TW201740079A - 膜厚度分布檢測方法 - Google Patents

膜厚度分布檢測方法 Download PDF

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Publication number
TW201740079A
TW201740079A TW106100977A TW106100977A TW201740079A TW 201740079 A TW201740079 A TW 201740079A TW 106100977 A TW106100977 A TW 106100977A TW 106100977 A TW106100977 A TW 106100977A TW 201740079 A TW201740079 A TW 201740079A
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TW
Taiwan
Prior art keywords
film
wafer
film thickness
thickness distribution
light
Prior art date
Application number
TW106100977A
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English (en)
Chinese (zh)
Inventor
Susumu Kuwabara
Original Assignee
Shin-Etsu Handotai Co Ltd
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Publication date
Application filed by Shin-Etsu Handotai Co Ltd filed Critical Shin-Etsu Handotai Co Ltd
Publication of TW201740079A publication Critical patent/TW201740079A/zh

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  • Length Measuring Devices By Optical Means (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
TW106100977A 2016-02-15 2017-01-12 膜厚度分布檢測方法 TW201740079A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016026340 2016-02-15
JP2016075691A JP6520795B2 (ja) 2016-02-15 2016-04-05 膜厚分布測定方法

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TW201740079A true TW201740079A (zh) 2017-11-16

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TW106100977A TW201740079A (zh) 2016-02-15 2017-01-12 膜厚度分布檢測方法

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JP (1) JP6520795B2 (ja)
TW (1) TW201740079A (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019184921A1 (zh) * 2018-03-26 2019-10-03 上海微电子装备（集团）股份有限公司 掩模版厚度检测装置、存储机构、传输机构及光刻***
CN111197961A (zh) * 2018-10-30 2020-05-26 三星钻石工业股份有限公司 垂直微裂纹的厚度的检查装置及方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7341849B2 (ja) 2019-10-24 2023-09-11 大塚電子株式会社 光学測定装置および光学測定方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IL110466A (en) * 1994-07-26 1998-07-15 C I Systems Israel Ltd Film thickness mapping using interferometric spectral imaging
JP4070887B2 (ja) * 1998-07-08 2008-04-02 大日本スクリーン製造株式会社 膜厚測定装置
JP2000314612A (ja) * 1999-04-30 2000-11-14 Kawatetsu Techno Res Corp 光透過膜の膜厚測定方法および膜厚測定装置
JP3866933B2 (ja) * 2001-04-27 2007-01-10 シャープ株式会社 膜厚測定装置
JP2004012302A (ja) * 2002-06-07 2004-01-15 Hitachi Ltd 膜厚分布計測方法及びその装置
JP5502227B1 (ja) * 2013-07-08 2014-05-28 株式会社多聞 膜厚分布測定方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019184921A1 (zh) * 2018-03-26 2019-10-03 上海微电子装备（集团）股份有限公司 掩模版厚度检测装置、存储机构、传输机构及光刻***
TWI696900B (zh) * 2018-03-26 2020-06-21 大陸商上海微電子裝備（集團）股份有限公司 光罩厚度檢測裝置、存儲機構、傳輸機構及光刻系統
CN111197961A (zh) * 2018-10-30 2020-05-26 三星钻石工业股份有限公司 垂直微裂纹的厚度的检查装置及方法

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Publication number Publication date
JP2017146288A (ja) 2017-08-24
JP6520795B2 (ja) 2019-05-29

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