TW201623163A - Method of chamfering glass - Google Patents
Method of chamfering glass Download PDFInfo
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- TW201623163A TW201623163A TW104131983A TW104131983A TW201623163A TW 201623163 A TW201623163 A TW 201623163A TW 104131983 A TW104131983 A TW 104131983A TW 104131983 A TW104131983 A TW 104131983A TW 201623163 A TW201623163 A TW 201623163A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
- B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
- B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
- B24B9/08—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of glass
- B24B9/10—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of glass of plate glass
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C25/00—Surface treatment of fibres or filaments made from glass, minerals or slags
- C03C25/002—Thermal treatment
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- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Surface Treatment Of Glass (AREA)
Abstract
Description
本發明係關於一種將玻璃倒角的方法，且更特定言之，係關於一種將玻璃倒角的方法，該方法將觸控螢幕面板中所使用之玻璃倒角而不損害該玻璃，同時具有高強度。 The present invention relates to a method of chamfering a glass, and more particularly to a method of chamfering a glass, which chamfers the glass used in the touch screen panel without damaging the glass, and has high strength.
玻璃產品在諸如視訊及光學設備(諸如監視器、攝影機、VTR、行動電話或類似者)、運輸設備(諸如汽車)、各種餐具、建築設施或類似者的廣泛範圍之技術及行業中被處理為整合組件。因此，具有各種性質之玻璃係根據每一行業領域之特性製造且目前在使用。 Glass products are processed in a wide range of technologies and industries such as video and optical equipment (such as monitors, cameras, VTRs, mobile phones or the like), transportation equipment (such as automobiles), various cutlery, building facilities or the like. Integrate components. Therefore, glass having various properties is manufactured according to the characteristics of each industry field and is currently in use.
其中，觸控螢幕作為視訊設備之關鍵組件而非常大地吸引公眾注意力。觸控螢幕為設置於用於終端機之監視器中的顯示及輸入裝置之組合，其中，當使用者藉由用其手指或輔助輸入部件(諸如觸摸或觸控筆)簡單地觸摸、寫字母或繪製數字或類似者來輸入各種資料時，觸控螢幕識別接觸點之座標值以執行對配備觸控螢幕之電子裝置的控制。此觸控螢幕係經由單向或雙向通信傳輸或交換資訊的各種數位裝置之關鍵組件，該等數位裝置諸如行動通信裝置(諸如智慧型手機、電腦、攝影機憑證發佈機器、工業設備或類似者)，且觸控螢幕之重要性程度逐漸增加以及觸控螢幕之使用範圍已在各種領域中快速擴展。 Among them, the touch screen is very important to attract public attention as a key component of video equipment. The touch screen is a combination of display and input devices provided in a monitor for a terminal, wherein the user simply touches and writes letters by using his finger or an auxiliary input member such as a touch or a stylus When drawing a number or the like to input various materials, the touch screen recognizes the coordinate value of the touch point to perform control of the electronic device equipped with the touch screen. The touch screen is a key component of various digital devices that transmit or exchange information via one-way or two-way communication, such as mobile communication devices (such as smart phones, computers, camera voucher publishing machines, industrial equipment, or the like). And the increasing importance of touch screens and the use of touch screens have expanded rapidly in various fields.
在包括於觸控螢幕中之組件中，直接與使用者之手指接觸的上部透明保護膜主要由諸如聚酯、壓克力(acryl)或類似者之塑膠有機材料製成。因為此等塑膠有機材料具有低耐熱性及機械強度，所以由此等材料製成之觸控螢幕由於連續及反覆使用及接觸而可變形、擦傷、斷裂或或類似損壞，且藉此，觸控螢幕之耐久性存在極限。因此，用於觸控螢幕之上部透明保護膜之現有透明塑膠逐漸被具有極佳耐熱性、機械強度及硬度之薄強化玻璃取代。此外，由於薄強化玻璃在LCD或OLED監視器之透明保護性窗口中起作用，因此除觸控螢幕外，薄強化玻璃之使用領域逐漸擴展。 Among the components included in the touch screen, the upper transparent protective film directly contacting the user's finger is mainly made of a plastic organic material such as polyester, acryl or the like. Because these plastic organic materials have low heat resistance and mechanical strength, the touch screen made of such materials can be deformed, scratched, broken or the like due to continuous and repeated use and contact, and thus, touch There is a limit to the durability of the screen. Therefore, the existing transparent plastic used for the transparent protective film on the upper surface of the touch screen is gradually replaced by a thin tempered glass having excellent heat resistance, mechanical strength and hardness. In addition, since thin tempered glass plays a role in the transparent protective window of an LCD or OLED monitor, the use of thin tempered glass has gradually expanded in addition to the touch screen.
當切割強化玻璃時，呈不受控碎裂形式之損害可由於存在於表面中之巨大壓縮應力而非預期形狀之切割而出現，或甚至在以預期形狀切割強化玻璃的情況下，對應於圍繞切割線約20mm之左右範圍的大面積之壓縮應力惡化，且藉此強度可能降低。因此，一旦強化玻璃經回火，即難以以所要大小或形狀來切割玻璃，不論玻璃之組成如何。 When cutting tempered glass, damage in the form of uncontrolled fragmentation may occur due to the large compressive stress present in the surface rather than the cut of the desired shape, or even in the case of cutting the tempered glass in the desired shape, corresponding to surrounding The large-area compressive stress in the range of about 20 mm in the cutting line is deteriorated, and the strength may be lowered by this. Therefore, once the tempered glass is tempered, it is difficult to cut the glass in the desired size or shape regardless of the composition of the glass.
就此而言，相比於切割玻璃之習知方法，在切割強化玻璃之方法中需要更精確且更嚴格的條件。作為切割強化玻璃之方法引入的方法如下。 In this regard, more precise and more stringent conditions are required in the method of cutting tempered glass than conventional methods of cutting glass. The method introduced as a method of cutting the tempered glass is as follows.
第一，存在一種機械切割方法，其包括：藉由跨強化玻璃之表面拖拽鑽石或碳化物雕刻輪而在玻璃板上以機械方式雕刻檢查線；及藉由沿著雕刻檢查線彎曲玻璃板進行切割以形成玻璃之切割邊緣。通常，在上述機械切割方法中，具有約100μm至約150μm之深度的側向裂紋可形成於玻璃板中，其中該等裂紋自雕刻輪之切割線產生。由於側向裂紋降低窗口基板之強度，因此窗口基板之切割部分應藉由拋光移除。 First, there is a mechanical cutting method comprising: mechanically engraving an inspection line on a glass sheet by dragging a diamond or carbide engraving wheel across the surface of the tempered glass; and bending the glass sheet by engraving along the engraving inspection line Cutting is performed to form a cut edge of the glass. Generally, in the above mechanical cutting method, a lateral crack having a depth of about 100 μm to about 150 μm may be formed in a glass sheet, wherein the cracks are generated from a cutting line of the engraving wheel. Since the lateral crack reduces the strength of the window substrate, the cut portion of the window substrate should be removed by polishing.
然而，上述機械切割方法具有如下缺點：需要隨時間替換昂貴的切割輪，此導致成本增加，且不容易實現精確切割。 However, the above mechanical cutting method has a drawback in that it is required to replace an expensive cutting wheel with time, which results in an increase in cost and it is not easy to achieve precise cutting.
接下來，存在一種使用雷射束之非接觸式切割方法，其包括：藉由沿著玻璃表面上的通過雕刻於窗口基板之邊緣上之檢查線的預定路徑移動雷射束來擴展強化玻璃之表面；藉由緊密跟隨在雷射束後之冷卻器使玻璃表面延伸；及熱傳播沿著雷射束之行進路徑所產生之裂紋以切割窗口基板。 Next, there is a non-contact cutting method using a laser beam, which comprises expanding the tempered glass by moving a laser beam along a predetermined path on the glass surface through an inspection line engraved on the edge of the window substrate. a surface; a glass surface extending by a cooler closely following the laser beam; and heat propagating cracks generated along a path of the laser beam to cut the window substrate.
同時，由於強化玻璃之切割平面具有易受外部衝擊損壞的陡峭且不平坦之切割平面，因此應對切割平面執行倒角製程。 At the same time, since the cutting plane of the tempered glass has a steep and uneven cutting plane susceptible to external impact damage, the chamfering process should be performed on the cutting plane.
倒角製程通常藉由研磨切割平面來執行，研磨藉由旋轉拋光輪進行，以便研磨切割部分，亦即將切割部分倒角。當執行倒角製程時，切割部分之光滑度得到改良，藉此使強度增加至某一程度。然而，藉由習知倒角製程難以提供具有極佳強度之窗口基板。 The chamfering process is usually performed by grinding the cutting plane, and the grinding is performed by rotating the polishing wheel to grind the cut portion, that is, to chamfer the cut portion. When the chamfering process is performed, the smoothness of the cut portion is improved, thereby increasing the strength to a certain extent. However, it is difficult to provide a window substrate having excellent strength by a conventional chamfering process.
國際公開案第WO 2005-044512號揭示藉由研磨及/或拋光雕花玻璃基板之邊緣來移除玻璃基板之鋒利邊緣的方法。此方法係藉由在抓緊玻璃基板並輸送其同時將玻璃基板倒角來執行，但此方法具有如下各種缺點。在研磨及/或拋光邊緣期間所產生之顆粒可為造成污染玻璃基板之表面的因素，以使得在倒角製程之後另外需要廣泛的沖洗及乾燥製程。因此，製造成本可增加。另外，玻璃基板之表面可由於俘獲於傳動帶與玻璃基板之間的顆粒及碎片而嚴重受損。此損害可常常造成一系列處理步驟之中斷，且藉此導致處理速率之降低。 International Publication No. WO 2005-044512 discloses a method of removing the sharp edges of a glass substrate by grinding and/or polishing the edges of the engraved glass substrate. This method is performed by chamfering the glass substrate while gripping the glass substrate and transporting it, but this method has various disadvantages as follows. The particles produced during the grinding and/or polishing of the edges can be factors that cause contamination of the surface of the glass substrate such that a wide range of processing and drying processes are additionally required after the chamfering process. Therefore, the manufacturing cost can be increased. In addition, the surface of the glass substrate may be severely damaged by particles and debris trapped between the belt and the glass substrate. This damage can often result in interruption of a series of processing steps and thereby result in a reduction in processing rate.
本發明之一目標為提供一種將玻璃倒角的方法，該方法可在均勻地維持一倒角能力以表現一高強度的同時執行倒角。 It is an object of the present invention to provide a method of chamfering a glass which performs chamfering while uniformly maintaining a chamfering ability to exhibit a high strength.
本發明之另一目標為提供一種將玻璃倒角的方法，其能夠獲得一光滑倒角平面。 Another object of the present invention is to provide a method of chamfering a glass which is capable of obtaining a smooth chamfered plane.
本發明之以上目標將藉由以下特性達成： The above objectives of the present invention will be achieved by the following characteristics:
(1)一種將玻璃倒角的方法，該方法藉由使以200rpm至900rpm之一旋轉速度旋轉之一加熱源接觸至玻璃之一側面邊緣且接著將該邊緣倒角來執行，其中由該加熱源供應至該玻璃之一總熱量滿足以下式1之一條件：
(其中，Q表示由該加熱源供應至該玻璃之該總熱量)。 (where Q represents the total amount of heat supplied to the glass by the heat source).
(2)根據上文(1)之組合物，其中該加熱源在倒角期間具有1,300℃至1,700℃之一溫度。 (2) The composition according to (1) above, wherein the heat source has a temperature of from 1,300 ° C to 1,700 ° C during chamfering.
(3)根據上文(1)之組合物，其中該加熱源在倒角期間以0.5公尺/分鐘至5公尺/分鐘之一移動速度移動。 (3) The composition according to (1) above, wherein the heat source moves at a moving speed of one of 0.5 m/min to 5 m/min during chamfering.
(4)根據上文(1)之組合物，其中該玻璃具有200kgf/mm2至1,200kgf/mm2之一維氏硬度。 (4) The above composition (1) of which the glass has 200kgf / mm 2 to 1,200kgf / mm 2 Vickers hardness one.
(5)根據上文(1)之組合物，其中該玻璃為一強化玻璃。 (5) The composition according to (1) above, wherein the glass is a tempered glass.
(6)根據上文(5)之組合物，其中該強化玻璃具有具10μm至200μm之一深度的一強化層。 (6) The composition according to (5) above, wherein the tempered glass has a reinforcing layer having a depth of from 10 μm to 200 μm.
根據本發明，當使該加熱源接觸至該玻璃該側面邊緣時，一特定範圍之一熱量在使該加熱源旋轉的同時供應且傳遞至該玻璃，以使得 該加熱源中之一溫度分佈係均勻的，且藉此在提供一高強度之同時均勻地維持該玻璃基板之倒角能力。 According to the present invention, when the heating source is brought into contact with the side edge of the glass, heat of a certain range is supplied and transmitted to the glass while rotating the heating source, so that One of the heat sources has a uniform temperature distribution and thereby uniformly maintains the chamfering ability of the glass substrate while providing a high strength.
另外，根據本發明，有可能有效地移除產生於該玻璃之側面上的細裂紋，以提供具有一高強度之一光滑倒角平面。 Further, according to the present invention, it is possible to effectively remove the fine cracks generated on the side faces of the glass to provide a smooth chamfer plane having a high strength.
10‧‧‧加熱源 10‧‧‧heat source
11‧‧‧玻璃基板 11‧‧‧ glass substrate
20‧‧‧感應線圈 20‧‧‧Induction coil
自結合隨附圖式進行之以下詳細描述將更清楚地理解本發明之以上及其他目標、特徵及其他優點，其中：圖1為示意地說明藉由高頻率感應加熱方法加熱之加熱源的視圖。 The above and other objects, features and other advantages of the present invention will be more clearly understood from the aspects of the appended claims appended < .
圖2為示意地說明倒角方法的視圖，在該倒角方法中，加熱源在接觸玻璃基板的同時移動以藉由使用熱應力移除成條帶形狀的藉由彼此正交之水平表面及垂直表面形成的玻璃基板之邊緣。 2 is a view schematically illustrating a chamfering method in which a heating source moves while contacting a glass substrate to remove a horizontal surface which is orthogonal to each other by using thermal stress into a strip shape and The edge of the glass substrate formed by the vertical surface.
圖3為說明當感應線圈之中心與加熱源之中心彼此不重合時的加熱源中之溫度分佈的視圖。 Fig. 3 is a view for explaining a temperature distribution in a heating source when the center of the induction coil and the center of the heating source do not coincide with each other.
圖4為示意地說明當感應線圈之中心與加熱源之中心彼此不重合時，倒角之前及之後的玻璃基板之表面的視圖。 4 is a view schematically showing the surface of the glass substrate before and after chamfering when the center of the induction coil and the center of the heating source do not coincide with each other.
圖5為示意地說明根據本發明之倒角方法的視圖。 Figure 5 is a view schematically illustrating a chamfering method according to the present invention.
圖6為說明根據本發明之倒角方法中的加熱源中之溫度分佈的視圖。 Fig. 6 is a view for explaining a temperature distribution in a heat source in a chamfering method according to the present invention.
圖7為示意地說明根據本發明之倒角方法中的倒角之前及之後的玻璃基板之表面的視圖。 Figure 7 is a view schematically showing the surface of a glass substrate before and after chamfering in the chamfering method according to the present invention.
圖8為根據本發明倒角的玻璃之側面的示意截面圖(a)及正視圖(b)。 Figure 8 is a schematic cross-sectional view (a) and a front view (b) of a side of a glass chamfered in accordance with the present invention.
圖9為示意地說明根據本發明之具體實例之倒角方法的視圖。 Fig. 9 is a view schematically illustrating a chamfering method according to a specific example of the present invention.
圖10為示意地說明根據本發明之另一具體實例之倒角方法的視圖。 Figure 10 is a view schematically illustrating a chamfering method according to another embodiment of the present invention.
本發明揭示一種將玻璃倒角的方法，該方法藉由使以200rpm至900rpm之一旋轉速度旋轉之一加熱源接觸至玻璃之一側面邊緣且接著將該邊緣倒角來執行，其中由該加熱源供應至該玻璃之一總熱量滿足式1之一條件。因此，有可能均勻地維持一倒角能力以表現一高強度。 The present invention discloses a method of chamfering a glass by contacting one of the heat sources at a rotational speed of 200 rpm to 900 rpm to one of the side edges of the glass and then chamfering the edge, wherein the heating is performed by the heating The source supplies one of the total heat of the glass to satisfy one of the conditions of Formula 1. Therefore, it is possible to uniformly maintain a chamfering ability to express a high intensity.
在下文中，將參看附圖詳細地描述本發明之例示性具體實例。 Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.
本發明之倒角方法為一種將玻璃基板倒角的方法，如圖1中所說明，其中使用感應線圈20藉由高頻率感應加熱方法加熱的加熱源10接觸玻璃基板之邊緣，且移動以藉由使用熱應力來移除玻璃基板之邊緣部分。當使加熱源接觸至玻璃基板之邊緣時，熱應力在與加熱源接觸到的邊緣部分處由具有低熱傳遞率之玻璃特性而產生，且藉此，自與加熱源接觸之部分起至一預定深度的一部分被切除。因此，當加熱源在與玻璃基板之邊緣接觸同時移動時，可將玻璃基板之邊緣倒角。 The chamfering method of the present invention is a method for chamfering a glass substrate, as illustrated in FIG. 1, wherein the heating source 10 heated by the high frequency induction heating method using the induction coil 20 contacts the edge of the glass substrate, and moves to borrow The edge portion of the glass substrate is removed by using thermal stress. When the heat source is brought into contact with the edge of the glass substrate, the thermal stress is generated by the glass characteristic having a low heat transfer rate at the edge portion in contact with the heat source, and thereby, from the portion in contact with the heat source to a predetermined A part of the depth is cut off. Therefore, when the heat source moves while being in contact with the edge of the glass substrate, the edge of the glass substrate can be chamfered.
然而，當藉由使使用如圖1中所說明之感應線圈20由高頻率感應加熱方法加熱的加熱源10接觸至玻璃基板11且如圖2中所說明地移動玻璃基板(在藉由圖2中之箭頭說明之方向上)進行倒角時，若感應線圈20之中心與加熱源10之中心彼此不重合，則加熱源10之表面中之溫度分佈不恆定，且因此，玻璃基板之倒角量及粗糙度不均勻，如圖4中所說明，藉此使玻璃基板之強度減小。然而，使感應線圈20之中心與加熱源10之中心重合的操作難以實踐，且需要大量時間及努力。 However, when the heating source 10 heated by the high frequency induction heating method using the induction coil 20 as illustrated in FIG. 1 is brought into contact with the glass substrate 11 and the glass substrate is moved as illustrated in FIG. 2 (in FIG. 2) When the chamfering is performed in the direction indicated by the arrow, if the center of the induction coil 20 and the center of the heating source 10 do not coincide with each other, the temperature distribution in the surface of the heating source 10 is not constant, and therefore, the chamfer of the glass substrate The amount and roughness are not uniform, as illustrated in Figure 4, whereby the strength of the glass substrate is reduced. However, the operation of overlapping the center of the induction coil 20 with the center of the heat source 10 is difficult to practice and requires a lot of time and effort.
考慮到此情形，在本發明之倒角方法中，倒角係藉由以200 rpm至900rpm之一旋轉速度旋轉加熱源10來執行，以解決上述問題。 In view of this situation, in the chamfering method of the present invention, the chamfering is performed by 200 The heating source 10 is rotated at a rotational speed of rpm to 900 rpm to perform the above problem.
當加熱源以在以上範圍內之旋轉速度旋轉時，即使感應線圈之中心與加熱源之中心彼此不重合，加熱源中之溫度分佈亦為恆定的。在本發明中，加熱源中之恆定溫度分佈包括加熱源之表面上的10℃或小於10℃之溫差。如圖5中所說明，根據包括旋轉加熱源10的本發明之倒角方法，如圖6中所說明，加熱源10之表面中之溫度分佈係恆定的。因此，倒角量可為均勻的，且可在倒角平面中提供高強度。 When the heating source is rotated at a rotational speed within the above range, even if the center of the induction coil and the center of the heating source do not coincide with each other, the temperature distribution in the heating source is constant. In the present invention, the constant temperature distribution in the heat source includes a temperature difference of 10 ° C or less on the surface of the heat source. As illustrated in Fig. 5, according to the chamfering method of the present invention including the rotary heat source 10, as illustrated in Fig. 6, the temperature distribution in the surface of the heat source 10 is constant. Therefore, the amount of chamfering can be uniform and high strength can be provided in the chamfered plane.
另外，由於加熱源在其旋轉之同時接觸至玻璃基板之側面邊緣，如圖7中所說明，因此來自加熱源之熱經由玻璃基板徑向地擴散，且藉此，倒角量可更均勻，且玻璃基板之表面在倒角之後可為均勻的。 In addition, since the heating source contacts the side edges of the glass substrate while it is rotating, as illustrated in FIG. 7, heat from the heating source is radially diffused through the glass substrate, and thereby, the amount of chamfering can be more uniform, And the surface of the glass substrate may be uniform after chamfering.
若加熱源以小於200rpm之旋轉速度旋轉，則靠近感應線圈之部分與遠離感應線圈之部分之間的溫差為20℃或大於20℃，以使得加熱源中之溫度分佈可不均勻，且倒角量可由於此現象而不相等。而在加熱源以超過900rpm之旋轉速度旋轉的情況下，玻璃可由於加熱源以過度高速旋轉而斷裂。 If the heating source rotates at a rotation speed of less than 200 rpm, the temperature difference between the portion close to the induction coil and the portion away from the induction coil is 20 ° C or more, so that the temperature distribution in the heating source may be uneven, and the amount of chamfering It can be unequal by this phenomenon. On the other hand, in the case where the heating source is rotated at a rotation speed exceeding 900 rpm, the glass may be broken due to excessive heating at a high speed.
在根據本發明之倒角方法中，為了表現本發明之效應，當加熱源在以上旋轉速度內旋轉時，較佳地，由加熱源供應至玻璃之總熱量經設定以滿足以下式1之一條件。 In the chamfering method according to the present invention, in order to express the effect of the present invention, when the heating source is rotated within the above rotational speed, preferably, the total amount of heat supplied from the heating source to the glass is set to satisfy one of the following formulas 1 condition.
(其中，Q表示由該加熱源供應至該玻璃之該總熱量)。 (where Q represents the total amount of heat supplied to the glass by the heat source).
藉由該加熱源供應至該玻璃之該總熱量可藉由使用以下各 者來控制：玻璃之導熱性、加熱源之溫度、玻璃之溫度、加熱源之移動速度、加熱源在玻璃方向上移動之距離或類似者。若總的供應熱量小於50千卡，則切掉玻璃基板之邊緣部分所需的熱應力不足夠且倒角可不執行，而若總的供應熱量超過200千卡，則變形可由於過度熱應力而出現在玻璃基板中，且玻璃之斷裂可能發生。 The total amount of heat supplied to the glass by the heating source can be achieved by using the following To control: the thermal conductivity of the glass, the temperature of the heating source, the temperature of the glass, the moving speed of the heating source, the distance the heating source moves in the direction of the glass, or the like. If the total supplied heat is less than 50 kcal, the thermal stress required to cut off the edge portion of the glass substrate is insufficient and chamfering may not be performed, and if the total supplied heat exceeds 200 kcal, the deformation may be due to excessive thermal stress. Appears in the glass substrate and breakage of the glass may occur.
另外，根據本發明之倒角方法可藉由使具有1,300℃至1,700℃之溫度之加熱源接觸至玻璃之側面邊緣來執行。當使具有以上範圍內之溫度之加熱源接觸至玻璃之側面邊緣時，熱應力在玻璃之邊緣部分處產生，以使得距離與加熱源接觸之部分一預定深度之一部分被切除。根據根據本發明之倒角方法，執行切割製程期間的玻璃之顯著減小伸長率可大大地增加至0.4%或大於0.4%，且藉此，玻璃之強度可得到改良。另外，有可能獲得背景中所描述之以上圖案更均勻的表面，且顯著減少倒角時間。 Further, the chamfering method according to the present invention can be carried out by bringing a heat source having a temperature of 1,300 ° C to 1,700 ° C into contact with the side edges of the glass. When the heat source having the temperature within the above range is brought into contact with the side edge of the glass, thermal stress is generated at the edge portion of the glass such that a portion of the predetermined contact depth from the portion in contact with the heat source is cut off. According to the chamfering method according to the present invention, the significant decrease in elongation of the glass during the cutting process can be greatly increased to 0.4% or more, and thereby, the strength of the glass can be improved. In addition, it is possible to obtain a more uniform surface of the above pattern as described in the background, and to significantly reduce the chamfering time.
在根據本發明之倒角方法中，加熱源在倒角期間可具有1,300℃至1,700℃之一溫度。若加熱源之溫度小於1,300℃，則倒角可不執行，而若加熱源之溫度超過1,700℃，則強化玻璃可變得熔化。 In the chamfering method according to the present invention, the heat source may have a temperature of 1,300 ° C to 1,700 ° C during chamfering. If the temperature of the heating source is less than 1,300 ° C, the chamfering may not be performed, and if the temperature of the heating source exceeds 1,700 ° C, the tempered glass may become melted.
此外，在根據本發明之倒角方法中，接觸玻璃之側面邊緣的加熱源可以例如0.5公尺/分鐘至5公尺/分鐘之移動速度沿著待倒角之部分移動。若移動速度小於0.5公尺/分鐘，則存在保護層之損壞、切割量之增加及玻璃熔化的問題，而若移動速度超過5公尺/分鐘，則倒角平面可能粗糙，且倒角形狀可能不均勻。 Further, in the chamfering method according to the present invention, the heat source contacting the side edges of the glass may be moved along the portion to be chamfered, for example, at a moving speed of 0.5 m/min to 5 m/min. If the moving speed is less than 0.5 m/min, there is a problem of damage of the protective layer, an increase in the amount of cutting, and melting of the glass, and if the moving speed exceeds 5 m/min, the chamfering plane may be rough, and the chamfer shape may be Not uniform.
在根據本發明之倒角方法中，可用作為熱源之材料並無特定限制，只要該材料可在上述溫度範圍內傳遞熱而不使強化玻璃變形。舉例 而言，可使用陶瓷材料等，但該材料不限於此。 In the chamfering method according to the present invention, the material usable as the heat source is not particularly limited as long as the material can transfer heat within the above temperature range without deforming the tempered glass. Example In terms of ceramic materials or the like, the material is not limited thereto.
另外，本發明之倒角方法可應用至的玻璃基板之類型並無特定限制。舉例而言，可使用習知玻璃、強化玻璃或類似者。可使用具有200kgf/mm2至1,200kgf/mm2且較佳600kgf/mm2至700kgf/mm2之一維氏硬度的強化玻璃。 Further, the type of the glass substrate to which the chamfering method of the present invention can be applied is not particularly limited. For example, conventional glass, tempered glass or the like can be used. It can be used with 200kgf / mm 2 to 1,200kgf / mm 2 and preferably 600kgf / mm 2 to 700kgf / mm 2 one glass reinforced Vickers hardness.
此外，玻璃基板之類型並非特定的，只要其為強化玻璃，但強化玻璃具有可具有10μm至200μm(在一較佳具體實例中)、40μm至200μm(在另一具體實例中)及120μm至200μm(在另一具體實例中)之一深度的強化層。 Further, the type of the glass substrate is not specific as long as it is a tempered glass, but the tempered glass may have 10 μm to 200 μm (in a preferred embodiment), 40 μm to 200 μm (in another specific example), and 120 μm to 200 μm. (In another specific example) one of the depth enhancement layers.
在本發明之另一態樣中，本發明之倒角方法可應用至的強化玻璃可具有60至90GPa且較佳65至85GPa之楊氏模數。 In another aspect of the invention, the tempered glass to which the chamfering method of the present invention is applicable may have a Young's modulus of 60 to 90 GPa and preferably 65 to 85 GPa.
在下文中，將參看附圖詳細地描述根據本發明之具體實例之倒角方法。在根據本發明之倒角方法中，玻璃之側面的上部邊緣部分及下部邊緣部分可經傾斜地倒角。圖8示意地說明根據本發明之倒角方法倒角的玻璃之側面，其中(a)為截面圖且(b)為正視圖。 Hereinafter, a chamfering method according to a specific example of the present invention will be described in detail with reference to the accompanying drawings. In the chamfering method according to the present invention, the upper edge portion and the lower edge portion of the side of the glass may be chamfered obliquely. Figure 8 is a schematic illustration of the side of a glass chamfered according to the chamfering method of the present invention, wherein (a) is a cross-sectional view and (b) is a front view.
在將如圖3中所說明的玻璃之側面之上部邊緣部分及下部邊緣部分傾斜地倒角的方法中，接觸加熱源的特定順序或數目，或加熱源之傾角並無特定限制，只要上部邊緣部分及下部邊緣部分之最終形狀係傾斜地形成。 In the method of obliquely chamfering the upper edge portion and the lower edge portion of the side surface of the glass as illustrated in FIG. 3, the specific order or number of contact heat sources, or the inclination angle of the heat source is not particularly limited as long as the upper edge portion And the final shape of the lower edge portion is formed obliquely.
更具體言之，例如，在本發明之一個具體實例中，可藉由使加熱源接觸至玻璃之上部邊緣部分及下部邊緣部分來執行倒角。如圖9中所示意地說明，傾斜平面可藉由使加熱源接觸至玻璃之側面的上部邊緣部 分①及下部邊緣部分②來形成。 More specifically, for example, in one embodiment of the present invention, chamfering can be performed by bringing a heat source into contact with the upper edge portion and the lower edge portion of the glass. As illustrated in Figure 9, the inclined plane can be contacted to the upper edge of the side of the glass by contacting the heating source The minute 1 and the lower edge portion 2 are formed.
在本發明之另一具體實例中，倒角可藉由使加熱源接觸至玻璃之側面的上部邊緣部分及下部邊緣部分，且接著在平行於玻璃之側面的方向上使加熱源接觸至玻璃之側面而執行。當待藉由倒角方法移除的強化玻璃之區域為大時，可有效地使用本發明具體實例。圖10示意地說明根據本具體實例之倒角方法。參看圖10，首先，加熱源接觸玻璃之側面的上部邊緣部分以形成至預定部分之傾斜平面①。接下來，加熱源接觸玻璃之側面的下部邊緣部分，以形成至預定部分之傾斜平面②。接著，加熱源在平行於玻璃之側面的方向上接觸玻璃之側面以移除玻璃至所需部分③，藉此可獲得最終截面形狀。 In another embodiment of the present invention, the chamfering may be performed by contacting the heating source with the upper edge portion and the lower edge portion of the side of the glass, and then contacting the heating source to the glass in a direction parallel to the side of the glass. Executed on the side. When the area of the tempered glass to be removed by the chamfering method is large, the specific example of the present invention can be effectively used. Figure 10 schematically illustrates a chamfering method in accordance with this embodiment. Referring to Fig. 10, first, the heat source contacts the upper edge portion of the side of the glass to form an inclined plane 1 to a predetermined portion. Next, the heat source contacts the lower edge portion of the side of the glass to form an inclined plane 2 to a predetermined portion. Next, the heat source contacts the side of the glass in a direction parallel to the side of the glass to remove the glass to the desired portion 3, whereby the final cross-sectional shape can be obtained.
另外，在本發明之當前具體實例中，倒角之順序可改變，即，倒角可藉由不同於圖10中所說明之順序的順序執行。舉例而言，倒角可以②、①及③之順序或③、②及①之順序執行，但其不限於此。 Further, in the current embodiment of the present invention, the order of the chamfers may be changed, that is, the chamfering may be performed by an order different from the order illustrated in FIG. For example, the chamfering may be performed in the order of 2, 1, and 3 or in the order of 3, 2, and 1, but is not limited thereto.
當藉由加熱源進行的玻璃之側面的傾斜平面處理如上所述地完成時，可視需要進一步執行玻璃之側面之表面的加強製程。藉由上述加強製程，有可能提供具有經改良強度的玻璃之側面的更均勻表面。 When the inclined plane processing of the side of the glass by the heat source is completed as described above, the reinforcing process of the surface of the side surface of the glass may be further performed as needed. By the above-described reinforcing process, it is possible to provide a more uniform surface of the side of the glass having improved strength.
加強製程可包括藉由使用拋光輪研磨玻璃之側面，或藉由使用包括氟酸(fluoric acid；HF)之蝕刻劑組合物蝕刻玻璃之側面。 Strengthening the process may include grinding the sides of the glass by using a polishing wheel, or etching the sides of the glass by using an etchant composition comprising fluoric acid (HF).
首先，執行藉由使用拋光輪研磨玻璃之側面的方法，其方式為，在藉由加熱源形成傾斜平面完成之後，旋轉的拋光輪接觸玻璃之側面以更均勻地研磨玻璃之側面。藉此，存在於玻璃之側面之表面上的細裂紋等經研磨以加強玻璃側面。 First, a method of grinding the side of the glass by using a buffing wheel is performed in such a manner that after the inclined plane is formed by the heat source, the rotating buffing wheel contacts the side of the glass to more uniformly grind the side of the glass. Thereby, fine cracks or the like existing on the surface of the side surface of the glass are ground to strengthen the side surface of the glass.
拋光輪可使用由諸如氧化鈰之磨料顆粒製成之輪。較佳地，磨料顆粒依據玻璃之側面之充分表達加強效果而具有5μm或小於5μm之大小。由於磨料顆粒之大小的減小導致研磨拋光準確度的增加，因此磨料顆粒愈小愈好。因此，儘管大小的下限並無特定限制，但考慮到製程時間或類似者可使用具有約0.01μm之大小的磨料顆粒。 The polishing wheel can use a wheel made of abrasive particles such as cerium oxide. Preferably, the abrasive particles have a size of 5 μm or less depending on the sufficient expression enhancing effect of the side of the glass. Since the reduction in the size of the abrasive particles results in an increase in the accuracy of the abrasive polishing, the smaller the abrasive particles, the better. Therefore, although the lower limit of the size is not particularly limited, abrasive grains having a size of about 0.01 μm may be used in consideration of the process time or the like.
拋光輪之旋轉速度並無特定限制，但其可經適合選擇以充分研磨玻璃之側面，以便獲得所需強度位準，且旋轉速度可為(例如)1,000rpm至10,000rpm。 The rotation speed of the polishing wheel is not particularly limited, but it may be suitably selected to sufficiently grind the side of the glass to obtain a desired strength level, and the rotation speed may be, for example, 1,000 rpm to 10,000 rpm.
接下來，執行使用包括氟酸之蝕刻劑來蝕刻玻璃之側面的方法，其方式為，將包括氟酸之蝕刻劑施加至玻璃之側面以蝕刻玻璃之側面之表面部分。當玻璃之側面藉由包括氟酸之蝕刻劑組合物蝕刻時，壓印圖案藉由蝕刻而形成於玻璃之側面之表面上以加強玻璃之側面之表面。 Next, a method of etching the side of the glass using an etchant including hydrofluoric acid is performed by applying an etchant including hydrofluoric acid to the side of the glass to etch the surface portion of the side of the glass. When the side of the glass is etched by an etchant composition comprising hydrofluoric acid, the embossed pattern is formed on the surface of the side of the glass by etching to strengthen the surface of the side of the glass.
包括氟酸之蝕刻劑為氟酸溶液，且可進一步包含(例如)除氟酸以外的所需酸組份，諸如氫氯酸、硝酸或硫酸等，該等酸在相關技術中被稱為玻璃蝕刻組合物。 The etchant including the hydrofluoric acid is a hydrofluoric acid solution, and may further contain, for example, a desired acid component other than hydrofluoric acid, such as hydrochloric acid, nitric acid or sulfuric acid, etc., which are referred to as glass in the related art. Etching the composition.
用於藉由包括氟酸之蝕刻劑蝕刻玻璃之側面的時間並無特定限制，但可在增加玻璃之強度方面在不在玻璃側面上過蝕刻的情況下(例如)在30秒至10分鐘之範圍內執行蝕刻。 The time for etching the side of the glass by an etchant including hydrofluoric acid is not particularly limited, but may be in the range of 30 seconds to 10 minutes in the case of increasing the strength of the glass without over-etching on the side of the glass (for example) Etching is performed inside.
包括氟酸之蝕刻劑在蝕刻期間的溫度並無特定限制，但蝕刻較佳地(例如)在20℃至50℃之範圍內執行。若蝕刻溫度小於20℃，則製程時間可增加且蝕刻不足可出現，而蝕刻溫度超過50℃，製程時間減少，但蝕刻可不均勻地進行。 The temperature of the etchant including the fluoric acid during the etching is not particularly limited, but the etching is preferably performed, for example, in the range of 20 ° C to 50 ° C. If the etching temperature is less than 20 ° C, the process time can be increased and insufficient etching can occur, and the etching temperature exceeds 50 ° C, and the process time is reduced, but the etching can be performed unevenly.
包括氟酸之蝕刻劑可藉由先前技術中已知的任何方法(諸如注入蝕刻劑至玻璃之側面、將玻璃之側面浸沒於蝕刻劑中或類似者)施加至玻璃之側面。 The etchant comprising fluoric acid can be applied to the side of the glass by any method known in the art, such as by injecting an etchant to the side of the glass, immersing the side of the glass in an etchant or the like.
在下文中，提議較佳具體實例以更具體地描述本發明。然而，給出以下實例僅用於說明本發明，且熟習此項技術者將顯然瞭解，在本發明之範圍及精神內，各種更改及修改為可能的。此等更改及修改恰當包括於所附申請專利範圍中。 In the following, preferred embodiments are proposed to more specifically describe the invention. However, the following examples are given to illustrate the invention, and it is obvious to those skilled in the art that various changes and modifications are possible within the scope and spirit of the invention. Such changes and modifications are appropriately included in the scope of the appended claims.
實例及比較實例Examples and comparison examples
藉由在如下表1中所描述之條件下使加熱源接觸至玻璃基板之側邊緣來執行倒角。 The chamfering was performed by contacting the heating source to the side edges of the glass substrate under the conditions described in Table 1 below.
使用康寧公司(Coming Co.)之大猩猩(Gorilla)玻璃作為玻璃基板，且該玻璃之性質如下表2中所示。 Corning glass of Coming Co. was used as a glass substrate, and the properties of the glass are shown in Table 2 below.
實驗實施例Experimental example
量測該等實施例及該等比較實施例中所準備的加熱源之溫度分佈、可工作性及伸長率，且量測結果描述於下表3中。伸長率係藉由50種或50種以上的強化玻璃之平均值來判定。 The temperature distribution, workability, and elongation of the heat sources prepared in the examples and the comparative examples were measured, and the measurement results are described in Table 3 below. The elongation is determined by the average of 50 or more tempered glass.
(2)加熱源中之溫度分佈的評估(2) Evaluation of temperature distribution in the heating source
藉由使用光學溫度量測裝置(pa21afll，Keller co.)在旋轉加熱源之同時量測在實施例及比較實施例中所準備之加熱源的靠近感應線圈之部分與遠離感應線圈之部分之間的溫差，且量測結果描述於下表3中。 By using an optical temperature measuring device (pa21afll, Keller co.), between the portion close to the induction coil and the portion away from the induction coil of the heating source prepared in the embodiment and the comparative example, while rotating the heating source The temperature difference and the measurement results are described in Table 3 below.
◎：無溫差 ◎: no temperature difference
○：10℃或小於10℃之溫差 ○: Temperature difference of 10 ° C or less
△：超過10℃但小於等於20℃之溫差 △: temperature difference exceeding 10 ° C but less than or equal to 20 ° C
×：超過20℃之溫差 ×: temperature difference exceeding 20 ° C
(2)可工作性的評估(倒角量均勻性)(2) Evaluation of workability (chamfering amount uniformity)
在執行實施例及比較實施例之倒角製程之後，量測表面粗糙度(Ra)以確認倒角量均勻性，且其結果展示於下表3中。 After performing the chamfering process of the examples and comparative examples, the surface roughness (Ra) was measured to confirm the uniformity of the chamfer amount, and the results are shown in Table 3 below.
○：20μm或小於20μm之表面粗糙度差 ○: difference in surface roughness of 20 μm or less
△：超過20μm之表面粗糙度差 △: difference in surface roughness exceeding 20 μm
×：強化玻璃斷裂 ×: tempered glass break
(3)伸長率的評估(3) Evaluation of elongation
伸長率係能夠評估強化玻璃之強度的指數，且以如下方式量測：將兩個分開的支撐延伸體(span)在實施例及比較實施例中所準備之強化玻璃基板之下自中心安置於對置側處，且當將負載藉由定位於基板之中心上部部分上之上部延伸件施加至窗口基板之上部部分時，量測上部延伸件接觸窗口基板所在之點與窗口基板斷裂(十字頭移位)所在之點之間的距離，以便根據以下式2計算伸長率，且計算之結果展示於下表3中。 Elongation is an index capable of evaluating the strength of the tempered glass and is measured in such a manner that two separate support extensions are placed from the center under the tempered glass substrate prepared in the examples and comparative examples. At the opposite side, and when the load is applied to the upper portion of the window substrate by positioning the upper extension on the upper portion of the center of the substrate, measuring the point at which the upper extension contacts the window substrate breaks with the window substrate (crosshead) The distance between the points at which the shift is located is to calculate the elongation according to the following formula 2, and the results of the calculation are shown in Table 3 below.
[式2]伸長率(%)=(6T δ)/s2 [Formula 2] Elongation (%) = (6T δ) / s 2
(其中，T指示窗口基板之厚度(mm)，δ指示十字頭移位(mm)，s指示支撐延伸件之間的距離(mm))。 (where T indicates the thickness (mm) of the window substrate, δ indicates the crosshead displacement (mm), and s indicates the distance (mm) between the support extensions.
參考上表3，可以看出，根據係根據本發明之倒角方法之條件所執行的實施例之強化玻璃具有加熱源中之恆定溫度分佈，同時表現出大於0.8%之高伸長率，及與比較實施例相比顯著改良之可工作性。 Referring to Table 3 above, it can be seen that the tempered glass of the embodiment performed according to the conditions of the chamfering method according to the present invention has a constant temperature distribution in the heating source while exhibiting a high elongation of more than 0.8%, and The comparative examples have significantly improved operability compared to the comparative examples.
然而，可以看出，在本發明之條件外的比較實施例之強化玻璃具有顯著減小的伸長率及可工作性。 However, it can be seen that the tempered glass of the comparative example outside the conditions of the present invention has significantly reduced elongation and workability.
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| US6325704B1 (en) * | 1999-06-14 | 2001-12-04 | Corning Incorporated | Method for finishing edges of glass sheets |
| JP3719904B2 (en) * | 2000-04-13 | 2005-11-24 | シャープ株式会社 | Method for chamfering glass substrate of liquid crystal display device and heater used in the method |
| US7125319B2 (en) | 2003-10-27 | 2006-10-24 | Corning Incorporated | Apparatus and method for grinding and/or polishing an edge of a glass sheet |
| US9027364B2 (en) * | 2006-11-15 | 2015-05-12 | Furukawa Electric Co., Ltd. | Method of manufacturing glass substrate |
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| WO2013099847A1 (en) * | 2011-12-28 | 2013-07-04 | 旭硝子株式会社 | Method for manufacturing sensor-integrated cover glass, and sensor-integrated cover glass |
| JP2015091610A (en) * | 2012-02-22 | 2015-05-14 | 旭硝子株式会社 | Glass plate end surface treatment method |
| KR101405442B1 (en) * | 2012-08-01 | 2014-06-13 | 주식회사 라미넥스 | Method for cutting of corner of glass using |
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