TWI396122B

TWI396122B - Manufacturing method of touch panel

Info

Publication number: TWI396122B
Application number: TW99118189A
Authority: TW
Inventors: Wei Chuan Chen
Original assignee: Wei Chuan Chen
Priority date: 2010-06-04
Filing date: 2010-06-04
Publication date: 2013-05-11
Also published as: TW201145103A

Description

觸控面板製造方法 Touch panel manufacturing method

本發明為一種觸控面板之製造方法，可以提升電容式觸控面板製程良率，以及減少投射電容式觸控面板之製造程序和減少貼合步驟。 The invention provides a method for manufacturing a touch panel, which can improve the process yield of the capacitive touch panel, reduce the manufacturing process of the projected capacitive touch panel and reduce the bonding step.

目前電容式觸控面板已經廣泛使用於各種電子產品之上，使用上僅需以手指輕壓觸控面板即可閱讀資訊或輸入資訊，可取代傳統電子裝置上的按鍵和鍵盤，為人類帶來便利性生活。然而目前電容觸控技術可分為兩種，一種為表面電容式觸控技術(Surface Capacitive)，另一種為投射電容式觸控技術(Projected Capacitive)。 At present, capacitive touch panels have been widely used in various electronic products. They can read information or input information by simply pressing the touch panel with a finger, and can replace the buttons and keyboards on the conventional electronic devices to bring humans. Convenient life. However, the current capacitive touch technology can be divided into two types, one is a surface capacitive touch technology (Surface Capacitive), and the other is a projected capacitive touch technology (Projected Capacitive).

電容式觸控技術是透過手指接觸觸控螢幕造成靜電場改變進行偵測，其中單點觸控電容式技術，就是表面電容式觸控技術。表面電容式技術架構較為單純，只需一面ITO層即可實現，而且此ITO層不需特殊感測通道設計，生產難度及成本都可降低。運作架構上，系統會在ITO層產生一個均勻電場，當手指接觸面板會出現電容充電效應，面板上的透明電極與手指間形成電容耦合，進而產生電容變化，控制器只要量測4個角落電流強度，就可依電流大小計算接觸位置。表面電容式技術雖然生產容易，但需進行校準工作，也得克服難解的EMI及噪訊問題。最大的限制則是，它無法實現多點觸控功能，因電極尺寸過大，並不適合小尺寸手持設備設計。 The capacitive touch technology detects the electrostatic field change through the touch of the touch screen. The single touch capacitive technology is the surface capacitive touch technology. The surface capacitive technology architecture is relatively simple, and can be realized only by one ITO layer, and the ITO layer does not need a special sensing channel design, and the production difficulty and cost can be reduced. In the operation architecture, the system generates a uniform electric field in the ITO layer. When the finger touches the panel, a capacitive charging effect occurs. The transparent electrode on the panel forms a capacitive coupling with the finger, which causes a change in capacitance. The controller only measures four corner currents. Intensity, the contact position can be calculated according to the current. Surface capacitive technology, although easy to produce, requires calibration and overcomes EMI and noise problems. The biggest limitation is that it can't implement multi-touch function. Because the electrode size is too large, it is not suitable for small-sized handheld devices.

投射式電容觸控面板為透過兩層相互垂直的ITO陣列，以建立均勻電場。使得人體在接觸時除了表面會形成電容之外，也會造成XY軸交會處之間電容值的變化。具有耐用性高、漂移現象較表面式電容小等優點，並且投射電容式支援多點觸控技術將成為未來主流趨勢。 The projected capacitive touch panel is a two-layer ITO array that is perpendicular to each other to establish a uniform electric field. When the human body is in contact, in addition to the surface will form a capacitance, it will also cause a change in the capacitance value between the intersections of the XY axes. It has the advantages of high durability, drift phenomenon and surface capacitance, and the projected capacitive support multi-touch technology will become the mainstream trend in the future.

如第1圖和第2a圖所示，投射電容式觸控面板結構為將分別鍍有x軸方向透明導電電極202之透明基板200和鍍有y軸方向透明導電電極212透明基板210以黏接層220對貼而成，然後將貼合好之感測結構以黏接層240黏貼於硬質透明基板260上，形成film/film/硬質透明基板之堆疊結構，其中硬質透明基板260為成形強化玻璃、PC或PMMA，作為觸控面板外層之cover lens。Film/film/硬質透明基板之結構複雜，製作上需要使用到兩層黏貼層220、240，以及多道黏貼及對位手續，使得產品良率偏低。並且投射電容式觸控面板之結構包含了兩層透明基板200、210、兩層黏貼層220、240以及硬質透明基板260，使得整體堆疊厚度增加，不但造成透光度降低，也不符目前電子裝置尺寸輕薄短小之發展趨勢。 As shown in FIG. 1 and FIG. 2a, the projected capacitive touch panel structure is configured to adhere the transparent substrate 200 respectively coated with the x-axis direction transparent conductive electrode 202 and the transparent substrate 210 plated with the y-axis direction transparent conductive electrode 212. The layer 220 is pasted, and then the bonded sensing structure is adhered to the rigid transparent substrate 260 by the adhesive layer 240 to form a stacked structure of a film/film/hard transparent substrate, wherein the rigid transparent substrate 260 is a shaped tempered glass. , PC or PMMA, as the cover lens of the outer layer of the touch panel. The structure of the Film/film/hard transparent substrate is complicated, and two layers of adhesive layers 220 and 240 are required for fabrication, and multiple layers are required. Pasting and matching procedures make the product yield low. The structure of the projected capacitive touch panel comprises two transparent substrates 200, 210, two adhesive layers 220, 240 and a rigid transparent substrate 260, so that the overall stack thickness is increased, which not only causes the transmittance to decrease, but also does not conform to the current electronic device. The trend of thin and light size.

如第1圖和第2b圖所示，投射電容式觸控面板結構可將具有x軸方向透明導電電極202製作於透明基板200之上，y軸方向透明導電電極212製作於硬質透明基板260之上，硬質透明基板260為成形強化玻璃。然後以黏接層240黏貼具有x軸方向透明導電電極202之透明基板200和具有y軸方向透明導電電極212之硬質透明基板260，形成film/glass之結構。Film/glass結構比Film/film/glass結構簡單，製程上少了一次貼合的步驟，可讓良率提升。然而，硬質透明基板260為成形強化玻璃，作為觸控面板cover lens，需要依手機或電子產品設計而有不同外形。因為強化玻璃硬度高且相對於一般玻璃較難加工，切割成形時容易在玻璃邊緣產生瑕疵(crack)，使得硬質透明基板260的成形良率偏低。另外於硬質透明基板260上形成x軸方向透明導電電極202以及周邊線路280時會面臨技術瓶頸。於硬質透明基板260上形成x軸方向透明導電電極202之後要製作周邊線路280，將周邊線路280與x軸方向透明導電電極202電性連接，如果對位上有偏差時，將造成觸控面板電性不良而產生NG。硬質透明基板260為成形強化玻璃，外形之公差大約為0.2公厘。當周邊線路280走向細線路製程線寬低於50微米之後，玻璃外形的公差將使得透明導電極 202與周邊線路280不易對位，而造成良率偏低。 As shown in FIG. 1 and FIG. 2b, the projected capacitive touch panel structure can be formed on the transparent substrate 200 with the x-axis transparent conductive electrode 202, and the y-axis transparent conductive electrode 212 can be formed on the rigid transparent substrate 260. Upper, the rigid transparent substrate 260 is a shaped tempered glass. Then, the transparent substrate 200 having the x-axis direction transparent conductive electrode 202 and the hard transparent substrate 260 having the y-axis direction transparent conductive electrode 212 are adhered by the adhesive layer 240 to form a film/glass structure. The Film/glass structure is simpler than the Film/film/glass structure, and there is one less step in the process to increase the yield. However, the rigid transparent substrate 260 is a shaped tempered glass, and as a touch panel cover lens, it needs to have different shapes depending on the design of the mobile phone or the electronic product. Since the tempered glass has high hardness and is difficult to process with respect to general glass, cracks are easily generated at the edge of the glass during the cutting and forming, so that the formation yield of the rigid transparent substrate 260 is low. In addition, when the x-axis transparent conductive electrode 202 and the peripheral line 280 are formed on the rigid transparent substrate 260, a technical bottleneck is encountered. After the x-axis transparent conductive electrode 202 is formed on the rigid transparent substrate 260, the peripheral line 280 is formed, and the peripheral line 280 is electrically connected to the x-axis transparent conductive electrode 202. If there is a deviation in the alignment, the touch panel is caused. Poor electrical properties produce NG. The rigid transparent substrate 260 is a shaped tempered glass with a tolerance of approximately 0.2 mm. When the peripheral line 280 strikes the fine line process line width less than 50 microns, the tolerance of the glass profile will make the transparent lead electrode 202 and the peripheral line 280 are not easy to align, resulting in low yield.

由於貼合的手續目前仍需要人工對位以及貼合，因此多次對位和貼合手續常常會因為環境異物進入疊層中或人為因素造成製程良率低落，於製程穩定度上將造成極大影響。隨著觸控面板周邊線路走向窄邊寬的製程之後，周邊線路線寬尺寸縮小到50微米以下，將使得傳統多次人工對位貼合之製程穩定度遭受極大考驗。 Since the fitting procedure still requires manual alignment and fitting, the multiple alignment and fitting procedures often result in low process yields due to environmental foreign matter entering the laminate or human factors, which will cause great process stability. influences. With the process of narrowing the width of the periphery of the touch panel, the line width of the peripheral line is reduced to less than 50 microns, which will greatly test the process stability of the traditional manual alignment.

為了提升電容式觸控面板製程良率，以及減少投射電容式觸控面板之製造程序和減少貼合步驟，發明人經由努力不懈的實驗以及創新，而研發出一種觸控面板的製造方法，以達到製程簡化以及良率提升之目的。 In order to improve the process yield of the capacitive touch panel, reduce the manufacturing process of the projected capacitive touch panel, and reduce the bonding process, the inventors have developed a touch panel manufacturing method through unremitting experimentation and innovation. Achieve process simplification and yield improvement.

為達成上述之目的，本發明之觸控面板的製造方法包括：提供可撓式透明基材，具有上表面和下表面，上表面和下表面相對設置，上表面和下表面分別具有邊緣，邊緣位於上表面和下表面一側；形成複數感測結構於可撓式透明基材之上表面和下表面，包括：形成透明導電層於上表面和下表面；圖案化位於上表面和下表面之透明導電層，分別形成複數第一感測串列和複數第二感測串列；形成至少一金屬層於該透明導電層；以及圖案化該金屬層，形成端子線路，端子線路設置於邊緣以供連接軟性電路板，端子線路分別連接複數第一感測串列與複數第二感測串列。 To achieve the above object, a method of manufacturing a touch panel of the present invention comprises: providing a flexible transparent substrate having an upper surface and a lower surface, the upper surface and the lower surface being oppositely disposed, the upper surface and the lower surface respectively having edges and edges Located on one side of the upper surface and the lower surface; forming a plurality of sensing structures on the upper surface and the lower surface of the flexible transparent substrate, comprising: forming a transparent conductive layer on the upper surface and the lower surface; and patterning on the upper surface and the lower surface a transparent conductive layer, respectively forming a plurality of first sensing series and a plurality of second sensing series; forming at least one metal layer on the transparent conductive layer; and patterning the metal layer to form a terminal line, the terminal line being disposed at the edge For connecting the flexible circuit board, the terminal lines are respectively connected to the plurality of first sensing series and the plurality of second sensing series.

為達成上述之目的，本發明之觸控面板的製造方法包括：提供可撓式透明基材，具有上表面和下表面，上表面和下表面相對設置，上表面和下表面分別具邊緣，邊緣位於上表面和下表面一側；形成複數感測結構於可撓式透明基材之上表面和下表面，包括：形成透明導電層於上表面和下表面；形成至少一金屬層於透明導電層；圖案化位於上表面和下表面之透明導電層和金屬層，分別形成具有金屬層於其上之複數第一感測串列、具有金屬層於其上之複數第二感測串列和端子線路，複數第一感測串列和複數第二感測串列相互交錯，端子線路設置於邊緣以供連接軟性電路板，端子線路分別連接複數第一感測串列與複數第二感測串列；以及圖案化位於複數第一感測串列和複數第二感測串列上之該金屬層。 To achieve the above object, a method of manufacturing a touch panel of the present invention includes: providing a flexible transparent substrate having an upper surface and a lower surface, the upper surface and the lower surface being oppositely disposed, and the upper surface and the lower surface respectively having edges and edges Located on one side of the upper surface and the lower surface; forming a plurality of sensing structures on the upper surface and the lower surface of the flexible transparent substrate, comprising: forming a transparent conductive layer on the upper surface and the lower surface; forming at least one metal layer on the transparent conductive layer Forming a transparent conductive layer and a metal layer on the upper surface and the lower surface, respectively forming a plurality of first sensing series having the metal layer thereon, a plurality of second sensing series having the metal layer thereon, and a terminal The circuit, the plurality of first sensing series and the plurality of second sensing series are mutually staggered, the terminal lines are disposed at the edges for connecting the flexible circuit boards, and the terminal lines are respectively connected to the plurality of first sensing series and the plurality of second sensing strings And arranging the metal layer on the plurality of first sensing series and the plurality of second sensing series.

為達成上述之目的，本發明之觸控面板的製造方法包括：提供可撓式透明基材，具有上表面和下表面，上表面和下表面相對設置，上表面和下表面分別具有邊緣，邊緣位於上表面和下表面一側；形成複數感測結構於該可撓式透明基材之上表面和下表面，包括：形成透明導電層於上表面和下表面；形成至少一金屬層於透明導電層；圖案化位於上表面和下表面之金屬層，形成端子線路，端子線路設置於邊緣以供連接軟性電路板；以及圖案化位於上表面和下表面之透明導電層，分別形成複數第一感測串列和複數第二感測串列，複數第一感測串列和複數第二感測串列相互交錯，端子線路分別連接複數第一感測串列與複數第二感測串列。 To achieve the above object, a method of manufacturing a touch panel of the present invention comprises: providing a flexible transparent substrate having an upper surface and a lower surface, the upper surface and the lower surface being oppositely disposed, the upper surface and the lower surface respectively having edges and edges Located on one side of the upper surface and the lower surface; forming a plurality of sensing structures on the upper surface and the lower surface of the flexible transparent substrate, comprising: forming a transparent conductive layer on the upper surface and the lower surface; forming at least one metal layer on the transparent conductive a layer; a metal layer on the upper surface and the lower surface is patterned to form a terminal line, a terminal line is disposed on the edge for connecting the flexible circuit board; and a transparent conductive layer on the upper surface and the lower surface is patterned to form a plurality of first senses The plurality of first sensing series and the plurality of second sensing series are interleaved, and the terminal lines are respectively connected to the plurality of first sensing series and the plurality of second sensing series.

為達成上述之目的，本發明之觸控面板的製造方法，其中該複數第一感測串列具有複數第一感測墊，複數第二感測串列具有複數第二感測墊，每一第一感測墊沿第一方向延伸，每一第二感測墊沿第二方向延伸。 In order to achieve the above object, a method of manufacturing a touch panel of the present invention, wherein the plurality of first sensing series The plurality of first sensing pads have a plurality of second sensing pads, each of the first sensing pads extending in a first direction, and each of the second sensing pads extending in a second direction.

為達成上述之目的，本發明之觸控面板的製造方法，其中複數第一感測串列分別具有複數第一感測墊和複數第一連接線，複數第一感測墊以陣列方式排列，複數第一連接線於第一方向電性連接複數第一感測墊，複數第二感測串列分別具有複數第二感測墊和複數第二連接線，複數第二感測墊以陣列方式排列，複數第二連接線於第二方向電性連接複數第二感測墊。 In the method for manufacturing the touch panel of the present invention, the plurality of first sensing series respectively have a plurality of first sensing pads and a plurality of first connecting lines, and the plurality of first sensing pads are arranged in an array manner. The plurality of first connecting lines are electrically connected to the plurality of first sensing pads in the first direction, the plurality of second sensing series respectively have a plurality of second sensing pads and a plurality of second connecting lines, and the plurality of second sensing pads are arranged in an array manner Arranging, the plurality of second connecting wires are electrically connected to the plurality of second sensing pads in the second direction.

為達成上述之目的，本發明之觸控面板的製造方法，其中圖案化該金屬層更包括形成複數導電線於複數第一連接線和複數第二連接線之上。 To achieve the above object, a method of manufacturing a touch panel of the present invention, wherein patterning the metal layer further comprises forming a plurality of conductive lines over the plurality of first connecting lines and the plurality of second connecting lines.

為達成上述之目的，本發明之觸控面板的製造方法，其中形成金屬層於導電層上之後，更包括：形成抗反射層於金屬層之上；以及圖案化抗反射層和金屬層，形成具有抗反射層之複數第一橋接線、複數第二橋接線和端子線路。 The method for manufacturing the touch panel of the present invention, after the metal layer is formed on the conductive layer, further comprises: forming an anti-reflection layer on the metal layer; and patterning the anti-reflection layer and the metal layer to form A plurality of first bridge wires, a plurality of second bridge wires, and terminal lines having an anti-reflection layer.

為達成上述之目的，本發明之觸控面板的製造方法，其中複數第一感測墊和複數第二感測墊相互交錯。 To achieve the above object, a method of manufacturing a touch panel of the present invention, wherein a plurality of first sensing pads and a plurality of second sensing pads are interlaced.

為達成上述之目的，本發明之觸控面板的製造方法，其中圖案化透明導電層包括：形成圖案化光阻層於透明導電層之上；蝕刻透明導電層；以及去除圖案化光阻層。 To achieve the above object, a method of manufacturing a touch panel of the present invention, wherein patterning the transparent conductive layer comprises: forming a patterned photoresist layer over the transparent conductive layer; etching the transparent conductive layer; and removing the patterned photoresist layer.

為達成上述之目的，本發明之觸控面板的製造方法，其中圖案化金屬層包括：形成圖案化光阻層於金屬層之上；蝕刻金屬層；以及去除圖案化光阻層。 In order to achieve the above object, a method of manufacturing a touch panel of the present invention, wherein the patterned metal layer comprises: Forming a patterned photoresist layer over the metal layer; etching the metal layer; and removing the patterned photoresist layer.

為達成上述之目的，本發明之觸控面板的製造方法，更包括熱壓軟性電路板於位在端子線之抗反射層之上。 In order to achieve the above object, the method for manufacturing a touch panel of the present invention further comprises a hot-pressing flexible circuit board positioned on the anti-reflection layer of the terminal line.

為達成上述之目的，本發明之觸控面板的製造方法，於圖案化導電層之後更包括形成黏著層於上表面之複數感測結構之上，然後裁切覆蓋有黏著層於複數感測結構之上之可撓式透明基材，形成複數片狀感測基材。 In order to achieve the above object, the method for manufacturing the touch panel of the present invention further comprises forming an adhesive layer on the upper sensing surface of the plurality of sensing structures after the patterned conductive layer, and then cutting and covering the adhesive layer on the plurality of sensing structures. The flexible transparent substrate is formed to form a plurality of sheet-shaped sensing substrates.

為達成上述之目的，本發明之觸控面板的製造方法，形成複數片狀感測基材之後更包括以黏著層黏著硬質透明基板於每一片狀感測基材。 In order to achieve the above object, the method for manufacturing the touch panel of the present invention further comprises forming a plurality of sheet-shaped sensing substrates, and further comprising adhering the hard transparent substrate to the sheet sensing substrate in an adhesive layer.

為達成上述之目的，本發明之觸控面板的製造方法，更包括形成一具有黏著層之透明導電層於下表面之複數感測結構之上。 To achieve the above object, the method for manufacturing a touch panel of the present invention further comprises forming a transparent conductive layer having an adhesive layer on a plurality of sensing structures on the lower surface.

為達成上述之目的，本發明之觸控面板的製造方法，於圖案化導電層之後更包括形成透明絕緣保護層於複數感測結構之上。 To achieve the above object, the method for manufacturing a touch panel of the present invention further comprises forming a transparent insulating protective layer on the plurality of sensing structures after patterning the conductive layer.

為達成上述之目的，本發明之觸控面板的製造方法，更包括形成透明抗反射層於透明絕緣保護層之上。 To achieve the above object, the method for manufacturing a touch panel of the present invention further comprises forming a transparent anti-reflective layer on the transparent insulating protective layer.

本發明為一種觸控面板的製造方法，該方法可以減少投射電容式觸控面板之製造程序和減少貼合步驟。 The invention is a method for manufacturing a touch panel, which can reduce the manufacturing process of the projected capacitive touch panel and reduce the bonding step.

請參考第3a圖至第3d圖所示係為本發明之一實施例所提供觸控面板的製造方法之示意圖。如第3a圖，提供可撓式透明基材300，具有上表面301和下表面302，上表面301和下表面302相對設置，上表面301和下表面302分別具有邊緣303，邊緣303分別位於上表面301和下表面302之一側。可撓式透明基材300為可撓曲之材質所構成，可以捲曲成滾筒狀。可撓式透明基材300之材質例如可為PEN、PET、PES、可撓式玻璃、PMMA、PC或PI之一，也可為上述材質之多層複合材料，而前述材質之上亦可形成有多層之透明堆疊結構之基材，多層之透明堆疊結構例如可為抗反射層。然後形成複數感測結構(無圖示)於該可撓式透明基材300之上表面301和下表面302。其中複數感測結構30之形成方法包括：形成透明導電層310於可撓式透明基材300之上表面301和下表面302，其中透明導電層310之材質，例如可為銦錫氧化物、氧化銦、氧化鋅、氧化銦鋅、摻雜有鋁之氧化鋅、以及摻雜有銻之氧化錫中之一或其混合物。如第3b圖，接著進行第一道黃光製程，將位於上表面301和下表面302之透明導電層310圖案化。其中第一道黃光製程包括形成光阻層320於透明導電層310之上，圖案化光阻層320，其中光阻層320之材質可為液態光阻或乾膜光阻。然後進行蝕刻步驟，蝕刻去除未受光阻層320保護之透明導電層310，以及去除圖案化光阻層320。而形成複數第一感測串列311和複數第二感測串列312，複數第一感測串列311分別具有複數第一感測墊3111和複數第一連接線3112，複數第一感測墊3111以陣列方式排列，複數第一連接線3112於第一方向D1電性連接該些第一感測墊3111，複數第二感測串列312分別具有複數第二感測墊3121和複數第二連接線3122，複數第二感測墊3121以陣列方式排列，複數第二連接線3122於第二方向D2電性連接複數第二感測墊3122，如第3c圖和第3d圖所示。 Please refer to FIGS. 3a to 3d for a schematic diagram of a method for manufacturing a touch panel according to an embodiment of the present invention. As shown in Fig. 3a, a flexible transparent substrate 300 is provided having an upper surface 301 and a lower surface 302, the upper surface 301 and the lower surface 302 being oppositely disposed, the upper surface 301 and the lower surface 302 having edges 303, respectively, the edges 303 being respectively located One side of the surface 301 and the lower surface 302. The flexible transparent substrate 300 is made of a flexible material and can be crimped into a roll shape. The material of the flexible transparent substrate 300 may be, for example, one of PEN, PET, PES, flexible glass, PMMA, PC or PI, or may be a multilayer composite material of the above materials, and the above materials may be formed thereon. The substrate of the multilayer transparent stack structure, the multilayer transparent stack structure may be, for example, an anti-reflection layer. A plurality of sensing structures (not shown) are then formed on the upper surface 301 and the lower surface 302 of the flexible transparent substrate 300. The method for forming the plurality of sensing structures 30 includes: forming a transparent conductive layer 310 on the upper surface 301 and the lower surface 302 of the flexible transparent substrate 300, wherein the material of the transparent conductive layer 310 is, for example, indium tin oxide, oxidized. One of indium, zinc oxide, indium zinc oxide, zinc oxide doped with aluminum, and tin oxide doped with antimony or a mixture thereof. As in Figure 3b, a first yellow light process is then performed to pattern the transparent conductive layer 310 on the upper surface 301 and the lower surface 302. The first yellow light process includes forming a photoresist layer 320 on the transparent conductive layer 310 and patterning the photoresist layer 320. The material of the photoresist layer 320 may be a liquid photoresist or a dry film photoresist. Then, an etching step is performed to remove the transparent conductive layer 310 not protected by the photoresist layer 320, and to remove the patterned photoresist layer 320. Forming a plurality of first sensing series 311 and a plurality of second sensing series 312, the plurality of first sensing series 311 respectively having a plurality of first sensing pads 3111 and a plurality of first connecting lines 3112, the plurality of first sensing The pads 3111 are arranged in an array, and the plurality of first connecting lines 3112 are electrically connected in the first direction D1. The first sensing pads 3111 are connected to the plurality of second sensing pads 3121 and the plurality of second connecting wires 3122, and the plurality of second sensing pads 3121 are arranged in an array manner. The two connecting wires 3122 are electrically connected to the plurality of second sensing pads 3122 in the second direction D2, as shown in FIGS. 3c and 3d.

如第3e圖和第3g圖所示，第3f圖為由上向下看上表面之俯視圖，第3g圖為由下向上看下表面之仰視圖。形成至少一金屬層330於位於上表面301和下表面302之透明導電層310，進行第二道黃光製程，圖案化至少一金屬層330，於上表面301和下表面302之邊緣303分別形成上端子線路331和下端子線路332。上端子線路331和下端子線路332供連接軟性電路板(無圖示)，並且上端子線路331電性連接複數第一感測串列311，下端子線路332電性連接複數第二感測串列312。上端子線路331和下端子線路332之結構可為至少一層導電金屬層，或者多層導電金屬層。其中導電金屬層之材質可為銅合金、鋁合金、金、銀、鋁、銅、鉬等導電金屬或導電合金。多層導電金屬層之結構，例如可為鉬層/鋁層/鉬層之堆疊結構，或者可為選自銅合金、鋁合金、金、銀、鋁、銅、鉬等導電金屬或導電合金之一種或多種材質而堆疊之多層導電金屬層結構。導電金屬層多為使用物理氣相沉積(PVD)或是化學氣相沉積(CVD)，沉積速率快且製程穩定。透明導電層310之材質可為透明導電材質，例如可為銦錫氧化物、氧化銦、氧化鋅、氧化銦鋅、摻雜有鋁之氧化鋅、以及摻雜有銻之氧化錫中之一或其混合物。 As shown in Fig. 3e and Fig. 3g, Fig. 3f is a plan view of the upper surface viewed from the top to the bottom, and Fig. 3g is a bottom view of the lower surface viewed from the bottom. Forming at least one metal layer 330 on the transparent conductive layer 310 on the upper surface 301 and the lower surface 302, performing a second yellow light process, patterning at least one metal layer 330, and forming an edge 303 on the upper surface 301 and the lower surface 302, respectively. Upper terminal line 331 and lower terminal line 332. The upper terminal line 331 and the lower terminal line 332 are connected to the flexible circuit board (not shown), and the upper terminal line 331 is electrically connected to the plurality of first sensing series 311, and the lower terminal line 332 is electrically connected to the plurality of second sensing strings. Column 312. The structure of the upper terminal line 331 and the lower terminal line 332 may be at least one layer of a conductive metal layer or a plurality of layers of a conductive metal layer. The material of the conductive metal layer may be a conductive metal or a conductive alloy such as a copper alloy, an aluminum alloy, gold, silver, aluminum, copper or molybdenum. The structure of the multi-layer conductive metal layer may be, for example, a stacked structure of a molybdenum layer/aluminum layer/molybdenum layer, or may be a conductive metal or a conductive alloy selected from the group consisting of copper alloy, aluminum alloy, gold, silver, aluminum, copper, molybdenum, and the like. A multi-layer conductive metal layer structure stacked with a plurality of materials. Most of the conductive metal layers use physical vapor deposition (PVD) or chemical vapor deposition (CVD), and the deposition rate is fast and the process is stable. The material of the transparent conductive layer 310 may be a transparent conductive material, for example, one of indium tin oxide, indium oxide, zinc oxide, indium zinc oxide, zinc oxide doped with aluminum, and tin oxide doped with antimony or Its mixture.

如第3h圖所示為具有複數感測結構於可撓式透明基材之上表面和下表面之俯視圖。第3i圖係沿第3h圖之剖線a-a’所繪示之剖面圖。如第3h圖和第3i圖所示，為上述製程步驟所形成複數感測結構30於可撓式透明基材300之上表面301和下表面302，其中複數第一感測墊3111與複數第二感測墊3121相互交錯排列。接著形成黏著層350於上表面301或下表面302之複數感測結構30之一上，也可分別形成黏著層350於上表面301和下表面302之複數感測結構30之上，於此實施例為黏著層350形成於上表面301之複數感測結構30之上如第3j圖所示。其中黏著層350之材質可為壓克力膠、UV膠、水膠或光學膠。接著如第3k圖所示，裁切覆蓋有該黏著層350於上表面301或下表面302該些感測結構30之上之該可撓式透明基材300，或者裁切覆蓋有該黏著層350於上表面301和下表面302該些感測結構30之上之該可撓式透明基材300，形成複數片狀感測基材370。然後如第3l圖所示，將每一片狀感測基材370以黏著層350黏貼於硬質透明基板360。硬質透明基板360可黏貼於位於上表面301之上的黏著層350，或者黏貼於位於ㄒ表面302之下的黏著層350。 As shown in Figure 3h, there is a top view of the complex sensing structure on the upper and lower surfaces of the flexible transparent substrate. Fig. 3i is a cross-sectional view taken along line a-a' of Fig. 3h. As shown in FIG. 3h and FIG. 3i, the plurality of sensing structures 30 formed in the above process steps are on the upper surface 301 and the lower surface 302 of the flexible transparent substrate 300, wherein the plurality of first sensing pads 3111 and the plurality of The two sensing pads 3121 are staggered with each other. Then, the adhesive layer 350 is formed on one of the plurality of sensing structures 30 of the upper surface 301 or the lower surface 302, and the adhesive layer 350 may be respectively formed on the plurality of sensing structures 30 of the upper surface 301 and the lower surface 302. For example, the adhesive layer 350 is formed on the complex sensing structure 30 of the upper surface 301 as shown in FIG. 3j. The material of the adhesive layer 350 may be acrylic glue, UV glue, water glue or optical glue. Then, as shown in FIG. 3k, the flexible transparent substrate 300 covered by the adhesive layer 350 on the upper surface 301 or the lower surface 302 of the sensing structures 30 is cut or covered with the adhesive layer. The flexible transparent substrate 300 above the sensing structures 30 on the upper surface 301 and the lower surface 302 forms a plurality of sheet sensing substrates 370. Then, as shown in FIG. 3l, each of the sheet-shaped sensing substrates 370 is adhered to the rigid transparent substrate 360 with an adhesive layer 350. The rigid transparent substrate 360 can be adhered to the adhesive layer 350 on the upper surface 301 or to the adhesive layer 350 located below the surface 302 of the crucible.

請參考第3m圖所示係為本發明之一實施例所提供觸控面板的製造方法之示意圖。如上述製程步驟形成複數感測結構30於可撓式透明基材300之上表面301和下表面302之後，更包括形成具有黏著層351之透明導電層340於位於下表面302之複數感測結構30，以黏著層351覆蓋位於下表面302之複數感測結構30並黏著透明導電層340。透明導電層340用以防止觸控面板之受到電磁干擾 (EMI)。透明導電層340之材質可為透明導電材質，例如可為銦錫氧化物、氧化銦、氧化鋅、氧化銦鋅、摻雜有鋁之氧化鋅、以及摻雜有銻之氧化錫中之一或其混合物。 Please refer to FIG. 3m, which is a schematic diagram of a method for manufacturing a touch panel according to an embodiment of the present invention. After the process step of forming the complex sensing structure 30 on the upper surface 301 and the lower surface 302 of the flexible transparent substrate 300, the method further comprises forming a transparent sensing layer 340 having an adhesive layer 351 on the lower sensing surface of the plurality of sensing structures. 30. The plurality of sensing structures 30 on the lower surface 302 are covered with an adhesive layer 351 and adhered to the transparent conductive layer 340. The transparent conductive layer 340 is used to prevent electromagnetic interference of the touch panel (EMI). The material of the transparent conductive layer 340 may be a transparent conductive material, for example, one of indium tin oxide, indium oxide, zinc oxide, indium zinc oxide, zinc oxide doped with aluminum, and tin oxide doped with antimony or Its mixture.

參考第3n圖至第3p圖所示係為本發明之一實施例所提供觸控面板的製造方法之示意圖。圖案化位於上表面301和下表面302之透明導電層310，形成複數第一感側墊3111和複數第二感測墊3121，複數第一感側墊3111和複數第二感測墊3121分別以陣列排列，複數第一感側墊3111和複數第二感測墊3121相互交錯。再形成至少一金屬層330於位於上表面301和下表面302之圖案化之透明導電層310之上，以及形成抗反射層370於金屬層330之上。圖案化抗反射層370和金屬層330，於上表面301和下表面302之邊緣303分別形成具有抗反射層370之上端子線路331和下端子線路332，以及位於上表面301具有抗反射層370之複數第一連接線3112和位於下表面302具有抗反射層370之複數第二連接線，複數第一連接線3112於第一方向D1電性連接該些第一感測墊3111形成複數第一感測串列311，複數第二連接線3122於第二方向D2電性連接複數第二感測墊3121形成複數第二感測串列312。上端子線路331和下端子線路332供連接軟性電路板(無圖示)，並且上端子線路331電性連接複數第一感測串列311，下端子線路332電性連接複數第二感測串列312。上端子線路331和下端子線路332分別設置於上表面301和下表面302之邊緣303以供連接軟性電路板，上端子線路331和下端子線路332分別連接複數第一感測串列311與複數第二感測串列312。其中抗反射層370之材質可為可為深色導電金屬，例如ITO、TiN、TiAlCN、TiAlN、NbO、NbN、Nb₂O_x、TiC、SiC或WC。亦可為深色絕緣材質，例如可為CuO、CoO、WO₃、MoO₃、CrO、CrON、Nb₂O₅。抗反射層370可有效降低金屬材質所造成之光反射。若抗反射層370之材質為深色導電金屬，則熱壓軟性電路板於位在上端子線路331和下端子線路332之抗反射層370之上。金屬層330結構可為至少一層導電金屬層，或者多層導電金屬層。其中導電金屬層之材質可為銅合金、鋁合金、金、銀、鋁、銅、鉬等導電金屬或導電合金。多層導電金屬層之結構，例如可為鉬層/鋁層/鉬層之堆疊結構，或者可為選自銅合金、鋁合金、金、銀、鋁、銅、鉬等導電金屬或導電合金之一種或多種材質而堆疊之多層導電金屬層結構。導電金屬層多為使用物理氣相沉積(PVD)或是化學氣相沉積(CVD)，沉積速率快且製程穩定。 Referring to FIGS. 3n to 3p, there is shown a schematic diagram of a method of manufacturing a touch panel according to an embodiment of the present invention. The transparent conductive layer 310 is disposed on the upper surface 301 and the lower surface 302 to form a plurality of first sensing side pads 3111 and a plurality of second sensing pads 3121, and the plurality of first sensing side pads 3111 and the plurality of second sensing pads 3121 respectively The array arrangement, the plurality of first sensing side pads 3111 and the plurality of second sensing pads 3121 are interlaced. At least one metal layer 330 is formed over the patterned transparent conductive layer 310 on the upper surface 301 and the lower surface 302, and an anti-reflective layer 370 is formed over the metal layer 330. The patterned anti-reflective layer 370 and the metal layer 330 are formed on the upper surface 301 and the edge 303 of the lower surface 302, respectively, with the terminal line 331 and the lower terminal line 332 over the anti-reflection layer 370, and the anti-reflection layer 370 on the upper surface 301. The plurality of first connecting lines 3112 and the plurality of second connecting lines having the anti-reflective layer 370 on the lower surface 302, the plurality of first connecting lines 3112 electrically connecting the first sensing pads 3111 in the first direction D1 to form a plurality of first lines The sensing series 311, the plurality of second connecting lines 3122 electrically connecting the plurality of second sensing pads 3121 in the second direction D2 to form a plurality of second sensing series 312. The upper terminal line 331 and the lower terminal line 332 are connected to the flexible circuit board (not shown), and the upper terminal line 331 is electrically connected to the plurality of first sensing series 311, and the lower terminal line 332 is electrically connected to the plurality of second sensing strings. Column 312. The upper terminal line 331 and the lower terminal line 332 are respectively disposed on the edge 303 of the upper surface 301 and the lower surface 302 for connecting the flexible circuit board, and the upper terminal line 331 and the lower terminal line 332 are respectively connected to the plurality of first sensing series 311 and the plurality The second sensing train 312. The anti-reflective layer 370 may be made of a dark conductive metal such as ITO, TiN, TiAlCN, TiAlN, NbO, NbN, Nb ₂ O _x , TiC, SiC or WC. It may also be a dark insulating material such as CuO, CoO, WO ₃ , MoO ₃ , CrO, CrON, Nb ₂ O ₅ . The anti-reflection layer 370 can effectively reduce the light reflection caused by the metal material. If the material of the anti-reflective layer 370 is a dark conductive metal, the thermocompression flexible circuit board is placed over the anti-reflective layer 370 of the upper terminal line 331 and the lower terminal line 332. The metal layer 330 structure may be at least one layer of conductive metal or a plurality of layers of conductive metal. The material of the conductive metal layer may be a conductive metal or a conductive alloy such as a copper alloy, an aluminum alloy, gold, silver, aluminum, copper or molybdenum. The structure of the multi-layer conductive metal layer may be, for example, a stacked structure of a molybdenum layer/aluminum layer/molybdenum layer, or may be a conductive metal or a conductive alloy selected from the group consisting of copper alloy, aluminum alloy, gold, silver, aluminum, copper, molybdenum, and the like. A multi-layer conductive metal layer structure stacked with a plurality of materials. Most of the conductive metal layers use physical vapor deposition (PVD) or chemical vapor deposition (CVD), and the deposition rate is fast and the process is stable.

如第4圖所示，係為本發明之一實施例所提供觸控面板的製造方法之示意圖。形成複數感測結構40於可撓式透明基材400之上表面401和下表面402後，再形成透明絕緣保護層490覆蓋複數感測結構40之上，以及不具有感測結構40之可撓式透明基板400之上，僅於端子線路與軟性電路板電性連接的區域(無圖示)無透明絕緣保護層490覆蓋。透明絕緣保護層490之材質可為二氧化矽(SiO₂)、有機絕緣材質、無機絕緣材質或光阻，光阻例如可為液態光阻或乾膜光阻，對於防止感測結構之水氣入侵或氧化的保護相當優異。接著再形成透明抗反射層491於透明絕緣保護層490之上，透明抗反射層491之材質例如可為 TiO₂或SiO₂等不同折射率之透明材質。透明抗反射層491可為TiO₂層、SiO₂層或上述兩層之多層堆疊。透明抗反射層491可減少光線因折射率不同而被反射，進而增加光線的穿透率。 FIG. 4 is a schematic view showing a method of manufacturing a touch panel according to an embodiment of the present invention. After the complex sensing structure 40 is formed on the upper surface 401 and the lower surface 402 of the flexible transparent substrate 400, the transparent insulating protective layer 490 is formed to cover the complex sensing structure 40, and the sensing structure 40 is not flexible. On the transparent substrate 400, only the region (not shown) where the terminal line and the flexible circuit board are electrically connected is covered with the transparent insulating protective layer 490. The transparent insulating protective layer 490 may be made of cerium oxide (SiO ₂ ), an organic insulating material, an inorganic insulating material or a photoresist. The photoresist may be, for example, a liquid photoresist or a dry film photoresist, for preventing moisture in the sensing structure. The protection of intrusion or oxidation is quite excellent. Then, a transparent anti-reflective layer 491 is formed on the transparent insulating protective layer 490. The material of the transparent anti-reflective layer 491 can be, for example, a transparent material having different refractive indexes such as TiO ₂ or SiO ₂ . The transparent anti-reflective layer 491 can be a TiO ₂ layer, a SiO ₂ layer, or a multilayer stack of the above two layers. The transparent anti-reflective layer 491 reduces the reflection of light due to the difference in refractive index, thereby increasing the transmittance of light.

本發明之另一實施例(無圖示)，上述製程步驟形成複數感測結構於可撓式透明基材之上表面和下表面之後，更包括形成具有黏著層之透明導電層於位於下表面之複數感測結構，以黏著層覆蓋位於下表面之複數感測結構並黏著透明導電層。透明導電層用以防止觸控面板之受到電磁干擾(EMI)。透明導電層之材質可為透明導電材質，例如可為銦錫氧化物、氧化銦、氧化鋅、氧化銦鋅、摻雜有鋁之氧化鋅、以及摻雜有銻之氧化錫中之一或其混合物。 In another embodiment of the present invention (not shown), the process step of forming a plurality of sensing structures after the upper surface and the lower surface of the flexible transparent substrate further comprises forming a transparent conductive layer having an adhesive layer on the lower surface. The plurality of sensing structures cover the plurality of sensing structures on the lower surface with an adhesive layer and adhere the transparent conductive layer. The transparent conductive layer is used to protect the touch panel from electromagnetic interference (EMI). The material of the transparent conductive layer may be a transparent conductive material, for example, one of indium tin oxide, indium oxide, zinc oxide, indium zinc oxide, aluminum-doped zinc oxide, and antimony-doped tin oxide or mixture.

請參考第5a圖至第5e圖所示係為本發明之一實施例所提供觸控面板的製造方法之示意圖。提供可撓式透明基材500，具有上表面501和下表面502，上表面501和下表面502相對設置，上表面501和下表面502分別具有邊緣503，邊緣503分別位於上表面501和下表面502之一側。可撓式透明基材500為可撓曲之材質所構成，可以捲曲成滾筒狀。可撓式透明基材500之材質例如可為PEN、PET、PES、可撓式玻璃、PMMA、PC或PI之一，也可為上述材質之多層複合材料，而前述材質之上亦可形成有多層之透明堆疊結構之基材，多層之透明堆疊結構例如可為抗反射層。然後形成複數感測結構(無圖示)於該可撓式透明基材500之上表面501和下表面502。其中複數感測結構之形成方法包括：形成透明導電層510於可撓式透明基材500之上表面501和下表面502，其中透明導電層510之材質，例如可為銦錫氧化物、氧化銦、氧化鋅、氧化銦鋅、摻雜有鋁之氧化鋅、以及摻雜有銻之氧化錫中之一或其混合物。再形成至少一金屬層530於位於上表面501和下表面502之透明導電層510之上。金屬層530可為至少一層導電金屬層，或者多層導電金屬層。其中導電金屬層之材質可為銅合金、鋁合金、金、銀、鋁、銅、鉬等導電金屬或導電合金。多層導電金屬層之結構，例如可為鉬層/鋁層/鉬層之堆疊結構，或者可為選自銅合金、鋁合金、金、銀、鋁、銅、鉬等導電金屬或導電合金之一種或多種材質而堆疊之多層導電金屬層結構。導電金屬層多為使用物理氣相沉積(PVD)或是化學氣相沉積(CVD)，沉積速率快且製程穩定。進行第一道黃光製程，將位於上表面501和下表面502之透明導電層510和金屬層530圖案化。其中第一道黃光製程包括形成光阻層(無圖示)於金屬層530之上，圖案化光阻層，其中光阻層之材質可為液態光阻或乾膜光阻。然後進行蝕刻步驟，蝕刻未受光阻層保護之透明導電層510和金屬層530，以及去除該圖案化光阻層。而形成具有金屬層530於其上之複數第一感測串列511、形成具有金屬層530於其上之複數第二感測串列512、上端子線路531和下端子線路532。複數第一感測串列511分別具有複數第一感測墊5111和複數第一連接線5112，該些第一感測墊5111以陣列方式排列，複數第一連接線5112於第一方向D1電性連接相鄰之複數第一感測墊5111，複數第二感測串列512分別具有複數第二感測墊5121和複數第二連接線5122，複數第二感測墊5121以陣列方式排列，複數第二連接線5122於第二方向D2電性連接相鄰之複數第二感測墊5122。上端子線路531和下端子線路532供連接軟性電路板(無圖示)，並且上端子線路531電性連接複數第一感測串列511，下端子線路532電性連接複數第二感測串列512。接著再圖案化位於複數第一感測串列511和複數第二感測串列512上之金屬層530，形成複數導電線533於複數第一連接線5112和複數第二連接線5122之上。 Please refer to FIG. 5a to FIG. 5e for a schematic diagram of a method for manufacturing a touch panel according to an embodiment of the present invention. A flexible transparent substrate 500 is provided having an upper surface 501 and a lower surface 502. The upper surface 501 and the lower surface 502 are oppositely disposed. The upper surface 501 and the lower surface 502 respectively have edges 503, and the edges 503 are respectively located on the upper surface 501 and the lower surface. One side of 502. The flexible transparent substrate 500 is made of a flexible material and can be crimped into a roll shape. The material of the flexible transparent substrate 500 may be, for example, one of PEN, PET, PES, flexible glass, PMMA, PC or PI, or may be a multilayer composite material of the above materials, and the above materials may be formed thereon. The substrate of the multilayer transparent stack structure, the multilayer transparent stack structure may be, for example, an anti-reflection layer. A plurality of sensing structures (not shown) are then formed on the upper surface 501 and the lower surface 502 of the flexible transparent substrate 500. The method for forming a plurality of sensing structures includes: forming a transparent conductive layer 510 on the upper surface 501 and the lower surface 502 of the flexible transparent substrate 500, wherein the transparent conductive layer The material of the layer 510 may be, for example, one of indium tin oxide, indium oxide, zinc oxide, indium zinc oxide, zinc oxide doped with aluminum, and tin oxide doped with antimony or a mixture thereof. At least one metal layer 530 is formed over the transparent conductive layer 510 on the upper surface 501 and the lower surface 502. The metal layer 530 can be at least one layer of conductive metal, or a plurality of layers of conductive metal. The material of the conductive metal layer may be a conductive metal or a conductive alloy such as a copper alloy, an aluminum alloy, gold, silver, aluminum, copper or molybdenum. The structure of the multi-layer conductive metal layer may be, for example, a stacked structure of a molybdenum layer/aluminum layer/molybdenum layer, or may be a conductive metal or a conductive alloy selected from the group consisting of copper alloy, aluminum alloy, gold, silver, aluminum, copper, molybdenum, and the like. A multi-layer conductive metal layer structure stacked with a plurality of materials. Most of the conductive metal layers use physical vapor deposition (PVD) or chemical vapor deposition (CVD), and the deposition rate is fast and the process is stable. A first yellow light process is performed to pattern the transparent conductive layer 510 and the metal layer 530 on the upper surface 501 and the lower surface 502. The first yellow light process includes forming a photoresist layer (not shown) on the metal layer 530 to pattern the photoresist layer, wherein the photoresist layer is made of a liquid photoresist or a dry film photoresist. An etching step is then performed to etch the transparent conductive layer 510 and the metal layer 530 that are not protected by the photoresist layer, and to remove the patterned photoresist layer. A plurality of first sensing series 511 having a metal layer 530 thereon are formed, a plurality of second sensing series 512 having a metal layer 530 thereon, an upper terminal line 531 and a lower terminal line 532 are formed. The first sensing series 511 respectively have a plurality of first sensing pads 5111 and a plurality of first connecting lines 5112. The first sensing pads 5111 are arranged in an array manner, and the plurality of first connecting lines 5112 are electrically connected in the first direction D1. The plurality of first sensing pads 5111 are connected to each other, and the plurality of second sensing strings 512 respectively have a plurality of second sensing pads 5121 and a plurality of second connecting lines 5122, and the plurality of second sensing pads 5121 are arranged in an array manner. The plurality of second connecting lines 5122 are electrically connected adjacent to each other in the second direction D2 The second plurality of sensing pads 5122. The upper terminal line 531 and the lower terminal line 532 are connected to the flexible circuit board (not shown), and the upper terminal line 531 is electrically connected to the plurality of first sensing series 511, and the lower terminal line 532 is electrically connected to the plurality of second sensing strings. Column 512. Then, the metal layer 530 on the plurality of first sensing series 511 and the plurality of second sensing series 512 is patterned to form a plurality of conductive lines 533 over the plurality of first connecting lines 5112 and the plurality of second connecting lines 5122.

請參考第6a圖至第6e圖所示係為本發明之一實施例所提供觸控面板的製造方法之示意圖。提供可撓式透明基材600，具有上表面601和下表面602，上表面601和下表面602相對設置，上表面601和下表面602分別具有邊緣603，邊緣603分別位於上表面601和下表面602之一側。可撓式透明基材600為可撓曲之材質所構成，可以捲曲成滾筒狀。可撓式透明基材600之材質例如可為PEN、PET、PES、可撓式玻璃、PMMA、PC或PI之一，也可為上述材質之多層複合材料，而前述材質之上亦可形成有多層之透明堆疊結構之基材，多層之透明堆疊結構例如可為抗反射層。然後形成複數感測結構(無圖示)於該可撓式透明基材600之上表面601和下表面602。其中複數感測結構之形成方法包括：形成透明導電層610於可撓式透明基材600之上表面601和下表面602，其中透明導電層610之材質，例如可為銦錫氧化物、氧化銦、氧化鋅、氧化銦鋅、摻雜有鋁之氧化鋅、以及摻雜有銻之氧化錫中之一或其混合物。再形成至少一金屬層630於位於上表面601和下表面602之透明導電層610之上。金屬層630可為至少一層導電金屬層，或者多層導電金屬層。其中導電金屬層之材質可為銅合金、鋁合金、金、銀、鋁、銅、鉬等導電金屬或導電合金。多層導電金屬層之結構，例如可為鉬層/鋁層/鉬層之堆疊結構，或者可為選自銅合金、鋁合金、金、銀、鋁、銅、鉬等導電金屬或導電合金之一種或多種材質而堆疊之多層導電金屬層結構。導電金屬層多為使用物理氣相沉積(PVD)或是化學氣相沉積(CVD)，沉積速率快且製程穩定。進行第一道黃光製程，將位於上表面601和下表面602之金屬層630圖案化。其中第一道黃光製程包括形成光阻層(無圖示)於金屬層630之上，圖案化光阻層，其中光阻層之材質可為液態光阻或乾膜光阻。然後進行蝕刻步驟，蝕刻未受光阻層保護之金屬層630，以及去除該圖案化光阻層，而形成上端子線路631和下端子線路632供連接軟性電路板(無圖示)，更可形成複數導電線633。再來進行第二道黃光製程，圖案化透明導電層610。第二道黃光製程包括形成光阻層(無圖示)於透明導電層610之上，圖案化光阻層，其中光阻層之材質可為液態光阻或乾膜光阻。然後進行蝕刻步驟，蝕刻未受光阻層保護之透明導電層610，以及去除該圖案化光阻層，形成複數第一感測串列611和複數第二感測串列612，以及具有透明導電層610於其下之上端子線路631和下端子線路632。複數第一感測串列611分別具有複數第一感測墊6111和複數第一連接線6112，複數第一感測墊6111以陣列方式排列，複數第一連接線6112於第一方向D1電性連接相鄰之複數第一感測墊6111，複數第二感測串列612分別具有複數第二感測墊6121和複數第二連接線6122，複數第二感測墊6121以陣列方式排列，複數第二連接線6122於第二方向D2電性連接相鄰之複數第二感測墊6122。複數導電線633分別位於複數第一連接線6112和複數第二連接線6122之上，用以增加導電度。上端子線路631電性連接複數第一感測串列611，下端子線路632電性連接複數第二感測串列612。接著再圖案化位於複數第一感測串列511和複數第二感測串列512上之金屬層530，形成複數導電線533於複數第一連接線5112和複數第二連接線5122之上。 Please refer to FIGS. 6 a to 6 e for a schematic diagram of a method for manufacturing a touch panel according to an embodiment of the present invention. A flexible transparent substrate 600 is provided having an upper surface 601 and a lower surface 602. The upper surface 601 and the lower surface 602 are oppositely disposed. The upper surface 601 and the lower surface 602 respectively have edges 603, and the edges 603 are respectively located on the upper surface 601 and the lower surface. One side of 602. The flexible transparent substrate 600 is made of a flexible material and can be crimped into a roll shape. The material of the flexible transparent substrate 600 may be, for example, one of PEN, PET, PES, flexible glass, PMMA, PC or PI, or may be a multilayer composite material of the above materials, and the above materials may be formed thereon. The substrate of the multilayer transparent stack structure, the multilayer transparent stack structure may be, for example, an anti-reflection layer. A plurality of sensing structures (not shown) are then formed on the upper surface 601 and the lower surface 602 of the flexible transparent substrate 600. The method for forming the plurality of sensing structures includes: forming a transparent conductive layer 610 on the upper surface 601 and the lower surface 602 of the flexible transparent substrate 600, wherein the material of the transparent conductive layer 610 is, for example, indium tin oxide or indium oxide. And one or a mixture of zinc oxide, indium zinc oxide, zinc oxide doped with aluminum, and tin oxide doped with antimony. At least one metal layer 630 is formed over the transparent conductive layer 610 on the upper surface 601 and the lower surface 602. The metal layer 630 can be at least one layer of conductive metal, or a plurality of layers of conductive metal. The material of the conductive metal layer may be a copper alloy, Conductive metal or conductive alloy such as aluminum alloy, gold, silver, aluminum, copper or molybdenum. The structure of the multi-layer conductive metal layer may be, for example, a stacked structure of a molybdenum layer/aluminum layer/molybdenum layer, or may be a conductive metal or a conductive alloy selected from the group consisting of copper alloy, aluminum alloy, gold, silver, aluminum, copper, molybdenum, and the like. A multi-layer conductive metal layer structure stacked with a plurality of materials. Most of the conductive metal layers use physical vapor deposition (PVD) or chemical vapor deposition (CVD), and the deposition rate is fast and the process is stable. A first yellow light process is performed to pattern the metal layer 630 on the upper surface 601 and the lower surface 602. The first yellow light process includes forming a photoresist layer (not shown) on the metal layer 630 to pattern the photoresist layer, wherein the photoresist layer is made of a liquid photoresist or a dry film photoresist. Then, an etching step is performed to etch the metal layer 630 not protected by the photoresist layer, and the patterned photoresist layer is removed, and the upper terminal line 631 and the lower terminal line 632 are formed to be connected to the flexible circuit board (not shown), and may be formed. A plurality of conductive lines 633. A second yellow light process is then performed to pattern the transparent conductive layer 610. The second yellow light process includes forming a photoresist layer (not shown) over the transparent conductive layer 610 to pattern the photoresist layer, wherein the photoresist layer is made of a liquid photoresist or a dry film photoresist. Then performing an etching step of etching the transparent conductive layer 610 not protected by the photoresist layer, and removing the patterned photoresist layer to form a plurality of first sensing series 611 and a plurality of second sensing series 612, and having a transparent conductive layer 610 is below its terminal line 631 and lower terminal line 632. The plurality of first sensing series 611 respectively have a plurality of first sensing pads 6111 and a plurality of first connecting lines 6112. The plurality of first sensing pads 6111 are arranged in an array manner, and the plurality of first connecting lines 6112 are electrically connected in the first direction D1. Connecting the adjacent plurality of first sensing pads 6111, the plurality of second sensing series 612 respectively have a plurality of second sensing pads 6121 and a plurality of second connecting lines 6122, and the plurality of second sensing pads 6121 are arranged in an array manner, the plurality The second connecting line 6122 is electrically connected to the adjacent one in the second direction D2 The second sensing pad 6122 is numbered. The plurality of conductive lines 633 are respectively located above the plurality of first connecting lines 6112 and the plurality of second connecting lines 6122 for increasing the conductivity. The upper terminal line 631 is electrically connected to the plurality of first sensing series 611, and the lower terminal line 632 is electrically connected to the plurality of second sensing series 612. Then, the metal layer 530 on the plurality of first sensing series 511 and the plurality of second sensing series 512 is patterned to form a plurality of conductive lines 533 over the plurality of first connecting lines 5112 and the plurality of second connecting lines 5122.

雖然本發明已以實施例揭露如上，然其並非用以限定本發明。任何熟習此技藝者，在不脫離本發明之精神和範圍內，當可作些許之更動與潤飾，因此本發明之保護範圍當視申請專利範圍所界定者為準。 Although the present invention has been disclosed above by way of example, it is not intended to limit the invention. The scope of the present invention is defined by the scope of the claims, and the scope of the invention is intended to be limited by the scope of the invention.

D1‧‧‧第一方向 D1‧‧‧ first direction

D2‧‧‧第二方向 D2‧‧‧ second direction

30、40‧‧‧感測結構 30, 40‧‧‧ Sensing structure

300、500、600‧‧‧可撓式透明基材 300, 500, 600‧‧‧ flexible transparent substrate

301、401、501、601‧‧‧上表面 301, 401, 501, 601 ‧ ‧ upper surface

302、402、502、602‧‧‧下表面 302, 402, 502, 602‧‧‧ lower surface

303、503、603‧‧‧邊緣 Edge of 303, 503, 603‧‧

310、510、610‧‧‧透明導電層 310, 510, 610‧‧‧ transparent conductive layer

320‧‧‧光阻層 320‧‧‧ photoresist layer

330、530、630‧‧‧金屬層 330, 530, 630‧‧‧ metal layers

331、531、631‧‧‧上端子線路 331, 531, 631‧‧‧ upper terminal lines

332、532、632‧‧‧下端子線路 332, 532, 632‧‧‧ lower terminal lines

340‧‧‧透明導電層 340‧‧‧Transparent conductive layer

350、351‧‧‧黏著層 350, 351‧‧ ‧ adhesive layer

360‧‧‧硬質透明基板 360‧‧‧hard transparent substrate

311、511、611‧‧‧複數第一感測串列 311, 511, 611‧‧‧ plural first sensing series

3111、5111、6111‧‧‧複數第一感測墊 3111, 5111, 6111‧‧‧ plural first sensing pads

3112、5112、6112‧‧‧複數第一連接線 3112, 5112, 6112‧‧‧ plural first connection line

312、512、612‧‧‧複數第二感測串列 312, 512, 612‧‧‧ plural second sensing series

3121、5121、6121‧‧‧複數第二感測墊 3121, 5121, 6121‧‧‧ plural second sensing pads

3122、5122、6122‧‧‧複數第二橋接線 3122, 5122, 6122‧‧‧ plural second bridge wiring

370‧‧‧複數片狀感測基材 370‧‧‧Multiple sheet sensing substrates

490‧‧‧透明絕緣保護層 490‧‧‧Transparent insulating protective layer

491‧‧‧透明抗反射層 491‧‧‧Transparent anti-reflective layer

第1圖、第2a圖和2b圖所示為習知之投射電容式觸控面板 Figure 1, Figure 2a and Figure 2b show a conventional projected capacitive touch panel

第3a圖至第3b圖所示為本發明之一實施例之觸控面板之剖面圖 3a to 3b are cross-sectional views showing a touch panel according to an embodiment of the present invention;

第3c圖所示為本發明之一實施例之觸控面板之俯視圖 FIG. 3c is a top view of the touch panel according to an embodiment of the present invention;

第3d圖所示為本發明之一實施例之觸控面板之仰視圖 Figure 3d is a bottom view of a touch panel according to an embodiment of the present invention

第3e圖所示為本發明之一實施例之觸控面板之剖面圖 FIG. 3e is a cross-sectional view showing a touch panel according to an embodiment of the present invention;

第3f圖所示為本發明之一實施例之觸控面板之俯視圖 FIG. 3f is a top view of the touch panel according to an embodiment of the present invention;

第3g圖所示為本發明之一實施例之觸控面板之俯視圖 FIG. 3g is a top view of the touch panel according to an embodiment of the present invention;

第3h圖所示為本發明之一實施例之觸控面板之俯視圖 FIG. 3h is a top view of the touch panel according to an embodiment of the present invention;

第3i圖和第3j圖所示為本發明之一實施例之觸控面板之剖面圖 3i and 3j are cross-sectional views showing a touch panel according to an embodiment of the present invention.

第3k圖所示為本發明之一實施例之觸控面板之俯視圖 FIG. 3k is a top view of the touch panel according to an embodiment of the present invention;

第3l圖和第3n圖所示為本發明之一實施例之觸控面板之剖面圖 FIGS. 3l and 3n are cross-sectional views showing a touch panel according to an embodiment of the present invention.

第3o圖所示為本發明之一實施例之觸控面板之俯視圖 FIG. 3o is a top view of a touch panel according to an embodiment of the present invention;

第3p圖和第3q圖所示為本發明之一實施例之觸控面板之剖面圖 3p and 3q are cross-sectional views showing a touch panel according to an embodiment of the present invention.

第4圖所示為本發明之一實施例之觸控面板之剖面圖 4 is a cross-sectional view showing a touch panel according to an embodiment of the present invention.

第5a圖所示為本發明之一實施例之觸控面板之剖面圖 FIG. 5a is a cross-sectional view showing a touch panel according to an embodiment of the present invention;

第5b圖至第5e圖所示為本發明之一實施例之觸控面板之俯視圖 5b to 5e are top views of a touch panel according to an embodiment of the present invention;

第6a圖所示為本發明之一實施例之觸控面板之剖面圖 FIG. 6a is a cross-sectional view showing a touch panel according to an embodiment of the present invention;

第6b圖至第6e圖所示為本發明之一實施例之觸控面板之俯視圖 6b to 6e are top views of a touch panel according to an embodiment of the present invention;

D1‧‧‧第一方向 D1‧‧‧ first direction

D2‧‧‧第二方向 D2‧‧‧ second direction

30‧‧‧複數感測結構 30‧‧‧Multiple sensing structure

300‧‧‧可撓式透明基材 300‧‧‧Flexible transparent substrate

303‧‧‧邊緣 303‧‧‧ edge

311‧‧‧複數個第一感測串列 311‧‧‧Multiple first sensing series

3111‧‧‧複數第一感測墊 3111‧‧‧Multiple first sensing pads

3112‧‧‧複數第一連接線 3112‧‧‧ plural first connection line

312‧‧‧複數個第二感測串列 312‧‧‧Multiple second sensing series

3121‧‧‧複數第二感測墊 3121‧‧‧ plural second sensing pads

3122‧‧‧複數第二連接線 3122‧‧‧ plural second connection line

331‧‧‧上端子線路 331‧‧‧Upper terminal line

332‧‧‧下端子線路 332‧‧‧Lower terminal line

Claims

一種觸控面板的製造方法，包括：提供一可撓式透明基材，具有一上表面和一下表面，該上表面和該下表面相對設置，該上表面和該下表面分別具有一邊緣，該邊緣位於該上表面和該下表面一側；形成複數感測結構於該可撓式透明基材之該上表面和該下表面，包括：形成一透明導電層於該上表面和該下表面；圖案化位於該上表面和該下表面之該透明導電層，分別形成複數第一感測串列和複數第二感測串列，該些第一感測串列和該些第二感測串列相互交錯；形成至少一金屬層於該透明導電層；以及圖案化該金屬層，形成一端子線路，該端子線路設置於該邊緣以供連接一軟性電路板，該端子線路分別連接該些第一感測串列與該些第二感測串列。 A method of manufacturing a touch panel, comprising: providing a flexible transparent substrate having an upper surface and a lower surface, the upper surface and the lower surface being oppositely disposed, the upper surface and the lower surface respectively having an edge, The edge is located on the upper surface and the lower surface side; forming the plurality of sensing structures on the upper surface and the lower surface of the flexible transparent substrate, comprising: forming a transparent conductive layer on the upper surface and the lower surface; Patterning the transparent conductive layers on the upper surface and the lower surface to form a plurality of first sensing series and a plurality of second sensing series, the first sensing series and the second sensing strings The columns are interlaced; at least one metal layer is formed on the transparent conductive layer; and the metal layer is patterned to form a terminal line, the terminal line is disposed at the edge for connecting a flexible circuit board, and the terminal lines are respectively connected to the first A sensing series and the second sensing series.

一種觸控面板的製造方法，包括：提供一可撓式透明基材，具有一上表面和一下表面，該上表面和該下表面相對設置，該上表面和該下表面分別具有一邊緣，該邊緣位於該上表面和該下表面一側；形成複數感測結構於該可撓式透明基材之該上表面和該下表面，包括：形成一透明導電層於該上表面和該下表面；形成至少一金屬層於該透明導電層；圖案化位於該上表面和該下表面之該透明導電層和該金屬層，分別形成具有該金屬層於其上之複數第一感測串列、具有金屬層於其上之複數第二感測串列和一端子線路，該些第一感測串列和該些第二感測串列相互交錯，該端子線路設置於該邊緣以供連接一軟性電路板，該端子線路分別連接該些第一感測串列與該些第二感測串列；以及圖案化位於該些第一感測串列和該些第二感測串列上之該金屬層。 A method of manufacturing a touch panel, comprising: providing a flexible transparent substrate having an upper surface and a lower surface, the upper surface and the lower surface being oppositely disposed, the upper surface and the lower surface respectively having an edge, The edge is located on the upper surface and the lower surface side; forming the plurality of sensing structures on the upper surface and the lower surface of the flexible transparent substrate, comprising: forming a transparent conductive layer on the upper surface and the lower surface; Forming at least one metal layer on the transparent conductive layer; patterning the transparent conductive layer and the metal layer on the upper surface and the lower surface to form a plurality of first sensing series having the metal layer thereon, respectively a plurality of second sensing series and a terminal line on the metal layer, the first sensing series and the second sensing series are interlaced, and the terminal line is disposed at the edge for connecting a soft a circuit board, the terminal lines are respectively connected to the first sensing series and the second sensing series; and the patterning is located in the first sensing series and the Some of the second senses the metal layer on the string.

一種觸控面板的製造方法，包括：提供一可撓式透明基材，具有一上表面和一下表面，該上表面和該下表面相對設置，該上表面和該下表面分別具有一邊緣，該邊緣位於該上表面和該下表面一側；形成複數感測結構於該可撓式透明基材之該上表面和該下表面，包括：形成一透明導電層於該上表面和該下表面；形成至少一金屬層於該透明導電層；圖案化位於該上表面和該下表面之該金屬層，形成一端子線路，該端子線路設置於該邊緣以供連接一軟性電路板；以及圖案化位於該上表面和該下表面之該透明導電層，分別形成複數第一感測串列和複數第二感測串列，該些第一感測串列和該些第二感測串列相互交錯，該端子線路分別連接該些第一感測串列與該些第二感測串列。 A method of manufacturing a touch panel, comprising: providing a flexible transparent substrate having an upper surface and a lower surface, the upper surface and the lower surface being oppositely disposed, the upper surface and the lower surface respectively having an edge, The edge is located on the upper surface and the lower surface side; forming the plurality of sensing structures on the upper surface and the lower surface of the flexible transparent substrate, comprising: forming a transparent conductive layer on the upper surface and the lower surface; Forming at least one metal layer on the transparent conductive layer; patterning the metal layer on the upper surface and the lower surface to form a terminal line, the terminal line is disposed at the edge for connecting a flexible circuit board; and the patterning is located The transparent conductive layer of the upper surface and the lower surface respectively form a plurality of first sensing series and a plurality of second sensing series, and the first sensing series and the second sensing series are interlaced The terminal lines are respectively connected to the first sensing series and the second sensing series.

如申請專利範圍第1項、第2項或第3項之觸控面板的製造方法，其中該些第一感測串列分別具有複數第一感測墊和複數第一連接線，該些第一感測墊以陣列方式排列，該些第一連接線於一第一方向電性連接相鄰之該些第一感測墊，該些第二感測串列分別具有複數第二感測墊和複數第二連接線，該些第二感測墊以陣列方式排列，該些第二連接線於一第二方向電性連接相鄰之該些第二感測墊，該些第一感測墊和該些第二感測墊相互交錯。 The method for manufacturing a touch panel according to the first, second or third aspect of the invention, wherein the first sensing series respectively have a plurality of first sensing pads and a plurality of first connecting lines, the first The first sensing lines are electrically connected to the adjacent first sensing pads in a first direction, and the second sensing series respectively have a plurality of second sensing pads. And the plurality of second connecting lines, the second sensing pads are arranged in an array, and the second connecting wires are electrically connected to the adjacent second sensing pads in a second direction, the first sensing The pad and the second sensing pads are interlaced.

如申請專利範圍第4項之觸控面板的製造方法，其中圖案化該金屬層更包括形成複數導電線於該些第一連接線和該些第二連接線之上。 The method of manufacturing the touch panel of claim 4, wherein the patterning the metal layer further comprises forming a plurality of conductive lines over the first connection lines and the second connection lines.

如申請專利範圍第5項之觸控面板的製造方法，其中形成該金屬層於該透明導電層上之後，更包括：形成一抗反射層於該金屬層之上；以及圖案化該抗反射層和該金屬層，形成具有該抗反射層之複數第一橋接線、複數第二橋接線和該端子線路。 The method for manufacturing a touch panel according to claim 5, wherein the metal layer is formed on the transparent guide After the electrical layer, the method further includes: forming an anti-reflection layer on the metal layer; and patterning the anti-reflection layer and the metal layer to form a plurality of first bridge lines and a plurality of second bridge lines having the anti-reflection layer And the terminal line.

如申請專利範圍第6項之觸控面板的製造方法，更包括熱壓一軟性電路板於位在該端子線路之該抗反射層之上。 The method for manufacturing a touch panel according to claim 6 further includes: hot pressing a flexible circuit board on the anti-reflection layer of the terminal line.

如申請專利範圍第1項、第2項或第3項之觸控面板的製造方法，於形成該些感測結構於該可撓式透明基材之該上表面和該下表面後更包括：形成一黏著層於該些感測結構之上；以及裁切覆蓋有該黏著層於該些感測結構之上之該可撓式透明基材，形成複數片狀感測基材。 The method for manufacturing a touch panel according to the first, second or third aspect of the patent application, after forming the sensing structures on the upper surface and the lower surface of the flexible transparent substrate, further comprising: Forming an adhesive layer on the sensing structures; and cutting the flexible transparent substrate covered with the adhesive layer over the sensing structures to form a plurality of sheet sensing substrates.

如申請專利範圍第8項之觸控面板的製造方法，形成複數片狀感測基材之後更包括以該黏著層黏著一硬質透明基板於每一片狀感測基材。 The method for manufacturing a touch panel according to claim 8 , after forming the plurality of sheet-shaped sensing substrates, further comprising bonding a rigid transparent substrate to each of the sheet-shaped sensing substrates with the adhesive layer.

如申請專利範圍第8項之觸控面板的製造方法，更包括形成一具有黏著層之透明導電層於該些感測結構之上。 The method for manufacturing a touch panel according to claim 8 further includes forming a transparent conductive layer having an adhesive layer on the sensing structures.

如申請專利範圍第1項、第2項或第3項之觸控面板的製造方法，於形成該些感測結構於該可撓式透明基材之該上表面和該下表面後更包括形成一透明絕緣保護層於該些感測結構之上。 The method for manufacturing a touch panel according to the first, second or third aspect of the patent application, further comprising forming the sensing structures on the upper surface and the lower surface of the flexible transparent substrate. A transparent insulating protective layer is over the sensing structures.

如申請專利範圍第11項之觸控面板的製造方法，更包括形成一透明抗反射層於該透明絕緣保護層之上。 The method for manufacturing a touch panel of claim 11, further comprising forming a transparent anti-reflective layer on the transparent insulating protective layer.