TW201518229A - Glass film manufacturing method, and glass film peeling method - Google Patents
Glass film manufacturing method, and glass film peeling method Download PDFInfo
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- TW201518229A TW201518229A TW103125294A TW103125294A TW201518229A TW 201518229 A TW201518229 A TW 201518229A TW 103125294 A TW103125294 A TW 103125294A TW 103125294 A TW103125294 A TW 103125294A TW 201518229 A TW201518229 A TW 201518229A
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- 239000011521 glass Substances 0.000 title claims abstract description 625
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 86
- 238000000034 method Methods 0.000 title claims abstract description 38
- 239000012530 fluid Substances 0.000 claims abstract description 65
- 239000000758 substrate Substances 0.000 claims description 31
- 238000010438 heat treatment Methods 0.000 claims description 25
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 22
- 238000012545 processing Methods 0.000 claims description 18
- 238000010030 laminating Methods 0.000 claims description 5
- 230000008569 process Effects 0.000 abstract description 9
- 238000005520 cutting process Methods 0.000 abstract description 5
- 238000007599 discharging Methods 0.000 abstract description 3
- 239000010408 film Substances 0.000 description 377
- 230000007246 mechanism Effects 0.000 description 21
- 238000003825 pressing Methods 0.000 description 16
- 239000010410 layer Substances 0.000 description 15
- 239000006059 cover glass Substances 0.000 description 13
- 239000002585 base Substances 0.000 description 11
- 230000003746 surface roughness Effects 0.000 description 9
- 238000007667 floating Methods 0.000 description 8
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 6
- 239000007789 gas Substances 0.000 description 6
- 239000003513 alkali Substances 0.000 description 5
- 230000008859 change Effects 0.000 description 5
- 238000006460 hydrolysis reaction Methods 0.000 description 5
- 239000005340 laminated glass Substances 0.000 description 5
- 239000007788 liquid Substances 0.000 description 5
- 239000000203 mixture Substances 0.000 description 5
- 239000001257 hydrogen Substances 0.000 description 4
- 229910052739 hydrogen Inorganic materials 0.000 description 4
- 238000007500 overflow downdraw method Methods 0.000 description 4
- 229910008051 Si-OH Inorganic materials 0.000 description 3
- 229910006358 Si—OH Inorganic materials 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 210000003323 beak Anatomy 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000007664 blowing Methods 0.000 description 3
- 239000005388 borosilicate glass Substances 0.000 description 3
- 238000006297 dehydration reaction Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000003780 insertion Methods 0.000 description 3
- 230000037431 insertion Effects 0.000 description 3
- 239000004973 liquid crystal related substance Substances 0.000 description 3
- 239000012528 membrane Substances 0.000 description 3
- 238000001179 sorption measurement Methods 0.000 description 3
- 125000006850 spacer group Chemical group 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- 239000011787 zinc oxide Substances 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 238000005336 cracking Methods 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 229910052733 gallium Inorganic materials 0.000 description 2
- 229910052738 indium Inorganic materials 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- 230000002265 prevention Effects 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000005368 silicate glass Substances 0.000 description 2
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Inorganic materials [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- 229910021193 La 2 O 3 Inorganic materials 0.000 description 1
- HBBGRARXTFLTSG-UHFFFAOYSA-N Lithium ion Chemical compound [Li+] HBBGRARXTFLTSG-UHFFFAOYSA-N 0.000 description 1
- 229910017493 Nd 2 O 3 Inorganic materials 0.000 description 1
- 229910018557 Si O Inorganic materials 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 229910002808 Si–O–Si Inorganic materials 0.000 description 1
- -1 Ta 2 O 5 Inorganic materials 0.000 description 1
- 229910010413 TiO 2 Inorganic materials 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 229910000272 alkali metal oxide Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 238000004873 anchoring Methods 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 125000004429 atom Chemical group 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 150000001768 cations Chemical class 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- DQUIAMCJEJUUJC-UHFFFAOYSA-N dibismuth;dioxido(oxo)silane Chemical compound [Bi+3].[Bi+3].[O-][Si]([O-])=O.[O-][Si]([O-])=O.[O-][Si]([O-])=O DQUIAMCJEJUUJC-UHFFFAOYSA-N 0.000 description 1
- 238000003280 down draw process Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 230000003631 expected effect Effects 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 230000005525 hole transport Effects 0.000 description 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 229910001416 lithium ion Inorganic materials 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- 238000005496 tempering Methods 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/10—Removing layers, or parts of layers, mechanically or chemically
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/06—Interconnection of layers permitting easy separation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H29/00—Delivering or advancing articles from machines; Advancing articles to or into piles
- B65H29/54—Article strippers, e.g. for stripping from advancing elements
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B2037/0092—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding in which absence of adhesives is explicitly presented as an advantage
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/538—Roughness
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
- B32B2309/60—In a particular environment
- B32B2309/68—Vacuum
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2315/00—Other materials containing non-metallic inorganic compounds not provided for in groups B32B2311/00 - B32B2313/04
- B32B2315/08—Glass
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/0007—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding involving treatment or provisions in order to avoid deformation or air inclusion, e.g. to improve surface quality
- B32B37/003—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding involving treatment or provisions in order to avoid deformation or air inclusion, e.g. to improve surface quality to avoid air inclusion
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H2301/00—Handling processes for sheets or webs
- B65H2301/40—Type of handling process
- B65H2301/44—Moving, forwarding, guiding material
- B65H2301/446—Assisting moving, forwarding or guiding of material
- B65H2301/4461—Assisting moving, forwarding or guiding of material by blowing air towards handled material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H2406/00—Means using fluid
- B65H2406/10—Means using fluid made only for exhausting gaseous medium
- B65H2406/12—Means using fluid made only for exhausting gaseous medium producing gas blast
- B65H2406/122—Nozzles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H2601/00—Problem to be solved or advantage achieved
- B65H2601/20—Avoiding or preventing undesirable effects
- B65H2601/25—Damages to handled material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H2801/00—Application field
- B65H2801/61—Display device manufacture, e.g. liquid crystal displays
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/841—Self-supporting sealing arrangements
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Joining Of Glass To Other Materials (AREA)
- Laminated Bodies (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
Description
本發明係關於玻璃膜之製造方法以及玻璃膜之剝離方法，詳而言之是關於，在製造電子裝置等時所使用之玻璃膜積層體中，用來從支承玻璃將玻璃膜剝離的技術。 The present invention relates to a method for producing a glass film and a method for peeling a glass film, and more particularly to a technique for peeling a glass film from a supporting glass in a glass film laminate used in the production of an electronic device or the like.
基於節省空間的觀點，取代從前普及的CRT型顯示器，近年來液晶顯示器、電漿顯示器、有機EL顯示器等的平面顯示器變得普及。 From the viewpoint of space saving, in place of the conventional CRT type display, in recent years, flat panel displays such as liquid crystal displays, plasma displays, and organic EL displays have become popular.
而且，在這些平面顯示器中，有更加的薄型化的需求。 Moreover, in these flat panel displays, there is a need for more thinning.
特別是有機EL顯示器，係具有可彎曲、可捲繞的特性，其容易搬運，不僅是平面，也能使用於曲面，因此被期待能活用於各種用途。 In particular, the organic EL display has the characteristics of being bendable and windable, and is easy to handle, and is not only a flat surface but also a curved surface, and therefore it is expected to be used for various purposes.
此外，被期待不僅是平面、也能使用於曲面的並不限於顯示器，例如如果能在汽車的車體表面、建築物的屋頂、柱、外壁等之具有曲面的物體之表面形成太陽電池、有機EL照明的話，其用途更廣。 Further, it is expected that not only a flat surface but also a curved surface can be used for a display, for example, if a solar cell or an organic body can be formed on the surface of a vehicle body surface, a roof of a building, a column, an outer wall, or the like having a curved surface. EL lighting is more versatile.
因此近年來，這些裝置所使用的基板、覆蓋玻璃，可實現更加薄化及高可撓性的需求變高。 Therefore, in recent years, the substrate and the cover glass used in these devices have become more demanding for thinner and higher flexibility.
有機EL顯示器所使用的發光體，會與氧、水蒸氣等的氣體反應而產生劣化。因此，有機EL顯示器所使用的基板要求高的氣體阻隔性，所以主要是採用玻璃基板。 The illuminant used in the organic EL display reacts with gases such as oxygen and water vapor to cause deterioration. Therefore, the substrate used in the organic EL display requires high gas barrier properties, so that a glass substrate is mainly used.
然而，玻璃基板不同於樹脂膜，其可撓性低，藉由將玻璃基板彎曲而在玻璃基板表面產生的拉伸應力超過破壞應力會導致破損，因此在要求可撓性的用途要採用玻璃基板是困難。 However, the glass substrate is different from the resin film, and its flexibility is low. When the glass substrate is bent, the tensile stress generated on the surface of the glass substrate exceeds the breaking stress, which causes breakage. Therefore, a glass substrate is used for applications requiring flexibility. It is difficult.
為了對玻璃基板賦予可撓性，使玻璃基板薄化是有效的。 In order to impart flexibility to the glass substrate, it is effective to thin the glass substrate.
下述專利文獻1提出厚度200μm以下的玻璃膜，該極薄的玻璃膜，備具有例如可使用於有機EL顯示器的程度之可撓性。 Patent Document 1 listed below proposes a glass film having a thickness of 200 μm or less, which has a flexibility such as that which can be used for an organic EL display.
平面顯示器、太陽電池等的電子裝置所使用之玻璃基板，被實施加工處理、洗淨處理等各種電子裝置製造相關的處理(以下稱為電子裝置製造相關處理)。 A glass substrate used in an electronic device such as a flat panel display or a solar cell is subjected to processing related to the manufacture of various electronic devices such as processing and cleaning (hereinafter referred to as processing related to electronic device manufacturing).
然而，若將這些電子裝置所使用的玻璃基板予以薄化，由於厚度200μm以下的玻璃膜具有可撓性，在進行處理時的定位變困難，在圖案化時會產生偏差等而存在問題。此外，若因變形而對局部施加大的應力，由於玻璃屬於脆性材料而會導致破損，在進行上述各種電子裝置製造相關處理時，存在非常難以操作的問題。 However, when the glass substrate used for these electronic devices is thinned, the glass film having a thickness of 200 μm or less has flexibility, and positioning at the time of processing becomes difficult, and there is a problem in that variations occur during patterning. Further, if a large stress is locally applied to the deformation due to the deformation, the glass is a brittle material, which causes breakage, and there is a problem that it is extremely difficult to handle when performing various processes related to the manufacture of electronic devices described above.
為了提高玻璃膜的操作性，在下述專利文獻2提出，在支承玻璃上積層玻璃膜而成之玻璃膜積層體。 In order to improve the handleability of the glass film, Patent Document 2 listed below proposes a glass film laminate in which a glass film is laminated on a supporting glass.
如此，縱使是採用其單獨為低剛性的玻璃膜，由於支承玻璃的剛性高，在處理時成為玻璃膜積層體整體而使定位變容易。 In this way, even if the glass film which is low in rigidity alone is used, since the rigidity of the supporting glass is high, the entire glass film layer is formed during processing, and positioning is facilitated.
而且，在處理結束後，藉由將玻璃膜從支承玻璃剝離，可獲得實施電子裝置製造相關處理後的玻璃膜(亦即電子裝置)。 Further, after the treatment is completed, the glass film (that is, the electronic device) subjected to the processing related to the manufacture of the electronic device can be obtained by peeling the glass film from the supporting glass.
又在此情況，如果玻璃膜積層體的厚度與習知玻璃基板的厚度相同的話，可共用習知玻璃基板用的電子裝置製造線來製造電子裝置。 In this case, if the thickness of the glass film laminate is the same as the thickness of a conventional glass substrate, the electronic device manufacturing line for a conventional glass substrate can be used to manufacture an electronic device.
另一方面，在前述各種電子裝置製造相關處理中，是包含透明導電膜的成膜處理、封裝處理等之伴隨有加熱的處理。 On the other hand, in the above-described various electronic device manufacturing related processes, the film forming process including the transparent conductive film, the encapsulation process, and the like are accompanied by heating.
在進行伴隨有加熱的處理的情況，由於直接積層之支承玻璃和玻璃膜的固著力增加，特別會發生從支承玻璃要將玻璃膜剝離變困難的問題。 In the case where the treatment with heating is performed, since the anchoring force of the directly laminated support glass and the glass film increases, the problem that the glass film is peeled off from the support glass is particularly difficult.
為了解決此問題，在下述專利文獻3提出一種玻璃膜積層體，是在玻璃膜的接觸面和支承玻璃的接觸面當中的至少一方設有：表面粗糙度相對大的區域和相對小的區域。 In order to solve this problem, Patent Document 3 listed below proposes a glass film laminate in which at least one of a contact surface of a glass film and a contact surface of a supporting glass is provided with a region having a relatively large surface roughness and a relatively small region.
此外，在下述專利文獻4提出一種玻璃膜積層體，是將支承玻璃以超出玻璃膜的方式進行積層，在支承玻璃以與支承玻璃的端邊隔著間隔的方式設有剝離開始部，該剝 離開始部是用來使玻璃膜之至少一角落部從支承玻璃露出。 In addition, in the following Patent Document 4, a glass film laminate is provided in which the support glass is laminated so as to extend beyond the glass film, and the support glass is provided with a peeling start portion so as to be spaced apart from the end of the support glass. The starting portion is for exposing at least one corner portion of the glass film from the supporting glass.
再者，在下述專利文獻5提出一種玻璃膜積層體，是將支承玻璃以超出玻璃膜的方式進行積層，在支承玻璃的端邊設有減薄部，使玻璃膜之端邊的至少一部分，在減薄部上與支承玻璃隔著間隔。 Further, Patent Document 5 listed below proposes a glass film laminate in which a support glass is laminated so as to extend beyond the glass film, and a thinned portion is provided at an end of the support glass to at least a part of an end side of the glass film. The thinned portion is spaced apart from the support glass.
而且，上述專利文獻3~專利文獻5之玻璃膜積層體，縱使對玻璃膜積層體進行伴隨有加熱之電子裝置製造相關處理，在電子裝置製造相關處理後仍能從支承玻璃將玻璃膜剝離。 In addition, in the glass film laminate of Patent Document 3 to Patent Document 5, even if the glass film laminate is subjected to processing related to the manufacture of an electronic device with heating, the glass film can be peeled off from the supporting glass after the electronic device manufacturing process.
專利文獻1：日本特開2010-132531號公報 Patent Document 1: Japanese Laid-Open Patent Publication No. 2010-132531
專利文獻2：國際公開第2011/048979號 Patent Document 2: International Publication No. 2011/048979
專利文獻3：日本特開2011-162432號公報 Patent Document 3: Japanese Laid-Open Patent Publication No. 2011-162432
專利文獻4：日本特開2012-30404號公報 Patent Document 4: Japanese Laid-Open Patent Publication No. 2012-30404
專利文獻5：日本特開2012-131664號公報 Patent Document 5: Japanese Laid-Open Patent Publication No. 2012-131664
然而，縱使是採用專利文獻3~專利文獻5之玻璃膜積層體的情況，由於玻璃膜和支承玻璃之固著力強，剝離作為費時，又依施力程度，剝離時可能發生玻璃膜破損的情況。 However, even in the case of using the glass film laminate of Patent Document 3 to Patent Document 5, since the adhesion between the glass film and the supporting glass is strong, the peeling is time-consuming, and depending on the degree of application, the glass film may be broken during peeling. .
因此，為了謀求玻璃膜之剝離作業的效率化以及改善 良率，期望能開發出能從玻璃膜積層體將支承玻璃和玻璃膜在短時間內毫無破損地予以剝離的技術。 Therefore, in order to improve the efficiency and improvement of the peeling operation of the glass film In the yield, it is desired to develop a technique capable of peeling off the supporting glass and the glass film from the glass film laminate without any damage in a short time.
本發明是為了解決上述習知技術的問題點而開發完成的，其目的是為了提供：能從支承玻璃將玻璃膜在短時間內毫無破損地予以剝離的玻璃膜之製造方法以及玻璃膜之剝離方法。 The present invention has been made in order to solve the problems of the above-described conventional techniques, and an object thereof is to provide a method for producing a glass film which can peel a glass film from a supporting glass without being damaged in a short time, and a glass film. Stripping method.
本發明所欲解決的課題如以上所敘述，接著說明用來解決此課題的手段。 The problem to be solved by the present invention is as described above, and the means for solving the problem will be described next.
亦即，本申請的第1發明，是一種玻璃膜之製造方法，係具備：第1步驟，將作為電子裝置製造相關處理前的玻璃膜之玻璃膜基材和支承玻璃予以積層而製作玻璃膜積層體；第2步驟，對前述玻璃膜積層體中的前述玻璃膜基材進行電子裝置製造相關處理；以及第3步驟，將前述電子裝置製造相關處理後之前述玻璃膜積層體分離成對前述玻璃膜基材實施前述電子裝置製造相關處理所獲得之玻璃膜和前述支承玻璃；其特徵在於，在前述第3步驟中，是使用具有形成為直線狀的刃部且構成為可從形成於該刃部之噴出口噴出流體之楔體，在前述玻璃膜積層體之前述玻璃膜和前述支承玻璃的界面，從前述刃部側將前述楔體***，然後，一邊從前述噴出口噴出流體，一邊以使前述刃部朝前述界面之未剝離部側移位的方式改變前述玻璃膜積層體和前述楔體的相對位置，而從前述支承玻璃 將前述玻璃膜剝離。 In the first aspect of the invention, the glass film substrate and the supporting glass are laminated to form a glass film. a second step of performing an electronic device manufacturing process on the glass film substrate in the glass film laminate; and a third step of separating the glass film laminate after the electronic device manufacturing process The glass film substrate is subjected to the glass film obtained by the above-described processing for manufacturing an electronic device, and the support glass. The third step is to use a blade portion formed in a linear shape and configured to be formed from the blade film. The wedge of the fluid is ejected from the discharge port of the blade, and the wedge is inserted from the blade side at the interface between the glass film and the support glass of the glass film layer, and then the fluid is discharged from the discharge port. Changing the relative positions of the glass film laminate and the wedge in such a manner that the blade portion is displaced toward the unpeeled portion side of the interface, From the supporting glass The aforementioned glass film was peeled off.
本申請的第2發明，前述流體為空氣。 According to a second aspect of the invention, the fluid is air.
本申請的第3發明，前述流體含有水。 According to a third aspect of the invention, the fluid contains water.
又在此所指的「水」，也包含水蒸氣(以下相同)。 The "water" referred to here also includes water vapor (the same applies hereinafter).
本申請的第4發明，前述電子裝置製造相關處理是伴隨對前述玻璃膜基材的加熱。 According to a fourth aspect of the invention, the electronic device manufacturing process is accompanied by heating of the glass film substrate.
本申請的第5發明，前述玻璃膜基材的厚度為0.2mm以下。 According to a fifth aspect of the invention, the glass film substrate has a thickness of 0.2 mm or less.
本申請的第6發明、前述楔體的厚度為3.0mm以下。 The sixth invention of the present application The thickness of the wedge body is 3.0 mm or less.
本申請的第7發明，前述楔體之刃部的角度為5度以下。 According to a seventh aspect of the invention, the angle of the blade portion of the wedge body is 5 degrees or less.
本申請的第8發明，是一種玻璃膜之剝離方法，是從將玻璃膜和支承玻璃積層所製作成之玻璃膜積層體將前述玻璃膜剝離的玻璃膜之剝離方法，其特徵在於， 使用具有形成為直線狀的刃部且構成為可從形成於該刃部之噴出口噴出流體之楔體，在前述玻璃膜積層體之前述玻璃膜和前述支承玻璃的界面，從前述刃部側將前述楔體***，然後，一邊從前述噴出口噴出流體，一邊以使前述刃部朝前述界面之未剝離部側移位的方式改變前述玻璃膜積層體和前述楔體的相對位置，而從前述支承玻璃將前述玻璃膜剝離。 The eighth invention of the present invention is a method for peeling off a glass film from a glass film laminate formed by laminating a glass film and a supporting glass, and is characterized in that the glass film is peeled off from the glass film. a wedge having a blade portion formed in a linear shape and capable of ejecting a fluid from a discharge port formed in the blade portion, and an interface between the glass film and the support glass of the glass film laminate is from the blade side Inserting the wedge body, and then changing the relative position of the glass film layered body and the wedge body so that the blade portion is displaced toward the unpeeled portion side of the interface while discharging the fluid from the discharge port. The support glass peels off the glass film.
本發明可發揮以下所示的效果。 The present invention can exert the effects shown below.
依據本申請的第1發明，藉由在玻璃膜及支承玻璃和楔體之間形成流體層，使玻璃膜以及支承玻璃不與楔體接觸而防止玻璃膜的破損，並利用流體讓均一壓力作用於界面，藉此能在短時間內效率良好地從支承玻璃將玻璃膜剝離。 According to the first invention of the present application, by forming a fluid layer between the glass film and the supporting glass and the wedge body, the glass film and the supporting glass are prevented from coming into contact with the wedge body to prevent breakage of the glass film, and the fluid is used to impart uniform pressure. At the interface, the glass film can be peeled off efficiently from the supporting glass in a short time.
依據本申請的第2發明，由於流體為空氣，可防止流體碰撞界面時的力量過高，能確實地防止玻璃膜及支承玻璃的破損。 According to the second aspect of the invention, since the fluid is air, the force at the time of collision of the fluid against the interface can be prevented from being excessively high, and the damage of the glass film and the supporting glass can be reliably prevented.
依據本申請的第3發明，藉由流體所含的水分，可促進水解反應，使玻璃膜和支承玻璃間的固著力減弱，而從支承玻璃將玻璃膜在短時間內效率良好地剝離。 According to the third aspect of the present invention, the hydrolysis reaction can be promoted by the moisture contained in the fluid, and the fixing force between the glass film and the supporting glass can be weakened, and the glass film can be efficiently peeled off from the supporting glass in a short time.
依據本申請的第4發明，縱使其對象的玻璃膜積層體，是藉由伴隨有加熱之電子裝置製造相關處理而使玻璃膜和支承玻璃的固著力增大的情況，仍能防止玻璃膜的破損，並在短時間內效率良好地將玻璃膜剝離。 According to the fourth aspect of the present invention, the glass film layered body of the present invention can prevent the adhesion of the glass film and the supporting glass by the process of manufacturing the electronic device with heating, and the glass film can be prevented. It is broken and the glass film is peeled off efficiently in a short time.
依據本申請的第5發明，縱使是厚度極小的玻璃膜，仍能毫無破損地進行剝離。 According to the fifth invention of the present application, even if the glass film has an extremely small thickness, peeling can be performed without damage.
依據本申請的第6發明，藉由將楔體的厚度減小，可抑制剝離時之玻璃膜的上浮，減少剝離時對玻璃膜造成的損傷，藉此確實地防止玻璃膜的破損。 According to the sixth invention of the present application, by reducing the thickness of the wedge body, it is possible to suppress the floating of the glass film at the time of peeling and to reduce damage to the glass film during peeling, thereby reliably preventing breakage of the glass film.
依據本申請的第7發明，藉由將楔體之刃部的角度減小，可抑制剝離時之玻璃膜的曲率及曲率變化，減少剝離時對玻璃膜造成的損傷，藉此確實地防止玻璃膜 的破損。 According to the seventh aspect of the present invention, by reducing the angle of the blade portion of the wedge, it is possible to suppress the change in the curvature and curvature of the glass film during peeling, and to reduce damage to the glass film during peeling, thereby reliably preventing the glass from being damaged. membrane Broken.
依據本申請的第8發明，藉由在玻璃膜及支承玻璃和楔體之間形成流體層，使玻璃膜以及支承玻璃不與楔體接觸而防止玻璃膜的破損，並利用流體讓均一壓力作用於界面，藉此能在短時間內效率良好地從支承玻璃將玻璃膜剝離。 According to the eighth aspect of the present invention, by forming a fluid layer between the glass film and the supporting glass and the wedge body, the glass film and the supporting glass are prevented from coming into contact with the wedge body to prevent breakage of the glass film, and the fluid is used to impart uniform pressure. At the interface, the glass film can be peeled off efficiently from the supporting glass in a short time.
1‧‧‧玻璃膜積層體 1‧‧‧Glass laminar body
3‧‧‧帶有支承玻璃的電子裝置 3‧‧‧Electronic devices with supporting glass
4‧‧‧楔體 4‧‧‧Wedge
4b‧‧‧刃部 4b‧‧‧blade
4c‧‧‧噴出口 4c‧‧‧ spout
5‧‧‧電子裝置 5‧‧‧Electronic devices
11‧‧‧玻璃膜 11‧‧‧ glass film
12‧‧‧支承玻璃 12‧‧‧Support glass
13‧‧‧界面 13‧‧‧ interface
41‧‧‧流體 41‧‧‧ Fluid
圖1係顯示本發明的玻璃膜之製造方法的側視示意圖。 BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic side view showing a method of producing a glass film of the present invention.
圖2係顯示玻璃膜的製作方法(溢流下拉法)之側視剖面示意圖。 Fig. 2 is a side cross-sectional view showing a method of producing a glass film (overflow down-draw method).
圖3係顯示玻璃膜積層體的製作狀況之立體示意圖。 Fig. 3 is a perspective view showing the state of fabrication of a glass film laminate.
圖4係顯示剝離開始部的形成狀況，(a)為在支承玻璃形成凹部的情況，(b)為在支承玻璃形成減薄部的情況。 Fig. 4 shows a state in which the peeling start portion is formed, (a) is a case where a concave portion is formed in the supporting glass, and (b) is a case where a thinned portion is formed in the supporting glass.
圖5係顯示帶有支承玻璃的電子裝置之側視示意圖。 Figure 5 is a side elevational view showing an electronic device with a supporting glass.
圖6係顯示本發明的一實施形態之玻璃膜之製造方法所使用之楔體的示意圖，(a)為全體立體示意圖，(b)為側視剖面示意圖。 Fig. 6 is a schematic view showing a wedge body used in a method for producing a glass film according to an embodiment of the present invention, wherein (a) is a full perspective view and (b) is a side cross-sectional view.
圖7係顯示楔體的示意圖，(a)顯示楔體的構成零件之俯視示意圖，(b)顯示楔體的重疊狀況之俯視示意圖。 Fig. 7 is a schematic view showing a wedge body, (a) showing a schematic view of the components of the wedge body, and (b) a schematic plan view showing the overlapping state of the wedge body.
圖8係顯示使用楔體的玻璃膜的剝離狀況之側視剖面示意圖。 Fig. 8 is a side cross-sectional view showing the peeling state of a glass film using a wedge.
圖9係用來說明玻璃膜和支承玻璃的接合機制之示意圖，(a)顯示羥基彼此的氫鍵狀況，(b)顯示介入水分子之氫鍵狀況，(c)顯示伴隨加熱之脫水反應而使共價鍵增強的狀況。 Figure 9 is a schematic view for explaining the bonding mechanism of the glass film and the supporting glass, (a) showing the hydrogen bonding state of the hydroxyl groups, (b) showing the hydrogen bonding state of the intervening water molecules, and (c) showing the dehydration reaction accompanying the heating. A condition that enhances the covalent bond.
圖10係顯示本發明的一實施形態的玻璃膜之製造方法所使用之剝離治具的示意圖，(a)顯示第一實施形態的剝離治具(具備按壓輥的態樣)之示意圖，(b)顯示第二實施形態的剝離治具(具備風扇的態樣)之示意圖。 Fig. 10 is a schematic view showing a peeling jig used in a method for producing a glass film according to an embodiment of the present invention, and (a) is a view showing a peeling jig (a state in which a pressing roll is provided) according to the first embodiment, (b) A schematic view showing a peeling jig (in the form of a fan) of the second embodiment.
圖11係顯示本發明的一實施形態的玻璃膜之製造方法所使用之第三實施形態的剝離治具(楔體構成為可移位的態樣)的示意圖。 Fig. 11 is a schematic view showing a peeling jig (the wedge body is configured to be displaceable) of the third embodiment used in the method for producing a glass film according to the embodiment of the present invention.
圖12係顯示本發明的一實施形態的玻璃膜之製造方法所使用之剝離治具的細部之示意圖，(a)顯示對玻璃膜之剝離始端側的端部施加張力的狀態，(b)顯示將玻璃膜之剝離終端側的端部按壓的狀態。 Fig. 12 is a schematic view showing a detail of a peeling jig used in a method for producing a glass film according to an embodiment of the present invention, wherein (a) shows a state in which tension is applied to an end portion on the peeling start side of the glass film, and (b) shows The state in which the end portion on the peeling end side of the glass film is pressed.
圖13係顯示本發明的一實施形態的玻璃膜之製造方法所使用之第四實施形態的剝離治具(構成為可將玻璃膜積層體移位以及旋轉的形態)之示意圖，(a)為全體示意圖，(b)顯示玻璃膜積層體的載置部之旋轉狀況之示意圖。 Figure 13 is a schematic view showing a peeling jig (a configuration in which a glass film laminate can be displaced and rotated) according to a fourth embodiment of the method for producing a glass film according to an embodiment of the present invention, wherein (a) is (b) is a schematic view showing the state of rotation of the mounting portion of the glass film laminate.
圖14係顯示本發明的一實施形態的玻璃膜之製造方法所使用之剝離治具的剝離狀況，(a)顯示對剝離開始部***楔體的狀況之示意圖，(b)顯示剝離開始部的放大狀況之示意圖。 Fig. 14 is a view showing the peeling state of the peeling jig used in the method for producing a glass film according to the embodiment of the present invention, wherein (a) shows a state in which the wedge is inserted into the peeling start portion, and (b) shows a peeling start portion. A schematic diagram of the magnified condition.
圖15係顯示本發明的一實施形態的玻璃膜之製造方法所使用之剝離治具的剝離狀況，(a)顯示剝離開始部的放大結束時的狀況之示意圖，(b)顯示對於將剝離開始部放大後的玻璃膜積層體之楔體配置狀況之示意圖。 Fig. 15 is a view showing the peeling state of the peeling jig used in the method for producing a glass film according to the embodiment of the present invention, wherein (a) shows a state at the time of completion of enlargement of the peeling start portion, and (b) shows that peeling starts. Schematic diagram of the wedge arrangement of the enlarged glass film laminate.
圖16係顯示本發明的一實施形態的玻璃膜之製造方法所使用之剝離治具的剝離狀況，(a)顯示從放大後的剝離開始部之剝離進展狀況的示意圖，(b)顯示玻璃膜之剝離完成時的狀況之示意圖。 Fig. 16 is a view showing the peeling state of the peeling jig used in the method for producing a glass film according to the embodiment of the present invention, (a) showing a state of peeling progress from the peeling start portion after the enlargement, and (b) showing the glass film. A schematic diagram of the condition at the time of completion of the stripping.
以下，對於本發明的玻璃膜之製造方法的較佳實施形態，參照圖式作說明。 Hereinafter, preferred embodiments of the method for producing a glass film of the present invention will be described with reference to the drawings.
本發明的玻璃膜之製造方法，如圖1所示般，係具備第1步驟、第2步驟及第3步驟，該第1步驟，是將玻璃膜11和支承玻璃12積層而製作成玻璃膜積層體1；該第2步驟，藉由進行伴隨對玻璃膜11的加熱之電子裝置製造相關處理，在玻璃膜積層體1的玻璃膜11上形成元件51，藉由覆蓋玻璃2將元件51封裝而製作成帶有支承玻璃的電子裝置3；該第3步驟，是在帶有支承玻璃的電子裝置3之玻璃膜11和支承玻璃12的界面13***楔體4，而將電子裝置5從支承玻璃12剝離。 As shown in FIG. 1, the method for producing a glass film of the present invention includes a first step, a second step, and a third step. The first step is to laminate a glass film 11 and a supporting glass 12 to form a glass film. The laminated body 1; in the second step, the element 51 is formed on the glass film 11 of the glass film layered body 1 by performing the related processing for manufacturing the electronic device with the heating of the glass film 11, and the element 51 is packaged by the cover glass 2. The electronic device 3 is formed with a supporting glass; the third step is to insert the wedge 4 at the interface 13 of the glass film 11 and the supporting glass 12 of the electronic device 3 supporting the glass, and to support the electronic device 5 from the support. The glass 12 is peeled off.
此外，在本實施形態，玻璃膜11和支承玻璃12之相互接觸側的表面粗糙度Ra分別為2.0nm以下。 Further, in the present embodiment, the surface roughness Ra of the glass film 11 and the supporting glass 12 on the mutually contacting side is 2.0 nm or less.
玻璃膜11是使用矽酸鹽玻璃，較佳為使用石 英玻璃、硼矽酸玻璃，最佳為使用無鹼玻璃。 The glass film 11 is made of silicate glass, preferably stone. Ying glass, borosilicate glass, the best use of alkali-free glass.
若在玻璃膜11含有鹼成分，在表面會發生陽離子的脫落，而產生所謂吹鹼現象，造成其構造變粗糙。在此情況，若將玻璃膜11彎曲來使用，隨著時間經過而劣化，很可能會從該變粗糙的部分發生破損。 When the glass film 11 contains an alkali component, cations are detached on the surface, and a so-called alkali blowing phenomenon occurs, resulting in a rough structure. In this case, if the glass film 11 is bent and used, it deteriorates with the passage of time, and it is likely that breakage occurs from the roughened portion.
又此處所指的無鹼玻璃，是實質上不含鹼成分(鹼金屬氧化物)之玻璃，具體而言為鹼成分1000ppm以下的玻璃。 Further, the alkali-free glass referred to herein is a glass which does not substantially contain an alkali component (alkali metal oxide), specifically, a glass having an alkali component of 1000 ppm or less.
本發明所使用之無鹼玻璃的鹼成分含有量，較佳為500ppm以下，更佳為300ppm以下。 The alkali component content of the alkali-free glass used in the present invention is preferably 500 ppm or less, more preferably 300 ppm or less.
玻璃膜11的厚度較佳為5~200μm，更佳為5~100μm。 The thickness of the glass film 11 is preferably 5 to 200 μm, more preferably 5 to 100 μm.
如此般使玻璃膜11的厚度更薄，可賦予適當的可撓性。 The thickness of the glass film 11 is made thinner in this manner, and appropriate flexibility can be imparted.
厚度變得更薄的玻璃膜11，其操作困難，且容易發生定位失誤、圖案化時的撓曲等問題，藉由使用後述的支承玻璃12，在第2步驟能輕易地進行電子裝置製造相關處理等。 The glass film 11 having a thinner thickness is difficult to handle, and problems such as positioning errors and deflection during patterning are likely to occur, and the use of the supporting glass 12 to be described later can easily perform electronic device manufacturing in the second step. Processing and so on.
又當玻璃膜11的厚度未達5μm時，玻璃膜11的強度容易變得不足，要從支承玻璃12將玻璃膜11剝離有變困難之虞。 Further, when the thickness of the glass film 11 is less than 5 μm, the strength of the glass film 11 tends to be insufficient, and it is difficult to peel off the glass film 11 from the support glass 12.
支承玻璃12，是與玻璃膜11同樣的，使用矽酸鹽玻璃、石英玻璃、硼矽酸玻璃、無鹼玻璃等。 The support glass 12 is the same as the glass film 11, and a bismuth silicate glass, a quartz glass, a borosilicate glass, an alkali-free glass, etc. are used.
關於支承玻璃12，較佳為使用其與玻璃膜11在30~ 380℃的熱膨脹係數差為5×10-7/℃以內的玻璃。 As the supporting glass 12, it is preferable to use a glass having a thermal expansion coefficient difference of 5 × 10 -7 / ° C from the glass film 11 at 30 to 380 °C.
藉此，縱使在電子裝置製造相關處理時伴隨有熱處理，也不容易發生膨脹率差所造成的熱彎曲、玻璃膜11的龜裂等，可維持玻璃膜積層體1之穩定的積層狀態。 As a result, even when heat treatment is involved in the manufacturing process of the electronic device, thermal bending due to the difference in expansion ratio, cracking of the glass film 11 or the like is less likely to occur, and a stable laminated state of the glass film layered body 1 can be maintained.
而且，基於抑制膨脹率差的觀點，支承玻璃12和玻璃膜11最佳為使用具有同一組成的玻璃。 Further, from the viewpoint of suppressing the difference in the expansion ratio, it is preferable to use the glass having the same composition for the support glass 12 and the glass film 11.
支承玻璃12的厚度較佳為400μm以上。若支承玻璃12的厚度未達400μm，將支承玻璃12單獨處理的情況，在強度方面有產生問題之虞。支承玻璃12的厚度較佳為400~700μm，最佳為500~700μm。 The thickness of the support glass 12 is preferably 400 μm or more. If the thickness of the supporting glass 12 is less than 400 μm, the case where the supporting glass 12 is treated separately may cause problems in terms of strength. The thickness of the supporting glass 12 is preferably 400 to 700 μm, preferably 500 to 700 μm.
藉此，能利用支承玻璃12將玻璃膜11予以確實地支承，且能有效抑制從支承玻璃12將玻璃膜11剝離時可能發生的玻璃膜11破損。 Thereby, the glass film 11 can be reliably supported by the support glass 12, and damage of the glass film 11 which may occur when the glass film 11 is peeled off from the support glass 12 can be suppressed effectively.
又在電子裝置製造相關處理時，未圖示的承載器上載置玻璃膜積層體1的情況，支承玻璃12的厚度亦可為未達400μm(例如300μm等之與玻璃膜11相同的厚度)。 In the case of the electronic device manufacturing process, when the glass film laminate 1 is placed on a carrier (not shown), the thickness of the support glass 12 may be less than 400 μm (for example, the same thickness as the glass film 11 such as 300 μm).
本發明所使用之玻璃膜11以及支承玻璃12，較佳為藉由下拉法來成形，更佳為藉由溢流下拉法來成形。 The glass film 11 and the supporting glass 12 used in the present invention are preferably formed by a down-draw method, and more preferably formed by an overflow down-draw method.
特別是圖2所示的溢流下拉法，是成形時之玻璃板的兩面不與成形構件接觸的成形法，所獲得之玻璃板的兩面(透光面)不容易發生傷痕，縱使不研磨也能獲得良好的表面品質。當然，本發明所使用的玻璃膜11以及支承玻璃12，也能藉由浮製法、狹縫下拉法、轉出(roll out)法、上 拉法、再拉(redraw)法等來成形。 In particular, the overflow down-draw method shown in Fig. 2 is a molding method in which both surfaces of the glass sheet are not in contact with the forming member at the time of molding, and the both surfaces (light-transmitting surfaces) of the obtained glass sheet are less likely to be scratched, even if they are not polished. Can get good surface quality. Of course, the glass film 11 and the supporting glass 12 used in the present invention can also be floated, slit-down, roll-out, and on. Pulling, redrawing, etc. are formed.
圖2所示的溢流下拉法，剛從剖面呈楔型之成形體60的下端部81往下流的玻璃帶G，藉由冷卻輥62，62一邊限制寬度方向的收縮一邊往下拉伸而減薄成既定的厚度。接著，將到達前述既定厚度後的玻璃帶G藉由未圖示的退火爐(回火爐)逐漸冷卻，將玻璃帶G的熱應變去除並將玻璃帶G切斷成既定尺寸，藉此使玻璃膜11以及支承玻璃12分別成形。 In the overflow down-draw method shown in Fig. 2, the glass ribbon G which has just descended from the lower end portion 81 of the wedge-shaped molded body 60 is stretched downward by the cooling rollers 62, 62 while restricting the contraction in the width direction. Thinned to a given thickness. Then, the glass ribbon G that has reached the predetermined thickness is gradually cooled by an annealing furnace (tempering furnace) (not shown), the thermal strain of the glass ribbon G is removed, and the glass ribbon G is cut into a predetermined size, thereby making the glass The film 11 and the support glass 12 are separately formed.
如圖1以及圖3所示，本發明的玻璃膜之製造方法的第1步驟，是將相互接觸側的表面粗糙度Ra分別為2.0nm以下之玻璃膜11和支承玻璃12積層而製作成玻璃膜積層體1。 As shown in Fig. 1 and Fig. 3, in the first step of the method for producing a glass film of the present invention, the glass film 11 and the supporting glass 12 having the surface roughness Ra of 2.0 nm or less on the mutually contacting side are laminated to form a glass. Membrane layer 1.
若玻璃膜11之與支承玻璃12的接觸面11a的表面粗糙度Ra、支承玻璃12之與玻璃膜11的接觸面12a的表面粗糙度Ra超過2.0nm，接觸面11a和接觸面12a之密合性降低，不透過黏著劑就要將玻璃膜11和支承玻璃12強固地積層有變得困難之虞。 If the surface roughness Ra of the contact surface 11a of the glass film 11 with the supporting glass 12 and the surface roughness Ra of the contact surface 12a of the supporting glass 12 with the glass film 11 exceed 2.0 nm, the contact surface 11a and the contact surface 12a are in close contact with each other. The property is lowered, and it is difficult to laminate the glass film 11 and the supporting glass 12 firmly without passing through the adhesive.
為了不透過黏著劑而將玻璃膜11和支承玻璃12強固地積層，本發明所使用的玻璃膜11以及支承玻璃12各自的接觸面11a、12a之表面粗糙度Ra分別較佳為1.0nm以下，更佳為0.5nm以下，最佳為0.2nm以下。 The surface roughness Ra of each of the contact faces 11a and 12a of the glass film 11 and the support glass 12 used in the present invention is preferably 1.0 nm or less, in order to strongly laminate the glass film 11 and the support glass 12 without using an adhesive. More preferably, it is 0.5 nm or less, and it is more preferably 0.2 nm or less.
另一方面，圖1以及圖3所示的玻璃膜11之有效面11b的表面粗糙度雖沒有特別的限定，但在後述第2步驟要進行成膜等之電子裝置製造相關處理，因此表面 粗糙度Ra較佳為2.0nm以下，更佳為1.0nm以下，特佳為0.5nm以下，最佳為0.2nm以下。支承玻璃12的搬運面12b之表面粗糙度沒有特別的限定。 On the other hand, the surface roughness of the effective surface 11b of the glass film 11 shown in FIG. 1 and FIG. 3 is not particularly limited, but in the second step to be described later, an electronic device manufacturing process such as film formation is performed. The roughness Ra is preferably 2.0 nm or less, more preferably 1.0 nm or less, particularly preferably 0.5 nm or less, and most preferably 0.2 nm or less. The surface roughness of the conveying surface 12b of the support glass 12 is not particularly limited.
而且，在第1步驟所製作的玻璃膜積層體1中，如圖4(a)(b)所示般，較佳為設有剝離開始部14，該剝離開始部14是作為將玻璃膜11的端部剝離之起點。 Further, in the glass film layered body 1 produced in the first step, as shown in FIGS. 4(a) and 4(b), it is preferable to provide a peeling start portion 14 as the glass film 11 The starting point of the end peeling.
作為剝離開始部14，如圖4(a)所示般可採用以下態樣。對應於玻璃膜11之至少一個角落部而在支承玻璃12設置凹部14a，在該凹部14a，使玻璃膜11的角落部和支承玻璃12分隔。 As the peeling start portion 14, as shown in Fig. 4 (a), the following aspects can be employed. A recess 14a is provided in the support glass 12 corresponding to at least one corner portion of the glass film 11, and the corner portion of the glass film 11 and the support glass 12 are separated in the recess 14a.
此外，作為剝離開始部14，如圖4(b)所示般也能採用以下態樣。在支承玻璃12之至少一個端邊設置減薄部14b，使玻璃膜11之端邊的至少一部分在減薄部14b上與支承玻璃12分隔。 Further, as the peeling start portion 14, as shown in Fig. 4 (b), the following aspects can be employed. A thinned portion 14b is provided at at least one end of the support glass 12 so that at least a portion of the end side of the glass film 11 is separated from the support glass 12 on the thinned portion 14b.
又剝離開始部14的態樣並不限定於圖4(a)(b)所示的態樣，只要是成為將楔體4***界面13的開端，可採用各種態樣。 Further, the aspect of the peeling start portion 14 is not limited to the one shown in Figs. 4(a) and 4(b), and various aspects can be employed as long as the wedge body 4 is inserted into the beginning of the interface 13.
此外，在支承玻璃12上積層玻璃膜11之第1步驟亦可在減壓下進行。藉此，能減少在玻璃膜11和支承玻璃12積層時所產生的氣泡。 Further, the first step of laminating the glass film 11 on the supporting glass 12 can also be carried out under reduced pressure. Thereby, the bubbles generated when the glass film 11 and the supporting glass 12 are laminated can be reduced.
本發明的玻璃膜之製造方法的第2步驟，藉由進行伴隨加熱之電子裝置製造相關處理，如圖5所示般，在第1步驟所製作的玻璃膜積層體1之玻璃膜11的有效面11b上形成元件51，利用封裝基板將玻璃膜11的 有效面11b上所形成之元件51予以封裝，藉此製作成帶有支承玻璃的電子裝置3。 In the second step of the method for producing a glass film of the present invention, the glass film 11 of the glass film layered body 1 produced in the first step is effective as shown in FIG. An element 51 is formed on the surface 11b, and the glass film 11 is used by the package substrate. The element 51 formed on the effective surface 11b is encapsulated, whereby the electronic device 3 with the supporting glass is fabricated.
作為第2步驟中之伴隨加熱的電子裝置製造相關處理，例如可列舉採用CVD法、濺鍍等之成膜處理等。 As a process related to the manufacture of an electronic device with heating in the second step, for example, a film formation process such as a CVD method or sputtering can be used.
作為玻璃膜11的有效面11b上所形成的元件，可列舉液晶元件、有機EL元件、觸控面板元件、太陽電池元件、壓電元件、受光元件、鋰離子2次電池等的電池元件、MEMS元件、半導體元件等。 Examples of the element formed on the effective surface 11b of the glass film 11 include a liquid crystal element, an organic EL element, a touch panel element, a solar cell element, a piezoelectric element, a light receiving element, a battery element such as a lithium ion secondary battery, and a MEMS. Components, semiconductor components, etc.
而且，作為元件51封裝所使用的封裝基板，與前述玻璃膜11同樣的，可使用矽酸鹽玻璃、石英玻璃、硼矽酸玻璃、無鹼玻璃等所構成的覆蓋玻璃2。 Further, as the package substrate used for the package of the element 51, a cover glass 2 made of tantalate glass, quartz glass, borosilicate glass, alkali-free glass or the like can be used similarly to the glass film 11.
關於覆蓋玻璃2，較佳為使用其與玻璃膜11在30~380℃的熱膨脹係數差為5×10-7/℃以內的玻璃。 As for the cover glass 2, it is preferable to use a glass which has a thermal expansion coefficient difference of 5 × 10 -7 / ° C from the glass film 11 at 30 to 380 °C.
藉此，縱使所製作成的電子裝置5之周邊環境的溫度改變，仍不容易發生膨脹率差所造成之熱彎曲、玻璃膜11以及覆蓋玻璃2的龜裂等，可成為不容易破損的電子裝置5。 As a result, even if the temperature of the surrounding environment of the manufactured electronic device 5 is changed, thermal bending due to the difference in expansion ratio, cracking of the glass film 11 and the cover glass 2, and the like are not easily caused, and the electrons are not easily broken. Device 5.
而且，基於抑制膨脹率差的觀點，覆蓋玻璃2和玻璃膜11最佳為使用具有同一組成的玻璃。 Further, from the viewpoint of suppressing the difference in the expansion ratio, the cover glass 2 and the glass film 11 are preferably made of glass having the same composition.
覆蓋玻璃2的厚度較佳為5~200μm，更佳為5~100μm。如此般使覆蓋玻璃的厚度更薄，可賦予適當的可撓性。若覆蓋玻璃2的厚度未達5μm，覆蓋玻璃2的強度容易變得不足。 The thickness of the cover glass 2 is preferably 5 to 200 μm, more preferably 5 to 100 μm. Thus, the thickness of the cover glass is made thinner, and appropriate flexibility can be imparted. If the thickness of the cover glass 2 is less than 5 μm, the strength of the cover glass 2 tends to be insufficient.
作為第2步驟所製作之帶有支承玻璃的電子 裝置3的一例，是圖5所示的有機EL面板。 The electron with the supporting glass produced as the second step An example of the device 3 is the organic EL panel shown in Fig. 5 .
在玻璃膜11的有效面11b上，藉由CVD法、濺鍍等公知的成膜方法，依序積層陽極層52a、電洞輸送層52b、發光層52c、電子輸送層52d、陰極層52e，而進行元件51的一例、即有機EL元件52的形成。 The anode layer 52a, the hole transport layer 52b, the light-emitting layer 52c, the electron transport layer 52d, and the cathode layer 52e are sequentially laminated on the effective surface 11b of the glass film 11 by a known film formation method such as CVD or sputtering. On the other hand, an example of the element 51, that is, the organic EL element 52 is formed.
然後，使用公知的雷射封裝等將覆蓋玻璃2和玻璃膜11接合，將有機EL元件52封裝，而製作成帶有支承玻璃的電子裝置3(在此為帶有支承玻璃的有機EL面板)。 Then, the cover glass 2 and the glass film 11 are joined by a known laser package or the like, and the organic EL element 52 is packaged to form an electronic device 3 with a supporting glass (here, an organic EL panel with a supporting glass). .
又在圖5所示的形態，雖是將覆蓋玻璃2和玻璃膜11直接接合，但也能使用適宜公知的玻璃料、間隔件(spacer)等來將覆蓋玻璃2和玻璃膜11接合。 Further, in the embodiment shown in Fig. 5, the cover glass 2 and the glass film 11 are directly joined, but the cover glass 2 and the glass film 11 may be joined by using a suitable glass frit, a spacer, or the like.
本發明的玻璃膜之製造方法的第3步驟，如圖1所示般，藉由在帶有支承玻璃的電子裝置3之玻璃膜11和支承玻璃12的界面13***楔體4，來將電子裝置5從支承玻璃12剝離。 In the third step of the method for producing a glass film of the present invention, as shown in FIG. 1, the electrons are inserted by inserting the wedge 4 at the interface 13 between the glass film 11 of the electronic device 3 supporting the glass and the supporting glass 12. The device 5 is peeled off from the support glass 12.
此外，在界面13***楔體4時，是一邊從楔體4噴出流體41一邊進行。 Further, when the wedge body 4 is inserted into the interface 13, the fluid 41 is ejected from the wedge body 4.
亦即，玻璃膜積層體1的一實施態樣為帶有支承玻璃的裝置3，此外，玻璃膜11的一實施態樣為電子裝置5，以下說明中的玻璃膜積層體1和帶有支承玻璃的裝置3、以及以下說明中的玻璃膜11和電子裝置5，分別可彼此互換。 That is, an embodiment of the glass film laminate 1 is a device 3 with a supporting glass. Further, an embodiment of the glass film 11 is an electronic device 5, and the glass film laminate 1 and the support are described below. The glass device 3 and the glass film 11 and the electronic device 5 in the following description are interchangeable with each other.
又在第3步驟中，在界面13將楔體4***時，是以剝離開始部14(參照圖4(a)(b))為起點。亦即，從剝離開始 部14之界面13開始進行楔體4的***。 Further, in the third step, when the wedge 4 is inserted at the interface 13, the peeling start portion 14 (see Fig. 4 (a) and (b)) is used as a starting point. That is, starting from stripping The interface 13 of the portion 14 begins the insertion of the wedge 4.
此外，當未形成剝離開始部14的情況，藉由在支承玻璃12和玻璃膜11的界面13將楔體4或未圖示的樹脂片等***，使玻璃膜的1邊從支承玻璃12往上浮而作為剝離起點亦可。 Further, when the peeling start portion 14 is not formed, the wedge body 4 or a resin sheet (not shown) is inserted at the interface 13 between the support glass 12 and the glass film 11, so that one side of the glass film is passed from the support glass 12 It can also be used as a starting point for peeling.
在此，針對楔體4作說明。 Here, the wedge 4 will be described.
又在此所指的「楔體」在概念上，該楔體之***方向的形狀，不僅是從刃部朝向根部使其厚度單純增加的形狀，也包含從刃部朝向根部使其厚度單純增後，從既定位置起成為一定厚度的形狀。 In addition, the "wedge body" referred to herein is conceptually such that the shape of the wedge body in the insertion direction is not only a shape in which the thickness is simply increased from the blade portion toward the root portion, but also includes a simple increase in thickness from the blade portion toward the root portion. Then, it has a certain thickness from a predetermined position.
如圖6(a)所示般，楔體4是在板厚方向視呈矩形(長方形)的板狀構件，係具有朝一側的長邊部向下傾斜的傾斜部4a，在該傾斜部4a的下端部形成有直線狀的刃部4b而具有大致刀刃狀形狀。 As shown in Fig. 6 (a), the wedge body 4 is a plate-like member which is rectangular (rectangular) in the thickness direction, and has an inclined portion 4a which is inclined downward toward the long side portion of one side, and the inclined portion 4a is inclined at the inclined portion 4a. The lower end portion is formed with a linear blade portion 4b and has a substantially blade shape.
又在圖6(a)，刃部4b雖是形成為直線狀，但刃部4b的形狀並不限定於此，亦可形成為平緩的凹曲線狀或凸曲線狀。 Further, in Fig. 6(a), the blade portion 4b is formed in a linear shape, but the shape of the blade portion 4b is not limited thereto, and may be formed into a gentle concave curve or a convex curve.
此外，如圖6(a)(b)所示般，楔體4在刃部4b，具有朝與板厚方向正交的方向開口之複數個噴出口4c，4c...，各噴出口4c，4c...與形成於楔體4的上面之供給口4d，4d(用來供給流體41的孔)連通。 Further, as shown in Fig. 6 (a) and (b), the wedge body 4 has a plurality of discharge ports 4c, 4c, ..., which are opened in a direction orthogonal to the thickness direction of the blade portion 4b, and each of the discharge ports 4c 4c... is in communication with the supply ports 4d, 4d (holes for supplying the fluid 41) formed on the upper surface of the wedge 4.
又關於噴出口4c，不僅是像本實施形態所示般分割成複數個的態樣，也能採用全體成為一個開口部之狹縫狀的態樣等。 Further, the discharge port 4c is not limited to a plurality of forms as shown in the present embodiment, and a slit-like shape in which all of the openings are formed can be used.
楔體4如圖6(b)所示般構成為，藉由未圖示的流體供給手段從供給口4d，4d供給流體41(本實施形態為空氣)，而從各噴出口4c，4c...噴出流體41。 As shown in Fig. 6(b), the wedge body 4 is configured to supply a fluid 41 (air in the present embodiment) from the supply ports 4d, 4d by a fluid supply means (not shown), and from each of the discharge ports 4c, 4c. .. ejecting fluid 41.
又作為流體41是採用空氣的情況，作為流體供給手段，可採用連接於壓縮機等的空氣源之空氣配管。 Further, as the fluid 41, air is used, and as the fluid supply means, an air pipe connected to an air source such as a compressor may be employed.
如圖7(a)(b)所示般，楔體4，是從下方起依序將底構件42、櫛狀構件43、頭構件44、蓋構件45這4個構件重疊，使用螺栓、螺帽等的緊固構件予以一體化，而構成為刀刃狀。 As shown in Fig. 7 (a) and (b), the wedge body 4 is formed by superposing the bottom member 42, the beak member 43, the head member 44, and the cover member 45 in this order from the lower side, using bolts and screws. The fastening members such as caps are integrated to form a blade shape.
櫛狀構件43，是在平板狀的構件上，以互相平行的方式形成複數個大致U字狀的凹部43a，43a...，而構成為櫛狀的構件。 The braided member 43 is a member which is formed in a meandering shape so as to form a plurality of substantially U-shaped recesses 43a, 43a, ... in parallel with each other.
底構件42是平板狀的構件，將其重疊配置在櫛狀構件43下方而將各凹部43a，43a...的下方封閉。 The bottom member 42 is a flat member, and is placed under the dam member 43 so as to be closed below the respective recesses 43a, 43a.
頭構件44，是在平板狀的構件上，形成空隙部44a(貫穿板厚方向的孔)之構件，將頭構件44重疊配置在櫛狀構件43上，利用空隙部44a來連通櫛狀構件43上所形成的各凹部43a，43a...，且利用該頭構件44之空隙部44a以外的部位來封閉凹部43a，43a...的上方。 The head member 44 is a member in which a cavity portion 44a (a hole penetrating the thickness direction) is formed in a flat member, and the head member 44 is placed on the beak member 43 in a superposed manner, and the beak member 43 is communicated by the gap portion 44a. Each of the recesses 43a, 43a, ... formed thereon is closed above the recesses 43a, 43a, ... by a portion other than the gap portion 44a of the head member 44.
蓋構件45是平板狀的構件，將其重疊配置在頭構件44上方而將空隙部44a的上方封閉。 The cover member 45 is a flat member, and is placed over the head member 44 to close the upper portion of the gap portion 44a.
此外，在蓋構件45上，在配置於頭構件44上的狀態下與空隙部44a連通的位置形成有供給口4d，4d，可通過該供給口4d，4d對楔體4內部供給流體41。 Further, on the lid member 45, a supply port 4d, 4d is formed at a position communicating with the gap portion 44a in a state of being disposed on the head member 44, and the fluid 41 can be supplied to the inside of the wedge body 4 through the supply ports 4d, 4d.
而且，楔體4構成為，各凹部43a，43a...之開放端部是成為噴出口4c，4c...而顯露於楔體4的刃部4b，能使通過供給口4d，4d而供給到空隙部44a的流體41從各噴出口4c，4c...。 Further, the wedge body 4 is configured such that the open end portions of the recessed portions 43a, 43a, ... are formed as the discharge ports 4c, 4c, ... and are exposed to the blade portion 4b of the wedge body 4, and can be passed through the supply ports 4d, 4d. The fluid 41 supplied to the gap portion 44a is from the respective discharge ports 4c, 4c, ....
楔體4，藉由使傾斜部4a之刃部4b的厚度縮小(亦即，使刃部4b變尖)，對於玻璃膜積層體1的界面13以及剝離開始部14，能將楔體4輕易地***。 The wedge body 4 can reduce the thickness of the blade portion 4b of the inclined portion 4a (that is, the blade portion 4b is sharpened), and the wedge body 4 can be easily made to the interface 13 of the glass laminate 1 and the peeling start portion 14. Insert it.
此外，藉由將楔體4的厚度減薄，能減低楔體4***界面13時之玻璃膜11的上浮量，藉此，可減少剝離時對玻璃膜11造成的損傷。 Further, by reducing the thickness of the wedge 4, the amount of floating of the glass film 11 when the wedge 4 is inserted into the interface 13 can be reduced, whereby damage to the glass film 11 at the time of peeling can be reduced.
本發明的玻璃膜之製造方法所使用之楔體4的厚度，較佳為3.0mm以下。 The thickness of the wedge 4 used in the method for producing a glass film of the present invention is preferably 3.0 mm or less.
此外，楔體4之刃部4b的刃角度較佳為5度以下，在本實施形態，楔體4之刃部4b的刃角度設定為5度以下。 Further, the blade angle of the blade portion 4b of the wedge body 4 is preferably 5 degrees or less. In the present embodiment, the blade angle of the blade portion 4b of the wedge body 4 is set to 5 degrees or less.
亦即，在本發明的玻璃膜之製造方法，該製造方法所使用之楔體4的厚度為3.0mm以下。 That is, in the method for producing a glass film of the present invention, the thickness of the wedge 4 used in the production method is 3.0 mm or less.
而且，如此般將楔體4的厚度減小，可抑制剝離時之玻璃膜11的上浮，減少對玻璃膜11造成的損傷，藉此確實地防止玻璃膜11的破損。 Further, by reducing the thickness of the wedge body 4 in this manner, it is possible to suppress the floating of the glass film 11 at the time of peeling and to reduce damage to the glass film 11, thereby reliably preventing breakage of the glass film 11.
此外，在本發明的玻璃膜之製造方法，該製造方法所使用之楔體4之刃部4b的角度設定為5度以下。 Further, in the method for producing a glass film of the present invention, the angle of the blade portion 4b of the wedge body 4 used in the production method is set to 5 degrees or less.
而且，藉由如此般將楔體4的刃部4b之角度縮小， 可抑制剝離時之玻璃膜11的曲率以及曲率變化，可減少對玻璃膜11造成的損傷，可確實地防止玻璃膜11的破損。 Moreover, by narrowing the angle of the blade portion 4b of the wedge body 4 as described above, The curvature and curvature change of the glass film 11 at the time of peeling can be suppressed, damage to the glass film 11 can be reduced, and damage of the glass film 11 can be reliably prevented.
接著說明，在第3步驟中，楔體4對界面13的***狀況。 Next, in the third step, the state in which the wedge body 4 is inserted into the interface 13 will be described.
如圖8所示，在本發明的玻璃膜之製造方法，在第3步驟中，是一邊從形成於刃部4b形成之各噴出口4c，4c...噴出流體41，一邊將該楔體4***帶有支承玻璃的電子裝置3(亦即，玻璃膜積層體1)之電子裝置5(亦即，玻璃膜11)和支承玻璃12的界面13。 As shown in Fig. 8, in the method for producing a glass film of the present invention, in the third step, the fluid is ejected from the respective ejection ports 4c, 4c, ... formed in the blade portion 4b, and the wedge is formed. 4 The electronic device 5 (i.e., the glass film 11) of the electronic device 3 (i.e., the glass film laminate 1) having the supporting glass is inserted into the interface 13 of the supporting glass 12.
而且，在本實施形態，作為流體41是採用空氣。 Further, in the present embodiment, air is used as the fluid 41.
從此狀態起，將楔體4固定住，使玻璃膜積層體1朝箭頭α方向移位，藉此使楔體4的刃部4b朝未剝離部的方向相對移位，而讓玻璃膜11的剝離進展。 From this state, the wedge body 4 is fixed, and the glass film layered body 1 is displaced in the direction of the arrow α, whereby the blade portion 4b of the wedge body 4 is relatively displaced in the direction of the unpeeled portion, and the glass film 11 is allowed to be displaced. Stripping progress.
此外，將玻璃膜積層體1固定住，使楔體4朝箭頭β方向移位，藉此讓楔體4的刃部4b朝未剝離部的方向相對移位亦可；或者是，使玻璃膜積層體1朝箭頭α方向移位且使楔體4朝箭頭β方向移位，藉此讓楔體4的刃部4b朝未剝離部的方向相對移位亦可。 Further, the glass film layered body 1 is fixed, and the wedge body 4 is displaced in the direction of the arrow β, whereby the blade portion 4b of the wedge body 4 is relatively displaced in the direction of the unpeeled portion; or, the glass film is made The laminated body 1 is displaced in the direction of the arrow α and the wedge body 4 is displaced in the direction of the arrow β, whereby the blade portion 4b of the wedge body 4 may be relatively displaced in the direction of the unpeeled portion.
從各噴出口4c，4c...噴出的流體41，為了逃脫而往各方向擴散，流向存在於該流體41的噴出方向之左右、後方之開放部，而從藉由玻璃膜11和支承玻璃12包圍的空間排出。 The fluid 41 ejected from the respective ejection ports 4c, 4c, ... diffuses in all directions in order to escape, and flows to the left and right opening portions existing in the discharge direction of the fluid 41, and the glass film 11 and the supporting glass are passed through. The space surrounded by 12 is discharged.
而且，利用流體41而使藉由玻璃膜11和支承玻璃 12包圍之空間內的壓力昇高，且該流體41直接碰撞界面13而賦予撞擊力，藉此從支承玻璃12將玻璃膜11剝離。 Moreover, the glass film 11 and the supporting glass are made by the fluid 41 The pressure in the space surrounded by 12 rises, and the fluid 41 directly collides with the interface 13 to impart an impact force, thereby peeling the glass film 11 from the support glass 12.
更詳細的說，在從各噴出口4c，4c...噴出流體41時，在楔體4的上面及下面形成流體41的層，藉此抑制楔體4和玻璃膜11及支承玻璃12之間的接觸。 More specifically, when the fluid 41 is ejected from the respective ejection ports 4c, 4c, ..., a layer of the fluid 41 is formed on the upper surface and the lower surface of the wedge 4, thereby suppressing the wedge 4, the glass film 11, and the supporting glass 12. Contact between.
如此，能將楔體4順利地***界面13，且減少楔體4對於玻璃膜11及支承玻璃12的接觸機會，而能防止玻璃膜11及支承玻璃12的破損。 In this way, the wedge body 4 can be smoothly inserted into the interface 13, and the contact chance of the wedge body 4 with respect to the glass film 11 and the supporting glass 12 can be reduced, and damage of the glass film 11 and the supporting glass 12 can be prevented.
在此說明，使用楔體4的情況之剝離順序。 Here, the peeling order in the case of using the wedge 4 will be described.
在使用楔體4來進行玻璃膜11之剝離的情況，是以形成於玻璃膜積層體1之剝離開始部14為起點(開端)，先將楔體4之刃部4b***玻璃膜11和支承玻璃12的界面13。 When the peeling of the glass film 11 is performed using the wedge 4, the peeling start portion 14 formed in the glass film layered body 1 is used as a starting point (opening end), and the blade portion 4b of the wedge 4 is first inserted into the glass film 11 and supported. Interface 13 of glass 12.
又這時的***動作可採用以下任一態樣。亦即，將玻璃膜積層體1固定住，藉由使楔體4移位而將楔體4***界面13的態樣，或者是，將楔體4固定住，藉由使玻璃膜積層體1移位而將楔體4***界面13的態樣(以下相同)。 At this time, the insertion action can adopt any of the following aspects. That is, the glass film laminate 1 is fixed, the wedge body 4 is inserted into the interface 13 by shifting the wedge 4, or the wedge 4 is fixed by the glass film laminate 1 The aspect in which the wedge 4 is inserted into the interface 13 by displacement (the same applies hereinafter).
接著，對於界面13將楔體4進一步***，遍及玻璃膜積層體1之被選擇的1邊之全長，成為將刃部4b***的狀態。 Next, the wedge body 4 is further inserted into the interface 13, and the blade portion 4b is inserted over the entire length of the selected one side of the glass film layered body 1.
接著，從該刃部4b遍及其全長而***的1邊，以使刃部4b接近該1邊之對邊的方式，一邊由刃部 4b之各噴出口4c，4c...噴出流體41，一邊使楔體4或玻璃膜積層體1移位且讓該移位繼續進行到刃部4b接觸前述對邊為止，藉此將玻璃膜11和支承玻璃12剝離。 Then, one side of the blade portion 4b inserted over the entire length thereof is provided with the blade portion 4b so as to approach the opposite side of the one side. Each of the discharge ports 4c, 4c, 4b of the 4b discharges the fluid 41, and the wedge body 4 or the glass film layered body 1 is displaced, and the displacement is continued until the blade portion 4b contacts the opposite side, thereby the glass film is thereby formed. 11 and the support glass 12 are peeled off.
在本發明的玻璃膜之製造方法，在第3步驟中，是使用楔體4來進行玻璃膜11的剝離，依據此構造，縱使是非常薄(厚度200μm以下)的玻璃膜11，仍能毫無破損地在短時間內高效率地剝離。 In the method for producing a glass film of the present invention, in the third step, the glass film 11 is peeled off by using the wedge 4, and according to this structure, even if the glass film 11 is very thin (thickness of 200 μm or less), it is still possible. It peels off efficiently and in a short time without damage.
此外，本發明的玻璃膜之製造方法之特徵在於，縱使玻璃膜11的厚度為200μm以下仍能良好地剝離，依據本發明的玻璃膜之製造方法，縱使是厚度極小的玻璃膜11，仍能毫無破損且良好地剝離。 Further, the method for producing a glass film of the present invention is characterized in that the thickness of the glass film 11 can be favorably peeled off even if the thickness of the glass film 11 is 200 μm or less. According to the method for producing a glass film of the present invention, even if the glass film 11 having a very small thickness can be used, No damage and good peeling.
再者，本發明的玻璃膜之製造方法的特徵在於，從噴出口4c噴出的流體41為空氣，可防止流體41碰撞界面13時的力量過高，能確實地防止玻璃膜11及支承玻璃12的破損。 Further, the method for producing a glass film according to the present invention is characterized in that the fluid 41 ejected from the discharge port 4c is air, and the force at the time when the fluid 41 collides with the interface 13 is prevented from being excessively high, and the glass film 11 and the supporting glass 12 can be surely prevented. Broken.
又在本實施形態，從噴出口4c，4c...噴出的流體41雖為空氣(空氣)，作為流體41更佳為使用含有水的空氣。 Further, in the present embodiment, the fluid 41 ejected from the discharge ports 4c, 4c, ... is air (air), and the fluid 41 is preferably air containing water.
而且，在此所指的「水」，其概念包含水蒸氣(以下相同)。 Moreover, the term "water" as used herein includes the concept of water vapor (the same applies hereinafter).
此外，作為流體41，雖最佳為含水的空氣，但也能使用空氣以外的氣體、液體、或是液體和氣體的混合體(氣液混合體)。 Further, although the fluid 41 is preferably water containing water, a gas other than air, a liquid, or a mixture of a liquid and a gas (a gas-liquid mixture) can be used.
圖8中，是對於玻璃膜11和支承玻璃12的 界面13，噴吹含水的流體41(更詳細的說，是含水的空氣)，來進行玻璃膜11和支承玻璃12的剝離。 In Fig. 8, it is for the glass film 11 and the supporting glass 12. At the interface 13, the aqueous fluid 41 (more specifically, water containing air) is blown to peel off the glass film 11 and the support glass 12.
如此，藉使是進行伴隨有加熱之電子裝置製造相關處理，仍能更順利地將玻璃膜11和支承玻璃12剝離。 As described above, the glass film 11 and the supporting glass 12 can be peeled off more smoothly even if the processing related to the manufacture of the electronic device with heating is performed.
關於藉由噴吹含水的流體41能將玻璃膜11和支承玻璃12非常良好地剝離，其詳細機制雖尚未解明，但推測應是基於以下的理由。 The glass film 11 and the supporting glass 12 can be peeled off very well by blowing the aqueous fluid 41. Although the detailed mechanism has not been clarified, it is presumed to be based on the following reasons.
若將玻璃膜11和支承玻璃12的各接觸面11a，12a平滑化成表面粗糙度Ra為2.0nm以下，在使這2個平滑的玻璃基板密合的情況，玻璃基板彼此不須透過黏著劑就能固著而成為玻璃膜積層體1。此現象推測應是基於以下的機制。 When the contact surfaces 11a and 12a of the glass film 11 and the supporting glass 12 are smoothed to have a surface roughness Ra of 2.0 nm or less, when the two smooth glass substrates are brought into close contact with each other, the glass substrates do not have to pass through the adhesive. It can be fixed and becomes the glass film laminate 1 . This phenomenon is supposed to be based on the following mechanism.
如圖9(a)所示般，是藉由在玻璃膜11的表面(接觸面11a)和支承玻璃12的表面(接觸面12a)上所形成的羥基彼此的氫鍵互相吸引。或者是，如圖9(b)所示般，使在玻璃膜11和支承玻璃12的界面13上所存在的水分子介入而形成氫鍵，藉此使玻璃膜11和支承玻璃12互相固著。 As shown in Fig. 9(a), the hydrogen atoms formed on the surface (contact surface 11a) of the glass film 11 and the surface (contact surface 12a) of the support glass 12 are attracted to each other by hydrogen bonding. Alternatively, as shown in FIG. 9(b), water molecules existing on the interface 13 between the glass film 11 and the supporting glass 12 are interposed to form hydrogen bonds, whereby the glass film 11 and the supporting glass 12 are fixed to each other. .
在這種狀態下，若將玻璃膜積層體1加熱，如圖9(c)所示般，在玻璃膜11和支承玻璃12的界面13上，產生Si-OH+HO-Si→Si-O-Si+H2O的脫水反應，使共價鍵增加而使玻璃膜11和支承玻璃12的固著力變強。 In this state, if the glass film laminate 1 is heated, as shown in Fig. 9(c), Si-OH + HO-Si → Si-O is produced at the interface 13 between the glass film 11 and the support glass 12. The dehydration reaction of -Si+H 2 O increases the covalent bond and strengthens the fixing force of the glass film 11 and the supporting glass 12 .
在上述電子裝置的製作步驟，係具有成膜處理等的伴隨加熱之裝置製造相關處理步驟，因此伴隨至少100℃以上的加熱步驟而進行製造。 In the production step of the above-described electronic device, since the device-related processing step associated with heating such as a film forming process is performed, the manufacturing process is performed with a heating step of at least 100 ° C or higher.
例如，在液晶顯示器、有機EL顯示器之TFT製作步驟，在非晶矽TFT的情況被加熱到300℃以上，在低溫多晶矽TFT的情況被加熱到至少400℃以上。在銦鎵鋅氧所構成的TFT的情況，被加熱到至少300℃以上。此外，在觸控感測器基板的製造過程，被加熱到至少150℃以上。 For example, in the TFT fabrication step of a liquid crystal display or an organic EL display, in the case of an amorphous germanium TFT, it is heated to 300 ° C or higher, and in the case of a low temperature polycrystalline TFT, it is heated to at least 400 ° C or higher. In the case of a TFT composed of indium gallium zinc oxide, it is heated to at least 300 ° C or higher. In addition, during the manufacturing process of the touch sensor substrate, it is heated to at least 150 ° C or more.
經由本發明人等的研究判明，玻璃膜11和支承玻璃12的固著力，隨著加熱溫度變高，又隨著加熱的保持時間變長，變得更強固，在從支承玻璃12將玻璃膜11剝離的步驟，玻璃膜11會發生破損，使玻璃膜11之剝離成功機率降低。 As a result of investigation by the inventors of the present invention, it has been found that the fixing force of the glass film 11 and the supporting glass 12 becomes stronger as the heating temperature becomes higher, and becomes longer as the holding time of the heating becomes longer, and the glass film is formed from the supporting glass 12 In the step of peeling off, the glass film 11 is broken, and the probability of successful peeling of the glass film 11 is lowered.
於是，本發明人等，為了確實建立將經由伴隨加熱之製造相關處理後的玻璃膜11和支承玻璃12毫無破壞地進行剝離的方法，反覆研究而深入努力的結果發現，在經由伴隨加熱之電子裝置製造相關處理的玻璃膜積層體1，以對玻璃膜11和支承玻璃12的界面13賦予至少含水的液體的狀態進行剝離，可將玻璃膜11和支承玻璃12輕易地剝離而達到本發明。 Then, the present inventors have found that the glass film 11 and the supporting glass 12 which have been subjected to the manufacturing-related treatment with heating are peeled off without any damage, and intensively researched and found that the heating is accompanied by the accompanying heating. The glass film laminate 1 for processing the electronic device manufacturing is peeled off in a state where at least the water containing the liquid is applied to the interface 13 of the glass film 11 and the supporting glass 12, and the glass film 11 and the supporting glass 12 can be easily peeled off to achieve the present invention. .
若對玻璃膜11和支承玻璃12的界面13賦予含水的流體41，會促進Si-O-Si+H2O→Si-OH+HO-Si 的水解反應，使玻璃膜11和支承玻璃12變得容易剝離。 When the aqueous fluid 41 is imparted to the interface 13 of the glass film 11 and the supporting glass 12, the hydrolysis reaction of Si-O-Si+H 2 O→Si-OH+HO-Si is promoted, and the glass film 11 and the supporting glass 12 are changed. It is easy to peel off.
而且，如本實施形態所示般，作為從楔體4的噴出口4c噴出之流體41，藉由選擇含水的空氣，使上述利用水的水解反應效果和利用流體41的力量之加壓效果相輔，可高效率地產生剝離，因此作為將經由伴隨加熱之電子裝置製造相關處理後之玻璃膜11和支承玻璃12毫無破損地剝離之方法是最適當的。 Further, as described in the present embodiment, as the fluid 41 ejected from the discharge port 4c of the wedge body 4, the effect of the hydrolysis reaction using the water and the pressurization effect of the force by the fluid 41 are selected by selecting the water containing water. Further, since the peeling can be efficiently performed, it is most suitable as a method of peeling off the glass film 11 and the supporting glass 12 after the related processing by the electronic device accompanying heating.
此外，此情況之空氣和水分所構成的流體41的態樣，可採用：空氣和水的氣液混合體、空氣中含有霧狀的水的態樣、或是空氣和蒸氣的混合氣體等的態樣。 Further, in this case, the fluid 41 composed of air and moisture may be a gas-liquid mixture of air and water, a misty water in the air, or a mixed gas of air and steam. Aspect.
又上述在玻璃膜11和支承玻璃12的界面13上之Si-OH基的脫水反應以及水解反應，不僅限定於Si，存在於Al、In、Sn、Zn、Ti、Zr、Ga等上的OH基也同樣會產生。因此，在支承玻璃12上，形成有SiO、SiO2、Al2O3、MgO、Y2O3、La2O3、Pr6O11、Sc2O3、WO3、HfO2、In2O3、ITO、ZnO2、Nd2O3、Ta2O5、CeO2、Nb2O5、TiO、TiO2、Ti3O5、NiO、ZnO等的無機薄膜的情況，也能期待同樣的效果。 Further, the dehydration reaction and the hydrolysis reaction of the Si-OH group on the interface 13 between the glass film 11 and the support glass 12 are not limited to Si, and are present in OH on Al, In, Sn, Zn, Ti, Zr, Ga, or the like. The base will also be produced. Therefore, on the support glass 12, SiO, SiO 2 , Al 2 O 3 , MgO, Y 2 O 3 , La 2 O 3 , Pr 6 O 11 , Sc 2 O 3 , WO 3 , HfO 2 , In 2 are formed. In the case of an inorganic thin film such as O 3 , ITO, ZnO 2 , Nd 2 O 3 , Ta 2 O 5 , CeO 2 , Nb 2 O 5 , TiO, TiO 2 , Ti 3 O 5 , NiO or ZnO, the same can be expected Effect.
此外，藉由在支承玻璃12上形成無機薄膜，縱使進行伴隨有加熱之電子裝置製造相關處理，仍可使玻璃膜11和支承玻璃12輕易地剝離。特別是若將具有與玻璃膜11的Si不同的原子之無機薄膜形成在支承玻璃12上，能更有效率地使玻璃膜11和支承玻璃12的剝離變容易。 Further, by forming an inorganic thin film on the supporting glass 12, the glass film 11 and the supporting glass 12 can be easily peeled off even if the processing relating to the manufacture of the electronic device with heating is performed. In particular, when an inorganic thin film having atoms different from Si of the glass film 11 is formed on the support glass 12, the peeling of the glass film 11 and the support glass 12 can be more easily performed.
亦即，在本發明的玻璃膜之製造方法，其特徵在於，從噴出口4c噴出之流體41為含水的空氣，該流體41中含有水。依據此構造，利用流體41所含的水分，可促進水解反應，使玻璃膜11和支承玻璃12間的固著力減弱，而從支承玻璃12將玻璃膜11在短時間內效率良好地剝離。 That is, in the method for producing a glass film of the present invention, the fluid 41 discharged from the discharge port 4c is water containing water, and the fluid 41 contains water. According to this configuration, the hydrolysis reaction is promoted by the moisture contained in the fluid 41, and the fixing force between the glass film 11 and the supporting glass 12 is weakened, and the glass film 11 is efficiently peeled off from the supporting glass 12 in a short time.
在第3步驟，對於帶有支承玻璃的電子裝置3的界面13，如圖8所示般，一邊從刃部4b之各噴出口4c，4c...噴出流體41，一邊將楔體4***。 In the third step, as shown in Fig. 8, the interface 13 of the electronic device 3 with the supporting glass is inserted into the fluid 41 from the respective ejection ports 4c, 4c, ... of the blade portion 4b, and the wedge 4 is inserted. .
而且，如圖1及圖8所示般，藉由第3步驟，從帶有支承玻璃的電子裝置3將支承玻璃12剝離，最後可製造出所期望的電子裝置5。 Further, as shown in FIGS. 1 and 8, the support glass 12 is peeled off from the electronic device 3 with the supporting glass by the third step, and finally, the desired electronic device 5 can be manufactured.
又在本實施形態雖是例示出，在玻璃膜11上形成有元件51(具體而言，有機EL元件52)，將構成電子裝置5之玻璃膜11和支承玻璃12剝離的情況，但縱使在玻璃膜11上未形成元件51的情況，利用本發明的方法也能將玻璃膜11和支承玻璃12剝離，這是理所當然的。 In the present embodiment, the element 51 (specifically, the organic EL element 52) is formed on the glass film 11, and the glass film 11 and the supporting glass 12 constituting the electronic device 5 are peeled off, but even in the case of In the case where the element 51 is not formed on the glass film 11, the glass film 11 and the supporting glass 12 can be peeled off by the method of the present invention, which is a matter of course.
換言之，在將實施伴隨有加熱的處理前之玻璃膜11和支承玻璃12直接積層來製作玻璃膜積層體1的情況，縱使是對該玻璃膜積層體1實施伴隨有加熱的處理的情況，依據本發明的方法，仍能將加熱處理後的玻璃膜11和支承玻璃12剝離，而輕易地製造出實施加熱處理後的玻璃膜11。 In other words, in the case where the glass film 11 and the supporting glass 12 are directly laminated to each other before the treatment with heating is performed to form the glass film layered body 1, the glass film layered body 1 is subjected to heat treatment. According to the method of the present invention, the glass film 11 and the supporting glass 12 after the heat treatment can be peeled off, and the glass film 11 subjected to the heat treatment can be easily produced.
本發明的電子裝置之製造方法，如圖1的示 意圖所示般，可將第1步驟、第2步驟以及第3步驟連續地進行。 The manufacturing method of the electronic device of the present invention is as shown in FIG. As shown in the figure, the first step, the second step, and the third step can be continuously performed.
此外，本發明的電子裝置之製造方法，並不限定於從第1步驟至第3步驟連續進行，例如，在第1步驟後將所製造的玻璃膜積層體1予以打包、出貨，而在另外的電子裝置製造相關處理施設中，進行第2步驟以及第3步驟亦可。 Further, the method of manufacturing the electronic device of the present invention is not limited to being continuously performed from the first step to the third step. For example, after the first step, the produced glass film layered body 1 is packaged and shipped, and In the other electronic device manufacturing related processing, the second step and the third step may be performed.
當然，在第2步驟後，將所製造之帶有支承玻璃的電子裝置3予以打包、出貨，在另外的施設進行第3步驟，藉此從支承玻璃12將玻璃膜11剝離而製造電子裝置5亦可。 Of course, after the second step, the manufactured electronic device 3 with the supporting glass is packaged and shipped, and the third step is performed in another installation, whereby the glass film 11 is peeled off from the supporting glass 12 to manufacture an electronic device. 5 is also possible.
亦即，本發明的一實施形態的玻璃膜之製造方法，係具備：第1步驟，將作為電子裝置製造相關處理前的玻璃膜之玻璃膜基材和支承玻璃12予以積層而製作玻璃膜積層體1；第2步驟，對玻璃膜積層體1之玻璃膜基材進行電子裝置製造相關處理；及第3步驟，將前述電子裝置製造相關處理後的玻璃膜積層體1分離成對前述玻璃膜基材實施前述電子裝置製造相關處理所獲得之玻璃膜11和支承玻璃12；在第3步驟中，是使用具有形成為直線狀的刃部4b且構成為可從形成於該刃部4b之噴出口4c，4c...噴出流體41之楔體4，在玻璃膜積層體1之玻璃膜11和支承玻璃12的界面13，從刃部4b側將楔體4***，然後，一邊從噴出口4c，4c...噴出流體41，一邊以使刃部4b朝界面13之未剝離部側移位的方式改變玻璃膜 積層體1和楔體4的相對位置，而從支承玻璃12將玻璃膜11剝離。 In the method of producing a glass film according to the embodiment of the present invention, the glass film substrate and the supporting glass 12 which are glass films before the electronic device manufacturing process are laminated to form a glass film layer. In the second step, the glass film substrate of the glass film layered body 1 is subjected to an electronic device manufacturing process; and in the third step, the glass film layered body 1 after the electronic device manufacturing process is separated into the glass film. The substrate is subjected to the glass film 11 and the supporting glass 12 obtained by the above-described processing related to the manufacture of the electronic device; in the third step, the blade portion 4b having a linear shape is used and configured to be sprayed from the blade portion 4b. The outlet 4c, 4c ... ejects the wedge 4 of the fluid 41, inserts the wedge 4 from the blade portion 4b side at the interface 13 between the glass film 11 of the glass laminate 1 and the support glass 12, and then, from the discharge port 4c, 4c... ejecting the fluid 41, changing the glass film in such a manner that the blade portion 4b is displaced toward the unpeeled portion side of the interface 13. The relative position of the laminated body 1 and the wedge 4 is peeled off from the support glass 12.
而且，依據本發明的玻璃膜之製造方法，藉由在玻璃膜11及支承玻璃12和楔體4之間形成流體41的層，可抑制玻璃膜11及支承玻璃12和楔體4之間的接觸而防止玻璃膜11的破損，並利用流體41使均一壓力作用於界面13，藉此能在短時間內效率良好地從支承玻璃12將玻璃膜11剝離。 Further, according to the method for producing a glass film of the present invention, by forming a layer of the fluid 41 between the glass film 11 and the support glass 12 and the wedge 4, the glass film 11 and the support glass 12 and the wedge 4 can be suppressed. The glass film 11 is prevented from being damaged by contact, and a uniform pressure is applied to the interface 13 by the fluid 41, whereby the glass film 11 can be efficiently peeled off from the support glass 12 in a short time.
此外，本發明的玻璃膜之製造方法的特徵在於，在第2步驟進行電子裝置製造相關處理，且伴隨有對玻璃膜11進行加熱。 Further, the method for producing a glass film of the present invention is characterized in that the electronic device manufacturing process is performed in the second step, and the glass film 11 is heated.
而且，依據本發明的玻璃膜之製造方法，縱使在玻璃膜11和支承玻璃12之固著力增大的情況，在第3步驟，仍能防止玻璃膜11的破損且在短時間內效率良好地將玻璃膜11剝離。 Further, according to the method for producing a glass film of the present invention, even when the fixing force of the glass film 11 and the supporting glass 12 is increased, in the third step, the glass film 11 can be prevented from being damaged and efficiently in a short time. The glass film 11 is peeled off.
又在本發明的玻璃膜之製造方法，雖是例示出，在第2步驟進行伴隨加熱之處理的情況，但本發明的玻璃膜之剝離方法，縱使是在對玻璃膜11不進行加熱的情況，該剝離方法當然仍是有效的。 In the method for producing a glass film of the present invention, the heating treatment is performed in the second step. However, the method for peeling off the glass film of the present invention is such that the glass film 11 is not heated. The stripping method is of course still effective.
亦即，本發明的一實施形態的玻璃膜之剝離方法，是從將玻璃膜11和支承玻璃12予以積層而製作之玻璃膜積層體1將玻璃膜11剝離，其特徵在於，是使用具有形成為直線狀之刃部4b且能從形成於該刃部4b之噴出口4c，4c...噴出流體41之楔體4，對於玻璃膜積層體1 之玻璃膜11和支承玻璃12的界面13，從刃部4b側將楔體4***，然後，一邊從噴出口4c，4c...噴出流體41，一邊以使刃部4b朝界面13之未剝離部側移位的方式改變玻璃膜積層體1和楔體4的相對位置，而從支承玻璃12將玻璃膜11剝離。 In the peeling method of the glass film according to the embodiment of the present invention, the glass film 11 is formed by laminating the glass film 11 and the supporting glass 12, and the glass film 11 is peeled off. The linear blade portion 4b is capable of ejecting the wedge body 4 of the fluid 41 from the ejection ports 4c, 4c, ... formed in the blade portion 4b, for the glass film laminate 1 The interface 13 between the glass film 11 and the supporting glass 12 is inserted into the wedge 4 from the blade portion 4b side, and then the fluid 41 is ejected from the ejection ports 4c, 4c, ... so that the blade portion 4b faces the interface 13 The manner in which the peeling portion side is displaced changes the relative positions of the glass laminate 1 and the wedge 4, and the glass film 11 is peeled off from the support glass 12.
而且，依據本發明的玻璃膜之剝離方法，不論是否對玻璃膜11進行加熱，都能抑制玻璃膜11及支承玻璃12和楔體4之間的接觸而防止玻璃膜11的破損，且利用流體41讓均一的壓力作用於界面13，藉由在短時間內效率良好地從支承玻璃12將玻璃膜11剝離。 Further, according to the peeling method of the glass film of the present invention, the contact between the glass film 11 and the supporting glass 12 and the wedge 4 can be suppressed to prevent breakage of the glass film 11 regardless of whether or not the glass film 11 is heated, and the fluid is used. 41, a uniform pressure is applied to the interface 13, and the glass film 11 is peeled off from the support glass 12 efficiently in a short time.
接著說明，使用楔體4之剝離方法所採用的剝離治具的構造。 Next, the structure of the peeling jig used by the peeling method of the wedge body 4 is demonstrated.
首先說明以下態樣的剝離治具20，亦即將楔體4固定住，一邊相對於楔體4之刃部4b將玻璃膜積層體1的界面13定位，一邊使玻璃膜積層體1移位，對於界面13將楔體4***而從支承玻璃12將玻璃膜11剝離。 First, the peeling jig 20 of the following aspect will be described, that is, the wedge body 4 is fixed, and the interface 13 of the glass film layer 1 is positioned with respect to the blade portion 4b of the wedge 4, and the glass film layer 1 is displaced. The wedge body 4 is inserted into the interface 13 to peel the glass film 11 from the support glass 12.
剝離治具20，是能讓使用楔體4之本發明的玻璃膜之剝離方法輕易地實現之治具，如圖10(a)(b)所示般，係具備基台部21、支承部22、按壓部23、分隔件24等，以在基台部21固定楔體4的狀態來使用。 The peeling jig 20 is a jig that can be easily realized by the peeling method of the glass film of the present invention using the wedge 4, and as shown in Fig. 10 (a) and (b), the base portion 21 and the support portion are provided. 22. The pressing portion 23, the spacer 24, and the like are used in a state in which the wedge body 4 is fixed to the base portion 21.
而且，該剝離治具20，是在本發明的一實施形態的玻璃膜之製造方法的第3步驟中，用來從帶有支承玻璃的電子裝置3將電子裝置5(玻璃膜11)剝離。 Further, in the third step of the method for producing a glass film according to the embodiment of the present invention, the peeling jig 20 is used for peeling off the electronic device 5 (glass film 11) from the electronic device 3 with the supporting glass.
基台部21，是構成剝離治具20之主要骨架部 分的板狀構件，在其上面部，形成有用來載置玻璃膜積層體1的平面部、即載置部21a。 The base portion 21 is the main skeleton portion constituting the peeling jig 20 In the upper plate member, a flat portion for placing the glass film layered body 1, that is, a placing portion 21a is formed on the upper surface portion.
此外，支承部22，是用來支承剝離治具20之楔體4的部位，在藉由基台部21支承之楔體4和載置部21a之間形成既定的間隙。 Further, the support portion 22 is a portion for supporting the wedge body 4 of the peeling jig 20, and a predetermined gap is formed between the wedge body 4 supported by the base portion 21 and the mounting portion 21a.
既定的間隙，是與構成玻璃膜積層體1之支承玻璃12的厚度大致一致的距離，藉由在載置部21a上載置玻璃膜積層體1，能輕易地使楔體4的刃部4b的位置與界面13的高度大致一致。 The predetermined gap is a distance substantially equal to the thickness of the supporting glass 12 constituting the glass laminated body 1. By placing the glass laminated body 1 on the placing portion 21a, the blade portion 4b of the wedge 4 can be easily obtained. The position is substantially the same as the height of the interface 13.
按壓部23，是用來將從支承玻璃12剝離後之玻璃膜11朝向下方按壓，而防止剝離後的玻璃膜11過度上浮。 The pressing portion 23 is for pressing the glass film 11 which has been peeled off from the support glass 12 downward, thereby preventing the glass film 11 after peeling from excessively floating.
按壓部23，例如圖10(a)所示般，在第一實施形態的剝離治具20(稱為剝離治具20A)，係具備在支承部22被支承成可旋轉之按壓輥23a，23b。 In the pressing portion 23, as shown in Fig. 10 (a), the peeling jig 20 (referred to as the peeling jig 20A) of the first embodiment includes press rolls 23a, 23b that are rotatably supported by the support portion 22. .
剝離治具20A係具備二個按壓輥23a，23b，第一按壓輥23a配置在楔體4的上方，第二按壓輥23b配置在分隔件24的上方。 The peeling jig 20A includes two pressing rollers 23a and 23b. The first pressing roller 23a is disposed above the wedge 4, and the second pressing roller 23b is disposed above the spacer 24.
分隔件24，是用來沿著其一面載置剝離後的玻璃膜11的部位，係透過支承腳25固定在基台部21。 The separator 24 is a portion for placing the peeled glass film 11 along one surface thereof, and is fixed to the base portion 21 through the support leg 25.
而且，剝離治具20A構成為，使剝離後的玻璃膜11接觸各按壓輥23a，23b，以防止玻璃膜11的過度上浮，並順利地轉移至分隔件24。 Further, the peeling jig 20A is configured such that the peeled glass film 11 is brought into contact with the respective pressing rolls 23a and 23b to prevent the glass film 11 from being excessively floated and smoothly transferred to the separator 24.
此外，如圖10(b)所示般，第二實施形態的剝 離治具20(稱為剝離治具20B)係具備風扇23c。 Further, as shown in FIG. 10(b), the peeling of the second embodiment The fixture 20 (referred to as a peeling jig 20B) is provided with a fan 23c.
風扇23c，是透過支承部22的角度調整部22a，而能調整其對於玻璃膜11之送風角度。 The fan 23c is passed through the angle adjusting portion 22a of the support portion 22, and the air blowing angle with respect to the glass film 11 can be adjusted.
而且，剝離治具20B構成為，利用風扇23c之送風，將剛***楔體4而剝離後的玻璃膜11往下方按壓，以防止其過度上浮，又用風扇23c之送風，將進一步剝離後的玻璃膜11轉移至分隔件24時的上浮予以按壓，而防止該上浮。 Further, the peeling jig 20B is configured such that the glass film 11 which has just been inserted into the wedge body 4 and is peeled off is pressed downward by the air blown by the fan 23c to prevent the air film 11 from being excessively floated, and is further separated by the air blow by the fan 23c. The floating of the glass film 11 when it is transferred to the separator 24 is pressed to prevent the floating.
接著說明，使用楔體4之剝離治具的其他實施形態(第三實施形態)。 Next, another embodiment (third embodiment) of the peeling jig using the wedge 4 will be described.
在此說明的態樣之剝離治具30，是將玻璃膜積層體1固定住，相對於楔體4之刃部4b將界面13定位，且使楔體4移位，藉此對於界面13將楔體4***，而從支承玻璃12將玻璃膜11剝離。 The peeling jig 30 of the aspect described herein fixes the glass film laminate 1 and positions the interface 13 with respect to the blade portion 4b of the wedge 4, and displaces the wedge 4, whereby the interface 13 will be The wedge body 4 is inserted, and the glass film 11 is peeled off from the support glass 12.
如圖11所示般，剝離治具30，是能讓使用楔體4之本發明的玻璃膜之剝離方法輕易實現的治具，如圖11所示般，係具備基台部31、支承部32、保持部33、上浮防止部34等，以相對於支承部32將楔體4固定的狀態來使用。 As shown in Fig. 11, the peeling jig 30 is a jig that can be easily realized by the peeling method of the glass film of the present invention using the wedge 4, and as shown in Fig. 11, the base portion 31 and the support portion are provided. 32. The holding portion 33, the floating prevention portion 34, and the like are used in a state in which the wedge body 4 is fixed to the support portion 32.
基台部31，是構成剝離治具30之主要的骨架部分之板狀構件，在其上面部，形成有用來載置玻璃膜積層體1之平面部、即載置部31a。 The base portion 31 is a plate-like member that constitutes a main skeleton portion of the peeling jig 30, and a flat portion on which the glass film layered body 1 is placed, that is, a mounting portion 31a is formed on the upper surface portion.
支承部32，是用來支承楔體4的部位，在藉由支承部32支承之楔體4和載置部31a之間形成既定的間隙 A。 The support portion 32 is a portion for supporting the wedge body 4, and a predetermined gap is formed between the wedge body 4 supported by the support portion 32 and the mounting portion 31a. A.
既定的間隙A，是與構成玻璃膜積層體1之支承玻璃12的厚度大致一致的距離，藉由在載置部31a上載置玻璃膜積層體1，能輕易地使楔體4的刃部4b與界面13的位置大致一致。 The predetermined gap A is a distance substantially equal to the thickness of the supporting glass 12 constituting the glass film layered body 1. By placing the glass film layered body 1 on the placing portion 31a, the blade portion 4b of the wedge body 4 can be easily obtained. It is substantially the same as the position of the interface 13.
此外，支承部32構成為，能沿著形成於基台部31之溝槽部31b，在與刃部4b的形成方向正交的方向往復移位。 Further, the support portion 32 is configured to be reciprocally displaceable in a direction orthogonal to the direction in which the blade portion 4b is formed along the groove portion 31b formed in the base portion 31.
把持部33b，是用來把持剝離後的玻璃膜11之端部，藉由該把持部33b來拘束玻璃膜11之端部。 The grip portion 33b is for gripping the end portion of the peeled glass film 11, and the end portion of the glass film 11 is restrained by the grip portion 33b.
此外，溝槽部31b形成為與載置部31a的面平行，支承部32構成為，能在與載置部31a的面平行的方向移位。 Further, the groove portion 31b is formed to be parallel to the surface of the mounting portion 31a, and the support portion 32 is configured to be displaceable in a direction parallel to the surface of the mounting portion 31a.
依據此構造，在將刃部4b***界面13的狀態，藉由使支承部32移位，能將楔體4正確***界面13之更深處。 According to this configuration, in a state where the blade portion 4b is inserted into the interface 13, the wedge portion 4 can be correctly inserted deeper into the interface 13 by displacing the support portion 32.
保持部33，是用來將玻璃膜11予以保持並固定的部位，如圖11所示般，係具備支承腳33a、把持部33b等。 The holding portion 33 is a portion for holding and fixing the glass film 11, and as shown in FIG. 11, includes a support leg 33a, a grip portion 33b, and the like.
支承腳33a被支承成，能沿著形成於基台部31之溝槽部31c移位的狀態，把持部33b，是藉由固定於支承腳33a的軸部33c而支承成能繞該軸部33c轉動的狀態。 The support leg 33a is supported so as to be displaceable along the groove portion 31c formed in the base portion 31, and the grip portion 33b is supported by the shaft portion 33c fixed to the support leg 33a so as to be rotatable around the shaft portion 33c turning state.
軸部33c被支承成，朝向與楔體4之刃部4b形成方向平行的方向，其構成為可改變把持部33b相對於玻璃膜 11的角度。 The shaft portion 33c is supported in a direction parallel to the direction in which the blade portion 4b of the wedge 4 is formed, and is configured to change the grip portion 33b with respect to the glass film. 11 angles.
又保持部33，如圖12(a)所示般，是構成為可繞軸部33c轉動，且能對玻璃膜11的剝離端部，朝向與剝離進展方向相反的方向，與支承玻璃12的接觸面12a平行地施加張力，藉此，能使剝離長度增加，可實現迅速的剝離。 Further, as shown in FIG. 12(a), the holding portion 33 is configured to be rotatable about the shaft portion 33c, and is capable of facing the peeling end portion of the glass film 11 in a direction opposite to the direction in which the peeling progresses, and the support glass 12. The contact surface 12a is applied with tension in parallel, whereby the peeling length can be increased, and rapid peeling can be achieved.
又在此所指的剝離長度，是將玻璃膜11的剝離端部從支承玻璃12往上拉時，自然會使剝離進展的長度。 Here, the peeling length referred to herein is a length which naturally causes peeling progress when the peeled end portion of the glass film 11 is pulled up from the support glass 12.
此外，作為將玻璃膜11的剝離端部，朝向與剝離進展方向相反的方向，與支承玻璃12之接觸面12a平行地施加張力之機構，例如圖12(a)所示般可採用：將彈簧33d和滑動件33e組合並在支承腳33a(參照圖11)連接彈簧33d所構成的機構。 Further, as a mechanism for applying tension to the peeling end portion of the glass film 11 in a direction opposite to the direction in which the peeling progresses, in parallel with the contact surface 12a of the support glass 12, for example, as shown in Fig. 12 (a), the spring can be used. 33d is combined with the slider 33e and is connected to the mechanism formed by the spring 33d at the support leg 33a (refer to Fig. 11).
上浮防止部34，是用來將剝離後的玻璃膜11保持於既定位置的部位，其構成為具備複數個吸附墊34a，34a，34a。 The floating prevention portion 34 is a portion for holding the peeled glass film 11 at a predetermined position, and is configured to include a plurality of adsorption pads 34a, 34a, 34a.
而且，吸附墊34a構成為，可限制從支承玻璃12剝離而上浮之玻璃膜11的高度，可吸附玻璃膜11而防止玻璃膜11再度附著於支承玻璃12。 Further, the adsorption pad 34a is configured to limit the height of the glass film 11 that is lifted off from the support glass 12, and to adsorb the glass film 11 to prevent the glass film 11 from adhering again to the support glass 12.
而且，剝離治具30，在本發明的玻璃膜之製造方法的第3步驟中，是用來從帶有支承玻璃的電子裝置3將電子裝置5(亦即玻璃膜11)剝離。 Further, in the third step of the method for producing a glass film of the present invention, the peeling jig 30 is for peeling off the electronic device 5 (that is, the glass film 11) from the electronic device 3 with the supporting glass.
此外，在將玻璃膜11剝離時，如圖12(b)所示般較佳為，一邊將玻璃膜11之剝離結束側的端部藉由 按壓手段35按壓、一邊完成剝離。這時按壓手段35所產生的按壓力，不是不讓剝離產生那麼強的按壓力，而是可反抗按壓力而讓玻璃膜11剝離的程度之按壓力。 Further, when the glass film 11 is peeled off, as shown in FIG. 12(b), the end portion on the peeling end side of the glass film 11 is preferably used. When the pressing means 35 is pressed, the peeling is completed. At this time, the pressing force generated by the pressing means 35 is not a pressing force which does not cause the peeling to be generated, but a pressing force which can resist the peeling of the glass film 11 by the pressing force.
在玻璃膜11之剝離結束側的端部，當玻璃膜11之剝離完成時，經常看到剝離急劇進展的現象。而且，當玻璃膜11之剝離結束側的端部急劇剝離時，玻璃膜11可能產生急劇的曲率變化而造成破損。然而，如圖12(b)所示般，一邊將玻璃膜11之剝離結束側的端部藉由按壓手段35按壓一邊完成剝離，可防止玻璃膜11之急劇的曲率變化，進而防止玻璃膜11的破損。 At the end portion on the peeling end side of the glass film 11, when the peeling of the glass film 11 is completed, the phenomenon that the peeling progresses sharply is often seen. Further, when the end portion on the peeling end side of the glass film 11 is peeled off sharply, the glass film 11 may undergo a sharp curvature change to cause breakage. However, as shown in FIG. 12(b), the end portion on the peeling end side of the glass film 11 is peeled off by the pressing means 35, whereby the sharp curvature change of the glass film 11 can be prevented, and the glass film 11 can be prevented. Broken.
而且，藉由使用各剝離治具20，30可輕易地實現，使用楔體4，對於玻璃膜積層體1之玻璃膜11和支承玻璃12的界面13，一邊從噴出口4c，4c...噴出流體41一邊從刃部4b側將楔體4輕易地***，且以使刃部4b朝界面13之未剝離部側移位的方式改變玻璃膜積層體1和楔體4的相對位置，而從支承玻璃12將玻璃膜11剝離。 Moreover, the use of the respective peeling jigs 20, 30 can be easily realized, using the wedge 4, for the glass film 11 of the glass film laminate 1 and the interface 13 of the supporting glass 12, from the ejection ports 4c, 4c... The discharge fluid 41 easily inserts the wedge body 4 from the blade portion 4b side, and changes the relative positions of the glass film laminate 1 and the wedge body 4 so that the blade portion 4b is displaced toward the unpeeled portion side of the interface 13, The glass film 11 is peeled off from the support glass 12.
此外，本發明的一實施形態的玻璃膜之剝離方法，作為剝離治具，較佳為使用如圖13(a)所示之第四實施形態的剝離治具70。 Further, in the method for peeling off the glass film according to the embodiment of the present invention, as the peeling jig, the peeling jig 70 of the fourth embodiment shown in Fig. 13 (a) is preferably used.
剝離治具70，是能讓使用楔體4之本發明的玻璃膜之剝離方法輕易地實現之治具，如圖13(a)所示般，係具備用來載置玻璃膜積層體1之載置部71。 The peeling jig 70 is a jig that can be easily realized by the peeling method of the glass film of the present invention using the wedge 4, and is provided with a glass film laminated body 1 as shown in Fig. 13 (a). The placing unit 71.
載置部71，是用來載置玻璃膜積層體1的部 位，在其載置面71a上刻設有作為吸附機構之溝槽部(未圖示)。而且，在該溝槽部連結著真空排氣手段(未圖示)，藉由將溝槽部內排氣，在載置面71a上將玻璃膜積層體1予以吸附固定。又溝槽部較佳為，分成複數區域，而能分別獨立進行排氣的態樣。 The placing portion 71 is a portion for placing the glass film laminate 1 A groove portion (not shown) as an adsorption mechanism is formed on the mounting surface 71a. Further, a vacuum evacuation means (not shown) is connected to the groove portion, and the glass membrane layered body 1 is adsorbed and fixed on the mounting surface 71a by exhausting the inside of the groove portion. Further, the groove portion is preferably divided into a plurality of regions, and the exhaust gas can be independently performed.
如果將溝槽部分成複數區域而構成的話，藉由一個載置部71，可對應於各種大小的玻璃膜積層體1。 If the groove portion is formed in a plurality of regions, the single-layer portion 71 can correspond to the glass film laminate 1 of various sizes.
又載置部71，是藉由移位機構72支承成能沿著箭頭β的方向往復移位。 Further, the placing portion 71 is supported by the shifting mechanism 72 so as to be reciprocally displaceable in the direction of the arrow β.
移位機構72，是藉由未圖示的測微頭(micrometer：head)驅動，藉由手動操作測微頭，能沿著軌道構件72a(亦即，沿箭頭β方向)使玻璃膜積層體1微小地移位。 The shifting mechanism 72 is driven by a micrometer (head) (not shown), and by manually operating the micrometer, the glass film laminate can be formed along the rail member 72a (that is, in the direction of the arrow β). 1 Minor shift.
此外，載置部71如圖13(b)所示般被支承成，相對於移位機構72可透過旋轉機構73而旋轉的狀態，藉此可調整玻璃膜積層體1對於楔體4的角度。 Further, as shown in FIG. 13(b), the placing portion 71 is rotatably supported by the rotating mechanism 73 with respect to the shifting mechanism 72, whereby the angle of the glass laminate 1 to the wedge 4 can be adjusted. .
再者，在剝離治具70，楔體4是透過移位機構(未圖示)而被支承，能朝圖13(a)所示的箭頭γ方向移位，按照玻璃膜積層體1之剝離開始部14的形成位置，可調整楔體4相對於玻璃膜積層體1的配置。 Further, in the peeling jig 70, the wedge body 4 is supported by a shifting mechanism (not shown), and can be displaced in the direction of the arrow γ shown in Fig. 13 (a), and peeled off according to the glass film layered body 1. The position of the start portion 14 can adjust the arrangement of the wedge 4 with respect to the glass film laminate 1.
接著說明，使用剝離治具70來將玻璃膜11剝離的順序。又使用剝離治具70將玻璃膜11剝離的情況較佳為，一邊從楔體4之刃部4b噴出適宜空氣等的流體一邊進行剝離。 Next, the procedure for peeling off the glass film 11 using the peeling jig 70 will be described. When the glass film 11 is peeled off by the peeling jig 70, it is preferable to peel off while ejecting a fluid such as air from the blade portion 4b of the wedge 4.
如圖14(a)所示般，當使用剝離治具70將玻璃膜11剝離時，首先藉由旋轉機構73使載置部71旋轉約45度，使玻璃膜積層體1的角部面對楔體4的刃部4b。這時，刃部4b的高度是與玻璃膜積層體1之界面13(參照圖8)的高度大致一致。 As shown in Fig. 14 (a), when the glass film 11 is peeled off using the peeling jig 70, first, the mounting portion 71 is rotated by about 45 degrees by the rotating mechanism 73, so that the corner portion of the glass film laminated body 1 faces. The blade portion 4b of the wedge body 4. At this time, the height of the blade portion 4b substantially coincides with the height of the interface 13 (see FIG. 8) of the glass film laminate 1.
接著，藉由移位機構72使載置部71朝楔體4側(箭頭β1方向)移位，讓刃部4b切入角部而製作剝離開始部14。 Then, the placing unit 71 is displaced toward the wedge 4 side (in the direction of the arrow β1) by the shifting mechanism 72, and the blade portion 4b is cut into the corner portion to form the peeling start portion 14.
而且，從該狀態起，如圖14(b)所示般，進一步藉由移位機構72使載置部71朝楔體4側(箭頭β1方向)移位，直到玻璃膜11之剝離始端側的一端遍及全寬被剝離為止，讓玻璃膜11的剝離繼續進展。 Further, from this state, as shown in FIG. 14(b), the placing portion 71 is further displaced toward the wedge body 4 side (arrow β1 direction) by the shift mechanism 72 until the peeling start side of the glass film 11 One end of the glass film 11 continues to progress as the entire width is peeled off.
接著，如圖15(a)所示般，藉由移位機構72使載置部71朝離開楔體4的一側(箭頭β2方向)一度移位，使楔體4離開玻璃膜積層體1。 Then, as shown in FIG. 15(a), the placing portion 71 is once displaced toward the side away from the wedge 4 (in the direction of the arrow β2) by the shift mechanism 72, and the wedge body 4 is separated from the glass film laminate 1 .
接下來，如圖15(b)所示般，藉由旋轉機構73使載置部71旋轉，調整玻璃膜積層體1的姿勢，而使玻璃膜11的一端部和刃部4b成為平行。 Then, as shown in FIG. 15(b), the mounting portion 71 is rotated by the rotation mechanism 73 to adjust the posture of the glass laminate 1 so that one end portion of the glass film 11 and the blade portion 4b are parallel.
接著，如圖16(a)所示般，再度藉由移位機構72使載置部71朝楔體4側(箭頭β1方向)移位，再度使刃部4b切入剝離開始端側，進一步藉由移位機構72使載置部71朝楔體4側移位。 Then, as shown in Fig. 16 (a), the placing portion 71 is again displaced toward the wedge 4 side (arrow β1 direction) by the shifting mechanism 72, and the blade portion 4b is again cut into the peeling start end side, and further borrowed. The placing unit 71 is displaced toward the wedge 4 by the shifting mechanism 72.
接著，如圖16(b)所示般，直到玻璃膜1遍及全長被剝離為止，再度藉由移位機構72使載置部71朝楔體4側 (箭頭β1方向)移位，一邊使玻璃膜1的剝離以微小的速度進展一邊從支承玻璃2將玻璃膜1剝離。 Next, as shown in FIG. 16(b), until the glass film 1 is peeled off over the entire length, the placing portion 71 is again brought to the side of the wedge 4 by the shift mechanism 72. In the (arrow β1 direction), the glass film 1 is peeled off from the support glass 2 while the peeling of the glass film 1 progresses at a slight speed.
依據這種剝離治具70，容易以剝離開始部14為起點，以玻璃膜11毫無破損的方式，將其一端部遍及全寬進行剝離，然後，在讓剝離進展的階段也是，能輕易地維持微小的剝離速度而進行剝離，因此能將玻璃膜11毫無破損且確實地進行剝離。 According to the peeling jig 70, it is easy to peel off one end portion of the glass film 11 from the full width so that the peeling start portion 14 is not used as a starting point, and then it is possible to easily perform the peeling progress. Since the peeling speed is maintained at a small peeling speed, the glass film 11 can be peeled off without any damage.
在使用上述剝離治具70之剝離方法，雖是如圖15(a)所示般一度使楔體4離開玻璃膜積層體1，但亦可使楔體4不離開玻璃膜積層體1，而從圖14(b)的狀態起藉由旋轉機構73繼續旋轉，當玻璃膜11的一端部和刃部4b成為平行後，直到玻璃膜11遍及全長被剝離為止，藉由移位機構72使載置部71朝楔體4側(箭頭β1方向)移位而進行玻璃膜1的剝離。 In the peeling method using the peeling jig 70 described above, the wedge body 4 is once separated from the glass film layered body 1 as shown in FIG. 15(a), but the wedge body 4 may not be separated from the glass film layered body 1. When the rotation of the rotation mechanism 73 is continued from the state of FIG. 14(b), when one end portion of the glass film 11 and the blade portion 4b are parallel, the glass film 11 is loaded by the shift mechanism 72 until the entire length of the glass film 11 is peeled off. The placement portion 71 is displaced toward the wedge 4 side (in the direction of the arrow β1) to peel off the glass film 1.
在使用上述剝離治具70之剝離方法，雖是讓楔體4的刃部4b切入來製作剝離開始部14，但當玻璃膜11和支承玻璃12的接著力較強的情況，雖未圖示出，另外使比剝離治具70更薄的剝離開始構件切入來製作剝離開始部14亦可。此外，另外藉由未圖示的薄型剝離開始構件，事先使玻璃膜積層體1之剝離開始端側的全寬剝離亦可。 In the peeling method using the peeling jig 70 described above, the peeling start portion 14 is formed by cutting the blade portion 4b of the wedge body 4. However, when the adhesion between the glass film 11 and the supporting glass 12 is strong, it is not shown. Further, the peeling start member which is thinner than the peeling jig 70 may be cut in to form the peeling start portion 14. In addition, the full width of the peeling start end side of the glass film layered body 1 may be peeled off in advance by a thin peeling start member (not shown).
本發明是關於在從玻璃膜積層體將玻璃膜剝 離的情況有效的剝離方法，其剝離對象並不限定為玻璃膜的情況，可適用於從基材將薄片狀構件剝離的情況。 The present invention relates to peeling a glass film from a glass film laminate In the case of the peeling method which is effective, the peeling target is not limited to the case of a glass film, and can be applied to the case where the sheet-like member is peeled off from the base material.
1‧‧‧玻璃膜積層體 1‧‧‧Glass laminar body
2‧‧‧覆蓋玻璃 2‧‧‧ Covering glass
3‧‧‧帶有支承玻璃的電子裝置 3‧‧‧Electronic devices with supporting glass
4‧‧‧楔體 4‧‧‧Wedge
11‧‧‧玻璃膜 11‧‧‧ glass film
12‧‧‧支承玻璃 12‧‧‧Support glass
13‧‧‧界面 13‧‧‧ interface
41‧‧‧流體 41‧‧‧ Fluid
51‧‧‧元件 51‧‧‧ components
Claims (8)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013153093 | 2013-07-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW201518229A true TW201518229A (en) | 2015-05-16 |
Family
ID=52393303
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW103125294A TW201518229A (en) | 2013-07-23 | 2014-07-24 | Glass film manufacturing method, and glass film peeling method |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPWO2015012268A1 (en) |
| TW (1) | TW201518229A (en) |
| WO (1) | WO2015012268A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106298617A (en) * | 2015-05-25 | 2017-01-04 | 中华映管股份有限公司 | Delamination method for laminated structure |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6519951B2 (en) * | 2015-07-24 | 2019-05-29 | 日本電気硝子株式会社 | METHOD FOR MANUFACTURING GLASS FILM, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE INCLUDING GLASS FILM |
| JP2019135180A (en) * | 2016-06-13 | 2019-08-15 | Ａｇｃ株式会社 | Peeling method and peeling device |
| KR102437535B1 (en) | 2016-11-15 | 2022-08-30 | 코닝 인코포레이티드 | How to process the substrate |
| WO2024053565A1 (en) * | 2022-09-05 | 2024-03-14 | 三井金属鉱業株式会社 | Circuit board manufacturing method |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3199964B2 (en) * | 1994-10-07 | 2001-08-20 | シャープ株式会社 | Substrate peeling device |
| JP3910485B2 (en) * | 2002-05-15 | 2007-04-25 | シャープ株式会社 | Film peeling apparatus and film peeling method |
| JP4241697B2 (en) * | 2005-09-06 | 2009-03-18 | ユーテック株式会社 | Film peeling device |
| TW201033000A (en) * | 2009-01-09 | 2010-09-16 | Asahi Glass Co Ltd | Glass laminate and manufacturing method therefor |
| CN102576106B (en) * | 2009-10-20 | 2015-02-11 | 旭硝子株式会社 | Glass laminate, glass laminate manufacturing method, display panel manufacturing method, and display panel obtained by means of display panel manufacturing method |
| US9156230B2 (en) * | 2010-01-12 | 2015-10-13 | Nippon Electric Glass Co., Ltd. | Glass film laminate without adhesive |
-
2014
- 2014-07-22 WO PCT/JP2014/069333 patent/WO2015012268A1/en active Application Filing
- 2014-07-22 JP JP2014535843A patent/JPWO2015012268A1/en active Pending
- 2014-07-24 TW TW103125294A patent/TW201518229A/en unknown
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106298617A (en) * | 2015-05-25 | 2017-01-04 | 中华映管股份有限公司 | Delamination method for laminated structure |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2015012268A1 (en) | 2015-01-29 |
| JPWO2015012268A1 (en) | 2017-03-02 |
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