TW201631686A - Substrate processing device, substrate processing system, and substrate process method - Google Patents
Substrate processing device, substrate processing system, and substrate process method Download PDFInfo
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/02—Bonding areas ; Manufacturing methods related thereto
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/02—Bonding areas ; Manufacturing methods related thereto
- H01L24/03—Manufacturing methods
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Abstract
Description
本發明是有關處理基板的基板處理裝置等。 The present invention relates to a substrate processing apparatus and the like for processing a substrate.
在電腦、行動電話、數位家電等中安裝有BGA(Ball Grid Array)或CSP(Chip Size Package)等表面安裝型的電子零件。在如此的電子零件的背面設有多數形成半球狀的凸塊(突起狀的端子)。藉由在電子零件的背面設置凸塊,使基板與電子零件的接點數大幅度增加,謀求電子零件的小型化‧高密度化。 Surface-mounted electronic components such as BGA (Ball Grid Array) or CSP (Chip Size Package) are installed in computers, mobile phones, and digital home appliances. On the back surface of such an electronic component, a plurality of hemispherical bumps (projecting terminals) are formed. By providing bumps on the back surface of the electronic component, the number of contacts between the substrate and the electronic component is greatly increased, and the electronic component is reduced in size and density.
並且,對應於設在電子零件的背面的凸塊,在安裝有此電子零件的基板也形成有多數的凸塊。作為在基板形成凸塊的方法,例如有球存入法為人所知。球存入法是經由設在遮罩的多數個微細的孔來將焊球存入基板(落入、搭載)的方法,具有可高精度形成間距非常窄的凸塊之優點。 Further, in correspondence with the bump provided on the back surface of the electronic component, a large number of bumps are formed on the substrate on which the electronic component is mounted. As a method of forming a bump on a substrate, for example, a ball deposit method is known. The ball depositing method is a method of depositing solder balls on a substrate (falling in and mounting) through a plurality of fine holes provided in the mask, and has the advantage of being able to form bumps having a very narrow pitch with high precision.
例如,在專利文獻1中記載有關在基板的電極上經由遮罩的各孔來塗佈焊劑,在塗佈有焊劑的電極上經由別的遮罩的各孔來搭載焊球的技術。 For example, Patent Document 1 discloses a technique in which a flux is applied to each electrode of a mask through an electrode of a mask, and a solder ball is mounted on each of the electrodes of the other mask on the electrode to which the flux is applied.
〔專利文獻1〕日本特開2009-177015號公報 [Patent Document 1] Japanese Patent Laid-Open Publication No. 2009-177015
在使用前述的球存入法時,大多是將面積比較大的基板(例如450mm×600mm)切斷分割成複數個,分別在分割後的基板搭載焊球。因為若基板的面積過大,則起因於藉由步進式曝光在基板印刷電路圖案時的位移或樹脂製的基板的收縮變形等,基板的各電極與遮罩的各孔的位移超過了容許範圍。另外,隨著設在基板的凸塊的微細化或凸塊間的間距的狹窄化進展,容易發生如此的位移。 When the above-described ball depositing method is used, a substrate having a relatively large area (for example, 450 mm × 600 mm) is cut into a plurality of pieces, and solder balls are mounted on the divided substrates. If the area of the substrate is too large, the displacement of each electrode of the substrate and the hole of the mask exceeds the allowable range due to the displacement at the time of printing the circuit pattern on the substrate by stepwise exposure or the shrinkage deformation of the resin substrate. . Further, as the protrusions provided on the substrate are made finer or the pitch between the bumps is narrowed, such displacement is likely to occur.
因此,一般進行的處理是將面積較大的基板切斷‧洗淨後,利用專利文獻1的技術來進行焊球的搭載等,再將此基板切斷‧洗淨而安裝電子零件。亦即,專利文獻1記載的技術是至少進行2次基板的切斷‧洗淨,因此會有一連串的處理所要的成本變高的問題。最好解決前述位移的問題,省一次切斷‧洗淨的工程,謀求基板的處理成本的降低。 Therefore, in general, the substrate is cut and washed, and the solder ball is mounted by the technique of Patent Document 1, and the substrate is cut and washed to mount the electronic component. In other words, in the technique described in Patent Document 1, since the cutting and cleaning of the substrate are performed at least twice, there is a problem that the cost required for the series of processes is increased. It is preferable to solve the above-mentioned problem of displacement, and to save the process of cutting and cleaning once, and to reduce the processing cost of the substrate.
於是,本發明是以提供一種處理成本便宜的基板處理裝置等為課題。 Accordingly, the present invention has been made in an effort to provide a substrate processing apparatus and the like which are inexpensive to handle.
為了解決前述課題,本發明的基板處理裝置,其特徵係具備:第1遮罩,其係針對平面視具有複數的領域之基板,設有對應於前述領域內的各電極之複數的孔;焊球充填手段,其係於前述第1遮罩的各孔中各充填一個焊球;及焊球搭載手段,其係具有設置對應於前述領域內的各電極的複數的孔之第2遮罩,按每個前述領域重複:經由前述第2遮罩的各孔來吸附藉由前述焊球充填手段而被充填於前述第1遮罩的各孔的焊球,且將吸附後的焊球搭載於前述領域的各電極之處理。 In order to solve the above problems, the substrate processing apparatus of the present invention is characterized in that the first mask includes a substrate having a plurality of fields in a plan view, and a plurality of holes corresponding to the respective electrodes in the field; The ball filling means is characterized in that each of the holes of the first mask is filled with one solder ball; and the solder ball mounting means has a second mask provided with a plurality of holes corresponding to the respective electrodes in the field. Repeating for each of the above-mentioned fields: the solder balls filled in the respective holes of the first mask by the solder ball filling means are adsorbed through the respective holes of the second mask, and the solder balls after the adsorption are mounted on Treatment of each electrode in the aforementioned fields.
若根據本發明,則可提供一種處理成本便宜的基板處理裝置等。 According to the present invention, it is possible to provide a substrate processing apparatus or the like which is inexpensive to handle.
S‧‧‧基板處理系統 S‧‧‧Substrate processing system
1‧‧‧焊劑印刷裝置(焊劑塗佈手段) 1‧‧‧Solder printing device (flux coating method)
2‧‧‧基板處理裝置 2‧‧‧Substrate processing unit
21,22,21A,22A,21B,22B‧‧‧焊球充填單元 21,22,21A,22A,21B,22B‧‧‧Ball fill unit
211,211A‧‧‧第1遮罩 211,211A‧‧‧1st mask
215,215B‧‧‧焊球充填手段 215, 215B‧‧‧ solder ball filling means
215c‧‧‧縫隙狀體 215c‧‧‧ slit body
24‧‧‧移動機構(焊球搭載手段) 24‧‧‧Mobile institutions (solder ball loading means)
25,25A‧‧‧第2遮罩(焊球搭載手段) 25,25A‧‧‧2nd mask (welding ball mounting means)
26‧‧‧搭載頭(焊球搭載手段) 26‧‧‧Heading head (solder ball loading means)
27‧‧‧攝影機(攝像手段) 27‧‧‧ Camera (camera means)
29‧‧‧恢復噴嘴(恢復手段) 29‧‧‧Recovery nozzle (recovery means)
30,30A‧‧‧控制裝置 30,30A‧‧‧Control device
32,32A‧‧‧充填控制部(焊球充填手段) 32,32A‧‧‧Filling Control Department (Ball Filling Means)
33,33A‧‧‧搭載控制部(焊球搭載手段) 33, 33A‧‧‧ Mounting control unit (solder ball mounting means)
34‧‧‧檢查部(檢查手段) 34‧‧‧Inspection Department (inspection means)
35‧‧‧恢復控制部(恢復手段) 35‧‧‧Restoration Control Department (Recovery Means)
41‧‧‧第3遮罩移動用馬達(第3遮罩移動手段) 41‧‧‧3rd mask moving motor (3rd mask moving means)
42‧‧‧第4遮罩移動用馬達(第4遮罩移動手段) 42‧‧‧4th cover movement motor (4th cover moving means)
a3‧‧‧第3遮罩的凸部 a3‧‧‧The convex part of the 3rd mask
a4‧‧‧第4遮罩的凸部 a4‧‧‧The convex part of the 4th mask
B‧‧‧基板 B‧‧‧Substrate
h1‧‧‧第1遮罩的孔 H1‧‧‧ hole of the first mask
h2‧‧‧第2遮罩的孔 H2‧‧‧ hole of the second mask
M3‧‧‧第3遮罩 M3‧‧‧3rd mask
M4‧‧‧第4遮罩 M4‧‧‧4th mask
R1,R2,R3,R4‧‧‧領域 R1, R2, R3, R4‧‧‧ fields
T‧‧‧縫隙 T‧‧‧ gap
Q‧‧‧電極 Q‧‧‧electrode
圖1是本發明的第1實施形態的基板處理系統的說明圖。 Fig. 1 is an explanatory view of a substrate processing system according to a first embodiment of the present invention.
圖2是基板的模式性的平面圖。 2 is a schematic plan view of a substrate.
圖3是焊劑印刷裝置的縱剖面圖。 3 is a longitudinal sectional view of a flux printing device.
圖4是基板處理裝置的立體圖。 4 is a perspective view of a substrate processing apparatus.
圖5是焊球充填單元的縱剖面圖。 Figure 5 is a longitudinal sectional view of the solder ball filling unit.
圖6(a)是縫隙狀體的展開圖,(b)是(a)所示的範圍K的部分擴大圖。 Fig. 6(a) is a developed view of the slit-shaped body, and Fig. 6(b) is a partially enlarged view of the range K shown in (a).
圖7是有關基板處理裝置所具備的控制裝置的機能方塊圖。 Fig. 7 is a functional block diagram of a control device provided in the substrate processing apparatus.
圖8是有關在第1遮罩的各孔中充填焊球的處理的流程圖。 Fig. 8 is a flow chart showing a process of filling a solder ball in each hole of the first mask.
圖9(a)是表示焊球被充填於第1遮罩的各孔的狀態的說明圖,(b)是表示經由第2遮罩的各孔來吸附焊球的狀態的說明圖,(c)是表示在基板中焊球被搭載於一個領域的各電極的狀態的說明圖。 (a) of FIG. 9 is an explanatory view showing a state in which the solder balls are filled in the respective holes of the first mask, and (b) is an explanatory view showing a state in which the solder balls are attracted through the respective holes of the second mask, (c) ) is an explanatory view showing a state in which the solder balls are mounted on the respective electrodes in one field in the substrate.
圖10是表示基板處理裝置的動作的流程的說明圖。 FIG. 10 is an explanatory view showing a flow of an operation of the substrate processing apparatus.
圖11是有關在基板的各電極搭載焊球的處理的流程圖。 FIG. 11 is a flowchart of a process of mounting a solder ball on each electrode of a substrate.
圖12是有關檢查處理及恢復處理的流程圖。 Fig. 12 is a flow chart showing the inspection processing and the recovery processing.
圖13是有關本發明的第2實施形態的基板處理系統的剖面圖,(a)是包含第2遮罩及第4遮罩的模式性的剖面圖,(b)是包含第1遮罩及第3遮罩的模式性的剖面圖。 Figure 13 is a cross-sectional view showing a substrate processing system according to a second embodiment of the present invention, wherein (a) is a schematic cross-sectional view including a second mask and a fourth mask, and (b) is a first mask and A schematic cross-sectional view of the third mask.
圖14是有關基板處理裝置所具備的控制裝置的機能方塊圖。 Fig. 14 is a functional block diagram of a control device provided in the substrate processing apparatus.
圖15是有關在基板的各電極搭載焊球的處理的流程圖。 Fig. 15 is a flowchart showing a process of mounting a solder ball on each electrode of a substrate.
圖16(a)是表示焊球被充填於第1遮罩的各孔的狀 態的說明圖,(b)是表示藉由第3遮罩來推起焊球的狀態的說明圖,(c)是表示搭載頭移動於成為對象的領域的正上面的狀態的說明圖,(d)是表示在基板中焊球被搭載於一個領域的各電極的狀態的說明圖。 Fig. 16 (a) shows the shape in which the solder balls are filled in the respective holes of the first mask. (b) is an explanatory view showing a state in which the solder ball is pushed up by the third mask, and (c) is an explanatory view showing a state in which the mounting head is moved right above the target region. d) is an explanatory view showing a state in which the solder balls are mounted on the respective electrodes in one field in the substrate.
圖17是本發明的變形例的基板處理系統所具備的焊球充填單元的縱剖面圖。 Fig. 17 is a longitudinal sectional view showing a solder ball filling unit included in a substrate processing system according to a modification of the present invention.
圖1是第1實施形態的基板處理系統S的說明圖。另外,圖1所示的箭號是表示基板B被搬送的方向。並且,如圖1所示般定義x,y,z方向。 Fig. 1 is an explanatory view of a substrate processing system S according to the first embodiment. In addition, the arrow shown in FIG. 1 is the direction which the board|substrate B was conveyed. Also, the x, y, and z directions are defined as shown in FIG.
基板處理系統S是在基板B的各電極Q(參照圖2)塗佈焊劑,再搭載焊球而形成凸塊(突起狀的端子)的系統。 The substrate processing system S is a system in which a flux is applied to each electrode Q (see FIG. 2 ) of the substrate B, and solder balls are mounted to form bumps (protrusive terminals).
基板處理系統S是具備:焊劑印刷裝置1、及基板處理裝置2。 The substrate processing system S includes a flux printing device 1 and a substrate processing device 2.
如圖1所示般,朝下游側依序配置有焊劑印刷裝置1及基板處理裝置2,基板B會藉由搬送體P來依序搬送。另外,板狀的搬送體P是可移動於x方向,在其下面吸附基板B後,在x方向的預定位置解除此吸附。 As shown in FIG. 1, the flux printing apparatus 1 and the substrate processing apparatus 2 are arranged in order to the downstream side, and the board|substrate B is conveyed sequentially by the conveyance body P. Further, the plate-shaped conveying body P is movable in the x direction, and after adsorbing the substrate B on the lower side thereof, the adsorption is released at a predetermined position in the x direction.
在此,基板處理系統S的構成之前先簡單說 明有關其處理對象的基板B。 Here, the composition of the substrate processing system S is briefly described The substrate B related to the object to be processed.
圖2是基板B的模式性的平面圖。基板B是安裝有電子零件(未圖示)的板狀體,平面視具有四個的領域R1~R4。在相鄰的矩形狀的領域R1~R4分別設有電極Q密集而成的複數的電極群(未圖示)。另外,領域R1~R4的電極Q的配列是設為大致相同。 FIG. 2 is a schematic plan view of the substrate B. The substrate B is a plate-like body to which an electronic component (not shown) is mounted, and has four fields R1 to R4 in plan view. A plurality of electrode groups (not shown) in which the electrodes Q are densely formed are provided in the adjacent rectangular regions R1 to R4. Further, the arrangement of the electrodes Q in the fields R1 to R4 is set to be substantially the same.
有關詳細方面是在後面敘述,在領域R1~R4中分別藉由搭載頭26(參照圖4)來個別搭載焊球。 The details will be described later. In the fields R1 to R4, the solder balls are individually mounted by the mounting head 26 (see FIG. 4).
圖2所示的領域R1~R4是被設定成即使樹脂製的基板B收縮變形,焊球與電極Q的位移還是會收於預定的容許範圍內。 The fields R1 to R4 shown in Fig. 2 are set such that even if the substrate B made of resin shrinks and deforms, the displacement of the solder balls and the electrodes Q will be within a predetermined allowable range.
並且,在基板B中,以步進式曝光印刷有預定的電路圖案。而且,領域R1~R4是分別被設定成含在每一次的曝光範圍。藉此,即使在進行步進式的曝光印刷時在各曝光範圍之間產生位移時,跨越複數的曝光範圍一起搭載焊球的情形也會消失,因此可抑制電極Q與焊球的位移。 Further, in the substrate B, a predetermined circuit pattern is printed by stepwise exposure. Further, the fields R1 to R4 are set to be included in each exposure range. Thereby, even when displacement occurs between the respective exposure ranges at the time of stepwise exposure printing, the case where the solder balls are mounted together across the plurality of exposure ranges is lost, so that the displacement of the electrodes Q and the solder balls can be suppressed.
焊劑印刷裝置1是經由形成於焊劑塗佈用的遮罩11的多數的孔(未圖示),在配置於此遮罩11的下方之基板B的各電極Q(參照圖2)塗佈焊劑的裝置。前述的「焊劑」是用以藉由其黏性來使焊球附著於基板B,或防止焊球的溶融時的氧化等的液體。 The flux printing apparatus 1 applies a flux to each electrode Q (see FIG. 2) of the substrate B disposed under the mask 11 via a plurality of holes (not shown) formed in the mask 11 for flux application. s installation. The above-mentioned "flux" is a liquid for adhering the solder ball to the substrate B by the viscosity thereof, or preventing oxidation or the like when the solder ball is melted.
圖3是焊劑印刷裝置1的縱剖面圖。 3 is a longitudinal sectional view of the flux printing apparatus 1.
焊劑印刷裝置1是具備:遮罩11、版框12、攝影機13、印刷平台14、及刮刀頭15。遮罩11是形成有對應於基板B的各電極Q的多數的孔之金屬遮罩,配置成與xy平面(水平面)平行。 The flux printing apparatus 1 includes a mask 11, a frame 12, a camera 13, a printing platform 14, and a blade head 15. The mask 11 is a metal mask in which a plurality of holes corresponding to the respective electrodes Q of the substrate B are formed, and is disposed in parallel with the xy plane (horizontal plane).
版框12是用以固定遮罩11的四角框狀的框體,設置在遮罩11的周緣部。另外,圖2所示的例子是版框12的z方向的位置會被固定。 The frame 12 is a frame having a rectangular frame shape for fixing the mask 11, and is provided at a peripheral portion of the mask 11. In addition, the example shown in FIG. 2 is that the position of the frame 12 in the z direction is fixed.
攝影機13是對本身的上方及下方進行攝像的2視野攝影機,可在x,y方向移動。攝影機13是分別攝取被印刷於遮罩11的下面之對位標記(兩處以上;未圖示)、及被印刷於基板B的上面之對位標記(兩處以上;未圖示),且將該攝像結果輸出至印刷平台14的控制裝置(未圖示)。 The camera 13 is a two-view camera that images the upper and lower sides of the camera 13 and is movable in the x and y directions. The camera 13 picks up the alignment marks (two or more; not shown) printed on the lower surface of the mask 11 and the alignment marks (two or more; not shown) printed on the upper surface of the substrate B, respectively. The imaging result is output to a control device (not shown) of the printing platform 14.
印刷平台14是在x,y方向、及θ方向(在xy平面上的旋轉方向)調整基板B的位置,再藉由昇降機構14a來調整基板B與遮罩11的z方向的距離之裝置。印刷平台14是根據攝影機13的攝像結果,以遮罩11的各孔的位置與基板B的各電極Q(參照圖2)的位置能夠平面視一致的方式調整基板B的位置。 The printing platform 14 is a device that adjusts the position of the substrate B in the x, y direction and the θ direction (rotation direction on the xy plane), and adjusts the distance between the substrate B and the mask 11 in the z direction by the elevating mechanism 14a. The printing platform 14 adjusts the position of the substrate B such that the position of each hole of the mask 11 matches the position of each electrode Q (see FIG. 2) of the substrate B in a plan view in accordance with the imaging result of the camera 13.
另外,在基板B塗佈焊劑時,是在攝影機13退避的狀態下,印刷平台14上昇,使基板B接近遮罩11(將兩者間的距離形成預定的遮罩間隙(screen gap))。 Further, when the flux is applied to the substrate B, the printing platform 14 is raised in a state where the camera 13 is retracted, and the substrate B is brought close to the mask 11 (the distance between the two is formed into a predetermined screen gap).
刮刀頭15是經由遮罩11的各孔來對基板B的各電極Q(參照圖2)塗佈焊劑者,具備刮板 (scraper)15a及刮刀15b。在基板B塗佈焊劑時,是以能夠在基板B塗上焊劑的方式,刮刀頭15往復於x方向。 The doctor blade 15 is a blade that applies a flux to each electrode Q (see FIG. 2) of the substrate B through each hole of the mask 11. (scraper) 15a and scraper 15b. When the flux is applied to the substrate B, the blade head 15 is reciprocated in the x direction so that the substrate B can be coated with a flux.
具體而言,使刮板15a下降後,一邊將刮板15a推至遮罩11的上面,一邊使移動至紙面左方向。然後,使刮板15a上昇,使刮刀15b下降,使該刮刀15b移動至紙面右方向。如此,按照刮刀頭15移動的方向,刮板15a及刮刀15b交替使用。 Specifically, after the squeegee 15a is lowered, the squeegee 15a is pushed to the upper surface of the mask 11, and moved to the left direction of the paper. Then, the squeegee 15a is raised, the blade 15b is lowered, and the blade 15b is moved to the right direction of the paper. Thus, the squeegee 15a and the blade 15b are alternately used in accordance with the direction in which the blade head 15 moves.
圖1所示的基板處理裝置2是在被塗佈焊劑的基板B的各電極Q(參照圖2)搭載焊球的裝置。又,基板處理裝置2是亦具有:檢查是否焊球被適當地搭載於基板B的各電極Q,在焊球未被適當地搭載的電極重新搭載焊球的機能。 The substrate processing apparatus 2 shown in FIG. 1 is a device in which solder balls are mounted on each electrode Q (see FIG. 2) of the substrate B to which the flux is applied. In addition, the substrate processing apparatus 2 also has a function of inspecting whether or not the solder balls are appropriately mounted on the respective electrodes Q of the substrate B, and re-loading the solder balls on the electrodes on which the solder balls are not properly mounted.
圖4是基板處理裝置2的立體圖。基板處理裝置2是具備:焊球充填單元21,22、載置台23、移動機構24、第2遮罩25、搭載頭26、攝影機27,28、恢復(repair)噴嘴29、及控制裝置30(參照圖7)。 FIG. 4 is a perspective view of the substrate processing apparatus 2. The substrate processing apparatus 2 includes solder ball filling units 21 and 22, a mounting table 23, a moving mechanism 24, a second mask 25, a mounting head 26, cameras 27 and 28, a recovery nozzle 29, and a control device 30 ( Refer to Figure 7).
焊球充填單元21是經由設在第1遮罩211的複數的孔h1(參照圖5)來充填焊球(使焊球整齊排列)。 The solder ball filling unit 21 fills the solder balls (the solder balls are arranged neatly) via a plurality of holes h1 (see FIG. 5) provided in the first mask 211.
圖5是焊球充填單元21的縱剖面圖。 FIG. 5 is a longitudinal sectional view of the solder ball filling unit 21.
焊球充填單元21是具備:第1遮罩211、版框212、充填台213、空氣壓調整器214(參照圖7)、及焊球充 填手段215。 The ball filling unit 21 includes a first mask 211, a frame 212, a filling table 213, an air pressure adjuster 214 (see FIG. 7), and a solder ball charge. Fill in the means 215.
第1遮罩211是設有對應於基板B的一個領域(領域R1~R4之中任意的一個;參照圖4)的各電極Q的多數的孔h1之遮罩。亦即,設在第1遮罩211的領域U1(圖4所示的一點鎖線的框內)的各孔h1的配列是形成與領域R1~R4之中任意的一個的各電極Q的配列相同。 The first mask 211 is a mask provided with a plurality of holes h1 corresponding to the respective electrodes Q of one field (any one of the fields R1 to R4; see FIG. 4) of the substrate B. In other words, the arrangement of the holes h1 provided in the field U1 of the first mask 211 (in the frame of the one-point lock line shown in FIG. 4) is the same as the arrangement of the electrodes Q of any one of the fields R1 to R4. .
圖5所示的版框212是將第1遮罩211固定於充填台213的框體,被設置在第1遮罩211的周緣部(在圖4中是省略圖示)。充填台213是被載置第1遮罩211的台。充填台213是具有連通至第1遮罩211的各孔h1的連通路D1。 The frame 212 shown in FIG. 5 is a frame in which the first mask 211 is fixed to the filling table 213, and is provided on the peripheral edge portion of the first mask 211 (not shown in FIG. 4). The filling station 213 is a stage on which the first mask 211 is placed. The filling station 213 is a communication path D1 having the respective holes h1 that are connected to the first mask 211.
空氣壓調整器214(參照圖7)是按照來自後述的充填控制部32的指令,使負壓產生,或解除此負壓者。空氣壓調整器214之負壓的產生是在第1遮罩211的各孔h1中充填焊球時被進行。 The air pressure regulator 214 (see Fig. 7) is a device that generates a negative pressure or releases the negative pressure in accordance with an instruction from the filling control unit 32, which will be described later. The generation of the negative pressure of the air pressure regulator 214 is performed when the solder balls are filled in the respective holes h1 of the first mask 211.
圖5所示的焊球充填手段215是在第1遮罩211的各孔h1中各充填一個焊球者。焊球充填手段215是具備:焊球供給部215a、安裝框215b、縫隙狀體215c、加振機215d、及馬達215e(在圖4中是僅圖示安裝框215b及縫隙狀體215c)。 The solder ball filling means 215 shown in FIG. 5 is one in which each solder ball is filled in each hole h1 of the first mask 211. The solder ball filling means 215 includes a solder ball supply portion 215a, a mounting frame 215b, a slit-like body 215c, a vibration damper 215d, and a motor 215e (only the mounting frame 215b and the slit-shaped body 215c are shown in Fig. 4).
焊球供給部215a是朝縫隙狀體215c供給適量的焊球者。在供給焊球時,是以其開口H面對縫隙狀體215c的方式,以旋轉軸G為中心,旋轉焊球供給部 215a。藉此,焊球經由開口H而落下,焊球被供給至縫隙狀體215c。 The solder ball supply portion 215a is an appropriate amount of solder balls supplied to the slit-shaped body 215c. When the solder ball is supplied, the solder ball supply unit is rotated around the rotation axis G so that the opening H faces the slit-like body 215c. 215a. Thereby, the solder ball falls through the opening H, and the solder ball is supplied to the slit-like body 215c.
安裝框215b是安裝縫隙狀體215c的框體,在y方向呈細長的四角框狀(參照圖4)。縫隙狀體215c是具有焊球可移動的多數的縫隙T(參照圖6(b)),且以能夠在對於第1遮罩211彎曲成凸狀的狀態下接觸於此第1遮罩211的方式配置。 The mounting frame 215b is a frame in which the slit-like body 215c is attached, and has a rectangular frame shape in the y direction (see FIG. 4). The slit-shaped body 215c is a slit T (see FIG. 6(b)) having a plurality of solder balls movable, and is in contact with the first mask 211 in a state in which the first mask 211 is curved in a convex shape. Mode configuration.
圖6(a)是縫隙狀體215c的展開圖。縫隙狀體215c是具備:平行延伸的一對的安裝部c1、及對於安裝部c1具有預定角度的多數的線狀體c2。縫隙狀體215c是在分別將安裝部c1,c1推至安裝框215b(參照圖5)中對向於x方向的一對的內壁面之狀態下,被固定於此安裝框215b。 Fig. 6(a) is a developed view of the slit-shaped body 215c. The slit-shaped body 215c is provided with a pair of mounting portions c1 extending in parallel and a plurality of linear bodies c2 having a predetermined angle with respect to the mounting portion c1. The slit-shaped body 215c is fixed to the mounting frame 215b in a state in which the mounting portions c1 and c1 are respectively pushed to the pair of inner wall surfaces in the x direction in the mounting frame 215b (see FIG. 5).
圖6(b)是圖6(a)所示的範圍K的部分擴大圖。 Fig. 6(b) is a partially enlarged view of the range K shown in Fig. 6(a).
被設在縫隙狀體215c的縫隙T是相鄰的線狀體c2之間的間隙。另外,相鄰的線狀體c2的距離L可為焊球的直徑以上,或亦可為未滿焊球的直徑,只要在加振機215d產生的振動下縫隙T變寬時焊球可移動。 The slit T provided in the slit-like body 215c is a gap between the adjacent linear bodies c2. In addition, the distance L of the adjacent linear body c2 may be equal to or larger than the diameter of the solder ball, or may be the diameter of the solder ball not full, as long as the gap T becomes wider when the vibration generated by the vibrator 215d is widened. .
又,縫隙狀體215c是安裝部c1與線狀體c2所成的角度為形成預定角度θ(0<θ<45°)。這是為了縫隙狀體215c在藉由後述的加振機215d(參照圖5)來振動於x方向時,使焊球轉動‧分散。 Further, the slit-like body 215c is formed at a predetermined angle θ (0 < θ < 45°) at an angle formed by the attachment portion c1 and the linear body c2. This is because when the slit-shaped body 215c vibrates in the x direction by the vibrator 215d (see FIG. 5) which will be described later, the solder ball is rotated and dispersed.
圖5所示的加振機215d是如前述般,使縫隙 狀體215c振動於x方向者,被設置在安裝框215b。若藉由加振機215d來使縫隙狀體215c振動於x方向,則存在於縫隙狀體215c的內側或外側的焊球會藉由與線狀體c2的接觸而轉動。藉此,使焊球分散,可在第1遮罩211的各孔h1(參照圖5)各充填一個焊球。 The vibration damper 215d shown in Fig. 5 is a slit as described above. The body 215c vibrates in the x direction and is disposed in the mounting frame 215b. When the slit-shaped body 215c is vibrated in the x direction by the vibrator 215d, the solder balls existing inside or outside the slit-like body 215c are rotated by contact with the linear body c2. Thereby, the solder balls are dispersed, and one solder ball can be filled in each of the holes h1 (see FIG. 5) of the first mask 211.
馬達215e是用以使縫隙狀體215c等移動於x方向的驅動源。一旦藉由馬達215e來使滾珠螺桿軸(未圖示)旋轉,則焊球供給部215a、安裝框215b、縫隙狀體215c、及加振機215d會一體移動於x方向。如前述般,接觸於第1遮罩211的縫隙狀體215c會一邊振動一邊移動於x方向,藉此經由縫隙T(參照圖6(b))而落下的焊球會被充填於第1遮罩211的各孔h1。 The motor 215e is a drive source for moving the slit-shaped body 215c or the like in the x direction. When the ball screw shaft (not shown) is rotated by the motor 215e, the solder ball supply portion 215a, the mounting frame 215b, the slit-like body 215c, and the vibrator 215d are integrally moved in the x direction. As described above, the slit-like body 215c that is in contact with the first mask 211 moves in the x direction while vibrating, and the solder ball that has fallen through the slit T (see FIG. 6(b)) is filled in the first cover. Each hole h1 of the cover 211.
另外,在圖5中雖省略圖示,但實際設有完成焊球的充填後除去殘留於遮罩11上的焊球進行清掃的清掃器(sweeper)。 Although not shown in FIG. 5, a sweeper that removes the solder balls remaining on the mask 11 and cleans it after the completion of the filling of the solder balls is actually provided.
圖4所示的焊球充填單元22是具備與前述的焊球充填單元21同樣的構成。之所以如此設置二個的焊球充填單元21,22,是因為焊球的每一次的充填所要的時間要比往基板B的各電極Q的每一次的搭載所要的時間更長。 The solder ball filling unit 22 shown in FIG. 4 has the same configuration as the solder ball filling unit 21 described above. The reason why the two solder ball filling units 21, 22 are provided in this way is because the time required for each filling of the solder balls is longer than the time required for each of the electrodes Q of the substrate B to be mounted.
圖4所示的載置台23是載置基板B的台。圖4所示的例子是基板B會藉由搬送體P來搬送至紙面右方向,載置於載置台23。 The mounting table 23 shown in FIG. 4 is a stage on which the substrate B is placed. In the example shown in FIG. 4, the substrate B is transported to the right side of the paper by the transport body P, and is placed on the mounting table 23.
移動機構24是使後述的搭載頭26移動於x,y,z方 向、及θ方向(在x,y平面上的旋轉方向)者。圖4所示的例子,移動機構24的構成是包含:一對的支撐體241a,241b、起重機架242、板狀體243、被設置體244、及馬達245,246。 The moving mechanism 24 moves the mounting head 26, which will be described later, to the x, y, and z sides. The direction of the direction and the direction of θ (the direction of rotation on the x, y plane). In the example shown in FIG. 4, the configuration of the moving mechanism 24 includes a pair of support bodies 241a and 241b, a crane frame 242, a plate-like body 243, an installed body 244, and motors 245 and 246.
起重機架241是可沿著設在一對的支撐體241a,241b的軌道E1,E1來移動於y方向。板狀體243是可沿著設在起重機架241的軌道E2,E2來移動於x方向。被設置體244是可沿著設在板狀體243的軌道E3,E3來移動於z方向。馬達245是使被設置體244移動於z方向的驅動源。馬達246是使搭載頭26對於被設置體244旋轉於θ方向的驅動源。 The gantry 241 is movable in the y direction along the rails E1, E1 provided on the pair of support bodies 241a, 241b. The plate-like body 243 is movable in the x direction along the rails E2, E2 provided on the gantry frame 241. The body 244 is movable in the z direction along the tracks E3, E3 provided in the plate-like body 243. The motor 245 is a drive source that moves the set body 244 in the z direction. The motor 246 is a drive source that rotates the mounting head 26 with respect to the set body 244 in the θ direction.
該等的馬達245,246是依照來自後述的搭載控制部33(參照圖7)的指令而驅動。另外,有關使起重機架241移動於y方向的馬達、及使板狀體243移動於x方向的馬達是省略圖示。並且,圖4所示的移動機構24為其一例,只要可將搭載頭26移動於x,y,z,θ方向,亦為其他的構成。 These motors 245 and 246 are driven in accordance with an instruction from a mounting control unit 33 (see FIG. 7) which will be described later. Further, a motor that moves the gantry 241 in the y direction and a motor that moves the plate-shaped body 243 in the x direction are not shown. Further, the moving mechanism 24 shown in FIG. 4 is an example, and the mounting head 26 can be moved in the x, y, z, and θ directions.
第2遮罩25是設有對應於基板B的一個領域(領域R1~R4的其中任意一個)的各電極Q之多數的孔h2(參照圖9(a))的遮罩,且被設置在搭載頭26的下面。 The second mask 25 is a mask provided with a hole h2 (see FIG. 9( a )) corresponding to a plurality of electrodes Q of one field (any one of the fields R1 to R4 ) of the substrate B, and is disposed at The lower surface of the head 26 is mounted.
搭載頭26是經由第2遮罩25的各孔h2(參照圖9(a))來吸附焊球,將吸附的焊球搭載於基板B的各電極Q者。搭載頭26是具備:連通至第2遮罩25的 各孔h2的連通路D2(參照圖9(a))、及進行經由此連通路D2之負壓的產生/解除的空氣壓調整器261(參照圖7)。 The mounting head 26 sucks the solder balls through the holes h2 of the second mask 25 (see FIG. 9( a )), and mounts the adsorbed solder balls on the respective electrodes Q of the substrate B. The mounting head 26 is provided to communicate with the second mask 25 The communication path D2 of each hole h2 (see FIG. 9(a)) and the air pressure regulator 261 (see FIG. 7) for generating/disabling the negative pressure via the communication path D2.
攝影機27是具有:進行第1遮罩211與第2遮罩25的對位時(參照圖9(a)),攝取被印刷於第1遮罩211的對位標記(未圖示)的機能,可移動於x,y方向。 The camera 27 has a function of picking up a registration mark (not shown) printed on the first mask 211 when the first mask 211 and the second mask 25 are aligned (see FIG. 9( a )). Can be moved in the x, y direction.
並且,攝影機27亦具有:進行第2遮罩25與基板B的領域R1~R4的任一個的對位時(圖參照9(c)),攝取被印刷於對象的領域的對位標記之機能。 Further, the camera 27 also has a function of capturing the alignment mark of the field to be printed on the object when the second mask 25 is aligned with any of the fields R1 to R4 of the substrate B (see FIG. 9(c)). .
而且,攝影機27具有:檢查焊球是否被適當地搭載於基板B的各電極Q時,對基板B進行攝像而取得畫像資訊的機能。 Further, the camera 27 has a function of capturing the image information of the substrate B when the solder balls are properly mounted on the respective electrodes Q of the substrate B, and acquiring image information.
攝影機28是在與之前不同的電路圖案的基板B搭載焊球時(亦即,更換第1遮罩211,221及第2遮罩25時),為了修正被儲存於記憶部31(參照圖7)的座標系,而攝取被印刷於第2遮罩25的對位標記。 The camera 28 is mounted on the substrate B of a circuit pattern different from the previous one (that is, when the first masks 211 and 221 and the second mask 25 are replaced), and is stored in the memory unit 31 for correction (see FIG. 7). The coordinate system is ingested, and the alignment mark printed on the second mask 25 is taken.
恢復噴嘴29是按照來自後述的恢復控制部35(參照圖7)的指令,按每個電極Q進行焊球的除去或再搭載,可移動於x,y,z方向。 In the recovery nozzle 29, in accordance with a command from the recovery control unit 35 (see FIG. 7) to be described later, the solder ball is removed or remounted for each electrode Q, and is movable in the x, y, and z directions.
圖7是有關基板處理裝置2所具備的控制裝置30的機能方塊圖。 FIG. 7 is a functional block diagram of the control device 30 included in the substrate processing apparatus 2.
控制裝置30是進行有關焊球的充填‧搭載的處理、及焊球是否被適當地充填的檢查處理、以及根據檢查處理 的結果的恢復處理。控制裝置30雖未圖示,但實際構成是包含:CPU(Central Processing Unit)、ROM(Read Only Memory)、RAM(Random Access Memory)、各種介面等的電子電路。而且,讀出被記憶於ROM的程式,展開於RAM,使CPU能實行各種處理。 The control device 30 performs a process of filling the solder ball, a process of mounting, and an inspection process of whether the solder ball is properly filled, and according to the inspection process. The recovery of the results of the processing. Although the control device 30 is not shown, the actual configuration includes an electronic circuit such as a CPU (Central Processing Unit), a ROM (Read Only Memory), a RAM (Random Access Memory), and various interfaces. Further, the program stored in the ROM is read and expanded in the RAM to enable the CPU to perform various processes.
如圖7所示般,控制裝置30是具備:記憶部31、充填控制部32、搭載控制部33、檢查部34、及恢復控制部35。 As shown in FIG. 7, the control device 30 includes a storage unit 31, a filling control unit 32, a mounting control unit 33, an inspection unit 34, and a recovery control unit 35.
記憶部31是例如半導體記憶裝置。在記憶部31中儲存有攝影機27,28的攝像結果、檢查部34之檢查處理的結果、恢復控制部35之恢復處理的結果等。 The memory unit 31 is, for example, a semiconductor memory device. The memory unit 31 stores the imaging result of the cameras 27 and 28, the result of the inspection process by the inspection unit 34, the result of the restoration process by the restoration control unit 35, and the like.
充填控制部32是具有:進行空氣壓調整器214之負壓的產生/解除、或加振機215d之縫隙狀體215c(參照圖5)的加振、馬達215e之縫隙狀體215c的移動等的機能。 The filling control unit 32 includes the generation/deactivation of the negative pressure of the air pressure adjuster 214, the vibration of the slit-like body 215c (see FIG. 5) of the vibrator 215d, and the movement of the slit-like body 215c of the motor 215e. Function.
搭載控制部33是具有:進行空氣壓調整器261之負壓的產生/解除、或移動機構24之搭載頭26的移動等的機能。 The mounting control unit 33 has a function of generating/disabling the negative pressure of the air pressure adjuster 261 or moving the mounting head 26 of the moving mechanism 24 .
檢查部34是具有:根據藉由攝影機27所取得的畫像資訊,例如藉由圖案匹配來檢查是否焊球被適當地搭載於基板B的各電極Q的機能。 The inspection unit 34 has a function of checking whether or not the solder balls are appropriately mounted on the respective electrodes Q of the substrate B by pattern matching based on the image information acquired by the camera 27.
恢復控制部35是具有:以能夠在藉由檢查部34來判定成焊球的搭載不適當的電極重新搭載焊球的方式,調整恢復噴嘴29的位置等之機能。 The recovery control unit 35 has a function of adjusting the position of the recovery nozzle 29, etc., so that the solder ball can be remounted by the electrode which is determined to be improperly mounted by the inspection unit 34.
圖8是有關在第1遮罩211的各孔h1中充填焊球的處理的流程圖。 FIG. 8 is a flowchart showing a process of filling a solder ball in each hole h1 of the first mask 211.
在步驟S101中,控制裝置30是藉由空氣壓調整器214(參照圖7)經由充填台213的連通路D1來使負壓產生。另外,亦可在後述的焊球的充填之後緊接著開始負壓的產生。 In step S101, the control device 30 generates a negative pressure via the communication passage D1 of the filling station 213 by the air pressure regulator 214 (see FIG. 7). Further, the generation of the negative pressure may be started immediately after the filling of the solder balls described later.
在步驟S102中,控制裝置30是藉由焊球充填手段215(參照圖5)來對第1遮罩211的各孔h1各充填一個焊球。亦即,控制裝置30是一邊藉由加振機215d(參照圖5)來使縫隙狀體215c振動,一邊使該縫隙狀體215c移動於x方向。 In step S102, the control device 30 fills each of the holes h1 of the first mask 211 with one solder ball by the solder ball filling means 215 (see FIG. 5). In other words, the control device 30 moves the slit-like body 215c in the x direction while vibrating the slit-shaped body 215c by the vibration damper 215d (see FIG. 5).
圖9(a)是表示焊球被充填於第1遮罩211的各孔h1的狀態的說明圖。被各一個充填於遮罩211的各孔h1的焊球是經由連通路D1來吸引(S101,S102)。另一方面,在基板B的各電極Q雖被塗佈焊劑,但在領域R1~R4皆焊球未被搭載。 (a) of FIG. 9 is an explanatory view showing a state in which the solder balls are filled in the respective holes h1 of the first mask 211. The solder balls each filled in each hole h1 of the mask 211 are attracted via the communication path D1 (S101, S102). On the other hand, although the flux is applied to each electrode Q of the substrate B, the solder balls are not mounted in the fields R1 to R4.
在圖8的步驟S103中,控制裝置30是判定搭載頭26是否接近第1遮罩211。當搭載頭26未接近第1遮罩211時(S103:No),控制裝置30重複步驟S103的處理。另一方面,當搭載頭26接近第1遮罩211時(S103:Yes),控制裝置30的處理是前進至步驟S104。 In step S103 of FIG. 8, the control device 30 determines whether or not the mounting head 26 is close to the first mask 211. When the mounting head 26 does not approach the first mask 211 (S103: No), the control device 30 repeats the processing of step S103. On the other hand, when the mounting head 26 approaches the first mask 211 (S103: Yes), the processing of the control device 30 proceeds to step S104.
在步驟S104中,控制裝置30是解除藉由空氣壓調整器214所產生的負壓。另外,亦可取代前述負壓的解除,經由連通路D1來施加推起焊球的正壓。 In step S104, the control device 30 cancels the negative pressure generated by the air pressure regulator 214. Further, instead of the release of the negative pressure, a positive pressure for pushing up the solder ball may be applied via the communication path D1.
在步驟S105中,控制裝置30是判定吸附焊球的搭載頭26是否離開第1遮罩211。當搭載頭26未離開第1遮罩211時(S105:No),控制裝置30是重複步驟S105的處理。另一方面,當搭載頭26離開第1遮罩211時(S105:Yes),控制裝置30的處理是回到「START」(RETURN)。 In step S105, the control device 30 determines whether or not the mounting head 26 that adsorbs the solder balls leaves the first mask 211. When the mounting head 26 has not left the first mask 211 (S105: No), the control device 30 repeats the processing of step S105. On the other hand, when the mounting head 26 leaves the first mask 211 (S105: Yes), the processing of the control device 30 returns to "START" (RETURN).
如此一來,控制裝置30是按基板B的各領域重複在第1遮罩211中充填焊球的處理。另外,在第1遮罩211的各孔h1中各充填1個焊球的「焊球充填處理」是含有步驟S101~S105的處理。 In this manner, the control device 30 repeats the process of filling the first mask 211 with the solder balls in accordance with each field of the substrate B. In addition, the "ball filling process" in which one solder ball is filled in each hole h1 of the first mask 211 is a process including steps S101 to S105.
其次,說明有關二個的焊球充填單元21,22(參照圖4)開始焊球的充填的時序。 Next, the timing of starting the filling of the solder balls by the two solder ball filling units 21, 22 (refer to FIG. 4) will be described.
圖10是表示基板處理裝置2的動作的流程的說明圖。 FIG. 10 is an explanatory diagram showing a flow of an operation of the substrate processing apparatus 2.
圖10的橫軸是搭載頭26朝第1遮罩211開始移動之後的經過時間(1刻度:0.5秒)。上側的範圍N1是表示藉由一方的焊球充填單元21(參照圖4)在第1遮罩211的各孔h1中充填焊球,再將焊球搭載於基板B為止的一連串的流程。下側的範圍N2是表示藉由另一方的焊球充填單元22(參照圖4)在第1遮罩221的各孔h1中充填焊球,再將焊球載置於基板B為止的一連串的流程。 The horizontal axis of FIG. 10 is an elapsed time (1 scale: 0.5 second) after the mounting head 26 starts moving toward the first mask 211. The upper range N1 is a series of flows in which the solder balls are filled in the holes h1 of the first mask 211 by one of the solder ball filling units 21 (see FIG. 4), and the solder balls are mounted on the substrate B. The lower range N2 is a series of rows in which the solder balls are filled in the holes h1 of the first mask 221 by the other solder ball filling unit 22 (see FIG. 4), and the solder balls are placed on the substrate B. Process.
圖10所示的例子是搭載頭26移動至第1遮罩211的正上面(0~1秒),搭載頭26吸附焊球(1秒~2.5秒),再於搭載頭26上昇之後(2.5秒~3.5秒),焊球的充填開始(S105:Yes、RETURN、S101,S102)。 In the example shown in FIG. 10, the mounting head 26 moves to the upper surface (0 to 1 second) of the first mask 211, and the mounting head 26 sucks the solder ball (1 second to 2.5 seconds), and after the mounting head 26 rises (2.5) Seconds to 3.5 seconds), the filling of the solder balls starts (S105: Yes, RETURN, S101, S102).
又,圖10所示的例子是若包含搭載頭26在第1遮罩211附近時的等待時間(3.5秒),則焊球的充填需要16秒(範圍N1:0秒~16秒)。同樣,藉由焊球充填單元22來進行焊球的充填時,也要16秒(範圍N2:8秒~24秒)。 Moreover, in the example shown in FIG. 10, when the waiting time (3.5 seconds) of the mounting head 26 in the vicinity of the first mask 211 is included, the filling of the solder ball takes 16 seconds (range N1: 0 second to 16 seconds). Similarly, when the solder ball is filled by the solder ball filling unit 22, it takes 16 seconds (range N2: 8 seconds to 24 seconds).
有關詳細是後述,搭載頭26朝向第1遮罩211之後在基板B的各電極Q搭載焊球的動作是例如0秒~8秒的8秒完成。亦即,焊球的每一次搭載時間是每一次的充填時間的一半完成。因此,本實施形態是焊球充填單元21,22會將時序錯開8秒開始焊球的充填,從第1遮罩211,221(參照圖4)之中充填完了起,藉由搭載頭26來吸附焊球。藉此,消除進行焊球的充填‧搭載時的等待時間,在每單位時間可處理多數的基板B。 As will be described in detail later, the operation of mounting the solder balls on the respective electrodes Q of the substrate B after the mounting head 26 faces the first mask 211 is completed in 8 seconds of, for example, 0 seconds to 8 seconds. That is, each time the solder ball is mounted is half of the filling time of each time. Therefore, in the present embodiment, the solder ball filling units 21 and 22 start the filling of the solder balls by shifting the timing by 8 seconds, and the first masks 211 and 221 (see FIG. 4) are filled in, and the mounting head 26 is used. Adsorb the solder balls. Thereby, the filling of the solder balls is eliminated, and the waiting time at the time of mounting is eliminated, and a large number of substrates B can be processed per unit time.
圖11是有關在基板B的各電極Q搭載焊球的處理的流程圖。 FIG. 11 is a flowchart showing a process of mounting a solder ball on each electrode Q of the substrate B.
在步驟S201中,控制裝置30是判定是否藉由焊球充填單元21,22的任一個充填焊球(亦即焊球的充填完了)。當焊球充填單元21,22皆為充填焊球中時(S201:No),控制裝置30是重複步驟S201的處理。 另一方面,當藉由焊球充填單元21,22的任一個充填焊球(亦即焊球的充填完了)時(S201:Yes),控制裝置30的處理前進至步驟S202。 In step S201, the control device 30 determines whether or not the solder ball is filled by any one of the solder ball filling units 21, 22 (i.e., the solder balls are filled). When the solder ball filling units 21, 22 are all filled with solder balls (S201: No), the control device 30 repeats the processing of step S201. On the other hand, when any one of the solder ball filling units 21, 22 is filled with the solder ball (that is, the solder ball is filled) (S201: Yes), the processing of the control device 30 proceeds to step S202.
在步驟S202中,控制裝置30是藉由移動機構24(參照圖4)來使搭載頭26移動至第1遮罩211的正上面(圖9(a),圖10的0秒~1秒)。亦即,控制裝置30是以第1遮罩211的各孔h1的位置與第2遮罩25的各孔h2的位置能夠平面視一致的方式使搭載頭26移動。 In step S202, the control device 30 moves the mounting head 26 to the front surface of the first mask 211 by the moving mechanism 24 (see FIG. 4) (FIG. 9(a), FIG. 10, 0 second to 1 second) . In other words, the control device 30 moves the mounting head 26 so that the position of each hole h1 of the first mask 211 and the position of each hole h2 of the second mask 25 can be aligned in plan view.
在步驟S203中,控制裝置30是藉由空氣壓調整器261(參照圖7)來使負壓產生,經由第2遮罩25的各孔h2來吸附焊球(圖10的1秒~2.5秒)。 In step S203, the control device 30 generates a negative pressure by the air pressure regulator 261 (see FIG. 7), and sucks the solder ball through each hole h2 of the second mask 25 (1 second to 2.5 seconds in FIG. 10). ).
在步驟S204中,控制裝置30是藉由移動機構24(參照圖4)來使搭載頭26移動至基板B的對象的領域(領域R1~R4的任一個)的正上面。亦即,控制裝置30是使搭載頭26上昇後(圖10的2.5秒~3.5秒),根據攝影機27的攝像結果,進行基板B的對位標記的辨識、及搭載頭26的移動(圖10的3.5秒~5秒)。 In step S204, the control device 30 moves the mounting head 26 to the front side of the target area (any one of the fields R1 to R4) of the substrate B by the moving mechanism 24 (see FIG. 4). In other words, the control device 30 raises the mounting head 26 (2.5 seconds to 3.5 seconds in FIG. 10), and recognizes the alignment mark of the substrate B and the movement of the mounting head 26 based on the imaging result of the camera 27. (FIG. 10) 3.5 seconds to 5 seconds).
圖9(b)是表示焊球被吸附於第2遮罩25的各孔h2的狀態的說明圖。控制裝置30是一面維持在第2遮罩25的各孔h2吸附焊球的狀態,一面以對象的領域的各電極Q的位置與第2遮罩25的各孔h2的位置能夠平面視一致的方式使搭載頭26移動。 (b) of FIG. 9 is an explanatory view showing a state in which the solder balls are adsorbed to the respective holes h2 of the second mask 25. The control device 30 is in a state in which the solder balls are held by the respective holes h2 of the second mask 25, and the position of each electrode Q in the target region and the position of each hole h2 of the second mask 25 can be aligned in plan view. The method moves the mounting head 26.
在圖11的步驟S205中,控制裝置30是在基 板B的各電極Q搭載焊球。亦即,控制裝置30是解除空氣壓調整器261之負壓,在基板B的各電極Q搭載焊球。另外,搭載焊球時,亦可經由連通路D2及第2遮罩25的各孔h2來施加使焊球朝基板B推下的正壓。 In step S205 of Fig. 11, the control device 30 is at the base Solder balls are mounted on the respective electrodes Q of the board B. That is, the control device 30 releases the negative pressure of the air pressure adjuster 261, and mounts the solder balls on the respective electrodes Q of the substrate B. Further, when the solder ball is mounted, a positive pressure for pushing the solder ball toward the substrate B may be applied through the holes h2 of the communication path D2 and the second mask 25.
圖9(c)是表示在基板B中於一個領域的各電極Q搭載焊球的狀態的說明圖。圖9(c)所示的例子是存在未搭載有焊球的領域(紙面右側的領域)。 (c) of FIG. 9 is an explanatory view showing a state in which the solder balls are mounted on the respective electrodes Q in one field in the substrate B. The example shown in FIG. 9(c) is a field in which a solder ball is not mounted (a field on the right side of the paper).
在圖11的步驟S206中,控制裝置30是判定在基板B中是否存在未搭載有焊球的領域。當存在未搭載有焊球的領域時(S206:Yes),控制裝置30的處理是回到步驟S201。另一方面,當基板B的領域R1~R4的全部搭載有焊球時(S206:No),控制裝置30終了處理(END)。 In step S206 of FIG. 11, the control device 30 determines whether or not there is a field in which the solder ball is not mounted on the substrate B. When there is a field in which the solder ball is not mounted (S206: Yes), the processing of the control device 30 returns to step S201. On the other hand, when all of the fields R1 to R4 of the substrate B are mounted with solder balls (S206: No), the control device 30 ends the processing (END).
另外,按每個領域重複在基板B的各電極Q搭載焊球的處理之「焊球搭載處理」中是含有步驟S201~S206的處理。 In addition, the "bump ball mounting process" in which the process of mounting the solder balls on each electrode Q of the substrate B is repeated for each field includes the processes of steps S201 to S206.
圖12是有關檢查處理及恢復處理的流程圖。 Fig. 12 is a flow chart showing the inspection processing and the recovery processing.
另外,在圖12所示的「START」的時間點,焊球會被搭載於基板B的領域R1~~R4的全部。 Further, at the time point "START" shown in FIG. 12, the solder balls are mounted on all of the fields R1 to R4 of the substrate B.
在步驟S301中,控制裝置30是藉由檢查部34(參照圖7)來實行檢查處理。亦即,控制裝置30是例如藉由圖案匹配來檢查焊球是否被適當地搭載於基板B的各電極Q。然後,控制裝置30將檢查處理的結果儲存於記憶部31。 In step S301, the control device 30 executes the inspection process by the inspection unit 34 (see Fig. 7). That is, the control device 30 checks whether or not the solder balls are appropriately mounted on the respective electrodes Q of the substrate B by pattern matching, for example. Then, the control device 30 stores the result of the inspection process in the storage unit 31.
在步驟S302中,控制裝置30是從記憶部31 讀出檢查處理的結果,判定是否存在焊球的搭載不適當的電極。不存在焊球的搭載不適當的電極時(S302:No),控制裝置30終了處理(END)。另一方面,存在焊球的搭載不適當的電極時(S302:Yes),控制裝置30的處理前進至步驟S303。 In step S302, the control device 30 is from the memory unit 31. The result of the inspection process is read, and it is determined whether or not there is an electrode on which the solder ball is mounted. When an improper electrode is not mounted on the solder ball (S302: No), the control device 30 ends the processing (END). On the other hand, when an improper electrode is mounted on the solder ball (S302: Yes), the process of the control device 30 proceeds to step S303.
在步驟S303中,控制裝置30是藉由恢復控制部35(參照圖7)來實行恢復處理。例如,控制裝置30是當焊球的搭載位置偏離基板B的電極,或複數的焊球被搭載於一個電極時,由此電極去除焊球。然後,控制裝置30在此電極搭載附焊劑的新焊球。又,當存在未被搭載焊球的電極時,控制裝置30在此電極搭載附焊劑的新焊球。 In step S303, the control device 30 executes the restoration processing by the restoration control unit 35 (see Fig. 7). For example, in the control device 30, when the mounting position of the solder ball is shifted from the electrode of the substrate B, or when a plurality of solder balls are mounted on one electrode, the electrode removes the solder ball. Then, the control device 30 mounts a new solder ball with a flux on this electrode. Further, when there is an electrode on which the solder ball is not mounted, the control device 30 mounts a new solder ball with a flux on the electrode.
在步驟S304中,控制裝置30判定是否存在其他焊球的搭載不適當的電極。當存在其他焊球的搭載不適當的電極時(S304:Yes),控制裝置30的處理是回到步驟S303。另一方面,當不存在焊球的搭載不適當的電極時(S304:No),控制裝置30終了處理(END)。 In step S304, the control device 30 determines whether or not there is an electrode on which another solder ball is mounted. When an improper electrode is mounted on another solder ball (S304: Yes), the processing of the control device 30 returns to step S303. On the other hand, when an improper electrode is not mounted on the solder ball (S304: No), the control device 30 ends the processing (END).
若根據本實施形態,則由於焊球會被個別地搭載於基板B的領域R1~R4(參照圖2),因此即使基板B的面積比較大,還是可將隨著基板B的收縮變形等而產生的位移壓在容許範圍內。 According to the present embodiment, since the solder balls are individually mounted on the regions R1 to R4 of the substrate B (see FIG. 2), even if the area of the substrate B is relatively large, the substrate B can be deformed by shrinkage or the like. The resulting displacement pressure is within the allowable range.
另外,就使設有多數孔的遮罩(未圖示)載於基板而 一次搭載焊球的以往方法而言,為了將遮罩的各孔與基板的各電極的位移壓在容許範圍內,而將面積比較大的基板切斷‧洗淨之後,對於各自的基板進行焊球的搭載等。 In addition, a mask (not shown) provided with a plurality of holes is placed on the substrate. In the conventional method of mounting a solder ball at a time, in order to press the displacement of each hole of the mask and each electrode of the substrate within an allowable range, the substrate having a relatively large area is cut and washed, and then the respective substrates are soldered. The ball is mounted.
相對的,就本實施形態而言,有關面積比較大的一片基板B,因為在其領域R1~R4個別地搭載焊球,所以可省略進行焊球的搭載等之前的基板B的切斷‧洗淨。因此,若根據本實施形態,則可比以往更大幅度降低一連串的處理所要的成本。 On the other hand, in the case of the substrate B having a relatively large area, since the solder balls are individually mounted in the fields R1 to R4, the cutting of the substrate B before the mounting of the solder balls or the like can be omitted. net. Therefore, according to the present embodiment, the cost required for a series of processes can be significantly reduced as compared with the prior art.
又,藉由使被配置成接觸於第1遮罩211的縫隙狀體215c(參照圖5)振動,如前述般,使焊球分散,可在基板B的各電極Q各搭載一個焊球。因此,可縮短恢復處理(S303;參照圖12)所要的時間,進而能夠在每單位時間處理更多的基板B。 Further, by vibrating the slit-shaped body 215c (see FIG. 5) disposed in contact with the first mask 211, as described above, the solder balls are dispersed, and one solder ball can be mounted on each of the electrodes Q of the substrate B. Therefore, the time required for the recovery process (S303; see FIG. 12) can be shortened, and more substrates B can be processed per unit time.
又,基板處理裝置2是構成除了焊球的充填‧搭載以外,亦可進行之後的檢查處理及恢復處理。因此,與另外設置檢查‧恢復裝置(未圖示)的情況作比較,可降低基板處理裝置2的製造成本,且可縮小包含焊劑印刷裝置1的各裝置全體的橫寬。 Further, the substrate processing apparatus 2 is configured to perform post-inspection processing and recovery processing in addition to charging of the solder balls. Therefore, in comparison with the case where the inspection ‧ recovery device (not shown) is separately provided, the manufacturing cost of the substrate processing apparatus 2 can be reduced, and the lateral width of the entire apparatus including the flux printing apparatus 1 can be reduced.
第2實施形態是設置:配置於第2遮罩25A(參照圖13(a))的上側之第4遮罩M4、及配置於第1遮罩211A(參照圖13(b))的下側之第3遮罩M3的點與第1實施形態不同。另外,有關其他的點(焊劑印刷裝置 1、移動機構24、攝影機27,28、恢復噴嘴29等;參照圖1、圖4)是與第1實施形態同樣。因此,針對與第1實施形態不同的部分進行說明,有關重複的部分是省略說明。 In the second embodiment, the fourth mask M4 disposed on the upper side of the second mask 25A (see FIG. 13(a)) and the lower side of the first mask 211A (see FIG. 13(b)) are provided. The point of the third mask M3 is different from that of the first embodiment. In addition, regarding other points (flux printing device) 1. The moving mechanism 24, the cameras 27, 28, the recovery nozzle 29, and the like; and Figs. 1 and 4) are the same as in the first embodiment. Therefore, the differences from the first embodiment will be described, and the description of the overlapping portions will be omitted.
圖13(a)是包含第2遮罩25A及第4遮罩M4的模式性的剖面圖。第2遮罩25A是具備:設有多數的孔h1的遮罩部25a、及由此遮罩部25a的周緣部延伸至上方的滑接部25b。滑接部25b是滑接於搭載頭26的周壁面。 Fig. 13 (a) is a schematic cross-sectional view including the second mask 25A and the fourth mask M4. The second mask 25A includes a mask portion 25a in which a plurality of holes h1 are provided, and a sliding portion 25b in which the peripheral edge portion of the mask portion 25a extends upward. The sliding portion 25b is slidably attached to the peripheral wall surface of the mounting head 26.
第4遮罩M4是具有對應於基板B的一個領域(領域R1~R4的任意的一個;參照圖2)的各電極Q之凸部a4,且被固定於搭載頭26。各自的凸部a4是突出至下方,面對第2遮罩25A的各孔h2。亦即,以在上下方向凸部a4與孔h2會重疊的方式,第4遮罩M4被配置於第2遮罩25A的上側。 The fourth mask M4 is a convex portion a4 having electrodes Q corresponding to one field (any one of the fields R1 to R4; see FIG. 2) corresponding to the substrate B, and is fixed to the mounting head 26. The respective convex portions a4 protrude to the lower side and face the respective holes h2 of the second mask 25A. In other words, the fourth mask M4 is disposed on the upper side of the second mask 25A so that the convex portion a4 and the hole h2 overlap each other in the vertical direction.
如前述般,滑接部25b是滑接於搭載頭26的周壁面,因此第2遮罩25A與第4遮罩M4之間的空間是形成大致被密閉的狀態。並且,在圖13(a)中雖圖示省略,但實際在第4遮罩M4中設有複數的孔,負壓/正壓會經由搭載頭26的連通路D2而作用。 As described above, since the sliding portion 25b is slidably attached to the peripheral wall surface of the mounting head 26, the space between the second mask 25A and the fourth mask M4 is substantially sealed. Further, although not shown in FIG. 13(a), a plurality of holes are actually provided in the fourth mask M4, and the negative pressure/positive pressure acts via the communication path D2 of the mounting head 26.
圖13(b)是包含第1遮罩211A及第3遮罩M3的模式性的剖面圖。第1遮罩211A是具備:設有多數的孔h1的遮罩部211a、及由此遮罩部211a的周緣部延伸至下方的滑接部211b。滑接部211b是滑接於充填台 213的周壁面。 Fig. 13 (b) is a schematic cross-sectional view including the first mask 211A and the third mask M3. The first mask 211A includes a mask portion 211a in which a plurality of holes h1 are provided, and a sliding portion 211b in which a peripheral edge portion of the mask portion 211a extends downward. The sliding portion 211b is slidably connected to the filling station The wall surface of 213.
第3遮罩M3是具有對應於基板B的一個領域(領域R1~R4的任意的一個;參照圖2)的各電極Q之多數的凸部a3,且被固定於充填台213。各自的凸部a3是突出至上方,面對第1遮罩211A的各孔h1。亦即,以在上下方向凸部a3與孔h1會重疊的方式,第3遮罩M3被配置於第1遮罩211A的下側。 The third mask M3 is a convex portion a3 having a plurality of electrodes Q corresponding to one field (any one of the fields R1 to R4; see FIG. 2) corresponding to the substrate B, and is fixed to the filling table 213. The respective convex portions a3 are protruded upward to face the respective holes h1 of the first mask 211A. In other words, the third mask M3 is disposed on the lower side of the first mask 211A so that the convex portion a3 and the hole h1 overlap each other in the vertical direction.
如前述般,滑接部211b是滑接於充填台213的周壁面,因此第1遮罩211A與第3遮罩M3之間的空間是形成大致被密閉的狀態。並且,在圖13(b)中雖圖示省略,但實際在第3遮罩M3中設有複數的孔,負壓/正壓會經由充填台213的連通路D1而作用。 As described above, since the sliding portion 211b is slidably attached to the peripheral wall surface of the filling table 213, the space between the first mask 211A and the third mask M3 is substantially sealed. Further, although not shown in FIG. 13(b), a plurality of holes are actually provided in the third mask M3, and the negative pressure/positive pressure acts via the communication path D1 of the filling table 213.
另外,另一方的焊球充填單元22A(未圖示)也具備與圖13(b)所示的焊球充填單元21A同樣的構成。 Further, the other solder ball filling unit 22A (not shown) also has the same configuration as the solder ball filling unit 21A shown in FIG. 13(b).
圖14是有關基板處理裝置2所具備的控制裝置30A的機能方塊圖。 FIG. 14 is a functional block diagram of the control device 30A included in the substrate processing apparatus 2.
圖14所示的第3遮罩移動用馬達41是例如利用滾珠螺桿軸來使第1遮罩211A(參照圖13(b))與第3遮罩M3接近/離開的驅動源。第4遮罩移動用馬達42是例如利用滾珠螺桿軸來使第2遮罩25A(參照圖13(a))與第4遮罩M4接近/離開的驅動源。 The third mask moving motor 41 shown in FIG. 14 is a driving source that closes and separates the first mask 211A (see FIG. 13(b)) and the third mask M3 by, for example, a ball screw shaft. The fourth mask moving motor 42 is a driving source that closes and separates the second mask 25A (see FIG. 13( a )) and the fourth mask M4 by, for example, a ball screw shaft.
充填控制部32A是具有:在第1遮罩211A(參照圖13(b))的各孔h1中充填焊球時,藉由第3遮罩移動用馬達41來使第3遮罩M3從第1遮罩211A離 開的機能。 The filling control unit 32A has a third mask M3 from the third mask moving motor 41 when the solder balls are filled in the holes h1 of the first mask 211A (see FIG. 13(b)). 1 mask 211A away Open function.
搭載控制部33A是具有:經由第2遮罩25A(參照圖13(a))的各孔h2來使負壓產生(吸附焊球)時,藉由第3遮罩移動用馬達41來使第3遮罩M3接近第1遮罩211A,且藉由第4遮罩移動用馬達42來使第4遮罩M4從第2遮罩25A離開的機能。 When the negative pressure is generated (adsorbing the solder ball) via the respective holes h2 of the second mask 25A (see FIG. 13(a)), the mounting control unit 33A is provided by the third mask moving motor 41. 3 The function of the mask M3 approaching the first mask 211A and the fourth mask moving motor 42 to move the fourth mask M4 away from the second mask 25A.
又,搭載控制部33A亦具有:將經由第2遮罩25A的孔h2而吸附的焊球搭載於基板B的各電極Q時,藉由第4遮罩移動用馬達42來使第4遮罩M4接近第2遮罩25A的機能。 Further, the mounting control unit 33A also has a fourth mask moving motor 42 for the fourth mask when the solder balls sucked through the holes h2 of the second mask 25A are mounted on the electrodes Q of the substrate B. M4 is close to the function of the second mask 25A.
圖15是有關在基板B的各電極Q搭載焊球的處理的流程圖。另外,對於與在第1實施形態說明過的圖11的流程圖重複的部分附上同樣的步驟號碼。 FIG. 15 is a flowchart showing a process of mounting a solder ball on each electrode Q of the substrate B. In addition, the same step numbers are attached to the portions overlapping with the flowchart of Fig. 11 described in the first embodiment.
在步驟S202中,控制裝置30A是使搭載頭26移動至第1遮罩211A的正上面。此時,如圖16(a)所示般,負壓會經由連通路D1而作用,因此被充填於第1遮罩211A的各孔h1之焊球會被吸引至下方。 In step S202, the control device 30A moves the mounting head 26 to the upper surface of the first mask 211A. At this time, as shown in FIG. 16( a ), since the negative pressure acts via the communication path D1 , the solder balls filled in the holes h1 of the first mask 211A are attracted to the lower side.
在步驟S203a中,控制裝置30A是藉由第3遮罩移動用馬達41來使第3遮罩M3上昇,且藉由凸部a3來推起焊球。並且,控制裝置30A是經由連通路D2來使負壓作用,經由第2遮罩25A的各孔h2來吸附焊球。另外,在進行步驟S203a的處理之前,經由充填台213的連通路D1來作用的負壓是被解除。 In step S203a, the control device 30A raises the third mask M3 by the third mask moving motor 41, and pushes the solder ball by the convex portion a3. Further, the control device 30A applies a negative pressure via the communication path D2, and sucks the solder balls through the respective holes h2 of the second mask 25A. Further, before the process of step S203a is performed, the negative pressure acting via the communication path D1 of the filling station 213 is released.
如圖16(b)所示般,藉由凸部a3來推起焊 球,被充填於第1遮罩211A的各孔h1之焊球容易藉由搭載頭26吸附。因此,可防止焊球殘留於第1遮罩211A的孔h1。 As shown in Fig. 16 (b), the welding is pushed up by the convex portion a3 The balls, which are filled in the holes h1 of the first mask 211A, are easily attracted by the mounting head 26. Therefore, it is possible to prevent the solder ball from remaining in the hole h1 of the first mask 211A.
在步驟S204中,控制裝置30A是使搭載頭26移動至對象的領域的正上面。亦即,如圖16(c)所示般,控制裝置30A是一面經由連通路D2來使負壓作用,一面使搭載頭26移動至基板B的預定的領域的正上面。 In step S204, the control device 30A moves the mounting head 26 to the upper side of the target area. In other words, as shown in FIG. 16(c), the control device 30A moves the mounting head 26 to the front surface of the predetermined region of the substrate B while the negative pressure is applied via the communication path D2.
在步驟S205a中,控制裝置30A是藉由第4遮罩移動用馬達42來使第4遮罩M4下降,且藉由凸部a4來推下焊球。如圖16(d)所示般,藉由凸部a4來推下焊球,被吸附於第2遮罩25A的各孔h2之焊球容易被搭載於基板B的各電極Q。並且,控制裝置30A是經由連通路D2來使推下焊球的正壓作用,在基板B的預定的領域搭載焊球。 In step S205a, the control device 30A lowers the fourth mask M4 by the fourth mask moving motor 42, and pushes the solder ball by the convex portion a4. As shown in FIG. 16(d), the solder balls are pushed down by the convex portions a4, and the solder balls adsorbed to the respective holes h2 of the second mask 25A are easily mounted on the electrodes Q of the substrate B. Further, the control device 30A performs a positive pressure action of pushing down the solder ball via the communication path D2, and mounts the solder ball in a predetermined area of the substrate B.
控制裝置30A是按基板B的各領域重複進行焊球的搭載(S206:Yes,RETURN)。 The control device 30A repeats the mounting of the solder balls in accordance with each field of the substrate B (S206: Yes, RETURN).
若根據本實施形態,則控制裝置30A是在經由第2遮罩25A的各孔h2來吸附焊球時,藉由第3遮罩M3的凸部a3來推起焊球(S203a)。並且,控制裝置30A是在基板B的各電極Q搭載焊球時,藉由第4遮罩M4的凸部a4來推下焊球(S205a)。藉此,可防止焊球殘留於第1遮罩211A的孔h1,或焊球殘留於第2遮罩25A的孔 h2。其結果,在檢查處理中被判定成「無焊球」的電極幾乎是沒有,因此可縮短恢復處理所要的時間,進而能夠在每單位時間處理更多的基板B。 According to the present embodiment, when the solder ball is sucked through each hole h2 of the second mask 25A, the control device 30A pushes up the solder ball by the convex portion a3 of the third mask M3 (S203a). In the control device 30A, when the solder balls are mounted on the respective electrodes Q of the substrate B, the solder balls are pushed down by the convex portions a4 of the fourth mask M4 (S205a). Thereby, it is possible to prevent the solder ball from remaining in the hole h1 of the first mask 211A or the hole of the solder ball remaining in the second mask 25A. H2. As a result, the electrode which is determined to be "no solder ball" in the inspection process is almost absent, so that the time required for the recovery process can be shortened, and more substrates B can be processed per unit time.
以上,說明有關本發明的基板處理系統S,但本發明並非限於各實施形態,亦可在不脫離其主旨的範圍適當變更。 The substrate processing system S according to the present invention has been described above, but the present invention is not limited to the respective embodiments, and may be appropriately changed without departing from the scope of the invention.
例如,在各實施形態是針對焊球充填手段215(參照圖5)具備一個縫隙狀體215c(參照圖5、圖6)的情況進行說明,但並非限於此。 For example, in each of the embodiments, the case where the solder ball filling means 215 (see FIG. 5) includes one slit-like body 215c (see FIGS. 5 and 6) will be described, but the present invention is not limited thereto.
圖17是本發明的變形例的基板處理系統S所具備的焊球充填單元21B的縱剖面圖。以下說明有關焊球充填單元21B所具備的焊球充填手段215B,有關其他的構成是省略說明。 FIG. 17 is a longitudinal cross-sectional view of the ball filling unit 21B included in the substrate processing system S according to a modification of the present invention. The solder ball filling means 215B provided in the solder ball filling unit 21B will be described below, and the other configurations are omitted.
焊球充填手段215B是具備:旋轉體215f、八個的縫隙狀體215c、及罩蓋215g。 The ball filling means 215B includes a rotating body 215f, eight slit-shaped bodies 215c, and a cover 215g.
旋轉體215f是剖面視呈正多角形狀(在圖17是正八角形狀),形成以延伸於y方向的旋轉軸y1為中心旋轉。縫隙狀體215c是分別與在第1實施形態(參照圖5、圖6)說明者同樣的構成,剖面視在旋轉體215f的各邊各設置一個。另外,旋轉體215f的旋轉軸y1的高度是八個的縫隙狀體215c的其中一個(位於最下側者)是被設定成接觸於第1遮罩211。 The rotating body 215f has a positive polygonal shape in cross section (a positive octagonal shape in FIG. 17), and is formed to rotate around a rotation axis y1 extending in the y direction. The slit-shaped body 215c has the same configuration as that described in the first embodiment (see FIGS. 5 and 6), and one cross section is provided on each side of the rotating body 215f. Further, one of the eight slit-shaped bodies 215c having the height of the rotation axis y1 of the rotating body 215f (located at the lowermost side) is set to be in contact with the first mask 211.
罩蓋215g是收容旋轉體215f及縫隙狀體215c者。在罩蓋215g的下端附近是設有用以對罩蓋215g內吹入空氣的開口h3。藉此,可防止在第1遮罩211上殘留焊球。具備前述旋轉體215f、縫隙狀體215c、及罩蓋215g的焊球充填手段215B是在第1遮罩211的各孔充填焊球時,移動於x方向。 The cover 215g is a case in which the rotating body 215f and the slit-shaped body 215c are accommodated. An opening h3 for blowing air into the cover 215g is provided in the vicinity of the lower end of the cover 215g. Thereby, it is possible to prevent the solder ball from remaining on the first mask 211. The ball filling means 215B including the rotating body 215f, the slit-like body 215c, and the cover 215g is moved in the x direction when the respective holes of the first mask 211 are filled with the solder balls.
由於在縫隙狀體215c中設有多數的縫隙T(參照圖6(b)),因此罩蓋215g內的焊球會藉由旋轉體215f的旋轉來分散,分散的焊球會被各一個充填於第1遮罩211的各孔h1。 Since a plurality of slits T are provided in the slit-like body 215c (see FIG. 6(b)), the solder balls in the cover 215g are dispersed by the rotation of the rotating body 215f, and the dispersed solder balls are filled one by one. Each hole h1 of the first mask 211.
又,各實施形態是針對基板B具有四個的領域R1~R4(參照圖2),分別在領域R1~R4依序搭載焊球的情況進行說明,但並非限於此。亦即,領域的數量是只要根據焊球的直徑、基板B的面積、凸塊(亦即,基板B的電極Q)間的間距等來適當設定即可。 Further, in each of the embodiments, the case where the substrate B has four fields R1 to R4 (see FIG. 2) and the solder balls are sequentially mounted in the fields R1 to R4 will be described, but the present invention is not limited thereto. That is, the number of fields may be appropriately set depending on the diameter of the solder ball, the area of the substrate B, the pitch between the bumps (that is, the electrode Q of the substrate B), and the like.
又,各實施形態是針對基板處理裝置2具備二個焊球充填單元21,22(參照圖4)的情況進行說明,但並非限於此。亦即,亦可根據焊球的充填‧搭載所要的時間,形成具備一個焊球充填單元的構成,或形成具備三個以上的焊球充填單元的構成。 Further, in each of the embodiments, the case where the substrate processing apparatus 2 includes the two ball filling units 21 and 22 (see FIG. 4) will be described, but the invention is not limited thereto. In other words, it is also possible to form a configuration including one solder ball filling unit or a configuration in which three or more solder ball filling units are formed, depending on the time required for the solder ball to be filled and mounted.
又,各實施形態是針對基板處理裝置2具備一個搭載頭26的情況進行說明,但並非限於此。亦即,亦可設置複數個設有第2遮罩25的搭載頭26。此情況,控制裝置30是以焊球的充填‧搭載不休息進行的方式, 從焊球的充填完了的第1遮罩211,藉由搭載頭26來進行焊球的吸附。 Further, in each of the embodiments, the case where the substrate processing apparatus 2 includes one mounting head 26 will be described, but the present invention is not limited thereto. In other words, a plurality of mounting heads 26 provided with the second mask 25 may be provided. In this case, the control device 30 is a method in which the solder ball is filled and the rest is carried out without rest. The solder ball is adsorbed by the mounting head 26 from the first mask 211 in which the solder balls are filled.
又,各實施形態是針對基板處理裝置2進行有關焊球的檢查處理(S301;參照圖12)及恢復處理(S303;參照圖12)的情況進行說明,但並非限於此。亦即,亦可在進行焊球的充填‧搭載的基板處理裝置的下游側設置依序進行檢查處理及恢復處理的檢查‧恢復裝置(未圖示)。並且,基板處理系統S亦可形成具備:進行焊劑的印刷的焊劑印刷裝置1、及只進行焊球的充填‧搭載的基板處理裝置之構成。 In addition, each of the embodiments describes the case where the substrate processing apparatus 2 performs the inspection process (S301; see FIG. 12) and the recovery process (S303; FIG. 12) regarding the solder ball, but the present invention is not limited thereto. In other words, it is also possible to perform inspection of the inspection process and the recovery process, and a recovery device (not shown) on the downstream side of the substrate processing apparatus mounted on the substrate. Further, the substrate processing system S may be configured to include a flux printing device 1 that performs printing of a flux, and a substrate processing device that performs only the filling of the solder balls.
又,第2實施形態是針對在第2遮罩25A(參照圖13(a))的上側配置第4遮罩M4,在第1遮罩211A(參照圖13(b))的下側配置第3遮罩M3之構成進行說明,但並非限於此。亦可從第2實施形態省略第3遮罩M3及第4遮罩M4的其中一方。 In the second embodiment, the fourth mask M4 is placed on the upper side of the second mask 25A (see FIG. 13(a)), and the first mask 211A (see FIG. 13(b)) is placed on the lower side. The configuration of the mask M3 will be described, but it is not limited thereto. One of the third mask M3 and the fourth mask M4 may be omitted from the second embodiment.
又,各實施形態說明的基板B是可為印刷基板,或半導體晶圓等,其他的電路零件。 Further, the substrate B described in each embodiment may be a printed circuit board or a semiconductor wafer or the like, and other circuit components.
又,各實施形態為了容易理解說明本發明而詳細記載,但並非是限於一定要具備所說明過的全部構成。並且,可針對各實施形態的構成的一部分進行其他構成的追加‧削除‧置換。 Further, each embodiment is described in detail for easy understanding of the present invention, but it is not limited to all of the configurations described above. Further, it is possible to add, remove, and replace other components for a part of the configuration of each embodiment.
又,前述的各構成、機能、處理部、處理手段等是亦可例如藉由積體電路設計等來以硬體實現該等的一部分或全部。又,機構或構成是顯示說明上必要者,製品上不一 定顯示全部的機構或構成。 Further, each of the above-described configurations, functions, processing units, processing means, and the like may be implemented in a part or all of the hardware by, for example, an integrated circuit design. Moreover, the organization or composition is necessary for display instructions, and the products are different. Display all the institutions or components.
23‧‧‧載置台 23‧‧‧ mounting table
25‧‧‧第2遮罩(焊球搭載手段) 25‧‧‧2nd mask (welding ball mounting means)
26‧‧‧搭載頭(焊球搭載手段) 26‧‧‧Heading head (solder ball loading means)
211‧‧‧第1遮罩 211‧‧‧1st mask
213‧‧‧充填台 213‧‧‧ Filling station
B‧‧‧基板 B‧‧‧Substrate
D1、D2‧‧‧連通路 D1, D2‧‧‧Connected Road
h1‧‧‧第1遮罩的孔 H1‧‧‧ hole of the first mask
h2‧‧‧第2遮罩的孔 H2‧‧‧ hole of the second mask
Q‧‧‧電極 Q‧‧‧electrode
R1~R4‧‧‧領域 R1~R4‧‧‧ Field
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JP2015032047A JP6567290B2 (en) | 2015-02-20 | 2015-02-20 | Substrate processing apparatus, substrate processing system, and substrate processing method |
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CN111162024A (en) * | 2018-11-07 | 2020-05-15 | 普罗科技有限公司 | Apparatus for mounting conductive balls |
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CN107708328A (en) * | 2017-06-27 | 2018-02-16 | 安徽华东光电技术研究所 | Improve the chip adequately grounded welding method with radiating |
US10879102B2 (en) * | 2017-08-07 | 2020-12-29 | Boston Process Technologies, Inc | Flux-free solder ball mount arrangement |
KR102107293B1 (en) * | 2018-04-26 | 2020-05-06 | 장성민 | Solder ball attachment method |
CN110950301B (en) * | 2018-09-27 | 2023-04-07 | 哈尔滨工业大学(威海) | Preparation method of flexible electrode complex pattern based on nanowire material |
KR102078936B1 (en) * | 2018-11-07 | 2020-02-19 | 주식회사 프로텍 | Method of Mounting Conductive Ball |
JP7249012B2 (en) * | 2018-12-07 | 2023-03-30 | アスリートFa株式会社 | Conductive ball inspection and repair equipment |
KR102280054B1 (en) * | 2019-12-06 | 2021-07-21 | 주식회사 에이앤에스월드 | Solder Ball Attachment Apparatus and Method |
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CN111162024A (en) * | 2018-11-07 | 2020-05-15 | 普罗科技有限公司 | Apparatus for mounting conductive balls |
TWI702706B (en) * | 2018-11-07 | 2020-08-21 | 南韓商普羅科技有限公司 | Apparatus for mounting conductive ball |
CN111162024B (en) * | 2018-11-07 | 2023-02-17 | 普罗科技有限公司 | Apparatus for mounting conductive balls |
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CN105914165B (en) | 2019-08-23 |
JP6567290B2 (en) | 2019-08-28 |
KR20160102357A (en) | 2016-08-30 |
TWI573217B (en) | 2017-03-01 |
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JP2016154193A (en) | 2016-08-25 |
CN105914165A (en) | 2016-08-31 |
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