highest position of the top surface of the dial member 71 is lower than the maximum position. The lowest position of the one-way helical tooth 421.
如圖12所示，該第一動力件63之作動桿631縮回，連帶使該框架62退回起始位置。此過程中該撥動件71呈向左偏移狀態，故移動時不會與該橫桿51接觸。As shown in FIG. 12, the actuating lever 631 of the first power member 63 is retracted, and the strap 62 is returned to the home position. In this process, the dial 71 is in a state of being shifted to the left, so that it does not come into contact with the crossbar 51 when moving.
在該框架62退回至初始位置後，該第二動力件73再次作動使該連動片72退回原位，就能呈現如圖9的狀態，等待另一個載具50放入該沉積反應槽40內。After the frame 62 is retracted to the initial position, the second power member 73 is again actuated to return the link piece 72 to the original position, and the state of FIG. 9 is presented, waiting for another carrier 50 to be placed in the deposition reaction tank 40. .
綜合以上所述，本發明運用載具逐片生產的化學沉積設備，利用該移動機構60所產動的往復運動，讓放入於該沉積反應槽40的載具50一次移動一個單向斜齒421的距離，藉此逐步由初始位置、數個該中繼位置、移動至最終位置，過程中所等留的時間，就能完成金屬沉積於該電路板的作業。另外該載具50每一次掉落至次一級單向斜齒421所產生的振動，可讓因沉積反應而附著於電路板表面的氣泡分離，多達數10次以上的振動，能有效地消除氣泡附著情形，另外不斷地振動也能增加反應液與電路板接觸，增加沉積速率，藉此維持著生產品質，又能滿足運用載具逐片生產的目的。In summary, the present invention utilizes a chemical deposition apparatus in which a carrier is produced piece by piece, and uses the reciprocating motion generated by the moving mechanism 60 to cause the carrier 50 placed in the deposition reaction tank 40 to move one unidirectional helical gear at a time. The distance of 421, thereby gradually completing the operation of depositing metal on the circuit board by the initial position, a plurality of the relay positions, moving to the final position, and the like in the process. In addition, the vibration generated by the carrier 50 falling to the next-stage one-way helical teeth 421 can separate the bubbles adhering to the surface of the circuit board due to the deposition reaction, and the vibration can be effectively eliminated by up to several times or more. In the case of bubble adhesion, the constant vibration can also increase the contact between the reaction liquid and the circuit board, increase the deposition rate, thereby maintaining the production quality, and satisfying the purpose of using the carrier to be produced piece by piece.
以上所述者僅為用以解釋本發明的較佳實施例，並非企圖據以對本發明做任何形式上的限制，是以，凡有在相同的創作精神下所作有關本發明的任何修飾或變更，皆仍應包括在本發明意圖保護的範疇。The above is only a preferred embodiment for explaining the present invention, and is not intended to limit the present invention in any way, so that any modifications or changes to the present invention made under the same creative spirit are made. All should still be included in the scope of the invention as intended.
101‧‧‧清潔槽 101‧‧‧cleaning tank
102‧‧‧水洗槽 102‧‧‧Washing tank
103‧‧‧微蝕槽 103‧‧‧micro-etching slot
104‧‧‧水洗槽 104‧‧‧Washing tank
105‧‧‧酸洗槽 105‧‧‧ Pickling tank
106‧‧‧水洗槽 106‧‧‧Washing tank
107‧‧‧預浸槽 107‧‧‧Prepreg tank
108‧‧‧換位槽 108‧‧‧Transposition slot
109‧‧‧活化槽 109‧‧‧Energy tank
110‧‧‧化學沉鎳槽 110‧‧‧Chemical nickel sink
111‧‧‧水洗槽 111‧‧‧Washing tank
112‧‧‧化學沉金槽 112‧‧‧Chemical sinking gold trough
113‧‧‧水洗槽 113‧‧‧Washing tank
114‧‧‧乾燥槽 114‧‧‧Dry tank
115‧‧‧吊籃 115‧‧‧ hanging basket
116‧‧‧龍門式天車 116‧‧‧ gantry crane
117‧‧‧龍門式天車 117‧‧‧ gantry crane
20‧‧‧預浸槽 20‧‧‧Prepreg tank
21‧‧‧活化槽 21‧‧‧Activity tank
22‧‧‧翻轉機構 22‧‧‧ flip mechanism
23‧‧‧化學沉鎳槽 23‧‧‧Chemical nickel sink
24‧‧‧水洗槽 24‧‧‧Washing tank
25‧‧‧化學沉金槽 25‧‧‧Chemical sinking gold trough
26‧‧‧回收水洗槽 26‧‧‧Recycled washing tank
27‧‧‧輸送機構 27‧‧‧Transportation agencies
A‧‧‧載具 A‧‧‧ Vehicles
B‧‧‧電路板 B‧‧‧Board
281‧‧‧第一移載機構 281‧‧‧First transfer mechanism
282‧‧‧第二移載機構 282‧‧‧Second transfer mechanism
283‧‧‧回收循環移載機構 283‧‧‧Recycling cycle transfer mechanism
40‧‧‧沉積反應槽 40‧‧‧Sedimentation reaction tank
41‧‧‧槽壁 41‧‧‧ slot wall
42‧‧‧齒條 42‧‧‧ rack
421‧‧‧單向斜齒 421‧‧‧One-way helical teeth
50‧‧‧載具 50‧‧‧ Vehicles
51‧‧‧横桿 51‧‧‧cross bar
52‧‧‧承架 52‧‧‧ Shelf
53‧‧‧開口 53‧‧‧ openings
54‧‧‧連接桿 54‧‧‧ Connecting rod
55‧‧‧持桿 55‧‧‧
551‧‧‧保持片 551‧‧‧ Keeping the film
60‧‧‧移動機構 60‧‧‧Mobile agencies
61‧‧‧軌道架 61‧‧‧Track frame
611‧‧‧軌道 611‧‧‧ Track
62‧‧‧框架 62‧‧‧Frame
621‧‧‧導輪 621‧‧‧guide wheel
63‧‧‧第一動力件 63‧‧‧First power piece
631‧‧‧作動桿 631‧‧‧Action rod
70‧‧‧撥動機構 70‧‧‧Toggle mechanism
71‧‧‧撥動件 71‧‧‧WD parts
711‧‧‧上樞接點 711‧‧‧Stop joint
712‧‧‧下樞接點 712‧‧‧ lower pivot joint
72‧‧‧連動片 72‧‧‧ linkage film
73‧‧‧第二動力件 73‧‧‧second power piece
圖1為習用化學鎳金製程設備的示意圖。 圖2A為本發明所開發之沉積製程設備的示意圖。 圖2B為本發明沉積製程設備中，電路板移動狀態的側視示意圖。 圖2C為本發明沉積製程設備中，電路板移動狀態的俯視示意圖。 圖3為本發明所開發之沉積製程設備運作的流程圖。 圖4為本發明運用載具採逐片連續生產的化學沉積方法之流程圖。 圖5為本發明運用載具採逐片連續生產的化學沉積設備之立體圖。 圖6為本發明運用載具採逐片連續生產的化學沉積設備之分解圖。 圖7為本發明之載具的立體放大圖。 圖8為本發明之移動機構及撥動機構之局部放大立體圖。 圖9為本發明實際運作的局部放大圖(一)。 圖10為本發明實際運作的局部放大圖(二)。 圖11為本發明實際運作的局部放大圖(三)。 圖12為本發明實際運作的局部放大圖(四)。Figure 1 is a schematic view of a conventional chemical nickel gold process equipment. 2A is a schematic view of a deposition process apparatus developed by the present invention. 2B is a side elevational view showing the state of movement of the circuit board in the deposition process apparatus of the present invention. 2C is a top plan view showing the moving state of the circuit board in the deposition process apparatus of the present invention. 3 is a flow chart showing the operation of the deposition process equipment developed by the present invention. 4 is a flow chart of a chemical deposition method for continuously producing a carrier sheet by using a carrier. Figure 5 is a perspective view of a chemical deposition apparatus for continuous production using a carrier slab. Figure 6 is an exploded view of a chemical deposition apparatus for continuous production using a carrier slab. Figure 7 is a perspective enlarged view of the carrier of the present invention. Figure 8 is a partially enlarged perspective view of the moving mechanism and the dialing mechanism of the present invention. Figure 9 is a partially enlarged view (I) of the actual operation of the present invention. Figure 10 is a partial enlarged view (2) of the actual operation of the present invention. Figure 11 is a partial enlarged view (3) of the actual operation of the present invention. Figure 12 is a partial enlarged view (4) of the actual operation of the present invention.
Claims (10)
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW106139548A TWI661753B (en) | 2017-11-15 | 2017-11-15 | Chemical deposition method and equipment for continuous production using carrier slab |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW106139548A TWI661753B (en) | 2017-11-15 | 2017-11-15 | Chemical deposition method and equipment for continuous production using carrier slab |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TWI661753B TWI661753B (en) | 2019-06-01 |
| TW201924502A true TW201924502A (en) | 2019-06-16 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI782416B (en) * | 2021-02-08 | 2022-11-01 | 柏承科技股份有限公司 | Cabin system with continuous process |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112442725B (en) * | 2020-11-27 | 2024-05-24 | 京东方科技集团股份有限公司 | Electrochemical deposition apparatus set and electrochemical deposition method |
| CN114807911A (en) * | 2022-06-06 | 2022-07-29 | 黄信翔 | Method and system for exchanging carriers of circuit boards |
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2017
- 2017-11-15 TW TW106139548A patent/TWI661753B/en active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI782416B (en) * | 2021-02-08 | 2022-11-01 | 柏承科技股份有限公司 | Cabin system with continuous process |
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| TWI661753B (en) | 2019-06-01 |
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