TW201901869A - Apparatus and method for laser processing - Google Patents

Apparatus and method for laser processing Download PDF

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Publication number
TW201901869A
TW201901869A TW107115994A TW107115994A TW201901869A TW 201901869 A TW201901869 A TW 201901869A TW 107115994 A TW107115994 A TW 107115994A TW 107115994 A TW107115994 A TW 107115994A TW 201901869 A TW201901869 A TW 201901869A
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laser
inspection
laser processing
welding
processing apparatus
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TW107115994A
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TWI719306B (en
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崔秉燦
姜基錫
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崔秉燦
姜基錫
南韓商ＮＤ Ｔｅｃｈ有限公司
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/005—Soldering by means of radiant energy
    • B23K1/0056—Soldering by means of radiant energy soldering by means of beams, e.g. lasers, E.B.
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Brazing of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Laser Beam Processing (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

Provided is a laser processing method capable of: loading an object on a jig; detecting and pre-inspecting an alignment state including the rotation and the arrangement of the object loaded on the jig; moving the jig to a soldering location; soldering the object by a laser; and unloading the soldered object, wherein the object is moved to an inspection unit in order for soldering quality to be inspected such that post-inspection can be selectively carried out by the inspection unit.

Description

雷射加工方法及裝置Laser processing method and device

本發明的實施例涉及一種雷射加工方法及裝置。Embodiments of the present invention relate to a laser processing method and apparatus.

通常，雷射加工方法及裝置執行的加工為將各種電子部件作為對象利用雷射進行鑽孔(drilling)、標記(marking)，焊接(soldering)等。其中，藉由雷射加工方法及裝置執行的焊接作為藉由使用導電物質(例如，焊球)使電子部件電連接的步驟，可以被應用到多種電子產品的製造中。Generally, the processing performed by the laser processing method and apparatus performs drilling, marking, soldering, and the like using a laser as a target for various electronic components. Among them, the soldering performed by the laser processing method and apparatus can be applied to the manufacture of various electronic products as a step of electrically connecting electronic components by using a conductive substance (for example, a solder ball).

[習知技術文獻][Practical Technical Literature]

[專利文獻][Patent Literature]

(專利文獻1)韓國授權專利公報 第10-0332378號(2002.03.30)(Patent Document 1) Korean Patent Gazette No. 10-0332378 (2002.03.30)

本發明的實施例涉及一種雷射加工裝置及方法，其目的在於，提供如下的雷射加工裝置及方法：利用雷射執行焊接，並且包括確定焊接位置的視覺檢查模組或步驟以及雷射焊接模組或步驟，從而快速且高效。Embodiments of the present invention relate to a laser processing apparatus and method, the object of which is to provide a laser processing apparatus and method that performs welding using a laser and includes a visual inspection module or step for determining a welding position and laser welding Modules or steps to be fast and efficient.

本發明提供一種雷射加工方法，包括以下步驟：將對象體裝載在夾具；對裝載於所述夾具的對象體的包括旋轉及配置的對齊狀態進行感測(Detect)及第一檢查(Pre-Inspection)；將所述夾具移動至焊接位置；藉由雷射器對所述對象體進行焊接；卸載所述焊接後的所述對象體，其中，為了檢查所述焊接的品質，能夠移動所述對象體而藉由檢查部選擇性地執行第二檢查(Post-Inspection)。The present invention provides a laser processing method comprising the steps of: loading a target body in a jig; sensing (Detect) and first checking an alignment state of the object body mounted on the jig including rotation and configuration (Pre- Moving the jig to a welding position; welding the object body by a laser; unloading the welded object body, wherein the machine body can be moved to check the quality of the welding The object body is selectively subjected to a second check (Post-Inspection) by the inspection unit.

較佳地，品質的檢測可以藉由視覺檢查執行。Preferably, the detection of quality can be performed by visual inspection.

較佳地，品質的檢查可以是感測檢查是否發生焊接區域的內部裂紋及孔隙(Pore)的檢查。Preferably, the inspection of the quality may be an inspection to detect whether internal cracks and pores of the weld zone have occurred.

較佳地，雷射器可以是包括光纖雷射器(Fiber Laser)及二極體雷射器(Diode Laser)中一種以上的固體雷射器。Preferably, the laser may be one or more solid lasers including a Fiber Laser and a Diode Laser.

較佳地，焊接步驟可以藉由雷射束集束光學頭、焊球供應裝置以及包括管嘴的焊接頭執行。Preferably, the soldering step can be performed by a laser beam bundling optical head, a solder ball supply device, and a soldering tip including a nozzle.

較佳地，焊接步驟可以藉由包括一個以上的焊接頭的拾取和放置焊接頭(Pick and Place Soldering Head)或者噴出焊接頭(Jet Soldering Head)執行。Preferably, the soldering step can be performed by a Pick and Place Soldering Head or a Jet Soldering Head comprising more than one solder joint.

較佳地，焊接步驟還可以包括如下的步驟：檢查排出焊球的管嘴的預定的狀態及品質而進行清洗或更換。Preferably, the soldering step may further comprise the steps of: checking the predetermined state and quality of the nozzle discharging the solder ball for cleaning or replacement.

較佳地，焊接步驟還可以包括如下的步驟：記錄所述雷射器的輸出並校正所述雷射器的輸出。Preferably, the soldering step may further comprise the steps of recording the output of the laser and correcting the output of the laser.

較佳地，藉由所述檢查部進行的檢查步驟能夠在執行焊接的步驟的同時執行。Preferably, the inspection step by the inspection portion can be performed at the same time as the step of performing the welding.

較佳地，品質的檢查步驟可以包括如下的步驟：丟棄或收集接合(bonding)測試時使用的焊球以及製造中存在缺陷的不良焊球。Preferably, the quality inspection step may include the steps of discarding or collecting the solder balls used in the bonding test and the defective solder balls having defects in the manufacturing.

較佳地，所述雷射加工方法還包括如下的步驟：在第二檢查(Post-Inspection)之後，根據預定的品質標準對所述對象體進行分類(Sorting)。Preferably, the laser processing method further comprises the step of sorting the object body according to a predetermined quality criterion after the second inspection (Post-Inspection).

較佳地，所述雷射加工方法還可以包括如下的步驟：對藉由第二檢查(Post-inspection)而不符合預定的品質標準的焊料部的一部分或全部照射雷射而使其熔融，進而提高焊料潤濕性，或者藉由再次熔解(Remelting)並再次焊接(Resoldering)。Preferably, the laser processing method may further include the steps of: melting a part or all of the solder portion that does not conform to a predetermined quality standard by a second inspection (Post-inspection), and melting the laser, In turn, the solder wettability is increased, or by remelting and resoldering.

較佳地，所述雷射加工方法還可以包括如下步驟：清潔步驟，用於在第二檢查(Post-Inspection)步驟之後去除灰塵及異物，其中，在所述清潔步驟中執行乾燥空氣吹送(Dry Air Blowing)、二氧化碳雪清潔(CO2 Snow Cleaning)及惰性氣體吹送中一種以上。Preferably, the laser processing method may further include the following steps: a cleaning step for removing dust and foreign matter after the second inspection (Post-Inspection) step, wherein dry air blowing is performed in the cleaning step ( Dry Air Blowing), CO 2 Snow Cleaning and inert gas blowing.

較佳地，對對象體執行的焊接可以包括後續焊接(Post-Soldering)及預焊接(Pre- Soldering)。Preferably, the welding performed on the object body may include post-soldering and pre-solding.

較佳地，在所述焊接執行步驟中，可以包括：用於校正雷射束(laser beam)位置、排出焊球的管嘴(nozzle)位置及視覺檢查(vision inspection)位置中的一種以上的步驟。Preferably, in the welding performing step, the method may include: correcting one or more of a laser beam position, a nozzle position at which the solder ball is discharged, and a vision inspection position. step.

本發明提供一種雷射加工裝置，包括：控制部；夾具，裝載對象體；第一檢查部，對裝載於夾具的對象體的包括旋轉及配置的對齊狀態進行感測(Detect)及第一檢查(Pre-Inspection)；移動部，將所述對象體裝載到夾具或者從夾具卸載所述對象體；加工部，藉由雷射器對對象體進行焊接；以及第二檢查部，藉由控制部的控制以所述對象體為對象選擇性地執行第二檢查(Post-Inspection)。The present invention provides a laser processing apparatus including: a control unit; a jig, a loading target body; and a first inspection unit that senses (Detect) and first checks an alignment state including rotation and arrangement of the object body mounted on the jig (Pre-Inspection); a moving unit that loads or unloads the object body into the jig; the processing unit that welds the object body by the laser; and the second inspection unit, by the control unit The control selectively performs a second check (Post-Inspection) with the object body as an object.

較佳地，第二檢查可以藉由視覺檢查執行。Preferably, the second inspection can be performed by visual inspection.

較佳地，第二檢查可以是感測檢查是否發生焊接區域的內部裂紋及孔隙(Pore)的檢查。Preferably, the second inspection may be an inspection to sense whether internal cracks and pores of the weld zone have occurred.

較佳地，雷射器可以是包括光纖雷射器(Fiber Laser)及二極體雷射器(Diode Laser)中一種以上的固體雷射器。Preferably, the laser may be one or more solid lasers including a Fiber Laser and a Diode Laser.

較佳地，藉由控制部執行焊接，加工部可以包括雷射束集束光學頭、焊球供應裝置以及用於排出焊球的包含管嘴的焊接頭。Preferably, the welding portion is performed by the control portion, and the processing portion may include a laser beam bundling optical head, a solder ball supply device, and a soldering tip including a nozzle for discharging the solder ball.

較佳地，焊接的步驟可以藉由雷射焊接管嘴執行，所述雷射焊接管嘴包含一個以上的焊接頭的拾取和放置焊接頭或者噴出焊接頭。Preferably, the step of welding can be performed by a laser welded nozzle that includes more than one weld head for picking and placing a weld head or a spray weld joint.

較佳地，控制部可以檢查排出焊球的管嘴的預定的狀態及品質而控制進行清洗或更換。Preferably, the control unit can check the predetermined state and quality of the nozzle that discharges the solder ball to control cleaning or replacement.

較佳地，控制部可以記錄雷射器的輸出並校正雷射器的輸出。Preferably, the control portion can record the output of the laser and correct the output of the laser.

較佳地，藉由第二檢查部進行的檢查可以與所述焊接同時執行。Preferably, the inspection by the second inspection portion can be performed simultaneously with the welding.

較佳地，藉由控制所述控制部，品質的檢查可以被控制為丟棄或收集接合(bonding)測試時使用的焊球以及製造中存在缺陷的不良焊球。Preferably, by controlling the control portion, the quality inspection can be controlled to discard or collect the solder balls used in the bonding test and the defective solder balls having defects in the manufacturing.

較佳地，所述雷射加工裝置還可以包括：分類裝置，在第二檢查(Post-Inspection)之後，根據預定的品質標準對所述對象體進行分類(Sorting) 。Preferably, the laser processing apparatus may further include: a sorting device that sorts the object according to a predetermined quality standard after the second inspection (Post-Inspection).

較佳地，藉由所述控制部的控制，可以將藉由所述第二檢查(Post-inspection)而不符合預定的品質標準的焊料部的全部或一部分(焊料部)為對象照射雷射而使其熔融，進而提高焊料潤濕性，或者藉由再次熔解去除並執行再次焊接。Preferably, all or a part (solder portion) of the solder portion that does not conform to the predetermined quality standard by the second inspection (Post-inspection) can be irradiated with the laser by the control of the control portion. It is melted to further improve the solder wettability, or is removed by re-melting and re-welding is performed.

較佳地，所述雷射加工裝置還可以包括：清潔裝置(Cleaning Device)，用於在第二檢查(Post-Inspection)步驟之後去除灰塵及異物，其中，清潔裝置包括提供乾燥空氣的吹送(Dry Air Blowing)裝置、二氧化碳雪清潔(CO2 Snow Cleaning)裝置及惰性氣體吹送裝置中一種以上。Preferably, the laser processing apparatus may further include: a cleaning device for removing dust and foreign matter after the second inspection (Post-Inspection) step, wherein the cleaning device includes blowing to provide dry air ( One or more of the Dry Air Blowing device, the CO 2 Snow Cleaning device, and the inert gas blowing device.

較佳地，對對象體執行的焊接步驟在後續焊接(Post-Soldering)之前還可以包括藉由預焊接部執行的預焊接(Pre-Soldering)。Preferably, the welding step performed on the object body may further include pre-soldering performed by the pre-welding portion before the subsequent welding (Post-Soldering).

較佳地，控制部可以執行校正雷射束(laser beam)位置、排出焊球的管嘴(nozzle)位置及視覺檢查(vision inspection)位置的控制。Preferably, the control portion may perform control for correcting the position of the laser beam, the position of the nozzle for discharging the solder ball, and the position of the vision inspection.

較佳地，控制部可以藉由雷射器的輸出、雷射照射時間、雷射照射次數及雷射器的輸出與照射時間的控制相關性中的斜率的組合確定的雷射規範執行。Preferably, the control portion can be executed by a laser specification determined by a combination of the output of the laser, the time of the laser irradiation, the number of laser irradiations, and the slope of the control correlation between the output of the laser and the illumination time.

本發明的實施例包括視覺檢查模組或步驟以及雷射焊接模組或步驟，從而能夠實現快速且高效的雷射加工裝置及方法。Embodiments of the present invention include a visual inspection module or step and a laser welding module or step to enable a fast and efficient laser processing apparatus and method.

以下，參照圖式對本發明的具體實施態樣進行說明。然而，這些僅為示例，本發明並不限定於此。Hereinafter, specific embodiments of the present invention will be described with reference to the drawings. However, these are merely examples, and the present invention is not limited thereto.

在對本發明進行說明的過程中，如果判斷為針對與本發明相關的習知技術的具體說明會給本發明的主旨帶來不必要的混亂，則省略其詳細的說明。而且，下文中的術語是考慮到其在本發明中的功能而定義的術語，可以根據用戶、運用者的意圖或習慣等而變得不同。因此，應當根據貫穿整個說明書的內容來對這些術語下定義。In the course of explaining the present invention, if it is determined that the specific description of the related art related to the present invention will cause unnecessary confusion to the gist of the present invention, the detailed description thereof will be omitted. Moreover, the terminology hereinafter is a term defined in consideration of its function in the present invention, and may be different depending on the user, the intention or habit of the user, and the like. Therefore, these terms should be defined in terms of the contents throughout the specification.

本發明的技術思想是藉由申請專利範圍確定的，以下的實施例僅僅是用於向本發明所屬的技術領域中具備通常知識的人有效地說明的本發明的技術思想的一手段。The technical idea of the present invention is determined by the scope of the patent application, and the following embodiments are merely a means for effectively explaining the technical idea of the present invention to those having ordinary knowledge in the technical field to which the present invention pertains.

藉由根據本發明的實施例的雷射加工裝置及方法可以對雷射加工對象執行標記(marking)、鑽孔(drilling)、熔接及焊接(soldering)等。以下，對將本發明的雷射加工裝置及方法作為執行焊接的示例而進行說明。即，也可以將雷射加工裝置作為焊接裝置使用而只執行用於焊接的步驟。以下，在上述情況當中可以將雷射加工裝置描述為焊接裝置。Marking, drilling, welding, soldering, and the like can be performed on a laser processing object by the laser processing apparatus and method according to an embodiment of the present invention. Hereinafter, the laser processing apparatus and method of the present invention will be described as an example of performing welding. That is, it is also possible to use the laser processing apparatus as a welding apparatus and perform only the steps for welding. Hereinafter, in the above case, the laser processing apparatus can be described as a welding apparatus.

所述雷射加工對象當然能夠應用於包括相機模組20的各種電子部件等多種電子部件的製造。以下，以相機模組(第1圖的20)為例對焊接的對象體進行說明。The laser processing object can of course be applied to the manufacture of various electronic components such as various electronic components including the camera module 20. Hereinafter, the object to be welded will be described by taking a camera module (20 of the first drawing) as an example.

以下所述的相機模組20當然能夠使用於智慧型電話、平板電腦等各種便攜式設備，並且能夠安裝而使用於：包括智慧型電視、家電產品的家用電器(Home Appliance)；車輛；或者安全相機(CCTV)、各種醫療設備等需要光學要素的各種裝置。例如，在相機模組20使用於汽車的情況下，可以應用於各種電子部件，在使用於家用電器的情況下，可以應用於旋轉保護殼(turning case)、平面屏幕監視器印刷電路板(PCB)、光電感測器等。並且，並且在便攜式設備中，可以應用於電荷耦合器件(CCD：Charged Coupled Device)相機模組20、USB連接端子、電池端子等。The camera module 20 described below can of course be used in various portable devices such as smart phones, tablet computers, and the like, and can be installed and used in: home appliances including smart televisions, home appliances, vehicles, or security cameras. (CCTV), various medical devices, and the like that require optical elements. For example, in the case where the camera module 20 is used in a car, it can be applied to various electronic components, and in the case of use in a home appliance, it can be applied to a rotary turning case, a flat screen monitor printed circuit board (PCB). ), optical sensor, etc. Further, in the portable device, it can be applied to a Charge Coupled Device (CCD) camera module 20, a USB connection terminal, a battery terminal, and the like.

並且，在以下說明的焊接過程中，對象體朝向夾具的移動或者從夾具的移動可以藉由移動部140 (見第17圖)實現。移動部140可以藉由拾取與放置(pick and place)方式握持對象體。或者，可以藉由磁性而黏附對象體，或者可以藉由產生吸力而吸附對象體。其可以形成為，藉由這種握持、黏附及吸附中的一種以上的方法而實現位置移動的機械臂(arm)形態。進而，在根據本發明的實施例的雷射加工裝置中所包含的雷射加工裝置不僅可以應用於焊接、錫焊、鍵接等多種步驟，除此之外，執行各個步驟的材質也可以應用金屬、電介質(dielectric)、半導體等多種材料。Further, in the welding process described below, the movement of the object body toward the jig or the movement from the jig can be realized by the moving portion 140 (see Fig. 17). The moving portion 140 can hold the object body by picking and placing. Alternatively, the object body may be adhered by magnetic force, or the object body may be adsorbed by generating suction. It can be formed into a form of a robot arm that realizes positional movement by one or more of such methods of holding, adhering, and adsorbing. Furthermore, the laser processing apparatus included in the laser processing apparatus according to the embodiment of the present invention can be applied not only to various steps such as soldering, soldering, bonding, etc., but also materials for performing the respective steps can be applied. A variety of materials such as metals, dielectrics, and semiconductors.

首先，第1圖是圖示對象體的構成的圖。相機模組20可以包括透鏡模組(透鏡致動器(Lens Actuator))21及圖像感測器模組(Image Sensor Module)22。First, FIG. 1 is a diagram showing the configuration of a target body. The camera module 20 may include a lens module (Lens Actuator) 21 and an Image Sensor Module 22 .

透鏡致動器可以包括透鏡模組21(Module Lens或Lens Module)、透鏡蓋(Lens Cover)、音圈馬達(VCM：Voice Coil Motor)驅動部、支架(Holder)、紅外線濾光片(IR Filter)等。並且，圖像感測器模組22可以包括半導體感測器芯片、各向異性導電膜(ACF)、軟性印刷電路板(FPCB)等。The lens actuator may include a lens module 21 (Module Lens or Lens Module), a lens cover (Lens Cover), a voice coil motor (VCM: Voice Coil Motor) drive unit, a bracket (Holder), and an infrared filter (IR Filter). )Wait. Also, the image sensor module 22 may include a semiconductor sensor chip, an anisotropic conductive film (ACF), a flexible printed circuit board (FPCB), or the like.

具體而言，相機模組(Camera Module)20或者微型相機模組(Compact Camera Module)20可以包括透鏡模組21(Module Lens)、自動對焦致動器(AF Actuator)、防抖裝置(Optical Image Stabilizer)、圖像感測器(Image Sensor)、AF驅動器(AF Driver)、PCB、FPCB、插座(Socket)等。透鏡模組21可以包括多個透鏡，例如用於成像的成像透鏡(Imaging Lens)，並且可以包括用於支撐多個透鏡的支撐體，並且紅外線濾光片(IR Filter)可以被包括於多個透鏡一側，IR濾光片可以被支撐體支撐。並且，圖像感測器可以被包括於圖像感測器模組22，並且圖像感測器模組22可以包括靈敏度增強微透鏡陣列(Sensitivity Improving MLA)、CCD或CMOS。Specifically, the Camera Module 20 or the Compact Camera Module 20 may include a lens module 21 (Module Lens), an AF Actuator, and an anti-shake device (Optical Image). Stabilizer), Image Sensor, AF Driver, PCB, FPCB, Socket, etc. The lens module 21 may include a plurality of lenses, such as an imaging lens for imaging, and may include a support for supporting a plurality of lenses, and an IR filter may be included in the plurality of lenses On the lens side, the IR filter can be supported by the support. Also, an image sensor can be included in the image sensor module 22, and the image sensor module 22 can include a Sensitivity Improving MLA, CCD, or CMOS.

在此，圖像感測器是將拍攝的影像轉換為電訊號的感測器，多個透鏡起到聚集影像的作用。並且，PCB起到將圖像感測器導線鍵接而支撐的作用以及能夠將感測器的電訊號輸出至外部的通路的作用，FPCB起到包括直接連接到外部後端芯片(Backend Chip)的連接線的作用。Here, the image sensor is a sensor that converts the captured image into an electrical signal, and the plurality of lenses function to aggregate the image. Moreover, the PCB functions as a support for bonding the image sensor wires and a path for outputting the sensor's electrical signals to the outside, and the FPCB functions to include a direct connection to the external backend chip (Backend Chip). The role of the connection line.

接下來，第2圖是簡略圖示根據本發明的實施例的相機模組20的製造步驟的圖。Next, Fig. 2 is a view schematically showing a manufacturing step of the camera module 20 according to an embodiment of the present invention.

根據本發明的實施例的相機模組20的製造步驟包括：製造透鏡模組21的步驟；藉由包裝(Packaging)所製造的透鏡模組21來製造包裝模組的步驟；藉由進一步完成包裝模組來製造相機模組20的步驟。The manufacturing steps of the camera module 20 according to the embodiment of the present invention include the steps of: manufacturing the lens module 21; the step of manufacturing the packaging module by the lens module 21 manufactured by packaging; by further completing the packaging The module is used to manufacture the camera module 20.

具體而言，相機模組20的製造步驟包括相機模組20的加工組裝及檢查步驟，更具體而言，單透鏡注入、單透鏡切割(cut)、單透鏡塗層(Coat)、單透鏡缺陷檢查、透鏡組裝、透鏡性能檢查、透鏡支架組裝。包裝模組製造步驟可以包括晶圓切割(Wafer Saw)、管芯貼裝(Die Attach)、導線鍵接(Wire Bond)、清潔(Clean)及透鏡支架安裝(Lens Holder Mount)。並且，包裝模組進一步完成步驟包括透鏡預安裝(Lens Pre-Ass'y)、焦點紫外線鎖定(Focus UV Lock)、感測器測試(Sensor Test)、FPCB貼裝(FPCB Attach)、保護殼(Case)組裝以及出荷檢查。Specifically, the manufacturing steps of the camera module 20 include processing assembly and inspection steps of the camera module 20, more specifically, single lens injection, single lens cutting, single lens coating (Coat), single lens defect Inspection, lens assembly, lens performance inspection, lens holder assembly. The packaging module manufacturing steps may include Wafer Saw, Die Attach, Wire Bond, Clean, and Lens Holder Mount. Moreover, the packaging module further completes the steps including lens pre-installation (Lens Pre-Ass'y), focus UV lock, sensor test, FPCB attachment, protective case ( Case) assembly and load check.

另外，參照第3圖，對用於智慧型電話及移動電話的便攜式設備的相機模組20的製造步驟進行具體說明如下。Further, referring to Fig. 3, the manufacturing steps of the camera module 20 for a portable device for a smart phone and a mobile phone will be specifically described below.

首先，提供用於製造感測器芯片(Sensor Chip)的晶圓(Wafer)(①)，切割所提供的晶圓而準備感測器芯片(②)，將準備的感測器芯片貼附到印刷電路板(PCB)(③)，在用金線(Gold Wire)連接感測器芯片與印刷電路板(④)之後，將透鏡機構安裝在上部(⑤)。接下來分離為單獨的相機模組20 (⑥)之後，接合FPCB(⑦)，旋轉模組並設置焦點(Focus Setting)(⑧)。接下來，在藉由環氧樹脂(Epoxy)固化固定模組的焦點之後，將經由相機模組20(CM模組)的光照射到測試圖(Test Chart)上而檢查畫像及色相(⑨)並進行設置(⑩)。First, a wafer (Wafer) (1) for manufacturing a sensor chip is provided, the supplied wafer is cut to prepare a sensor chip (2), and the prepared sensor chip is attached to A printed circuit board (PCB) (3) is mounted on the upper portion (5) after the sensor chip and the printed circuit board (4) are connected by a gold wire. After separating into separate camera modules 20 (6), the FPCB (7) is engaged, the module is rotated and the focus (Focus Setting) (8) is set. Next, after the focus of the fixed module is cured by epoxy resin (Epoxy), the light passing through the camera module 20 (CM module) is irradiated onto the test chart to check the portrait and the hue (9). And set (10).

在上述的步驟中，可以在FPCB貼裝(FPCB Attach)、保護殼(Case)組裝等步驟中使用雷射加工裝置(Laser Soldering Apparatus)。在FPCB貼裝及保護殼組裝步驟中為了進行端子的連接而需要進行錫焊，即焊接(soldering)步驟，並且在這些過程中可以使用本發明的實施例中包含的雷射加工裝置。In the above steps, a laser soldering device (Laser Soldering Apparatus) can be used in the steps of FPCB attach, case assembly, and the like. In the FPCB mounting and protective case assembly step, a soldering, that is, a soldering step is required for the connection of the terminals, and the laser processing apparatus included in the embodiment of the present invention can be used in these processes.

如第4圖所示，這樣的雷射加工裝置在相機模組20中可以使用於雙面焊接(two-side soldering)或三面焊接(three-side soldering)。在雙面焊接的情況下，可以對相機模組20的上表面進行6點至8點焊接(6~8 points soldering)，並且可以在與上表面相反的下表面進行6點至8點焊接(6~8 points soldering)。另外，在三面焊接的情況下，可以以整體地將16點覆蓋於三個表面的方式進行焊接。在這種情況下，相機模組20可以是光學圖像穩定器(OIS：Optical Image Stabilizer)相機模組20。As shown in FIG. 4, such a laser processing apparatus can be used in the camera module 20 for two-side soldering or three-side soldering. In the case of double-sided soldering, 6 to 8 points soldering can be performed on the upper surface of the camera module 20, and 6 to 8 points of soldering can be performed on the lower surface opposite to the upper surface ( 6~8 points soldering). Further, in the case of three-sided welding, welding may be performed so as to cover 16 points on the entire surface as a whole. In this case, the camera module 20 may be an Optical Image Stabilizer (OIS) camera module 20.

參照第5圖，對如上所述的雷射加工裝置執行的雷射焊接過程的說明如下。Referring to Fig. 5, the description of the laser welding process performed by the laser processing apparatus as described above is as follows.

首先，可以將雷射照射到焊點而執行預熱(Pre-Heat)PH1步驟。雷射照射的區域發散熱，例如，發散圓形、四邊形、環形等面狀的熱。接下來，熱被傳遞至周圍區域，從而能夠使溫度上升。然後，可以供應焊球S(solder ball)並借助於雷射進行後熱(Post-Heat)PH2過程。接下來，經過冷卻(Cool Down)CD而進行焊接過程。在此，根據需要，也可以不進行預熱(Pre-Heat)PH1步驟，經過焊球S(solder ball)的供應、後熱(Post-Heat)PH2步驟及冷卻(Cool Down)CD過程而完成焊接過程。First, a pre-heating (Pre-Heat) PH1 step can be performed by irradiating the laser to the solder joint. The area illuminated by the laser radiates heat, for example, diverging circular, quadrangular, or circular planar heat. Next, heat is transferred to the surrounding area, so that the temperature can be raised. Then, a solder ball can be supplied and a post-Heat PH2 process can be performed by means of a laser. Next, the welding process is performed by cooling down the CD. Here, as needed, the pre-Heat PH1 step may be performed without the supply of the solder ball S, the post-Heat PH2 step, and the Cool Down CD process. Welding process.

當雷射焊接裝置利用焊絲時，根據利用焊球S的情況和利用焊膏的情況中的一種，裝置的構成及雷射照射方法可以不同。When the laser welding apparatus utilizes the welding wire, the configuration of the apparatus and the laser irradiation method may be different depending on one of the case of using the solder ball S and the case of using the solder paste.

尤其，在利用焊球S的情況下，如第6圖所示，可以採用拾取和放置(Pick and Place)焊接方法：拾取焊球S並移動，將焊球S放置到所需位置，並且將雷射照射到焊球S而使焊球S熔融並滴落，進而進行接合。In particular, in the case of using the solder ball S, as shown in FIG. 6, a pick and place soldering method may be employed: picking up the solder ball S and moving it, placing the solder ball S to a desired position, and The laser beam is irradiated onto the solder ball S, and the solder ball S is melted and dripped, and the bonding is performed.

並且，可以採用焊料噴出(Solder Jetting)方法：藉由管嘴移動焊球S而使其在管嘴內部熔融，進而噴出(Jetting)。Further, a solder discharge method may be employed: the solder ball S is moved by the nozzle to be melted inside the nozzle, and then jetted.

進而，對於所述管嘴而言，若檢測到異常狀態則可以進行更換。管嘴還可以包括用於檢測是否處於包括污染及變形的所述異常狀態的感測部。感測部可以包括第一感測部及第二感測部。Further, the nozzle can be replaced if an abnormal state is detected. The nozzle may also include a sensing portion for detecting whether the abnormal state is included including contamination and deformation. The sensing portion may include a first sensing portion and a second sensing portion.

所述第一感測部是用於確認管嘴的狀態的感測器，可以是電荷耦合元件(CCD：charged-coupled device)相機。第一感測部可以檢查管嘴的狀態，進而在管嘴狀態無異常的情況下執行正常的焊球應用操作。然而，若第一感測部檢測到管嘴的異常狀態，則可以藉由卸載部使異常狀態的管嘴脫離，並取出存儲於管嘴筒(Nozzle cartridge)中的新的管嘴並貼附在結合部。若新的管嘴被貼附於結合部，則可以藉由對準(Alignment)部將新管嘴對準。The first sensing portion is a sensor for confirming the state of the nozzle, and may be a CCD (charged-coupled device) camera. The first sensing portion can check the state of the nozzle, thereby performing a normal solder ball application operation without abnormality in the nozzle state. However, if the first sensing portion detects an abnormal state of the nozzle, the nozzle in the abnormal state can be disengaged by the unloading portion, and the new nozzle stored in the nozzle cartridge can be taken out and attached. At the joint. If a new nozzle is attached to the joint, the new nozzle can be aligned by the Alignment section.

並且，所述第二感測部可以是電荷耦合元件(CCD：charged-coupled device)相機、區域感測器(area sensor)、霍爾感測器(hole sensor)、電容感測器。藉由第二感測部能夠確認盤(disk)的異常狀態，尤其是焊球移送口的異常狀態，並發送至控制部。即，確認焊球移送口的污染狀態，如果污染程度為足以干擾焊球的供應的程度(例如，當焊球移送口內的直徑為預設的數值以下時)，則可以將表示焊球移送口異常狀態的訊號發送至控制部。若控制部確認移動並提供焊球S的盤處於異常狀態，則能夠向用戶顯示該結果，以提供使用戶能夠更換盤的訊息。Moreover, the second sensing portion may be a CCD (charged-coupled device) camera, an area sensor, a hole sensor, a capacitance sensor. The second sensing unit can confirm the abnormal state of the disk, in particular, the abnormal state of the solder ball transfer port, and transmit it to the control unit. That is, the contamination state of the solder ball transfer port is confirmed, and if the contamination level is sufficient to interfere with the supply of the solder ball (for example, when the diameter of the solder ball transfer port is below a preset value), the transfer of the solder ball can be performed. The signal of the abnormal state of the port is sent to the control unit. If the control unit confirms that the disk that is moving and provides the solder ball S is in an abnormal state, the result can be displayed to the user to provide a message enabling the user to replace the disk.

作為一例，藉由第6圖對拾取和放置焊接方法進行更具體的說明，如第6圖的(a)所示，將準備的焊球S(步驟1)藉由管嘴拾取一個以上(步驟2)並放置在需要焊接的位置的上部(步驟3)。位於上部的焊球S藉由雷射照射熔解而滴落至需要焊球S的位置(步驟4)。另外，如第6圖的(b)所示，在管嘴拾取兩個以上焊球S的情況下，可以將雷射按序地照射到各個焊球S。當然，第6圖圖示了管嘴拾取兩個以上的焊球S的情形，然而並不局限於此，也可以包括吸取一個焊球S而滴落至需要焊接的位置的情形。As an example, the pick-and-place soldering method will be more specifically explained by the sixth drawing. As shown in (a) of FIG. 6, the prepared solder ball S (step 1) is picked up by the nozzle by one or more steps. 2) Place it on top of the location where soldering is required (step 3). The solder ball S located at the upper portion is melted by laser irradiation and dropped to a position where the solder ball S is required (step 4). Further, as shown in (b) of FIG. 6, in the case where the nozzle picks up two or more solder balls S, the lasers may be sequentially irradiated to the respective solder balls S. Of course, FIG. 6 illustrates a case where the nozzle picks up two or more solder balls S, but is not limited thereto, and may include a case where one solder ball S is sucked and dropped to a position where soldering is required.

以下技術內容及第7圖與第6圖(拾取和放置(Pick and Place))不同，在照射焊絲、焊膏、預置的焊料的情況下可以考慮。The following technical contents, unlike Figures 7 and 6 (Pick and Place), can be considered in the case of illuminating the wire, solder paste, and preset solder.

在這樣的雷射加工裝置中，根據要求考慮的要素，需要進行雷射的操作。需要考慮如下內容：關於藉由雷射加熱的區域的尺寸(size of heated area)；誤差防止；以及確保使得即使發生誤差也能夠順利進行雷射焊接的焦距(focus distance)的確保；能夠防止在照射雷射的過程中被周圍構成要素阻斷或者對周圍構成要素造成缺陷的雷射的圓錐角。In such a laser processing apparatus, it is necessary to perform a laser operation in accordance with an element considered as required. It is necessary to consider the following: about the size of the heated area by the laser; the error prevention; and ensuring the focus distance that enables the laser welding to be smoothly performed even if an error occurs; A cone angle of a laser that is blocked by surrounding constituent elements or that causes defects to surrounding constituent elements during the laser irradiation.

因此，如第7圖所示，藉由調節具有圓錐形狀的雷射的圓錐角及波長可以調節被雷射加熱的區域的尺寸及焦距。並且，可以藉由減小雷射的圓錐角，防止由於周圍構成要素的接觸而造成的缺陷。為了調節這樣的雷射的圓錐角及波長，根據本發明的實施例的雷射加工裝置在藉由管嘴16供應雷射的上側雷射供應部包括雷射波長調節部及雷射圓錐角調節部。Therefore, as shown in Fig. 7, the size and focal length of the region heated by the laser can be adjusted by adjusting the cone angle and the wavelength of the laser having a conical shape. Also, it is possible to prevent defects due to contact of surrounding constituent elements by reducing the taper angle of the laser. In order to adjust the cone angle and wavelength of such a laser, the laser processing apparatus according to the embodiment of the present invention includes a laser wavelength adjustment section and a laser cone angle adjustment in the upper side laser supply section that supplies the laser through the nozzle 16. unit.

不僅如此，還可以綜合考慮雷射加工裝置的循環週期、工作溫度以及被焊接的材料的溫度靈敏度、接觸敏感度、下一個步驟的順利執行所需要的允許溫度等。Moreover, it is also possible to comprehensively consider the cycle time of the laser processing apparatus, the operating temperature, and the temperature sensitivity of the material to be welded, the contact sensitivity, the allowable temperature required for the smooth execution of the next step, and the like.

在雷射加工裝置中，若具體觀察關於回流(reflow)時間(timing)的考慮事項則如下。In the laser processing apparatus, the following considerations regarding the reflow timing are as follows.

第一，可以考慮焊接對象體的熱負荷。對象體越大，熱傳導越慢，熱傳導率高的對象體可以起到類似於散熱器(heat sink)的作用。First, the thermal load of the welding target body can be considered. The larger the object body, the slower the heat conduction, and the object with high thermal conductivity can function like a heat sink.

第二，可以考慮焊膏(焊球S)的質量。這是因為雷射必須追加足夠的能量來蒸發助焊劑並液化合金。並且，還因為助焊劑蒸汽影響加熱速度並且還可能會自燃。Second, the quality of the solder paste (solder ball S) can be considered. This is because the laser must add enough energy to evaporate the flux and liquefy the alloy. Also, because the flux vapor affects the heating rate and may also ignite spontaneously.

第三，可以考慮與潤濕(wetted)處之間的距離。距離越遠，雷射照射時間可能越長。這是因為合金需要是能夠橫向流過表面並將其潤濕的液體狀態。Third, the distance from the wetterd can be considered. The further the distance, the longer the laser exposure time. This is because the alloy needs to be in a liquid state that can flow laterally across the surface and wet it.

第四，可以考慮焊縫形狀(Joint geometry)。這是因為在焊縫形狀是諸如絞合線等複雜的形狀的情況下，可能需要更長時間使合金完全潤濕。因為合金需要是能夠橫向流過表面並將其潤濕的液體狀態。Fourth, joint geometry can be considered. This is because in the case where the weld bead shape is a complicated shape such as a stranded wire, it may take a longer time to completely wet the alloy. Because the alloy needs to be in a liquid state that can flow laterally across the surface and wet it.

第五，可以考慮熱敏感度。部件及焊料必須迅速加熱以限制吸收的總熱量。這是因為過多的熱可能會傳導至周圍的構成而使周圍的構成受損。Fifth, thermal sensitivity can be considered. Parts and solder must be heated quickly to limit the total heat absorbed. This is because too much heat may be transmitted to the surrounding structure to damage the surrounding structure.

如第8圖所示，可以根據時間控制雷射的能量輸出(laser power)，因此可以對加熱進行規範化(profiling)以能夠最大程度地應用所需的加熱效果。在沒有考慮事項進行點對點的加熱的情況下，規範(profile)可以是一次為單個功率電平(level)。在週期時間重要且需要直到部件完全濕潤為止的最少的時間的情況下，為了以不發生過熱地保持回流的程度保持加熱的區域，可以施加為足以能夠在降低至更低的功率之前開始回流的充分高的功率電平。雷射器輸出電平也可以根據時間的經過而線性變更，從而從一個輸出電平漸變(ramping)為另一輸出電平。As shown in Fig. 8, the laser power of the laser can be controlled according to time, so that heating can be profiling to maximize the application of the desired heating effect. In the case where point-to-point heating is not considered, the profile may be a single power level at a time. In the case where the cycle time is important and requires a minimum time until the component is completely wet, in order to maintain the heated region to the extent that the reflow is maintained without overheating, it may be applied to be able to start the reflow before reducing to a lower power. Fully high power level. The output level of the laser can also be linearly changed according to the passage of time to ramp from one output level to another.

這樣的雷射焊接步驟可以自動化。例如，在雷射加工裝置中可以實現用於識別對象體的視覺識別，並且可以控制為視覺識別與雷射焊接可以在同一條線上進行。並且，包括線性馬達(linear motor)能夠實現控制的效率化及作業性的提高。並且，執行雷射焊接的管嘴16焊接頭可以包括兩個(雙雷射接合頭(dual laser bonding head))或超過兩個，從而自然能夠提高操作性。並且，包括兩個以上的焊接頭且實現各個雷射焊接的焊接台(table)與所述焊接頭對應地包括兩個以上，從而能夠並列地進行作業。進而，雖然未利用附圖進行詳細地圖示，然而這樣的雷射加工裝置當然可以包括含有能夠實現兩個以上的方向的移動的馬達的移動台，並且可以包括用於供應雷射的雷射供應部以及能夠供應焊料的焊球S供應部。並且，可以包括能夠使雷射加工裝置管嘴16旋轉的旋轉馬達，管嘴16借助於旋轉馬達的旋轉而旋轉，從而能夠在對象體中對需要雷射焊接的部分傾斜地照射雷射。Such a laser welding step can be automated. For example, visual recognition for recognizing a subject can be realized in a laser processing apparatus, and it can be controlled that visual recognition and laser welding can be performed on the same line. Further, the linear motor can realize the efficiency of control and the improvement of workability. Also, the welding head of the nozzle 16 performing laser welding may include two (dual laser bonding head) or more than two, so that the operability can be naturally improved. Further, a welding table including two or more welding heads and realizing each laser welding includes two or more corresponding to the welding head, so that work can be performed in parallel. Further, although not illustrated in detail with reference to the drawings, such a laser processing apparatus may of course include a mobile station including a motor capable of realizing movement in two or more directions, and may include a laser for supplying a laser. A supply portion and a solder ball S supply portion capable of supplying solder. Further, it is possible to include a rotary motor that can rotate the nozzle 16 of the laser processing apparatus, and the nozzle 16 is rotated by the rotation of the rotary motor, whereby the laser beam can be obliquely irradiated to the target body in a portion requiring laser welding.

雷射加工裝置可以製造成臺式型，也可以製造成能夠使雷射焊接管嘴16借助機器人移動的機器人自動化類型。進而，自然可以作為在製造生產線上自動化的系統的構成而提供為自動化裝置，或者也可以提供為獨立型系統。進而，如第9圖所示，作為相機模組20步驟的音圈電機(VCM：Voice Coil Motor)焊接裝備，也可以將雷射將音圈電機終端(VCM Terminal)/軛(Yoke)端子與陶瓷多層基板(HTCC基板，High Temperature Coried Ceramics)作為用於焊接的裝備而採用。The laser processing apparatus can be manufactured in a desktop type or can be manufactured in a robotic automation type that enables the laser welding nozzle 16 to be moved by means of a robot. Further, it can naturally be provided as an automatic device as a configuration of a system that is automated on a manufacturing line, or can be provided as a stand-alone system. Further, as shown in FIG. 9, as the voice coil motor (VCM: Voice Coil Motor) welding equipment of the camera module 20 step, the laser can be used to connect the voice coil motor terminal (VCM terminal)/yoke terminal (Yoke) terminal with Ceramic multilayer substrates (HTCC substrates, High Temperature Coried Ceramics) are used as equipment for welding.

並且，根據本發明的實施例的雷射加工裝置可以包括控制部，進而執行雷射焊接所需的控制。控制部可以藉由外部訊號實現啟動、內置系統及程序的升級，也可以藉由焊接參數的輸入/輸出進行控制乃至調整。根據本發明的實施例的雷射加工裝置可以包括用於容易地掌握裝置的操作狀態和控制狀態的顯示部。Also, the laser processing apparatus according to the embodiment of the present invention may include a control portion to perform control required for laser welding. The control unit can be upgraded by an external signal, built-in system and program, or controlled or adjusted by the input/output of the welding parameters. The laser processing apparatus according to an embodiment of the present invention may include a display portion for easily grasping an operation state and a control state of the device.

進而，根據本發明的實施例的雷射加工裝置可以包括能夠測量對象體和焊料中的至少一個的溫度的非接觸式溫度感測器。並且，可以包括用於進行精確的焊料供料的供料機(feeder)。並且，控制部可以包括兩個以上可選擇的焊接規範，從而即使不輸入額外的控制因素也能夠進行雷射焊接。例如，根據本發明的實施例的雷射加工裝置可以具有三個焊接規範，並且各個雷射焊接規範可以分為三個步驟、八個步驟順序而能夠實現靈活且準確的參數控制。另外，根據本發明的實施例的雷射加工裝置的控制部可以提供為能夠選擇焦距、IR溫度檢測及實時焊接質量監控中的兩種以上的雷射焊接頭選項。Further, the laser processing apparatus according to an embodiment of the present invention may include a non-contact temperature sensor capable of measuring a temperature of at least one of a subject body and a solder. Also, a feeder for performing precise solder feeding may be included. Also, the control portion may include more than two selectable welding specifications so that laser welding can be performed even without inputting additional control factors. For example, a laser processing apparatus according to an embodiment of the present invention may have three welding specifications, and each laser welding specification may be divided into three steps, eight step sequences, enabling flexible and accurate parameter control. Further, the control portion of the laser processing apparatus according to the embodiment of the present invention may be provided as a laser welding head option capable of selecting two or more of the focal length, the IR temperature detection, and the real-time welding quality monitoring.

另外，雷射焊接規範也可以包括雷射器的輸出、雷射照射時間、雷射照射次數及雷射器的輸出與照射時間相關性中的斜率。In addition, the laser welding specification may also include the output of the laser, the time of the laser illumination, the number of laser illuminations, and the slope in the correlation between the output of the laser and the illumination time.

藉由上述四種條件的多種組合能夠確定與焊球的尺寸及與焊接環境對應的雷射規範。例如，在焊球較大的情況下可能無法實現焊球完全熔融，因此為了實現焊球的熔融，能夠多次進行用於加熱的雷射照射。可以根據焊球的尺寸執行回流焊接。並且，若完成加熱，則可以進行緩冷，如果進行急冷，則可能發生冷焊現象而導致焊接部產生裂紋。因此，在冷卻時可以進行緩冷。The laser specifications corresponding to the size of the solder balls and the soldering environment can be determined by various combinations of the above four conditions. For example, in the case where the solder ball is large, the solder ball may not be completely melted, and therefore, in order to achieve melting of the solder ball, laser irradiation for heating can be performed a plurality of times. Reflow soldering can be performed according to the size of the solder balls. Further, when the heating is completed, the slow cooling can be performed, and if the cooling is performed, the cold welding phenomenon may occur and cracks may occur in the welded portion. Therefore, slow cooling can be performed while cooling.

另外，所述緩冷可以包括持續減小雷射器輸出而執行的緩冷以及階段性地減小輸出而執行的緩冷。即使是持續減小雷射器輸出而進行緩冷的情況，雷射器的輸出與照射時間相關性的斜率越大，緩冷的效果還是會與急冷效果相似，因此可以選擇性地進行調節。Additionally, the slow cooling may include slow cooling performed to continuously reduce the output of the laser and slow cooling performed to reduce the output stepwise. Even if the laser output is continuously reduced and the cooling is performed, the slope of the correlation between the output of the laser and the irradiation time is larger, and the effect of the slow cooling is similar to that of the quenching, so that the adjustment can be selectively performed.

即，為了藉由雷射器的輸出、雷射照射時間、雷射照射次數及雷射器的輸出與照射時間的關係中的斜率的組合而在焊接過程中形成一個以上的輸出區間，可以選擇多種雷射規範。That is, in order to form more than one output section in the welding process by the combination of the output of the laser, the laser irradiation time, the number of laser irradiations, and the slope in the relationship between the output of the laser and the irradiation time, it is possible to select A variety of laser specifications.

藉由上述的雷射加工裝置，如第10圖所示，焊接可以應用於多種端子的電連接。例如，即使在端子位於同一平面上或佈置為具有角度的情況下也能夠順利地執行焊接。因此，如第11圖的(a)至第11圖的(d)所示，根據本發明的實施例的雷射加工裝置能夠實現角接合(Corner connection)、空腔接合(Cavity connection)及全方位接合(All connection)等多種連接。With the laser processing apparatus described above, as shown in Fig. 10, the soldering can be applied to electrical connections of various terminals. For example, the welding can be smoothly performed even in the case where the terminals are on the same plane or arranged to have an angle. Therefore, as shown in (a) to (d) of FIG. 11, the laser processing apparatus according to the embodiment of the present invention can realize corner connection, cavity connection, and full A variety of connections, such as a joint connection.

首先，可以藉由第12圖對包括根據本發明的實施例的雷射加工裝置的管嘴16的裝置進行說明。First, an apparatus including a nozzle 16 of a laser processing apparatus according to an embodiment of the present invention will be described by way of Fig. 12.

根據本發明的實施例的裝置的一部分包括上部基座17及下部基座18，並且包括位於上部基座17與下部基座18之間的漏盤(Hole disk)。漏盤可以借助於旋轉軸6而旋轉，並且包括多個孔，進而能夠借助於以旋轉軸6為中心的旋轉而將焊球搬運至雷射傳輸通道14。即，藉由焊球入口2流入的焊球S被放置在配備於漏盤的多個孔中的一個，位於漏盤的一個孔的焊球S借助於旋轉軸6的旋轉可以移動至雷射傳輸通道14側。A portion of the device in accordance with an embodiment of the present invention includes an upper base 17 and a lower base 18 and includes a leak disk between the upper base 17 and the lower base 18. The drain pan can be rotated by means of the rotary shaft 6 and comprises a plurality of holes, which in turn can carry the solder balls to the laser transport channel 14 by means of rotation about the axis of rotation 6. That is, the solder ball S flowing in through the solder ball inlet 2 is placed in one of a plurality of holes provided in the drain disk, and the solder ball S located in one hole of the drain disk can be moved to the laser by the rotation of the rotating shaft 6. Transmission channel 14 side.

在此，供應至焊球入口2的焊球S可以臨時存儲於存儲腔室3，並可以借助於藉由氮氣入口11、4供應的氮氣移動至焊球出口端5，進而移動至焊球出口端5的焊球S位於配置於漏盤的多個孔中的一個。Here, the solder balls S supplied to the solder ball inlet 2 may be temporarily stored in the storage chamber 3, and may be moved to the solder ball outlet end 5 by means of nitrogen supplied through the nitrogen inlets 11, 4, thereby moving to the solder ball outlet. The solder ball S of the end 5 is located in one of a plurality of holes disposed in the drain pan.

在上部基座17可以配置有能夠可旋轉地支撐旋轉軸6的結構，並且在上側可以包括適配器7。並且，可以包括貫通上部基座17及下部基座18的接收端口10及傳輸端口9。移動至雷射傳輸通道14側的焊球S可以藉由焊球出口通道12移動至管嘴16側。The upper base 17 may be configured with a structure capable of rotatably supporting the rotary shaft 6, and may include an adapter 7 on the upper side. Further, a receiving port 10 and a transmission port 9 that penetrate the upper base 17 and the lower base 18 may be included. The solder ball S moved to the side of the laser transmission channel 14 can be moved to the nozzle 16 side by the solder ball outlet channel 12.

在雷射傳輸通道14的上側可以配置有透明玻璃13，經由透明玻璃13照射的雷射可以經由雷射傳輸通道14照射至管嘴16側。A transparent glass 13 may be disposed on the upper side of the laser transmission passage 14, and a laser irradiated via the transparent glass 13 may be irradiated to the nozzle 16 side via the laser transmission passage 14.

管嘴16可以藉由配置於下部基座18的管嘴防鬆鎖緊螺釘15結合。因此，可以使管嘴16能夠經由管嘴防鬆鎖緊螺釘15而與下部基座18結合，從而易於更換管嘴16。在本發明的實施例中，以管嘴防鬆鎖緊螺釘15為例進行了說明，然而，顯然，能夠管嘴16的更換的管嘴16與下部基座18之間的結合結構可以採用多種形式。並且，在雷射傳輸通道14的上側可以配置用於供應氮氣的氮氣入口11、4，使藉由雷射熔融的管嘴16內部的焊球S能夠排出至需要雷射焊接的部分。The nozzle 16 can be coupled by a nozzle lock screw 15 disposed on the lower base 18. Therefore, the nozzle 16 can be coupled to the lower base 18 via the nozzle lock screw 15, so that the nozzle 16 can be easily replaced. In the embodiment of the present invention, the nozzle lock screw 15 is taken as an example. However, it is obvious that the joint structure between the nozzle 16 and the lower base 18 of the nozzle 16 can be various. form. Further, nitrogen inlets 11 and 4 for supplying nitrogen gas may be disposed on the upper side of the laser transmission passage 14 so that the solder balls S inside the nozzle 16 which is melted by the laser can be discharged to a portion where laser welding is required.

作為一例，將根據本發明的實施例的雷射加工裝置中所包含的管嘴16放大進行觀察，可以如第13圖所示。As an example, the nozzle 16 included in the laser processing apparatus according to the embodiment of the present invention is enlarged and observed, as shown in Fig. 13.

在如第13圖所示的管嘴16可以形成有通孔，所述通孔包括圓柱體形狀部以及結合於圓柱體形狀部下部的圓錐台形狀部。焊球S經由焊球出口通道12流入管嘴16內部之後，經由圓柱體形狀部並借助於重力而落下。落下的焊球S被卡在圓錐台形狀部而無法流到管嘴16外部。經由透明玻璃13向卡在圓錐台形狀部的焊球照射雷射，從而熔融的焊球S借助於氮氣排出至外部。The nozzle 16 as shown in Fig. 13 may be formed with a through hole including a cylindrical shape portion and a truncated cone shaped portion coupled to a lower portion of the cylindrical shape portion. After the solder ball S flows into the inside of the nozzle 16 via the solder ball outlet passage 12, it falls through the cylindrical shape portion by gravity. The dropped solder ball S is caught in the shape of the truncated cone and cannot flow outside the nozzle 16. The laser beam stuck to the truncated cone shaped portion is irradiated with laser light through the transparent glass 13, so that the molten solder ball S is discharged to the outside by means of nitrogen gas.

另外，在焊球入口2一側可以配置有蓋1，蓋1可以僅當焊球S從存儲焊球S的焊球S供應腔室向焊球入口2側移動時開放。不僅如此，配置於焊球入口2的蓋1可以僅在使用根據本發明的實施例的雷射加工裝置的情況下開放，以能夠供應焊球S。Further, a cover 1 may be disposed on the side of the solder ball inlet 2, and the cover 1 may be opened only when the solder ball S moves from the solder ball S supply chamber of the storage solder ball S to the solder ball inlet 2 side. Moreover, the cover 1 disposed at the solder ball inlet 2 can be opened only in the case of using the laser processing apparatus according to the embodiment of the present invention to be able to supply the solder ball S.

並且，在上述的雷射加工裝置中僅主要針對氮氣進行了說明，然而除了氮氣以外還可以使用諸如氦氣和氬氣等所有能夠作為惰性氣體而使用的氣體。Further, in the above-described laser processing apparatus, only nitrogen gas has been mainly described. However, in addition to nitrogen gas, all gases such as helium gas and argon gas which can be used as an inert gas can be used.

以下，後文藉由依次示出作為雷射加工裝置的示例的一部分步驟的第14圖及第15圖描述A至F及A'至F'。對圖示於第14圖的順序圖(A至F)進行簡略的說明。Hereinafter, A to F and A' to F' will be described later by means of Figs. 14 and 15 which show a part of the steps as an example of the laser processing apparatus in order. The sequence diagrams (A to F) shown in Fig. 14 will be briefly described.

首先，在裝載對象體之後，將對象體移動至視覺檢查位置(A)，接下來檢測對象體的對齊狀態、旋轉及配置(B)。之後，移動至焊接位置(C)，從而藉由雷射加工裝置進行焊接(D)。接下來移動至卸載位置(E)進行卸載。當裝載下一個對象體(F)時，再次移動至視覺檢查位置(A)。另外，為了在雷射焊接之後檢查焊接的質量，顯然還可以添加移動至視覺檢查位置的選項。First, after loading the object body, the object body is moved to the visual inspection position (A), and then the alignment state, rotation, and arrangement (B) of the object body are detected. Thereafter, it is moved to the welding position (C) to be welded (D) by the laser processing apparatus. Next move to the uninstall location (E) to uninstall. When loading the next object body (F), move to the visual inspection position (A) again. In addition, in order to check the quality of the weld after laser welding, it is obviously also possible to add an option to move to the visual inspection position.

對第15圖所示的順序(A'至F')進行簡略的說明。首先，當將焊接後的對象體置於卸載位置(A')時，取出焊接後的對象體並將待焊接的對象體置於卸載位置(B')，之後將其移動至視覺檢查位置(C')。接下來檢測對象體的對齊狀態、旋轉及配置(D')。之後，移動至焊接位置(E')，並藉由雷射加工裝置進行焊接(F')。在此，作為可追加的選項，為了在雷射焊接之後檢查焊接的質量，可以添加將對象體移動至視覺檢查位置(position)的步驟，並且在針對對象體檢測對齊狀態、旋轉及配置之後，當對齊狀態、旋轉及配置異常時，可以添加移動至卸載位置而再次進行卸載及加載的選項。The order (A' to F') shown in Fig. 15 will be briefly described. First, when the welded object body is placed in the unloading position (A'), the welded object body is taken out and the object to be welded is placed in the unloading position (B'), and then moved to the visual inspection position ( C'). Next, the alignment state, rotation, and configuration (D') of the object body are detected. Thereafter, it is moved to the welding position (E') and welded (F') by the laser processing apparatus. Here, as an optional option, in order to check the quality of the welding after the laser welding, a step of moving the object to the visual inspection position may be added, and after the alignment state, the rotation, and the configuration are detected for the object, When the alignment state, rotation, and configuration are abnormal, you can add the option to move to the uninstall location and uninstall and load again.

藉由所述第14圖及第15圖說明的加工順序由控制部控制，藉由圖示概念圖的第17圖可以進行更具體的說明。焊接藉由加工部執行，並且加工部包括頭部110。頭部110可以包括雷射束集束光學焊接頭、焊球供應裝置中的一個以上。並且，加工部還可以包括排出焊球的管嘴。並且，控制部200可以判斷所述管嘴16的預定的狀態，即污染或損壞等狀態，從而決定清洗或更換時間，進而，控制部200可以記錄雷射器輸出並校正雷射器輸出。並且，藉由控制部的控制可以執行針對作為被焊接部分的焊料部的品質檢測，可以控制為丟棄或收集接合(bonding)測試時使用的焊球以及製造中存在缺陷的不良焊球。The processing sequence described by the fourteenth and fifteenth drawings is controlled by the control unit, and can be more specifically explained by the seventeenth diagram of the conceptual diagram. The welding is performed by the processing portion, and the processing portion includes the head portion 110. The head 110 may include one or more of a laser beam bundling optical soldering tip and a solder ball supply device. Also, the processing portion may further include a nozzle that discharges the solder balls. Further, the control unit 200 can determine the predetermined state of the nozzle 16, that is, the state of contamination or damage, thereby determining the cleaning or replacement time, and further, the control unit 200 can record the laser output and correct the laser output. Further, quality control for the solder portion as the soldered portion can be performed by the control of the control portion, and it is possible to control to discard or collect the solder balls used in the bonding test and the defective solder balls having defects in the manufacturing.

在上述的品質檢測過程中可以以未複合預定的品質標準的焊料部為對象再次照射雷射而使焊料部再次熔融，進而提高焊料的潤濕性，或者藉由再次溶解而去除並執行再次焊接。作為另一例，也可以藉由分類裝置150進行分類。控制部200可以執行校正雷射束位置、管嘴位置和視覺檢查位置的控制。並且，控制部200可以藉由雷射器的輸出、雷射器照射時間、雷射器照射次數及雷射器的輸出與照射時間之間的相關性的中斜率的組合確定的所述雷射的規範來控制執行焊接。In the above-described quality inspection process, it is possible to re-illuminate the solder portion for the solder portion which is not composited with the predetermined quality standard, thereby re-melting the solder portion, thereby improving the wettability of the solder, or removing and performing re-soldering by re-dissolving. . As another example, classification may be performed by the classification device 150. The control section 200 can perform control for correcting the position of the laser beam, the position of the nozzle, and the position of the visual inspection. And, the control unit 200 can determine the laser by a combination of a laser output, a laser irradiation time, a laser irradiation number, and a medium slope of a correlation between an output of the laser and an irradiation time. The specification to control the execution of the weld.

根據上述的雷射加工裝置及雷射加工方法，根據本發明的實施例的裝置乃至方法可以包括如下構成。另外，以下說明的檢查可以包括由第一檢查部120和第二檢查部130執行的第一檢查(pre-inspection)及第二檢查(post-inspection)。對於第一檢查(pre-inspection)而言，可以是檢查在執行焊接之前對對象體的安裝狀態，即包括旋轉及配置狀態的對齊狀態進行感測，對於第二檢查(post-inspection)而言，可以是在執行焊接之後感測焊料部的裂紋及孔隙(Pore)中一個以上的檢查。如同下文中的說明，根據第二檢查結果，可以對未滿足品質標準的對象體與滿足品質標準的對象體CM進行分類，並且針對未滿足品質標準的對象體CM還可以執行再次焊接(re-soldering)。According to the above-described laser processing apparatus and laser processing method, the apparatus or method according to an embodiment of the present invention may include the following constitution. In addition, the inspection described below may include a first inspection (pre-inspection) and a second inspection (post-inspection) performed by the first inspection section 120 and the second inspection section 130. For the first inspection (pre-inspection), it may be that the mounting state of the object body before the welding is performed, that is, the alignment state including the rotation and the configuration state is sensed, for the second inspection (post-inspection) It may be that one or more inspections of the cracks and pores of the solder portion are sensed after the soldering is performed. As explained below, according to the second inspection result, the object body that does not satisfy the quality standard can be classified with the object body CM that satisfies the quality standard, and the object body CM that does not satisfy the quality standard can also perform re-welding (re- Soldering).

第一，從雷射供應裝置供應的雷射器可以是根據焊料材質具有較高的雷射吸收率的波長的雷射器。並且，可以是光纖雷射器或二極體雷射器(Fiber Laser或Diode Laser)等固體雷射器。從雷射發生裝置產生的雷射束可以無需獨立的光學鏡而藉由光纖傳輸至雷射焊接頭。因此，能夠實現雷射的穩定供應及藉由雷射照射的焊接時的精密的操作。First, the laser supplied from the laser supply device may be a laser having a higher laser absorption rate depending on the solder material. Also, it may be a solid laser such as a fiber laser or a diode laser (Fiber Laser or Diode Laser). The laser beam generated from the laser generating device can be transmitted to the laser welding head by an optical fiber without a separate optical mirror. Therefore, it is possible to achieve stable supply of laser light and precise operation at the time of welding by laser irradiation.

第二，雷射加工裝置100可以包括包含雷射焊接管嘴16的拾取和放置焊接頭(Pick and Place Soldering Head)或者噴出焊接頭(Jet Soldering Head)。雷射焊接頭可以包括雷射束集束光學頭、焊球S供應裝置及管嘴16。在此，當雷射焊接頭表示頭部110時，不僅可以構成為單頭(single head)，還可以構成為包括兩個焊接頭的雙焊接頭(dual head)。不僅如此，當然也可以構成為包括三個以上焊接頭的焊接頭體。在包括兩個以上雷射焊接頭的情況下，能夠提高裝置的生產性。Second, the laser processing apparatus 100 can include a Pick and Place Soldering Head or a Jet Soldering Head that includes a laser welded nozzle 16. The laser welding head may include a laser beam bundling optical head, a solder ball S supply device, and a nozzle 16. Here, when the laser welding head indicates the head portion 110, it may be configured not only as a single head but also as a dual head including two welding heads. Not only that, but it is of course also possible to constitute a welded joint body comprising three or more welded joints. In the case where two or more laser welding heads are included, the productivity of the apparatus can be improved.

第三，可以包括視覺檢查模組(Vision Inspection Module/unit)或視覺檢查步驟。由於包括這樣的視覺檢查模組或視覺檢查步驟，能夠進行待焊接相機模組20的位置檢查、對齊狀態檢查等(第一檢查(Pre-Inspection))，並且根據需要，可以進行焊接後的焊接品質檢查(第二檢查(Post-Inspection))。Third, it may include a Vision Inspection Module/unit or a visual inspection step. By including such a visual inspection module or a visual inspection step, it is possible to perform position inspection, alignment state inspection, and the like (first inspection (Pre-Inspection)) of the camera module 20 to be welded, and welding can be performed after welding as needed. Quality inspection (Post-Inspection).

因此，1)可以安裝由低倍率和高倍率鏡頭組成的視覺檢查模組，或者2)可以安裝電動變焦鏡頭(Motorized Variable Zoom Lens, 1X ~ x18:最高倍率可以根據變焦鏡頭(Zoom Lens)的設計而更高)，進而能夠自動檢查低倍率至高倍率以及寬區域至窄區域。Therefore, 1) a visual inspection module consisting of low-magnification and high-magnification lenses can be installed, or 2) a motorized zoom lens (Motorized Variable Zoom Lens, 1X ~ x18 can be installed: the highest magnification can be designed according to the zoom lens (Zoom Lens) Higher), in turn, can automatically check low to high magnification and wide to narrow areas.

雖然也可以利用一個視覺檢查模組進行預檢查(Pre-Inspection)及後續檢查(Post-Inpsection)，但是為了提高生產性，可以構成為單獨的視覺檢查模組(例如，由一個預檢查(Pre-Inspection)功能用視覺檢查模組、一個後續檢查(Post-Inpsection)功能用視覺檢查模組構成)。Although it is also possible to perform a pre-inspection and a post-inpsection using a visual inspection module, in order to improve productivity, it may be configured as a separate visual inspection module (for example, by a pre-check (Pre The -Inspection function uses a visual inspection module and a Post-Inpsection function with a visual inspection module.

在利用一個視覺檢查模組進行預檢查(Pre-Inspection)及後續檢查(Post-Inpsection)的情況下，在經過預檢查(Pre-Inspection)的對象體移動至用於焊接的位置進行焊接之後，可以回到之前的位置而進行後續檢查(Post-Inpsection)。在視覺檢查模組由兩個構成，即由一個預檢查(Pre-Inspection)功能用視覺檢查模組和一個後續檢查(Post-Inpsection)功能用視覺檢查模組構成的情況下，對象體按預檢查(Pre-Inspection)模組和雷射焊接模組及後續檢查(Post-Inpsection)模組所在的位置依次移動並進行檢查及焊接。In the case of pre-inspection and post-inpsection using a visual inspection module, after the pre-inspection object body is moved to a position for soldering, You can go back to the previous location and perform a post-inpsection. In the case where the visual inspection module is composed of two, that is, a pre-inspection function using a visual inspection module and a post-inpsection function using a visual inspection module, the object body is pre-predicted. The position of the Pre-Inspection module and the laser welding module and the Post-Inpsection module are sequentially moved and inspected and welded.

進而，為了實時監控焊接品質而控制參數或者進行針對焊接後的區域的內部裂紋、孔隙(Pore)的檢查等後續檢查(Post-Inpsection)，還可以包括紅外線(Infra-red)檢查裝置。Further, in order to monitor the welding quality in real time, control parameters or perform post-inspection of internal cracks and inspection of pores in the region after welding, an infrared (Infra-red) inspection device may be included.

第四，還可以包括能夠對不符合所述後續檢查(Post-Inpsection)之後要求的焊接品質標準的對象體進行分類的分類(Sorting)裝置。Fourth, it may also include a sorting device capable of classifying a subject that does not meet the welding quality standard required after the post-inpsection.

第五，還可以包括能夠對不符合所述後續檢查(Post-Inpsection)之後要求的焊接品質標準的對象體進行修理的修理裝置。這樣的修理裝置可以照射雷射而使焊料部再次熔融，進而提高焊料潤濕性，或者去除已焊接的焊料並執行再次焊接(Resoldering)。在去除已焊接的焊料時，可以使用諸如銷(Pin)等機械的工具而自動去除，或者可以利用雷射使其再次熔解(remelting)並吸入而自動去除。Fifth, it is also possible to include a repairing device capable of repairing a target body that does not meet the welding quality standard required after the post-inpsection. Such a repair device can irradiate a laser to re-melt the solder portion, thereby improving solder wettability, or removing the soldered solder and performing resoldering. When the solder to be soldered is removed, it may be automatically removed using a mechanical tool such as a pin, or may be automatically removed by laser remelting and inhaling.

第六，為了管理焊接(Soldering)後的品質，還可以包括包含用於去除灰塵及異物的集塵裝置的清潔裝置(Cleaning Device)400。此外還可以包括乾燥空氣吹送(Dry Air Blowing)裝置、二氧化碳雪清潔(CO2 Snow Cleaning)裝置及惰性氣體吹送裝置中的一個以上的裝置。Sixth, in order to manage the quality after soldering, a cleaning device 400 including a dust collecting device for removing dust and foreign matter may be included. Further, one or more of a Dry Air Blowing device, a CO 2 Snow Cleaning device, and an inert gas blowing device may be included.

第七，還可以包括根據需要焊接的器材種類而預先進行焊接的預焊接部111。並且，可以額外地包括雷射焊接頭(Soldering Head)而最大限度地提高焊接質量並提高生產性。Seventh, it is also possible to include a pre-welded portion 111 that is previously welded according to the type of equipment to be welded. Also, a Soldering Head can be additionally included to maximize the quality of the weld and improve productivity.

雖然在上述的實施例中未進行說明，但是在也可以使用於不需要熔接材料(焊球S(Solder Ball))的接合。即，作為熔接材料的焊球S的供應可以是選擇性的，在不供應焊球S的雷射加工裝置中，也可以應用於金屬之間的接合(bonding)、金屬與樹脂之間的接合(bonding)及塑料熔接等。根據被照射雷射的對象體的性質，可以使雷射的照射強度、照射時間及照射週期等條件不同而執行兩種母材的接合(bonding)。Although not described in the above embodiments, it is also possible to use a bonding that does not require a solder material (Solder Ball S). That is, the supply of the solder ball S as a fusion material may be selective, and in a laser processing apparatus that does not supply the solder ball S, it may be applied to bonding between metals and bonding between metal and resin. (bonding) and plastic welding. Bonding of the two base materials can be performed depending on the nature of the target body to be irradiated by the laser, such as the irradiation intensity of the laser, the irradiation time, and the irradiation period.

進而，作為一實施例，若對圖示夾具30形態的第16圖及額外的雷射加工方法及裝置進行說明，則雷射加工裝置中還可以包括多個上述的管嘴16。即，焊球S藉由漏盤8供應至管嘴16側時，可以與多個管嘴16對應地藉由漏盤8供應焊球S。即，並非選擇性地提供至多個管嘴16中的一個管嘴16，而是可以執行同時供應的動作。例如，根據上述的動作，焊球S被供應至雙焊接頭(dual laser bonding head)側並借助於雷射熔解之後，可以藉由排出氮氣而從所述焊接頭排出。由於這樣的過程可以在兩個焊接頭同時進行，因此能夠縮短焊接時間。作為一例，配置雙焊接頭(dual laser bonding head)的裝置由於配置有更多數量的焊接頭，因此自然能夠增進作業效率。Further, as an embodiment, a sixteenth diagram of the illustrated jig 30 and an additional laser processing method and apparatus will be described. The laser processing apparatus may further include a plurality of the nozzles 16 described above. That is, when the solder ball S is supplied to the nozzle 16 side by the leaky disk 8, the solder ball S can be supplied by the drain disk 8 corresponding to the plurality of nozzles 16. That is, it is not selectively provided to one of the plurality of nozzles 16, but an action of simultaneous supply can be performed. For example, according to the above-described action, the solder ball S is supplied to the side of the dual laser bonding head and after being melted by means of the laser, it can be discharged from the soldering head by discharging nitrogen gas. Since such a process can be performed simultaneously on the two welding heads, the welding time can be shortened. As an example, since the device for arranging a dual laser bonding head is provided with a larger number of welding heads, it is naturally possible to improve work efficiency.

並且，雷射加工裝置還可以包括夾具(jig)。所述夾具可以是以旋轉型移動方式移動的夾具(rotating fixture jig)。可以配置有包括多個採用所述旋轉型移動方式的夾具的夾具部(fixture jig channel)。例如，可以配備結合三個以上以旋轉型移動方式移動的夾具而配置的夾具部(fixture jig channel)。在這樣的夾具部(fixture jig channel)可以包括或安裝多個待執行焊接作業的對象體。在此，在對對象體的兩個以上的點分別執行焊接及接合(bonding)中一種以上的作業時，若對存在於一個對象體的所述兩個點中一個點執行焊接或接合(bonding)作業，則夾具可以移動，使得能夠對存在於對象體的兩個點中剩餘的點執行雷射加工。在此，所述夾具的所述移動可以是旋轉，並且也可以是藉由直線運動的移動，也可以是藉由所述旋轉及直線運動的組合的移動。若所述移動結束，則可以對所述剩餘的點執行焊接或接合(bonding)。Also, the laser processing apparatus may further include a jig. The jig may be a rotating fixture jig that is moved in a rotary type. A fixture jig channel including a plurality of jigs employing the rotary type of movement can be disposed. For example, a fixture jig channel configured in combination with three or more jigs that move in a rotary type of movement may be provided. In such a fixture jig channel, a plurality of object bodies to be subjected to a welding operation may be included or installed. Here, when one or more operations in welding and bonding are performed on two or more points of the object body, welding or bonding is performed on one of the two points existing in one object body. The job can move the jig so that laser processing can be performed on the remaining points existing in the two points of the object body. Here, the movement of the jig may be a rotation, and may also be a movement by a linear motion or a combination of the rotation and the linear motion. If the movement ends, welding or bonding can be performed on the remaining points.

作為具體的示例，第一焊接頭(laser bonding head 1)可以在第一夾具部(fixture jig channel 1)上執行接合(bonding)，第二焊接頭(laser bonding head 2)可以在第三夾具部(fixture jig channel 3)上執行接合(bonding)。As a specific example, the first bonding head 1 may perform bonding on a first jig channel 1 and the second bonding head 2 may be in a third jig part Bonding is performed on (fixture jig channel 3).

若焊接頭(第一焊接頭及第二焊接頭)在各個位置完成接合(bonding)，則第一焊接頭可以在第二夾具部上執行接合(bonding)作業。If the bonding heads (the first bonding head and the second bonding head) are bonded at various positions, the first bonding head can perform a bonding operation on the second jig portion.

並且，若所述第一夾具部位於脫離雷射照射位置的卸載位置，則完成接合作業的對象體可以被取出。在取出對象體的第一夾具部上可以放置新的對象體而等待接合作業。Further, if the first jig portion is located at an unloading position away from the laser irradiation position, the object to be joined can be taken out. A new object body can be placed on the first jig portion of the object to be taken out and wait for the joining operation.

若針對位於第三夾具部的對象體的接合作業完成，則所述對象體可以被取出，並且在取出對象體的第三夾具部上可以配置新的對象體而準備進行接合作業。When the joining work for the object body located in the third jig portion is completed, the object body can be taken out, and a new object body can be placed on the third jig portion of the object to be taken out to prepare the joining work.

若第一焊接頭針對位於第二夾具部上的對象體的接合作業完成，則第一焊接頭可以對位於第一夾具部上的對象體執行接合作業。If the joining work of the first welding head with respect to the object body located on the second jig portion is completed, the first welding head can perform the joining work on the object body located on the first jig portion.

並且，若所述第二夾具部位於所述卸載位置，則完成接合作業的對象體可以被取出，並且在第二夾具部上放置新的對象體而等待接合作業。Further, if the second jig portion is located at the unloading position, the object body that has completed the joining work can be taken out, and a new object body is placed on the second jig portion to wait for the joining work.

若第二焊接頭針對位於第三夾具部上的對象體的接合作業完成，則第二焊接頭可以針對第二夾具部執行接合作業。可以反復執行所述接合作業並進行雷射加工。If the joining work of the second welding head with respect to the object body located on the third jig portion is completed, the second welding head can perform the joining work for the second jig portion. The joining operation can be repeatedly performed and laser processing can be performed.

更具體而言，在裝載或卸載位置，配置有多個對象體的各個夾具30可以安裝於第一夾具部。並且，在裝載或卸載的位置，配置有多個對象體的各個夾具可以安裝於第二夾具部。並且，在裝載或卸載的位置，配置有多個對象體的各個夾具可以安裝於第三夾具部。More specifically, in the loading or unloading position, each of the jigs 30 in which a plurality of object bodies are disposed may be attached to the first jig portion. Further, at the loading or unloading position, each jig in which a plurality of object bodies are disposed may be attached to the second jig portion. Further, at the position where the object is loaded or unloaded, each jig in which a plurality of object bodies are disposed may be attached to the third jig portion.

若第一夾具部位於接合作業的位置，則視覺檢查(inspection)單元(vision inspection unit)可以檢查待作業的對象體的對齊狀態、旋轉、配置等的正常操作與否。If the first grip portion is at the position of the joining work, the vision inspection unit can check the normal operation of the alignment state, rotation, configuration, and the like of the object to be worked.

第一雷射頭可以接合形成於在第一夾具部上配置的各個對象體的接合面。在第一夾具部執行接合作業的期間內，視覺檢查單元(vision inspection unit)可以檢查配置於第三夾具部的各個對象體的對齊狀態、旋轉、配置等的正常操作與否。The first laser head may engage a joint surface formed on each of the object bodies disposed on the first clamp portion. During the execution of the joining operation by the first jig portion, the vision inspection unit can check the normal operation of the alignment state, rotation, arrangement, and the like of the respective object bodies disposed in the third jig portion.

第二雷射頭可以接合形成於在第二夾具部上配置的各個對象體的接合面。若配置於第一夾具部上的各個對象體的一面的接合作業結束，則第一夾具部所包括的各個夾具可以移動至另一面的接合作業位置。所述移動可以是旋轉移動。The second laser head may engage a joint surface formed on each of the object bodies disposed on the second clamp portion. When the joining operation of one surface of each of the object bodies disposed on the first jig portion is completed, each of the jigs included in the first jig portion can be moved to the joining work position on the other side. The movement can be a rotational movement.

在配置於第三夾具部的對象體執行接合作業的期間，視覺檢查(inspection)單元(vision inspection unit)可以檢查位於第一夾具部上的各個對象體的對齊狀態、配置等。While the target body disposed in the third jig portion performs the bonding work, the vision inspection unit can check the alignment state, arrangement, and the like of the respective object bodies located on the first jig portion.

並且，可以接合借助於第一焊接頭移動配置的第一夾具部上的對象體的另一面。若接合作業結束，則第一夾具部可以移動至卸載位置。若接合作業結束，則第一夾具部上的對象體可以被取出，從而新的對象體可以配置於第一夾具部上。And, the other face of the object body on the first jig portion that is moved by the first welding head can be joined. If the joining operation is completed, the first clamp portion can be moved to the unloading position. When the joining operation is completed, the object body on the first jig portion can be taken out, so that the new object body can be disposed on the first jig portion.

若配置於第三夾具部的各個對象體的接合的兩個面中一個面完成接合作業，則第三夾具部所包括的各個夾具可以移動至另一面的接合作業位置。When one of the two faces of the joint of the respective target bodies disposed in the third jig portion completes the joining work, the respective jigs included in the third jig portion can be moved to the joining work position on the other side.

之後，視覺檢查單元(vision inspection unit)可以檢查借助第三夾具部旋轉的各個對象體的對齊狀態、配置等。並且，第二焊接頭可以接合配置於第三夾具部上的各個對象體的另一面。Thereafter, the vision inspection unit can check the alignment state, arrangement, and the like of the respective object bodies rotated by the third clamp portion. Further, the second welding head may engage the other surface of each of the object bodies disposed on the third clamp portion.

在第二夾具部對位於第三夾具部上的對象體進行接合作業的期間內，視覺檢查(inspection)單元(vision inspection unit)可以檢查配置於第二夾具部的各個對象體的對齊狀態、旋轉、配置等。During a joining operation of the object body located on the third jig portion by the second jig portion, a vision inspection unit can check the alignment state and rotation of each object body disposed in the second jig portion. , configuration, etc.

第一焊接頭可以接合配置於第二夾具部的各個對象體的一面，配置有新的待進行接合作業的對象體的第一夾具部可以一直等待直到第二夾具部的作業結束為止。因此，之後的作業過程可以反復上述的過程。The first welding head can engage one surface of each of the object bodies disposed on the second clamp portion, and the first clamp portion of the object body on which the new bonding work is to be placed can wait until the operation of the second clamp portion ends. Therefore, the subsequent process can repeat the above process.

作業結束的夾具部(fixture jig channel)的各個對象體可以通過一個或兩個視覺檢查(inspection)模塊/單元(vision inspection module/unit)執行接合品質檢查(第二檢查(post-inspection))。Each object body of the fixture jig channel can perform a joint quality check (post-inspection) through one or two vision inspection modules/units.

另外，在管嘴16藉由氮氣等氣體進行加壓而將位於內側的熔接材料(焊球S(Solder Ball))排出的過程中，管嘴16的內側面，即與熔解的熔接材料接觸的管嘴16的內側面可能受污染。所述污染可以包括未能排出而殘留並固著的熔接材料、在由於熔接材料熔解時的溫度造成熱損傷的過程中產生的異物以及由於反復排出氣體(氮氣等)而產生於表面的異物等。若所述異物等累積，則對雷射加工效率產生影響而存在導致負面結果的可能性。因此，藉由檢查管嘴16的狀態及品質的過程，需要以預設週期或間歇性地去除(cleaning)該污染，在測量污染程度而在到達預設污染水平時，或者在以預設的單位時間為標準而確定的週期，移動至清洗區域而進行清洗或者在未配置對象體的狀態下藉由管嘴清洗單元(nozzle cleaning unit)去除異物及粉塵等。可以藉由物理或化學等方法清洗(cleaning)，並且作為執行該清洗的構成，可以包括視覺單元(vision unit)、管嘴16監視器(nozzle monitor)。Further, in the process in which the nozzle 16 is pressurized by a gas such as nitrogen gas to discharge the welding material (solder ball S) located inside, the inner side surface of the nozzle 16 is in contact with the molten welding material. The inner side of the nozzle 16 may be contaminated. The contamination may include a fusion material that remains and is fixed without being discharged, a foreign matter generated in a process of thermal damage due to a temperature at which the fusion material is melted, and a foreign matter generated on the surface due to repeated discharge of a gas (nitrogen or the like). . If the foreign matter or the like is accumulated, there is an influence on the laser processing efficiency and there is a possibility of causing a negative result. Therefore, by examining the state and quality of the nozzle 16, it is necessary to clean the contamination in a preset cycle or intermittently, when measuring the degree of contamination while reaching a preset pollution level, or at a predetermined The cycle defined by the standard unit time is moved to the cleaning area to be cleaned or the foreign matter, dust, and the like are removed by a nozzle cleaning unit in a state where the target body is not disposed. The cleaning may be performed by physical or chemical means, and as a configuration for performing the cleaning, a vision unit, a nozzle monitor, or a nozzle monitor may be included.

進而，當以對應於雷射加工程度的預設雷射照射強度照射雷射時，可以藉由雷射強度(能量、輸出)檢測單元(laser power(energy) detection unit)檢查照射的實際雷射強度(laser power; energy)，並在與所述預設雷射照射強度產生差異的情況下，調整雷射強度，以補正所述差異。因此，控制部(未圖示)與雷射強度(能量、輸出)檢測單元(laser power(energy) detection unit)相互連接而基於從雷射強度(能量、輸出)檢測單元(laser power(energy) detection unit)接收的訊息與預設雷射強度進行比較，進而增加/減小照射的雷射的強度。Further, when the laser is irradiated with a predetermined laser irradiation intensity corresponding to the laser processing degree, the actual laser irradiation can be inspected by a laser power (energy) detection unit (laser power (energy) detection unit) The laser power is adjusted and the laser intensity is adjusted to correct the difference in the case of a difference from the predetermined laser irradiation intensity. Therefore, the control unit (not shown) and the laser power (energy) detection unit are connected to each other based on the laser power (energy, output) detection unit (laser power (energy)) The detection unit compares the received laser intensity with the preset laser intensity to increase/decrease the intensity of the illuminated laser.

並且，雷射加工裝置還可以包括丟棄或收集接合(bonding)測試時使用的焊球S及製造時存在缺陷的不良焊球S的廢棄焊球收集單元(waster ball collecting unit)。例如，藉由廢棄焊球收集單元(waster ball collecting unit)，還可以在從焊球S供應至雷射加工裝置之後到排出之前移動的過程中進行收集，進而廢棄。Further, the laser processing apparatus may further include a waste ball collecting unit that discards or collects the solder ball S used in the bonding test and the defective solder ball S which is defective in manufacturing. For example, by the waste ball collecting unit, it is also possible to collect and then discard it during the process from the supply of the solder ball S to the laser processing apparatus to the movement before the discharge.

另外，還包括用於校正雷射束(laser beam)位置、管嘴16(nozzle)位置及視覺檢查(vision inspection)位置的校準板(calibration plate)，與所述控制部(未圖示)連接的校準板(calibration plate)可以即刻感測雷射束(laser beam)、管嘴16(nozzle)及視覺檢查(vision inspection)的絕對坐標及相對坐標中的一個以上的訊息，從而藉由與預設於控制部的設定值進行比較，進而補正與所述預設的設定值之間的差異而將雷射束(laser beam)的位置、管嘴16(nozzle)的位置及視覺檢查(vision inspection)的位置移動，以收斂於所述預設的設定值。進而，在不位於預設的值的情況下，不執行雷射照射步驟，從而能夠防止發生與雷射照射相關的誤操作。In addition, a calibration plate for correcting the position of the laser beam, the position of the nozzle 16 and the position of the vision inspection is also included, and is connected to the control unit (not shown). The calibration plate can instantly sense more than one of the absolute and relative coordinates of the laser beam, the nozzle 16 and the vision inspection, thereby The set values provided in the control unit are compared, and the difference between the preset value and the preset set value is corrected to adjust the position of the laser beam, the position of the nozzle 16 and the visual inspection (vision inspection) The position moves to converge to the preset set value. Further, in the case where it is not located at the preset value, the laser irradiation step is not performed, so that an erroneous operation related to the laser irradiation can be prevented from occurring.

以上，藉由代表性的實施例而對本發明進行了詳細的說明，但是在本發明所屬的技術領域中具有通常知識的人可以理解，針對上述的實施例，在不超過本發明的範圍的限度內能夠實現多樣的變形。因此，本發明的權利範圍不能局限於所說明的實施例，應當根據申請專利範圍以及與申請專利範圍記載的範圍等同的範圍來確定。Hereinabove, the present invention has been described in detail by way of a representative embodiment, but those having ordinary knowledge in the technical field to which the present invention pertains can understand that the above-described embodiments are not limited to the scope of the present invention. A variety of deformations can be achieved within. Therefore, the scope of the invention is not limited to the illustrated embodiments, and should be determined in accordance with the scope of the claims and the scope equivalent to the scope of the claims.

1‧‧‧蓋1‧‧‧ Cover

2‧‧‧焊球入口2‧‧‧ solder ball entrance

3‧‧‧存儲腔室3‧‧‧Storage chamber

4、11‧‧‧氮氣入口4, 11‧‧‧ nitrogen inlet

5‧‧‧焊球出口端5‧‧‧ solder ball exit end

6‧‧‧旋轉軸6‧‧‧Rotary axis

7‧‧‧適配器7‧‧‧Adapter

8‧‧‧漏盤8‧‧‧ leaking disk

9‧‧‧傳輸端口9‧‧‧Transport port

10‧‧‧接收端口10‧‧‧ Receiving port

12‧‧‧焊球出口通道12‧‧‧ solder ball exit channel

13‧‧‧透明玻璃13‧‧‧clear glass

14‧‧‧雷射傳輸通道14‧‧‧Laser transmission channel

15‧‧‧防鬆鎖緊螺釘15‧‧‧Anti-locking screws

16‧‧‧管嘴16‧‧‧ nozzle

17‧‧‧上部基座17‧‧‧Upper pedestal

18‧‧‧下部基座18‧‧‧Lower base

20‧‧‧相機模組20‧‧‧ camera module

21‧‧‧透鏡模組21‧‧‧ lens module

22‧‧‧圖像感測器模組22‧‧‧Image Sensor Module

30‧‧‧夾具30‧‧‧Clamp

100‧‧‧雷射加工裝置100‧‧‧ Laser processing equipment

110‧‧‧頭部110‧‧‧ head

111‧‧‧預焊接部111‧‧‧Pre-welding department

120‧‧‧第一檢查部120‧‧‧First Inspection Department

130‧‧‧第二檢查部130‧‧‧Second Inspection Department

140‧‧‧移動部140‧‧‧Mobile Department

150‧‧‧分類裝置150‧‧‧Classification device

200‧‧‧控制部200‧‧‧Control Department

300‧‧‧夾具300‧‧‧ fixture

400‧‧‧清潔裝置400‧‧‧ cleaning device

CM‧‧‧對象體CM‧‧‧ object body

CD‧‧‧冷卻CD‧‧‧cooling

PH1‧‧‧預熱PH1‧‧‧ preheating

PH2‧‧‧後熱PH2‧‧‧post heat

S‧‧‧焊球S‧‧‧ solder balls

第1圖是示出根據本發明的實施例的相機模組的圖。FIG. 1 is a diagram showing a camera module according to an embodiment of the present invention.

第2圖及第3圖是示出根據本發明的實施例的雷射加工方法的圖。2 and 3 are views showing a laser processing method according to an embodiment of the present invention.

第4圖是示出根據本發明的一實施例的作為焊接對象體的相機模組的圖。Fig. 4 is a view showing a camera module as a welding target body according to an embodiment of the present invention.

第5圖是示出根據本發明的一實施例的加熱步驟的圖。Fig. 5 is a view showing a heating step according to an embodiment of the present invention.

第6圖是示出根據本發明的一實施例的焊球藉由管嘴而移動的情形的圖。Fig. 6 is a view showing a state in which a solder ball is moved by a nozzle according to an embodiment of the present invention.

第7圖是示出根據本發明的一實施例的雷射的圓錐角度及波長的圖。Fig. 7 is a view showing a cone angle and a wavelength of a laser according to an embodiment of the present invention.

第8圖是示出根據本發明的一實施例的雷射能量輸出的圖。Figure 8 is a diagram showing laser energy output in accordance with an embodiment of the present invention.

第9圖是示出在根據本發明的一實施例的相機製造步驟中採用的音圈馬達(VCM：Voice Coil Motor)焊接(Soldering)裝置的圖。Fig. 9 is a view showing a voice coil motor (VCM: Voice Coil Motor) welding device employed in a camera manufacturing step according to an embodiment of the present invention.

第10圖是示出根據本發明的一實施例的在端子的連接中利用焊接的圖。Fig. 10 is a view showing the use of welding in the connection of terminals in accordance with an embodiment of the present invention.

第11圖是示出根據根據本發明的一實施例的焊接接合的圖。Figure 11 is a diagram showing a solder joint in accordance with an embodiment in accordance with the present invention.

第12圖是示出根據本發明的一實施例的包括管嘴的雷射加工裝置的圖。Fig. 12 is a view showing a laser processing apparatus including a nozzle according to an embodiment of the present invention.

第13圖是放大示出根據本發明的一實施例的管嘴的剖面的圖。Figure 13 is a view showing, in an enlarged manner, a cross section of a nozzle according to an embodiment of the present invention.

第14圖及第15圖是示出根據本發明的一實施例的焊接方法的圖。14 and 15 are views showing a welding method according to an embodiment of the present invention.

第16圖是示出根據本發明的一實施例的夾具的圖。Figure 16 is a view showing a jig according to an embodiment of the present invention.

第17圖是示出根據本發明的一實施例的雷射加工裝置的圖。Figure 17 is a view showing a laser processing apparatus according to an embodiment of the present invention.

Claims (31)

一種雷射加工方法，其包括以下步驟： 將對象體裝載在夾具； 對裝載於該夾具的該對象體的包括旋轉及配置的對齊狀態進行感測及第一檢查； 將該夾具移動至焊接位置； 藉由雷射器對該對象體進行焊接；以及 卸載該焊接後的該對象體， 其中，為了檢查該焊接的品質，能夠移動該對象體而藉由檢查部選擇性地執行第二檢查。A laser processing method comprising the steps of: loading a target body in a jig; sensing and first checking an alignment state of the object body including rotation and configuration loaded on the jig; moving the jig to a welding position The target body is welded by a laser; and the welded object is unloaded. In order to check the quality of the welding, the object can be moved and the second inspection can be selectively performed by the inspection unit. 如申請專利範圍第1項所述之雷射加工方法，其中該品質的檢測藉由視覺檢查執行。The laser processing method of claim 1, wherein the detecting of the quality is performed by visual inspection. 如申請專利範圍第1項所述之雷射加工方法，其中該品質的檢查是感測檢查是否發生焊接區域的內部裂紋及孔隙的檢查。The laser processing method according to claim 1, wherein the inspection of the quality is an inspection to detect whether an internal crack and a void of the welded region occur. 如申請專利範圍第1項所述之雷射加工方法，其中該雷射器是包括光纖雷射器及二極體雷射器中一種以上的固體雷射器。The laser processing method of claim 1, wherein the laser is one or more solid lasers including a fiber laser and a diode laser. 如申請專利範圍第1項所述之雷射加工方法，其中該焊接的步驟藉由雷射束集束光學頭、焊球供應裝置以及包括管嘴的焊接頭執行。The laser processing method of claim 1, wherein the step of soldering is performed by a laser beam bundling optical head, a solder ball supply device, and a soldering tip including a nozzle. 如申請專利範圍第1項所述之雷射加工方法，其中該焊接的步驟藉由包括一個以上的焊接頭的拾取和放置焊接頭或者噴出焊接頭執行。The laser processing method of claim 1, wherein the step of soldering is performed by picking up and placing a soldering tip or ejecting a soldering tip including more than one soldering tip. 如申請專利範圍第1項所述之雷射加工方法，其中該焊接的步驟還包括如下的步驟：檢查排出焊球的管嘴的預定的狀態及品質而進行清洗或更換。The laser processing method of claim 1, wherein the step of soldering further comprises the step of: inspecting a predetermined state and quality of the nozzle for discharging the solder ball for cleaning or replacement. 如申請專利範圍第1項所述之雷射加工方法，其中該焊接的步驟還包括如下的步驟：記錄該雷射器的輸出並校正該雷射器的輸出。The laser processing method of claim 1, wherein the step of soldering further comprises the step of recording the output of the laser and correcting the output of the laser. 如申請專利範圍第1項所述之雷射加工方法，其中藉由該檢查部進行的檢查步驟能夠在執行該焊接的步驟的同時執行。The laser processing method according to claim 1, wherein the inspection step by the inspection portion can be performed at the same time as the step of performing the welding. 如申請專利範圍第1項所述之雷射加工方法，其中該品質的檢查步驟包括如下的步驟：丟棄或收集接合測試時使用的焊球以及製造中存在缺陷的不良焊球。The laser processing method of claim 1, wherein the quality inspection step comprises the steps of discarding or collecting the solder balls used in the bonding test and the defective solder balls having defects in the manufacturing. 如申請專利範圍第1項所述之雷射加工方法，其進一步包括如下的步驟：在該第二檢查之後，根據預定的品質標準對該對象體進行分類。The laser processing method of claim 1, further comprising the step of classifying the object body according to a predetermined quality criterion after the second inspection. 如申請專利範圍第1項所述之雷射加工方法，其中還包括如下的步驟：對藉由該第二檢查而不符合預定的品質標準的焊料部照射雷射而使其熔融，進而提高焊料潤濕性，或者藉由再次熔解去除並再次焊接。The laser processing method according to claim 1, further comprising the step of: melting the solder portion which is not in conformity with a predetermined quality standard by the second inspection to melt the solder, thereby increasing the solder Wettability, or removed by re-melting and soldering again. 如申請專利範圍第1項所述之雷射加工方法，其進一步包括如下步驟：清潔步驟，用於在該第二檢查步驟之後去除灰塵及異物，其中在該清潔步驟中執行乾燥空氣吹送、二氧化碳雪清潔及惰性氣體吹送中一種以上。The laser processing method of claim 1, further comprising the step of: removing a dust and a foreign matter after the second inspection step, wherein the drying air blowing, carbon dioxide is performed in the cleaning step More than one of snow cleaning and inert gas blowing. 如申請專利範圍第1項所述之雷射加工方法，其中對該對象體執行的焊接包括後續焊接及預焊接。The laser processing method of claim 1, wherein the welding performed on the object body includes subsequent welding and pre-welding. 如申請專利範圍第1項所述之雷射加工方法，其中在該焊接執行步驟中，包括：用於校正雷射束位置、排出焊球的管嘴位置及視覺檢查位置中的一種以上的步驟。The laser processing method of claim 1, wherein the step of performing the welding includes: one or more steps of correcting a position of the laser beam, a nozzle position at which the solder ball is discharged, and a visual inspection position. . 一種雷射加工裝置，其包括： 控制部； 夾具，裝載對象體； 第一檢查部，對裝載於該夾具的該對象體的包括旋轉及配置的對齊狀態進行感測及第一檢查； 移動部，將該對象體裝載到該夾具或者從該夾具卸載該對象體； 加工部，藉由雷射器對該對象體進行焊接；以及 第二檢查部，藉由該控制部的控制以該對象體為對象選擇性地執行第二檢查。A laser processing apparatus comprising: a control unit; a jig, a loading object; and a first inspection unit that senses and first checks an alignment state of the object body including rotation and arrangement of the object; Loading or unloading the object onto the jig; the processed portion is welded to the object by a laser; and the second inspection portion is controlled by the control portion A second check is selectively performed for the object. 如申請專利範圍第16項所述之雷射加工裝置，其中該第二檢查藉由視覺檢查執行。The laser processing apparatus of claim 16, wherein the second inspection is performed by visual inspection. 如申請專利範圍第16項所述之雷射加工裝置，其中該第二檢查是感測檢查是否發生焊接區域的內部裂紋及孔隙的檢查。The laser processing apparatus of claim 16, wherein the second inspection is to inspect an inspection of whether internal cracks and voids in the welded area occur. 如申請專利範圍第16項所述之雷射加工裝置，其中該雷射器是包括光纖雷射器及二極體雷射器中一種以上的固體雷射器。The laser processing apparatus of claim 16, wherein the laser is one or more solid lasers including a fiber laser and a diode laser. 如申請專利範圍第16項所述之雷射加工裝置，其中藉由該控制部執行焊接，該加工部包括雷射束集束光學頭、焊球供應裝置以及用於排出焊球的包含管嘴的焊接頭。The laser processing apparatus of claim 16, wherein the welding is performed by the control portion, the processing portion including a laser beam bundling optical head, a solder ball supply device, and a nozzle including a nozzle for discharging the solder ball Welding head. 如申請專利範圍第16項所述之雷射加工裝置，其中該焊接步驟藉由雷射焊接管嘴執行，該雷射焊接管嘴包含一個以上的焊接頭的拾取和放置焊接頭或者噴出焊接頭。The laser processing apparatus of claim 16, wherein the welding step is performed by a laser welding nozzle comprising more than one welding head for picking and placing a welding head or a welding joint . 如申請專利範圍第16項所述之雷射加工裝置，其中該控制部檢查排出焊球的管嘴的預定的狀態及品質而控制進行清洗或更換。The laser processing apparatus according to claim 16, wherein the control unit controls the predetermined state and quality of the nozzle for discharging the solder ball to control cleaning or replacement. 如申請專利範圍第16項所述之雷射加工裝置，其中該控制部記錄該雷射器的輸出並校正該雷射器的輸出。The laser processing apparatus of claim 16, wherein the control portion records an output of the laser and corrects an output of the laser. 如申請專利範圍第16項所述之雷射加工裝置，其中藉由該第二檢查部進行的檢查與該焊接同時執行。The laser processing apparatus according to claim 16, wherein the inspection by the second inspection unit is performed simultaneously with the welding. 如申請專利範圍第16項所述之雷射加工裝置，其中藉由控制該控制部，該品質的檢查被控制為丟棄或收集接合測試時使用的焊球以及製造中存在缺陷的不良焊球。The laser processing apparatus according to claim 16, wherein by controlling the control portion, the inspection of the quality is controlled to discard or collect the solder balls used in the bonding test and the defective solder balls having defects in the manufacturing. 如申請專利範圍第16項所述之雷射加工裝置，其進一步包括：分類裝置，在該第二檢查之後，根據預定的品質標準對該對象體進行分類。The laser processing apparatus of claim 16, further comprising: a sorting device, after which the object is classified according to a predetermined quality criterion. 如申請專利範圍第16項所述之雷射加工裝置，其中藉由該控制部的控制，將藉由該第二檢查而不符合預定的品質標準的焊料部為對象，照射雷射而使其熔融，進而提高焊料潤濕性，或者藉由再次熔解去除並執行再次焊接。The laser processing apparatus according to claim 16, wherein the laser portion irradiated by the second inspection without conforming to a predetermined quality standard is controlled by the control unit Melting, thereby improving solder wettability, or removing by re-melting and performing re-soldering. 如申請專利範圍第16項所述之雷射加工裝置，其進一步包括：清潔裝置，用於在該第二檢查步驟之後去除灰塵及異物，其中該清潔裝置包括提供乾燥空氣的吹送裝置、二氧化碳雪清潔裝置及惰性氣體吹送裝置中一種以上。The laser processing apparatus of claim 16, further comprising: a cleaning device for removing dust and foreign matter after the second inspection step, wherein the cleaning device comprises a blowing device for providing dry air, carbon dioxide snow One or more of the cleaning device and the inert gas blowing device. 如申請專利範圍第16項所述之雷射加工裝置，其進一步包括預焊接部，在對該對象體執行後續焊接之前執行預焊接。The laser processing apparatus of claim 16, further comprising a pre-welding portion that performs pre-welding before performing subsequent welding on the object body. 如申請專利範圍第16項所述之雷射加工裝置，其中該控制部執行校正雷射束位置、管嘴位置及視覺檢查位置的控制。The laser processing apparatus according to claim 16, wherein the control unit performs control for correcting the position of the laser beam, the position of the nozzle, and the position of the visual inspection. 如申請專利範圍第16項所述之雷射加工裝置，其中該控制部藉由該雷射器的輸出、雷射照射時間、雷射照射次數及該雷射器的輸出與該雷射照射時間之間的相關性中的斜率的組合確定的雷射規範執行。The laser processing apparatus of claim 16, wherein the control unit has an output of the laser, a laser irradiation time, a number of laser irradiations, and an output of the laser and the laser irradiation time. The combination of slopes in the correlation is determined by the execution of the laser specification.
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