TW201614008A - Siloxane resin composition, transparent cured product using said composition, transparent pixel, microlens, and solid-state imaging element - Google Patents

Siloxane resin composition, transparent cured product using said composition, transparent pixel, microlens, and solid-state imaging element

Info

Publication number
TW201614008A
TW201614008A TW104131687A TW104131687A TW201614008A TW 201614008 A TW201614008 A TW 201614008A TW 104131687 A TW104131687 A TW 104131687A TW 104131687 A TW104131687 A TW 104131687A TW 201614008 A TW201614008 A TW 201614008A
Authority
TW
Taiwan
Prior art keywords
transparent
composition
siloxane resin
microlens
solid
Prior art date
Application number
TW104131687A
Other languages
Chinese (zh)
Inventor
Naotsugu Muro
Hideki Takakuwa
Makoto Kubota
Shoichi Nakamura
Yoshinori Taguchi
Tetsuya Kamimura
Original Assignee
Fujifilm Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=55630345&utm_source=***_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=TW201614008(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Fujifilm Corp filed Critical Fujifilm Corp
Publication of TW201614008A publication Critical patent/TW201614008A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/07—Aldehydes; Ketones
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
    • G02B1/04—Optical elements characterised by the material of which they are made; Optical coatings for optical elements made of organic materials, e.g. plastics
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B3/00—Simple or compound lenses
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/029—Inorganic compounds; Onium compounds; Organic compounds having hetero atoms other than oxygen, nitrogen or sulfur
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031—Organic compounds not covered by group G03F7/029
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds

Abstract

Provided is a siloxane resin composition containing a siloxane resin, mesityl oxide, a solvent, and metal-containing particles. Also provided are a transparent cured product, a transparent pixel, a microlens, and a solid-state imaging element that use the siloxane resin composition.
TW104131687A 2014-10-03 2015-09-25 Siloxane resin composition, transparent cured product using said composition, transparent pixel, microlens, and solid-state imaging element TW201614008A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014205273A JP6013422B2 (en) 2014-10-03 2014-10-03 Siloxane resin composition, transparent cured product, transparent pixel, microlens, and solid-state imaging device using the same

Publications (1)

Publication Number Publication Date
TW201614008A true TW201614008A (en) 2016-04-16

Family

ID=55630345

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104131687A TW201614008A (en) 2014-10-03 2015-09-25 Siloxane resin composition, transparent cured product using said composition, transparent pixel, microlens, and solid-state imaging element

Country Status (3)

Country Link
JP (1) JP6013422B2 (en)
TW (1) TW201614008A (en)
WO (1) WO2016052307A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6001041B2 (en) 2014-10-03 2016-10-05 富士フイルム株式会社 Siloxane resin composition, transparent cured product, transparent pixel, microlens, and solid-state imaging device using the same

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH062703B2 (en) * 1986-02-15 1994-01-12 三菱化成株式会社 Purification method of diacetone alcohol
DE3631125A1 (en) * 1986-09-12 1988-03-24 Wacker Chemie Gmbh METHOD FOR PRODUCING ORGANOPOLYSILOXANELASTOMERS AND NEW ORGANOSILICIUM COMPOUNDS
JPH0761968B2 (en) * 1988-07-01 1995-07-05 三菱化学株式会社 Diacetone alcohol purification method
JP3179334B2 (en) * 1996-04-11 2001-06-25 大日本塗料株式会社 Stabilized composition containing hydrolyzable silicon compound
JPH10306258A (en) * 1997-03-04 1998-11-17 Nissan Chem Ind Ltd Coating composition and optical member
JP4288432B2 (en) * 1998-08-20 2009-07-01 日産化学工業株式会社 Coating composition and optical member
JP2005272270A (en) * 2004-03-26 2005-10-06 Fuji Photo Film Co Ltd Conductive titanium dioxide fine particle, high refractive index coating, composition for forming high refractive index coating, and method for manufacturing these
JP4653961B2 (en) * 2004-03-26 2011-03-16 富士フイルム株式会社 Conductive titanium dioxide fine particles containing cobalt, high refractive index film, composition for forming high refractive index film, and production method thereof
JP4860129B2 (en) * 2004-09-01 2012-01-25 日揮触媒化成株式会社 Coating liquid for forming transparent film and substrate with transparent film
JP4973093B2 (en) * 2005-10-03 2012-07-11 東レ株式会社 Siloxane resin composition, optical article, and method for producing siloxane resin composition
CN101815676B (en) * 2007-10-03 2013-12-18 日产化学工业株式会社 Modified metal-oxide composite sol, coating composition, and optical member
JP5182533B2 (en) * 2007-10-03 2013-04-17 日産化学工業株式会社 Metal oxide composite sol, coating composition and optical member
JP5255270B2 (en) * 2007-12-27 2013-08-07 日揮触媒化成株式会社 Inorganic oxide fine particles having a core-shell structure, dispersed sol containing the fine particles, and coating solution for optical substrate
JP2012031353A (en) * 2010-08-03 2012-02-16 Nissan Chem Ind Ltd Coating composition and optical member
JP5557662B2 (en) * 2010-09-10 2014-07-23 日揮触媒化成株式会社 Dispersion of core-shell type inorganic oxide fine particles, process for producing the same, and coating composition containing the dispersion
JP6049368B2 (en) * 2011-09-15 2016-12-21 日揮触媒化成株式会社 Al-modified inorganic oxide fine particles, production method thereof, dispersion, and coating composition
JP6234228B2 (en) * 2011-12-21 2017-11-22 日揮触媒化成株式会社 Oligomer-modified fine particles, method for producing the same, and paint
JP2014038293A (en) * 2012-08-20 2014-02-27 Nissan Chem Ind Ltd Dispersion liquid of titanium oxide-based fine particles, coating composition including particles and base material with transparent film
JP6080583B2 (en) * 2013-02-07 2017-02-15 日揮触媒化成株式会社 Surface-modified inorganic composite oxide fine particles, production method thereof, dispersion containing the fine particles, coating solution for optical substrate, coating film for optical substrate, and coated substrate
JP6049521B2 (en) * 2013-03-29 2016-12-21 富士フイルム株式会社 Photosensitive resin composition, cured film, image forming method, solid-state imaging device, color filter, and ultraviolet absorber
JP5799182B1 (en) * 2014-10-03 2015-10-21 富士フイルム株式会社 Siloxane resin composition, transparent cured product, transparent pixel, microlens, and solid-state imaging device using the same

Also Published As

Publication number Publication date
WO2016052307A1 (en) 2016-04-07
JP6013422B2 (en) 2016-10-25
JP2016074797A (en) 2016-05-12

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