TW201510464A - Control method for cooling film and heat-dissipating module using the same - Google Patents
Control method for cooling film and heat-dissipating module using the same Download PDFInfo
- Publication number
- TW201510464A TW201510464A TW102131902A TW102131902A TW201510464A TW 201510464 A TW201510464 A TW 201510464A TW 102131902 A TW102131902 A TW 102131902A TW 102131902 A TW102131902 A TW 102131902A TW 201510464 A TW201510464 A TW 201510464A
- Authority
- TW
- Taiwan
- Prior art keywords
- temperature
- duty cycle
- control method
- cold end
- heat dissipation
- Prior art date
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
- F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
- F25B2321/021—Control thereof
- F25B2321/0212—Control thereof of electric power, current or voltage
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2700/00—Sensing or detecting of parameters; Sensors therefor
- F25B2700/21—Temperatures
- F25B2700/2106—Temperatures of fresh outdoor air
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2700/00—Sensing or detecting of parameters; Sensors therefor
- F25B2700/21—Temperatures
- F25B2700/2107—Temperatures of a Peltier element
Abstract
Description
本案係關於一種控制方法，尤指一種致冷片之控制方法及其適用之散熱模組。
The present invention relates to a control method, and more particularly to a method for controlling a cooling sheet and a heat dissipation module to which the same is applied.
隨著科技的進步與人類對生活品質的要求，各式電子產品的開發在技術上係不斷地突破，藉此加強電子產品的功能以及處理速度，然而此也導致電子產品在運轉時所產生的熱能增加，因此為了維持電子產品的正常運作及延長電子產品的使用壽命等，如何排除熱能便成為電子產品所需考量的關鍵技術之一。With the advancement of technology and human requirements for quality of life, the development of various electronic products has been continuously broken through technology, thereby enhancing the functions and processing speed of electronic products. However, this also leads to the production of electronic products during operation. The increase in heat energy, in order to maintain the normal operation of electronic products and extend the service life of electronic products, how to eliminate thermal energy has become one of the key technologies for electronic products.
對於高瓦數的電子產品，例如投影機、個人電腦等，對於內部所具有的光學元件或電子元件等的散熱方式往往係使用具有熱管之散熱鰭片(Heatsink with heat-pipes)或液態冷卻(Liquid cooling)的方式解熱，但兩者的散熱效率均有其限制，因此對於瓦數高而耐溫規格低的元件而言，上述之散熱方式並無法有效地使元件降溫，以符合耐溫規格的目標。是以目前部分的電子產品係朝向使用散熱效率及可靠性皆較佳之致冷片來進行散熱。For high-wattage electronic products, such as projectors, personal computers, etc., the heat dissipation methods for internal optical components or electronic components, etc., often use heat sinks with heat-pipes or liquid cooling ( The method of liquid cooling is to dispel heat, but the heat dissipation efficiency of both is limited. Therefore, for components with high wattage and low temperature resistance, the above heat dissipation method cannot effectively cool the components to meet the temperature resistance specifications. The goal. Therefore, some of the current electronic products are cooled toward the use of a cooling fin having better heat dissipation efficiency and reliability.
致冷片為一PN半導體元件，其在電流通過時，分別會形成一冷端以及一熱端，以藉由冷端以及熱端之間所產生的溫度差來帶走熱能，其中冷端係設置於需進行散熱之元件處，以對元件進行冷卻，熱端則相對於冷端而產生熱能。然而，在實際應用上，當致冷片之冷端對電子產品之內部元件進行冷卻時，致冷片之冷端可能產生低於週遭環境溫度之表面溫度，導致致冷片之冷端及電子產品之內部元件上有結露的情況，進而產生水氣，如此一來，對於電子產品的信賴性及使用壽命將會有很大的影響。The cooling fin is a PN semiconductor component, and when the current passes, a cold end and a hot end are respectively formed to take away the thermal energy by the temperature difference generated between the cold end and the hot end, wherein the cold end is It is placed at the component where heat is required to cool the component, and the hot end generates heat relative to the cold end. However, in practical applications, when the cold end of the cooling fin cools the internal components of the electronic product, the cold end of the cooling fin may generate a surface temperature lower than the ambient temperature, resulting in the cold end and the electron of the cooling fin. There is condensation on the internal components of the product, which in turn produces moisture, which will have a great impact on the reliability and service life of electronic products.
因此，如何發展一種可改善上述習知技術缺失之致冷片之控制方法及其適用之散熱模組，實為相關技術領域者目前所迫切需要解決之問題。
Therefore, how to develop a control method for a refrigerant chip which can improve the above-mentioned conventional technology and a heat dissipation module thereof are urgently needed to be solved by those skilled in the related art.
本案之目的在於提供一種致冷片之控制方法及其適用之散熱模組，其中控制方法藉由判斷致冷片之冷端的溫度是否大於等於環境溫度，以增加或減少對應於致冷片所接收之電能大小之責任週期，俾解決習知致冷片之冷端對電子產品之內部元件進行冷卻時，冷端可能產生低於週遭環境溫度之表面溫度，導致致冷片之冷端及電子產品之內部元件上有結露的情況而產生水氣，進而影響電子產品的信賴性及使用壽命之缺失。The purpose of the present invention is to provide a method for controlling a cooling sheet and a heat dissipation module thereof, wherein the control method increases or decreases the reception corresponding to the cooling sheet by determining whether the temperature of the cold end of the cooling sheet is greater than or equal to the ambient temperature. The duty cycle of the power level, when the cold end of the conventional cooling fin is cooled to the internal components of the electronic product, the cold end may generate a surface temperature lower than the ambient temperature, resulting in the cold end of the cooling piece and the electronic product. There is condensation on the internal components to generate moisture, which affects the reliability of the electronic product and the lack of service life.
為達上述目的，本案之一較廣義實施態樣為提供一種控制方法，用以控制致冷片之運作，其中致冷片具有冷端及熱端，控制方法係包含下列步驟：(a)於致冷片開始運作時，取得冷端的溫度及致冷片所在之環境溫度；(b)判斷環境溫度是否大於等於溫度設定值；(c)依據步驟(b)之判斷結果設定對應於致冷片所接收之電能大小之責任週期之初始值；(d)判斷致冷片之冷端的溫度是否大於等於環境溫度；(e)當步驟(d)之判斷的結果為是時，將責任週期增加預設比例值，並再次執行步驟(d)；以及(f)當步驟(d)之判斷的結果為否時，依據責任週期是否大於0%而對應地將責任週期減少預設比例值，並再次執行步驟(d)。In order to achieve the above object, a broader aspect of the present invention provides a control method for controlling the operation of a refrigerating sheet, wherein the refrigerating sheet has a cold end and a hot end, and the control method comprises the following steps: (a) When the cooling film starts to operate, the temperature of the cold end and the ambient temperature of the cooling piece are obtained; (b) determining whether the ambient temperature is greater than or equal to the temperature setting value; (c) setting the corresponding cooling film according to the judgment result of the step (b); The initial value of the duty cycle of the received power level; (d) determining whether the temperature of the cold end of the cooling fin is greater than or equal to the ambient temperature; (e) when the result of the judgment of step (d) is YES, increasing the duty cycle Set the proportional value and perform step (d) again; and (f) when the result of the judgment of step (d) is no, correspondingly reduce the duty cycle by a preset ratio value according to whether the duty cycle is greater than 0%, and again Perform step (d).
為達上述目的，本案之另一較廣義實施態樣為提供一種散熱模組，其係包含：致冷片，係包含冷端以及熱端；電源供應電路，係與致冷片電連接，並以責任週期運作，以提供相對應之電能至致冷片而驅動致冷片作動；第一溫度偵測器，係與致冷片之冷端相鄰設，用以偵測冷端之溫度；第二溫度偵測器，用以偵測致冷片所在之環境溫度；以及控制器，係與第一溫度偵測器、第二溫度偵測器及電源供應電路電連接，用以依據第一溫度偵測器以及第溫度二偵測器之偵測結果，判斷致冷片之冷端的溫度是否大於等於環境溫度，並依據判斷結果調整電源供應電路之責任週期，以對應調整電源供應電路所輸出之電能大小。
In order to achieve the above object, another broad aspect of the present invention provides a heat dissipation module comprising: a cooling sheet comprising a cold end and a hot end; and a power supply circuit electrically connected to the cooling sheet, and Operating in a duty cycle to provide corresponding electrical energy to the cooling plate to drive the cooling plate to operate; the first temperature detector is disposed adjacent to the cold end of the cooling plate for detecting the temperature of the cold end; a second temperature detector for detecting an ambient temperature of the cooling piece; and a controller electrically connected to the first temperature detector, the second temperature detector, and the power supply circuit for The temperature detector and the detection result of the second temperature detector determine whether the temperature of the cold end of the cooling piece is greater than or equal to the ambient temperature, and adjust the duty cycle of the power supply circuit according to the judgment result, so as to adjust the output of the power supply circuit correspondingly The size of the power.
1‧‧‧散熱模組
10‧‧‧第一溫度偵測器
11‧‧‧第二溫度偵測器
13‧‧‧控制器
14‧‧‧致冷片
15‧‧‧散熱鰭片
16‧‧‧第三溫度偵測器
9‧‧‧電子元件
S1~S8‧‧‧控制器控制致冷片之控制方法的流程步驟
S40~S41‧‧‧子步驟
1‧‧‧ Thermal Module
10‧‧‧First temperature detector
11‧‧‧Second temperature detector
13‧‧‧ Controller
14‧‧‧Cold film
15‧‧‧ Heat sink fins
16‧‧‧ Third temperature detector
9‧‧‧Electronic components
S1~S8‧‧‧ Process steps for controlling the control method of the cooling plate
S40~S41‧‧‧ substeps
第1圖係為本案較佳實施例之散熱模組之電路方塊示意圖。Figure 1 is a block diagram showing the circuit of the heat dissipation module of the preferred embodiment of the present invention.
第2圖係為第1圖所示之散熱模組之部分結構示意圖。Figure 2 is a partial structural view of the heat dissipation module shown in Figure 1.
第3圖係為第1圖所示之控制器控制致冷片之控制方法的流程步驟。Fig. 3 is a flow chart showing the control method of the controller-controlled cooling fin shown in Fig. 1.
第4圖係為本案另一較佳實施例之控制器控制致冷片之控制方法的流程步驟。
Figure 4 is a flow chart showing the control method of the controller for controlling the cooling fin of another preferred embodiment of the present invention.
體現本案特徵與優點的一些典型實施例將在後段的說明中詳細敘述。應理解的是本案能夠在不同的態樣上具有各種的變化，其皆不脫離本案的範圍，且其中的說明及圖示在本質上係當作說明之用，而非架構於限制本案。Some exemplary embodiments embodying the features and advantages of the present invention are described in detail in the following description. It is to be understood that the present invention is capable of various modifications in various aspects, and is not to be construed as a limitation.
請參閱第1圖，其係為本案較佳實施例之散熱模組之電路方塊示意圖。如第1圖所示，本實施例之散熱模組1係包含一第一溫度偵測器10、一第二溫度偵測器11、一電源供應電路12、一控制器13以及一致冷片14。其中電源供應電路12係與致冷片14電連接，其係以一責任週期運作，以提供相對應之電能給致冷片14，俾驅動致冷片14運作。致冷片14可由一PN半導體元件所構成，且具有一冷端140以及一熱端141(如第2圖所示)，冷端140及熱端141係位於致冷片14相對兩側，當致冷片14接收由電源供應電路12所提供之電能而開始運作時，冷端140係產生致冷效果，熱端141則相對冷端140而產生熱能。第一溫度偵測器10用以偵測致冷片14之冷端140的溫度。第二溫度偵測器11用以偵測致冷片14所在之環境溫度，亦即為散熱模組1所在之環境溫度。Please refer to FIG. 1 , which is a circuit block diagram of a heat dissipation module according to a preferred embodiment of the present invention. As shown in FIG. 1 , the heat dissipation module 1 of the present embodiment includes a first temperature detector 10 , a second temperature detector 11 , a power supply circuit 12 , a controller 13 , and a uniform cold plate 14 . . The power supply circuit 12 is electrically connected to the cooling fins 14, and operates in a duty cycle to provide corresponding electrical energy to the cooling fins 14, and the crucible driving fins 14 operate. The cooling fin 14 can be composed of a PN semiconductor component and has a cold end 140 and a hot end 141 (as shown in FIG. 2), and the cold end 140 and the hot end 141 are located on opposite sides of the refrigerating sheet 14, when When the cooling fin 14 receives the electric energy supplied from the power supply circuit 12 to start operation, the cold end 140 generates a cooling effect, and the hot end 141 generates thermal energy with respect to the cold end 140. The first temperature detector 10 is configured to detect the temperature of the cold end 140 of the fins 14. The second temperature detector 11 is configured to detect the ambient temperature of the cooling fins 14 , that is, the ambient temperature of the heat dissipation module 1 .
控制器13係與第一溫度偵測器10、第二溫度偵測器11以及電源供應電路12電連接，控制器13係依據第一溫度偵測器10以及第二溫度偵測器11之偵測結果，判斷致冷片14之冷端140的溫度是否大於等於環境溫度，並根據判斷結果控制電源供應電路12之一責任週期，以調整由電源供應電路12所輸出且與該責任週期有相對應關係之電能大小。
請參閱第2圖，並配合第1圖，其中第2圖係為第1圖所示之散熱模組之部分結構示意圖。如第1及2圖所示，致冷片14之冷端140實際上係與一電子元件9相鄰設，因此當致冷片14運作時，致冷片14之冷端140可對電子元件9進行冷卻。此外，第一溫度偵測器10可與致冷片14之冷端140相鄰設，當然，第一溫度偵測器10更可直接設置於冷端140上，以準確地獲得冷端140之溫度。The controller 13 is electrically connected to the first temperature detector 10, the second temperature detector 11, and the power supply circuit 12. The controller 13 is based on the detection of the first temperature detector 10 and the second temperature detector 11. As a result of the measurement, it is determined whether the temperature of the cold end 140 of the cooling fin 14 is greater than or equal to the ambient temperature, and a duty cycle of the power supply circuit 12 is controlled according to the judgment result to adjust the output by the power supply circuit 12 and is related to the duty cycle. The power of the corresponding relationship.
Please refer to FIG. 2 and cooperate with FIG. 1 , wherein FIG. 2 is a partial structural diagram of the heat dissipation module shown in FIG. 1 . As shown in Figures 1 and 2, the cold end 140 of the fin 14 is actually disposed adjacent to an electronic component 9, so that when the fin 14 is in operation, the cold end 140 of the fin 14 can be placed on the electronic component. 9 to cool. In addition, the first temperature detector 10 can be disposed adjacent to the cold end 140 of the refrigerating sheet 14. Of course, the first temperature detector 10 can be directly disposed on the cold end 140 to accurately obtain the cold end 140. temperature.
於其它實施例中，散熱模組1更具有一散熱鰭片15，例如第2圖所示，散熱鰭片15係設置於致冷片14之熱端141上，用以導出於熱端141上之熱能。此外，又於一些實施例中，第1圖所示之散熱模組1更具有一第三溫度偵測器16，係與致冷片14之熱端141相鄰設，例如設置於熱端141上，且與控制器13電連接，第三溫度偵測器16係用以偵測熱端141之溫度，使控制器13可於熱端141之溫度超過一保護溫度值時，控制電源供應電路12停止輸出電能至致冷片14，以保護散熱模組1，其中該保護溫度值係可依實際需求，例如散熱模組所能承受之耐熱溫度等，來預先設定。In other embodiments, the heat dissipation module 1 further has a heat dissipation fin 15 . For example, as shown in FIG. 2 , the heat dissipation fin 15 is disposed on the hot end 141 of the cooling fin 14 for being led out on the hot end 141 . The heat. In addition, in some embodiments, the heat dissipation module 1 shown in FIG. 1 further has a third temperature detector 16 disposed adjacent to the hot end 141 of the cooling fin 14 , for example, disposed at the hot end 141 . And electrically connected to the controller 13, the third temperature detector 16 is configured to detect the temperature of the hot end 141, so that the controller 13 can control the power supply circuit when the temperature of the hot end 141 exceeds a protection temperature value. 12 Stopping the output of the electric energy to the cooling fins 14 to protect the heat dissipating module 1 , wherein the protection temperature value can be preset according to actual needs, such as the heat resistant temperature that the heat dissipating module can withstand.
以下將進一步說明第1圖所示之控制器13控制致冷片14之控制方法的流程步驟，請參閱第3圖，並配合第1及2圖，其中第3圖係為第1圖所示之控制器控制致冷片之控制方法的流程步驟。如第3圖所示，首先，執行步驟S1，散熱模組1開始運作，亦即致冷片14開始運作。接著，執行步驟S2，即於致冷片14開始運作時，取得致冷片14之冷端140的溫度及致冷片14所在之環境溫度，其中致冷片14之冷端140的溫度係由第一溫度偵測器10所偵測，致冷片14所在之環境溫度則由第二溫度偵測器11所偵測。接著，執行步驟S3，控制器13依據第一溫度偵測器10以及第二溫度偵測器11的偵測結果判斷判斷環境溫度是否大於等於一溫度設定值，其中於步驟S3中，溫度設定值可為但不限於30℃。The flow chart of the control method for controlling the cooling fins 14 by the controller 13 shown in FIG. 1 will be further described below. Please refer to FIG. 3 and cooperate with the first and second figures, wherein the third figure is shown in FIG. The controller controls the flow steps of the control method of the cooling fin. As shown in FIG. 3, first, in step S1, the heat dissipation module 1 starts to operate, that is, the cooling fins 14 start to operate. Then, step S2 is performed, that is, when the cooling sheet 14 starts to operate, the temperature of the cold end 140 of the cooling fin 14 and the ambient temperature of the cooling fin 14 are obtained, wherein the temperature of the cold end 140 of the cooling fin 14 is determined by The ambient temperature of the cooling fin 14 is detected by the first temperature detector 10 and detected by the second temperature detector 11. Then, in step S3, the controller 13 determines whether the ambient temperature is greater than or equal to a temperature setting value according to the detection result of the first temperature detector 10 and the second temperature detector 11, wherein the temperature setting value is in step S3. It can be, but is not limited to, 30 °C.
接著，執行步驟S4，即依據步驟S3之判斷結果設定對應於致冷片14所接收之電能大小之電源供應電路12之責任週期的初始值，其中於此步驟中，係包含兩個子步驟S40及S41，以依據步驟S3之判斷結果來決定執行子步驟S40或是子步驟S41，更進一步說明，當步驟S3中之判斷結果為是，即環境溫度係大於等於30℃時，執行子步驟S40，控制器13係設定電源供應電路12之責任週期之初始值為50%，並執行步驟S5，而在子步驟S40中，因應目前環境溫度係相對較高，故控制器13設定電源供應電路12之責任週期之初始值為50%，使電源供應電路12在運作初期即輸出相對較大的電能至致冷片14，以加強致冷片14之冷端140之致冷效率，使致冷片14之冷端140於開始運作後，即可因應環境溫度較高而快速地提供較高的致冷效率來對電子元件9進行冷卻。Next, step S4 is performed, that is, the initial value of the duty cycle of the power supply circuit 12 corresponding to the amount of power received by the cooling fin 14 is set according to the determination result of step S3, wherein in this step, the two sub-steps S40 are included. And S41, the sub-step S40 or the sub-step S41 is determined according to the determination result of the step S3, and further, when the determination result in the step S3 is YES, that is, the ambient temperature system is greater than or equal to 30 ° C, the sub-step S40 is performed. The controller 13 sets the initial value of the duty cycle of the power supply circuit 12 to 50%, and performs step S5. In the sub-step S40, the controller 13 sets the power supply circuit 12 in response to the current ambient temperature being relatively high. The initial value of the duty cycle is 50%, so that the power supply circuit 12 outputs relatively large amount of electric energy to the cooling fins 14 at the initial stage of operation to enhance the cooling efficiency of the cold end 140 of the refrigerating sheet 14, so that the cooling fins After the cold end 140 of the first operation, the electronic component 9 can be cooled by rapidly providing a higher cooling efficiency in response to a higher ambient temperature.
反之，當步驟S3中之判斷結果為否時，則執行子步驟S41，即控制器13係設定電源供應電路12之責任週期的初始值為0%，並執行步驟S5，而在子步驟S41中，由於目前環境溫度係相對較低，使得致冷片14之冷端140無須於開始運作後，立即提供較高的致冷效率來對電子元件9進行冷卻，因此控制器13係設定電源供應電路12之責任週期之初始值為0%。On the other hand, when the determination result in the step S3 is NO, the sub-step S41 is executed, that is, the controller 13 sets the initial value of the duty cycle of the power supply circuit 12 to 0%, and executes step S5, and in the sub-step S41. Since the current ambient temperature is relatively low, the cold end 140 of the cooling fin 14 does not need to provide a higher cooling efficiency to cool the electronic component 9 immediately after starting the operation, so the controller 13 sets the power supply circuit. The initial duty cycle of 12 is 0%.
當執行完步驟S4後，即進入步驟S5，控制器13係判斷致冷片14之冷端140的溫度是否大於等於環境溫度。當步驟S5判斷的結果為是時，則執行步驟S6，即控制器13將電源供應電路12之責任週期增加一預設比例值，例如1%，並再次執行步驟S5。由上可知，當致冷片14之冷端140的溫度大於等於環境溫度時，表示致冷片14之冷端140並不會發生結露情況，故可再增加電源供應電路12之責任週期，使電源供應電路12提高輸出電能，如此一來，可使冷端140之溫度下降而提高致冷效果，是以提高對電子元件9之散熱效果。When step S4 is performed, the process proceeds to step S5, and the controller 13 determines whether the temperature of the cold end 140 of the fin 14 is greater than or equal to the ambient temperature. When the result of the determination in the step S5 is YES, the step S6 is executed, that is, the controller 13 increases the duty cycle of the power supply circuit 12 by a predetermined proportional value, for example, 1%, and executes step S5 again. It can be seen from the above that when the temperature of the cold end 140 of the cooling fin 14 is greater than or equal to the ambient temperature, it indicates that the cold end 140 of the fin 14 does not dew condensation, so the duty cycle of the power supply circuit 12 can be further increased. The power supply circuit 12 increases the output power, so that the temperature of the cold end 140 can be lowered to improve the cooling effect, so that the heat dissipation effect on the electronic component 9 is improved.
反之，當步驟S5判斷的結果為否時，則執行步驟S7，即控制器13判斷電源供應電路12之責任週期是否為大於0%。當步驟S7判斷的結果為是時，則再次執行步驟S5。反之，當步驟S7判斷的結果為否時，則執行步驟S8，即控制器13將電源供應電路12之責任週期減少一預設比例值，例如1%，並再次執行步驟S5，而於步驟S8中，由於此時控制器13判斷出致冷片14之冷端140的溫度小於環境溫度，亦即致冷片14之冷端140將發生結露的情況而產生水氣，因此控制器13係減少電源供應電路12之責任週期，使電源供應電路12降低輸出電能，如此一來，可使冷端140之溫度升高，以避免致冷片14之冷端140發生結露的情況而產生水氣。On the other hand, when the result of the determination in the step S5 is NO, the step S7 is executed, that is, the controller 13 judges whether or not the duty cycle of the power supply circuit 12 is greater than 0%. When the result of the determination in step S7 is YES, step S5 is executed again. On the other hand, when the result of the determination in step S7 is NO, step S8 is executed, that is, the controller 13 reduces the duty cycle of the power supply circuit 12 by a preset ratio value, for example, 1%, and performs step S5 again, and in step S8. In this case, since the controller 13 determines that the temperature of the cold end 140 of the fin 14 is lower than the ambient temperature, that is, the cold end 140 of the fin 14 will dew condensation to generate moisture, the controller 13 is reduced. The duty cycle of the power supply circuit 12 causes the power supply circuit 12 to reduce the output power, so that the temperature of the cold terminal 140 can be raised to avoid condensation of the cold end 140 of the fin 14 to generate moisture.
請參閱第4圖，其係為本案另一較佳實施例之控制器控制致冷片之控制方法的流程步驟。如第4圖所示，本實施例之控制方法的流程步驟係與第3圖所示之控制方法的流程步驟相似，故僅以相同標號標示而不再贅述。惟相較於第3圖之步驟S4之子步驟S40，本實施例之步驟S4之子步驟S40’係改為控制器13係設定電源供應電路12之責任週期的初始值係經過一延遲時間後達到50%，如此一來，可避免在環境溫度大於等於溫度設定值時，控制器13立即將電源供應電路12之責任週期設定為50%，使電源供應電路12立即提供相對較大的電能給致冷片14，導致致冷片14之冷端140可能於致冷片14接收電能時立刻低於環境溫度而產生結露的情況。Please refer to FIG. 4, which is a flow chart of a controller control method for controlling a cooling sheet according to another preferred embodiment of the present invention. As shown in FIG. 4, the flow steps of the control method of the present embodiment are similar to those of the control method shown in FIG. 3, and therefore are only designated by the same reference numerals and will not be described again. In the sub-step S40 of the step S4 of the third embodiment, the sub-step S40 of the step S4 of the embodiment is changed to the controller 13 to set the initial value of the duty cycle of the power supply circuit 12 to reach 50 after a delay time. %, in this way, when the ambient temperature is greater than or equal to the temperature set value, the controller 13 immediately sets the duty cycle of the power supply circuit 12 to 50%, so that the power supply circuit 12 immediately provides relatively large electric energy to the refrigeration. The sheet 14 causes the cold end 140 of the fin 14 to cause dew condensation immediately below the ambient temperature when the fin 14 receives electrical energy.
綜上所述，本案提供一種致冷片之控制方法及其適用之散熱模組，其中控制方法藉由判斷致冷片之冷端的溫度是否大於等於環境溫度，以增加或減少對應於致冷片所接收之電能大小之責任週期，如此一來，可於致冷片之冷端的溫度大於等於環境溫度時，增加對應於致冷片所接收之電能大小之責任週期而提高致冷片之冷端的致冷效率，反之，可於致冷片之冷端的溫度小於環境溫度時，減少對應於致冷片所接收之電能大小之責任週期，以避免致冷片之冷端產生結露的情況，如此一來，當本案之散熱模組應用於電子產品中而對內部電子元件進行散熱時，便可避免電子元件受到水氣的影響而損壞，是以可提升電子產品之穩定性及使用壽命。In summary, the present invention provides a method for controlling a cooling sheet and a heat dissipation module thereof, wherein the control method increases or decreases the corresponding cooling sheet by determining whether the temperature of the cold end of the cooling sheet is greater than or equal to the ambient temperature. The duty cycle of the received power amount, so that when the temperature of the cold end of the cooling fin is greater than or equal to the ambient temperature, the duty cycle corresponding to the amount of power received by the cooling fin is increased to increase the cold end of the cooling fin. Cooling efficiency, on the contrary, when the temperature of the cold end of the cooling fin is lower than the ambient temperature, the duty cycle corresponding to the amount of electric energy received by the cooling fin is reduced to avoid condensation on the cold end of the cooling fin, such that When the heat dissipation module of the present invention is applied to an electronic product and heats the internal electronic components, the electronic components can be prevented from being damaged by the influence of moisture, so that the stability and the service life of the electronic product can be improved.
本案得由熟習此技術之人士任施匠思而為諸般修飾，然皆不脫如附申請專利範圍所欲保護者。
This case has been modified by people who are familiar with the technology, but it is not intended to be protected by the scope of the patent application.
S1~S8‧‧‧控制器控制致冷片之控制方法的流程步驟 S1~S8‧‧‧ Process steps for controlling the control method of the cooling plate
S40~S41‧‧‧子步驟 S40~S41‧‧‧ substeps
Claims (1)
一種控制方法，用以控制一致冷片之運作，其中該致冷片係具有一冷端及一熱端，該控制方法係包含下列步驟：
(a)於該致冷片開始運作時，取得該冷端的溫度及該致冷片所在之一環境溫度；
(b)判斷該環境溫度是否大於等於一溫度設定值；
(c)依據步驟(b)之判斷結果設定對應於該致冷片所接收之電能大小之一責任週期之初始值；
(d)判斷該致冷片之該冷端的溫度是否大於等於該環境溫度；
(e)當步驟(d)之判斷的結果為是時，將該責任週期增加一預設比例值，並再次執行步驟(d)；以及
(f)當步驟(d)之判斷的結果為否時，依據該責任週期是否大於0%而對應地將該責任週期減少該預設比例值，並再次執行步驟(d)。
2. 如申請專利範圍第1項所述之控制方法，其中於步驟(c)中，當判斷結果為是時，係設定該責任週期之初始值為50%
3. 如申請專利範圍第1項所述之控制方法，其中於步驟(c)中，當判斷結果為是時，係設定該責任週期之初始值經過一延遲時間後達到50%。
4. 如申請專利範圍第1項所述之控制方法，其中於步驟(c)中，當判斷結果為否時，係設定該責任週期之初始值為0%。
5. 如申請專利範圍第1項所述之控制方法，其中於步驟(b)中，該溫度設定值係為30℃。
6. 如申請專利範圍第1項所述之控制方法，其中於步驟(f)中，當該責任週期大於0%時，係將該責任週期減少該預設比例值。
7. 如申請專利範圍第1項所述之控制方法，其中於步驟(f)中，當該責任週期等於0%時，係直接執行步驟(d)。
8. 一種散熱模組，其係包含：
一致冷片，係包含一冷端以及一熱端；
一電源供應電路，係與該致冷片電連接，並以一責任週期運作，以提供相對應之電能至該致冷片而驅動該致冷片作動；
一第一溫度偵測器，係與該致冷片之該冷端相鄰設，用以偵測該冷端之溫度；
一第二溫度偵測器，用以偵測該致冷片所在之一環境溫度；以及
一控制器，係與該第一溫度偵測器、該第二溫度偵測器及該電源供應電路電連接，用以依據該第一溫度偵測器以及該第溫度二偵測器之偵測結果，判斷該致冷片之該冷端的溫度是否大於等於該環境溫度，並依據判斷結果調整該電源供應電路之該責任週期，以對應調整該電源供應電路所輸出之電能大小。
9. 如申請專利範圍的8項所述之散熱模組，其中該控制器係具有一控制方法，係包含下列步驟：
(a)於該致冷片開始運作時，取得該冷端的溫度及該致冷片所在之一環境溫度；
(b)判斷該環境溫度是否大於等於一溫度設定值；
(c)依據步驟(b)之判斷結果設定對應於該致冷片所接收之電能大小之一責任週期之初始值；
(d)判斷該致冷片之該冷端的溫度是否大於等於該環境溫度；
(e)當步驟(d)之判斷的結果為是時，將該責任週期增加一預設比例值，並再次執行步驟(d)；以及
(e)當步驟(d)之判斷的結果為否時，依據該責任週期是否大於0%而將該責任週期減少該預設比例值，並再次執行步驟(d)。
10. 如申請專利範圍第8項所述之散熱模組，其中該第一溫度偵測器係設至於該冷端上。
11. 如申請專利範圍第8項所述之散熱模組，其中該散熱模組更具有一散熱鰭片，係設置於該致冷片之該熱端上，用以導出該熱端上之熱能。
12. 如申請專利範圍第8項所述之散熱模組，其中該散熱模組更具有一第三溫度偵測器，係鄰設於該致冷片之該熱端上，且與該控制器相連接，用以偵測該熱端上之溫度，使該控制器於該熱端超過一保護溫度值時，控制該電源供應電路停止供電至該致冷片。
A control method for controlling the operation of a uniform cold chip, wherein the cooling film has a cold end and a hot end, and the control method comprises the following steps:
(a) at the beginning of operation of the chiller, obtaining the temperature of the cold end and an ambient temperature at which the chiller is located;
(b) determining whether the ambient temperature is greater than or equal to a temperature set value;
(c) setting an initial value of a duty cycle corresponding to the amount of power received by the chiller according to the judgment result of the step (b);
(d) determining whether the temperature of the cold end of the cooling fin is greater than or equal to the ambient temperature;
(e) when the result of the judgment of the step (d) is YES, the duty cycle is increased by a predetermined ratio value, and the step (d) is performed again;
(f) When the result of the judgment of the step (d) is NO, the duty cycle is correspondingly reduced by the preset ratio value according to whether the duty cycle is greater than 0%, and the step (d) is performed again.
2. The control method according to claim 1, wherein in the step (c), when the judgment result is YES, the initial value of the responsibility period is set to 50%.
3. The control method according to claim 1, wherein in the step (c), when the determination result is YES, the initial value of the responsibility period is set to reach 50% after a delay time.
4. The control method according to claim 1, wherein in the step (c), when the determination result is no, the initial value of the responsibility period is set to 0%.
5. The control method according to claim 1, wherein in the step (b), the temperature setting is 30 °C.
6. The control method according to claim 1, wherein in the step (f), when the duty cycle is greater than 0%, the duty cycle is decreased by the preset ratio value.
7. The control method according to claim 1, wherein in the step (f), when the duty cycle is equal to 0%, the step (d) is directly performed.
8. A heat dissipation module comprising:
Consistent cold film, comprising a cold end and a hot end;
a power supply circuit electrically connected to the refrigerating sheet and operating in a duty cycle to provide corresponding electrical energy to the refrigerating sheet to drive the refrigerating sheet to act;
a first temperature detector is disposed adjacent to the cold end of the refrigerating sheet for detecting a temperature of the cold end;
a second temperature detector for detecting an ambient temperature of the refrigerant sheet;
a controller is electrically connected to the first temperature detector, the second temperature detector and the power supply circuit for detecting the first temperature detector and the second temperature detector As a result, it is determined whether the temperature of the cold end of the cooling piece is greater than or equal to the ambient temperature, and the duty cycle of the power supply circuit is adjusted according to the determination result to correspondingly adjust the power output by the power supply circuit.
9. The heat dissipation module of claim 8, wherein the controller has a control method comprising the following steps:
(a) at the beginning of operation of the chiller, obtaining the temperature of the cold end and an ambient temperature at which the chiller is located;
(b) determining whether the ambient temperature is greater than or equal to a temperature set value;
(c) setting an initial value of a duty cycle corresponding to the amount of power received by the chiller according to the judgment result of the step (b);
(d) determining whether the temperature of the cold end of the cooling fin is greater than or equal to the ambient temperature;
(e) when the result of the judgment of the step (d) is YES, the duty cycle is increased by a predetermined ratio value, and the step (d) is performed again;
(e) When the result of the judgment of the step (d) is NO, the duty cycle is decreased by the preset ratio value according to whether the duty cycle is greater than 0%, and the step (d) is performed again.
10. The heat dissipation module of claim 8, wherein the first temperature detector is attached to the cold end.
11. The heat dissipation module of claim 8, wherein the heat dissipation module further has a heat dissipation fin disposed on the hot end of the refrigerant sheet for deriving heat energy on the hot end .
12. The heat dissipation module of claim 8, wherein the heat dissipation module further has a third temperature detector disposed adjacent to the hot end of the cooling plate and coupled to the controller Connected to detect the temperature on the hot end, so that the controller controls the power supply circuit to stop supplying power to the refrigerating sheet when the hot end exceeds a protection temperature value.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW102131902A TWI534405B (en) | 2013-09-04 | 2013-09-04 | Control method for cooling film and heat-dissipating module using the same |
| US14/149,440 US20150059358A1 (en) | 2013-09-04 | 2014-01-07 | Controlling method for thermoelectric cooling device and heat-dissipating module employing same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW102131902A TWI534405B (en) | 2013-09-04 | 2013-09-04 | Control method for cooling film and heat-dissipating module using the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201510464A true TW201510464A (en) | 2015-03-16 |
| TWI534405B TWI534405B (en) | 2016-05-21 |
Family
ID=52581241
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW102131902A TWI534405B (en) | 2013-09-04 | 2013-09-04 | Control method for cooling film and heat-dissipating module using the same |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US20150059358A1 (en) |
| TW (1) | TWI534405B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI697272B (en) * | 2019-05-06 | 2020-06-21 | 宏達國際電子股份有限公司 | Heat dissipation module and electronic device |
| US10785893B1 (en) | 2019-05-06 | 2020-09-22 | Htc Corporation | Heat dissipation module and electronic device |
| CN114061207A (en) * | 2020-08-04 | 2022-02-18 | 合肥华凌股份有限公司 | Refrigerator, control method of refrigerator, and computer-readable storage medium |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9686891B2 (en) | 2015-07-06 | 2017-06-20 | International Business Machines Corporation | Thermoelectric-enhanced, inlet air cooling for an electronics rack |
| US9504189B1 (en) * | 2015-08-12 | 2016-11-22 | International Business Machines Corporation | Thermoelectric-enhanced, inlet air-cooled thermal conductors |
| US9949412B2 (en) | 2015-08-12 | 2018-04-17 | International Business Machines Corporation | Thermoelectric-enhanced, inlet air-cooled thermal conductors |
| US10845375B2 (en) * | 2016-02-19 | 2020-11-24 | Agjunction Llc | Thermal stabilization of inertial measurement units |
| FR3062899B1 (en) * | 2017-02-10 | 2019-06-07 | Noxant | DEVICE AND METHOD FOR CONTROLLING THE TEMPERATURE OF A STIRLING ENGINE ADAPTED TO AN INFRARED QUANTUM SENSOR |
| CN112066592B (en) * | 2020-08-25 | 2022-01-25 | 武汉理工大学 | Transient refrigeration method of ultrathin thermoelectric film applied to chip |
| US11765862B2 (en) * | 2020-09-29 | 2023-09-19 | Baidu Usa Llc | Thermal management system for electronic components with thermoelectric element |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5444984A (en) * | 1994-05-10 | 1995-08-29 | Carson; Steven D. | Storage cabinet with active dehumidifier |
| US5862669A (en) * | 1996-02-15 | 1999-01-26 | Springwell Dispensers, Inc. | Thermoelectric water chiller |
| US6161388A (en) * | 1998-12-28 | 2000-12-19 | International Business Machines Corporation | Enhanced duty cycle design for micro thermoelectromechanical coolers |
| US20050193742A1 (en) * | 2004-02-10 | 2005-09-08 | Its Kool, Llc | Personal heat control devicee and method |
| US7290395B2 (en) * | 2005-10-06 | 2007-11-06 | Gentcorp Ltd | High power thermoelectric controller |
| US20080168775A1 (en) * | 2007-01-11 | 2008-07-17 | Nextreme Thermal Solutions, Inc. | Temperature Control Including Integrated Thermoelectric Temperature Sensing and Related Methods and Systems |
| US7971440B2 (en) * | 2008-05-02 | 2011-07-05 | Cisco Technology, Inc. | Thermal pump module and temperature regulation |
| US20100281884A1 (en) * | 2009-01-22 | 2010-11-11 | John Myron Rawski | Thermoelectric Management Unit |
| US20110111838A1 (en) * | 2009-11-12 | 2011-05-12 | Wms Gaming Inc. | Thermal Management Systems For Wagering Game Terminals |
| US8397518B1 (en) * | 2012-02-20 | 2013-03-19 | Dhama Innovations PVT. Ltd. | Apparel with integral heating and cooling device |
| US20140030560A1 (en) * | 2012-07-25 | 2014-01-30 | GM Global Technology Operations LLC | Battery with solid state cooling |
-
2013
- 2013-09-04 TW TW102131902A patent/TWI534405B/en active
-
2014
- 2014-01-07 US US14/149,440 patent/US20150059358A1/en not_active Abandoned
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI697272B (en) * | 2019-05-06 | 2020-06-21 | 宏達國際電子股份有限公司 | Heat dissipation module and electronic device |
| US10785893B1 (en) | 2019-05-06 | 2020-09-22 | Htc Corporation | Heat dissipation module and electronic device |
| CN114061207A (en) * | 2020-08-04 | 2022-02-18 | 合肥华凌股份有限公司 | Refrigerator, control method of refrigerator, and computer-readable storage medium |
| CN114061207B (en) * | 2020-08-04 | 2023-07-18 | 合肥华凌股份有限公司 | Refrigerator, control method of refrigerator and computer readable storage medium |
Also Published As
| Publication number | Publication date |
|---|---|
| US20150059358A1 (en) | 2015-03-05 |
| TWI534405B (en) | 2016-05-21 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI534405B (en) | Control method for cooling film and heat-dissipating module using the same | |
| WO2015144078A1 (en) | Control system for semiconductor refrigerator | |
| TWI410769B (en) | Temperature control method and electric device thereof | |
| TWI249097B (en) | Method of auto-regulating rotational speed of a fan | |
| US20220137685A1 (en) | Heat transfer apparatus for a computer environment | |
| TWI540262B (en) | Fan controll system and method for controlling fan speed | |
| US10458683B2 (en) | Systems and methods for mitigating heat rejection limitations of a thermoelectric module | |
| US20160018140A1 (en) | Systems and methods for operating a thermoelectric module to increase efficiency | |
| US20120329377A1 (en) | Fan control system, computer system, and method for controlling fan speed thereof | |
| TW201200996A (en) | System and method for controlling temperature of a computer | |
| US10935877B2 (en) | Projection apparatus and heat dissipation control method | |
| US20140326442A1 (en) | Method and system for cooling a device | |
| US20100034235A1 (en) | Heat sink testing method | |
| WO2015176353A1 (en) | Cooling circuit and terminal and terminal refrigeration method | |
| TW552461B (en) | Method and apparatus for cooling control | |
| JP2010245181A (en) | Electronic apparatus cooling device | |
| TWM470448U (en) | Temperature sensing cooling device and power supply system thereof | |
| TWI710874B (en) | Heat dissipation module and heat dissipation method thereof | |
| CN111856857B (en) | Projection device and heat dissipation control method thereof | |
| JP2010056116A (en) | Heat sink test method | |
| CN104427828B (en) | The control method of refrigerating sheet and its applicable radiating module | |
| TW201223426A (en) | Cooling system for cooling a heat source and projector having the same | |
| JP5608889B2 (en) | Electronic control unit | |
| JP6677708B2 (en) | System and method for mitigating the waste heat limit of a thermoelectric module | |
| TW201437490A (en) | Controlling system and method for fan |