TW201518391A - 硬化性樹脂組成物、粉體成形用硬化性樹脂組成物、及光半導體裝置 - Google Patents

硬化性樹脂組成物、粉體成形用硬化性樹脂組成物、及光半導體裝置 Download PDF

Info

Publication number
TW201518391A
TW201518391A TW103129788A TW103129788A TW201518391A TW 201518391 A TW201518391 A TW 201518391A TW 103129788 A TW103129788 A TW 103129788A TW 103129788 A TW103129788 A TW 103129788A TW 201518391 A TW201518391 A TW 201518391A
Authority
TW
Taiwan
Prior art keywords
group
resin composition
curable resin
epoxy
formula
Prior art date
Application number
TW103129788A
Other languages
English (en)
Chinese (zh)
Inventor
Tsukasa Yoshida
Original Assignee
Daicel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Daicel Corp filed Critical Daicel Corp
Publication of TW201518391A publication Critical patent/TW201518391A/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2237—Oxides; Hydroxides of metals of titanium
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/642—Heat extraction or cooling elements characterized by the shape

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
TW103129788A 2013-08-30 2014-08-29 硬化性樹脂組成物、粉體成形用硬化性樹脂組成物、及光半導體裝置 TW201518391A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013180511 2013-08-30

Publications (1)

Publication Number Publication Date
TW201518391A true TW201518391A (zh) 2015-05-16

Family

ID=52586638

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103129788A TW201518391A (zh) 2013-08-30 2014-08-29 硬化性樹脂組成物、粉體成形用硬化性樹脂組成物、及光半導體裝置

Country Status (2)

Country Link
TW (1) TW201518391A (ja)
WO (1) WO2015030089A1 (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2017131152A1 (ja) * 2016-01-27 2018-11-29 クラスターテクノロジー株式会社 白色リフレクター用硬化性エポキシ樹脂組成物及びその硬化物、光半導体素子搭載用基板、並びに光半導体装置
JPWO2017138268A1 (ja) * 2016-02-12 2018-12-13 株式会社ダイセル 半導体封止用硬化性樹脂組成物、その硬化物、及び半導体装置
JP2021178941A (ja) * 2020-05-15 2021-11-18 株式会社ダイセル 新規エポキシ樹脂及びエポキシ樹脂組成物

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5060707B2 (ja) * 2004-11-10 2012-10-31 日立化成工業株式会社 光反射用熱硬化性樹脂組成物
JP5303097B2 (ja) * 2005-10-07 2013-10-02 日立化成株式会社 熱硬化性光反射用樹脂組成物、ならびにこれを用いた光半導体搭載用基板とその製造方法および光半導体装置。
WO2013008680A1 (ja) * 2011-07-13 2013-01-17 株式会社ダイセル 硬化性エポキシ樹脂組成物

Also Published As

Publication number Publication date
WO2015030089A1 (ja) 2015-03-05

Similar Documents

Publication Publication Date Title
US8853734B2 (en) Curable epoxy resin composition
US9184355B2 (en) Curable resin composition for reflection of light, and optical semiconductor device
JP2014156591A (ja) 熱硬化性樹脂組成物及びその硬化物、光半導体素子搭載用基板、並びに光半導体装置
EP2647667A1 (en) Curable epoxy resin composition
CN113728031B (zh) 脂环式环氧化合物制品
KR20130118298A (ko) 경화물의 제조 방법 및 경화물
JP2016108499A (ja) 硬化性エポキシ樹脂組成物及びその硬化物、光半導体素子搭載用基板、並びに光半導体装置
JP6174836B2 (ja) 白色リフレクター成型用硬化性エポキシ樹脂組成物及びその硬化物、光半導体素子搭載用基板、並びに光半導体装置
TW201446826A (zh) 硬化性環氧樹脂組成物及其硬化物、二烯烴化合物及其製造方法以及二環氧化合物之製造方法
TW201518391A (zh) 硬化性樹脂組成物、粉體成形用硬化性樹脂組成物、及光半導體裝置
WO2016017531A1 (ja) 硬化性樹脂組成物及びその硬化物、光半導体素子搭載用基板、並びに光半導体装置
JP2018119032A (ja) 光反射用硬化性樹脂組成物及びその硬化物、並びに光半導体装置
TW201833167A (zh) 光反射用硬化性樹脂組成物及其硬化物，以及光半導體裝置
WO2017138487A1 (ja) 白色リフレクター用硬化性エポキシ樹脂組成物及びその硬化物、光半導体素子搭載用基板、光半導体装置、並びに製造方法
WO2017131152A1 (ja) 白色リフレクター用硬化性エポキシ樹脂組成物及びその硬化物、光半導体素子搭載用基板、並びに光半導体装置
WO2017138491A1 (ja) 光反射用硬化性樹脂組成物及びその硬化物、並びに光半導体装置
JP2017137408A (ja) 白色リフレクター用硬化性エポキシ樹脂組成物及びその硬化物、光半導体素子搭載用基板、並びに光半導体装置
JP2015189932A (ja) 熱硬化性樹脂組成物及びその硬化物、光半導体素子搭載用基板、並びに光半導体装置
JP2016222865A (ja) 白色リフレクター用硬化性エポキシ樹脂組成物及びその硬化物、光半導体素子搭載用基板、並びに光半導体装置
JP2016210897A (ja) 白色リフレクター用硬化性エポキシ樹脂組成物及びその硬化物、光半導体素子搭載用基板、並びに光半導体装置
WO2017138490A1 (ja) 光反射用硬化性樹脂組成物及びその硬化物、並びに光半導体装置
JP2016210896A (ja) 白色リフレクター用硬化性エポキシ樹脂組成物及びその硬化物、光半導体素子搭載用基板、並びに光半導体装置
JP2016222866A (ja) 白色リフレクター用硬化性エポキシ樹脂組成物及びその硬化物、光半導体素子搭載用基板、並びに光半導体装置
TW201542673A (zh) 熱硬化性樹脂組成物及其硬化物、光半導體元件搭載用基板、以及光半導體裝置
JP2017155145A (ja) 光学材料用硬化性エポキシ樹脂組成物