TW201604625A - 背光裝置 - Google Patents
背光裝置 Download PDFInfo
- Publication number
- TW201604625A TW201604625A TW104119576A TW104119576A TW201604625A TW 201604625 A TW201604625 A TW 201604625A TW 104119576 A TW104119576 A TW 104119576A TW 104119576 A TW104119576 A TW 104119576A TW 201604625 A TW201604625 A TW 201604625A
- Authority
- TW
- Taiwan
- Prior art keywords
- light
- backlight device
- light emitting
- insulating layer
- emitting diode
- Prior art date
Links
- 239000000463 material Substances 0.000 claims description 13
- 230000003287 optical effect Effects 0.000 claims description 13
- 239000000203 mixture Substances 0.000 claims 1
- 238000009413 insulation Methods 0.000 abstract description 4
- 239000010410 layer Substances 0.000 description 36
- 230000007246 mechanism Effects 0.000 description 9
- 230000017525 heat dissipation Effects 0.000 description 7
- 239000004973 liquid crystal related substance Substances 0.000 description 7
- 239000012788 optical film Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 229910000831 Steel Inorganic materials 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 230000001795 light effect Effects 0.000 description 1
- 239000012811 non-conductive material Substances 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S8/00—Lighting devices intended for fixed installation
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133602—Direct backlight
- G02F1/133603—Direct backlight with LEDs
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
- G02B6/0086—Positioning aspects
- G02B6/0088—Positioning aspects of the light guide or other optical sheets in the package
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/001—Arrangement of electric circuit elements in or on lighting devices the elements being electrical wires or cables
- F21V23/002—Arrangements of cables or conductors inside a lighting device, e.g. means for guiding along parts of the housing or in a pivoting arm
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0066—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form characterised by the light source being coupled to the light guide
- G02B6/0068—Arrangements of plural sources, e.g. multi-colour light sources
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0066—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form characterised by the light source being coupled to the light guide
- G02B6/0073—Light emitting diode [LED]
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
- G02B6/0083—Details of electrical connections of light sources to drivers, circuit boards, or the like
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
- G02B6/0085—Means for removing heat created by the light source from the package
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
- G02B6/0086—Positioning aspects
- G02B6/009—Positioning aspects of the light source in the package
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/133524—Light-guides, e.g. fibre-optic bundles, louvered or jalousie light-guides
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
- H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
- H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/647—Heat extraction or cooling elements the elements conducting electric current to or from the semiconductor body
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0284—Details of three-dimensional rigid printed circuit boards
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133602—Direct backlight
- G02F1/133608—Direct backlight including particular frames or supporting means
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133602—Direct backlight
- G02F1/133612—Electrical details
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- G—PHYSICS
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- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
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- G02F1/133615—Edge-illuminating devices, i.e. illuminating from the side
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
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- H01—ELECTRIC ELEMENTS
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- H01L2924/0001—Technical content checked by a classifier
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
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- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09909—Special local insulating pattern, e.g. as dam around component
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10128—Display
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2054—Light-reflecting surface, e.g. conductors, substrates, coatings, dielectrics
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
- H05K2203/302—Bending a rigid substrate; Breaking rigid substrates by bending
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
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Abstract
一種背光裝置,用以解決目前背光裝置難以輕薄化的問題。本發明的背光裝置包含:一背板,該背板具有一第一部及一第二部,該第二部連接在該第一部的外周,該第一部及該第二部共同形成一混光腔,一絕緣層形成於該第一部位在該混光腔中的一表面上,或形成於該第二部位在該混光腔中的一表面上;一發光模組,該發光模組具有至少一導電電路及發光二極體,該發光二極體電連接於該導電電路,該導電電路成型於該絕緣層上;及一光學模組,該光學模組結合於該背板並位於該混光腔的頂部。
Description
本發明係有關於一種顯示器用之背光裝置,尤指一種可以增加導熱速度、輕量化、薄型化、減少組裝工時之背光裝置。
近年來,發光二極體(light-emitting diode,LED)等小型化、高亮度之光源,被大量的使用在各種背光裝置的應用上;小至手機螢幕,大至大尺寸電視螢幕等。
早期常見的背光裝置多採用「側入式」背光模組,而隨著對大尺寸電視螢幕的需求增加,目前已另發展出「直下式」背光模組,以提升大尺寸的螢幕所呈現的畫質。
請參照第1圖,其係一種使用直下式背光模組的習知背光裝置9,該習知的背光裝置9具有一背板91,該背板91具有一水平的底部911及一傾斜的側壁部912,該側壁部912連接在該底部911的外周,以共同形成一混光腔913。
該習知的背光裝置9另於該混光腔913中設有數個直下式發光模組92;即,請參照第2圖,各該直下式發光模組92是將數個發光二極體921以排列的方式黏固在條狀的電路板922上,再將該數條電路板922結合在該背板91的底部911內側表面。
請再參照第1圖,該習知的背光裝置9在該混光腔913中鋪設一反射層93,及於該混光腔913的頂部設有單層或多層的光學膜94,該
光學膜94二側分別設有一支撐部95,再以一外框96封裝在該光學膜94上,及搭配一液晶面板(未繪示)設於該外框96上,以由該習知的背光裝置9作為該液晶面板的背光源。
據此,該數個發光二極體921可以排列在該液晶面板的背側,故該數個發光二極體921運作時,其光線可於該混光腔913混光後,投射於該液晶面板,令該液晶面板上的各處皆獲得均勻的光線,以提升所呈現的畫質。類似於該習知的背光裝置9的一實施例已揭露於中華民國公告第M479438號「用於LED TV之背光模組」、公告第I422783號「直下式發光二極體光源」、公告第M371308號「發光二極體模組」及美國公告第7588362號「BACKLIGHT ASSEMBLY,DISPLAY DEVICE PROVIDED WITH THE SAME,AND METHOD FOR ASSEMBLING BACKLIGHT ASSEMBLY」等專利案當中。
其中,發光二極體921的使用壽命與其工作溫度有關,過高的工作溫度將導致發光二極體921的使用壽命迅速衰減;因此,發光二極體921運作時所產生的熱能須儘速地傳導至電路板922,再經由電路板922傳導至該背板91以排除熱能,使發光二極體921能維持適當工作溫度。然而,由於電路板922的厚度一般約有0.8~3mm,且電路板922本身材質的導熱性相當差,故經由電路板922傳導至該背板91的熱傳導效率亦必然相當不好。
又,為確保電路板922與背板91之間能緊密相連,避免空隙中的空氣嚴重妨害導熱效果,該習知的背光裝置9將發光二極體921黏固至電路板922後,需再選擇利用螺絲、背膠、或卡扣等固接機構,將電路板922緊密地固接結合在背板91。惟,不論使用螺絲、背膠、或卡扣等固接機構,都必須以相當密集的方式來固接,令該些固接機構的使用數量相當可觀,不僅材料成本高、組裝耗時長,再加上電路板922本身的重量
與厚度,使得該習知的背光裝置9難以輕量、薄型化。再者,為供結合該些固接機構,電路板922上須預留固接的孔位或定位結構,而背板91則須在相對位置上預留配合的卡扣或鎖付孔等結構,亦額外增加電路板922與背板91的製作成本。
有鑑於此,習知的背光裝置確實仍有加以改善之必要。
本發明提供一種背光裝置,可供發光模組的導電電路直接成型在背板的絕緣層上,使得設於該導電電路上的發光二極體運作時所產生的熱能,能高效率地傳導至該背板,以大幅提升發光二極體的散熱效率,並有效減小該背光裝置的整體重量與厚度。
本發明的背光裝置,包含:一背板,該背板具有一第一部及一第二部,該第二部連接在該第一部的外周,該第一部及該第二部共同形成一混光腔,一絕緣層形成於該第一部位在該混光腔中的一表面上,或形成於該第二部位在該混光腔中的一表面上;一發光模組,該發光模組具有至少一導電電路及發光二極體,該發光二極體電連接於該導電電路,該導電電路成型於該絕緣層上;及一光學模組,該光學模組結合於該背板並位於該混光腔的頂部。
其中,該絕緣層設於該第一部,以構成「直下式」背光裝置。
其中,該第一部可以呈非平面的型態,例如呈曲面型態。
其中,該第二部可以延伸超過該第一部的外側周緣。
其中,該背板在位於該混光腔中的至少一表面可以設有一反射層,該發光二極體凸伸穿出該反射層。
其中,該絕緣層設於該第二部,該混光腔中設有一導光板,且該導光板位於該發光二極體的發光側,以構成「側入式」背光裝置。
其中,該發光模組具有至少一功能性電子零件,該功能性電
子零件電連接於該導電電路。例如,該功能性電子零件可以為用以驅動該發光二極體的電子電路元件。
其中,該背板的第一部與第二部可以分別製造再予以組裝接合。
其中,該第一部與該第二部的材質不同。
其中,該第一部嵌合於該第二部中。
據此,本發明的背光裝置可供發光模組的導電電路直接成型在背板的絕緣層上,而絕緣層的厚度一般約為40~150μm,遠小於電路板0.8~3mm的厚度,故可大幅降低經由絕緣層傳導至該背板的熱傳導阻抗,使得設於該導電電路上的發光二極體運作時所產生的熱能,能高效率地傳導至該背板,以大幅提升發光二極體的散熱效率,不僅可延長發光二極體的使用壽命,更能讓發光二極體即使以更高的功率運作,也不擔心工作溫度過高。此外,由於本發明的背光裝置不須設置電路板及如螺絲、背膠、或卡扣等固接機構,故能有效降低該背光裝置的材料成本,提升組裝效率,並使該背光裝置得以明顯地輕量、薄型化。
1‧‧‧背板
11‧‧‧第一部
12‧‧‧第二部
13‧‧‧絕緣層
14‧‧‧反射層
15‧‧‧導光板
2‧‧‧發光模組
21‧‧‧導電電路
22‧‧‧發光二極體
23‧‧‧功能性電子零件
3‧‧‧光學模組
S‧‧‧混光腔
9‧‧‧背光裝置
91‧‧‧背板
911‧‧‧底部
912‧‧‧側壁部
913‧‧‧混光腔
92‧‧‧直下式發光模組
921‧‧‧發光二極體
922‧‧‧電路板
93‧‧‧反射層
94‧‧‧光學膜
95‧‧‧支撐部
96‧‧‧外框
第1圖:一種習知背光裝置的側剖結構示意圖。
第2圖:一種習知背光裝置局部俯視結構示意圖。
第3圖:本發明第一實施例的側剖結構示意圖。
第4圖:本發明第一實施例的局部立體結構示意圖。
第5圖:本發明第一實施例的背板呈曲面型態的側視結構示意圖。
第6圖:本發明第一實施例使用另一型態背板的側視結構示意圖。
第7圖:本發明第一實施例使用組合式背板的側視結構示意圖。
第8圖:本發明第二實施例的立體分解結構示意圖。
為讓本發明之上述及其他目的、特徵及優點能更明顯易懂,下文特舉本發明之較佳實施例,並配合所附圖式,作詳細說明如下:
請參照第3圖,其係本發明背光裝置的第一實施例,該背光裝置大致上包含一背板1、一發光模組2及一光學模組3,該發光模組2及該光學模組3均結合於該背板1。
請參照第3、4圖,該背板1具有一第一部11及一第二部12,該第二部12連接在該第一部11的外周,使該背板1形成立體的結構體,並具有一定的結構強度而不易變形。其中,可選擇使該第一部11及該第二部12先呈共平面地相連,將該發光模組2結合至該背板1之後,再使該第二部12相對於該第一部11拗折,令該背板1形成立體的結構體;或者,該第一部11及該第二部12也可以直接呈非共平面地相連,以形成立體結構體的該背板1供該發光模組2結合。
該第一部11可選擇呈平面型態(如第3圖所示),或是呈非平面的型態,例如第5圖所示的曲面型態,或是多平面之間傾斜相連的型態。該第二部12的型態則不加以限制,例如可以是垂直於該第一部11的環牆,或是傾斜狀的環牆,或者該第二部12也可以延伸超過該第一部11的外側周緣(如第6圖所示),使該背板1的背側可保持形成一散熱空間。
又,該第一部11及該第二部12可以一體相連,或是由不同構件組合而成;該第一部11及該第二部12的材質亦可相同或不同。舉例而言,請參照第7圖,其揭示組合式的背板1;亦即,該背板1的第一部11及第二部12可以分別製造再予以組裝接合,甚至該第一部11或該第二部12都還可再細分成數個部位並分別製造,而該背板1各部位的接合方式不限,可例如是鎖接、黏接或銲接等。組合式背板1的優點在於,該背板1的各部位體積較小,相較於一體成型式的背板1,組合式的背板1可大幅
降低模具成本。另一方面,組合式的背板1還可以依據各部位的需求而選擇適當的材質,例如,該第一部11可以選擇散熱性較佳的鋁材,該第二部12則可選擇結構強度較佳的鋼材或輕質的塑膠材等。又,在第7圖所示的實施例中,該第一部11嵌合於該第二部12中,無論該第一部11與該第二部12的材質是否相同,都可更進一步地提升該第一部11與該第二部12之間的結合穩固性。
另,請再參照第3、4圖,該第一部11及該第二部12共同形成一混光腔S,一絕緣層13形成於該第一部11位於該混光腔S中的一表面上,或形成於該第二部位12於該混光腔S中的一表面上。該背板1若為可導電的材質,該絕緣層13可例如是塗佈在該背板1表面上的絕緣介質;其中,可選擇使該絕緣層13的分佈範圍配合所需設置的導電電路21型態設置,而非在該第一部11或該第二部12的表面上設置整片的絕緣層13;據此,僅沿著該導電電路21的型態設有對應型態的該絕緣層13,可大幅減少該絕緣層13的使用量,有助降低製造成本。該背板1若為不可導電的材質,該絕緣層13則不必額外設置,為本領域中具有通常知識者可以理解。又,該背板1還可以在位於該混光腔S中的至少一表面設有一反射層14,該反射層14可選擇貼接或塗佈在該絕緣層13上。
該發光模組2包含至少一導電電路21及發光二極體22,該發光二極體22電連接於該導電電路21,該導電電路21成型於該絕緣層13上,該發光二極體22凸伸穿出該反射層14。此外,該發光模組2可另包含至少一功能性電子零件23,該功能性電子零件23電連接於該導電電路21,該功能性電子零件23可例如是用以驅動發光二極體22運作的電子電路元件等。
該光學模組3具有轉變光特性的功能,主要用以將該發光模組2於混光腔S進行混光後所產生的光線,轉變為符合該背光裝置所需要
的配光,或產生均光的效果;該光學模組3的細部結構與原理為本領域中具有通常知識者可以理解,且非屬本發明之重點,故於此不再加以詳述。在本實施例中,該光學模組3可例如由一外框(圖未繪示)壓掣結合於該背板1,並使該光學模組3位於該混光腔S的頂部。
據由前述結構,本發明的背光裝置可藉由在背板1的絕緣層13上成型發光模組2的導電電路21,而絕緣層13的厚度一般約為40~150μm,遠小於習知背光裝置所使用的電路板922(標示於第1圖中)厚度,故可大幅降低經由絕緣層傳導至該背板的熱傳導阻抗,使得設於該導電電路21上的發光二極體22運作時所產生的熱能可迅速傳導至該背板1以快速散熱,進而大幅提升發光二極體22的散熱效率。如此一來,不僅可延長發光二極體22的使用壽命,更能讓發光二極體22即使以更高的功率運作,也不必擔心工作溫度過高。
此外,由於本發明的背光裝置不須設置電路板及如螺絲、背膠、或卡扣等固接機構,故能有效降低該背光裝置的材料成本,提升組裝效率,並有效減小該背光裝置的整體重量與厚度,使該背光裝置得以明顯地輕量、薄型化。再者,本發明背光裝置的背板1也不須再為了結合該些固接機構而預留卡扣或鎖付孔等結構,故該背板1的製作成本亦得以降低。
尤其,本實施例選擇使該絕緣層13設於該第一部11,以搭配該發光模組2及該光學模組3構成「直下式」背光裝置,特別適合應用於大尺寸的液晶面板背側,且更能凸顯本發明背光裝置的優點。
具體而言,以同製成應用於32吋螢幕的背光裝置為例,以本發明技術製成的背光裝置,其混光腔S的長度約為709mm,寬度約為400mm,高度約為20mm,且背板1可使用板厚為0.8mm的鋼板材質(密度約為7.8g/cm3),故該背板1的總重量約為2.11kg。相較之下,以習知技術製成的背光裝置,其電路板若使用板厚為1mm的FR-4環氧玻璃布層壓
板(密度約為1.8g/cm3),並佈滿混光腔於背板第一部表面時,其電路板的重量約為0.51kg,故習知技術製成的背光裝置,其背板加上電路板的總重量為2.62kg;是以,本發明技術製成的背光裝置可節省約20%的重量。
再者,以習知技術製成的背光裝置,其電路板需螺絲、背膠、或卡扣等固接機構,使得發光二極體彼此之間的間距很難小於30mm,因此其混光腔的高度也很難小於20mm;相較之下,以本發明技術製成的背光裝置因為沒有固接機構的限制,使數個發光二極體22的間距得以大幅縮減。舉例而言,當二相鄰發光二極體22的間距為15mm時,混光腔S的高度即可降低至14mm,可縮減混光腔S約30%的高度,同時還能維持良好的混光效果。
請參照第8圖,其係本發明背光裝置的第二實施例,該第二實施例大致上同於上述的第一實施例,其主要差異在於:本實施例選擇使該絕緣層13設於該第二部12,並另於該混光腔S中設一導光板15,以搭配該發光模組2及該光學模組3構成「側入式」背光裝置。
詳言之,由於本實施例的該絕緣層13位於該第二部12,而該導光板15位於該混光腔S中,且該導光板15位於發光二極體22的發光側,該發光二極體22電連接於該導電電路21,且將該發光模組2的導電電路21設至該絕緣層13上,則該發光二極體22運作時所產生的光線可從側端射入該導光板15,由該導光板15將光線均勻地導向該光學模組3。本實施例的背光裝置較適合應用在如手機、平板或筆電等具有較小尺寸液晶面板的電子裝置中。
綜上所述,本發明的背光裝置,可供發光模組的導電電路直接成型在背板的絕緣層上,故可大幅降低經由絕緣層傳導至該背板的熱傳導阻抗,使得設於該導電電路上的發光二極體運作時所產生的熱能,能高效率地傳導至該背板,以大幅提升發光二極體的散熱效率,延長發光二極
體的使用壽命,同時降低該背光裝置的材料成本、提升組裝效率,並使該背光裝置得以明顯地輕量、薄型化。
雖然本發明已利用上述較佳實施例揭示,然其並非用以限定本發明,任何熟習此技藝者在不脫離本發明之精神和範圍之內,相對上述實施例進行各種更動與修改仍屬本發明所保護之技術範疇,因此本發明之保護範圍當視後附之申請專利範圍所界定者為準。
1‧‧‧背板
11‧‧‧第一部
12‧‧‧第二部
13‧‧‧絕緣層
14‧‧‧反射層
2‧‧‧發光模組
21‧‧‧導電電路
22‧‧‧發光二極體
3‧‧‧光學模組
S‧‧‧混光腔
Claims (10)
- 一種背光裝置,包含:一背板,該背板具有一第一部及一第二部,該第二部連接在該第一部的外周,該第一部及該第二部共同形成一混光腔,一絕緣層形成於該第一部位在該混光腔中的一表面上,或形成於該第二部位在該混光腔中的一表面上;一發光模組,該發光模組具有至少一導電電路及發光二極體,該發光二極體電連接於該導電電路,該導電電路成型於該絕緣層上;及一光學模組,該光學模組結合於該背板並位於該混光腔的頂部。
- 如申請專利範圍第1項所述之背光裝置,其中,該絕緣層設於該第一部。
- 如申請專利範圍第1項所述之背光裝置,其中,該第一部呈非平面的型態。
- 如申請專利範圍第1項所述之背光裝置,其中,該絕緣層設於該第二部,該混光腔中設有一導光板,且該導光板位於該發光二極體的發光側。
- 如申請專利範圍第1至4項中任一項所述之背光裝置,其中,該第二部延伸超過該第一部的外側周緣。
- 如申請專利範圍第1至4項中任一項所述之背光裝置,其中,該背板在位於該混光腔中的至少一表面設有一反射層,該發光二極體凸伸穿出該反射層。
- 如申請專利範圍第1至4項中任一項所述之背光裝置,其中,該發光模組具有至少一功能性電子零件,該功能性電子零件電連接於該導電電路。
- 如申請專利範圍第1至4項中任一項所述之背光裝置,其中,該背板的第一部與第二部係分別製造再予以組裝接合。
- 如申請專利範圍第8項所述之背光裝置,其中,該第一部與該第二部的材質不同。
- 如申請專利範圍第8項所述之背光裝置,其中,該第一部嵌合於該第二部中。
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TW104119576A TW201604625A (zh) | 2014-07-17 | 2015-06-17 | 背光裝置 |
CN201510362249.1A CN105276445A (zh) | 2014-07-17 | 2015-06-26 | 背光装置 |
US14/788,892 US20160018591A1 (en) | 2014-07-17 | 2015-07-01 | Backlight Device |
EP15175546.9A EP2975452A1 (en) | 2014-07-17 | 2015-07-06 | Backlight device |
JP2015136745A JP2016025080A (ja) | 2014-07-17 | 2015-07-08 | バックライト装置 |
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TW104119576A TW201604625A (zh) | 2014-07-17 | 2015-06-17 | 背光裝置 |
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CN105276445A (zh) | 2016-01-27 |
JP2016025080A (ja) | 2016-02-08 |
US20160018591A1 (en) | 2016-01-21 |
EP2975452A1 (en) | 2016-01-20 |
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