TW201546459A - Method of manufacturing inspection sheet and inspection sheet - Google Patents
Method of manufacturing inspection sheet and inspection sheet Download PDFInfo
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- TW201546459A TW201546459A TW104111796A TW104111796A TW201546459A TW 201546459 A TW201546459 A TW 201546459A TW 104111796 A TW104111796 A TW 104111796A TW 104111796 A TW104111796 A TW 104111796A TW 201546459 A TW201546459 A TW 201546459A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
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Abstract
Description
本發明概念是關於製造測試片的方法,藉由所述方法能簡單地製造測試片且即使在較小負載的情況下仍能保證牢固電連接,以及是關於使用此方法製造的測試片。The present invention relates to a method of manufacturing a test piece by which the test piece can be simply manufactured and a secure electrical connection can be ensured even under a small load, and a test piece manufactured using this method.
一般來說,執行電試驗以判定待測試裝置(諸如,所製造半導體裝置)是否有缺陷。詳言之,測試設備藉由將試驗信號傳輸至待測試裝置來判定待測試裝置的基板是否具有短路。測試設備以及待測試裝置並不直接彼此接觸。實情為,測試設備以及待測試裝置經由諸如試驗插座的媒介裝置彼此間接接觸。當測試設備的端子直接接觸待測試裝置的端子時, 測試設備的端子在重複試驗期間受到磨損或破壞。當測試設備的端子受到破壞時,應替換測試設備,此情況導致成本增加。因此,當使用試驗插座時,待測試裝置接觸安裝於測試設備上的試驗插座, 且因此當試驗插座歸因於試驗插座與待測試裝置之間的重複接觸而受到磨損或破壞時, 僅需要替換試驗插座, 此情況導致替換成本減少。Generally, an electrical test is performed to determine if a device under test, such as a fabricated semiconductor device, is defective. In detail, the test device determines whether the substrate of the device to be tested has a short circuit by transmitting the test signal to the device to be tested. The test equipment and the devices to be tested are not in direct contact with each other. The fact is that the test equipment and the device under test are in indirect contact with each other via a media device such as a test socket. When the terminals of the test equipment directly contact the terminals of the device to be tested, the terminals of the test equipment are subject to wear or damage during repeated tests. When the terminals of the test equipment are damaged, the test equipment should be replaced, which leads to an increase in cost. Therefore, when the test socket is used, the device to be tested contacts the test socket mounted on the test device, and thus only needs to be replaced when the test socket is worn or damaged due to repeated contact between the test socket and the device to be tested. Test the socket, which leads to a reduction in replacement costs.
諸如包含彈簧的彈簧式頂針的各種裝置可用作試驗插座。然而,最近已使用含有導電粒子的彈性測試片。Various devices such as spring loaded thimbles containing springs can be used as test sockets. However, elastic test pieces containing conductive particles have recently been used.
圖1中繪示此測試片的實例。藉由在彈性材料內含有多個導電粒子21而形成測試片1。多個導電粒子21以測試片1的厚度方向定向且形成單一導電部分20。多個導電部分20可以測試片1的表面方向配置且面向待測試設備50的端子51。配置於並不面向待測試設備50的端子51的位置處的絕緣支撐件10與導電部分20組合,且因此支撐導電部分20並使導電部分20彼此絕緣。An example of this test piece is illustrated in FIG. The test piece 1 is formed by containing a plurality of conductive particles 21 in an elastic material. The plurality of conductive particles 21 are oriented in the thickness direction of the test piece 1 and form a single conductive portion 20. The plurality of conductive portions 20 may be configured to test the surface direction of the sheet 1 and face the terminal 51 of the device under test 50. The insulating support 10 disposed at a position not facing the terminal 51 of the device under test 50 is combined with the conductive portion 20, and thus supports the conductive portion 20 and insulates the conductive portion 20 from each other.
當測試片1安裝於測試設備40上時,測試片1的導電部分20接觸測試設備40的墊片41。接著,當如圖2中所繪示的下降待測試設備50時,待測試設備50的端子51分別接觸導電部分20並向下按壓測試片1。因此,導電部分20中的每一者內的導電粒子21彼此接觸並在端子51與接觸墊片41之間建立電連接。此後,當自測試設備40施加預定試驗信號時,試驗信號經由測試片1傳輸至待測試設備50,且由待測試設備50反射的反射信號經由測試片1進入測試設備40。When the test piece 1 is mounted on the test device 40, the conductive portion 20 of the test piece 1 contacts the spacer 41 of the test device 40. Next, when the device under test 50 is lowered as illustrated in FIG. 2, the terminals 51 of the device under test 50 respectively contact the conductive portion 20 and press the test piece 1 downward. Therefore, the conductive particles 21 in each of the conductive portions 20 are in contact with each other and establish an electrical connection between the terminal 51 and the contact pad 41. Thereafter, when a predetermined test signal is applied from the test device 40, the test signal is transmitted to the device under test 50 via the test piece 1, and the reflected signal reflected by the device under test 50 enters the test device 40 via the test piece 1.
此測試片僅當在厚度方向上受到按壓時在其厚度方向上導電。測試片並不使用諸如焊接或彈簧的機械構件,且因此可達成耐用且小型電連接。另外,由於測試片能夠吸收機械衝擊或變形,因此軟連接是可能的。因此,測試片廣泛用於在各種電路裝置與測試設備之間建立電連接。This test piece is electrically conductive in its thickness direction only when pressed in the thickness direction. The test piece does not use a mechanical member such as a weld or a spring, and thus a durable and small electrical connection can be achieved. In addition, a soft connection is possible because the test piece is capable of absorbing mechanical shock or deformation. Therefore, test strips are widely used to establish electrical connections between various circuit devices and test equipment.
藉由使用新近的測試片經歷試驗的待測試裝置經建構,使得每單位面積配置大量端子,端子之間的間隔減小。在此狀況下(亦即,當端子數目增加且其間的間隔減小時),牢固地接觸待測試裝置的端子以及測試片所需的加壓力將增加。然而,當極大地增加加壓力時,端子中的一些或測試片可受到破壞。因此,考慮到上文問題,如圖3中所繪示的各自垂直延伸的凹槽11可形成於絕緣支撐件10中,使得端子中的一些或測試片可甚至在較小加壓力的情況下容易地變形。為如上文所描述地在絕緣支撐件10內形成凹槽11,將雷射光束用於照射導電部分20之間的區域,或使用切割設備。然而,上文方法要求許多時間。特定言之,當存在許多導電部分時,密集地形成凹槽並不容易。The device to be tested subjected to the test using the recent test piece is constructed such that a large number of terminals are arranged per unit area, and the interval between the terminals is reduced. In this case (i.e., when the number of terminals is increased and the interval therebetween is decreased), the pressing force required to firmly contact the terminals of the device to be tested and the test piece will increase. However, some of the terminals or test pieces may be damaged when the applied pressure is greatly increased. Therefore, in consideration of the above problems, the respective vertically extending grooves 11 as illustrated in FIG. 3 may be formed in the insulating support 10 such that some of the terminals or the test piece may be even under a small pressing force. It is easily deformed. To form the grooves 11 in the insulating support 10 as described above, the laser beam is used to illuminate the area between the conductive portions 20, or a cutting device is used. However, the above method requires a lot of time. In particular, when there are many conductive portions, it is not easy to densely form the grooves.
另外,由於凹槽由於其特性而垂直凹陷,因此凹槽可主要僅吸收導電部分的上部部分的變形。因此,甚至無法預期導電部分的變形。In addition, since the groove is vertically recessed due to its characteristics, the groove can mainly absorb only the deformation of the upper portion of the conductive portion. Therefore, deformation of the conductive portion is not even expected.
[技術問題][technical problem]
本發明概念提供一種製造測試片的方法,藉由所述方法即使在較小加壓力的情況下仍能保證牢固電連接且能簡單地製造測試片,以及提供一種使用此方法製造的測試片。 [技術解決方案]The inventive concept provides a method of manufacturing a test piece by which a strong electrical connection can be ensured even under a small pressing force and a test piece can be simply manufactured, and a test piece manufactured using the method can be provided. [Technical Solutions]
根據本發明概念的態樣,提供一種製造安置於待測試裝置的端子與測試設備的墊片之間且將所述端子電連接至所述墊片的測試片的方法,所述方法包含:自第一材料製造框架,當將預定溫度或更大的熱量施加至所述第一材料時所述第一材料能夠自固態改變至氣態,所述框架包括分別形成於對應於所述待測試裝置的所述端子的位置處的孔;將所述框架嵌入至模具並用藉由在液體聚合物內分佈磁性導電粒子所形成的液體模製材料填充所述模具;將磁場以所述模具的厚度方向施加至所述模具,使得所述導電粒子在所述液體模製材料內配置於對應於所述待測試裝置的所述端子的所述位置中的每一者處;藉由固化所述液體模製材料製造與所述框架整合的測試片;以及藉由將預定溫度或更大的熱量施加至所述框架來氣化所述框架而自所述測試片移除所述框架而在所述測試片內形成連通孔。According to an aspect of the inventive concept, there is provided a method of manufacturing a test piece disposed between a terminal of a device to be tested and a gasket of a test device and electrically connecting the terminal to the gasket, the method comprising: The first material manufacturing frame is capable of changing from a solid state to a gaseous state when a predetermined temperature or more is applied to the first material, the frame including being formed respectively corresponding to the device to be tested a hole at a position of the terminal; embedding the frame into a mold and filling the mold with a liquid molding material formed by distributing magnetic conductive particles in a liquid polymer; applying a magnetic field in a thickness direction of the mold To the mold such that the conductive particles are disposed in the liquid molding material at each of the positions corresponding to the terminals of the device to be tested; by curing the liquid molding Producing a test piece integrated with the frame; and removing the frame from the test piece by vaporizing the frame by applying a predetermined temperature or more to the frame The communication holes formed in the test piece.
所述第一材料可為發泡劑。The first material can be a blowing agent.
所述發泡劑可為碳酸鈉、偶氮甲醯胺或苯磺醯肼。The blowing agent may be sodium carbonate, azomethamine or benzenesulfonate.
所述框架可進一步包含第二材料,當將熱量施加至呈固態的所述第二材料時所述第二材料改變至液體。The frame may further comprise a second material that changes to the liquid when heat is applied to the second material in a solid state.
所述第二材料可為石蠟烴或醇脂肪酸酯。The second material may be a paraffinic hydrocarbon or an alcoholic fatty acid ester.
所述框架可包含位於所述測試片內的內部部分以及暴露於所述測試片外部的暴露部分。由於所述內部部分連接至所述暴露部分,因此呈氣態的所述第一材料可自所述內部部分釋放至外部。The frame may include an inner portion located within the test piece and an exposed portion exposed to the exterior of the test piece. Since the inner portion is connected to the exposed portion, the first material in a gaseous state can be released from the inner portion to the outside.
所述連通孔可彼此連接,且所述連通孔中的每一者的至少一部分可連接至外部。The communication holes may be connected to each other, and at least a portion of each of the communication holes may be connected to the outside.
多個框架可彼此分隔開地配置於所述測試片的厚度方向上。The plurality of frames may be disposed apart from each other in the thickness direction of the test piece.
根據本發明概念的另一態樣,提供一種製造安置於待測試裝置的端子與測試設備的墊片之間且將所述端子電連接至所述墊片的測試片的方法,所述方法包含:製造包括分別形成於對應於所述待測試裝置的所述端子的位置處的通孔的框架;將所述框架嵌入至模具並用藉由在液體聚合物內分佈磁性導電粒子所形成的液體模製材料填充所述模具;將磁場以所述模具的厚度方向施加至所述模具,使得所述導電粒子在所述液體模製材料內以所述厚度方向配置於對應於所述待測試裝置的所述端子的所述位置中的每一者處;藉由固化所述液體模製材料製造與所述框架整合的測試片;以及藉由以所述測試片的平面方向移動所述框架而自所述測試片移除所述框架而在所述測試片內形成連通孔。According to another aspect of the inventive concept, there is provided a method of manufacturing a test piece disposed between a terminal of a device to be tested and a gasket of a test device and electrically connecting the terminal to the gasket, the method comprising Manufacturing a frame including through holes respectively formed at positions corresponding to the terminals of the device to be tested; embedding the frame into a mold and using a liquid mold formed by distributing magnetic conductive particles in a liquid polymer Filling the mold with a material; applying a magnetic field to the mold in a thickness direction of the mold, such that the conductive particles are disposed in the liquid molding material in the thickness direction corresponding to the device to be tested Each of the positions of the terminals; manufacturing a test piece integrated with the frame by curing the liquid molding material; and self-moving the frame in a planar direction of the test piece The test piece removes the frame to form a communication hole in the test piece.
所述框架的至少一部分可暴露於所述測試片外部。At least a portion of the frame can be exposed to the exterior of the test piece.
所述框架可包含以規則間隔彼此分隔開地配置且各自以一個方向延伸的橫桿型部件。The frame may include crossbar-type members that are disposed apart from each other at regular intervals and each extend in one direction.
多個框架可配置於所述測試片的厚度方向上,使得在所述測試片的厚度方向上彼此鄰近的所述框架的橫桿型部件以直角彼此交叉。A plurality of frames may be disposed in a thickness direction of the test piece such that cross-bar type members of the frame adjacent to each other in a thickness direction of the test piece cross each other at right angles.
所述連通孔可彼此連接,且所述連通孔中的每一者的至少一部分可連接至外部。The communication holes may be connected to each other, and at least a portion of each of the communication holes may be connected to the outside.
多個所述框架可彼此分隔開地配置於所述測試片的厚度方向上。A plurality of the frames may be disposed apart from each other in a thickness direction of the test piece.
根據本發明概念的另一態樣,提供一種使用前述方法製造的測試片。According to another aspect of the inventive concept, a test piece manufactured using the foregoing method is provided.
根據本發明概念的另一態樣,提供一種安置於待測試裝置的端子與測試設備的墊片之間且將所述端子電連接至所述墊片的測試片,所述測試片包含:分別配置於對應於所述待測試裝置的所述端子的位置處的多個導電部分,所述導電部分中的每一者以所述測試片的厚度方向延伸且藉由在彈性絕緣材料中含有多個導電粒子而形成;以及分別支撐所述多個導電部分並使所述多個導電部分彼此絕緣的絕緣支撐件。所述絕緣支撐件包含連通孔,每一連通孔以垂直於所述厚度方向的方向延伸通過所述多個導電部分之間的區域,且所述連通孔中的每一者的末端連接至外部。According to another aspect of the inventive concept, there is provided a test piece disposed between a terminal of a device to be tested and a gasket of a test device and electrically connecting the terminal to the gasket, the test piece comprising: a plurality of conductive portions disposed at positions corresponding to the terminals of the device to be tested, each of the conductive portions extending in a thickness direction of the test piece and being contained in an elastic insulating material Forming conductive particles; and insulating supports respectively supporting the plurality of conductive portions and insulating the plurality of conductive portions from each other. The insulating support member includes communication holes each extending through a region between the plurality of conductive portions in a direction perpendicular to the thickness direction, and an end of each of the communication holes is connected to the outside .
所述連通孔中的每一者的橫截面可為圓形或矩形。The cross section of each of the communication holes may be circular or rectangular.
如自所述測試片的頂部檢視,所述連通孔可形成網格。 [有利效果]The communication holes may form a mesh as viewed from the top of the test piece. [Advantageous effect]
根據本發明概念的測試片包含水平延伸的連通孔以即使在較小加壓力的情況下仍促進牢固電連接,且所述測試片被簡單地製造。The test piece according to the inventive concept includes horizontally extending communication holes to promote a firm electrical connection even under a small pressing force, and the test piece is simply manufactured.
現將參考隨附圖式詳細地描述根據本發明概念的例示性實施例的製造測試片的方法以及測試片。A method of manufacturing a test piece and a test piece according to an exemplary embodiment of the inventive concept will now be described in detail with reference to the accompanying drawings.
根據本發明概念的例示性實施例的測試片100安置於待測試裝置的端子與測試設備的墊片之間以將端子與墊片彼此電連接。測試片100包含導電部分110以及絕緣支撐件120。A test piece 100 according to an exemplary embodiment of the inventive concept is disposed between a terminal of a device to be tested and a gasket of a test device to electrically connect the terminal and the gasket to each other. The test piece 100 includes a conductive portion 110 and an insulating support 120.
導電部分110分別配置於對應於待測試裝置的端子的位置處,且導電部分110中的每一者以測試片100的厚度方向延伸且是藉由在彈性絕緣材料中含有多個導電粒子111而形成。The conductive portions 110 are respectively disposed at positions corresponding to the terminals of the device to be tested, and each of the conductive portions 110 extends in the thickness direction of the test piece 100 and is composed of a plurality of conductive particles 111 in the elastic insulating material. form.
彈性絕緣材料可為耐熱交聯聚合物。耐熱交聯聚合物可自諸如液體矽酮橡膠的各種可固化聚合物形成材料獲得。The elastic insulating material may be a heat resistant crosslinked polymer. The heat resistant crosslinked polymer can be obtained from various curable polymer forming materials such as liquid fluorenone rubber.
液體矽酮橡膠可為加成固化或縮合固化液體矽酮橡膠。較佳地,可使用加成固化液體矽酮橡膠。由乙烯基與Si-H鍵的反應固化加成固化液體矽酮橡膠。存在由含有乙烯基以及Si-H鍵兩者的聚矽氧烷組成的1-液體(1-組份)型加成固化液體矽酮橡膠,以及由含有乙烯基的聚矽氧烷與含有Si-H鍵的聚矽氧烷組成的2-液體(2-組份)型加成固化液體矽酮橡膠。然而,2-液體型加成固化液體矽酮橡膠可用於本發明概念中。The liquid fluorenone rubber may be an addition cure or condensation cure liquid fluorenone rubber. Preferably, an addition cure liquid fluorenone rubber can be used. The liquid ketone rubber is cured by addition of a reaction of a vinyl group and a Si-H bond. There is a 1-liquid (1-component) type addition-curing liquid fluorenone rubber composed of a polysiloxane having both a vinyl group and a Si-H bond, and a polysiloxane containing a vinyl group and containing Si A 2-liquid (2-component) type addition-curing liquid fluorenone rubber composed of a polyoxymethane of the -H bond. However, a 2-liquid type addition-curing liquid fluorenone rubber can be used in the concept of the present invention.
可使用在23℃下具有100 Pa•s至1,250 Pa•s的黏度的加成固化液體矽酮橡膠。更佳地,可使用在23℃下具有150 Pa•s至800 Pa•s的黏度的加成固化液體矽酮橡膠。更佳地,可使用在23℃下具有250 Pa•s至500 Pa•s的黏度的加成固化液體矽酮橡膠。當加成固化液體矽酮橡膠的黏度小於100 Pa•s時,加成固化液體矽酮橡膠內的導電粒子111易於下沉且無法獲得良好的保持可靠性(conservation security)。此外,當將平行磁場施加至模製材料層時,導電粒子111未經定向以便以測試片100的厚度方向對準,且在一些狀況下可難以形成呈偶態(even state)的導電粒子111鏈。另一方面,當加成固化液體矽酮橡膠的黏度超出1250 Pa•s時,可獲得的模製材料具有高黏度,且因此在一些狀況下可難以在模具140中形成模製材料層。此外,即使在將平行磁場施加至模製材料層時,導電粒子111亦不充分移動且因此在一些狀況下可能難以定向導電粒子111使得導電粒子111以厚度方向對準。An addition-curing liquid fluorenone rubber having a viscosity of from 100 Pa•s to 1,250 Pa•s at 23 ° C can be used. More preferably, an addition-curing liquid fluorenone rubber having a viscosity of from 150 Pa•s to 800 Pa•s at 23 ° C can be used. More preferably, an addition-curing liquid fluorenone rubber having a viscosity of from 250 Pa•s to 500 Pa•s at 23 ° C can be used. When the viscosity of the addition-curing liquid fluorenone rubber is less than 100 Pa•s, the conductive particles 111 in the addition-curing liquid fluorenone rubber are liable to sink and fail to obtain good preservation security. Further, when a parallel magnetic field is applied to the layer of the molding material, the conductive particles 111 are not oriented so as to be aligned in the thickness direction of the test piece 100, and in some cases, it is difficult to form the conductive particles 111 in an even state. chain. On the other hand, when the viscosity of the addition-curing liquid fluorenone rubber exceeds 1250 Pa•s, the obtained molding material has a high viscosity, and thus it may be difficult to form a layer of the molding material in the mold 140 under some conditions. Further, even when a parallel magnetic field is applied to the layer of the molding material, the conductive particles 111 are not sufficiently moved and thus it may be difficult to orient the conductive particles 111 in some cases such that the conductive particles 111 are aligned in the thickness direction.
較佳地,可藉由用高度導電金屬塗佈金屬芯粒子(在下文中被稱作磁芯粒子)來形成構成導電部分110的導電粒子111。高度導電金屬意謂在0℃下具有5 x 106 Ω-1 m-1 或更大的導電性的金屬。用於形成導電粒子111的磁芯粒子可具有3 μm至40 μm的數目平均粒徑。磁芯粒子的數目平均粒徑是藉由雷射繞射散射方法加以量測。Preferably, the conductive particles 111 constituting the conductive portion 110 can be formed by coating metal core particles (hereinafter referred to as magnetic core particles) with a highly conductive metal. The highly conductive metal means a metal having a conductivity of 5 x 10 6 Ω -1 m -1 or more at 0 °C. The magnetic core particles for forming the conductive particles 111 may have a number average particle diameter of from 3 μm to 40 μm. The number average particle diameter of the core particles is measured by a laser diffraction scattering method.
較佳地,當數目平均粒徑等於或大於3 μm時,容易發生歸因於加壓的變形,且容易獲得電阻較低且連接可靠性較高的導電部分110。另一方面,當數目平均粒徑小於或等於40 μm時,可容易地形成用於連接的精細導電部分110,且用於連接的所得導電部分110傾向於具有穩定導電性。Preferably, when the number average particle diameter is equal to or larger than 3 μm, deformation due to pressurization easily occurs, and the conductive portion 110 having lower resistance and higher connection reliability is easily obtained. On the other hand, when the number average particle diameter is less than or equal to 40 μm, the fine conductive portion 110 for connection can be easily formed, and the resulting conductive portion 110 for connection tends to have stable conductivity.
可用於形成磁芯粒子的材料的實例可包含鐵、鎳、鈷以及藉由用所列舉金屬塗佈銅或樹脂形成的材料。此外,磁性材料亦可用於形成磁芯粒子。用於塗佈磁芯粒子的高度導電金屬的實例包含金、銀、銠、鉑以及鉻。較佳地,金可用作高度導電金屬,此是因為金在化學上穩定且高度導電。Examples of materials that can be used to form the core particles can include iron, nickel, cobalt, and materials formed by coating copper or resin with the recited metals. In addition, magnetic materials can also be used to form magnetic core particles. Examples of highly conductive metals used to coat magnetic core particles include gold, silver, rhodium, platinum, and chromium. Preferably, gold can be used as a highly conductive metal because gold is chemically stable and highly conductive.
絕緣支撐件120配置於並不對應於待測試裝置的端子的位置處。絕緣支撐件120與導電部分110組合且因此支撐導電部分110並使導電部分110彼此絕緣。較佳地,絕緣支撐件120可由相同於用於形成導電部分110的彈性材料的材料形成。詳言之,絕緣支撐件120可由矽橡膠形成。然而,可用於形成絕緣支撐件120的材料不限於此,且絕緣支撐件120可由不同於用於形成導電部分110的彈性材料的材料形成。The insulating support 120 is disposed at a position that does not correspond to the terminal of the device to be tested. The insulating support 120 is combined with the conductive portion 110 and thus supports the conductive portion 110 and insulates the conductive portion 110 from each other. Preferably, the insulating support 120 may be formed of the same material as the elastic material used to form the conductive portion 110. In detail, the insulating support member 120 may be formed of a ruthenium rubber. However, the material that can be used to form the insulating support 120 is not limited thereto, and the insulating support 120 may be formed of a material different from the elastic material used to form the conductive portion 110.
絕緣支撐件120具有以垂直於厚度方向的方向(水平地)延伸同時穿過多個導電部分110之間的空間且其末端連接至外部的連通孔121。連通孔121具有大約矩形橫截面且如自頂部檢視形成網格。連通孔121皆彼此連接,且因此即使在連通孔121中的一些被壓縮時,歸因於壓縮而被壓縮的空氣也經由連通孔121滑出,從而允許實現導電部分的可靠變形。The insulating support 120 has a communication hole 121 that extends in a direction perpendicular to the thickness direction (horizontal) while passing through a space between the plurality of conductive portions 110 and whose ends are connected to the outside. The communication hole 121 has an approximately rectangular cross section and forms a mesh as viewed from the top. The communication holes 121 are all connected to each other, and thus even when some of the communication holes 121 are compressed, the air compressed due to the compression is slid out through the communication hole 121, thereby allowing reliable deformation of the conductive portion.
如下為製造測試片100的方法。The method of manufacturing the test piece 100 is as follows.
首先,如圖4中所繪示,製造框架130,框架130由能夠在受到預定溫度或更大的熱量時自固態改變至氣態的第一材料形成且具有分別形成於對應於待測試裝置的端子的位置處的孔。框架130大約為網格形狀。First, as illustrated in FIG. 4, a frame 130 is formed which is formed of a first material capable of changing from a solid state to a gaseous state when subjected to a predetermined temperature or more and has terminals respectively formed corresponding to the device to be tested The hole at the location. The frame 130 is approximately in the shape of a mesh.
接著,如圖5中所繪示,將框架130嵌入模具140中,且用藉由在液體聚合物內分佈導電粒子111所形成的液體模製材料100'填充模具140。此時,液體模製材料100'填充於模具140的空腔內以便環繞框架130。Next, as illustrated in FIG. 5, the frame 130 is embedded in the mold 140, and the mold 140 is filled with the liquid molding material 100' formed by distributing the conductive particles 111 in the liquid polymer. At this time, the liquid molding material 100' is filled in the cavity of the mold 140 so as to surround the frame 130.
接著,如圖6中所繪示,將磁場以模具140的厚度方向施加至模具140,使得導電粒子111在液體模製材料100'內對應於待測試裝置的端子的位置中的每一者處對準。詳言之,在一對模具140內,磁性材料層141配置於以規則間隔鄰近空腔的位置處,且非磁性材料層142形成於磁性材料層141之間。此時,磁性材料層141可配置於對應於待測試裝置的端子的位置處。磁性基板143形成於磁性材料層141的底表面以及非磁性材料層142的底表面上,且電磁體(未繪示)或其類似者可配置於磁性基板143的底表面上。在此狀況下,當驅動電磁體時,電磁體的磁場自頂部移動至底部。此時,液體矽橡膠內的導電粒子111可垂直對準於液體模製材料100'(矽橡膠)內。Next, as illustrated in FIG. 6, a magnetic field is applied to the mold 140 in the thickness direction of the mold 140 such that the conductive particles 111 are in each of the positions of the liquid molding material 100' corresponding to the terminals of the device to be tested. alignment. In detail, in the pair of dies 140, the magnetic material layer 141 is disposed at a position spaced apart from the cavity at regular intervals, and the non-magnetic material layer 142 is formed between the magnetic material layers 141. At this time, the magnetic material layer 141 may be disposed at a position corresponding to the terminal of the device to be tested. The magnetic substrate 143 is formed on the bottom surface of the magnetic material layer 141 and the bottom surface of the non-magnetic material layer 142, and an electromagnet (not shown) or the like may be disposed on the bottom surface of the magnetic substrate 143. In this case, when the electromagnet is driven, the magnetic field of the electromagnet moves from the top to the bottom. At this time, the conductive particles 111 in the liquid helium rubber may be vertically aligned in the liquid molding material 100' (rubber rubber).
接著,當固化液體模製材料100'時,完成與框架130整合的測試片100的製造。當自模具140取出經固化測試片100時,獲得如圖7中所繪示的測試片100。Next, when the liquid molding material 100' is cured, the manufacture of the test piece 100 integrated with the frame 130 is completed. When the cured test piece 100 is taken out from the mold 140, the test piece 100 as shown in FIG. 7 is obtained.
此後,藉由預定溫度或更大的熱量汽化框架130,藉此自測試片100移除框架130。當自測試片100移除框架130時,連通孔121形成於已移除框架130的位置處。連通孔121的形狀對應於框架130的形狀。Thereafter, the frame 130 is vaporized by a predetermined temperature or more, thereby removing the frame 130 from the test piece 100. When the frame 130 is removed from the test piece 100, the communication hole 121 is formed at a position where the frame 130 has been removed. The shape of the communication hole 121 corresponds to the shape of the frame 130.
框架130的第一材料可為發泡劑,其可為碳酸鈉、偶氮甲醯胺或苯磺醯肼。然而,用於形成框架130的材料不限於此,且框架130可進一步包含當將熱量施加至呈固態的第二材料時液化的第二材料。第二材料可為石蠟烴或醇脂肪酸酯。The first material of the frame 130 can be a blowing agent which can be sodium carbonate, azomethamine or benzene sulfonium. However, the material for forming the frame 130 is not limited thereto, and the frame 130 may further include a second material that liquefies when heat is applied to the second material in a solid state. The second material can be a paraffinic hydrocarbon or an alcoholic fatty acid ester.
框架130包含位於測試片100內的內部部分131以及暴露於測試片100外部的暴露部分。由於內部部分131連接至暴露部分,所以呈氣態的第一材料自內部部分131釋放至外部。由框架130所形成的連通孔121彼此連接,且連通孔121中的每一者的至少一部分連接至外部。框架130可製造於預定模具內,但不限於此。可根據各種方法製造框架130。The frame 130 includes an inner portion 131 located within the test piece 100 and an exposed portion exposed to the outside of the test piece 100. Since the inner portion 131 is connected to the exposed portion, the first material in a gaseous state is released from the inner portion 131 to the outside. The communication holes 121 formed by the frame 130 are connected to each other, and at least a portion of each of the communication holes 121 is connected to the outside. The frame 130 may be manufactured in a predetermined mold, but is not limited thereto. The frame 130 can be manufactured according to various methods.
根據本發明概念的實施例的測試片100具有以下價值。The test piece 100 according to an embodiment of the inventive concept has the following value.
首先,當圍繞導電部分的連通孔接觸待測試裝置時,連通孔在一定程度上符合導電部分在測試片100的厚度方向上的任何變形,從而使得測試片100能夠藉由較小負載接觸待測試裝置。First, when the communication hole surrounding the conductive portion contacts the device to be tested, the communication hole conforms to some extent to any deformation of the conductive portion in the thickness direction of the test piece 100, so that the test piece 100 can be tested by a small load contact. Device.
另外,在測試片100中,可以高密度精細地配置導電部分110的導電粒子111。大體而言,當精細地或密集地配置導電粒子111時,鄰近導電部分110可彼此連接。然而,根據本發明概念,提供將鄰近導電部分110彼此分離的框架130以防止鄰近導電部分110之間的連接。In addition, in the test piece 100, the conductive particles 111 of the conductive portion 110 can be finely and finely arranged. In general, when the conductive particles 111 are finely or densely arranged, the adjacent conductive portions 110 may be connected to each other. However, according to the inventive concept, the frame 130 that separates the adjacent conductive portions 110 from each other is provided to prevent the connection between the adjacent conductive portions 110.
可如圖10至圖13中所繪示地修改測試片100。換言之,儘管將單一框架130用於圖4以及圖9之實施例中,但多個框架230可配置於如圖10至圖13中所繪示的測試片200的厚度方向上。The test piece 100 can be modified as illustrated in FIGS. 10 to 13. In other words, although the single frame 130 is used in the embodiment of FIGS. 4 and 9, the plurality of frames 230 may be disposed in the thickness direction of the test piece 200 as illustrated in FIGS. 10 to 13.
當使用多個框架230製造測試片240時,連通孔221可彼此分隔開地配置於測試片200的厚度方向上。因此,絕緣支撐件220能夠充分吸收導電部分210在測試片240的厚度方向上的變形。When the test piece 240 is manufactured using the plurality of frames 230, the communication holes 221 may be disposed apart from each other in the thickness direction of the test piece 200. Therefore, the insulating support 220 can sufficiently absorb the deformation of the conductive portion 210 in the thickness direction of the test piece 240.
可如圖14以及圖15中所繪示地修改根據上文所描述實施例的測試片300。The test strip 300 according to the embodiments described above can be modified as illustrated in FIGS. 14 and 15.
圖14以及圖15說明製造安置於待測試裝置的端子與測試設備的墊片之間以將端子與墊片彼此電連接的測試片300的方法。方法可包含:製造具有分別形成於對應於待測試裝置的端子的位置處的通孔的多個框架330;將框架330嵌入至模具300並用藉由在液體聚合物內分佈磁性導電粒子111所形成的液體模製材料填充模具300;在模具的厚度方向上將磁場施加至模具,使得導電粒子在液體模製材料內在厚度方向上配置於對應於待測試裝置的端子的位置中的每一者處;藉由固化液體模製材料而製造與多個框架330整合的測試片300;以及藉由在測試片300的平面方向上移動多個框架330而自測試片300移除多個框架330,且因此在測試片300內形成連通孔321。14 and 15 illustrate a method of manufacturing a test piece 300 disposed between a terminal of a device to be tested and a gasket of a test device to electrically connect the terminal and the gasket to each other. The method may include: fabricating a plurality of frames 330 having through holes respectively formed at positions corresponding to terminals of the device to be tested; embedding the frame 330 into the mold 300 and forming by disposing the magnetic conductive particles 111 in the liquid polymer a liquid molding material filling the mold 300; applying a magnetic field to the mold in a thickness direction of the mold such that the conductive particles are disposed in the liquid molding material in a thickness direction at each of positions corresponding to the terminals of the device to be tested Manufacturing the test piece 300 integrated with the plurality of frames 330 by curing the liquid molding material; and removing the plurality of frames 330 from the test piece 300 by moving the plurality of frames 330 in the planar direction of the test piece 300, and Therefore, the communication hole 321 is formed in the test piece 300.
在此狀況下,暴露多個框架330中的每一者的至少一部分,且多個框架330中的每一者可包含以規則間隔彼此分隔開地配置且各自以一個方向延伸的橫桿型部件。詳言之,多個框架330可大約為梳狀形狀。In this case, at least a portion of each of the plurality of frames 330 is exposed, and each of the plurality of frames 330 may include a crossbar type that is spaced apart from each other at regular intervals and each extends in one direction component. In particular, the plurality of frames 330 can be approximately comb shaped.
多個框架330在測試片300的厚度方向上配置,使得在測試片300的厚度方向上彼此鄰近的多個框架330的橫桿型部件可以直角彼此交叉。此外,連通孔321可彼此連接、連通孔321中的每一者的至少一部分可暴露於外部,且多個框架330可彼此分隔開地配置於測試片300的厚度方向上。The plurality of frames 330 are disposed in the thickness direction of the test piece 300 such that the cross-bar type members of the plurality of frames 330 adjacent to each other in the thickness direction of the test piece 300 may cross each other at right angles. Further, the communication holes 321 may be connected to each other, at least a portion of each of the communication holes 321 may be exposed to the outside, and the plurality of frames 330 may be disposed apart from each other in the thickness direction of the test piece 300.
在固化測試片300之後,自測試片300移除各自具有梳狀形狀且在模具內與測試片300整合的多個框架330。此時,可藉由在一個方向上取出來移除多個框架330。After curing the test piece 300, a plurality of frames 330 each having a comb shape and integrated with the test piece 300 within the mold are removed from the test piece 300. At this time, the plurality of frames 330 can be removed by taking them out in one direction.
測試片100不限於此,且可具有如圖16以及圖17中所繪示的形狀。換言之,各自滲透通過導電部分410之間的空間的多個連通孔421可形成於測試片400內。每一連通孔421具有大約圓柱形橫截面且以水平方向延伸。The test piece 100 is not limited thereto and may have a shape as illustrated in FIGS. 16 and 17. In other words, a plurality of communication holes 421 each penetrating through the space between the conductive portions 410 may be formed in the test piece 400. Each of the communication holes 421 has an approximately cylindrical cross section and extends in a horizontal direction.
雖然根據本發明概念的電子測試插座已參考其例示性實施例具體繪示以及描述,但將理解,可在不脫離以下申請專利範圍的精神以及範疇的情況下作出形式以及細節的各種改變。While the electronic test sockets have been shown and described with reference to the exemplary embodiments thereof, it is understood that various changes in form and details may be made without departing from the spirit and scope of the invention.
1、100、200、400‧‧‧測試片
10、120、220‧‧‧絕緣支撐件
11‧‧‧凹槽
20、110、210、410‧‧‧導電部分
21、111‧‧‧導電粒子
40‧‧‧測試設備
41‧‧‧接觸墊片
50‧‧‧待測試設備
51‧‧‧端子
100'‧‧‧液體模製材料
121、221、321、421‧‧‧連通孔
130、230、330‧‧‧框架
131‧‧‧內部部分
140‧‧‧模具
141‧‧‧磁性材料層
142‧‧‧非磁性材料層
143‧‧‧磁性基板
300‧‧‧測試片/模具1, 100, 200, 400‧‧‧ test pieces
10, 120, 220‧‧‧Insulation support
11‧‧‧ Groove
20, 110, 210, 410‧‧‧ conductive parts
21, 111‧‧‧ conductive particles
40‧‧‧Test equipment
41‧‧‧Contact gasket
50‧‧‧Devices to be tested
51‧‧‧ terminals
100'‧‧‧Liquid molding materials
121, 221, 321, 421‧‧‧Connected holes
130, 230, 330‧‧‧ framework
131‧‧‧Internal part
140‧‧‧Mold
141‧‧‧ Magnetic material layer
142‧‧‧Non-magnetic material layer
143‧‧‧Magnetic substrate
300‧‧‧Test piece/mold
圖1 為習知測試片的橫截面圖。 圖2 說明圖1 的操作。 圖3 為另一習知測試片的橫截面圖。 圖4 至圖8 說明根據本發明概念的實施例的製造測試片的方法。 圖9 為藉由圖4 至圖8 中所說明的方法所製造的測試片的透視圖。 圖10 至圖13 說明根據本發明概念的另一實施例的製造測試片的方法。 圖14 以及圖15 說明根據本發明概念的另一實施例的製造測試片的方法。 圖16 以及圖17 說明根據本發明概念的另一實施例的製造測試片的方法。Figure 1 is a cross-sectional view of a conventional test piece. Figure 2 illustrates the operation of Figure 1. Figure 3 is a cross-sectional view of another conventional test piece. 4 through 8 illustrate a method of manufacturing a test piece in accordance with an embodiment of the inventive concept. Figure 9 is a perspective view of a test piece manufactured by the method illustrated in Figures 4 to 8. 10 to 13 illustrate a method of manufacturing a test piece according to another embodiment of the inventive concept. 14 and 15 illustrate a method of manufacturing a test piece according to another embodiment of the inventive concept. 16 and 17 illustrate a method of manufacturing a test piece according to another embodiment of the inventive concept.
100'‧‧‧液體模製材料 100'‧‧‧Liquid molding materials
111‧‧‧導電粒子 111‧‧‧ conductive particles
130‧‧‧框架 130‧‧‧Frame
140‧‧‧模具 140‧‧‧Mold
141‧‧‧磁性材料層 141‧‧‧ Magnetic material layer
142‧‧‧非磁性材料層 142‧‧‧Non-magnetic material layer
143‧‧‧磁性基板 143‧‧‧Magnetic substrate
Claims (18)
Applications Claiming Priority (1)
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KR1020140043685A KR101506131B1 (en) | 2014-04-11 | 2014-04-11 | Fabrication method of test sheet and test sheet |
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TW201546459A true TW201546459A (en) | 2015-12-16 |
TWI570414B TWI570414B (en) | 2017-02-11 |
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TW104111796A TWI570414B (en) | 2014-04-11 | 2015-04-13 | Method of manufacturing inspection sheet and inspection sheet |
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KR (1) | KR101506131B1 (en) |
CN (1) | CN106560004B (en) |
TW (1) | TWI570414B (en) |
WO (1) | WO2015156653A1 (en) |
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KR101751269B1 (en) | 2016-05-13 | 2017-06-27 | 배준규 | rubber socket for semiconductor test, and manufacturing method of conductive pole for the same |
KR20180049424A (en) * | 2016-11-01 | 2018-05-11 | 솔브레인멤시스(주) | Anisotropic conductive sheet deconcentrating load in testing |
KR101969792B1 (en) * | 2017-10-23 | 2019-04-17 | 주식회사 오킨스전자 | Device for test socket having void and method for manufacturing test socket using spacer |
KR102388678B1 (en) * | 2020-08-28 | 2022-04-20 | 주식회사 스노우 | Test socket |
KR102338903B1 (en) * | 2021-03-29 | 2021-12-14 | (주)위드멤스 | Contactor and method for manufacturing the same |
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JP3945083B2 (en) | 1999-09-09 | 2007-07-18 | Jsr株式会社 | Anisotropic conductive sheet and manufacturing method thereof |
KR100448414B1 (en) * | 2001-04-12 | 2004-09-13 | 주식회사 아이에스시테크놀러지 | An integrated silicon contactor and a device and method for manufacturing same |
KR100942842B1 (en) * | 2002-12-12 | 2010-02-18 | 엘지디스플레이 주식회사 | Method of controling brightness for each position and liquid crystal display using the same |
KR20040084202A (en) * | 2003-03-27 | 2004-10-06 | 주식회사 아이에스시테크놀러지 | Manufacturing method of integrated silicone contactor |
US7489147B2 (en) * | 2004-07-15 | 2009-02-10 | Jsr Corporation | Inspection equipment of circuit board and inspection method of circuit board |
JP2006040632A (en) * | 2004-07-23 | 2006-02-09 | Jsr Corp | Anisotropic conductive connector, its manufacturing method, adapter device and electrical inspection device of circuit device |
KR100721265B1 (en) * | 2007-03-26 | 2007-05-23 | 삼성물산 주식회사 | Tunnel lining concrete construction method |
TWI337258B (en) * | 2007-06-26 | 2011-02-11 | Advanced Semiconductor Eng | Multipattern test pad |
KR101204939B1 (en) | 2009-08-27 | 2012-11-26 | 주식회사 아이에스시 | Sheet for electrical test and fabrication method therefor |
KR101266124B1 (en) * | 2012-04-03 | 2013-05-27 | 주식회사 아이에스시 | Test socket with high density conduction section and fabrication method thereof |
KR101339166B1 (en) * | 2012-06-18 | 2013-12-09 | 주식회사 아이에스시 | Test socket with conductive powder having through-hole and fabrication method thereof |
-
2014
- 2014-04-11 KR KR1020140043685A patent/KR101506131B1/en active IP Right Grant
-
2015
- 2015-04-13 WO PCT/KR2015/003660 patent/WO2015156653A1/en active Application Filing
- 2015-04-13 CN CN201580029419.2A patent/CN106560004B/en active Active
- 2015-04-13 TW TW104111796A patent/TWI570414B/en active
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WO2015156653A1 (en) | 2015-10-15 |
TWI570414B (en) | 2017-02-11 |
CN106560004B (en) | 2020-01-21 |
KR101506131B1 (en) | 2015-03-26 |
CN106560004A (en) | 2017-04-05 |
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