TWI459880B - Circuit board and method for manufactuing same - Google Patents
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本發明涉及電路板製作技術領域，尤其涉及一種電路板及其製作方法。 The present invention relates to the field of circuit board manufacturing technology, and in particular, to a circuit board and a manufacturing method thereof.
作為消費電子產品必不可少的部件之一軟性印刷電路板(以下稱FPC)，目前常用包括單面銅箔或雙面銅箔的軟性覆銅基板(FCCL)，通過影像轉移工藝及蝕刻工藝等製作成導電線路，再貼合覆蓋膜或者印刷防焊油墨以保護導電線路，最後再對覆蓋膜或油墨未覆蓋的部分導電線路(如電性接觸墊)進行表面處理後製作而成。 As a soft printed circuit board (hereinafter referred to as FPC), which is an indispensable component of consumer electronics, a flexible copper-clad substrate (FCCL) including single-sided copper foil or double-sided copper foil is commonly used, through image transfer process and etching process. The conductive circuit is fabricated, and then the cover film or the solder resist ink is printed to protect the conductive line, and finally the surface of the conductive film (such as the electrical contact pad) which is not covered by the cover film or the ink is surface-treated.
上述FPC產品中，導電線路之間的絕緣層通常為聚醯亞胺(PI)，其介電常數Dk值在3.4~4.0之間，而作為保護層的覆蓋膜的絕緣層也是PI，其膠層通常為普通的亞克力或環氧樹脂類熱固膠。目前消費電子產品的信號傳輸速度有日益提高的趨勢，在信號高頻高速傳輸的過程中，由於上述的絕緣層及覆蓋膜的Dk值較大，目前，FPC產品導致信號的完整性無法保證，需要一種新的FPC來保證高頻高速電子產品的信號傳輸的完整性。 In the above FPC products, the insulating layer between the conductive lines is usually polyimine (PI), and the dielectric constant Dk value is between 3.4 and 4.0, and the insulating layer of the cover film as the protective layer is also PI, and the glue thereof The layer is usually an ordinary acrylic or epoxy thermoset. At present, the signal transmission speed of consumer electronic products is increasing. In the process of high-frequency transmission of signals, due to the large Dk value of the above-mentioned insulation layer and cover film, the integrity of the signal caused by FPC products cannot be guaranteed. A new FPC is needed to ensure the integrity of the signal transmission of high frequency, high speed electronics.
有鑑於此，提供一種電路板的製作及其方法，可以使得電路板中的絕緣層具有較小的介電常數，使得所述電路板能夠用於高頻電 子產品實屬必要。 In view of the above, there is provided a circuit board and a method thereof, which can make an insulating layer in a circuit board have a small dielectric constant, so that the circuit board can be used for high frequency electricity. Sub-products are necessary.
一種電路板，其包括第一導電線路層、介電層及第二導電線路層，所述第一導電線路層和第二導電線路層形成於介電層的相對兩個表面，所述介電層包括一層絕緣基材層及至少一層特氟龍材料層。所述電路板內形成導電通孔及導電盲孔。所述導電通孔貫穿第一導電線路層、介電層和第二導電線路層。所述導電盲孔貫穿第一導電線路層和介電層。在第一導電線路層一側壓合第一覆蓋層，所述第一覆蓋層包括第一絕緣材料層和第一黏接層。所述第一黏接層與第一導電線路層相接觸。在第二導電線路層一側壓合第二覆蓋層，所述第二覆蓋層包括第二絕緣材料層和第二黏接層。所述第二黏接層與第二導電線路層相接觸。所述導電通孔及導電盲孔均被所述第一黏接層與所述第二黏接層填满。所述第一黏接層及第二黏接層的材料為含氟的丙烯酸類樹脂或者含氟的環氧樹脂。 A circuit board comprising a first conductive circuit layer, a dielectric layer and a second conductive circuit layer, the first conductive circuit layer and the second conductive circuit layer being formed on opposite surfaces of the dielectric layer, the dielectric The layer includes a layer of insulating substrate and at least one layer of Teflon material. Conductive through holes and conductive blind holes are formed in the circuit board. The conductive via extends through the first conductive wiring layer, the dielectric layer, and the second conductive wiring layer. The conductive blind via penetrates through the first conductive wiring layer and the dielectric layer. The first cover layer is press-bonded on one side of the first conductive circuit layer, and the first cover layer includes a first insulating material layer and a first adhesive layer. The first adhesive layer is in contact with the first conductive circuit layer. A second cover layer is press-bonded on one side of the second conductive circuit layer, and the second cover layer includes a second insulating material layer and a second adhesive layer. The second adhesive layer is in contact with the second conductive circuit layer. The conductive via and the conductive via are filled by the first adhesive layer and the second adhesive layer. The material of the first adhesive layer and the second adhesive layer is a fluorine-containing acrylic resin or a fluorine-containing epoxy resin.
一種電路板的製作方法，包括步驟：提供覆銅基板，所述覆銅基板包括介電層、第一銅箔層和第二銅箔層，所述第一銅箔層和第二銅箔層形成於介電層的相對兩個表面，所述介電層包括一層絕緣基材層及至少一層特氟龍材料層；以及將所述第一銅箔製作形成第一導電線路層，並將第二銅箔製作形成第二導電線路層，得到電路板。所述覆銅基板內形成導電通孔及導電盲孔。所述導電通孔貫穿第一導電線路層、介電層和第二導電線路層。所述導電盲孔貫穿第一導電線路層和介電層。在第一導電線路層一側壓合第一覆蓋層，所述第一覆蓋層包括第一絕緣材料層和第一黏接層。所述第一黏接層與第一導電線路層相接觸。在第二導電線路層 一側壓合第二覆蓋層，所述第二覆蓋層包括第二絕緣材料層和第二黏接層。所述第二黏接層與第二導電線路層相接觸。所述導電通孔及導電盲孔均被所述第一黏接層與所述第二黏接層填满。所述第一黏接層及第二黏接層的材料為含氟的丙烯酸類樹脂或者含氟的環氧樹脂。 A method of manufacturing a circuit board, comprising the steps of: providing a copper clad substrate, the copper clad substrate comprising a dielectric layer, a first copper foil layer and a second copper foil layer, the first copper foil layer and the second copper foil layer Forming on opposite surfaces of the dielectric layer, the dielectric layer includes an insulating substrate layer and at least one layer of Teflon material; and forming the first copper foil to form a first conductive circuit layer, and The second copper foil is formed to form a second conductive circuit layer to obtain a circuit board. Conductive through holes and conductive blind holes are formed in the copper clad substrate. The conductive via extends through the first conductive wiring layer, the dielectric layer, and the second conductive wiring layer. The conductive blind via penetrates through the first conductive wiring layer and the dielectric layer. The first cover layer is press-bonded on one side of the first conductive circuit layer, and the first cover layer includes a first insulating material layer and a first adhesive layer. The first adhesive layer is in contact with the first conductive circuit layer. In the second conductive circuit layer The second cover layer is press-fitted on one side, and the second cover layer includes a second insulating material layer and a second adhesive layer. The second adhesive layer is in contact with the second conductive circuit layer. The conductive via and the conductive via are filled by the first adhesive layer and the second adhesive layer. The material of the first adhesive layer and the second adhesive layer is a fluorine-containing acrylic resin or a fluorine-containing epoxy resin.
本技術方案提供的電路板及電路板製作方法，由於介電層採用絕緣基材層和至少一層特氟龍材料層的疊構，現比於現有技術中僅採用採用絕緣基材層作為介電層，可以減小介電層的介電常數，從而可以使得電路板能夠應用於高頻電子產品中。所述的電路板及電路板的製作方法也應用於剛撓結合板及剛撓結合板的製作。 The circuit board and the circuit board manufacturing method provided by the technical solution, since the dielectric layer adopts a stack of an insulating substrate layer and at least one layer of Teflon material, it is now only used as an dielectric layer in the prior art. The layer can reduce the dielectric constant of the dielectric layer, thereby enabling the circuit board to be applied to high frequency electronic products. The manufacturing method of the circuit board and the circuit board is also applied to the production of the rigid-flex board and the rigid-flex board.
100‧‧‧電路板 100‧‧‧ boards
101‧‧‧導電通孔 101‧‧‧ conductive through holes
102‧‧‧導電盲孔 102‧‧‧ Conductive blind holes
110‧‧‧覆銅基板 110‧‧‧Copper substrate
112‧‧‧介電層 112‧‧‧ dielectric layer
1121‧‧‧絕緣基材層 1121‧‧‧Insulating substrate layer
1122‧‧‧特氟龍材料層 1122‧‧‧Teflon material layer
111‧‧‧第一銅箔層 111‧‧‧First copper foil layer
113‧‧‧第二銅箔層 113‧‧‧Second copper foil layer
114‧‧‧通孔 114‧‧‧through hole
115‧‧‧盲孔 115‧‧‧Blind holes
116‧‧‧導電金屬層 116‧‧‧ Conductive metal layer
117‧‧‧抗電鍍膜 117‧‧‧Anti-electroplating film
120‧‧‧第一導電線路層 120‧‧‧First conductive circuit layer
130‧‧‧第二導電線路層 130‧‧‧Second conductive circuit layer
140‧‧‧第一覆蓋層 140‧‧‧First cover
142‧‧‧第一黏接層 142‧‧‧First bonding layer
141‧‧‧第一絕緣材料層 141‧‧‧First insulating material layer
150‧‧‧第二覆蓋層 150‧‧‧second cover
152‧‧‧第二黏接層 152‧‧‧Second adhesive layer
151‧‧‧第二絕緣材料層 151‧‧‧Second layer of insulating material
圖1為本技術方案實施例提供的覆銅基板的剖面示意圖。 FIG. 1 is a cross-sectional view of a copper clad substrate provided by an embodiment of the present technical solution.
圖2為圖1的覆銅基板中形成通孔及盲孔後的剖面示意圖。 2 is a cross-sectional view showing a through hole and a blind hole in the copper clad substrate of FIG. 1.
圖3至圖5為圖2中的通孔製作形成導電通孔，並將盲孔製作形成導電盲孔後的剖面示意圖。 3 to FIG. 5 are schematic cross-sectional views showing the formation of conductive vias in the via holes of FIG. 2 and the formation of the via holes to form conductive vias.
圖6為將覆銅基板中的第一銅箔層製作形成第一導電線路層，並將第二銅箔層製作形成第二導電線路層後的剖面示意圖。 6 is a schematic cross-sectional view showing a first copper foil layer in a copper-clad substrate formed into a first conductive wiring layer, and a second copper foil layer formed into a second conductive wiring layer.
圖7為本技術方案提供的電路板的剖面示意圖。 FIG. 7 is a schematic cross-sectional view of a circuit board provided by the technical solution.
本技術方案提供的電路板製作方法包括如下步驟：第一步，請參閱圖1，提供覆銅基板110。 The circuit board manufacturing method provided by the technical solution includes the following steps: First, referring to FIG. 1, a copper clad substrate 110 is provided.
本實施例中，覆銅基板110為雙面覆銅基板，其包括第一銅箔層 111、介電層112及第二銅箔層113。第一銅箔層111位於介電層一表面，第二銅箔層113位於介電層112的另一相對的表面。所述覆銅基板110為柔性覆銅基板(Flexible Copper Clad Laminate,FCCL)。即所述介電層112為柔性材料製作。 In this embodiment, the copper clad substrate 110 is a double-sided copper clad substrate including a first copper foil layer. 111, dielectric layer 112 and second copper foil layer 113. The first copper foil layer 111 is on one surface of the dielectric layer, and the second copper foil layer 113 is on the other opposite surface of the dielectric layer 112. The copper clad substrate 110 is a Flexible Copper Clad Laminate (FCCL). That is, the dielectric layer 112 is made of a flexible material.
所述介電層112包括一層絕緣基材層1121和至少一層特氟龍(Teflon)材料層1122。所述絕緣基材層1121的材料為聚醯亞胺等本領域中用於製作軟性電路板絕緣層的材料。所述特氟龍材料層的具體材料可以為聚四氟乙烯樹脂。本實施例中，所述介電層112包括兩層特氟龍材料層1122及一層絕緣基材層1121。絕緣基材層1121設置於兩層特氟龍材料層1122之間。所述介電層112的介電常數為2.3至2.5之間。 The dielectric layer 112 includes an insulating substrate layer 1121 and at least one layer of Teflon material 1122. The material of the insulating base material layer 1121 is a material used in the art for producing a flexible circuit board insulating layer such as polyimide. The specific material of the Teflon material layer may be a polytetrafluoroethylene resin. In this embodiment, the dielectric layer 112 includes two layers of Teflon material 1122 and an insulating substrate layer 1121. The insulating substrate layer 1121 is disposed between the two layers of Teflon material layers 1122. The dielectric layer 112 has a dielectric constant between 2.3 and 2.5.
第二步，請參閱圖2，在覆銅基板110內形成至少一個通孔114及至少一個盲孔115。 In the second step, referring to FIG. 2, at least one through hole 114 and at least one blind hole 115 are formed in the copper clad substrate 110.
本步驟中，通孔114可以採用鐳射燒蝕的方式形成。通孔114貫穿第一銅箔層111、介電層112及第二銅箔層113。通孔114也可以採用機械鑽孔的方式形成。通孔114的個數可以為一個，也可以為多個。圖2中以形成一個通孔114為例進行說明。 In this step, the through holes 114 may be formed by laser ablation. The through hole 114 penetrates through the first copper foil layer 111, the dielectric layer 112, and the second copper foil layer 113. The through hole 114 can also be formed by mechanical drilling. The number of the through holes 114 may be one or plural. In FIG. 2, a through hole 114 is formed as an example for description.
盲孔115可以採用鐳射燒蝕的方式形成。所述盲孔115僅貫穿第一銅箔層111和介電層112。第二銅箔層113靠近介電層112的表面從盲孔115的底部露出。 The blind holes 115 can be formed by laser ablation. The blind via 115 penetrates only the first copper foil layer 111 and the dielectric layer 112. The second copper foil layer 113 is exposed from the bottom of the blind via 115 near the surface of the dielectric layer 112.
第三步，請參閱圖3至圖5，在通孔114的內壁及盲孔115的內壁形成導電金屬層116，從而得到導電通孔101和導電盲孔102。 In the third step, referring to FIG. 3 to FIG. 5, a conductive metal layer 116 is formed on the inner wall of the through hole 114 and the inner wall of the blind hole 115, thereby obtaining the conductive via 101 and the conductive via hole 102.
本步驟具體包括：首先，在第一銅箔層111和第二銅箔層113的表 面形成抗電鍍膜117，使得盲孔115及環繞盲孔115的部分第一銅箔層111被露出，通孔114及環繞通孔114的部分第一銅箔層111和第二銅箔層113被露出。然後，採用先化學鍍再電鍍的方式，在通孔114的內壁、盲孔115的內壁以及從抗電鍍膜117露出的部分第一銅箔層111和第二銅箔層113的表面形成導電金屬層116。最後，去除第一銅箔層111和第二銅箔層113的表面形成抗電鍍膜117。 The step specifically includes: first, a table of the first copper foil layer 111 and the second copper foil layer 113 The surface of the anti-plating film 117 is formed such that the blind via 115 and a portion of the first copper foil layer 111 surrounding the blind via 115 are exposed, the via 114 and a portion of the first copper foil layer 111 and the second copper foil layer 113 surrounding the via 114. Being exposed. Then, the inner wall of the through hole 114, the inner wall of the blind hole 115, and the portions of the first copper foil layer 111 and the second copper foil layer 113 exposed from the plating resist 117 are formed by electroless plating. Conductive metal layer 116. Finally, the surfaces of the first copper foil layer 111 and the second copper foil layer 113 are removed to form an anti-plating film 117.
第四步，請參閱圖6，選擇性去除部分第一銅箔層111從而形成第一導電線路層120，選擇性去除部分第二銅箔層113從而形成第二導電線路層130。 In the fourth step, referring to FIG. 6, a portion of the first copper foil layer 111 is selectively removed to form a first conductive wiring layer 120, and a portion of the second copper foil layer 113 is selectively removed to form a second conductive wiring layer 130.
本步驟中，採用影像轉移工藝及化學蝕刻工藝將第一銅箔層111製作形成第一導電線路層120，將第二銅箔層113製作形成第二導電線路層130。 In this step, the first copper foil layer 111 is formed into a first conductive wiring layer 120 by using an image transfer process and a chemical etching process, and the second copper foil layer 113 is formed into a second conductive wiring layer 130.
第五步，請參閱圖7，在第一導電線路層120一側壓合第一覆蓋層140，在第二導電線路層130一側壓合第二覆蓋層150，從而得到電路板100。 In the fifth step, referring to FIG. 7, the first cover layer 140 is pressed on the side of the first conductive circuit layer 120, and the second cover layer 150 is pressed on the side of the second conductive line layer 130, thereby obtaining the circuit board 100.
本步驟中，所述第一覆蓋層140包括第一絕緣材料層141和第一黏接層142。第二覆蓋層150包括第二絕緣材料層151和第二黏接層152。其中，第一絕緣材料層141和第二絕緣材料層151的材料可以為本技術領域常見的用於作為覆蓋膜的材料，如聚醯亞胺等。所述第一黏接層142和第二黏接層152的材料為含氟的丙烯酸類樹脂或者含氟的環氧樹脂等。由於第一黏接層142和第二黏接層152由含氟材料製成，從而可以降低第一覆蓋層140和第二覆蓋層150的介電常數。本實施例中，第一覆蓋層140和第二覆蓋層150的介 電常數為2.6至2.9。 In this step, the first cover layer 140 includes a first insulating material layer 141 and a first adhesive layer 142. The second cover layer 150 includes a second insulating material layer 151 and a second adhesive layer 152. The material of the first insulating material layer 141 and the second insulating material layer 151 may be a material commonly used as a cover film in the art, such as polyimide or the like. The material of the first adhesive layer 142 and the second adhesive layer 152 is a fluorine-containing acrylic resin or a fluorine-containing epoxy resin. Since the first adhesive layer 142 and the second adhesive layer 152 are made of a fluorine-containing material, the dielectric constants of the first cover layer 140 and the second cover layer 150 can be lowered. In this embodiment, the first cover layer 140 and the second cover layer 150 are interposed. The electrical constant is 2.6 to 2.9.
在進行壓合過程中，第一黏接層142和第二黏接層152還填充於導電通孔101和導電盲孔102內部，使得電路板100內部不具有氣體。 During the nip process, the first adhesive layer 142 and the second adhesive layer 152 are also filled inside the conductive via 101 and the conductive via 102, so that the inside of the circuit board 100 does not have gas.
可以理解的是，所述第一覆蓋層140中還可以形成多個第一開口，使得第一導電線路層120的電性接觸墊從對應的第一開口露出，以使得第一導電線路層120的電性接觸墊可以與其他電子元件進行連接。第二覆蓋層150中還可以形成多個第二開口，使得第二導電線路層130的電性接觸墊從對應的第二開口露出，使得第二導電線路層130的電性接觸墊可以與其他的電子元件進行連接。 It can be understood that a plurality of first openings may be formed in the first cover layer 140 such that the electrical contact pads of the first conductive circuit layer 120 are exposed from the corresponding first openings, such that the first conductive circuit layer 120 The electrical contact pads can be connected to other electronic components. A plurality of second openings may also be formed in the second cover layer 150 such that the electrical contact pads of the second conductive circuit layer 130 are exposed from the corresponding second openings, so that the electrical contact pads of the second conductive circuit layer 130 can be combined with other The electronic components are connected.
可以理解的是，本技術方案提供的電路板製作方法，也可以應用於剛撓結合板的製作。 It can be understood that the circuit board manufacturing method provided by the technical solution can also be applied to the fabrication of the rigid-flex board.
本技術方案還提供一種電路板100，電路板100包括介電層112、第一導電線路層120、第二導電線路層130、第一覆蓋層140和第二覆蓋層150。所述電路板100可以為柔性電路板。 The technical solution also provides a circuit board 100 including a dielectric layer 112, a first conductive circuit layer 120, a second conductive circuit layer 130, a first cover layer 140, and a second cover layer 150. The circuit board 100 can be a flexible circuit board.
所述介電層112包括至少一層絕緣基材層1121和一層特氟龍材料層1122。所述絕緣基材層1121的材料為聚醯亞胺等本領域中用於製作軟性電路板絕緣層的材料。所述特氟龍材料層的具體材料可以為聚四氟乙烯樹脂。本實施例中，所述介電層112包括兩層特氟龍材料層1122及一層絕緣基材層1121。絕緣基材層1121設置於兩層特氟龍材料層1122之間。所述介電層112的介電常數為2.3至2.5之間。 The dielectric layer 112 includes at least one insulating substrate layer 1121 and a layer of Teflon material 1122. The material of the insulating base material layer 1121 is a material used in the art for producing a flexible circuit board insulating layer such as polyimide. The specific material of the Teflon material layer may be a polytetrafluoroethylene resin. In this embodiment, the dielectric layer 112 includes two layers of Teflon material 1122 and an insulating substrate layer 1121. The insulating substrate layer 1121 is disposed between the two layers of Teflon material layers 1122. The dielectric layer 112 has a dielectric constant between 2.3 and 2.5.
所述第一導電線路層120和第二導電線路層130形成於介電層112的相對兩個表面。在電路板100中，還形成有導電通孔101和導電盲孔102。所述導電通孔101貫穿第一導電線路層120、介電層112及第二導電線路層130，以電導通第一導電線路層120和第二導電線路層130。所述導電盲孔102僅貫穿第一導電線路層120和介電層112，以電導通第一導電線路層120和第二導電線路層130。 The first conductive wiring layer 120 and the second conductive wiring layer 130 are formed on opposite surfaces of the dielectric layer 112. In the circuit board 100, a conductive via 101 and a conductive via 102 are also formed. The conductive vias 101 extend through the first conductive wiring layer 120 , the dielectric layer 112 , and the second conductive wiring layer 130 to electrically conduct the first conductive wiring layer 120 and the second conductive wiring layer 130 . The conductive via hole 102 penetrates only the first conductive wiring layer 120 and the dielectric layer 112 to electrically conduct the first conductive wiring layer 120 and the second conductive wiring layer 130.
所述第一覆蓋層140包括第一絕緣材料層141和第一黏接層142。第二覆蓋層150包括第二絕緣材料層151和第二黏接層152。其中，第一絕緣材料層141和第二絕緣材料層151的材料可以為本技術領域常見的用於作為覆蓋膜的材料，如聚醯亞胺等。所述第一黏接層142和第二黏接層152的材料為含氟的丙烯酸類樹脂或者含氟的環氧樹脂等。由於第一黏接層142和第二黏接層152由含氟材料製成，從而可以降低第一覆蓋層140和第二覆蓋層150的介電常數。本實施例中，第一覆蓋層140和第二覆蓋層150的介電常數為2.6至2.9。第一覆蓋層140的第一黏接層142與第一導電線路層120相黏接，第二覆蓋層150的第二黏接層152與第二導電線路層130相互黏接。第一黏接層142和第二黏接層152還填充於導電通孔101和導電盲孔102內部。 The first cover layer 140 includes a first insulating material layer 141 and a first adhesive layer 142. The second cover layer 150 includes a second insulating material layer 151 and a second adhesive layer 152. The material of the first insulating material layer 141 and the second insulating material layer 151 may be a material commonly used as a cover film in the art, such as polyimide or the like. The material of the first adhesive layer 142 and the second adhesive layer 152 is a fluorine-containing acrylic resin or a fluorine-containing epoxy resin. Since the first adhesive layer 142 and the second adhesive layer 152 are made of a fluorine-containing material, the dielectric constants of the first cover layer 140 and the second cover layer 150 can be lowered. In this embodiment, the first cap layer 140 and the second cap layer 150 have a dielectric constant of 2.6 to 2.9. The first adhesive layer 142 of the first cover layer 140 is bonded to the first conductive circuit layer 120, and the second adhesive layer 152 of the second cover layer 150 and the second conductive circuit layer 130 are bonded to each other. The first adhesive layer 142 and the second adhesive layer 152 are also filled inside the conductive via 101 and the conductive via 102.
本技術方案提供的電路板及電路板製作方法，由於介電層採用絕緣基材層和至少一層特氟龍材料層的疊構，現比於現有技術中僅採用採用絕緣基材層作為介電層，可以減小介電層的介電常數，從而可以使得電路板能夠應用於高頻電子產品中。進一步的，覆蓋層中的黏接層採用含氟的黏接材料製作，也可以降低覆蓋層的介電常數，從而進一步提高電路板在傳輸高頻信號時的信號完整 性。 The circuit board and the circuit board manufacturing method provided by the technical solution, since the dielectric layer adopts a stack of an insulating substrate layer and at least one layer of Teflon material, it is now only used as an dielectric layer in the prior art. The layer can reduce the dielectric constant of the dielectric layer, thereby enabling the circuit board to be applied to high frequency electronic products. Further, the adhesive layer in the cover layer is made of a fluorine-containing adhesive material, and the dielectric constant of the cover layer can also be reduced, thereby further improving the signal integrity of the circuit board when transmitting high-frequency signals. Sex.
綜上所述，本發明確已符合發明專利之要件，遂依法提出專利申請。惟，以上所述者僅為本發明之較佳實施方式，自不能以此限制本案之申請專利範圍。舉凡熟悉本案技藝之人士援依本發明之精神所作之等效修飾或變化，皆應涵蓋於以下申請專利範圍內。 In summary, the present invention has indeed met the requirements of the invention patent, and has filed a patent application according to law. However, the above description is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application of the present invention. Equivalent modifications or variations made by persons skilled in the art in light of the spirit of the invention are intended to be included within the scope of the following claims.
100‧‧‧電路板 100‧‧‧ boards
101‧‧‧導電通孔 101‧‧‧ conductive through holes
102‧‧‧導電盲孔 102‧‧‧ Conductive blind holes
1121‧‧‧絕緣基材層 1121‧‧‧Insulating substrate layer
1122‧‧‧特氟龍材料層 1122‧‧‧Teflon material layer
120‧‧‧第一導電線路層 120‧‧‧First conductive circuit layer
130‧‧‧第二導電線路層 130‧‧‧Second conductive circuit layer
140‧‧‧第一覆蓋層 140‧‧‧First cover
142‧‧‧第一黏接層 142‧‧‧First bonding layer
141‧‧‧第一絕緣材料層 141‧‧‧First insulating material layer
150‧‧‧第二覆蓋層 150‧‧‧second cover
152‧‧‧第二黏接層 152‧‧‧Second adhesive layer
151‧‧‧第二絕緣材料層 151‧‧‧Second layer of insulating material
Claims (12)
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| CN201210493906.2A CN103857176A (en) | 2012-11-28 | 2012-11-28 | Circuit board and manufacture method for the same |
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| Publication Number | Publication Date |
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| TW201422089A TW201422089A (en) | 2014-06-01 |
| TWI459880B true TWI459880B (en) | 2014-11-01 |
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| TW (1) | TWI459880B (en) |
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| TWI581689B (en) * | 2014-11-17 | 2017-05-01 | 欣興電子股份有限公司 | Method for manufacturing circuit board |
| CN106332442B (en) * | 2015-06-26 | 2020-02-14 | 鹏鼎控股(深圳)股份有限公司 | Circuit board and manufacturing method thereof |
| CN106376170A (en) * | 2015-07-24 | 2017-02-01 | 宏启胜精密电子(秦皇岛)有限公司 | Flexible circuit board, manufacturing method thereof, and electronic device |
| CN106470526A (en) * | 2015-08-18 | 2017-03-01 | 宏启胜精密电子(秦皇岛)有限公司 | Induction structure, flexible PCB and preparation method thereof |
| CN111800943A (en) * | 2019-04-09 | 2020-10-20 | 深南电路股份有限公司 | Circuit board and manufacturing method thereof |
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| CN101747854B (en) * | 2008-12-04 | 2012-11-21 | 比亚迪股份有限公司 | Adhesive combination, covering film and flexible circuit board |
| CN101534605A (en) * | 2009-04-11 | 2009-09-16 | 黄威豪 | Method for manufacturing high frequency copper-clad plate |
| CN101934610A (en) * | 2010-07-21 | 2011-01-05 | 顾根山 | Wide-dielectric-coefficient Ccopper foil plate covered with wide-dielectric-coefficient polyfluortetraethylene glass cloth and preparation method thereof |
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