TW201720258A - Solder pad and method for manufacturing same - Google Patents
Solder pad and method for manufacturing same Download PDFInfo
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- TW201720258A TW201720258A TW104134478A TW104134478A TW201720258A TW 201720258 A TW201720258 A TW 201720258A TW 104134478 A TW104134478 A TW 104134478A TW 104134478 A TW104134478 A TW 104134478A TW 201720258 A TW201720258 A TW 201720258A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/02—Bonding areas ; Manufacturing methods related thereto
- H01L24/03—Manufacturing methods
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/02—Bonding areas ; Manufacturing methods related thereto
- H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
Abstract
Description
本發明涉及一種焊墊及焊墊製作方法。The invention relates to a solder pad and a method of manufacturing the same.
先前技術中在焊墊上面焊接零件時，由於焊墊表面平整，當焊接在焊墊上的零件遭受外推力作用時，所述零件連同焊料一起從所述焊墊表面剝離。為解決零件受外推力作用時，其連同焊料一起自所述焊墊表面剝離的問題，通常會針對焊接零件增加點膠制程。然而，此將造成生產流程的冗長及生產成本的增加。In the prior art, when soldering a part on a pad, since the surface of the pad is flat, when the part soldered on the pad is subjected to an external thrust, the part is peeled off from the surface of the pad together with the solder. In order to solve the problem that the part is peeled off from the surface of the pad together with the solder when it is subjected to external thrust, a dispensing process is usually added for the welded part. However, this will result in a lengthy production process and an increase in production costs.
有鑑於此，有必要提供一種克服上述問題的一種焊墊及焊墊製作方法。In view of the above, it is necessary to provide a solder pad and a solder pad manufacturing method that overcome the above problems.
一種焊墊，形成在一基體上並與該基體電連接。所述焊墊包括接觸部及圍繞所述接觸部的週邊部。所述週邊部形成有多條凹槽。所述接觸部的厚度大於所述週邊部的厚度。所述接觸部與所述週邊部形成階梯結構。A solder pad is formed on a substrate and electrically connected to the substrate. The pad includes a contact portion and a peripheral portion surrounding the contact portion. The peripheral portion is formed with a plurality of grooves. The thickness of the contact portion is greater than the thickness of the peripheral portion. The contact portion and the peripheral portion form a stepped structure.
一種焊墊製作方法，包括步驟：提供一基體，其一側表面形成有導電金屬層，所述導電金屬層包括一預形成接觸部區及圍繞所述預形成接觸部區的週邊區；在所述預形成接觸部區形成一鍍層，以使得所述預形成接觸部區與所述週邊區形成階梯結構；選擇性移除部分位於所述週邊區的所述導電金屬層形成多條凹槽，以形成位於所述預形成接觸部區的接觸部及圍繞所述接觸部且位於所述週邊區的週邊部，進而形成焊墊。A solder pad manufacturing method comprising the steps of: providing a substrate having a conductive metal layer formed on one surface thereof, the conductive metal layer comprising a pre-formed contact region and a peripheral region surrounding the pre-formed contact region; Forming a contact layer to form a plating layer such that the pre-formed contact region forms a stepped structure with the peripheral region; and selectively removing a portion of the conductive metal layer located in the peripheral region to form a plurality of grooves, A bonding pad is formed to form a contact portion located in the pre-formed contact portion region and a peripheral portion surrounding the contact portion and located in the peripheral region.
相較于先前技術，本發明提供的焊墊及焊墊製作方法，由於所述焊墊包括接觸部及圍繞接觸部的週邊部，且所述週邊部形成有多條凹槽，在焊接零件時，增大了焊料與所述焊墊之間的接觸面積，從而增強了焊接強度，一方面，可使得焊接在焊墊上的零件在遭受外推力時不易從焊墊表面剝離，另一方面，可免去點膠固定焊接在焊墊上的零件的步驟，縮短生產流程及降低生產成本。Compared with the prior art, the present invention provides a solder pad and a solder pad manufacturing method, wherein the solder pad includes a contact portion and a peripheral portion surrounding the contact portion, and the peripheral portion is formed with a plurality of grooves when soldering the component Increasing the contact area between the solder and the pad, thereby enhancing the welding strength. On the one hand, the parts welded on the pad can be easily peeled off from the surface of the pad when subjected to external thrust, and on the other hand, Eliminating the need to dispense parts that are soldered to the pads, shortening the production process and reducing production costs.
圖1係本發明提供的焊墊的俯視示意圖。1 is a top plan view of a solder pad provided by the present invention.
圖2係本發明提供的焊墊的剖面示意圖。2 is a schematic cross-sectional view of a bonding pad provided by the present invention.
圖3係本發明提供的一側表面形成有導電金屬層的基體的俯視示意圖。3 is a schematic top plan view of a substrate having a conductive metal layer formed on one side of the surface provided by the present invention.
圖4係圖3的一側表面形成有導電金屬層的基體的剖面示意圖。4 is a schematic cross-sectional view showing a substrate on which one side surface of FIG. 3 is formed with a conductive metal layer.
圖5係在圖3的導電金屬層的預形成接觸部區形成鍍層後的俯視示意圖。Figure 5 is a top plan view showing the formation of a plating layer in the pre-formed contact region of the conductive metal layer of Figure 3.
圖6係圖5的導電金屬層的預形成接觸部區形成有鍍層的剖視示意圖。6 is a cross-sectional view showing a pre-formed contact region of the conductive metal layer of FIG. 5 with a plating layer formed thereon.
圖7係選擇性移除圖6中部分位於週邊區的導電金屬層形成多條凹槽後的俯視示意圖。FIG. 7 is a top plan view showing the selective removal of a portion of the conductive metal layer in the peripheral region of FIG. 6 to form a plurality of grooves.
圖8係圖7的選擇性移除圖6中部分位於週邊區的導電金屬層形成多條凹槽後的剖視圖。Figure 8 is a cross-sectional view showing the selective removal of a portion of the conductive metal layer in the peripheral region of Figure 6 after forming a plurality of grooves.
圖9係在圖7所示的形成有多條凹槽的導電金屬層上形成防焊層後的俯視圖。Fig. 9 is a plan view showing a solder resist layer formed on the conductive metal layer having a plurality of grooves formed in Fig. 7.
圖10係在圖7所示的形成有多條凹槽的導電金屬層上形成防焊層後的剖視圖。Figure 10 is a cross-sectional view showing a solder resist layer formed on the conductive metal layer having a plurality of grooves formed in Figure 7 .
圖11係在圖9中自所述防焊層露出的導電金屬層上形成保焊層後的俯視圖。Figure 11 is a plan view showing the solder resist layer formed on the conductive metal layer exposed from the solder resist layer in Figure 9.
圖12係在圖9中自所述防焊層露出的導電金屬層上形成保焊層後的剖視圖。Figure 12 is a cross-sectional view showing the solder resist layer formed on the conductive metal layer exposed from the solder resist layer in Figure 9.
圖13-15係在焊墊上焊接零件的過程剖視圖。Figure 13-15 is a cross-sectional view of the process of soldering a part on a pad.
下面結合具體實施方式對本發明提供的焊墊及焊墊製作方法進行詳細說明。The solder pad and the pad manufacturing method provided by the present invention will be described in detail below with reference to specific embodiments.
請一併參閱圖1及圖2，本發明提供的焊墊10形成在一基體100上。所述焊墊10與所述基體100電性連接。所述焊墊10可由銅、鋁、銀等導電材料製成。所述基體100可為電路板、晶片或其他電子元件。Referring to FIG. 1 and FIG. 2 together, the bonding pad 10 provided by the present invention is formed on a substrate 100. The pad 10 is electrically connected to the base 100. The pad 10 may be made of a conductive material such as copper, aluminum or silver. The substrate 100 can be a circuit board, wafer or other electronic component.
所述焊墊10包括接觸部11及週邊部12。本實施方式中，所述接觸部的厚度大於所述週邊部12的厚度。所述接觸部11與所述週邊部12形成階梯結構。The pad 10 includes a contact portion 11 and a peripheral portion 12. In the embodiment, the thickness of the contact portion is larger than the thickness of the peripheral portion 12. The contact portion 11 and the peripheral portion 12 form a stepped structure.
本實施方式中，所述接觸部11包括基層111及鍍層112。所述鍍層112位於所述基層111背離所述基體100的一側。In the present embodiment, the contact portion 11 includes a base layer 111 and a plating layer 112. The plating layer 112 is located on a side of the base layer 111 facing away from the substrate 100.
所述週邊部12圍繞所述接觸部11設置。所述週邊部12形成有多條凹槽121。本實施方式中，所述多條凹槽121自所述接觸部11向外發散分佈。所述凹槽121在厚度方向上貫穿所述週邊部12。部分所述基體100自所述凹槽121露出。The peripheral portion 12 is disposed around the contact portion 11. The peripheral portion 12 is formed with a plurality of grooves 121. In this embodiment, the plurality of grooves 121 are distributed outward from the contact portion 11 . The groove 121 penetrates the peripheral portion 12 in the thickness direction. A portion of the substrate 100 is exposed from the recess 121.
所述焊墊10還包括保焊層13。所述保焊層13可為金層或有機保焊層。所述保焊層13覆蓋所述接觸部11及週邊部12。所述凹槽121自所述保焊層13露出。The pad 10 further includes a solder resist layer 13. The solder resist layer 13 may be a gold layer or an organic solder resist layer. The solder resist layer 13 covers the contact portion 11 and the peripheral portion 12. The groove 121 is exposed from the solder resist layer 13.
可以理解的是，其他實施方式中，所述多條凹槽121可延伸至所述接觸部11。It can be understood that, in other embodiments, the plurality of grooves 121 may extend to the contact portion 11.
本發明還提供一種上述焊墊10的製作方法。所述焊墊製作方法包括以下步驟。The present invention also provides a method of fabricating the above-described solder pad 10. The solder pad manufacturing method includes the following steps.
第一步，請一併參閱圖3及圖4，提供一個基體100。In the first step, please refer to FIG. 3 and FIG. 4 together to provide a substrate 100.
所述基體100可為電路板基材、電路板、晶片或其他電子元件。所述基體100一側表面形成有導電金屬層101。所述導電金屬層101可為銅、鋁、銀等。所述導電金屬層101包括預形成接觸部區1011及圍繞所述預形成接觸部區1011的週邊區1012。本實施方式中，所述導電金屬層101包括兩個間隔的預形成接觸部區1011。The substrate 100 can be a circuit board substrate, a circuit board, a wafer, or other electronic component. A conductive metal layer 101 is formed on a surface of one side of the substrate 100. The conductive metal layer 101 may be copper, aluminum, silver, or the like. The conductive metal layer 101 includes a pre-formed contact region 1011 and a peripheral region 1012 surrounding the pre-formed contact region 1011. In this embodiment, the conductive metal layer 101 includes two spaced pre-formed contact regions 1011.
第二步，請一併參閱圖5及圖6，在所述預形成接觸部區1011形成鍍層112。In the second step, referring to FIG. 5 and FIG. 6, a plating layer 112 is formed on the pre-formed contact region 1011.
所述鍍層112凸出於所述導電金屬層101。所述鍍層112可藉由電鍍或化學鍍的方式形成。The plating layer 112 protrudes from the conductive metal layer 101. The plating layer 112 can be formed by electroplating or electroless plating.
第三步，請一併參閱圖7及圖8，選擇性移除部分位於所述週邊區1012的所述導電金屬層101，形成多條凹槽121，以形成所述接觸部11及圍繞所述接觸部11的週邊部12，從而形成兩個所述焊墊10。In the third step, referring to FIG. 7 and FIG. 8 , the conductive metal layer 101 located in the peripheral region 1012 is selectively removed, and a plurality of grooves 121 are formed to form the contact portion 11 and the surrounding portion. The peripheral portion 12 of the contact portion 11 is formed to form two of the pads 10.
本實施方式中，所述多條凹槽121自所述接觸部11發散分佈。所述兩個焊墊10相向側未形成所述凹槽121。所述凹槽121在厚度方向上貫穿所述導電金屬層101。部分所述基體100自所述凹槽121露出。所述多條凹槽121可藉由影像轉移及蝕刻的方式形成。In the embodiment, the plurality of grooves 121 are distributed from the contact portion 11 . The grooves 121 are not formed on opposite sides of the two pads 10. The groove 121 penetrates the conductive metal layer 101 in the thickness direction. A portion of the substrate 100 is exposed from the recess 121. The plurality of grooves 121 can be formed by image transfer and etching.
可以理解的是，請一併參閱圖9及圖10，當所述基體100為電路板基材或電路板時，在形成所述凹槽121後，所述焊墊製作方法還包括形成防焊層14的步驟。所述防焊層14開設有開口141。所述焊墊10自所述開口141露出。It can be understood that, when referring to FIG. 9 and FIG. 10, when the base 100 is a circuit board substrate or a circuit board, after the recess 121 is formed, the solder pad manufacturing method further includes forming a solder resist. The steps of layer 14. The solder resist layer 14 is provided with an opening 141. The pad 10 is exposed from the opening 141.
可以理解的是，請一併參閱圖11及圖12，在形成所述防焊層14後，所述焊墊製作方法還包括形成所述保焊層13。所述保焊層13可為金層或有機保焊層。所述保焊層13覆蓋所述接觸部11及週邊部12。部分所述凹槽121自所述保焊層13露出。It can be understood that, referring to FIG. 11 and FIG. 12 , after the solder resist layer 14 is formed, the solder pad manufacturing method further includes forming the solder resist layer 13 . The solder resist layer 13 may be a gold layer or an organic solder resist layer. The solder resist layer 13 covers the contact portion 11 and the peripheral portion 12. A portion of the groove 121 is exposed from the solder resist layer 13.
可以理解的是，當所述基體100為電路板基材時，在形成所述焊墊10的過程中可同時將電路板基材製作形成電路板。It can be understood that when the substrate 100 is a circuit board substrate, the circuit board substrate can be simultaneously formed into a circuit board during the process of forming the bonding pad 10.
可以理解的是，其他實施方式中，也可不在所述預形成接觸部區1011形成所述鍍層112。It can be understood that in other embodiments, the plating layer 112 may not be formed in the pre-formed contact region 1011.
當在所述焊墊10上焊接零件30時，請一併參圖13、圖14及圖15，首先，在所述焊墊10的接觸部11形成焊料20；接著，將零件30安裝在所述焊墊10上，所述零件30的焊墊31經由所述焊料20與所述接觸部電連接；然後，經回爐焊，將所述零件30焊接在所述焊墊10上，由於回爐焊時高溫使所述焊料20熔融而流至所述週邊部12，並灌入所述凹槽121，增大了所述焊料20與所述焊墊10之間的接觸面積，並將所述零件30受外推力作用的應力點引至所述焊墊10內部，因此，可使得所述零件30在遭受外推力時不易從所述焊墊10表面剝離。When the component 30 is soldered on the pad 10, please refer to FIG. 13, FIG. 14 and FIG. 15, firstly, solder 20 is formed on the contact portion 11 of the pad 10; then, the component 30 is mounted in the same place. On the pad 10, the pad 31 of the component 30 is electrically connected to the contact portion via the solder 20; then, after the furnace welding, the component 30 is soldered to the pad 10 due to reflow soldering. The high temperature causes the solder 20 to melt and flow to the peripheral portion 12, and is poured into the recess 121, increasing the contact area between the solder 20 and the pad 10, and the part is The stress point affected by the external thrust is introduced into the inside of the pad 10, so that the part 30 can be made difficult to peel off from the surface of the pad 10 when subjected to external thrust.
另外，由於所述凹槽121係自所述接觸部11向外發散分佈，在回爐焊時，氣體可沿所述凹槽121逃逸，從而不易在焊接中形成氣泡。In addition, since the groove 121 is distributed outward from the contact portion 11, gas can escape along the groove 121 during reflowing, so that it is difficult to form bubbles in the welding.
相較于先前技術，本發明提供的焊墊及焊墊製作方法，由於所述焊墊包括接觸部及圍繞接觸部的週邊部，且所述週邊部形成有多條凹槽，在焊接零件時，增大了焊料與所述焊墊之間的接觸面積，從而增強了焊接強度，一方面，可使得焊接在焊墊上的零件在遭受外推力時不易從焊墊表面剝離，另一方面，可免去點膠固定焊接在焊墊上的零件的步驟，縮短生產流程及降低生產成本。Compared with the prior art, the present invention provides a solder pad and a solder pad manufacturing method, wherein the solder pad includes a contact portion and a peripheral portion surrounding the contact portion, and the peripheral portion is formed with a plurality of grooves when soldering the component Increasing the contact area between the solder and the pad, thereby enhancing the welding strength. On the one hand, the parts welded on the pad can be easily peeled off from the surface of the pad when subjected to external thrust, and on the other hand, Eliminating the need to dispense parts that are soldered to the pads, shortening the production process and reducing production costs.
綜上所述，本發明確已符合發明專利之要件，遂依法提出專利申請。惟，以上所述者僅為本發明之較佳實施方式及所列之數據為作試驗及參考之所用，自不能以此限制本案之申請專利範圍。舉凡熟悉本案技藝之人士援依本發明之精神所作之等效修飾或變化，皆應涵蓋於以下申請專利範圍內。In summary, the present invention has indeed met the requirements of the invention patent, and has filed a patent application according to law. However, the above description is only for the preferred embodiment of the present invention and the data listed therein are used for testing and reference, and the scope of patent application in this case cannot be limited thereby. Equivalent modifications or variations made by persons skilled in the art in light of the spirit of the invention are intended to be included within the scope of the following claims.
100‧‧‧基體100‧‧‧ base
10、31‧‧‧焊墊10, 31‧‧‧ solder pads
11‧‧‧接觸部11‧‧‧Contacts
12‧‧‧週邊部12‧‧‧ peripherals
111‧‧‧基層111‧‧‧ grassroots
112‧‧‧鍍層112‧‧‧ plating
121‧‧‧凹槽121‧‧‧ Groove
13‧‧‧保焊層13‧‧‧welding layer
101‧‧‧導電金屬層101‧‧‧ Conductive metal layer
1011‧‧‧預形成接觸部區1011‧‧‧Preformed contact area
1012‧‧‧週邊區1012‧‧‧ surrounding area
14‧‧‧防焊層14‧‧‧ solder mask
141‧‧‧開口141‧‧‧ openings
20‧‧‧焊料20‧‧‧ solder
30‧‧‧零件30‧‧‧ parts
無no
31‧‧‧焊墊 31‧‧‧ solder pads
121‧‧‧凹槽 121‧‧‧ Groove
20‧‧‧焊料 20‧‧‧ solder
30‧‧‧零件 30‧‧‧ parts
Claims (10)
提供一基體，其一側表面形成有導電金屬層，所述導電金屬層包括一預形成接觸部區及圍繞所述預形成接觸部區的週邊區；
在所述預形成接觸部區形成一鍍層，以使得所述預形成接觸部區與所述週邊區形成階梯結構；
選擇性移除部分位於所述週邊區的所述導電金屬層形成多條凹槽，以形成位於所述預形成接觸部區的接觸部及圍繞所述接觸部且位於所述週邊區的週邊部，進而形成焊墊。A method for manufacturing a solder pad, comprising the steps of:
Providing a substrate having a conductive metal layer formed on one surface thereof, the conductive metal layer including a pre-formed contact region and a peripheral region surrounding the pre-formed contact region;
Forming a plating layer in the pre-formed contact region to form a stepped structure between the pre-formed contact region and the peripheral region;
Selectively removing a portion of the conductive metal layer located in the peripheral region to form a plurality of grooves to form a contact portion in the pre-formed contact portion region and a peripheral portion surrounding the contact portion and located in the peripheral portion And forming a solder pad.
The method of manufacturing a pad according to claim 7, wherein the conductive metal layer located in the peripheral region is selectively removed by image transfer and etching to form a plurality of grooves to form the pre-position. A contact portion forming the contact portion and a peripheral portion surrounding the contact portion and located at the peripheral portion.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510644990.7A CN106560919B (en) | 2015-10-06 | 2015-10-06 | Weld pad and weld pad production method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201720258A true TW201720258A (en) | 2017-06-01 |
| TWI608775B TWI608775B (en) | 2017-12-11 |
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| TW104134478A TWI608775B (en) | 2015-10-06 | 2015-10-21 | Solder pad and method for manufacturing same |
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| CN (1) | CN106560919B (en) |
| TW (1) | TWI608775B (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN114222425A (en) * | 2021-12-17 | 2022-03-22 | 浪潮商用机器有限公司 | PCB pad and circuit board |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
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| US8021976B2 (en) * | 2002-10-15 | 2011-09-20 | Megica Corporation | Method of wire bonding over active area of a semiconductor circuit |
| TW200826771A (en) * | 2006-12-15 | 2008-06-16 | Inventec Appliances Corp | Printed circuit board with enhanced solder joint strength |
| CN101018451A (en) * | 2007-03-06 | 2007-08-15 | 友达光电股份有限公司 | Welding pad structure |
| US7808089B2 (en) * | 2007-12-18 | 2010-10-05 | National Semiconductor Corporation | Leadframe having die attach pad with delamination and crack-arresting features |
| CN101384136B (en) * | 2008-10-17 | 2014-04-02 | 林克治 | Surface mounting process for flexible circuit board and used magnetic tool and steel mesh |
| US8163643B1 (en) * | 2009-08-31 | 2012-04-24 | Linear Technology Corporation | Enhanced pad design for solder attach devices |
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2015
- 2015-10-06 CN CN201510644990.7A patent/CN106560919B/en active Active
- 2015-10-21 TW TW104134478A patent/TWI608775B/en active
Also Published As
| Publication number | Publication date |
|---|---|
| TWI608775B (en) | 2017-12-11 |
| CN106560919B (en) | 2019-03-12 |
| CN106560919A (en) | 2017-04-12 |
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