TW201514065A - Package structure for solar modules - Google Patents
Package structure for solar modules Download PDFInfo
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- TW201514065A TW201514065A TW102135685A TW102135685A TW201514065A TW 201514065 A TW201514065 A TW 201514065A TW 102135685 A TW102135685 A TW 102135685A TW 102135685 A TW102135685 A TW 102135685A TW 201514065 A TW201514065 A TW 201514065A
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Abstract
Description
本發明是有關一種太陽能模組之包裝結構。 The invention relates to a packaging structure of a solar module.
習知用來容置太陽能模組的包裝結構可具有上蓋與下蓋，而太陽能模組位於上蓋與下蓋形成的空間中。其中，上蓋與下蓋為紙板製作，紙板的邊緣可被彎折而形成側壁，相鄰的側壁搭配黏膠或釘子彼此連接。 The packaging structure for accommodating the solar module may have an upper cover and a lower cover, and the solar module is located in a space formed by the upper cover and the lower cover. Wherein, the upper cover and the lower cover are made of cardboard, the edge of the cardboard can be bent to form a side wall, and the adjacent side walls are connected with each other by glue or nail.
由於上蓋與下蓋並無其他支撐結構，在垂直方向的抗壓強度差。當包裝結構堆疊時，下層包裝結構中的太陽能模組容易受壓力而損壞。此外，包裝結構在打束帶的過程中，上蓋與下蓋因強度不足，可能會受束帶施壓而變形，造成其內的太陽能模組破裂。 Since the upper cover and the lower cover have no other supporting structure, the compressive strength in the vertical direction is poor. When the packaging structure is stacked, the solar modules in the lower packaging structure are easily damaged by pressure. In addition, during the process of winding the belt, the upper cover and the lower cover may be deformed by the pressure of the belt due to insufficient strength, causing the solar module therein to rupture.
為了增加包裝結構的強度，太陽能模組製造商可在上蓋與下蓋形成的空間中放置額外的發泡棉(其材質例如為發泡聚乙烯；EPE)，以提供包裝結構較佳的抗壓強度。然而，發泡棉的材料成本高，且需經切割製程才可使用，使包裝結構的成本增加。另外，當發泡棉安裝於包裝結構時，需較大的包裝結構才具有足夠的空間容納發泡棉，因 此對於運輸工具而言，具發泡棉之包裝結構的運輸量較少，會提高太陽能模組的出貨成本。 In order to increase the strength of the packaging structure, the solar module manufacturer can place additional foamed cotton (such as foamed polyethylene; EPE) in the space formed by the upper and lower covers to provide better compression resistance of the packaging structure. strength. However, the material cost of the foamed cotton is high and requires a cutting process to be used, so that the cost of the packaging structure is increased. In addition, when the foamed cotton is installed in the packaging structure, a larger packaging structure is required to have sufficient space for the foamed cotton, because For transport vehicles, the packaging structure with foamed cotton is less transported, which increases the cost of shipping solar modules.
本發明之一技術態樣為一種太陽能模組之包裝結構。 One aspect of the present invention is a packaging structure of a solar module.
根據本發明一實施方式，一種太陽能模組之包裝結構包含箱體、隔板與至少一補強塊。箱體包含上蓋與下蓋。上蓋與下蓋共同定義容置空間。隔板設置於容置空間中以將容置空間分隔為上下配置的兩個次容置空間，用以分別容納太陽能模組。隔板具有至少一凹部。凹部與箱體共同形成至少一定位槽。補強塊可拆卸地定位於定位槽中。補強塊具有相對兩端面，且補強塊之端面用以分別抵頂上蓋與下蓋。 According to an embodiment of the invention, a packaging structure of a solar module includes a box body, a partition plate and at least one reinforcing block. The box body includes an upper cover and a lower cover. The upper cover and the lower cover together define an accommodation space. The partition plate is disposed in the accommodating space to divide the accommodating space into two sub-accommodating spaces arranged up and down to respectively accommodate the solar module. The separator has at least one recess. The recess and the case form at least one positioning groove. The reinforcing block is detachably positioned in the positioning groove. The reinforcing block has opposite end faces, and the end faces of the reinforcing block are used to respectively abut the upper cover and the lower cover.
在本發明上述實施方式中，由於隔板的凹部與箱體共同形成定位槽，因此補強塊可拆卸地定位於定位槽中。在使用時，補強塊的相對兩端面可分別抵頂箱體的上蓋與下蓋，以提供包裝結構的抗壓強度。 In the above embodiment of the present invention, since the concave portion of the partition forms a positioning groove together with the casing, the reinforcing block is detachably positioned in the positioning groove. In use, the opposite end faces of the reinforcing block can respectively abut the upper cover and the lower cover of the top cover to provide the compressive strength of the packaging structure.
本發明之另一技術態樣為一種太陽能模組之包裝結構。 Another technical aspect of the present invention is a packaging structure of a solar module.
根據本發明一實施方式，一種太陽能模組之包裝結構包含箱體、至少一隔板與至少兩補強塊。箱體包含上蓋與下蓋。上蓋與下蓋共同定義容置空間。隔板設置於容置空間中以將容置空間分隔為上下配置的兩個次容置空間， 用以分別容納太陽能模組。兩補強塊分別設置於容置空間中之相對兩側。每一補強塊具有卡合槽。隔板之端緣可拆卸地定位於卡合槽中。具有相對兩端面，補強塊之兩端面用以分別抵頂該上蓋與下蓋。 According to an embodiment of the invention, a packaging structure of a solar module includes a box body, at least one partition plate and at least two reinforcing blocks. The box body includes an upper cover and a lower cover. The upper cover and the lower cover together define an accommodation space. The partition plate is disposed in the accommodating space to divide the accommodating space into two sub-accommodating spaces arranged up and down, Used to accommodate solar modules separately. The two reinforcing blocks are respectively disposed on opposite sides of the accommodating space. Each reinforcing block has an engaging groove. The end edge of the partition is detachably positioned in the engaging groove. There are opposite end faces, and both end faces of the reinforcing block are used to respectively abut the upper cover and the lower cover.
在本發明上述實施方式中，由於補強塊具有卡合槽，因此隔板之端緣可拆卸地定位於卡合槽中。在使用時，補強塊的相對兩端面可分別抵頂箱體的上蓋與下蓋，以提供包裝結構的抗壓強度。 In the above embodiment of the invention, since the reinforcing block has the engaging groove, the end edge of the partition is detachably positioned in the engaging groove. In use, the opposite end faces of the reinforcing block can respectively abut the upper cover and the lower cover of the top cover to provide the compressive strength of the packaging structure.
100‧‧‧包裝結構 100‧‧‧Packaging structure
110‧‧‧箱體 110‧‧‧ cabinet
112‧‧‧上蓋 112‧‧‧上盖
114‧‧‧下蓋 114‧‧‧Under the cover
114a‧‧‧下蓋 114a‧‧‧下盖
116‧‧‧容置空間 116‧‧‧ accommodating space
121‧‧‧第一折頁 121‧‧‧First fold
122‧‧‧底板 122‧‧‧floor
123‧‧‧第二折頁 123‧‧‧ second fold
124‧‧‧第一側壁 124‧‧‧First side wall
125‧‧‧插口 125‧‧‧ socket
125a‧‧‧插口 125a‧‧‧ socket
126‧‧‧第二側壁 126‧‧‧ second side wall
127‧‧‧插片 127‧‧‧ inserts
127a‧‧‧插片 127a‧‧‧ insert
128‧‧‧支撐板 128‧‧‧Support board
128a‧‧‧支撐板 128a‧‧‧Support board
130‧‧‧隔板 130‧‧‧Baffle
130a‧‧‧隔板 130a‧‧‧Baffle
132‧‧‧凹部 132‧‧‧ recess
132a‧‧‧凹部 132a‧‧‧ recess
134‧‧‧定位槽 134‧‧‧ positioning slot
136a‧‧‧主表面 136a‧‧‧Main surface
136b‧‧‧主表面 136b‧‧‧Main surface
140‧‧‧補強塊 140‧‧‧ reinforcing block
140a‧‧‧補強塊 140a‧‧‧ reinforcing block
140b‧‧‧補強塊 140b‧‧‧ reinforcing block
142‧‧‧端面 142‧‧‧ end face
144‧‧‧端面 144‧‧‧ end face
146‧‧‧卡合槽 146‧‧‧ snap groove
202‧‧‧棧板 202‧‧‧ pallet
210a‧‧‧電子裝置 210a‧‧‧Electronic devices
210b‧‧‧電子裝置 210b‧‧‧Electronic device
220‧‧‧直立式包裝箱 220‧‧‧Vertical box
6-6‧‧‧線段 6-6‧‧‧ segments
H1‧‧‧垂直距離 H1‧‧‧ vertical distance
D‧‧‧支撐方向 D‧‧‧Support direction
H2‧‧‧垂直距離 H2‧‧‧Vertical distance
第1圖繪示根據本發明一實施方式之太陽能模組之包裝結構的立體圖。 FIG. 1 is a perspective view showing a packaging structure of a solar module according to an embodiment of the present invention.
第2圖繪示第1圖之太陽能模組之包裝結構的分解圖。 FIG. 2 is an exploded view showing the packaging structure of the solar module of FIG. 1.
第3圖繪示第2圖之隔板組裝於下蓋時的俯視圖。 Fig. 3 is a plan view showing the spacer of Fig. 2 assembled to the lower cover.
第4圖繪示第2圖之隔板與補強塊組裝於下蓋時的立體圖。 Fig. 4 is a perspective view showing the spacer and the reinforcing block of Fig. 2 assembled to the lower cover.
第5圖繪示第2圖之下蓋的展開圖。 Fig. 5 is a view showing the unfolded view of the lower cover of Fig. 2.
第6圖繪示第1圖之包裝結構容置電子裝置時沿線段6-6的剖面圖。 FIG. 6 is a cross-sectional view along line 6-6 of the package structure of FIG. 1 when the electronic device is housed.
第7圖繪示第6圖之包裝結構堆疊時的前視圖。 Figure 7 is a front elevational view showing the packaging structure of Figure 6 stacked.
第8圖繪示第6圖之包裝結構位於兩直立式包裝箱上的前視圖。 Figure 8 is a front elevational view of the package structure of Figure 6 on two upright packages.
第9圖繪示根據本發明一實施方式之隔板與補強塊組 裝於下蓋時的立體圖。 Figure 9 is a diagram showing a spacer and a reinforcing block according to an embodiment of the present invention. A perspective view when mounted on the lower cover.
第10圖繪示根據本發明一實施方式之隔板與補強塊組裝於下蓋時的立體圖。 FIG. 10 is a perspective view showing a state in which a partition plate and a reinforcing block are assembled to a lower cover according to an embodiment of the present invention.
第11圖繪示根據本發明另一實施方式之下蓋的展開圖。 11 is a developed view of a lower cover according to another embodiment of the present invention.
第12圖繪示根據本發明一實施方式之隔板與補強塊組裝於下蓋時的立體圖。 Fig. 12 is a perspective view showing a state in which a partition plate and a reinforcing block are assembled to a lower cover according to an embodiment of the present invention.
第13圖繪示第12圖之隔板與補強塊的立體圖。 Fig. 13 is a perspective view showing the partition plate and the reinforcing block of Fig. 12.
第14圖繪示根據本發明一實施方式之隔板與補強塊的分解圖。 Figure 14 is an exploded view of a spacer and a reinforcing block according to an embodiment of the present invention.
以下將以圖式揭露本發明之複數個實施方式，為明確說明起見，許多實務上的細節將在以下敘述中一併說明。然而，應瞭解到，這些實務上的細節不應用以限制本發明。也就是說，在本發明部分實施方式中，這些實務上的細節是非必要的。此外，為簡化圖式起見，一些習知慣用的結構與元件在圖式中將以簡單示意的方式繪示之。 The embodiments of the present invention are disclosed in the following drawings, and the details of However, it should be understood that these practical details are not intended to limit the invention. That is, in some embodiments of the invention, these practical details are not necessary. In addition, some of the conventional structures and elements are shown in the drawings in a simplified schematic manner in order to simplify the drawings.
第1圖繪示根據本發明一實施方式之太陽能模組之包裝結構100的立體圖。第2圖繪示第1圖之太陽能模組之包裝結構100的分解圖。同時參閱第1圖與第2圖，包裝結構100包含箱體110、隔板130與補強塊140。其中，箱體110包含上蓋112與下蓋114，且上蓋112與下蓋114共同定義容置空間116，用以容納複數板狀物件，例如複數 太陽能模組或顯示器模組。隔板130與補強塊140設置於容置空間116中，隔板130用以將容置空間116分隔為上下配置的至少兩次容置空間，每一次容置空間可用來容納至少一板狀物件(例如第6圖之電子裝置210a、210b)。 FIG. 1 is a perspective view of a packaging structure 100 of a solar module according to an embodiment of the present invention. 2 is an exploded view of the packaging structure 100 of the solar module of FIG. 1. Referring also to FIGS. 1 and 2, the package structure 100 includes a case 110, a partition 130, and a reinforcing block 140. The upper part 112 and the lower cover 114 together define an accommodating space 116 for accommodating a plurality of plate members, for example, plural Solar module or display module. The partitioning block 130 and the reinforcing block 140 are disposed in the accommodating space 116. The partitioning plate 130 is configured to divide the accommodating space 116 into at least two accommodating spaces arranged up and down, and each accommodating space can be used for accommodating at least one plate-shaped member. (For example, the electronic devices 210a, 210b of Fig. 6).
隔板130具有相對之兩主表面136a、136b，兩主表面136a、136b之間的距離定義為隔板130之厚度H2。隔板130與下蓋114之底板122具有大致相似的輪廓，例如隔板130的長邊的長度與底板122的長邊的長度約略相等，而隔板130的短邊的寬度與底板122的短邊的寬度約略相等。補強塊140具有相對兩端面142、144，且補強塊140之端面142、144間的垂直距離H1大於隔板130之主表面136a、136b間的垂直距離H2，亦即隔板130之厚度。如此一來，補強塊140具有橫跨端面142、144之支撐方向D，且支撐方向D與隔板130之主表面136a、136b其中任一者大致垂直。 The spacer 130 has opposite major surfaces 136a, 136b, and the distance between the two major surfaces 136a, 136b is defined as the thickness H2 of the spacer 130. The partition 130 has a substantially similar profile to the bottom plate 122 of the lower cover 114. For example, the length of the long side of the partition 130 is approximately equal to the length of the long side of the bottom plate 122, and the width of the short side of the partition 130 is shorter than the thickness of the bottom plate 122. The width of the sides is approximately equal. The reinforcing block 140 has opposite end faces 142, 144, and the vertical distance H1 between the end faces 142, 144 of the reinforcing block 140 is greater than the vertical distance H2 between the main faces 136a, 136b of the spacer 130, that is, the thickness of the spacer 130. As such, the stiffening block 140 has a support direction D across the end faces 142, 144, and the support direction D is substantially perpendicular to either of the major surfaces 136a, 136b of the spacer 130.
第3圖繪示第2圖之隔板130組裝於下蓋114時的俯視圖。同時參閱第2圖與第3圖，隔板130具有複數個凹部132，且隔板130的凹部132與箱體110(見第1圖)之下蓋114共同形成複數個定位槽134，其中不在隔板130角落的定位槽134數量並不以限制本發明。在本實施方式中，位於容置空間116之長邊的定位槽134呈長條形，而位於容置空間116之角落的定位槽134呈L形，但並不以限制本發明。此外，不在隔板130角落的定位槽134與位在隔板130角落任一邊的定位槽134長度相同，因此均可 使用相同的補強塊140，方便製造與組裝。 FIG. 3 is a plan view showing the spacer 130 of FIG. 2 assembled to the lower cover 114. Referring to FIGS. 2 and 3, the partition 130 has a plurality of recesses 132, and the recess 132 of the partition 130 and the lower cover 114 of the casing 110 (see FIG. 1) form a plurality of positioning slots 134, wherein The number of locating slots 134 at the corners of the spacer 130 is not intended to limit the invention. In the present embodiment, the positioning groove 134 located on the long side of the accommodating space 116 has an elongated shape, and the positioning groove 134 located at the corner of the accommodating space 116 has an L shape, but does not limit the present invention. In addition, the positioning groove 134 not at the corner of the partition plate 130 has the same length as the positioning groove 134 located at either side of the corner of the partition plate 130, and thus The same reinforcing block 140 is used to facilitate manufacturing and assembly.
第4圖繪示第2圖之隔板130與補強塊140組裝於下蓋114時的立體圖。同時參閱第3圖與第4圖，當隔板130組裝於下蓋114時，凹部132與下蓋114間的定位槽134可供補強塊140***。也就是說，補強塊140可拆卸地定位於定位槽134中。在本實施方式中，補強塊140均呈長條狀，且兩長條狀補強塊140經組合後可具有L形外觀。如此一來，位於容置空間116之角落的L形定位槽134可由兩長條狀的補強塊140***。 FIG. 4 is a perspective view showing the partition plate 130 and the reinforcing block 140 of FIG. 2 assembled to the lower cover 114. Referring to FIGS. 3 and 4, when the partition 130 is assembled to the lower cover 114, the positioning groove 134 between the recess 132 and the lower cover 114 is inserted into the reinforcing block 140. That is, the reinforcing block 140 is detachably positioned in the positioning groove 134. In the present embodiment, the reinforcing blocks 140 are each elongated, and the two elongated reinforcing blocks 140 may have an L-shaped appearance when combined. In this way, the L-shaped positioning grooves 134 located at the corners of the accommodating space 116 can be inserted by the two elongated reinforcing blocks 140.
同時參閱第2圖與第4圖，當上蓋112覆蓋於下蓋114時，補強塊140之端面142可抵頂上蓋112，且補強塊140之端面144可抵頂下蓋114，因此，補強塊140之端面142、144間的垂直距離H1相當於上蓋112與下蓋114之間容置空間116的高度。如此一來，包裝結構100的在垂直方向的抗壓強度便可藉由補強塊140提升。在本實施方式中，箱體110(見第1圖)之上蓋112與下蓋114、隔板130與補強塊140的材質均為紙，材料便宜且所占體積小，可節省習知使用發泡棉的成本與空間。 Referring to FIG. 2 and FIG. 4 simultaneously, when the upper cover 112 covers the lower cover 114, the end surface 142 of the reinforcing block 140 can abut the top cover 112, and the end surface 144 of the reinforcing block 140 can abut the top cover 114. Therefore, the reinforcing block The vertical distance H1 between the end faces 142 and 144 of 140 corresponds to the height of the accommodation space 116 between the upper cover 112 and the lower cover 114. As a result, the compressive strength of the packaging structure 100 in the vertical direction can be increased by the reinforcing block 140. In the present embodiment, the upper cover 112 and the lower cover 114, the partition plate 130 and the reinforcing block 140 are made of paper, and the material is cheap and the volume is small, so that the conventional use can be saved. The cost and space of foam.
在以下敘述中，將說明上述下蓋114的結構，而此結構的下蓋114可提升整體包裝結構100的抗壓強度。 In the following description, the structure of the lower cover 114 described above will be explained, and the lower cover 114 of this structure can improve the compressive strength of the overall package structure 100.
第5圖繪示第2圖之下蓋114的展開圖。如圖所示，下蓋114包含底板122、一對第一側壁124與一對第二側壁126。兩第一側壁124鄰接於底板122之相對側邊而彼此相對。每一第一側壁124具有第一折頁121與第二折頁 123。其中，第一折頁121鄰接底板122之側邊，且第一折頁121與底板122之鄰接處具有複數插口125。第二折頁123鄰接第一折頁121，且第二折頁123遠離第一折頁121之端緣具有複數突出的插片127。在組裝下蓋114時，可將第二折頁123向第一折頁121與底板122之鄰接處反折，使得插片127***插口125中固定。 Fig. 5 is a view showing the development of the lower cover 114 of Fig. 2. As shown, the lower cover 114 includes a bottom plate 122, a pair of first side walls 124, and a pair of second side walls 126. The two first side walls 124 are adjacent to each other adjacent to opposite sides of the bottom plate 122. Each first side wall 124 has a first hinge 121 and a second hinge 123. The first flap 121 is adjacent to the side of the bottom plate 122, and the first flap 121 has a plurality of sockets 125 adjacent to the bottom plate 122. The second flap 123 abuts the first flap 121, and the second flap 123 has a plurality of protruding tabs 127 away from the end edge of the first flap 121. When the lower cover 114 is assembled, the second flap 123 can be folded back toward the abutment of the first flap 121 and the bottom plate 122, so that the insert 127 is inserted into the socket 125 for fixing.
此外，兩第二側壁126鄰接於底板122之另一對相對側邊而彼此相對。每一第二側壁126之兩端均具有支撐板128。在組裝下蓋114時，可將支撐板128彎折夾置於第一折頁121與第二折頁123之間。藉由第一折頁121、第二折頁123與支撐板128的設計，便可提升下蓋114的抗壓強度。此外，下蓋114不需使用黏膠或釘子成型，可節省時間與材料成本。 Additionally, the two second side walls 126 abut each other opposite the other pair of opposite sides of the bottom plate 122. Each of the second side walls 126 has a support plate 128 at both ends thereof. When the lower cover 114 is assembled, the support plate 128 can be bent and sandwiched between the first flap 121 and the second flap 123. The compressive strength of the lower cover 114 can be improved by the design of the first flap 121, the second flap 123 and the support plate 128. In addition, the lower cover 114 does not require the use of adhesive or nail molding, which saves time and material costs.
第6圖繪示第1圖之包裝結構100容置電子裝置210a、210b時沿線段6-6的剖面圖。同時參閱第3圖與第6圖，在包裝板狀電子裝置210a、210b時，可先將電子裝置210a放置於下蓋114的底板122上。接著將隔板130放置於電子裝置210a背對底板122的表面上，此時隔板130之凹部132與下蓋114間會形成定位槽134，如第3圖所示。之後便可將補強塊140***定位槽134中。接著將電子裝置210b放置於隔板130背對電子裝置210a的表面上。最後蓋上上蓋112，使得補強塊140抵頂上蓋112與下蓋114。上述的順序並不以限制本發明，舉例來說，使用者亦可先將補強塊140放置於下蓋114中，接著才依序放置電 子裝置210a與隔板130於下蓋114中。 FIG. 6 is a cross-sectional view along line 6-6 of the packaging structure 100 of FIG. 1 when the electronic devices 210a and 210b are housed. Referring to FIGS. 3 and 6, the electronic device 210a can be placed on the bottom plate 122 of the lower cover 114 when the board-shaped electronic devices 210a and 210b are packaged. Then, the spacer 130 is placed on the surface of the electronic device 210a facing away from the bottom plate 122. At this time, a positioning groove 134 is formed between the recess 132 and the lower cover 114 of the spacer 130, as shown in FIG. The reinforcing block 140 can then be inserted into the positioning slot 134. The electronic device 210b is then placed on the surface of the spacer 130 facing away from the electronic device 210a. Finally, the upper cover 112 is covered so that the reinforcing block 140 abuts the upper cover 112 and the lower cover 114. The above sequence is not intended to limit the present invention. For example, the user may first place the reinforcing block 140 in the lower cover 114, and then sequentially place the electricity. The sub-device 210a and the partition 130 are in the lower cover 114.
待蓋上上蓋112後，包裝結構100可經打束帶製程，使上蓋112與下蓋114由束帶固定避免分開。由於隔板130、補強塊140與下蓋114的結構可提升包裝結構100的強度，上蓋112與下蓋114不易受束帶施壓而變形，可保護容置空間116中的電子裝置210a、210b。在本實施方式中，電子裝置210a、210b可以為太陽能模組或顯示器模組，不以限制本發明。 After the upper cover 112 is to be covered, the packaging structure 100 can be processed by the belt, so that the upper cover 112 and the lower cover 114 are fixed by the strap to avoid separation. Since the structure of the spacer 130, the reinforcing block 140 and the lower cover 114 can improve the strength of the packaging structure 100, the upper cover 112 and the lower cover 114 are not easily deformed by the belt pressing, and the electronic devices 210a, 210b in the accommodating space 116 can be protected. . In the present embodiment, the electronic devices 210a and 210b may be solar modules or display modules, and are not intended to limit the present invention.
第7圖繪示第6圖之包裝結構100堆疊時的前視圖。同時參閱第6圖與第7圖，由於包裝結構100在上蓋112與下蓋114之間垂直方向的抗壓強度可藉由補強塊140提升，因此當包裝結構100堆疊時，下層包裝結構100中的電子裝置210a、210b不易受壓力而損壞。在本實施方式中，包裝結構100的抗壓力可達3449 kgf，運輸時可同時堆疊20至25箱於一片棧板202上，也就是能包裝40至50片的電子裝置210a、210b的運輸量。 FIG. 7 is a front view showing the packaging structure 100 of FIG. 6 stacked. Referring to FIG. 6 and FIG. 7 , since the compressive strength of the packaging structure 100 in the vertical direction between the upper cover 112 and the lower cover 114 can be increased by the reinforcing block 140, when the packaging structure 100 is stacked, the lower packaging structure 100 is The electronic devices 210a, 210b are less susceptible to damage by pressure. In the present embodiment, the packaging structure 100 can withstand a pressure of 3,449 kgf, and can transport 20 to 25 boxes simultaneously on one pallet 202 during transportation, that is, the transportation capacity of the electronic devices 210a and 210b capable of packaging 40 to 50 sheets. .
第8圖繪示第6圖之包裝結構100位於兩直立式包裝箱220上的前視圖，第6圖之包裝結構100例如為兩片式包裝結構，而直立式包裝箱220例如為多片式包裝結構。同時參閱第6圖與第8圖，兩直立式包裝箱220併排排列，包裝結構100位於兩直立式包裝箱220的上表面，且包裝結構100的長邊長度與兩直立式包裝箱220之上表面的兩短邊長度和大致相同。如此一來，當貨車運送兩直立式包裝箱220時，包裝結構100因體積小能疊置於兩直立式包 裝箱220之上表面，可提高電子裝置210a、210b的運輸量，降低出貨成本。 8 is a front view of the packaging structure 100 of FIG. 6 on the two vertical packaging boxes 220. The packaging structure 100 of FIG. 6 is, for example, a two-piece packaging structure, and the vertical packaging box 220 is, for example, a multi-piece. Packaging structure. Referring also to FIGS. 6 and 8, the two vertical packaging boxes 220 are arranged side by side, and the packaging structure 100 is located on the upper surface of the two vertical packaging boxes 220, and the long side length of the packaging structure 100 is above the two vertical packaging boxes 220. The length of the two short sides of the surface is approximately the same. In this way, when the truck transports two vertical packaging boxes 220, the packaging structure 100 can be stacked in two vertical packages due to its small size. The upper surface of the box 220 can increase the transportation amount of the electronic devices 210a and 210b and reduce the shipping cost.
應瞭解到，在以下敘述中，已敘述過的元件連接關係將不在重複贅述，合先敘明。 It should be understood that in the following description, the component connection relationships that have been described will not be repeated, and will be described first.
第9圖繪示根據本發明一實施方式之隔板130與補強塊140a組裝於下蓋114時的立體圖。與第4圖實施方式不同的地方在於：補強塊140a呈L形而位於容置空間116的角落。其中，補強塊140a可以為長條狀但經彎折而呈L形的紙板，依設計者需求而定。 FIG. 9 is a perspective view of the spacer 130 and the reinforcing block 140a assembled to the lower cover 114 according to an embodiment of the present invention. The difference from the embodiment of FIG. 4 is that the reinforcing block 140a is L-shaped and is located at a corner of the accommodating space 116. Wherein, the reinforcing block 140a may be a long strip-shaped cardboard which is bent and L-shaped, depending on the needs of the designer.
第10圖繪示根據本發明一實施方式之隔板130與補強塊140組裝於下蓋114時的立體圖。與第4圖實施方式不同的地方在於：隔板130具有凹部132a，且凹部132a的缺口大於第4圖凹部132的缺口。在本實施方式中，凹部132a與下蓋114間可***兩補強塊140，以提升包裝結構100(見第2圖)的抗壓強度。也就是說，凹部132a的缺口大小與補強塊140的數量可依設計者需求而定，不以限制本發明。 FIG. 10 is a perspective view of the spacer 130 and the reinforcing block 140 assembled to the lower cover 114 according to an embodiment of the present invention. The difference from the embodiment of Fig. 4 is that the partition 130 has a recess 132a, and the recess of the recess 132a is larger than the recess of the recess 132 of Fig. 4. In the present embodiment, two reinforcing blocks 140 can be inserted between the recess 132a and the lower cover 114 to improve the compressive strength of the package structure 100 (see FIG. 2). That is, the size of the notch of the recess 132a and the number of the reinforcing blocks 140 may be determined by the designer and are not intended to limit the present invention.
第11圖繪示根據本發明另一實施方式之下蓋114a的展開圖。下蓋114a包含底板122、一對第一側壁124與一對第二側壁126。其中，兩第一側壁124鄰接於底板122之相對側邊而彼此相對。每一第一側壁124具有第一折頁121與第二折頁123，第一折頁121鄰接底板122之側邊，第二折頁123鄰接第一折頁121，第一折頁121與第二折頁123之鄰接處具有複數插口125a。 11 is a developed view of the lower cover 114a according to another embodiment of the present invention. The lower cover 114a includes a bottom plate 122, a pair of first side walls 124, and a pair of second side walls 126. The two first sidewalls 124 are adjacent to each other opposite to opposite sides of the bottom plate 122. Each of the first side walls 124 has a first hinge 121 and a second hinge 123. The first hinge 121 abuts the side of the bottom plate 122, and the second hinge 123 abuts the first hinge 121, and the first hinge 121 and the first The abutment of the bi-fold page 123 has a plurality of sockets 125a.
兩第二側壁126鄰接於底板122之另一對相對側邊而彼此相對。每一第二側壁126之兩端均具有支撐板128a。支撐板128a遠離底板122之端緣具有突出的插片127a。在組裝下蓋114a時，可將第二折頁123向第一折頁121與底板122之鄰接處反折，並將支撐板128a彎折夾置於第一折頁121與第二折頁123之間，使得支撐板128a之插片127a***第一折頁121與第二折頁123間之插口125a中固定。藉由第一折頁121、第二折頁123與支撐板128a的設計，便可提升下蓋114a的抗壓強度。 The two second side walls 126 abut each other opposite the other pair of opposite sides of the bottom plate 122. Each of the second side walls 126 has a support plate 128a at both ends thereof. The end edge of the support plate 128a away from the bottom plate 122 has a protruding tab 127a. When the lower cover 114a is assembled, the second flap 123 can be folded back toward the adjacent portion of the first flap 121 and the bottom plate 122, and the support plate 128a is bent and placed on the first flap 121 and the second flap 123. Between the insertion pieces 127a of the support plate 128a is inserted into the socket 125a between the first flap 121 and the second flap 123. By the design of the first flap 121, the second flap 123 and the support plate 128a, the compressive strength of the lower cover 114a can be improved.
第12圖繪示根據本發明一實施方式之隔板130a與補強塊140b組裝於下蓋114時的立體圖。第13圖繪示第12圖之隔板130a與補強塊140b的立體圖。同時參閱第12圖與第13圖，與第4圖實施方式不同的地方在於：此實施方式隔板與補強塊係由複數隔板130a與複數補強塊140b所組成，例如每兩個補強塊140b與一片隔板130a為一組，兩個補強塊140b分別設置於容置空間116中短邊的相對兩側，隔板130a不具凹部132，但補強塊140b具有卡合槽146，使得隔板130a之兩端緣可拆卸地定位於補強塊140b之卡合槽146中。如此一來，補強塊140b的相對兩端面142、144可分別抵頂箱體110(見第6圖)的上蓋112與下蓋114，以提供包裝結構100的抗壓強度。 FIG. 12 is a perspective view of the spacer 130a and the reinforcing block 140b assembled to the lower cover 114 according to an embodiment of the present invention. Fig. 13 is a perspective view showing the spacer 130a and the reinforcing block 140b of Fig. 12. Referring to FIG. 12 and FIG. 13 at the same time, the difference from the embodiment of FIG. 4 is that the partition plate and the reinforcing block of this embodiment are composed of a plurality of partition plates 130a and a plurality of reinforcing blocks 140b, for example, two reinforcing blocks 140b. A plurality of partitions 130a are disposed in a group, and two reinforcing blocks 140b are respectively disposed on opposite sides of the short side of the accommodating space 116. The partition 130a has no recess 132, but the reinforcing block 140b has an engaging groove 146, so that the partition 130a The two end edges are detachably positioned in the engaging grooves 146 of the reinforcing block 140b. In this way, the opposite end faces 142, 144 of the reinforcing block 140b can respectively abut the upper cover 112 and the lower cover 114 of the casing 110 (see FIG. 6) to provide the compressive strength of the packaging structure 100.
在本實施方式中，補強塊140b呈長條狀，且補強塊140b之卡合槽146也呈長條形，但並不以限制本發明。 In the present embodiment, the reinforcing block 140b is elongated, and the engaging groove 146 of the reinforcing block 140b is also elongated, but the invention is not limited thereto.
第14圖繪示根據本發明一實施方式之隔板130a與 補強塊140b的分解圖。與第13圖實施方式不同的地方在於：補強塊140b之卡合槽146呈L形，且補強塊140b呈L形，補強塊140b可由兩個長條狀紙板組合而成，亦可為長條狀但經彎折而呈L形的紙板。當隔板130a的兩相鄰邊***補強塊140b的卡合槽146後，可放置於容置空間116(見第12圖)的角落。 Figure 14 illustrates a spacer 130a and an embodiment of the present invention. An exploded view of the reinforcement block 140b. The difference from the embodiment of Fig. 13 is that the engaging groove 146 of the reinforcing block 140b has an L shape, and the reinforcing block 140b has an L shape, and the reinforcing block 140b can be composed of two long strips of cardboard, or can be long strips. A cardboard that is shaped but bent into an L shape. When the two adjacent sides of the spacer 130a are inserted into the engaging grooves 146 of the reinforcing block 140b, they can be placed at the corners of the accommodating space 116 (see FIG. 12).
雖然本發明已以實施方式揭露如上，然其並非用以限定本發明，任何熟習此技藝者，在不脫離本發明之精神和範圍內，當可作各種之更動與潤飾，因此本發明之保護範圍當視後附之申請專利範圍所界定者為準。 Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and the present invention can be modified and modified without departing from the spirit and scope of the present invention. The scope is subject to the definition of the scope of the patent application attached.
100‧‧‧包裝結構 100‧‧‧Packaging structure
112‧‧‧上蓋 112‧‧‧上盖
114‧‧‧下蓋 114‧‧‧Under the cover
116‧‧‧容置空間 116‧‧‧ accommodating space
122‧‧‧底板 122‧‧‧floor
130‧‧‧隔板 130‧‧‧Baffle
132‧‧‧凹部 132‧‧‧ recess
136a‧‧‧主表面 136a‧‧‧Main surface
136b‧‧‧主表面 136b‧‧‧Main surface
140‧‧‧補強塊 140‧‧‧ reinforcing block
142‧‧‧端面 142‧‧‧ end face
144‧‧‧端面 144‧‧‧ end face
D‧‧‧支撐方向 D‧‧‧Support direction
H1‧‧‧垂直距離 H1‧‧‧ vertical distance
H2‧‧‧垂直距離 H2‧‧‧Vertical distance
Claims (18)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW102135685A TWI505971B (en) | 2013-10-02 | 2013-10-02 | Package structure for solar modules |
| CN201310726849.2A CN103786995B (en) | 2013-10-02 | 2013-12-19 | Packaging structure of solar module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW102135685A TWI505971B (en) | 2013-10-02 | 2013-10-02 | Package structure for solar modules |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201514065A true TW201514065A (en) | 2015-04-16 |
| TWI505971B TWI505971B (en) | 2015-11-01 |
Family
ID=50663143
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW102135685A TWI505971B (en) | 2013-10-02 | 2013-10-02 | Package structure for solar modules |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN103786995B (en) |
| TW (1) | TWI505971B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107685952A (en) * | 2016-11-18 | 2018-02-13 | 住华科技股份有限公司 | Partition plate and optical film packaging structure |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5913474A (en) * | 1997-10-10 | 1999-06-22 | Merryland Products, Inc. | Foldable tote box |
| CN2837237Y (en) * | 2004-12-24 | 2006-11-15 | 河南安彩高科股份有限公司 | Horizontal package box structure for glass screen |
| TWI277592B (en) * | 2005-01-06 | 2007-04-01 | Chunghwa Picture Tubes Ltd | Packing box and transport equipment |
| TWM327341U (en) * | 2007-07-03 | 2008-02-21 | Bohhae Jihpiin Co Ltd | Paper box structure for gift |
| JP2009040478A (en) * | 2007-08-09 | 2009-02-26 | Sharp Corp | Packaging case |
| TWM334837U (en) * | 2008-01-03 | 2008-06-21 | Sun Toward Tech Entpr Co Ltd | Substrate board container |
| CN202072064U (en) * | 2011-02-24 | 2011-12-14 | 上海晶澳太阳能科技有限公司 | Split-type packaging box for solar photovoltaic component |
| CN202208464U (en) * | 2011-08-02 | 2012-05-02 | 山东力诺太阳能电力股份有限公司 | Packing box for solar battery plate |
-
2013
- 2013-10-02 TW TW102135685A patent/TWI505971B/en not_active IP Right Cessation
- 2013-12-19 CN CN201310726849.2A patent/CN103786995B/en not_active Expired - Fee Related
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| CN103786995B (en) | 2016-04-13 |
| CN103786995A (en) | 2014-05-14 |
| TWI505971B (en) | 2015-11-01 |
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