TW201811708A - Optical coating method, apparatus and product - Google Patents

Abstract

This disclosure is directed to an improved process for making glass articles having optical coating and easy-to clean coating thereon, an apparatus for the process and a product made using the process. In particular, the disclosure is directed to a process in which the application of the optical coating and the easy-to-clean coating can be sequentially applied using a single apparatus. Using the combination of the coating apparatus and the substrate carrier described herein results in a glass article having both optical and easy-to-clean coating that have improved scratch resistance durability and optical performance, and in addition the resulting articles are "shadow free".

Description

光學鍍膜的方法、裝置及產品Optical coating method, device and product

本申請案係2012年11月30日提出申請之美國非臨時專利申請案第13/690829號，標題為「光學鍍膜方法、裝置及產品（Optical Coating Method, Apparatus and Product）」之部分連續案，其主張於2012年10月4日提出申請的美國臨時專利申請案第61/709423號，標題為「光學鍍膜方法、裝置及產品（Optical Coating Method, Apparatus and Product）」的優先權，且上述諸案之內容係供參考且以全文引用之方式併入本文，且本申請案亦係2012年11月30日提出申請之美國非臨時專利申請案第13/690,904號，名稱「製作具有光學和容易清潔鍍膜之玻璃製品之製程（Process for Making of Glass Articles with Optical and Easy-To-Clean Coatings）」之部分連續案，該案之內容係供參考且以全文引用之方式併入本文。This application is a continuation-in-progress, entitled "Optical Coating Method, Apparatus and Product", filed on November 30, 2012, which is incorporated herein by reference. U.S. Provisional Patent Application Serial No. 61/709,423, filed on Oct. 4, 2012, entitled <RTIgt;"Optical Coating Method, Apparatus and Product" The contents of the present application are hereby incorporated by reference in its entirety by reference in its entirety herein in its entirety in its entirety in its entirety in its entirety in Part of the continuation of Process for Making of Glass Articles with Optical and Easy-To-Clean Coatings, the contents of which are incorporated herein by reference in its entirety.

本發明係針對用於製作玻璃製品之一種製程，在玻璃製品上具有光學鍍膜和容易清潔(easy-to-clean，ETC)鍍膜、執行該製程之一種裝置及使用該製程製作之一種製品。特別地，本發明係針對一種製程，於該製程中光學鍍膜和ETC鍍膜之塗佈可使用相同的裝置而循序地進行。The present invention is directed to a process for making a glass article, an optical coating and an easy-to-clean (ETC) coating on a glass article, a device for performing the process, and a product produced using the process. In particular, the present invention is directed to a process in which the coating of an optical coating and an ETC coating can be carried out sequentially using the same apparatus.

玻璃，特別是化學強化玻璃，已變成許多，即使不是大多數，消費性電子產品之視窗螢幕之材料選項。例如，化學強化玻璃係特別地受到「觸控」螢幕產品之青睞，無論其是諸如手機、音樂播放器、電子書閱讀器和電子記事本之小型物件，或者是諸如電腦、自動提款機、機場自助報到櫃台機或其他類似電子物件之大型物件。許多該等物件需要在玻璃上塗佈抗反射鍍膜(antireflective (AR) coatings)，為要減少來自玻璃之可見光反射，且藉此改善對比和可讀性，例如，在陽光直射下使用裝置時。然而，AR鍍膜之某些缺點是其表面污染之敏感性和不良之持久耐刮性，意即，AR鍍膜在使用時變得容易被刮傷，例如，被抺布或灰塵及使用者手指之污垢。指紋和污漬在AR鍍膜上係非常明顯的且並非總是容易移除的。結果，高度期望的是任何觸控裝置之玻璃表面係容易清潔的，而此舉是可以利用將ETC鍍膜塗佈在玻璃表面來達成的。Glass, especially chemically strengthened glass, has become a material option for many, if not most, consumer electronics windows. For example, chemically strengthened glass is particularly popular with "touch" screen products, whether they are small objects such as cell phones, music players, e-book readers and electronic notebooks, or computers, cash dispensers, Airport self-service check-in counters or other large objects like electronic objects. Many of these objects require the application of antireflective (AR) coatings on the glass in order to reduce visible light reflection from the glass and thereby improve contrast and readability, for example, when the device is used in direct sunlight. However, some of the disadvantages of AR coatings are their surface contamination sensitivity and poor long-lasting scratch resistance, meaning that AR coatings become susceptible to scratching during use, for example, by crepe or dust and by the fingers of the user. dirt. Fingerprints and stains are very noticeable on the AR coating and are not always easy to remove. As a result, it is highly desirable that the glass surface of any touch device be easily cleaned, and this can be achieved by coating an ETC coating on the surface of the glass.

用於製作具有抗反射和ETC鍍膜二者之玻璃製品之現有製程係需要使用不同的設備來塗佈鍍膜，因此需要分開的製造流程。基本的程序是將抗反射(「AR」)鍍膜，例如使用化學氣相沉積(「CVD」)或物理氣相沉積(「PVD」)方法，塗佈在玻璃製品上。於習知的製程中，光學塗佈製品，例如，具有AR鍍膜之製品，將從光學鍍膜裝置被傳送到另一裝置將ETC鍍膜塗佈在AR鍍膜的頂部。當該等製程可產出具有抗反射鍍膜和ETC鍍膜二者之製品時，其需要分開的流程且由於需要額外的處理，因此會有較高的產出損失(yield loss)。此舉可能造成最終產品的不良可靠度，係由於自AR鍍膜和ETC鍍膜程序間之額外處理所產生的污染。例如，使用習知之將ETC置於光學鍍膜上之二步驟鍍膜製程導致在觸控螢幕應用中容易刮傷之製品。此外，雖然AR鍍膜表面在塗佈ETC鍍膜之前可以事先清潔，但在製造過程中此舉涉及了額外的步驟。所有額外的步驟增加產品的成本。結果，二種鍍膜需要其他替代的方法和裝置以使用相同的基本程序和設備來塗佈，藉此，降低製造成本。揭示於本文之製程之優點和所得到之產品係敍述於以下段落和權利請求項。Existing process lines for making glass articles with both anti-reflective and ETC coatings require different equipment to be used to coat the coating, thus requiring a separate manufacturing process. The basic procedure is to apply an anti-reflective ("AR") coating, for example, to a glass article using chemical vapor deposition ("CVD") or physical vapor deposition ("PVD") methods. In a conventional process, an optical coated article, for example, an article having an AR coating, is transferred from the optical coating device to another device to coat the ETC coating on top of the AR coating. When such processes can produce articles having both anti-reflective coatings and ETC coatings, they require a separate process and, because of the additional processing required, have a higher yield loss. This may result in poor reliability of the final product due to contamination from additional processing between the AR coating and the ETC coating process. For example, the use of conventional two-step coating processes that place ETC on an optical coating results in articles that are susceptible to scratching in touch screen applications. In addition, although the AR coating surface can be cleaned prior to coating the ETC coating, this involves additional steps during the manufacturing process. All the extra steps increase the cost of the product. As a result, the two coatings require other alternative methods and apparatus to coat using the same basic procedures and equipment, thereby reducing manufacturing costs. The advantages of the processes disclosed herein and the resulting products are set forth in the following paragraphs and claims.

於一個或多個實施例中，本發明提供在鍍膜製程中用於握持基板之一種基板載具。基板載具可包括包含滯留表面、底面和基板滯留區之基板載具底座，基板滯留區係設置在滯留表面上。基板滯留區可具有小於滯留表面之面積。基板載具也可包括耦合於基板載具底座之底面之複數個磁鐡且複數個磁鐡係定位於基板滯留區之周邊之外。於一個或多個實施例中，黏合材料可定位於在基板滯留區內之滯留表面上，其係用於將被鍍膜之至少一基板可拆卸地固定在滯留表面。黏合材料可包括壓敏黏合劑(pressure sensitive adhesive)。於一變化態樣中，黏合材料可包括丙烯酸類黏合劑(acrylic adhesives)、橡膠黏合劑(rubber adhesives)和/或矽膠黏合劑(silicone adhesives)。可選地，聚合物薄膜可定位在滯留表面和黏合材料之間。In one or more embodiments, the present invention provides a substrate carrier for holding a substrate in a coating process. The substrate carrier can include a substrate carrier base including a retention surface, a bottom surface, and a substrate retention zone, the substrate retention zone being disposed on the retention surface. The substrate retention zone can have an area that is less than the retention surface. The substrate carrier can also include a plurality of magnetic turns coupled to the bottom surface of the substrate carrier base and a plurality of magnetic turns are positioned outside the perimeter of the substrate retention zone. In one or more embodiments, the bonding material can be positioned on the retention surface in the retention zone of the substrate for releasably securing at least one substrate of the coated film to the retention surface. The adhesive material can include a pressure sensitive adhesive. In one variation, the bonding material can include acrylic adhesives, rubber adhesives, and/or silicone adhesives. Alternatively, the polymeric film can be positioned between the retention surface and the bonding material.

基板載具可包括用於支撐定位於滯留表面上之基板之複數根插銷。可選地，基板載具可包括包含可伸縮插銷之彈簧系統，可伸縮插銷係由彈簧適當地定位，當基板定位在滯留表面上時，彈簧係偏置可伸縮插銷而接觸基板；及自基板載具底座延伸一段距離之複數個側止動件，使得當基板定位在複數根插銷上時，複數個側止動件之頂部係位於基板之頂表面下方。於一變化態樣中，基板載具可包括內部設置可伸縮插銷之外罩，其中可伸縮插銷係由彈簧適當地定位，當基板定位在滯留表面上時，可伸縮插銷係自外罩向外地被偏置且接觸基板；及當基板定位在滯留表面上時，用於握持基板之邊緣之複數根移動式插銷。於另一變化態樣中，複數根插銷之位置係可調整以容納不同形狀和尺寸的基板。The substrate carrier can include a plurality of pins for supporting a substrate positioned on the retention surface. Optionally, the substrate carrier may include a spring system including a retractable latch, the telescopic pin being properly positioned by the spring, the spring biasing the retractable latch to contact the substrate when the substrate is positioned on the retention surface; and the substrate The carrier base extends a plurality of side stops a distance such that when the substrate is positioned over the plurality of pins, the tops of the plurality of side stops are located below the top surface of the substrate. In a variation, the substrate carrier can include an internally disposed retractable latch cover, wherein the retractable latch is properly positioned by the spring, and when the substrate is positioned on the retention surface, the retractable latch is biased outwardly from the cover And contacting the substrate; and a plurality of moving latches for holding the edge of the substrate when the substrate is positioned on the retention surface. In another variation, the positions of the plurality of pins are adjustable to accommodate substrates of different shapes and sizes.

於再另一變化態樣中，本發明係提供對基板進行鍍膜之一種鍍膜裝置。鍍膜裝置可包括真空腔室及定位於真空腔室內且包含磁性材料之旋轉圓頂。電漿源可定位於真空腔室內部且電漿源係實質上垂直定向以引導電漿至旋轉圓頂之底面，其中電漿源係定位在旋轉圓頂下方且自旋轉圓頂之旋轉軸徑向地向外，使得自電漿源射出之電漿係從旋轉圓頂之至少一外邊緣到旋轉圓頂之至少一中心而入射到旋轉圓頂之底面。於一個或多個實施例中，旋轉圓頂之旋轉軸至電漿源間之距離係大於旋轉圓頂之凸出周邊至電漿源間之距離。鍍膜裝置可包括定位於真空腔室內之至少一熱蒸鍍源(thermal evaporation source)。In still another variation, the present invention provides a coating apparatus for coating a substrate. The coating apparatus can include a vacuum chamber and a rotating dome positioned within the vacuum chamber and containing magnetic material. The plasma source can be positioned inside the vacuum chamber and the plasma source is oriented substantially vertically to direct the plasma to the bottom surface of the rotating dome, wherein the plasma source is positioned below the rotating dome and the rotating shaft diameter of the rotating dome Toward the ground, the plasma ejected from the plasma source is incident on the bottom surface of the rotating dome from at least one outer edge of the rotating dome to at least one center of the rotating dome. In one or more embodiments, the distance between the axis of rotation of the rotating dome and the plasma source is greater than the distance between the convex periphery of the rotating dome and the plasma source. The coating apparatus can include at least one thermal evaporation source positioned within the vacuum chamber.

鍍膜裝置可選擇地包括定位於真空腔室內之至少一電子束源(e-beam source)，電子束源係定向以引導電子束至定位於真空腔室內之鍍膜源材料(coating source material)上。鍍膜裝置可包括定位於真空腔室內之第二電子束源。第二電子束源可定向以引導第二電子束至定位於真空腔室內之鍍膜源材料上。The coating apparatus optionally includes at least one e-beam source positioned within the vacuum chamber, the electron beam source being oriented to direct the electron beam to a coating source material positioned within the vacuum chamber. The coating apparatus can include a second electron beam source positioned within the vacuum chamber. The second electron beam source can be oriented to direct the second electron beam onto the coating source material positioned within the vacuum chamber.

於另一選項中，鍍膜裝置可包括可調整地可定位於真空腔室內部之至少一遮罩(shadow mask)。遮罩係可在伸展位置和縮回位置之間調整，伸展位置係至少一遮罩定位於至少一電子束源和旋轉圓頂之間，縮回位置係至少一遮罩非定位於至少一電子束源和旋轉圓頂之間。於一個或多個實施例中，可包括第二遮罩。於此類實施例中，第二遮罩可定位於第二電子束源和旋轉圓頂之間。In another option, the coating apparatus can include at least one shadow mask that is adjustably positionable within the vacuum chamber. The mask is adjustable between an extended position in which at least one mask is positioned between the at least one electron beam source and the rotating dome, and a retracted position in which the at least one mask is not positioned at least one of the electrons Between the beam source and the rotating dome. In one or more embodiments, a second mask can be included. In such an embodiment, the second mask can be positioned between the second electron beam source and the rotating dome.

鍍膜裝置可包括旋轉圓頂，旋轉圓頂包括位於旋轉圓頂之頂中央之開口；遮蓋旋轉圓頂之開口之透明玻璃板；及定位於透明玻璃板中之開口之監視器，其係用於監視沉積於真空腔室內之鍍膜材料之沉積速率。光纖可定位於透明玻璃板上方，其中當透明玻璃板被鍍膜以決定透明玻璃板之反射率變化且因此決定塗佈在透明玻璃板之鍍膜厚度時，光纖係收集反射自透明玻璃板之光線。The coating apparatus may include a rotating dome including an opening at the center of the top of the rotating dome; a transparent glass plate covering the opening of the rotating dome; and a monitor positioned to open the opening in the transparent glass plate, which is used for The deposition rate of the coating material deposited in the vacuum chamber is monitored. The optical fiber can be positioned over the transparent glass sheet, wherein the optical fiber collects light reflected from the transparent glass sheet when the transparent glass sheet is coated to determine the reflectance of the transparent glass sheet and thus determines the thickness of the coating applied to the transparent glass sheet.

於再另一實施例中，本發明係提供對基板進行鍍膜之一種鍍膜裝置。鍍膜裝置可包括真空腔室和定位於真空腔室內之旋轉圓頂。旋轉圓頂可使用磁性材料建造。裝置也可包括用於固定於旋轉圓頂之至少一基板載具。至少一基板載具可包括包含滯留表面、底面和基板滯留區之基板載具底座，基板滯留區係設置在滯留表面上。複數個磁鐡可耦合於基板載具底座之底面之且複數個磁鐡係定位於基板滯留區之周邊之外。黏合材料可定位於在基板滯留區內之滯留表面上，其係用於可拆卸地固定將被鍍膜之至少一基板。鍍膜裝置可包括定位於真空腔室內部之電漿源且電漿源係實質上垂直定向以引導電漿至旋轉圓頂之底面，其中電漿源係定位在旋轉圓頂下方且自旋轉圓頂之旋轉軸徑向地向外，使得自電漿源射出之電漿係從旋轉圓頂之至少一外邊緣到旋轉圓頂之至少一中心而入射到旋轉圓頂之底面。於一變化態樣中，旋轉圓頂之旋轉軸至電漿源間之距離係大於旋轉圓頂之凸出周邊至電漿源間之距離。鍍膜裝置可包括第一電子束源和第二電子束源，第一電子束源係定位於真空腔室內且定向以引導第一電子束至定位於真空腔室內之第一鍍膜源材料上，第二電子束源係定位於真空腔室內且定向以引導第二電子束至定位於真空腔室內之第二鍍膜源材料上。第一鍍膜源材料可展現高折射率且第二鍍膜源材料可展現低折射率或中等折射率。鍍膜裝置可包括可調整地可定位於真空腔室內部之至少一遮罩。遮罩可在伸展位置和縮回位置之間調整，伸展位置係至少一遮罩定位於第一電子束源和第二電子束源中之至少一個和旋轉圓頂之間，縮回位置係至少一遮罩非定位於第一電子束源或第二電子束源和旋轉圓頂之間。In still another embodiment, the present invention provides a coating apparatus for coating a substrate. The coating apparatus can include a vacuum chamber and a rotating dome positioned within the vacuum chamber. The rotating dome can be constructed using magnetic materials. The device can also include at least one substrate carrier for attachment to the rotating dome. The at least one substrate carrier may include a substrate carrier base including a retention surface, a bottom surface, and a substrate retention zone, the substrate retention zone being disposed on the retention surface. A plurality of magnetic turns may be coupled to the bottom surface of the substrate carrier base and a plurality of magnetic turns are positioned outside the periphery of the substrate retention zone. The adhesive material can be positioned on the retention surface in the retention zone of the substrate for releasably securing at least one substrate to be coated. The coating apparatus can include a plasma source positioned within the vacuum chamber and the plasma source is oriented substantially vertically to direct the plasma to the bottom surface of the rotating dome, wherein the plasma source is positioned below the rotating dome and the spin dome The rotating shaft is radially outward such that the plasma emerging from the plasma source is incident on the bottom surface of the rotating dome from at least one outer edge of the rotating dome to at least one center of the rotating dome. In a variation, the distance between the rotating shaft of the rotating dome and the plasma source is greater than the distance between the protruding periphery of the rotating dome and the plasma source. The coating device may include a first electron beam source and a second electron beam source, the first electron beam source being positioned in the vacuum chamber and oriented to guide the first electron beam to the first coating source material positioned in the vacuum chamber, The two electron beam sources are positioned within the vacuum chamber and oriented to direct the second electron beam onto the second coating source material positioned within the vacuum chamber. The first coating source material may exhibit a high refractive index and the second coating source material may exhibit a low refractive index or a medium refractive index. The coating apparatus can include at least one mask that is adjustably positionable within the vacuum chamber. The mask is adjustable between an extended position in which at least one mask is positioned between the at least one of the first electron beam source and the second electron beam source and the revolving dome, the retracted position being at least one mask A mask is not positioned between the first electron beam source or the second electron beam source and the rotating dome.

敍於本文之方法之額外的特徵和優點將在隨後之詳細敍述中加以闡明，且從此敍述其某部分地對於本領域技術人員而言是顯而易見的，或者藉由施行敍於本文之實施例，包含隨後之詳細敍述、權利請求項和附屬圖式，而被認知。Additional features and advantages of the methods described herein will be set forth in the description which follows. It is recognized by the following detailed description, claim, and accompanying drawings.

應當理解的是上述一般性之敍述和隨後詳細之敍述兩者係敍述各種不同實施例且意圖提供請求標的之本質和特性的概述和架構。附屬圖式係被包含以提供對於各種實施例進一步的了解，且被合併於並組成此說明書。圖式係圖示敍於本文之各種實施例，且與此說明書一起用以解釋請求標的之原理與操作。It is to be understood that both the foregoing general description and the claims Affiliated drawings are included to provide a further understanding of the various embodiments and are incorporated in and constitute this specification. The drawings are illustrative of various embodiments of the invention, and are used in conjunction with the description herein.

現在將詳細針對鍍有光學鍍膜和容易清潔鍍膜之玻璃製品和形成此玻璃製品之方法和裝置之諸實施例進行參考說明，其範例係圖示於所附圖式。若可能，相同的元件符號將在所有圖式中使用以代表相同或類似的零件。鍍膜裝置之一實施例係示意地描繪於第1A圖。鍍膜裝置通常包括真空腔室，其具有定位在其中之磁性圓頂。鍍膜裝置也包括電子束源、熱蒸鍍源和電漿源。將被鍍膜之玻璃基板可被磁性地貼附於圓頂之底面且分別使用電子束源和熱蒸鍍源，鍍上光學鍍膜和ETC鍍膜。於實施例中，電漿源可使用來使沉積光學鍍膜材料變得密實(densify)。用於循序地將光學鍍膜和ETC鍍膜塗佈到玻璃基板之裝置和方法之各種實施例將具體參考所附圖式於本文詳細地加以敍述。Reference will now be made in detail to embodiments of a glass article coated with an optical coating and an easy-to-clean coating, and a method and apparatus for forming the glass article, examples of which are illustrated in the drawings. Where possible, the same symbol will be used in all figures to represent the same or similar parts. An embodiment of a coating apparatus is schematically depicted in Figure 1A. The coating apparatus typically includes a vacuum chamber having a magnetic dome positioned therein. The coating device also includes an electron beam source, a thermal evaporation source, and a plasma source. The glass substrate to be coated can be magnetically attached to the bottom surface of the dome and optically coated with an electron beam source and a thermal evaporation source, respectively, and plated with an optical coating and an ETC coating. In an embodiment, the plasma source can be used to densify the deposited optical coating material. Various embodiments of apparatus and methods for sequentially applying optical coatings and ETC coatings to glass substrates are described in detail herein with particular reference to the drawings herein.

在本文中之術語「製程」和「方法」可以交換使用。此外本文中之術語「無陰影(shadowless)」和「去陰影(shadow free)」係指光學鍍膜均勻地沉積在玻璃基板整個表面，使得當具有使用敍於本文之方法和裝置而沉積之鍍膜之玻璃製品被察看時，在具有使用習知光學鍍膜方法和裝置所製備的光學鍍膜之玻璃製品上原可被觀察到的陰影係無法被觀察到。當正被鍍膜之基板區域遮擋基板表面而無法被光學鍍膜材料所沉積時，在習知鍍膜玻璃製品被觀察到的陰影將會出現。該等陰影經常在鄰近以下元件之處被觀察到：在鍍膜過程中被用來將正在鍍膜之基板握持在適當位置之元件或者在基板載具上用於傳輸正在鍍膜之載具和元件進出塗佈機之元件。The terms "process" and "method" are used interchangeably herein. Furthermore, the terms "shadowless" and "shadow free" as used herein mean that the optical coating is uniformly deposited on the entire surface of the glass substrate such that it has a coating deposited using the methods and apparatus described herein. When the glass article was observed, the shadows which were originally observed on the glass article having the optical coating prepared by the conventional optical coating method and apparatus could not be observed. When the substrate area being coated blocks the surface of the substrate and cannot be deposited by the optical coating material, shadows observed in conventional coated glass articles will appear. These shadows are often observed adjacent to the following components: components used to hold the substrate being coated in place during the coating process or on the substrate carrier for transporting the carrier and component being coated The components of the coater.

術語「玻璃製品」和「玻璃基板」於本文中可以交換使用且通常係指使用敍於本文之方法和裝置鍍膜之任何玻璃物件。The terms "glass article" and "glass substrate" are used interchangeably herein and generally refer to any glass article that is coated using the methods and apparatus described herein.

本發明係針對一種製程，其中例如包含交替的高、低折射率材料薄層之AR鍍膜之光學鍍膜和例如全氟烷基矽烷鍍膜(perfluoroalkylsilane coating)之ETC鍍膜兩者係可以循序步驟(意即，首先塗佈光學鍍膜，接著在光學鍍膜上塗佈ETC鍍膜)使用實質上相同的程序塗佈在玻璃基板上，而不需要將製品在光學鍍膜和ETC鍍膜之塗佈過程的任何時間曝露在空氣或周圍大氣中。可靠的ETC鍍膜係提供潤滑作用至玻璃、透明導電鍍膜(transparent conductive coating，TCC)和光學鍍膜之表面上。此外，玻璃和光學鍍膜之抗刮損性(abrasion resistance)將比習知鍍膜製程好上超過10倍或者比沒有ETC鍍膜之AR鍍膜(係使用原位、單步驟製程，其中鍍膜係循序塗佈，如第10、11和17B圖所圖解描繪)好上100-1000倍。使用此類技術，在設計時ETC鍍膜可被視為光學鍍膜的一部分，且藉此，ETC鍍膜將不會改變所欲的光學效能。敍於本文的玻璃製品在玻璃的整個光學鍍膜表面上係沒有陰影的。The present invention is directed to a process in which, for example, an optical coating of an AR coating comprising alternating layers of high and low refractive index materials and an ETC coating such as a perfluoroalkylsilane coating are sequential steps (ie, First, the optical coating is applied, then the ETC coating is coated on the optical coating) and coated on the glass substrate using substantially the same procedure without exposing the article to any time during the coating process of the optical coating and the ETC coating. In the air or in the surrounding atmosphere. Reliable ETC coatings provide lubrication to the surface of glass, transparent conductive coating (TCC) and optical coatings. In addition, the glass and optical coatings have an abrasion resistance that is more than 10 times better than the conventional coating process or an AR coating that is less than the ETC coating (using an in-situ, single-step process in which the coating is sequentially coated) , as illustrated by Figures 10, 11 and 17B) is 100-1000 times better. Using such techniques, the ETC coating can be considered part of the optical coating at design time, and as such, the ETC coating will not alter the desired optical performance. The glazing described herein is unshaded over the entire optical coating surface of the glass.

原位製程之一種特別的範例係示意地描繪在第1A圖中之箱型塗佈機(box coater)。箱型塗佈機配備有用於光學鍍膜之電子束源（e-beam source）、用於ETC鍍膜材料之熱蒸鍍源以及用於鍍膜前之表面清潔和在鍍膜過程中之光學鍍膜緊壓(optical coating impaction)之離子束(ion beam)或電漿源，其係以增加鍍膜密度和鍍膜表面之平坦度。A particular example of an in-situ process is schematically depicted in the box coater of Figure 1A. The box coater is equipped with an e-beam source for optical coating, a thermal evaporation source for ETC coating materials, and a surface cleaning before coating and optical coating pressing during coating ( An optical beam or ion source that increases the density of the coating and the flatness of the surface of the coating.

光學鍍膜係由高及中等或者低折射率材料所組成。範例性的高折射率材料係具有大於或等於1.7且小於或等於3.0之折射率，包括ZrO₂ 、HfO₂ 、Ta₂ O₅ 、Nb₂ O₅ 、TiO₂ 、Y₂ O₃ 、Si₃ N₄ 、SrTiO₃ 、WO₃ ；具有大於或等於1.5且小於1.7之折射率n之範例性中等折射率材料係Al₂ O₃ ；且範例性的低折射率材料係具有大於或等於1.3且小於或等於1.6之折射率n，包括SiO₂ 、MgF₂ 、YF₃ 、YbF₃ 。沉積在基板上之光學鍍膜堆疊(optical coating stack)係包含提供特定光學功能之至少一材料/薄層。在大多數例子中，一高和一低折射率材料可使用來設計複雜的光學濾波器(包括AR鍍膜)，例如作為高折射率材料之HfO₂ 和作為低折射率材料之SiO₂ 。適合使用於鍍膜之TCC (tow-component coating，二成份鍍膜)材料包括ITO (indium tin oxide，銦錫氧化物)、AZO (Al doped zinc oxide，鋁摻雜氧化鋅)、IZO (Zn stabilized indium oxide，鋅穩氧化銦)、In₂ O₃ 和類似的二元及三元氧化物化合物。Optical coatings consist of high and medium or low refractive index materials. Exemplary high refractive index materials have a refractive index greater than or equal to 1.7 and less than or equal to 3.0, including ZrO ₂ , HfO ₂ , Ta ₂ O ₅ , Nb ₂ O ₅ , TiO ₂ , Y ₂ O ₃ , Si ₃ N ₄ , SrTiO ₃ , WO ₃ ; an exemplary medium refractive index material having a refractive index n greater than or equal to 1.5 and less than 1.7 is Al ₂ O ₃ ; and an exemplary low refractive index material having greater than or equal to 1.3 and less than or A refractive index n equal to 1.6, including SiO ₂ , MgF ₂ , YF ₃ , YbF ₃ . An optical coating stack deposited on a substrate comprises at least one material/thin layer that provides a particular optical function. In most cases, a high and a low refractive index material can be used to design complex optical filters (including AR coatings), such as HfO ₂ as a high refractive index material and SiO ₂ as a low refractive index material. TCC (tow-component coating) materials suitable for coating include ITO (indium tin oxide), AZO (Al doped zinc oxide), IZO (Zn stabilized indium oxide) , zinc stabilized indium oxide), In ₂ O ₃ and similar binary and ternary oxide compounds.

於實施例中，光學鍍膜係使用PVD鍍膜(濺鍍或具有ETC鍍膜之熱蒸鍍之IAD-EB覆蓋光學鍍膜)而塗佈至玻璃基板上。PVD係一種「冷」製程，其中基板溫度係低於100^o C。因此被塗佈鍍膜之化學強化或強化玻璃之強度並沒有退化。In the examples, the optical coating was applied to a glass substrate using a PVD coating (spraying or IAD-EB coated optical coating with thermal evaporation of ETC coating). PVD is a "cold" process in which the substrate temperature is below 100 ^o C. Therefore, the strength of the chemically strengthened or tempered glass of the coated coating is not degraded.

在述於本文之實施例中，使用於製作敍於本文之去陰影之光學和ETC鍍膜玻璃製品可以是離子交換玻璃或非離子交換玻璃。範例性之玻璃包括石英玻璃(silica glass)、鋁矽酸鹽玻璃(aluminosilicate glass)、硼矽酸鹽玻璃(borosilicate glass)、鋁硼矽酸鹽玻璃(aluminoborosilicate glass)和鈉鈣玻璃(soda lime glass)。玻璃製品具有在0.2 mm至1.5 mm之間範圍的厚度，且具有適合預定目的之長度和寬度。因此玻璃製品之長度和寬度之範圍可從手機到平板電腦，或更大。In the embodiments described herein, the de-shadowed optical and ETC coated glass articles used to make the text herein may be ion exchange glass or non-ion exchange glass. Exemplary glasses include silica glass, aluminosilicate glass, borosilicate glass, aluminoborosilicate glass, and soda lime glass. ). The glazing has a thickness ranging between 0.2 mm and 1.5 mm and has a length and width suitable for the intended purpose. Thus the length and width of the glass article can range from cell phones to tablets, or larger.

本文所指之光學鍍膜係包括抗反射鍍膜(AR鍍膜)、帶通濾波器鍍膜、邊緣中性鏡面鍍膜(edge neutral mirror coating)和分束器、多層高度反射鍍膜和邊緣濾波器(edge filter)，如H. Angus Macleod ，物理出版研究，布里斯托爾和費城，2001年出版之「薄膜光學濾波器（Thin Film Optical Filters）」第三版中所述。使用此類光學鍍膜之應用包括顯示器、相機鏡片、電信元件、儀器、醫療裝置、光致變色和電致變色裝置(photochromic and electrochromic device)、光伏裝置(photovoltaic device)和其他元件和裝置。The optical coatings referred to herein include anti-reflective coatings (AR coatings), bandpass filter coatings, edge neutral mirror coatings and beam splitters, multilayer highly reflective coatings, and edge filters. , as described in H. Angus Macleod, Physical Publishing Research, Bristol and Philadelphia, 2001, "Thin Film Optical Filters," Third Edition. Applications using such optical coatings include displays, camera lenses, telecommunications components, instruments, medical devices, photochromic and electrochromic devices, photovoltaic devices, and other components and devices.

交替的高、低折射率材料薄層可使用來形成光學鍍膜，例如對於紫外線（「UV」）、可見光（「VIS」）或紅外線（「IR」）應用之抗反射或抗眩光。光學鍍膜可使用不同的方法沉積。本文中用於沉積光學鍍膜之PVD方法(意即，離子輔助、電子束沉積)係使用作為範例性方法。光學鍍膜包含至少一層高折射率材料H和至少一層低折射率材料L。多層鍍膜係由複數個交替的高、低折射率層所組成，例如HL、HL、HL等或者LH、LH、LH等。一對HL層(或LH層)係稱為「週期」或「鍍膜週期」。中等折射率材料M可被用來取代所有或部分低折射率層中之低折射率材料。「索引」一詞使用於本文係指材料之折射率。在多層鍍膜中，週期數目可取決於預期產品之功能而廣泛地變動。例如，對於AR鍍膜而言，週期數目可在大於或等於2且小於或等於20之範圍內。SiO₂ 之可選用最終覆蓋層也可沉積在AR鍍膜之頂部作為最終層。不同的技術可使用來將ETC材料沉積在光學鍍膜的頂部而不需將光學鍍膜曝露在周圍大氣，不同的技術係包括，不受限於，熱蒸鍍、化學氣相沉積(CVD)或原子層沉積(ALD)。Alternating thin layers of high and low refractive index materials can be used to form optical coatings, such as anti-reflective or anti-glare applications for ultraviolet ("UV"), visible ("VIS") or infrared ("IR") applications. Optical coatings can be deposited using different methods. The PVD method (i.e., ion assisted, electron beam deposition) for depositing optical coatings herein is used as an exemplary method. The optical coating comprises at least one layer of high refractive index material H and at least one layer of low refractive index material L. The multi-layer coating consists of a plurality of alternating high and low refractive index layers, such as HL, HL, HL, etc. or LH, LH, LH, and the like. A pair of HL layers (or LH layers) is called a "cycle" or a "coating cycle." The medium refractive index material M can be used to replace all or a portion of the low refractive index material in the low refractive index layer. The term "index" as used herein refers to the refractive index of a material. In multi-layer coatings, the number of cycles can vary widely depending on the function of the intended product. For example, for AR coating, the number of cycles may be in the range of greater than or equal to 2 and less than or equal to 20. An optional final coating of SiO ₂ can also be deposited on top of the AR coating as the final layer. Different techniques can be used to deposit ETC materials on top of the optical coating without exposing the optical coating to the surrounding atmosphere. Different technologies include, without limitation, thermal evaporation, chemical vapor deposition (CVD) or atomic Layer deposition (ALD).

沉積在敍於本文之玻璃基板之光學鍍膜可以是包含至少一週期之高折射率材料和低折射率材料之多層光學鍍膜。高折射率材料可選自於ZrO₂ 、HfO₂ 、Ta₂ O₅ 、Nb₂ O₅ 、TiO₂ 、Y₂ O₃ 、Si₃ N₄ 、SrTiO₃ 和WO₃ 。然而，應當理解的是也可以使用其他適合的高折射率材料。低折射率材料可選自由SiO₂ 、MgF₂ 、YF₃ 和YbF₃ 所組成的群組。然而，應當理解的是也可以使用其他適合的低折射率材料。在某些實施例中，低折射率材料可被中等折射率材料所取代，例如Al₂ O₃ 或其他適合的中等折射率材料。The optical coating deposited on the glass substrate described herein may be a multilayer optical coating comprising a high refractive index material and a low refractive index material of at least one cycle. The high refractive index material may be selected from the group consisting of ZrO ₂ , HfO ₂ , Ta ₂ O ₅ , Nb ₂ O ₅ , TiO ₂ , Y ₂ O ₃ , Si ₃ N ₄ , SrTiO _{3 ,} and WO ₃ . However, it should be understood that other suitable high refractive index materials may also be used. The low refractive index material may be selected from the group consisting of SiO ₂ , MgF ₂ , YF ₃ and YbF ₃ . However, it should be understood that other suitable low refractive index materials may also be used. In certain embodiments, the low refractive index material can be replaced by a medium refractive index material, such as Al ₂ O ₃ or other suitable medium refractive index materials.

在一實施例中，本發明係針對一種製程，其中在第一步驟中，多層光學鍍膜係沉積在玻璃基板上，接著在第二步驟中，ETC鍍膜係在與光學鍍膜相同的腔室中，被熱氣化(thermally evaporated)和沉積。在另一實施例中，多層光學鍍膜係在一腔室中沉積在玻璃基板上，接著在第二腔室中將ETC鍍膜熱氣化和沉積在多層光學鍍膜之頂部，藉由提供多層光學鍍膜基板在多層光學鍍膜和ETC鍍膜間之塗佈不用曝露於空氣之串聯方式從第一腔室輸送到第二腔室。使用的鍍膜技術可包括，但不限制於，PVD、CVD/PECVD和ALD鍍膜技術。取決於腔室或多個腔室之尺寸大小和將被鍍膜基板之尺寸大小，一片或複數片的基板可同時在單一腔室內進行鍍膜。In one embodiment, the present invention is directed to a process wherein, in a first step, a multilayer optical coating is deposited on a glass substrate, and then in a second step, the ETC coating is in the same chamber as the optical coating, It is thermally evaporated and deposited. In another embodiment, the multilayer optical coating is deposited on a glass substrate in a chamber, and then the ETC coating is thermally vaporized and deposited on top of the multilayer optical coating in the second chamber by providing a multilayer optical coating substrate. The coating between the multilayer optical coating and the ETC coating is delivered from the first chamber to the second chamber without exposure to air in series. Coating techniques used may include, but are not limited to, PVD, CVD/PECVD, and ALD coating techniques. Depending on the size of the chamber or chambers and the size of the substrate to be coated, one or more of the substrates may be simultaneously coated in a single chamber.

多層光學鍍膜通常係氧化物鍍膜，其中高折射率鍍膜係鑭系氧化物(lanthanide series oxide)，例如La、Nb、Y、Gd或其他鑭系金屬，且低折射率鍍膜係SiO₂ 。ETC材料可以是，例如氟化矽烷(fluorinated silanes)、具有化學式(R_F )_X SiX_4-x 之典型全氟化碳烷基矽烷(alkyl perfluorocarbon silanes)，其中R_f 係直鏈C₆ -C₃₀ 全氟化碳烷基，X=Cl或-OCH₃ -且X=2或3。碳氟化合物具有長度在大於或等於3 nm且小於或等於50 nm之範圍內之碳鏈。碳氟化合物可從市場上自以下廠商取得，包括，但不限於，道康寧公司(例如碳氟化合物2604和2634)、3M公司(例如ECC-1000和4000)、大金公司、佳能、唐(南韓)、Ceko(南韓)、科泰公司(例如DURALON UltraTec)和贏創。The multilayer optical coating is usually an oxide coating, wherein the high refractive index coating is a lanthanide series oxide such as La, Nb, Y, Gd or other lanthanide metal, and the low refractive index coating is SiO ₂ . The ETC material may be, for example, fluorinated silanes, typical perfluorocarbon silanes of the formula (R _F ) _X SiX _4-x , wherein R _f is a linear C ₆ -C ₃₀ perfluorocarbon alkyl, X = Cl or -OCH ₃ - and X = 2 or 3. The fluorocarbon has a carbon chain having a length in the range of greater than or equal to 3 nm and less than or equal to 50 nm. Fluorocarbons are available on the market from the following manufacturers, including, but not limited to, Dow Corning Corporation (eg fluorocarbons 2604 and 2634), 3M companies (eg ECC-1000 and 4000), Daikin, Canon, Tang (South Korea) ), Ceko (South Korea), Ketai (such as DURALON UltraTec) and Evonik.

第1A圖係示意地描繪根據敍於本文之一個或多個實施例之鍍膜裝置100和裝置之不同操作元件。座標軸係供參考。在正面視圖中，x係從側邊到側邊(意即從左到右)，y係從前到後(意即進和出頁面)，z係從底到頂。鍍膜裝置100通常包含真空腔室102，真空腔室102內部具有含有唇部161 (描繪於第3A圖)之旋轉圓頂110，唇部161係支撐圓頂110之框架160 (進一步圖示於第3B圖)的一部分。圓頂包括磁性貼附於圓頂底面之複數個基板載具130，如第2圖所圖示。電漿源118係位於真空腔室102內，圓頂110下方且通常係被定向向上發射離子或電漿到圓頂110之底面。當光學鍍膜材料被沉積且/或沉積後，電漿源係用來使光學鍍膜材料變得密實，藉此增加已完成光學鍍膜之硬度。特別地，發射自電漿源之離子或電漿在沉積過程中且/或鍍膜層已被塗佈之後係撞擊鍍膜，造成沉積材料之密實化(densification)。將沉積光學鍍膜密實化可改善光學鍍膜之抗刮損性。例如，在某些實施例中，沉積光學鍍膜相較於沒有使用電漿源進行沉積之光學鍍膜將具有至少兩倍的刮損可靠度或抗刮損性。電漿源118可以和中和器(neutralizer) 121一起使用，如在本文中相對於第21A圖更詳細地描述。1A is a schematic depiction of different operational elements of a coating apparatus 100 and apparatus according to one or more embodiments herein. The coordinate axis is for reference. In the front view, x is from the side to the side (meaning from left to right), y is from front to back (meaning the page is in and out), and the z is from bottom to top. The coating apparatus 100 generally includes a vacuum chamber 102 having a rotating dome 110 having a lip portion 161 (drawn in FIG. 3A) inside, and a lip portion 161 supporting the frame 160 of the dome 110 (further illustrated in Part of 3B). The dome includes a plurality of substrate carriers 130 magnetically attached to the bottom surface of the dome, as illustrated in FIG. The plasma source 118 is located within the vacuum chamber 102, below the dome 110 and is typically directed upwardly to emit ions or plasma to the underside of the dome 110. When the optical coating material is deposited and/or deposited, the plasma source is used to densify the optical coating material, thereby increasing the hardness of the finished optical coating. In particular, ions or plasma emitted from the plasma source impinge on the coating during deposition and/or after the coating has been applied, resulting in densification of the deposited material. Densifying the deposited optical coating improves the scratch resistance of the optical coating. For example, in certain embodiments, a deposited optical coating will have at least twice the scratch reliability or scratch resistance compared to an optical coating that is not deposited using a plasma source. The plasma source 118 can be used with a neutralizer 121 as described in more detail herein with respect to Figure 21A.

鍍膜裝置進一步包含位於圓頂110下方之電子束源120和電子束反射鏡122，電子束反射鏡122係用於將電子束從電子束源引導至正被塗佈到玻璃基板的光學鍍膜材料，藉以將光學材料氣化。用於允許在整個圓頂均勻鍍膜的遮罩125係位於圓頂110下方。遮罩125之形狀和位置係可以調整使得遮罩係「可調的(tunable)」以達到所欲的鍍膜均勻度。遮罩125係定位在支架125a上，使得遮罩125的位置能夠沿著支架125a垂直地調整，如雙箭頭虛線所指。遮罩125在支架125a上的位置可依所需調整，以防止遮罩當光學鍍膜被塗佈時遮擋住位於圓頂110底面之玻璃基板受到來自電漿源118之離子或電漿之照射。雖然第1A圖描繪單一電子束源120，但應當理解的是也可使用複數組電子束源將從一種鍍膜材料變換到另一種鍍膜材料的時間減少到最少，例如從Nb₂ O₅ 變換到SiO₂ ，又變換回來，其係根據所需對於光學鍍膜而沉積個別材料層所需的層數。例如，在某些實施例中，鍍膜裝置可包含大於或等於2組且小於或等於6組的電子束源。當使用複數組電子束源時，每組電子束源可被引導到握持將被鍍膜之材料之分離容器(意即舟皿126，於本文進一步敍述)。The coating apparatus further includes an electron beam source 120 and an electron beam mirror 122 positioned below the dome 110 for directing the electron beam from the electron beam source to the optical coating material being coated onto the glass substrate. Thereby the optical material is vaporized. A mask 125 for allowing uniform coating throughout the dome is located below the dome 110. The shape and position of the mask 125 can be adjusted such that the mask is "tunable" to achieve the desired uniformity of the coating. The mask 125 is positioned on the bracket 125a such that the position of the mask 125 can be adjusted vertically along the bracket 125a, as indicated by the double arrow dotted line. The position of the mask 125 on the bracket 125a can be adjusted as needed to prevent the mask from obscuring the glass substrate located on the bottom surface of the dome 110 from ions or plasma from the plasma source 118 when the optical coating is applied. While Figure 1A depicts a single electron beam source 120, it should be understood that the time to convert a coating material to another coating material can also be minimized using a complex array electron beam source, such as from Nb ₂ O ₅ to SiO. ₂ , again, which is based on the number of layers required to deposit individual layers of material for the optical coating. For example, in some embodiments, the coating apparatus can include greater than or equal to 2 sets and less than or equal to 6 sets of electron beam sources. When a complex array of electron beam sources is used, each set of electron beam sources can be directed to a separate container holding the material to be coated (i.e., boat 126, as further described herein).

鍍膜裝置100進一步包含具有複數個舟皿126之光學鍍膜載具124，舟皿126係含有光學鍍膜材料。舟皿126係使用於包含用於沉積光學鍍膜層之不同材料之分離的來源容器。光學鍍膜載具124係定位在真空腔室102內，使得發射自電子束源120之電子束能夠被電子束反射鏡122反射到被包含於舟皿126內的光學鍍膜材料，藉此將光學鍍膜材料氣化。舟皿126含有不同的光學鍍膜材料，以便一次僅塗佈一種鍍膜材料(例如，高折射率材料、低折射率材料或者中等折射率材料)。在達到一種鍍膜材料的適當厚度之後，相對應舟皿之上蓋(圖未示)即關閉且含有將被塗佈之不同鍍膜材料之舟皿上蓋被開啟。以此方式，高折射率材料、低折射率材料或者中等折射率材料可輪流地塗佈以形成具有所欲光學特性之光學鍍膜材料。The coating apparatus 100 further includes an optical coating carrier 124 having a plurality of boats 126, the boat 126 containing an optical coating material. Boat 126 is used in a source container containing the separation of the different materials used to deposit the optical coating layer. The optical coating carrier 124 is positioned within the vacuum chamber 102 such that electron beams emitted from the electron beam source 120 can be reflected by the electron beam mirror 122 to the optical coating material contained within the boat 126, thereby optically coating the film The material is vaporized. The boat 126 contains different optical coating materials to coat only one coating material (e.g., a high refractive index material, a low refractive index material, or a medium refractive index material) at a time. After reaching a suitable thickness of a coating material, the upper cover of the corresponding upper cover of the boat (not shown) is closed and the upper cover of the boat containing the different coating materials to be coated is opened. In this manner, a high refractive index material, a low refractive index material, or a medium refractive index material can be applied in turn to form an optical coating material having desired optical characteristics.

鍍膜裝置100也包含至少一熱蒸鍍源128，熱蒸鍍源128係用於將ETC鍍膜材料熱氣化以加速將鍍膜材料沉積在固定在圓頂110底面的玻璃基板上。該至少一熱蒸鍍源128係定位在真空腔室102內，圓頂110下方。於一個或多個實施例中，ETC鍍膜係藉由鋼絲絨填充銅坩堝(steel wool-filled copper crucible)(圖未示)或多孔陶瓷填充銅坩堝(porous ceramic-filled copper crucible)(圖未示)而提供於真空腔室102內。使用鋼絲絨係提供對於ETC材料之均勻加熱且增加氣化表面面積。使用鋼絲絨也提供ETC在基板上鍍膜之更加可控制的沉積速率。The coating apparatus 100 also includes at least one thermal evaporation source 128 for thermally vaporizing the ETC coating material to accelerate deposition of the coating material on the glass substrate fixed to the bottom surface of the dome 110. The at least one thermal evaporation source 128 is positioned within the vacuum chamber 102 below the dome 110. In one or more embodiments, the ETC coating is made of steel wool-filled copper crucible (not shown) or porous ceramic-filled copper crucible (not shown) Provided in the vacuum chamber 102. The use of steel wool provides uniform heating of the ETC material and increases the vaporized surface area. The use of steel wool also provides a more controlled deposition rate of ETC coating on the substrate.

依然參考第1A圖，圓頂110係用磁性或包含磁性材料之輕質材料所製成，例如，但不受限於，含鐡成份之鋁或其他適當的磁性材料。圓頂110可順時針或逆時針轉動。在圓頂之頂中央有開口164 (描繪於第3B圖)且透明玻璃板116係放置在圓頂底面以遮蓋開口。透明玻璃板116可包括如描繪於第1B圖之透明玻璃板116之放大圖中之開口116a。石英監視器114係收納於且貫穿透明玻璃板116。光纖112係定位在透明玻璃板116上方，如圖示。石英監視器114藉由迴授至電子束電源供應器之訊號而控制光學材料的沉積速率，為使鍍膜材料之沉積速率可保持大致上穏定。光纖112係定位在透明玻璃板116上方以避免其本身在真空腔室102內被材料所沉積。光纖測量反射率以決定鍍膜材料的各層沉積何時應該停止，因已達到目標設計厚度。Still referring to FIG. 1A, the dome 110 is made of a magnetic or lightweight material comprising a magnetic material such as, but not limited to, aluminum containing niobium or other suitable magnetic material. The dome 110 can be rotated clockwise or counterclockwise. At the center of the top of the dome there is an opening 164 (drawn in Figure 3B) and a transparent glass plate 116 is placed over the bottom of the dome to cover the opening. The transparent glass sheet 116 can include an opening 116a as shown in an enlarged view of the transparent glass sheet 116 of FIG. 1B. The quartz monitor 114 is housed in and penetrates the transparent glass plate 116. The fiber 112 is positioned above the transparent glass plate 116 as shown. The quartz monitor 114 controls the deposition rate of the optical material by feeding back signals to the electron beam power supply, so that the deposition rate of the coating material can be kept substantially constant. The fiber 112 is positioned over the transparent glass sheet 116 to avoid itself being deposited by the material within the vacuum chamber 102. The fiber measures the reflectivity to determine when the deposition of the layers of the coating material should stop because the target design thickness has been reached.

第1C圖係第1A圖中透明玻璃板116之圓圈區域之放大圖，係顯示光纖112、石英監視器114和透明玻璃板116之相對方位。石英監視器114係定位在透明玻璃板116之中間且通過開口116a。光纖112係定位在石英監視器114之側邊。從光纖112發射之光線通過透明玻璃板116且被反射回來，因為透明玻璃板表面被鍍膜。鄰近%R之箭頭係示意地描繪，當透明玻璃板正被鍍膜時，來自透明玻璃板之表面116b之光線的反射。反射係隨著塗佈在透明玻璃板之表面116b的鍍膜厚度增加而增強。反射自透明玻璃板之表面116b之光線被引導回到與電子束源之控制器(圖未示)相耦合的光學感測器(圖未示)。光學感測器之輸出(係表示所塗佈光學鍍膜和/或ETC鍍膜之厚度)係被控制器使用來決定鍍膜的沉積厚度。藉此，反射光線可使用來控制個別層、鍍膜週期和整個光學鍍膜之沉積厚度以及ETC鍍膜之沉積厚度。Fig. 1C is an enlarged view of the circled area of the transparent glass plate 116 in Fig. 1A showing the relative orientation of the optical fiber 112, the quartz monitor 114, and the transparent glass plate 116. The quartz monitor 114 is positioned in the middle of the transparent glass plate 116 and passes through the opening 116a. The fiber 112 is positioned on the side of the quartz monitor 114. Light emitted from the optical fiber 112 passes through the transparent glass plate 116 and is reflected back because the surface of the transparent glass plate is coated. The arrow adjacent to %R is a schematic depiction of the reflection of light from surface 116b of the transparent glass sheet as the transparent glass sheet is being coated. The reflection system is enhanced as the thickness of the coating applied to the surface 116b of the transparent glass plate is increased. Light reflected from surface 116b of the transparent glass sheet is directed back to an optical sensor (not shown) coupled to a controller (not shown) of the electron beam source. The output of the optical sensor (representing the thickness of the coated optical coating and/or ETC coating) is used by the controller to determine the deposited thickness of the coating. Thereby, the reflected light can be used to control the deposition thickness of the individual layers, the plating cycle and the entire optical coating, and the deposited thickness of the ETC coating.

圓頂110頂部係貼附在以雙平行虛線表示之真空屏蔽旋轉軸117。真空屏蔽旋轉軸117具有貼附在真空屏蔽旋轉軸上用於旋轉真空屏蔽旋轉軸117和圓頂110之真空密封軸承119。因此，應當理解的是真空屏蔽旋轉軸117係真空密封到圓頂110頂部。真空屏蔽旋轉軸117係由位於真空腔室102外部之外部馬達(圖未示)所驅動。於一實施例中，圓頂110可以在從大約20 rpm到大約120 rpm之旋轉頻率範圍內被轉動。於另一實施例中，旋轉頻率範圍係介於大約40 rpm到大約83 rpm之間。The top of the dome 110 is attached to a vacuum shielded rotating shaft 117 indicated by double parallel dashed lines. The vacuum shield rotating shaft 117 has a vacuum sealed bearing 119 attached to the vacuum shield rotating shaft for rotating the vacuum shield rotating shaft 117 and the dome 110. Therefore, it should be understood that the vacuum shield rotating shaft 117 is vacuum sealed to the top of the dome 110. The vacuum shield rotating shaft 117 is driven by an external motor (not shown) located outside the vacuum chamber 102. In one embodiment, the dome 110 can be rotated over a range of rotational frequencies from about 20 rpm to about 120 rpm. In another embodiment, the rotational frequency range is between about 40 rpm and about 83 rpm.

第2圖係示意地描繪圓頂110之區塊110a。如第2圖所示，複數個基板載具130係磁性地貼附在圓頂110上。基板載具130係被使用來固定玻璃基板在鍍膜裝置100內進行鍍膜。Figure 2 schematically depicts block 110a of dome 110. As shown in FIG. 2, a plurality of substrate carriers 130 are magnetically attached to the dome 110. The substrate carrier 130 is used to fix the glass substrate and is coated in the coating device 100.

第3A圖係圖示圓頂110之區塊110a之傾斜上側視圖，其係顯示唇部161和複數個磁性貼附在圓頂110上之基板載具130。第3B圖係被使用來支撐複數個區塊110a之框架160之圖示。框架160具有外側唇部161 (如於第3A圖所描繪)、鄰近開口164且真空屏蔽旋轉軸117(圖未示)可貼附於此之內側緣(無編號)及自內側緣徑向地向外延伸之複數個輻條162。輻條162係足夠寬以容納如圖示於168之圓頂區塊之側邊緣。3A is an oblique upper side view of block 110a of dome 110 showing lip 161 and a plurality of substrate carriers 130 magnetically attached to dome 110. Figure 3B is an illustration of a frame 160 that is used to support a plurality of blocks 110a. The frame 160 has an outer lip 161 (as depicted in FIG. 3A), adjacent the opening 164 and a vacuum shielded rotating shaft 117 (not shown) to which the inner edge (not numbered) can be attached and radially from the inner edge A plurality of spokes 162 extending outward. The spokes 162 are wide enough to accommodate the side edges of the dome block as shown at 168.

第17A圖係鍍膜裝置之另一實施例之簡單圖示，其係用於將光學鍍膜和ETC鍍膜沉積在基板上。於此實施例中，鍍膜裝置包括遮蓋圓頂選定區域之遮罩127，以改善沉積在基板上之光學鍍膜之均勻度。用於可調整地支撐遮罩127之支架沒有描繪在第17A圖中。在第17A圖中之鍍膜裝置中，電漿源係離子源118a。因被用來氣化光學鍍膜材料之離子源118a和電子束源120係位於真空腔室內不同側，離子源不會被遮罩所遮擋，因此可改善離子源118a對於所沉積光學鍍膜材料進行硬化之功效。離子源係用來使光學鍍膜材料變得密實以接近本體密度(bulk density)，藉此增加光學鍍膜之硬度並改善光學鍍膜之刮損可靠度/抗刮損性。Figure 17A is a simplified illustration of another embodiment of a coating apparatus for depositing an optical coating and an ETC coating on a substrate. In this embodiment, the coating apparatus includes a mask 127 that covers a selected area of the dome to improve the uniformity of the optical coating deposited on the substrate. The bracket for adjustably supporting the mask 127 is not depicted in Figure 17A. In the coating apparatus of Fig. 17A, the plasma source is an ion source 118a. Since the ion source 118a and the electron beam source 120 used to vaporize the optical coating material are located on different sides of the vacuum chamber, the ion source is not blocked by the mask, thereby improving the hardening of the deposited optical coating material by the ion source 118a. The effect. The ion source is used to make the optical coating material dense to approximate bulk density, thereby increasing the hardness of the optical coating and improving the scratch reliability/scratch resistance of the optical coating.

第21A圖係示意地描繪用於將光學鍍膜和ETC鍍膜沉積到基板上之鍍膜裝置500之另一實施例。鍍膜裝置500之截面圖係示意地描繪於第21B圖。於此實施例中，鍍膜裝置500包括具有旋轉圓頂110之真空腔室102，旋轉圓頂110包含磁性材料，如相對於第1圖所敍。旋轉圓頂係耦合至設置在真空密封軸承119內之真空屏蔽旋轉軸117，以助於圓頂在真空腔室內之旋轉。圓頂也包括具有石英監視器114之透明玻璃板116及光纖112，其係共同地被使用來監視和控制塗佈於基板上之鍍膜沉積速率，基板係貼附於圓頂，如相對於　上文第1A-1C圖所述。Figure 21A schematically depicts another embodiment of a coating apparatus 500 for depositing an optical coating and an ETC coating onto a substrate. A cross-sectional view of the coating apparatus 500 is schematically depicted in Figure 21B. In this embodiment, the coating apparatus 500 includes a vacuum chamber 102 having a rotating dome 110 that includes a magnetic material, as described with respect to FIG. The rotating dome is coupled to a vacuum shielded rotating shaft 117 disposed within the vacuum sealed bearing 119 to facilitate rotation of the dome within the vacuum chamber. The dome also includes a transparent glass plate 116 having a quartz monitor 114 and an optical fiber 112 that are commonly used to monitor and control the deposition rate of the coating applied to the substrate, the substrate being attached to the dome, such as relative to This is described in Figure 1A-1C.

鍍膜裝置500也包括具有複數個舟皿126之光學鍍膜載具124，舟皿126係含有光學鍍膜材料。舟皿126係用於包含用於將光學鍍膜層沉積至基板之不同材料之分離的來源容器，基板係固定於圓頂110底面。舟皿126含有不同的光學鍍膜材料，以便一次僅塗佈一種鍍膜材料(例如，高折射率材料、低折射率材料或者中等折射率材料)。於此實施例中，鍍膜裝置500包括第一電子束源120a、第二電子束源120b和電子束反射鏡122。第一電子束源120a、第二電子束源120b和電子束反射鏡122被安排成使得發射自各電子束源之電子束被引導到電子束反射鏡122且從電子束反射鏡122再引導到位在光學鍍膜載具124上之舟皿126內的單一光學鍍膜材料，以共同將光學鍍膜材料氣化。已經被發現的是使用多重電子束源用來共同氣化單一光學鍍膜材料可以強化沉積在基板上之生成鍍膜之厚度均勻度。額外地或替代地，第一電子束源120a發射第一電子束至電子束反射鏡122，使得第一電子束被引導回包含於舟皿126內的第一光學鍍膜材料且第二電子束源120b發射第二電子束至電子束反射鏡122，使得第二電子束被再引導回包含於不同舟皿126內的第二光學鍍膜材料。於一個或多個實施例中，第一光學鍍膜材料係不同於第二光學鍍膜材料。於實施例中，第一光學鍍膜材料包含一種高折射率材料且第二光學鍍膜材料包含一種中等或低折射率材料。於實施例中，可使用超過一個的反射鏡，使得一個反射鏡(圖未示)再引導第一電子束且第二個反射鏡(圖未示)再引導第二電子束。The coating apparatus 500 also includes an optical coating carrier 124 having a plurality of boats 126, the boat 126 containing an optical coating material. The boat 126 is used to separate the source containers of the different materials used to deposit the optical coating layer onto the substrate, the substrate being secured to the bottom surface of the dome 110. The boat 126 contains different optical coating materials to coat only one coating material (e.g., a high refractive index material, a low refractive index material, or a medium refractive index material) at a time. In this embodiment, the coating apparatus 500 includes a first electron beam source 120a, a second electron beam source 120b, and an electron beam mirror 122. The first electron beam source 120a, the second electron beam source 120b, and the electron beam mirror 122 are arranged such that electron beams emitted from the respective electron beam sources are directed to the electron beam mirror 122 and redirected from the electron beam mirror 122 to the position A single optical coating material within the boat 126 on the optical coating carrier 124 is used to vaporize the optical coating material together. It has been discovered that the use of multiple electron beam sources for co-gasification of a single optical coating material enhances the uniformity of the thickness of the resulting coating deposited on the substrate. Additionally or alternatively, the first electron beam source 120a emits a first electron beam to the electron beam mirror 122 such that the first electron beam is directed back to the first optical coating material contained within the boat 126 and the second electron beam source 120b emits a second electron beam to electron beam mirror 122 such that the second electron beam is redirected back to the second optical coating material contained within the different boat 126. In one or more embodiments, the first optical coating material is different than the second optical coating material. In an embodiment, the first optical coating material comprises a high refractive index material and the second optical coating material comprises a medium or low refractive index material. In an embodiment, more than one mirror may be used such that one mirror (not shown) redirects the first electron beam and a second mirror (not shown) redirects the second electron beam.

於此實施例中，鍍膜裝置500進一步包括可調整地可定位於真空腔室102內部之第一遮罩125和在真空腔室102內部具固定位置之第二遮罩129。第一遮罩係可在伸展位置(描繪於第21A圖)和縮回位置(圖未示)之間調整，伸展位置係第一遮罩125定位於諸電子束源之至少之一和旋轉圓頂之間，縮回位置係第一遮罩非定位於旋轉圓頂和任一電子束源之間。特別地，在實施例中，第一遮罩125可包含耦合於例如電動馬達或類似者之致動器175之第一位置180，其係將第一遮罩125從伸展位置旋轉到縮回位置。在實施例中，第一遮罩125可包含樞接於第一位置180之第二位置181。當第一遮罩旋轉至縮回位置時( 意即，當第一遮罩以第21A圖中之順時針方向向下旋轉時)，第二位置181可以摺向第一位置180。In this embodiment, the coating apparatus 500 further includes a first mask 125 that is adjustably positionable within the vacuum chamber 102 and a second mask 129 that has a fixed position within the vacuum chamber 102. The first mask is adjustable between an extended position (depicted in FIG. 21A) and a retracted position (not shown), the extended position being the first mask 125 positioned at least one of the electron beam sources and the rotating circle Between the tops, the retracted position is such that the first mask is not positioned between the rotating dome and any of the electron beam sources. In particular, in an embodiment, the first mask 125 can include a first position 180 coupled to an actuator 175, such as an electric motor or the like, that rotates the first mask 125 from the extended position to the retracted position. . In an embodiment, the first mask 125 can include a second location 181 that is pivotally coupled to the first location 180. When the first mask is rotated to the retracted position (ie, when the first mask is rotated downward in the clockwise direction in FIG. 21A), the second position 181 can be folded toward the first position 180.

在示意地描繪於第21B圖之鍍膜裝置500之截面圖中，第一遮罩125當其位於伸展位置時，係定位在第一電子束源120a和圓頂110之底面(圖未示)之間。第二遮罩129係固定地定位在電子束源120b和圓頂110之底面(圖未示)之間。第一遮罩125可被伸展或縮回係取決於被沉積之光學鍍膜材料之種類。例如，當Nb₂ O₅ 沉積時，第一遮罩125可以在縮回位置。然而，當SiO₂ 沉積時，第一遮罩125可以在伸展位置。遮罩係使用來提升被沉積光學鍍膜之厚度均勻度，而不管基板是在圓頂上哪個位置。特別地參考第22圖，蒸鍍自點來源400之鍍膜材料沉積厚度通常係根據關係式Cosⁿ (θ)/R² 而變化，其中n係與材料和製程參數相關且R是蒸鍍源和被鍍膜基板140間之距離，且θ是至點來源之垂直法向量(vertical normal) 402與被鍍膜基板140表面之法線404之間的夾角，如第22圖所示意描繪。因此，電漿源之位置、電子束源之位置和圓頂的形狀和直徑，每一個將影響到沉積在基板上鍍膜的厚度。描繪於第22圖的輪廓線410係示意地描繪出距離點來源400一給定距離R之材料沉積厚度。一特定曲線上每一分離的位置將具有大約相同的沉積材料厚度。給定沉積鍍膜厚度的潛在變化，定位於真空腔室內部之均勻度遮罩係適當地被成形及定位以提供均勻的鍍膜厚度給定位在圓頂不同區域的基板，其係藉由當圓頂上的基板在真空腔室內旋轉時，提供將基板間歇地遮擋鍍膜材料之遮罩來達成。In a cross-sectional view schematically depicted in the coating apparatus 500 of FIG. 21B, the first mask 125 is positioned on the bottom surface (not shown) of the first electron beam source 120a and the dome 110 when it is in the extended position. between. The second mask 129 is fixedly positioned between the electron beam source 120b and the bottom surface (not shown) of the dome 110. The first mask 125 can be stretched or retracted depending on the type of optical coating material being deposited. For example, when Nb ₂ O _{5 is} deposited, the first mask 125 can be in the retracted position. However, when SiO _{2 is} deposited, the first mask 125 can be in the extended position. A mask is used to increase the thickness uniformity of the deposited optical coating regardless of where the substrate is on the dome. With particular reference to Figure 22, the deposition thickness of the deposited material from the point source 400 is typically varied according to the relationship Cos ⁿ (θ)/R ² , where n is related to the material and process parameters and R is the evaporation source and The distance between the coated substrates 140, and θ is the angle between the vertical normal 402 of the point source and the normal 404 of the surface of the substrate to be coated 140, as depicted in Fig. 22. Thus, the location of the plasma source, the location of the electron beam source, and the shape and diameter of the dome each will affect the thickness of the coating deposited on the substrate. The outline 410 depicted in Fig. 22 schematically depicts the material deposition thickness from a point source 400 a given distance R. Each separate location on a particular curve will have approximately the same deposited material thickness. Given the potential variation in the thickness of the deposited coating, the uniformity mask positioned within the vacuum chamber is suitably shaped and positioned to provide a uniform coating thickness to the substrate positioned in different regions of the dome, by being on the dome When the substrate is rotated in the vacuum chamber, a mask is provided to intermittently block the coating material.

此外，鍍膜裝置500也包括至少一熱蒸鍍源128。熱蒸鍍源128係用於將ETC鍍膜材料氣化以加速將鍍膜材料沉積在固定在圓頂110底面的基板上。該至少一熱蒸鍍源128係定位在真空腔室102內，圓頂110下方。於實施例中，液態ETC鍍膜材料係放置在鋼絲絨填充之銅坩堝或者多孔陶瓷材料填充之銅坩堝。坩堝被熱蒸鍍源128加熱而將ETC鍍膜材料氣化，接著ETC鍍膜材料被沉積在位於旋轉圓頂110底面之基板上。In addition, the coating apparatus 500 also includes at least one thermal evaporation source 128. The thermal evaporation source 128 is used to vaporize the ETC coating material to accelerate deposition of the coating material on the substrate fixed to the bottom surface of the dome 110. The at least one thermal evaporation source 128 is positioned within the vacuum chamber 102 below the dome 110. In an embodiment, the liquid ETC coating material is placed in a steel wool filled copper crucible or a porous ceramic filled copper crucible. The crucible is heated by the thermal evaporation source 128 to vaporize the ETC coating material, and then the ETC coating material is deposited on the substrate on the bottom surface of the rotating dome 110.

鍍膜裝置500也包括例如離子束源之電漿源。如參考上文第1A圖所述，電漿源118係位於真空腔室102內，圓頂110下方且通常係被定向向上發射離子或電漿到圓頂110之底面，藉此使塗佈到貼附於圓頂底部之基板上之光學鍍膜變得密實且/或被硬化。於本文所述之實施例，電漿源係垂直定向且定位於真空腔室102內部，使得電漿源118係位於自旋轉圓頂110之旋轉軸171徑向地向外且自電漿源118射出之電漿係從圓頂之至少一中心到旋轉圓頂之至少一外邊緣172而入射到旋轉圓頂110之底面。例如，在實施例中，電漿源118係被定位使得旋轉圓頂110之旋轉軸171至電漿源118間之距離S係大於電漿源118至凸出周邊173(意即，被旋轉圓頂110之旋轉所限制之圓柱體的周邊)間之距離S’。此外，電漿源118和圓頂110底面之間的路徑係不被遮擋(例如被遮罩或類似者所遮擋)，其係增加入射到圓頂110底面之電漿數量。以此種方式之電漿源118定位係減少電漿源和圓頂底面間之平均距離，其因此改善塗佈到貼附於圓頂底部之基板上之鍍膜的密實化程度。光學鍍膜材料所增加的密度係改善鍍膜的抗刮損性。於實施例中，鍍膜裝置500也可包括中和器(neutralizer) 121，中和器121係被定位以投射電子雲(electron cloud)到發射自電漿源118之電漿路徑中。特別地，發射自電漿源118之電漿可包括帶電離子(例如Ar⁺¹ 離子、O⁺¹ 離子和/或O⁺² 離子)，其係被陽極所加速而奔向基板。一旦該等帶電離子抵達基板，其可能排斥同樣地帶電離子，因此消除了電漿輔助沉積的效果。為克服此問題，中和器121被使用來引導電子雲到發射自電漿源118之電漿路徑中。中和器121包括例如熱燈絲及/或高通率/高速率之電子發射元件之電子發射器。於某些實施例中，電子發射器可包括空心陰極(hollow cathode)。發射自中和器之電子雲與電漿中之帶電離子互相作用，藉此中和電荷(例如，Ar⁺¹ 離子→ Ar⁰ 、O⁺¹ 離子→ O₂ ，等等)。Coating apparatus 500 also includes a plasma source such as an ion beam source. As described with reference to Figure 1A above, the plasma source 118 is located within the vacuum chamber 102, below the dome 110 and is typically directed upwardly to emit ions or plasma onto the bottom surface of the dome 110, thereby allowing application to The optical coating on the substrate attached to the bottom of the dome becomes dense and/or hardened. In the embodiments described herein, the plasma source is oriented vertically and positioned within the vacuum chamber 102 such that the plasma source 118 is located radially outward of the rotating shaft 171 of the spin dome 110 and from the plasma source 118. The injected plasma is incident on the bottom surface of the rotating dome 110 from at least one center of the dome to at least one outer edge 172 of the rotating dome. For example, in an embodiment, the plasma source 118 is positioned such that the distance S between the rotating shaft 171 of the rotating dome 110 and the plasma source 118 is greater than the plasma source 118 to the convex perimeter 173 (ie, rotated round) The distance S' between the circumferences of the cylinders limited by the rotation of the top 110. Moreover, the path between the plasma source 118 and the bottom surface of the dome 110 is unobstructed (e.g., obscured by a mask or the like) which increases the amount of plasma incident on the bottom surface of the dome 110. The positioning of the plasma source 118 in this manner reduces the average distance between the source of plasma and the bottom surface of the dome, which thus improves the degree of densification of the coating applied to the substrate attached to the bottom of the dome. The increased density of the optical coating material improves the scratch resistance of the coating. In an embodiment, the coating apparatus 500 can also include a neutralizer 121 that is positioned to project an electron cloud into a plasma path that is emitted from the plasma source 118. In particular, the plasma emitted from the plasma source 118 can include charged ions (eg, Ar ⁺¹ ions, O ⁺¹ ions, and/or O ^{+ 2} ions) that are accelerated by the anode to the substrate. Once the charged ions reach the substrate, they may repel the same charged ions, thus eliminating the effect of plasma assisted deposition. To overcome this problem, neutralizer 121 is used to direct the electron cloud into the plasma path that is emitted from plasma source 118. The neutralizer 121 includes an electron emitter such as a hot filament and/or a high-pass/high-rate electron-emitting element. In certain embodiments, the electron emitter can comprise a hollow cathode. The electron cloud emitted from the neutralizer interacts with the charged ions in the plasma to neutralize the charge (eg, Ar ⁺¹ ions → Ar ⁰ , O ⁺¹ ions → O ₂ , etc.).

現在參考第4A和4B圖，其係示意地描繪用於承載單一尺寸基板之基板載具130。如第4A圖所圖示，基板載具130具有非磁性基板載具底座131、用於可拆卸地固定將被鍍膜之基板之滯留表面131a、定位於滯留表面131a相對側之底面131b以及用於將載具磁性貼附於圓頂110和用於將基板載具自圓頂偏置一段距離之複數個磁鐡134。於一個或多個實施例中，基板係可拆卸地固定在基板載具之滯留表面131a。各種不同的機構可使用來將基板載具可拆卸地固定在滯留表面。描繪於第4A和4B圖之實施例中，基板載具130也可包括用於支撐基板140表面之複數根插銷136(圖示於第4B圖)及彈簧系統132。彈簧系統132通常包括由彈簧133(示意地描繪成箭頭)適當地定位之可伸縮插銷138a以及複數個固定插銷138b，彈簧133係將可伸縮插銷138a往箭頭指示之方向偏置。插銷138a和138b係使用於當玻璃基板正在鍍膜時，將基板140(由虛線表示)握持在基板載具130上之適當位置。特別地，當基板140定位在基板載具130之滯留表面131a上時，基板邊緣之一部分鄰接插銷138b且彈簧系統132被排列以偏置插銷138a而接觸基板之相對側，藉此可拆卸地將基板保持在插銷138a、138b之間。於一實施例中，插銷138a、138b係排列在基板載具底座131上，使得插銷沒有任何部分延伸超過基板表面，藉此提升玻璃基板整個鍍膜表面上之鍍膜厚度均勻度。於另一實施例中(相對於第5圖於本文進一步地討論)，插銷係被建構和排列在基板載具底座131上，以將塗佈在基板上鍍膜厚度之變動最小化。第4B圖係第4A圖之側視圖，其係圖示基板140、複數個磁鐡134和側止動件150，基板140係支撐在插銷136上，插銷136係從滯留表面131a延伸進入非磁性基板載具底座131一段距離；磁鐡134係從基板載具130之滯留表面131a下方延伸而穿過基板超過底面131b一段距離；側止動件150係從非磁性基板載具底座131延伸到離基板140之頂面140a一段距離，基板140係可拆卸地固定在滯留表面131a上。側止動件150將玻璃基板定向在非磁性基板載具底座131上而不會影響鍍膜之塗佈，藉此避免玻璃基板表面上之「陰影」。特別地，玻璃基板之頂面140a係將被鍍上光學鍍膜和容易清潔鍍膜之表面。側止動件150之尺寸大小係使得側止動件150不會延伸超過基板140之頂面140a，基板140係可拆卸地固定在滯留表面131a上。對於具有5 mm厚度之玻璃基板，側止動件150之頂部將位於基板140之頂面140a下方2-3 mm之範圍內。基板載具中間之開口(無編號)可減少載具之重量。Reference is now made to Figures 4A and 4B, which schematically depict a substrate carrier 130 for carrying a single size substrate. As shown in FIG. 4A, the substrate carrier 130 has a non-magnetic substrate carrier base 131, a retention surface 131a for detachably fixing the substrate to be coated, a bottom surface 131b positioned on the opposite side of the retention surface 131a, and The carrier is magnetically attached to the dome 110 and a plurality of magnetic turns 134 for biasing the substrate carrier a distance from the dome. In one or more embodiments, the substrate is detachably secured to the retention surface 131a of the substrate carrier. A variety of different mechanisms can be used to detachably secure the substrate carrier to the retention surface. In the embodiment depicted in Figures 4A and 4B, the substrate carrier 130 can also include a plurality of pins 136 (shown in Figure 4B) for supporting the surface of the substrate 140 and a spring system 132. The spring system 132 generally includes a retractable latch 138a that is suitably positioned by a spring 133 (schematically depicted as an arrow) and a plurality of fixed latches 138b that bias the telescoping latch 138a in the direction indicated by the arrow. The pins 138a and 138b are used to hold the substrate 140 (indicated by the dashed line) in position on the substrate carrier 130 when the glass substrate is being coated. In particular, when the substrate 140 is positioned on the retention surface 131a of the substrate carrier 130, one of the edge portions of the substrate abuts the latch 138b and the spring system 132 is arranged to bias the latch 138a to contact the opposite side of the substrate, thereby detachably The substrate is held between the pins 138a, 138b. In one embodiment, the pins 138a, 138b are arranged on the substrate carrier base 131 such that no part of the plug extends beyond the surface of the substrate, thereby increasing the uniformity of the coating thickness over the entire coated surface of the glass substrate. In another embodiment (discussed further herein with respect to FIG. 5), the pins are constructed and arranged on the substrate carrier base 131 to minimize variations in coating thickness applied to the substrate. 4B is a side view of FIG. 4A, which illustrates a substrate 140, a plurality of magnetic turns 134, and side stops 150. The substrate 140 is supported on the pins 136, and the pins 136 extend from the retention surface 131a into the non-magnetic state. The substrate carrier base 131 has a distance; the magnetic raft 134 extends from below the retention surface 131a of the substrate carrier 130 and passes through the substrate over the bottom surface 131b; the side stopper 150 extends from the non-magnetic substrate carrier base 131 to The substrate 140 is detachably fixed to the retention surface 131a at a distance from the top surface 140a of the substrate 140. The side stops 150 orient the glass substrate on the non-magnetic substrate carrier base 131 without affecting the application of the coating, thereby avoiding "shadows" on the surface of the glass substrate. In particular, the top surface 140a of the glass substrate will be plated with an optical coating and the surface of the coating can be easily cleaned. The side stops 150 are sized such that the side stops 150 do not extend beyond the top surface 140a of the substrate 140, and the substrate 140 is removably secured to the retention surface 131a. For a glass substrate having a thickness of 5 mm, the top of the side stop 150 will be located within 2-3 mm below the top surface 140a of the substrate 140. The opening (unnumbered) in the middle of the substrate carrier reduces the weight of the carrier.

僅管第4A和4B圖顯示磁鐡134在基板載具底座131內之特定排列，應當理解的是也可考慮其他的排列。例如，在實施例中，磁鐡134可排列在基板載具底座131內，將磁鐡磁場影響鍍膜製程之效應最小化，例如互斥的離子和/或沉積在基板上特定的圖案。參考第4C圖，基板載具底座131具有在相對於底面131b之基板滯留表面上之基板滯留區141(以虛線示意地描繪)。基板滯留區141之面積係小於基板滯留表面之面積且磁鐡134定位於基板載具底座131之底面131b上且定位於基板滯留區141之周邊142之外。將磁鐡134放置在基板滯留區141之周邊142之外係可減緩每一磁鐡134之磁場對於鍍膜製程之效應。敍於本文之實施例中，磁鐡可以是適當的大小以迎合保持在基板滯留表面上之基板的大小和重量。例如，較大的磁鐡可和大小調整為握持較大基板之基板載具底座一起使用，然而較小的磁鐡可和大小調整為握持較小基板之基板載具底座一起使用。Although Figures 4A and 4B show a particular arrangement of the magnetic rafts 134 within the substrate carrier base 131, it should be understood that other arrangements are also contemplated. For example, in an embodiment, the magnetic rafts 134 can be arranged within the substrate carrier mount 131 to minimize the effects of the magnetic field magnetic field on the coating process, such as mutually exclusive ions and/or a particular pattern deposited on the substrate. Referring to FIG. 4C, the substrate carrier base 131 has a substrate retention zone 141 (depicted schematically in phantom) on the substrate retention surface relative to the bottom surface 131b. The area of the substrate retention zone 141 is smaller than the area of the substrate retention surface and the magnetic disk 134 is positioned on the bottom surface 131b of the substrate carrier base 131 and positioned outside the perimeter 142 of the substrate retention zone 141. Placing the magnetic rafts 134 outside the perimeter 142 of the substrate retention zone 141 slows the effect of the magnetic field of each magnetic iridium 134 on the coating process. In the embodiments described herein, the magnetic enthalpy may be of a suitable size to cater for the size and weight of the substrate held on the substrate retention surface. For example, a larger magnetic disk can be used with a substrate carrier base that is sized to hold a larger substrate, whereas a smaller magnetic disk can be used with a substrate carrier base that is sized to hold a smaller substrate.

現在參考第15圖，其係描繪類似圖示於第4A圖之固定基板載具130之可調式基板載具130a。可調式基板載具130a具有包括複數個磁鐡134之非磁性基板載具底座131，磁鐡134係將可調式基板載具貼附於上述鍍膜裝置之圓頂。可調式基板載具130a也包括一個或多個機構或黏合助劑，用於將一片或多片的基板可拆卸地固定於基板載具130a，或更特定地，固於於基板載具之滯留表面131a。在顯示於第15圖之實施例中，機構或黏合助劑係包括自基板載具之滯留表面131a延伸之複數根插銷136，係用於支撐可拆卸地固定於可調式基板載具130a上之玻璃基板表面。機構或黏合助劑可包括外殼138aa，其係定位鄰近於可調式基板載具130a之邊緣且收容可伸縮插銷138a (被描繪成部分地延伸出外殼)。外殼138aa包括定位於外殼138aa內之彈簧(圖未示)。彈簧係將可伸縮插銷138a自外殼138aa向外偏置。可調式基板載具130a可選擇地包括用於將玻璃基板在可調式基板載具130a進行定向之側止動件150a (未顯示於第15圖)。在描繪於第15圖之實施例中，可調式基板載具130a進一步包括用於握持玻璃基板邊緣之複數根移動式插銷139。移動式插銷139係定位於軌道137內以加速移動式插銷139相對於可調式基板載具130a進行可調整地定位。移動式插銷139與可伸縮插銷138a相結合能夠使用單一載具來承載不同尺寸的基板。一片基板或數片基板可***銷和相對於第4A和4B圖之上述相同方式之選擇性側止動件150a所握持，為要在基板上形成去陰影之鍍膜。此外，磁鐡134可定位在基板滯留區之周邊之外，如上述相對於第4C圖所敍。Referring now to Figure 15, a tunable substrate carrier 130a similar to the fixed substrate carrier 130 illustrated in Figure 4A is depicted. The adjustable substrate carrier 130a has a non-magnetic substrate carrier base 131 including a plurality of magnetic 134s, and the magnetic 134 is attached to the dome of the coating device. The adjustable substrate carrier 130a also includes one or more mechanisms or adhesive auxiliaries for detachably securing one or more of the substrates to the substrate carrier 130a or, more specifically, to the substrate carrier. Surface 131a. In the embodiment shown in Figure 15, the mechanism or adhesive aid includes a plurality of pins 136 extending from the retention surface 131a of the substrate carrier for supporting the detachable attachment to the adjustable substrate carrier 130a. The surface of the glass substrate. The mechanism or bonding aid can include a housing 138aa positioned adjacent the edge of the adjustable substrate carrier 130a and receiving a retractable latch 138a (depicted as extending partially out of the housing). The outer casing 138aa includes a spring (not shown) positioned within the outer casing 138aa. The spring biases the retractable latch 138a outwardly from the housing 138aa. The adjustable substrate carrier 130a can optionally include a side stop 150a (not shown in Figure 15) for orienting the glass substrate on the adjustable substrate carrier 130a. In the embodiment depicted in Figure 15, the adjustable substrate carrier 130a further includes a plurality of mobile latches 139 for gripping the edges of the glass substrate. The mobile latch 139 is positioned within the track 137 to accelerate the adjustable positioning of the mobile latch 139 relative to the adjustable substrate carrier 130a. The mobile latch 139 in combination with the retractable latch 138a enables the use of a single carrier to carry substrates of different sizes. A single substrate or a plurality of substrates can be held by the pins and the selective side stoppers 150a in the same manner as described above in Figs. 4A and 4B, in order to form a shadow-free coating on the substrate. Additionally, the magnetic raft 134 can be positioned outside of the perimeter of the substrate retention zone, as described above with respect to FIG. 4C.

現在參考第20A圖，其係示意地描繪基板載具130b之另一實施例。於此實施例中，基板載具130係使用設置在基板滯留區中之滯留表面131a上之一層黏合材料143來可　拆卸地收納將被鍍膜之基板。黏合劑之使用排除了可能導致塗佈鍍膜厚度變異之機械固定件之需求。黏合材料143通常包含壓敏接觸黏合劑。適當的材料可包括，但不受限於，丙烯酸類黏合劑、橡膠黏合劑、矽膠黏合劑和/或類似的壓敏黏合劑。或者，基板可使用靜電荷而被握持在滯留表面131a上，例如當帶靜電荷薄膜被定位在滯留表面131a上且作為一種黏合材料時。該等材料允許基板在鍍膜過程中被堅固地貼附在基板載具130b，且特別地貼附在滯留表面131a上，但鍍膜完成後，也允許基板容易地自基板載具130b被移除。磁鐡134可定位在基板滯留區之周邊之外，如上述相對於第4C圖所敍。再者，在滯留表面使用一層黏合材料143能夠使用單一尺寸基板載具來承載不同尺寸和/或形狀之基板且也允許多重基板被貼附於單一基板載具。Referring now to Figure 20A, another embodiment of a substrate carrier 130b is schematically depicted. In this embodiment, the substrate carrier 130 detachably houses the substrate to be coated by using one of the layer bonding materials 143 provided on the retention surface 131a of the substrate retention region. The use of adhesives eliminates the need for mechanical fasteners that can cause variations in coating thickness. Adhesive material 143 typically comprises a pressure sensitive contact adhesive. Suitable materials may include, but are not limited to, acrylic adhesives, rubber adhesives, silicone adhesives, and/or similar pressure sensitive adhesives. Alternatively, the substrate may be held on the retention surface 131a using an electrostatic charge, such as when the electrostatically charged film is positioned on the retention surface 131a and as a bonding material. These materials allow the substrate to be firmly attached to the substrate carrier 130b during the coating process, and in particular to the retention surface 131a, but after the coating is completed, the substrate is also allowed to be easily removed from the substrate carrier 130b. The magnetic raft 134 can be positioned outside of the perimeter of the substrate retention zone, as described above with respect to Figure 4C. Furthermore, the use of a layer of bonding material 143 on the retention surface enables the use of a single size substrate carrier to carry substrates of different sizes and/or shapes and also allows multiple substrates to be attached to a single substrate carrier.

現在參考描繪於第20B圖中之基板載具130b之截面圖，在實施例中黏合材料143係定位在聚合物薄膜144上方，接著，聚合物薄膜144被黏貼至基板載具底座131之滯留表面131a上。在實施例中，聚合物薄膜可以是熱塑聚合物薄膜，例如聚乙烯(polyethylene)薄膜或聚酯(polyester)聚合物薄膜。Referring now to the cross-sectional view of the substrate carrier 130b depicted in FIG. 20B, in the embodiment the adhesive material 143 is positioned over the polymer film 144, and then the polymer film 144 is adhered to the retention surface of the substrate carrier base 131. On 131a. In an embodiment, the polymeric film can be a thermoplastic polymer film such as a polyethylene film or a polyester polymer film.

在某些實施例中，聚合物薄膜可以是能夠被靜電充電(statically charged)之聚合物薄膜。在該等實施例中，不需要分離的黏合材料，係因為靜電充電薄膜係作為用於將基板可拆卸地保持在滯留表面131a上之黏合劑。適合的靜電充電薄膜包括，但不受限於，英國聚乙烯工業有限公司(British Polyethylene Industries Limited)生產的維斯昆膜(Visqueen film)。In certain embodiments, the polymeric film can be a polymeric film that can be electrostatically charged. In such embodiments, a separate adhesive material is not required because the electrostatically charged film acts as a bond for releasably retaining the substrate on the retention surface 131a. Suitable electrostatic charging films include, but are not limited to, Visqueen film manufactured by British Polyethylene Industries Limited.

基板載具130、130a、130b具有非磁性基板載具底座131以及用於將載具握持於圓頂110和用於將載具自圓頂偏置一段距離之複數個磁鐡134。該等磁性載具之使用對於使用於例如透鏡之光學元件鍍膜之圓頂載具而言係一種改善。例如，第16A圖係圖示具有用於定位將被鍍膜透鏡之複數個開口302之習知圓頂載具300。當透鏡被鍍膜時，其係被置入載具之開口內。然而在此習知設計之中，在圓頂之內外兩側均均地鍍膜係有困難的。保持鍍膜材料遠離不被鍍膜之透鏡表面也是有困難的。此外，當圓頂加熱時，被鍍膜部分可相對於圓頂開口而移動，導致鍍膜之後圓頂冷卻而破裂。例如，第16B圖係圖示透鏡304自圓頂載具之開口302內之一個支座肩部306滑落。顯而易見地，若載具冷卻得比透鏡304還快，載具的收縮將造成透鏡的破裂。在本申請案中，因為基板載具係藉由將載具握持到圓頂之磁鐡自圓頂而偏置一段距離，熱傳被最小化且當圓頂冷卻時不會發生破裂。此外，僅有玻璃製品被鍍膜之一側係容易受到鍍膜材料之影響，因為載具/基板的汙染接近圓頂內部表面。結果，上文所敍在習知圓頂載具中之因難能夠被避免。The substrate carriers 130, 130a, 130b have a non-magnetic substrate carrier base 131 and a plurality of magnetic turns 134 for holding the carrier to the dome 110 and for biasing the carrier a distance from the dome. The use of such magnetic carriers is an improvement for dome carriers used for coating optical elements such as lenses. For example, Figure 16A illustrates a conventional dome carrier 300 having a plurality of openings 302 for positioning a lens to be coated. When the lens is coated, it is placed into the opening of the carrier. However, in this conventional design, it is difficult to uniformly coat both the inner and outer sides of the dome. It is also difficult to keep the coating material away from the uncoated lens surface. Further, when the dome is heated, the coated portion is movable relative to the dome opening, causing the dome to cool and rupture after coating. For example, Figure 16B illustrates the lens 304 sliding off a seat shoulder 306 in the opening 302 of the dome carrier. Obviously, if the carrier cools faster than the lens 304, the contraction of the carrier will cause the lens to rupture. In the present application, since the substrate carrier is biased a distance from the dome by holding the carrier to the dome, the heat transfer is minimized and no cracking occurs when the dome is cooled. In addition, only one side of the glass article to be coated is susceptible to the coating material because the contamination of the carrier/substrate is close to the inner surface of the dome. As a result, the difficulties described above in conventional dome carriers can be avoided.

現在參考第5圖，其係示意地描繪插銷138a、138b之實施例之截面圖，玻璃基板140係藉由可伸縮插銷138a所作用抵靠玻璃基板之力量而保持抵靠插銷。該等插銷可使用於基板載具內，如第4A圖和第15圖所示意地描繪。特別地，玻璃基板具有配合在插銷138a和138b之頭部138h以及插銷本體其餘部分之間的造形邊緣。玻璃基板之邊緣可形成倒角，如於141所圖示之圓滑、外圓角(bull nosed)或其他輪廓。當基板140與插銷138a和138b嚙合時，玻璃基板之頂面140a係位於插銷138a和138b之頂部下方2-3 mm。於此圖中，符號140b表示基板140之底面。Referring now to Figure 5, which is a cross-sectional view schematically depicting an embodiment of the pins 138a, 138b, the glass substrate 140 is held against the latch by the force of the telescoping pin 138a against the glass substrate. The pins can be used in a substrate carrier as depicted in Figures 4A and 15 . In particular, the glass substrate has shaped edges that fit between the heads 138h of the pins 138a and 138b and the remainder of the plug body. The edges of the glass substrate may be chamfered, as shown by the slick, bull nose or other contours illustrated at 141. When the substrate 140 is engaged with the pins 138a and 138b, the top surface 140a of the glass substrate is located 2-3 mm below the top of the pins 138a and 138b. In the figure, reference numeral 140b denotes the bottom surface of the substrate 140.

現在參考第4A圖和第6圖，基板140係被裝載至基板載具130上且基板140和基板載具130之組合係磁性貼附至圓頂110之底面。當基板載具130和基板140(虛線)被裝載至圓頂110上進行鍍膜時，可伸縮插銷138a係定位成垂直於如箭頭所示之圓頂110旋轉方向；意即，此插銷相較於固定插銷138b係較靠近於圓頂110頂端T之開口。當基板載具如此定位時，光學鍍膜係均勻地沉積在玻璃基板140的整個表面，形成「無陰影」或「去陰影」之鍍膜基板140。該等術語，「無陰影」或「去陰影」，係表示以下之事實，如果： (1)可伸縮插銷138a沒有定位在圓頂110上，如第6圖所敍述及圖示，且 (2)玻璃基板140之頂面140a位於插銷138a之頭部138h下方小於1 mm之處，且 (3)側止動件150之頂部不低於頂面140a； 則光學鍍膜之沉積在該等元件及握持基板之其他元件所在之處將會不均勻。結果，光學鍍膜在靠近該等元件之處將會較薄且在遠離該等元件之處將會較厚。結果是會被製品使用者注意到之非均勻光學沉積或「陰影」。此類陰影可使用敍於本發明之裝置和方法來避免。此類陰影也可使用不包括任突出超過定位在載具上之基板頂面之元件的基板載具來加以避免，例如使用一層黏合材料將基板可拆卸地貼附在基板滯留表面的基板載具，如第20A圖所描繪。Referring now to FIGS. 4A and 6 , the substrate 140 is loaded onto the substrate carrier 130 and the combination of the substrate 140 and the substrate carrier 130 is magnetically attached to the bottom surface of the dome 110 . When the substrate carrier 130 and the substrate 140 (dashed line) are loaded onto the dome 110 for coating, the telescopic latch 138a is positioned perpendicular to the direction of rotation of the dome 110 as indicated by the arrow; that is, the latch is compared to The fixed pin 138b is closer to the opening of the top end T of the dome 110. When the substrate carrier is positioned as such, the optical coating is uniformly deposited on the entire surface of the glass substrate 140 to form a "shaded" or "shaded" coated substrate 140. The terms "no shading" or "de-shadowing" mean the following if: (1) the retractable latch 138a is not positioned on the dome 110, as illustrated and illustrated in Figure 6, and (2) The top surface 140a of the glass substrate 140 is located less than 1 mm below the head 138h of the pin 138a, and (3) the top of the side stopper 150 is not lower than the top surface 140a; then the optical coating is deposited on the components and The other components holding the substrate will be uneven. As a result, the optical coating will be thinner near the components and will be thicker away from the components. The result is non-uniform optical deposition or "shadowing" that is noticed by the user of the article. Such shadows can be avoided using the apparatus and methods described herein. Such shadows may also be avoided using substrate carriers that do not include elements that protrude beyond the top surface of the substrate positioned on the carrier, such as substrate carriers that detachably attach the substrate to the substrate retention surface using a layer of bonding material. As depicted in Figure 20A.

再參考第1A圖，一旦可調式基板載具130a被磁性地貼附在圓頂110，用於將光學鍍膜塗佈到玻璃基板上之材料係被裝載至光學鍍膜載具124之分離舟皿126(意即分離的來源容器)。如上文所述，光學鍍膜係由交替的高、低折射率材料薄層或交替的高、中等折射率材料薄層所組成。具有大於或等於1.7且小於或等於3.0之折射率n之範例性高折射率材料係：ZrO₂ 、HfO₂ 、Ta₂ O₅ 、Nb₂ O₅ 、TiO₂ 、Y₂ O₃ 、Si₃ N₄ 、SrTiO₃ 、WO₃ ；具有大於或等於1.5且小於1.7之折射率n之範例性中等折射率材料係Al₂ O₃ ；且具有大於或等於1.3且小於或等於1.6之折射率n之範例性低折射率材料係SiO₂ 、MgF₂ 、YF₃ 、YbF₃ 。於某些實施例中，中等折射率材料可使用來形成低折射率層L。因此，於某些實施例中，低折射率材料可選自SiO₂ 、MgF₂ 、YF₃ 、YbF₃ 和Al₂ O₃ 。於範例性實施例中，光學鍍膜材料係氧化物鍍膜，其中高折射率鍍膜係鑭系氧化物(lanthanide series oxide)，例如La、Nb、Y、Gd或其他鑭系金屬，且低折射率鍍膜係SiO₂ 。此外，用於塗佈容易清潔(ETC)鍍膜之材料係裝載到至少一熱蒸鍍源128。如上文所述，ETC材料可以是，例如氟化矽烷(fluorinated silanes)、具有化學式(R_F )_X SiX_4-x 之典型全氟化碳烷基矽烷(alkyl perfluorocarbon silanes)，其中R_f 係直鏈C₆ -C₃₀ 全氟化碳烷基，X=Cl或-OCH₃ -且X=2或3。碳氟化合物具有在大於或等於3 nm且小於或等於50 nm之範圍內之碳鏈長度。Referring again to FIG. 1A, once the adjustable substrate carrier 130a is magnetically attached to the dome 110, the material used to apply the optical coating to the glass substrate is loaded onto the separation boat 126 of the optical coating carrier 124. (meaning separate source containers). As noted above, the optical coating consists of alternating thin layers of high and low refractive index materials or alternating thin layers of high and medium refractive index materials. Exemplary high refractive index materials having a refractive index n greater than or equal to 1.7 and less than or equal to 3.0 are: ZrO ₂ , HfO ₂ , Ta ₂ O ₅ , Nb ₂ O ₅ , TiO ₂ , Y ₂ O ₃ , Si ₃ N ₄ , SrTiO ₃ , WO ₃ ; an exemplary medium refractive index material having a refractive index n greater than or equal to 1.5 and less than 1.7, Al ₂ O ₃ ; and an example of a refractive index n greater than or equal to 1.3 and less than or equal to 1.6 The low refractive index materials are SiO ₂ , MgF ₂ , YF ₃ , and YbF ₃ . In certain embodiments, a medium refractive index material can be used to form the low refractive index layer L. Thus, in certain embodiments, the low refractive index material can be selected from the group consisting of SiO ₂ , MgF ₂ , YF ₃ , YbF _{3 ,} and Al ₂ O ₃ . In an exemplary embodiment, the optical coating material is an oxide coating, wherein the high refractive index coating is a lanthanide series oxide such as La, Nb, Y, Gd or other lanthanide metal, and the low refractive index coating Is SiO ₂ . Further, a material for coating an easy-to-clean (ETC) coating is loaded to at least one of the thermal evaporation sources 128. As noted above, the ETC material can be, for example, fluorinated silanes, typical perfluorocarbon silanes of the formula (R _F ) _X SiX _4-x , wherein R _f is straight Chain C ₆ -C ₃₀ perfluorocarbon alkyl, X=Cl or -OCH ₃ - and X = 2 or 3. The fluorocarbon has a carbon chain length in a range of greater than or equal to 3 nm and less than or equal to 50 nm.

一旦鍍膜材料被裝載，真空腔室102被密封且抽氣至小於或等於10^-4 托之壓力。接著圓頂110藉由旋轉真空屏蔽旋轉軸117而在真空腔室內旋轉。接著電漿源118被致動以引導離子和/或電漿射向定位在圓頂110之底面之玻璃基板，當光學鍍膜材料被塗佈到玻璃基板時，可將光學鍍膜材料密實化。隨後，光學鍍膜和ETC鍍膜循序地塗佈到玻璃基板。光學鍍膜首先藉由將定位於光學鍍膜載具124之舟皿126內的光學材料加以氣化而塗佈。特別地，電子束源120被通電且發射電子流，電子流係由電子束反射鏡122被導向光學鍍膜載具124之舟皿126上。當玻璃基板與圓頂110旋轉時，氣化之材料係沉積在玻璃基板的表面。圓頂110之旋轉連同遮罩125及玻璃基板在基板載具130上的方位，係允許光學鍍膜材料被均勻地鍍在玻璃基板載具上，藉以避免「陰影」出現在玻璃基板的鍍膜表面上。如上所述，電子束源120被使用來循序地沉積高折射率材料薄層和低折射率材料薄層或中等折射率材料薄層以達成具有所欲光學特性之光學鍍膜。石英監視器114和光纖112 係用來監測沉積材料之厚度且藉此控制光學鍍膜之沉積，如本文所述。Once the coating material is loaded, the vacuum chamber 102 is sealed and evacuated to a pressure less than or equal to 10 ^-4 Torr. The dome 110 is then rotated within the vacuum chamber by rotating the vacuum shield rotating shaft 117. The plasma source 118 is then actuated to direct ions and/or plasma toward the glass substrate positioned on the bottom surface of the dome 110, which can be densified when the optical coating material is applied to the glass substrate. Subsequently, the optical coating and the ETC coating were sequentially applied to the glass substrate. The optical coating is first applied by vaporizing an optical material positioned within the boat 126 of the optical coating carrier 124. In particular, electron beam source 120 is energized and emits a stream of electrons that are directed by electron beam mirror 122 onto boat 126 of optical coating carrier 124. When the glass substrate and the dome 110 are rotated, the vaporized material is deposited on the surface of the glass substrate. The rotation of the dome 110 together with the orientation of the mask 125 and the glass substrate on the substrate carrier 130 allows the optical coating material to be uniformly plated on the glass substrate carrier to avoid "shadow" appearing on the coated surface of the glass substrate. . As described above, the electron beam source 120 is used to sequentially deposit a thin layer of high refractive index material and a thin layer of low refractive index material or a thin layer of medium refractive index material to achieve an optical coating having desired optical characteristics. Quartz monitor 114 and fiber optic 112 are used to monitor the thickness of the deposited material and thereby control the deposition of the optical coating, as described herein.

一旦光學鍍膜使用所欲之光學鍍膜材料已被塗佈在玻璃基板至所欲的厚度，光學鍍膜便中止且ETC 鍍膜藉由熱蒸鍍在玻璃基板隨著圓頂110旋轉時而被塗佈在整個光學鍍膜上。特別地，定位於至少一熱蒸鍍源128內之ETC材料係被加熱，藉此將ETC材料在真空腔室102內加以氣化。氣化後之ETC材料係藉由凝結作用而沉積在玻璃基板上。圓頂110之旋轉連同玻璃基板在基板載具130上的方位係有助於將ETC材料均勻地鍍到玻璃基板上。石英監視器114和光纖112 係用來監測沉積材料之厚度且藉此控制ETC鍍膜之沉積，如本文所述。Once the optical coating has been applied to the glass substrate to the desired thickness using the desired optical coating material, the optical coating is discontinued and the ETC coating is applied by thermal evaporation on the glass substrate as the dome 110 rotates. On the entire optical coating. In particular, the ETC material positioned within the at least one thermal evaporation source 128 is heated, thereby vaporizing the ETC material within the vacuum chamber 102. The vaporized ETC material is deposited on the glass substrate by coagulation. The rotation of the dome 110 along with the orientation of the glass substrate on the substrate carrier 130 helps to uniformly plate the ETC material onto the glass substrate. Quartz monitor 114 and fiber 112 are used to monitor the thickness of the deposited material and thereby control the deposition of the ETC coating, as described herein.

第7A圖-第7C圖係與玻璃或氧化物光學鍍膜之氟化矽烷接枝反應(意即，在ETC鍍膜材料和玻璃或氧化物光學鍍膜之間的反應)之示意表示圖。第7C圖係圖示，當氟碳三氯矽烷(fluorocarbon trichlorosilane)與玻璃接枝時，矽烷矽(silane silicon)原子能夠被(1)三鍵結(三根Si-O鍵)至玻璃基板或基板上多層氧化物鍍膜之表面，或(2)雙鍵結至玻璃基板且具有一根鄰近R_F Si官能基之Si-O-Si鍵。ETC鍍膜製程時間非常短暫且可被用來提供具有厚度在大於或等於3 nm且小於或等於50 nm之範圍內之ETC鍍膜，其係遍佈整個剛塗佈光學鍍膜上且不需要破真空(意即，不需要將光學鍍膜曝露在周圍大氣中)。在敍於本文之鍍膜製程中，ETC材料係自單一來源而氣化。然而，應當理解的是ETC材料也可同時自複數個來源而氣化。例如，已經發現2-5個分離的ETC材料來源是有幫助的。特別地，使用含有ETC材料之複數個來源會形成更均勻的ETC鍍膜且可以增加鍍膜的耐久性。使用於本文之「來源」一詞係表示ETC材料自其中熱氣化之容器或坩堝。Fig. 7A - Fig. 7C are schematic representations of a graft reaction of a fluorinated decane with a glass or oxide optical coating (i.e., a reaction between an ETC coating material and a glass or oxide optical coating). Figure 7C is a diagram showing that when fluorocarbon trichlorosilane is grafted with glass, silane silicon atoms can be (1) triple bonded (three Si-O bonds) to a glass substrate or substrate. The surface of the upper multilayer oxide coating, or (2) double bonded to the glass substrate and having a Si-O-Si bond adjacent to the R _F Si functional group. The ETC coating process time is very short and can be used to provide ETC coatings with thicknesses greater than or equal to 3 nm and less than or equal to 50 nm, which are spread over the entire coated optical coating and do not require vacuum breaking. That is, it is not necessary to expose the optical coating to the surrounding atmosphere). In the coating process described herein, ETC materials are gasified from a single source. However, it should be understood that ETC materials can also be gasified at the same time from multiple sources. For example, it has been found that 2-5 separate sources of ETC material are helpful. In particular, the use of multiple sources containing ETC materials results in a more uniform ETC coating and can increase the durability of the coating. The term "source" as used herein refers to a container or crucible from which an ETC material is heat vaporized.

在敍於本文之實施例中，SiO₂ 層通常係被塗佈作為光學鍍膜之覆蓋層。在ETC鍍膜沉積之前，SiO₂ 層通常係被沉積作為光學鍍膜之一部分。此SiO₂ 層係提供緻密的表面供ETC鍍膜之矽原子之接枝和交連，因該等薄層係在高真空 (10^-4 -10^-6 托)下沒有自由OH基的環境下被沉積。自由OH基，例如，在玻璃或AR表面上之一層水薄層，在係ETC材料沉積過程中係不利的，因為OH會阻止ETC材料中的矽原子與金屬氧化物或矽氧化物表面，意即光學鍍膜表面，之氧原子鍵結。當沉積裝置破真空時，意即裝置被打開曝露在大氣中，含有水蒸氣之環境中之空氣係進入且ETC鍍膜之矽原子與光學鍍膜表面反應，在ETC矽原子和表面氧原子之間產生至少一化學鍵，且一旦曝露在空氣即釋放出醇或酸。因為ETC鍍膜材料通常含有1-2個氟化基團(fluorinated group)和2-3個活性基團(reactive group)，例如CH₃ O-基團，ETC鍍膜能夠在光學鍍膜表面上與2-3個氧原子產生鍵結，或與其他鍍膜分子產生交連，如第7C圖所示，以產生強鍵結之ETC鍍膜。PVD沉積之SiO₂ 表面係未受損的(pristine)且具有活性表面。例如，對於PVD沉積之SiO₂ 覆蓋層而言，其相較於具有複雜表面化學成份之玻璃係具有低很多的活化能，如第8圖所圖示，在玻璃表面上係具有環境污染物或具有水薄層。In the embodiments described herein, the SiO ₂ layer is typically coated as a cover layer for the optical coating. Prior to deposition of the ETC coating, the SiO ₂ layer is typically deposited as part of the optical coating. The SiO ₂ layer provides a dense surface for the grafting and crosslinking of the ruthenium atoms of the ETC coating, since the thin layers are deposited under high vacuum (10 ^-4 -10 ^-6 Torr) without free OH groups. . Free OH groups, for example, a thin layer of water on the surface of glass or AR, are disadvantageous in the deposition of ETC materials because OH blocks the surface of ruthenium atoms and metal oxides or ruthenium oxides in ETC materials. That is, the surface of the optical coating is bonded by oxygen atoms. When the deposition device is vacuumed, it means that the device is opened and exposed to the atmosphere. The air in the environment containing water vapor enters and the helium atoms of the ETC coating react with the surface of the optical coating to produce between the ETC germanium atom and the surface oxygen atom. At least one chemical bond, and upon exposure to air, releases alcohol or acid. Because ETC coating materials usually contain 1-2 fluorinated groups and 2-3 reactive groups, such as CH ₃ O-groups, ETC coatings can be coated on the surface of optical coatings with 2- The three oxygen atoms create a bond or crosslink with other coating molecules, as shown in Figure 7C, to produce a strongly bonded ETC coating. The SiO ₂ surface deposited by PVD is pristine and has an active surface. For example, for a PVD deposited SiO ₂ cap layer, it has much lower activation energy than a glass system with complex surface chemistry, as illustrated in Figure 8, with environmental contaminants on the glass surface or Has a thin layer of water.

因此，一旦ETC鍍膜已被塗佈在整個光學鍍膜上，已有光學鍍膜和ETC鍍膜之玻璃基板自腔室被移開且允許在空氣中被固化。若僅是放置在室溫(大約18-25^o C，相對濕度RH 40%)被固化，固化需要1-3天。可使用較高的溫度來加速固化。例如，在一實施例中，ETC鍍膜製品可被加熱至80-100^o C，時間約10分鐘到約30鐘，濕度在大於50%且小於100%之範圍內。通常相對濕度係在50-85%之範圍。Therefore, once the ETC coating has been applied over the entire optical coating, the glass substrate of the existing optical coating and ETC coating is removed from the chamber and allowed to be cured in the air. If it is only allowed to stand at room temperature (about 18-25 ^o C, relative humidity RH 40%), it takes 1-3 days to cure. Higher temperatures can be used to accelerate curing. For example, in one embodiment, the ETC coated article can be heated to 80-100 ^o C for a period of from about 10 minutes to about 30 minutes and a humidity in the range of greater than 50% and less than 100%. Usually the relative humidity is in the range of 50-85%.

一旦ETC鍍膜被固化後，鍍膜表面以軟刷或異丙醇刮拭來移除任何尚未與光學鍍膜產生鍵結之ETC材料。Once the ETC coating is cured, the coated surface is wiped with a soft brush or isopropyl alcohol to remove any ETC material that has not been bonded to the optical coating.

敍於本文之方法和裝置可使用於生產鍍膜玻璃製品，例如鍍膜玻璃基板，其係具有光學鍍膜(例如AR鍍膜或類似光學功能鍍膜)和定位在整個光學鍍膜上之ETC鍍膜二者。使用敍於本文之方法和裝置，鍍膜玻璃製品通常係在玻璃製品之整個光學鍍膜表面上沒有陰影。在一些實施例中，塗佈在玻璃製品之光學鍍膜可具有複數個週期，每週期包含具有大於或等於1.7且小於或等於3.0之折射率n之高折射率材料H層和具有大於或等於1.3且小於或等於1.6之折射率n之低折射率材料L層。高折射率材料層可以是每週期之第一層且低折射率材料L層可以是每週期之第二層。或者，低折射率材料層可以是每週期之第一層且高折射率材料H層可以是每週期之第二層。在某些實施例中，光學鍍膜中之鍍膜週期數目可以大於或等於2且小於或等於1000。光學鍍膜可進一步包括一層SiO₂ 之覆蓋層。覆蓋層可塗佈在一個或複數個週期上且可具有在大於或等於20 nm且小於或等於200 nm之範圍內之厚度。在敍於本文之實施例中，光學鍍膜可具有在大於或等於100 nm且小於或等於2000 nm之範圍內之厚度。然而，更大的厚度也有可能，係取決於鍍膜製品之預期用途。例如，在某些實施例中，光學鍍膜厚度可在100 nm到2000 nm之範圍內。在某些其他實施例中，光學鍍膜厚度可在400 nm到1200 nm之範圍內或甚至在400 nm到1500 nm之範圍內。The methods and apparatus described herein can be used to produce coated glass articles, such as coated glass substrates, which have both optical coatings (e.g., AR coatings or similar optically functional coatings) and ETC coatings positioned throughout the optical coatings. Using the methods and apparatus described herein, coated glass articles are typically unshaded on the entire optical coating surface of the glass article. In some embodiments, the optical coating applied to the glass article can have a plurality of cycles, each cycle comprising a high refractive index material H layer having a refractive index n greater than or equal to 1.7 and less than or equal to 3.0 and having greater than or equal to 1.3. And a low refractive index material L layer having a refractive index n of less than or equal to 1.6. The high refractive index material layer may be the first layer per cycle and the low refractive index material L layer may be the second layer per cycle. Alternatively, the low refractive index material layer may be the first layer per cycle and the high refractive index material H layer may be the second layer per cycle. In some embodiments, the number of coating cycles in the optical coating can be greater than or equal to 2 and less than or equal to 1000. The optical coating may further comprise a cover layer of SiO ₂ . The cover layer may be coated on one or more cycles and may have a thickness in the range of greater than or equal to 20 nm and less than or equal to 200 nm. In the embodiments described herein, the optical coating may have a thickness in a range of greater than or equal to 100 nm and less than or equal to 2000 nm. However, larger thicknesses are also possible depending on the intended use of the coated article. For example, in certain embodiments, the optical coating thickness can range from 100 nm to 2000 nm. In certain other embodiments, the optical coating thickness can range from 400 nm to 1200 nm or even from 400 nm to 1500 nm.

高折射率材料薄層和低折射率材料薄層之各層厚度可以是從大於或等於5nm且小於或等於200 nm之範圍內。高折射率材料薄層和低折射率材料薄層之各層厚度可以是從大於或等於5nm且小於或等於100 nm之範圍內。如本文將進一步描述的，鍍膜玻璃製品對於使用於本文之特定鍍膜方法或技術係展現改善的抗刮損性。塗佈於玻璃製品之鍍膜之退化可藉由玻璃鍍膜接受刮損測試之後的水接觸角來加以評估。刮損測試之實施係使用0000#等級之鋼絲絨在10 kg之正向負載下對玻璃基板之鍍膜表面進行刮拭。刮除區域大小係10 mm×10 mm。刮拭之頻率係60 Hz且鋼絲絨之刮拭距離係50 mm。刮損測試係在相對濕度RH＜ 40%下執行。在敍於本文之實施例中，玻璃製品在6,000次刮損週期之後具有至少75^o 的水接觸角。在某些實施例中，玻璃製品在6,000次刮損週期之後具有至少105^o 的水接觸角。在另外其他實施例中，玻璃製品在10,600次刮損週期之後具有大於90^o 的水接觸角。The thickness of each of the thin layers of the high refractive index material and the thin layer of the low refractive index material may be in a range from greater than or equal to 5 nm and less than or equal to 200 nm. The thickness of each of the thin layers of the high refractive index material and the thin layer of the low refractive index material may be in a range from greater than or equal to 5 nm and less than or equal to 100 nm. As will be further described herein, coated glass articles exhibit improved scratch resistance for the particular coating methods or techniques used herein. Degradation of the coating applied to the glass article can be evaluated by accepting the water contact angle after the scratch test of the glass coating. The scratch test was performed by wiping the coated surface of the glass substrate with a 0000# grade steel wool under a forward load of 10 kg. The size of the scraping area is 10 mm × 10 mm. The wiping frequency is 60 Hz and the wiping distance of the steel wool is 50 mm. The scratch test was performed at a relative humidity RH < 40%. In the embodiments described herein, the glass article has a water contact angle of at least 75 ^o after 6,000 scratch cycles. In certain embodiments, the glass article has a water contact angle of at least 105 ^o after 6,000 scratch cycles. In still other embodiments, the glass article has a water contact angle of greater than 90 ^o after 10,600 scratch cycles.

玻璃製品之抗刮損性和抗退化性也可以刮損測試之後在玻璃製品上之刮痕長度加以評估。在敍於本文之實施例中，鍍膜玻璃製品在8000次刮損週期後具有小於2 mm之表面刮痕長度。The scratch resistance and degradation resistance of the glass article can also be evaluated by the scratch length on the glass article after the scratch test. In the examples described herein, the coated glass article has a surface scratch length of less than 2 mm after 8000 scratch cycles.

此外，玻璃製品之抗刮損性和抗退化性也可藉由刮損測試之後玻璃製品之反射率和/或穿透率(transmittance)之變化來加以評估，將於本文更加詳細地敍述。在某些實施例中，玻璃製品在至少8,000次刮損/刮拭週期之後之%反射率係實質上相同於未刮損/未刮拭之玻璃製品的%反射率。在某些實施例中，玻璃製品在至少8,000次刮損/刮拭週期之後之%穿透率係實質上相同於未刮損/未刮拭之玻璃製品的%穿透率。In addition, the scratch resistance and degradation resistance of the glass article can also be evaluated by the change in reflectivity and/or transmittance of the glass article after the scratch test, as will be described in more detail herein. In certain embodiments, the % reflectance of the glass article after at least 8,000 scratch/scratch cycles is substantially the same as the % reflectance of the unscratched/unscratched glass article. In certain embodiments, the % transmittance of the glass article after at least 8,000 scratch/scratch cycles is substantially the same as the % penetration of the unscratched/unscratched glass article.

敍於本文之沉積方法可被用來生產去陰影之光學鍍膜。此舉意謂著光學鍍膜係均勻地沉積在玻璃基板的整個鍍膜表面上。在敍於本文之鍍膜玻璃基板之實施例中，從玻璃基板之光學鍍膜第一邊緣到光學鍍膜第二邊緣之光學鍍膜厚度變動係小於4%。例如，在某些實施例中，從玻璃基板之光學鍍膜第一邊緣到光學鍍膜第二邊緣之光學鍍膜厚度變動係小於或等於3%。在某些其他實施例中，從玻璃基板之光學鍍膜第一邊緣到光學鍍膜第二邊緣之光學鍍膜厚度變動係小於或等於2%。於再其他實施例中，從玻璃基板之光學鍍膜第一邊緣到光學鍍膜第二邊緣之光學鍍膜厚度變動係小於或等於1%。The deposition method described herein can be used to produce a shadowed optical coating. This means that the optical coating is uniformly deposited on the entire coated surface of the glass substrate. In an embodiment of the coated glass substrate described herein, the optical coating thickness variation from the first edge of the optical coating of the glass substrate to the second edge of the optical coating is less than 4%. For example, in some embodiments, the optical coating thickness variation from the first edge of the optical coating of the glass substrate to the second edge of the optical coating is less than or equal to 3%. In certain other embodiments, the optical coating thickness variation from the first edge of the optical coating of the glass substrate to the second edge of the optical coating is less than or equal to 2%. In still other embodiments, the optical coating thickness variation from the first edge of the optical coating of the glass substrate to the second edge of the optical coating is less than or equal to 1%.

敍於本文之鍍膜裝置500、基板載具130和/或方法可被使用來形成在玻璃基板或其他基板(例如塑膠基板)上之其他鍍膜。此類其他的鍍膜可包括光學裝飾鍍膜或保護鍍膜，其可包括，但不受限於，非吸收性材料和吸收性材料。範例性之裝飾鍍膜可由透明介電質或吸收材料來形成。此類材料包括金屬(例如Cr、Ag、Au、W、Ti和類似者)、半導體(例如Si、AlN、諸如ITO 和SnO_x 之TCO材料、Ge及類似者)及吸收性材料(SiN_x 、SiO_x N_y 、TiN、AlSiO_x 、CrO_x 和類似者)。The coating apparatus 500, substrate carrier 130, and/or method described herein can be used to form other coatings on a glass substrate or other substrate (eg, a plastic substrate). Such other coatings may include optical decorative coatings or protective coatings, which may include, but are not limited to, non-absorbent materials and absorbent materials. An exemplary decorative coating can be formed from a transparent dielectric or absorbing material. Such materials include metals (such as Cr, Ag, Au, W, Ti, and the like), semiconductors (such as Si, AlN, TCO materials such as ITO and SnO _x , Ge and the like) and absorbent materials (SiN _x , SiO _x N _y , TiN, AlSiO _x , CrO _x and the like).

離子輔助電子束沉積係提供用於小型及中型玻璃基板鍍膜之獨特的優勢，例如那些具有從約略40 mm×60 mm到約略180 mm×320 mm範圍內之面部尺寸之基板，其係取決於腔室之尺寸大小。離子輔助鍍膜製程提供剛沉積之光學鍍膜於玻璃表面上，玻璃表面對於後續之ETC鍍膜塗佈而言係具有低的表面活化能，因為沒有可能會影響ETC鍍膜效能和可靠度之表面污染物(水或其他環境)。光學鍍膜完成之後直接塗佈ETC鍍膜係可改善二氟碳官能基之間的交連、改善抗磨損性及改善施加於鍍膜數千次刮損週期之後的接觸角效能(較高的疏油和疏水的接觸角)。此外，離子輔助電子束鍍膜大大地減少鍍膜週期時間以增加塗佈機之使用率和產出率。再者，ETC鍍膜沉積後之熱處理或紫外線固化係沒有需要，因為光學鍍膜表面較低的活化能，其使得製程可相容於不允許加熱之後ETC製程。使用敍於本文之離子輔助電子束PVD製程，ETC材料能塗佈在選擇區域上以避免污染到基板的其他位置。範例 1 ： Ion-assisted electron beam deposition offers unique advantages for small and medium-sized glass substrate coatings, such as those having a face size ranging from approximately 40 mm x 60 mm to approximately 180 mm x 320 mm, depending on the cavity The size of the room. The ion assisted coating process provides a freshly deposited optical coating on the glass surface that has low surface activation energy for subsequent ETC coating applications because there are no surface contaminants that may affect ETC coating efficacy and reliability ( Water or other environment). Direct coating of ETC coating after completion of optical coating improves cross-linking between difluorocarbon functional groups, improves abrasion resistance, and improves contact angle performance after thousands of scratch cycles applied to the coating (higher oleophobic and hydrophobic) Contact angle). In addition, ion-assisted electron beam coating greatly reduces coating cycle time to increase coater usage and yield. Furthermore, heat treatment or UV curing after deposition of the ETC coating is not required because of the lower activation energy of the optical coating surface, which makes the process compatible with the ETC process after heating is not allowed. Using the ion-assisted electron beam PVD process described herein, ETC materials can be coated on selected areas to avoid contamination to other locations on the substrate. Example 1 :

四層的SiO₂ /Nb₂ O₅ /SiO₂ /Nb₂ O₅ /基板AR光學鍍膜被沉積在60片的Gorilla^TM 玻璃(可從市場上之康寧公司取得)，每片尺寸(長、寬、厚)約為115 mm L×60 mm W×0.7 mm T。鍍膜係使用敍於本文之方法而沉積。AR鍍膜具有約略600 nm之厚度。AR鍍膜沉積之後，ETC鍍膜藉由熱蒸鍍使用全氟烷基三氯矽烷(perfluoroalkyl trichlorosilanes)而塗佈在AR鍍膜之頂部，其中全氟烷基三氯矽烷係具有5 nm至20 nm之範圍內之碳鏈長度(大金公司之Optool^TM 氟鍍膜被使用作為一種範例性種類)。AR和ETC鍍膜之沉積係在如第1A圖中所圖示之單一腔室鍍膜裝置內執行。AR鍍膜被沉積之後，AR鍍膜源材料被關閉且ETC材料被熱蒸鍍及沉積在已AR鍍膜玻璃上。鍍膜製程包括零件裝載/卸載係73分鐘。接著，在ETC鍍膜被固化之後，使用顯示於第1表之各種刮損週期將表面刮拭之後決定水接觸角。刮損測試係以#0之鋼絲絨在1 kg之負載下進行。第1表之資料指出樣本具有非常好的抗磨損和疏水特性。鍍膜順序和鍍膜在玻璃基板上之6層Nb₂ O₅ /SiO₂ 之各層厚度見第2表。 第1表：水接觸角刮損測試結果 第2表 範例 2 ： Four layers of SiO ₂ /Nb ₂ O ₅ /SiO ₂ /Nb ₂ O ₅ /substrate AR optical coatings were deposited on 60 sheets of Gorilla ^TM glass (available from Corning Incorporated), each piece size (length, width) , thickness) is approximately 115 mm L × 60 mm W × 0.7 mm T. The coating is deposited using the methods described herein. The AR coating has a thickness of approximately 600 nm. After the AR coating is deposited, the ETC coating is applied to the top of the AR coating by thermal evaporation using perfluoroalkyl trichlorosilanes, which have a range of 5 nm to 20 nm. carbon chain lengths within (Daikin of Optool ^TM film is used as a fluorine exemplary species). The deposition of the AR and ETC coatings is performed in a single chamber coating apparatus as illustrated in Figure 1A. After the AR coating is deposited, the AR coating source material is turned off and the ETC material is thermally evaporated and deposited on the AR coated glass. The coating process included a part loading/unloading system for 73 minutes. Next, after the ETC plating film was cured, the water contact angle was determined by wiping the surface using various scratching cycles shown in Table 1. The scratch test was carried out with a steel wool of #0 under a load of 1 kg. The data in Table 1 indicates that the sample has very good anti-wear and hydrophobic properties. The coating sequence and the thickness of each layer of the six layers of Nb ₂ O ₅ /SiO ₂ coated on the glass substrate are shown in Table 2. Table 1: Water contact angle scratch test results Table 2 Example 2 :

於此範例中，使用於範例1之相同的氟鍍膜係被鍍在GRIN透鏡上作為光學連接器，如第9圖所圖示，係使用在用於膝上型電腦之光纖206上。符號200和箭頭指向GRIN透鏡208之選擇區域用於將ETC鍍膜置於850 nm AR鍍膜之頂部以提供抗微粒(particle)性和抗磨損性。符號202係圖示光纖到膝上型或平板元件之連接，且符號204係圖示鍍膜光纖被使用連接至膝上型電腦或媒體基座(media dock)。In this example, the same fluoroplating film used in Example 1 was plated on a GRIN lens as an optical connector, as illustrated in Fig. 9, for use on an optical fiber 206 for a laptop computer. Symbols 200 and arrows point to selected regions of the GRIN lens 208 for placing the ETC coating on top of the 850 nm AR coating to provide particle resistance and abrasion resistance. Symbol 202 illustrates the connection of fiber to laptop or tablet components, and symbol 204 illustrates that the coated fiber is used to connect to a laptop or media dock.

第10圖係具有1層8-10nm熱沉積ETC鍍膜在含有基板/(Nb₂ O₅ /SiO₂ )3之6層AR鍍膜，ETC/6L-AR鍍膜對比於僅具有噴灑塗佈ETC鍍膜之玻璃樣本之刮損測試資料。玻璃係0.7 mm厚，市售之康寧公司編號2319玻璃，係化學調和(chemically tempered)(離子交換)玻璃。刮損測試係在以下條件下進行：0000#等級之鋼絲絨、10 kg負載於10 mm×10 mm區域、60 Hz、50 mm之刮拭距離、RH＜40%。大於75^o 之水接觸角係判定鍍膜失效之基準。已發現具有AR鍍膜而無ETC鍍膜之玻璃僅於10-12次刮拭週期後便被刮損。第10圖顯示二玻璃樣本以120^o 之水接觸角開始進行測試，且在經過6000次刮損週期後，僅具有ETC鍍膜之玻璃樣本具有80^o 之水接觸角，然而如敍於本文所製作的玻璃樣本，ETC/6層-AR鍍膜，係具有至少105^o 之水接觸角。在經過10,000次刮損週期後，ETC/6層-AR鍍膜製品之水接觸角係大於90^o 。此測試明白地指出具有ETC鍍膜沉積在AR鍍膜頂部之玻璃製品比僅具有塗佈到玻璃之ETC鍍膜之玻璃製品係具有較大程度之抗刮性。Figure 10 shows a 6-layer 8-10 nm thermally deposited ETC coating on a 6-layer AR coating containing a substrate /(Nb ₂ O ₅ /SiO ₂ )3. The ETC/6L-AR coating is compared to a spray-coated ETC coating. Scratch test data for glass samples. The glass system is 0.7 mm thick, and the commercially available Corning Company number 2319 glass is a chemically tempered (ion exchange) glass. The scratch test was carried out under the following conditions: 0000# grade steel wool, 10 kg load in a 10 mm × 10 mm area, 60 Hz, 50 mm wiper distance, RH < 40%. Water contact angles greater than 75 ^{o are} the basis for determining coating failure. It has been found that glass having an AR coating without an ETC coating is scratched only after 10-12 wipe cycles. Figure 10 shows that the two glass samples were tested at a water contact angle of 120 ^o , and after 6,000 scratch cycles, only the glass samples with ETC coating had a water contact angle of 80 ^o , however, as described in this paper The glass sample, ETC/6 layer-AR coating, has a water contact angle of at least 105 ^o . After 10,000 scratch cycles, the water contact angle of the ETC/6 layer-AR coated article is greater than 90 ^o . This test clearly indicates that a glass article having an ETC coating deposited on top of the AR coating has a greater degree of scratch resistance than a glass article having only an ETC coating applied to the glass.

第11圖係(1)具有6層PVD IAD-DB AR鍍膜和1層在AR鍍膜頂部之8-10 nm熱沉積ETC鍍膜之玻璃製品(由符號220和菱形資料標記所表示)對比於(2)具有由第一商用塗佈機裝置所沉積之PVD-AR鍍膜及在第二腔室由例如浸泡或噴灑之商用製程所沉積之ETC之市售玻璃製品(由符號222和方形資料標記所表示)之刮損持久性比較。兩種鍍膜係沉積於相同的化學調和(離子交換)，0.7 mm厚之康寧公司編號2319玻璃上。玻璃製品220係根據敍於本文之方法來鍍膜。市售之玻璃製品係由商用鍍膜供應商所鍍膜。刮損持久性測試係在40%相對濕度下進行。在箭頭224所表示的點上，在800次週期之後，僅出現淺短且長度小於2 mm之刮痕。相反地，在箭頭226所表示的點上，僅在200次週期之後，即出現深的、長度大於5 mm之長刮痕。測試結果指出依述於本文所鍍膜之AR鍍膜-ETC玻璃之刮損持久性係至少大於10倍市售產品之刮損持久性。Figure 11 is a (1) glass article with 6 layers of PVD IAD-DB AR coating and 1 layer of 8-10 nm thermally deposited ETC coating on top of the AR coating (indicated by symbol 220 and diamond data). a commercially available glass article having a PVD-AR coating deposited by a first commercial coater device and an ETC deposited in a second chamber by a commercial process such as immersion or spraying (represented by symbol 222 and square data mark) ) Scratch durability comparison. Both coatings were deposited on the same chemically tuned (ion exchange), 0.7 mm thick Corning Incorporated No. 2319 glass. The glass article 220 is coated according to the method described herein. Commercially available glass products are coated by commercial coating suppliers. The scratch durability test was performed at 40% relative humidity. At the point indicated by arrow 224, after 800 cycles, only scratches of shallow length and less than 2 mm in length appear. Conversely, at the point indicated by arrow 226, a deep scratch having a length greater than 5 mm occurs only after 200 cycles. The test results indicate that the scratch durability of the AR coating-ETC glass as described herein is at least greater than 10 times the scratch durability of the commercially available product.

第17B圖係描繪出水接觸角對比於刮損週期之圖形，係圖示使用描繪於第17A圖所配置之鍍膜裝置所獲得的改善。水接觸角結果可與第10圖和第11圖之水接觸角結果相比較。第17B圖之資料顯示在10,000次刮損週期之後，圖示於第17B圖之所有基板係具有大於110^o 之水接觸角，且實質上所有的基板係具有112^o 或更大的水接觸角。相反地，第10圖和第11圖之資料顯示在10,000次刮損週期之後，水接觸角係小於100^o 。再者，在第17B圖之資料顯示對於經歷過12,000次刮損週期後之基板，基板之水接觸角係大於106^o 。Figure 17B is a graph depicting the water contact angle versus the scratch cycle, showing the improvement obtained using the coating apparatus depicted in Figure 17A. The water contact angle results can be compared to the water contact angle results of Figures 10 and 11. The data in Fig. 17B shows that after 10,000 scratch cycles, all of the substrates shown in Fig. 17B have a water contact angle greater than 110 ^o , and substantially all of the substrate have a water contact angle of 112 ^o or more. . Conversely, the data in Figures 10 and 11 shows that after 10,000 scratch cycles, the water contact angle is less than 100 ^o . Furthermore, the data in Figure 17B shows that for substrates that have experienced 12,000 scratch cycles, the water contact angle of the substrate is greater than 106 ^o .

第12圖係%反射率對波長之關係圖，其中反射率意指從鍍有如敍於本文之AR鍍膜和ETC鍍膜之鍍膜玻璃製品之表面所反射光線之百分比。新的(未刮損或未刮拭)製品使用於每次刮拭測試中。刮損/刮拭係在下列條件下進行：0000#等級之鋼絲絨、10 kg負載於10 mm×10 mm區域、60 Hz、50 mm之刮拭距離、RH＜40%。在經過6K、7K、8K和9K次刮拭後量測反射率。圖形顯示新的製品與經刮拭最高8K次後之製品實質上具有相同的反射率。8K次刮拭之後，反射率增加。此反射率增加係被認為是由於大量刮拭所造成玻璃表面輕微刮損的結果。圖形中之字母「A」意指「刮拭後」且字母「B」意指「刮拭前」(無刮拭)。字母「K」意指「kilo」或「千」。Figure 12 is a graph of % reflectance versus wavelength, where reflectance is the percentage of light reflected from the surface of a coated glass article plated with an AR coating and an ETC coating as described herein. New (unscratched or unscratched) articles were used in each wipe test. Scratch/wipe is performed under the following conditions: 0000# grade steel wool, 10 kg load in 10 mm × 10 mm area, 60 Hz, 50 mm wiper distance, RH < 40%. The reflectance was measured after 6K, 7K, 8K, and 9K wipes. The graphic shows that the new article has substantially the same reflectivity as the article after being wiped up to 8K times. After 8K wipes, the reflectance increases. This increase in reflectance is believed to be the result of slight scratching of the glass surface due to extensive wiping. The letter "A" in the figure means "after wiping" and the letter "B" means "before wiping" (no wiping). The letter "K" means "kilo" or "thousand".

第13圖係%穿透率對波長之關係圖。測試係執行於如敍於本文塗佈有AR鍍膜和ETC鍍膜之鍍膜玻璃製品上。新的(未刮損或未刮拭)製品使用於每次刮拭測試中。穿透測試使用如反射測試相同之製品。圖形指出新的製品與經刮拭最高8K次後之製品實質上具有相似的穿透率，穿透率在95-96%之範圍。8K次刮拭之後，穿透率在整個波長範圍係掉到大約92%。此穿透率之減少被認為是由於大量刮拭所造成玻璃表面輕微刮損的結果。圖形中之字母「A」意指「刮拭後」且字母「B」意指「刮拭前」(無刮拭)。字母「K」意指「kilo」或「千」。Figure 13 is a plot of % penetration versus wavelength. The test system was performed on a coated glass article coated with an AR coating and an ETC coating as described herein. New (unscratched or unscratched) articles were used in each wipe test. The penetration test uses the same article as the reflection test. The graph indicates that the new article has substantially similar penetration to the article after being wiped for up to 8K times, with a penetration rate in the range of 95-96%. After 8K wipes, the penetration dropped to approximately 92% over the entire wavelength range. This reduction in penetration is believed to be the result of slight scratching of the glass surface due to extensive wiping. The letter "A" in the figure means "after wiping" and the letter "B" means "before wiping" (no wiping). The letter "K" means "kilo" or "thousand".

第12圖和第13圖之資料指出在玻璃製品上之光學鍍膜除了具有如顯示於第10圖和第11圖之優異水接觸角保持性外，也具有高度的持久性。The data in Figures 12 and 13 indicate that the optical coating on the glass article has a high degree of durability in addition to the excellent water contact angle retention as shown in Figures 10 and 11.

第14圖係反射率%對波長之圖形，其圖示AR鍍膜層/週期數目對反射率之效應，係相對於沒有AR鍍膜之玻璃。曲線240表示未鍍膜離子交換玻璃，康寧公司編號2319。曲線244表示由SiO₂ /Nb₂ O₃ 薄層對組成之2-層或1-週期鍍膜。曲線246和248係SiO₂ /Nb₂ O₃ 薄層對組成之4-層(2-週期)及6-層(3-週期)之鍍膜。曲線242係1-層之Nb₂ O₃ 鍍膜。資料指出增加AR鍍膜堆疊數目(層/週期)將擴大AR鍍膜光譜範圍之效用且也將會減少反射率%。範例 3 ： Figure 14 is a graph of reflectance versus wavelength, which illustrates the effect of the number of AR coating layers/cycles on reflectivity versus glass without AR coating. Curve 240 represents uncoated ion exchange glass, Corning Incorporated No. 2319. Curve 244 represents a 1- to 2-ply or coating of a cycle consisting of SiO ₂ / Nb ₂ O ₃ thin. Curves 246 and 248 are a coating of a 4-layer (2-period) and a 6-layer (3-cycle) of a thin layer of SiO ₂ /Nb ₂ O ₃ . Curve 242 is a 1-layer Nb ₂ O ₃ coating. The data indicates that increasing the number of AR coating stacks (layers/cycles) will increase the utility of the AR coating spectral range and will also reduce the reflectance %. Example 3 :

第18圖係反射率(y-軸)作為波長(x-軸)之函數之電腦模擬圖形，其係針對以6層AR鍍膜(Nb₂ O₅ /SiO₂ )和ETC鍍膜之玻璃基板。AR鍍膜係以2%之厚度變動來模擬。結果，所得到的反射率輪廓線係模擬6層AR鍍膜(Nb₂ O₅ /SiO₂ )和ETC鍍膜之反射率，其中ETC鍍膜具有2%之厚度變異。第19圖係圖解描繪反射率(y-軸)作為波長(x-軸)之函數，其係針對使用敍於本文之方法和裝置之以6層AR鍍膜(Nb₂ O₅ /SiO₂ )和1層ETC鍍膜加以鍍膜之複數個真實樣本。如第19圖所描繪，真實樣本之反射率輪廓線係相似於模擬樣本之反射率輪廓線，因此顯示出使用所述方法鍍膜之樣本具有光學鍍膜，其中在整個鍍膜基板上(意即從光學鍍膜第一邊緣到第二邊緣)之光學鍍膜的厚度變動係小於3%。Figure 18 is a computer simulation of reflectance (y-axis) as a function of wavelength (x-axis) for a glass substrate coated with 6 layers of AR (Nb ₂ O ₅ /SiO ₂ ) and ETC. The AR coating was simulated with a thickness variation of 2%. As a result, the obtained reflectance profile simulates the reflectance of the 6-layer AR coating (Nb ₂ O ₅ /SiO ₂ ) and the ETC coating, wherein the ETC coating has a thickness variation of 2%. Figure 19 is a graphical representation of reflectance (y-axis) as a function of wavelength (x-axis) for a 6-layer AR coating (Nb ₂ O ₅ /SiO ₂ ) using the methods and apparatus described herein and A number of real samples were coated with a layer of ETC coating. As depicted in Figure 19, the reflectance profile of the real sample is similar to the reflectance profile of the simulated sample, thus showing that the sample coated using the method has an optical coating over the entire coated substrate (ie, from optical The thickness variation of the optical coating of the first edge to the second edge of the coating is less than 3%.

敍於本文之AR/ETC鍍膜能使用在許多商用製品。例如，所得到的鍍膜能使得電視、手機、電子平板和書籍閱讀器和其他裝置在日光之下可以閱讀。AR/ETC鍍膜在下列產品中也有其實用性：抗反射分光鏡、稜鏡、反射鏡和雷射產品；用於電信的光纖和組件；使用於生物學和醫學應用以及使用於抗微生物表面之光學鍍膜。The AR/ETC coatings described herein can be used in many commercial products. For example, the resulting coating allows televisions, cell phones, electronic tablets and book readers and other devices to be read under daylight. AR/ETC coatings are also useful in the following products: anti-reflective beamsplitters, enamels, mirrors and laser products; fibers and components for telecommunications; for biological and medical applications and for use on antimicrobial surfaces Optical coating.

對本領域技術人員而言顯而易見的是在不背離請求標的之精神和範圍下，可對敘於本文之實施例進行各種不同之修飾和變化。因此，涵蓋敍於本文之各種不同實施例之修飾和變化態樣之說明書之目的係提供落於所附專利權利請求項及其等效物之範圍內之此類修飾和變化態樣。It will be apparent to those skilled in the art that various modifications and changes can be made to the embodiments described herein without departing from the spirit and scope of the invention. The specification and the modifications of the various embodiments of the present invention are intended to be included within the scope of the appended claims and their equivalents.

100‧‧‧鍍膜裝置
102‧‧‧真空腔室
110‧‧‧旋轉圓頂
110a‧‧‧區塊
112‧‧‧光纖
114‧‧‧石英監視器
116‧‧‧玻璃板
116a‧‧‧開口
116b‧‧‧表面
117‧‧‧旋轉軸
118‧‧‧電漿源
118a‧‧‧離子源
119‧‧‧真空密封軸承
120‧‧‧電子束源
120a‧‧‧第一電子束源
120b‧‧‧第二電子束源
121‧‧‧中和器
122‧‧‧電子束反射鏡
124‧‧‧光學鍍膜載具
125‧‧‧遮罩、第一遮罩
125a‧‧‧支架
126‧‧‧舟皿
127‧‧‧遮罩
128‧‧‧熱蒸鍍源
129‧‧‧第二遮罩
130‧‧‧基板載具
130a‧‧‧表面、可調式基板載具
130b‧‧‧基板載具
131‧‧‧基板載具底座
131a‧‧‧滯留表面
131b‧‧‧底面
132‧‧‧彈簧系統
133‧‧‧彈簧
134‧‧‧元件、磁鐵
136‧‧‧插銷
137‧‧‧軌道
138a‧‧‧彈簧裝載調整式插銷、可伸縮插銷
138aa‧‧‧外殼
138b‧‧‧插銷、固定插銷
138h‧‧‧頭部
139‧‧‧移動式插銷
140‧‧‧基板/製品
140a‧‧‧頂面
140b‧‧‧底面
141‧‧‧基板滯留區、造形邊緣
142‧‧‧周邊
143‧‧‧黏合材料
144‧‧‧聚合物薄膜
150‧‧‧側止動件
150a‧‧‧側止動件
160‧‧‧框架
161‧‧‧唇部/緣部
162‧‧‧輻條
164‧‧‧開口
168‧‧‧側邊緣
171‧‧‧旋轉軸
172‧‧‧外邊緣
173‧‧‧凸出周邊
175‧‧‧致動器
180‧‧‧第一位置
181‧‧‧第二位置
206‧‧‧光纖
208‧‧‧GRIN透鏡
220‧‧‧玻璃製品
224‧‧‧箭頭
240‧‧‧曲線
242‧‧‧曲線
244‧‧‧曲線
246‧‧‧曲線
248‧‧‧曲線
300‧‧‧圓頂載具
302‧‧‧開口
304‧‧‧透鏡
306‧‧‧肩部
400‧‧‧點來源
402‧‧‧垂直法向量
404‧‧‧法線
410‧‧‧輪廓線
500‧‧‧鍍膜裝置100‧‧‧ coating device
102‧‧‧vacuum chamber
110‧‧‧Rotating dome
110a‧‧‧ Block
112‧‧‧Fiber
114‧‧‧Quartz monitor
116‧‧‧ glass plate
116a‧‧‧ openings
116b‧‧‧ surface
117‧‧‧Rotary axis
118‧‧‧ Plasma source
118a‧‧‧Ion source
119‧‧‧ Vacuum sealed bearings
120‧‧‧Electronic beam source
120a‧‧‧First electron beam source
120b‧‧‧second electron beam source
121‧‧‧ neutralizer
122‧‧‧electron beam mirror
124‧‧‧Optical coating carrier
125‧‧‧Mask, first mask
125a‧‧‧ bracket
126‧‧‧ boat
127‧‧‧ mask
128‧‧‧hot evaporation source
129‧‧‧ second mask
130‧‧‧Substrate carrier
130a‧‧‧Surface, adjustable substrate carrier
130b‧‧‧Substrate carrier
131‧‧‧Substrate carrier base
131a‧‧‧Retained surface
131b‧‧‧ bottom
132‧‧‧Spring system
133‧‧ ‧ spring
134‧‧‧ components, magnets
136‧‧‧ latch
137‧‧‧ Track
138a‧‧•Spring loaded adjustment latch, retractable latch
138aa‧‧‧shell
138b‧‧‧Latch, fixed latch
138h‧‧‧ head
139‧‧‧Mobile latch
140‧‧‧Substrate/Product
140a‧‧‧ top surface
140b‧‧‧ bottom
141‧‧‧Substrate retention zone
Around 142‧‧
143‧‧‧Adhesive materials
144‧‧‧ polymer film
150‧‧‧ side stop
150a‧‧‧ side stop
160‧‧‧Frame
161‧‧‧Lips/Edges
162‧‧ spokes
164‧‧‧ openings
168‧‧‧ side edge
171‧‧‧Rotary axis
172‧‧‧ outer edge
173‧‧‧ protruding out
175‧‧‧Actuator
180‧‧‧ first position
181‧‧‧ second position
206‧‧‧Fiber
208‧‧‧GRIN lens
220‧‧‧Glass products
224‧‧‧ arrow
240‧‧‧ Curve
242‧‧‧ Curve
244‧‧‧ Curve
246‧‧‧ Curve
248‧‧‧ Curve
300‧‧‧Dome Vehicle
302‧‧‧ openings
304‧‧‧ lens
306‧‧‧ shoulder
400‧‧‧ point source
402‧‧‧Vertical normal vector
404‧‧‧ normal
410‧‧‧ contour
500‧‧‧ coating device

第1A圖係根據敍於本文之一個或多個實施例之鍍膜裝置100之示意圖；1A is a schematic illustration of a coating apparatus 100 according to one or more embodiments herein;

第1B圖係示意地描繪玻璃板116之放大圖且圖示用於收納石英監視器之開口116a；1B is a schematic view of an enlarged view of the glass plate 116 and illustrates an opening 116a for receiving a quartz monitor;

第1C圖係示意地描繪具有被收納於開口之石英監視器之玻璃板和光纖之放大圖，二者係使用於測量和控制貼附於基板載具之玻璃基板上之光學鍍膜材料之沉積；1C is a schematic enlarged view of a glass plate and an optical fiber having a quartz monitor housed in an opening, which are used for measuring and controlling deposition of an optical coating material attached to a glass substrate of a substrate carrier;

第2圖係表示經由第1A圖之鍍膜裝置之圓頂部分之俯視圖形，係圖示磁性貼附於圓頂之複數個基板載具；2 is a plan view showing a dome portion of the coating device of FIG. 1A, showing a plurality of substrate carriers magnetically attached to the dome;

第3A圖係示意地描繪具有磁性貼附於圓頂之複數個基板載具之第1A圖之鍍膜裝置之圓頂區塊之傾斜上視圖；Figure 3A is a schematic elevational elevational view of a dome block of a coating apparatus of Figure 1A having a plurality of substrate carriers magnetically attached to a dome;

第3B圖係示意地描繪支撐圓頂區塊110a之框架；框架160具有如圖示於第3A圖中之外側唇部/緣部161、位於旋轉軸117(圖未示)可貼附之開口164處之內側緣(無編號)及足夠寬以容納如圖示於168之圓頂區塊側邊緣之複數個輻條162；Fig. 3B schematically depicts the frame supporting the dome block 110a; the frame 160 has an outer lip/edge portion 161 as shown in Fig. 3A, and an opening affixable to the rotating shaft 117 (not shown). The inner edge (not numbered) at 164 and a plurality of spokes 162 wide enough to accommodate the side edges of the dome block as shown at 168;

第4A圖係示意地描繪具有用於將載具磁性貼附至圓頂110且用於在鍍膜製程中握持玻璃基板/製品140之複數個元件134之非磁性基板載具130；4A is a schematic depiction of a non-magnetic substrate carrier 130 having a plurality of elements 134 for magnetically attaching a carrier to a dome 110 and for holding a glass substrate/article 140 in a coating process;

第4B圖係第4A圖之側視圖，係圖示放置於從基板載具表面130a延伸進入基板載具底座131一段距離之插銷136上之玻離基板140、自基板載具130之表面130a延伸穿過基板超過底座130b一段距離之複數個磁鐵134、自載具130底座延伸到離玻璃製品140之頂面140a一段距離之側止動件150；4B is a side view of FIG. 4A, showing the glass substrate 140 placed on the pin 136 extending from the substrate carrier surface 130a into the substrate carrier base 131, extending from the surface 130a of the substrate carrier 130. a plurality of magnets 134 extending through the substrate beyond the base 130b, and extending from the base of the carrier 130 to a side stop 150 at a distance from the top surface 140a of the glass article 140;

第4C圖係基板載具底座131之仰視圖，其係描繪定位於基板滯留區141之周邊142外之磁鐵134；4C is a bottom view of the substrate carrier base 131, which depicts a magnet 134 positioned outside the periphery 142 of the substrate retention zone 141;

第5圖係示意地描繪插銷138a和138b之一以及造形邊緣141，玻璃基板140係藉由彈簧裝載調整式插銷138a所作用抵靠玻璃基板之力量而保持抵靠插銷，造形邊緣141係接觸插銷，於本例中係倒角邊緣；Fig. 5 schematically depicts one of the pins 138a and 138b and the forming edge 141. The glass substrate 140 is held against the latch by the force of the spring loaded adjustment pin 138a against the glass substrate, and the forming edge 141 is in contact with the latch. , in this case, the chamfered edge;

第6圖係圖示貼附於圓頂110之基板載具130，使得可伸縮插銷138a垂直於旋轉方向而定位，意即，相較插銷138b係較接近於圓頂110之頂端T之開口，亦圖示於第6圖；Figure 6 is a diagram showing the substrate carrier 130 attached to the dome 110 such that the telescoping pin 138a is positioned perpendicular to the direction of rotation, i.e., closer to the opening of the top end T of the dome 110 than the pin 138b. Also shown in Figure 6;

第7A圖-第7C圖係與玻璃或氧化物AR鍍膜之氟化矽烷接枝反應(fluorinated silane grafting reaction)之示意表示圖；Figure 7A - Figure 7C is a schematic representation of a fluorinated silane grafting reaction with a glass or oxide AR coating;

第8 圖係圖示位於ECT鍍膜下方之AR光學鍍膜層以提供隔絕玻璃表面化學成份和污染之阻障層，且進一步提供較低的活化能位址供氟化矽烷(fluorinated silane)以最大的鍍膜密度和在鍍膜表面交連(crosslinking)與AR光學鍍膜進行化學鍵結，以將刮損可靠度(abrasion reliability)(持久性) 最大化；Figure 8 shows the AR optical coating under the ECT coating to provide a barrier to the chemical composition and contamination of the glass surface, and further provides a lower activation energy address for the largest fluorinated silane. The coating density and chemical bonding at the coating surface cross-linking with the AR optical coating to maximize scratch reliability (persistence);

第9圖係AR-ETC鍍膜之GRIN透鏡208與光纖206一起使用之圖例及其某些用途；Figure 9 is a diagram of an AR-ETC coated GRIN lens 208 for use with fiber 206 and some of its uses;

第10圖係具有1層PVD 8-10nm ETC在6層ARC (Nb₂ O₅ /SiO₂ )鍍膜上方之玻璃製品與僅具有噴灑塗佈ETC鍍膜(spray coated ETC coating)之玻璃製品的刮損測試資料比較；Figure 10 is a scratch of a glass article having a layer of PVD 8-10 nm ETC over a 6-layer ARC (Nb ₂ O ₅ /SiO ₂ ) coating and a glass article having only spray coated ETC coating Comparison of test data;

第11圖係刮損可靠度之比較：具有6層PVD IAD-DB AR鍍膜和1層在AR鍍膜頂部之8-10 nm 熱沉積ETC鍍膜之玻璃製品對比於具有在第一習知塗佈機(coater)中沉積之PVD AR鍍膜和在第二習知塗佈機中沉積之ETC之玻璃製品；Figure 11 is a comparison of scratch reliability: a glass article with 6 layers of PVD IAD-DB AR coating and 1 layer of 8-10 nm thermally deposited ETC coating on top of the AR coating compared to having the first conventional coating machine a PVD AR coating deposited in a (coater) and a glass article of ETC deposited in a second conventional coating machine;

第12圖係塗佈有AR鍍膜和ETC鍍膜之玻璃製品在經過6K、7K、8K和9K次刮拭後之%反射率對波長之關係圖；Figure 12 is a graph showing the % reflectance versus wavelength after 6K, 7K, 8K and 9K wipes of a glass article coated with an AR coating and an ETC coating;

第13圖係塗佈有AR鍍膜和ETC鍍膜之玻璃製品在經過6K、7K、8K和9K次刮拭後之%穿透率對波長之關係圖；Figure 13 is a graph showing the % transmittance versus wavelength after 6K, 7K, 8K and 9K wipes of a glass article coated with an AR coating and an ETC coating;

第14圖係反射率%對比於波長之圖形且圖示AR鍍膜層/週期反射率數目對比於沒有AR鍍膜玻璃之效應；Figure 14 is a plot of % reflectance vs. wavelength and shows the number of AR coating layers/periodic reflectance versus the effect of no AR coated glass;

第15圖係圖示調整式磁性載具130a，其係實質上類似於圖示在第4A圖之載具130且可以供不同尺寸基板之單一載具使用；Figure 15 is a diagram illustrating an accommodating magnetic carrier 130a that is substantially similar to the carrier 130 illustrated in Figure 4A and that can be used with a single carrier of different sized substrates;

第16A圖係圖示習知圓頂載具300，其具有供將被鍍膜之透鏡放置之複數個開口302；Figure 16A is a diagram showing a conventional dome carrier 300 having a plurality of openings 302 for placing a lens to be coated;

第16B圖係圖示自開口302內之載具300肩部306滑落之透鏡304，透鏡304係位於當載具300冷卻時將破裂之位置；Figure 16B is a diagram showing the lens 304 sliding from the shoulder 306 of the carrier 300 within the opening 302, the lens 304 being located where the carrier 300 will rupture when cooled;

第17A圖係鍍膜裝置之一實施例之圖例，鍍膜裝置係具有遮蓋圓頂之一選擇區域之遮罩，以改良光學鍍膜之均勻度；Figure 17A is a diagram of an embodiment of a coating apparatus having a mask covering a selected area of the dome to improve the uniformity of the optical coating;

第17B圖係水接觸角(Water Contact Angle)對比於刮損週期(Abrasion Cycle)之圖形，其係圖示使用如圖示於第17A圖之遮罩所獲得的改善；Figure 17B is a graph of Water Contact Angle versus Abrasion Cycle, which is an illustration of the improvement obtained using a mask as illustrated in Figure 17A;

第18圖係反射率(y-軸)作為波長(x-軸)之函數之模擬圖形，其係針對鍍有6層AR鍍膜(Nb₂ O₅ /SiO₂ )和1層ETC鍍膜之玻璃基板，其中ETC鍍膜係具有2%厚度變動(variation) 之AR鍍膜；Figure 18 is a simulation of the reflectance (y-axis) as a function of wavelength (x-axis) for a glass substrate coated with 6 layers of AR coating (Nb ₂ O ₅ /SiO ₂ ) and 1 layer of ETC coating. , wherein the ETC coating is an AR coating having a 2% thickness variation;

第19圖係圖解描繪反射率(y-軸)作為波長之函數，其係針對以6層AR鍍膜(Nb₂ O₅ /SiO₂ )和1層ETC鍍膜加以鍍膜之複數個真實樣本；Figure 19 is a graphical representation of reflectance (y-axis) as a function of wavelength for a plurality of real samples coated with 6 layers of AR coating (Nb ₂ O ₅ /SiO ₂ ) and 1 layer of ETC coating;

第20A圖係示意地描繪具有1層黏合材料143沉積在其上之基板載具之滯留表面131a；Figure 20A is a schematic depiction of a retention surface 131a of a substrate carrier having a layer of adhesive material 143 deposited thereon;

第20B圖係示意地描繪基板載具之截面圖，聚合物薄膜144和黏合材料143係定位在基板載具底座上；Figure 20B is a schematic cross-sectional view of the substrate carrier, the polymer film 144 and the adhesive material 143 are positioned on the substrate carrier base;

第21A圖係示意地描繪鍍膜裝置之一實施例之垂直截面圖；21A is a vertical cross-sectional view schematically showing an embodiment of a coating apparatus;

第21B圖係示意地描繪第21A圖之鍍膜裝置之水平截面圖；及Figure 21B is a horizontal cross-sectional view schematically showing the coating device of Figure 21A; and

第22圖係圖解描繪鍍膜厚度變動作為鍍膜源和被鍍膜基板相對定位之函數。Figure 22 is a graphical representation of the variation in coating thickness as a function of the relative location of the coating source and the substrate being coated.

國內寄存資訊（請依寄存機構、日期、號碼順序註記） 無 國外寄存資訊（請依寄存國家、機構、日期、號碼順序註記） 無Domestic deposit information (please note according to the order of the depository, date, number) None Foreign deposit information (please note according to the country, organization, date, number order)

Claims (10)

一種用於鍍膜一基板之鍍膜裝置，該鍍膜裝置包含：一真空腔室；一旋轉圓頂，其定位於該真空腔室內且包含一磁性材料；及一電漿源，其定位於該真空腔室內部且該電漿源係實質上垂直定向以引導電漿至該旋轉圓頂之一底面，其中該電漿源係定位在該旋轉圓頂下方且自該旋轉圓頂之一旋轉軸徑向地向外，使得自該電漿源射出之電漿係從該旋轉圓頂之至少一外邊緣到該旋轉圓頂之至少一中心而入射到該旋轉圓頂之該底面。A coating device for coating a substrate, the coating device comprising: a vacuum chamber; a rotating dome positioned in the vacuum chamber and comprising a magnetic material; and a plasma source positioned in the vacuum chamber a chamber portion and the plasma source is substantially vertically oriented to direct plasma to a bottom surface of the rotating dome, wherein the plasma source is positioned below the rotating dome and radially from one of the rotating domes The ground is outwardly such that the plasma ejected from the plasma source is incident on the bottom surface of the rotating dome from at least one outer edge of the rotating dome to at least one center of the rotating dome. 如請求項1所述之鍍膜裝置，其中該旋轉圓頂之該旋轉軸至該電漿源間之一距離係大於該旋轉圓頂之一凸出周邊至該電漿源間之一距離。The coating device of claim 1, wherein a distance between the rotating shaft of the rotating dome and the plasma source is greater than a distance between a convex periphery of the rotating dome and the plasma source. 如請求項1所述之鍍膜裝置，進一步包含定位於該真空腔室內之至少一電子束源，該電子束源係定向以引導一電子束至定位於該真空腔室內之鍍膜源材料。The coating apparatus of claim 1, further comprising at least one electron beam source positioned within the vacuum chamber, the electron beam source being oriented to direct an electron beam to a coating source material positioned within the vacuum chamber. 如請求項3所述之鍍膜裝置，進一步包含可調整地可定位於該真空腔室內部之至少一遮罩。The coating apparatus of claim 3, further comprising at least one mask adjustably positionable inside the vacuum chamber. 如請求項4所述之鍍膜裝置，其中該至少一遮罩係可在一伸展位置和一縮回位置之間調整，該伸展位置係該至少一遮罩定位於該至少一電子束源和該旋轉圓頂之間，該縮回位置係該至少一遮罩非定位於該至少一電子束源和該旋轉圓頂之間。The coating device of claim 4, wherein the at least one mask is adjustable between an extended position and a retracted position, the extended position being the at least one mask positioned at the at least one electron beam source and the Between the rotating domes, the retracted position is such that the at least one mask is not positioned between the at least one electron beam source and the rotating dome. 如請求項4所述之鍍膜裝置，進一步包含定位於該真空腔室內之一第二電子束源，該第二電子束源係定向以引導一第二電子束至定位於該真空腔室內之鍍膜源材料。The coating apparatus of claim 4, further comprising a second electron beam source positioned within the vacuum chamber, the second electron beam source being oriented to direct a second electron beam to a coating positioned within the vacuum chamber Source material. 如請求項6所述之鍍膜裝置，進一步包含定位於該第二電子束源和該旋轉圓頂間之一第二遮罩。The coating apparatus of claim 6, further comprising a second mask positioned between the second electron beam source and the rotating dome. 如請求項1所述之鍍膜裝置，進一步包含定位於該真空腔室內之至少一熱蒸鍍源。The coating apparatus of claim 1, further comprising at least one thermal evaporation source positioned in the vacuum chamber. 如請求項1所述之鍍膜裝置，其中該旋轉圓頂包含：一開口，其位於該旋轉圓頂之一頂中央；一透明玻璃板，其遮蓋該旋轉圓頂之該開口；及一監視器，其定位於該透明玻璃板中之一開口，該監視器係用於監視沉積於該真空腔室內之鍍膜材料之一沉積速率。The coating apparatus of claim 1, wherein the rotating dome comprises: an opening at a top center of one of the rotating domes; a transparent glass plate covering the opening of the rotating dome; and a monitor It is positioned in one of the openings in the transparent glass sheet for monitoring the deposition rate of one of the coating materials deposited in the vacuum chamber. 如請求項9所述之鍍膜裝置，進一步包含定位於該透明玻璃板上方之一光纖，其中當該透明玻璃板被鍍膜以決定該透明玻璃板之一反射率變化且因此決定塗佈在該透明玻璃板之一鍍膜厚度時，該光纖係收集反射自該透明玻璃板之光線。The coating apparatus of claim 9, further comprising an optical fiber positioned above the transparent glass plate, wherein the transparent glass plate is coated to determine a reflectance change of the transparent glass plate and thus is determined to be coated on the transparent When one of the glass sheets is coated with a thickness, the fiber collects light reflected from the transparent glass sheet.