TW201639992A - Heating chamber and semiconductor processing device - Google Patents
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本發明涉及半導體裝置製造領域，具體地，涉及一種加熱腔室以及半導體加工裝置。The present invention relates to the field of semiconductor device fabrication, and in particular to a heating chamber and a semiconductor processing device.
物理氣相沉積（Physical Vapor Deposition，以下簡稱PVD）技術是微電子領域常用的加工技術，如，用於加工積體電路中的銅互連層。製作銅互連層主要包括去氣、預清洗、Ta(N)沉積以及Cu沉積等步驟，其中，去氣步驟是去除晶片等被加工工件上的水蒸氣及其它易揮發性雜質。在實施去氣步驟時，需要利用加熱腔室將晶片等被加工工件加熱至300℃以上。Physical Vapor Deposition (PVD) technology is a commonly used processing technology in the field of microelectronics, for example, for processing copper interconnect layers in integrated circuits. The copper interconnect layer mainly includes steps of degassing, pre-cleaning, Ta(N) deposition, and Cu deposition, wherein the degassing step is to remove water vapor and other volatile impurities on the workpiece to be processed such as a wafer. When the degassing step is performed, it is necessary to heat the workpiece to be processed such as a wafer to 300 ° C or higher by using a heating chamber.
現有的一種加熱腔室主要包括真空腔室、環形光源、片盒和片盒升降裝置。其中，真空腔室具有可供晶片通過的傳片口；環形光源環繞設置在真空腔室內，且位於傳片口的上方，用以自真空腔室的周圍向內部輻射熱量，具體地，環形光源由多個加熱燈管組成，且多個加熱燈管沿真空腔室的周向環繞形成筒狀熱源；並且，在該環形光源的一側設置有電引入元件，其與電源連接，用以將電流傳導至各個加熱燈管。片盒用於承載多個晶片，且使多個晶片沿環形光源的軸向間隔排布；片盒升降裝置用於驅動片盒上升至由環形光源限定的內部空間內，或者下降至與傳片口相對應的位置處。A conventional heating chamber mainly comprises a vacuum chamber, an annular light source, a cassette and a cassette lifting device. Wherein, the vacuum chamber has a film opening for the wafer to pass through; the annular light source is disposed around the vacuum chamber and above the film opening for radiating heat from the periphery of the vacuum chamber to the interior, specifically, the annular light source is a heating lamp tube, and a plurality of heating lamps are circumferentially formed around the vacuum chamber to form a cylindrical heat source; and, on one side of the annular light source, an electric lead-in element is disposed, which is connected to the power source for conducting current To each heating tube. The cassette is used to carry a plurality of wafers, and the plurality of wafers are arranged along the axial interval of the annular light source; the cassette lifting device is used to drive the cassette to rise into the internal space defined by the annular light source, or to descend to the transfer opening Corresponding position.
上述加熱腔室在實際應用中不可避免地存在以下問題，即：當需要對加熱燈管進行維護時，需要將環形光源從真空腔室中拆卸下來，還需要拆開電引入元件與環形光源之間的連接，最終才能拆開環形光源，以對其中的加熱燈管進行維護。因此，上述加熱腔室的拆裝過程複雜，維護性較差。In the above, the heating chamber inevitably has the following problems: when the maintenance of the heating lamp tube is required, the annular light source needs to be detached from the vacuum chamber, and the electric lead-in element and the ring-shaped light source need to be disassembled. The connection between the two can finally disassemble the ring light source to maintain the heating tube. Therefore, the disassembly and assembly process of the above heating chamber is complicated and the maintenance is poor.
本發明旨在至少解決現有技術中存在的技術問題之一，提出了一種加熱腔室以及半導體加工裝置，其可以簡化加熱腔室的拆裝過程，從而可以更方便地對加熱腔室進行維護。The present invention aims to at least solve one of the technical problems existing in the prior art, and proposes a heating chamber and a semiconductor processing apparatus which can simplify the disassembly and assembly process of the heating chamber, so that the heating chamber can be more conveniently maintained.
為實現本發明的目的而提供一種加熱腔室，包括設置在該加熱腔室內的加熱筒體以及可拆卸地安裝在該加熱筒體中的環形光源元件：該環形光源元件包括：環繞設置在該加熱筒體內側的筒狀熱源，用於自該加熱筒體的周圍向內部輻射熱量；電引入總成，用於將電流傳導至該筒狀熱源；支撐總成，包括：環形支撐元件，該筒狀熱源安裝在該環形支撐元件上；安裝元件，與該環形支撐元件連接，該電引入總成安裝在該安裝元件上，且通過該環形支撐元件與該筒狀熱源間接電連接。To achieve the object of the present invention, there is provided a heating chamber comprising a heating cylinder disposed within the heating chamber and an annular light source member detachably mounted in the heating cylinder: the annular light source member includes: a wraparound Heating a cylindrical heat source inside the cylinder for radiating heat from the periphery of the heating cylinder; electrically introducing the assembly for conducting current to the cylindrical heat source; and supporting the assembly, comprising: an annular supporting member, A cylindrical heat source is mounted on the annular support member; a mounting member is coupled to the annular support member, the electrical lead-in assembly being mounted to the mounting member and indirectly electrically coupled to the cylindrical heat source by the annular support member.
較佳的，該筒狀熱源包括：至少兩組光源組，每組光源組由多個加熱燈管組成，且多個加熱燈管沿該環形支撐元件的周向均勻分佈，並且各組光源組中的加熱燈管之間交叉排列，且相互並聯。Preferably, the cylindrical heat source comprises: at least two sets of light sources, each set of light sources is composed of a plurality of heating lamps, and the plurality of heating tubes are evenly distributed along the circumferential direction of the annular supporting member, and each group of light sources The heating lamps in the middle are arranged in a crosswise manner and are connected in parallel with each other.
較佳的，還包括至少兩個功率控制器，各個功率控制器用於一一對應地控制各個光源組的加熱功率。Preferably, at least two power controllers are further included, and each of the power controllers is configured to control the heating power of each of the light source groups in a one-to-one correspondence.
較佳的，該光源組的數量為兩組；該環形支撐元件包括第一導電環、第二導電環和內導電環，其中，該第一導電環和該第二導電環在該加熱筒體的軸向上相對設置，且該內導電環設置在該第一導電環的內側，並且該內導電環和該第一導電環電絕緣；每個加熱燈管位於該第一導電環和第二導電環之間，其中一組光源組中的各個加熱燈管的正極/負極分別與該第一導電環/第二導電環電連接；其中另一組光源組中的各個加熱燈管的正極/負極分別與該內導電環/第二導電環電連接；該電引入總成包括第一電引入元件、第二電引入元件和內電引入元件，其中，該第一電引入元件與該第一導電環電連接；該第二電引入元件與該第二導電環電連接；該內引入元件與該內導電環電連接。Preferably, the number of the light source groups is two; the annular support member comprises a first conductive ring, a second conductive ring and an inner conductive ring, wherein the first conductive ring and the second conductive ring are in the heating cylinder The axially oppositely disposed, and the inner conductive ring is disposed inside the first conductive ring, and the inner conductive ring is electrically insulated from the first conductive ring; each of the heating lamps is located at the first conductive ring and the second conductive Between the rings, a positive electrode/negative electrode of each of the heat lamps of the group of light sources is electrically connected to the first conductive ring/second conductive ring respectively; and the positive/negative electrodes of the respective heating lamps in the other group of the light source groups Electrically coupled to the inner conductive ring/second conductive ring; the electrical lead-in assembly includes a first electrical lead-in element, a second electrical lead-in element, and an internal electrical lead-in element, wherein the first electrical lead-in element and the first conductive element a second electrical lead-in element is electrically connected to the second conductive ring; the inner lead-in element is electrically connected to the inner conductive ring.
較佳的，該環形支撐元件還包括導電短杆和內導電轉接元件，其中，該導電短杆與該內電引入元件在該加熱筒體的軸向上對應設置，且該導電短杆的一端與該內電引入元件電接觸，該導電短杆的另一端通過該內導電轉接元件與該內導電環電連接。Preferably, the annular support member further comprises a conductive short rod and an inner conductive switching element, wherein the conductive short rod and the inner electric lead-in element are disposed correspondingly in the axial direction of the heating cylinder, and one end of the conductive short rod In electrical contact with the internal electrical lead-in component, the other end of the conductive stub is electrically coupled to the inner conductive loop by the inner conductive transition element.
較佳的，該內導電轉接元件包括第一螺釘、導電轉接件和第二螺釘，其中，該導電轉接件的一端與該導電短杆通過該第一螺釘電連接，該導電轉接件的另一端與該內導電環通過該第二螺釘電連接。Preferably, the inner conductive switching element comprises a first screw, a conductive adapter and a second screw, wherein one end of the conductive adapter is electrically connected to the conductive short rod through the first screw, and the conductive switch The other end of the member is electrically connected to the inner conductive ring through the second screw.
較佳的，在該導電短杆上還套設有第一絕緣管，用以將該導電短杆與該第一導電環電絕緣。Preferably, the conductive short rod is further sleeved with a first insulating tube for electrically isolating the conductive short rod from the first conductive ring.
較佳的，該環形支撐元件還包括內電引入背板和內電引入壓板，二者分別位於該導電短杆和該內電引入元件的內側和外側，用以通過螺釘夾緊該導電短杆和該內電引入元件，且使二者電導通。Preferably, the annular support member further includes an inner electric introduction back plate and an inner electric introduction pressure plate respectively disposed on the inner side and the outer side of the conductive short rod and the inner electric lead-in member for clamping the conductive short rod by screws And the internal electricity is introduced into the component, and the two are electrically conducted.
較佳的，該環形支撐元件還包括導電長杆，該導電長杆與該第二電引入元件在該加熱筒體的軸向上對應設置，且該導電長杆的一端與該第二電引入元件電接觸，該導電長杆的另一端與該第二導電環電連接。Preferably, the annular support member further includes a conductive long rod, the conductive long rod and the second electric lead-in member are correspondingly disposed in an axial direction of the heating cylinder, and one end of the conductive long rod and the second electric lead-in member In electrical contact, the other end of the conductive rod is electrically connected to the second conductive ring.
較佳的，在該導電長杆上還套設有第二絕緣管，用以將該導電長杆與該第一導電環之間電絕緣。Preferably, a second insulating tube is further disposed on the conductive long rod for electrically isolating the conductive long rod from the first conductive ring.
較佳的，該環形支撐元件還包括第一電引入背板和第一電引入壓板，二者分別位於該導電長杆和該第二電引入元件的內側和外側，用以通過螺釘夾緊該導電長杆和該第二電引入元件，且使二者電導通。Preferably, the annular support member further includes a first electrical lead-in plate and a first electrical lead-in plate, respectively located on an inner side and an outer side of the conductive long rod and the second electric lead-in member for clamping the screw The conductive long rod and the second electrical lead-in element are electrically connected to each other.
較佳的，該環形支撐元件還包括轉接壓板和轉接背板，其中，該轉接背板位於該導電長杆的內側；該轉接壓板位於該導電長杆的外側，且與該轉接背板利用螺釘夾緊該導電長杆；並且，該轉接壓板用於將該第二導電環和該導電長杆電導通。Preferably, the annular support member further includes a transfer pressure plate and an adapter back plate, wherein the transfer back plate is located inside the conductive long rod; the transfer pressure plate is located outside the conductive long rod, and the turn The connecting back plate clamps the conductive long rod with a screw; and the transfer pressing plate is used for electrically conducting the second conductive ring and the conductive long rod.
較佳的，該環形支撐元件還包括第一絕緣背板和第一絕緣壓板，該第一絕緣背板位於該轉接背板的內側；該第一絕緣壓板罩設在該轉接壓板的外部；該第一絕緣背板和第一絕緣壓板用於將該轉接壓板和轉接背板包覆在其中。Preferably, the annular support member further includes a first insulating back plate and a first insulating pressing plate, the first insulating back plate is located inside the transfer back plate; the first insulating pressing plate is disposed outside the transfer pressing plate The first insulating back plate and the first insulating platen are used to wrap the transfer platen and the transfer back plate therein.
較佳的，該環形支撐元件還包括第二電引入壓板和第二導電背板，其中，該第二導電背板位於該第一電引入元件的內側；該第二電引入壓板位於該第一電引入元件的外側，且與該第二導電背板利用螺釘夾緊該第一電引入元件；並且，該第二電引入壓板用於將該第一導電環和該第一電引入元件電導通。Preferably, the annular support member further includes a second electrical lead-in platen and a second conductive back plate, wherein the second conductive back plate is located inside the first electrical lead-in element; the second electrical lead-in platen is located at the first Electrically introducing the outer side of the component and clamping the first electrical lead-in component with the second conductive backplate; and the second electrical lead-in platen is for electrically conducting the first conductive loop and the first electrical lead-in component .
較佳的，該環形支撐元件還包括第二絕緣背板和第二絕緣壓板，該第二絕緣背板位於該第二導電背板的內側；該第二絕緣壓板罩設在該第二電引入壓板內電引入壓板的外部；該第二絕緣背板和第二絕緣壓板用於將該第二電引入壓板和第二導電背板包覆在其中；該第一電引入元件上套設有第三絕緣管。Preferably, the annular support member further includes a second insulating back plate and a second insulating pressing plate, the second insulating back plate is located inside the second conductive back plate; the second insulating pressing plate is disposed at the second electrical introduction The inside of the pressure plate is electrically introduced into the outside of the pressure plate; the second insulation back plate and the second insulation pressure plate are used for covering the second electric introduction platen and the second conductive back plate; the first electric lead-in element is sleeved Three insulated tubes.
較佳的，該環形支撐元件還包括第一內環、第二內環和內環連接件，三者均採用絕緣材料製作，其中，該第一內環環繞設置在該第一導電環及內導電環之間，用以支撐該第一導電環及內導電環；該第二內環環繞設置在該第二導電環的內側，用以支撐該第二導電環；該內環連接件的數量為多個，且沿該加熱筒體的周向間隔設置；每個內環連接件分別與該第一內環和第二內環連接，且對二者進行支撐。Preferably, the annular support member further includes a first inner ring, a second inner ring and an inner ring connecting member, all of which are made of an insulating material, wherein the first inner ring is disposed around the first conductive ring and Between the conductive rings, the first conductive ring and the inner conductive ring are supported; the second inner ring is disposed around the second conductive ring to support the second conductive ring; the number of the inner ring connectors A plurality of and spaced apart along the circumferential direction of the heating cylinder; each inner ring connector is coupled to the first inner ring and the second inner ring, respectively, and supports both.
較佳的，該環形支撐元件還包括第一外環、第二外環和外環連接件，三者均採用絕緣材料製作，其中，該第一外環罩設在該第一導電環的外部，且將該第一導電環包覆在該第一外環與該第一內環之間；該第二外環罩設在該第二導電環的外部，且將該第二導電環包覆在該第二外環與該第二內環之間；該外環連接件的數量為至少兩個，且沿該加熱筒體的周向間隔設置，每個外環連接件分別與該第一外環和第二外環連接，且對二者進行支撐。Preferably, the annular support member further includes a first outer ring, a second outer ring and an outer ring connecting member, all of which are made of an insulating material, wherein the first outer ring cover is disposed outside the first conductive ring And covering the first conductive ring between the first outer ring and the first inner ring; the second outer ring cover is disposed outside the second conductive ring, and the second conductive ring is covered Between the second outer ring and the second inner ring; the number of the outer ring connectors is at least two, and is spaced along the circumferential direction of the heating cylinder, each outer ring connector and the first The outer ring and the second outer ring are connected and support the two.
較佳的，該第一導電環由相互間隔的兩個導電半環組成；該第一電引入元件的數量為兩個，且分別與該導電半環電連接。Preferably, the first conductive ring is composed of two conductive half rings spaced apart from each other; the number of the first electrical lead-in elements is two, and is electrically connected to the conductive half-rings respectively.
較佳的，在該其中另一組光源組中的各個加熱燈管與該內導電環的連接處還設置有隔離元件，用以將該連接處與該第一導電環相互隔離。Preferably, at the junction of each of the heating lamps in the other set of light sources and the inner conductive ring, an isolating member is further disposed to isolate the joint from the first conductive ring.
作為另一個技術方案，本發明還提供一種半導體加工裝置，其包括加熱腔室，該加熱腔室採用了本發明提供的上述加熱腔室。As another technical solution, the present invention also provides a semiconductor processing apparatus including a heating chamber using the above-described heating chamber provided by the present invention.
本發明具有以下有益效果：The invention has the following beneficial effects:
本發明提供的加熱腔室，其通過將電引入總成安裝在與環形支撐元件連接的安裝元件上，並通過該環形支撐元件將電引入總成與筒狀熱源電連接，可以在對加熱燈管進行維護時，只需要將環形光源元件從加熱筒體中整體拆下，即可直接進行維修、更換燈管等操作，而無需進行拆卸電引入總成這一步驟，也就是說，電引入總成與筒狀熱源之間可以始終保持連接，從而可以簡化加熱腔室的拆裝過程，從而可以更方便地對加熱腔室進行維護。The invention provides a heating chamber which is mounted on a mounting member connected to the annular support member by electrically introducing the assembly into the assembly, and electrically connecting the electric lead-in assembly to the cylindrical heat source through the annular support member, and the heating lamp can be When the tube is being maintained, only the annular light source component needs to be completely removed from the heating cylinder body, and the operation of repairing and replacing the lamp tube can be directly performed without the step of disassembling the electric introduction assembly, that is, the electric introduction The assembly and the cylindrical heat source can be kept connected at all times, thereby simplifying the disassembly process of the heating chamber, thereby making it easier to maintain the heating chamber.
本發明提供的半導體加工裝置，其通過採用本發明提供的上述加熱腔室，可以簡化加熱腔室的拆裝過程，從而可以更方便地對加熱腔室進行維護。The semiconductor processing apparatus provided by the invention can simplify the disassembly and assembly process of the heating chamber by adopting the above-mentioned heating chamber provided by the invention, so that the heating chamber can be more conveniently maintained.
為使本領域的技術人員更好地理解本發明的技術方案，下面結合附圖來對本發明提供的加熱腔室以及半導體加工裝置進行詳細描述。In order to enable those skilled in the art to better understand the technical solutions of the present invention, the heating chamber and the semiconductor processing apparatus provided by the present invention will be described in detail below with reference to the accompanying drawings.
第1圖為本發明提供的加熱腔室的結構分解圖。請參閱第1圖，加熱腔室包括腔室元件1、加熱筒體5、環形光源元件、片盒2和片盒升降裝置3。其中，腔室元件1位於最外側且包括腔體，在該腔體的一側設置有傳片口（圖中未示出），用以供晶片通過。加熱筒體5套置於由腔室元件1所限定的中空空間內，且位於該傳片口的上方，該中空空間為真空環境。該加熱筒體5採用中空的筒狀結構，且由其限定的內部空間用作對晶片進行加熱的製程環境，且同樣為真空環境。環形光源元件可拆卸地安裝在加熱筒體5中。該環形光源元件包括筒狀熱源，該筒狀熱源環繞設置在加熱筒體5內側，用於自加熱筒體5的周圍向由加熱筒體5限定的內部空間輻射熱量。Figure 1 is an exploded view of the heating chamber provided by the present invention. Referring to Fig. 1, the heating chamber includes a chamber member 1, a heating cylinder 5, an annular light source member, a cassette 2, and a cassette lifting device 3. Wherein the chamber element 1 is located at the outermost side and includes a cavity, and a side of the cavity is provided with a film opening (not shown) for the wafer to pass through. The heating cylinder 5 is placed in a hollow space defined by the chamber element 1 and above the film opening, which is a vacuum environment. The heating cylinder 5 has a hollow cylindrical structure, and an internal space defined by it serves as a process environment for heating the wafer, and is also a vacuum environment. The annular light source element is detachably mounted in the heating cylinder 5. The annular light source element includes a cylindrical heat source disposed around the inside of the heating cylinder 5 for radiating heat from the periphery of the heating cylinder 5 to the internal space defined by the heating cylinder 5.
在本實施例中，片盒2用於承載多個晶片，其可以由天板、底板和多個立柱組成，其中，在立柱上沿加熱筒體5的軸向間隔設置有多個可承載晶片的槽口，用以使多個晶片沿加熱筒體5的軸向（垂直於晶片表面的方向）間隔設置。片盒升降裝置3連接片盒2，用於驅動片盒2在加熱腔室的軸向方向上作升降運動。例如，在片盒升降裝置3的驅動下，片盒2可以經由加熱筒體5的底端開口升入加熱筒體5的內部空間，此時環繞設置在加熱筒體5內側的筒狀熱源即可環繞在片盒2的周圍，從而可以朝向片盒2內的各個晶片輻射熱量。或者，在片盒升降裝置3的驅動下，片盒2可以自加熱筒體5的內部空間經由加熱筒體5的底端開口下降至與傳片口相對應的位置處，並且通過調節片盒2相對於傳片口的高度，可以使各個晶片逐一位於與傳片口相同高度的位置處，並由機械手經由傳片口移入腔室元件1的中空空間內，並取出位於與傳片口相同高度的位置處的晶片。In the present embodiment, the cassette 2 is used to carry a plurality of wafers, which may be composed of a top plate, a bottom plate and a plurality of uprights, wherein a plurality of loadable wafers are disposed on the column along the axial interval of the heating cylinder 5 The notch is for spacing the plurality of wafers along the axial direction of the heating cylinder 5 (the direction perpendicular to the wafer surface). The cassette lifting device 3 is connected to the cassette 2 for driving the cassette 2 to move up and down in the axial direction of the heating chamber. For example, under the driving of the cassette lifting device 3, the cassette 2 can be lifted into the inner space of the heating cylinder 5 via the bottom end opening of the heating cylinder 5, and at this time, a cylindrical heat source disposed inside the heating cylinder 5 is surrounded. It can be wrapped around the cassette 2 so that heat can be radiated toward the respective wafers in the cassette 2. Alternatively, under the driving of the cassette lifting device 3, the cassette 2 may be lowered from the inner space of the heating cylinder 5 via the bottom end opening of the heating cylinder 5 to a position corresponding to the transfer opening, and passed through the regulating cassette 2 With respect to the height of the film opening, each wafer can be placed one by one at the same height as the film opening, and moved by the robot into the hollow space of the chamber element 1 via the film opening, and taken out at the same height as the film opening. Wafer.
上述環形光源元件還包括電引入總成8和支撐總成。其中，電引入總成8用於將電流傳導至上述筒狀熱源；支撐總成用於固定筒狀熱源和電引入元件8。具體地，第2A圖為本發明實施例中支撐總成的結構分解圖。請一併參閱第1圖和第2A圖，支撐總成包括環形支撐元件6和安裝元件7，其中，筒狀熱源安裝在環形支撐元件6上。安裝元件7可拆卸地設置在環形支撐元件6的頂部，電引入總成8安裝在安裝元件7上，且通過環形支撐元件6與筒狀熱源間接電連接。The annular light source component described above also includes an electrical lead-in assembly 8 and a support assembly. Wherein, the electric lead-in assembly 8 is for conducting current to the above-mentioned cylindrical heat source; the support assembly is for fixing the cylindrical heat source and the electric lead-in member 8. Specifically, FIG. 2A is a structural exploded view of the support assembly in the embodiment of the present invention. Referring to Figures 1 and 2A together, the support assembly includes an annular support member 6 and a mounting member 7, wherein a cylindrical heat source is mounted on the annular support member 6. The mounting element 7 is detachably disposed on top of the annular support member 6, the electrical lead-in assembly 8 is mounted on the mounting member 7, and is indirectly electrically coupled to the cylindrical heat source by the annular support member 6.
從裝配關係上來看，由於電引入總成8安裝在與環形支撐元件6連接的安裝元件7上，這使得在需要對加熱燈管進行維護時，只需要將環形光源元件（包括環形支撐元件6、安裝元件7和電引入元件8）從加熱筒體5中整體拆下，即可直接進行維修、更換燈管等操作，而無需進行拆卸電引入總成8這一步驟，從而可以簡化加熱腔室的拆裝過程，從而可以更方便地對加熱腔室進行維護。From the standpoint of assembly, since the electrical lead-in assembly 8 is mounted on the mounting member 7 that is coupled to the annular support member 6, this necessitates only the annular light source member (including the annular support member 6) when maintenance of the heated lamp tube is required. The mounting member 7 and the electric lead-in member 8) are integrally removed from the heating cylinder 5, so that the maintenance, replacement of the lamp tube, and the like can be directly performed without the step of disassembling the electric introduction assembly 8, thereby simplifying the heating chamber. The disassembly process of the chamber makes it easier to maintain the heating chamber.
本實施例所採用的筒狀熱源包括兩組光源組和兩個功率控制器，其中，其中一組光源組由多個加熱燈管91組成，其中另一組光源組由多個加熱燈管92組成，且每組光源組中的多個加熱燈管沿環形支撐元件6的周向均勻分佈，並且，第2B圖為本發明實施例中加熱燈管的排布示意圖。請參閱第2B圖，其中一組光源組中的加熱燈管91與其中另一組光源組中的加熱燈管92之間交叉排列，且相互並聯。各個功率控制器用於一一對應地控制各個光源組的加熱功率。The cylindrical heat source used in this embodiment includes two sets of light sources and two power controllers, wherein one set of light sources is composed of a plurality of heat lamps 91, and the other group of light sources is composed of a plurality of heat lamps 92. The plurality of heating lamps in each group of the light source groups are evenly distributed along the circumferential direction of the annular support member 6, and FIG. 2B is a schematic view showing the arrangement of the heating lamps in the embodiment of the present invention. Referring to FIG. 2B, the heating lamps 91 in one set of light sources are arranged in cross-over with the heating tubes 92 in the other set of light sources, and are connected in parallel with each other. Each power controller is used to control the heating power of each of the light source groups in a one-to-one correspondence.
在實際進行加熱去氣製程時，如果加熱燈管的功率較大，那麼晶片溫度可以快速提高，但是最終穩定後的晶片溫度也會較高，而通常製程要求能夠在穩定後獲得較低的晶片溫度。如果加熱燈管的功率較小，雖然可以在穩定後獲得較低的晶片溫度，但是晶片溫度的升溫速率較低，從而導致製程效率較低。因此，在使晶片溫度快速提高的同時，能夠在穩定後獲得較低的晶片溫度是目前亟待解決的一個難題。為此，本實施例提供的加熱腔室通過使其中一組光源組中的加熱燈管91與其中另一組光源組中的加熱燈管92之間交叉排列，且相互並聯，可以實現對各個光源組的加熱功率進行獨立控制，從而可以通過分別調節各個光源組的加熱功率，來解決上述難題。例如，本實施例通過利用兩個功率控制器分別獨立地控制各個光源組的加熱功率，可以實現對加熱燈管的加熱功率進行分區控制，進一步說，在晶片升溫過程中，使兩組光源組中的加熱燈管91和92同時工作，以使晶片溫度可以快速提高；當晶片升溫過程結束，開始進行恆溫過程時，關閉其中一組光源組，而僅保留其中一組光源組工作，並調低工作的光源組的加熱功率，最終可以在恆溫過程中獲得較低的晶片溫度。較佳的，兩組光源組可以分別使用加熱功率不同的兩種加熱燈管，一組光源組的加熱燈管具有較低的加熱功率，另一組光源組的加熱燈管具有較高的加熱功率，這樣在開始進行恆溫過程時，僅需關閉加熱功率較高的加熱燈管即可，而無需再進行調節加熱功率的操作。In the actual heating and degassing process, if the power of the heating lamp is large, the temperature of the wafer can be rapidly increased, but the temperature of the wafer after the final stabilization is also high, and the process requirement can obtain a lower wafer after stabilization. temperature. If the power of the heating lamp is small, although a lower wafer temperature can be obtained after stabilization, the heating rate of the wafer temperature is lower, resulting in lower process efficiency. Therefore, while the wafer temperature is rapidly increased, it is a difficult problem to be solved to obtain a lower wafer temperature after stabilization. To this end, the heating chamber provided in this embodiment can realize each of the heating lamps 91 in one of the light source groups and the heating lamps 92 in the other group of the light source groups, and are connected in parallel with each other. The heating power of the light source group is independently controlled, so that the above problem can be solved by separately adjusting the heating power of each light source group. For example, in this embodiment, by separately controlling the heating power of each light source group by using two power controllers, the heating power of the heating lamps can be controlled by partitioning. Further, during the heating process of the wafers, the two groups of light sources are enabled. The heating lamps 91 and 92 are operated simultaneously so that the temperature of the wafer can be rapidly increased; when the temperature rising process of the wafer ends and the constant temperature process is started, one of the light source groups is turned off, and only one of the light source groups is kept and adjusted. The heating power of the low working light source group can ultimately achieve a lower wafer temperature during the constant temperature process. Preferably, the two sets of light source groups can respectively use two kinds of heating lamps with different heating powers, the heating lamps of one group of the light source group have lower heating power, and the heating tubes of the other group of the light source group have higher heating. Power, so that when the constant temperature process is started, it is only necessary to turn off the heating lamp with higher heating power, and there is no need to adjust the heating power.
為了實現其中一組光源組中的加熱燈管91與其中另一組光源組中的加熱燈管92之間相互並聯，還需要對本實施例中的支撐總成和電引入總成的結構進行適應性的改進。具體地，請一併參閱第2A圖和第3A圖至第3G圖，環形支撐元件6包括第一導電環68、第二導電環67和內導電環62，其中，第一導電環68和第二導電環67在加熱筒體5的軸向上相對設置，且第一導電環68位於第二導電環67的上方；內導電環62設置在第一導電環68的內側，且內導電環62和第一導電環68電絕緣；每個加熱燈管（91或92）位於第一導電環68和第二導電環67之間，其中一組光源組中的各個加熱燈管91（或92）的正極/負極分別與第一導電環68/第二導電環67電連接；其中另一組光源組中的各個加熱燈管92（或91）的正極/負極分別與內導電環62/第二導電環67電連接。換言之，不同光源組中的加熱燈管的上端電極連接不同的導電環（第一導電環68或內導電環62），而下端電極則共用同一導電環（第二導電環67），從而實現不同光源組中的加熱燈管之間相互並聯。另外，由於內導電環62和第一導電環68相互間隔，因此二者不相導通。In order to realize the parallel connection between the heating lamp tubes 91 in one group of the light source group and the heating lamp tubes 92 in the other group of the light source groups, it is also necessary to adapt the structure of the support assembly and the electric lead-in assembly in the embodiment. Sexual improvement. Specifically, please refer to FIG. 2A and FIGS. 3A to 3G together, the annular support member 6 includes a first conductive ring 68, a second conductive ring 67 and an inner conductive ring 62, wherein the first conductive ring 68 and the first The two conductive rings 67 are oppositely disposed in the axial direction of the heating cylinder 5, and the first conductive ring 68 is located above the second conductive ring 67; the inner conductive ring 62 is disposed inside the first conductive ring 68, and the inner conductive ring 62 and The first conductive ring 68 is electrically insulated; each of the heating lamps (91 or 92) is located between the first conductive ring 68 and the second conductive ring 67, wherein each of the heat source tubes 91 (or 92) of the group of light sources The positive electrode/negative electrode are electrically connected to the first conductive ring 68 / the second conductive ring 67 respectively; wherein the positive/negative electrodes of the respective heating lamps 92 (or 91) in the other group of the light source group are respectively connected to the inner conductive ring 62 / the second conductive Ring 67 is electrically connected. In other words, the upper end electrodes of the heating lamps in the different light source groups are connected to different conductive rings (the first conductive ring 68 or the inner conductive ring 62), and the lower end electrodes share the same conductive ring (the second conductive ring 67), thereby achieving different The heating lamps in the light source group are connected in parallel with each other. In addition, since the inner conductive ring 62 and the first conductive ring 68 are spaced apart from each other, the two are not electrically connected.
電引入總成8包括兩個第一電引入元件81、第二電引入元件83和內電引入元件82，其中，第一電引入元件81與第一導電環68電連接。第二電引入元件83與第二導電環67電連接；內引入元件82與內導電環62電連接，如第2A圖所示。使用兩個第一電引入元件81的原因在於：為了保證第一導電環68與內導電環62能夠在安全絕緣的前提下，同時盡可能地佔用較少的空間，較佳將第一導電環68對應地分割為兩個導電半環，且兩個導電半環相互間隔，但是，由於位於第一導電環68的內側的內導電環62在兩個導電半環附近佔據了一定的空間，導致兩個導電半環很難在間隔處直接連接，為此，通過使用兩個第一電引入元件81分別與這兩個導電半環電連接，來實現兩個導電半環的電引入。The electrical lead-in assembly 8 includes two first electrical lead-in elements 81, a second electrical lead-in element 83, and an inner electrical lead-in element 82, wherein the first electrical lead-in element 81 is electrically coupled to the first conductive ring 68. The second electrical lead-in element 83 is electrically coupled to the second conductive ring 67; the inner lead-in element 82 is electrically coupled to the inner conductive ring 62 as shown in FIG. 2A. The reason for using the two first electrical lead-in elements 81 is that the first conductive ring is preferably used in order to ensure that the first conductive ring 68 and the inner conductive ring 62 can be used as safely as possible while occupying as little space as possible. 68 is correspondingly divided into two conductive half rings, and the two conductive half rings are spaced apart from each other, but since the inner conductive ring 62 located inside the first conductive ring 68 occupies a certain space near the two conductive half rings, The two conductive half-rings are difficult to connect directly at the spacing, for which purpose the electrical introduction of the two conductive half-rings is achieved by electrically connecting the two electrically conductive half-rings respectively using two first electrical lead-in elements 81.
在本實施例中，內電引入元件82與內導電環62電連接的方式具體為：環形支撐元件6還包括導電短杆61和內導電轉接元件，其中，導電短杆61和內電引入元件82在加熱筒體5的軸向（即豎直方向）上對應設置，且導電短杆61位於內電引入元件82的下方，並且導電短杆61的上端與內電引入元件82的下端電接觸，導電短杆61的下端通過內導電轉接元件與內導電環62電連接，如第3B圖所示。進一步說，內導電轉接元件包括第一螺釘642、導電轉接件641和第二螺釘643，其中，導電轉接件641的一端與導電短杆61通過第一螺釘642電接觸；導電轉接件641的另一端與內導電環62通過第二螺釘643電連接。借助上述內導電轉接元件，可以將在豎直方向上不在同一條直線上的導電短杆61與內導電環62（其相對於導電短杆61向內偏移）電連接。當然，在實際應用中，內導電轉接元件還可以採用其他任意結構，只要其能夠實現導電短杆61與內導電環62的電連接即可。In this embodiment, the internal electrical lead-in element 82 is electrically connected to the inner conductive ring 62. The annular support member 6 further includes a conductive short rod 61 and an inner conductive switching element, wherein the conductive short rod 61 and the internal electric lead are introduced. The element 82 is correspondingly disposed in the axial direction (i.e., the vertical direction) of the heating cylinder 5, and the conductive short rod 61 is located below the inner electric lead-in member 82, and the upper end of the conductive short rod 61 is electrically connected to the lower end of the inner electric lead-in member 82. In contact, the lower end of the conductive stub 61 is electrically connected to the inner conductive ring 62 through the inner conductive switching element as shown in FIG. 3B. Further, the inner conductive switching element includes a first screw 642, a conductive adapter 641 and a second screw 643, wherein one end of the conductive adapter 641 is electrically contacted with the conductive short rod 61 through the first screw 642; The other end of the member 641 is electrically connected to the inner conductive ring 62 by a second screw 643. With the inner conductive switching element described above, the conductive short rod 61 which is not in the same straight line in the vertical direction can be electrically connected to the inner conductive ring 62 which is offset inward with respect to the conductive short rod 61. Of course, in practical applications, the inner conductive switching element can also adopt any other structure as long as it can realize the electrical connection between the conductive short rod 61 and the inner conductive ring 62.
另外，當將上蓋元件7安裝在環形支撐元件6上時，內電引入元件82通過與導電短杆61對接而實現電接觸，該連接方式實際上是可拆卸的，以在需要時可將上蓋元件7自環形支撐元件6上拆卸下來。較佳的，內電引入元件82與導電短杆61電接觸的方式具體為：環形支撐元件6還包括內電引入背板631和內電引入壓板632，二者分別位於導電短杆61和內電引入元件82的內側和外側，用以通過螺釘夾緊導電短杆61和內電引入元件82，且使二者電導通。當然，在實際應用中，還可以採用其他方式實現內電引入元件82與導電短杆61的電連接，且二者是可拆卸的，例如插接等。In addition, when the upper cover member 7 is mounted on the annular support member 6, the internal electric lead-in member 82 is electrically contacted by abutting against the conductive short rod 61, which is actually detachable to allow the upper cover to be provided when needed The element 7 is detached from the annular support element 6. Preferably, the internal electric lead-in member 82 is in electrical contact with the conductive short rod 61. The annular support member 6 further includes an inner electric introduction back plate 631 and an inner electric introduction pressure plate 632, which are respectively located in the conductive short rod 61 and The inner side and the outer side of the electric lead-in member 82 are used to clamp the conductive short rod 61 and the inner electric lead-in member 82 by screws and electrically conduct them. Of course, in practical applications, the electrical connection between the internal electric lead-in element 82 and the conductive short rod 61 can also be implemented in other ways, and the two are detachable, such as plugging or the like.
較佳的，在導電短杆61上還套設有第一絕緣管85，用以將導電短杆61與第一導電環68電絕緣。Preferably, a first insulating tube 85 is further disposed on the conductive short rod 61 for electrically insulating the conductive short rod 61 from the first conductive ring 68.
較佳的，在內導電環62和與之連接的電源組中的各個加熱燈管的連接處還設置有隔離元件，用以將該連接處與第一導電環68相互隔離。隔離元件的具體結構如第3G圖所示，其包括採用絕緣材料製作的隔離件21，隔離件21位於第一導電環68與內導電環62和各個加熱燈管的連接處之間，以避免串路。另外，在本實施例中，內導電環62通過一導電連接件22實現與各個加熱燈管電連接。Preferably, an isolation element is disposed at the junction of the inner conductive ring 62 and each of the heating lamps in the power supply group connected thereto to isolate the connection from the first conductive ring 68. The specific structure of the spacer element is as shown in FIG. 3G, which includes a spacer 21 made of an insulating material, and the spacer 21 is located between the first conductive ring 68 and the inner conductive ring 62 and the respective heating lamps to avoid Stringing. In addition, in the present embodiment, the inner conductive ring 62 is electrically connected to each of the heating lamps through a conductive connecting member 22.
在本實施例中，第二電引入元件83與第二導電環67電連接的方式具體為：如第3C圖至第3D圖所示，環形支撐元件6還包括導電長杆66，導電長杆66與第二電引入元件83在加熱筒體5的軸向上對應設置，且導電長杆66位於第二電引入元件83的下方，並且導電長杆66的上端與第二電引入元件83電接觸，導電長杆66的下端與第二導電環67電連接。而且，環形支撐元件6還包括第一電引入背板和第一電引入壓板，二者即分別為內電引入背板631和內電引入壓板632，也就是說，內電引入背板631和內電引入壓板632均為完整的圓環，用以在夾緊導電短杆61和內電引入元件82的同時，還用於夾緊導電長杆66和第二電引入元件83。當然，在實際應用中，內電引入背板631和內電引入壓板632還可以為不完整的圓弧，僅用於夾緊導電短杆61和內電引入元件82，在這種情況下，第一電引入背板和第一電引入壓板為另設的兩個部件，二者分別位於導電長杆66和第二電引入元件83的內側和外側，僅用於通過螺釘夾緊導電長杆66和第二電引入元件83，且使二者電導通。當然，在實際應用中，導電長杆66與第二電引入元件83還可以採用其他方式實現電連接，且二者是可拆卸的，例如插接等。In this embodiment, the second electrical lead-in element 83 is electrically connected to the second conductive ring 67. Specifically, as shown in FIGS. 3C to 3D, the annular support member 6 further includes a conductive long rod 66 and a conductive long rod. 66 is disposed corresponding to the second electric lead-in member 83 in the axial direction of the heating cylinder 5, and the conductive long rod 66 is located below the second electric lead-in member 83, and the upper end of the conductive long rod 66 is in electrical contact with the second electric lead-in member 83. The lower end of the conductive long rod 66 is electrically connected to the second conductive ring 67. Moreover, the annular support member 6 further includes a first electrical lead-in backplane and a first electrical lead-in pressure plate, which are respectively an internal power introduction backplane 631 and an internal electrical introduction pressure plate 632, that is, the internal power is introduced into the backplane 631 and The internal power introduction platen 632 is a complete ring for clamping the conductive long rod 66 and the second electric lead-in member 83 while clamping the conductive short rod 61 and the internal electric lead-in member 82. Of course, in practical applications, the internal power introduction backplane 631 and the internal electrical introduction pressure plate 632 may also be incomplete arcs, only for clamping the conductive short rod 61 and the internal electric lead-in element 82, in this case, The first electrical introduction backplane and the first electrical introduction pressure plate are two separate components, which are respectively located on the inner side and the outer side of the conductive long rod 66 and the second electric lead-in element 83, and are only used for clamping the conductive long rod by screws. 66 and the second electrical lead-in element 83 are electrically conducted. Of course, in practical applications, the conductive long rod 66 and the second electric lead-in element 83 can also be electrically connected in other ways, and the two are detachable, such as plugging or the like.
此外，環形支撐元件6還包括轉接壓板634和轉接背板633，其中，轉接背板633設置在第二導電環67的上方，且位於導電長杆66的內側；轉接壓板634位於導電長杆66的外側，且轉接壓板634與轉接背板633利用螺釘夾緊導電長杆66；並且，轉接壓板634用於將第二導電環67和導電長杆66電導通，從而實現與第二電引入元件83的電導通，具體地，轉接壓板634的上端與導電長杆66電連接，轉接壓板634的下端豎直向下延伸，並與第二導電環67電連接。In addition, the annular support member 6 further includes a transfer platen 634 and an adapter back plate 633, wherein the transfer back plate 633 is disposed above the second conductive ring 67 and on the inner side of the conductive long rod 66; the transfer pressure plate 634 is located The outer side of the conductive long rod 66, and the transfer pressure plate 634 and the transfer back plate 633 clamp the conductive long rod 66 with a screw; and the transfer pressure plate 634 is used to electrically conduct the second conductive ring 67 and the conductive long rod 66, thereby The electrical connection with the second electrical lead-in element 83 is achieved. Specifically, the upper end of the transfer pressure plate 634 is electrically connected to the conductive long rod 66. The lower end of the transfer pressure plate 634 extends vertically downward and is electrically connected to the second conductive ring 67. .
較佳的，在導電長杆66上還套設有第二絕緣管87，用以將導電長杆66與第一導電環68之間電絕緣。Preferably, a second insulating tube 87 is further disposed on the conductive long rod 66 for electrically isolating the conductive long rod 66 from the first conductive ring 68.
在本實施例中，第一電引入元件81與第一導電環68電連接的方式具體為：如第3E圖至第3F圖所示，環形支撐元件6還包括第二電引入壓板636和第二導電背板635，其中，第二導電背板635設置在第一導電環68的上方，且位於第一電引入元件81的內側；第二電引入壓板636位於第一電引入元件81的外側，且與第二導電背板635利用螺釘夾緊第一電引入元件81；並且，第二電引入壓板636用於將第一導電環68和第一電引入元件81電導通，具體地，第二電引入壓板636的上端與第一電引入元件81電連接，第二電引入壓板636的下端豎直向下延伸，並與第一導電環68電連接。In this embodiment, the first electrical lead-in element 81 is electrically connected to the first conductive ring 68. Specifically, as shown in FIGS. 3E to 3F, the annular support member 6 further includes a second electrical lead-in platen 636 and a first a second conductive backing plate 635, wherein the second conductive backing plate 635 is disposed above the first conductive ring 68 and located inside the first electrical lead-in element 81; the second electrical lead-in pressing plate 636 is located outside the first electrical lead-in element 81 And clamping the first electrical lead-in element 81 with the second conductive backing plate 635; and the second electrical lead-in pressure plate 636 is used to electrically conduct the first conductive ring 68 and the first electrical lead-in element 81, in particular, The upper end of the second electric induction pressure plate 636 is electrically connected to the first electric lead-in member 81, and the lower end of the second electric induction pressure plate 636 extends vertically downward and is electrically connected to the first conductive ring 68.
較佳的，在第一電引入元件81上套設有第三絕緣管88，用以將第一電引入元件81與安裝元件7之間電絕緣。Preferably, a third insulating tube 88 is sleeved on the first electrical lead-in element 81 for electrically isolating the first electrical lead-in element 81 from the mounting element 7.
較佳的，在第二電引入元件83上套設有第四絕緣管86，用以將第二電引入元件83與安裝元件7之間電絕緣。Preferably, a fourth insulating tube 86 is sleeved over the second electrical lead-in element 83 for electrically isolating the second electrical lead-in element 83 from the mounting element 7.
在本實施例中，環形支撐元件6還包括第一內環653、第二內環657和內環連接件，三者均採用絕緣材料（例如陶瓷）製作，其中，第一內環653環繞設置在第一導電環68及內導電環62之間，用以支撐第一導電環68及內導電環；第二內環657環繞設置在第二導電環67的內側，用以支撐第二導電環67。內環連接件的數量為多個，且沿加熱筒體5的周向間隔設置；每個內環連接件分別與第一內環653和第二內環657連接，且對二者進行支撐。In this embodiment, the annular support member 6 further includes a first inner ring 653, a second inner ring 657 and an inner ring connecting member, all of which are made of an insulating material (for example, ceramic), wherein the first inner ring 653 is disposed around. Between the first conductive ring 68 and the inner conductive ring 62 for supporting the first conductive ring 68 and the inner conductive ring; the second inner ring 657 is disposed around the inner side of the second conductive ring 67 for supporting the second conductive ring 67. The number of inner ring connectors is plural and arranged along the circumferential direction of the heating cylinder 5; each inner ring connector is connected to the first inner ring 653 and the second inner ring 657, respectively, and supports both.
較佳的，環形支撐元件6還包括第一絕緣背板655、第一絕緣壓板656、第二絕緣背板651和第二絕緣壓板652，其中，第二絕緣背板651分別位於第二導電背板635和內電引入背板631的內側；第二絕緣壓板652罩設在第二電引入壓板636和內電引入壓板632的外部，第二絕緣壓板652 和第二絕緣背板651用於將內電引入壓板632、第二電引入壓板636、第二導電背板635、內電引入背板631以及相應的其他部件包覆在其中，從而實現了這些部件與外界的絕緣隔離。與之相類似的，第一絕緣背板655位於轉接背板633的內側；第一絕緣壓板656罩設在轉接壓板634的外部，第一絕緣背板655和第一絕緣壓板656用於將轉接壓板634和轉接背板633以及相應的其他部件包覆在其中，從而實現了這些部件與外界的絕緣隔離。Preferably, the annular support member 6 further includes a first insulating back plate 655, a first insulating pressing plate 656, a second insulating back plate 651, and a second insulating pressing plate 652, wherein the second insulating back plate 651 is respectively located on the second conductive back The plate 635 and the inner electricity are introduced to the inner side of the back plate 631; the second insulating platen 652 is disposed outside the second electric lead-in platen 636 and the inner electric lead-in platen 632, and the second insulating platen 652 and the second insulating back plate 651 are used for The internal power introducing platen 632, the second electric lead-in platen 636, the second conductive backing plate 635, the internal electric lead-in backing plate 631, and the corresponding other components are coated therein, thereby achieving insulation isolation of these components from the outside. Similarly, the first insulating back plate 655 is located inside the transfer back plate 633; the first insulating pressing plate 656 is disposed outside the transfer pressing plate 634, and the first insulating back plate 655 and the first insulating pressing plate 656 are used. The transfer platen 634 and the transfer back plate 633 and corresponding other components are coated therein to achieve insulation isolation of these components from the outside.
在本實施例中，環形支撐元件6還包括第一外環654、第二外環658和外環連接件，三者均採用絕緣材料製作，其中，第一外環654罩設在第一導電環68的外部，且將第一導電環68及相應的其它部件均包覆在第一外環654與第一內環653之間，從而實現了第一外環654與第一內環653之間的所有部件與外界的絕緣隔離。第二外環658罩設在第二導電環67的外部，且將第二導電環67及相應的其它部件均包覆在第二外環658與第二內環657之間，從而實現了第二外環658與第二內環657之間的所有部件與外界的絕緣隔離。外環連接件233的數量為至少兩個，且沿加熱筒體5的周向間隔設置，每個外環連接件233分別與第一外環654和第二外環658連接，且對二者進行支撐。In this embodiment, the annular support member 6 further includes a first outer ring 654, a second outer ring 658, and an outer ring connecting member, all of which are made of an insulating material, wherein the first outer ring 654 is covered by the first conductive The first outer conductive ring 68 and the corresponding other components are wrapped between the first outer ring 654 and the first inner ring 653, thereby realizing the first outer ring 654 and the first inner ring 653. All components are isolated from the outside world. The second outer ring 658 is disposed outside the second conductive ring 67, and the second conductive ring 67 and corresponding other components are wrapped between the second outer ring 658 and the second inner ring 657, thereby achieving the All components between the second outer ring 658 and the second inner ring 657 are isolated from the outside. The number of outer ring connectors 233 is at least two, and is spaced along the circumferential direction of the heating cylinder 5, and each outer ring connector 233 is connected to the first outer ring 654 and the second outer ring 658, respectively, and Support.
較佳的，為了便於拆裝，如第3G圖所示，第一外環654由兩個第一分環231和兩個第一分環234組成一個閉合的整環；第二外環658由兩個第二分環232和兩個第二分環235組成一個閉合的整環。並且，各個第一分環231（或232）與各個第二分環234（或235）一一對應，每個第一分環231（或232）和與之對應的第二分環234（或235）利用一個外環連接件233連接，且對二者進行支撐。Preferably, for ease of disassembly, as shown in FIG. 3G, the first outer ring 654 is composed of two first partial rings 231 and two first partial rings 234 forming a closed full ring; the second outer ring 658 is composed of The two second partial rings 232 and the two second partial rings 235 form a closed full ring. Moreover, each of the first partial rings 231 (or 232) is in one-to-one correspondence with each of the second partial rings 234 (or 235), and each of the first partial rings 231 (or 232) and the corresponding second partial ring 234 (or 235) is connected by an outer ring connector 233 and supports both.
在本實施例中，如第3G圖所示，每個加熱燈管9為條狀燈管，該條狀燈管9的長度方向與加熱筒體5的軸向相互平行，且多個條狀燈管9沿加熱筒體5的周向間隔排布，以在加熱筒體5的內側環繞形成筒狀熱源，這很容易保證各晶片間以及晶片各區域之間的溫度均勻性。當然，由於晶片所獲得的熱量需要自其邊緣逐漸向中心傳遞，因而只要有足夠時間完成片內的熱量傳遞，就可以保證晶片各區域之間的溫度均勻性。In the present embodiment, as shown in FIG. 3G, each of the heating lamps 9 is a strip-shaped tube, and the longitudinal direction of the strip-shaped tube 9 is parallel to the axial direction of the heating cylinder 5, and a plurality of strips are formed. The lamps 9 are arranged in the circumferential direction of the heating cylinder 5 to form a cylindrical heat source around the inside of the heating cylinder 5, which easily ensures temperature uniformity between the wafers and between the respective regions of the wafer. Of course, since the heat obtained by the wafer needs to be gradually transferred from the edge to the center, temperature uniformity between the regions of the wafer can be ensured as long as there is sufficient time to complete the heat transfer in the wafer.
在本實施例中，如第2A圖所示，安裝元件7包括安裝本體71，且在該安裝本體71中設置有冷卻通道，通過向該冷卻通道中通入冷卻水，來冷卻加熱筒體5和安裝本體71，由於二者可***作人員直接接觸，因而通過冷卻加熱筒體5和安裝本體71，可以避免操作人員因接觸到高溫的加熱筒體5和安裝本體71而被燙傷，同時可以保證安裝於加熱筒體5和安裝本體71上的諸如密封圈、電氣零件以及線纜等的零部件可正常工作。具體來說，在安裝本體71的上表面設置有冷卻凹道，且在該冷卻凹道上設置有冷卻蓋板72，冷卻凹道與冷卻蓋板72形成上述冷卻通道；並且，在冷卻蓋板72上分別設置有與冷卻通道相連通的進水接頭73和出水接頭74。借助冷卻通道、進水接頭73和出水接頭74，可以實現迴圈冷卻的效果。In the present embodiment, as shown in FIG. 2A, the mounting member 7 includes a mounting body 71, and a cooling passage is provided in the mounting body 71, and the heating cylinder 5 is cooled by passing cooling water into the cooling passage. And the mounting body 71, since the two can be directly contacted by the operator, by cooling the heating cylinder 5 and the mounting body 71, it is possible to prevent the operator from being burnt due to contact with the high temperature heating cylinder 5 and the mounting body 71, and at the same time It is ensured that components such as seals, electrical parts, and cables mounted on the heating cylinder 5 and the mounting body 71 can function normally. Specifically, a cooling recess is provided on the upper surface of the mounting body 71, and a cooling cover 72 is disposed on the cooling recess, the cooling recess and the cooling cover 72 form the cooling passage; and, in the cooling cover 72 The water inlet joint 73 and the water outlet joint 74 which are in communication with the cooling passage are respectively provided. The effect of the circulation cooling can be achieved by means of the cooling passage, the water inlet joint 73 and the water outlet joint 74.
需要說明的是，在本實施例中，安裝元件7設置在環形支撐元件6的頂部，但是本發明並不侷限於此，在實際應用中，安裝元件還可以設置在環形支撐元件的底部，在這種情況下，安裝在安裝元件上的電引入總成同樣可以通過環形支撐元件與筒狀熱源間接電連接。與此同時，環形支撐元件的結構應相當於上述實施例中倒置的環形支撐元件6的結構，以實現電引入總成與筒狀熱源的電連接，具體例如，第一導電環應位於第二導電環的下方；內導電環同樣設置在第一導電環的內側；導電短杆位於內電引入元件的上方；導電長杆位於第二電引入元件的上方。It should be noted that, in this embodiment, the mounting member 7 is disposed on the top of the annular supporting member 6, but the present invention is not limited thereto. In practical applications, the mounting member may also be disposed at the bottom of the annular supporting member. In this case, the electrical lead-in assembly mounted on the mounting element can also be indirectly electrically connected to the cylindrical heat source by the annular support element. At the same time, the structure of the annular support member should correspond to the structure of the inverted annular support member 6 in the above embodiment to achieve electrical connection between the electrical lead-in assembly and the cylindrical heat source. Specifically, for example, the first conductive ring should be located at the second Below the conductive ring; the inner conductive ring is also disposed on the inner side of the first conductive ring; the conductive short rod is located above the inner electrical lead-in element; and the conductive long rod is located above the second electrical lead-in element.
另外，加熱筒體的結構也應相當於上述實施例中倒置的加熱筒體5的結構，並且該加熱筒體位於傳片口的下方，且加熱筒體的可供片盒通過的開口朝上，即為頂端開口。在這種情況下，在片盒升降裝置的驅動下，片盒可以經由加熱筒體的頂端開口下降至加熱筒體的內部空間；或者，在片盒升降裝置的驅動下，片盒可以自加熱筒體的內部空間經由加熱筒體的頂端開口上升至與傳片口相對應的位置處，並且通過調節片盒相對於傳片口的高度，可以使各個晶片逐一位於與傳片口相同高度的位置處，並由機械手經由傳片口移入腔室元件的中空空間內，並取出位於與傳片口相同高度的位置處的晶片。In addition, the structure of the heating cylinder should also correspond to the structure of the inverted heating cylinder 5 in the above embodiment, and the heating cylinder is located below the film opening, and the opening of the heating cylinder for the cassette to pass upwards, It is the top opening. In this case, under the driving of the cassette lifting device, the cassette can be lowered to the inner space of the heating cylinder via the top opening of the heating cylinder; or, under the driving of the cassette lifting device, the cassette can be self-heating The inner space of the cylinder rises to a position corresponding to the film opening through the top opening of the heating cylinder, and by adjusting the height of the film cassette relative to the film opening, each wafer can be located one by one at the same height as the film opening, And the robot moves into the hollow space of the chamber element via the transfer port, and takes out the wafer at the same height as the transfer port.
還需要說明的是，在本實施例中，加熱燈管為條狀燈管，但是本發明並不侷限於此，在實際應用中，加熱燈管也可以為諸如螺旋狀燈管、環形燈管等的其他任意形狀，並且根據不同形狀的加熱燈管，對加熱燈管的排布方式以及電性連接方式進行適應性設計，以保證各晶片間以及晶片內各區域的溫度均勻性。容易理解，支撐元件和電引入元件的結構均是配合加熱燈管而設計的，因此，支撐元件和電引入元件並不侷限於本實施例提供的上述結構，應根據加熱燈管的排布方式以及電性連接方式的變化作適應性設計。It should be noted that, in this embodiment, the heating tube is a strip tube, but the invention is not limited thereto. In practical applications, the heating tube may also be a spiral tube or a ring tube. Other arbitrary shapes, and according to different shapes of the heating lamp tube, the arrangement of the heating lamp tube and the electrical connection manner are adaptively designed to ensure temperature uniformity between the wafers and the regions in the wafer. It is easy to understand that the structure of the supporting element and the electric lead-in element are designed to match the heating lamp tube. Therefore, the supporting element and the electric lead-in element are not limited to the above-mentioned structure provided by the embodiment, and should be arranged according to the arrangement of the heating lamp tube. And the change of the electrical connection method is adaptive design.
進一步需要說明的是，在實際應用中，片盒多個立柱的排布在保證穩定支撐晶片的基礎上，還應使得在相鄰兩個立柱之間形成的可供晶片通過的開口與傳片口相對，以保證晶片能夠依次移出該開口和傳片口。除此之外，多個立柱的排布還需要考慮加熱燈管的佈局，以避免遮擋加熱燈管輻射出的光線。It should be further noted that, in practical applications, the arrangement of the plurality of pillars of the cassette is on the basis of ensuring stable support of the wafer, and the opening and the passage opening for the passage of the wafer formed between the adjacent two pillars are also required. In contrast, to ensure that the wafer can be removed from the opening and the transfer opening in sequence. In addition, the arrangement of the plurality of columns also needs to consider the layout of the heating lamps to avoid obscuring the light radiated from the heating tubes.
進一步需要說明的是，在本實施例中，筒狀熱源包括兩組光源組，但是本發明並不侷限於此，在實際應用中，光源組的數量還可以為三組、四組或者五組以上，每組光源組由多個加熱燈管組成，且多個加熱燈管沿加熱筒體的周向均勻分佈，並且各組光源組中的加熱燈管之間交叉排列，且相互並聯；功率控制器的數量與光源組的數量相對應，且各個功率控制器用於一一對應地控制各個光源組的加熱功率。It should be further noted that, in this embodiment, the tubular heat source includes two sets of light sources, but the present invention is not limited thereto. In practical applications, the number of the light source groups may also be three groups, four groups, or five groups. In the above, each group of the light source group is composed of a plurality of heating lamps, and the plurality of heating lamps are uniformly distributed along the circumferential direction of the heating cylinder, and the heating lamps in each group of the light source are arranged in a crosswise manner and are connected in parallel; The number of controllers corresponds to the number of light source groups, and each power controller is used to control the heating power of each light source group in a one-to-one correspondence.
綜上所述，本發明上述實施例提供的加熱腔室，其通過將電引入總成安裝在與環形支撐元件連接的安裝元件上，並通過該環形支撐元件將電引入總成與筒狀熱源電連接，可以在對加熱燈管進行維護時，只需要將環形光源元件從加熱筒體中整體拆下，即可直接進行維修、更換燈管等操作，而無需進行拆卸電引入總成這一步驟，也就是說，電引入總成與筒狀熱源之間可以始終保持連接，從而可以簡化加熱腔室的拆裝過程，從而可以更方便地對加熱腔室進行維護。In summary, the above embodiment of the present invention provides a heating chamber that mounts an electrical lead-in assembly on a mounting member that is coupled to an annular support member and that electrically introduces electricity into the assembly and the cylindrical heat source through the annular support member. The electrical connection can be used for the maintenance of the heating lamp tube, and only the annular light source component is completely removed from the heating cylinder body, and the operation of directly repairing and replacing the lamp tube can be performed without removing the electric induction assembly. The step, that is to say, the connection between the electric lead-in assembly and the cylindrical heat source can be kept at all times, so that the disassembly process of the heating chamber can be simplified, so that the heating chamber can be more conveniently maintained.
作為另一個技術方案，本發明還提供一種半導體加工裝置，其包括加熱腔室，該加熱腔室採用了本發明實施例提供的上述加熱腔室。As another technical solution, the present invention also provides a semiconductor processing apparatus including a heating chamber using the above-described heating chamber provided by the embodiment of the present invention.
本發明實施例提供的半導體加工裝置，其通過採用本發明上述各個實施例提供的上述加熱腔室，可以簡化筒狀熱源的拆裝過程，從而可以更方便地對加熱腔室進行維護。The semiconductor processing apparatus provided by the embodiment of the present invention can simplify the disassembly and assembly process of the cylindrical heat source by using the above-mentioned heating chamber provided by the above various embodiments of the present invention, so that the heating chamber can be more conveniently maintained.
可以理解的是，以上實施方式僅僅是為了說明本發明的原理而採用的示例性實施方式，然而本發明並不侷限於此。對於本領域內的普通技術人員而言，在不脫離本發明的精神和實質的情況下，可以做出各種變型和改進，這些變型和改進也視為本發明的保護範圍。It is to be understood that the above embodiments are merely exemplary embodiments employed to explain the principles of the invention, but the invention is not limited thereto. Various modifications and improvements can be made by those skilled in the art without departing from the spirit and scope of the invention. These modifications and improvements are also considered to be within the scope of the invention.
1‧‧‧腔室元件
2‧‧‧片盒
3‧‧‧片盒升降裝置
5‧‧‧加熱筒體
6‧‧‧環形支撐元件
7‧‧‧安裝元件
8‧‧‧電引入總成
9、91、92‧‧‧加熱燈管
21‧‧‧隔離件
22‧‧‧導電連接件
61‧‧‧導電短杆
62‧‧‧內導電環
66‧‧‧導電長杆
67、68‧‧‧導電環
71‧‧‧安裝本體
72‧‧‧冷卻蓋板
73‧‧‧進水接頭
74‧‧‧出水接頭
81、83‧‧‧電引入元件
82‧‧‧內電引入元件
85、86、87、88‧‧‧絕緣管
231、232、234、235‧‧‧分環
233‧‧‧外環連接件
631‧‧‧內電引入背板
632‧‧‧內電引入壓板
633‧‧‧轉接背板
634‧‧‧轉接壓板
635‧‧‧導電背板
636‧‧‧電引入壓板
641‧‧‧導電轉接件
642、643‧‧‧螺釘
651、655‧‧‧絕緣背板
652、656‧‧‧絕緣壓板
653、657‧‧‧內環
654、658‧‧‧外環
I、II、III、IV‧‧‧區域1‧‧‧ chamber components
2‧‧‧Packs
3‧‧‧Cartridge lifting device
5‧‧‧heating cylinder
6‧‧‧Ring support elements
7‧‧‧Installation components
8‧‧‧Electric introduction assembly
9, 91, 92‧ ‧ heating lamps
21‧‧‧Parts
22‧‧‧Electrical connectors
61‧‧‧Electrical short rod
62‧‧‧Inner conductive ring
66‧‧‧Electrical long rod
67,68‧‧‧ Conductive ring
71‧‧‧Installing the body
72‧‧‧Cooling cover
73‧‧‧ water inlet joint
74‧‧‧Water connection
81, 83‧‧‧Electrical introduction components
82‧‧‧Internal power introduction components
85, 86, 87, 88‧‧‧ insulating tubes
231, 232, 234, 235 ‧ ‧ ring
233‧‧‧Outer ring connectors
631‧‧‧Introduction of backplane
632‧‧‧Introduction of pressure plate
633‧‧‧Transfer backplane
634‧‧‧Transfer platen
635‧‧‧conductive backplane
636‧‧‧Electric introduction of pressure plate
641‧‧‧conductive adapter
642, 643‧‧‧ screws
651, 655‧‧‧Insulated backplane
652, 656‧‧‧Insulated pressure plate
653, 657‧‧ inner ring
654, 658‧‧‧ outer ring
I, II, III, IV‧‧‧ areas
第1圖為本發明提供的加熱腔室的結構分解圖； 第2A圖為本發明實施例中支撐總成的結構分解圖； 第2B圖為本發明實施例中加熱燈管的排布示意圖； 第3A圖為本發明實施例中支撐總成的主視圖； 第3B圖為第3A圖中I區域的放大圖； 第3C圖為第3A圖中II區域的放大圖； 第3D圖為第3A圖中III區域的放大圖； 第3E圖為本發明實施例中支撐總成的側視圖； 第3F圖為第3E圖中IV區域的放大圖；以及 第3G圖為本發明實施例中支撐總成的結構分解圖。1 is a structural exploded view of a heating chamber provided by the present invention; FIG. 2A is a structural exploded view of a support assembly according to an embodiment of the present invention; FIG. 2B is a schematic view showing the arrangement of a heating lamp tube according to an embodiment of the present invention; 3A is a front view of the support assembly in the embodiment of the present invention; FIG. 3B is an enlarged view of a region I in FIG. 3A; FIG. 3C is an enlarged view of a region II in FIG. 3A; FIG. 3D is a third view FIG. 3E is a side view of the support assembly in the embodiment of the present invention; FIG. 3F is an enlarged view of the IV area in FIG. 3E; and FIG. 3G is a view of the support in the embodiment of the present invention. An exploded view of the structure.
1‧‧‧腔室元件 1‧‧‧ chamber components
2‧‧‧片盒 2‧‧‧Packs
3‧‧‧片盒升降裝置 3‧‧‧Cartridge lifting device
5‧‧‧加熱筒體 5‧‧‧heating cylinder
6‧‧‧環形支撐元件 6‧‧‧Ring support elements
7‧‧‧安裝元件 7‧‧‧Installation components
8‧‧‧電引入總成 8‧‧‧Electric introduction assembly
Claims (20)
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510251571.7A CN106282914B (en) | 2015-05-15 | 2015-05-15 | Heating chamber and semiconductor processing equipment |
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| Publication Number | Publication Date |
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| TWI550146B TWI550146B (en) | 2016-09-21 |
| TW201639992A true TW201639992A (en) | 2016-11-16 |
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| CN107871681B (en) | 2016-09-27 | 2019-10-08 | 北京北方华创微电子装备有限公司 | One kind going to gas chamber and semiconductor processing device |
| KR102188604B1 (en) * | 2019-04-02 | 2020-12-09 | 주식회사 미래보 | Apparatus for collecting by-product of semiconductor manufacturing process |
| CN112760609B (en) * | 2020-12-22 | 2022-10-21 | 北京北方华创微电子装备有限公司 | Magnetron sputtering device |
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| JP3204699B2 (en) * | 1990-11-30 | 2001-09-04 | 株式会社東芝 | Heat treatment equipment |
| CN1202279C (en) * | 2003-04-15 | 2005-05-18 | 西安理工大学 | Heating device for electronic film material growth |
| CN102534473B (en) * | 2010-12-08 | 2015-02-25 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Heating device and substrate treatment device applying same |
| CN102820206B (en) * | 2011-06-10 | 2015-02-25 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Heat reflection device and semiconductor processing device |
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| CN106282914A (en) | 2017-01-04 |
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