TW201619082A - Scribing head device of laminated substrate - Google Patents

Scribing head device of laminated substrate Download PDF

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Publication number
TW201619082A
TW201619082A TW104124711A TW104124711A TW201619082A TW 201619082 A TW201619082 A TW 201619082A TW 104124711 A TW104124711 A TW 104124711A TW 104124711 A TW104124711 A TW 104124711A TW 201619082 A TW201619082 A TW 201619082A
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Prior art keywords
substrate
air bearing
wheel
head
contact air
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TW104124711A
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Chinese (zh)
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TWI690499B (en
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Won-Yong Ju
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Mitsuboshi Diamond Ind Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/10—Glass-cutting tools, e.g. scoring tools
    • C03B33/105—Details of cutting or scoring means, e.g. tips
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/08—Means for treating work or cutting member to facilitate cutting
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/0207—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet being in a substantially vertical plane
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/03—Glass cutting tables; Apparatus for transporting or handling sheet glass during the cutting or breaking operations
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/037—Controlling or regulating

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • Mechanical Engineering (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Liquid Crystal (AREA)

Abstract

The scribing head device of laminated substrate of the present invention can obtain the excellent scribing quality even under situations of different thicknesses of each substrate constituting the laminated substrate. By means of at least one of a pair of scribing heads oppositely disposed by each of the upper/lower faces of the laminated substrate 3, the non-contact air bearing part 30 with surface-injecting air is disposed and attached towards the laminated substrate 3 to thereby be able to maintain the force balance even under the situation of different load from the lower scribing head to that from the upper scribing head according to the substrate thickness, and to be able to obtain the same dividing precision on the two faces of the laminated substrate.

Description

貼合基板之刻劃頭裝置 Scratch head device for bonding substrates

本發明是關於一種貼合基板之刻劃頭裝置，更具體而言，是關於一種能夠同時對貼合有相互不同厚度之基板而成之貼合基板之兩面進行刻劃的貼合基板之刻劃頭裝置。 The present invention relates to a scriber device for bonding a substrate, and more particularly to a substrate for affixing both sides of a bonded substrate formed by bonding substrates having different thicknesses to each other at the same time. Scratch device.

一般而言，作為玻璃基板等脆性材料基板，被製造有貼合厚度互為相同之二枚基板而成之貼合基板(以下，亦稱為貼合單元)。 In general, as a brittle material substrate such as a glass substrate, a bonded substrate (hereinafter also referred to as a bonding unit) in which two substrates having the same thickness are bonded to each other is produced.

針對同時對如此般之貼合單元之上下兩面進行刻劃之習知的刻劃頭裝置參照圖1進行說明。 A conventional scoring head device for scribing both upper and lower sides of such a bonding unit will be described with reference to Fig. 1 .

參照圖1，以貼合相同厚度之二枚玻璃之方式形成貼合單元1，在該貼合單元1之上部設置上部刻劃頭10，在貼合單元1之下部設置下部刻劃頭20。然後，當將分別安裝於上部刻劃頭10及下部刻劃頭20之刻劃輪，對貼合單元1之上下面以相同壓力(負載)加壓並行進時，則同時刻劃貼合單元1之上下面。 Referring to Fig. 1, a bonding unit 1 is formed so as to bond two glasses of the same thickness, an upper scribe head 10 is provided on the upper portion of the bonding unit 1, and a lower scribe head 20 is provided on the lower portion of the bonding unit 1. Then, when the scribing wheels respectively mounted on the upper scoring head 10 and the lower scoring head 20 are pressed and traveled under the same pressure (load) on the upper and lower surfaces of the laminating unit 1, the laminating unit is simultaneously scored 1 above.

如此般，在構成貼合單元1之二枚玻璃具有互為相同厚度的情形，一旦使刻劃頭10、20對貼合單元1之上下玻璃以相同壓力進行加壓並行進時，則毫無疑問地刻劃貼合單元1。 In this way, in the case where the two glasses constituting the bonding unit 1 have the same thickness, once the scribe heads 10, 20 are pressed against the lower glass of the bonding unit 1 at the same pressure and travel, there is no The fitting unit 1 is scored in question.

然而在最近，構成貼合單元1之基板之厚度相互不同之貼合 單元(以下，亦稱為異型貼合單元)的需求持續增加，而頻繁地必須同時刻劃如此般之異型貼合單元之上下面。 However, recently, the thicknesses of the substrates constituting the bonding unit 1 are different from each other. The demand for units (hereinafter, also referred to as profiled fitting units) continues to increase, and it is often necessary to simultaneously scribe such a profiled unit above and below.

然而，在同時對貼合單元之上下面進行刻劃之習知的刻劃頭裝置中，係以使上部刻劃頭10之負載與下部刻劃頭20之負載相互配合而為相同之方式進行刻劃。對此，在對貼合相互不同厚度之基板而成之異型貼合單元進行刻劃的情形，由於必須依據基板之厚度而使負載相互不同，因此在習知的刻劃頭裝置中，存在有難以對異型貼合單元進行刻劃的問題。 However, in the conventional scoring head device which simultaneously scribes the upper portion of the bonding unit, the load of the upper scoring head 10 and the load of the lower scoring head 20 are matched to each other in the same manner. Characterized. In this case, in the case where the profiled bonding unit formed by bonding substrates having different thicknesses is scribed, since the loads must be different from each other depending on the thickness of the substrate, there is a conventional scriber device. It is difficult to scribe the profiled bonding unit.

為了解決該問題，可考慮以下方法：在習知的刻劃頭裝置中，使安裝於上部刻劃頭10之刻劃輪與安裝於下部刻劃頭20之刻劃輪的種類相互不同，並以相同負載對異型貼合單元之上下面進行刻劃。 In order to solve this problem, a method in which the type of the scribing wheel mounted on the upper scoring head 10 and the scribing wheel mounted on the lower scoring head 20 are different from each other in a conventional scoring head device, and The upper and lower sides of the profiled unit are scored under the same load.

但是，存在有如下之問題：若一邊使用如此般相互不同之刻劃輪，一邊以相同負載對異型貼合單元之上下面進行刻劃，則並無法期待在構成異型貼合單元之各基板有相同程度之精度，而使不良率增加。 However, there is a problem that it is not possible to expect that each of the substrates constituting the profiled bonding unit is to be scribed when the upper and lower surfaces of the profiled bonding unit are scribed with the same load while using the scriber wheels which are different from each other. The same degree of precision increases the defect rate.

亦即，在構成貼合單元之基板厚度互為相同的情形，若對貼合單元之上下兩面使用相同刻劃輪並一邊施加相同負載一邊進行刻劃，則能夠以均一的深度在貼合單元之上下兩面形成刻劃線。但是，在異型貼合單元的情形，存在有以下問題：若對異型貼合單元之上下兩面使用相同刻劃輪並一邊施加相同負載一邊進行刻劃，則由於在形成於異型貼合單元之上下兩面之刻劃線深度產生差異，因此無法獲得均一且穩定之刻劃斷面，此外，即便使用相互不同種類之刻劃輪，亦無法期待在各基板有相同程度之精度。 In other words, in the case where the thicknesses of the substrates constituting the bonding unit are the same, if the same scribing wheel is used on the upper and lower surfaces of the bonding unit and the same load is applied while scribing, the bonding unit can be uniformly formed at a depth. The upper and lower sides form a score line. However, in the case of the profiled bonding unit, there is a problem in that if the same marking wheel is used on the upper and lower sides of the profiled bonding unit and the same load is applied while scribing, it is formed under the profiled bonding unit. There is a difference in the depth of the scribe lines on both sides, so that a uniform and stable scribe line cannot be obtained, and even if different types of scribe wheels are used, it is impossible to expect the same degree of precision on each substrate.

本發明是有鑑於如上述般之習知問題而創造出來的發明，其 目的在於提供一種無關乎構成貼合基板之上部基板與下部基板之厚度差異，而能夠對貼合基板之上下面同時進行刻劃，並在各基板獲得相同精度之刻劃斷面的貼合基板之刻劃頭裝置。 The present invention has been made in view of the above-mentioned conventional problems, and The object of the present invention is to provide a bonded substrate which can be simultaneously scribed on the upper and lower surfaces of the bonded substrate irrespective of the difference in thickness between the upper substrate and the lower substrate of the bonded substrate, and which has the same precision in each substrate. The scribing device is engraved.

為了達成上述般之本發明之目的，本發明之貼合基板之刻劃頭裝置，係對貼合有第1基板及第2基板之貼合基板外面進行刻劃，具備：第1刻劃頭，配置於該第1基板側，以第1刻劃輪對該第1基板進行刻劃；以及第2刻劃頭，配置於該第2基板側，以第2刻劃輪對該第2基板進行刻劃；在該第1刻劃頭及該第2刻劃頭之至少一者，裝附有對該貼合基板表面賦予加壓力之非接觸式空氣軸承部。 In order to achieve the above-described object of the present invention, the squeezing head device of the bonded substrate of the present invention is characterized in that the outer surface of the bonded substrate to which the first substrate and the second substrate are bonded is scribed, and the first scribe head is provided. Arranging on the first substrate side, scribing the first substrate with a first scribing wheel; and placing a second scribing head on the second substrate side, and using the second scribing wheel to the second substrate At least one of the first scribe head and the second scribe head is attached with a non-contact air bearing portion that applies a pressing force to the surface of the bonded substrate.

亦可為：該第1基板之厚度形成為較該第2基板薄；該非接觸式空氣軸承部，裝附於配置在該第1基板側之該第1刻劃頭。 The first substrate may be formed to be thinner than the second substrate, and the non-contact air bearing portion may be attached to the first scribe head disposed on the first substrate side.

亦可為：該第1刻劃輪之刻劃時之負載設定成較該第2刻劃輪之刻劃時之負載小；從該非接觸式空氣軸承部朝向該第1基板賦予之加壓力，以相應於該第2刻劃輪之刻劃時之負載與該第1刻劃輪之刻劃時之負載之差的方式調整。 Alternatively, the load at the time of the first scribe stroke may be set to be smaller than the load at the time of the second scribe stroke; and the pressure applied from the non-contact air bearing portion toward the first substrate may be It is adjusted so as to correspond to the difference between the load at the time of the scoring of the second scoring wheel and the load at the time of scoring the first scoring wheel.

亦可為：在該非接觸式空氣軸承部，沿該第1刻劃輪之行進線形成粉塵去除槽。 Alternatively, in the non-contact air bearing portion, a dust removing groove may be formed along a traveling line of the first scriber wheel.

亦可為：以該非接觸式空氣軸承部可相對於該第1基板之表面接近及遠離之方式，在該第1刻劃頭裝附有汽缸(cylinder)。 Alternatively, the cylinder may be attached to the first scribe head so that the non-contact air bearing portion can approach and move away from the surface of the first substrate.

亦可為：該非接觸式空氣軸承部，以圍繞裝附之刻劃頭上之刻劃輪周圍的方式配置。 It can also be: the non-contact air bearing portion is arranged around the engraved wheel on the scribed head.

亦可為：該非接觸式空氣軸承部，以襯墊(pad)形態形成。 Alternatively, the non-contact air bearing portion may be formed in the form of a pad.

本發明具有以下之效果：能夠一邊以相互不同之刻劃輪之負載對上部基板與下部基板之厚度相互不同之異型貼合單元之上下兩面進行刻劃，並一邊維持上部刻劃頭與下部刻劃頭之間的力平衡，且能夠對異型貼合單元之上部基板與下部基板兩方期待有相同之刻劃精度。 The present invention has the effect of being able to scribe the upper and lower sides of the profiled bonding unit having different thicknesses of the upper substrate and the lower substrate from each other by the load of the different scribed wheels, while maintaining the upper scribed head and the lower portion The balance between the strokes is balanced, and the same scoring accuracy can be expected for both the upper substrate and the lower substrate of the profiled bonding unit.

此外，具有以下之效果：根據構成異型貼合單元之各基板之厚度，藉由調節由刻劃輪所施加之負載與由非接觸式空氣軸承部所賦予之負載，而能夠效率佳地對各種種類之異型貼合單元進行刻劃。 Further, it is possible to efficiently perform various effects by adjusting the load applied by the scribing wheel and the load applied by the non-contact air bearing portion depending on the thickness of each of the substrates constituting the profile bonding unit. The type of profiled unit is used for scribing.

2‧‧‧上部基板(第2基板) 2‧‧‧Upper substrate (2nd substrate)

3‧‧‧異型貼合單元 3‧‧‧ Shaped fitting unit

4‧‧‧下部基板(第1基板) 4‧‧‧lower substrate (first substrate)

10‧‧‧上部刻劃頭(第2刻劃頭) 10‧‧‧Top scored head (2nd scratch)

11‧‧‧上部刻劃輪(第2刻劃輪) 11‧‧‧Upper scoring wheel (2nd rowing wheel)

20‧‧‧下部刻劃頭(第1刻劃頭) 20‧‧‧The lower scored head (the first scratch)

22‧‧‧下部刻劃輪(第1刻劃輪) 22‧‧‧Lower scoring wheel (1st rowing wheel)

30‧‧‧非接觸式空氣軸承部 30‧‧‧ Non-contact air bearing department

33‧‧‧粉塵去除槽 33‧‧‧dust removal tank

40‧‧‧汽缸 40‧‧‧ cylinder

圖1，係表示使用習知的刻劃頭裝置刻劃貼合單元之樣子的概略圖。 Fig. 1 is a schematic view showing a state in which a bonding unit is scribbled using a conventional scribing head device.

圖2，係概略性地表示本發明之一實施形態之貼合基板之刻劃頭裝置的立體圖。 Fig. 2 is a perspective view schematically showing a scribe head device for a bonded substrate according to an embodiment of the present invention.

圖3，係表示在本發明之一實施形態之貼合基板之刻劃頭裝置中，非接觸式空氣軸承部作動之狀態的圖。 Fig. 3 is a view showing a state in which the non-contact air bearing unit is actuated in the scribe head device of the bonded substrate according to the embodiment of the present invention.

圖4，係表示本發明之一實施形態之貼合基板之刻劃頭裝置於異型貼合單元上一邊行進一邊刻劃之樣子的概略圖。 Fig. 4 is a schematic view showing a state in which the scribing head device of the bonded substrate according to the embodiment of the present invention is scribed while traveling on the profile bonding unit.

以下，參照所附之圖式，針對本發明之實施形態詳細地進行說明。但是，本發明可以各種不同的形態具體實現，並不限於此處說明的實施形態。為了利用圖式簡單明瞭地說明本發明，因此省略與說明無關的部分，且遍及說明書整體針對相同或類似的構成要素標記相同的參照符號。此外，針對本發明之實施形態，以與習知的貼合單元用刻劃頭裝置在 構成上之差異點為中心進行說明，關於與習知的貼合單元用刻劃頭裝置相同或類似的構成，則省略其說明。 Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the present invention can be embodied in various different forms and is not limited to the embodiments described herein. The present invention will be described in a simplified and simplified manner, and the same reference numerals will be given to the same or similar components throughout the specification. Further, in accordance with an embodiment of the present invention, a scribing head device is used with a conventional bonding unit. The difference in the configuration will be mainly described, and the description of the same or similar configuration as the conventional scotch unit of the bonding unit will be omitted.

首先，參照圖2至圖4，說明本發明之一實施形態之貼合單元之刻劃頭裝置。 First, a scribe head device of a bonding unit according to an embodiment of the present invention will be described with reference to Figs. 2 to 4 .

如圖2所示，本發明之一實施形態之刻劃頭裝置，在第1刻劃頭20(以下，亦稱為下部刻劃頭)裝附第1刻劃輪22(以下，亦稱為下部刻劃輪)。下部刻劃輪22，係一邊與在貼合有互為不同厚度之第1基板4(以下，亦稱為下部基板)與第2基板2(以下，亦稱為上部基板)的異型貼合單元3(參照圖4)中厚度相對較薄之下部基板4之外面抵接，一邊加壓及刻劃之刻劃輪。 As shown in FIG. 2, in the scribing apparatus according to an embodiment of the present invention, the first scribing wheel 22 (hereinafter also referred to as a lower scribing head) is attached to the first scoring wheel 22 (hereinafter also referred to as Lower score wheel). The lower scoring wheel 22 is a profiled bonding unit that is bonded to the first substrate 4 (hereinafter also referred to as a lower substrate) and the second substrate 2 (hereinafter also referred to as an upper substrate) having different thicknesses from each other. 3 (refer to FIG. 4), the wheel is pressed and scored while the outer surface of the lower substrate 4 is relatively thin.

而且，在下部刻劃頭20，於較下部刻劃輪22之端部更為下部側，設置非接觸式空氣軸承部30。亦即，由於下部刻劃輪22必須一邊對異型貼合單元3之下部基板4進行加壓，一邊進行刻劃，因此下部刻劃輪22形成為較非接觸式空氣軸承部30更往上方突出。 Further, in the lower scribed head 20, a non-contact air bearing portion 30 is provided on the lower side of the lower end portion of the lower scoring wheel 22. In other words, since the lower scoring wheel 22 must be scribed while pressing the lower substrate 4 of the profiled bonding unit 3, the lower scoring wheel 22 is formed to protrude upward from the non-contact air bearing portion 30. .

此外，非接觸式空氣軸承部30，以維持與異型貼合單元3之下部基板4一定的間隔之方式分離，且形成為從非接觸式空氣軸承部30之表面朝向下部基板4之表面噴射空氣。因此，藉由從非接觸式空氣軸承部30噴射出之空氣而對貼合單元2之下部基板4之表面，作用支承該下部基板4之力。 Further, the non-contact air bearing portion 30 is separated to maintain a certain interval from the lower substrate 4 of the profiled bonding unit 3, and is formed to eject air from the surface of the non-contact air bearing portion 30 toward the surface of the lower substrate 4. . Therefore, the force of supporting the lower substrate 4 acts on the surface of the lower substrate 4 of the bonding unit 2 by the air ejected from the non-contact air bearing portion 30.

如圖2所示，非接觸式空氣軸承部30，較佳為以與異型貼合單元3之下部基板4之表面對應之方式，以襯墊形態形成。而且，該襯墊形態之非接觸式空氣軸承部30，以圍繞下部刻劃輪22周圍之方式形成。 As shown in FIG. 2, the non-contact air bearing portion 30 is preferably formed in a gasket form so as to correspond to the surface of the lower substrate 4 of the profile bonding unit 3. Further, the non-contact air bearing portion 30 of the gasket form is formed to surround the periphery of the lower scoring wheel 22.

非接觸式空氣軸承部30以圍繞下部刻劃輪22周圍之方式形 成的理由，係為了使下部刻劃輪22在其行進時，不與非接觸式空氣軸承部30產生干擾，以及，為了有效率地從下部基板4側支承由第2刻劃頭10(以下，亦稱為上部刻劃頭)之第2刻劃輪11(以下，亦稱為上部刻劃輪)所施加之負載(參照圖4)。 The non-contact air bearing portion 30 is shaped to surround the lower scoring wheel 22 The reason for this is that the lower scoring wheel 22 does not interfere with the non-contact air bearing unit 30 when it travels, and the second scribing head 10 is supported from the lower substrate 4 side efficiently (hereinafter) The load applied by the second scoring wheel 11 (hereinafter also referred to as the upper scoring wheel) of the upper scribing head (see FIG. 4).

另一方面，以非接觸式空氣軸承部30可在下部刻劃頭20上與下部刻劃輪22獨立地移動於垂直方向的方式，在下部刻劃頭20設置汽缸40。 On the other hand, the non-contact air bearing portion 30 can be moved in the vertical direction independently of the lower scoring wheel 22 on the lower scribing head 20, and the cylinder 40 can be provided in the lower scoring head 20.

亦即，在非接觸式空氣軸承部30裝附有汽缸40，如圖3所示，構成為藉由汽缸40之作動而在下部刻劃頭20上使非接觸式空氣軸承部30於垂直方向滑動。而且，非接觸式空氣軸承部30與異型貼合單元3之下部基板4的間隔，可以調節汽缸40之作動之方式而變更。 That is, the cylinder 40 is attached to the non-contact air bearing unit 30, and as shown in FIG. 3, the non-contact air bearing portion 30 is vertically oriented on the lower scoring head 20 by the operation of the cylinder 40. slide. Further, the distance between the non-contact air bearing portion 30 and the lower substrate 4 of the profile bonding unit 3 can be changed by adjusting the operation of the cylinder 40.

此外，在圖式中雖未示出，但使非接觸式空氣軸承部30於垂直方向滑動之汽缸40，若事先根據異型貼合單元3之被刻劃基板之厚度而使用調節器等調節空壓，則可一邊維持一定之壓力一邊使其作動。 Further, although not shown in the drawings, the cylinder 40 that slides the non-contact air bearing portion 30 in the vertical direction is adjusted in advance by using a regulator or the like according to the thickness of the substrate to which the profile bonding unit 3 is scribed. When pressed, it can be actuated while maintaining a certain pressure.

以下，針對使用本實施形態之刻劃頭裝置同時刻劃異型貼合單元3之兩面的動作，參照圖4具體地進行說明。 Hereinafter, the operation of simultaneously dicing both surfaces of the profile bonding unit 3 using the reticle device of the present embodiment will be specifically described with reference to FIG. 4.

如圖4所示，在對異型貼合單元3之上下面進行刻劃時，使配置於異型貼合單元3上部側之上部刻劃頭10之上部刻劃輪11，於垂直方向移動以與上部基板2之上面抵接，與此同時地，使配置於異型貼合單元3下部側之下部刻劃頭20之下部刻劃輪22，於垂直方向移動以與下部基板4之下面抵接。 As shown in FIG. 4, when the lower surface of the profiled bonding unit 3 is scribed, the upper portion of the upper portion of the profiled unit 3 is scribed on the upper portion of the scribe head 10, and the scribe wheel 11 is moved in the vertical direction to While the upper surface of the upper substrate 2 is in contact with each other, the scribing wheel 22 disposed below the lower portion of the lower portion of the profiled bonding unit 3 is moved in the vertical direction to abut against the lower surface of the lower substrate 4.

然而此時，由於異型貼合單元3之下部基板4之基板厚度形 成為較上部基板2薄，因此若由上部刻劃輪11對上部基板2施加之負載、與由下部刻劃輪22對下部基板4施加之負載互為相同，則無法對異型貼合單元3之上部基板2及下部基板4同時高精度地進行刻劃。 However, at this time, due to the thickness of the substrate of the lower substrate 4 of the profiled bonding unit 3 Since the load applied to the upper substrate 2 by the upper scoring wheel 11 and the load applied to the lower substrate 4 by the lower scoring wheel 22 are the same as each other, the profile bonding unit 3 cannot be used. The upper substrate 2 and the lower substrate 4 are simultaneously scored with high precision.

對此，在本實施形態之刻劃頭裝置中，在基板厚度相對較薄之下部基板4側之下部刻劃頭20，設置非接觸式空氣軸承部30及汽缸40。而且，使用汽缸40使非接觸式空氣軸承部30升降，以維持與下部基板4之下面一定間隔。非接觸式空氣軸承部30與下部基板4之下面間之間隔，可根據下部基板4之厚度、下部刻劃輪22之種類等而進行調節。 On the other hand, in the reticle device of the present embodiment, the head 20 is scribed on the lower portion of the lower substrate 4 side with the substrate thickness being relatively thin, and the non-contact air bearing portion 30 and the cylinder 40 are provided. Further, the non-contact air bearing portion 30 is moved up and down using the cylinder 40 to maintain a constant interval from the lower surface of the lower substrate 4. The distance between the non-contact air bearing portion 30 and the lower surface of the lower substrate 4 can be adjusted according to the thickness of the lower substrate 4, the type of the lower scoring wheel 22, and the like.

而且，從非接觸式空氣軸承部30噴射之空氣，作為藉由調節器等而具有一定壓力之空氣流而噴出。 Further, the air ejected from the non-contact air bearing unit 30 is ejected as an air flow having a constant pressure by a regulator or the like.

如此般，一旦從非接觸式空氣軸承部30之表面噴出空氣，則使得由位於異型貼合單元3上部側之上部刻劃輪11往下部側施加之負載減少約空氣之空壓量。亦即，即使不讓使用上部刻劃輪11對上部基板2施加之負載、與使用下部刻劃輪22對下部基板4施加之負載互為相同，亦能夠藉由從非接觸式空氣軸承部30之表面噴出之空氣而填補其差異，以達成在上下方向之負載平衡。 When the air is ejected from the surface of the non-contact air bearing unit 30, the load applied to the lower side of the scribing wheel 11 on the upper portion of the upper portion of the profiled bonding unit 3 is reduced by about the air pressure. That is, even if the load applied to the upper substrate 2 by the upper scribing wheel 11 is not the same as the load applied to the lower substrate 4 by the lower scoring wheel 22, the non-contact air bearing portion 30 can be used. The air ejected from the surface fills the difference to achieve load balance in the up and down direction.

具體而言，異型貼合單元3之上部基板2為較厚層，下部基板4為相對較薄層，且將由上部刻劃頭10之上部刻劃輪11施加之負載，設定成較由下部刻劃頭20之下部刻劃輪22施加之負載為大。 Specifically, the upper substrate 2 of the profiled bonding unit 3 is a thicker layer, the lower substrate 4 is a relatively thin layer, and the load applied by the upper portion of the upper scoring head 10 is set to be engraved by the lower portion. The load applied by the scoring wheel 22 under the scratch head 20 is large.

而且，如上所述，若不一邊使由上部刻劃頭10之上部刻劃輪11施加之負載與由下部刻劃頭20之下部刻劃輪22施加之負載呈相同地配合、一邊進行刻劃，便無法滑順地刻劃異型貼合單元3。 Further, as described above, the load applied by the upper portion of the upper scribing head 10 is not the same as the load applied by the lower portion of the lower scoring head 20, and is scribed. Therefore, the profile fitting unit 3 cannot be smoothly slid.

因此，如在圖4之部分放大圖中箭頭方向所示般，從裝附於下部刻劃頭20上之非接觸式空氣軸承部30朝向上方噴出空氣，藉由所噴出之空氣，可填補由上部刻劃頭10之上部刻劃輪11施加之負載與由下部刻劃頭20之下部刻劃輪22施加之負載之差異。 Therefore, as shown by the direction of the arrow in the enlarged view of Fig. 4, the air is ejected upward from the non-contact air bearing portion 30 attached to the lower scribing head 20, and the air ejected can be filled by The difference between the load applied by the scoring wheel 11 above the upper scoring head 10 and the load applied by the scoring wheel 22 under the lower scoring head 20 is the difference.

亦即，藉由非接觸式空氣軸承部30，噴出和由上部刻劃輪11對上部基板2施加之負載與由下部刻劃輪22對下部基板4施加之負載之差異相應之空壓的空氣，藉此能夠在上部刻劃頭10與下部刻劃頭20之間維持上下方向之力平衡，藉此對異型貼合單元3之上下面均能夠精度高且高品質地進行刻劃。 That is, by the non-contact type air bearing portion 30, the air which is ejected and the load applied to the upper substrate 2 by the upper scoring wheel 11 and the load applied by the lower scoring wheel 22 to the lower substrate 4 are air-pressured air. Thereby, the balance of the force in the vertical direction can be maintained between the upper scribing head 10 and the lower scribing head 20, whereby the upper and lower surfaces of the profile bonding unit 3 can be scored with high precision and high quality.

此外，在非接觸式空氣軸承部30，在下部刻劃輪22行進於下部基板4之線上形成粉塵去除槽33。藉此，一邊刻劃異型貼合單元3一邊產生之粉塵或殘渣，能夠藉由從非接觸式空氣軸承部30噴射之空氣而沿粉塵去除槽33排出，且能夠防止污染被刻劃之異型貼合單元3之表面。 Further, in the non-contact air bearing portion 30, a dust removing groove 33 is formed on a line on which the lower scoring wheel 22 travels on the lower substrate 4. Thereby, the dust or the residue generated while the profile bonding unit 3 is being scribed, can be discharged along the dust removal groove 33 by the air ejected from the non-contact air bearing unit 30, and can prevent the contamination from being scribed. Combine the surface of unit 3.

在本實施形態中，粉塵去除槽33雖形成於下部刻劃輪22行進之線上，但本發明之粉塵去除槽33之形狀，並不限定於此，當然亦可為從非接觸式空氣軸承部30以刻劃輪22為中心呈放射狀地形成多個長槽。 In the present embodiment, the dust removing groove 33 is formed on the line on which the lower scoring wheel 22 travels. However, the shape of the dust removing groove 33 of the present invention is not limited thereto, and may be a non-contact type air bearing portion. A plurality of long grooves are radially formed around the scoring wheel 22.

此外，在本實施形態中，雖已說明了異型貼合單元3之下部基板4之厚度形成為較上部基板2薄，且在下部基板4側之下部刻劃頭20上設置非接觸式空氣軸承部30，但本發明並不限定於此，亦可為在上部基板2之厚度形成為較下部基板4薄的情形時，在上部基板2側之上部刻劃頭10上設置非接觸式空氣軸承部30。 Further, in the present embodiment, it has been described that the thickness of the lower substrate 4 of the profile bonding unit 3 is formed thinner than that of the upper substrate 2, and the non-contact air bearing is provided on the lower portion of the lower substrate 4 side. The portion 30, but the present invention is not limited thereto, and when the thickness of the upper substrate 2 is thinner than the lower substrate 4, the non-contact air bearing may be provided on the upper portion 10 of the upper substrate 2 side. Part 30.

此外，在本實施形態中，雖已說明了僅在異型貼合單元3 之下部基板4側之下部刻劃頭20上設置非接觸式空氣軸承部30，但本發明並不限定於此，亦可為在上部刻劃頭10與下部刻劃頭20兩方分別設置非接觸式空氣軸承部30。在該情形，若對應上部基板2之厚度與下部基板4之厚度，調節來自設置於上部刻劃頭10上之非接觸式空氣軸承部30之空壓大小與來自設置於下部刻劃頭20上之非接觸式空氣軸承部30之空壓大小，則能夠獲得與本實施形態相同之效果。 Further, in the present embodiment, it has been described that only in the profile bonding unit 3 The non-contact air bearing portion 30 is provided on the lower portion of the lower substrate 4 side of the scribing head 20. However, the present invention is not limited thereto, and the non-smooth head 10 and the lower scoring head 20 may be separately disposed on both sides. Contact air bearing portion 30. In this case, if the thickness of the upper substrate 2 and the thickness of the lower substrate 4 are adjusted, the magnitude of the air pressure from the non-contact air bearing portion 30 provided on the upper scoring head 10 is adjusted from the position provided on the lower scribing head 20. The magnitude of the air pressure of the non-contact air bearing unit 30 can obtain the same effects as those of the embodiment.

此外，在本實施形態中，雖以基板厚度相互不同之異型貼合單元3為對象進行了說明，但本發明並不限定於此，即使是在構成貼合單元之基板厚度互為相同但基板種類相互不同，且為了刻劃各基板而被要求之負載存在差異的情形，亦可適用。 Further, in the present embodiment, the profile bonding unit 3 having different substrate thicknesses has been described. However, the present invention is not limited thereto, and the substrate thicknesses of the substrates constituting the bonding unit are the same, but the substrate is the same. The types are different from each other, and it is also applicable to the case where the required load is different in order to scribe each substrate.

20‧‧‧下部刻劃頭(第1刻劃頭) 20‧‧‧The lower scored head (the first scratch)

22‧‧‧下部刻劃輪(第1刻劃輪) 22‧‧‧Lower scoring wheel (1st rowing wheel)

30‧‧‧非接觸式空氣軸承部 30‧‧‧ Non-contact air bearing department

30a‧‧‧非接觸式空氣軸承部之一部分 30a‧‧‧Part of the non-contact air bearing department

30b‧‧‧非接觸式空氣軸承部之另一部分 30b‧‧‧Another part of the non-contact air bearing department

33‧‧‧粉塵去除槽 33‧‧‧dust removal tank

40‧‧‧汽缸 40‧‧‧ cylinder

Claims (7)

一種貼合基板之刻劃頭裝置，係對貼合有第1基板(4)及第2基板(2)之貼合基板(3)之外面進行刻劃，其特徵在於，具備：第1刻劃頭(20)，配置於該第1基板(4)側，以第1刻劃輪(22)對該第1基板(4)進行刻劃；以及第2刻劃頭(10)，配置於該第2基板(2)側，以第2刻劃輪(11)對該第2基板(2)進行刻劃；在該第1刻劃頭(20)及該第2刻劃頭(10)之至少一者，裝附有對該貼合基板(3)之表面賦予加壓力之非接觸式空氣軸承部(30)。 A squeegee device for bonding a substrate, which is characterized by dicing the outer surface of the bonded substrate (3) to which the first substrate (4) and the second substrate (2) are bonded, and is characterized in that: The dicing head (20) is disposed on the first substrate (4) side, the first substrate (4) is scribed by the first scriber wheel (22), and the second scribed head (10) is disposed on the first substrate (4) On the second substrate (2) side, the second substrate (2) is scribed by the second scriber wheel (11); the first scribe head (20) and the second scribe head (10) At least one of the non-contact air bearing portions (30) for applying a pressing force to the surface of the bonded substrate (3) is attached. 如申請專利範圍第1項之貼合基板之刻劃頭裝置，其中，該第1基板(4)之厚度形成為較該第2基板(2)薄；該非接觸式空氣軸承部(30)，裝附於配置在該第1基板(4)側之該第1刻劃頭(20)。 The scriber device for bonding a substrate according to the first aspect of the invention, wherein the thickness of the first substrate (4) is thinner than the second substrate (2); the non-contact air bearing portion (30), The first scribe head (20) disposed on the first substrate (4) side is attached. 如申請專利範圍第2項之貼合基板之刻劃頭裝置，其中，該第1刻劃輪(22)之刻劃時之負載設定成較該第2刻劃輪(11)之刻劃時之負載小；從該非接觸式空氣軸承部(30)朝向該第1基板(4)賦予之加壓力，以相應於該第2刻劃輪(11)之刻劃時之負載與該第1刻劃輪(22)之刻劃時之負載之差的方式調整。 The sculpt device of the bonded substrate of claim 2, wherein the load of the first scoring wheel (22) is set to be smaller than the scoring of the second scoring wheel (11) The load is small; the pressing force is applied from the non-contact air bearing portion (30) toward the first substrate (4) to correspond to the load at the time of the second scoring wheel (11) and the first moment The difference between the load of the rowing wheel (22) and the load is adjusted. 如申請專利範圍第2項之貼合基板之刻劃頭裝置，其中，在該非接觸式空氣軸承部(30)，沿該第1刻劃輪(22)之行進線形成粉塵去除槽(33)。 The scriber device for bonding a substrate according to the second aspect of the invention, wherein the non-contact air bearing portion (30) forms a dust removing groove (33) along a traveling line of the first scriber wheel (22) . 如申請專利範圍第2項之貼合基板之刻劃頭裝置，其中，以該非接觸式空氣軸承部(30)可相對於該第1基板(4)之表面接近及遠離之方式，在該 第1刻劃頭(20)裝附有汽缸(40)。 The scriber device for bonding a substrate according to claim 2, wherein the non-contact air bearing portion (30) is close to and away from the surface of the first substrate (4). The first kerchief (20) is attached with a cylinder (40). 如申請專利範圍第1項之貼合基板之刻劃頭裝置，其中，該非接觸式空氣軸承部(30)，以圍繞裝附之刻劃頭上之刻劃輪周圍的方式配置。 The squeezing head device of the bonded substrate of claim 1, wherein the non-contact air bearing portion (30) is disposed around the periphery of the scribed wheel on the scribed head. 如申請專利範圍第1項之貼合基板之刻劃頭裝置，其中，該非接觸式空氣軸承部(30)，以襯墊形態形成。 The scriber device for bonding a substrate according to the first aspect of the invention, wherein the non-contact air bearing portion (30) is formed in a gasket form.
TW104124711A 2014-11-19 2015-07-30 Scribing head device for bonding substrate TWI690499B (en)

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CN105601097B (en) 2020-09-18
CN105601097A (en) 2016-05-25

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