TW201523401A - Touch panel and manufacturing method - Google Patents
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Abstract
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本發明係有關於一種觸控結構及其製造方法，尤指一種可提升觸控面板光學性能與靈敏度之觸控結構及製造方法。 The present invention relates to a touch structure and a method of fabricating the same, and more particularly to a touch structure and a manufacturing method that can improve the optical performance and sensitivity of the touch panel.
按，目前坊間之觸控面板(Touch Panel)的觸控輸入方式，包括有電阻式、電容式、光學式、電磁感應式、音波感應式等；其中，電阻式及電容式是藉由使用者以手指或感應筆對面板表面進行觸碰，而於受觸碰位置的面板內部產生電容值的變化，據以偵測出面板表面所接受觸碰的位置，以達到觸控感測之目的。 According to the current touch panel input mode, including resistive, capacitive, optical, electromagnetic induction, sonic induction, etc.; Touching the surface of the panel with a finger or a sensor pen, and generating a change in the capacitance value inside the panel subjected to the touched position, thereby detecting the position of the touched surface of the panel to achieve the purpose of touch sensing.
且知，為了要偵測出使用者以手指或感應筆觸碰於觸控板上之位置，業者研發出各種不同之電容式觸碰感測結構。習知之電容式觸控面板的感應電極係由複數感測結構排列而成之感測陣列，其中各感測結構多以氧化銦錫(ITO)為材料設計為具有規則形狀(例如：鑽石圖形)之感測單元，由於感測結構大多由ITO所製成。當ITO阻抗較大時，將導致觸碰感測結構之信號傳遞靈敏度難以提升。 Moreover, in order to detect that the user touches the position on the touch panel with a finger or a sensor pen, the manufacturer has developed various capacitive touch sensing structures. A sensing electrode of a conventional capacitive touch panel is a sensing array in which a plurality of sensing structures are arranged, wherein each sensing structure is designed with indium tin oxide (ITO) as a regular shape (for example, a diamond pattern). The sensing unit is mostly made of ITO because the sensing structure. When the ITO impedance is large, the signal transmission sensitivity of the touch sensing structure is difficult to increase.
而另種習知之電容式觸控面板的感應電極係為複數金屬線構成之金屬網狀感測結構，相較於ITO該金屬材質之網狀感測結構的阻抗較低；惟，在這樣的設計中，容易因金屬線因製程上產生斷線的問題，而使感測結構的電性連接中斷，而導致斷路。且在雙層網狀感測結構在堆疊時，上層與下層之網狀感測結構相互重疊，造成重疊位置的圖案變得非常明顯，即會產生所謂 的“疊紋(Moire)”的視覺缺陷，以致影響使用者觀看的視覺品質。 The sensing electrode of the conventional capacitive touch panel is a metal mesh sensing structure composed of a plurality of metal wires, and the impedance of the mesh sensing structure of the metal material is lower than that of the ITO; In the design, it is easy to cause the electrical connection of the sensing structure to be interrupted due to the problem of wire breakage in the process, resulting in an open circuit. And when the double-layer mesh sensing structure is stacked, the mesh sensing structures of the upper layer and the lower layer overlap each other, so that the pattern of the overlapping position becomes very obvious, that is, the so-called The visual defect of the "Moire" affects the visual quality of the user's viewing.
為解決此課題，本發明提供一種可提升觸控面板光學性能與靈敏度的技術手段。 To solve this problem, the present invention provides a technical means for improving the optical performance and sensitivity of a touch panel.
為達成上述之目的，本發明之觸控結構包含：一第一可撓式透明基材、一上感測結構以及一下感測結構；其中，上感測結構位於第一可撓式透明基材，具有複數上透明感測圖案，以及分別與複數上透明感測圖案電性連接之複數上周邊線路，且每一上透明感測圖案係相鄰排列，該些上透明感測圖案表面並設有複數上金屬線柵，該些上透明感測圖案以及上金屬線柵係沿第一方向延伸；下感測結構位於第一可撓式透明基材，具有複數下透明感測圖案，以及分別與複數下透明感測圖案電性連接之複數下周邊線路，且每一下透明感測圖案係相鄰排列，該些下透明感測圖案表面並設有複數下金屬線柵，該些下透明感測圖案以及下金屬線柵係沿第二方向延伸，該第二方向係與該第一方向相互交錯。 To achieve the above objective, the touch structure of the present invention comprises: a first flexible transparent substrate, an upper sensing structure and a lower sensing structure; wherein the upper sensing structure is located on the first flexible transparent substrate a plurality of upper transparent sensing patterns, and a plurality of upper peripheral lines electrically connected to the plurality of transparent sensing patterns, and each of the upper transparent sensing patterns is adjacently arranged, and the upper transparent sensing patterns are erected a plurality of upper metal wire grids, the upper transparent sensing patterns and the upper metal wire grid extending in a first direction; the lower sensing structure is located on the first flexible transparent substrate, having a plurality of transparent sensing patterns, and respectively a plurality of lower peripheral lines electrically connected to the plurality of transparent sensing patterns, and each of the lower transparent sensing patterns is adjacently arranged, and the lower transparent sensing pattern surface is provided with a plurality of lower metal wire grids, and the lower transparent feeling The pattern and the lower wire grid extend in a second direction that is interdigitated with the first direction.
為達成上述之目的，本發明之觸控結構，其中下感測結構係位於一第二可撓式透明基材，第二可撓式透明基材黏貼於第一可撓式透明基材之下。 In order to achieve the above object, the touch structure of the present invention, wherein the lower sensing structure is located on a second flexible transparent substrate, and the second flexible transparent substrate is adhered to the first flexible transparent substrate. .
為達成上述之目的，本發明之觸控結構，其中第一可撓式透明基材黏貼於一硬質透明基板之下。 To achieve the above object, the touch structure of the present invention, wherein the first flexible transparent substrate is adhered to a hard transparent substrate.
為達成上述之目的，本發明之觸控結構，其中上感測結構係位於第一可撓式透明基材之上表面，下感測結構係位於第一可撓式透明基材之下表面，第一可撓式透明基材黏貼於一硬質透明基板之下。 In order to achieve the above object, the touch structure of the present invention, wherein the upper sensing structure is located on the upper surface of the first flexible transparent substrate, and the lower sensing structure is located on the lower surface of the first flexible transparent substrate. The first flexible transparent substrate is adhered to a hard transparent substrate.
為達成上述之目的，本發明之觸控結構之製造方 法，至少包含下列步驟：提供一第一可撓式透明基材和一第二可撓式透明基材；形成一透明導電層於該第一可撓式透明基材和該第二可撓式透明基材之上；形成一金屬層於該透明導電層之上；分別圖案化位於該第一可撓式透明基材和該第二可撓式透明基材之該透明導電層以及金屬層，於該第一可撓式透明基材形成具有金屬層於其上之複數上透明感測圖案，以及分別與該些上透明感測圖案電性連接之複數上周邊線路，該些上透明感測圖案係沿第一方向延伸，以及於該第二可撓式透明基材形成具有金屬層於其上之複數下透明感測圖案，以及分別與該些下透明感測圖案電性連接之複數下周邊線路，該些下透明感測圖案係沿第二方向延伸，該第二方向係與該第一方向相互交錯；分別圖案化位於該上透明感測圖案和該下透明感測圖案之該金屬層，於該上透明感測圖案表面形成複數上金屬線柵，該些上金屬線柵係沿第一方向延伸，於該下透明感測圖案表面形成複數下金屬線柵，該些下金屬線柵係沿第二方向延伸；黏貼該第一可撓式透明基材和該第二可撓式透明基材，使該些上透明感測圖案和該些下透明感測圖案交錯，形成觸控結構。 To achieve the above object, the manufacturer of the touch structure of the present invention The method comprises the steps of: providing a first flexible transparent substrate and a second flexible transparent substrate; forming a transparent conductive layer on the first flexible transparent substrate and the second flexible Forming a metal layer on the transparent conductive layer; respectively patterning the transparent conductive layer and the metal layer on the first flexible transparent substrate and the second flexible transparent substrate, Forming, on the first flexible transparent substrate, a plurality of upper transparent sensing patterns having a metal layer thereon, and a plurality of upper peripheral lines respectively electrically connected to the upper transparent sensing patterns, the upper transparent sensing The pattern extends along the first direction, and the second flexible transparent substrate forms a plurality of transparent sensing patterns having the metal layer thereon, and is electrically connected to the lower transparent sensing patterns respectively. The lower transparent sensing patterns extend along the second direction, the second direction is interlaced with the first direction; respectively patterning the metal in the upper transparent sensing pattern and the lower transparent sensing pattern Layer, transparent on it Forming a plurality of upper metal wire grids on the surface of the pattern, the upper metal wire grids extending along the first direction, forming a plurality of lower metal wire grids on the surface of the lower transparent sensing pattern, the lower metal wire grids extending in the second direction Adhering the first flexible transparent substrate and the second flexible transparent substrate to interlace the upper transparent sensing patterns and the lower transparent sensing patterns to form a touch structure.
為達成上述之目的，本發明觸控結構之製造方法，其中黏貼該第一可撓式透明基材和該第二可撓式透明基材之後更包括以一黏著層黏著一硬質透明基板於該第一可撓式透明基材之上。 In order to achieve the above object, the method for manufacturing the touch structure of the present invention, wherein after bonding the first flexible transparent substrate and the second flexible transparent substrate, further comprises adhering a hard transparent substrate with an adhesive layer. Above the first flexible transparent substrate.
為達成上述之目的，本發明另提供一種觸控結構之製造方法，至少包含下列步驟：提供一第一可撓式透明基材，具有一上表面和一下表面，該上表面和該下表面相對設置；形成一透明導電層於該上表面和該下表面；形成至少一金屬層於該透明導電層；圖案化位於該上表面和該下表面之該透明導電層以及金 屬層，分別於該第一可撓式透明基材之該上表面形成具有金屬層於其上之複數上透明感測圖案，以及分別與該些上透明感測圖案電性連接之複數上周邊線路，該些上透明感測圖案係沿第一方向延伸，以及於該第一可撓式透明基材之該下表面具有金屬層於其上之複數下透明感測圖案，以及分別與該些下透明感測圖案電性連接之複數下周邊線路，該些下透明感測圖案係沿第二方向延伸，該第二方向係與該第一方向相互交錯；分別圖案化位於該上透明感測圖案和該下透明感測圖案之該金屬層，於該上透明感測圖案表面形成複數上金屬線柵，該些上金屬線柵係沿第一方向延伸，於該下透明感測圖案表面形成複數下金屬線柵，該些下金屬線柵係沿第二方向延伸。 In order to achieve the above object, the present invention further provides a method for manufacturing a touch structure, comprising at least the following steps: providing a first flexible transparent substrate having an upper surface and a lower surface, the upper surface and the lower surface being opposite to each other Providing a transparent conductive layer on the upper surface and the lower surface; forming at least one metal layer on the transparent conductive layer; patterning the transparent conductive layer on the upper surface and the lower surface and gold a plurality of upper transparent sensing patterns having a metal layer thereon, and a plurality of upper peripheral portions electrically connected to the upper transparent sensing patterns respectively on the upper surface of the first flexible transparent substrate a plurality of upper transparent sensing patterns extending in a first direction, and a lower transparent sensing pattern on the lower surface of the first flexible transparent substrate having a metal layer thereon, and respectively The lower transparent sensing pattern is electrically connected to the plurality of lower peripheral lines, and the lower transparent sensing patterns extend along the second direction, the second direction is interlaced with the first direction; respectively, the pattern is located on the upper transparent sensing The pattern and the metal layer of the lower transparent sensing pattern form a plurality of upper metal wire grids on the surface of the upper transparent sensing pattern, the upper metal wire grids extending along the first direction to form a surface of the lower transparent sensing pattern The plurality of metal wire grids extend in the second direction.
為達成上述之目的，本發明之觸控結構之製造方法，其中於圖案化該透明導電層之後更包括以一黏著層黏著一硬質透明基板於該第一可撓式透明基材之上。 In order to achieve the above object, the method for manufacturing a touch structure of the present invention, after patterning the transparent conductive layer, further comprises adhering a rigid transparent substrate to the first flexible transparent substrate with an adhesive layer.
110,210,310,410‧‧‧第一可撓式透明基材 110,210,310,410‧‧‧First flexible transparent substrate
411‧‧‧上表面 411‧‧‧ upper surface
412‧‧‧下表面 412‧‧‧ lower surface
120,220‧‧‧上感測結構 120, 220‧‧‧ sensing structure
121,221,321,421‧‧‧複數上透明感測圖案 121,221,321,421‧‧‧plural transparent sensing pattern
122,222,322,422‧‧‧複數上周邊線路 122,222,322,422‧‧‧multiple peripheral lines
123,223,323,423‧‧‧複數上金屬線柵 123,223,323,423‧‧‧Multiple metal wire grids
130,230‧‧‧下感測結構 Sensing structure under 130,230‧‧
131,231,331,431‧‧‧複數下透明感測圖案 131,231,331,431‧‧‧Multiple transparent sensing patterns
132,232,332,432‧‧‧複數下周邊線路 132,232,332,432‧‧‧Multiple peripheral lines
133,233,333,433‧‧‧複數下金屬線柵 133,233,333,433‧‧‧multiple metal wire grid
140,340‧‧‧第二可撓式透明基材 140,340‧‧‧Second flexible transparent substrate
150,250,350,450‧‧‧黏著層 150,250,350,450‧‧‧Adhesive layer
160,360,460‧‧‧硬質透明基板 160,360,460‧‧‧hard transparent substrate
371,471‧‧‧透明導電層 371,471‧‧‧Transparent conductive layer
372,472‧‧‧金屬層 372,472‧‧‧ metal layer
第1a圖所示為本發明中觸控結構之第一實施例示意圖。 FIG. 1a is a schematic view showing a first embodiment of the touch structure of the present invention.
第1b圖所示為本發明中上感測結構之結構示意圖。 Figure 1b is a schematic view showing the structure of the upper sensing structure of the present invention.
第1c圖所示為本發明中下感測結構之結構示意圖。 Figure 1c is a schematic view showing the structure of the lower sensing structure of the present invention.
第2圖所示為本發明中觸控結構之第二實施例示意圖。 FIG. 2 is a schematic view showing a second embodiment of the touch structure of the present invention.
第3a圖至第3h圖所示為本發明中觸控結構之製造方法之第一實施例示意圖。 3a to 3h are schematic views showing a first embodiment of a method of manufacturing a touch structure according to the present invention.
第4a圖至第4e圖所示為本發明中觸控結構之製造方法之第二實施例示意圖。 4a to 4e are schematic views showing a second embodiment of the manufacturing method of the touch structure of the present invention.
請參閱第1a圖所示為本發明第一實施例之觸控結構 示意圖。首先，本發明之觸控結構包括一第一可撓式透明基材110、一上感測結構120以及一下感測結構130；其中第一可撓式透明基材110，可以捲曲成滾筒狀。其材質例如可為PEN、PET、PES、可繞式玻璃、PMMA、PC或PI之一。 Please refer to FIG. 1a for the touch structure of the first embodiment of the present invention. schematic diagram. First, the touch structure of the present invention comprises a first flexible transparent substrate 110, an upper sensing structure 120 and a lower sensing structure 130; wherein the first flexible transparent substrate 110 can be curled into a roll shape. The material may be, for example, one of PEN, PET, PES, wrapable glass, PMMA, PC or PI.
上感測結構120位於第一可撓式透明基材110，具有複數上透明感測圖案121，以及分別與複數上透明感測圖案121電性連接之複數上周邊線路122，複數上透明感測圖案121係沿第一方向延伸，請同時參閱第1b圖所示，且每一上透明感測圖案121係相鄰排列，如圖所示之實施例中，上透明感測圖案121可以為矩形圖案，且上透明感測圖案121之延伸方向係沿第一方向X延伸。當然，上透明感測圖案亦可以為其他幾何形狀。其中上透明感測圖案使用具有透光能力且導電能力之材質，例如可為金屬氧化物所構成，其中金屬氧化物例如可為氧化銦錫(indium tin oxide,ITO)、氧化銦鋅(indium zinc oxide,IZO)、氧化鎘錫(cadmium tin oxide,CTO)、氧化鋁鋅(aluminum zinc oxide,AZO)、氧化銦鋅錫(indium tin zinc oxide,ITZO)、氧化鋅(zinc oxide)、氧化鎘(cadmium oxide)、氧化鉿(hafnium oxide,HfO)、氧化銦鎵鋅(indium gallium zinc oxide,InGaZnO)、氧化銦鎵鋅鎂(indium gallium zinc magnesium oxide,InGaZnMgO)、氧化銦鎵鎂(indium gallium magnesium oxide,InGaMgO)或氧化銦鎵鋁(indium gallium aluminum oxide,InGaAlO)等。上透明感測圖案121表面並設有複數上金屬線柵123，且複數上金屬線柵123係沿第一方向(亦即X方向)延伸。上金屬線柵123係為金屬材質，銅合金、鋁合金、金、銀、鋁、銅、鉬等導電金屬或導電合金。多層導電金屬層之結構，例如可為鉬層/鋁層/鉬層之堆疊結構，或者可為選自銅合金、鋁合金、金、銀、鋁、銅、鉬等導電金屬或導電合金之一種或多種材 質而堆疊之多層導電金屬層結構。 The upper sensing structure 120 is located on the first flexible transparent substrate 110, and has a plurality of upper transparent sensing patterns 121, and a plurality of upper peripheral lines 122 electrically connected to the plurality of transparent sensing patterns 121, respectively. The pattern 121 extends along the first direction. Please refer to FIG. 1b at the same time, and each upper transparent sensing pattern 121 is adjacently arranged. In the embodiment shown in the figure, the upper transparent sensing pattern 121 may be rectangular. The pattern, and the extending direction of the upper transparent sensing pattern 121 extends in the first direction X. Of course, the upper transparent sensing pattern can also be other geometric shapes. The upper transparent sensing pattern is made of a material having light transmissivity and conductivity, for example, may be a metal oxide, wherein the metal oxide may be, for example, indium tin oxide (ITO) or indium zinc. Oxide, IZO), cadmium tin oxide (CTO), aluminum zinc oxide (AZO), indium tin zinc oxide (ITZO), zinc oxide, cadmium oxide Cadmium oxide), hafnium oxide (HfO), indium gallium zinc oxide (InGaZnO), indium gallium zinc magnesium oxide (InGaZnMgO), indium gallium magnesium oxide , InGaMgO) or indium gallium aluminum oxide (InGaAlO) or the like. The upper surface of the transparent sensing pattern 121 is provided with a plurality of upper metal wire grids 123, and the plurality of upper metal wire grids 123 extend in the first direction (ie, the X direction). The upper metal wire grid 123 is made of a metal material, a conductive metal such as a copper alloy, an aluminum alloy, gold, silver, aluminum, copper or molybdenum or a conductive alloy. The structure of the multi-layer conductive metal layer may be, for example, a stacked structure of a molybdenum layer/aluminum layer/molybdenum layer, or may be a conductive metal or a conductive alloy selected from the group consisting of copper alloy, aluminum alloy, gold, silver, aluminum, copper, molybdenum, and the like. Or a variety of materials A multi-layer conductive metal layer structure that is stacked in a mass.
下感測結構130係位於第一可撓式透明基材110，下感測結構130具有複數下透明感測圖案131，以及分別與複數下透明感測圖案131電性連接之複數下周邊線路132，下透明感測圖案131係沿第二方向延伸，請同時參閱第1c圖所示，該第二方向係與該第一方向相互交錯，且每一下透明感測圖案131係相鄰排列，下透明感測圖案131可以為矩形圖案，且下透明感測圖案131之延伸方向係沿第二方向Y延伸。當然，下透明感測圖案亦可以為其他幾何形狀。其中下透明感測圖案使用具有透光能力且導電能力之材質，例如可為金屬氧化物所構成，其中金屬氧化物例如可為氧化銦錫(indium tin oxide,ITO)、氧化銦鋅(indium zinc oxide,IZO)、氧化鎘錫(cadmium tin oxide,CTO)、氧化鋁鋅(aluminum zinc oxide,AZO)、氧化銦鋅錫(indium tin zinc oxide,ITZO)、氧化鋅(zinc oxide)、氧化鎘(cadmium oxide)、氧化鉿(hafnium oxide,HfO)、氧化銦鎵鋅(indium gallium zinc oxide,InGaZnO)、氧化銦鎵鋅鎂(indium gallium zinc magnesium oxide,InGaZnMgO)、氧化銦鎵鎂(indium gallium magnesium oxide,InGaMgO)或氧化銦鎵鋁(indium gallium aluminum oxide,InGaAlO)等。下透明感測圖案131表面並設有複數下金屬線柵133，如第1c圖所示，且複數下金屬線柵133係沿第二方向(亦即Y方向)延伸。下金屬線柵133係為金屬材質，銅合金、鋁合金、金、銀、鋁、銅、鉬等導電金屬或導電合金。多層導電金屬層之結構，例如可為鉬層/鋁層/鉬層之堆疊結構，或者可為選自銅合金、鋁合金、金、銀、鋁、銅、鉬等導電金屬或導電合金之一種或多種材質而堆疊之多層導電金屬層結構。 The lower sensing structure 130 is located on the first flexible transparent substrate 110, and the lower sensing structure 130 has a plurality of transparent sensing patterns 131, and a plurality of lower peripheral lines 132 electrically connected to the plurality of transparent sensing patterns 131, respectively. The lower transparent sensing pattern 131 extends along the second direction. Please refer to FIG. 1c at the same time, the second direction is interlaced with the first direction, and each lower transparent sensing pattern 131 is adjacently arranged. The transparent sensing pattern 131 may be a rectangular pattern, and the extending direction of the lower transparent sensing pattern 131 extends in the second direction Y. Of course, the lower transparent sensing pattern can also be other geometric shapes. The lower transparent sensing pattern is made of a material having light transmissive ability and electrical conductivity, for example, may be a metal oxide, wherein the metal oxide may be, for example, indium tin oxide (ITO) or indium zinc. Oxide, IZO), cadmium tin oxide (CTO), aluminum zinc oxide (AZO), indium tin zinc oxide (ITZO), zinc oxide, cadmium oxide Cadmium oxide), hafnium oxide (HfO), indium gallium zinc oxide (InGaZnO), indium gallium zinc magnesium oxide (InGaZnMgO), indium gallium magnesium oxide , InGaMgO) or indium gallium aluminum oxide (InGaAlO) or the like. The surface of the lower transparent sensing pattern 131 is provided with a plurality of lower metal wire grids 133 as shown in FIG. 1c, and the plurality of metal wire grids 133 extend in the second direction (ie, the Y direction). The lower metal wire grid 133 is made of a metal material, a conductive metal such as a copper alloy, an aluminum alloy, gold, silver, aluminum, copper, or molybdenum or a conductive alloy. The structure of the multi-layer conductive metal layer may be, for example, a stacked structure of a molybdenum layer/aluminum layer/molybdenum layer, or may be a conductive metal or a conductive alloy selected from the group consisting of copper alloy, aluminum alloy, gold, silver, aluminum, copper, molybdenum, and the like. A multi-layer conductive metal layer structure stacked with a plurality of materials.
且如第1a圖所示之實施例中，下感測結構130係位於一第二可撓式透明基材140，而第二可撓式透明基材140可藉由 黏著層150黏貼於第一可撓式透明基材110之下；再將第一可撓式透明基材110貼合於硬質透明基板160(例如可以為強化玻璃)。 And in the embodiment shown in FIG. 1a, the lower sensing structure 130 is located on a second flexible transparent substrate 140, and the second flexible transparent substrate 140 is The adhesive layer 150 is adhered to the first flexible transparent substrate 110; the first flexible transparent substrate 110 is attached to the rigid transparent substrate 160 (for example, may be tempered glass).
其中，複數上金屬線柵與其下方之上透明感測圖案電性連接，以及下金屬線柵與其下方之下透明感測圖案電性連接，分別提升上、下感測結構之導電度。由於各上金屬線柵或下金屬線柵均勻分布並分別接觸其下方之上、下透明感測圖案，將可均勻降低感測結構之阻值，縱使上金屬線柵或下金屬線柵產生斷線的問題，仍可分別利用其下方之上、下透明感測圖案形成電性連接，而不會發生電性連接中斷以及斷路之問題，可大為提升觸控面板之生產良率；且上、下感測結構相互疊層時，上金屬線柵以及下金屬線柵重疊面積較小，而可大幅降低疊紋(moire)視覺缺陷。 Wherein, the plurality of metal wire grids are electrically connected to the transparent sensing patterns on the lower side thereof, and the lower metal wire grids are electrically connected to the lower transparent sensing patterns to enhance the conductivity of the upper and lower sensing structures, respectively. Since the upper metal wire grid or the lower metal wire grid are uniformly distributed and respectively contact the upper and lower transparent sensing patterns below, the resistance value of the sensing structure can be uniformly reduced, even if the upper metal wire grid or the lower metal wire grid is broken. The problem of the line can still be electrically connected by using the upper and lower transparent sensing patterns underneath, without the problem of interruption of electrical connection and disconnection, which can greatly improve the production yield of the touch panel; When the lower sensing structures are stacked on each other, the overlapping area of the upper metal wire grid and the lower metal wire grid is small, and the moire visual defects can be greatly reduced.
請參閱第2圖所示為本發明之第二實施例之觸控結構示意圖。本發明之觸控結構同樣包括第一可撓式透明基材210、一上感測結構220以及一下感測結構230；其中，上感測結構220係位於第一可撓式透明基材210之上表面，具有複數上透明感測圖案221，以及分別與複數上透明感測圖案221電性連接之複數上周邊線路222，上透明感測圖案221表面並設有複數上金屬線柵223，而下感測結構230係位於第一可撓式透明基材210之下表面，其具有複數下透明感測圖案231，以及分別與複數下透明感測圖案231電性連接之複數下周邊線路232，下透明感測圖案231表面並設有複數下金屬線柵233，而第一可撓式透明基材210由一黏著層250黏貼於一硬質透明基板260之下。 Please refer to FIG. 2 , which is a schematic diagram of a touch structure according to a second embodiment of the present invention. The touch structure of the present invention also includes a first flexible transparent substrate 210, an upper sensing structure 220, and a lower sensing structure 230. The upper sensing structure 220 is located on the first flexible transparent substrate 210. The upper surface has a plurality of upper transparent sensing patterns 221, and a plurality of upper peripheral lines 222 electrically connected to the plurality of transparent sensing patterns 221, and a surface of the upper transparent sensing patterns 221 is provided with a plurality of upper metal wire grids 223, and The lower sensing structure 230 is located on the lower surface of the first flexible transparent substrate 210, and has a plurality of transparent sensing patterns 231, and a plurality of lower peripheral lines 232 electrically connected to the plurality of transparent sensing patterns 231, respectively. The surface of the transparent sensing pattern 231 is provided with a plurality of metal wire grids 233, and the first flexible transparent substrate 210 is adhered to a hard transparent substrate 260 by an adhesive layer 250.
請參閱第3a至3h圖所示為本發明之第一實施例之觸控結構之製造方法示意圖。首先，請參閱第3a圖及第3b圖，提供一第一可撓式透明基材310和第二可撓式透明基材340。第一 可撓式透明基材310和第二可撓式透明基材340為可撓曲之材質所構成，可以捲曲成滾筒狀。第一可撓式透明基材310和第二可撓式透明基材340之材質例如可為PEN、PET、PES、可撓式玻璃、PMMA、PC或PI之一，也可為上述材質之多層複合材料，而前述材質之上亦可形成有多層之透明堆疊結構之基材，多層之透明堆疊結構例如可為抗反射層。 Please refer to FIGS. 3a to 3h for a schematic view showing a manufacturing method of the touch structure according to the first embodiment of the present invention. First, referring to Figures 3a and 3b, a first flexible transparent substrate 310 and a second flexible transparent substrate 340 are provided. the first The flexible transparent substrate 310 and the second flexible transparent substrate 340 are made of a flexible material and can be crimped into a roll shape. The material of the first flexible transparent substrate 310 and the second flexible transparent substrate 340 may be, for example, one of PEN, PET, PES, flexible glass, PMMA, PC or PI, or may be multiple layers of the above materials. The composite material, and the above material may also be formed with a plurality of transparent stacked structure substrates, and the multilayer transparent stack structure may be, for example, an anti-reflection layer.
並於第一可撓式透明基材310以及第二可撓式透明基材340之表面依序形成透明導電層371和金屬層372，以形成多層之透明堆疊結構。其中形成透明堆疊結構的方式例如可採用捲對捲物理氣相沉積(PVD)、捲對捲化學氣相沉積(CVD)、捲對捲電鍍、捲對捲塗佈製程等手段。而透明導電層371可為金屬氧化物所構成，其中金屬氧化物例如可為氧化銦錫(indium tin oxide,ITO)、氧化銦鋅(indium zinc oxide,IZO)、氧化鎘錫(cadmium tin oxide,CTO)、氧化鋁鋅(aluminum zinc oxide,AZO)、氧化銦鋅錫(indium tin zinc oxide,ITZO)、氧化鋅(zinc oxide)、氧化鎘(cadmium oxide)、氧化鉿(hafnium oxide,HfO)、氧化銦鎵鋅(indium gallium zinc oxide,InGaZnO)、氧化銦鎵鋅鎂(indium gallium zinc magnesium oxide,InGaZnMgO)、氧化銦鎵鎂(indium gallium magnesium oxide,InGaMgO)或氧化銦鎵鋁(indium gallium aluminum oxide,InGaAlO)等；金屬層372可為至少一層導電金屬層，或者多層導電金屬層。其材質可為銅合金、鋁合金、金、銀、鋁、銅、鉬等導電金屬或導電合金。多層導電金屬層之結構，例如可為鉬層/鋁層/鉬層之堆疊結構，或者可為選自銅合金、鋁合金、金、銀、鋁、銅、鉬等導電金屬或導電合金之一種或多種材質而堆疊之多層導電金屬層結構。 A transparent conductive layer 371 and a metal layer 372 are sequentially formed on the surfaces of the first flexible transparent substrate 310 and the second flexible transparent substrate 340 to form a multilayer transparent stack structure. The manner in which the transparent stacked structure is formed may be, for example, a roll-to-roll physical vapor deposition (PVD), a roll-to-roll chemical vapor deposition (CVD), a roll-to-roll plating, a roll-to-roll coating process, or the like. The transparent conductive layer 371 can be composed of a metal oxide. The metal oxide can be, for example, indium tin oxide (ITO), indium zinc oxide (IZO), or cadmium tin oxide. CTO), aluminum zinc oxide (AZO), indium tin zinc oxide (ITZO), zinc oxide, cadmium oxide, hafnium oxide (HfO), Indium gallium zinc oxide (InGaZnO), indium gallium zinc magnesium oxide (InGaZnMgO), indium gallium magnesium oxide (InGaMgO) or indium gallium aluminum oxide , InGaAlO), etc.; the metal layer 372 can be at least one layer of a conductive metal, or a plurality of layers of a conductive metal. The material may be a conductive metal or a conductive alloy such as a copper alloy, an aluminum alloy, gold, silver, aluminum, copper or molybdenum. The structure of the multi-layer conductive metal layer may be, for example, a stacked structure of a molybdenum layer/aluminum layer/molybdenum layer, or may be a conductive metal or a conductive alloy selected from the group consisting of copper alloy, aluminum alloy, gold, silver, aluminum, copper, molybdenum, and the like. A multi-layer conductive metal layer structure stacked with a plurality of materials.
圖案化透明導電層和金屬層，圖案化製程可採用捲 對捲黃光製程或捲對捲雷射製程，較佳為採用捲對捲黃光製程，將上述多層之透明堆疊結構進行第一道黃光製程，請參閱第3c圖以及第3d圖，將透明導電層371和金屬層372圖案化。其中第一道黃光製程包括形成圖案化光阻層(圖未示)於透明導電層371和金屬層372之上，光阻層之材質可為液態光阻或乾膜光阻。然後進行蝕刻步驟，蝕刻去除未受光阻層保護之透明導電層371和金屬層372，以及去除圖案化光阻層，於第一可撓式透明基材310形成具有金屬層372於其上之複數上透明感測圖案321，以及分別與複數上透明感測圖案321電性連接之複數上周邊線路322，上透明感測圖案321係沿第一方向延伸，以及於第二可撓式透明基材340形成具有金屬層372於其上之複數下透明感測圖案331，以及分別與複數下透明感測圖案331電性連接之複數下周邊線路332，下透明感測圖案331係沿第二方向延伸，第二方向係與該第一方向相互交錯。 Patterning a transparent conductive layer and a metal layer, and the patterning process can adopt a roll For the roll-to-roll process or the roll-to-roll laser process, it is preferred to use a roll-to-roll yellow process to perform the first yellow light process of the above-mentioned multilayer transparent stack structure, see Figure 3c and Figure 3d, The transparent conductive layer 371 and the metal layer 372 are patterned. The first yellow light process includes forming a patterned photoresist layer (not shown) over the transparent conductive layer 371 and the metal layer 372. The material of the photoresist layer may be a liquid photoresist or a dry film photoresist. Then, an etching step is performed to remove the transparent conductive layer 371 and the metal layer 372 which are not protected by the photoresist layer, and the patterned photoresist layer is removed, and the first flexible transparent substrate 310 is formed on the first flexible transparent substrate 310 with the metal layer 372 thereon. The upper transparent sensing pattern 321 and the plurality of upper peripheral lines 322 electrically connected to the plurality of transparent sensing patterns 321 respectively, the upper transparent sensing patterns 321 extending along the first direction, and the second flexible transparent substrate 340 is formed with a plurality of lower transparent sensing patterns 331 having a metal layer 372 thereon, and a plurality of lower peripheral lines 332 electrically connected to the plurality of transparent sensing patterns 331 respectively. The lower transparent sensing patterns 331 extend in the second direction. The second direction is interlaced with the first direction.
接著請參閱第3e圖以及第3f圖。進行圖案化之第2道黃光製程，分別圖案化位於上透明感測圖案321和下透明感測圖案331之金屬層，移除部分金屬層，於上透明感測圖案321表面形成複數上金屬線柵323，上金屬線柵323係沿第一方向延伸，於下透明感測圖案321表面形成複數下金屬線柵333，下金屬線柵333係沿第二方向延伸。 Please refer to Figure 3e and Figure 3f. Performing a patterned second yellow light process, respectively patterning the metal layers of the upper transparent sensing pattern 321 and the lower transparent sensing pattern 331 to remove a portion of the metal layer, forming a plurality of upper metals on the surface of the upper transparent sensing pattern 321 The wire grid 323 and the upper metal wire grid 323 extend in the first direction, and a plurality of lower metal wire grids 333 are formed on the surface of the lower transparent sensing pattern 321 , and the lower metal wire grid 333 extends in the second direction.
如第3g圖以及第3h圖所示，再疊合並黏貼第一可撓式透明基材310和第二可撓式透明基材340而完成觸控結構，使複數上透明感測圖案321和複數下透明感測圖案331相互交錯。每一上透明感測圖案321與其上之上金屬線柵323沿第一方向X延伸，每一下透明感測圖案331與其上之下金屬線柵333沿第二方向Y延伸。其中上述疊層黏貼方式可為以不具有複數上透明感測圖 案321之面之第一可撓式透明基材310黏貼於具有複數下透明感測圖案331之面之第二可撓式透明基材340上、以具有複數上透明感測圖案321之面之第一可撓式透明基材310黏貼於具有複數下透明感測圖案331之面之第二可撓式透明基材340、和以不具有複數上透明感測圖案321之面之第一可撓式透明基材310黏貼於不具有複數下透明感測圖案331之面之第二可撓式透明基材340。若是以具有複數上透明感測圖案321之面之第一可撓式透明基材310黏貼於具有複數下透明感測圖案331之面之第二可撓式透明基材340時，需要以較厚之黏著層350黏貼用以電性絕緣複數上透明感測圖案321和複數下透明感測圖案331。然後如第3h圖所示，將上述之觸控結構以黏著層350黏貼於硬質透明基板360。其中硬質透明基板360之材質可為玻璃、強化玻璃或硬質塑膠，提供保護作用。其中上述之黏著層350之材質可為壓克力膠、UV膠、水膠或光學膠。 As shown in FIG. 3g and FIG. 3h, the first flexible transparent substrate 310 and the second flexible transparent substrate 340 are pasted and pasted to complete the touch structure, so that the plurality of transparent sensing patterns 321 and plural The lower transparent sensing patterns 331 are interlaced with each other. Each of the upper transparent sensing patterns 321 and the upper metal wire grid 323 thereof extend in the first direction X, and each of the lower transparent sensing patterns 331 and the upper and lower metal wire grids 333 extend in the second direction Y. Wherein the above-mentioned lamination bonding method can be such that there is no complex transparent sensing pattern The first flexible transparent substrate 310 on the surface of the case 321 is adhered to the second flexible transparent substrate 340 having the surface of the plurality of transparent sensing patterns 331 to have a plurality of transparent sensing patterns 321 The first flexible transparent substrate 310 is adhered to the second flexible transparent substrate 340 having the surface of the plurality of transparent sensing patterns 331 and the first flexible surface having no surface of the plurality of transparent sensing patterns 321 The transparent substrate 310 is adhered to the second flexible transparent substrate 340 having no surface of the plurality of transparent sensing patterns 331. If the first flexible transparent substrate 310 having the surface of the plurality of transparent sensing patterns 321 is adhered to the second flexible transparent substrate 340 having the surface of the plurality of transparent sensing patterns 331, it is required to be thicker. The adhesive layer 350 is adhered to electrically insulate the plurality of transparent sensing patterns 321 and the plurality of transparent sensing patterns 331. Then, as shown in FIG. 3h, the touch structure described above is adhered to the hard transparent substrate 360 by the adhesive layer 350. The material of the rigid transparent substrate 360 can be glass, tempered glass or hard plastic to provide protection. The material of the adhesive layer 350 may be acrylic glue, UV glue, water glue or optical glue.
請參閱第4a至4h圖所示為本發明之第二實施例之觸控結構之製造方法示意圖。首先，請參閱第4a圖，提供一第一可撓式透明基材410，具有上表面411和下表面412，上表面411和下表面412相對設置。第一可撓式透明基材410為可撓曲之材質所構成，可以捲曲成滾筒狀。第一可撓式透明基材410之材質例如可為PEN、PET、PES、可撓式玻璃、PMMA、PC或PI之一，也可為上述材質之多層複合材料，而前述材質之上亦可形成有多層之透明堆疊結構之基材，多層之透明堆疊結構例如可為抗反射層。 Please refer to FIGS. 4a to 4h for a schematic view showing a manufacturing method of a touch structure according to a second embodiment of the present invention. First, referring to Fig. 4a, a first flexible transparent substrate 410 is provided having an upper surface 411 and a lower surface 412, the upper surface 411 and the lower surface 412 being disposed opposite each other. The first flexible transparent substrate 410 is made of a flexible material and can be curled into a roll shape. The material of the first flexible transparent substrate 410 may be, for example, one of PEN, PET, PES, flexible glass, PMMA, PC or PI, or may be a multilayer composite material of the above materials, and the above materials may also be used. A substrate having a plurality of transparent stack structures, such as an anti-reflective layer, may be formed.
請參閱第4b圖，形成透明導電層471於第一可撓式透明基材410之上表面411和下表面412。其中形成透明堆疊結構的方式例如可採用捲對捲物理氣相沉積(PVD)、捲對捲化學氣相沉積(CVD)、捲對捲電鍍、捲對捲塗佈製程等手段。而透明導電層471可為金屬氧化物所構成，其中金屬氧化物例如可為氧化銦錫 (indium tin oxide,ITO)、氧化銦鋅(indium zinc oxide,IZO)、氧化鎘錫(cadmium tin oxide,CTO)、氧化鋁鋅(aluminum zinc oxide,AZO)、氧化銦鋅錫(indium tin zinc oxide,ITZO)、氧化鋅(zinc oxide)、氧化鎘(cadmium oxide)、氧化鉿(hafnium oxide,HfO)、氧化銦鎵鋅(indium gallium zinc oxide,InGaZnO)、氧化銦鎵鋅鎂(indium gallium zinc magnesium oxide,InGaZnMgO)、氧化銦鎵鎂(indium gallium magnesium oxide,InGaMgO)或氧化銦鎵鋁(indium gallium aluminum oxide,InGaAlO)等。再形成至少一金屬層472於位於上表面411和下表面412之透明導電層471之上。金屬層472可為至少一層導電金屬層，或者多層導電金屬層。其材質可為銅合金、鋁合金、金、銀、鋁、銅、鉬等導電金屬或導電合金。多層導電金屬層之結構，例如可為鉬層/鋁層/鉬層之堆疊結構，或者可為選自銅合金、鋁合金、金、銀、鋁、銅、鉬等導電金屬或導電合金之一種或多種材質而堆疊之多層導電金屬層結構。 Referring to FIG. 4b, a transparent conductive layer 471 is formed on the upper surface 411 and the lower surface 412 of the first flexible transparent substrate 410. The manner in which the transparent stacked structure is formed may be, for example, a roll-to-roll physical vapor deposition (PVD), a roll-to-roll chemical vapor deposition (CVD), a roll-to-roll plating, a roll-to-roll coating process, or the like. The transparent conductive layer 471 can be composed of a metal oxide, wherein the metal oxide can be, for example, indium tin oxide. (indium tin oxide, ITO), indium zinc oxide (IZO), cadmium tin oxide (CTO), aluminum zinc oxide (AZO), indium tin zinc oxide , ITZO), zinc oxide, cadmium oxide, hafnium oxide (HfO), indium gallium zinc oxide (InGaZnO), indium gallium zinc magnesium (indium gallium zinc magnesium) Oxide, InGaZnMgO), indium gallium magnesium oxide (InGaMgO) or indium gallium aluminum oxide (InGaAlO). Further, at least one metal layer 472 is formed over the transparent conductive layer 471 on the upper surface 411 and the lower surface 412. Metal layer 472 can be at least one layer of conductive metal, or a plurality of layers of conductive metal. The material may be a conductive metal or a conductive alloy such as a copper alloy, an aluminum alloy, gold, silver, aluminum, copper or molybdenum. The structure of the multi-layer conductive metal layer may be, for example, a stacked structure of a molybdenum layer/aluminum layer/molybdenum layer, or may be a conductive metal or a conductive alloy selected from the group consisting of copper alloy, aluminum alloy, gold, silver, aluminum, copper, molybdenum, and the like. A multi-layer conductive metal layer structure stacked with a plurality of materials.
圖案化透明導電層和金屬層，圖案化製程可採用捲對捲黃光製程或捲對捲雷射製程，較佳為採用捲對捲黃光製程，將上述多層之透明堆疊結構進行第一道黃光製程，請參閱第4c圖，將位於上表面411和下表面412之透明導電層471以及金屬層472圖案化。其中第一道黃光製程包括形成圖案化光阻層(圖未示)於透明導電層471以及金屬層472之上，光阻層之材質可為液態光阻或乾膜光阻。然後進行蝕刻步驟，蝕刻去除未受光阻層保護之透明導電層471以及金屬層472，以及去除圖案化光阻層，而於第一可撓式透明基材410之上表面411形成具有金屬層472於其上之複數上透明感測圖案421，以及分別與上透明感測圖案421電性連接之複數上周邊線路422，複數上透明感測圖案421係沿第一方向延伸。以及於第一可撓式透明基材410之下表面412形成具有金屬 層472於其上之複數下透明感測圖案431，以及分別與下透明感測圖案431電性連接之複數下周邊線路432，複數下透明感測圖案431係沿第二方向延伸，第二方向係與第一方向相互交錯。 The transparent conductive layer and the metal layer are patterned, and the patterning process may adopt a roll-to-roll yellow process or a roll-to-roll laser process, preferably a roll-to-roll yellow process, and the first layer of the transparent stack structure is firstly processed. For the yellow light process, please refer to FIG. 4c to pattern the transparent conductive layer 471 and the metal layer 472 on the upper surface 411 and the lower surface 412. The first yellow light process includes forming a patterned photoresist layer (not shown) over the transparent conductive layer 471 and the metal layer 472. The material of the photoresist layer may be a liquid photoresist or a dry film photoresist. Then, an etching step is performed to remove the transparent conductive layer 471 and the metal layer 472 which are not protected by the photoresist layer, and the patterned photoresist layer is removed, and the metal layer 472 is formed on the upper surface 411 of the first flexible transparent substrate 410. The plurality of transparent sensing patterns 421 and the plurality of upper peripheral lines 422 electrically connected to the upper transparent sensing patterns 421 respectively extend the plurality of transparent sensing patterns 421 in the first direction. And forming a metal on the lower surface 412 of the first flexible transparent substrate 410 The transparent sensing pattern 431 on the plurality of layers 472 and the plurality of lower peripheral lines 432 electrically connected to the lower transparent sensing patterns 431 respectively, the plurality of transparent sensing patterns 431 extending in the second direction, the second direction The system is interlaced with the first direction.
複數上金屬線柵423以及複數下金屬線柵433，複數上金屬線柵423係沿第一方向延伸，而複數下金屬線柵433則沿第二方向延伸，第二方向係與第一方向相互交錯。 a plurality of upper metal wire grids 423 and a plurality of lower metal wire grids 433, the plurality of upper metal wire grids 423 extending in a first direction, and the plurality of lower metal wire grids 433 extending in a second direction, the second direction being in a first direction staggered.
接著請參閱第4d圖。進行圖案化之第2道黃光製程，將上透明感測圖案421和下透明感測圖案431之金屬層圖案化，移除部分金屬層，而完成觸控結構；其中，於上透明感測圖案421表面形成複數上金屬線柵423，上金屬線柵423係沿第一方向延伸，於下透明感測圖案431表面形成複數下金屬線柵433，下金屬線柵433係沿第二方向延伸。然後可如第4e圖所示，將上述之觸控結構以黏著層450黏貼於硬質透明基板460。其中硬質透明基板460之材質可為玻璃、強化玻璃或硬質塑膠，提供保護作用。其中上述之黏著層450之材質可為壓克力膠、UV膠、水膠或光學膠。 Please refer to Figure 4d. Performing a patterning second yellow light process, patterning the metal layers of the upper transparent sensing pattern 421 and the lower transparent sensing pattern 431, removing part of the metal layer, and completing the touch structure; wherein, the transparent sensing is performed A plurality of upper metal wire grids 423 are formed on the surface of the pattern 421. The upper metal wire grids 423 extend in the first direction, and a plurality of lower metal wire grids 433 are formed on the surface of the lower transparent sensing patterns 431, and the lower metal wire grids 433 extend in the second direction. . Then, as shown in FIG. 4e, the touch structure described above is adhered to the hard transparent substrate 460 by the adhesive layer 450. The material of the rigid transparent substrate 460 can be glass, tempered glass or hard plastic to provide protection. The material of the adhesive layer 450 may be acrylic glue, UV glue, water glue or optical glue.
雖然本發明已以實施例揭露如上，然其並非用以限定本發明。任何熟習此技藝者，在不脫離本發明之精神和範圍內，當可作些許之更動與潤飾，因此本發明之保護範圍當視申請專利範圍所界定者為準。 Although the present invention has been disclosed above by way of example, it is not intended to limit the invention. The scope of the present invention is defined by the scope of the claims, and the scope of the invention is intended to be limited by the scope of the invention.
110‧‧‧第一可撓式透明基材 110‧‧‧First flexible transparent substrate
120‧‧‧上感測結構 120‧‧‧Upper sensing structure
121‧‧‧複數上透明感測圖案 121‧‧‧Multiple transparent sensing patterns
122‧‧‧複數上周邊線路 122‧‧‧Multiple peripheral lines
123‧‧‧複數上金屬線柵 123‧‧‧Multiple metal wire grids
130‧‧‧下感測結構 130‧‧‧Sensor structure
131‧‧‧複數下透明感測圖案 131‧‧‧Multiple transparent sensing patterns
132‧‧‧複數下周邊線路 132‧‧‧Multiple peripheral lines
133‧‧‧複數下金屬線柵 133‧‧‧Multiple metal wire grids
140‧‧‧第二可撓式透明基材 140‧‧‧Second flexible transparent substrate
150‧‧‧黏著層 150‧‧‧Adhesive layer
160‧‧‧硬質透明基板 160‧‧‧hard transparent substrate
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