TW201504063A - Substrate treating system and laminating apparatus included in the same, and substrate treating method - Google Patents
Substrate treating system and laminating apparatus included in the same, and substrate treating method Download PDFInfo
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B39/00—Layout of apparatus or plants, e.g. modular laminating systems
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/16—Drying; Softening; Cleaning
- B32B38/162—Cleaning
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/18—Handling of layers or the laminate
- B32B38/1808—Handling of layers or the laminate characterised by the laying up of the layers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/18—Handling of layers or the laminate
- B32B2038/1891—Using a robot for handling the layers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B41/00—Arrangements for controlling or monitoring lamination processes; Safety arrangements
- B32B2041/04—Detecting wrong registration, misalignment, deviation, failure
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Abstract
Description
相關申請案之交互參照Cross-references to related applications
本申請案主張2013年7月29日於韓國智慧財產局(Korean Intellectual Property Office)提出之韓國專利申請字號10-2013-0089824之利益，其揭露之全部內容整合於此以作為參照。The present application claims the benefit of Korean Patent Application No. 10-2013-0089824, filed on Jan. 29, 2013, in the Korean Intellectual Property Office, the entire disclosure of which is incorporated herein by reference.
本發明之一或多個實施例係關於用於層壓薄板玻璃於載體玻璃上之基板處理系統， 包含於其中之層壓設備及使用該 基板處理系統之 基板處理方法。One or more embodiments of the present invention relate to a substrate processing system for laminating thin glass on a carrier glass, a laminating apparatus included therein, and a substrate processing method using the substrate processing system.
顯示裝置隨往輕量化、易攜帶性與可折疊性的潮流改變。為此，需要更薄的顯示裝置。The display device has changed in the trend of lightweight, portability and foldability. For this reason, a thinner display device is required.
為了製造平板顯示裝置，基板及密封基板可在顯示裝置製造後蝕刻以降低顯示裝置之總厚度。然而，用上述方法製造的顯示裝置可能具有難以製作超薄平板顯示裝置之限制。In order to manufacture a flat panel display device, the substrate and the sealing substrate may be etched after the display device is manufactured to reduce the total thickness of the display device. However, the display device manufactured by the above method may have limitations in that it is difficult to fabricate an ultra-thin flat panel display device.
薄板玻璃可用作為基板以製作平板顯示裝置。然而，當薄板玻璃被單獨處理，薄板玻璃可能容易受損。因此，在薄板玻璃被層壓於載體玻璃上後，顯示裝置可被製造，然後載體玻璃可被移除。A thin plate glass can be used as a substrate to produce a flat panel display device. However, when the sheet glass is treated separately, the sheet glass may be easily damaged. Therefore, after the thin glass is laminated on the carrier glass, the display device can be manufactured, and then the carrier glass can be removed.
載體玻璃可包含在中央部位之分離區以及在外圍部位之吸附區。因此，當薄板玻璃被層壓於載體玻璃上時，薄板玻璃必須要無錯置地正確層壓，以輕易地附著或分離於載體玻璃。The carrier glass may comprise a separation zone at the central portion and an adsorption zone at the peripheral location. Therefore, when the thin glass is laminated on the carrier glass, the thin glass must be properly laminated without being misplaced to easily adhere or separate from the carrier glass.
同樣地，當薄板玻璃正層壓於載體玻璃上時，氣阱可能發生在兩玻璃間。結果，製造顯示器時，薄板玻璃中之破裂或圖樣錯誤可能因氣阱而發生。同樣地，亦難以在移除載體玻璃前移除氣阱。因此，當薄板玻璃層壓於載體玻璃上時，需要最小化氣阱。Likewise, when the sheet glass is being laminated to the carrier glass, the gas trap may occur between the two glasses. As a result, cracks or pattern errors in the sheet glass may occur due to the gas trap when the display is manufactured. Likewise, it is also difficult to remove the air trap before removing the carrier glass. Therefore, when the sheet glass is laminated on the carrier glass, it is necessary to minimize the gas trap.
同樣地，當薄板玻璃層壓於載體玻璃上時，可能因兩玻璃間熱膨脹係數之差異及層壓時的壓力而發生彎曲現象。如果無法適當地控制彎曲，則破裂可能發生在薄板玻璃中。Similarly, when the thin glass is laminated on the carrier glass, the bending phenomenon may occur due to the difference in thermal expansion coefficient between the two glasses and the pressure at the time of lamination. If the bending cannot be properly controlled, the cracking may occur in the sheet glass.
本發明之一或多個實施例包含用於層壓薄板玻璃於載體玻璃上之 基板處理系統、包含於其中之層壓設備以及使用該基板處理系統之基板處理方法。One or more embodiments of the present invention comprise a substrate processing system for laminating thin glass on a carrier glass, a lamination apparatus contained therein, and a substrate processing method using the substrate processing system.
其他態樣將會部份陳述在隨後敘述中以而部份會從描述中變得更明顯，或者可藉由實行所示實施例而了解。Other aspects will be set forth in part in the description which follows.
根據本發明之一或多個實施例，基板處理系統包含： 包含其中第一基板對應於第二基板，以使第一基板與第二基板接觸於彼此，從而初步層壓第一及第二基板之第一層壓構件之第一腔室；包含其中初步層壓之第一及第二基板被 施壓 及層壓於彼此上之第二層壓構件之第二腔室；以及包含輸送第一及第二基板之機械手臂之第三腔室，第三腔室連結於第一及第二腔室。According to one or more embodiments of the present invention, a substrate processing system includes: including a first substrate corresponding to a second substrate such that the first substrate and the second substrate are in contact with each other, thereby initially laminating the first and second substrates a first chamber of the first laminate member; a second chamber including a second laminate member in which the first and second substrates are initially laminated and which are laminated and laminated to each other; and And a third chamber of the robot arm of the second substrate, the third chamber being coupled to the first and second chambers.
基板處理系統可進一步包含：清潔至少第一基板之頂面之第一清潔單元，第一清潔單元連接於第三腔室；以及清潔至少第二基板之頂面之第二清潔單元，第二清潔單元連接於第三腔室。The substrate processing system may further include: a first cleaning unit that cleans at least a top surface of the first substrate, the first cleaning unit is coupled to the third chamber; and a second cleaning unit that cleans at least a top surface of the second substrate, the second cleaning The unit is connected to the third chamber.
第一清潔單元可包含以第三腔室之方向輸送第一基板之複數個輸送滾筒，第二清潔單元包含以第三腔室之方向輸送第二基板之複數個輸送滾筒，以及第一清潔單元之輸送滾筒之間的距離小於第二清潔單元之輸送滾筒之間的距離。The first cleaning unit may include a plurality of conveying rollers conveying the first substrate in a direction of the third chamber, the second cleaning unit including a plurality of conveying rollers conveying the second substrate in a direction of the third chamber, and the first cleaning unit The distance between the transport rollers is less than the distance between the transport rollers of the second cleaning unit.
第一及第二清潔單元可各維持在大氣壓，第一到第三腔室可各維持在真空狀態，以及用於調整壓力之第一輔助腔室可放置於第一清潔單元與第三腔室間，以及用於調整壓力之第二輔助腔室可放置於第二清潔單元與第三腔室間。The first and second cleaning units may each be maintained at atmospheric pressure, the first to third chambers may each be maintained in a vacuum state, and the first auxiliary chamber for adjusting the pressure may be placed in the first cleaning unit and the third chamber A second auxiliary chamber for adjusting the pressure may be placed between the second cleaning unit and the third chamber.
機械手臂可從第一輔助腔室輸送第一基板到第一腔室以及從第二輔助腔室輸送第二基板到第一腔室。The robot arm can transport the first substrate from the first auxiliary chamber to the first chamber and the second substrate to the first chamber from the second auxiliary chamber.
基板處理系統可更進一步包含連結於第二腔室以調整壓力之第三輔助腔室。The substrate processing system can further include a third auxiliary chamber coupled to the second chamber to adjust pressure.
第一層壓構件可包含：於其上放置第二基板之平台；以對應於第二基板之方向輸送第一基板之對準單元；以及靜電施加於其外圍面之第一滾筒單元，第一滾筒單元從對準單元，以其旋轉方向沿外圍面，藉由靜電輸送第一基板，以初步層壓第一基板到第二基板上，其中平台可放置於第一滾筒單元下，以及對準單元可放置於第一滾筒單元上。The first laminate member may include: a platform on which the second substrate is placed; an alignment unit that conveys the first substrate in a direction corresponding to the second substrate; and a first roller unit that electrostatically applies to the peripheral surface thereof, first The roller unit is configured to preliminarily laminate the first substrate to the second substrate by electrostatically transporting the first substrate from the alignment unit along the peripheral surface thereof in a rotational direction thereof, wherein the platform can be placed under the first roller unit, and the alignment The unit can be placed on the first drum unit.
第二層壓構件可包含：施壓給初步層壓之第一及第二基板以層壓第一及第二基板於彼此上之第二滾筒單元；包含輸送被初步層壓之第一及第二基板到第二滾筒單元之複數個輸送滾筒之第一輸送單元；以及包含載運被施壓及層壓到彼此上之第一及第二基板到第三輔助腔室之複數個載運滾筒之第二輸送單元。The second laminate member may include: a first roller unit that presses the first and second substrates that are initially laminated to laminate the first and second substrates on each other; and includes the first and the first to be conveyed by the preliminary lamination a first conveying unit of a plurality of conveying rollers from the second substrate to the second roller unit; and a plurality of carrying rollers that carry the first and second substrates to the third auxiliary chamber that are pressed and laminated to each other Two delivery units.
根據本發明之一或多個實施例，使第一及第二基板接觸於彼此以初步層壓第一及第二基板之層壓設備包含：於其上放置第二基板之平台；對準單元以一方向輸送第一基板以對應於第二基板；靜電施加於其外圍面之滾筒單元，滾筒單元從對準單元，以其旋轉方向沿外圍面，藉由靜電輸送第一基板，以初步層壓第一基板到第二基板上，其中平台被放置於滾筒單元下，以及對準單元被放置於滾筒單元上。According to one or more embodiments of the present invention, the laminating apparatus for causing the first and second substrates to contact each other to initially laminate the first and second substrates comprises: a platform on which the second substrate is placed; the aligning unit The first substrate is transported in one direction to correspond to the second substrate; the roller unit is electrostatically applied to the peripheral surface thereof, and the roller unit is transported from the aligning unit along the peripheral surface thereof by the electrostatic direction to the first substrate, to the preliminary layer The first substrate is pressed onto the second substrate, wherein the stage is placed under the drum unit, and the alignment unit is placed on the drum unit.
對準單元可包含以一方向輸送第一基板之複數個輸送滾筒及偵測第一基板之扭曲之偵測部分，以及層壓設備可更進一步包含在第一基板之扭曲被偵測部分偵測到時，調整輸送滾筒之位置，以更正第一基板之扭曲之第一控制單元。The aligning unit may include a plurality of conveying rollers that convey the first substrate in one direction and a detecting portion that detects the distortion of the first substrate, and the laminating device may further include a distortion detecting portion of the first substrate At that time, the position of the transport roller is adjusted to correct the twisted first control unit of the first substrate.
層壓設備可更進一步包含根據第一基板是否接觸滾筒單元，控制靜電施加到滾筒之外圍面之第二控制單元。The laminating apparatus may further include a second control unit that controls the application of static electricity to the peripheral surface of the drum according to whether the first substrate contacts the drum unit.
第二控制單元可與滾筒單元之旋轉速率聯動以根據第一基板是否接觸第二基板，控制平台之移動。The second control unit can be linked with the rotation rate of the drum unit to control the movement of the platform according to whether the first substrate contacts the second substrate.
平台及滾筒單元以對應於第一及第二基板之厚度總和的距離在空間上互相隔離。The platform and roller unit are spatially isolated from each other by a distance corresponding to a sum of thicknesses of the first and second substrates.
根據本發明之一或多個實施例，施壓給被初步層壓於彼此上之第一及第二基板以層壓第一及第二基板之層壓設備包含：施壓給被初步層壓於彼此上之第一及第二基板，以層壓第一基板及第二基板之滾筒單元；包含輸送被初步層壓於彼此上之第一及第二基板到滾筒單元之複數個輸送滾筒之第一輸送單元；以及包含載運被施壓及層壓到彼此上之第一及第二基板到輔助腔室之複數個載運滾筒之第二輸送單元。According to one or more embodiments of the present invention, a laminating apparatus for applying a first and a second substrate which are initially laminated on each other to laminate the first and second substrates comprises: applying pressure to the preliminary lamination First and second substrates on each other to laminate the first substrate and the second substrate of the roller unit; and including a plurality of conveying rollers for conveying the first and second substrates preliminarily laminated to each other to the drum unit a first conveying unit; and a second conveying unit that carries a plurality of carrying rollers that are pressed and laminated to the first and second substrates on each other to the auxiliary chamber.
滾筒單元可具有以軟性材料製成之外圍面。The drum unit may have a peripheral surface made of a soft material.
各輸送滾筒及載運滾筒可根據第一及第二基板之彎曲程度而設定高度。Each of the transport roller and the transport roller can set a height according to the degree of bending of the first and second substrates.
根據本發明之一或多個實施例，基板處理方法包含：在大氣壓力下分別清潔至少第一基板及第二基板之頂面；在真空狀態中使第一基板之頂面接觸第二基板之頂面，以初步層壓第一及第二基板到彼此上；以及在真空狀態中施壓給被初步層壓之第一及第二基板以層壓第一及第二基板到彼此上。According to one or more embodiments of the present invention, a substrate processing method includes: cleaning at least a top surface of at least a first substrate and a second substrate under atmospheric pressure; and contacting a top surface of the first substrate with the second substrate in a vacuum state; a top surface to initially laminate the first and second substrates onto each other; and pressurizing the first and second substrates to be initially laminated in a vacuum state to laminate the first and second substrates to each other.
第一及第二基板之初步層壓可包含：對準第一基板以使第一基板被放置於第二基板上以對應第二基板；以及沿一圓弧形軌跡往第二基板輸送第一基板使第一基板及第二基板之頂面接觸於彼此。The preliminary lamination of the first and second substrates may include: aligning the first substrate such that the first substrate is placed on the second substrate to correspond to the second substrate; and transporting the first substrate along the circular arc track to the second substrate The substrate brings the top surfaces of the first substrate and the second substrate into contact with each other.
施壓給第一及第二基板以層壓第一及第二基板包含滾動接觸於彼此之第一及第二基板以層壓第一及第二基板。The first and second substrates are pressed to laminate the first and second substrates including the first and second substrates that are in rolling contact with each other to laminate the first and second substrates.
11‧‧‧第一基板11‧‧‧First substrate
12‧‧‧第二基板12‧‧‧second substrate
12a‧‧‧分離區12a‧‧‧Separation zone
12b‧‧‧接合區12b‧‧‧ junction area
100‧‧‧基板處理系統100‧‧‧Substrate processing system
111‧‧‧第一清潔單元111‧‧‧First cleaning unit
112‧‧‧第二清潔單元112‧‧‧Second cleaning unit
111a、112a、1311a‧‧‧輸送滾筒111a, 112a, 1311a‧‧‧ transport rollers
121‧‧‧第一輔助腔室121‧‧‧First auxiliary chamber
122‧‧‧第二輔助腔室122‧‧‧Second auxiliary chamber
123‧‧‧第三輔助腔室123‧‧‧ third auxiliary chamber
131‧‧‧第一腔室131‧‧‧First chamber
132‧‧‧第二腔室132‧‧‧Second chamber
133‧‧‧第三腔室133‧‧‧ third chamber
133a‧‧‧機械手臂133a‧‧‧ Robotic arm
1311‧‧‧對準單元1311‧‧‧Alignment unit
1311b‧‧‧偵測部分1311b‧‧‧Detection section
1312‧‧‧平台1312‧‧‧ platform
1313‧‧‧第一滾筒單元1313‧‧‧First roller unit
1314‧‧‧第一控制單元1314‧‧‧First Control Unit
1315‧‧‧第二控制單元1315‧‧‧Second Control Unit
1321‧‧‧輸送滾筒1321‧‧‧Conveyor roller
1322‧‧‧載運滾筒1322‧‧‧Loading roller
1323‧‧‧滾筒單元1323‧‧‧Roller unit
d‧‧‧距離D‧‧‧distance
S51、S52、S53‧‧‧步驟S51, S52, S53‧‧‧ steps
從以下實施例之敘述，配合所附圖式，這些以及/或其他態樣將會變得明顯及更容易地被領會，其中：These and/or other aspects will become apparent and more readily appreciated from the following description of the embodiments, in which:
第1A及1B圖為根據本發明實施例之第一及第二基板之示意圖；1A and 1B are schematic views of first and second substrates in accordance with an embodiment of the present invention;
第2圖為根據本發明實施例之基板處理系統之示意圖；2 is a schematic view of a substrate processing system according to an embodiment of the present invention;
第3圖為第2圖之第一清潔單元之圖；Figure 3 is a view of the first cleaning unit of Figure 2;
第4圖為第2圖之第二清潔單元之圖；Figure 4 is a view of the second cleaning unit of Figure 2;
第5圖為使用第2圖之基板處理系統之基板處理方法之流程圖；Figure 5 is a flow chart showing a substrate processing method using the substrate processing system of Figure 2;
第6圖為描繪第2圖之第一腔室之第一層壓設備之詳圖；Figure 6 is a detailed view of the first laminating apparatus depicting the first chamber of Figure 2;
第7A到7C圖為描繪驅動第2圖之第一腔室中之第一層壓設備的過程之圖。Figures 7A through 7C are diagrams depicting the process of driving the first laminating apparatus in the first chamber of Figure 2.
第8圖為描繪第2圖之第二腔室之第二層壓設備之詳圖；以及Figure 8 is a detailed view of a second laminating apparatus depicting the second chamber of Figure 2;
第9A及9B圖為描繪驅動第2圖之第二腔室中之第二層壓設備的過程之圖。Figures 9A and 9B are diagrams depicting the process of driving the second laminating apparatus in the second chamber of Figure 2.
因為本發明可有多樣的修改實施例，例示性實施例被繪製於圖式中。然而，這不限制本發明於特定實施例中以及應被了解的是，本發明涵蓋本發明之概念與技術範疇中之所有修改、等效應用及置換。在本發明之描述中，關於廣泛已知功能或配置之細節描述將被排除以免不必要地模糊本發明主旨。Since the invention is susceptible to various modifications, the illustrative embodiments are illustrated in the drawings. However, the invention is not limited to the specific embodiments, and it is understood that the invention covers all modifications, equivalent applications and permutations in the scope of the invention. In the description of the present invention, the detailed description of the widely known functions or configurations will be omitted to avoid unnecessarily obscuring the subject matter of the present invention.
其需被了解的是，雖然詞彙「第一(first)」、「第二(second)」被用於文中以描述各種元件，這些元 件不應被該類詞彙限制。該類詞彙只用來區別一部件與其他部件。It should be understood that although the terms "first" and "second" are used in the text to describe various elements, these elements should not be limited by such words. This type of vocabulary is only used to distinguish one component from another.
除非指出並非如此，否則單數形式之詞彙可包含複數形式。詞彙「包含(include)」、「包含(comprise)」、「包含(including)」及「包含(comprising)」如用於文中，指明特徵、形狀、操作、元件、部件或其組合，但並不排除其他特徵、形狀、操作、元件、部件或其組合。Unless otherwise stated, the singular forms of the singular can include the plural. The terms "include", "comprise", "including" and "comprising" are used in the context to identify features, shapes, operations, components, components or combinations thereof, but not Other features, shapes, operations, components, components, or combinations thereof are excluded.
在下文中，根據本發明實施例之基板處理系統及使用其之基板處理之方法將藉參照所附圖式詳細描述。在所附圖式之描述中，相同參照符號代表在各處之相同元件，且刪除重沓的解釋。在圖式中，層及區域之尺寸可為了清楚描述而誇大或縮減。在圖式中，層及區域之尺寸為了清楚描述而誇大。Hereinafter, a substrate processing system and a substrate processing method using the same according to embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the description of the drawings, the same reference numerals are used to refer to the In the drawings, the dimensions of layers and regions may be exaggerated or reduced for clarity. In the drawings, the dimensions of layers and regions are exaggerated for clarity of description.
如同文中使用，詞彙「以及/或(and/or)」包含一或多個相關所述項目之任何及所有組合。表示如「至少其中之一(at least one of)」，當先行於一列元件時，為修飾整列元件而非修飾列表中之個別元件。As used herein, the term "and/or" includes any and all combinations of one or more of the associated. Representation of "at least one of", when preceded by a list of elements, is intended to modify the entire list of elements rather than to modify individual elements in the list.
第1A及1B圖為根據本發明實施例之第一基板11及第二基板12之示意圖。第2圖為根據本發明實施例之基板處理系統100之示意圖。第3圖為第2圖之第一清潔單元111之圖。第4圖為第2圖之第二清潔單元112之圖。1A and 1B are schematic views of a first substrate 11 and a second substrate 12 according to an embodiment of the present invention. 2 is a schematic diagram of a substrate processing system 100 in accordance with an embodiment of the present invention. Fig. 3 is a view of the first cleaning unit 111 of Fig. 2. Fig. 4 is a view of the second cleaning unit 112 of Fig. 2.
根據本發明實施例之基板處理系統100為用於層壓具有小厚度之第一基板11及為載體基板之第二基板12之系統。The substrate processing system 100 according to an embodiment of the present invention is a system for laminating a first substrate 11 having a small thickness and a second substrate 12 being a carrier substrate.
在本說明書中，第一基板11可具有小厚度及被用作為顯示裝置之下基板。舉例來說，參照第1A及1B圖，第一基板11可為薄板玻璃。薄板玻璃可具有約數 ㎛ 到約500 ㎛ 之 厚度。也就是說，薄板玻璃可具有約1 ㎛ 到約100 ㎛ 之 厚度。當薄板玻璃具有約1 ㎛ 到約20 ㎛ 之 厚度，平板顯示裝置可為可折疊的。In the present specification, the first substrate 11 may have a small thickness and be used as a substrate under the display device. For example, referring to FIGS. 1A and 1B, the first substrate 11 may be a thin plate glass. The sheet glass may have a thickness of from about several μm to about 500 μm. That is, the thin plate glass may have a thickness of about 1 μm to about 100 μm. When the sheet glass has a thickness of from about 1 μm to about 20 μm, the flat panel display device may be foldable.
在本說明書中，第二基板12被用作為在製造顯示裝置於第一基板11上的流程中支持第一基板11之載體基板。舉例來說，參照第1B圖，第二基板12可為載體玻璃。載體玻璃包含接合區12b以及分離區12a在其頂面上。In the present specification, the second substrate 12 is used as a carrier substrate that supports the first substrate 11 in the flow of manufacturing the display device on the first substrate 11. For example, referring to FIG. 1B, the second substrate 12 can be a carrier glass. The carrier glass comprises a land 12b and a separation zone 12a on its top surface.
接合區12b環繞分離區12a並具有封閉形狀在載體玻璃之邊緣。接合區12b可為未經處理之裸玻璃。因此，當薄板玻璃層壓於接合區12b上以實行熱處理時，共價鍵形成在薄板玻璃與接合區12b間之介面。因此，薄板玻璃被固定於載體玻璃。The land 12b surrounds the separation zone 12a and has a closed shape at the edge of the carrier glass. The land 12b can be untreated bare glass. Therefore, when the thin plate glass is laminated on the joining portion 12b to carry out heat treatment, a covalent bond is formed between the thin plate glass and the joint portion 12b. Therefore, the thin plate glass is fixed to the carrier glass.
分離區12a在載體玻璃之中央部位上。舉例而言，分離區12a之表面可被蝕刻。或者，如同第1A圖中所示，金屬氧化物層可被設置於分離區12a之表面上。因此，雖然熱處理在薄板玻璃層壓於載體玻璃上之後實行，共價鍵不會形成在薄板玻璃與分離區12a間之介面。當顯示裝置形成於薄板玻璃上，且接著沿著接合區12b及分離區12a間之邊界切開以移除對應於分離區12a之部分薄板玻璃，而獲得平板顯示裝置。The separation zone 12a is on the central portion of the carrier glass. For example, the surface of the separation region 12a can be etched. Alternatively, as shown in FIG. 1A, a metal oxide layer may be disposed on the surface of the separation region 12a. Therefore, although the heat treatment is carried out after the thin glass is laminated on the carrier glass, the covalent bond is not formed in the interface between the thin glass and the separation region 12a. The flat panel display device is obtained when the display device is formed on the thin glass and then cut along the boundary between the land 12b and the separation region 12a to remove a portion of the thin glass corresponding to the separation region 12a.
根據本發明之實施例，第一及第二基板11及12不受限於上述結構。也就是說，第一及第二基板11及12各可以不同材料及結構實現。舉例來說，第一基板11可用 聚醯亞胺 製成之塑膠薄膜。According to an embodiment of the present invention, the first and second substrates 11 and 12 are not limited to the above structure. That is to say, the first and second substrates 11 and 12 can each be realized by different materials and structures. For example, the first substrate 11 may be a plastic film made of polyimide.
參照第2圖，根據本發明實施例之基板處理系統100有其中複數腔室連接於彼此之叢集結構。根據本發明實施例之基板處理系統100包含用以初步層壓第一及第二基板11及12之第一腔室131、用以施壓給及層壓第一及第二基板11及12之第二腔室132、包含用以輸送第一及第二基板11及12之機械手臂133a之第三腔室133、用以清潔第一基板11之第一清潔單元111、用以清潔第二基板12之第二清潔單元112、連接第一清潔單元111到第三腔室133之第一輔助腔室121、連接第二清潔單元112到第三腔室133之第二輔助腔室122、以及連接第二腔室132到外部之第三輔助腔室123。Referring to Fig. 2, a substrate processing system 100 in accordance with an embodiment of the present invention has a cluster structure in which a plurality of chambers are connected to each other. The substrate processing system 100 according to an embodiment of the present invention includes a first chamber 131 for preliminary laminating the first and second substrates 11 and 12 for applying and laminating the first and second substrates 11 and 12 a second chamber 132, a third chamber 133 including a robot arm 133a for transporting the first and second substrates 11 and 12, a first cleaning unit 111 for cleaning the first substrate 11, and a second substrate for cleaning a second cleaning unit 112 of 12, a first auxiliary chamber 121 connecting the first cleaning unit 111 to the third chamber 133, a second auxiliary chamber 122 connecting the second cleaning unit 112 to the third chamber 133, and a connection The second chamber 132 is to the outer third auxiliary chamber 123.
第一腔室131包含連接於第三腔室133之第一層壓設備以初步層壓第一及第二基板11及12。第一層壓設備初步層壓第一及第二基板11及12以對應第一及第二基板11及12。第一層壓設備之細節描述將提供在後。說明書中之初步層壓意味著第一基板11被設置在第二基板12之頂面之適合位置上以物理上接觸第二基板12。也就是說，第一基板11可對準並單純放置於第二基板12。然後，第一及第二基板11及12於其間之介面上未接合於彼此。第一腔室131維持在真空狀態以當第一及第二基板11及12接觸彼此時避免引入顆粒或雜質並降低第一層壓設備中之劣化。The first chamber 131 includes a first laminating apparatus coupled to the third chamber 133 to initially laminate the first and second substrates 11 and 12. The first laminating apparatus initially laminates the first and second substrates 11 and 12 to correspond to the first and second substrates 11 and 12. A detailed description of the first laminating apparatus will be provided later. The preliminary lamination in the specification means that the first substrate 11 is disposed at a suitable position on the top surface of the second substrate 12 to physically contact the second substrate 12. That is, the first substrate 11 can be aligned and simply placed on the second substrate 12. Then, the first and second substrates 11 and 12 are not bonded to each other at the interface therebetween. The first chamber 131 is maintained in a vacuum state to avoid introduction of particles or impurities and to reduce deterioration in the first laminating apparatus when the first and second substrates 11 and 12 are in contact with each other.
第二腔室132包含連接於第三腔室133之第二層壓設備及第三輔助腔室123以施壓給及層壓接觸於彼此之第一及第二基板11及12。第二層壓設備先後施壓給第一及第二基板11及12以接合第一及第二基板11及12。在此流程中，第一及第二基板11及12之間的氣阱可被移除。第二層壓設備之詳細結構會在之後描述。本說明書中之施壓及層壓意味著單純接觸彼此之第一及第二基板11及12接合於彼此。當第一及第二基板11及12被施壓及層壓於彼此上時，第一及第二基板11及12可藉由第一及第二基板11及12間介面之型態導致之凡得瓦力而不被簡單地分離。第二腔室132被維持在真空狀態以當第一及第二基板11及12接合彼此時避免引入顆粒或雜質並降低第二層壓設備中之劣化。The second chamber 132 includes a second laminating device and a third auxiliary chamber 123 connected to the third chamber 133 for applying pressure to and laminating the first and second substrates 11 and 12 contacting each other. The second laminating apparatus applies pressure to the first and second substrates 11 and 12 to bond the first and second substrates 11 and 12. In this flow, the gas trap between the first and second substrates 11 and 12 can be removed. The detailed structure of the second laminating apparatus will be described later. The pressing and laminating in the present specification means that the first and second substrates 11 and 12 which are in direct contact with each other are joined to each other. When the first and second substrates 11 and 12 are pressed and laminated on each other, the first and second substrates 11 and 12 can be caused by the type of the interface between the first and second substrates 11 and 12 Walsh is not simply separated. The second chamber 132 is maintained in a vacuum state to avoid introduction of particles or impurities and to reduce deterioration in the second lamination apparatus when the first and second substrates 11 and 12 are joined to each other.
因第二腔室132被維持在真空狀態，第二腔室132未直接地連接於有大氣壓力之外部，而是透過第三輔助腔室123連接於外部。第三輔助腔室 配置以調整壓力。Since the second chamber 132 is maintained in a vacuum state, the second chamber 132 is not directly connected to the outside of the atmospheric pressure, but is connected to the outside through the third auxiliary chamber 123. The third auxiliary chamber is configured to adjust the pressure.
第三腔室133可被連接於第一腔室131、第二腔室132、第一輔助腔室121以及第二輔助腔室122。因第三腔室133連接於第一腔室131及第二腔室132，第三腔室133維持在真空狀態。用於分別地從第一及第二輔助腔室121及122輸送第一及第二基板11及12進入第三腔室133以從第一腔室131輸送接觸彼此之第一及第二基板11及12進入第二腔室132之機械手臂133a被設置在第三腔室133中。機械手臂133a可具有適合輸送第一及第二基板11及12之形狀並依配置或驅動方法為各種修改。此外，因為機械手臂133a在先前以被廣泛了解，省略其詳細敘述。The third chamber 133 may be coupled to the first chamber 131, the second chamber 132, the first auxiliary chamber 121, and the second auxiliary chamber 122. Since the third chamber 133 is connected to the first chamber 131 and the second chamber 132, the third chamber 133 is maintained in a vacuum state. The first and second substrates 11 and 12 are respectively transported from the first and second auxiliary chambers 121 and 122 into the third chamber 133 to transport the first and second substrates 11 contacting each other from the first chamber 131. The robot arm 133a that enters the second chamber 132 and 12 is disposed in the third chamber 133. The robot arm 133a may have a shape suitable for conveying the first and second substrates 11 and 12 and various modifications depending on the configuration or driving method. Further, since the robot arm 133a has been widely known in the past, its detailed description is omitted.
第一清潔單元111透過第一輔助腔室121連接於第三腔室133。參照第3圖，第一清潔單元111清潔至少第一基板11之頂面。藉由通過第二腔室132，接合於彼此之第一及第二基板11及12於熱處理期間在其間的介面上共價地鍵結於彼此。因此，第一及第二基板11及12可更穩固地結合於彼此。第一及第二基板11及12之各頂面應有親水性。因此，第一基板11之頂面於第一清潔單位111中可有親水性。第一清潔單元111可包含用於給予第一基板11之頂面親水性之裝置。舉例來說，第一清潔單元111可透過噴水器或灑水器提供水、臭氧水或含氧水以清潔第一基板11。因為水具有如氫氧基(OH-)之親水基團，親水性可被給予第一基板11之表面。如果有機汙染物質或有機微粒存在於第一基板11之表面上，第一及第二基板11及12之間的接合可能被干擾。因此，物理清潔流程，舉例來說，使用刷子，可被額外地在第一清潔單元111實行。此外，給予第一基板11之表面之親水性因為水之蒸發，可隨時間經過而降低。因此，第一清潔單元111可與第一及第二腔室131及132連結成列。接觸第二基板12之第一基板11之表面應被清潔，以及此外，清潔表面之表面接觸不應發生在第一及第二基板接合於彼此前。因此，第一基板11以接觸第二基板12之第一基板11頂面向上的狀態置於第一清潔單元111之中。此外，第一基板11之頂面不應接觸除了第二基板12以外之其他部件。第一清潔單元111可維持在大氣壓。The first cleaning unit 111 is connected to the third chamber 133 through the first auxiliary chamber 121. Referring to FIG. 3, the first cleaning unit 111 cleans at least the top surface of the first substrate 11. By passing through the second chamber 132, the first and second substrates 11 and 12 bonded to each other are covalently bonded to each other at the interface therebetween during the heat treatment. Therefore, the first and second substrates 11 and 12 can be more firmly bonded to each other. The top surfaces of the first and second substrates 11 and 12 should be hydrophilic. Therefore, the top surface of the first substrate 11 may be hydrophilic in the first cleaning unit 111. The first cleaning unit 111 may include means for imparting hydrophilicity to the top surface of the first substrate 11. For example, the first cleaning unit 111 can supply water, ozone water or oxygenated water through the water sprayer or the sprinkler to clean the first substrate 11. Since water has a hydrophilic group such as a hydroxyl group (OH-), hydrophilicity can be imparted to the surface of the first substrate 11. If organic contaminants or organic particles are present on the surface of the first substrate 11, the bonding between the first and second substrates 11 and 12 may be disturbed. Therefore, the physical cleaning process, for example, using a brush, can be additionally performed at the first cleaning unit 111. Further, the hydrophilicity imparted to the surface of the first substrate 11 can be lowered as time elapses due to evaporation of water. Therefore, the first cleaning unit 111 can be coupled to the first and second chambers 131 and 132 in a row. The surface of the first substrate 11 contacting the second substrate 12 should be cleaned, and further, the surface contact of the cleaning surface should not occur before the first and second substrates are bonded to each other. Therefore, the first substrate 11 is placed in the first cleaning unit 111 in a state in which the top surface of the first substrate 11 contacting the second substrate 12 faces upward. Further, the top surface of the first substrate 11 should not contact other components than the second substrate 12. The first cleaning unit 111 can be maintained at atmospheric pressure.
因為第一清潔單元111維持在大氣壓，且將被連接到第一清潔單元111之第三腔室133維持在真空狀態，用於調整壓力之第一輔助腔室121可設置於第一清潔單元111與第三腔室133之間。Since the first cleaning unit 111 is maintained at atmospheric pressure, and the third chamber 133 to be connected to the first cleaning unit 111 is maintained in a vacuum state, the first auxiliary chamber 121 for adjusting the pressure may be disposed in the first cleaning unit 111. Between the third chamber 133 and the third chamber 133.
第二清潔單元112透過第二輔助腔室122連接於第三腔室133。參照第4圖，第二清潔單元112可與第一清潔單元111不同在於第二清潔單元112清潔至少第二基板12之頂面。第一清潔單元111清潔薄板玻璃，而第二清潔單元清潔厚度大於薄板玻璃之載體玻璃。因此，相較於設置在第二清潔單元112中之複數輸送滾筒112a之安排，設置在第一清潔單元111中之複數輸送滾筒111a可被密集地安排，以避免薄板玻璃於輸送時受損。因為第二清潔單元112之其他組成、型態及作用實質上與第一清潔單元111相同，省略其重複描述。The second cleaning unit 112 is connected to the third chamber 133 through the second auxiliary chamber 122. Referring to FIG. 4, the second cleaning unit 112 may be different from the first cleaning unit 111 in that the second cleaning unit 112 cleans at least the top surface of the second substrate 12. The first cleaning unit 111 cleans the thin glass, and the second cleaning unit cleans the carrier glass with a thickness greater than that of the thin glass. Therefore, the plurality of conveying rollers 111a disposed in the first cleaning unit 111 can be densely arranged as compared with the arrangement of the plurality of conveying rollers 112a disposed in the second cleaning unit 112 to prevent the sheet glass from being damaged during transportation. Since the other compositions, patterns, and effects of the second cleaning unit 112 are substantially the same as those of the first cleaning unit 111, repeated description thereof will be omitted.
因為第二清潔單元112維持在大氣壓，且將連結第二清潔單元112之第三腔室133維持在真空狀態，用於調整壓力之第二輔助腔室122可設置在第二清潔單元112與第三腔室133之間。Because the second cleaning unit 112 is maintained at atmospheric pressure, and the third chamber 133 connecting the second cleaning unit 112 is maintained in a vacuum state, the second auxiliary chamber 122 for adjusting the pressure may be disposed in the second cleaning unit 112 and the second Between the three chambers 133.
第5圖為使用第2圖之基板處理系統100之基板處理方法之流程圖。使用第2圖之基板處理系統100之基板處理方法隨著參照第5圖被概略地描述。Fig. 5 is a flow chart showing a substrate processing method using the substrate processing system 100 of Fig. 2. The substrate processing method using the substrate processing system 100 of Fig. 2 is roughly described with reference to Fig. 5.
首先，第一及第二基板11及12分別地被置入第一及第二清潔單元111及112以在大氣壓下實行清潔過程(步驟S51)。在此過程中，第一基板11之頂面可有親水性，以及此外，第二基板12之頂面可有親水性。First, the first and second substrates 11 and 12 are placed in the first and second cleaning units 111 and 112, respectively, to perform a cleaning process at atmospheric pressure (step S51). In this process, the top surface of the first substrate 11 may be hydrophilic, and further, the top surface of the second substrate 12 may be hydrophilic.
清潔之第一及第二基板11及12分別地被納入第一及第二輔助腔室121及122。The cleaned first and second substrates 11 and 12 are incorporated into the first and second auxiliary chambers 121 and 122, respectively.
設置於第三腔室133中之機械手臂133a同時地或先後地輸送清潔之第一及第二基板11及12進入第一腔室131。第一基板11在真空狀態下以第一基板11之頂面向上之狀態對準於第二基板12。此處，第一基板11可設置於第二基板12上。當第一基板11之頂面沿著圓弧形軌跡從面朝上變面朝下被倒置時，第一基板11之頂面可接觸第二基板12之頂面。因此，第一及第二基板11及12可初步層壓於彼此(步驟S52)。The robot arm 133a disposed in the third chamber 133 simultaneously or sequentially transports the cleaned first and second substrates 11 and 12 into the first chamber 131. The first substrate 11 is aligned with the second substrate 12 in a vacuum state with the top surface of the first substrate 11 facing upward. Here, the first substrate 11 may be disposed on the second substrate 12. When the top surface of the first substrate 11 is inverted downward from the face-up side along the circular arc track, the top surface of the first substrate 11 may contact the top surface of the second substrate 12. Therefore, the first and second substrates 11 and 12 can be initially laminated to each other (step S52).
接觸彼此之第一及第二基板11及12透過機械手臂133a被輸送進第二腔室132。The first and second substrates 11 and 12 that are in contact with each other are transported into the second chamber 132 through the robot arm 133a.
第一及第二基板11及12可於輸送方向透過滾動方法先後地被施壓並因此接合於彼此。因此，第一及第二基板11及12可被施壓-層壓(press-laminated)在彼此上(步驟S53)。The first and second substrates 11 and 12 can be sequentially pressed and thus joined to each other in the conveying direction by a rolling method. Therefore, the first and second substrates 11 and 12 can be press-laminated on each other (step S53).
接合於彼此之第一及第二基板11及12，被連續地輸送進第三輔助腔室123然後被送出第三輔助腔室123。The first and second substrates 11 and 12 joined to each other are continuously fed into the third auxiliary chamber 123 and then sent out of the third auxiliary chamber 123.
第6圖為描繪第2圖之第一腔室131之第一層壓設備之詳圖。第7A到7C圖為描繪驅動第2圖之第一腔室131中之第一層壓設備的過程之圖。在下文中，第一層壓設備之結構及驅動方法將藉參照第6到7C圖被詳細描述。Figure 6 is a detailed view of the first laminating apparatus depicting the first chamber 131 of Figure 2. 7A to 7C are views depicting a process of driving the first laminating apparatus in the first chamber 131 of Fig. 2. Hereinafter, the structure and driving method of the first laminating apparatus will be described in detail with reference to Figs. 6 to 7C.
第一層壓設備可為用於實行第一及第二基板11及12之初步層壓之設備。也就是說，第一層壓設備將第一及第二基板11及12彼此對齊以單純地使第一及第二基板11及12接觸彼此。第一層壓設備包含第二基板12設置於其上之平台1312、對準單元1311、控制對準單元1311之第一控制單元1314以及控制第一滾筒單元1313及平台1312之第二控制單元1315。The first laminating apparatus may be an apparatus for performing preliminary lamination of the first and second substrates 11 and 12. That is, the first laminating apparatus aligns the first and second substrates 11 and 12 with each other to simply bring the first and second substrates 11 and 12 into contact with each other. The first laminating apparatus includes a platform 1312 on which the second substrate 12 is disposed, an alignment unit 1311, a first control unit 1314 that controls the alignment unit 1311, and a second control unit 1315 that controls the first roller unit 1313 and the platform 1312. .
於實行初步層壓時，平台1312可提供第二基板12設置於其上之位置。平台1312可有平坦頂面。此外，平台1312可以至少在第一滾筒單元1313之旋轉方向及相反於旋轉方向之方向線性地移動。平台1312可藉由螺釘或直線導軌線性地移動。舉例來說，透過能達到的精確位置控制之線性導軌可用於平台1312之移動。當實行初步層壓時，平台1312被設置在第一滾動單元1313下。The platform 1312 can provide a location on which the second substrate 12 is disposed during the initial lamination. The platform 1312 can have a flat top surface. Further, the platform 1312 can be linearly moved at least in the direction of rotation of the first roller unit 1313 and in the direction opposite to the direction of rotation. The platform 1312 can be linearly moved by screws or linear guides. For example, a linear guide that is controlled by precise position can be used for movement of the platform 1312. When preliminary lamination is performed, the stage 1312 is disposed under the first rolling unit 1313.
對準單元1311可在第一控制單元1314的控制下對準第一及第二基板11及12於彼此。細節上，對準單元1311可包含複數個輸送滾筒1311a以及偵測部分1311b。對準單元1311被設置於第一滾筒單元1313上。The aligning unit 1311 can align the first and second substrates 11 and 12 with each other under the control of the first control unit 1314. In detail, the aligning unit 1311 may include a plurality of conveying rollers 1311a and a detecting portion 1311b. The alignment unit 1311 is disposed on the first roller unit 1313.
複數個輸送滾筒1311a可輸送從機械手臂133a傳輸之第一基板11至第一滾筒單元1313。偵測部分1311b設置在各複數個輸送滾筒1311a之端點上，也就是說，鄰接於第一滾筒單元1313之各複數個輸送滾筒1311a之邊緣。然而，本發明並不受限於偵測部分1311b之位置。舉例來說，偵測部分1311b可沿輸送滾筒1311a之安排方向線性地設置。A plurality of transport rollers 1311a can transport the first substrate 11 transported from the robot arm 133a to the first roller unit 1313. The detecting portion 1311b is disposed at the end of each of the plurality of conveying rollers 1311a, that is, adjacent to the edges of the plurality of conveying rollers 1311a of the first roller unit 1313. However, the present invention is not limited to the position of the detecting portion 1311b. For example, the detecting portion 1311b can be linearly arranged along the arrangement direction of the conveying drum 1311a.
偵測部分1311b偵測第一基板11與第二基板12之對準。舉例來說，偵測部分1311b可包含攝影機、紅外線感應器、光學感應器等等。偵測部分1311b可判定從輸送滾筒1311a輸送之第一基板11是否被二維地扭曲或發生多少扭曲。舉例來說，偵測部分1311b可比較第一基板11之位置值與第一基板11之設定理想位置值以判定第一基板11實際上扭曲了多少。The detecting portion 1311b detects the alignment of the first substrate 11 and the second substrate 12. For example, the detecting portion 1311b may include a camera, an infrared sensor, an optical sensor, and the like. The detecting portion 1311b can determine whether the first substrate 11 conveyed from the transport roller 1311a is two-dimensionally twisted or how much distortion occurs. For example, the detecting portion 1311b can compare the position value of the first substrate 11 with the set ideal position value of the first substrate 11 to determine how much the first substrate 11 is actually distorted.
參照回第1A圖，第一基板11可完全地覆蓋設置於第二基板12之中央部位之分離區12a並接觸接合區12b。因此，當第一基板11以第一基板11被二維地扭曲的狀態設置於第二基板12上時，分離區12a可被暴露於外部導致第一及第二基板11及12間接合的問題。因此，其可能難以保證產品可靠性。此外，就第一層壓設備而言，第一基板11以第一基板11之頂面向上的狀態輸送，以最小化設備空間。然後，第一基板11之頂面被倒置以面朝下，從而接觸第二基板12。以此方式，因為在輸送第一基板11期間不可能修正第一基板11之扭曲，可能需要透過使用對準單元1311以對準第一及第二基板11及12於彼此之過程。Referring back to FIG. 1A, the first substrate 11 can completely cover the separation region 12a disposed at the central portion of the second substrate 12 and contact the bonding region 12b. Therefore, when the first substrate 11 is disposed on the second substrate 12 in a state in which the first substrate 11 is two-dimensionally twisted, the separation region 12a can be exposed to the outside to cause a problem of bonding between the first and second substrates 11 and 12. . Therefore, it may be difficult to ensure product reliability. Further, in the case of the first laminating apparatus, the first substrate 11 is conveyed in a state in which the top surface of the first substrate 11 faces upward to minimize the space of the apparatus. Then, the top surface of the first substrate 11 is inverted to face downward, thereby contacting the second substrate 12. In this manner, since it is impossible to correct the distortion of the first substrate 11 during the conveyance of the first substrate 11, it may be necessary to align the first and second substrates 11 and 12 with each other by using the alignment unit 1311.
當第一基板11之二維扭曲未被偵測部分1311b偵測到時，第一基板11就這樣被供給到第一滾筒單元1313。然而，當第一基板11之二維扭曲被偵測部分1311b偵測到時，第一控制單元1314可調整位置，舉例來說，輸送滾筒1311a之平角，以修正第一基板11之扭曲。為此，複數個輸送滾筒可以平角個別地調整。舉例而言，角度調整單元可被提供在各輸送滾筒1311a上以調整各輸送滾筒1311a之平角。因為機械裝置如角度調整單元在先前已被廣泛了解，省略其細節描述。然而，本發明之實施例不限於此。舉例來說，第一基板11之扭曲可透過分離的修正裝置，如機械手臂133a，直接修正。When the two-dimensional distortion of the first substrate 11 is not detected by the detecting portion 1311b, the first substrate 11 is thus supplied to the first roller unit 1313. However, when the two-dimensional distortion of the first substrate 11 is detected by the detecting portion 1311b, the first control unit 1314 can adjust the position, for example, the flat angle of the transport roller 1311a, to correct the distortion of the first substrate 11. To this end, a plurality of transport rollers can be individually adjusted at a flat angle. For example, an angle adjustment unit may be provided on each of the transport rollers 1311a to adjust the flat angle of each of the transport rollers 1311a. Since a mechanical device such as an angle adjustment unit has been widely known before, a detailed description thereof will be omitted. However, embodiments of the invention are not limited thereto. For example, the distortion of the first substrate 11 can be directly corrected by a separate correction device, such as the robot arm 133a.
靜電可被施加於第一滾筒單元1313之外圍面以透過使用電吸引力輸送第一基板11。舉例來說，第一滾筒單元1313可為靜電放電(electrostatic discharge, ESD)滾筒。第一滾筒單元1313可沿其外圍面輸送自對準單元1311輸送之第一基板11以接觸在平台1312上之第二基板12。第一滾筒單元1313以與設置於對準單元1311中之各輸送滾筒1311a之旋轉方向相同方向旋轉。第二控制單元1315可根據第一滾筒單元1313之外圍面之位置控制靜電之施加。舉例來說，當第一基板11從對準單元1311接觸第一滾筒單元1313時，靜電被施加。當第一基板11被輸送時，靜電被施加到接觸第一基板11之第一滾筒單元1313之整個外圍面。此外，當第一及第二基板11及12接觸彼此時，靜電未被施加於第一滾筒單元1313之外圍面所以第一基板11從第一滾筒單元1313分離以接觸第二基板12。如上所述，第二控制單元1315可根據第一基板11之接觸狀態控制到第一滾筒單元1313之外圍面之靜電施加。Static electricity can be applied to the peripheral surface of the first roller unit 1313 to convey the first substrate 11 by using the electric attraction force. For example, the first roller unit 1313 can be an electrostatic discharge (ESD) roller. The first roller unit 1313 can convey the first substrate 11 conveyed from the alignment unit 1311 along its peripheral surface to contact the second substrate 12 on the stage 1312. The first roller unit 1313 rotates in the same direction as the rotation direction of each of the transport rollers 1311a provided in the aligning unit 1311. The second control unit 1315 can control the application of static electricity according to the position of the peripheral surface of the first roller unit 1313. For example, when the first substrate 11 contacts the first roller unit 1313 from the alignment unit 1311, static electricity is applied. When the first substrate 11 is conveyed, static electricity is applied to the entire peripheral surface of the first roller unit 1313 contacting the first substrate 11. Further, when the first and second substrates 11 and 12 are in contact with each other, static electricity is not applied to the peripheral surface of the first roller unit 1313, so the first substrate 11 is separated from the first roller unit 1313 to contact the second substrate 12. As described above, the second control unit 1315 can control the electrostatic application to the peripheral surface of the first roller unit 1313 in accordance with the contact state of the first substrate 11.
第二控制單元1315可根據第一滾筒單元1313之旋轉速率控制平台1312之位置。當第一滾筒單元1313旋轉以允許第一基板11接觸第二基板12時，第二控制單元1315可根據第一滾筒單元1313之旋轉方向及速率移動平台1312。結果，整個第一基板11可先後地接觸第二基板12。The second control unit 1315 can control the position of the platform 1312 according to the rotation rate of the first roller unit 1313. When the first roller unit 1313 rotates to allow the first substrate 11 to contact the second substrate 12, the second control unit 1315 can move the stage 1312 according to the rotational direction and rate of the first roller unit 1313. As a result, the entire first substrate 11 can sequentially contact the second substrate 12.
第一滾筒單元1313可執行用於往第二基板12之上側輸送第一基板11之簡單功能以及可不施壓給接觸彼此之第一及第二基板11及12。因此，第一滾筒單元1313之表面可用堅硬材料製成。此外，第一滾筒單元1313及平台1312可以等於或大於相對應之第一及第二基板11及12之厚度總和之距離d在空間上彼此相距。也就是說，第一滾筒單元1313及平台1312可以對應第一及第二基板11及12之厚度總和之距離d在空間上彼此相距，因第一滾筒單元1313不施壓給第一及第二基板11及12，如果第一滾筒單元1313以大於第一及第二基板11及12之厚度總和之距離平台1312空間上相距，第一滾筒單元1313可為可操作的。The first roller unit 1313 can perform a simple function of transporting the first substrate 11 toward the upper side of the second substrate 12 and can apply pressure to the first and second substrates 11 and 12 contacting each other. Therefore, the surface of the first roller unit 1313 can be made of a hard material. In addition, the first roller unit 1313 and the platform 1312 may be spatially apart from each other by a distance d equal to or greater than a sum of thicknesses of the corresponding first and second substrates 11 and 12. That is, the first roller unit 1313 and the platform 1312 can be spatially separated from each other by the distance d corresponding to the sum of the thicknesses of the first and second substrates 11 and 12, because the first roller unit 1313 does not apply pressure to the first and second The first roller unit 1313 can be operable if the first roller unit 1313 is spatially spaced apart from the platform 1312 by a distance greater than the sum of the thicknesses of the first and second substrates 11 and 12.
參照第7A圖，從第三腔室133之機械手臂133a輸送之第一基板11被設置於對準單元1311之輸送滾筒1311a上，以及第二基板12被設置於平台1312上。此處，第一基板11被設置於第二基板12上，因為第一基板11透過第一滾筒單元1313被放置於第二基板12上。Referring to FIG. 7A, the first substrate 11 transported from the robot arm 133a of the third chamber 133 is disposed on the transport roller 1311a of the aligning unit 1311, and the second substrate 12 is disposed on the platform 1312. Here, the first substrate 11 is disposed on the second substrate 12 because the first substrate 11 is placed on the second substrate 12 through the first roller unit 1313.
第一基板11在對準單元1311與第二基板12對準。細節上，當第一基板11沿輸送滾筒1311a輸送時，第一基板之二維扭曲藉由偵測部分1311b偵測。此處，如果發生第一基板11之扭曲，第一基板11之扭曲可被修正。The first substrate 11 is aligned with the second substrate 12 at the alignment unit 1311. In detail, when the first substrate 11 is transported along the transport roller 1311a, the two-dimensional distortion of the first substrate is detected by the detecting portion 1311b. Here, if the distortion of the first substrate 11 occurs, the distortion of the first substrate 11 can be corrected.
參照第7B圖，當對準之第一基板11先後地接觸以一方向旋轉之第一滾筒單元1313，靜電可被先後地施加給第一滾筒單元1313之外圍面。因此，第一基板11沿圓弧形軌跡在第一滾筒單元1313之外圍面上往第二基板輸送。Referring to FIG. 7B, when the aligned first substrate 11 sequentially contacts the first roller unit 1313 which is rotated in one direction, static electricity can be sequentially applied to the peripheral faces of the first roller unit 1313. Therefore, the first substrate 11 is transported toward the second substrate on the peripheral surface of the first roller unit 1313 along the circular arc-shaped trajectory.
參照第7C圖，當對準之第一基板11先後地接觸第二基板12，可停止對第一滾筒單元1313外圍面靜電之施加。同時地，支撐第二基板12之平台1312可以第一滾筒單元1313之旋轉方向移動。此處，平台1312之移動速率及第一滾筒單元1313之旋轉速率可彼此聯動。因此，第一及第二基板11及12可先後地接觸彼此。Referring to FIG. 7C, when the aligned first substrate 11 sequentially contacts the second substrate 12, the application of static electricity to the peripheral surface of the first roller unit 1313 can be stopped. Simultaneously, the platform 1312 supporting the second substrate 12 can be moved in the rotational direction of the first roller unit 1313. Here, the moving speed of the stage 1312 and the rotation rate of the first roller unit 1313 may be interlocked with each other. Therefore, the first and second substrates 11 and 12 can sequentially contact each other.
根據本發明之實施例，第一基板11可以第一基板11之親水面朝上的狀態對準。然後第一基板11之親水面可被倒置以面向下側，沿圓弧形軌跡去接觸第二基板12之親水面。在上述方法中，在起始階段，第一基板11被設置在第二基板12上。因此，相較於比較實施例，上述方法可為更穩定，因為第一基板11之親水面被倒置以接觸第二基板12之親水面。因此，可避免第一基板11之損傷。此外，相較於比較實施例，因用於倒置第一基板11所需之空間相對較小，設備體積可被最小化。According to an embodiment of the present invention, the first substrate 11 may be aligned in a state in which the hydrophilic surface of the first substrate 11 faces upward. Then, the hydrophilic surface of the first substrate 11 can be inverted to face the lower side, and the hydrophilic surface of the second substrate 12 is contacted along the circular arc track. In the above method, the first substrate 11 is disposed on the second substrate 12 at the initial stage. Therefore, the above method can be more stable than the comparative embodiment because the hydrophilic surface of the first substrate 11 is inverted to contact the hydrophilic surface of the second substrate 12. Therefore, damage of the first substrate 11 can be avoided. Further, compared to the comparative embodiment, since the space required for inverting the first substrate 11 is relatively small, the apparatus volume can be minimized.
第8圖為描繪第二腔室132之第二層壓設備之詳圖。第9A及9B圖為描繪驅動第2圖之第二腔室中之第二層壓設備的過程之圖。在下文中，第二層壓設備之結構及驅動方法藉參照第8到9B圖描述。Figure 8 is a detailed view depicting the second lamination apparatus of the second chamber 132. Figures 9A and 9B are diagrams depicting the process of driving the second laminating apparatus in the second chamber of Figure 2. Hereinafter, the structure and driving method of the second laminating apparatus will be described with reference to Figs. 8 to 9B.
第二層壓設備可為用於接合接觸彼此之第一及第二基板11及12之設備。也就是說，第二層壓設備施壓給接觸彼此之第一及第二基板11及12，透過使用滾動方法以層壓第一及第二基板11及12。第二層壓設備包含施壓給第一及第二基板11及12以接合第一基板11到第二基板12之滾筒單元1323，以及分別設置於滾筒單元1323之前端及後端之第一及第二輸送單元。The second lamination apparatus can be a device for engaging the first and second substrates 11 and 12 that contact each other. That is, the second laminating apparatus applies pressure to the first and second substrates 11 and 12 contacting each other by laminating the first and second substrates 11 and 12 by using a rolling method. The second laminating apparatus includes a roller unit 1323 that applies pressure to the first and second substrates 11 and 12 to join the first substrate 11 to the second substrate 12, and a first and a rear end respectively disposed on the roller unit 1323 and Second delivery unit.
滾筒單元1323可為透過使用滾動方法施壓給二基板之單元。滾筒單元1323可包含至少二上與下滾筒。滾筒單元1323可具有以如 胺甲酸乙酯 、橡膠等等之軟性材料製成之外圍面。因此，雖然第一基板11透過滾筒單元1323被施壓及接合，第一基板11之損傷可被避免。在其中兩基板透過滾筒單元1323接合於彼此之方法中，因兩基板透過線接觸先後地被接合，兩基板之間的氣阱可被移除。The roller unit 1323 may be a unit that applies pressure to the two substrates by using a rolling method. The drum unit 1323 may include at least two upper and lower rollers. The roller unit 1323 may have a peripheral surface made of a soft material such as urethane, rubber or the like. Therefore, although the first substrate 11 is pressed and joined through the roller unit 1323, damage of the first substrate 11 can be avoided. In the method in which the two substrates are bonded to each other through the roller unit 1323, since the two substrates are successively joined by the line contact, the air trap between the two substrates can be removed.
第一及第二基板11及12彼此可有不同厚度、表面狀態以及被施壓時之壓力分佈。此外，由於基板具有分離區12a及接合區12b，將接合於彼此之兩基板之部分可為不均勻。因此，當兩基板透過使用滾筒單元1323施壓及接合時，可能發生第一基板11或第一及第二基板11及12之彎曲或翹曲。如果顯示裝置形成於彎曲的第一基板11上，則可能發生圖樣形成錯誤以劣化顯示裝置之可靠性。要解決上述限制，根據本發明之實施例，可提供第一及第二輸送單元。The first and second substrates 11 and 12 may have different thicknesses, surface states, and pressure distributions when pressed. Further, since the substrate has the separation region 12a and the bonding region 12b, portions of the substrates bonded to each other may be uneven. Therefore, when the two substrates are pressed and joined by the roller unit 1323, bending or warping of the first substrate 11 or the first and second substrates 11 and 12 may occur. If the display device is formed on the curved first substrate 11, pattern formation errors may occur to deteriorate the reliability of the display device. To address the above limitations, in accordance with embodiments of the present invention, first and second delivery units may be provided.
第一輸送單元包含複數個輸送滾筒1321以輸送接觸彼此之第一及第二基板11及12到滾筒單元1323。第二輸送單元包含複數個載運滾筒1322以載運過滾筒單元1323接合於彼此之第一及第二基板11及12到第三輔助腔室123。各複數個輸送及載運滾筒1321及1322可根據第一及第二基板11及12之彎曲及翹曲設置高度。也就是說，各輸送滾筒1321及載運滾筒1322可設定高度以抵消第一及第二基板11及12之彎曲及翹曲。The first conveying unit includes a plurality of conveying rollers 1321 to convey the first and second substrates 11 and 12 contacting each other to the drum unit 1323. The second transport unit includes a plurality of carrier rollers 1322 for carrying the first and second substrates 11 and 12 to the third auxiliary chamber 123 that are coupled to each other by the roller unit 1323. Each of the plurality of transport and carrying rollers 1321 and 1322 can be set in height according to the bending and warping of the first and second substrates 11 and 12. That is, each of the transport rollers 1321 and the transport roller 1322 can be set in height to cancel the bending and warpage of the first and second substrates 11 and 12.
根據本發明之實施例，複數輸送及載運滾筒1321及1322之高度可設定如下：初步層壓於彼此上之第一及第二基板11及12之彎曲或翹曲程度可透過厚度、表面狀態、被施壓時壓力分佈以及透過滾筒單元1323施加於各第一及第二基板11及12之壓力的整體考量而決定。彎曲或翹曲程度可透過模擬或複數個實驗推測。此外，輸送及載運滾筒1321及1322可事先地設定以抵消彎曲或翹曲。也就是說，在層壓過程實行前，可先設定第一及第二輸送單元。According to an embodiment of the present invention, the heights of the plurality of transport and carrying rollers 1321 and 1322 can be set as follows: the degree of bending or warpage of the first and second substrates 11 and 12 which are initially laminated on each other, the thickness, the surface state, The pressure distribution at the time of pressing and the overall consideration of the pressure applied to each of the first and second substrates 11 and 12 by the roller unit 1323 are determined. The degree of bending or warping can be inferred by simulation or a number of experiments. Further, the conveying and carrying rollers 1321 and 1322 can be set in advance to cancel the bending or warping. That is to say, the first and second conveying units can be set before the lamination process is carried out.
舉例來說，參照第9A圖，如果假設通過第一輸送單元之第一及第二基板11及12未近乎彎曲或翹曲，第一輸送單元之輸送滾筒1321可被設置為平行於滾筒單元1323。然而，對於透過通過滾筒單元1323而接合於彼此之第一及第二基板11及12之情形來說，如果假設發生朝向第一基板11之彎曲，參照第9B圖，第二輸送單元之載運滾筒1322可被設置向下傾斜以透過重力抵消彎曲。然而，這僅是範例，以及因此，可根據基板之狀態及滾動之程度採取各種應用。For example, referring to FIG. 9A, if it is assumed that the first and second substrates 11 and 12 passing through the first transport unit are not nearly bent or warped, the transport roller 1321 of the first transport unit may be disposed parallel to the drum unit 1323. . However, in the case of the first and second substrates 11 and 12 joined to each other through the roller unit 1323, if it is assumed that the bending toward the first substrate 11 occurs, referring to FIG. 9B, the carrier roller of the second conveying unit The 1322 can be set to tilt downward to counteract bending by gravity. However, this is merely an example, and thus, various applications can be taken depending on the state of the substrate and the degree of rolling.
操作第8圖之第二層壓設備之方法將被簡單描述。The method of operating the second laminating apparatus of Fig. 8 will be briefly described.
首先，接觸彼此之第一及第二基板11及12透過機械手臂133a從第一腔室131被輸送到第二腔室132。第一及第二基板11及12透過第一輸送單元被輸送到滾筒單元1323。First, the first and second substrates 11 and 12 contacting each other are transported from the first chamber 131 to the second chamber 132 through the robot arm 133a. The first and second substrates 11 and 12 are conveyed to the drum unit 1323 through the first conveying unit.
當通過滾筒單元1323時，第一及第二基板11及12可先後以線接觸方法滾動，然後層壓及接合於彼此。此處，兩基板間之氣阱可被移除。因第一及第二基板11及12在第一腔室131中預先對準於彼此，在第二腔室132中可不發生兩基板間之未對準。When passing through the roller unit 1323, the first and second substrates 11 and 12 may be sequentially rolled in a line contact method, then laminated and joined to each other. Here, the gas trap between the two substrates can be removed. Since the first and second substrates 11 and 12 are pre-aligned with each other in the first chamber 131, misalignment between the two substrates may not occur in the second chamber 132.
接合於彼此之第一及第二基板11及12可透過第二輸送單元被輸送進第三輔助腔室123，然後，可實行下一個過程。The first and second substrates 11 and 12 joined to each other can be transported into the third auxiliary chamber 123 through the second transport unit, and then the next process can be carried out.
在根據本發明實施例之基板處理系統100及使用其之基板處理方法中，當顯示裝置於第一及第二基板11及12接合於彼此後形成於第一基板11上，氣阱可不發生在第一及第二基板11及12之間以避免第一基板11被彎曲或翹曲，從而提升可靠性。In the substrate processing system 100 and the substrate processing method using the same according to the embodiment of the present invention, when the display device is formed on the first substrate 11 after the first and second substrates 11 and 12 are bonded to each other, the gas trap may not occur in the substrate processing method 100. The first and second substrates 11 and 12 are prevented from being bent or warped, thereby improving reliability.
第一及第二層壓設備可獨立於基板處理系統100使用。此外，第一及第二層壓設備可彼此一同或單獨地使用。The first and second lamination devices can be used independently of the substrate processing system 100. Furthermore, the first and second laminating devices can be used together or separately from one another.
根據本發明之實施例，薄板玻璃及載體玻璃可容易地被對準於彼此。此外，當薄板玻璃及載體玻璃層壓於彼此時，可不發生氣阱。另外，薄板玻璃及載體玻璃可根據兩玻璃之彎曲程度層壓。According to an embodiment of the invention, the sheet glass and the carrier glass can be easily aligned to each other. Further, when the thin plate glass and the carrier glass are laminated to each other, the air trap may not occur. In addition, the thin glass and the carrier glass can be laminated according to the degree of bending of the two glasses.
需被了解的是，本文中所述之例示性實施例應被認為僅係描述之意思且並不用於限制。各實施例中特徵或態樣之描述應典型地被認為通用於其他實施例中之其他相似特徵或態樣。雖然本發明之一或多個實施例已參照圖式而描述，所屬領域中一般技術人員將了解的是，可對其進行各種形式上或細節上的變化而不偏離如以下發明申請專利範圍所定義之本發明之精神與範疇。It is to be understood that the illustrative embodiments described herein are to be considered as illustrative and not limiting. Descriptions of features or aspects of the various embodiments are typically considered to be common to other similar features or aspects in other embodiments. Although one or more embodiments of the present invention have been described with reference to the drawings, it will be understood by those of ordinary skill in the art The spirit and scope of the invention is defined.
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11‧‧‧第一基板 11‧‧‧First substrate
12‧‧‧第二基板 12‧‧‧second substrate
131‧‧‧第一腔室 131‧‧‧First chamber
133a‧‧‧機械手臂 133a‧‧‧ Robotic arm
1311‧‧‧對準單元 1311‧‧‧Alignment unit
1311a‧‧‧輸送滾筒 1311a‧‧‧Conveyor roller
1311b‧‧‧偵測部分 1311b‧‧‧Detection section
1312‧‧‧平台 1312‧‧‧ platform
1313‧‧‧第一滾筒單元 1313‧‧‧First roller unit
1314‧‧‧第一控制單元 1314‧‧‧First Control Unit
1315‧‧‧第二控制單元 1315‧‧‧Second Control Unit
d‧‧‧距離 D‧‧‧distance
Claims (19)
一第一腔室，其包含其中一第一基板對應於一第二基板，以使該第一基板與該第二基板接觸於彼此，從而初步層壓該第一基板及該第二基板之一第一層壓構件；
一第二腔室，其包含其中被初步層壓之該第一基板及該第二基板被施壓及層壓在彼此上之一第二層壓構件；以及
一第三腔室，其包含輸送該第一基板及該第二基板之一機械手臂，該第三腔室連結於該第一腔室及該第二腔室。A substrate processing system comprising:
a first chamber, wherein the first substrate corresponds to a second substrate, so that the first substrate and the second substrate are in contact with each other, thereby initially laminating one of the first substrate and the second substrate First laminate member;
a second chamber comprising a first laminate substrate in which the first substrate and the second substrate are initially laminated and a second laminate member pressed and laminated on each other; and a third chamber containing the conveyance One of the first substrate and the second substrate, the third chamber is coupled to the first chamber and the second chamber.
一第一清潔單元，其清潔至少該第一基板之一頂面，該第一清潔單元連接於該第三腔室；以及
一第二清潔單元，其清潔至少該第二基板之一頂面，該第二清潔單元連接於該第三腔室。The substrate processing system of claim 1, further comprising:
a first cleaning unit that cleans at least one top surface of the first substrate, the first cleaning unit is coupled to the third chamber, and a second cleaning unit that cleans at least one of the top surfaces of the second substrate, The second cleaning unit is coupled to the third chamber.
該第二清潔單元包含以該第三腔室之方向輸送該第二基板之複數個輸送滾筒，以及
該第一清潔單元之該複數個輸送滾筒之間的距離小於該第二清潔單元之該複數個輸送滾筒之間的距離。The substrate processing system of claim 2, wherein the first cleaning unit comprises a plurality of conveying rollers conveying the first substrate in a direction of the third chamber,
The second cleaning unit includes a plurality of conveying rollers conveying the second substrate in a direction of the third chamber, and a distance between the plurality of conveying rollers of the first cleaning unit is less than the plural of the second cleaning unit The distance between the conveyor rollers.
該第一腔室到該第三腔室各維持在真空狀態，以及
用於調整壓力之一第一輔助腔室放置於該第一清潔單元與該第三腔室間，以及用於調整壓力之一第二輔助腔室放置於該第二清潔單元與該第三腔室間。The substrate processing system of claim 2, wherein the first cleaning unit and the second cleaning unit are each maintained at atmospheric pressure,
The first chamber to the third chamber are each maintained in a vacuum state, and one of the first auxiliary chambers is placed between the first cleaning unit and the third chamber for adjusting the pressure, and for adjusting the pressure A second auxiliary chamber is placed between the second cleaning unit and the third chamber.
一第二滾筒單元，其施壓給被初步層壓之該第一基板及該第二基板其以層壓該第一基板及該第二基板於彼此上；
一第一輸送單元，其包含輸送被初步層壓之該第一基板及該第二基板到該第二滾筒單元之複數個輸送滾筒；以及
一第二輸送單元，其包含載運被施壓及層壓到彼此上之該第一基板及該第二基板到該第三輔助腔室之複數個載運滾筒。The substrate processing system of claim 6, wherein the second laminate member comprises:
a second roller unit that presses the first substrate and the second substrate that are initially laminated to laminate the first substrate and the second substrate on each other;
a first transport unit comprising: a plurality of transport rollers conveying the first substrate and the second substrate to the second roller unit; and a second transport unit comprising a load and a layer Pressing the first substrate on each other and the plurality of carrier rollers from the second substrate to the third auxiliary chamber.
一平台，該第二基板被放置於其上；
一對準單元，以對應於該第二基板之方向輸送該第一基板；以及
一第一滾筒單元，靜電施加於其外圍面，該第一滾筒單元從該對準單元，以其旋轉方向沿外圍面，藉由靜電輸送該第一基板，以初步層壓該第一基板到該第二基板上，
其中該平台被放置於該第一滾筒單元下，以及該對準單元被放置於該第一滾筒單元上。The substrate processing system of claim 1, wherein the first laminate member comprises:
a platform on which the second substrate is placed;
An aligning unit transporting the first substrate in a direction corresponding to the second substrate; and a first roller unit, electrostatically being applied to a peripheral surface thereof, the first roller unit being rotated from the aligning unit in a direction of rotation thereof a peripheral surface, the first substrate is electrostatically transported to initially laminate the first substrate to the second substrate,
Wherein the platform is placed under the first roller unit and the alignment unit is placed on the first roller unit.
一平台，該第二基板被放置於其上；
一對準單元，以一個方向輸送該第一基板以對應於該第二基板；
一滾筒單元，靜電施加於其外圍面處，該滾筒單元從該對準單元，以其旋轉方向沿外圍面，藉由該靜電輸送該第一基板，以初步層壓該第一基板到該第二基板上，
其中該平台被放置於該滾筒單元下，以及該對準單元被放置於該滾筒單元上。A laminating apparatus for initially laminating a first substrate and a second substrate to each other to initially laminate the first substrate and the second substrate, the laminating apparatus comprising:
a platform on which the second substrate is placed;
An aligning unit, conveying the first substrate in one direction to correspond to the second substrate;
a roller unit, electrostatically being applied to a peripheral surface thereof, the roller unit transporting the first substrate from the alignment unit along the peripheral surface thereof by the electrostatic direction to initially laminate the first substrate to the first On the second substrate,
Wherein the platform is placed under the drum unit and the alignment unit is placed on the drum unit.
該層壓設備更進一步包含當該第一基板之扭曲被該偵測部分偵測到時，調整該複數個輸送滾筒之位置以更正該第一基板之扭曲之一第一控制單元。The laminating apparatus of claim 9, wherein the aligning unit comprises a plurality of conveying rollers conveying the first substrate in one direction and detecting a distortion detecting portion of the first substrate, and the The laminating apparatus further includes a first control unit that adjusts a position of the plurality of transport rollers to correct a distortion of the first substrate when the distortion of the first substrate is detected by the detecting portion.
一滾筒單元，其施壓給被初步層壓於彼此上之該第一基板及該第二基板以層壓該第一基板及該第二基板；
一第一輸送單元，其包含輸送被初步層壓於彼此上之該第一基板及該第二基板到該滾筒單元之複數個輸送滾筒；以及
一第二輸送單元，其包含載運被施壓及層壓到彼此上之該第一基板及該第二基板到一輔助腔室之複數個載運滾筒。A laminating apparatus for pressing a first substrate and a second substrate which are initially laminated on each other to laminate the first substrate and the second substrate, the laminating apparatus comprising:
a roller unit that presses the first substrate and the second substrate that are initially laminated on each other to laminate the first substrate and the second substrate;
a first transport unit comprising: a plurality of transport rollers conveying the first substrate and the second substrate initially laminated to each other to the drum unit; and a second transport unit including the load being pressurized and A plurality of carrier rollers laminated to each other on the first substrate and the second substrate to an auxiliary chamber.
在大氣壓力下分別清潔至少一第一基板及一第二基板之頂面；
在真空狀態中使該第一基板之頂面接觸該第二基板之頂面以初步層壓該第一基板及該第二基板到彼此上；以及
在真空狀態中施壓給被初步層壓之該第一基板及該第二基板以層壓該第一基板及該第二基板到彼此上。A substrate processing method comprising:
Cleaning at least one of the first substrate and the top surface of the second substrate under atmospheric pressure;
The top surface of the first substrate is brought into contact with the top surface of the second substrate in a vacuum state to initially laminate the first substrate and the second substrate to each other; and is pressed in a vacuum state to be initially laminated The first substrate and the second substrate are laminated on the first substrate and the second substrate to each other.
對準該第一基板以使該第一基板被放置於該第二基板上以對應該第二基板；以及
沿一圓弧形軌跡往該第二基板輸送該第一基板以使該第一基板及該第二基板之頂面接觸於彼此。The substrate processing method of claim 17, wherein the preliminary lamination of the first substrate and the second substrate comprises:
Aligning the first substrate such that the first substrate is placed on the second substrate to correspond to the second substrate; and transporting the first substrate to the second substrate along a circular arc track to make the first substrate And the top surface of the second substrate is in contact with each other.
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| KR102169438B1 (en) * | 2018-09-14 | 2020-10-26 | 에이피시스템 주식회사 | Apparatus for laminating and method for laminating the same |
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| JP2002025877A (en) * | 2000-06-30 | 2002-01-25 | Tokyo Electron Ltd | Parts maintenance device for semiconductor processor, and method therefor |
| KR20090048206A (en) * | 2007-11-09 | 2009-05-13 | 주식회사 에이디피엔지니어링 | System for attaching display panel for stereoscopic image |
| KR20100009836A (en) * | 2008-07-21 | 2010-01-29 | 엘지전자 주식회사 | Method for manufacturing flexible display |
| KR100976801B1 (en) * | 2009-03-24 | 2010-08-20 | 세광테크 주식회사 | Apparatus for adhering window film |
| EP2327547A1 (en) * | 2009-11-27 | 2011-06-01 | Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO | Apparatus and method for laminating a first and a second sheet |
| KR20120010946A (en) * | 2010-07-27 | 2012-02-06 | 가부시키가이샤 후쿠 | Apparatus for joining plate-shaped members |
-
2013
- 2013-07-29 KR KR1020130089824A patent/KR102173043B1/en active IP Right Grant
- 2013-10-29 TW TW102139013A patent/TWI616346B/en active
-
2014
- 2014-04-02 CN CN201410131092.7A patent/CN104347451B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| KR102173043B1 (en) | 2020-11-03 |
| KR20150014314A (en) | 2015-02-06 |
| CN104347451A (en) | 2015-02-11 |
| TWI616346B (en) | 2018-03-01 |
| CN104347451B (en) | 2018-12-07 |
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