TW201511381A - Display apparatus and method of fabricating the same - Google Patents

Display apparatus and method of fabricating the same Download PDF

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Publication number
TW201511381A
TW201511381A TW103130550A TW103130550A TW201511381A TW 201511381 A TW201511381 A TW 201511381A TW 103130550 A TW103130550 A TW 103130550A TW 103130550 A TW103130550 A TW 103130550A TW 201511381 A TW201511381 A TW 201511381A
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Taiwan
Prior art keywords
layer
display device
protective layer
pattern
organic
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TW103130550A
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Chinese (zh)
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TWI673896B (en
Inventor
南宮埈
朴順龍
成柱燁
蘇正鎬
金光赫
白碩基
田銀英
鄭哲宇
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三星顯示器有限公司
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    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0175—Inorganic, non-metallic layer, e.g. resist or dielectric for printed capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10128—Display
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits

Abstract

A display apparatus may include a substrate, a pad unit on the substrate, a display panel on the substrate, an encapsulation layer covering the display panel, and a protective layer on the pad unit. The protective layer may have an elastic coefficient ranging from about 10 MPa to about 200 GPa.

Description

顯示設備及其製造方法 Display device and method of manufacturing same 【優先權聲明】[Priority statement]

2013年9月13日在韓國智慧財產局提出申請且名稱為「顯示設備及其製造方法(Display Apparatus and Method of Fabricating The Same)」之韓國專利申請案第10-2013-0110618號以引用方式全文併入本文中。 Korean Patent Application No. 10-2013-0110618, filed on Sep. 13, 2013, in the Korean Intellectual Property Office, and entitled "Display Apparatus and Method of Fabricating The Same" Incorporated herein.

本發明之實施例係關於一種顯示設備及其製造方法。 Embodiments of the present invention relate to a display device and a method of fabricating the same.

藉由增大觀看尺寸及減小重量，平板顯示設備之效能已經得到改進。半導體技術之進步使得提高效能已經成為可能。平板顯示設備包括液晶顯示器(liquid crystal display；LCD)、電漿顯示裝置(plasma display device；PDP)、場致發射顯示裝置(field emission display device；FED)、電致發光顯示裝置(electroluminescence display device；ELD)、電泳顯示裝置(electrophoresis display device；EPD)、以及有機發光顯示裝置(organic light-emitting display device；OLED)。因相較於陰極射線管(cathode ray tube；CRT)顯示器，該等平板顯示裝置重量輕、纖薄且觀看尺寸大，故對該等較新型平板顯示設備之需求已顯著增長。可撓性顯示設備之使用亦大大增加。此等設備可使用一包括可撓性材料之基板，因此可甚至在例如像 紙一樣彎曲時仍保持其顯示效能。平板顯示設備可包括一封裝層，用以封裝顯示裝置，俾使外部氧氣或水分不會滲透入裝置中。此等封裝結構可應用於可撓性、可捲起、及可折疊之顯示裝置。 The performance of flat panel display devices has been improved by increasing the viewing size and reducing the weight. Advances in semiconductor technology have made it possible to improve performance. The flat panel display device includes a liquid crystal display (LCD), a plasma display device (PDP), a field emission display device (FED), and an electroluminescence display device (electroluminescence display device; ELD), an electrophoresis display device (EPD), and an organic light-emitting display device (OLED). The demand for such newer flat panel display devices has increased significantly as compared to cathode ray tube (CRT) displays, which are lightweight, slim, and have a large viewing size. The use of flexible display devices has also increased dramatically. Such devices may use a substrate comprising a flexible material, and thus may even It maintains its display performance when the paper is bent. The flat panel display device may include an encapsulation layer for encapsulating the display device so that external oxygen or moisture does not penetrate into the device. These package structures are applicable to flexible, rollable, and foldable display devices.

本發明實施例係關於一種顯示設備，該顯示設備包括：一基板；一墊單元，位於該基板上；一顯示面板，位於該基板上；一封裝層，覆蓋該顯示面板；以及一保護層，位於該墊單元上。該保護層具有約10百萬帕(MPa)至約200十億帕(GPa)之彈性係數。該墊單元可包括：一墊電極，位於該基板上；以及一可撓性印刷電路板，位於該墊電極上，該可撓性印刷電路板係電性連接至該墊電極。 The embodiment of the invention relates to a display device, comprising: a substrate; a pad unit on the substrate; a display panel on the substrate; an encapsulation layer covering the display panel; and a protective layer, Located on the mat unit. The protective layer has a modulus of elasticity of from about 10 million Pascals (MPa) to about 200 Billion Pascals (GPa). The pad unit may include: a pad electrode on the substrate; and a flexible printed circuit board on the pad electrode, the flexible printed circuit board being electrically connected to the pad electrode.

該保護層可位於該墊單元上，該保護層覆蓋該墊電極及該可撓性印刷電路板之一區域。該保護層可包括一有機材料、一無機材料、或一金屬材料。該有機材料可包括，例如，環烯烴共聚物(cyclic olefin copolymer；COC)、聚甲基丙烯酸甲酯(poly(methyl methacrylate)；PMMA)、聚碳酸酯(polycarbonate；PC)、環烯烴聚合物(cyclo olefin polymer；COP)、液晶聚合物(liquid crystal polymer；LCP)、聚二甲基矽氧烷(polydimethyl siloxane；PDMS)、聚醯胺(polyamide；PA)、聚乙烯(polyethylene；PE)、聚醯亞胺(polyimide；PI)、聚丙烯(polypropylene；PP)、聚苯醚(polyphenylene ether；PPE)、聚苯乙烯(polystyrene；PS)、聚甲醛(polyoxymethylene；POM)、聚醚醚酮(polyetheretherketone；PEEK)、聚對苯二甲酸乙二酯(polyethylene terephthalate；PET)、聚四氟乙烯(polytetrafluoroethylene；PTFE)、聚氯乙烯(polyvinylchloride；PVC)、聚偏二氟乙烯(polyvinylidene fluoride；PVDF)、聚對苯二甲酸丁二酯(polybutylene terephthalate；PBT)、氟化乙烯丙烯(fluorinated ethylene propylene；FEP)、四氟乙烯 (tetrafluoroethylene；PFA)、或其混合物。 The protective layer can be located on the pad unit, the protective layer covering the pad electrode and a region of the flexible printed circuit board. The protective layer may comprise an organic material, an inorganic material, or a metallic material. The organic material may include, for example, a cyclic olefin copolymer (COC), a poly(methyl methacrylate) (PMMA), a polycarbonate (PC), a cycloolefin polymer ( Cyclo olefin polymer; COP), liquid crystal polymer (LCP), polydimethyl siloxane (PDMS), polyamine (PA), polyethylene (PE), poly Polyimide (PI), polypropylene (PP), polyphenylene ether (PPE), polystyrene (PS), polyoxymethylene (POM), polyetheretherketone (polyetheretherketone) ;PEEK), polyethylene terephthalate (PET), polytetrafluoroethylene (PTFE), polyvinyl chloride (PVC), polyvinylidene fluoride (PVDF), Polybutylene terephthalate (PBT), fluorinated ethylene propylene (FEP), tetrafluoroethylene (tetrafluoroethylene; PFA), or a mixture thereof.

該無機材料可係為碳膜、碳化矽、或氧化物系材料。該金屬材料可係為鎢或碳化鎢。 The inorganic material may be a carbon film, a tantalum carbide, or an oxide-based material. The metal material may be tungsten or tungsten carbide.

該保護層可包括：一包括一有機材料之有機層；一金屬層，位於該有機層上；以及一無機層，位於該金屬層上。該保護層可包括交替堆疊之至少一有機層、至少一金屬層及至少一無機層。該保護層可包括一有機層及位於該有機層上之一第一圖案，其中該第一圖案可包括例如環烯烴共聚物(COC)、聚甲基丙烯酸甲酯(PMMA)、聚碳酸酯(PC)、環烯烴聚合物(COP)、液晶聚合物(LCP)、聚二甲基矽氧烷(PDMS)、聚醯胺(PA)、聚乙烯(PE)、聚醯亞胺(PI)、聚丙烯(PP)、聚苯醚(PPE)、聚苯乙烯(PS)、聚甲醛(POM)、聚醚醚酮(PEEK)、聚對苯二甲酸乙二酯(PET)、聚四氟乙烯(PTFE)、聚氯乙烯(PVC)、聚偏二氟乙烯(PVDF)、聚對苯二甲酸丁二酯(PBT)、氟化乙烯丙烯(FEP)、四氟乙烯(PFA)、或其混合物。 The protective layer may include: an organic layer including an organic material; a metal layer on the organic layer; and an inorganic layer on the metal layer. The protective layer may include at least one organic layer, at least one metal layer, and at least one inorganic layer alternately stacked. The protective layer may include an organic layer and a first pattern on the organic layer, wherein the first pattern may include, for example, a cyclic olefin copolymer (COC), polymethyl methacrylate (PMMA), polycarbonate ( PC), cycloolefin polymer (COP), liquid crystal polymer (LCP), polydimethyl siloxane (PDMS), polyamine (PA), polyethylene (PE), polyimine (PI), Polypropylene (PP), polyphenylene ether (PPE), polystyrene (PS), polyoxymethylene (POM), polyetheretherketone (PEEK), polyethylene terephthalate (PET), polytetrafluoroethylene (PTFE), polyvinyl chloride (PVC), polyvinylidene fluoride (PVDF), polybutylene terephthalate (PBT), fluorinated ethylene propylene (FEP), tetrafluoroethylene (PFA), or mixtures thereof .

該第一圖案可具有一彈性係數，該彈性係數小於該有機層之一彈性係數。該第一圖案可具有一梯形或三角形截面。 The first pattern may have a modulus of elasticity that is less than one of the elastic coefficients of the organic layer. The first pattern can have a trapezoidal or triangular cross section.

該顯示設備可更包括位於該有機層上之一平坦化層，該平坦化層覆蓋該第一圖案。該平坦化層可包括一液相樹脂，該液相樹脂具有一彈性係數，該彈性係數小於該第一圖案之一彈性係數。該顯示設備可更包括位於該保護層上之一第二圖案，其中該第二圖案包括環烯烴共聚物(COC)、聚甲基丙烯酸甲酯(PMMA)、聚碳酸酯(PC)、環烯烴聚合物(COP)、液晶聚合物(LCP)、聚二甲基矽氧烷(PDMS)、聚醯胺(PA)、聚乙烯(PE)、聚醯亞胺(PI)、聚丙烯(PP)、聚苯醚(PPE)、聚苯乙烯(PS)、聚甲醛(POM)、聚醚醚酮(PEEK)、聚對苯二甲酸乙二酯(PET)、聚四 氟乙烯(PTFE)、聚氯乙烯(PVC)、聚偏二氟乙烯(PVDF)、聚對苯二甲酸丁二酯(PBT)、氟化乙烯丙烯(FEP)、四氟乙烯(PFA)、或其混合物。該顯示面板可包括彼此間隔開之複數個有機發光顯示裝置(organic light-emitting display device；OLED)。 The display device can further include a planarization layer on the organic layer, the planarization layer covering the first pattern. The planarization layer may include a liquid phase resin having a modulus of elasticity that is less than a modulus of elasticity of the first pattern. The display device may further include a second pattern on the protective layer, wherein the second pattern comprises a cyclic olefin copolymer (COC), polymethyl methacrylate (PMMA), polycarbonate (PC), cycloolefin Polymer (COP), Liquid Crystal Polymer (LCP), Polydimethyloxane (PDMS), Polyamide (PA), Polyethylene (PE), Polyimine (PI), Polypropylene (PP) , polyphenylene ether (PPE), polystyrene (PS), polyoxymethylene (POM), polyetheretherketone (PEEK), polyethylene terephthalate (PET), polytetra Vinyl fluoride (PTFE), polyvinyl chloride (PVC), polyvinylidene fluoride (PVDF), polybutylene terephthalate (PBT), fluorinated ethylene propylene (FEP), tetrafluoroethylene (PFA), or Its mixture. The display panel may include a plurality of organic light-emitting display devices (OLEDs) spaced apart from each other.

一種製造一顯示裝置之方法可包括以下步驟。可形成一顯示面板於一基板之一顯示區域上，以及形成一覆蓋該顯示面板之一封裝層。可形成一保護層，覆蓋該基板上之一墊單元之一墊電極。該保護層可具有約10百萬帕至約200十億帕之彈性係數。 A method of manufacturing a display device can include the following steps. A display panel can be formed on a display area of a substrate, and an encapsulation layer covering the display panel can be formed. A protective layer may be formed covering one of the pad electrodes of one of the pad units on the substrate. The protective layer can have a modulus of elasticity of from about 10 MPa to about 200 kPa.

形成該保護層可包括在該墊電極上使用一黏合劑。 Forming the protective layer can include using an adhesive on the pad electrode.

形成該保護層可包括在該墊電極上使用一液相樹脂。 Forming the protective layer can include using a liquid phase resin on the pad electrode.

該封裝層可包括一有機材料、一無機材料、或一金屬材料。 The encapsulation layer may comprise an organic material, an inorganic material, or a metallic material.

100a~100g‧‧‧顯示設備 100a~100g‧‧‧ display equipment

110‧‧‧基板 110‧‧‧Substrate

112‧‧‧緩衝層 112‧‧‧buffer layer

113‧‧‧閘極絕緣層 113‧‧‧ gate insulation

114‧‧‧層間絕緣層 114‧‧‧Interlayer insulation

115‧‧‧平坦化層 115‧‧‧flattening layer

116‧‧‧畫素界定層 116‧‧‧ pixel definition layer

120‧‧‧顯示面板 120‧‧‧ display panel

121‧‧‧主動層 121‧‧‧Active layer

122‧‧‧閘極 122‧‧‧ gate

123‧‧‧源極 123‧‧‧ source

124‧‧‧汲極 124‧‧‧汲polar

125‧‧‧第一電極 125‧‧‧First electrode

126‧‧‧中間層 126‧‧‧Intermediate

127‧‧‧第二電極 127‧‧‧second electrode

130‧‧‧墊電極 130‧‧‧ pads electrode

140‧‧‧封裝層 140‧‧‧Encapsulation layer

150、150a~150f‧‧‧保護層 150, 150a~150f‧‧‧ protective layer

152‧‧‧有機層 152‧‧‧Organic layer

153a、153b‧‧‧第一圖案 153a, 153b‧‧‧ first pattern

154‧‧‧金屬層 154‧‧‧metal layer

155‧‧‧平坦化層 155‧‧‧flattening layer

156‧‧‧無機層 156‧‧‧Inorganic layer

157‧‧‧第二圖案 157‧‧‧second pattern

170‧‧‧可撓性印刷電路板 170‧‧‧Flexible printed circuit boards

200‧‧‧顯示面板 200‧‧‧ display panel

DA‧‧‧顯示區域 DA‧‧‧ display area

H‧‧‧通孔 H‧‧‧through hole

NDA‧‧‧非顯示區域 NDA‧‧‧ non-display area

OLED‧‧‧有機發光顯示裝置 OLED‧‧‧ organic light emitting display device

PA‧‧‧墊單元 PA‧‧‧mat unit

TR‧‧‧薄膜電晶體 TR‧‧‧thin film transistor

藉由參照附圖詳細闡述實例性實施例，本發明之特徵對於熟習此項技術者將變得顯而易見，在附圖中：第1圖例示一顯示設備之一結構之平面圖；第2圖例示沿第1圖中之線I-I'截取之剖視圖；第3圖至第8圖示意性地例示沿第1圖中之線I-I'截取之顯示設備之截面之剖視圖；第9圖示意性地例示一顯示面板之一實施例之剖視圖。 The features of the present invention will become apparent to those skilled in the art from the <RTIgt;</RTI><RTIgt;</RTI><RTIgt; A cross-sectional view taken along line II ' in Fig. 1; and Figs. 3 to 8 schematically illustrate a cross-sectional view of a cross section of the display device taken along line II ' in Fig. 1; Fig. 9 schematically illustrates A cross-sectional view of one embodiment of a display panel.

以下，將參照附圖闡述實例性實施例；然而，該等實例性實施例可實施為諸多不同形式，而不應被視為僅限於本文中所述之實施例。更確切而言，提供該等實施例係為了使揭露內容透徹及完整並向熟習此項技術者全面傳達實例性實施方案。在附圖中，為清晰地例示起見，可誇大 層及區域之尺寸。當闡述一層或元件位於另一層或基板「上」，該層或元件可直接位於該另一層或基板上，抑或可存在中間層。當闡述一層位於另一層「下」時，該層可直接位於之下，抑或可存在一或多個中間層。當闡述一層位於兩層「之間」時，該層可係為該兩層間之唯一一層，抑或可存在一或多個中間層。為清晰及方便解釋起見，可誇大附圖中元件之尺寸。通篇中相同之編號指示相同之元件。例如「至少其中之一」等表達當位於一列元件之前時，係修飾整列元件而非修飾該列元件中之個別元件。 The exemplary embodiments are described below with reference to the drawings; however, the example embodiments may be embodied in many different forms and should not be construed as limited to the embodiments described herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, In the drawings, exaggerated for clarity of illustration The size of the layers and areas. When a layer or component is "on" another layer or substrate, the layer or element can be directly on the other layer or substrate, or an intermediate layer can be present. When a layer is placed "under" another layer, the layer may be directly below, or one or more intermediate layers may be present. When it is stated that a layer is "between" two layers, the layer can be the only layer between the two layers, or one or more intermediate layers can be present. For clarity and ease of explanation, the dimensions of the elements in the drawings may be exaggerated. The same reference numerals are used throughout the drawings. For example, "at least one of" or the like, when preceding a list of elements, modifies the entire list of elements rather than the individual elements of the list.

除非另外指明，否則一單數形式之用語可包括複數形式。「include(包括)」、「comprise(包含)」、「including(包括)」、或「comprising(包含)」之意義係指明一特性、一區域、一固定數、一步驟、一製程、一元件及/或一組件之存在，但並不排除其他特性、區域、固定數、步驟、製程、元件及/或組件之存在。例如「第一」、「第二」等關係用語及類似用語可用於描述各種元件，但該等元件不應受限於該等用語。該等用語係僅用於區分各個元件。當以不同之方式實施某一實施例時，可使用與所述次序不同之次序來執行特定過程次序。舉例而言，兩個順次描述之過程可實質上同時地執行，抑或以與所述次序相反之次序來執行。 Unless otherwise indicated, a singular term may include the plural. The meaning of "include", "comprise", "including", or "comprising" means a property, a region, a fixed number, a step, a process, a component. And/or the presence of a component, but does not exclude the presence of other features, regions, fixed numbers, steps, processes, components and/or components. Terms such as "first" and "second" and the like may be used to describe various elements, but such elements should not be limited to such terms. These terms are only used to distinguish the individual components. When an embodiment is implemented in a different manner, a particular process order can be performed in a different order than the described order. For example, two processes described in succession may be performed substantially concurrently or in the reverse order.

第1圖例示一顯示設備100a之一結構之平面圖，且第2圖係為顯示設備100a沿第1圖中之線I-I'截取之剖視圖。一併參照第1圖及第2圖，顯示設備100a可包括：一基板110、一顯示面板120、一墊電極130、一封裝層140、以及一保護層150。基板110可包括例如一透明玻璃材料，該透明玻璃材料包括SiO2作為主要組分。舉例而言，基板包括各種適宜之材料，例如陶瓷材料、塑膠材料、或金屬。基板110可係為一可撓性基板。基板110可係為例如一纖維增強塑膠(fiber reinforced plastic；FRP)基板。基板110可包括例如纖維組織或/及聚合物樹脂。該纖維組織可係為一光學纖維、或使用 光學纖維之一棉紗或織物。該聚合物樹脂可包括環氧樹脂、丙烯酸樹脂、或類似之材料。 1 is a plan view showing a structure of one display device 100a, and FIG. 2 is a cross-sectional view of the display device 100a taken along line II ' in FIG. 1. Referring to FIG. 1 and FIG. 2 together, the display device 100a can include a substrate 110, a display panel 120, a pad electrode 130, an encapsulation layer 140, and a protective layer 150. The substrate 110 may include, for example, a transparent glass material including SiO 2 as a main component. For example, the substrate includes a variety of suitable materials, such as ceramic materials, plastic materials, or metals. The substrate 110 can be a flexible substrate. The substrate 110 can be, for example, a fiber reinforced plastic (FRP) substrate. The substrate 110 may include, for example, fibrous tissue or/and a polymer resin. The fibrous structure can be an optical fiber or a cotton yarn or fabric using one of the optical fibers. The polymer resin may include an epoxy resin, an acrylic resin, or the like.

顯示面板120可位於基板110上，使得能夠達成用於顯示字母、數字、或影像之面板，並可包括一驅動裝置以驅動複數個顯示裝置及/或其自身。顯示裝置可係為液晶顯示器(LCD)、有機發光顯示裝置(OLED)、電漿顯示裝置(PDP)、或電泳顯示裝置(EDP)。顯示裝置可包括例如：訊號線，例如用以傳送閘極訊號之閘極線以及用以傳送資料訊號之資料線；一開關裝置，連接至閘極線及資料線；以及一畫素電極，連接至該開關裝置以接收資料訊號。各該顯示裝置可形成一單元畫素。 The display panel 120 can be located on the substrate 110 such that a panel for displaying letters, numbers, or images can be achieved and can include a drive to drive a plurality of display devices and/or itself. The display device may be a liquid crystal display (LCD), an organic light emitting display device (OLED), a plasma display device (PDP), or an electrophoretic display device (EDP). The display device may include, for example, a signal line, such as a gate line for transmitting a gate signal and a data line for transmitting a data signal; a switching device connected to the gate line and the data line; and a pixel electrode connected To the switching device to receive the data signal. Each of the display devices can form a unit pixel.

形成顯示面板120之一區域可係為顯示設備100a之一顯示區域DA。在顯示設備100a中，除顯示區域DA外之一區域可係為一非顯示區域NDA。在顯示面板120外之非顯示區域NDA中，可形成包括複數個墊電極130之一墊單元PA。該等複數個墊電極130可電性連接至顯示面板120。顯示裝置100a可連接至一驅動電路及一電源，以接收一驅動訊號及電力。電力及該驅動訊號可經由墊單元PA之墊電極130而被施加至顯示設備100a。墊電極130可電性連接至顯示面板120中之對應導線。 One of the areas forming the display panel 120 may be one of the display areas DA of the display device 100a. In the display device 100a, one area other than the display area DA may be a non-display area NDA. In the non-display area NDA outside the display panel 120, a pad unit PA including a plurality of pad electrodes 130 may be formed. The plurality of pad electrodes 130 can be electrically connected to the display panel 120. The display device 100a can be connected to a driving circuit and a power source to receive a driving signal and power. The power and the drive signal can be applied to the display device 100a via the pad electrode 130 of the pad unit PA. The pad electrode 130 can be electrically connected to a corresponding wire in the display panel 120.

驅動電路可位於一可撓性印刷電路板170上，該可撓性印刷電路板170可經由墊單元PA電性連接至顯示設備100a，或者可以積體電路(integrated circuit；IC)晶片之形式安裝於顯示設備100a之除顯示區域DA外之區域上。可在覆蓋顯示面板120的封裝層140之後且在墊單元PA上形成一保護層150之前，在墊電極130上形成可撓性印刷電路板170。 The driving circuit can be located on a flexible printed circuit board 170, which can be electrically connected to the display device 100a via the pad unit PA, or can be mounted in the form of an integrated circuit (IC) chip. On the area of the display device 100a other than the display area DA. The flexible printed circuit board 170 may be formed on the pad electrode 130 after covering the encapsulation layer 140 of the display panel 120 and before forming a protective layer 150 on the pad unit PA.

訊號線(例如，顯示面板120之掃描線及/或資料線)可分別連接至對應之墊電極130，以接收自驅動電路供應之掃描訊號及資料訊號。顯示面板120之電源線可連接至對應之墊電極130，以接收自電源供應之電 力。為電性連接顯示面板120至墊電極130，一連接導線可自顯示面板120延伸以形成墊電極130。一連接導線可例如位於顯示面板120與墊電極130之間。 The signal lines (for example, the scan lines and/or data lines of the display panel 120) can be respectively connected to the corresponding pad electrodes 130 to receive the scan signals and data signals supplied from the driving circuit. The power line of the display panel 120 can be connected to the corresponding pad electrode 130 to receive power from the power supply. force. To electrically connect the display panel 120 to the pad electrode 130, a connecting wire may extend from the display panel 120 to form the pad electrode 130. A connecting wire can be located, for example, between the display panel 120 and the pad electrode 130.

封裝層140可被提供用於防止外部空氣(例如外部水分或氧氣)侵入顯示面板中，並可環繞一上表面及各側面。封裝層140可包括複數個無機層、或一無機層及一有機層。封裝層140之有機層可包括例如一聚合物，並可係為一單層或一層堆疊(layer stack)，該層堆疊包括例如聚對苯二甲酸乙二酯、聚醯亞胺、聚碳酸酯、環氧樹脂、聚乙烯、聚丙烯酸酯、或類似之材料。有機層可包括例如聚丙烯酸酯，且例如可包括一含有二丙烯酸酯系單體(diacrylate-based monomer)及三丙烯酸酯系單體(triacrylate-based monomer)之聚合單體組成物。該單體組成物可更包括單丙烯酸單酯系單體(monoacrylate-based monomer)。該單體組成物可更包括例如一適宜之光起始劑，例如三甲基苯甲醯二苯氧膦(trimethyl benzoyl diphenyl phosphine oxide；TPO)。 The encapsulation layer 140 may be provided to prevent intrusion of outside air (eg, external moisture or oxygen) into the display panel and to surround an upper surface and sides. The encapsulation layer 140 may include a plurality of inorganic layers, or an inorganic layer and an organic layer. The organic layer of the encapsulation layer 140 may include, for example, a polymer, and may be a single layer or a layer stack including, for example, polyethylene terephthalate, polyimide, polycarbonate. , epoxy, polyethylene, polyacrylate, or similar materials. The organic layer may include, for example, a polyacrylate, and may, for example, include a polymerizable monomer composition containing a diacrylate-based monomer and a triacrylate-based monomer. The monomer composition may further include a monoacrylate-based monomer. The monomer composition may further comprise, for example, a suitable photoinitiator such as trimethyl benzoyl diphenyl phosphine oxide (TPO).

封裝層140之無機層可係為一單層或一包括金屬氧化物或金屬氮化物之層堆疊。詳言之，該無機層可包括SiNx、Al2O3、SiO2、及TiO2之任一者。被暴露至外部之封裝層140之頂部層可包括例如一無機層，以防止水分侵入至有機發光裝置中。封裝層140可包括至少一個其中至少一個有機層位於至少兩個無機層之間的夾層結構(sandwich structure)。封裝層140可包括例如至少一個其中至少一個無機層位於至少兩個有機層之間的夾層結構。封裝層140可包括其中至少一個有機層位於至少兩個無機層之間的一夾層結構以及其中至少一個無機層位於至少兩個有機層之間一夾層結構。 The inorganic layer of the encapsulation layer 140 can be a single layer or a layer stack comprising a metal oxide or a metal nitride. In detail, the inorganic layer may include any one of SiN x , Al 2 O 3 , SiO 2 , and TiO 2 . The top layer of the encapsulation layer 140 exposed to the outside may include, for example, an inorganic layer to prevent moisture from intruding into the organic light-emitting device. The encapsulation layer 140 may include at least one sandwich structure in which at least one organic layer is located between at least two inorganic layers. The encapsulation layer 140 may include, for example, at least one sandwich structure in which at least one inorganic layer is located between at least two organic layers. The encapsulation layer 140 may include a sandwich structure in which at least one organic layer is located between at least two inorganic layers and a sandwich structure in which at least one inorganic layer is located between at least two organic layers.

封裝層140可包括自顯示面板120之頂部依序形成之一第一無機層、一第一有機層、以及一第二無機層。封裝層140可包括自顯示面板 120之頂部依序形成之一第一無機層、一第一有機層、一第二無機層、一第二有機層、以及一第三無機層。封裝層140可包括自顯示面板120之頂部依序形成之一第一無機層、一第一有機層、一第二無機層、一第二有機層、一第三無機層、一第三有機層、以及一第四無機層。可在顯示面板120與第一無機層之間另外包括含有氟化鋰(LiF)之一鹵化金屬層。該鹵化金屬層可防止顯示面板120在例如藉由一濺鍍法或一電漿沈積法形成第一無機層時受到損傷。 The encapsulation layer 140 may include a first inorganic layer, a first organic layer, and a second inorganic layer sequentially formed from the top of the display panel 120. The encapsulation layer 140 can include a self-display panel A first inorganic layer, a first organic layer, a second inorganic layer, a second organic layer, and a third inorganic layer are sequentially formed on the top of 120. The encapsulation layer 140 may include a first inorganic layer, a first organic layer, a second inorganic layer, a second organic layer, a third inorganic layer, and a third organic layer sequentially formed from the top of the display panel 120. And a fourth inorganic layer. A halogenated metal layer containing one of lithium fluoride (LiF) may be additionally included between the display panel 120 and the first inorganic layer. The metal halide layer prevents the display panel 120 from being damaged when the first inorganic layer is formed, for example, by a sputtering method or a plasma deposition method.

第一有機層可小於第二無機層，且第二有機層可小於第三無機層。第一有機層可被第二無機層完全或局部覆蓋，且第二有機層可被第三無機層完全或局部覆蓋。 The first organic layer may be smaller than the second inorganic layer, and the second organic layer may be smaller than the third inorganic layer. The first organic layer may be completely or partially covered by the second inorganic layer, and the second organic layer may be completely or partially covered by the third inorganic layer.

一保護層150可形成於墊單元PA上以覆蓋墊電極130。該保護層150可在形成覆蓋顯示面板120之封裝層140後形成於墊單元PA上。保護層150可具有例如約10百萬帕(MPa)至約200十億帕(GPa)之一彈性係數，並可藉由使用一黏合劑層(adhesive layer)而位於墊單元PA之基板110上。保護層150可使用一有機材料、一無機材料、或一金屬材料形成。保護層150可具有例如約10微米(μm)至約150微米之一厚度。 A protective layer 150 may be formed on the pad unit PA to cover the pad electrode 130. The protective layer 150 may be formed on the pad unit PA after forming the encapsulation layer 140 covering the display panel 120. The protective layer 150 may have a modulus of elasticity of, for example, about 10 million Pascals (MPa) to about 200 billion Pascals (GPa), and may be located on the substrate 110 of the pad unit PA by using an adhesive layer. . The protective layer 150 may be formed using an organic material, an inorganic material, or a metallic material. The protective layer 150 may have a thickness of, for example, about 10 micrometers (μm) to about 150 micrometers.

有機材料可包括例如彈性係數滿足本文所述範圍之以下材料：例如環烯烴共聚物(COC)、聚甲基丙烯酸甲酯(PMMA)、聚碳酸酯(PC)、環烯烴聚合物(COP)、液晶聚合物(LCP)、聚二甲基矽氧烷(PDMS)、聚醯胺(PA)、聚乙烯(PE)、聚醯亞胺(PI)、聚丙烯(PP)、聚苯醚(PPE)、聚苯乙烯(PS)、聚甲醛(POM)、聚醚醚酮(PEEK)、聚對苯二甲酸乙二酯(PET)、聚四氟乙烯(PTFE)、聚氯乙烯(PVC)、聚偏二氟乙烯(PVDF)、聚對苯二甲酸丁二酯(PBT)、氟化乙烯丙烯(FEP)、四氟乙烯(PFA)、或其任一混合物。可使用任一適宜之有機材料，例如只 要該有機材料之彈性係數滿足此範圍。 The organic material may include, for example, the following materials having a modulus of elasticity that meets the ranges described herein: for example, a cyclic olefin copolymer (COC), polymethyl methacrylate (PMMA), polycarbonate (PC), cycloolefin polymer (COP), Liquid Crystal Polymer (LCP), Polydimethyloxane (PDMS), Polydecylamine (PA), Polyethylene (PE), Polyimine (PI), Polypropylene (PP), Polyphenylene Ether (PPE) ), polystyrene (PS), polyoxymethylene (POM), polyetheretherketone (PEEK), polyethylene terephthalate (PET), polytetrafluoroethylene (PTFE), polyvinyl chloride (PVC), Polyvinylidene fluoride (PVDF), polybutylene terephthalate (PBT), fluorinated ethylene propylene (FEP), tetrafluoroethylene (PFA), or any mixture thereof. Any suitable organic material can be used, for example only The elastic modulus of the organic material is required to satisfy this range.

無機材料可係為，舉例而言，彈性係數滿足例如本文所述範圍之一碳膜、碳化矽、或氧化物系材料。可使用任一適宜之無機材料，例如只要該無機材料之彈性係數滿足此範圍。金屬材料可係為，舉例而言，彈性係數例如滿足本文所述範圍之鎢或碳化鎢。可使用任一適宜之金屬材料，只要該金屬材料之彈性係數例如滿足此範圍。保護層150可使用彈性係數滿足本文所述範圍之玻璃纖維強化聚酯、玻璃粉、或玻璃纖維形成。位於墊單元PA之基板100上之黏合劑層可具有例如約10微米至約150微米之厚度。黏合劑層可包括選自丙烯酸系樹脂(acryl-based resin)、胺基甲酸酯系樹脂(urethane-based resin)、矽系樹脂(silicon-based resin)及環氧系樹脂(epoxy-based resin)之至少一種樹脂。 The inorganic material may be, for example, a coefficient of elasticity that satisfies, for example, one of the ranges described herein as a carbon film, tantalum carbide, or oxide based material. Any suitable inorganic material may be used, for example, as long as the modulus of elasticity of the inorganic material satisfies this range. The metallic material can be, for example, a modulus of elasticity such as tungsten or tungsten carbide that meets the ranges described herein. Any suitable metal material may be used as long as the elastic modulus of the metal material satisfies, for example, this range. The protective layer 150 may be formed using a glass fiber reinforced polyester, glass frit, or glass fiber having a modulus of elasticity that satisfies the ranges described herein. The adhesive layer on the substrate 100 of the pad unit PA may have a thickness of, for example, about 10 microns to about 150 microns. The adhesive layer may include an acryl-based resin, a urethane-based resin, a silicon-based resin, and an epoxy-based resin. At least one resin.

可利用在墊電極130上塗佈樹脂之方法形成保護層150。該樹脂可包括例如丙烯酸系樹脂、胺基甲酸酯系樹脂、矽系樹脂、或環氧系樹脂。該樹脂可更包括添加劑，例如紫外光(UV)硬化劑或熱硬化劑，並可更包括奈米粒子，例如奈米規模之Al或SiO2。因保護層150係位於墊電極130上，故可緩解當例如顯示設備100a彎曲時施加至墊單元PA之高應力。即使當例如顯示設備100a彎曲時，亦可防止在墊電極130中出現例如裂紋等故障，俾可增強顯示設備100a之可靠性。 The protective layer 150 can be formed by a method of coating a resin on the pad electrode 130. The resin may include, for example, an acrylic resin, a urethane resin, a fluorene resin, or an epoxy resin. The resin may further include an additive such as an ultraviolet (UV) hardener or a heat hardener, and may further include nano particles such as nanometer-sized Al or SiO 2 . Since the protective layer 150 is located on the pad electrode 130, the high stress applied to the pad unit PA when, for example, the display device 100a is bent can be alleviated. Even when, for example, the display device 100a is bent, occurrence of a failure such as a crack in the pad electrode 130 can be prevented, and the reliability of the display device 100a can be enhanced.

第3圖至第8圖示意性地例示各種實施例之顯示設備100a(被稱為顯示設備100b至顯示設備100g)之截面沿第1圖中之線I-I'截取之剖視圖。在第3圖中，與第2圖中相同之參考編號指示相同之構件。參照第3圖，位於顯示設備100b之一墊單元PA中一墊電極130上之一保護層150a可包括依序堆疊之一有機層152、一金屬層154、以及一無機層156。 3 to 8 schematically illustrate cross-sectional views of the cross section of the display device 100a (referred to as display device 100b to display device 100g) of various embodiments taken along line II ' in Fig. 1. In Fig. 3, the same reference numerals as in Fig. 2 denote the same members. Referring to FIG. 3, a protective layer 150a on a pad electrode 130 in a pad unit PA of the display device 100b may include an organic layer 152, a metal layer 154, and an inorganic layer 156 sequentially stacked.

有機層152可具有例如約10百萬帕至約200十億帕之一彈性 係數，並可包括環烯烴共聚物(COC)、聚甲基丙烯酸甲酯(PMMA)、聚碳酸酯(PC)、環烯烴聚合物(COP)、液晶聚合物(LCP)、聚二甲基矽氧烷(PDMS)、聚醯胺(PA)、聚乙烯(PE)、聚醯亞胺(PI)、聚丙烯(PP)、聚苯醚(PPE)、聚苯乙烯(PS)、聚甲醛(POM)、聚醚醚酮(PEEK)、聚對苯二甲酸乙二酯(PET)、聚四氟乙烯(PTFE)、聚氯乙烯(PVC)、聚偏二氟乙烯(PVDF)、聚對苯二甲酸丁二酯(PBT)、氟化乙烯丙烯(FEP)、四氟乙烯(PFA)、或其任一混合物。可使用任一適宜之有機材料，只要該有機材料之彈性係數例如滿足本文所述之範圍。金屬層154可包括例如含有Pt、Au、Ag、Ta、Ti、Cr、Al、Cu、碳奈米管(carbon nanotube；CNT)、石墨烯(graphene)、銀奈米線(silver nanowire)、聚合物導體、或其組合之一材料。無機層156可包括例如SiNx、Al2O3、SiO2、TiO2、SiON、AZO、ZnO、ZrO、或其組合。雖然一實施例可顯示及描述保護層150a包括依序排列於有機層152上之金屬層154及無機層156，但亦可使用其他排列方式，例如，無機層156及金屬層154可依序位於有機層152上。 The organic layer 152 may have an elastic modulus of, for example, about 10 MPa to about 200 billion kPa, and may include a cyclic olefin copolymer (COC), polymethyl methacrylate (PMMA), polycarbonate (PC), Cycloolefin polymer (COP), liquid crystal polymer (LCP), polydimethyl methoxy oxane (PDMS), polydecylamine (PA), polyethylene (PE), polyimine (PI), polypropylene ( PP), polyphenylene ether (PPE), polystyrene (PS), polyoxymethylene (POM), polyetheretherketone (PEEK), polyethylene terephthalate (PET), polytetrafluoroethylene (PTFE) , polyvinyl chloride (PVC), polyvinylidene fluoride (PVDF), polybutylene terephthalate (PBT), fluorinated ethylene propylene (FEP), tetrafluoroethylene (PFA), or any mixture thereof. Any suitable organic material may be used as long as the elastic modulus of the organic material, for example, satisfies the ranges described herein. The metal layer 154 may include, for example, Pt, Au, Ag, Ta, Ti, Cr, Al, Cu, carbon nanotubes (CNT), graphene, silver nanowire, polymerization. A material conductor, or a combination thereof. The inorganic layer 156 may include, for example, SiN x , Al 2 O 3 , SiO 2 , TiO 2 , SiON, AZO, ZnO, ZrO, or a combination thereof. Although an embodiment may show and describe that the protective layer 150a includes the metal layer 154 and the inorganic layer 156 sequentially arranged on the organic layer 152, other arrangements may be used. For example, the inorganic layer 156 and the metal layer 154 may be sequentially located. On the organic layer 152.

第4圖示意性地例示一實施例之顯示設備100a(被稱為顯示設備100c)之截面沿第1圖中之線I-I'截取之剖視圖。在第4圖中，與第3圖中相同之參考編號指示相同之構件。參照第4圖，位於顯示設備100c之一墊單元PA中一墊電極130上之一保護層150b可包括交替形成之一有機層152、一金屬層154、以及一無機層156。第4圖例示可將包括有機層152、金屬層154、及無機層156之一保護層150a堆疊成例如兩層，以形成一單一保護層150b。在其他實施方案中，舉例而言，保護層150a可被堆疊成三或更多個層以形成一單一保護層150b。 Fig. 4 schematically illustrates a cross-sectional view of a section of a display device 100a (referred to as a display device 100c) of an embodiment taken along line II ' in Fig. 1. In Fig. 4, the same reference numerals as in Fig. 3 denote the same members. Referring to FIG. 4, a protective layer 150b on a pad electrode 130 in a pad unit PA of the display device 100c may include an organic layer 152, a metal layer 154, and an inorganic layer 156 alternately formed. 4 illustrates that the protective layer 150a including the organic layer 152, the metal layer 154, and the inorganic layer 156 may be stacked, for example, in two layers to form a single protective layer 150b. In other embodiments, for example, the protective layer 150a can be stacked in three or more layers to form a single protective layer 150b.

第5圖示意性地例示一實施例之顯示設備100a(被稱為顯示設備100d)之截面沿第1圖中之線I-I'截取之剖視圖。在第5圖中，與第2圖中 相同之參考編號指示相同之構件。參照第5圖，位於顯示設備100d之一墊單元PA中一墊電極130上之一保護層150c可包括一有機層152、以及位於有機層152上之一第一圖案153a。該第一圖案153a可具有例如一矩形截面。在其他實施方案中，可採用其他形狀之截面。 Fig. 5 schematically illustrates a cross-sectional view of a section of a display device 100a (referred to as a display device 100d) of an embodiment taken along line II ' in Fig. 1. In Fig. 5, the same reference numerals as in Fig. 2 denote the same members. Referring to FIG. 5, a protective layer 150c on a pad electrode 130 in a pad unit PA of the display device 100d may include an organic layer 152 and a first pattern 153a on the organic layer 152. The first pattern 153a may have, for example, a rectangular cross section. In other embodiments, cross-sections of other shapes may be employed.

第一圖案153a可包括例如環烯烴共聚物(COC)、聚甲基丙烯酸甲酯(PMMA)、聚碳酸酯(PC)、環烯烴聚合物(COP)、液晶聚合物(LCP)、聚二甲基矽氧烷(PDMS)、聚醯胺(PA)、聚乙烯(PE)、聚醯亞胺(PI)、聚丙烯(PP)、聚苯醚(PPE)、聚苯乙烯(PS)、聚甲醛(POM)、聚醚醚酮(PEEK)、聚對苯二甲酸乙二酯(PET)、聚四氟乙烯(PTFE)、聚氯乙烯(PVC)、聚偏二氟乙烯(PVDF)、聚對苯二甲酸丁二酯(PBT)、氟化乙烯丙烯(FEP)、四氟乙烯(PFA)、或其混合物。第一圖案153a可包括例如彈性係數小於有機層152的彈性係數之一材料，並可具有例如約10百萬帕至約10十億帕之一彈性係數。 The first pattern 153a may include, for example, a cyclic olefin copolymer (COC), polymethyl methacrylate (PMMA), polycarbonate (PC), cycloolefin polymer (COP), liquid crystal polymer (LCP), polydimethylene Base oxane (PDMS), polyamine (PA), polyethylene (PE), polyimine (PI), polypropylene (PP), polyphenylene ether (PPE), polystyrene (PS), poly Formaldehyde (POM), polyetheretherketone (PEEK), polyethylene terephthalate (PET), polytetrafluoroethylene (PTFE), polyvinyl chloride (PVC), polyvinylidene fluoride (PVDF), poly Butylene terephthalate (PBT), fluorinated ethylene propylene (FEP), tetrafluoroethylene (PFA), or mixtures thereof. The first pattern 153a may include, for example, a material having a modulus of elasticity that is less than a coefficient of elasticity of the organic layer 152, and may have a modulus of elasticity of, for example, about 10 MPa to about 10 MPa.

第6圖示意性地例示一實施例之顯示設備100a(被稱為顯示設備100e)之截面沿第1圖中之線I-I'截取之剖視圖。在第6圖中，與第5圖中相同之參考編號指示相同之構件。參照第6圖，位於顯示設備100e之一墊單元PA中一墊電極130上之一保護層150d可包括：一有機層152；一第一圖案153a，位於該有機層152上；以及一平坦化層155，位於有機層152上並覆蓋該第一圖案153a。平坦化層155可在覆蓋第一圖案153a之同時使第一圖案153a平坦化，並可利用一液相樹脂而形成。該樹脂可具有小於第一圖案153a的彈性係數之一彈性係數。 Fig. 6 is a schematic cross-sectional view showing a section of a display device 100a (referred to as a display device 100e) of an embodiment taken along line II ' in Fig. 1. In Fig. 6, the same reference numerals as in Fig. 5 denote the same members. Referring to FIG. 6, a protective layer 150d on a pad electrode 130 in a pad unit PA of the display device 100e may include: an organic layer 152; a first pattern 153a on the organic layer 152; and a planarization A layer 155 is disposed on the organic layer 152 and covers the first pattern 153a. The planarization layer 155 may planarize the first pattern 153a while covering the first pattern 153a, and may be formed using a liquid phase resin. The resin may have a modulus of elasticity that is less than one of the elastic coefficients of the first pattern 153a.

第7圖示意性地例示一實施例之顯示設備100a(被稱為顯示設備100f)之截面沿第1圖中之線I-I'截取之剖視圖。在第7圖中，與第5圖中相同之編號指示相同之構件。參照第7圖，位於顯示設備100f之一墊單元PA 中一墊電極130上之一保護層150e可包括一有機層152、以及位於有機層152上之一第一圖案153b。該第一圖案153b可包括例如環烯烴共聚物(COC)、聚甲基丙烯酸甲酯(PMMA)、聚碳酸酯(PC)、環烯烴聚合物(COP)、液晶聚合物(LCP)、聚二甲基矽氧烷(PDMS)、聚醯胺(PA)、聚乙烯(PE)、聚醯亞胺(PI)、聚丙烯(PP)、聚苯醚(PPE)、聚苯乙烯(PS)、聚甲醛(POM)、聚醚醚酮(PEEK)、聚對苯二甲酸乙二酯(PET)、聚四氟乙烯(PTFE)、聚氯乙烯(PVC)、聚偏二氟乙烯(PVDF)、聚對苯二甲酸丁二酯(PBT)、氟化乙烯丙烯(FEP)、四氟乙烯(PFA)、或其混合物。第一圖案153b可包括例如彈性係數例如小於有機層152的彈性係數之一材料，並可具有例如約10百萬帕至約10十億帕之一彈性係數。儘管第7圖例示第一圖案153b具有一梯形截面，然而在其他實施例中，第一圖案153b之截面亦可使用其他形狀。 Fig. 7 is a view schematically showing a cross section of a section of a display device 100a (referred to as a display device 100f) of an embodiment taken along line II ' in Fig. 1. In Fig. 7, the same reference numerals as in Fig. 5 denote the same members. Referring to FIG. 7, a protective layer 150e on a pad electrode 130 in a pad unit PA of the display device 100f may include an organic layer 152 and a first pattern 153b on the organic layer 152. The first pattern 153b may include, for example, a cyclic olefin copolymer (COC), polymethyl methacrylate (PMMA), polycarbonate (PC), cycloolefin polymer (COP), liquid crystal polymer (LCP), poly 2 Methyl decane (PDMS), polyamine (PA), polyethylene (PE), polyimine (PI), polypropylene (PP), polyphenylene ether (PPE), polystyrene (PS), POM, PEEK, polyethylene terephthalate (PET), polytetrafluoroethylene (PTFE), polyvinyl chloride (PVC), polyvinylidene fluoride (PVDF), Polybutylene terephthalate (PBT), fluorinated ethylene propylene (FEP), tetrafluoroethylene (PFA), or a mixture thereof. The first pattern 153b may include, for example, a material having a modulus of elasticity such as less than one of the elastic coefficients of the organic layer 152, and may have a modulus of elasticity of, for example, about 10 MPa to about 10 MPa. Although FIG. 7 illustrates that the first pattern 153b has a trapezoidal cross section, in other embodiments, other shapes may be used for the cross section of the first pattern 153b.

第8圖示意性地例示一實施例之顯示設備100a(被稱為顯示設備100g)之截面沿第1圖中之線I-I'截取之剖視圖。在第8圖中，與第6圖中相同之編號指示相同之構件。參照第8圖，位於顯示設備100g之一墊單元PA中一墊電極130上之一保護層150f可包括一有機層152；一第一圖案153a，位於有機層152上；一平坦化層155，位於有機層152上並覆蓋第一圖案153a；以及一第二圖案157，位於平坦化層155上。第二圖案157可包括例如環烯烴共聚物(COC)、聚甲基丙烯酸甲酯(PMMA)、聚碳酸酯(PC)、環烯烴聚合物(COP)、液晶聚合物(LCP)、聚二甲基矽氧烷(PDMS)、聚醯胺(PA)、聚乙烯(PE)、聚醯亞胺(PI)、聚丙烯(PP)、聚苯醚(PPE)、聚苯乙烯(PS)、聚甲醛(POM)、聚醚醚酮(PEEK)、聚對苯二甲酸乙二酯(PET)、聚四氟乙烯(PTFE)、聚氯乙烯(PVC)、聚偏二氟乙烯(PVDF)、聚對苯二甲酸丁二酯(PBT)、氟化乙烯丙烯(FEP)、四氟乙烯(PFA)、或其混合物。 第二圖案157可包括，舉例而言，彈性係數例如小於有機層152的彈性係數之一材料，並可具有例如約10百萬帕至約10十億帕之一彈性係數。儘管第8圖可顯示第二圖案157具有一三角形截面，然而在其他實施方案中，第二圖案157亦可具有各種其他形狀之截面。 Fig. 8 is a cross-sectional view schematically showing a section of a display device 100a (referred to as a display device 100g) of an embodiment taken along line II ' in Fig. 1. In Fig. 8, the same reference numerals as in Fig. 6 denote the same members. Referring to FIG. 8, a protective layer 150f on a pad electrode 130 in a pad unit PA of the display device 100g may include an organic layer 152; a first pattern 153a on the organic layer 152; a planarization layer 155, Located on the organic layer 152 and covering the first pattern 153a; and a second pattern 157 on the planarization layer 155. The second pattern 157 may include, for example, a cyclic olefin copolymer (COC), polymethyl methacrylate (PMMA), polycarbonate (PC), cycloolefin polymer (COP), liquid crystal polymer (LCP), polydimethylene Base oxane (PDMS), polyamine (PA), polyethylene (PE), polyimine (PI), polypropylene (PP), polyphenylene ether (PPE), polystyrene (PS), poly Formaldehyde (POM), polyetheretherketone (PEEK), polyethylene terephthalate (PET), polytetrafluoroethylene (PTFE), polyvinyl chloride (PVC), polyvinylidene fluoride (PVDF), poly Butylene terephthalate (PBT), fluorinated ethylene propylene (FEP), tetrafluoroethylene (PFA), or mixtures thereof. The second pattern 157 may include, for example, a material having a modulus of elasticity that is, for example, less than one of the elastic coefficients of the organic layer 152, and may have an elastic modulus of, for example, about 10 MPa to about 10 billion Pa. Although FIG. 8 may show that the second pattern 157 has a triangular cross section, in other embodiments, the second pattern 157 may have a cross section of various other shapes.

第9圖示意性地例示一顯示面板之剖視圖。顯示面板200可包括例如彼此間隔開之複數個OLED、及薄膜電晶體(TR)。該等OLED及TR可位於一基板110上。基板110可包括例如玻璃材料、塑膠材料、或金屬材料。一緩衝層112可位於基板110上。緩衝層112可包括一絕緣體以使基板110之頂面為一平坦化表面，並防止水分或異物顆粒向基板110中侵入。 Fig. 9 is a schematic cross-sectional view showing a display panel. The display panel 200 may include, for example, a plurality of OLEDs spaced apart from each other, and a thin film transistor (TR). The OLEDs and TRs can be located on a substrate 110. The substrate 110 may include, for example, a glass material, a plastic material, or a metal material. A buffer layer 112 can be located on the substrate 110. The buffer layer 112 may include an insulator such that the top surface of the substrate 110 is a planarized surface and prevents moisture or foreign particles from intruding into the substrate 110.

一薄膜電晶體(TR)、一電容器、以及一有機發光顯示裝置(OLED)可位於緩衝層112上。薄膜電晶體TR可包括一主動層121、一閘極122、一源極123、以及一汲極124。OLED可包括一第一電極125、一第二電極127、以及一中間層126。詳言之，主動層121可在緩衝層112上設置成一預定圖案。主動層121可包括一無機材料(例如，矽)、一有機材料、或一氧化物半導體材料；或者可藉由植入p型或n型摻雜劑而形成。一閘極絕緣層113可位於主動層121上。閘極122可位於閘極絕緣層113上，對應於主動層121。可形成覆蓋閘極122之一層間絕緣層114，且源極123及汲極124可位於與主動層121之預定區域接觸之層間絕緣層114上。 A thin film transistor (TR), a capacitor, and an organic light emitting display device (OLED) may be disposed on the buffer layer 112. The thin film transistor TR may include an active layer 121, a gate 122, a source 123, and a drain 124. The OLED can include a first electrode 125, a second electrode 127, and an intermediate layer 126. In detail, the active layer 121 may be disposed in a predetermined pattern on the buffer layer 112. The active layer 121 may comprise an inorganic material (eg, germanium), an organic material, or an oxide semiconductor material; or may be formed by implanting a p-type or n-type dopant. A gate insulating layer 113 may be located on the active layer 121. The gate 122 may be located on the gate insulating layer 113 corresponding to the active layer 121. An interlayer insulating layer 114 covering the gate 122 may be formed, and the source 123 and the drain 124 may be located on the interlayer insulating layer 114 in contact with a predetermined region of the active layer 121.

可形成覆蓋源極123及汲極124之平坦化層115，且於平坦化層115上可更形成一附加的絕緣層。第一電極125可位於平坦化層115上。第一電極125可被形成為使其經由一通孔(h)電性連接至源極123與汲極124其中之任一者。一畫素界定層116可覆蓋第一電極125。在畫素界定層116中形成一預定開口後，可於由該開口界定之一區域中形成具有一有機發射層之中間層126。畫素界定層116可界定一畫素區域及一非畫素區域。亦即， 畫素界定層116之開口可成為一實質的畫素區域。 A planarization layer 115 covering the source 123 and the drain 124 may be formed, and an additional insulating layer may be further formed on the planarization layer 115. The first electrode 125 may be located on the planarization layer 115. The first electrode 125 may be formed such that it is electrically connected to any one of the source 123 and the drain 124 via a via (h). A pixel defining layer 116 may cover the first electrode 125. After a predetermined opening is formed in the pixel defining layer 116, an intermediate layer 126 having an organic emissive layer may be formed in a region defined by the opening. The pixel defining layer 116 can define a pixel region and a non-pixel region. that is, The opening of the pixel defining layer 116 can be a substantial pixel area.

第二電極127可位於中間層126上。第一電極125可被每一畫素地圖案化，且第二電極127可被形成為使一共用電壓可施加至所有畫素。儘管附圖中僅例示一個OLED，然而顯示面板200可包括複數個OLED。各該OLED可形成例如一個畫素，且每一畫素可顯示紅色、綠色、藍色、或白色。亦可使用其他數目之畫素及/或顏色。 The second electrode 127 can be located on the intermediate layer 126. The first electrode 125 may be patterned every pixel, and the second electrode 127 may be formed such that a common voltage can be applied to all pixels. Although only one OLED is illustrated in the drawings, the display panel 200 may include a plurality of OLEDs. Each of the OLEDs may form, for example, one pixel, and each pixel may display red, green, blue, or white. Other numbers of pixels and/or colors can also be used.

無論畫素位置如何，中間層126皆可被共同地提供於平坦化層115之整個表面上。有機發射層可被形成為一如下結構，在該結構中，包括發出紅色光之一發光物質、發出綠色光之一發光物質、以及發出藍色光之一發光物質之層係彼此垂直堆疊或混合。除了紅色、綠色、及藍色之組合以外、或者代替紅色、綠色、及藍色之組合，亦可使用任何能夠發出白色光之各種顏色之組合。畫素可包括一顏色轉換層或一濾色片，該顏色轉換層或濾色片將白色光轉換成預定顏色之光。封裝層140可位於OLED上，且畫素界定層116可覆蓋並保護該OLED。 The intermediate layer 126 may be collectively provided on the entire surface of the planarization layer 115 regardless of the pixel position. The organic emission layer may be formed into a structure in which a layer including a luminescent material that emits red light, a luminescent material that emits green light, and a luminescent material that emits blue light are vertically stacked or mixed with each other. In addition to the combination of red, green, and blue, or in lieu of a combination of red, green, and blue, any combination of colors that emit white light can be used. The pixels may include a color conversion layer or a color filter that converts white light into light of a predetermined color. The encapsulation layer 140 can be located on the OLED, and the pixel defining layer 116 can cover and protect the OLED.

藉由統整與回顧，根據本文所述實施例其中之一或多個實施例，一保護層可位於一墊單元上以增強顯示設備(例如顯示設備100a、100b、100c、100d、100e、100f、及100g)之可靠性。 By way of integration and review, a protective layer can be located on a pad unit to enhance a display device (eg, display devices 100a, 100b, 100c, 100d, 100e, 100f, in accordance with one or more embodiments of the embodiments described herein). And 100g) reliability.

本文中已揭露各種實例性實施例，且儘管使用各種具體用語，但該等用語僅用於及被解釋為一般性及描述性意義，而並非用於限制目的。在某些情形中，如在本申請案提出申請之前此項技術中具有通常知識者所易知，除非明確地指明，否則結合一特定實施例所闡述之特徵、特性、及/或元件可單獨使用或可與結合其他實施例所闡述之特徵、特性、及/或元件組合使用。因此，在不背離由下文申請專利範圍所述之本發明之精神及範圍之條件下，可作出各種形式及細節上之變化。 Various example embodiments have been disclosed herein, and are not intended to be limiting. In certain instances, as will be apparent to those of ordinary skill in the art prior to the application of the present application, the features, characteristics, and/or components described in connection with a particular embodiment can be Use or in combination with features, characteristics, and/or elements set forth in connection with other embodiments. Various changes in form and detail may be made without departing from the spirit and scope of the invention as described in the appended claims.

100a‧‧‧顯示設備 100a‧‧‧Display equipment

110‧‧‧基板 110‧‧‧Substrate

120‧‧‧顯示面板 120‧‧‧ display panel

130‧‧‧墊電極 130‧‧‧ pads electrode

140‧‧‧封裝層 140‧‧‧Encapsulation layer

150‧‧‧保護層 150‧‧‧protection layer

170‧‧‧可撓性印刷電路板 170‧‧‧Flexible printed circuit boards

DA‧‧‧顯示區域 DA‧‧‧ display area

NDA‧‧‧非顯示區域 NDA‧‧‧ non-display area

PA‧‧‧墊單元 PA‧‧‧mat unit

Claims (20)

一種顯示設備，包含：一基板；一墊單元，位於該基板上；一顯示面板，位於該基板上；一封裝層，覆蓋該顯示面板；以及一保護層，位於該墊單元上，並具有約10百萬帕(MPa)至約200十億帕(GPa)的彈性係數。 A display device comprising: a substrate; a pad unit on the substrate; a display panel on the substrate; an encapsulation layer covering the display panel; and a protective layer on the pad unit and having an A modulus of elasticity from 10 million Pascals (MPa) to about 200 Billion Pascals (GPa). 如請求項1所述之顯示設備，其中該墊單元包括：一墊電極，位於該基板上；以及一可撓性印刷電路板，位於該墊電極上，該可撓性印刷電路板係電性連接至該墊電極。 The display device of claim 1, wherein the pad unit comprises: a pad electrode on the substrate; and a flexible printed circuit board on the pad electrode, the flexible printed circuit board being electrically Connect to the pad electrode. 如請求項2所述之顯示設備，其中該保護層係位於該墊單元上，該保護層覆蓋該墊電極之一區域以及該可撓性印刷電路板之一區域。 The display device of claim 2, wherein the protective layer is on the pad unit, the protective layer covering an area of the pad electrode and an area of the flexible printed circuit board. 如請求項1所述之顯示設備，其中該保護層包括一有機材料、一無機材料、或一金屬材料。 The display device of claim 1, wherein the protective layer comprises an organic material, an inorganic material, or a metallic material. 如請求項4所述之顯示設備，其中該有機材料包括環烯烴共聚物(cyclic olefin copolymer；COC)、聚甲基丙烯酸甲酯(poly(methyl methacrylate)；PMMA)、聚碳酸酯(polycarbonate；PC)、環烯烴聚合物(cyclo olefin polymer；COP)、液晶聚合物(liquid crystal polymer；LCP)、聚二甲基矽氧烷(polydimethyl siloxane；PDMS)、聚醯胺(polyamide；PA)、聚 乙烯(polyethylene；PE)、聚醯亞胺(polyimide；PI)、聚丙烯(polypropylene；PP)、聚苯醚(polyphenylene ether；PPE)、聚苯乙烯(polystyrene；PS)、聚甲醛(polyoxymethylene；POM)、聚醚醚酮(polyetheretherketone；PEEK)、聚對苯二甲酸乙二酯(polyethylene terephthalate；PET)、聚四氟乙烯(polytetrafluoroethylene；PTFE)、聚氯乙烯(polyvinylchloride；PVC)、聚偏二氟乙烯(polyvinylidene fluoride；PVDF)、聚對苯二甲酸丁二酯(polybutylene terephthalate；PBT)、氟化乙烯丙烯(fluorinated ethylene propylene；FEP)、四氟乙烯(tetrafluoroethylene；PFA)、或其混合物。 The display device according to claim 4, wherein the organic material comprises a cyclic olefin copolymer (COC), poly(methyl methacrylate; PMMA), polycarbonate (polycarbonate; PC) ), cycloolefin polymer (COP), liquid crystal polymer (LCP), polydimethyl siloxane (PDMS), polyamine (PA), poly Ethylene (PE), polyimide (PI), polypropylene (PP), polyphenylene ether (PPE), polystyrene (PS), polyoxymethylene (POM) ), polyetheretherketone (PEEK), polyethylene terephthalate (PET), polytetrafluoroethylene (PTFE), polyvinyl chloride (PVC), polyvinylidene fluoride Polyvinylidene fluoride (PVDF), polybutylene terephthalate (PBT), fluorinated ethylene propylene (FEP), tetrafluoroethylene (PFA), or a mixture thereof. 如請求項4所述之顯示設備，其中該無機材料係為碳膜、碳化矽、或氧化物系材料。 The display device according to claim 4, wherein the inorganic material is a carbon film, a tantalum carbide, or an oxide-based material. 如請求項4所述之顯示設備，其中該金屬材料係為鎢或碳化鎢。 The display device of claim 4, wherein the metal material is tungsten or tungsten carbide. 如請求項1所述之顯示設備，其中該保護層包括：一包括一有機材料之有機層；一金屬層，位於該有機層上；以及一無機層，位於該金屬層上。 The display device of claim 1, wherein the protective layer comprises: an organic layer comprising an organic material; a metal layer on the organic layer; and an inorganic layer on the metal layer. 如請求項1所述之顯示設備，其中該保護層係包括交替堆疊之至少一有機層、至少一金屬層及至少一無機層。 The display device of claim 1, wherein the protective layer comprises at least one organic layer, at least one metal layer and at least one inorganic layer alternately stacked. 如請求項1所述之顯示設備，其中該保護層係包括一有機層及位於該有機層上之一第一圖案，該第一圖案包括環烯烴共聚物(COC)、聚甲基丙烯酸甲酯(PMMA)、聚碳酸酯(PC)、環烯烴聚合物(COP)、液晶聚合物(LCP)、聚二甲基矽氧烷(PDMS)、聚醯胺(PA)、聚乙烯(PE)、 聚醯亞胺(PI)、聚丙烯(PP)、聚苯醚(PPE)、聚苯乙烯(PS)、聚甲醛(POM)、聚醚醚酮(PEEK)、聚對苯二甲酸乙二酯(PET)、聚四氟乙烯(PTFE)、聚氯乙烯(PVC)、聚偏二氟乙烯(PVDF)、聚對苯二甲酸丁二酯(PBT)、氟化乙烯丙烯(FEP)、四氟乙烯(PFA)、或其混合物。 The display device of claim 1, wherein the protective layer comprises an organic layer and a first pattern on the organic layer, the first pattern comprising a cyclic olefin copolymer (COC), polymethyl methacrylate (PMMA), polycarbonate (PC), cycloolefin polymer (COP), liquid crystal polymer (LCP), polydimethyl siloxane (PDMS), polyamine (PA), polyethylene (PE), Polyimine (PI), polypropylene (PP), polyphenylene ether (PPE), polystyrene (PS), polyoxymethylene (POM), polyetheretherketone (PEEK), polyethylene terephthalate (PET), polytetrafluoroethylene (PTFE), polyvinyl chloride (PVC), polyvinylidene fluoride (PVDF), polybutylene terephthalate (PBT), fluorinated ethylene propylene (FEP), PTFE Ethylene (PFA), or a mixture thereof. 如請求項10所述之顯示設備，其中該第一圖案具有一彈性係數，該彈性係數小於該有機層之一彈性係數。 The display device of claim 10, wherein the first pattern has a modulus of elasticity that is less than a coefficient of elasticity of the organic layer. 如請求項10所述之顯示設備，其中該第一圖案具有一梯形或三角形截面。 The display device of claim 10, wherein the first pattern has a trapezoidal or triangular cross section. 如請求項10所述之顯示設備，更包含位於該有機層上之一平坦化層，該平坦化層覆蓋該第一圖案。 The display device of claim 10, further comprising a planarization layer on the organic layer, the planarization layer covering the first pattern. 如請求項13所述之顯示設備，其中該平坦化層係包括一液相樹脂，該液相樹脂具有一彈性係數，該彈性係數小於該第一圖案之一彈性係數。 The display device of claim 13, wherein the planarization layer comprises a liquid phase resin having a modulus of elasticity that is less than a modulus of elasticity of the first pattern. 如請求項13所述之顯示設備，更包含位於該保護層上之一第二圖案，其中該第二圖案包括環烯烴共聚物(COC)、聚甲基丙烯酸甲酯(PMMA)、聚碳酸酯(PC)、環烯烴聚合物(COP)、液晶聚合物(LCP)、聚二甲基矽氧烷(PDMS)、聚醯胺(PA)、聚乙烯(PE)、聚醯亞胺(PI)、聚丙烯(PP)、聚苯醚(PPE)、聚苯乙烯(PS)、聚甲醛(POM)、聚醚醚酮(PEEK)、聚對苯二甲酸乙二酯(PET)、聚四氟乙烯(PTFE)、聚氯乙烯(PVC)、聚偏二氟乙烯(PVDF)、聚對苯二甲酸丁二酯(PBT)、 氟化乙烯丙烯(FEP)、四氟乙烯(PFA)、或其混合物。 The display device of claim 13, further comprising a second pattern on the protective layer, wherein the second pattern comprises a cyclic olefin copolymer (COC), polymethyl methacrylate (PMMA), polycarbonate (PC), cycloolefin polymer (COP), liquid crystal polymer (LCP), polydimethylsiloxane (PDMS), polyamine (PA), polyethylene (PE), polyimine (PI) , polypropylene (PP), polyphenylene ether (PPE), polystyrene (PS), polyoxymethylene (POM), polyetheretherketone (PEEK), polyethylene terephthalate (PET), polytetrafluoroethylene Ethylene (PTFE), polyvinyl chloride (PVC), polyvinylidene fluoride (PVDF), polybutylene terephthalate (PBT), Fluorinated ethylene propylene (FEP), tetrafluoroethylene (PFA), or a mixture thereof. 如請求項1所述之顯示設備，其中該顯示面板包括彼此間隔開之複數個有機發光顯示裝置(organic light-emitting display device；OLED)。 The display device of claim 1, wherein the display panel comprises a plurality of organic light-emitting display devices (OLEDs) spaced apart from each other. 一種製造一顯示裝置之方法，該方法包含：形成一顯示面板於一基板之一顯示區域上，以及形成一覆蓋該顯示面板之封裝層；以及形成一保護層，覆蓋該基板上一墊單元之一墊電極，其中該保護層具有約10百萬帕至200十億帕的彈性係數。 A method of manufacturing a display device, comprising: forming a display panel on a display area of a substrate; and forming an encapsulation layer covering the display panel; and forming a protective layer covering a pad unit on the substrate A pad electrode wherein the protective layer has a modulus of elasticity of from about 10 megapascals to about 2 billion kPa. 如請求項17所述之方法，其中形成該保護層係包括在該墊電極上使用一黏合劑。 The method of claim 17, wherein forming the protective layer comprises using an adhesive on the pad electrode. 如請求項17所述之方法，其中形成該保護層係包括在該墊電極上使用一液相樹脂。 The method of claim 17, wherein forming the protective layer comprises using a liquid phase resin on the pad electrode. 如請求項17所述之方法，其中該封裝層包括一有機材料、一無機材料、或一金屬材料。 The method of claim 17, wherein the encapsulating layer comprises an organic material, an inorganic material, or a metallic material.
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US10285278B2 (en) 2019-05-07
CN104464517A (en) 2015-03-25
US20150077953A1 (en) 2015-03-19
KR102079256B1 (en) 2020-02-20

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