TW201628790A - Vibration-assisted polishing machine - Google Patents
Vibration-assisted polishing machine Download PDFInfo
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本發明是有關於一種研磨拋光機,特別是有關於具有線上量測、線上清洗及線上修整功能之研磨拋光機。 The present invention relates to an abrasive polishing machine, and more particularly to an abrasive polishing machine having on-line measurement, in-line cleaning, and in-line finishing functions.
化學機械拋光機為一種應用於半導體製程之裝置,其通常為晶圓製程的最後一道製程。由於在半導體製程中,大多要求晶圓須具有平坦的表面,故必須利用化學機械拋光機在拋光液反應及機械研磨下,先去除掉晶圓的表面缺陷。 A chemical mechanical polishing machine is a device used in a semiconductor process, which is usually the last process of a wafer process. Since in the semiconductor manufacturing process, most of the wafers are required to have a flat surface, it is necessary to remove the surface defects of the wafer by a chemical mechanical polishing machine under the reaction of the polishing liquid and the mechanical polishing.
其中,影響晶圓移除率最重要的參數便在於研磨的穩定度以及拋光墊之修整率。當研磨穩定度不足時,將導致晶圓表面的移除率不一致。而拋光墊之表面粗糙程度不僅影響拋光液的互相作用,也決定拋光墊可蘊含多少數量的拋光液。故而在晶圓研磨拋光後還必須進行後續量測,以校準其晶圓移除率及拋光墊的修正率。 Among them, the most important parameters affecting the wafer removal rate are the stability of the polishing and the dressing rate of the polishing pad. When the polishing stability is insufficient, the removal rate of the wafer surface will be inconsistent. The surface roughness of the polishing pad not only affects the interaction of the polishing liquid, but also determines how much polishing liquid can be contained in the polishing pad. Therefore, after the wafer is polished and polished, subsequent measurement must be performed to calibrate the wafer removal rate and the polishing pad correction rate.
因此,為了方便進行並整合晶圓製程,發明人積極投入時間並竭盡心思,完成一種同時具有線上量測、線上清洗及線上修整功能之研磨拋光機。 Therefore, in order to facilitate and integrate the wafer process, the inventors actively invested time and tried their best to complete a grinding and polishing machine with both on-line measurement, on-line cleaning and on-line finishing.
本發明之目的是在於提供一種多功能之研磨拋光機,特別是一種具有線上量測、線上清洗及線上修整功能之研磨拋光機。 The object of the present invention is to provide a multi-functional grinding and polishing machine, in particular to a grinding and polishing machine having on-line measurement, on-line cleaning and on-line finishing functions.
根據本發明一結構實施態樣是在提供一種研磨拋光機,包含一機體、一氣浮研磨座、二研磨拋光頭、一研磨量測系統、一修整件、一音圈馬達以及一可撓清洗管。氣浮研磨座設於機體上,氣浮研磨座上設有一研磨拋光墊,用以同時研磨二被研磨物。二研磨拋光頭可移動地設於機體上,二研磨拋光頭用以分別固定被研磨物。研磨量測系統可移動地設於機體上,研磨量測系統用以於被研磨物停止研磨時量測被研磨物之一厚度,且研磨量測系統於被研磨物停止研磨時可量測研磨拋光墊之一工作移除率。修整件可移動地設於機體,修整件依據工作移除率對研磨拋光墊進行補償修整。音圈馬達設於機體上,音圈馬達驅動二研磨拋光頭,用以提高研磨拋光墊之一修整率及工作移除率。可撓清洗管設於機體上。 According to a structural embodiment of the present invention, there is provided an abrasive polishing machine comprising a body, an air floating polishing seat, two polishing polishing heads, a grinding measuring system, a trimming member, a voice coil motor and a flexible cleaning tube. . The air floating grinding seat is disposed on the air body, and the air floating grinding seat is provided with an abrasive polishing pad for simultaneously grinding the two objects to be ground. The second polishing head is movably disposed on the body, and the second polishing head is used to respectively fix the object to be polished. The grinding measurement system is movably disposed on the body, and the grinding measurement system is configured to measure the thickness of one of the objects to be polished when the object is stopped, and the grinding measurement system can measure the grinding when the object is stopped. One of the polishing pads works at a removal rate. The trimming member is movably disposed on the body, and the trimming member compensates for the grinding and polishing pad according to the working removal rate. The voice coil motor is arranged on the body, and the voice coil motor drives two grinding and polishing heads to improve the trimming rate and the work removal rate of the polishing pad. The flexible cleaning tube is disposed on the body.
根據前述結構實施態樣之一實施例,其中氣浮研磨座包含一座體、複數氣浮軸承、複數支撐架、一研磨平台以及一旋轉支架。座體延伸設於機體上,座體中間具有一中心孔。氣浮軸承圍繞中心孔設於座體。支撐架分佈設於氣浮軸承之間。研磨平台位於氣浮軸承及支撐架上。旋轉支架可移動地穿設於中心孔並可帶動研磨平台旋轉。 According to one embodiment of the foregoing structural embodiment, the air floating grinding seat comprises a body, a plurality of air bearing, a plurality of supporting frames, a grinding platform and a rotating bracket. The seat body is extended on the body, and a central hole is formed in the middle of the seat body. The air bearing is disposed around the center hole in the seat body. The support frame is distributed between the air bearing. The grinding platform is located on the air bearing and the support frame. The rotating bracket is movably disposed through the center hole and can drive the grinding platform to rotate.
根據前述結構實施態樣之另一實施例,其中研磨拋光頭可為多孔性陶磁吸盤。二研磨拋光頭間之一距離可對應等於研磨拋光墊之一直徑。 According to another embodiment of the foregoing structural embodiment, the abrasive polishing head can be a porous ceramic chuck. One of the distances between the two polishing heads may correspond to a diameter of one of the polishing pads.
根據本發明另一結構實施態樣是在提供一種研磨拋光機,包含一機體、一第一移動平台、一第二移動平台、一第三移動平台、一氣浮研磨座、二研磨拋光頭、一研磨量測系統、一修整件、一音圈馬達以及一可撓清洗管。第一移動平台設於機體上且移動於一第一軸向及一第二軸向。第二移動平台設於機體上且移動於第一軸向。第三移動平台設於機體上且移動於一第三軸向。氣浮研磨座設於機體上,氣浮研磨座上設有一研磨拋光墊,用以同時研磨二被研磨物,氣浮研磨座包含一座體、六氣浮軸承、六支撐架、一研磨平台及一旋轉支架,座體延伸設於機體上,座體中間具有一中心孔。六氣浮軸承圍繞中心孔設於座體。六支撐架分佈設於氣浮軸承之間。研磨平台位於氣浮軸承及支撐架上。旋轉支架可移動地穿設於中心孔並可帶動研磨平台旋轉。二研磨拋光頭設於第一移動平台,二研磨拋光頭用以分別固定二被研磨物。研磨量測系統設於第二移動平台,研磨量測系統包含一非接觸式位移計及一接觸式位移計。非接觸式位移計用以於被研磨物停止研磨時量測被研磨物之一厚度。接觸式位移計於被研磨物停止研磨時量測研磨拋光墊之一工作移除率。修整件設於第三移動平台且連接接觸式位移計,修整件依據工作移除率對研磨拋光墊進行補償修整。音圈馬達設於第一移動平台上,音圈馬達驅動二研磨拋光頭,用以提高研磨拋光 墊之一修整率及工作移除率。可撓清洗管設於第一移動平台上且位於二研磨拋光頭之間。 According to another embodiment of the present invention, an abrasive polishing machine is provided, including a body, a first moving platform, a second moving platform, a third moving platform, an air floating polishing seat, and two polishing polishing heads. A grinding measurement system, a trimmer, a voice coil motor, and a flexible cleaning tube. The first moving platform is disposed on the body and moves in a first axial direction and a second axial direction. The second moving platform is disposed on the body and moves in the first axial direction. The third moving platform is disposed on the body and moves in a third axial direction. The air floating grinding seat is arranged on the air body, and the air floating grinding seat is provided with a grinding polishing pad for simultaneously grinding the two objects to be ground. The air floating grinding seat comprises a body, a six air bearing, a six supporting frame, a grinding platform and A rotating bracket, the base body is extended on the body, and a central hole is formed in the middle of the seat body. The six air bearing is arranged around the center hole in the seat body. Six support frames are distributed between the air bearing. The grinding platform is located on the air bearing and the support frame. The rotating bracket is movably disposed through the center hole and can drive the grinding platform to rotate. The two polishing and polishing heads are disposed on the first moving platform, and the two polishing polishing heads are used to respectively fix the two objects to be polished. The grinding measurement system is disposed on the second mobile platform, and the grinding measurement system comprises a non-contact displacement meter and a contact displacement meter. A non-contact displacement gauge is used to measure the thickness of one of the objects to be polished when the object is stopped. The contact displacement gauge measures the working removal rate of one of the abrasive polishing pads when the abrasive is stopped. The trimming piece is disposed on the third moving platform and is connected with the contact type displacement meter, and the trimming part compensates the grinding and polishing pad according to the working removal rate. The voice coil motor is arranged on the first moving platform, and the voice coil motor drives two grinding and polishing heads to improve the grinding and polishing. One of the mat trimming rate and work removal rate. The flexible cleaning tube is disposed on the first moving platform and between the two polishing heads.
根據前述結構實施態樣之一實施例,其中研磨拋光頭可為多孔性陶磁吸盤。二研磨拋光頭間之一距離可對應等於研磨拋光墊之一直徑。 According to one embodiment of the foregoing structural embodiment, the abrasive polishing head can be a porous ceramic chuck. One of the distances between the two polishing heads may correspond to a diameter of one of the polishing pads.
因此,由前述研磨拋光機的實施方式及實施例之可得知,本發明將二研磨拋光頭、研磨量測系統、修整器及可撓清洗管同時架設於機體上,使研磨拋光機同時可進行線上量測、線上清洗及線上修整,並可同時研磨二被研磨物,不僅方便且節省重複的製程作業時間。此外,本發明之研磨拋光機更採用音圈馬達來驅動研磨拋光頭,並利用氣浮軸承來承載研磨平台,藉此增加研磨的穩定度,且可同時提升拋光墊修整率及工作移除率。 Therefore, it can be seen from the embodiments and the embodiments of the foregoing polishing and polishing machine that the second polishing polishing head, the grinding measuring system, the trimmer and the flexible cleaning tube are simultaneously mounted on the body, so that the polishing and polishing machine can simultaneously On-line measurement, on-line cleaning and on-line finishing, and simultaneous grinding of two objects, not only facilitates and saves repetitive process time. In addition, the grinding and polishing machine of the present invention further uses a voice coil motor to drive the polishing and polishing head, and uses the air bearing to carry the grinding platform, thereby increasing the stability of the grinding, and simultaneously improving the polishing pad dressing rate and the work removal rate. .
100‧‧‧機體 100‧‧‧ body
110‧‧‧承載部 110‧‧‧Loading Department
120‧‧‧延伸部 120‧‧‧Extension
200‧‧‧移動平台系統 200‧‧‧Mobile Platform System
210‧‧‧第一移動平台 210‧‧‧First mobile platform
220‧‧‧第二移動平台 220‧‧‧Second mobile platform
230‧‧‧第三移動平台 230‧‧‧ Third mobile platform
300‧‧‧氣浮研磨座 300‧‧‧Air floating grinding seat
310‧‧‧座體 310‧‧‧ body
311‧‧‧中心孔 311‧‧‧ center hole
320‧‧‧氣浮軸承 320‧‧‧Air bearing
330‧‧‧支撐架 330‧‧‧Support frame
340‧‧‧研磨平台 340‧‧‧ Grinding platform
350‧‧‧旋轉支架 350‧‧‧Rotating bracket
400‧‧‧研磨拋光頭 400‧‧‧Abrasive polishing head
500‧‧‧研磨量測系統 500‧‧‧Grinding measurement system
510‧‧‧非接觸式位移計 510‧‧‧ Non-contact displacement meter
520‧‧‧接觸式位移計 520‧‧‧Contact Displacement Meter
600‧‧‧修整件 600‧‧‧Repair
700‧‧‧音圈馬達 700‧‧‧ voice coil motor
800‧‧‧可撓清洗管 800‧‧‧Flexible cleaning tube
M‧‧‧被研磨物 M‧‧‧Abrased objects
CP‧‧‧研磨拋光墊 CP‧‧‧Abrasive polishing pad
X‧‧‧第一軸向 X‧‧‧first axial direction
Z‧‧‧第二軸向 Z‧‧‧second axial
Y‧‧‧第三軸向 Y‧‧‧third axial
為讓本發明之上述和其他目的、特徵、優點與實施例能更明顯易懂,所附圖式之說明如下:第1圖係繪示依照本發明一實施方式的一種研磨拋光機之外觀示意圖。 The above and other objects, features, advantages and embodiments of the present invention will become more <RTIgt; <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; .
第2圖係繪示第1圖之研磨拋光機之部分示意圖。 Fig. 2 is a partial schematic view showing the grinding and polishing machine of Fig. 1.
第3圖係繪示第1圖中氣浮研磨座之配置示意圖。 Fig. 3 is a schematic view showing the arrangement of the air-floating grinding seat in Fig. 1.
第4圖係繪示第1圖之研磨拋光機同時進行研磨與修整之示意圖。 Fig. 4 is a schematic view showing the grinding and trimming of the polishing and polishing machine of Fig. 1 at the same time.
第5圖係繪示第4圖之研磨拋光機同時進行研磨與修整之側視圖。 Fig. 5 is a side view showing the simultaneous grinding and trimming of the lapping and polishing machine of Fig. 4.
第6圖係繪示第1圖之研磨拋光機進行量測之示意圖。 Fig. 6 is a schematic view showing the measurement of the grinding and polishing machine of Fig. 1.
請參照第1圖、第2圖及第3圖,其中第1圖及第2圖係分別繪示依照本發明一實施方式的一種研磨拋光機之外觀示意圖及部分示意圖,第3圖係繪示第1圖中氣浮研磨座之配置示意圖。研磨拋光機包含一機體100、一移動平台系統200、一氣浮研磨座300、二研磨拋光頭400、一研磨量測系統500、一修整件600、一音圈馬達700以及一可撓清洗管800。 Please refer to FIG. 1 , FIG. 2 and FIG. 3 , wherein FIG. 1 and FIG. 2 are respectively a schematic view and a partial schematic view of a polishing and polishing machine according to an embodiment of the present invention, and FIG. 3 is a schematic view. Fig. 1 is a schematic view showing the arrangement of an air floating polishing seat. The polishing and polishing machine comprises a body 100, a moving platform system 200, an air floating polishing seat 300, two polishing polishing heads 400, a grinding measuring system 500, a trimming unit 600, a voice coil motor 700 and a flexible cleaning tube 800. .
機體100為一矩形座體,機體100包含一承載部110及一延伸部120。 The body 100 is a rectangular base body, and the body 100 includes a bearing portion 110 and an extending portion 120.
一移動平台系統200包含一第一移動平台210、一第二移動平台220及一第三移動平台230。第一移動平台210設於機體100之延伸部120上且移動於一第一軸向X及一第二軸向Z。第二移動平台220設於機體100之延伸部120上且移動於第一軸向X。第三移動平台230設於機體100之延伸部120上且移動於一第三軸向Y。 A mobile platform system 200 includes a first mobile platform 210, a second mobile platform 220, and a third mobile platform 230. The first moving platform 210 is disposed on the extension portion 120 of the body 100 and moves in a first axial direction X and a second axial direction Z. The second moving platform 220 is disposed on the extension portion 120 of the body 100 and moves in the first axial direction X. The third moving platform 230 is disposed on the extension portion 120 of the body 100 and moves in a third axial direction Y.
氣浮研磨座300設於機體100之承載部110上,氣浮研磨座300上設有一研磨拋光墊CP,用以同時研磨二被研磨物M,氣浮研磨座300包含一座體310、六氣浮軸承320、六支撐架330、一研磨平台340及一旋轉支架350,座體310延 伸設於機體100之承載部110上,座體310中間具有一中心孔311。六氣浮軸承320圍繞中心孔311設於座體310。六支撐架330分佈設於氣浮軸承320之間(第3圖其中部分支撐架330被座體310遮掩)。研磨平台340位於氣浮軸承320及支撐架330上,而研磨拋光墊CP位於研磨平台340上。旋轉支架350可移動地穿設於中心孔311並可支撐帶動研磨平台340旋轉。 The air floating polishing seat 300 is disposed on the bearing portion 110 of the body 100. The air floating polishing seat 300 is provided with an abrasive polishing pad CP for simultaneously grinding the two workpieces M. The air floating polishing seat 300 includes a body 310 and six gas. Floating bearing 320, six support frame 330, a grinding platform 340 and a rotating bracket 350, the base body 310 is extended The support body 110 of the body 100 is extended, and a central hole 311 is defined in the middle of the base body 310. The six air bearing 320 is disposed on the base 310 around the center hole 311. Six support frames 330 are distributed between the air bearings 320 (Fig. 3, in which part of the support frames 330 are covered by the base 310). The grinding platform 340 is located on the air bearing 32 and the support frame 330, and the polishing pad CP is located on the grinding platform 340. The rotating bracket 350 is movably disposed through the central hole 311 and can support the rotation of the grinding platform 340.
二研磨拋光頭400設於第一移動平台210,二研磨拋光頭400用以分別固定二被研磨物M。本實施方式所採之研磨拋光頭400可為多孔性陶磁吸盤,且研磨拋光頭400利用真空吸附方式來固定被研磨物M。 The two polishing heads 400 are disposed on the first moving platform 210, and the two polishing heads 400 are used to respectively fix the two objects M to be polished. The lapping and polishing head 400 taken in the present embodiment may be a porous ceramic chuck, and the lapping and polishing head 400 fixes the object M by vacuum adsorption.
研磨量測系統500設於第二移動平台220,研磨量測系統500包含一非接觸式位移計510及一接觸式位移計520。非接觸式位移計510用以於被研磨物M停止研磨時量測被研磨物M之厚度。接觸式位移計520於被研磨物M停止研磨時量測研磨拋光墊CP之工作移除率。在本實施方式中,非接觸式位移計510可為一雷射位移計、一渦電流式位移計、一電容式位移計或一光纖位移計,接觸式位移計520可為一線性差動變壓位移計(LVDT)或一拉線式位移計,前述舉例為可行實施類型,但本發明範圍並不限於此。 The grinding measurement system 500 is disposed on the second moving platform 220. The grinding measurement system 500 includes a non-contact displacement meter 510 and a contact displacement meter 520. The non-contact displacement meter 510 is for measuring the thickness of the workpiece M when the workpiece M stops grinding. The contact displacement meter 520 measures the working removal rate of the polishing pad CP when the workpiece M stops grinding. In the present embodiment, the non-contact displacement meter 510 can be a laser displacement meter, an eddy current displacement meter, a capacitive displacement meter or a fiber displacement meter, and the contact displacement meter 520 can be a linear differential change. A pressure displacement gauge (LVDT) or a pull-type displacement gauge, the foregoing examples are of a possible implementation type, but the scope of the invention is not limited thereto.
修整件600設於第三移動平台230且連接接觸式位移計520,修整件600依據接觸式位移計520所量測之工作移除率對研磨拋光墊CP進行補償修整。 The trimming member 600 is disposed on the third moving platform 230 and connected to the contact displacement meter 520. The trimming member 600 compensates the polishing polishing pad CP according to the working removal rate measured by the contact displacement meter 520.
音圈馬達700設於第一移動平台210上,音圈馬達700作為二研磨拋光頭400致動源,用以提高研磨拋光墊CP之一修整率及工作移除率。 The voice coil motor 700 is disposed on the first moving platform 210, and the voice coil motor 700 serves as an actuating source for the two polishing and polishing heads 400 to improve the trimming rate and the work removal rate of the polishing polishing pad CP.
可撓清洗管800設於第一移動平台210上且位於二研磨拋光頭400之間。 The flexible cleaning tube 800 is disposed on the first moving platform 210 and between the two polishing heads 400.
請參照第4圖、第5圖及第6圖,第4圖及第5圖係繪示第1圖之研磨拋光機100同時進行研磨與修整之示意圖及側視圖。第6圖係繪示第1圖之研磨拋光機100進行量測之示意圖。如第4圖所示,當研磨拋光機100進行研磨時,控制第二移動平台220朝第二軸向Z往下,使二研磨拋光頭400上之被研磨物M碰觸研磨拋光墊CP,由於音圈馬達700具有線性傳動、無振頓推力優點,且研磨平台340底下由設置六氣浮軸承320同時吹出高壓氣體來使其懸浮,更可加強研磨的穩定性並活化研磨製程。如第5圖所示,利用第三移動平台230承載修整件600往第三軸向Y前進至研磨拋光墊CP上方,如此便可同時對兩被研磨物M研磨,且又同時對研磨拋光墊CP修整。在這邊注意的是,二研磨拋光頭400之一距離可對應等於研磨拋光墊CP之一直徑,而修整件600伸出時剛好位於二研磨拋光頭400之間而不互相影響。 Please refer to FIG. 4, FIG. 5 and FIG. 6 . FIG. 4 and FIG. 5 are schematic and side views showing the simultaneous polishing and trimming of the polishing and polishing machine 100 of FIG. 1 . Fig. 6 is a schematic view showing the measurement of the lapping and polishing machine 100 of Fig. 1. As shown in FIG. 4, when the polishing and polishing machine 100 performs grinding, the second moving platform 220 is controlled to face downward in the second axial direction Z, so that the workpiece M on the second polishing polishing head 400 touches the polishing polishing pad CP. Since the voice coil motor 700 has the advantages of linear transmission and no vibrating thrust, and the grinding platform 340 is provided with a six-air floating bearing 320 simultaneously blowing high-pressure gas to suspend it, the grinding stability can be enhanced and the grinding process can be activated. As shown in FIG. 5, the third moving platform 230 carries the trimming member 600 to the third axial direction Y to advance above the polishing polishing pad CP, so that the two workpieces M can be simultaneously polished, and at the same time, the polishing pad is simultaneously polished. CP trimming. It is noted here that one of the two abrasive polishing heads 400 may correspond to a diameter equal to one of the abrasive polishing pads CP, and the trimming member 600 extends just between the two polishing polishing heads 400 without affecting each other.
如第6圖所示,當研磨拋光機100進行量測時,研磨拋光頭400及修整件600已經藉由第一移動平台210及第三移動平台230移動至初始位置。接者,控制第二移動平台220往第一軸向X移動至研磨拋光頭400之下方及研磨拋光墊CP上方,同時利用非接觸式位移計510對研磨拋光頭400上之 被研磨物M量測其厚度,接觸式位移計520則碰觸研磨拋光墊CP以量測其工作移除率並回傳修整件600使其確認修整率。 As shown in FIG. 6, when the lapping and polishing machine 100 performs the measurement, the lapping and polishing head 400 and the trimming member 600 have been moved to the initial position by the first moving platform 210 and the third moving platform 230. Receiving, the second moving platform 220 is moved to the first axial direction X to move under the polishing polishing head 400 and above the polishing polishing pad CP, while the non-contact displacement meter 510 is used to polish the polishing head 400. The thickness of the object to be polished M is measured, and the contact type displacement meter 520 touches the polishing pad CP to measure the work removal rate and returns the trimming member 600 to confirm the dressing rate.
因此,本發明之研磨拋光機具有以下優點: Therefore, the abrasive polishing machine of the present invention has the following advantages:
1.於同一機台上同時具有線上量測、線上清洗及線上修整之多功能。 1. On the same machine, it has the functions of online measurement, online cleaning and online finishing.
2.具有二研磨拋光頭,可在相對研磨拋光墊支直徑範圍內同時對二被研磨物進行研磨。 2. With two abrasive polishing heads, the two objects to be ground can be simultaneously polished in the range of the diameter of the polishing pad.
3.具有音圈馬達以及氣浮軸承,增加研磨的穩定度,可同時提升拋光墊修整率及工作移除率。 3. With voice coil motor and air bearing, increase the stability of grinding, can improve the polishing pad dressing rate and work removal rate.
雖然本發明已以實施方式揭露如上,然其並非用以限定本發明,任何熟習此技藝者,在不脫離本發明之精神和範圍內,當可作各種之更動與潤飾,因此本發明之保護範圍當視後附之申請專利範圍所界定者為準。 Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and the present invention can be modified and modified without departing from the spirit and scope of the present invention. The scope is subject to the definition of the scope of the patent application attached.
100‧‧‧機體 100‧‧‧ body
110‧‧‧承載部 110‧‧‧Loading Department
120‧‧‧延伸部 120‧‧‧Extension
200‧‧‧移動平台系統 200‧‧‧Mobile Platform System
210‧‧‧第一移動平台 210‧‧‧First mobile platform
220‧‧‧第二移動平台 220‧‧‧Second mobile platform
230‧‧‧第三移動平台 230‧‧‧ Third mobile platform
300‧‧‧氣浮研磨座 300‧‧‧Air floating grinding seat
400‧‧‧研磨拋光頭 400‧‧‧Abrasive polishing head
500‧‧‧研磨量測系統 500‧‧‧Grinding measurement system
510‧‧‧非接觸式位移計 510‧‧‧ Non-contact displacement meter
520‧‧‧接觸式位移計 520‧‧‧Contact Displacement Meter
600‧‧‧修整件 600‧‧‧Repair
700‧‧‧音圈馬達 700‧‧‧ voice coil motor
800‧‧‧可撓清洗管 800‧‧‧Flexible cleaning tube
CP‧‧‧研磨拋光墊 CP‧‧‧Abrasive polishing pad
M‧‧‧被研磨物 M‧‧‧Abrased objects
X‧‧‧第一軸向 X‧‧‧first axial direction
Z‧‧‧第二軸向 Z‧‧‧second axial
Y‧‧‧第三軸向 Y‧‧‧third axial
Claims (7)
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TWI602645B (en) * | 2016-12-26 | 2017-10-21 | 台灣積體電路製造股份有限公司 | Thickness reducing apparatus and thickness reducing method |
CN108237468A (en) * | 2016-12-26 | 2018-07-03 | 台湾积体电路制造股份有限公司 | Reduced down in thickness device and reduced down in thickness method |
CN114871941A (en) * | 2022-04-25 | 2022-08-09 | 季华实验室 | Polishing head and polishing machine |
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CN111307437B (en) * | 2020-03-09 | 2021-11-23 | 西南交通大学 | Rotary tribology behavior simulation test bed for realizing vibration decoupling |
CN111307436B (en) * | 2020-03-09 | 2022-01-25 | 西南交通大学 | Reciprocating tribology behavior research test bed for isolating vibration transmission |
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US6196896B1 (en) * | 1997-10-31 | 2001-03-06 | Obsidian, Inc. | Chemical mechanical polisher |
TWI246448B (en) * | 2000-08-31 | 2006-01-01 | Multi Planar Technologies Inc | Chemical mechanical polishing (CMP) head, apparatus, and method and planarized semiconductor wafer produced thereby |
EP1395392A1 (en) * | 2001-06-12 | 2004-03-10 | Nutool, Inc. | Improved method and apparatus for bi-directionally polishing a workpiece |
JP4658182B2 (en) * | 2007-11-28 | 2011-03-23 | 株式会社荏原製作所 | Polishing pad profile measurement method |
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TWI602645B (en) * | 2016-12-26 | 2017-10-21 | 台灣積體電路製造股份有限公司 | Thickness reducing apparatus and thickness reducing method |
CN108237468A (en) * | 2016-12-26 | 2018-07-03 | 台湾积体电路制造股份有限公司 | Reduced down in thickness device and reduced down in thickness method |
CN114871941A (en) * | 2022-04-25 | 2022-08-09 | 季华实验室 | Polishing head and polishing machine |
CN114871941B (en) * | 2022-04-25 | 2024-04-05 | 季华实验室 | Polishing head and polishing machine |
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