TW201623509A - Double-sided adhesive tape, article, and separation method - Google Patents

Double-sided adhesive tape, article, and separation method Download PDF

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TW201623509A
TW201623509A TW104136091A TW104136091A TW201623509A TW 201623509 A TW201623509 A TW 201623509A TW 104136091 A TW104136091 A TW 104136091A TW 104136091 A TW104136091 A TW 104136091A TW 201623509 A TW201623509 A TW 201623509A
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double
layer
adhesive tape
sided adhesive
heat
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TW104136091A
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Chinese (zh)
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TWI669373B (en
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Seiji Akiyama
Akinori Morino
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Dainippon Ink & Chemicals
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)

Abstract

The present invention addresses the problem of providing a double-sided adhesive tape, which is capable of being used for application on an adherend and for affixing two or more adherends and with which easy separation is possible when separating the two or more adherends. The present invention relates to a double-sided adhesive tape characterized in having an adhesive layer, directly or via another intervening layer, on both sides of an easy separation layer containing a binder and heat-expandable microspheres. The present invention also relates to an article characterized in having a configuration in which two or more adherends are bonded using said double-sided adhesive tape.

Description

雙面黏貼膠帶、物品及分離方法Double-sided adhesive tape, articles and separation method

本發明關於一種易拆解性的雙面黏貼膠帶，使用該雙面黏貼膠帶進行向被黏體的貼附、物品間的固定時，經過一定期間後可輕易地解除該貼附、固定；並係關於藉由該雙面黏貼膠帶貼合的2個以上的被黏體的分離方法。The invention relates to a double-sided adhesive tape which is easy to disassemble, and when the double-sided adhesive tape is used for attaching to the adherend and fixing between the articles, the attaching and fixing can be easily released after a certain period of time; A method of separating two or more adherends bonded by the double-sided adhesive tape.

黏貼膠帶，作為加工性優異且接著可靠性高的接合手段，使用於OA設備、IT設備、家電產品、汽車等各產業領域的零件固定用途、零件的臨時固定用途、顯示產品信息的標籤用途等。近年，以保護地球環境的觀點觀之，該等產業領域中舊產品的回收、再利用的要求不斷增長。進行各種產品的回收、再利用時，將用於零件的固定、標籤的黏貼膠帶剝離的作業成為必要，但由於該黏貼膠帶設置於產品中的各處，期望能藉由簡單的除去步驟降低作業成本。Adhesive tape is used as a bonding means with excellent processability and high reliability, and is used for fixing parts of parts in various industrial fields such as OA equipment, IT equipment, home electric appliances, and automobiles, temporary fixing of parts, and labeling of product information. . In recent years, in order to protect the global environment, the requirements for recycling and reuse of old products in these industrial fields have continued to grow. When recycling and recycling various products, it is necessary to separate the fixing of the parts and the adhesive tape of the label. However, since the adhesive tape is provided in various places in the product, it is desirable to reduce the operation by a simple removal step. cost.

作為相對容易剝離的黏貼膠帶，例如，有人揭示了具有接著力不同的2層以上的黏貼層的黏貼構件(參照專利文獻1)。該黏貼膠帶係藉由介隔具有重疊結構的黏貼層的黏貼構件中的弱黏貼層而接合處理被黏體，以實現被黏體的牢固的固著、及以該弱黏貼層作為剝離面的容易的拆解的黏貼構件。 但，該黏貼構件以多層黏貼劑層作為必要的構造，因此存在製造成本高的問題。又，該黏貼構件為藉由弱黏貼層而進行與被黏體的接著的構造，因此於接著力的提高上有限制，且於牢固地固定物品的用途上的展開較困難。 【專利文獻】As an adhesive tape which is relatively easy to peel, for example, an adhesive member having two or more adhesive layers having different adhesion forces has been disclosed (see Patent Document 1). The adhesive tape is bonded to the adherend by a weak adhesive layer in the adhesive member interposing the adhesive layer having the overlapping structure, thereby achieving firm fixation of the adherend and easy peeling of the adhesive layer. Disassembled adhesive components. However, this adhesive member has a multilayer adhesive layer as a necessary structure, and thus has a problem of high manufacturing cost. Further, since the adhesive member is a structure that adheres to the adherend by the weak adhesive layer, there is a limit in the improvement of the adhesion force, and it is difficult to develop the use for firmly fixing the article. [Patent Literature]

[專利文獻1] 日本特開平10－140093號公報[Patent Document 1] Japanese Patent Laid-Open No. Hei 10-140093

[發明所欲解決之課題][Problems to be solved by the invention]

本發明所欲解決之課題為提供一種雙面黏貼膠帶，該雙面黏貼膠帶可用於向被黏體的貼附、2個以上的被黏體的固定，且於將該2個以上的被黏體分離時可簡單地拆解。  [解決課題之手段]The problem to be solved by the present invention is to provide a double-sided adhesive tape which can be used for attaching to a adherend, fixing two or more adherends, and sticking the two or more adhesives. It can be easily disassembled when the body is separated. [Means for solving the problem]

本發明係關於一種雙面黏貼膠帶，其特徵在於：於含有黏結劑及熱膨脹性微球之易拆解層之兩面直接或介隔其他層而具有黏貼劑層。The present invention relates to a double-sided adhesive tape characterized by having an adhesive layer directly or in addition to other layers on both sides of a easily disassemblable layer containing a binder and heat-expandable microspheres.

又，本發明係關於一種物品，其特徵在於：具有2個以上之被黏體藉由上述雙面黏貼膠帶接著而形成之構造。Further, the present invention relates to an article characterized in that it has a structure in which two or more adherends are formed by the double-sided adhesive tape.

又，本發明係關於一種分離方法，該分離方法藉由將構成上述物品之上述易拆解層加熱，使上述熱膨脹性微球膨脹，藉此分離構成該物品之2個以上之被黏體。 [發明之效果]Moreover, the present invention relates to a separation method for separating two or more adherends constituting the article by heating the above-described easily disassemblable layer constituting the article to expand the heat-expandable microsphere. [Effects of the Invention]

本發明之雙面黏貼膠帶，可貼附至被黏體，且可牢固地貼合2個以上的被黏體，於消除該被黏體彼此的貼合而藉此拆解上述物品時，藉由加熱可簡單地分離該2個以上的被黏體。The double-sided adhesive tape of the present invention can be attached to the adherend, and can firmly bond two or more adherends, thereby eliminating the adhesion of the adherends and thereby disassembling the articles. The two or more adherends can be easily separated by heating.

根據本發明之雙面黏貼膠帶之製造方法，可製造本發明之雙面黏貼膠帶。According to the method for producing a double-sided adhesive tape of the present invention, the double-sided adhesive tape of the present invention can be produced.

根據本發明之分離方法，可簡單地分離被黏體彼此的貼合。According to the separation method of the present invention, the adhesion of the adherends to each other can be easily separated.

《雙面黏貼膠帶》 本發明之雙面黏貼膠帶，其特徵在於：於含有黏結劑及熱膨脹性微球之易拆解層之兩面直接或介隔其他層而具有黏貼劑層。"Double-Sided Adhesive Tape" The double-sided adhesive tape of the present invention is characterized in that it has an adhesive layer directly or in addition to other layers on both sides of the easily disassemblable layer containing the binder and the heat-expandable microspheres.

以下，對本發明之雙面黏貼膠帶之實施方式之一例進行說明。Hereinafter, an example of an embodiment of the double-sided adhesive tape of the present invention will be described.

＜第1實施方式＞ 圖1係根據本發明之雙面黏貼膠帶之實施方式之一例。雙面黏貼膠帶1，於含有黏結劑11及熱膨脹性微球12之易拆解層10之兩面側，具有黏貼劑層20，21。於黏貼劑層20，21上，可分別層疊剝離片30，31。<First Embodiment> Fig. 1 is an example of an embodiment of a double-sided adhesive tape according to the present invention. The double-sided adhesive tape 1 has adhesive layers 20, 21 on both sides of the easy-to-disassemble layer 10 containing the adhesive 11 and the heat-expandable microspheres 12. The release sheets 30, 31 may be laminated on the adhesive layers 20, 21, respectively.

以下，對雙面黏貼膠帶之各構造進行說明。 [易拆解層] 易拆解層10，含有黏結劑11及熱膨脹性微球12。易拆解層，係於將藉由雙面黏貼膠帶貼合的2個以上的被黏體分離時，由於將被黏體彼此分離等的剝離應力而破壞的層。Hereinafter, each structure of the double-sided adhesive tape will be described. [Easy-Removable Layer] The easily disassemblable layer 10 contains a binder 11 and heat-expandable microspheres 12. The easy-to-disassemble layer is a layer that is broken by peeling stress such as separation of adherends from each other when two or more adherends bonded by a double-sided adhesive tape are separated.

上述黏結劑，可使用因上述熱膨脹性微球膨脹(所產生)的力而可輕易地拆解的物質。又，該黏結劑使用熱塑性者較佳。此處，熱塑性係指該黏結劑之於1Hz及23℃之以動態黏彈性譜測定之儲存彈性模量G23 為1.0×103 ～5.0×107 Pa之範圍，於1Hz及120℃之以動態黏彈性譜測定之儲存彈性模量G120 為1.0×102 ～5.0×106 Pa之範圍。As the above-mentioned binder, a substance which can be easily disassembled by the force of expansion (produced) of the above-mentioned heat-expandable microspheres can be used. Further, it is preferred that the binder be made of a thermoplastic. Here, thermoplastic means that the storage elastic modulus G 23 measured by dynamic viscoelasticity at 1 Hz and 23 ° C is in the range of 1.0 × 10 3 to 5.0 × 10 7 Pa at 1 Hz and 120 ° C. The storage elastic modulus G 120 measured by the dynamic viscoelastic spectrum is in the range of 1.0 × 10 2 to 5.0 × 10 6 Pa.

通常狀態下，在藉由本發明之雙面黏貼膠帶使被黏體彼此牢固地接著方面，使用構成易拆解層之黏結劑之於1Hz及23℃之以動態黏彈性譜測定之儲存彈性模量G23 為1.0×103 ～5.0×107 Pa者較佳，使用為5.0×103 ～5.0×106 Pa者更佳，使用為5.0×103 ～1.0×106 Pa者尤佳，使用為1.0×104 ～1.0×106 Pa者特佳。In the normal state, in the case where the adherends are firmly adhered to each other by the double-sided adhesive tape of the present invention, the storage elastic modulus measured by dynamic viscoelasticity at 1 Hz and 23 ° C using the adhesive constituting the easily disassemblable layer is used. G 23 is preferably 1.0 × 10 3 to 5.0 × 10 7 Pa, more preferably 5.0 × 10 3 to 5.0 × 10 6 Pa, and particularly preferably 5.0 × 10 3 to 1.0 × 10 6 Pa. It is particularly good for 1.0 × 10 4 to 1.0 × 10 6 Pa.

又，在藉由加熱將被黏體彼此輕易地分離方面，使用構成易拆解層之黏結劑之於1Hz及120℃之以動態黏彈性譜測定之儲存彈性模量G120 為1.0×102 ～5.0×106 Pa者較佳，使用為5.0×102 ～1.0×106 Pa者更佳，使用為5.0×102 ～5.0×105 Pa者尤佳。Further, in terms of easily separating the adherends from each other by heating, the storage elastic modulus G 120 measured by dynamic viscoelasticity at 1 Hz and 120 ° C using a binder constituting the easily disassemblable layer was 1.0 × 10 2 It is preferably from 5.0 to 10 6 Pa, more preferably from 5.0 × 10 2 to 1.0 × 10 6 Pa, and particularly preferably from 5.0 × 10 2 to 5.0 × 10 5 Pa.

易拆解層之黏結劑之上述儲存彈性模量G120 ，宜比上述儲存彈性模量G23 小較佳。The storage elastic modulus G 120 of the adhesive of the easily disassemblable layer is preferably smaller than the above storage elastic modulus G 23 .

上述儲存彈性模量G23 及G120 ，係指對使用構成易拆解層的黏結劑而形成的試驗片進行測定的結果。該試驗片中不含熱膨脹性微球。試驗片的厚度為2mm。試驗片可藉由將易拆解層中所含有的黏結劑塗布於片材上等而得到。The storage elastic moduli G 23 and G 120 are the results of measurement of a test piece formed using a binder constituting the easily disassemblable layer. The test piece contained no heat-expandable microspheres. The thickness of the test piece was 2 mm. The test piece can be obtained by applying a binder contained in the easily disassemblable layer to a sheet or the like.

儲存彈性模量G23 及G120 ，可使用市售的黏彈性試驗機，利用後述實施例中所記載的方法進行測定。The storage elastic moduli G 23 and G 120 can be measured by a method described in the examples below using a commercially available viscoelasticity tester.

上述易拆解層的厚度為5μm～80μm較佳，5μm～60μm更佳，10μm～50μm尤佳。易拆解層的厚度，係測定在易拆解層的厚度方向隨機選出的5個地方的厚度而得到的平均值。易拆解層的厚度藉由為上述範圍，可成為層的形成容易且易拆解性優異的易拆解層。The thickness of the above-mentioned easily disassemblable layer is preferably 5 μm to 80 μm, more preferably 5 μm to 60 μm, and particularly preferably 10 μm to 50 μm. The thickness of the easily disassemblable layer is an average value obtained by measuring the thicknesses of five places randomly selected in the thickness direction of the easily disassemblable layer. The thickness of the easily disassemblable layer is in the above range, and the layer can be easily formed and easily disassembled.

上述易拆解層中所含有的上述黏結劑例如使用熱塑性樹脂時，易因熱而軟化且易拆解故為較佳。When the above-mentioned binder contained in the above-mentioned easily disassemblable layer is, for example, a thermoplastic resin, it is easy to be softened by heat and easily disassembled, which is preferable.

上述熱塑性樹脂，例如可列舉聚胺脂(PU)、熱塑性聚胺脂(TPU)等胺甲酸乙酯系樹脂；聚碳酸酯(PC)；聚氯乙烯(PVC)、氯乙烯－乙酸乙烯酯共聚物樹脂等氯乙烯系樹脂；聚丙烯酸、聚甲基丙烯酸、聚丙烯酸甲酯、聚甲基丙烯酸甲酯(PMMA)、聚甲基丙烯酸乙酯等丙烯酸系樹脂；聚對苯二甲酸乙二醇酯(PET)、聚對苯二甲酸丁二醇酯、聚對苯二甲酸丙二醇酯、聚萘二甲酸乙二醇酯、聚萘二甲酸丁二醇酯等聚酯系樹脂；尼龍(註冊商標)等聚醯胺系樹脂；聚苯乙烯(PS)、醯亞胺改性聚苯乙烯、丙烯腈・丁二烯・苯乙烯(ABS)樹脂、醯亞胺改性ABS樹脂、苯乙烯・丙烯腈共聚物(SAN)樹脂、丙烯腈・乙烯 －丙烯－二烯・苯乙烯(AES)樹脂等聚苯乙烯系樹脂；聚乙烯(PE)樹脂、聚丙烯(PP)樹脂、環烯烴樹脂等烯烴系樹脂；硝化纖維素、乙酸纖維素等纖維素系樹脂；矽氧系樹脂；氟系樹脂等熱塑性樹脂，苯乙烯系熱塑性彈性體、烯烴系熱塑性彈性體、氯乙烯系熱塑性彈性體、胺甲酸乙酯系熱塑性彈性體、酯系熱塑性彈性體、醯胺系熱塑性彈性體等熱塑性彈性體。Examples of the thermoplastic resin include urethane-based resins such as polyurethane (PU) and thermoplastic polyurethane (TPU); polycarbonate (PC); polyvinyl chloride (PVC) and vinyl chloride-vinyl acetate copolymerization. Vinyl chloride resin such as resin; acrylic resin such as polyacrylic acid, polymethacrylic acid, polymethyl acrylate, polymethyl methacrylate (PMMA) or polyethyl methacrylate; polyethylene terephthalate Polyester resin such as ester (PET), polybutylene terephthalate, polytrimethylene terephthalate, polyethylene naphthalate or polybutylene naphthalate; nylon (registered trademark Polyamide type resin; polystyrene (PS), yttrium imide modified polystyrene, acrylonitrile, butadiene, styrene (ABS) resin, yttrium imide modified ABS resin, styrene/propylene Polystyrene resin such as nitrile copolymer (SAN) resin, acrylonitrile, ethylene-propylene-diene/styrene (AES) resin, olefin such as polyethylene (PE) resin, polypropylene (PP) resin or cycloolefin resin Resin; cellulose resin such as nitrocellulose or cellulose acetate; oxime resin; fluoro resin The thermoplastic resin of the thermoplastic elastomer, a styrene based thermoplastic elastomer, olefin thermoplastic elastomer, vinyl chloride thermoplastic elastomer, an amine-based urethane thermoplastic elastomers, ester-based thermoplastic elastomer, acyl amine-based thermoplastic elastomer.

就熱塑性樹脂而言，上述該等中特別是使用苯乙烯系熱塑性彈性體、烯烴系熱塑性彈性體、氯乙烯系熱塑性彈性體、酯系熱塑性彈性體、胺甲酸乙酯系熱塑性彈性體、醯胺系熱塑性彈性體或丙烯酸系樹脂等較佳，使用苯乙烯系熱塑性彈性體或丙烯酸系樹脂特佳。In the above-mentioned thermoplastic resin, a styrene-based thermoplastic elastomer, an olefin-based thermoplastic elastomer, a vinyl chloride-based thermoplastic elastomer, an ester-based thermoplastic elastomer, an urethane-based thermoplastic elastomer, or a guanamine is used. It is preferably a thermoplastic elastomer or an acrylic resin, and a styrene-based thermoplastic elastomer or an acrylic resin is particularly preferable.

作為苯乙烯系熱塑性彈性體，例如，可列舉苯乙烯－乙烯－丁烯共聚物(SEB)等苯乙烯系二嵌段共聚物；苯乙烯－丁二烯－苯乙烯共聚物(SBS)、SBS的氫化物(苯乙烯－乙烯－丁烯－苯乙烯共聚物(SEBS))、苯乙烯－異戊二烯－苯乙烯共聚物(SIS)、SIS的氫化物(苯乙烯－乙烯－丙烯－苯乙烯共聚物(SEPS))、苯乙烯－異丁烯－苯乙烯共聚物(SIBS)等苯乙烯系三嵌段共聚物；苯乙烯－丁二烯－苯乙烯－丁二烯(SBSB)等苯乙烯系四嵌段共聚物；苯乙烯－丁二烯－苯乙烯－丁二烯－苯乙烯(SBSBS)等苯乙烯系五嵌段共聚物；具有該等以上的重複單元的苯乙烯系多嵌段共聚物；將苯乙烯－丁二烯橡膠(SBR)等苯乙烯系無規共聚物的乙烯性雙鍵氫化後的氫化物等。苯乙烯系熱塑性彈性體亦可使用市售品。Examples of the styrene-based thermoplastic elastomer include styrene-based diblock copolymers such as styrene-ethylene-butylene copolymer (SEB); styrene-butadiene-styrene copolymer (SBS) and SBS. Hydride (styrene-ethylene-butylene-styrene copolymer (SEBS)), styrene-isoprene-styrene copolymer (SIS), hydride of SIS (styrene-ethylene-propylene-benzene) Styrene-based triblock copolymers such as ethylene copolymer (SEPS), styrene-isobutylene-styrene copolymer (SIBS), and styrene-butadiene-styrene-butadiene (SBSB) Tetrablock copolymer; styrene-based pentablock copolymer such as styrene-butadiene-styrene-butadiene-styrene (SBSBS); styrenic multi-block copolymer having repeating units of the above A hydrogenated product obtained by hydrogenating a vinyl double bond of a styrene-based random copolymer such as styrene-butadiene rubber (SBR). A commercially available product can also be used for the styrene thermoplastic elastomer.

就上述苯乙烯系熱塑性彈性體而言，使用上述苯乙烯系三嵌段共聚物及苯乙烯系二嵌段共聚物的混合物的話，具有上述於23℃的儲存彈性模量與上述於120℃的儲存彈性模量、及該於23℃的儲存彈性模量除以於120℃測定的儲存彈性模量的值，其結果為，在得到於約23℃的常溫範圍下2個以上的被黏體可牢固地貼合，且藉由加熱至約120℃可輕易地分離2個以上的被黏體的黏貼膠帶方面較佳，使用相對於該苯乙烯系熱塑性彈性體全體，該苯乙烯系二嵌段共聚物之含量為10質量%～90質量%之範圍者更佳，以15質量%～80質量%之範圍使用尤佳，以20質量%～75質量%之範圍使用特佳。When the styrene-based thermoplastic elastomer is a mixture of the styrene-based triblock copolymer and the styrene-based diblock copolymer, the storage elastic modulus at 23 ° C and the above-mentioned temperature at 120 ° C are used. The storage elastic modulus and the storage elastic modulus at 23 ° C were divided by the value of the storage elastic modulus measured at 120 ° C, and as a result, two or more adherends were obtained at a normal temperature range of about 23 ° C. It is preferable that it can be firmly bonded, and it is preferable to easily separate two or more adherend adhesive tapes by heating to about 120 ° C, and the styrene-based two-in-one is used with respect to the entire styrene-based thermoplastic elastomer. The content of the segment copolymer is preferably in the range of 10% by mass to 90% by mass, particularly preferably in the range of 15% by mass to 80% by mass, and particularly preferably in the range of 20% by mass to 75% by mass.

就上述苯乙烯系熱塑性彈性體而言，在使加熱所致之拆解性更為提高方面，使用具有1萬～80萬之範圍之重量平均分子量者較佳，使用具有5萬～50萬之範圍之重量平均分子量者更佳，使用具有15萬～45萬之範圍之重量平均分子量者尤佳。In the styrene-based thermoplastic elastomer, it is preferable to use a weight average molecular weight in the range of 10,000 to 800,000, and to use 50,000 to 500,000, in terms of improving the disintegration property by heating. The weight average molecular weight of the range is more preferably, and it is particularly preferable to use a weight average molecular weight in the range of 150,000 to 450,000.

上述丙烯酸系樹脂，例如，可使用由含有(甲基)丙烯酸烷基酯的單體聚合而得到的物質。As the acrylic resin, for example, a material obtained by polymerizing a monomer containing an alkyl (meth)acrylate can be used.

就上述 (甲基)丙烯酸烷基酯而言，使用具有碳原子數4～12的烷基的(甲基)丙烯酸酯較佳，具體而言，使用(甲基)丙烯酸丁酯、(甲基)丙烯酸異辛酯、(甲基)丙烯酸2－乙基己酯等較佳，丙烯酸丁酯及丙烯酸2－乙基己酯單獨或組合使用更佳。In the above (meth)acrylic acid alkyl ester, it is preferred to use a (meth) acrylate having an alkyl group having 4 to 12 carbon atoms, specifically, butyl (meth) acrylate, (methyl) As the isooctyl acrylate, 2-ethylhexyl (meth)acrylate, etc., butyl acrylate and 2-ethylhexyl acrylate are preferably used singly or in combination.

又，上述單體除上述物質以外，可使用丙烯腈、(甲基)丙烯酸、馬來酸酐、丙烯醯胺、衣康酸、苯乙烯、乙酸乙烯酯等。Further, in addition to the above, the above monomers may be acrylonitrile, (meth)acrylic acid, maleic anhydride, acrylamide, itaconic acid, styrene or vinyl acetate.

上述易拆解層中所含有的熱膨脹性微球，係能因熱的影響而膨脹者。具體而言，該熱膨脹性微球宜使用於120℃的熱膨脹率為150%以上者較佳，使用於120℃的熱膨脹率為170%以上者更佳，使用於120℃的熱膨脹率為200%以上者尤佳，使用於120℃的熱膨脹率為220%以上者特佳，使用250%以上者時，可輕易地拆解易拆解層，其結果為可輕易地進行被黏體彼此的分離因而為特佳。又，該膨脹率的上限並無特別限制，為大概5000%較佳。此外，該熱膨脹率係指利用以下的方法算出的值。The heat-expandable microspheres contained in the above-mentioned easily disassemblable layer are capable of expanding due to the influence of heat. Specifically, the heat-expandable microspheres are preferably used at a thermal expansion coefficient of 120% or more at 120 ° C, more preferably 170% or more, and a thermal expansion coefficient of 120% at 120 ° C. It is particularly preferable that the thermal expansion coefficient at 120 ° C is particularly preferably 220% or more, and when the temperature is 250% or more, the easily disassemblable layer can be easily disassembled, and as a result, the separation of the adherends can be easily performed. Therefore, it is especially good. Further, the upper limit of the expansion ratio is not particularly limited, and is preferably about 5,000%. Further, the coefficient of thermal expansion refers to a value calculated by the following method.

首先，將熱膨脹性微球(未膨脹者)1g置於量瓶中，利用水中置換法測定真比重。然後，將該熱膨脹性微球1g置於吉爾式烘箱(geer type oven)中，於120℃下加熱2分鐘使其膨脹。First, 1 g of heat-expandable microspheres (unexpanded) was placed in a measuring flask, and the true specific gravity was measured by a water displacement method. Then, 1 g of the heat-expandable microspheres was placed in a geer type oven, and heated at 120 ° C for 2 minutes to be expanded.

然後，將膨脹後的微球置於量瓶中，利用水中置換法測定真比重。Then, the expanded microspheres were placed in a measuring flask, and the true specific gravity was measured by a water displacement method.

算出膨脹前的熱膨脹性微球的真比重相對於熱膨脹後的微球的真比重的比率，將其乘以100得到的值作為熱膨脹率。The ratio of the true specific gravity of the heat-expandable microspheres before expansion to the true specific gravity of the microspheres after thermal expansion was calculated, and the value obtained by multiplying it by 100 was made into the thermal expansion ratio.

上述熱膨脹性微球的膨脹開始溫度並無特別限制，為80℃以上較佳，85℃～120℃更佳，為90℃～120℃時，形成易拆解層時不會發生膨脹，且不會引起2個以上的被黏體的熱損傷，在將該等2個以上的被黏體分離方面尤佳。此外，該「熱膨脹性微球的膨脹開始溫度」，係使用熱分析儀(「TMA/SS6100」、SII・Nanotechnology Inc.製)，利用膨脹法(荷重：0.1N、探頭：3mmΦ、升溫速度：5℃/分)對熱膨脹性微球進行評價時的，熱膨脹性微球的膨脹開始時 的溫度。The expansion start temperature of the heat-expandable microspheres is not particularly limited, and is preferably 80 ° C or higher, more preferably 85 ° C to 120 ° C, and 90 ° C to 120 ° C. When the easy-to-disassemble layer is formed, expansion does not occur, and Thermal damage of two or more adherends is caused, and it is particularly preferable to separate the two or more adherends. In addition, the "expansion start temperature of the heat-expandable microspheres" is a thermal analyzer ("TMA/SS6100", manufactured by SII, Nanotechnology Inc.), and the expansion method (load: 0.1 N, probe: 3 mm Φ, temperature increase rate: The temperature at the start of expansion of the heat-expandable microspheres when the heat-expandable microspheres were evaluated at 5 ° C /min.

上述熱膨脹性微球的最大膨脹溫度並無特別限制，為90℃以上較佳，90℃～180℃更佳，為100℃以上～150℃時，不會引起2個以上的被黏體的熱損傷，在將該等2個以上的被黏體分離方面尤佳。此外，該「最大膨脹溫度」，係使用熱分析儀(「TMA/SS6100」、SII・Nanotechnology Inc.製)，利用膨脹法(荷重：0.1N、探頭：3mmΦ、升溫速度：5℃/分)對熱膨脹性微球進行評價時的，熱膨脹性微球的膨脹為最大時的溫度。此外，加熱至比最大膨脹溫度更高的溫度的熱膨脹性微球，通常會產生收縮且膨脹率降低，因此不要加熱至比上述最大膨脹溫度更高的溫度較佳。The maximum expansion temperature of the heat-expandable microspheres is not particularly limited, and is preferably 90° C. or higher, more preferably 90° C. to 180° C., and 100° C. to 150° C. does not cause heat of two or more adherends. Damage is particularly preferable in separating the two or more adherends. In addition, the "maximum expansion temperature" is a thermal analyzer ("TMA/SS6100", manufactured by SII, Nanotechnology Inc.), and the expansion method (load: 0.1 N, probe: 3 mm Φ, temperature increase rate: 5 ° C / min) When the heat-expandable microspheres were evaluated, the expansion of the heat-expandable microspheres was the maximum temperature. Further, the heat-expandable microspheres heated to a temperature higher than the maximum expansion temperature generally shrink and the expansion ratio is lowered, so that it is preferable not to heat to a temperature higher than the above-mentioned maximum expansion temperature.

此外，製造上述熱膨脹性微球時，其製造中所使用的膠囊的壁厚、氣化物質的含量等難以全部均勻化，因此其膨脹開始溫度及最大膨脹溫度通常具有一定的範圍。Further, when the above-mentioned heat-expandable microspheres are produced, it is difficult to uniformly homogenize the thickness of the capsule used in the production and the content of the vaporized substance, and therefore the expansion start temperature and the maximum expansion temperature generally have a certain range.

上述熱膨脹性微球的粒徑(膨脹前)並無特別限制，在進一步提高加熱後的易拆解層的拆解性，且實現易拆解層及雙面黏貼膠帶的薄型化方面，為1μm～50μm之範圍內較佳，3μm～30μm之範圍內更佳，5μm～20μm之範圍內尤佳。The particle size (before expansion) of the heat-expandable microspheres is not particularly limited, and the disassembly property of the easily disassemblable layer after heating is further improved, and the thickness of the easily disassemblable layer and the double-sided adhesive tape is reduced to 1 μm. It is preferably in the range of ～50 μm, more preferably in the range of 3 μm to 30 μm, and particularly preferably in the range of 5 μm to 20 μm.

此外，上述熱膨脹性微球，通常為具有不同粒徑等的微球的集合。因此，測定該熱膨脹性微球的粒徑時，會得到一個分布(粒度分布)。本發明中，該熱膨脹性微球的粒徑(膨脹前)，係使用Malvern Instruments製粒度分布測定儀「Mastersizer 2000」利用雷射繞射散射法進行10次測定而得到的基於10個粒度分布之10點之極大值的最大值與最小值以範圍來表示。具體而言，熱膨脹性微球的粒徑(膨脹前)，基於使用上述方法進行10次測定而得到之10個粒度分布之10點之極大值的最大值為15μm，其最小值為9μm時，該熱膨脹性微球的粒徑(膨脹前)表示為9μm～15μm。Further, the above-mentioned heat-expandable microspheres are usually a collection of microspheres having different particle diameters and the like. Therefore, when the particle diameter of the heat-expandable microspheres is measured, a distribution (particle size distribution) is obtained. In the present invention, the particle size (before expansion) of the heat-expandable microspheres is based on 10 particle size distributions obtained by laser diffraction scattering method using a particle size distribution analyzer "Mastersizer 2000" manufactured by Malvern Instruments. The maximum and minimum values of the maximum of 10 points are expressed in terms of ranges. Specifically, the particle diameter (before expansion) of the heat-expandable microspheres is 15 μm at a maximum value of 10 points of 10 particle size distributions obtained by measuring 10 times using the above method, and the minimum value is 9 μm. The particle diameter (before expansion) of the heat-expandable microspheres is represented by 9 μm to 15 μm.

上述熱膨脹性微球，例如可使用於具有彈性的膠囊內含有因熱而氣化之物質者。The above-mentioned heat-expandable microspheres can be used, for example, in a capsule having elasticity, which contains a substance vaporized by heat.

上述因熱而氣化之物質，使用藉由加熱至80℃～150℃左右而氣化的物質較佳，具體而言使用丁烷、異丁烷、丙烷、異戊烷、異辛烷等較佳。The substance which is vaporized by heat is preferably a material which is vaporized by heating to about 80 ° C to 150 ° C, and specifically, butane, isobutane, propane, isopentane, isooctane, etc. are used. good.

上述具有彈性的膠囊，例如可使用由藉由加熱至90℃～150℃左右而軟化的物質所構成者，具體而言可列舉由偏二氯乙烯－丙烯腈共聚物、聚乙烯醇、聚乙烯醇縮丁醛、聚甲基丙烯酸甲酯、聚丙烯腈、聚偏二氯乙烯、聚碸等所構成的膠囊狀物。The capsule having elasticity may be, for example, a material which is softened by heating to about 90 ° C to 150 ° C, and specifically, a vinylidene chloride-acrylonitrile copolymer, polyvinyl alcohol, or polyethylene may be used. A capsule composed of butyral, polymethyl methacrylate, polyacrylonitrile, polyvinylidene chloride, polyfluorene or the like.

上述熱膨脹性微球，例如可使用凝聚法(Coacervation method)、界面聚合法等公知慣用的方法進行製造。The heat-expandable microspheres can be produced, for example, by a known method such as a coacervation method or an interfacial polymerization method.

上述熱膨脹性微球，例如，亦可使用「Matsumoto microsphere」(商品名，松本油脂製藥(股)製)、「Microsphere Expancel」(商品名，Japan Fillite co., ltd.製)、「DAIFOAM」(商品名，大日精化工業(股)製)等市售品。For the heat-expandable microspheres, for example, "Matsumoto microsphere" (trade name, manufactured by Matsumoto Oil & Fats Co., Ltd.), "Microsphere Expancel" (trade name, manufactured by Japan Fillite Co., Ltd.), "DAIFOAM" ("DAIFOAM") Commercial name, such as the trade name, Dairi Seiki Co., Ltd.).

上述熱膨脹性微球之含量(調配量)，在能兼顧與黏貼劑層的良好的黏著性及易拆解性方面，相對於上述易拆解層中所含有的上述黏結劑100重量份宜為1質量份～100質量份較佳，3質量份～50質量份更佳，5質量份～30質量份尤佳。The content (adjusted amount) of the heat-expandable microspheres is preferably 100 parts by weight based on 100 parts by weight of the above-mentioned adhesive agent contained in the easily disassemblable layer in terms of achieving good adhesion to the adhesive layer and easy disintegration. It is preferably from 1 part by mass to 100 parts by mass, more preferably from 3 parts by mass to 50 parts by mass, even more preferably from 5 parts by mass to 30 parts by mass.

[黏貼劑層] 黏貼劑層20，21係與被黏體接著的層。構成黏貼劑層20，21的黏貼劑，可使用含有天然橡膠系聚合物、合成橡膠系聚合物、丙烯酸系聚合物、矽氧系聚合物、胺甲酸乙酯系聚合物、乙烯醚系聚合物等的物質。該黏貼劑的形態，可列舉溶劑系；乳液型黏貼劑、水溶性黏貼劑等水系；熱熔型黏貼劑、UV硬化型黏貼劑、EB硬化型黏貼劑等無溶劑系等。[Adhesive layer] The adhesive layer 20, 21 is a layer which is adhered to the adherend. The adhesive agent constituting the adhesive layer 20, 21 may be a natural rubber-based polymer, a synthetic rubber-based polymer, an acrylic polymer, a siloxane polymer, an urethane polymer, or a vinyl ether polymer. Etc. Examples of the form of the adhesive include a solvent system, an emulsion type adhesive, a water-soluble adhesive, and the like, and a solvent-free system such as a hot-melt adhesive, a UV-curable adhesive, or an EB-curable adhesive.

上述黏貼劑層20，21含有丙烯酸系共聚物較佳。丙烯酸系共聚物，為具有親水性的(甲基)丙烯酸與可與其共聚的其他單體的共聚物，可列舉使(甲基)丙烯酸與乙烯醚反應而得到的(甲基)丙烯酸酯等。The adhesive layer 20, 21 preferably contains an acrylic copolymer. The acrylic copolymer is a copolymer of a hydrophilic (meth)acrylic acid and another monomer copolymerizable therewith, and examples thereof include (meth)acrylate obtained by reacting (meth)acrylic acid with vinyl ether.

黏貼劑層的厚度為5μm～100μm較佳，10μm～80μm更佳，30μm～70μm尤佳。黏貼劑層的厚度為上述範圍時，層的形成容易，且被黏體彼此的接著性亦優異因而較佳。The thickness of the adhesive layer is preferably 5 μm to 100 μm, more preferably 10 μm to 80 μm, and particularly preferably 30 μm to 70 μm. When the thickness of the adhesive layer is in the above range, the formation of the layer is easy, and the adhesion between the adherends is also excellent, which is preferable.

黏貼劑層20，21，必要時亦可含有增黏樹脂、交聯劑、其他添加劑等。The adhesive layer 20, 21 may also contain a tackifying resin, a crosslinking agent, other additives, etc., if necessary.

上述增黏樹脂，以調節黏貼劑層的強接著性為目的，例如，可例示松香系增黏樹脂、聚合松香系增黏樹脂、聚合松香酯系增黏樹脂、松香酚系增黏樹脂、穩定化松香酯增黏樹脂、歧化松香酯增黏樹脂、萜烯系增黏樹脂、萜烯酚系增黏樹脂、石油樹脂系增黏樹脂等。The tackifying resin is for the purpose of adjusting the strong adhesion of the adhesive layer. For example, a rosin-based tackifying resin, a polymerized rosin-based tackifying resin, a polymerized rosin ester-based tackifying resin, a rosin-based tackifying resin, and a stabilization can be exemplified. A rosin ester tackifying resin, a disproportionated rosin ester tackifying resin, a terpene tackifying resin, a terpene phenol tackifying resin, a petroleum resin tackifying resin, and the like.

上述交聯劑，以提高黏貼劑層的內聚力為目的，可使用公知的異氰酸酯系交聯劑、環氧系交聯劑、氮丙啶系交聯劑、多價金屬鹽系交聯劑、金屬螯合物系交聯劑、酮・醯肼系交聯劑、噁唑啉系交聯劑、碳二亞胺系交聯劑、矽烷系交聯劑、縮水甘油(烷氧基)環氧矽烷系交聯劑等。The above-mentioned crosslinking agent may be a known isocyanate crosslinking agent, an epoxy crosslinking agent, an aziridine crosslinking agent, a polyvalent metal salt crosslinking agent, or a metal for the purpose of improving the cohesive force of the adhesive layer. Chelate crosslinking agent, ketone/antimony crosslinking agent, oxazoline crosslinking agent, carbodiimide crosslinking agent, decane crosslinking agent, glycidyl (alkoxy) epoxy decane A crosslinking agent or the like.

上述添加劑，在不損害本發明所期望的效果的範圍內，必要時可於黏貼劑中任意添加為調節pH的鹼(氨水等)或酸、發泡劑、增塑劑、軟化劑、抗氧化劑、玻璃或塑膠製的纖維・氣球・珠粒・金屬粉末等填充劑、顏料・染料等著色劑、pH調節劑、成膜助劑、流平劑、增稠劑、防水劑、消泡劑等公知的物質。又，亦可添加酸觸媒、產酸劑。The above-mentioned additives may be arbitrarily added as a pH-adjusting alkali (ammonia water or the like) or an acid, a foaming agent, a plasticizer, a softener, or an antioxidant in a range which does not impair the desired effect of the present invention. , glass or plastic fiber, balloon, bead, filler such as metal powder, colorant such as pigment and dye, pH adjuster, filming aid, leveling agent, thickener, water repellent, defoamer, etc. A well-known substance. Further, an acid catalyst or an acid generator may be added.

上述酸觸媒、產酸劑，例如可以藉由光、熱的外部刺激而產生拆解性為目的而使用。該酸觸媒、產酸劑，可使用與作為上述易拆解層中可使用者所例示的物質同樣的物質。The acid catalyst and the acid generator can be used, for example, for the purpose of causing disintegration by external stimulation of light or heat. As the acid catalyst or the acid generator, the same ones as those exemplified as the user can be used as the above-mentioned easily disassemblable layer.

於上述黏貼劑層的形成中可使用的上述黏貼劑，在保持良好的塗布加工性等方面，可使用含有溶劑者。該溶劑，例如，可使用甲苯、二甲苯、乙酸乙酯、乙酸丁酯、丙酮、甲乙酮、己烷等。又，使用水系黏貼劑作為該黏貼劑時，可使用水、或以水為主體的水性溶劑作為該溶劑。The above-mentioned adhesive which can be used for the formation of the above-mentioned adhesive layer can be used as a solvent, in order to maintain good coating processability and the like. As the solvent, for example, toluene, xylene, ethyl acetate, butyl acetate, acetone, methyl ethyl ketone, hexane or the like can be used. Further, when a water-based adhesive is used as the adhesive, water or an aqueous solvent mainly composed of water can be used as the solvent.

就剝離片30及31而言，例如，可列舉玻璃紙、牛皮紙、黏土塗布紙、將聚乙烯等的膜層壓而形成的紙、塗布聚乙烯醇或丙烯酸酯共聚物等樹脂的紙、於聚酯或聚丙烯等合成樹脂膜等上塗布係剝離劑的氟樹脂或矽氧樹脂等而形成的紙等。Examples of the release sheets 30 and 31 include, for example, cellophane, kraft paper, clay coated paper, paper formed by laminating a film such as polyethylene, and paper coated with a resin such as polyvinyl alcohol or an acrylate copolymer. A paper or the like formed by applying a fluororesin or a silicone resin which is a release agent to a synthetic resin film such as an ester or a polypropylene.

本實施方式之雙面黏貼膠帶所具有的一對黏貼劑層，可分別為相同的構造，亦可分別為不同的構造。The pair of adhesive layers of the double-sided adhesive tape of the present embodiment may have the same structure or may have different configurations.

本實施方式之雙面黏貼膠，由於易拆解層中含有熱膨脹性微球，藉由加熱會發生易拆解層中所含有之黏結劑的軟化，及該熱膨脹性微球的膨脹，其結果為，相較於使用不含有熱膨脹性填充物的易拆解層的情況，用較弱的力即可拆解被黏體彼此的接著。In the double-sided adhesive of the present embodiment, since the heat-expandable microspheres are contained in the easily disassemblable layer, the softening of the binder contained in the easily disassemblable layer and the expansion of the heat-expandable microspheres are caused by heating. In contrast, in the case where a easily disassemblable layer containing no heat-expandable filler is used, the adhesion of the adherends can be disassembled with a weak force.

＜第2實施方式＞ 圖2係根據本發明之雙面黏貼膠帶之實施方式之一例。雙面黏貼膠帶2，於含有黏結劑11及熱膨脹性微球12之易拆解層10之兩面側具有黏貼劑層20，21，於該易拆解層與黏貼劑層之間之兩者具有基底膜40，41。於黏貼劑層20，21上，可分別層疊剝離片30，31。<Second Embodiment> Fig. 2 is an example of an embodiment of a double-sided adhesive tape according to the present invention. The double-sided adhesive tape 2 has an adhesive layer 20, 21 on both sides of the easy-to-disassemble layer 10 containing the adhesive 11 and the heat-expandable microspheres 12, and has two between the easily disassemblable layer and the adhesive layer Base film 40, 41. The release sheets 30, 31 may be laminated on the adhesive layers 20, 21, respectively.

第2實施方式之雙面黏貼膠帶，係上述＜第1實施方式＞之雙面黏貼膠帶於上述易拆解層與上述黏貼劑層之間之兩者進一步具有基底膜40，41者。此外，關於與該＜第1實施方式＞共同的點，其說明將省略。In the double-sided adhesive tape of the second embodiment, the double-sided adhesive tape according to the first embodiment has the base film 40 or 41 between the easy-to-remove layer and the adhesive layer. In addition, about the point which is common with this <1st Embodiment>, description is abbreviate|omitted.

上述基底膜例如可列舉由聚烯烴(例如，聚丙烯、聚乙烯)、聚酯(例如，聚對苯二甲酸乙二醇酯、聚萘二甲酸乙二醇酯)、聚苯乙烯、丙烯腈－丁二烯－苯乙烯樹脂(ABS樹脂)、聚碳酸酯、聚醯亞胺、聚氯乙烯、尼龍、聚乙烯醇等構成的塑膠系膜；使用紙漿、人造絲、馬尼拉麻、丙烯腈、尼龍、聚酯等得到的不織布、紙、布、或金屬箔等。Examples of the base film include polyolefin (for example, polypropylene, polyethylene), polyester (for example, polyethylene terephthalate, polyethylene naphthalate), polystyrene, and acrylonitrile. - plastic film composed of butadiene-styrene resin (ABS resin), polycarbonate, polyimine, polyvinyl chloride, nylon, polyvinyl alcohol, etc.; using pulp, rayon, manila hemp, acrylonitrile, Non-woven fabric, paper, cloth, or metal foil obtained from nylon, polyester, etc.

上述基底膜，於藉由雙面黏貼膠帶貼合的被黏體彼此拆解且易拆解層斷裂後，將雙面黏貼膠帶從被黏體剝離時，可發揮作為支撐體的作用。The base film can be used as a support when the double-sided adhesive tape is peeled off from the adherend after the adherends which are bonded by the double-sided adhesive tape are disassembled and the easy-to-remove layer is broken.

故，考量易兼顧基底膜與雙面黏貼膠帶的其他層的接著性(本實施方式中，為基底膜40，41與黏貼劑層20，21的接著性)及作為支撐體的強度的方面，塑膠系膜較佳，聚酯膜更佳。Therefore, it is considered that the adhesion between the base film and the other layers of the double-sided adhesive tape (in the present embodiment, the adhesion between the base films 40 and 41 and the adhesive layers 20 and 21) and the strength of the support are considered. The plastic film is preferred, and the polyester film is better.

又，以提高上述基底膜與黏貼劑層的黏著性為目的，可於基底膜的一面或兩面，施行電暈處理、電漿處理、錨塗層處理等。Further, for the purpose of improving the adhesion between the base film and the adhesive layer, corona treatment, plasma treatment, anchor coating treatment, or the like may be applied to one surface or both surfaces of the base film.

本實施方式之雙面黏貼膠帶，藉由加熱造成易拆解層中所含有的黏結劑發生軟化，且上述熱膨脹性微球發生膨脹，上述易拆解層的內聚力顯著降低且可輕易地拆解，因此上述加熱後，幾乎不用施加力即可拆解雙面黏貼膠帶，並將2個以上的被黏體彼此分離。In the double-sided adhesive tape of the present embodiment, the adhesive contained in the easily disassemblable layer is softened by heating, and the heat-expandable microspheres are expanded, and the cohesive force of the easily disassemblable layer is remarkably lowered and can be easily disassembled. Therefore, after the above heating, the double-sided adhesive tape can be disassembled almost without applying a force, and two or more adherends are separated from each other.

又，第2實施方式之雙面黏貼膠帶，進一步於易拆解與黏貼劑層之間具有基底膜。拆除後的雙面黏貼膠帶，有時會有雙面黏貼膠帶的殘渣殘留在被黏體上的情況。特別是於具有如易拆解層的易拆解性的脆弱的層的雙面黏貼膠帶中，有時會有難以除去被黏體上所殘留的雙面黏貼膠帶的殘渣的情況。但，本實施方式之雙面黏貼膠帶，進一步於易拆解與黏貼劑層之間具有基底膜，因此藉由握持基底膜部分並拉扯等，可輕易地將拆解後的雙面黏貼膠帶的殘渣全體從被黏體剝下。Moreover, the double-sided adhesive tape of the second embodiment further has a base film between the easy-to-disassemble and adhesive layer. After the removal of the double-sided adhesive tape, sometimes the residue of the double-sided adhesive tape remains on the adherend. In particular, in a double-sided adhesive tape having a fragile layer which is easy to disassemble, such as an easy-to-disassemble layer, it may be difficult to remove the residue of the double-sided adhesive tape remaining on the adherend. However, the double-sided adhesive tape of the present embodiment further has a base film between the easy-to-disassemble and adhesive layer, so that the double-sided adhesive tape can be easily disassembled by holding the base film portion and pulling it. The whole residue is peeled off from the adherend.

此外，本實施方式中，例示了由含有黏結劑11及熱膨脹性微球12的易拆解層10、黏貼劑層20，21、基底膜40，41、及剝離片30，31構成的雙面黏貼膠帶，該等的層構造之外，亦可進一步具有任意的層構造。Further, in the present embodiment, the both sides of the easily disassemblable layer 10 including the binder 11 and the heat-expandable microspheres 12, the adhesive layers 20, 21, the base films 40, 41, and the release sheets 30, 31 are exemplified. The adhesive tape may have any layer structure in addition to the layer structure.

例如，本發明之雙面黏貼膠帶，可使用於上述基底膜40，41與黏貼劑層20，21之間，或上述基底膜40，41與易拆解層10之間具有發泡體(foam材料)層者。該發泡體層發揮緩衝的作用，可對於具有發泡體層的雙面黏貼膠帶賦予緩衝性。For example, the double-sided adhesive tape of the present invention can be used for foaming between the base film 40, 41 and the adhesive layer 20, 21, or between the base film 40, 41 and the easily disassemblable layer 10 (foam) Material) layer. The foam layer functions as a buffer, and can impart cushioning properties to the double-sided adhesive tape having a foam layer.

本發明之雙面黏貼膠帶，例如可適合地使用於作為被黏體的剛體與剛體的接著、剛體與剛體彼此的分離。剛體的被黏體，例如可列舉金屬板、金屬框體、金屬蓋、玻璃板、塑膠板等。藉由本發明之雙面黏貼膠帶接著的2個以上的被黏體，可為相同種類的被黏體，亦可為不同種類的被黏體。又，藉由本發明之雙面黏貼膠帶接著及分離的被黏體彼此可為相同種類的被黏體，亦可為不同種類的被黏體。The double-sided adhesive tape of the present invention can be suitably used, for example, for the separation of a rigid body as a adherend and a rigid body, and a separation between a rigid body and a rigid body. Examples of the adherend of the rigid body include a metal plate, a metal frame, a metal cover, a glass plate, a plastic plate, and the like. The two or more adherends adhering to the double-sided adhesive tape of the present invention may be the same type of adherend or different types of adherends. Moreover, the double-sided adhesive tape of the present invention may be the same type of adherends and the different adherends.

本發明之雙面黏貼膠帶，可於再利用、回收時的構件間分離時藉由加熱輕易地進行拆解。因此，可適合地用作進行汽車、建材、OA、家電業界等工業用途中的各種產品的零件間固定的雙面黏貼膠帶。進行再利用、回收時的大量的零件的分離、大量的標籤剝離等時亦具有良好的工作效率。The double-sided adhesive tape of the present invention can be easily disassembled by heating when separating between components during recycling and recycling. Therefore, it can be suitably used as a double-sided adhesive tape for fixing between parts of various products in industrial applications such as automobiles, building materials, OA, and home electric appliances. It also has good work efficiency when it is reused, separation of a large number of parts during recycling, and a large number of label peeling.

本發明之雙面黏貼膠帶，亦可藉由較低的加熱溫度實現拆解。因此，特別適合地用作進行擔心因熱而引起零件的劣化的手機、影像顯示設備、電腦等電器產品的零件間固定的雙面黏貼膠帶。The double-sided adhesive tape of the present invention can also be disassembled by a lower heating temperature. Therefore, it is particularly suitably used as a double-sided adhesive tape for fixing between parts of an electric appliance such as a mobile phone, an image display device, or a computer, which is worried about deterioration of components due to heat.

《雙面黏貼膠帶之製造方法》 本發明之雙面黏貼膠帶之製造方法，係製作含有黏結劑及熱膨脹性微球的易拆解層，於該易拆解層的其中一側貼合其中一黏貼劑層，然後，於該易拆解層的另一側貼合另一黏貼劑層。<<Manufacturing Method of Double-Sided Adhesive Tape>> The method for producing a double-sided adhesive tape of the present invention is to produce a easily disassemblable layer containing a binder and heat-expandable microspheres, and one of the ones of the easy-to-disassemble layer is attached thereto Adhesive layer, and then another adhesive layer is attached to the other side of the easy-to-disassemble layer.

圖3係根據本發明之雙面黏貼膠帶之製造方法之實施方式之一例。首先，準備構成黏貼劑層的黏貼劑、構成易拆解層的黏結劑及熱膨脹性微球的混合物。然後，如圖3所示，使用塗抹機，於剝離片32，34上塗布黏貼劑而形成黏貼劑層20，21，於剝離片33上塗布黏結劑及熱膨脹性微球的混合物而形成易拆解層10。然後，於易拆解層10的一面貼合黏貼劑層20後，於易拆解層10的另一面貼合黏貼劑層21，得到本發明之雙面黏貼膠帶。Fig. 3 is an illustration of an embodiment of a method of manufacturing a double-sided adhesive tape according to the present invention. First, a mixture of an adhesive agent constituting the adhesive layer, a binder constituting the easy-to-disassemble layer, and heat-expandable microspheres is prepared. Then, as shown in FIG. 3, an adhesive is applied to the release sheets 32, 34 to form the adhesive layers 20, 21 using an applicator, and a mixture of the adhesive and the heat-expandable microspheres is applied to the release sheet 33 to form an easy-to-remove. Solution layer 10. Then, after the adhesive layer 20 is bonded to one surface of the easy-to-disassemble layer 10, the adhesive layer 21 is bonded to the other surface of the easy-disassembled layer 10 to obtain the double-sided adhesive tape of the present invention.

上述雙面黏貼膠帶的製造，在抑制上述熱膨脹性微球的膨脹方面，於80℃以下的溫度進行較佳，於40℃～80℃的溫度進行較佳，於50℃～80℃的範圍進行更佳。The production of the double-sided adhesive tape is preferably at a temperature of 80 ° C or lower, and preferably at a temperature of 40 ° C to 80 ° C, and in a range of 50 ° C to 80 ° C, in suppressing expansion of the heat-expandable microspheres. Better.

本實施方式之雙面黏貼膠帶之製造方法中，製造的雙面黏貼膠帶的2層黏貼劑層20，21為相同的構造，因此藉由將易拆解層與黏貼劑層個別成形並貼合，黏貼劑層的成形步驟可為一次，可以良好效率製造雙面黏貼膠帶。In the method for producing a double-sided adhesive tape according to the present embodiment, since the two adhesive layers 20 and 21 of the double-sided adhesive tape are manufactured in the same structure, the easily disassemblable layer and the adhesive layer are separately formed and bonded. The forming step of the adhesive layer can be one time, and the double-sided adhesive tape can be manufactured with good efficiency.

《接著方法・分離方法》 本發明之接著方法係將被黏體彼此藉由本發明之雙面黏貼膠帶進行貼合。<<Next Method and Separation Method>> The next method of the present invention is to bond the adherends to each other by the double-sided adhesive tape of the present invention.

又，本發明之分離方法，係將上述易拆解層加熱，並將已藉由本發明之接著方法貼合的上述被黏體彼此分離。Further, in the separation method of the present invention, the above-mentioned easily disassemblable layer is heated, and the adherends which have been bonded by the subsequent method of the present invention are separated from each other.

圖4係根據本發明之接著方法之實施方式之一例。如圖4所示，使被黏體50，51接觸雙面黏貼膠帶的兩面的黏貼劑層20，21，使被黏體彼此貼合而接著。Figure 4 is an illustration of an embodiment of an alternative method in accordance with the present invention. As shown in Fig. 4, the adherends 50, 51 are brought into contact with the adhesive layers 20, 21 on both sides of the double-sided adhesive tape, and the adherends are bonded to each other.

圖5係根據本發明之分離方法之實施方式之一例。Figure 5 is an illustration of an embodiment of a separation method in accordance with the present invention.

首先，將雙面黏貼膠帶加熱。雙面黏貼膠帶的加熱亦可藉由將已貼合的上述被黏體及雙面黏貼膠帶全體加熱而進行。然後，易拆解層10之黏結劑11因熱而發生軟化，且熱膨脹性微球12發生膨脹。此時藉由沿使被黏體50，51彼此分離的方向對雙面黏貼膠帶施加力，而對雙面黏貼膠帶施加剝離應力。由於本發明之雙面黏貼膠帶之易拆解層中含有熱膨脹性微球，熱膨脹性微球因加熱等而發生膨脹時，能使被黏體彼此輕易地分離。First, heat the double-sided adhesive tape. The heating of the double-sided adhesive tape can also be performed by heating the bonded body and the double-sided adhesive tape. Then, the binder 11 of the easily disassemblable layer 10 is softened by heat, and the heat-expandable microspheres 12 expand. At this time, a peeling stress is applied to the double-sided adhesive tape by applying a force to the double-sided adhesive tape in a direction in which the adherends 50, 51 are separated from each other. Since the heat-expandable microspheres are contained in the easily disassemblable layer of the double-sided adhesive tape of the present invention, the heat-expandable microspheres can be easily separated from each other by swelling due to heating or the like.

圖6係示意性地表示本發明之分離方法與別種方法中，被黏體的分離的狀態的一例的圖。圖6(a)為本發明之分離方法之一例，表示雙面黏貼膠帶之易拆解層10中含有熱膨脹性微球12的情況。圖6(b)表示雙面黏貼膠帶之易拆解層10中不含有熱膨脹性微球12的情況。Fig. 6 is a view schematically showing an example of a state in which the adherend is separated in the separation method and the other method of the present invention. Fig. 6(a) shows an example of the separation method of the present invention, and shows a case where the heat-expandable microspheres 12 are contained in the easily disassemblable layer 10 of the double-sided adhesive tape. Fig. 6(b) shows a case where the heat-expandable microspheres 12 are not contained in the easily disassemblable layer 10 of the double-sided adhesive tape.

如圖6(b)所示，易拆解層10中不含有熱膨脹性微球12時，對黏結劑11所施加的應力分散，黏結劑11的層難以拆解。As shown in FIG. 6(b), when the heat-dissipative microspheres 12 are not contained in the easily disassemblable layer 10, the stress applied to the binder 11 is dispersed, and the layer of the binder 11 is difficult to be disassembled.

另一方面，本發明之分離方法中，由於雙面黏貼膠帶之易拆解層10中含有熱膨脹性微球12，藉由熱膨脹性微球12因加熱而發生膨脹，如圖6(a)所示，對黏結劑11所施加的應力集中，相較於易拆解層中不含有熱膨脹性微球12的情況，以較小的力即可拆解易拆解層，其結果為可輕易地分離2個以上的被黏體。On the other hand, in the separation method of the present invention, since the heat-expandable microspheres 12 are contained in the easily disassemblable layer 10 of the double-sided adhesive tape, the heat-expandable microspheres 12 expand by heating, as shown in Fig. 6(a). It is shown that the stress concentration applied to the bonding agent 11 can be easily disassembled with a small force compared to the case where the heat-expandable microsphere 12 is not contained in the easily disassemblable layer, and as a result, it is easy to Separate more than 2 adherends.

上述分離方法中進行的加熱，可因應使用的熱膨脹性微球、作業環境進行適宜選擇，於85℃～150℃較佳，90℃～120℃更佳。本發明之雙面黏貼膠帶，於通常的使用環境(大概80℃以下)下不會發生拆解等，可牢固地接著被黏體彼此，另一方面，於上述以上的溫度加熱時，易拆解層可輕易地拆解，其結果為可輕易地分離被黏體。The heating to be carried out in the above separation method can be appropriately selected depending on the heat-expandable microspheres to be used and the working environment, and is preferably 85 ° C to 150 ° C, more preferably 90 ° C to 120 ° C. The double-sided adhesive tape of the present invention does not disassemble under normal use environment (about 80 ° C or lower), and can be firmly adhered to each other by the adherend. On the other hand, when heated at the above temperature, it is easy to disassemble. The layer can be easily disassembled, with the result that the adherend can be easily separated.

上述加熱方法，例如可列舉使用乾燥機、鹵素燈直接或間接地加熱上述雙面黏貼膠帶的方法。The heating method may, for example, be a method of heating the double-sided adhesive tape directly or indirectly using a dryer or a halogen lamp.

上述加熱時，可使鹵素燈接近或接觸上述雙面黏貼膠帶，亦可藉由使鹵素燈接近或接觸被黏體而間接加熱該黏貼膠帶。例如，該雙面黏貼膠帶的端部比該被黏體的端部還要露出於外側時，可使鹵素燈接近或接觸該雙面黏貼膠帶的端部。In the above heating, the halogen lamp can be brought into close contact with or contact with the double-sided adhesive tape, and the adhesive tape can be indirectly heated by bringing the halogen lamp close to or contacting the adherend. For example, when the end of the double-sided adhesive tape is exposed to the outside of the end of the adherend, the halogen lamp can be brought close to or in contact with the end of the double-sided adhesive tape.

於上述加熱步驟，使用裝備有鹵素燈等的加熱裝置，將上述雙面黏貼膠帶的溫度加熱至80℃～130℃較佳，加熱至85℃～125℃更佳，加熱至90℃～120℃尤佳。又，該加熱於20秒以內進行較佳，15秒以內更佳，10秒以內的較短時間尤佳。In the above heating step, the temperature of the double-sided adhesive tape is preferably heated to 80 ° C to 130 ° C using a heating device equipped with a halogen lamp or the like, preferably heated to 85 ° C to 125 ° C, and heated to 90 ° C to 120 ° C. Especially good. Further, the heating is preferably carried out within 20 seconds, more preferably within 15 seconds, and even less preferably within 10 seconds.

具體而言，使用上述鹵素燈、乾燥機的加熱步驟為於20秒以內使上述雙面黏貼膠帶的溫度成為100℃的步驟的話，可提高物品的拆解效率，且可防止被黏體的熱變形等，因此為較佳。Specifically, when the heating step using the halogen lamp or the dryer is such that the temperature of the double-sided adhesive tape is 100 ° C within 20 seconds, the disassembly efficiency of the article can be improved, and the heat of the adherend can be prevented. Deformation, etc., is therefore preferred.

又，裝備有鹵素燈的加熱裝置，例如可使用能於短時間加熱一定面積的“平行光型鹵素燈加熱器”、可局部加熱的集光型鹵素燈等，使用平行光型鹵素燈加熱器時，可一次加熱大範圍，因此可將加熱時間縮短至上述時間。Further, as a heating device equipped with a halogen lamp, for example, a "parallel light type halogen lamp heater" capable of heating a certain area in a short period of time, a locally-collecting concentrating type halogen lamp, or the like can be used, and a parallel light type halogen lamp heater is used. In this case, a large range can be heated at one time, so that the heating time can be shortened to the above time.

上述平行光型鹵素燈加熱器一次可加熱的面積，為10cm2 ～500cm2 左右較佳。又，平行光型鹵素燈加熱器等加熱裝置為可攜帶的大小及重量的話，在提高上述物品的拆解作業的效率方面較佳。該重量為3kg以下較佳，2kg以下更佳，0.1kg～1kg尤佳。The area in which the parallel light type halogen lamp heater can be heated at one time is preferably from about 10 cm 2 to about 500 cm 2 . Further, when the heating device such as the parallel light type halogen lamp heater is of a portable size and weight, it is preferable to improve the efficiency of disassembling the article. The weight is preferably 3 kg or less, more preferably 2 kg or less, and particularly preferably 0.1 kg to 1 kg.

以上述方法加熱的上述物品，即使對構成該物品的2個以上的被黏體幾乎不施加力，或施加較弱的力即可輕易地拆解。The article heated by the above method can be easily disassembled even if a force is hardly applied to two or more adherends constituting the article or a weak force is applied.

本發明之雙面黏貼膠帶，於60℃以下的溫度範圍下具有非常優異的接著力，因此例如可使用於構成具備複印功能、掃描功能的複印機、多功能機等電子裝置的透明頂板與其框體的固定。The double-sided adhesive tape of the present invention has a very excellent adhesive force at a temperature range of 60 ° C or lower, and thus can be used, for example, to form a transparent top plate and a frame thereof for an electronic device such as a copying machine or a multifunction machine having a copying function and a scanning function. Fixed.

上述透明頂板，可使用一般的搭載有複印機能、掃描功能的複印機、多功能機中所設置的透明頂板。As the transparent top plate, a general copying machine equipped with a copying function and a scanning function, and a transparent top plate provided in a multifunction machine can be used.

上述透明頂板，例如可使用由玻璃或塑膠製成的透明板狀剛體。該塑膠，例如可使用壓克力板、聚碳酸酯板等。As the transparent top plate, for example, a transparent plate-like rigid body made of glass or plastic can be used. As the plastic, for example, an acrylic plate, a polycarbonate plate or the like can be used.

上述透明頂板，可使用與設置有該透明頂板的複印機等的形狀吻合者，通常使用正方形或長方形者較佳。The transparent top plate can be used in a shape conforming to the shape of a copying machine or the like provided with the transparent top plate, and a square or a rectangle is usually used.

上述雙面黏貼膠帶，例如若為長方形的上述透明頂板時，宜沿著相對的兩邊的端部進行貼附較佳。此時，該黏貼膠帶可使用裁切成因應該透明頂板的邊的長度之大小者，例如使用寬度為0.5mm～20mm、長度為0.1mm～2.0mm者較佳。When the double-sided adhesive tape is, for example, a rectangular transparent top plate, it is preferable to attach it along the opposite end portions. At this time, the adhesive tape can be used to cut the length of the side of the transparent top plate, for example, a width of 0.5 mm to 20 mm and a length of 0.1 mm to 2.0 mm are preferable.

又，本發明之雙面黏貼膠帶，可專門使用於構成便攜式電子裝置的構件的固定。該構件例如可列舉構成電子裝置的2個以上的框體或透鏡構件。Further, the double-sided adhesive tape of the present invention can be used exclusively for fixing a member constituting a portable electronic device. The member may be, for example, two or more frames or lens members constituting an electronic device.

上述便攜式電子裝置，例如可列舉具有作為上述構件之框體與透鏡構件或其他框體之一者介隔上述雙面黏貼膠帶而接合的結構者。The portable electronic device includes, for example, a structure in which a frame as the member is bonded to one of a lens member or another frame via the double-sided adhesive tape.

上述構件的固定，例如，可列舉將上述框體或透鏡構件之一者與其他框體或透鏡構件介隔上述雙面黏貼膠帶進行層疊後，使其熟化一定期間的方法。For example, a method in which one of the above-mentioned frame or lens member is laminated with another frame or a lens member via the double-sided adhesive tape and then aged for a predetermined period of time is exemplified.

圖7係根據本發明之分離方法之實施方式之一例。首先，實施上述圖6所示之分離方法。此時於被黏體50，51上，殘留有拆解後的雙面黏貼膠帶的殘渣。然後，將雙面黏貼膠帶冷卻。然後，可藉由拉扯基底膜41的部分，以基底膜與雙面黏貼膠帶的其他層成為一體的狀態，將雙面黏貼膠帶的殘渣全體從被黏體剝下。Figure 7 is an illustration of an embodiment of a separation method in accordance with the present invention. First, the separation method shown in Fig. 6 described above is carried out. At this time, the residue of the disassembled double-sided adhesive tape remains on the adherends 50, 51. Then, cool the double-sided adhesive tape. Then, the entire portion of the double-sided adhesive tape can be peeled off from the adherend by pulling the portion of the base film 41 in a state in which the base film and the other layers of the double-sided adhesive tape are integrated.

冷卻只要是適當冷卻至因加熱而軟化的雙面黏貼膠帶的殘渣中的黏結劑的軟化程度降低且易除去處理雙面黏貼膠帶的殘渣的狀態的溫度即可，35℃以下較佳，25℃以下更佳。 【實施例】The cooling may be carried out by cooling to a temperature in which the softening degree of the adhesive of the double-sided adhesive tape softened by heating is lowered and the residue of the double-sided adhesive tape is easily removed, preferably 35° C. or less, 25° C. The following is better. [Examples]

[製造例1] 易拆解層(1) 以重量平均分子量為20萬的苯乙烯－異戊二烯嵌段共聚物S(三嵌段共聚物與二嵌段共聚物的混合物。該二嵌段共聚物相對於該混合物之總量的所占比例為52質量%。聚苯乙烯單元相對於該苯乙烯－異戊二烯嵌段共聚物之全體的所占質量比例為15質量%，聚異戊二烯單元的質量比例為85質量%)100質量份、C5石油系增黏樹脂(軟化點100℃、數量平均分子量885)40質量份、聚合松香酯系增黏樹脂(軟化點125℃、數量平均分子量880)30質量份、作為液狀增黏樹脂的HV－100(JX日礦日石(股)公司製，低分子量聚丁烯)5質量份、作為熱膨脹性微球的Matsumoto microsphere F－48 (松本油脂製藥(股)公司製，於120℃的熱膨脹率為370%，膨脹開始溫度為90℃～100℃，最大膨脹溫度為125℃～135℃，粒徑(膨脹前)為9μm～15μm)10質量份的調配比進行混合後溶解於甲苯中，藉此得到合成橡膠溶液。[Production Example 1] Easy-to-disassemble layer (1) A styrene-isoprene block copolymer S (a mixture of a triblock copolymer and a diblock copolymer) having a weight average molecular weight of 200,000. The proportion of the copolymer of the segment copolymer to the total amount of the mixture was 52% by mass, and the mass ratio of the polystyrene unit to the entire styrene-isoprene block copolymer was 15% by mass. The mass ratio of the isoprene unit is 85% by mass) 100 parts by mass, the C5 petroleum-based tackifying resin (softening point 100 ° C, number average molecular weight 885) 40 parts by mass, and the polymerized rosin ester-based tackifying resin (softening point 125 ° C) Quantitative molecular weight: 880) 30 parts by mass, HV-100 (manufactured by JX Nippon Mining Co., Ltd., low molecular weight polybutene) as a liquid tackifying resin, 5 parts by mass, Matsumoto microsphere as heat-expandable microspheres F-48 (made by Matsumoto Oil & Fats Co., Ltd.) has a thermal expansion rate of 370% at 120 ° C, an expansion start temperature of 90 ° C to 100 ° C, a maximum expansion temperature of 125 ° C to 135 ° C, and a particle size (before expansion). 9 μm to 15 μm) 10 parts by mass of the compounding ratio is mixed and dissolved in toluene to obtain a combination Rubber solution.

以使乾燥後的厚度成為40μm的方式，將上述溶液使用塗抹機塗布於剝離片的表面，藉由於85℃乾燥5分鐘而製造易拆解層(1)。The solution was applied to the surface of the release sheet using an applicator so that the thickness after drying became 40 μm, and the easy-disassembled layer (1) was produced by drying at 85 ° C for 5 minutes.

[製造例2] 易拆解層(2) 將Matsumoto microsphere F－48替換為Microsphere Expancel 053－40 (Japan Fillite co., ltd.製，於120℃的熱膨脹率為350%，膨脹開始溫度為96℃～103℃，最大膨脹溫度為138℃～146℃，粒徑(膨脹前)為10μm～16μm)10質量份，除此以外，利用與上述製造例1同樣的方法製造易拆解層(2)。[Production Example 2] Easy-to-disassemble layer (2) The Matsumoto microsphere F-48 was replaced by Microsphere Expancel 053-40 (manufactured by Japan Fillite Co., Ltd., the thermal expansion coefficient at 120 ° C was 350%, and the expansion start temperature was 96. The easy-to-disassemble layer was produced by the same method as the above-mentioned Production Example 1 except that the maximum expansion temperature was 138 ° C to 146 ° C and the particle diameter (before expansion) was 10 μm to 16 μm. ).

[製造例3] 易拆解層(3) 將Matsumoto microsphere F－48替換為Microsphere Expancel 031－40 (Japan Fillite co., ltd.製、於120℃的熱膨脹率為450%，膨脹開始溫度為81℃～95℃，最大膨脹溫度為120℃～135℃，粒徑(膨脹前)為10μm～16μm)10質量份，除此以外，利用與上述製造例1同樣的方法製造易拆解層(3)。[Manufacturing Example 3] Easy-to-disassemble layer (3) Replace Matsumoto microsphere F-48 with Microsphere Expancel 031-40 (manufactured by Japan Fillite Co., Ltd., having a thermal expansion coefficient of 450% at 120 ° C and an expansion start temperature of 81 A free-removable layer was produced by the same method as in the above Production Example 1 except that the maximum expansion temperature was from 120 ° C to 135 ° C and the particle diameter (before expansion) was 10 μm to 16 μm. ).

[製造例4] 易拆解層(4) 將Matsumoto microsphere F－48替換為Matsumoto microsphere FN－80GSD (松本油脂製藥(股)公司製，於120℃的熱膨脹率為220%，膨脹開始溫度為100℃～110℃，最大膨脹溫度為125℃～135℃，粒徑(膨脹前)為6μm～10μm)10質量份，除此以外，利用與上述製造例1同樣的方法製造易拆解層(4)。[Production Example 4] Easy-to-disassemble layer (4) Replace Matsumoto microsphere F-48 with Matsumoto microsphere FN-80GSD (made by Matsumoto Oil & Fats Co., Ltd.), the thermal expansion rate at 220 ° C is 220%, and the expansion start temperature is 100. The easy-to-disassemble layer was produced by the same method as the above-mentioned Production Example 1 except that the maximum expansion temperature was from 125 ° C to 135 ° C and the particle diameter (before expansion) was 10 μm to 10 μm. ).

[製造例5] 易拆解層(5) 將苯乙烯－異戊二烯嵌段共聚物S替換為重量平均分子量為30萬的苯乙烯－異戊二烯嵌段共聚物T(三嵌段共聚物與二嵌段共聚物的混合物。該二嵌段共聚物相對於該混合物之總量的所占比例為20質量%。聚苯乙烯單元相對於該苯乙烯－異戊二烯嵌段共聚物之全體的所占質量比例為15質量%，聚異戊二烯單元的質量比例為85質量%)，除此以外，利用與製造例1同樣的方法製造易拆解層(5)。[Manufacturing Example 5] easily disassemblable layer (5) The styrene-isoprene block copolymer S was replaced with a styrene-isoprene block copolymer T (triblock) having a weight average molecular weight of 300,000. a mixture of a copolymer and a diblock copolymer. The proportion of the diblock copolymer to the total amount of the mixture is 20% by mass. The polystyrene unit is copolymerized with respect to the styrene-isoprene block. The easily disassemblable layer (5) was produced by the same method as in Production Example 1, except that the mass ratio of the entire material was 15% by mass and the mass ratio of the polyisoprene unit was 85% by mass.

[製造例6] 易拆解層(6) 將Matsumoto microsphere F－48(松本油脂製藥(股)公司製)的使用量由10質量份變更為20質量份，除此以外，利用與製造例1同樣的方法製造易拆解層(6)。[Production Example 6] The easy-to-disassemble layer (6) The use amount of Matsumoto microsphere F-48 (manufactured by Matsumoto Oil & Fats Co., Ltd.) was changed from 10 parts by mass to 20 parts by mass, and the use and production example 1 were used. The same method is used to make the easy-to-disassemble layer (6).

[製造例7] 易拆解層(7) 將Matsumoto microsphere F－48(松本油脂製藥(股)公司製)的使用量由10質量份變更為5質量份，除此以外，利用與製造例1同樣的方法製造易拆解層(7)。[Production Example 7] The easy-to-disassemble layer (7) The use amount of Matsumoto microsphere F-48 (manufactured by Matsumoto Oil & Fats Co., Ltd.) was changed from 10 parts by mass to 5 parts by mass, and the use and production example 1 were used. The same method is used to make the easy-to-disassemble layer (7).

[製造例8] 易拆解層(8) 將易拆解層的厚度由40μm變更為20μm，除此以外，利用與製造例1同樣的方法製造易拆解層(8)。[Production Example 8] The easily disassemblable layer (8) was produced by the same method as in Production Example 1, except that the thickness of the easily disassemblable layer was changed from 40 μm to 20 μm.

[製造例9] 易拆解層(9) 藉由將LA2250(Kurary Co.,LTD.製，丙烯酸系熱塑性彈性體)100質量份、Matsumoto microsphere F－48 (松本油脂製藥(股)公司製，於120℃的熱膨脹率為370%，膨脹開始溫度為90℃～100℃，最大膨脹溫度為125℃～135℃，粒徑(膨脹前)為9μm～15μm)10質量份、與甲苯混合而得到非揮發性成分為40質量%的丙烯酸樹脂組成物。[Production Example 9] Easily disassembled layer (9) 100 parts by mass of LA2250 (acrylic thermoplastic elastomer manufactured by Kurary Co., Ltd.) and Matsumoto microsphere F-48 (manufactured by Matsumoto Oil & Fats Co., Ltd.) The thermal expansion coefficient at 120 ° C is 370%, the expansion start temperature is 90 ° C to 100 ° C, the maximum expansion temperature is 125 ° C to 135 ° C, and the particle diameter (before expansion) is 10 μm to 15 μm), and 10 parts by mass is mixed with toluene. The nonvolatile component was a 40% by mass acrylic resin composition.

以使乾燥後的厚度成為40μm的方式，將上述丙烯酸樹脂組成物使用塗抹機塗布於剝離片的表面，藉由於85℃乾燥5分鐘而製造易拆解層(9)。The acrylic resin composition was applied onto the surface of the release sheet by an applicator so that the thickness after drying became 40 μm, and the easy-disassembled layer (9) was produced by drying at 85 ° C for 5 minutes.

[製造例10] 易拆解層(10) 於裝備有攪拌機、回流冷凝器、溫度計、滴液漏斗及氮氣導入口的反應容器內，將丙烯酸丁酯44.9質量份、丙烯酸2－乙基己酯50質量份、丙烯酸2質量份、乙酸乙烯酯3質量份、丙烯酸4－羥基丁酯0.1質量份、及作為聚合引發劑的2,2'－偶氮雙異丁腈0.1質量份，溶解於乙酸乙酯100質量份中，於70℃聚合10小時，以得到重量平均分子量為80萬的丙烯酸系共聚物溶液。然後，相對於該丙烯酸系共聚物100質量份，添加聚合松香酯系增黏樹脂(軟化點為125℃，數量平均分子量為880)30質量份，加入乙酸乙酯並混合，藉此得到非揮發性成分為45質量%的丙烯酸系共聚物組成物(1)。[Production Example 10] Easy-to-disassemble layer (10) 44.9 parts by mass of butyl acrylate and 2-ethylhexyl acrylate in a reaction vessel equipped with a stirrer, a reflux condenser, a thermometer, a dropping funnel, and a nitrogen introduction port 50 parts by mass, 2 parts by mass of acrylic acid, 3 parts by mass of vinyl acetate, 0.1 parts by mass of 4-hydroxybutyl acrylate, and 0.1 parts by mass of 2,2'-azobisisobutyronitrile as a polymerization initiator, dissolved in acetic acid 100 parts by mass of the ethyl ester was polymerized at 70 ° C for 10 hours to obtain an acrylic copolymer solution having a weight average molecular weight of 800,000. Then, 30 parts by mass of a polymerized rosin ester-based tackifying resin (softening point: 125 ° C, number average molecular weight: 880) was added to 100 parts by mass of the acrylic copolymer, and ethyl acetate was added and mixed to obtain a nonvolatile matter. The sexual component was 45 mass% of the acrylic copolymer composition (1).

將上述丙烯酸系共聚物組成物(1)100質量份、「CORONATE L－45」(日本聚胺脂工業(股)製，異氰酸酯系交聯劑，固體成分為45質量%)1.1質量份、Matsumoto microsphere F－48(松本油脂製藥(股)公司製，於120℃的熱膨脹率為370%，膨脹開始溫度為90℃～100℃，最大膨脹溫度為125℃～135℃，粒徑(膨脹前)為9μm～15μm)10質量份混合後，以使乾燥後的厚度成為40μm的方式，使用塗抹機塗布於剝離片的表面，於85℃乾燥5分鐘，藉此形成易拆解層(10)。100 parts by mass of the above-mentioned acrylic copolymer composition (1), "CORONATE L-45" (manufactured by Nippon Polyurethane Industry Co., Ltd., isocyanate-based crosslinking agent, solid content: 45 mass%) 1.1 parts by mass, Matsumoto Microsphere F-48 (made by Matsumoto Oil & Fats Co., Ltd.), has a thermal expansion rate of 370% at 120 ° C, an expansion start temperature of 90 ° C to 100 ° C, a maximum expansion temperature of 125 ° C to 135 ° C, and a particle size (before expansion) After mixing 10 parts by mass of 9 μm to 15 μm, the surface of the release sheet was applied to the surface of the release sheet by a spreader so as to have a thickness of 40 μm after drying, and dried at 85 ° C for 5 minutes to form an easily disassemblable layer (10).

[製造例11] 易拆解層(11) 將丙烯酸丁酯44.9質量份、丙烯酸2－乙基己酯50質量份、丙烯酸2質量份、乙酸乙烯酯3質量份與丙烯酸4－羥基丁酯0.1質量份替換為丙烯酸丁酯20質量份及丙烯酸2－乙基己酯74.9質量份，除此以外，利用與製造例10同樣的方法形成易拆解層(11)。[Production Example 11] Easily disassemblable layer (11) 44.9 parts by mass of butyl acrylate, 50 parts by mass of 2-ethylhexyl acrylate, 2 parts by mass of acrylic acid, 3 parts by mass of vinyl acetate, and 4-hydroxybutyl acrylate 0.1 The easily disassemblable layer (11) was formed in the same manner as in Production Example 10 except that 20 parts by mass of butyl acrylate and 74.9 parts by mass of 2-ethylhexyl acrylate were used.

[比較製造例1] 中芯層(1) 未使用Matsumoto microsphere F－48(松本油脂製藥(股)公司製)，除此以外，利用與製造例1同樣的方法製造中芯層(1)。[Comparative Production Example 1] The core layer (1) was produced in the same manner as in Production Example 1 except that Matsumoto microsphere F-48 (manufactured by Matsumoto Oil & Fats Co., Ltd.) was not used.

[比較製造例2] 中芯層(2) 未使用Matsumoto microsphere F－48(松本油脂製藥(股)公司製)，除此以外，利用與製造例9同樣的方法製造中芯層(2)。[Comparative Production Example 2] The core layer (2) was produced by the same method as in Production Example 9 except that Matsumoto microsphere F-48 (manufactured by Matsumoto Oil & Fats Co., Ltd.) was not used.

[比較製造例3] 中芯層(3) 未使用Matsumoto microsphere F－48(松本油脂製藥(股)公司製)，除此以外，利用與製造例10同樣的方法製造中芯層(3)。[Comparative Production Example 3] The core layer (3) was produced in the same manner as in Production Example 10 except that Matsumoto microsphere F-48 (manufactured by Matsumoto Oil & Fats Co., Ltd.) was not used.

[比較製造例4] 中芯層(4) 未使用Matsumoto microsphere F－48(松本油脂製藥(股)公司製)，除此以外，利用與製造例11同樣的方法製造中芯層(4)。[Comparative Production Example 4] The core layer (4) was produced in the same manner as in Production Example 11 except that Matsumoto microsphere F-48 (manufactured by Matsumoto Oil & Fats Co., Ltd.) was not used.

[製備例1] 黏貼劑層(1) 於裝備有攪拌機、回流冷凝器、溫度計、滴液漏斗及氮氣導入口的反應容器內，將丙烯酸丁酯44.9質量份、丙烯酸2－乙基己酯50質量份、丙烯酸2質量份、乙酸乙烯酯3質量份、丙烯酸4－羥基丁酯0.1質量份、及作為聚合引發劑的2,2'－偶氮雙異丁腈0.1質量份，溶解於乙酸乙酯100質量份中，於70℃聚合10小時，藉此得到重量平均分子量為80萬的丙烯酸系共聚物溶液。然後，相對於該丙烯酸系共聚物100質量份，添加聚合松香酯系增黏樹脂(軟化點為125℃，數量平均分子量為880)30質量份，加入乙酸乙酯並混合，藉此得到非揮發性成分為45質量%的丙烯酸系共聚物組成物(1)。[Preparation Example 1] Adhesive layer (1) In a reaction vessel equipped with a stirrer, a reflux condenser, a thermometer, a dropping funnel, and a nitrogen introduction port, 44.9 parts by mass of butyl acrylate and 2-ethylhexyl acrylate 50 were used. Parts by mass, 2 parts by mass of acrylic acid, 3 parts by mass of vinyl acetate, 0.1 parts by mass of 4-hydroxybutyl acrylate, and 0.1 parts by mass of 2,2'-azobisisobutyronitrile as a polymerization initiator, dissolved in acetic acid 100 parts by mass of the ester was polymerized at 70 ° C for 10 hours to obtain an acrylic copolymer solution having a weight average molecular weight of 800,000. Then, 30 parts by mass of a polymerized rosin ester-based tackifying resin (softening point: 125 ° C, number average molecular weight: 880) was added to 100 parts by mass of the acrylic copolymer, and ethyl acetate was added and mixed to obtain a nonvolatile matter. The sexual component was 45 mass% of the acrylic copolymer composition (1).

將上述丙烯酸系共聚物組成物(1)100質量份、與「CORONATE L－45」(日本聚胺脂工業(股)製、異氰酸酯系交聯劑、固體成分為45質量%)1.1質量份混合後得到的黏貼劑，以使乾燥後的厚度成為50μm的方式，使用塗抹機塗布於剝離片的表面，於85℃乾燥5分鐘而形成黏貼劑層(1)。100 parts by mass of the above-mentioned acrylic copolymer composition (1) was mixed with 1.1 parts by mass of "CORONATE L-45" (manufactured by Nippon Polyurethane Industry Co., Ltd., isocyanate-based crosslinking agent, solid content: 45 mass%). The adhesive agent obtained after that was applied to the surface of the release sheet by using a spreader so as to have a thickness of 50 μm after drying, and dried at 85 ° C for 5 minutes to form an adhesive layer (1).

(實施例1) 如圖8(a)所示，將上述黏貼劑層(1)22貼合於厚度為16μm的聚對苯二甲酸乙二醇酯膜42上(貼合品)。(Example 1) As shown in Fig. 8 (a), the above-mentioned adhesive layer (1) 22 was bonded to a polyethylene terephthalate film 42 having a thickness of 16 μm (a bonded product).

另一方面，將另一黏貼劑層(1)23與易拆解層(1)15分別貼合於厚度為16μm的聚對苯二甲酸乙二醇酯膜43的兩面。然後，將該易拆解層(1)15表面的剝離片除去，並貼合於預先製作的上述聚對苯二甲酸乙二醇酯膜42及黏貼劑層(1)22的貼合品後，藉由以4kgf/cm2 的壓力進行加壓層疊，製作實施例1的雙面黏貼膠帶。On the other hand, the other adhesive layer (1) 23 and the easily disassemblable layer (1) 15 were respectively bonded to both surfaces of a polyethylene terephthalate film 43 having a thickness of 16 μm. Then, the release sheet on the surface of the easily disassemblable layer (1) 15 is removed, and bonded to the previously prepared laminate of the polyethylene terephthalate film 42 and the adhesive layer (1) 22 The double-sided adhesive tape of Example 1 was produced by pressure lamination under a pressure of 4 kgf/cm 2 .

(實施例2) 將上述易拆解層(1)替換為上述易拆解層(2)，除此以外，利用與上述實施例1同樣的方法製作實施例2的雙面黏貼膠帶。(Example 2) A double-sided adhesive tape of Example 2 was produced by the same method as that of Example 1 except that the above-mentioned easily disassemblable layer (1) was replaced with the above-mentioned easily disassemblable layer (2).

(實施例3) 將上述易拆解層(1)替換為上述易拆解層(3)，除此以外，利用與上述實施例1同樣的方法製作實施例3的雙面黏貼膠帶。(Example 3) A double-sided adhesive tape of Example 3 was produced by the same method as that of Example 1 except that the above-mentioned easily disassemblable layer (1) was replaced with the above-mentioned easily disassemblable layer (3).

(實施例4) 將上述易拆解層(1)替換為上述易拆解層(4)，除此以外，利用與上述實施例1同樣的方法製作實施例4的雙面黏貼膠帶。(Example 4) A double-sided adhesive tape of Example 4 was produced in the same manner as in Example 1 except that the above-mentioned easily disassemblable layer (1) was replaced with the above-mentioned easily disassemblable layer (4).

(實施例5) 將上述易拆解層(1)替換為上述易拆解層(5)，除此以外，利用與上述實施例1同樣的方法製作實施例5的雙面黏貼膠帶。(Example 5) A double-sided adhesive tape of Example 5 was produced in the same manner as in Example 1 except that the above-mentioned easily disassemblable layer (1) was replaced with the above-mentioned easily disassemblable layer (5).

(實施例6) 將單側的16μm的聚對苯二甲酸乙二醇酯膜替換為厚度為16μm的聚對苯二甲酸乙二醇酯膜與厚度為100μm的聚烯烴系發泡體的疊層體並使發泡體側接觸易拆解層，除此以外，利用與上述實施例1同樣的方法製作實施例6的雙面黏貼膠帶。(Example 6) A one-side 16 μm polyethylene terephthalate film was replaced with a stack of a polyethylene terephthalate film having a thickness of 16 μm and a polyolefin foam having a thickness of 100 μm. The double-sided adhesive tape of Example 6 was produced by the same method as that of Example 1 except that the layered body was brought into contact with the easily disassemblable layer.

(實施例7) 將上述易拆解層(1)替換為上述易拆解層(6)，除此以外，利用與上述實施例1同樣的方法製作實施例7的雙面黏貼膠帶。(Example 7) A double-sided adhesive tape of Example 7 was produced by the same method as that of Example 1 except that the above-mentioned easily disassemblable layer (1) was replaced with the above-mentioned easily disassemblable layer (6).

(實施例8) 將上述易拆解層(1)替換為上述易拆解層(7)，除此以外，利用與上述實施例1同樣的方法製作實施例8的雙面黏貼膠帶。(Example 8) A double-sided adhesive tape of Example 8 was produced in the same manner as in Example 1 except that the above-mentioned easily disassemblable layer (1) was replaced with the above-mentioned easily disassemblable layer (7).

(實施例9) 將上述易拆解層(1)替換為上述易拆解層(8)，除此以外，利用與上述實施例1同樣的方法製作實施例9的雙面黏貼膠帶。(Example 9) A double-sided adhesive tape of Example 9 was produced by the same method as that of Example 1 except that the above-mentioned easily disassemblable layer (1) was replaced with the above-mentioned easily disassemblable layer (8).

(實施例10) 將上述易拆解層(1)替換為上述易拆解層(9)，除此以外，利用與上述實施例1同樣的方法製作實施例10的雙面黏貼膠帶。(Example 10) A double-sided adhesive tape of Example 10 was produced in the same manner as in Example 1 except that the above-mentioned easily disassemblable layer (1) was replaced with the above-mentioned easily disassemblable layer (9).

(實施例11) 將上述易拆解層(1)替換為上述易拆解層(10)，除此以外，利用與上述實施例1同樣的方法製作實施例11的雙面黏貼膠帶。(Example 11) A double-sided adhesive tape of Example 11 was produced by the same method as that of Example 1 except that the above-mentioned easily disassemblable layer (1) was replaced with the above-mentioned easily disassemblable layer (10).

(實施例12) 將上述易拆解層(1)替換為上述易拆解層(11)，除此以外，利用與上述實施例1同樣的方法製作實施例12的雙面黏貼膠帶。(Example 12) A double-sided adhesive tape of Example 12 was produced by the same method as that of Example 1 except that the above-mentioned easily disassemblable layer (1) was replaced with the above-mentioned easily disassemblable layer (11).

(比較例1) 將上述易拆解層(1)替換為上述中芯層(1)，除此以外，利用與上述實施例1同樣的方法製作比較例1的雙面黏貼膠帶。(Comparative Example 1) A double-sided adhesive tape of Comparative Example 1 was produced in the same manner as in Example 1 except that the above-mentioned easily disassembled layer (1) was replaced with the above-mentioned core layer (1).

(比較例2) 將上述易拆解層(1)替換為上述中芯層(2)，除此以外，利用與上述實施例1同樣的方法製作比較例2的雙面黏貼膠帶。(Comparative Example 2) A double-sided adhesive tape of Comparative Example 2 was produced in the same manner as in Example 1 except that the above-mentioned easily disassembled layer (1) was replaced with the above-mentioned core layer (2).

(比較例3) 將上述易拆解層(1)替換為上述中芯層(3)，除此以外，利用與上述實施例1同樣的方法製作比較例3的雙面黏貼膠帶。(Comparative Example 3) A double-sided adhesive tape of Comparative Example 3 was produced in the same manner as in Example 1 except that the above-mentioned easily disassembled layer (1) was replaced with the above-mentioned core layer (3).

(比較例4) 將上述易拆解層(1)替換為上述中芯層(4)，除此以外，利用與上述實施例1同樣的方法製作比較例4的雙面黏貼膠帶。(Comparative Example 4) A double-sided adhesive tape of Comparative Example 4 was produced in the same manner as in Example 1 except that the above-mentioned easily disassembled layer (1) was replaced with the above-mentioned core layer (4).

對上述實施例及比較例中得到的雙面黏貼膠帶進行以下的評價。得到的結果如表1、表2所示。The following evaluations were performed on the double-sided adhesive tapes obtained in the above examples and comparative examples. The results obtained are shown in Tables 1 and 2.

＜常溫時的180度剝離接著力＞ 180度剝離接著力根據JIS Z 0237進行測定。<180-degree peeling adhesion force at normal temperature> 180-degree peeling adhesion force was measured in accordance with JIS Z 0237.

將雙面黏貼膠帶的其中一面的剝離片剝離，將此黏貼劑層以厚度為50μm的鋁箔作為背襯。將該有背襯的黏貼膠帶切為20mm寬度後，將另一面的剝離片剝離，將此黏貼劑層貼合於SUS板的經過脫脂處理的平滑表面，以作為試驗片。The release sheet of one side of the double-sided adhesive tape was peeled off, and this adhesive layer was backed by an aluminum foil having a thickness of 50 μm. After the backing adhesive tape was cut into a width of 20 mm, the peeling sheet on the other side was peeled off, and this adhesive layer was bonded to the smooth surface of the SUS plate which was subjected to degreasing treatment to obtain a test piece.

將上述試驗片於23℃環境下放置30分鐘後，於相同環境下使用TENSILON拉伸試驗機[A&D Co., Ltd. 製，型號：RTM－100]，測定將構成該試驗片的雙面黏貼膠帶從SUS板沿180度方向以300mm/分的速度剝離時的接著力。After the test piece was allowed to stand in an environment of 23 ° C for 30 minutes, the TENSILON tensile tester [A&D Co., Ltd., model: RTM-100] was used in the same environment, and the double-sided adhesive sheet constituting the test piece was measured. The adhesive force when the tape was peeled off from the SUS plate at a speed of 300 mm/min in the 180-degree direction.

＜加熱後的180度剝離接著力＞ 180度剝離接著力根據JIS Z 0237進行測定。<180 degree peeling adhesion force after heating> 180 degree peeling adhesion force was measured according to JIS Z 0237.

將雙面黏貼膠帶的其中一面的剝離片剝離，將此黏貼劑層以厚度為50μm的鋁箔作為背襯。將該有背襯的黏貼膠帶切為20mm寬度後，將另一面的剝離片剝離，將此黏貼劑層貼合於SUS板的經過脫脂處理的平滑表面，以作為試驗片。The release sheet of one side of the double-sided adhesive tape was peeled off, and this adhesive layer was backed by an aluminum foil having a thickness of 50 μm. After the backing adhesive tape was cut into a width of 20 mm, the peeling sheet on the other side was peeled off, and this adhesive layer was bonded to the smooth surface of the SUS plate which was subjected to degreasing treatment to obtain a test piece.

將上述試驗片於120℃環境下放置30分鐘後，於相同環境下使用TENSILON拉伸試驗機[A&D Co., Ltd. 製，型號：RTM－100]，測定將構成該試驗片的雙面黏貼膠帶從SUS板沿180度方向以300mm/分的速度剝離時的接著力。After the test piece was allowed to stand at 120 ° C for 30 minutes, the TENSILON tensile tester [A&D Co., Ltd., model: RTM-100] was used in the same environment to measure the double-sided adhesive sheet constituting the test piece. The adhesive force when the tape was peeled off from the SUS plate at a speed of 300 mm/min in the 180-degree direction.

＜加熱後的拆解性試驗＞ 圖9係說明拆解性試驗的方法的圖。首先，將實施例及比較例中得到的雙面黏貼膠帶切為一邊(外側)的長度為20mm的正方形狀。將該切斷的雙面黏貼膠帶202貼合於長度為100mm、寬度為30mm及厚度為1mm的SUS板201的經過脫脂處理的平滑表面。<Removability Test after Heating> FIG. 9 is a view for explaining a method of the disintegration test. First, the double-sided adhesive tapes obtained in the examples and the comparative examples were cut into a square shape having a length of one side (outer side) of 20 mm. The cut double-sided adhesive tape 202 was bonded to a smooth surface of the SUS plate 201 having a length of 100 mm, a width of 30 mm, and a thickness of 1 mm.

然後，將SUS板201’的經過脫脂處理的平滑表面貼附於和上述雙面黏貼膠帶202與SUS板201貼附的面為相反的面，以5kg荷重輥進行1次來回加壓，以作為試驗片。Then, the smooth surface of the SUS plate 201' which has been subjected to the degreasing treatment is attached to the surface opposite to the surface to which the double-sided adhesive tape 202 and the SUS plate 201 are attached, and is pressed back and forth once with a 5 kg load roller as Test piece.

將製作的試驗片，於120℃環境下放置30分鐘後，於23℃下取出，對於15秒以內手持SUS板201及201’的兩端，於垂直方向進行剝離時的SUS板的分離容易程度進行評價。The prepared test piece was allowed to stand at 120 ° C for 30 minutes, and then taken out at 23 ° C. The SUS plate was easily separated in the vertical direction by holding both ends of the SUS plates 201 and 201 ′ within 15 seconds. Conduct an evaluation.

○：雙面黏貼膠帶因易拆解層內斷裂，不用施加任何力，2塊SUS板即被分離。其結果為不用施加任何力即可拆解試驗片。○: The double-sided adhesive tape is broken due to breakage in the easy-to-remove layer, and no SUS plate is separated without applying any force. As a result, the test piece can be disassembled without applying any force.

△：2塊SUS板接著，但藉由施加很小的力即可將其分離，並可拆解上述試驗片。△: Two SUS plates were next, but they were separated by applying a small force, and the test piece described above was disassembled.

╳：若不用兩手施加相當的力便不能分離2塊SUS板並拆解上述試驗片。╳: If the equivalent force is not applied by both hands, the two SUS plates cannot be separated and the test piece described above is disassembled.

＜構成易拆解層及中芯層的黏結劑的動態黏彈性(儲存彈性模量)測定＞ 將易拆解層及中芯層的製造中所使用的黏結劑溶解於甲苯後，以使乾燥後的厚度成為100μm的方式，使用塗抹機塗布於脫模襯墊的表面，於85℃乾燥5分鐘，藉此形成多片厚度為100μm的黏結劑層。<Measurement of Dynamic Viscoelasticity (Storage Elastic Modulus) of Adhesive constituting the Easy-Release Layer and the Core Layer> The binder used in the production of the easy-to-disassemble layer and the core layer is dissolved in toluene to be dried. After the thickness was 100 μm, it was applied to the surface of the release liner using an applicator, and dried at 85 ° C for 5 minutes, thereby forming a plurality of adhesive layers having a thickness of 100 μm.

然後，藉由將使用相同的黏結劑所得到的黏結劑層重疊，製成由厚度為2mm的黏結劑層構成的試驗片。Then, a test piece composed of a thickness of 2 mm of a binder layer was formed by laminating the adhesive layers obtained by using the same adhesive.

於TA Instruments. Japan.製的黏彈性試驗機(ARES 2kSTD)安裝直徑為7.9mm的平行板。將上述試驗片以壓縮荷重50g夾入該平行板，於頻率1Hz、溫度範圍－60～150℃、及升溫速度2℃/min的條件下，對於23℃的儲存彈性模量(G23 )及於120℃的儲存彈性模量(G120 ) 進行測定。A parallel plate having a diameter of 7.9 mm was attached to a viscoelasticity tester (ARES 2kSTD) manufactured by TA Instruments. Japan. The test piece was sandwiched into the parallel plate at a compression load of 50 g at a frequency of 1 Hz, a temperature range of -60 to 150 ° C, and a temperature increase rate of 2 ° C/min, and a storage elastic modulus (G 23 ) at 23 ° C and The storage elastic modulus (G 120 ) at 120 ° C was measured.

[表1] [Table 1]

[表2] [Table 2]

[表3] [table 3]

1，2‧‧‧雙面黏貼膠帶
10‧‧‧易拆解層
11‧‧‧黏結劑
12‧‧‧熱膨脹性微球(膨脹前)
12’‧‧‧熱膨脹性微球(膨脹後)
20，21‧‧‧黏貼劑層(1)
30，31，32，33，34‧‧‧剝離片
40，41‧‧‧基底膜
50，51‧‧‧被黏體
3，4‧‧‧雙面黏貼膠帶
14‧‧‧熱膨脹性微球(膨脹前)
15‧‧‧易拆解層(1)
16‧‧‧中芯層(1)
22，23‧‧‧黏貼劑層(1)
42，43‧‧‧聚對苯二甲酸乙二醇酯膜
202‧‧‧雙面黏貼膠帶
201，201’‧‧‧SUS板1,2‧‧‧Double adhesive tape
10‧‧‧Dismantling layer
11‧‧‧Adhesive
12‧‧‧Heat-expandable microspheres (before expansion)
12'‧‧‧Hot-expandable microspheres (after expansion)
20,21‧‧‧Adhesive layer (1)
30, 31, 32, 33, 34‧‧‧ peeling film
40,41‧‧‧base film
50, 51‧ ‧ viscous body
3,4‧‧‧Double adhesive tape
14‧‧‧Heat-expandable microspheres (before expansion)
15‧‧‧Dismantling layer (1)
16‧‧‧core layer (1)
22,23‧‧‧Adhesive layer (1)
42,43‧‧ ‧ polyethylene terephthalate film
202‧‧‧Double adhesive tape
201,201'‧‧‧SUS board

[圖1] 係表示根據本發明之雙面黏貼膠帶之實施方式之一例的剖面圖。 [圖2] 係表示根據本發明之雙面黏貼膠帶之實施方式之一例的剖面圖。 [圖3] 係說明根據本發明之雙面黏貼膠帶之製造方法之實施方式之一例的圖。 [圖4] 係說明根據本發明之接著方法之實施方式之一例的圖。 [圖5] 係說明根據本發明之分離方法之實施方式之一例的圖。 [圖6] (a)~(b)係示意性地表示被黏體的分離的狀態的圖。 [圖7] 係表示根據本發明之分離方法之實施方式之一例的剖面圖。 [圖8] (a)~(b)係說明實施例1之雙面黏貼膠帶及比較例1之雙面黏貼膠帶之製造方法，與實施例1之雙面黏貼膠帶及比較例1之雙面黏貼膠帶之構造的圖。 [圖9] 係說明實施例中的拆解性試驗的方法的圖。Fig. 1 is a cross-sectional view showing an example of an embodiment of a double-sided adhesive tape according to the present invention. Fig. 2 is a cross-sectional view showing an example of an embodiment of a double-sided adhesive tape according to the present invention. Fig. 3 is a view showing an example of an embodiment of a method for producing a double-sided adhesive tape according to the present invention. Fig. 4 is a view for explaining an example of an embodiment of a method according to the present invention. Fig. 5 is a view for explaining an example of an embodiment of a separation method according to the present invention. [Fig. 6] (a) to (b) are diagrams schematically showing a state in which the adherend is separated. Fig. 7 is a cross-sectional view showing an example of an embodiment of a separation method according to the present invention. [Fig. 8] (a) to (b) illustrate the method for producing the double-sided adhesive tape of the first embodiment and the double-sided adhesive tape of the first embodiment, and the double-sided adhesive tape of the first embodiment and the double-sided tape of the comparative example 1. A diagram of the construction of the adhesive tape. Fig. 9 is a view showing a method of the disintegration test in the examples.

無no

Claims (12)

一種雙面黏貼膠帶，其特徵在於： 於含有黏結劑及熱膨脹性微球之易拆解層之兩面側具有黏貼劑層。A double-sided adhesive tape characterized by: an adhesive layer on both sides of a easily disassemblable layer containing a binder and heat-expandable microspheres. 如申請專利範圍第1項之雙面黏貼膠帶，其中，該黏結劑係熱塑性樹脂。The double-sided adhesive tape of claim 1, wherein the adhesive is a thermoplastic resin. 如申請專利範圍第1或2項之雙面黏貼膠帶，其中，該黏結劑之於1Hz及23℃之以動態黏彈性譜測定之儲存彈性模量G23 為1.0×103 ～5.0×107 Pa之範圍，於1Hz及120℃之以動態黏彈性譜測定之儲存彈性模量G120 為1.0×102 ～5.0×106 Pa之範圍。The double-sided adhesive tape of claim 1 or 2, wherein the storage elastic modulus G 23 measured by dynamic viscoelasticity at 1 Hz and 23 ° C is 1.0 × 10 3 to 5.0 × 10 7 The range of Pa is such that the storage elastic modulus G 120 measured by dynamic viscoelasticity at 1 Hz and 120 ° C is in the range of 1.0 × 10 2 to 5.0 × 10 6 Pa. 如申請專利範圍第1或2項之雙面黏貼膠帶，其中，該黏結劑係苯乙烯系熱塑性彈性體、烯烴系熱塑性彈性體或丙烯酸系樹脂。The double-sided adhesive tape according to claim 1 or 2, wherein the adhesive is a styrene thermoplastic elastomer, an olefin thermoplastic elastomer or an acrylic resin. 如申請專利範圍第4項之雙面黏貼膠帶，其中，該苯乙烯系熱塑性彈性體含有苯乙烯系二嵌段共聚物及苯乙烯系三嵌段共聚物，且該苯乙烯系二嵌段共聚物之含量相對於該苯乙烯系熱塑性彈性體全體為 10質量%～90質量%之範圍。The double-sided adhesive tape of claim 4, wherein the styrene-based thermoplastic elastomer contains a styrene-based diblock copolymer and a styrene-based triblock copolymer, and the styrene-based diblock copolymer The content of the material is in the range of 10% by mass to 90% by mass based on the total amount of the styrene-based thermoplastic elastomer. 如申請專利範圍第1或2項之雙面黏貼膠帶，其中，該熱膨脹性微球之於120℃之熱膨脹率為150%以上。The double-sided adhesive tape of claim 1 or 2, wherein the heat-expandable microspheres have a thermal expansion coefficient of 150% or more at 120 °C. 如申請專利範圍第1或2項之雙面黏貼膠帶，其中，該熱膨脹性微球係於具有彈性之膠囊內含有因熱而氣化之物質者。The double-sided adhesive tape of claim 1 or 2, wherein the heat-expandable microspheres are contained in a flexible capsule containing a substance vaporized by heat. 如申請專利範圍第1或2項之雙面黏貼膠帶，其中，於該易拆解層及該黏貼劑層之間之至少一者具有基底膜。The double-sided adhesive tape of claim 1 or 2, wherein at least one of the easily disassemblable layer and the adhesive layer has a base film. 如申請專利範圍第8項之雙面黏貼膠帶，其中，於該易拆解層及該黏貼劑層之間之兩者具有基底膜。The double-sided adhesive tape of claim 8, wherein the base layer is provided between the easily disassemblable layer and the adhesive layer. 如申請專利範圍第1或2項之雙面黏貼膠帶，其中，該黏貼劑層之至少一者含有丙烯酸系共聚物。The double-sided adhesive tape of claim 1 or 2, wherein at least one of the adhesive layer contains an acrylic copolymer. 一種物品，其特徵在於： 具有2個以上之被黏體藉由如申請專利範圍第1至10項中任一項之雙面黏貼膠帶接著而形成之構造。An article characterized by having a configuration in which two or more adherends are formed by a double-sided adhesive tape as disclosed in any one of claims 1 to 10. 一種分離方法，藉由將構成如申請專利範圍第11項之物品之該易拆解層加熱，使該熱膨脹性微球膨脹，藉此分離構成該物品之2個以上之被黏體。A separation method in which the heat-expandable microspheres are inflated by heating the easily disassemblable layer constituting the article of claim 11 to separate two or more adherends constituting the article.
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