M394569 五、新型說明： 【新型所屬之技術領域】 本創作係提供一種線路基板，尤指一種利用導熱絕緣 雙面滕來達到散熱及連接安裝目的之一種導熱自黏線路基 板0 【先前技術】 由於科技的進步，照明設備也由亮度較高、使用壽命 較長及耗電量較低的LED燈取代過去的傳統燈源，而被大 量的應用在各個不同的領域。 ED燈内疋„又置有線路基板，一般而言，線路基板通 常是紹基板或陶竟基板，但是此兩種基板都有使用上的缺 陷，鋁基板的缺陷在於導熱性與耐電壓性差，造成散熱不 易和響LED的使用壽命，並且安裝上也需要以繁瑣反覆 的上螺絲動作來協助以，相當不便m基㈣然具 有不錯的導熱性，Y曰匍；生# + J_ u彳-製k成本較南、質地易碎，並且與紹 基板相同，在安裝上也相當不便。 〜 有鏗於此，本案之創竹去交 則作者以多年之研究經驗，研發出 種可解決習知技術所盔法解 …凌解决的一種導熱自黏線路美 板。 土 3 M394569 【新型内容】 本創作之主要目的，在於提供一種導熱自黏線路基 板，可解決習知技術線路基板之散熱不良，耐電壓性差， 質地易碎及安裝不便等問題。 該導熱自黏線路基板係包含：一自黏層，係有導熱、 絕緣及黏貼的功能，並且具有一第一黏面及一第二黏面； 一銅箔層’其表面設有電子線路，並具有一第一表面及一 • 第二表面，該第二表面係連接於該第一黏面；及一絕緣層， 係具有一第一絕緣面、一第二絕緣面及複數個鍍錫孔，該 第二絕緣面係連接於該第一表面。 【實施方式】 為了能夠更清楚地描述本創作所提出之一種導熱自黏 線路基板’以下將酉己合圖*，詳盡說明本創作之較佳實施 例0M394569 V. New description: [New technical field] The present invention provides a circuit substrate, especially a thermally conductive self-adhesive circuit substrate using heat-conductive and insulating double-sided to achieve heat dissipation and connection installation. [Prior Art] With the advancement of technology, lighting equipment has also replaced traditional light sources in the past with LED lamps with higher brightness, longer service life and lower power consumption, and has been widely used in various fields. In the ED lamp, there is a circuit substrate. Generally, the circuit substrate is usually a substrate or a ceramic substrate. However, both substrates have defects in use. The defects of the aluminum substrate are poor thermal conductivity and withstand voltage. The heat dissipation is not easy and the service life of the LED is loud, and the installation also needs to be assisted by the cumbersome and repeated screw action. It is quite inconvenient, the m base (four) has good thermal conductivity, Y曰匍; 生# + J_ u彳- k cost is more south than the texture, and it is fragile, and it is the same as the Shao substrate. It is also quite inconvenient to install. ~ In this case, the author of this case is the result of many years of research and development, and the research and development of the technology can solve the conventional technology. The helmet is a solution of a heat-conducting self-adhesive circuit board. Earth 3 M394569 [New content] The main purpose of this creation is to provide a self-adhesive self-adhesive circuit substrate, which can solve the problem of poor heat dissipation of the conventional circuit board. The voltage is poor, the texture is fragile, and the installation is inconvenient. The thermally conductive self-adhesive circuit substrate comprises: a self-adhesive layer, which has the functions of heat conduction, insulation and adhesion, and has a first a bonding surface and a second bonding surface; a copper foil layer having an electronic circuit on its surface and having a first surface and a second surface, the second surface being connected to the first bonding surface; and an insulating layer The layer has a first insulating surface, a second insulating surface and a plurality of tin-plated holes, and the second insulating surface is connected to the first surface. [Embodiment] In order to more clearly describe the present invention A thermally conductive self-adhesive circuit substrate hereinafter will be described in detail with reference to a preferred embodiment of the present invention.
請同時參閱第-圖、第二圖及第三圖，係本創作之— 種導熱自黏線路基板之展開示意®、組合示意圖及導熱自 黏線路基板與led燈座遠垃-甚园...^ 且厘連接不意圖，係包含：一自黏層卜 係具有一第一黏面11及—^ _ 第一黏面12 ; —銅落層2，係具 有一第一表面21及一笛一* _ _ 第一表面22 ; —絕緣層3，係具有一 第一絕緣面31、— — λα 第一絕緣面32及複數個鍍錫孔33 ;及 一 LED燈座4。 4 M394569 • 該自黏層1係一導熱絕緣雙面膠，具有導熱、絕緣及 黏貼的功能，且該第—黏面u係連接於該第二表面22， 該第二黏面12係可直接黏貼於該LED燈座4,不用反覆地 上螺絲來達到固定的目的；該銅箔層2表面藉由藥劑之顯 衫蝕刻而製作出電子線路，其中，該第一表面21係藉由矽 膠、壓克力膠、熱溶膠及膠水之等連接於第二絕緣面32; 該絕緣層3係耐高溫絕緣薄膜，並於該第一絕緣面31上沖 ® 孔出該複數個鍍錫孔3 3，以用於電性連接led。 請繼續參閱第四圖，係本創作之導熱自黏線路基板之 第一種製造方法流程圖，其步驟係包括： 51 ·在絕緣層3之第二絕緣面32上塗上膠黏劑。 52 .從絕緣層3之第一絕緣面3丨上沖出複數個鍍錫孔 33，讓出鍍錫位置。 53 .將冲孔後的絕緣層3以第二絕緣面黏貼於銅箔 % 層2的第一表面21上。 54 .於銅箔層2的第二表面22上以藥劑之顯影蝕刻而 製作出電子線路。 55 .以銅荡層2之第二表面22黏貼於該自黏層1之第 一黏面11。 56 :沖壓成型外框。 其中，步驟S1中之膠黏劑可為矽膠、壓克力膠、熱溶 膠及或膠水等》 5 M394569 請繼續參閱第五圖’係本創作之導熱自黏線路基板之 第二種製造方法流程圖，於上述之第一種製造方法不同的 地方在於其製造方法係可逆向操作，其步驟如下： S1’：以自黏層1之第一黏面u黏貼於銅箔層2之第 一表面22。 S2 ·於銅箔層2之第一表面21以藥劑之顯影蝕刻而 製作出電子線路。 S3’：在絕緣層3之第二絕緣面”上塗上膠黏劑。 S4，：從絕緣層3之第一絕緣面31上沖出複數個鍵錫 孔33，讓出鍍錫位置。 之 S5’ ：以絕緣層3之第二绍絡τ 乐一、色緣面32黏貼於銅箔層 第一表面21。 膠黏劑可為矽膠、壓克力膠、熱溶 S6’ ：沖壓成型外框 其中，步驟S3’中之 膠或膠水等。 請繼續參閱第六圖，传太 ^ 創作之導熱自黏線路基板之 第二種製造方法流程圖，其步騍如下. 11黏貼於銅箔層2之第 S1’，：以自黏層1之第—黏面 二表面22。 以藥劑之顯影蝕刻而 S2” ：在銅箔層2之箆一主 ^ 衣面21 製作出電子線路。 6 M394569 * S3” ：於銅箔層2之第一表面21塗上絕緣塗料，以形 成讓出鍍錫位置之絕緣層3。 S4” ：沖壓成型外框。 上述已經對本創作做了相當完整之揭露，综合上述， 可以得知本創作係具有下列之優點： 1 ·因使用導熱絕緣雙面膠，使導熱自黏線路基板之導熱 性能及耐電壓性提升，並且不易破碎。 馨I 2.使用導熱絕緣雙面膠黏貼於led燈座，安裝方便，解 決習知技術之上螺絲的繁複動作造成的安裝不便。 3.從第一及第二製造方法可知，該製程可同時從兩端進 行’不僅降低製程的限制，並提升生產的效率。 然而，上述之詳細說明係針對本創作可行實施例之具 體說明，惟該實施例並非用以限制本創作之專利範圍，凡 未脫離本創作技藝精神所為之等效實施或變更均應包含 鲁於本案之專利範圍中。 【圖式簡單說明】 第一圖係本創作之一種導熱自黏線路基板之展開示 意圖； 第二圖係本創作之導熱自黏線路基板之組合示意圖； 第三圖係本創作之導熱自黏線路基板與LED燈座連 接示意圖； 7 第四圖 係本創作之導熱自 方法流程圖； 第五圖 係本創作之導熱自 方法流程圖；及 第六圖 係本創作之導熱自 方法流程圖。 主要元件符號說明】 1 自黏層 11 第一黏面 12 第二黏面 2 銅羯層 21 第一表面 22 第二表面 3 絕緣層 31 第一絕緣面 32 第二絕緣面 33 鍵锡孔 4 LED燈座 S1-S6 導熱自黏線路基板 sue’ 導熱自黏線路基板 S1”〜S4” 導熱自黏線路基板 黏線路基板之第一種製^造^ 黏線路基板之第二種製造 黏線路基板之第三種製造 之第—種製造方法之步驟 之第二種製造方法之步驟 之第三種製造方法之步驟Please also refer to the first, second and third figures, which is the development of the self-adhesive self-adhesive circuit substrate, the combination diagram and the self-adhesive self-adhesive circuit substrate and the led lamp holder. . . . and the connection is not intended to include: a self-adhesive layer having a first adhesive surface 11 and a first adhesive surface 12; a copper falling layer 2 having a first surface 21 and a flute The first surface 22; the insulating layer 3 has a first insulating surface 31, a λα first insulating surface 32 and a plurality of tin-plated holes 33; and an LED lamp holder 4. 4 M394569 • The self-adhesive layer 1 is a thermally conductive and insulating double-sided tape having the functions of heat conduction, insulation and adhesion, and the first adhesive surface u is connected to the second surface 22, and the second adhesive surface 12 is directly Adhesively attached to the LED lamp holder 4, the screw is not repeatedly applied to achieve the purpose of fixing; the surface of the copper foil layer 2 is etched by the medicinal coating to form an electronic circuit, wherein the first surface 21 is made of silicone rubber and pressure. The acryl, the hot sol and the glue are connected to the second insulating surface 32; the insulating layer 3 is a high temperature resistant insulating film, and the plurality of tin plating holes 3 3 are punched out through the first insulating surface 31, For electrical connection led. Please refer to the fourth figure, which is a flow chart of the first manufacturing method of the thermally conductive self-adhesive circuit substrate of the present invention, the steps of which include: 51. Applying an adhesive on the second insulating surface 32 of the insulating layer 3. 52. A plurality of tin-plated holes 33 are punched from the first insulating surface 3 of the insulating layer 3 to give a tin plating position. 53. The punched insulating layer 3 is adhered to the first surface 21 of the copper foil layer 2 with a second insulating surface. 54. An electronic circuit is formed on the second surface 22 of the copper foil layer 2 by development etching of a drug. 55. The second surface 22 of the copper layer 2 is adhered to the first adhesive surface 11 of the self-adhesive layer 1. 56: Stamped frame. Wherein, the adhesive in step S1 can be silicone, acrylic, hot melt or glue, etc. 5 M394569 Please continue to refer to the fifth diagram of the second manufacturing method of the thermally conductive self-adhesive circuit substrate. The difference in the first manufacturing method described above is that the manufacturing method is reversible, and the steps are as follows: S1': the first adhesive surface u of the self-adhesive layer 1 is adhered to the first surface of the copper foil layer 2 twenty two. S2 - An electronic circuit is formed on the first surface 21 of the copper foil layer 2 by chemical development etching. S3': an adhesive is applied on the second insulating surface of the insulating layer 3. S4, a plurality of key tin holes 33 are punched out from the first insulating surface 31 of the insulating layer 3 to give a tin plating position. ' : The second layer of the insulating layer 3, Le Yi, color edge surface 32 is adhered to the first surface 21 of the copper foil layer. The adhesive can be silicone rubber, acrylic glue, hot melt S6': stamping frame Among them, the glue or glue in step S3', etc. Please continue to refer to the sixth figure, the flow chart of the second manufacturing method of the self-adhesive self-adhesive circuit substrate, which is created by the following, is as follows. 11 adhered to the copper foil layer 2 The first S1': the first surface of the self-adhesive layer 1 - the surface 2 of the adhesive surface is etched by the development of the drug and S2": an electronic circuit is formed on the main surface 21 of the copper foil layer 2. 6 M394569 * S3": An insulating coating is applied to the first surface 21 of the copper foil layer 2 to form an insulating layer 3 for the tinning position. S4": a stamped frame. The above has made a fairly complete disclosure of this creation. In combination with the above, it can be known that the creation department has the following advantages: 1) The use of thermally conductive and insulating double-sided adhesive improves the thermal conductivity and withstand voltage of the thermally conductive self-adhesive circuit substrate. And not easy to break. Xin I 2. Use heat-conductive and insulating double-sided adhesive to stick to the LED lamp holder. It is easy to install and solve the inconvenience caused by the complicated operation of the screw on the conventional technology. 3. As can be seen from the first and second manufacturing methods, the process can be performed simultaneously from both ends to not only reduce process limitations, but also increase production efficiency. However, the above detailed description is intended to be illustrative of the specific embodiments of the present invention, and is not intended to limit the scope of the present invention, and the equivalent implementations or modifications may be included without departing from the spirit of the invention. The patent scope of this case. [Simple diagram of the diagram] The first diagram is a schematic diagram of the development of a thermally conductive self-adhesive circuit substrate; the second diagram is a schematic diagram of the combination of the thermally conductive self-adhesive circuit substrate; the third diagram is the heat conduction self-adhesive circuit of the present invention. Schematic diagram of the connection between the substrate and the LED lamp holder; 7 The fourth figure is a flow chart of the heat conduction self-method of the present creation; the fifth picture is a flow chart of the heat conduction self-method of the present creation; and the sixth figure is a flow chart of the heat conduction self-method of the present creation. Main component symbol description] 1 Self-adhesive layer 11 First adhesive surface 12 Second adhesive surface 2 Copper beryllium layer 21 First surface 22 Second surface 3 Insulating layer 31 First insulating surface 32 Second insulating surface 33 Key tin hole 4 LED Lamp holder S1-S6 Thermal self-adhesive circuit substrate sue' Thermal self-adhesive circuit substrate S1"~S4" Thermal self-adhesive circuit substrate Adhesive circuit substrate The first type of manufacturing adhesive circuit substrate is the second manufacturing adhesive circuit substrate The third manufacturing method of the steps of the second manufacturing method of the third manufacturing method