TW201536960A - Ceramic thermal sprayed-film coated member and member for semiconductor manufacturing device - Google Patents
Ceramic thermal sprayed-film coated member and member for semiconductor manufacturing device Download PDFInfo
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- TW201536960A TW201536960A TW104103404A TW104103404A TW201536960A TW 201536960 A TW201536960 A TW 201536960A TW 104103404 A TW104103404 A TW 104103404A TW 104103404 A TW104103404 A TW 104103404A TW 201536960 A TW201536960 A TW 201536960A
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C4/00—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge
- C23C4/04—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge characterised by the coating material
- C23C4/10—Oxides, borides, carbides, nitrides or silicides; Mixtures thereof
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/04—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings of inorganic non-metallic material
- C23C28/042—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings of inorganic non-metallic material including a refractory ceramic layer, e.g. refractory metal oxides, ZrO2, rare earth oxides
Abstract
Description
本發明是關於藉由高能束(high energy beam)的照射使基材(substrate)上的陶瓷熔射塗膜(ceramic thermal spray coating)的表層緻密化並賦予耐腐蝕性(corrosion resistance)或減少微粒(particle)等的功能性，並且防止由於高能束的照射而產生的裂痕(crack)之朝深部方向進展之陶瓷熔射塗膜包覆構件及半導體製造裝置用構件。The present invention relates to densifying a surface layer of a ceramic thermal spray coating on a substrate by irradiation with a high energy beam and imparting corrosion resistance or reducing particles. A ceramic spray coating coating member and a member for a semiconductor manufacturing apparatus which prevent the crack in the deep direction due to the irradiation of the high-energy beam.
為了提高構造物的耐磨耗性、低摩擦化等，在構造構件的表面形成各種熔射塗膜當作熔射塗膜包覆構件被進行。熔射法(thermal spraying method)是將陶瓷、金屬、金屬陶瓷(cermet)等的熔射粉末材料供給至可燃性氣體的燃燒火焰中，或供給至藉由Ar、He、H2 等的氣體而使其產生的電漿噴流焰(plasma jet flame)中，在使該等陶瓷、金屬、金屬陶瓷等的熔射粉末材料成軟化或熔融的狀態，藉由以高速噴塗至被熔射體的表面，在被熔射體的表面形成熔射塗膜的表面處理技術。In order to improve the wear resistance of the structure, low friction, and the like, various spray coating films are formed on the surface of the structural member as the spray coating film covering member. In the thermal spraying method, a molten powder material such as ceramics, metal, or cermet is supplied to a combustion flame of a combustible gas, or is supplied to a gas such as Ar, He, or H 2 . In the plasma jet flame generated by the plasma jet flame, the molten powder material of the ceramic, metal, cermet or the like is softened or melted, and sprayed onto the surface of the melted body at a high speed. A surface treatment technique in which a spray coating film is formed on the surface of the fused body.
隨著熔射塗膜包覆構件的適用領域的擴大，熔射材料使用陶瓷的陶瓷熔射塗膜包覆構件被期待更進一步的提高功能性。陶瓷熔射塗膜包覆構件的用途之一有構成CVD裝置(Chemical Vapor Deposition equipment:化學氣相沉積裝置)、PVD裝置(Physical Vapor Deposition equipment:物理氣相沉積裝置)、光阻塗佈裝置(resist coater)等的半導體製造裝置的構造構件。在半導體製程中的處理容器內因包含氟化物或氯化物的處理氣體(processed gas)常被使用，故有被置於處理容器內的各種構件腐蝕的問題。因此，在相關的製程所使用的構件除了電絕緣性之外，也被要求耐腐蝕性。進而在處理容器內產生之被稱為微粒(particle)的微粒子的存在會影響半導體元件製品的品質或良率(yield)。針對這種問題的對策是在半導體製造裝置用構件的表面形成陶瓷熔射塗膜，提高電絕緣性及耐腐蝕性，並且使微粒的產生減少。With the expansion of the field of application of the spray coating film covering member, the use of a ceramic ceramic spray coating film covering member for a molten material is expected to further improve the functionality. One of the applications of the ceramic spray coating coating member is a CVD device (Chemical Vapor Deposition equipment), a PVD device (Physical Vapor Deposition equipment), and a photoresist coating device ( Structural member of a semiconductor manufacturing apparatus such as a resist coater). In a processing container in a semiconductor process, a processed gas containing fluoride or chloride is often used, so that various members placed in the processing container are corroded. Therefore, the components used in the related processes are required to have corrosion resistance in addition to electrical insulation. Further, the presence of particles called particles generated in the processing container affects the quality or yield of the semiconductor device article. A countermeasure against such a problem is to form a ceramic spray coating film on the surface of a member for a semiconductor manufacturing apparatus, thereby improving electrical insulating properties and corrosion resistance, and reducing generation of fine particles.
但是，在過嚴的腐蝕性氣體存在的條件下等，有未必能得到充分的耐腐蝕性的效果的情形。除此之外，在電路不斷地微細化(refinement)的半導體元件的製程中，迄今未被視為問題的更微細的尺寸的微粒的產生也開始被視為問題。因此，已知有將高能束照射於形成於基材上的熔射塗膜的表面，使表層的塗膜組成物再熔融、再凝固，使表層成緻密化層被進行，據此，耐腐蝕性或微粒的減少效果格外地提高。However, in the presence of an excessively corrosive gas, there is a case where an effect of sufficient corrosion resistance may not be obtained. In addition to this, in the process of continuously refining semiconductor elements, the generation of finer-sized particles which have hitherto not been regarded as a problem has also been regarded as a problem. Therefore, it is known that a high energy beam is irradiated onto the surface of a spray coating film formed on a substrate, and the coating film composition of the surface layer is remelted and resolidified, whereby the surface layer is densified, and accordingly, corrosion resistance is performed. The reduction effect of sex or particles is particularly enhanced.
例如在專利文獻1記載有在基材表面熔射週期表的第13族元素的氧化物，形成多孔層，藉由對多孔層的表層高能照射形成二次再結晶層，當作半導體加工裝置用陶瓷包覆構件的製造方法的技術。在專利文獻2記載有具備如下之半導體製造裝置用構件：藉由將雷射束(laser beam)或電子束(electron beam)照射於陶瓷熔射塗膜使該熔射塗膜表層的陶瓷組成物再熔融、再凝固，形成有網眼狀的龜裂之高強度陶瓷層。For example, Patent Document 1 discloses that an oxide of a Group 13 element of a periodic table is sprayed on a surface of a substrate to form a porous layer, and a secondary recrystallized layer is formed by irradiating a surface of the porous layer with high energy to form a semiconductor processing apparatus. A technique for a method of manufacturing a ceramic coated member. Patent Document 2 discloses a member for a semiconductor manufacturing apparatus in which a laser beam is irradiated onto a ceramic spray coating film by a laser beam or an electron beam to form a ceramic composition of the surface layer of the spray coating film. It is melted and resolidified to form a high-strength ceramic layer having a mesh-like crack.
[專利文獻1] 日本國特開2007-247043號公報 [專利文獻2] 日本國特開2013-095973號公報[Patent Document 1] Japanese Laid-Open Patent Publication No. 2007-247043 [Patent Document 2] Japanese Patent Laid-Open Publication No. 2013-095973
但是，在基材表面熔射週期表的第13族元素的氧化物，形成多孔層，藉由對多孔層的表層高能照射形成二次再結晶層，當作半導體加工裝置用陶瓷包覆構件的製造方法的技術(專利文獻1)中，在藉由高能照射使多孔層熔融，形成二次再結晶層時，在多孔層產生裂痕被預想到。會擔心由於該裂痕的形態而使微粒的增加或耐腐蝕性的降低及電絕緣性的降低等。However, an oxide of a Group 13 element of the periodic table is sprayed on the surface of the substrate to form a porous layer, and a secondary recrystallized layer is formed by irradiating the surface layer of the porous layer with high energy, and is used as a ceramic covering member for a semiconductor processing apparatus. In the technique of the production method (Patent Document 1), when the porous layer is melted by high-energy irradiation to form a secondary recrystallized layer, it is expected that cracks will occur in the porous layer. There is a concern that the increase in fine particles or the decrease in corrosion resistance and the decrease in electrical insulation due to the form of the crack may occur.
在具備藉由將雷射束或電子束照射於陶瓷熔射塗膜使該熔射塗膜表層的陶瓷組成物再熔融、再凝固，形成有網眼狀的龜裂之高強度陶瓷層的半導體製造裝置用構件(專利文獻2)中，在使熔射塗膜表層的陶瓷組成物再熔融、再凝固時，控制在熔射塗膜表層產生網眼狀的裂痕的大小。但是，會擔心在裂痕朝熔射塗膜的深部側深深地形成的情形下，熔射塗膜的損傷或電絕緣性的顯著的降低。A semiconductor having a high-strength ceramic layer having a mesh-like crack formed by re-melting and resolidifying a ceramic composition of the surface of the spray coating film by irradiating a laser beam or an electron beam onto a ceramic spray coating film In the member for manufacturing a device (Patent Document 2), when the ceramic composition of the surface layer of the spray coating film is remelted and resolidified, the size of the mesh-like crack is generated in the surface layer of the spray coating film. However, in the case where the crack is formed deep toward the deep side of the spray coating film, the damage of the spray coating film or the electrical insulation property is remarkably lowered.
因此，本發明是鑑於習知技術的問題點，其目的為提供一種耐腐蝕性、電絕緣性及耐久性優良的陶瓷熔射塗膜包覆構件及半導體製造裝置用構件。Therefore, the present invention has been made in view of the problems of the prior art, and an object thereof is to provide a ceramic spray coating film covering member and a member for a semiconductor manufacturing apparatus which are excellent in corrosion resistance, electrical insulating properties, and durability.
為了達成上述目的，採取以下的技術手段。也就是說本發明為一種陶瓷熔射塗膜包覆構件，將高能束照射於基材上的陶瓷熔射塗膜的表面形成緻密化層，其特徵在於:在前述緻密化層之下存在由在積層狀態下互相分散的複數個熔射材料構成的裂痕抑制層。In order to achieve the above objectives, the following technical means are adopted. That is, the present invention is a ceramic spray coating film covering member which forms a densified layer on a surface of a ceramic spray coating film which is irradiated with a high energy beam on a substrate, and is characterized in that: under the aforementioned densification layer, there is A crack suppressing layer composed of a plurality of molten materials dispersed in a laminated state.
在本發明的陶瓷熔射塗膜包覆構件的緻密化層之下存在阻止照射高能束形成緻密化層時的裂痕的進展的裂痕抑制層。因裂痕抑制層藉由分散的複數個熔射材料構成，故在深部方向超過緻密化層而進展起來的裂痕到達複數個熔射材料的界面時，發生該界面接觸界線的熔射材料彼此的不一致。因此，裂痕的力被釋放，可阻止更進一步的裂痕的進展。可藉由複數個熔射材料在積層狀態下分散而有效地使由緻密化層進展起來的裂痕的方向轉換。因此，即使加大雷射束的能量進行照射，使緻密化層的厚度增大，也能抑制超過緻密化層的裂痕的進展。Under the densified layer of the ceramic spray coating film covering member of the present invention, there is a crack suppressing layer that prevents the progress of cracks when the high energy beam is irradiated to form the densified layer. Since the crack suppressing layer is composed of a plurality of dispersed molten materials, when the crack which progresses beyond the densified layer in the deep direction reaches the interface of the plurality of molten materials, the molten material of the interface contact boundary is inconsistent with each other. . As a result, the force of the crack is released, preventing the progression of further cracks. The direction of the cracks progressing from the densified layer can be effectively converted by the dispersion of a plurality of molten materials in a laminated state. Therefore, even if the energy of the laser beam is increased and the thickness of the densified layer is increased, the progress of the crack exceeding the densified layer can be suppressed.
可藉由包含氧化物系陶瓷(oxide-based ceramics)的兩種以上的陶瓷構成前述複數個熔射材料，可大大地使進展至裂痕抑制層的裂痕的方向轉換。The plurality of kinds of the above-mentioned plurality of kinds of the ceramics can be formed by the two or more kinds of ceramics containing the oxide-based ceramics, and the direction of the crack progressing to the crack-suppressing layer can be greatly converted.
前述複數個熔射材料之中的至少一個若以20μm~200μm左右的寬度形成略扁平狀的話，可更加大由緻密化層進展起來的裂痕的力的釋放效果，可更大大地使裂痕方向轉換。When at least one of the plurality of molten materials is formed in a slightly flat shape with a width of about 20 μm to 200 μm, the effect of releasing the crack force by the densified layer can be further increased, and the crack direction can be more greatly converted. .
藉由以50μm以上的厚度形成前述裂痕抑制層，可更確實地阻止裂痕的進展。By forming the crack-inhibiting layer with a thickness of 50 μm or more, the progress of the crack can be more reliably prevented.
前述裂痕抑制層中的前述複數個熔射材料之中的一個的含有率為3vol%~97vol%較佳。據此可更有效地阻止裂痕的進展。The content of one of the plurality of the above-mentioned plurality of molten materials in the crack suppressing layer is preferably from 3 vol% to 97 vol%. According to this, the progress of the crack can be prevented more effectively.
本發明的半導體製造裝置用構件是由在基材上形成有陶瓷熔射塗膜之陶瓷熔射塗膜包覆構件構成，其特徵在於:該陶瓷熔射塗膜包覆構件為在上述說明的陶瓷熔射塗膜包覆構件。The member for a semiconductor manufacturing apparatus of the present invention is composed of a ceramic spray coating film covering member having a ceramic spray coating film formed on a substrate, wherein the ceramic spray coating film covering member is as described above. Ceramic spray coating film covering member.
在構成本發明的半導體製造裝置用構件的陶瓷熔射塗膜包覆構件的緻密化層之下存在阻止照射高能束形成緻密化層時的裂痕的進展的裂痕抑制層。因裂痕抑制層藉由分散的複數個熔射材料構成，故在深部方向超過緻密化層而進展起來的裂痕到達複數個熔射材料的界面時，發生該界面接觸界線的熔射材料彼此的不一致。因此，裂痕的力被釋放，可阻止更進一步的裂痕的進展。可藉由複數個熔射材料在積層狀態下分散而有效地使由緻密化層進展起來的裂痕的方向轉換。因此，即使加大雷射束的能量進行照射，使緻密化層的厚度增大，也能抑制超過緻密化層的裂痕的進展。Under the densified layer of the ceramic spray coating film covering member constituting the member for a semiconductor manufacturing apparatus of the present invention, there is a crack suppressing layer that prevents the progress of cracking when the high energy beam is formed to form the densified layer. Since the crack suppressing layer is composed of a plurality of dispersed molten materials, when the crack which progresses beyond the densified layer in the deep direction reaches the interface of the plurality of molten materials, the molten material of the interface contact boundary is inconsistent with each other. . As a result, the force of the crack is released, preventing the progression of further cracks. The direction of the cracks progressing from the densified layer can be effectively converted by the dispersion of a plurality of molten materials in a laminated state. Therefore, even if the energy of the laser beam is increased and the thickness of the densified layer is increased, the progress of the crack exceeding the densified layer can be suppressed.
依照本發明，進行利用雷射等的高能束的照射時，即使加大能量使緻密化層的厚度增大，也能抑制在深部方向產生的裂痕的進展，故可提高耐腐蝕性、電絕緣性及耐久性。According to the present invention, when irradiation with a high-energy beam such as a laser is performed, even if the energy is increased to increase the thickness of the densified layer, the progress of cracks in the deep direction can be suppressed, so that corrosion resistance and electrical insulation can be improved. Sex and durability.
就本發明的實施形態進行說明。圖1是與本發明的第一實施形態有關的陶瓷熔射塗膜包覆構件1之剖面模式圖。陶瓷熔射塗膜包覆構件1是在例如半導體製造裝置等的各式各樣的用途被使用，藉由基材2，與形成於該基材2的表面的陶瓷熔射塗膜3構成。此外，在請求項1所謂的基材上的陶瓷熔射塗膜是指包含在基材的表面直接形成有陶瓷熔射塗膜的情形，在基材隔著底塗(undercoat)或其他的層形成有陶瓷熔射塗膜的情形的任一方。Embodiments of the present invention will be described. Fig. 1 is a schematic cross-sectional view showing a ceramic spray coating film covering member 1 according to a first embodiment of the present invention. The ceramic spray coating film covering member 1 is used for various applications such as a semiconductor manufacturing apparatus, and is composed of a base material 2 and a ceramic spray coating film 3 formed on the surface of the base material 2. Further, the ceramic spray coating film on the substrate of the claim 1 refers to a case where a ceramic spray coating film is directly formed on the surface of the substrate, and an undercoat or other layer is interposed on the substrate. Any of the cases in which a ceramic spray coating film is formed.
基材2可舉出金屬、陶瓷、金屬陶瓷、高分子材料、碳纖維(carbon fiber)或複合陶瓷的高分子材料等，未被特別限定。以在構件上形成堆焊(weld overlaying)、電鍍及另一熔射塗膜等當作基材2也可以。也可以配設堆焊、電鍍及另一熔射塗膜等當作陶瓷熔射塗膜3的底塗。The base material 2 is not particularly limited as long as it is a metal, a ceramic, a cermet, a polymer material, a carbon fiber or a polymer material of a composite ceramic. It is also possible to form weld overlaying, plating, another spray coating film, or the like as the substrate 2 on the member. It is also possible to provide a primer for the ceramic spray coating film 3 such as surfacing, plating, and another spray coating film.
陶瓷熔射塗膜3的表層成為藉由照射高能束形成的緻密化層4，其下層(圖1下側的層)成為抑制進展起來的裂痕用的裂痕抑制層5。The surface layer of the ceramic spray coating film 3 is a densification layer 4 formed by irradiating a high-energy beam, and the lower layer (the layer on the lower side in FIG. 1) serves as a crack suppression layer 5 for suppressing cracks which progress.
就照射高能束前的陶瓷熔射塗膜進行說明。此處所謂的陶瓷熔射塗膜對應圖1中的陶瓷熔射塗膜3。陶瓷熔射塗膜包含至少一個氧化物系陶瓷，且藉由熔射由兩種以上的陶瓷構成的複數個熔射材料而形成。陶瓷熔射塗膜的厚度為50μm~4000μm的範圍較適合。在厚度未滿50μm下，塗膜的均勻性降低無法充分發揮耐腐蝕性或耐電絕緣性等的塗膜功能，一超過4000μm，就因塗膜內部的殘留應力(residual stress)的影響而使塗膜的機械強度(mechanical strength)降低。The ceramic spray coating film before the irradiation of the high energy beam will be described. The ceramic spray coating film referred to herein corresponds to the ceramic spray coating film 3 of Fig. 1 . The ceramic spray coating film contains at least one oxide-based ceramic and is formed by spraying a plurality of molten materials composed of two or more kinds of ceramics. The thickness of the ceramic spray coating film is preferably in the range of 50 μm to 4000 μm. When the thickness is less than 50 μm, the uniformity of the coating film is lowered, and the coating film function such as corrosion resistance or electrical insulation resistance cannot be sufficiently exhibited. When the thickness exceeds 4000 μm, the coating is affected by the residual stress inside the coating film. The mechanical strength of the film is reduced.
構成陶瓷熔射塗膜的陶瓷熔射材料的組合藉由包含氧化物系陶瓷的兩種以上的陶瓷成膜較佳。陶瓷熔射材料的具體例可舉出：以選自於Ni、Cr、Co、Al、Ta、Y、W、Nb、V、Ti、B、Si、Mo、Zr、Fe、Hf、La、Ni的群的元素單體或該等元素的一種以上為主成分的氧化物系陶瓷、氮化物系陶瓷、氟化物系陶瓷、碳化物系陶瓷、硼化物系陶瓷等或氧化物系陶瓷、氮化物系陶瓷、氟化物系陶瓷、碳化物系陶瓷、硼化物系陶瓷的混合物。The combination of the ceramic spray materials constituting the ceramic spray coating film is preferably formed by two or more kinds of ceramics containing an oxide-based ceramic. Specific examples of the ceramic spray material include: selected from the group consisting of Ni, Cr, Co, Al, Ta, Y, W, Nb, V, Ti, B, Si, Mo, Zr, Fe, Hf, La, Ni. An elemental monomer of the group or an oxide ceramic, a nitride-based ceramic, a fluoride-based ceramic, a carbide-based ceramic, a boride-based ceramic, or an oxide-based ceramic or nitride containing one or more of the above-mentioned elements as a main component. A mixture of ceramics, fluoride-based ceramics, carbide-based ceramics, and boride-based ceramics.
氧化物系陶瓷的具體例可舉出Al2 O3 、HfO2 、La2 O3 、Al2 O3 /SiO2 、NiO、ZrO2 /SiO2 、TiO2 、SiO2 、Cr2 O3 、ZrO2 、Y2 O3 、MgO、CaO等。氮化物系陶瓷可舉出TiN、TaN、AlN、BN、Si3 N4 、HfN、NbN、YN、ZrN、Mg3 N2 、Ca3 N2 等。氟化物系陶瓷可舉出LiF、CaF2 、BaF2 、YF3 、AlF3 、ZrF4 、MgF2 等。碳化物系陶瓷可舉出TiC、WC、TaC、B4 C、SiC、HfC、ZrC、VC、Cr3 C2 等。硼化物系陶瓷可舉出TiB2 、ZrB2 、HfB2 、VB2 、TaB2 、NbB2 、W2 B5 、CrB2 、LaB6 等。Specific examples of the oxide-based ceramics include Al 2 O 3 , HfO 2 , La 2 O 3 , Al 2 O 3 /SiO 2 , NiO, ZrO 2 /SiO 2 , TiO 2 , SiO 2 , Cr 2 O 3 , ZrO 2 , Y 2 O 3 , MgO, CaO, and the like. Examples of the nitride-based ceramics include TiN, TaN, AlN, BN, Si 3 N 4 , HfN, NbN, YN, ZrN, Mg 3 N 2 , and Ca 3 N 2 . Examples of the fluoride-based ceramics include LiF, CaF 2 , BaF 2 , YF 3 , AlF 3 , ZrF 4 , and MgF 2 . Examples of the carbide-based ceramics include TiC, WC, TaC, B 4 C, SiC, HfC, ZrC, VC, and Cr 3 C 2 . Examples of the boride-based ceramics include TiB 2 , ZrB 2 , HfB 2 , VB 2 , TaB 2 , NbB 2 , W 2 B 5 , CrB 2 , and LaB 6 .
為了形成陶瓷熔射塗膜，例如藉由預先混合複數個陶瓷熔射粉末，使用一個材料供給裝置將該陶瓷熔射粉末投入到熔射槍(thermal spraying gun)的框架(frame)而進行熔射。另一方法是將不同的熔射粉末放入複數個材料供給裝置的各個，使用該裝置將不同的熔射粉末同時投入到熔射槍的框架而進行熔射。In order to form a ceramic spray coating film, for example, by mixing a plurality of ceramic powders in advance, the ceramic powder is thrown into a frame of a thermal spraying gun using a material supply device to perform the spraying. . Another method is to place different spray powders into each of a plurality of material supply devices, and use the device to simultaneously apply different spray powders to the frame of the spray gun for spraying.
用以形成陶瓷熔射塗膜的熔射方法可舉出大氣電漿熔射法(atmospheric plasma spraying method)、低壓電漿熔射法(low pressure atmosphere plasma spraying method)、水穩電漿熔射法(water stabilized plasma spraying method)、高速火焰熔射法(high velocity flame spraying method)、氣體火焰熔射法(gas flame spraying method)、***火焰熔射法(detonation flame spraying method)等。特別是以電能為熱源的電漿熔射法(plasma spraying method)是利用氬、氫及氮等當作電漿的產生源而成膜，因熱源溫度高、火焰速度快，特別是可緻密地將高熔點的材料成膜，故適合形成陶瓷熔射塗膜3用的熔射方法。Examples of the method for forming a ceramic spray coating film include an atmospheric plasma spraying method, a low pressure atmosphere plasma spraying method, and a water stable plasma spraying method. Water stabilized plasma spraying method, high velocity flame spraying method, gas flame spraying method, detonation flame spraying method, and the like. In particular, the plasma spraying method using electric energy as a heat source is formed by using argon, hydrogen, nitrogen or the like as a source of plasma, because the heat source has a high temperature and a high flame speed, particularly densely. Since a material having a high melting point is formed into a film, it is suitable for a method of forming a ceramic spray coating film 3.
用以形成陶瓷熔射塗膜的原料粉末使用粒徑5μm~80μm左右的粒度範圍(size range)的粉末。若使用該粒度範圍的陶瓷粉末進行熔射，則能以20μm~200μm左右的寬度熔射成略扁平狀。若粉末粒徑比5μm小，則粉末的流動性降低無法進行穩定的供給，塗膜的厚度容易變成不均勻，若超過80μm的話，則有在未完全熔融下被成膜之虞，因過度地被多孔化使膜質變粗糙，故不佳。利用該等各熔射法的成膜條件只要依照基材、原料粉末、膜厚、製造環境等適宜設定的話即可。The raw material powder for forming the ceramic spray coating film is a powder having a particle size range of about 5 μm to 80 μm. When the ceramic powder having the particle size range is used for the spraying, it can be melted to a slightly flat shape with a width of about 20 μm to 200 μm. When the particle size of the powder is smaller than 5 μm, the fluidity of the powder is lowered, and the supply of the powder is not stable. The thickness of the coating film tends to be uneven. If it exceeds 80 μm, the film is not completely melted, and the film is excessively melted. It is not preferable because it is made porous and the film quality is roughened. The film formation conditions by the respective deposition methods may be appropriately set in accordance with the substrate, the raw material powder, the film thickness, the production environment, and the like.
緻密化層4藉由將高能束照射於陶瓷熔射塗膜的表層而形成。緻密化層4的下層成為未被進行緻密化處理的裂痕抑制層5。藉由使陶瓷熔射塗膜的表層再熔融、再凝固，使構成陶瓷熔射塗膜的不同的陶瓷熔射組織的邊界變少，緻密化層4成為非常緻密的塗膜組織。該緻密化層4的平均孔隙率(mean porosity)未滿5%較佳，未滿2%更佳。The densified layer 4 is formed by irradiating a high energy beam onto the surface layer of the ceramic spray coating film. The lower layer of the densified layer 4 becomes the crack suppressing layer 5 which is not subjected to densification treatment. By remelting and resolidifying the surface layer of the ceramic spray coating film, the boundaries of the different ceramic melted structures constituting the ceramic spray coating film are reduced, and the densified layer 4 becomes a very dense coating film structure. The average porosity of the densified layer 4 is preferably less than 5%, more preferably less than 2%.
緻密化層4的厚度由表面起10μm~200μm左右較佳。若比10μm還薄，則形成緻密化層4的效果小，若以超過200μm的厚度，則在形成緻密化層4的效果飽和上，使其再熔融、再凝固的表層的殘留應力過大，對外部的力的耐衝擊性反而降低。The thickness of the densified layer 4 is preferably from about 10 μm to about 200 μm from the surface. When it is thinner than 10 μm, the effect of forming the densified layer 4 is small. When the thickness is more than 200 μm, the residual stress of the surface layer which is remelted and resolidified is too large when the effect of forming the densified layer 4 is saturated. The impact resistance of the external force is reduced.
用以得到緻密化層4的高能束是指雷射束及電子束等。高能束的照射是以雷射束或電子束掃描形成於基材2上的陶瓷熔射塗膜的表面而進行。高能束的掃描有藉由電流掃描器(galvano scanner)等進行的方法，或將掃描的對象物(XY stage)，使XY平台移動於X方向及Y方向而進行的方法等，只要適宜調節掃描條件以滿足緻密化層4所要求的厚度或孔隙率(porosity)而進行的話即可。The high energy beam for obtaining the densified layer 4 means a laser beam, an electron beam, or the like. The irradiation of the high energy beam is performed by scanning the surface of the ceramic spray coating film formed on the substrate 2 with a laser beam or an electron beam. The scanning of the high-energy beam may be performed by a method such as a galvano scanner or a method of moving the XY stage in the X direction and the Y direction by scanning the object (XY stage), etc., as long as the scanning is appropriately adjusted. The conditions may be such that the thickness or porosity required for the densified layer 4 is satisfied.
在雷射束的照射中使用CO2 氣體雷射、YAG雷射(Yttrium Aluminum Garnet laser：釔鋁石榴石雷射)較佳。推薦如下的條件當作雷射束的照射條件：雷射輸出：0.01~1kW、雷射束面積：0.01~250mm2 、照射速度：1~100mm/s。推薦如下的條件當作電子束的照射條件：照射環境：10~0.0005Pa、照射輸出：0.1~8kW、照射速度：1~30m/s。在該等條件下只要適宜調節照射條件以滿足緻密化層4所要求的厚度或孔隙率而進行的話即可。It is preferable to use a CO 2 gas laser or a YAG laser (Yttrium Aluminum Garnet laser) for the irradiation of the laser beam. The following conditions are recommended as the irradiation conditions of the laser beam: laser output: 0.01 to 1 kW, laser beam area: 0.01 to 250 mm 2 , and irradiation speed: 1 to 100 mm/s. The following conditions are recommended as the irradiation conditions of the electron beam: irradiation environment: 10 to 0.0005 Pa, irradiation output: 0.1 to 8 kW, and irradiation speed: 1 to 30 m/s. Under these conditions, the irradiation conditions may be appropriately adjusted to satisfy the thickness or porosity required for the densification layer 4.
緻密化層4因與照射高能束前的陶瓷熔射塗膜的表層比較具有非常緻密的構造，故機械強度提高，可提高耐腐蝕性或微粒的減少效果。Since the densified layer 4 has a very dense structure as compared with the surface layer of the ceramic spray coating film before the irradiation of the high energy beam, the mechanical strength is improved, and the corrosion resistance or the reduction effect of the fine particles can be improved.
一般照射高能束形成緻密化層時，由於使陶瓷熔射塗膜的表層再熔融、再凝固時的收縮而產生裂痕。當裂痕之朝塗膜深部方向的進展過深時會造成耐腐蝕性、耐受電壓(withstand voltage)等的塗膜功能的降低。在本實施形態中，使阻止裂痕6的進展的裂痕抑制層5存在於緻密化層4之下。在本實施形態所謂的緻密化層4之下是指使接觸該緻密化層4並存在於正下方之意，不是在緻密化層4之下隔著某些層而存在此一意思。裂痕抑制層5必須存在於接觸緻密化層4的位置。When a high-energy beam is generally irradiated to form a densified layer, cracks are generated due to re-melting of the surface layer of the ceramic spray coating film and shrinkage upon re-solidification. When the crack progresses too deep in the deep direction of the coating film, the coating function such as corrosion resistance and withstand voltage is lowered. In the present embodiment, the crack suppressing layer 5 that prevents the progress of the crack 6 is present under the densified layer 4. In the present embodiment, the lower portion of the densified layer 4 means that the densified layer 4 is placed directly underneath, and that it does not exist under the densified layer 4 via some layers. The crack suppression layer 5 must be present at a position contacting the densification layer 4.
裂痕抑制層5是在熔射陶瓷熔射塗膜3後，照射高能束在陶瓷熔射塗膜3中的上層側形成緻密化層4時的當作該緻密化層4的下層而得的層。因此，裂痕抑制層5包含至少一個氧化物系陶瓷，且藉由由兩種以上的陶瓷構成的複數個熔射材料構成。The crack-inhibiting layer 5 is a layer obtained as a lower layer of the densified layer 4 when the high-energy beam is irradiated onto the upper layer side of the ceramic spray coating film 3 after the ceramic spray coating film 3 is sprayed. . Therefore, the crack suppressing layer 5 contains at least one oxide-based ceramic and is composed of a plurality of molten materials composed of two or more kinds of ceramics.
裂痕抑制層5是藉由熔射複數個熔射材料而得的層，複數個熔射材料成為在該裂痕抑制層5中在積層狀態下互相分散的材料。藉由裂痕抑制層5的存在，可大大地使進展至該裂痕抑制層5的裂痕6的方向轉換，可確實地阻止裂痕6之朝深部方向進展。The crack suppressing layer 5 is a layer obtained by spraying a plurality of molten materials, and a plurality of the molten materials are materials which are dispersed in the layered state in the crack suppressing layer 5. By the presence of the crack suppressing layer 5, the direction of the crack 6 progressing to the crack suppressing layer 5 can be greatly changed, and the progress of the crack 6 in the deep direction can be surely prevented.
藉由裂痕抑制層5的複數個熔射材料包含至少一個氧化物系陶瓷，使熔射性提高，使耐腐蝕性及耐受電壓等的塗膜功能提高。在選擇了Al2 O3 、TiO2 、Y2 O3 等的良率高的熔射材料的情形下而成為工學上有利。裂痕抑制層5中的具有積層構造的複數個熔射材料之中的至少一個以20μm~200μm左右的寬度形成略扁平狀。此處所謂的寬度是指沿著圖1左右方向的長度。若複數個熔射材料的至少一個比20μm小，則因無法大大地使裂痕6的進展轉換，故抑制裂痕6的進展的效果小，在比200μm大的情形下，在積層構造中產生多數個裂痕，阻止裂痕6之朝深部方向進展的效果變小。The plurality of molten materials of the crack suppressing layer 5 include at least one oxide-based ceramic to improve the meltability and improve the coating function such as corrosion resistance and withstand voltage. It is technically advantageous in the case where a high-strength spray material such as Al 2 O 3 , TiO 2 or Y 2 O 3 is selected. At least one of the plurality of molten materials having a laminated structure in the crack suppressing layer 5 is formed in a slightly flat shape with a width of about 20 μm to 200 μm. The term "width" as used herein refers to the length in the left-right direction of FIG. When at least one of the plurality of molten materials is smaller than 20 μm, since the progress of the crack 6 cannot be greatly changed, the effect of suppressing the progress of the crack 6 is small, and when it is larger than 200 μm, a plurality of layers are formed in the laminated structure. The cracks prevent the crack 6 from progressing in the deep direction.
裂痕抑制層5的厚度為40μm以上較佳，100μm以上更佳。可藉由以這種厚度更確實地阻止裂痕6之朝深部方向進展。若裂痕抑制層5的厚度比40μm薄，則裂痕6往往會超過裂痕抑制層5而朝深部方向進展。The thickness of the crack suppressing layer 5 is preferably 40 μm or more, more preferably 100 μm or more. It is possible to more reliably prevent the crack 6 from progressing in the deep direction with such a thickness. If the thickness of the crack suppressing layer 5 is thinner than 40 μm, the crack 6 tends to extend beyond the crack suppressing layer 5 and progress toward the deep direction.
裂痕抑制層5中的以複數個熔射材料之中的一個熔射材料構成的積層塗膜的含有率為3vol%~97vol%較佳，10vol%~90vol%更佳。可藉由以這種含有率更確實地阻止裂痕6之朝深部方向進展。當該含有率比3vol%小或比97vol%大時，包含於裂痕抑制層5的複數個熔射材料彼此的界面的面積變小。因此，裂痕6無法到達相關的界面，有裂痕6之朝深部方向進展的抑制效果消失的情形。The content of the buildup coating film composed of one of the plurality of melt materials in the crack suppressing layer 5 is preferably 3 vol% to 97 vol%, more preferably 10 vol% to 90 vol%. It is possible to more reliably prevent the crack 6 from progressing in the deep direction in this content rate. When the content ratio is smaller than 3 vol% or larger than 97 vol%, the area of the interface between the plurality of molten materials included in the crack suppression layer 5 becomes small. Therefore, the crack 6 cannot reach the relevant interface, and the suppression effect of the progress of the crack 6 in the deep direction disappears.
如以上，在本實施形態的陶瓷熔射塗膜包覆構件1的緻密化層4之下存在阻止照射高能束形成緻密化層4時的裂痕的進展之裂痕抑制層5，裂痕抑制層5藉由分散的複數個熔射材料構成。因此，在深部方向超過緻密化層4而進展起來的裂痕6到達複數個熔射材料的界面時，發生該界面接觸界線的熔射材料彼此的不一致。因此，裂痕6的力被釋放，可阻止更進一步的裂痕6的進展。可藉由複數個熔射材料在積層狀態下分散而有效地使由緻密化層4進展起來的裂痕6的方向轉換。As described above, under the densified layer 4 of the ceramic spray coating film covering member 1 of the present embodiment, there is a crack inhibiting layer 5 which prevents the progress of cracking when the high-energy beam is formed into the densified layer 4, and the crack suppressing layer 5 It consists of a plurality of dispersed molten materials. Therefore, when the crack 6 which has progressed beyond the densification layer 4 in the deep direction reaches the interface of the plurality of molten materials, the inconsistencies of the melted materials of the interface contact boundary occur. Therefore, the force of the crack 6 is released, which prevents further progression of the crack 6. The direction of the crack 6 progressing from the densified layer 4 can be effectively converted by the dispersion of a plurality of molten materials in a laminated state.
因此，即使加大雷射束的能量進行照射，使緻密化層4的厚度增大，也能抑制超過緻密化層4的裂痕6的進展。據此，進行利用雷射等的高能束的照射時，即使加大能量使緻密化層4的厚度增大，也能抑制在深部方向產生的裂痕的進展，故可提高耐腐蝕性、電絕緣性及耐久性。Therefore, even if the energy of the laser beam is increased and the thickness of the densified layer 4 is increased, the progress of the crack 6 exceeding the densified layer 4 can be suppressed. According to this, when irradiation with a high-energy beam such as a laser is performed, even if the energy is increased to increase the thickness of the densified layer 4, the progress of cracks in the deep direction can be suppressed, so that corrosion resistance and electrical insulation can be improved. Sex and durability.
圖2是與本發明有關的陶瓷熔射塗膜包覆構件的剖面之電子顯微鏡照片。該陶瓷熔射塗膜包覆構件是分別以50vol%的含有率將Al2 O3 與Y2 O3 混合並以此當作熔射粉末，藉由電漿熔射法將該熔射粉末熔射於Al製的基材上，進而照射0.03kW的CO2 雷射束形成緻密化層的例子。陶瓷熔射塗膜的厚度以400μm左右，緻密化層的厚度以50μm左右。構成緻密化層的下層之裂痕抑制層中的積層構造的各熔射材料以20μm~200μm左右的寬度成略扁平狀。認定了進展至緻密化層的裂痕被其正下方的裂痕抑制層阻止。Fig. 2 is an electron micrograph of a cross section of a ceramic spray coating film covering member according to the present invention. The ceramic spray coating coating member is obtained by mixing Al 2 O 3 and Y 2 O 3 at a content ratio of 50 vol%, respectively, and using the powder as a spray powder, and melting the molten powder by a plasma spray method. An example of forming a densified layer by irradiating a 0.03 kW CO 2 laser beam onto a substrate made of Al. The thickness of the ceramic spray coating film is about 400 μm, and the thickness of the densified layer is about 50 μm. Each of the molten materials of the laminated structure in the crack-suppressing layer constituting the lower layer of the densified layer has a substantially flat shape with a width of about 20 μm to 200 μm. It was confirmed that the crack progressing to the densified layer was blocked by the crack suppressing layer directly below it.
[實施例] 使用實施例更詳細地說明本發明。本發明不是被限定於以下的實施例。基材使用50mm×50mm×10mm的鋁(A5052)材，在該基材上藉由電漿熔射法形成陶瓷熔射塗膜，使用0.03kW的CO2 雷射適宜設定雷射照射條件(掃描速度或間距等)形成了緻密化層。使熔射材料、各熔射材料的含有率、熔射後的熔射材料的扁平寬、裂痕抑制層的厚度變化製作實施例1~11及比較例1~5的試樣，評價了裂痕是否貫通裂痕抑制層。將結果顯示於表1。認定了在各實施例中裂痕之朝深部的進展被抑制。[Examples] The present invention will be described in more detail by way of examples. The invention is not limited to the following examples. The substrate is made of aluminum (A5052) material of 50 mm × 50 mm × 10 mm, and a ceramic spray coating film is formed by plasma spraying on the substrate, and laser irradiation conditions are appropriately set using a 0.03 kW CO 2 laser (scanning) The speed or spacing, etc.) forms a densified layer. The samples of Examples 1 to 11 and Comparative Examples 1 to 5 were prepared by changing the content of the melted material, the content of each of the melted materials, the flatness of the melted material after the melt, and the thickness of the crack suppressing layer, and whether the crack was evaluated. Through the crack suppression layer. The results are shown in Table 1. It was confirmed that progress toward the deep part of the crack was suppressed in each of the examples.
[表1] [Table 1]
圖3是與本發明的第二實施形態有關的陶瓷熔射塗膜包覆構件10之剖面模式圖。在第一實施形態中基材2上的塗膜是以由裂痕抑制層5與緻密化層4構成的兩層構造，而在本實施形態中基材11上的塗膜是以由介電層(dielectric layer)12與裂痕抑制層13與緻密化層14構成的三層構造。在本實施形態的陶瓷熔射塗膜包覆構件10中，在基材11上形成構成介電層12的熔射塗膜，進而在該介電層12的表面形成由複數個熔射材料構成的陶瓷熔射塗膜15。然後，將高能束照射於由複數個熔射材料構成的陶瓷熔射塗膜15的表面，在陶瓷熔射塗膜15的表層形成緻密化層14。如此在緻密化層14之下形成裂痕抑制層13抑制裂痕16的進展。Fig. 3 is a schematic cross-sectional view showing a ceramic spray coating film covering member 10 according to a second embodiment of the present invention. In the first embodiment, the coating film on the substrate 2 is a two-layer structure composed of the crack suppression layer 5 and the densification layer 4, and in the present embodiment, the coating film on the substrate 11 is a dielectric layer. A three-layer structure composed of a dielectric layer 12 and a crack suppression layer 13 and a densification layer 14. In the ceramic spray coating film covering member 10 of the present embodiment, a spray coating film constituting the dielectric layer 12 is formed on the substrate 11, and further, a plurality of molten materials are formed on the surface of the dielectric layer 12. Ceramic spray coating film 15. Then, the high-energy beam is irradiated onto the surface of the ceramic spray coating film 15 composed of a plurality of molten materials, and the densified layer 14 is formed on the surface layer of the ceramic spray coating film 15. Thus, the formation of the crack suppressing layer 13 under the densified layer 14 suppresses the progress of the crack 16.
本發明不是被限定於上述的實施形態及實施例。陶瓷熔射塗膜包覆構件的適用對象不被限定，只要藉由與本發明有關的陶瓷熔射塗膜包覆構件構成例如半導體製造裝置用構件的話即可。此情形可使半導體製造裝置用構件的耐久性格外地提高。The present invention is not limited to the above embodiments and examples. The application of the ceramic spray coating film covering member is not limited, and the ceramic spray coating film covering member according to the present invention may be, for example, a member for a semiconductor manufacturing apparatus. In this case, the durability of the member for a semiconductor manufacturing apparatus can be particularly improved.
圖4是顯示陶瓷熔射塗膜包覆構件的三個例子之模式剖面圖。圖4 的(a)是顯示未形成緻密化層的未處理構件20，圖4 的(a1)~ (a3)是調整高能束的能量，使緻密化層21的厚度變化的例子。在未照射圖4 (a)所示的高能束的未處理構件20中，在基材22上形成有由複數個熔射材料構成的陶瓷熔射塗膜23，進而在其表面形成有其他的陶瓷熔射塗膜24。Fig. 4 is a schematic cross-sectional view showing three examples of a ceramic spray coating film covering member. (a) of FIG. 4 shows an unprocessed member 20 in which a densified layer is not formed, and (a1) to (a3) of FIG. 4 are examples in which the energy of the high-energy beam is adjusted to change the thickness of the densified layer 21. In the untreated member 20 in which the high-energy beam shown in Fig. 4 (a) is not irradiated, a ceramic spray coating film 23 composed of a plurality of molten materials is formed on the substrate 22, and further formed on the surface thereof. Ceramic spray coating film 24.
圖4(a1)的例子為其他的陶瓷熔射塗膜的區域成為緻密化層21，進而緻密化層21稍微進入由複數個熔射材料構成的陶瓷熔射塗膜23的區域之陶瓷熔射塗膜包覆構件。圖4(a2)的例子為僅其他的陶瓷熔射塗膜的區域成為緻密化層21之陶瓷熔射塗膜包覆構件。圖4(a3)的例子為其他的陶瓷熔射塗膜的區域的一部分成為緻密化層21，殘留其他的陶瓷熔射塗膜24的區域之陶瓷熔射塗膜包覆構件。因此在該例子中，在基材22上依如下的順序形成：陶瓷熔射塗膜23、其他的陶瓷熔射塗膜24、緻密化層21。也就是說為了達成本發明的目的，只要在藉由高能束的照射形成的緻密化層之下存在使複數個陶瓷熔射材料分散的裂痕抑制層的話即可，基材上的塗膜構造不被限定。The example of Fig. 4 (a1) is that the region of the other ceramic spray coating film becomes the densified layer 21, and the densified layer 21 slightly enters the ceramic spray of the region of the ceramic spray coating film 23 composed of a plurality of molten materials. Coating film covering member. The example of Fig. 4 (a2) is a ceramic spray coating film covering member in which only the region of the other ceramic spray coating film is the densified layer 21. The example of Fig. 4 (a3) is a ceramic spray coating film covering member in which a part of the region of the other ceramic spray coating film is the densified layer 21 and the other ceramic spray coating film 24 remains. Therefore, in this example, the substrate 22 is formed in the following order: a ceramic spray coating film 23, another ceramic spray coating film 24, and a densified layer 21. That is, in order to achieve the object of the present invention, as long as there is a crack inhibiting layer in which a plurality of ceramic molten materials are dispersed under the densified layer formed by irradiation of a high-energy beam, the coating film structure on the substrate is not Limited.
1‧‧‧陶瓷熔射塗膜包覆構件
2、11、22‧‧‧基材
3、15、23、24‧‧‧陶瓷熔射塗膜
4、14、21‧‧‧緻密化層
5、13‧‧‧裂痕抑制層
6、16‧‧‧裂痕
12‧‧‧介電層
20‧‧‧未處理構件1‧‧‧Ceramic spray coating coating member
2,11,22‧‧‧Substrate
3, 15, 23, 24‧‧‧ ceramic spray coating
4, 14, 21‧‧ densified layers
5, 13‧‧‧ crack suppression layer
6, 16‧‧‧ crack
12‧‧‧Dielectric layer
20‧‧‧Unprocessed components
圖1是與本發明的第一實施形態有關的陶瓷熔射塗膜包覆構件之剖面模式圖。 圖2是與本發明有關的陶瓷熔射塗膜包覆構件的剖面之電子顯微鏡照片。 圖3是與本發明的第二實施形態有關的陶瓷熔射塗膜包覆構件之剖面模式圖。 圖4(a)~(a3)是顯示陶瓷熔射塗膜包覆構件的三個例子之模式剖面圖。Fig. 1 is a schematic cross-sectional view showing a ceramic spray coating film covering member according to a first embodiment of the present invention. Fig. 2 is an electron micrograph of a cross section of a ceramic spray coating film covering member according to the present invention. Fig. 3 is a schematic cross-sectional view showing a ceramic spray coating film covering member according to a second embodiment of the present invention. 4(a) to 4(a3) are schematic cross-sectional views showing three examples of a ceramic spray coating film covering member.
1‧‧‧陶瓷熔射塗膜包覆構件 1‧‧‧Ceramic spray coating coating member
2‧‧‧基材 2‧‧‧Substrate
3‧‧‧陶瓷熔射塗膜 3‧‧‧Ceramic spray coating
4‧‧‧緻密化層 4‧‧‧ Densified layer
5‧‧‧裂痕抑制層 5‧‧‧Rift inhibition layer
6‧‧‧裂痕 6‧‧‧ crack
Claims (6)
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| Application Number | Priority Date | Filing Date | Title |
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| JP2014071466A JP2015193872A (en) | 2014-03-31 | 2014-03-31 | Member coated with ceramic spray coating film, and member for semiconductor manufacturing apparatus |
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| Publication Number | Publication Date |
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| TW201536960A true TW201536960A (en) | 2015-10-01 |
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| JP (1) | JP2015193872A (en) |
| TW (1) | TW201536960A (en) |
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| WO2021117498A1 (en) * | 2019-12-12 | 2021-06-17 | 信越化学工業株式会社 | Tantalum carbonate-coated graphite member and method for producing same |
| CN112410719B (en) * | 2020-10-20 | 2023-01-20 | 安徽华飞机械铸锻有限公司 | Wear-resistant heat-resistant steel |
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| JP4398436B2 (en) * | 2006-02-20 | 2010-01-13 | トーカロ株式会社 | Ceramic spray coating coated member having excellent heat radiation characteristics, etc. and method for producing the same |
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2014
- 2014-03-31 JP JP2014071466A patent/JP2015193872A/en active Pending
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2015
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| WO2015151573A1 (en) | 2015-10-08 |
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