JP2008153319A - Screen printing device and bump forming method - Google Patents

Screen printing device and bump forming method Download PDF

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JP2008153319A
JP2008153319A JP2006337720A JP2006337720A JP2008153319A JP 2008153319 A JP2008153319 A JP 2008153319A JP 2006337720 A JP2006337720 A JP 2006337720A JP 2006337720 A JP2006337720 A JP 2006337720A JP 2008153319 A JP2008153319 A JP 2008153319A
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Prior art keywords
printing
substrate
screen
shib
mask
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JP2006337720A
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JP5018062B2 (en
Inventor
Noriaki Mukai
範昭 向井
Makoto Honma
真 本間
Isao Abe
猪佐雄 阿部
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Hitachi Plant Technologies Ltd
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Hitachi Plant Technologies Ltd
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Priority to JP2006337720A priority Critical patent/JP5018062B2/en
Priority to TW096146997A priority patent/TW200900246A/en
Priority to CNB2007101994669A priority patent/CN100524677C/en
Priority to KR1020070130566A priority patent/KR100941275B1/en
Publication of JP2008153319A publication Critical patent/JP2008153319A/en
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H01L2224/11001—Involving a temporary auxiliary member not forming part of the manufacturing apparatus, e.g. removable or sacrificial coating, film or substrate
    • H01L2224/11005—Involving a temporary auxiliary member not forming part of the manufacturing apparatus, e.g. removable or sacrificial coating, film or substrate for aligning the bump connector, e.g. marks, spacers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L2224/742—Apparatus for manufacturing bump connectors

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Printing Methods (AREA)
  • Screen Printers (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To solve a problem in the method for filling a predetermined aperture with a solder ball by swaying or vibrating a mask in formation of a bump electrode that the aperture cannot be filled because particles are in close contact with each other due to reduction in diameter of solder ball particle and because a close contact force between particles becomes larger than the self-weight of particles in the case where the hole diameter of the mask is under 1.3 times the diameter of particle, and also to solve the similar problem on the occasion of filling the aperture with the solder ball by utilizing squeegee and parallel advancing motion of brushes or the like. <P>SOLUTION: A printer for filling of solder balls has been developed, on the basis of a low price and high precision screen printing technology used in the printing method, to achieve high-speed and highly accurate filling and printing of fine particles of solder balls for assuring stable height of bumps. Moreover, it has been achieved that the solder balls are used for filling and printing while the solder balls are held in the closed state in order to effectively use the fine particles of solder balls. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

本発明はスクリーン印刷装置に係り、特にはんだボール印刷によるバンプ形成法に関する。   The present invention relates to a screen printing apparatus, and more particularly to a bump forming method by solder ball printing.

１８０〜１５０μｍピッチのボールバンプ形成（直径８０〜１００μｍ）において、上記されている高精度スクリーン印刷装置を用い、クリームはんだを印刷後にリフローし、ハンダボール形成を実施する印刷法がある。スクリーン印刷装置の１例としては、基板搬入コンベア，基板搬出コンベア，昇降機構を備えたテーブル部，転写パターンを開口部として有するマスク，スキージ，スキージ昇降機構および水平方向移動機構を備えたスキージヘッド、これらの機構を制御する制御装置を備えている。基板を搬入コンベア部から装置内に搬入後、基板を印刷テーブル部に仮位置決め固定し、この後、基板と回路パターンに対応した開口部を有するマスクの双方のマークをカメラで認識して、双方のずれ量を位置補正し、基板をマスクに位置合わせしてから、基板がマスクと接するように印刷テーブルを上昇させ、スキージによってマスクを基板に接触させながらマスクの開口部にクリームはんだ等のペーストを充填し、さらにテーブルを下降して、基板とマスクを離すことによってペーストを基板上に転写し、その後、基板を装置から搬出することによって印刷がなされている。   In ball bump formation (diameter 80 to 100 μm) with a pitch of 180 to 150 μm, there is a printing method in which a solder ball is formed by reflowing cream solder after printing using the above-described high-precision screen printing apparatus. As an example of a screen printing apparatus, a substrate carry-in conveyor, a substrate carry-out conveyor, a table unit provided with a lifting mechanism, a mask having a transfer pattern as an opening, a squeegee, a squeegee lifting mechanism, and a squeegee head equipped with a horizontal movement mechanism, A control device for controlling these mechanisms is provided. After the substrate is carried into the apparatus from the carry-in conveyor unit, the substrate is temporarily positioned and fixed to the printing table unit, and then both the marks on the substrate and the mask having the opening corresponding to the circuit pattern are recognized by the camera. After correcting the amount of misalignment and aligning the substrate with the mask, the print table is raised so that the substrate is in contact with the mask, and a paste such as cream solder is applied to the opening of the mask while the mask is in contact with the substrate with a squeegee In addition, the paste is transferred onto the substrate by lowering the table and separating the mask from the substrate, and then printing is performed by unloading the substrate from the apparatus.

また、高精度で微細な穴あけ加工された治具にハンダボールを振込み、所定のピッチで整列させ直接基板上に移載し、載置後にリフローすることでハンダボール形成するボール振込み法が知られている。更には、特開２０００−４９１８３号公報によれば、マスクを揺動または振動させ所定の開口にハンダボールを充填する方法やブラシの併進運動等による充填後に加熱する工程からなる方法がある。   Also known is a ball transfer method in which solder balls are formed by transferring solder balls into jigs that have been drilled with high precision, aligning them at a predetermined pitch, transferring them directly onto the substrate, and reflowing after placement. ing. Furthermore, according to Japanese Patent Laid-Open No. 2000-49183, there is a method comprising a method of filling a predetermined opening with a solder ball by swinging or vibrating the mask, or a method of heating after filling by translational movement of a brush or the like.

特開２０００−４９１８３号公報JP 2000-49183 A

クリームはんだによる印刷法は設備コストが安価であり、一括して大量のバンプ形成が可能であることからスループットが高く製造コストが低く抑えられる利点がある。しかしながら、印刷法は転写体積の均一性確保が難しくフラッタリング処理により、リフロー後のハンダバンプをプレスし高さを平滑化する処理を行っており、工程数が多く設備コストがかかるという問題が存在する。また、デバイスの高密度化に伴い１５０〜１２０μｍピッチ等へファイン化が進展した場合、印刷歩留まりが悪く生産性が良くないという点が存在する。一方、ボール振込み法はハンダボールの分級精度確保により安定した高さのバンプ形成が可能でありファイン化に適しているが、ハンダボールを高精度なハンダボール吸着治具を用い、ロボットで搭載しているが、ファイン化した場合のタクト増大，治具・設備価格アップによるバンプ形成コストの増大という問題が存在する。   The printing method using cream solder has an advantage that the equipment cost is low and a large amount of bumps can be formed at a time, so that the throughput is high and the manufacturing cost is kept low. However, in the printing method, it is difficult to ensure the uniformity of the transfer volume, and the process of smoothing the height by pressing the solder bump after reflow is performed by the fluttering process, and there is a problem that the number of processes is large and the equipment cost is high. . In addition, when the finer process progresses to a pitch of 150 to 120 μm as the density of the device increases, there is a point that the printing yield is poor and the productivity is not good. On the other hand, the ball transfer method can form bumps with a stable height by ensuring the classification accuracy of the solder balls, and is suitable for refinement. However, the solder balls are mounted by a robot using a high-precision solder ball suction jig. However, there are problems of increased tact when finer and increased bump formation cost due to increased jig / equipment prices.

更には、特開２０００−４９１８３号公報によるマスクを揺動または振動させ所定の開口にハンダボールを充填する方法では、ハンダボール粒子径の小径化に伴い粒子間の密着現象が発生し、マスクの穴径が粒子径の１.３ 倍未満では粒子間の密着力が、粒子自重より大きく開口部に充填できない問題が存在する。また同様にスキージやブラシの併進運動等による充填においても同様な問題が存在する。   Further, in the method of swinging or vibrating a mask according to Japanese Patent Laid-Open No. 2000-49183 and filling a predetermined opening with a solder ball, an adhesion phenomenon between the particles occurs as the solder ball particle diameter is reduced. When the hole diameter is less than 1.3 times the particle diameter, there is a problem that the adhesion force between the particles is larger than the particle weight and the opening cannot be filled. Similarly, there is a similar problem in filling by squeegee or brush translation.

本発明の目的は、超ファインピッチのバンプ形成において、印刷法のように一括して大量のバンプ形成が可能であり、かつ、ボール振込み法のように安定した高さのバンプ形成が可能な、安価で高速に効率よく印刷・充填を可能とした生産性の高いハンダボール充填用印刷装置及びバンプ形成方法を提供することである。   The object of the present invention is to form a large amount of bumps as in the printing method, and to form a bump having a stable height as in the ball transfer method. It is an object of the present invention to provide a solder ball filling printing apparatus and a bump forming method which are inexpensive and capable of printing and filling efficiently at high speed and with high productivity.

上記目的を達成するために本発明においては以下の手段を実施した。まず、印刷法で用いている安価で高精度なスクリーン印刷技術をベースとし、バンプ高さが安定するハンダボール微粒子を高速・高精度に充填・印刷可能なハンダボール充填用印刷装置を開発した。またハンダボール微粒子を効率よく使用するためにハンダボールを密閉状態で保持しながら充填・印刷することを実現した。更に、ハンダボールの充填不良を抑止し安定した品質の高いバンプ形成方法を開発した。   In order to achieve the above object, the following means are implemented in the present invention. First, based on the inexpensive and high-precision screen printing technology used in the printing method, we developed a solder ball filling printing device that can quickly and accurately fill and print solder ball fine particles with stable bump height. In addition, in order to use the solder ball fine particles efficiently, filling and printing was realized while holding the solder ball in a sealed state. Furthermore, we have developed a stable and high-quality bump formation method that suppresses solder ball filling defects.

図１に、バンプ電極形成用に使用されているメタルマスク事例を示す。図１（ａ）にはマスク全体の状態を、（ｂ）には１個のデバイスに印刷する電極群に相当する開口パターン２０ｐの例を示している。即ちマスク２０は版枠２１に取付けられている。以後版枠
２１を含み全体をマスク２０と称する。本マスクを使用した事例としては、電極パッド部直径１２０μｍ，ピッチ１５０μｍで、１個のＣＰＵチップのパッド数が数千個となる電極パッド群が数十個も配置される多数個取り基板等に対し、印刷法によりバンプ形成に用いられている。図１（ａ）の四角形状が１つの電極パッド群２０ａを示している。すなわち、１つの電極パッド群に対応して設けてあるマスク開口部２０ｃは、電極パッドの大きさに対応した径で多数開口されている。このマスク２０を使用して印刷を行い、印刷終了後、印刷テーブル１０を降下させて、印刷テーブル１０に固定された基板５が下降することで、版離れ動作を実施し、印刷する。 FIG. 1 shows an example of a metal mask used for forming bump electrodes. FIG. 1A shows the state of the entire mask, and FIG. 1B shows an example of an opening pattern 20p corresponding to an electrode group printed on one device. That is, the mask 20 is attached to the plate frame 21. Hereinafter, the whole including the plate frame 21 is referred to as a mask 20. As an example of using this mask, the electrode pad portion has a diameter of 120 μm, a pitch of 150 μm, and a multi-chip substrate in which dozens of electrode pads are arranged with several thousands of pads of one CPU chip. On the other hand, it is used for bump formation by a printing method. The square shape in FIG. 1A shows one electrode pad group 20a. That is, a large number of mask openings 20c provided corresponding to one electrode pad group are opened with a diameter corresponding to the size of the electrode pads. Printing is performed using the mask 20, and after the printing is finished, the printing table 10 is lowered, and the substrate 5 fixed to the printing table 10 is lowered, thereby performing the plate separation operation and printing.

図２に、本発明におけるスクリーン印刷装置の構成を示す。図２（ａ）にスクリーン印刷装置の正面から見た構成とシステム構成図を示す。さらに図２（ｂ）にスクリーン印刷装置を側面から見た構成を示す。また図３（ａ），（ｂ）にスクリーン印刷装置を側面から見た構成で印刷中の状態を示す。   FIG. 2 shows the configuration of the screen printing apparatus according to the present invention. FIG. 2A shows a configuration and a system configuration diagram as viewed from the front of the screen printing apparatus. Further, FIG. 2B shows a configuration of the screen printing apparatus viewed from the side. FIGS. 3A and 3B show a state during printing with a configuration in which the screen printing apparatus is viewed from the side.

本体フレームには図示していない版枠受けが設けられており、版枠受けには印刷パターンを開口部として持つスクリーンを張ったマスク２０がセットされるように構成されている。マスク２０の上方には、充填・印刷ヘッド２が配置され、充填・印刷ヘッド２にはスキージ（本発明ではスキージの代わりにシブ状体４５とスクレーパ３等で構成して有る）からなる充填ユニットが装着されている。充填・印刷ヘッド２は充填・印刷ヘッド移動機構６により水平方向に移動が可能に構成してある。充填ユニットは充填ユニット昇降機構４によって上下方向に移動できる。マスク２０の下方にはマスク２０に対向するように印刷対象物である基板５を載置し保持する印刷テーブル１０が設けて有る。この印刷テーブル１０は、基板５を水平方向に移動してマスクとの位置合わせを行うＸＹθテーブル１１と、基板５を搬入コンベア２５から受け取り、かつ基板５をマスク２０面に近付けるか又は接触させるためのテーブル昇降機構１２とを備えている。印刷テーブル１０の上面には基板受け取りコンベア２６が設けられており、基板搬入コンベア２５によって搬入された基板５を印刷テーブル１０上に受け取り、印刷が終了すると基板搬出コンベア２７に基板５を排出する。   A plate frame receiver (not shown) is provided on the main body frame, and a mask 20 with a screen having a printing pattern as an opening is set on the plate frame receiver. A filling / printing head 2 is disposed above the mask 20, and the filling / printing head 2 is composed of a filling unit comprising a squeegee (in the present invention, a shib 45 and a scraper 3 are used instead of the squeegee). Is installed. The filling / printing head 2 is configured to be movable in the horizontal direction by a filling / printing head moving mechanism 6. The filling unit can be moved in the vertical direction by the filling unit lifting mechanism 4. A printing table 10 is provided below the mask 20 to place and hold the substrate 5 as a printing object so as to face the mask 20. This printing table 10 receives the substrate 5 from the carry-in conveyor 25 and moves the substrate 5 in the horizontal direction to align it with the mask, and brings the substrate 5 close to or in contact with the mask 20 surface. The table elevating mechanism 12 is provided. A substrate receiving conveyor 26 is provided on the upper surface of the printing table 10. The substrate 5 carried by the substrate carrying conveyor 25 is received on the printing table 10, and when printing is completed, the substrate 5 is discharged to the substrate carrying conveyor 27.

印刷ユニット本体１においてはマスク２０と基板５の位置合わせを自動的に行う機能を備えている。すなわち、ＣＣＤカメラ１５によって、マスク２０と基板５のそれぞれに設けられている位置合わせ用マークを撮像し、画像処理して位置ずれ量を求めて、そのずれ量を補正するようにＸＹθテーブル１１を駆動して位置合わせを行うものである。   The printing unit main body 1 has a function of automatically aligning the mask 20 and the substrate 5. That is, the CCD camera 15 images the alignment marks provided on each of the mask 20 and the substrate 5, performs image processing to obtain a positional deviation amount, and sets the XYθ table 11 so as to correct the deviation amount. It is driven and aligned.

なお、各部駆動用の印刷制御部３６やＣＣＤカメラ１５からの画像信号を処理する画像入力部３７等を行う印刷機制御部３０は、印刷機本体フレームの内部に設けてあり、制御用データの書き換えや、印刷条件の変更等を行うためのデータ入力部５０や、印刷状況等や取込んだ認識マークをモニタするための表示部４０が印刷機の外側に、配置してある。   A printing machine control unit 30 that performs a printing control unit 36 for driving each unit, an image input unit 37 that processes an image signal from the CCD camera 15, and the like is provided inside the printer body frame, and includes control data A data input unit 50 for rewriting, changing printing conditions, and the like, and a display unit 40 for monitoring the printing status and captured recognition marks are arranged outside the printing press.

印刷機制御部３０には、充填ユニットをコントロールする充填ユニット制御部３６をもち、生産するバンプのピッチやハンダボール粒子径の違い及び使用するメタルマスクの種類によって適切な充填・印刷モードを簡単にセレクト設定できる。また、入力画像に応じて相関値を計算する相関値計算部３１や、取り込んだ画像や辞書３８からのデータに基づいて形状を求める形状推定部３２，位置座標を求める位置座標演算部３３，寸法演算部
３４を備え、ＣＣＤカメラ１５で撮像したデータから基板とマスクに設けてある位置認識マークに基づいて、位置ずれ量を求めて、ＸＹθテーブルを駆動して位置合わせを行う構成となっている。 The printing press control unit 30 has a filling unit control unit 36 for controlling the filling unit, and an appropriate filling / printing mode can be easily selected depending on the pitch of the bump to be produced, the difference in the solder ball particle diameter, and the type of the metal mask to be used. Select setting is possible. In addition, a correlation value calculation unit 31 that calculates a correlation value according to an input image, a shape estimation unit 32 that calculates a shape based on the captured image and data from the dictionary 38, a position coordinate calculation unit 33 that calculates a position coordinate, dimensions A calculation unit 34 is provided, and based on the position recognition marks provided on the substrate and the mask from the data captured by the CCD camera 15, the positional deviation amount is obtained and the XYθ table is driven to perform alignment. .

次に本発明の印刷装置の動作を説明する。   Next, the operation of the printing apparatus of the present invention will be described.

バンプを形成される基板５は、基板搬入コンベア２５によって基板受け取りコンベア
２６に供給され、印刷テーブル１０上の所定の位置に固定される。基板固定後、予め登録設定された基板マーク位置にＣＣＤカメラ１５を移動する。続いてＣＣＤカメラ１５が基板５及びマスク２０に設けられた位置認識用マーク（図示せず）を撮像し、印刷機制御部３０に転送する。制御部内の画像入力部３７では、画像データからマスク２０と基板５の位置ずれ量を求め、その結果に基づいて印刷機制御部３０は印刷テーブル１０を移動させるＸＹθテーブル３５を動作させてマスク２０に対する基板５の位置を修正・位置合わせする。位置合わせ動作完了後、ＣＣＤカメラ１５が印刷テーブル１０と干渉しない位置まで所定量退避動作する。ＣＣＤカメラ１５が退避完了後、印刷テーブル１０が上昇し、基板５とマスク２０を接触させる。その後、充填ユニット昇降機構を動作させることで、充填・印刷ヘッド２に設けてあるシブ状体をマスク２０面に接触させる。次に、シブ状体を加振しながらマスク面上を移動させてシブ状体の開口からマスク面に設けた開口を介して基板の電極部にハンダボールが供給される。 The substrate 5 on which the bumps are formed is supplied to the substrate receiving conveyor 26 by the substrate carry-in conveyor 25 and fixed at a predetermined position on the printing table 10. After fixing the substrate, the CCD camera 15 is moved to a substrate mark position registered and set in advance. Subsequently, the CCD camera 15 images a position recognition mark (not shown) provided on the substrate 5 and the mask 20 and transfers it to the printing press control unit 30. The image input unit 37 in the control unit obtains the amount of positional deviation between the mask 20 and the substrate 5 from the image data, and based on the result, the printing press control unit 30 operates the XYθ table 35 for moving the printing table 10 to operate the mask 20. The position of the substrate 5 with respect to is corrected and aligned. After the alignment operation is completed, the CCD camera 15 is retracted by a predetermined amount to a position where it does not interfere with the print table 10. After the CCD camera 15 is retracted, the printing table 10 is raised and the substrate 5 and the mask 20 are brought into contact with each other. After that, the filling unit lifting mechanism is operated to bring the shibbed body provided in the filling / printing head 2 into contact with the surface of the mask 20. Next, solder balls are supplied to the electrode portions of the substrate through the openings provided in the mask surface by moving the surface of the mask while vibrating the shibs.

充填・印刷ヘッド２は水平方向に一定距離ストロークした後に上昇する。そして、印刷テーブル１０が下降し、マスク２０と基板５が離れ、マスク２０の開口部に充填されたハンダボールは基板に転写される。そして、ハンダボールが印刷された基板５は基板搬出コンベア２７を経て次工程に送られる。   The filling / printing head 2 moves up after a certain distance stroke in the horizontal direction. Then, the printing table 10 is lowered, the mask 20 and the substrate 5 are separated, and the solder ball filled in the opening of the mask 20 is transferred to the substrate. And the board | substrate 5 with which the solder ball was printed is sent to the following process through the board | substrate carrying-out conveyor 27. FIG.

なお、基板５とマスク２０には相対的に同一な箇所に認識位置合わせ用マークが２ケ以上設けられており、この双方のマーク各々を、上下方向２視野を有する特殊なＣＣＤカメラ１５により、マスク２０のマークは下から認識し、基板５のマークは上から認識して、所定箇所に設けてあるマーク全ての位置座標を読み取り、マスク２０に対する基板５のずれ量を位置演算・補正し、基板５をマスク２０に対して位置合わせする。   The substrate 5 and the mask 20 are provided with two or more recognition positioning marks at relatively the same location, and both of these marks are respectively separated by a special CCD camera 15 having two vertical fields of view. The mark of the mask 20 is recognized from the bottom, the mark of the substrate 5 is recognized from the top, the position coordinates of all the marks provided at predetermined positions are read, the amount of displacement of the substrate 5 with respect to the mask 20 is calculated and corrected, The substrate 5 is aligned with the mask 20.

次に本発明の印刷ヘッドについて説明する。   Next, the print head of the present invention will be described.

図４にマスク上を充填・印刷ヘッドがハンダボールをマスクに充填しながら移動するときの模式図を示す。図５に充填・印刷ヘッドの断面図を示す。   FIG. 4 shows a schematic diagram when the filling / printing head moves on the mask while filling the solder balls into the mask. FIG. 5 shows a cross-sectional view of the filling / printing head.

図４に示すように充填・印刷ヘッド２にはハンダボールを載置するシブ状体４５をシブ状体固定金具３ａと、シブ状体４５に垂直若しくは水平振動を与える加振手段４７と、スクリーン面上に供給され充填されていないハンダボールを残さず掻き取り可能なスクレーパ３とを具備している。尚図４ではスクレーパ３にシブ状体を取付ける構成としているが、図５に示すようにシブ状体はシブ状体固定金具３ａに取付け、スクレーパ３はその外側に設けた構成としても良い。またシブ状体固定金具３ａに刷毛を設けて、スクレーパ３を省略する構成としてもよい。シブ状体４５は網目状の開口４６或いは連続した円形，楕円形，長方形、またはスリット等の開口４６を持つ極薄の金属板で形成されている。なお、網目状の開口４６は金属板に電鋳法等により一体成型して形成することができる。シブ状体４５の上部に置かれたハンダボール４８は、シブ状体４５を垂直若しくは水平方向、或いは両者を複合させた方向（矢印４２の方向）に加振手段４７にて振動させることで、ハンダボール同士の密着力を低減・拡散すると共に、ハンダボールに回転力を作用させることが可能である。このハンダボール４８に発生させた回転力により、ハンダボール４８には鉛直方向下向き成分の力が発生する。この下向きの力により、シブ状体４５の開口４６を通してマスク２０の所定の開口位置にハンダボール４８を充填することができる。すなわち、充填・印刷ヘッド２がマスク２０面上を、シブ状体４５を加振すると共に、水平方向に移動して行くことで連続的にハンダボール４８を基板５面上の電極部５ｐに充填・印刷を行う。   As shown in FIG. 4, the filling / printing head 2 has a shib-like body 45 on which a solder ball is placed, a shib-like body fixing bracket 3a, a vibration means 47 that applies vertical or horizontal vibration to the shib-like body 45, a screen. And a scraper 3 which can be scraped off without leaving unfilled solder balls supplied on the surface. In FIG. 4, the scraper 3 is attached to the shib-like body. However, as shown in FIG. 5, the shib-like body may be attached to the shib-like body fixing bracket 3a, and the scraper 3 may be provided outside. Moreover, it is good also as a structure which provides a brush in the shibu-shaped body fixing metal fitting 3a, and abbreviate | omits the scraper 3. FIG. The shib-like body 45 is formed of a net-like opening 46 or a very thin metal plate having an opening 46 such as a continuous circle, ellipse, rectangle, or slit. The mesh-shaped opening 46 can be formed by integrally molding a metal plate by electroforming or the like. The solder ball 48 placed on the upper part of the shib-like body 45 causes the shib-like body 45 to vibrate in the vertical or horizontal direction, or a direction in which both are combined (direction of the arrow 42) by the vibration means 47, It is possible to reduce and diffuse the adhesion force between the solder balls and to apply a rotational force to the solder balls. Due to the rotational force generated on the solder ball 48, a force having a downward component in the vertical direction is generated on the solder ball 48. With this downward force, the solder ball 48 can be filled into a predetermined opening position of the mask 20 through the opening 46 of the shim-like body 45. That is, the filling / printing head 2 continuously fills the electrode portion 5p on the surface of the substrate 5 by vibrating the shib-like body 45 on the surface of the mask 20 and moving in the horizontal direction.・ Print.

図５に示すように、充填・印刷ヘッド２は、シブ状体４５によって印刷に必要な量のハンダボール４８を密閉状態で保持できるハンダボール収納手段を形成している。充填・印刷ヘッド２は、印刷動作中にハンダボール４８を収納したシブ状体４５を対向したスクレーパ３と連結振動させるように構成した。すなわち、シブ状体固定金具３ａとスクレーパ３を加振する加振手段４７を設けて、スクレーパ３とシブ状体４５とを同期して振動するように構成してある。   As shown in FIG. 5, the filling / printing head 2 forms a solder ball storage means that can hold the amount of solder balls 48 necessary for printing in a hermetically sealed state by the shibbed body 45. The filling / printing head 2 is configured to connect and vibrate the shibbed body 45 containing the solder balls 48 with the opposing scraper 3 during the printing operation. That is, a vibration means 47 for vibrating the shib-like body fixing metal 3a and the scraper 3 is provided so that the scraper 3 and the shib-like body 45 vibrate in synchronization.

図６に連結振動作用のあるシブ構造図を示す。シブ状体４５は前述のように、極薄のメタル板で構成してあり、その底面に網目状等の開口４６が設けてある。そして、この両端部がシブ状体固定金具３ａの傾きに合わせて折り曲げられ、折り曲げ部がシブ状体固定金具３ａの面に取付けられる。シブ状体４５は容易に伸縮変形可能なことから、その形状特性を利用し、ハンダボール直径＞開口寸法＋伸縮変形寸法の場合は、ハンダボール４８が通過できず、ハンダボール４８の保持が可能となる。一方で、その逆に、ハンダボール直径＜開口寸法＋伸縮変形寸法の場合は、ハンダボール４８が通過できる隙間が確保され、ハンダボールの充填が可能となる。このシブ状体４５の伸縮は、シブ状体４５を加振すること若しくは磁力等の外力で発生させることができる。   FIG. 6 shows a shib structure diagram having a coupled vibration action. As described above, the shib-like body 45 is composed of an extremely thin metal plate, and has a mesh-like opening 46 provided on the bottom surface thereof. Then, both end portions are bent according to the inclination of the shib-shaped body fixing bracket 3a, and the bent portion is attached to the surface of the shib-shaped body fixing bracket 3a. Since the shib-like body 45 can be easily stretched and deformed, its shape characteristics are utilized. When the solder ball diameter> opening size + stretch deformation size, the solder ball 48 cannot pass and the solder ball 48 can be held. It becomes. On the other hand, when solder ball diameter <opening size + stretchable deformation size, a gap through which the solder ball 48 can pass is secured, and the solder ball can be filled. The expansion and contraction of the shibu-shaped body 45 can be generated by exciting the shibu-shaped body 45 or by an external force such as a magnetic force.

図７に、図示していないシブ状体４５を介した充填・印刷ヘッドによるハンダボールの充填・印刷メカニズムの説明図を示す。図においてシブ状体固定金具３ａはアタック角度θを約６０度に設定されている。この充填・印刷ヘッド２を、図示していない加振手段
４７を用いてシブ状体固定金具３ａを斜め方向（アタック角方向）に加振しながら矢印
４１方向に移動させる。この振動は、シブ状体固定金具３ａを介してシブ状体４５に伝達される。シブ状体４５の底面に収納されているハンダボール４８にこの振動が伝達されると、ハンダボール４８には矢印４１ｒ方向の回転力が発生する。この回転によりハンダボール４８には矢印４１方向の力（水平方向）と、矢印４１ａ方向（垂直方向）の力を発生する。すなわち、ハンダボール４８には、回転力により下向きの力が発生する。この状態で、シブ状体４５は伸縮を繰り返し、シブ状体４５が伸びた状態になるとその底面部に設けた開口部が大きく開口し、そこからハンダボールがマスク面に落下，移動する。マスクの開口部に落下したハンダボールはシブ状体の折り曲げ角部又はスクレーパにより、マスク開口部に押し込まれる。マスク面上の開口部以外に落下したハンダボールはシブ状体
４５の折り曲げ角部又はスクレーパ３等によって掻き取られる。 FIG. 7 is an explanatory diagram of a solder ball filling / printing mechanism by a filling / printing head through a shim-like body 45 (not shown). In the figure, the shim-like body fixing bracket 3a has an attack angle θ set to about 60 degrees. The filling / printing head 2 is moved in the direction of the arrow 41 while vibrating the shib-shaped body fixing bracket 3a in an oblique direction (attack angle direction) using a vibration means 47 (not shown). This vibration is transmitted to the shib-like body 45 via the shib-like body fixing bracket 3a. When this vibration is transmitted to the solder ball 48 housed on the bottom surface of the shib-like body 45, a rotational force in the direction of the arrow 41r is generated in the solder ball 48. This rotation generates a force in the direction of arrow 41 (horizontal direction) and a force in the direction of arrow 41a (vertical direction) on the solder ball 48. That is, a downward force is generated on the solder ball 48 by the rotational force. In this state, the shib-like body 45 repeatedly expands and contracts, and when the shib-like body 45 is in a stretched state, the opening provided in the bottom surface portion is greatly opened, from which the solder ball falls and moves to the mask surface. The solder balls that have fallen into the opening of the mask are pushed into the mask opening by the bent corners or scrapers of the shibbed body. Solder balls that have fallen outside the opening on the mask surface are scraped off by the bent corners of the shibbed body 45 or by the scraper 3 or the like.

なお、上記説明ではスクレーパを設けてマスク面上に残留するハンダボールを掻き取ることで説明したが、スクレーパを設けずにシブ状体固定金具３ａの下部にマスク面に接触する部分に刷毛を設けて、刷毛によりハンダボールを掃きとっても良い。また、前述までの説明では刷毛の本体部分にシブ状体を設ける構成としているが、シブ状体とは別にスクレーパや刷毛を取付けるようにしても良い。この場合、シブ状体を加振する加振機構とスクレーパや刷毛を加振する加振機構が必要になる。   In the above description, the scraper is provided to scrape off the solder balls remaining on the mask surface. However, the brush is provided at the lower part of the shib-like body fixing metal fitting 3a without contacting the mask surface. The solder balls may be swept away with a brush. In the above description, the brush body is provided on the brush body, but a scraper or brush may be attached separately from the shib body. In this case, a vibration mechanism that vibrates the shib-like body and a vibration mechanism that vibrates a scraper or a brush are required.

次に図８に本発明に用いるマスク開口部にハンダボールを充填する状況の一例を示す。また図９にマスク下部の樹脂層部に設けた吸引流路の配置を示す。図１０にはマスク開口部の拡大図を示す。   Next, FIG. 8 shows an example of a situation in which solder balls are filled in the mask openings used in the present invention. FIG. 9 shows the arrangement of suction channels provided in the resin layer portion below the mask. FIG. 10 shows an enlarged view of the mask opening.

図８に示すようにマスク２０は磁性材料からなるメタル層２０ｓの下に樹脂層２０ｎを設けた２層構造のマスク形状としたものである。なお、２０ｎは密着性・柔軟性を持たせるために樹脂層としたが、耐久性を考えるとニッケル等の薄い金属で形成することでも実現できる。電極パッド５ｐの上部にはハンダボールの接着性を増すためのフラックス５ｆ（ペースト）が供給されている。また、印刷テーブル１０の基板受け面側には、印刷テーブル１０面と同じ面になるように複数の磁石パッド１０ｂが固定されている。この磁石パッド１０ｂの磁気力でマスクのメタル層２０ｓを吸引することで、マスク２０と基板５の夫々の面の密着性を増すためのものである。   As shown in FIG. 8, the mask 20 has a two-layered mask shape in which a resin layer 20n is provided under a metal layer 20s made of a magnetic material. In addition, although 20n was used as the resin layer in order to give adhesiveness and flexibility, it can also be realized by forming it with a thin metal such as nickel in view of durability. A flux 5f (paste) for increasing the adhesion of the solder balls is supplied to the upper part of the electrode pad 5p. A plurality of magnet pads 10 b are fixed on the substrate receiving surface side of the printing table 10 so as to be the same surface as the printing table 10 surface. By attracting the metal layer 20s of the mask with the magnetic force of the magnet pad 10b, the adhesion between the mask 20 and the respective surfaces of the substrate 5 is increased.

また、本実施例では、図９に示すように、メタル層２０ｓの下部の樹脂層２０ｎには、マスク面に設けた開口部から空気流を吸引するための溝が略碁盤の目状に設けてある。この溝は基板にマスクを載せたときに空気を排出する排気流路５２となるのものである。尚排気流路５２は、電極群を囲むように設けた溝で構成される排気溝５１を結ぶように形成してある。なお、図示していないが、空気を吸引するためのポンプが配置されており、このポンプと排気流路５２を接続する配管が設けてある。なお、上記説明では、ポンプを用いて排気流路５２を経由してマスク開口部から空気を吸引する構成としているが、印刷・充填ヘッド側にマスク面に空気を吹き付ける加圧空気供給手段を設けて、ハンダボールを印刷後、圧縮空気をマスク面に圧縮空気を吹き付けることで、ハンダボールをマスク開口部から電極パッド部に押し込むようにしてもよい。この場合もマスクを構成する樹脂層に排気流路を設けておきマスク周辺より空気を逃がす構成とすることで、ハンダボールがマスク開口部に供給し易くすることができる。   Further, in this embodiment, as shown in FIG. 9, the resin layer 20n below the metal layer 20s is provided with grooves for sucking an air flow from an opening provided on the mask surface in a substantially grid pattern. It is. This groove serves as an exhaust passage 52 for discharging air when a mask is placed on the substrate. The exhaust passage 52 is formed so as to connect an exhaust groove 51 constituted by a groove provided so as to surround the electrode group. Although not shown, a pump for sucking air is arranged, and a pipe for connecting the pump and the exhaust passage 52 is provided. In the above description, air is sucked from the mask opening via the exhaust flow path 52 using a pump. However, a pressurized air supply means for blowing air to the mask surface is provided on the printing / filling head side. Then, after the solder ball is printed, the solder ball may be pushed into the electrode pad portion from the mask opening by blowing the compressed air onto the mask surface. Also in this case, by providing an exhaust passage in the resin layer constituting the mask so that air can escape from the periphery of the mask, the solder balls can be easily supplied to the mask opening.

図１０に示すように、マスク２０はメタル層２０ｓ側の開口に比べて樹脂層２０ｎ側の開口が大きくなるように形成されている。このように、マスクの基板と接触する側に樹脂層を設けることで、マスクの基板に対する密着性を増すと共に、基板の損傷を防止し、基板の電極部に確実にハンダボールを供給できるようにしたものである。マスクの開口の間隔（ピッチ）Ｌ，メタル層２０ｓ側の開口の直径Ｒｓ，樹脂層２０ｎ側の開口の直径Ｒｒ（＝１.１Ｒｓ），排気溝５２の幅Ｒｌ（約０.４Ｒｒ）としている。マスクの開口径は供給するハンダボールの径で決定される。   As shown in FIG. 10, the mask 20 is formed such that the opening on the resin layer 20n side is larger than the opening on the metal layer 20s side. Thus, by providing the resin layer on the side of the mask that comes into contact with the substrate, adhesion of the mask to the substrate is increased, damage to the substrate is prevented, and solder balls can be reliably supplied to the electrode portions of the substrate. It is a thing. The distance (pitch) L between the openings of the mask, the diameter Rs of the opening on the metal layer 20s side, the diameter Rr (= 1.1Rs) of the opening on the resin layer 20n side, and the width Rl (about 0.4 Rr) of the exhaust groove 52 are set. . The opening diameter of the mask is determined by the diameter of the solder ball to be supplied.

以上のように、本発明によれば、ハンダバンプ高さ精度の安定した大量のハンダバンプを一括で安価に高速で形成することが可能である。また装置もシンプルな構成となり設備コストも低く抑えることができる。   As described above, according to the present invention, it is possible to form a large number of solder bumps with stable solder bump height accuracy at a low cost at a high speed. In addition, the apparatus has a simple configuration, and the equipment cost can be kept low.

メタルマスクの一事例を示す図である。It is a figure which shows an example of a metal mask. スクリーン印刷装置の一事例を示す図である。It is a figure which shows an example of a screen printing apparatus. スクリーン印刷装置の印刷動作の概略を説明するための図である。It is a figure for demonstrating the outline of the printing operation of a screen printing apparatus. 充填・印刷ヘッドのハンダボール充填の例を示す図である。It is a figure which shows the example of the solder ball filling of a filling and a printing head. 充填・印刷ヘッドの一例の断面を示す図である。It is a figure which shows the cross section of an example of a filling and a printing head. 充填・印刷ヘッドの収納式シブ形状の一事例を示す図である。It is a figure which shows an example of the storage-type shib shape of a filling and printing head. 充填・印刷メカニズムを示す図である。It is a figure which shows a filling and printing mechanism. メタルマスクの構造概念図である。It is a structure conceptual diagram of a metal mask. メタルマスクの排気流路の例を示す図である。It is a figure which shows the example of the exhaust flow path of a metal mask. メタルマスクの開口部と排気流路の概略を示す図である。It is a figure which shows the outline of the opening part of a metal mask, and an exhaust flow path.

符号の説明Explanation of symbols

１ 印刷ユニット本体
２ 充填・印刷ヘッド
３ スクレーパ
５ 基板
１０ 印刷テーブル
１１ ＸＹθテーブル
１５ カメラ
２０ マスク
４５ シブ状体 1 Print Unit Body 2 Filling / Print Head 3 Scraper 5 Substrate 10 Print Table 11 XYθ Table 15 Camera 20 Mask 45 Shiv

Claims (8)

ハンダボールを用いたバンプ形成法において、ハンダボールを所定のパターンで充填・転写する開口を有するスクリーンと、スクリーンを載置・固定するスクリーン固定手段と、バンプ形成する基板を搬入・固定し所定の印刷・転写完了後に搬出する基板固定手段と、スクリーンと基板の各々の基準マークを画像処理しスクリーンと基板を位置合せする認識位置決め手段と、基板をスクリーンに対して密着させるための密着手段と、スクリーンを通して所定の位置にハンダボールを充填するための印刷手段と、印刷手段をスクリーン面に対し平行運動させる平動手段と、スクリーン開口に充填されたハンダボールを基板上に固着し版離れにより転写する転写手段とを有する印刷装置であって、印刷手段にはハンダボールを載置するシブ状体と、シブ状体に垂直若しくは水平振動を与える振動手段とを具備したバンプ形成方法。   In a bump forming method using solder balls, a screen having an opening for filling and transferring solder balls in a predetermined pattern, a screen fixing means for placing and fixing the screen, and a substrate for bump formation are carried in and fixed to a predetermined A substrate fixing means for carrying out after completion of printing / transfer, a recognition positioning means for performing image processing on the reference marks of the screen and the substrate and aligning the screen and the substrate, a contact means for bringing the substrate into close contact with the screen, Printing means for filling solder balls in a predetermined position through the screen, flat movement means for moving the printing means in parallel with the screen surface, and solder balls filled in the screen openings are fixed on the substrate and transferred by releasing the plate. And a transfer device for transferring, and the printing means includes a shib-like body on which a solder ball is placed; Bump forming method and a vibration means for imparting vertical or horizontal vibrations in Shiv-shaped body. 前記シブ状体に印刷に必要な量のハンダボールを密閉状態で保持可能なハンダボール収納手段を設け、印刷動作中にハンダボールを収納した前記シブ状体を振動させることを特徴とした請求項１のバンプ形成方法。   A solder ball storage means capable of holding in a sealed state a quantity of solder balls necessary for printing is provided on the shib-like body, and the shib-like body containing the solder balls is vibrated during a printing operation. 1 is a bump forming method. 前記印刷手段にシブ状体と併設若しくは独立したはけ状体又はスクレーパ手段を具備し、印刷動作中にはけ状体又はスクレーパ手段を振動させることを特徴とした請求項１の印刷装置及びバンプ形成方法。   2. A printing apparatus and a bump according to claim 1, wherein said printing means is provided with a brush-like body or scraper means which is provided with or independent of a shib-like body, and vibrates the scrap-like body or scraper means during a printing operation. Forming method. 前記スクリーン裏面のパターン開口部周囲に樹脂材料により段差を一体成形した総厚みがハンダボール直径の１倍から１.２ 倍以下としたスクリーンと、ハンダボール直径の１／２以下の前記段差と、前記スクリーンの段差部にスリットを設け基板と密着した時に形成される吸引経路と、スクリーン吸着手段とを具備したことを特徴とした請求項１のバンプ形成方法。   A step in which a step is integrally formed of a resin material around the pattern opening on the back side of the screen, the total thickness being 1 to 1.2 times the solder ball diameter, and the step being ½ or less of the solder ball diameter; 2. The bump forming method according to claim 1, further comprising: a suction path formed when a slit is provided in the stepped portion of the screen and brought into close contact with the substrate; and a screen suction means. 前記印刷手段には、ハンダボール充填動作後に前記スクリーンの柔軟性を利用し、スクリーン上部から下向きに押し圧力を加えるハンダボール加圧手段を具備したことを特徴とした請求項１のバンプ形成方法。   2. The bump forming method according to claim 1, wherein the printing means includes solder ball pressurizing means for applying a pressing force downward from the upper part of the screen by utilizing the flexibility of the screen after the solder ball filling operation. 基板上に形成された電極にマスクを介して印刷手段を用いてハンダボールを供給し印刷するスクリーン印刷装置において、
前記印刷手段は複数の開口部を有する金属面を備えたシブ状体と、前記シブ状体に振動を加える加振手段とを備え、前記加振手段によりシブ状体を加振することで前記開口を広げ、前記シブ状体上に収納したハンダボールを前記マスクを介して基板上の電極に供給する構成としたことを特徴とするスクリーン印刷装置。 In a screen printing apparatus that supplies and prints solder balls using a printing means through a mask to electrodes formed on a substrate,
The printing means includes a shib-like body having a metal surface having a plurality of openings, and a vibration means for applying vibration to the shib-like body, and the shib-like body is vibrated by the vibration means. A screen printing apparatus characterized in that an opening is widened and a solder ball accommodated on the shib-like body is supplied to an electrode on a substrate through the mask. 基板上に形成された電極にマスクを介して印刷手段を用いてハンダボールを供給し印刷するスクリーン印刷装置において、
前記印刷手段は複数の開口部を有する金属面を備えたシブ状体と、前記シブ状体に振動を加える加振手段と、基板を支え固定する基板保持手段とを備え、前記基板保持手段には磁石を内蔵し、印刷手段がマスク面上を平行移動時に基板を通して前記金属製マスクと金属製シブに対し磁力を作用させシブ開口を広げ、前記シブ状体上に収納したハンダボールを前記マスクを介して基板上の電極に供給する構成としたことを特徴とするスクリーン印刷装置。 In a screen printing apparatus that supplies and prints solder balls using a printing means through a mask to electrodes formed on a substrate,
The printing means includes a shib-like body having a metal surface having a plurality of openings, a vibration means for applying vibration to the shib-like body, and a substrate holding means for supporting and fixing the substrate. Has a built-in magnet, and when the printing means moves in parallel on the mask surface, a magnetic force is applied to the metal mask and the metal shib through the substrate to widen the shib opening, and the solder ball stored on the shib-like body is transferred to the mask. A screen printing apparatus characterized in that it is configured to be supplied to an electrode on a substrate via 請求項６又は７に記載のスクリーン印刷装置において、前記充填ユニットに前記シブ状体に併設、または独立してはけ状体又はスクレーパ手段を設け、印刷動作中にはけ状体を振動させる加振手段を備えたことを特徴としたスクリーン印刷装置。   8. A screen printing apparatus according to claim 6 or 7, wherein said filling unit is provided with a shim-like body or a scraper means independently of said shib-like body, and the shading body is vibrated during a printing operation. A screen printing apparatus comprising a vibration means.
JP2006337720A 2006-12-15 2006-12-15 Solder ball printing device Expired - Fee Related JP5018062B2 (en)

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