TW201512583A - Light condensation projecting light bulb with sideway light source - Google Patents
Light condensation projecting light bulb with sideway light source Download PDFInfo
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本創作是關於一種聚光型LED投射燈泡，特別是指具有側光源之聚光型LED投射燈泡，能避免疊影現象並具有絕佳的散熱效果。 This creation is about a concentrating LED projection bulb, especially a concentrating LED projection bulb with a side light source, which avoids the phenomenon of overlapping and has excellent heat dissipation effect.
LED燈泡已是相當普遍的光源。請參考圖8A與8B所示的投射燈泡示意圖，圖8A的大面積LED光源70係大功率LED元件或複數小功率LED元件所組成，其外側設有反射板71；圖8B的小面積LED光源72係小功率LED元件所組成，其外側亦設有反射板73，其中圖8A與8B所示的反射板71、73具有相同的長度尺寸。從圖8A可見，由於大面積LED光源70到反射板71的距離因素，其投射角度較大，該大面積LED光源70發出的光線雖有部分在反射板71上形成反射而成為投射光束(A)，但仍有大部份的光線(B)未被反射板71反射而無法聚光成為投射光束，導致投射效果不佳，係一般採用大面積LED光源70來製作投射燈泡無法達到有效聚光的原因之一。如圖8B所示，因此目前僅使用小面積LED光源72，其的投射角度較小，故小面積LED光源72所發出的光線大都能在反射板73上形成反射而聚光成為投射光束(C)。 LED bulbs are a fairly common source of light. Please refer to the schematic diagram of the projection light bulb shown in FIG. 8A and FIG. 8B. The large-area LED light source 70 of FIG. 8A is composed of a high-power LED element or a plurality of low-power LED elements, and a reflector 71 is disposed on the outer side thereof; and a small-area LED light source of FIG. 8B is provided. The 72-series low-power LED element is also provided with a reflecting plate 73 on the outer side thereof, wherein the reflecting plates 71, 73 shown in Figs. 8A and 8B have the same length dimension. As can be seen from FIG. 8A, due to the distance factor of the large-area LED light source 70 to the reflecting plate 71, the projection angle is large, and the light emitted by the large-area LED light source 70 is partially reflected on the reflecting plate 71 to become a projection beam (A). ), but most of the light (B) is not reflected by the reflector 71 and cannot be condensed into a projected beam, resulting in poor projection. Generally, the large-area LED light source 70 is used to make the projection bulb, which cannot achieve effective concentrating. One of the reasons. As shown in FIG. 8B, therefore, only a small-area LED light source 72 is used at present, and the projection angle thereof is small. Therefore, the light emitted by the small-area LED light source 72 can be reflected on the reflection plate 73 to be concentrated and become a projection beam (C). ).
但是通常小面積LED光源72意謂著驅動功率 亦不能太高。若採用了單一顆高功率LED元件來作為投射燈泡的LED光源，會使熱源集中在此單一LED元件上，LED元件的功率密度越高，容易造成LED元件產生熱點(hot spot)，會使散熱效果更是不佳。因此習知LED燈泡係如台灣專利第M443356號的結構，其包含有一燈杯、一基板與一投射透鏡，該燈杯具有一容置空間，該基板設置在該容置空間的底部並具有一正面，該正面係面向一出光面並設有複數個LED元件，該投射透鏡設於該燈杯上並包含複數投射面，該些投射面分別對應於該些LED元件。當LED元件發光時，投射面能輔助光線朝一特定方向投射，如此可以不必把所有輸出功率集中在單一顆LED元件，卻又能使複數LED元件各自聚光。 But usually a small area LED light source 72 means drive power Nor can it be too high. If a single high-power LED component is used as the LED light source for the projection bulb, the heat source will be concentrated on the single LED component. The higher the power density of the LED component, the hot spot of the LED component will be generated, which will cause heat dissipation. The effect is even worse. Therefore, the conventional LED light bulb is a structure of the Japanese Patent No. M443356, which comprises a lamp cup, a substrate and a projection lens. The lamp cup has an accommodating space, and the substrate is disposed at the bottom of the accommodating space and has a The front side faces a light emitting surface and is provided with a plurality of LED elements. The projection lens is disposed on the light cup and includes a plurality of projection surfaces respectively corresponding to the LED elements. When the LED element emits light, the projection surface can assist the light to be projected in a specific direction, so that it is not necessary to concentrate all of the output power on a single LED element, but each of the plurality of LED elements can be concentrated.
然而，前述LED燈泡又會產生疊影問題。請參考圖9A所示，假設有一LED光源74朝一物體75投光，該物體75的背光側產生影子76。由於LED光源74為單一光源，故物體75產生單一個影子76。然而，請參考圖9B所示，如前述台灣專利第M443356號的LED燈泡，其複數LED元件相當於複數LED光源77，並各自對物體78投射光線，每個LED光源77為獨立的光源。當該些LED光源77分別照射在物體78上時，會使該物體78產生多個影子79，從而衍生疊影現象，疊影現象會干擾眼睛的視覺，令人產生疲勞與不適。 However, the aforementioned LED bulbs have a problem of overlapping. Referring to FIG. 9A, it is assumed that an LED light source 74 projects light toward an object 75, and the backlight side of the object 75 produces a shadow 76. Since the LED light source 74 is a single light source, the object 75 produces a single shadow 76. However, referring to FIG. 9B, the LED bulb of the aforementioned Taiwan Patent No. M443356 has a plurality of LED elements corresponding to a plurality of LED light sources 77, and each of which projects light to the object 78, and each of the LED light sources 77 is an independent light source. When the LED light sources 77 are respectively irradiated on the object 78, the object 78 is caused to generate a plurality of shadows 79, thereby deriving a superimposed phenomenon, which may interfere with the vision of the eyes, causing fatigue and discomfort.
為了避免產生疊影現象，現有一種高功率LED燈泡，其包含有較大尺寸的燈杯、基板與投射透鏡，該基板的正面上設置高功率LED元件(例如，大於4W以 上的消耗功率)，提高光場均勻性以消除疊影現象，但是該高功率LED元件的封裝面積相對更大，就會產生如圖8A所解釋原理，投射透鏡或反射板73亦必須具有足夠大尺寸的投射面，才能反射高功率LED元件所發出的光線。若是為了達到特定的窄角投射光線效果，由於燈杯、基板與投射透鏡的體積大，使用者不易安裝LED燈泡，並影響LED燈泡的美觀。而若是考量合理的燈體積及美觀來設計，則又無法達到窄角投射的效果，因為受限光學原理的基本法則，較大面積的發光源需要較大的反射結構才能達到特定的聚焦效果。 In order to avoid the phenomenon of stacking, there is a high-power LED bulb comprising a larger-sized lamp cup, a substrate and a projection lens, and a high-power LED element is disposed on the front surface of the substrate (for example, greater than 4W) The power consumption on the substrate) improves the uniformity of the light field to eliminate the phenomenon of stacking. However, the package area of the high-power LED element is relatively larger, and the principle explained in FIG. 8A is generated. The projection lens or the reflector 73 must also have sufficient The large size of the projection surface reflects the light from the high-power LED components. In order to achieve a specific narrow-angle projection light effect, due to the large volume of the lamp cup, the substrate and the projection lens, it is difficult for the user to install the LED bulb and affect the appearance of the LED bulb. However, if a reasonable lamp volume and aesthetic design are considered, the effect of narrow-angle projection cannot be achieved. Because of the basic rule of the limited optical principle, a large-area illumination source requires a large reflection structure to achieve a specific focusing effect.
最後，請參考圖10所示習知的LED燈泡示意圖，LED光源80設於燈杯81的底部82。當LED光源80發光時，如箭號所標示，熱能係從燈杯81的底部82傳至外表面的散熱鰭片83，最後才由散熱鰭片83進行散熱，此熱傳導路徑長，影響散熱效果。 Finally, please refer to the conventional LED bulb diagram shown in FIG. 10, and the LED light source 80 is disposed at the bottom 82 of the lamp cup 81. When the LED light source 80 emits light, as indicated by the arrow, the thermal energy is transmitted from the bottom 82 of the lamp cup 81 to the heat dissipation fin 83 on the outer surface, and finally the heat dissipation fin 83 is used for heat dissipation, and the heat conduction path is long, which affects the heat dissipation effect. .
有鑒於現有LED燈泡的疊影現象與散熱不佳的缺點，本創作的主要目的是提供一種具有側光源之聚光型LED投射燈泡，除了可消除疊影現象，在達到窄角投射效果還同時可提升散熱效果。 In view of the shortcomings of the existing LED bulbs and the disadvantages of poor heat dissipation, the main purpose of the present invention is to provide a concentrating LED projection bulb with a side light source, in addition to eliminating the phenomenon of folding, while achieving a narrow angle projection effect. Improves heat dissipation.
本創作具有側光源之聚光型LED投射燈泡包含有：一散熱燈杯，內部具有一內側面與一裝配空間；一座體，設於該裝配空間中且包含有設置該內側面上的基板，基板具有一背面與一正面，該背面係接觸該散熱 燈杯的內側面，該正面設有LED元件以作為側光源；以及一反射結構，設於該裝配空間中且包含有一反射面，該反射面位於該些基板的正面內側。 The concentrating LED projection bulb having a side light source comprises: a heat dissipating lamp cup having an inner side and an assembly space therein; and a body disposed in the assembly space and including a substrate on the inner side surface; The substrate has a back surface and a front surface, and the back surface is in contact with the heat dissipation An inner side surface of the lamp cup, the front side is provided with an LED element as a side light source; and a reflective structure is disposed in the assembly space and includes a reflective surface, the reflective surface being located inside the front side of the substrate.
根據本創作的結構，當該些LED元件發光時，光線係由該反射結構反射光線。由於該些LED元件所發出的光線係通過同一個反射結構而對外投射，而不是直接分別對外投射光線。因此複數側光源經反射結構轉折為正向投射的光源，並產生混光效果而形成單一光源，單一光源自然沒有疊影的現象，進而免除習知技術的疊影現象。 According to the structure of the present invention, when the LED elements emit light, the light is reflected by the reflective structure. Since the light emitted by the LED elements is projected externally through the same reflective structure, instead of directly projecting light directly. Therefore, the plurality of side light sources are converted into a forward-projection light source through the reflection structure, and a light-mixing effect is generated to form a single light source, and the single light source naturally has no overlapping phenomenon, thereby eliminating the folding phenomenon of the prior art.
在散熱的效果方面，因該些LED元件係設置在基板上，又基板直接接觸散熱燈杯的內側面，係相對於散熱鰭片的內側，因此本創作之導熱路徑較習知技術由燈杯底部導熱至側邊散熱鰭片的導熱路徑大幅縮短。故本創作LED元件產生的熱能係直接傳導至散熱燈杯的散熱鰭片以進行散熱，進而提升散熱效果。 In terms of heat dissipation effect, since the LED components are disposed on the substrate, and the substrate directly contacts the inner side surface of the heat dissipation lamp cup, relative to the inner side of the heat dissipation fin, the heat conduction path of the present invention is better than the conventional technology by the lamp cup. The heat conduction path from the bottom to the side heat sink fins is greatly shortened. Therefore, the heat energy generated by the LED component of the present invention is directly transmitted to the heat dissipation fin of the heat dissipation lamp cup for heat dissipation, thereby improving the heat dissipation effect.
此外，相較於先前技術，本創作中由複數個基板提供LED元件設置的面積係大於習知單個基板能提供LED元件設置的面積，因此本創作較先前技術能設置更多的LED元件。且由該基板設置更多數目的小功率LED元件，達成熱能量分散的目的，並且有效的降低該些LED元件的熱密度，使得散熱能力更佳。 In addition, compared with the prior art, the area in which the LED elements are provided by the plurality of substrates in the present invention is larger than the area in which the conventional single substrate can provide the LED elements, and thus the present invention can provide more LED elements than the prior art. Moreover, a larger number of low-power LED elements are disposed on the substrate to achieve the purpose of thermal energy dispersion, and the heat density of the LED elements is effectively reduced, so that the heat dissipation capability is better.
舉例來說，受限於習知基板的面積，當習知LED燈泡欲達一定亮度，習知LED燈泡採用高功率LED 元件，導致習知LED燈泡整體的體積增加。然而，由於本創作可供LED元件設置的面積增加，當本創作LED燈泡要達到該亮度，可在各基板安裝多顆小功率的LED元件即可達到該亮度，採用低功率LED元件且搭配側向入光型式的特殊反射結構光學設計，不需使用大尺寸的燈杯與透鏡，不會造成本創作LED投射燈泡體積的增加，又低功率LED元件的熱密度較低，故能讓散熱效果更為顯著。 For example, limited by the area of the conventional substrate, when the conventional LED bulb wants to achieve a certain brightness, the conventional LED bulb uses a high-power LED. The component causes an increase in the overall volume of the conventional LED bulb. However, due to the increase in the area of the LED component that can be set by the present invention, when the LED bulb of the present invention is to achieve the brightness, a plurality of low-power LED components can be mounted on each substrate to achieve the brightness, and the low-power LED component is used and the side is matched. The optical design of the special reflective structure of the light-in type does not require the use of a large-sized lamp cup and lens, and does not cause an increase in the volume of the LED projection bulb of the present invention, and the heat density of the low-power LED component is low, so that the heat dissipation effect can be achieved. More significant.
本創作藉由側光源及利用光學技術設置反射結構來克服原本光源分散的問題，並同時藉由熱源分散及縮短導熱路徑來增加散熱功能，達到同時可以聚光的投射光效果，使LED投射燈泡的技術突破原本習知的長久瓶頸。 The present invention overcomes the problem of dispersion of the original light source by using a side light source and a reflective structure by using optical technology, and at the same time, by dispersing the heat source and shortening the heat conduction path, the heat dissipation function is increased, and the projection light effect at the same time can be concentrated to make the LED projection bulb The technology breaks through the long-standing bottlenecks of the original.
10‧‧‧散熱燈杯 10‧‧‧heating lamp cup
11‧‧‧開口 11‧‧‧ openings
12‧‧‧裝配空間 12‧‧‧ Assembly space
13‧‧‧容槽 13‧‧‧ 容容
14‧‧‧內側面 14‧‧‧ inside side
15‧‧‧散熱鰭片 15‧‧‧ Heat sink fins
20‧‧‧驅動電路板 20‧‧‧Drive Circuit Board
21‧‧‧組接端 21‧‧‧ group end
30‧‧‧座體 30‧‧‧ body
31‧‧‧底板 31‧‧‧floor
310‧‧‧設置孔 310‧‧‧Set hole
32‧‧‧基板 32‧‧‧Substrate
321‧‧‧背面 321‧‧‧back
322‧‧‧正面 322‧‧‧ positive
40‧‧‧LED元件 40‧‧‧LED components
50‧‧‧反射結構 50‧‧‧Reflective structure
51‧‧‧本體 51‧‧‧Ontology
510‧‧‧入光面 510‧‧‧Into the glossy surface
511‧‧‧錐狀反射面 511‧‧‧Cone reflecting surface
512‧‧‧反射層 512‧‧‧reflective layer
52‧‧‧透光板 52‧‧‧Translucent plate
520‧‧‧光散射表面 520‧‧‧Light scattering surface
60‧‧‧LED光源 60‧‧‧LED light source
61‧‧‧散熱燈杯 61‧‧‧heating lamp cup
610‧‧‧內側面 610‧‧‧ inside
62‧‧‧散熱鰭片 62‧‧‧Heat fins
70‧‧‧大面積LED光源 70‧‧‧Large-area LED light source
71‧‧‧反射板 71‧‧‧reflector
72‧‧‧小面積LED光源 72‧‧‧Small area LED light source
73‧‧‧反射板 73‧‧‧reflector
74‧‧‧LED光源 74‧‧‧LED light source
75‧‧‧物體 75‧‧‧ objects
76‧‧‧影子 76‧‧‧ shadow
77‧‧‧LED光源 77‧‧‧LED light source
78‧‧‧物體 78‧‧‧ objects
79‧‧‧影子 79‧‧‧ shadow
80‧‧‧LED光源 80‧‧‧LED light source
81‧‧‧燈杯 81‧‧‧light cup
82‧‧‧底部 82‧‧‧ bottom
83‧‧‧散熱鰭片 83‧‧‧Heat fins
圖1：本創作第一較佳實施例的立體分解示意圖。 Figure 1 is a perspective exploded view of the first preferred embodiment of the present invention.
圖2：本創作第一較佳實施例的立體外觀示意圖。 Fig. 2 is a perspective view showing the appearance of the first preferred embodiment of the present invention.
圖3：本創作第一較佳實施例的剖面示意圖。 Figure 3 is a cross-sectional view showing the first preferred embodiment of the present invention.
圖4：本創作中該反射結構較佳實施例的剖面示意圖。 Figure 4 is a cross-sectional view showing a preferred embodiment of the reflective structure in the present creation.
圖5：本創作中該反射結構較佳實施例的剖面示意圖。 Figure 5 is a cross-sectional view showing a preferred embodiment of the reflective structure in the present creation.
圖6：本創作中該反射結構反射光線的參考圖。 Figure 6: Reference diagram of the reflected light reflected by the reflective structure in this creation.
圖7：本創作較佳實施例的導熱路徑示意圖。 Figure 7 is a schematic illustration of the thermally conductive path of the preferred embodiment of the present invention.
圖8A：習知LED光源之光線投射示意圖(一)。 Fig. 8A is a schematic diagram of light projection of a conventional LED light source (1).
圖8B：習知LED光源之光線投射示意圖(二)。 Fig. 8B is a schematic diagram of light projection of a conventional LED light source (2).
圖9A：單一LED光源照射一物體的示意圖。 Figure 9A: Schematic diagram of a single LED source illuminating an object.
圖9B：多個LED光源照射一物體的示意圖。 Figure 9B is a schematic illustration of a plurality of LED light sources illuminating an object.
圖10：習知LED燈泡的導熱路徑示意圖。 Figure 10: Schematic diagram of the heat conduction path of a conventional LED bulb.
請參考圖1至3所示，本創作LED投射燈泡包含有一散熱燈杯10、一驅動電路板20、一座體30、複數個LED元件40與一反射結構50。 Referring to FIGS. 1 to 3, the LED projection lamp of the present invention comprises a heat dissipation lamp cup 10, a driving circuit board 20, a body 30, a plurality of LED elements 40 and a reflection structure 50.
該散熱燈杯10具有一內側面14與一裝配空間12，該裝配空間12包含一朝前的開口11與複數形成在內側面14上的容槽13，該散熱燈杯10的外側面可形成複數散熱鰭片15。該散熱燈杯10可為鋁、銅、石墨、陶瓷或導熱塑膠所製成的構件。 The heat sink cup 10 has an inner side surface 14 and an assembly space 12, and the assembly space 12 includes a front opening 11 and a plurality of receptacles 13 formed on the inner side surface 14. The outer side surface of the heat dissipation lamp cup 10 can be formed. A plurality of heat sink fins 15. The heat sink cup 10 can be a member made of aluminum, copper, graphite, ceramic or thermally conductive plastic.
該驅動電路板20設於該裝配空間12的底部且包含有一組接端21，該組接端21係朝向該散熱燈杯10的開口11。該驅動電路板20可為印刷電路板(PCB)、軟式印刷電路板(FPC)、金屬印刷電路板(MCPCB)或FR4板。 The driving circuit board 20 is disposed at the bottom of the assembly space 12 and includes a plurality of terminals 21 facing the opening 11 of the heat dissipation lamp cup 10. The driver circuit board 20 can be a printed circuit board (PCB), a flexible printed circuit board (FPC), a metal printed circuit board (MCPCB), or an FR4 board.
該座體30設於該散熱燈杯10的裝配空間12中。該座體30包含有一底板31與複數基板32，該底板31包含有設置孔310，該底板31的設置孔310係與該驅動電路板20的組接端21連接，使該底板31固定在該裝配空間12中，其中該底板31上可設有電連接LED元件40的驅動電路。該些基板32設置在該底板31前側面的外緣並分別設置在該些容槽13中，且基板32與底板31 電性連接。各基板32包含有相對的一背面321與一正面322，該背面321係接觸該散熱燈杯10的內側面14。本較佳實施例中，該些基板32係與該底板31一體連接。 The base body 30 is disposed in the assembly space 12 of the heat dissipation lamp cup 10. The base body 30 includes a bottom plate 31 and a plurality of base plates 32. The bottom plate 31 includes a mounting hole 310. The mounting hole 310 of the bottom plate 31 is connected to the assembly end 21 of the driving circuit board 20, so that the bottom plate 31 is fixed thereto. In the assembly space 12, a driving circuit electrically connecting the LED elements 40 may be disposed on the bottom plate 31. The substrates 32 are disposed on the outer edges of the front side of the bottom plate 31 and are respectively disposed in the plurality of slots 13 , and the substrate 32 and the bottom plate 31 . Electrical connection. Each of the substrates 32 includes an opposite back surface 321 and a front surface 322 that contacts the inner side surface 14 of the heat dissipation lamp cup 10. In the preferred embodiment, the substrates 32 are integrally connected to the bottom plate 31.
該複數LED元件40設於該些基板32的正面322以作為側光源，且LED元件40電連接該驅動電路板20，該驅動電路板20用以驅動該複數LED元件40發光。 The plurality of LED elements 40 are disposed on the front surface 322 of the substrate 32 as a side light source, and the LED element 40 is electrically connected to the driving circuit board 20 for driving the plurality of LED elements 40 to emit light.
該反射結構50設於該散熱燈杯10中，其包含有一本體51。該本體51位於裝配空間12中，且該本體51包含有一反射面，該反射面位於該些基板32的正面322內側。本較佳實施例中，該本體51的外周側面形成複數個入光面510，該些入光面510面對該些基板32的正面322，各入光面510可為平面或曲面。該反射面可為一凹設在該本體51後端的錐狀反射面511，錐狀反射面511位於該本體51的內側。該反射結構50的前端位在該散熱燈杯10的開口11處。請參考圖2所示，該反射結構50的前側具有一光散射表面520，該光散射表面520可為一波浪狀表面。 The reflective structure 50 is disposed in the heat sink cup 10 and includes a body 51. The body 51 is located in the assembly space 12, and the body 51 includes a reflective surface located inside the front surface 322 of the substrate 32. In the preferred embodiment, the outer peripheral side of the body 51 is formed with a plurality of light incident surfaces 510. The light incident surfaces 510 face the front surface 322 of the substrates 32. The light incident surfaces 510 may be flat or curved. The reflecting surface may be a tapered reflecting surface 511 recessed at the rear end of the body 51, and the tapered reflecting surface 511 is located inside the body 51. The front end of the reflective structure 50 is located at the opening 11 of the heat sink cup 10. Referring to FIG. 2, the front side of the reflective structure 50 has a light scattering surface 520, which may be a wavy surface.
請參考圖4所示，於另一較佳實施例中，該本體51於錐狀反射面511上形成一反射層512，該反射層512可完全反射LED元件40所發出的光線，提升本創作投射燈泡所發出的亮度。 Referring to FIG. 4, in another preferred embodiment, the body 51 forms a reflective layer 512 on the tapered reflective surface 511. The reflective layer 512 can completely reflect the light emitted by the LED element 40, thereby enhancing the creation. Project the brightness of the bulb.
請參考圖5所示，該反射結構50還包含一透光板52，本體51與透光板52可為分離設置，該本體51可為一傘狀反光體，並供設於該座體30的底板31上，該 反射面形成在該傘狀反光體的外表面，且該反射面可為所述的錐狀反射面511。 As shown in FIG. 5 , the reflective structure 50 further includes a light-transmitting plate 52 . The body 51 and the light-transmitting plate 52 can be separated. The body 51 can be an umbrella-shaped reflector and can be disposed on the base 30 . On the bottom plate 31, the A reflecting surface is formed on an outer surface of the umbrella-shaped reflector, and the reflecting surface may be the tapered reflecting surface 511.
請參考圖6所示，以第一較佳實施例為例，當LED元件40發光時，光線60通過該反射結構50的入光面510並在該錐狀反射面511產生反射，進而朝向該透光板52的光散射表面520對外投射，該光散射表面520可令光線產生散射而更為均勻化。由於該反射結構50係將所有LED元件40發出的光線60對外反射，整體而言，本創作視同單一光源，藉由該反射結構50的設置，當本創作照射一物體時，可避免產生疊影的現象。 Referring to FIG. 6 , in the first preferred embodiment, when the LED component 40 emits light, the light 60 passes through the light incident surface 510 of the reflective structure 50 and is reflected on the tapered reflective surface 511 , thereby The light scattering surface 520 of the light transmissive plate 52 projects outward, and the light scattering surface 520 can scatter light to be more uniform. Since the reflective structure 50 reflects the light 60 emitted by all the LED elements 40 to the outside, as a whole, the creation is regarded as a single light source. By the arrangement of the reflective structure 50, when the object is illuminated by the creation, the stack can be avoided. The phenomenon of shadow.
再者，由於本創作係令LED元件40設置在基板32上，相較於先前技術，複數個基板32提供LED元件40設置的面積係大於習知底板提供LED元件設置的面積，故本創作可供設置更多LED元件40。如此一來，本創作能使用多個低功率的LED元件40達到一特定的亮度，而不需直接使用高功率LED元件以達到該亮度。 Moreover, since the present invention causes the LED element 40 to be disposed on the substrate 32, compared to the prior art, the plurality of substrates 32 provide the LED element 40 to have an area larger than that of the conventional substrate to provide the LED element. For providing more LED elements 40. In this way, the present invention can use a plurality of low power LED elements 40 to achieve a particular brightness without the need to directly use high power LED elements to achieve this brightness.
低功率的LED元件40產生的熱能遠低於高功率LED元件產生的熱能，又該些基板32係直接與該散熱燈杯10的內側面14直接接觸且對應於散熱鰭片15內側，故本創作中LED元件40產生的熱能係快速傳導至散熱鰭片15，藉此提供最短的導熱路徑而產生最佳的散熱效果。如圖7所示的示意圖，前述的LED元件相當於LED光源60，LED光源60設於散熱燈杯61的內側面610。如圖7的箭號所標示，並比較圖10所示習知LED燈泡的熱傳導路徑，本創作的熱傳導路徑遠小於習知LED 燈泡的熱傳導路徑，故本創作LED光源60產生的熱能係快速傳導至設於散熱燈杯61外側的散熱鰭片62，相較於習知LED燈泡有更佳的散熱效果。 The low-power LED component 40 generates much lower thermal energy than the high-power LED component, and the substrate 32 directly contacts the inner side surface 14 of the heat-dissipating lamp cup 10 and corresponds to the inner side of the heat-dissipating fin 15 . The thermal energy generated by the LED element 40 in the creation is quickly conducted to the heat dissipation fins 15, thereby providing the shortest heat conduction path for optimum heat dissipation. As shown in the schematic diagram of FIG. 7, the LED element described above corresponds to the LED light source 60, and the LED light source 60 is disposed on the inner side surface 610 of the heat dissipation lamp cup 61. As shown by the arrow in Fig. 7, and comparing the heat conduction paths of the conventional LED bulb shown in Fig. 10, the heat conduction path of the present invention is much smaller than that of the conventional LED. The heat conduction path of the bulb is rapidly transmitted to the heat dissipation fins 62 disposed outside the heat dissipation cup 61, which has better heat dissipation effect than the conventional LED bulb.
10‧‧‧散熱燈杯 10‧‧‧heating lamp cup
11‧‧‧開口 11‧‧‧ openings
12‧‧‧裝配空間 12‧‧‧ Assembly space
13‧‧‧容槽 13‧‧‧ 容容
14‧‧‧內側面 14‧‧‧ inside side
15‧‧‧散熱鰭片 15‧‧‧ Heat sink fins
20‧‧‧驅動電路板 20‧‧‧Drive Circuit Board
21‧‧‧組接端 21‧‧‧ group end
30‧‧‧座體 30‧‧‧ body
31‧‧‧底板 31‧‧‧floor
310‧‧‧設置孔 310‧‧‧Set hole
32‧‧‧基板 32‧‧‧Substrate
321‧‧‧背面 321‧‧‧back
322‧‧‧正面 322‧‧‧ positive
40‧‧‧LED元件 40‧‧‧LED components
50‧‧‧反射結構 50‧‧‧Reflective structure
51‧‧‧本體 51‧‧‧Ontology
510‧‧‧入光面 510‧‧‧Into the glossy surface
511‧‧‧錐狀反射面 511‧‧‧Cone reflecting surface
Claims (16)
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| TW102134911A TW201512583A (en) | 2013-09-27 | 2013-09-27 | Light condensation projecting light bulb with sideway light source |
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| Application Number | Priority Date | Filing Date | Title |
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| TW102134911A TW201512583A (en) | 2013-09-27 | 2013-09-27 | Light condensation projecting light bulb with sideway light source |
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| TW201512583A true TW201512583A (en) | 2015-04-01 |
| TWI500877B TWI500877B (en) | 2015-09-21 |
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