TWI586234B - Disassembly Method and Scribing Device of Laminated Ceramic Substrate - Google Patents
Disassembly Method and Scribing Device of Laminated Ceramic Substrate Download PDFInfo
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Description
本發明係關於一種於陶瓷基板上積層有金屬膜之積層陶瓷基板之分斷方法及用於此之刻劃裝置。 The present invention relates to a method for separating a laminated ceramic substrate having a metal film laminated on a ceramic substrate, and a scribing apparatus therefor.
習知，於將於陶瓷基板上積層有金屬膜之積層陶瓷基板分斷之情形時，較多使用晶圓切割機等進行分斷。又，專利文獻1中提出有如下之陶瓷接合基板之製造方法：對陶瓷基板進行刻劃後將金屬層接合，藉由蝕刻將刻劃線之金屬層去除，之後進行斷裂。 Conventionally, when a laminated ceramic substrate in which a metal film is laminated on a ceramic substrate is divided, it is often cut by a wafer cutter or the like. Further, Patent Document 1 proposes a method of manufacturing a ceramic bonded substrate in which a metal substrate is bonded, and a metal layer is bonded by etching, and the metal layer of the score line is removed by etching, followed by fracture.
[專利文獻1]日本特開2009-252971號公報 [Patent Document 1] Japanese Patent Laid-Open Publication No. 2009-252971
上述專利文獻1中存在如下問題點：必須於在陶瓷基板上積層金屬薄膜之前進行刻劃，並非係將已積層之積層陶瓷基板進行分斷。 The above Patent Document 1 has a problem in that it is necessary to perform scribing before laminating a metal thin film on a ceramic substrate, and it is not necessary to divide the laminated ceramic substrate.
又，對將如圖1(a)所示般於陶瓷基板101之兩面積層有金屬膜102、103之積層陶瓷基板100進行刻劃從而進行斷裂之情形進行說明。首先，如圖1(b)所示，使用刻劃輪104於金屬膜102之面實施刻劃，其次，如圖1(c)所示，使用斷裂棒105欲使積層陶瓷基板100分斷，即便如此，亦未於金屬膜102形成充分之垂直裂縫，未於陶瓷基板101、金屬 膜103產生垂直裂縫。因此，有難以斷裂，無法分離，或如圖1(d)所示般未按照刻劃線分離之問題點。 In addition, a case where the laminated ceramic substrate 100 in which the metal films 102 and 103 are layered on the two regions of the ceramic substrate 101 as shown in Fig. 1(a) is scribed to be broken. First, as shown in FIG. 1(b), the scribing wheel 104 is used to perform scribing on the surface of the metal film 102. Next, as shown in FIG. 1(c), the fracture bar 105 is used to break the laminated ceramic substrate 100. Even so, no sufficient vertical cracks are formed in the metal film 102, and the ceramic substrate 101 and the metal are not present. The film 103 produces vertical cracks. Therefore, there is a problem that it is difficult to break, cannot be separated, or is not separated according to the score line as shown in Fig. 1(d).
又，作為其他方法，如圖2(b)所示般使用刻劃輪104於金屬膜102之面實施刻劃，其次，如圖2(c)所示般使用刻劃輪104於金屬膜103之面實施刻劃，其次，如圖2(d)所示，使用斷裂棒105欲使積層陶瓷基板100分斷，即便如此，亦未於金屬膜102、103形成充分之垂直裂縫，未於陶瓷基板101產生垂直裂縫。因此，有難以斷裂，如圖2(e)所示般未按照刻劃線分離之問題點。 Further, as another method, as shown in FIG. 2(b), the scribing wheel 104 is used to perform scribing on the surface of the metal film 102, and secondly, as shown in FIG. 2(c), the scribing wheel 104 is used for the metal film 103. The surface is scribed, and secondly, as shown in Fig. 2(d), the fractured bar 105 is used to break the laminated ceramic substrate 100. Even so, no sufficient vertical cracks are formed in the metal films 102 and 103, and the ceramic is not formed. The substrate 101 generates vertical cracks. Therefore, there is a problem that it is difficult to break, as shown in Fig. 2(e), which is not separated by the score line.
本發明係鑒於此種問題點而完成者，其目的在於可使於陶瓷基板上積層有金屬膜之積層陶瓷基板完全地分斷而個別化。 The present invention has been made in view of such a problem, and an object thereof is to enable a multilayer ceramic substrate in which a metal film is laminated on a ceramic substrate to be completely separated and individualized.
為了解決該問題，本發明之積層陶瓷基板之分斷方法係於陶瓷基板之兩面積層有金屬膜之積層陶瓷基板之分斷方法，其係如下者：利用具有既定形狀之刀尖之圖案化工具沿上述積層陶瓷基板之刻劃預定線去除固定之寬度之一方之金屬膜，以形成金屬膜被去除之槽，且利用具有既定形狀之刀尖之圖案化工具沿上述積層陶瓷基板之刻劃預定線去除固定之寬度之另一方之金屬膜，以形成金屬膜被去除之槽，沿自上述任一方之金屬膜去除金屬膜後形成之槽使刻劃輪相對上述陶瓷基板轉動，而使用上述刻劃輪於上述陶瓷基板形成刻劃線，按照上述積層陶瓷基板之上述刻劃線進行斷裂。 In order to solve the problem, the method for dividing a laminated ceramic substrate of the present invention is a method for dividing a laminated ceramic substrate having a metal film on two areas of a ceramic substrate, which is as follows: a patterning tool using a blade having a predetermined shape A metal film of one of the fixed widths is removed along a predetermined line of the above-mentioned laminated ceramic substrate to form a groove in which the metal film is removed, and a patterning tool having a blade having a predetermined shape is used to scribe along the laminated ceramic substrate Removing the metal film of the other width from the fixed line to form a groove in which the metal film is removed, and forming a groove formed by removing the metal film from the metal film of any one of the above, causing the scoring wheel to rotate relative to the ceramic substrate, and using the above engraving A scribing is formed on the ceramic substrate by the scribing, and the scribe line is fractured according to the scribe line of the laminated ceramic substrate.
為了解決該問題，本發明之積層陶瓷基板之分斷方法係於陶瓷基板之兩面積層有金屬膜之積層陶瓷基板之分斷方法，其係如下者：利 用具有既定形狀之刀尖之圖案化工具沿上述積層陶瓷基板之刻劃預定線去除固定之寬度之一方之金屬膜，以形成金屬膜被去除之槽，沿自上述金屬膜之面去除金屬膜後形成之槽使刻劃輪相對上述陶瓷基板轉動，而使用上述刻劃輪於上述陶瓷基板形成刻劃線，利用具有既定形狀之刀尖之圖案化工具沿上述積層陶瓷基板之刻劃預定線去除固定之寬度之另一方之金屬膜，以形成金屬膜被去除之槽，按照上述積層陶瓷基板之上述刻劃線進行斷裂。 In order to solve the problem, the method for dividing a laminated ceramic substrate of the present invention is a method for dividing a laminated ceramic substrate having a metal film on two areas of a ceramic substrate, which is as follows: Removing a metal film of one of the fixed widths along a predetermined line of the above-mentioned laminated ceramic substrate by a patterning tool having a blade having a predetermined shape to form a groove in which the metal film is removed, and removing the metal film from the surface of the metal film a post-forming groove rotates the scoring wheel relative to the ceramic substrate, and the scribe line is formed on the ceramic substrate by using the scribing wheel, and a predetermined line is drawn along the laminated ceramic substrate by using a patterning tool having a predetermined shape The other metal film of the fixed width is removed to form a groove in which the metal film is removed, and is broken according to the above-mentioned scribe line of the laminated ceramic substrate.
為了解決該問題，本發明之積層陶瓷基板之刻劃裝置係用於在陶瓷基板上積層有金屬膜之積層陶瓷基板之分斷之刻劃裝置，其具備：平台，其保持成為刻劃之對象之積層陶瓷基板；橋，其具有平行於設置於上述平台之積層陶瓷基板之面之樑；第1刻劃頭，其沿上述樑移動自如地設置，利用圖案化工具沿保持於上述平台之積層陶瓷基板之刻劃預定線對表面之金屬膜進行槽加工；及第2刻劃頭，其沿上述樑移動自如地設置，使刻劃輪轉動而對經上述槽加工之積層陶瓷基板之槽進行刻劃。 In order to solve the problem, the scribing device for a laminated ceramic substrate of the present invention is a device for dicing a laminated ceramic substrate in which a metal film is laminated on a ceramic substrate, and has a platform which is kept as a target of scribing. a laminated ceramic substrate; a bridge having a beam parallel to a surface of the laminated ceramic substrate disposed on the platform; a first scribe head movably disposed along the beam, and a layered layer held on the platform by a patterning tool The scribe line of the ceramic substrate is grooved to the metal film on the surface; and the second scribe head is movably disposed along the beam to rotate the scribe wheel to perform the groove of the laminated ceramic substrate processed through the groove Characterized.
根據具有此種特徵之本發明，沿刻劃預定線對於陶瓷基板之兩面積層有金屬膜之積層陶瓷基板進行槽加工，對於上下之相同部分帶狀地將金屬膜去除。其次，自所去除之金屬膜之槽對陶瓷基板進行刻劃，其後使積層陶瓷基板反轉而斷裂。因此，可獲得如下效果：可使於兩面具有金屬膜之積層陶瓷基板完全地分斷為所需之形狀而個別化，可提高端面精度。 According to the invention having such a feature, the laminated ceramic substrate having the metal film in the two-area layer of the ceramic substrate is grooved along the scribed line, and the metal film is removed in the strip shape for the upper and lower portions. Next, the ceramic substrate is scribed from the groove of the removed metal film, and then the laminated ceramic substrate is reversed and broken. Therefore, it is possible to obtain an effect that the laminated ceramic substrate having the metal film on both sides can be completely separated into a desired shape and individualized, and the end surface precision can be improved.
又，請求項3之刻劃裝置可獲得如下效果：可利用1台刻劃 裝置同時實現帶狀地將金屬膜去除與進行刻劃。 Moreover, the scoring device of claim 3 can obtain the following effects: one scribing can be utilized The device simultaneously removes and scribes the metal film in a strip shape.
10‧‧‧刻劃裝置 10‧‧‧ scoring device
11‧‧‧移動台 11‧‧‧Mobile Station
16‧‧‧平台 16‧‧‧ platform
20‧‧‧橋 20‧‧ ‧Bridge
22‧‧‧樑 22‧‧‧ beams
23‧‧‧線性馬達 23‧‧‧Linear motor
24、26‧‧‧刻劃頭 24, 26‧‧ ‧ scratching head
25‧‧‧圖案化工具 25‧‧‧patterning tools
27‧‧‧刻劃輪 27‧‧‧Scratch
30‧‧‧積層陶瓷基板 30‧‧‧Multilayer ceramic substrate
31‧‧‧陶瓷基板 31‧‧‧Ceramic substrate
32、33‧‧‧金屬膜 32, 33‧‧‧ metal film
32a、33a‧‧‧槽 32a, 33a‧‧‧ slots
34、35‧‧‧支承構件 34, 35‧‧‧Support members
36‧‧‧膠帶 36‧‧‧ Tape
37‧‧‧斷裂棒 37‧‧‧Fracture rod
圖1係表示自積層陶瓷基板之一面側之金屬膜側進行刻劃及斷裂之情形之分斷處理之圖。 Fig. 1 is a view showing a breaking process in the case where the metal film side of one side of the laminated ceramic substrate is scribed and broken.
圖2係表示自積層陶瓷基板之相反面側之金屬膜側進行刻劃且進行斷裂時之狀態之圖。 Fig. 2 is a view showing a state in which the metal film side on the opposite side of the laminated ceramic substrate is scribed and fractured.
圖3係表示本發明之實施形態之積層陶瓷基板之分斷中所使用之刻劃裝置之立體圖。 Fig. 3 is a perspective view showing a scribing device used for the division of the laminated ceramic substrate according to the embodiment of the present invention.
圖4係表示本實施形態中所使用之用於金屬膜之槽加工之圖案化工具之圖。 Fig. 4 is a view showing a patterning tool for groove processing of a metal film used in the embodiment.
圖5係表示本發明之實施形態之積層陶瓷基板之分斷處理(利用圖案化工具而進行之槽加工)之圖。 Fig. 5 is a view showing a breaking process (groove processing by a patterning tool) of a laminated ceramic substrate according to an embodiment of the present invention.
圖6係表示本發明之實施形態之積層陶瓷基板之分斷處理(刻劃及斷裂)之圖。 Fig. 6 is a view showing a breaking process (scratching and breaking) of the laminated ceramic substrate according to the embodiment of the present invention.
圖3係表示本發明之實施形態之積層陶瓷基板之分斷中所使用之刻劃裝置之一例之概略立體圖。該刻劃裝置10中，移動台11沿一對導軌12a、12b於y軸方向上移動自如地保持。滾珠螺桿13與移動台11螺合。滾珠螺桿13藉由馬達14之驅動進行旋轉，使移動台11沿導軌12a、12b於y軸方向上移動。於移動台11之上表面設置有馬達15。馬達15係使平台16於xy平面上旋轉而定位於特定角度者。 Fig. 3 is a schematic perspective view showing an example of a scribing device used for the division of the laminated ceramic substrate according to the embodiment of the present invention. In the scribing device 10, the moving table 11 is movably held in the y-axis direction along the pair of guide rails 12a and 12b. The ball screw 13 is screwed to the moving table 11. The ball screw 13 is rotated by the driving of the motor 14, and the moving table 11 is moved in the y-axis direction along the guide rails 12a and 12b. A motor 15 is provided on the upper surface of the mobile station 11. Motor 15 is such that platform 16 is rotated in the xy plane to be positioned at a particular angle.
於刻劃裝置10中，藉由支柱21a、21b以橫跨移動台11與其上部之平台16之方式沿x軸方向架設有橋20。橋20於橫方向上平行於平台16之面地設置有樑22，於樑22之長度方向上設置有線性馬達23。於線性馬達23設置有圖案化用之第1刻劃頭24。於刻劃頭24之下端部安裝有圖案化工具25。該圖案化工具25係用於以固定之寬度將金屬膜剝離之工具，例如使用日本特開2011-216646號中所示之用作太陽能電池之槽加工工具之圖案化工具。圖案化工具25例如亦可為如圖4(a)中立體圖所示般圓錐台形狀之工具。又，亦可為如圖4(b)所示般刀尖為角柱狀之工具，進而，亦可為如圖4(c)所示般將角柱狀之左右切去後之形狀者。又，亦可不僅工具之前端為角柱狀，整體亦為角柱狀。於刻劃頭24之內部設置有可進行如此之升降動作之升降部，例如使用氣壓控制之氣缸或藉由線性馬達之電動升降部等。 In the scoring device 10, the bridge 20 is bridged in the x-axis direction by the struts 21a, 21b so as to straddle the platform 16 of the mobile station 11 and its upper portion. The bridge 20 is provided with a beam 22 parallel to the surface of the platform 16 in the lateral direction, and a linear motor 23 is disposed in the longitudinal direction of the beam 22. The linear motor 23 is provided with a first scribe head 24 for patterning. A patterning tool 25 is mounted at the lower end of the scribing head 24. The patterning tool 25 is a tool for peeling a metal film with a fixed width, for example, a patterning tool used as a groove processing tool for a solar cell as shown in Japanese Laid-Open Patent Publication No. 2011-216646. The patterning tool 25 may be, for example, a tool having a truncated cone shape as shown in the perspective view of Fig. 4(a). Further, as shown in FIG. 4(b), the tool tip may be a corner column-shaped tool, or may be a shape in which the corner column shape is cut out as shown in FIG. 4(c). Moreover, not only the front end of the tool is a prismatic column, but the whole is also a prismatic column. A lifting portion capable of performing such a lifting operation is provided inside the scribing head 24, for example, a cylinder that uses air pressure control or an electric lifting portion that is driven by a linear motor.
又，於線性馬達23設置有刻劃用之第2刻劃頭26。刻劃頭26係上下移動自如地保持刻劃輪27者。線性馬達23係使刻劃頭24、26沿x軸方向移動之驅動源。 Further, the linear motor 23 is provided with a second scribe head 26 for scribing. The scribing head 26 is configured to hold the scoring wheel 27 freely. The linear motor 23 is a drive source that moves the scribing heads 24, 26 in the x-axis direction.
圖5(a)係表示成為分斷之對象之積層陶瓷基板(以下，簡稱為積層基板)30之圖。積層基板30係於陶瓷基板31之兩面積層有金屬膜32、33之基板。此處，陶瓷基板31可為LTCC基板，亦可為氧化鋁或氮化鋁、鈦酸鋇、鐵氧體、氮化矽等之陶瓷基板。又，金屬膜32、33為鎳、銀、金、銅及鉑等之薄膜，例如使膜厚為10~20μm。此時，金屬膜32、33亦可為形成有任何圖案者。 (a) of FIG. 5 is a view showing a laminated ceramic substrate (hereinafter simply referred to as a laminated substrate) 30 to be divided. The build-up substrate 30 is a substrate on which the metal films 32 and 33 are formed in two areas of the ceramic substrate 31. Here, the ceramic substrate 31 may be an LTCC substrate, or may be a ceramic substrate such as alumina or aluminum nitride, barium titanate, ferrite or tantalum nitride. Further, the metal films 32 and 33 are thin films of nickel, silver, gold, copper, platinum, and the like, and have a film thickness of, for example, 10 to 20 μm. At this time, the metal films 32 and 33 may be formed with any pattern.
於以特定之圖案將如此之積層基板30分斷之情形時，首 先，將積層基板30載置於圖3之刻劃裝置10之平台16。其次，如圖5(b)所示，利用圖案化工具25沿預定刻劃之線以固定之寬度直線地將金屬膜32去除。該金屬膜之去除係藉由線性馬達23使刻劃裝置10之刻劃頭24移動而進行。將以此方式去除金屬膜32後之積層陶瓷基板30之剖面圖示於圖5(c)中。該槽32a之寬度例如設為25~200μm之寬度。 When the laminated substrate 30 is cut in a specific pattern, the first First, the laminated substrate 30 is placed on the platform 16 of the scoring apparatus 10 of FIG. Next, as shown in Fig. 5 (b), the metal film 32 is linearly removed by a patterning tool 25 along a predetermined scribed line in a fixed width. The removal of the metal film is performed by moving the scribe head 24 of the scoring device 10 by the linear motor 23. A cross-sectional view of the laminated ceramic substrate 30 after the metal film 32 is removed in this manner is shown in Fig. 5(c). The width of the groove 32a is, for example, a width of 25 to 200 μm.
進而，如圖5(d)所示，使積層基板30反轉，利用圖案化工具25對於與上述槽32a相同部分將金屬膜33去除，於與槽32a對稱之位置形成相同寬度之槽33a。如此，如圖6(e)所示，沿刻劃預定線而兩面之金屬膜被去除。 Further, as shown in FIG. 5(d), the laminated substrate 30 is reversed, and the metal film 33 is removed by the patterning tool 25 in the same portion as the groove 32a, and the groove 33a having the same width is formed at a position symmetrical with the groove 32a. Thus, as shown in FIG. 6(e), the metal film on both sides is removed along the predetermined line.
其次，自任一方之金屬膜此處為金屬膜33之面對帶狀之槽33a之內側之陶瓷基板31進行刻劃。關於該刻劃亦使用圖3所示之刻劃裝置10，如圖6(f)所示，對積層基板30以固定之荷重按壓刻劃輪27且使其轉動，從而以使裂縫垂直地滲透之方式形成刻劃線S1。該刻劃中所使用之刻劃輪既可使用可進行高滲透之刻劃者，亦可使用通常者。例如，如日本專利文獻3074143號所示，提出有於圓周面上隔開特定間隔而形成大量槽，使其間成為突起而成為高滲透型之刻劃輪。 Next, from the metal film of either side, the ceramic substrate 31 facing the inner side of the strip-shaped groove 33a of the metal film 33 is scribed. With regard to this scribe, the scribing device 10 shown in FIG. 3 is also used, and as shown in FIG. 6(f), the scribing wheel 27 is pressed against the laminated substrate 30 with a fixed load, and is rotated so that the crack penetrates vertically. The manner of forming the score line S1. The scribing wheel used in the scribing can be used for both high penetration and regular use. For example, as shown in Japanese Patent Laid-Open No. 3074143, it is proposed to form a large number of grooves at a predetermined interval on the circumferential surface, and to form a high-permeability scribing wheel.
其次，如圖6(g)所示，使積層基板30反轉，於斷裂裝置之一對支承構件34、35之上表面配置膠帶36，以刻劃線位於支承構件34、35之中間之方式配置積層基板30。其次，自其上部沿刻劃線S1按下斷裂棒37而進行斷裂。如此，如圖6(h)所示，可使積層基板沿刻劃線完全地分斷，可提高端面精度。藉由格子狀地進行該積層基板之分斷，可形成單個之積層基板晶片。再者，圖6(f)所示之刻劃亦可對槽32a進行，此情形時 亦於進行斷裂之前使積層陶瓷基板反轉而進行斷裂。 Next, as shown in Fig. 6(g), the laminated substrate 30 is reversed, and a tape 36 is disposed on the upper surface of the supporting members 34, 35 on one of the breaking means so as to be scribed in the middle of the supporting members 34, 35. The laminated substrate 30 is disposed. Next, the fracture bar 37 is pressed from the upper portion along the score line S1 to break. Thus, as shown in FIG. 6(h), the laminated substrate can be completely separated along the scribe line, and the end surface accuracy can be improved. A single laminated substrate wafer can be formed by dividing the laminated substrate in a lattice shape. Furthermore, the scribe shown in FIG. 6(f) can also be performed on the groove 32a. The laminated ceramic substrate was also inverted and fractured before the fracture.
該實施形態中，如圖5(b)~圖6(f)所示般於金屬膜之兩面進行槽加工，其次，自金屬之槽對陶瓷基板進行刻劃。亦可取代此而對一面之金屬膜進行槽加工，自其槽對陶瓷基板進行刻劃，之後進行反轉而對另一方之金屬膜進行槽加工。其後之斷裂之步驟相同。 In this embodiment, as shown in FIGS. 5(b) to 6(f), groove processing is performed on both surfaces of the metal film, and second, the ceramic substrate is scribed from the groove of the metal. Instead of this, the metal film on one side may be grooved, and the ceramic substrate may be scribed from the groove, and then reversed to perform groove processing on the other metal film. The subsequent steps of the fracture are the same.
又，雖然該實施形態中係以圖6(f)之步驟使用刻劃裝置使刻劃輪轉動而執行刻劃，但亦可利用雷射刻劃裝置進行刻劃。又，係以圖6(g)之步驟使用斷裂裝置進行斷裂，但亦可代替此而於要分斷之碎片之形狀相對較大之情形時作業人員直接用手進行分斷。於此情形時無需膠帶36。 Further, in this embodiment, the scribing wheel is rotated by the scribing device in the step of FIG. 6(f) to perform scribing, but the scoring device may perform scribing. Further, the breaking is performed by using the breaking device in the step of Fig. 6(g), but instead of the case where the shape of the pieces to be broken is relatively large, the worker directly breaks by hand. In this case, no tape 36 is required.
該實施形態之刻劃裝置不僅可應用於對於兩面具有金屬膜之積層陶瓷基板剝離兩面之金屬膜而對陶瓷基板進行刻劃之分斷方法，亦可用於在僅於任一面積層有金屬膜之積層陶瓷基板中剝離一方之金屬膜而對陶瓷基板進行刻劃之分斷方法。 The scribing device of the embodiment can be applied not only to the method of separating the ceramic substrate by peeling the metal film on both sides of the laminated ceramic substrate having the metal film on both sides, but also for the metal film in only one of the area layers. A method of dividing a ceramic substrate by peeling one of the metal films in the laminated ceramic substrate.
本發明可使用圖案化工具與刻劃裝置容易地將於陶瓷基板上積層有金屬膜之積層基板分斷，對製造微小之積層基板有效。 According to the present invention, it is possible to easily separate a laminated substrate in which a metal film is laminated on a ceramic substrate by using a patterning tool and a scribing device, which is effective for producing a minute laminated substrate.
25‧‧‧圖案化工具 25‧‧‧patterning tools
30‧‧‧積層陶瓷基板 30‧‧‧Multilayer ceramic substrate
31‧‧‧陶瓷基板 31‧‧‧Ceramic substrate
32、33‧‧‧金屬膜 32, 33‧‧‧ metal film
32a‧‧‧槽 32a‧‧‧ slots
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| TWI580067B (en) * | 2016-07-01 | 2017-04-21 | 新日光能源科技股份有限公司 | Division device and division method thereof |
| WO2019082736A1 (en) * | 2017-10-27 | 2019-05-02 | 三星ダイヤモンド工業株式会社 | Method for segmenting substrate having metal film |
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