TW201725354A - Thin vapor chamber structure - Google Patents
Thin vapor chamber structure Download PDFInfo
- Publication number
- TW201725354A TW201725354A TW105101303A TW105101303A TW201725354A TW 201725354 A TW201725354 A TW 201725354A TW 105101303 A TW105101303 A TW 105101303A TW 105101303 A TW105101303 A TW 105101303A TW 201725354 A TW201725354 A TW 201725354A
- Authority
- TW
- Taiwan
- Prior art keywords
- chamber
- housing
- plate
- frame
- thin
- Prior art date
Links
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
本發明是有關一種均溫板結構，尤指一種可防止均溫板在熱傳導及熱擴散的過程中，殼體表面產生形變的薄型均溫板結構。The invention relates to a temperature equalizing plate structure, in particular to a thin uniform temperature plate structure capable of preventing deformation of a surface of a casing during heat conduction and heat diffusion.
隨著科技的日新月異，電子元件的功率與效能日益提升，因此電子元件在操作時也產生更多的熱量。倘若這些熱量未能及時散逸出去而累積於該電子元件的內部，將會導致該電子元件的溫度升高且影響其效能，甚至嚴重者將導致該電子元件故障損壞。所以業界一直不斷地研發各種散熱裝置，以解決電子元件散熱的問題，其中均溫板就是一種很常見的散熱裝置。With the rapid development of technology, the power and efficiency of electronic components are increasing, so electronic components generate more heat during operation. If the heat is not accumulated in time and accumulates inside the electronic component, the temperature of the electronic component will rise and affect its performance, and even severely, the electronic component will be damaged. Therefore, the industry has been continuously researching various heat sinks to solve the problem of heat dissipation of electronic components. The temperature equalization plate is a very common heat sink.
均溫板主要包括一扁平密閉殼體、成型於該扁平密閉殼體內的一毛細組織及填注在該扁平密閉殼體內的一工作流體。扁平密閉殼體具有一吸熱面及與吸熱面相反的一放熱面，吸熱面接觸一電子發熱元件，例如中央處理器(CPU)等，藉由均溫板內的工作流體之汽液相變化而將電子發熱元件所產生的熱量從吸熱面傳遞至放熱面。The temperature equalizing plate mainly comprises a flat sealed casing, a capillary structure formed in the flat sealed casing, and a working fluid filled in the flat sealed casing. The flat sealed housing has a heat absorbing surface and a heat releasing surface opposite to the heat absorbing surface, and the heat absorbing surface contacts an electronic heating element, such as a central processing unit (CPU), etc., by a vapor-liquid phase change of the working fluid in the temperature equalizing plate. The heat generated by the electronic heating element is transferred from the heat absorbing surface to the heat releasing surface.
此外，電子產品尺寸朝輕薄化設計，所以均溫板的尺寸也必須縮小，即使是幾公厘的厚度縮減，對於電子產品的薄型化來說都是很重要的一項突破。特別是筆記型電腦中，主機板上的中央處理器是最主要的運算元件，也是發熱量最大的電子元件。因此現有的均溫板多設計為平面式結構，利用均溫板的吸熱面與中央處理單元的表面相互接觸以進行散熱。現有均溫板結構為了增加散熱效果，會將平面面積加大以將吸熱面吸收的熱量透過工作流體傳導到最遠的放熱面，如此增加散熱效率。然而均溫板在吸熱面的殼體上由於受熱十分容易塌陷變形，導致導熱性能不佳，甚至使均溫板損壞無法使用。In addition, the size of electronic products is designed to be lighter and thinner, so the size of the uniform temperature plate must also be reduced. Even a reduction in thickness of a few millimeters is an important breakthrough for the thinning of electronic products. Especially in the notebook computer, the central processing unit on the motherboard is the most important computing component, and it is also the electronic component with the largest amount of heat. Therefore, the existing temperature equalizing plates are mostly designed as a planar structure, and the heat absorbing surface of the temperature equalizing plate is in contact with the surface of the central processing unit to dissipate heat. In order to increase the heat dissipation effect, the existing uniform temperature plate structure increases the plane area to conduct the heat absorbed by the heat absorption surface to the farthest heat release surface through the working fluid, thereby increasing the heat dissipation efficiency. However, the temperature plate on the heat absorbing surface is easily collapsed and deformed due to heat, resulting in poor thermal conductivity and even damage to the temperature plate.
有鑑於此，本發明人遂針對上述現有技術，特潛心研究並配合學理的運用，盡力解決上述之問題點，即成為本發明人改良之目標。In view of the above, the inventors of the present invention have made great efforts to solve the above problems in view of the above-mentioned prior art, and have made great efforts to solve the above problems, which has become the object of improvement of the present inventors.
本發明目的之一，在於提供一種可防止均溫板在熱傳導及熱擴散作用的過程中，均溫板的殼體表面不會產生形變的薄型均溫板結構。One of the objects of the present invention is to provide a thin uniform temperature plate structure which can prevent the temperature of the temperature equalizing plate from being deformed during the heat conduction and heat diffusion.
本發明另一目的，在於提供一種適用於大面積/尺寸的薄型均溫板結構。Another object of the present invention is to provide a thin uniform temperature plate structure suitable for a large area/size.
為達上述目的，本發明提供一種薄型均溫板結構，包括一第一殼體及一第二殼體。第一殼體包含一第一腔室及設置於第一腔室的一毛細組織層，其中毛細組織層與第一腔室齊平。第二殼體具有一第二腔室及設置於第二腔室的複數支撐柱，其中每一支撐柱與第二腔室齊平，第二殼體與第一殼體封合後各支撐柱抵觸毛細組織層的表面。To achieve the above object, the present invention provides a thin uniform temperature plate structure including a first casing and a second casing. The first housing includes a first chamber and a capillary tissue layer disposed in the first chamber, wherein the capillary tissue layer is flush with the first chamber. The second housing has a second chamber and a plurality of support columns disposed in the second chamber, wherein each of the support columns is flush with the second chamber, and the second housing is sealed with the first housing Resists the surface of the capillary layer.
本發明還具有以下功效，第一殼體與第二殼體分別設置毛細組織層及多個支撐柱，各支撐柱可與毛細組織層彼此抵觸地連接，使本發明的均溫板形成一實心板體，因此本發明的均溫板能夠製作成大面積/尺寸且薄型的均溫板，以適用於各種趨於薄型化的電子產品中。The invention also has the following effects: the first housing and the second housing respectively have a capillary structure layer and a plurality of support columns, and each support column can be connected to the capillary tissue layer in abutting manner, so that the temperature equalization plate of the invention forms a solid The plate body, therefore, the temperature equalizing plate of the present invention can be fabricated into a large-area/size and thin-type temperature equalizing plate, which is suitable for use in various electronic products which tend to be thinner.
有關本發明之詳細說明及技術內容，配合圖式說明如下，然而所附圖式僅提供參考與說明用，並非用來對本發明加以限制者。The detailed description and technical content of the present invention are set forth in the accompanying drawings.
如圖1至圖3所示，本發明提供一種薄型均溫板結構，包括一第一殼體110及一第二殼體200。第一殼體110包含一第一腔室120及設置於第一腔室120的一毛細組織層150，其中毛細組織層150與第一腔室120齊平。As shown in FIG. 1 to FIG. 3, the present invention provides a thin uniform temperature plate structure including a first housing 110 and a second housing 200. The first housing 110 includes a first chamber 120 and a capillary tissue layer 150 disposed on the first chamber 120, wherein the capillary tissue layer 150 is flush with the first chamber 120.
在本實施例中，第一殼體110還包含一第一板體130及直立地從第一板體130周緣凸起的一第一邊框140。第一腔室120形成於第一板體130及第一邊框140之間，且毛細組織層150的一側面貼接第一板體130的內表面，另一側面則與第一邊框140的高度等高。也就是說，毛細組織層150的厚度D較佳與第一腔室120的深度160相同。In the embodiment, the first housing 110 further includes a first plate body 130 and a first frame 140 that is erected from the periphery of the first plate body 130. The first chamber 120 is formed between the first plate body 130 and the first frame 140, and one side of the capillary structure layer 150 is attached to the inner surface of the first plate body 130, and the other side is opposite to the height of the first frame 140. Contour. That is, the thickness D of the capillary tissue layer 150 is preferably the same as the depth 160 of the first chamber 120.
在此所指的毛細組織層150包含但不限於粉末燒結的孔隙組織、金屬網、纖維絲或其組合，可使容置於其中的工作流體(圖略)得以迅速藉由粉末燒結的孔隙組織、纖維絲或金屬網擴散至遠處。The capillary structure layer 150 referred to herein includes, but is not limited to, powder sintered pore structure, metal mesh, fiber filament or a combination thereof, so that the working fluid (not shown) accommodated therein can be quickly formed by powder sintered pore structure , fiber or metal mesh spread to a distance.
第二殼體200具有一第二腔室220及設置於第二腔室220的複數支撐柱250，其中每一支撐柱250與第二腔室220齊平。當第二殼體200與第一殼體110封合後，各支撐柱250抵觸毛細組織層150的表面，如此可防止均溫板100在熱傳導及熱擴散作用的過程中，均溫板100的殼體表面不會產生形變。The second housing 200 has a second chamber 220 and a plurality of support columns 250 disposed in the second chamber 220, wherein each of the support columns 250 is flush with the second chamber 220. After the second housing 200 is sealed with the first housing 110, the support columns 250 are in contact with the surface of the capillary structure layer 150, so that the temperature equalization plate 100 can be prevented from being in the process of heat conduction and thermal diffusion. The surface of the housing does not deform.
在本實施例中，第二殼體200還包含一第二板體230及直立地從第二板體230周緣凸起的一第二邊框240。第二腔室220形成於第二板體230及第二邊框240之間，且各支撐柱250的一側面直立地連接第一板體230的內表面，直到與第二邊框240的高度等高。也就是說，各支撐柱250的高度與第二腔室220的深度相同，且各支撐柱250的形狀較佳為圓柱體。In the embodiment, the second housing 200 further includes a second plate 230 and a second frame 240 that is erected from the periphery of the second plate 230. The second chamber 220 is formed between the second plate 230 and the second frame 240, and one side of each support column 250 is connected to the inner surface of the first plate 230 upright until the height of the second frame 240 is equal. . That is, the height of each support post 250 is the same as the depth of the second chamber 220, and the shape of each support post 250 is preferably a cylinder.
然而在如圖5所示的實施例中，各支撐柱250的形狀亦可包含矩形柱體。又在其他不同的範例中，各支撐柱250的形狀亦可為三角柱體、橢圓柱體或上述形狀的組合，並不限定。此外，各支撐柱250包含蝕刻、鍛造或與第二殼體200一體成型製成。However, in the embodiment shown in FIG. 5, the shape of each support post 250 may also include a rectangular cylinder. In other different examples, the shape of each support post 250 may be a triangular cylinder, an elliptical cylinder, or a combination of the above shapes, and is not limited. Further, each of the support columns 250 is formed by etching, forging, or integrally molding with the second housing 200.
如圖3所示，當第一殼體110的第一邊框130與第二殼體200的第二邊框230的頂面相互蓋合後，即會形成一密閉空間170。密閉空間170中更注入一工作流體(圖略)，例如水等。進一步而言，當蓋合封閉平板形的均溫板100並貼接於發熱源(圖略)時，較佳是以第一殼體110的第一板體130外側面貼接發熱源的頂面。此時第一版體130會形成一吸熱面，第一殼體110的內壁面則設有吸液的毛細組織層150。As shown in FIG. 3, when the first frame 130 of the first casing 110 and the top surface of the second frame 230 of the second casing 200 are covered with each other, a sealed space 170 is formed. A working fluid (not shown), such as water, is injected into the confined space 170. Further, when the flat plate-shaped temperature equalizing plate 100 is closed and attached to the heat source (not shown), it is preferable that the outer surface of the first plate body 130 of the first casing 110 is attached to the top of the heat source. surface. At this time, the first plate body 130 forms a heat absorbing surface, and the inner wall surface of the first casing 110 is provided with a liquid absorbing capillary structure layer 150.
當工作流體(圖略)受熱後，藉由工作流體的液汽相變化，並經由毛細組織層150將發熱源的熱快速傳導至第二殼體200的兩端而形成一放熱區。當工作流體由液態轉換成汽態時，工作液體會帶走大量的熱量，使發熱源產生的熱量迅速導離。又當汽態的工作流體流凝結成液態後，工作流體又會從放熱區流回到吸熱區，如此完成一熱傳循環。When the working fluid (not shown) is heated, a heat release zone is formed by rapidly changing the liquid vapor phase of the working fluid and rapidly transferring the heat of the heat source to both ends of the second casing 200 via the capillary structure layer 150. When the working fluid is converted from a liquid state to a vapor state, the working fluid will carry a large amount of heat, so that the heat generated by the heat source is quickly guided away. When the vaporous working fluid stream condenses into a liquid state, the working fluid flows back from the heat release zone to the heat absorption zone, thus completing a heat transfer cycle.
在此須說明的是，如圖3所示的實施例中，第一腔室120的深度160較佳等於第二腔室220的深度260。然而在如圖4所示的實施例中，第一腔室120的深度160亦可小於第二腔室220的深度260，視散熱需求以及能夠設置環境空間而左右。It should be noted that, in the embodiment shown in FIG. 3, the depth 160 of the first chamber 120 is preferably equal to the depth 260 of the second chamber 220. However, in the embodiment shown in FIG. 4, the depth 160 of the first chamber 120 may also be less than the depth 260 of the second chamber 220, depending on the heat dissipation requirements and the ability to set the environmental space.
由於第一板體130或第二板體230的面積能夠製作的相對較大，而密閉空間170的間距相對較小，因此本實施例的第一殼體110與第二殼體200內分別設置毛細組織層150及多個支撐柱250，各支撐柱250可與毛細組織層150彼此抵觸地連接，使本發明的均溫板100形成一實心板體。因此本發明的均溫板100不論是抽真空或是製作成大面積/尺寸的薄型均溫板，以適用於狹小空間環境的各種趨於薄型化的電子產品中。The first housing 110 and the second housing 200 of the present embodiment are respectively disposed in the first housing 110 and the second housing 200, because the area of the first board 130 or the second board 230 can be relatively large, and the spacing of the confined space 170 is relatively small. The capillary structure layer 150 and the plurality of support columns 250, each of the support columns 250 can be coupled to the capillary structure layer 150 in abutting manner, so that the temperature equalization plate 100 of the present invention forms a solid plate body. Therefore, the temperature equalizing plate 100 of the present invention is vacuum-treated or made into a large-area/size thin-type temperature equalizing plate, and is suitable for use in various thin electronic products in a narrow space environment.
綜上所述，本文於此所揭示的實施例應被視為用以說明本發明，而非用以限制本發明。本發明的範圍應由後附申請專利範圍所界定，並涵蓋其合法均等物，並不限於先前的描述。In the above, the embodiments disclosed herein are to be considered as illustrative of the invention and not to limit the invention. The scope of the present invention is defined by the scope of the appended claims, and the legal equivalents thereof are not limited to the foregoing description.
圖1為繪示本發明第一具體實施例之薄型均溫板結構的分解示意圖。1 is an exploded perspective view showing the structure of a thin type uniform temperature plate according to a first embodiment of the present invention.
圖2為繪示本發明第一具體實施例之薄型均溫板結構的剖視分解圖。Fig. 2 is a cross-sectional, exploded view showing the structure of a thin isothermal plate according to a first embodiment of the present invention.
圖3為繪示本發明第一具體實施例之薄型均溫板結構的剖視組合圖。3 is a cross-sectional view showing the structure of a thin type uniform temperature plate according to a first embodiment of the present invention.
圖4為繪示本發明另一具體實施例之薄型均溫板結構的剖視組合圖。4 is a cross-sectional view showing a structure of a thin type uniform temperature plate according to another embodiment of the present invention.
圖5為繪示本發明第二具體實施例之薄型均溫板結構的分解示意圖。FIG. 5 is an exploded perspective view showing the structure of a thin type uniform temperature plate according to a second embodiment of the present invention.
100‧‧‧均溫板 100‧‧‧even temperature board
110‧‧‧第一殼體 110‧‧‧First housing
120‧‧‧第一腔室 120‧‧‧First chamber
130‧‧‧第一板體 130‧‧‧First board
140‧‧‧第一邊框 140‧‧‧First border
150‧‧‧毛細組織層 150‧‧‧Capillary layer
200‧‧‧第二殼體 200‧‧‧ second housing
220‧‧‧第二腔室 220‧‧‧Second chamber
230‧‧‧第二板體 230‧‧‧Second plate
240‧‧‧第二邊框 240‧‧‧second border
250‧‧‧支撐柱 250‧‧‧Support column
Claims (12)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW105101303A TWI618907B (en) | 2016-01-15 | 2016-01-15 | Thin? vapor chamber structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW105101303A TWI618907B (en) | 2016-01-15 | 2016-01-15 | Thin? vapor chamber structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201725354A true TW201725354A (en) | 2017-07-16 |
| TWI618907B TWI618907B (en) | 2018-03-21 |
Family
ID=60047243
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW105101303A TWI618907B (en) | 2016-01-15 | 2016-01-15 | Thin? vapor chamber structure |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWI618907B (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110243216A (en) * | 2018-03-09 | 2019-09-17 | 双鸿电子科技工业(昆山)有限公司 | Temperature-uniforming plate and its manufacturing method |
| TWI680273B (en) * | 2018-06-28 | 2019-12-21 | 泰碩電子股份有限公司 | Using capillary structure and bumps to form a temperature equalizing plate for liquid-vapor channels |
| CN111465254A (en) * | 2019-01-18 | 2020-07-28 | 东莞钱锋特殊胶粘制品有限公司 | Ultra-thin heat dissipation plate |
| CN112033197A (en) * | 2018-06-08 | 2020-12-04 | 讯凯国际股份有限公司 | Temperature equalizing plate and manufacturing method thereof |
| CN112747619A (en) * | 2019-10-31 | 2021-05-04 | 建准电机工业股份有限公司 | Temperature equalizing plate |
| CN112747618A (en) * | 2019-10-31 | 2021-05-04 | 建准电机工业股份有限公司 | Vapor chamber and capillary sheet thereof |
| CN112867335A (en) * | 2019-11-12 | 2021-05-28 | 台达电子工业股份有限公司 | Temperature equalizing plate and assembling method thereof |
| CN114061345A (en) * | 2020-07-31 | 2022-02-18 | 尼得科超众科技股份有限公司 | Heat conduction member and method for manufacturing heat conduction member |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI679394B (en) * | 2019-01-16 | 2019-12-11 | 東莞錢鋒特殊膠黏製品有限公司 | Ultra-thin heat sink |
| TWI733272B (en) | 2019-12-12 | 2021-07-11 | 國立清華大學 | Vapor chamber device |
| TWI770901B (en) | 2021-03-25 | 2022-07-11 | 健策精密工業股份有限公司 | Vapor chamber and method for manufacturing thereof |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6302192B1 (en) * | 1999-05-12 | 2001-10-16 | Thermal Corp. | Integrated circuit heat pipe heat spreader with through mounting holes |
| TWI378219B (en) * | 2008-09-26 | 2012-12-01 | Pegatron Corp | Vapor chamber with skive fin structure and manufacturing method thereof |
-
2016
- 2016-01-15 TW TW105101303A patent/TWI618907B/en active
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110243216A (en) * | 2018-03-09 | 2019-09-17 | 双鸿电子科技工业(昆山)有限公司 | Temperature-uniforming plate and its manufacturing method |
| CN110243216B (en) * | 2018-03-09 | 2024-06-07 | 双鸿电子科技工业(昆山)有限公司 | Temperature equalizing plate and manufacturing method thereof |
| CN112033197A (en) * | 2018-06-08 | 2020-12-04 | 讯凯国际股份有限公司 | Temperature equalizing plate and manufacturing method thereof |
| TWI680273B (en) * | 2018-06-28 | 2019-12-21 | 泰碩電子股份有限公司 | Using capillary structure and bumps to form a temperature equalizing plate for liquid-vapor channels |
| CN111465254B (en) * | 2019-01-18 | 2024-05-24 | 东莞钱锋特殊胶粘制品有限公司 | Ultrathin radiating plate |
| CN111465254A (en) * | 2019-01-18 | 2020-07-28 | 东莞钱锋特殊胶粘制品有限公司 | Ultra-thin heat dissipation plate |
| CN112747619A (en) * | 2019-10-31 | 2021-05-04 | 建准电机工业股份有限公司 | Temperature equalizing plate |
| CN112747618A (en) * | 2019-10-31 | 2021-05-04 | 建准电机工业股份有限公司 | Vapor chamber and capillary sheet thereof |
| CN112747619B (en) * | 2019-10-31 | 2022-10-18 | 建准电机工业股份有限公司 | Temperature equalizing plate |
| CN112867335A (en) * | 2019-11-12 | 2021-05-28 | 台达电子工业股份有限公司 | Temperature equalizing plate and assembling method thereof |
| CN112867335B (en) * | 2019-11-12 | 2023-10-20 | 台达电子工业股份有限公司 | Temperature equalizing plate and assembling method thereof |
| US11997828B2 (en) | 2019-11-12 | 2024-05-28 | Delta Electronics, Inc. | Vapor chamber and assembly method thereof |
| CN114061345A (en) * | 2020-07-31 | 2022-02-18 | 尼得科超众科技股份有限公司 | Heat conduction member and method for manufacturing heat conduction member |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI618907B (en) | 2018-03-21 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI618907B (en) | Thin? vapor chamber structure | |
| CN106996710B (en) | Thin type equalizing plate structure | |
| TWI400032B (en) | Heat dissipation module and supporting element thereof | |
| TWI553288B (en) | Vapor chamber and method for manufacturing same | |
| JP6321089B2 (en) | Vapor chamber and electronic equipment | |
| US20170122671A1 (en) | Vapor chamber and upper housing thereof | |
| JP2019032134A (en) | Plate type heat transport device and electronic apparatus | |
| TWM494951U (en) | Heat dissipation module with high-low surface for binding with mobile device | |
| US20200232718A1 (en) | Heat dissipation unit and heat dissipation device using same | |
| TWM517812U (en) | Vapor chamber and upper shell member thereof | |
| CN112868275A (en) | Vapor chamber, heat sink, and terminal | |
| TW201728866A (en) | Heat dissipating device and a method for increasing the heat conduction of the heat dissipating device | |
| US20100264790A1 (en) | Computer enclosure | |
| TWM501091U (en) | Structure of support for temperature-equalisation plate | |
| US20140174704A1 (en) | Heat dissipation device | |
| TW201317532A (en) | Heat-dissipating device | |
| TWI597466B (en) | Heat dissipation device and heat dissipation device manufacturing method | |
| TWI582366B (en) | Vapor chamber structure | |
| TWI658776B (en) | Heat dissipation system of electronic device | |
| TWM383283U (en) | Slimming uniform temperature board and heat dissipating module with the uniform temperature board | |
| TWM585474U (en) | Reinforcing structure of heat dissipation module | |
| TWI641309B (en) | Heat dissipation element | |
| TWM484134U (en) | Thin type heat dissipater | |
| TWM482251U (en) | Circuit board heat dissipation component | |
| TWM460507U (en) | Housing structure of handheld devices |