TW201436949A - Grinding processing method - Google Patents
Grinding processing method Download PDFInfo
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- TW201436949A TW201436949A TW103100529A TW103100529A TW201436949A TW 201436949 A TW201436949 A TW 201436949A TW 103100529 A TW103100529 A TW 103100529A TW 103100529 A TW103100529 A TW 103100529A TW 201436949 A TW201436949 A TW 201436949A
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- workpiece block
- grindstone
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- elastic deformation
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/07—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor involving a stationary work-table
- B24B7/075—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor involving a stationary work-table using a reciprocating grinding head mounted on a movable carriage
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
- B24B49/04—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent involving measurement of the workpiece at the place of grinding during grinding operation
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
Abstract
Description
本發明，是有關被使用在被加工物的表面研磨等的研磨加工裝置中的研磨加工方法，尤其是，有關於其空轉開始位置的修正。 The present invention relates to a polishing processing method used in a polishing processing apparatus such as surface polishing of a workpiece, and more particularly to correction of a idling start position.
將工件塊(被加工物)的表面研磨成平面的研磨加工裝置，是將工件塊的表面及磨石的表面相互平行，藉由一邊使各別旋轉一邊藉由給進機構將磨石與工件塊接觸，將工件塊研磨。例如，在專利文獻1中揭示了：藉由給進機構將磨石朝工件塊側給進而將工件塊研磨的研磨加工裝置。此研磨加工裝置，是依據顯示對於磨石的給進速度的複數目標速度及複數目標位置的加工圖型，藉由從粗研磨加工至精研磨加工的方式，控制對於給進位置的給進速度，就可獲得良好的精度的研磨結果。 A polishing apparatus for polishing a surface of a workpiece block (subject to be processed) by paralleling the surface of the workpiece block and the surface of the grindstone, and grinding the stone and the workpiece by the feeding mechanism while rotating each other Block contact, grinding the workpiece block. For example, Patent Document 1 discloses a polishing processing apparatus that applies a grinding stone to a workpiece block side to further grind a workpiece block by a feeding mechanism. The grinding processing device controls the feeding speed for the feeding position by means of a rough grinding process to a fine grinding process according to a machining pattern showing a plurality of target speeds and a plurality of target positions for the feed speed of the grindstone. , the grinding results with good precision can be obtained.
且在專利文獻1中，從厚度感測器的測量值及給進位置的原點設定時及加工後或是加工中的測量值將磨石的磨耗算出，依據該值修正磨石與工件塊接觸之前的空轉開始位置。在各加工開始之前，藉由被適切地修正空轉 開始位置使空轉距離被短縮，使加工時間被短縮。 Further, in Patent Document 1, the wear of the grindstone is calculated from the measured value of the thickness sensor and the origin of the feed position and the measured value after the machining or the machining, and the grindstone and the workpiece block are corrected based on the value. The idling start position before the contact. Before being corrected, the idling is corrected appropriately The starting position causes the idle distance to be shortened, so that the machining time is shortened.
專利文獻1：日本專利第4338458號公報 Patent Document 1: Japanese Patent No. 4338458
在專利文獻1中，從工件塊的研磨終了時的厚度感測器的測量值及給進位置的值以加工前設定的各原點中的值為基準將磨石的磨耗算出，藉由依據該算出值將加工圖型整體移動修正，將空轉開始位置修正。使空轉不會各別給與磨石及工件塊破壞的方式可接觸的給進速度進行的給進控制。藉由磨石及工件塊不會接觸，且磨石及工件塊儘可能接近的位置開始空轉，就可以將空轉距離短縮，將整體的加工時間短縮。 In Patent Document 1, the wear value of the grindstone is calculated from the values of the measured values of the thickness sensor and the values of the feed position at the end of the polishing of the workpiece block, based on the values of the respective origins set before the machining, by This calculated value corrects the overall movement of the machining pattern and corrects the idle start position. The feed control that makes the idling do not give the feed speed that can be contacted by the grindstone and the workpiece block. By the grinding stone and the workpiece block will not touch, and the grinding stone and the workpiece block begin to idling as close as possible, the idling distance can be shortened, and the overall processing time is shortened.
專利文獻1的修正方法，是在成為前提的預定的條件下中非常穩定且有用，但是成為該前提的條件未被滿足的話，就有無法將空轉開始位置適切地修正的情況。這種情況的例，例如，在如需要藍寶石加工的較高壓住力的加工中，無法忽視由機械構成要素的彈性變形所產生的變位。 The correction method of the patent document 1 is very stable and useful under predetermined conditions that are premised. However, if the condition for the premise is not satisfied, the idling start position cannot be corrected as appropriate. In the case of such a case, for example, in the processing of a higher pressing force such as sapphire processing, the displacement due to the elastic deformation of the mechanical constituent elements cannot be ignored.
此專利文獻1的修正方法，對於起因於機械構成要素的彈性變形的修正量是比空轉距離小的前提會成立。但是，工件塊是如藍寶石硬度非常高的情況時，因為有需要由大的壓住力將磨石與工件塊抵接，所以機械構成要素的彈性變形變大，此前提會不成立。 In the correction method of Patent Document 1, it is assumed that the correction amount due to the elastic deformation of the mechanical constituent element is smaller than the idling distance. However, when the workpiece block has a very high hardness such as sapphire, since it is necessary to contact the grinding stone with the workpiece block by a large pressing force, the elastic deformation of the mechanical component becomes large, and this premise does not hold.
例如，將磨石由大的壓住力抵接地將藍寶石研磨時，在研磨加工裝置中大的彈性變形會產生，由該彈性變形所產生的變位會成為被包含於厚度感測器的測量值及給進位置。 For example, when the grindstone is grounded by a large pressing force to grind the sapphire, a large elastic deformation occurs in the lapping device, and the displacement caused by the elastic deformation becomes a measurement included in the thickness sensor. Value and feed position.
因此，依據包含由彈性變形所產生的變位的測量值和給進位置被修正的空轉開始位置，會被設定成比無彈性變形的狀態中的工件塊的表面更後側，在空轉開始之前具有磨石與工件塊衝突的可能性。為了避免此，將被設想的彈性變形量以上的空轉距離充裕地設定的話，因為修正的效果會減少，空轉的時間會變長，整體的加工時間也會變長。 Therefore, the vacant start position corrected according to the displacement including the displacement caused by the elastic deformation is set to be more rearward than the surface of the workpiece block in the state of the inelastic deformation, before the start of the idling There is the possibility of collision between the grindstone and the workpiece block. In order to avoid this, if the idling distance equal to or greater than the assumed amount of elastic deformation is sufficiently set, the effect of the correction is reduced, the idling time is lengthened, and the overall machining time is also lengthened.
本發明的目的，是提供即使機械的彈性變形也不被影響可將空轉開始位置適切地修正的一種研磨加工方法。 SUMMARY OF THE INVENTION An object of the present invention is to provide a polishing processing method which can correct a vacant start position as appropriate even if mechanical elastic deformation is not affected.
本發明的一態樣的研磨加工方法，是藉由控制將磨石及工件塊相對地往復移動的給進台，使前述磨石及前述工件塊旋轉且經過成為可安全接觸的空轉而接觸，將前述工件塊的表面研磨，其中，將前述工件塊進行至加工目標位置為止的研磨之後在返回前述磨石的位置的途中，當被包含於前述給進台的變位的機械的彈性變形是成為可以忽視的狀態時測量前述給進台的位置或是變位量，依據前述給進台的位置或是變位量將空轉開始位置的修正 值算出，依據前述修正值修正下次的空轉開始位置者。 An aspect of the polishing method of the present invention is to control the grinding table and the workpiece block to reciprocate relative to each other, so that the grinding stone and the workpiece block are rotated and contacted by a idling which is safely contactable. Polishing the surface of the workpiece block, wherein the mechanical deformation of the mechanical component included in the displacement of the feed table is on the way back to the position of the grindstone after the grinding of the workpiece block to the machining target position When the position of the feeding table or the amount of displacement is measured in a negligible state, the correction of the idling start position is determined according to the position of the feeding table or the displacement amount. The value is calculated, and the next idling start position is corrected based on the aforementioned correction value.
且本發明的其他的態樣的研磨加工方法，是藉由控制將磨石及工件塊相對地往復移動的給進台，使前述磨石及前述工件塊旋轉且經過成為可安全接觸的空轉而接觸，將前述工件塊的表面研磨，其中，將前述工件塊研磨至加工目標位置為止時，測量：前述工件塊的表面位置或是厚度、及前述給進台的位置或是變位量，取得被包含於前述工件塊研磨至前述加工目標位置為止時的前述給進台的變位的機械的彈性變形量，藉由前述彈性變形量修正依據前述工件塊的表面位置或是厚度、及前述給進台的位置或是變位量被算出的空轉開始位置的修正值，依據被修正的前述修正值修正下次的空轉開始位置者。 In another aspect of the present invention, the polishing method is a method of controlling the grinding table and the workpiece block to reciprocate relative to each other, and rotating the grinding stone and the workpiece block to pass the safe contact. Contacting, grinding the surface of the workpiece block, wherein when the workpiece block is polished to the processing target position, measuring: the surface position or thickness of the workpiece block, and the position or displacement of the feeding table, The mechanical elastic deformation amount of the displacement of the feeding table when the workpiece block is polished to the processing target position is corrected by the surface deformation or the thickness of the workpiece block by the elastic deformation amount, and the The position of the entering stage or the correction value of the idling start position calculated by the displacement amount is corrected by the corrected correction value to the next idling start position.
依據本發明的話，成為可適切地修正由磨石將工件塊研磨的研磨加工裝置的空轉開始位置。 According to the present invention, the idling start position of the lapping apparatus which grinds the workpiece block by the grindstone can be appropriately corrected.
S1、S2‧‧‧感測器 S1, S2‧‧‧ sensor
1‧‧‧研磨加工裝置 1‧‧‧ Grinding and processing equipment
2‧‧‧磨石 2‧‧‧millstone
30‧‧‧基座構件 30‧‧‧Base member
40‧‧‧工件支撐部 40‧‧‧Workpiece support
41‧‧‧支撐台 41‧‧‧Support table
42‧‧‧工件旋轉軸 42‧‧‧Workpiece rotation axis
42A‧‧‧中心軸 42A‧‧‧Center axis
43‧‧‧驅動馬達 43‧‧‧Drive motor
44‧‧‧挾盤 44‧‧‧挟
50‧‧‧研磨加工部 50‧‧‧ Grinding and Processing Department
51‧‧‧固定台 51‧‧‧ fixed table
52‧‧‧給進台 52‧‧‧To enter the station
53‧‧‧給進驅動部 53‧‧‧Driving drive department
54‧‧‧支撐台 54‧‧‧Support table
55‧‧‧磨石旋轉軸 55‧‧‧ Millstone rotating shaft
55A‧‧‧中心軸 55A‧‧‧Center axis
56‧‧‧驅動馬達 56‧‧‧Drive motor
6‧‧‧控制裝置 6‧‧‧Control device
[第1圖]顯示有關於本實施例所使用的研磨加工裝置中的研磨的構成的圖。 [Fig. 1] A view showing a configuration of polishing in the polishing apparatus used in the present embodiment.
[第2圖]說明磨石2及工件塊W的位置關係用的圖。 [Fig. 2] A view for explaining the positional relationship between the grindstone 2 and the workpiece block W.
[第3圖]顯示有關於研磨加工裝置中的控制的概略的構成的方塊圖。 [Fig. 3] A block diagram showing a schematic configuration of control in the polishing processing apparatus.
[第4圖]顯示彈性變形量d(1)及修正量△(1)的關係的圖。 [Fig. 4] A graph showing the relationship between the amount of elastic deformation d(1) and the amount of correction Δ(1).
參照圖面說明本發明的實施例。 Embodiments of the invention are described with reference to the drawings.
第1圖，是顯示有關於本實施例所使用的研磨加工裝置中的研磨的構成的圖。本實施例中的研磨加工裝置，其中一例，是藉由將工件塊側固定在給進方向，將磨石側朝該工件塊的方向給進移動並接觸，而將工件塊的表面研磨的裝置。 Fig. 1 is a view showing a configuration of polishing in the polishing apparatus used in the present embodiment. An example of the polishing processing apparatus in the present embodiment is a device for grinding the surface of the workpiece block by moving the workpiece side to the feeding direction and moving the grinding stone side toward the workpiece block in contact with the workpiece block side. .
研磨加工裝置1，是如第1圖所示，具備：將工件塊W的表面研磨的磨石2、及基座構件30、及被配置於基座構件30的上面的工件支撐部40及研磨加工部50、及將研磨加工裝置1的作動控制的控制裝置6。在基座構件30的上面，工件支撐部40是被配置在第1圖的右側的領域，研磨加工部50是被配置在第1圖的左側的領域。 As shown in Fig. 1, the polishing apparatus 1 includes a grinding stone 2 for polishing the surface of the workpiece block W, a base member 30, and a workpiece support portion 40 disposed on the upper surface of the base member 30 and polishing. The processing unit 50 and the control device 6 that controls the operation of the polishing processing device 1. On the upper surface of the base member 30, the workpiece support portion 40 is disposed on the right side of the first figure, and the polishing portion 50 is disposed on the left side of the first figure.
且本實施例的研磨加工裝置1，雖顯示在軸方向是被橫方向配置的磨石旋轉軸55的前端面安裝有磨石2的橫形的研磨裝置，但是本發明也可由縱形實施。 In the polishing apparatus 1 of the present embodiment, a horizontal polishing apparatus in which the grindstone 2 is attached to the tip end surface of the grindstone rotating shaft 55 disposed in the lateral direction is shown. However, the present invention may be implemented in a vertical shape.
工件支撐部40，是具備：支撐台41、及設在支撐台41的工件旋轉軸42、及將工件旋轉軸42旋轉用的驅動馬達43、及將工件塊W保持的挾盤44。 The workpiece support portion 40 includes a support base 41, a workpiece rotation shaft 42 provided on the support base 41, a drive motor 43 for rotating the workpiece rotation shaft 42, and a tray 44 for holding the workpiece block W.
支撐台41，是被固定於基座構件30的上面，從支撐台41朝向研磨加工部50設有工件旋轉軸42。工件旋轉軸42，是藉由設在支撐台41的上部的驅動馬達43，繞工件旋轉軸42的中心軸42A周圍旋轉的方式構成。 The support base 41 is fixed to the upper surface of the base member 30, and the workpiece rotating shaft 42 is provided from the support base 41 toward the polishing processing portion 50. The workpiece rotating shaft 42 is configured to rotate around the central axis 42A of the workpiece rotating shaft 42 by a drive motor 43 provided on the upper portion of the support base 41.
挾盤44，是設在工件旋轉軸42的前端面，藉由真空吸附將工件塊W保持者。 The chuck 44 is provided on the front end surface of the workpiece rotating shaft 42, and holds the workpiece block W by vacuum suction.
研磨加工部50，是具備：固定台51、及與固定台51連結的給進台52、及將給進台52移動用的給進驅動部53、及被安裝於給進台52的支撐台54、及設在支撐台54的磨石旋轉軸55、及將磨石旋轉軸55旋轉用的驅動馬達56。 The polishing processing unit 50 includes a fixing table 51, a feeding table 52 coupled to the fixing table 51, a feeding driving unit 53 for moving the feeding table 52, and a support table attached to the feeding table 52. 54. A grindstone rotating shaft 55 provided on the support base 54 and a drive motor 56 for rotating the grindstone rotating shaft 55.
固定台51，是被固定於基座構件30的上面。在固定台51的上部中，給進台52是朝第1圖的左右方向(X方向)可滑動自如地連結。給進驅動部53，是將給進台52朝第1圖的左右方向移動的機構。 The fixing table 51 is fixed to the upper surface of the base member 30. In the upper portion of the fixed table 51, the feeding table 52 is slidably coupled to the left-right direction (X direction) of Fig. 1 . The feeding drive unit 53 is a mechanism that moves the feeding table 52 in the horizontal direction of the first drawing.
支撐台54，是被安裝於給進台52的上部，從支撐台54朝向工件支撐部40設有磨石旋轉軸55。 The support base 54 is attached to the upper portion of the feed table 52, and a grindstone rotation shaft 55 is provided from the support table 54 toward the workpiece support portion 40.
磨石旋轉軸55，是藉由設在支撐台54的內部的驅動馬達56，繞磨石旋轉軸55的中心軸55A周圍旋轉的方式構成。 The grindstone rotating shaft 55 is configured to rotate around the central axis 55A of the grindstone rotating shaft 55 by a drive motor 56 provided inside the support base 54.
在磨石旋轉軸55的前面端中，安裝有磨石2。 In the front end of the grindstone rotating shaft 55, a grindstone 2 is mounted.
又，在本實施例中雖顯示藉由將磨石2側移動，將磨石2及工件塊W相對地給進移動的例，但是本發明不限定於此。其他例，如將工件塊W側移動者也可以， 或是將磨石2側及工件塊W側的雙方移動者也可以。 Further, in the present embodiment, the example in which the grindstone 2 and the workpiece block W are relatively moved by moving the grindstone 2 side is shown, but the present invention is not limited thereto. Other examples, such as moving the workpiece block W side, can also be, It is also possible to move both the grinding stone 2 side and the workpiece block W side.
研磨加工裝置1的動作，是在將被保持在磨石2及挾盤44的工件塊W旋轉的狀態下，將磨石2朝給進方向接近工件塊W的方式移動，藉由將磨石2與工件塊W接觸而將工件塊W研磨。 The operation of the polishing apparatus 1 is such that the grinding stone 2 is moved toward the workpiece block W in the feeding direction while the workpiece block W held by the grinding stone 2 and the disk 44 is rotated, and the grinding stone is moved. 2 The workpiece block W is ground by contact with the workpiece block W.
第2圖，是說明磨石2及工件塊W的位置關係用的圖。 Fig. 2 is a view for explaining the positional relationship between the grindstone 2 and the workpiece block W.
被安裝於磨石旋轉軸55的磨石2、及被保持在挾盤44的工件塊W，是將彼此的中心軸錯開的方式平行地相面對。磨石2的端面是與工件塊W的中心W0接觸的方式被定位。在研磨加工時，磨石2是一邊旋轉，一邊由所期的加工速度朝工件塊W側被送出。 The grindstone 2 attached to the grindstone rotating shaft 55 and the workpiece block W held by the crucible 44 face each other in such a manner as to be shifted from each other in the central axis. The end face of the grindstone 2 is positioned in contact with the center W0 of the workpiece block W. At the time of the grinding process, the grindstone 2 is rotated while being fed to the workpiece block W side by the predetermined machining speed.
第3圖，是顯示有關於研磨加工裝置1中的控制的概略的構成的方塊圖。 Fig. 3 is a block diagram showing a schematic configuration of control in the polishing processing apparatus 1.
在研磨加工裝置1中具備各種感測器。在此感測器的1個中，例如，具有將工件塊W的表面位置檢出的厚度感測器S1。厚度感測器S1是接觸式者或非接觸式者也可以。厚度感測器S1，是將挾盤44的表面位置及工件塊W的表面位置檢出，將其中的工件塊W的表面位置朝控制裝置6通知者也可以，或是將那些的差分作為工件塊W的厚度朝控制裝置6通知者也可以。 Various types of sensors are provided in the polishing apparatus 1. In one of the sensors, for example, there is a thickness sensor S1 that detects the surface position of the workpiece block W. The thickness sensor S1 may be a contact type or a non-contact type. The thickness sensor S1 detects the surface position of the disk 44 and the surface position of the workpiece block W, and notifies the surface position of the workpiece block W to the control device 6, or uses the difference as a workpiece. The thickness of the block W may be notified to the control device 6.
且其他的感測器，是具有將磨石2的給進量檢出的給進位置感測器S2。給進位置感測器S2，是藉由給進台52的位置或是變位量測量磨石2的給進量。但是，在給 進台52中，因為透過支撐台54、驅動馬達56、磨石旋轉軸55等固定有磨石2，所以在給進台52的變位中包含那些機械的彈性變形。 And the other sensors are the feed position sensors S2 having the feed amount of the grindstone 2 detected. The feed position sensor S2 measures the feed amount of the grindstone 2 by the position or displacement amount of the feed table 52. But, given In the table 52, since the grindstone 2 is fixed through the support table 54, the drive motor 56, the grindstone rotating shaft 55, and the like, mechanical deformation of those of the feed table 52 is included.
控制裝置6，是利用來自感測器S1、S2的通知，控制將磨石旋轉軸55往復移動的給進驅動部53，並藉由控制磨石2的給進速度或是位置，將工件塊W研磨至所期的厚度為止。給進速度或是位置的控制，是隨著預定的研磨加工圖型進行。此時，控制裝置6，是直到磨石2與工件塊W接觸為止依據從感測器S2的給進位置感測器被通知的磨石2的給進量進行給進控制，工件塊W的研磨開始之後是依據從厚度感測器S1被通知的工件塊W的表面位置或是厚度進行給進控制。或是依據從全部感測器S2被通知的位置進行給進控制也可以。 The control device 6 controls the feed drive portion 53 that reciprocates the grindstone rotation shaft 55 by the notification from the sensors S1, S2, and controls the workpiece block by controlling the feed speed or position of the grindstone 2. W is ground to the desired thickness. Feed speed or position control is performed with a predetermined grinding pattern. At this time, the control device 6 performs the feed control based on the feed amount of the grindstone 2 notified from the feed position sensor of the sensor S2 until the grindstone 2 comes into contact with the workpiece block W, the workpiece block W After the start of the grinding, the feeding control is performed in accordance with the surface position or thickness of the workpiece block W notified from the thickness sensor S1. It is also possible to perform the feed control based on the position notified from all the sensors S2.
接著，說明依據研磨加工圖型的研磨加工整體的概略的流程。在研磨加工圖型中，顯示對於磨石的給進速度的複數目標速度及對於那些目標速度的複數目標位置，在此也包含空轉開始位置。 Next, a schematic flow of the entire polishing process according to the polishing pattern will be described. In the grinding pattern, the complex target speeds for the feed rate of the grindstone and the complex target positions for those target speeds are also included, here also the idle start position.
控制裝置6，首先是將磨石2迅速地接近至工件塊W的附近之後，開始預定的空轉速度中的給進。空轉，是將磨石2與工件塊W接觸時的衝擊鬆緩用的動作，一邊將磨石2旋轉，一邊由在接觸時不會給與工件塊W和磨石2破壞程度的給進速度朝工件塊W側給進。一般，是與下次的粗加工研磨相同速度。 The control device 6 firstly starts the feeding in the predetermined idle speed after quickly approaching the grindstone 2 to the vicinity of the workpiece block W. The idling is an operation for loosening the impact when the grindstone 2 is in contact with the workpiece block W, and the feed speed is not given to the workpiece block W and the grindstone 2 when the grindstone 2 is rotated. Feed toward the side of the workpiece block W. Generally, it is the same speed as the next roughing.
在此其中一例，研磨加工裝置1是具備測量施 加於磨石旋轉軸55的負荷的手段，將磨石2與工件塊W接觸的狀態，從施加於磨石旋轉軸55的負荷的變化檢出也可以。施加於磨石旋轉軸55的負荷是例如可以藉由磨石驅動用的驅動馬達56的電流測量。 In one of the examples, the polishing apparatus 1 is provided with a measuring device. The means for applying the load to the grindstone rotating shaft 55 may detect the change in the load applied to the grindstone rotating shaft 55 in a state in which the grindstone 2 is in contact with the workpiece block W. The load applied to the grindstone rotating shaft 55 is, for example, a current measurement of the drive motor 56 that can be driven by the grindstone.
其他例，如研磨加工裝置1是具備測量磨石旋轉軸55的旋轉數的手段，將磨石2與工件塊W接觸的狀態，從磨石旋轉軸55的旋轉數的變化檢出也可以。磨石旋轉軸55的旋轉數可以作為磨石驅動用的驅動馬達56的旋轉數測量。 In another example, the polishing apparatus 1 is provided with means for measuring the number of rotations of the grindstone rotating shaft 55, and the state in which the grindstone 2 is in contact with the workpiece block W may be detected from the change in the number of revolutions of the grindstone rotating shaft 55. The number of rotations of the grindstone rotating shaft 55 can be measured as the number of revolutions of the drive motor 56 for driving the grindstone.
從磨石2與工件塊W接觸的時點開始工件塊W的研磨。隨著預定的研磨加工圖型直到工件塊W成為指定的厚度的加工目標位置為止進行給進控制。 The grinding of the workpiece block W is started from the point of time when the grindstone 2 comes into contact with the workpiece block W. The advance control is performed with the predetermined polishing pattern until the workpiece block W becomes the processing target position of the specified thickness.
在研磨加工圖型中，為了可高速且高精度的研磨，而包含粗研磨加工及其後的精研磨加工者也可以。該情況，由比較高速進行研磨的粗研磨加工，是只有預定距離，或是工件塊W是成為指定的厚度為止進行的話，就移行至精研磨加工。在精研磨加工中，控制裝置6，是由與粗研磨加工的速度相比低速的精加工的加工速度將工件塊W高精度地研磨。直到加工目標位置為止將工件塊W研磨的話，將磨石2返回至原來的位置終了研磨加工。 In the polishing pattern, in order to perform high-speed and high-precision polishing, a rough polishing process or a fine polishing process may be employed. In this case, the rough polishing process performed at a relatively high speed is performed only until a predetermined distance or the workpiece block W is formed to a predetermined thickness, and then the process proceeds to the finish polishing process. In the finish polishing process, the control device 6 grinds the workpiece block W with high precision by a machining speed of finishing at a lower speed than the speed of the rough grinding process. When the workpiece block W is polished until the machining target position, the grinding stone 2 is returned to the original position and the grinding process is finished.
在終了精研磨加工將磨石2返回至原來的位置的返回控制中，控制裝置6，是取得藉由厚度感測器S1及給進位置感測器S2被測量的測量值。控制裝置6，是使用在此取得的值，調整包含空轉開始位置的下次的研磨加工 的研磨加工圖型。即，空轉開始位置的修正是可以藉由研磨加工圖型的移動修正來進行。 In the return control in which the finish grinding process returns the grinding stone 2 to the original position, the control device 6 obtains the measured value measured by the thickness sensor S1 and the feed position sensor S2. The control device 6 adjusts the next grinding process including the idle start position using the value obtained here. Grinding pattern. That is, the correction of the idling start position can be performed by the movement correction of the polishing pattern.
接著，詳細說明空轉開始位置的修正。 Next, the correction of the idling start position will be described in detail.
進行工件塊W的研磨的話磨石2也會磨耗。磨石2磨耗的話，研磨加工中的工件塊W的表面位置的變位及磨石2的給進位置的變位的差分會變化。其是因為磨石2磨耗的話磨石2的給進位置也只有前進磨耗分。 When the workpiece block W is polished, the grindstone 2 is also worn. When the grindstone 2 is worn, the difference in the displacement of the surface position of the workpiece block W during the polishing process and the displacement of the feed position of the grindstone 2 changes. It is because the grinding stone 2 is worn only when the grinding stone 2 is fed.
本實施例的研磨加工裝置，是具備將空轉開始位置對應磨石2的磨耗地修正並設定適切的空轉開始位置的功能。磨石2是藉由在不與工件塊W衝突的範圍，儘可能地接近的方式空轉開始，所以成為可短縮加工時間。 The polishing apparatus of the present embodiment has a function of correcting the wear of the grindstone 2 in accordance with the idling start position and setting an appropriate idling start position. The grindstone 2 starts to idling as close as possible to the range in which the workpiece block W does not collide with the workpiece block W, so that the grinding time can be shortened.
第N+1次的加工中的空轉開始位置，是前次(第N次)的加工時，只有被修正依據由厚度感測器S1檢出的感測器測量值S(N)、及由給進位置感測器S2檢出的給進位置值X(N)所算出的修正值的量。 The idle start position in the N+1th machining is the previous (Nth) machining, and only the sensor measured value S(N) detected by the thickness sensor S1 is corrected, and The amount of correction value calculated by the feed position value X(N) detected by the position sensor S2.
在專利文獻1中，在機械的彈性變形量比空轉距離小的前提條件下，第N次的研磨加工終了時(例如100%終了的時點，或是接近100%為止終了的時點)，測量給進位置值X(N)及感測器測量值S(N)，依據作為那些的差分被算出的修正值=-((X(N)-S(N))-(X(0)-S(0)))將空轉開始位置修正。又，X(0)是給進位置值的原點，S(0)是感測器測量值的原點，在此X(0)及S(0)皆將挾盤44的表面位置作為原點例示。但是，將挾盤44的表面位置作成原點只是一例，原點的位置即使不特別限定，本修正方法的效果也不 變。其他例，如以在工件塊W的加工目標位置，即，在挾盤44的表面位置將工件塊W的加工後的厚度加算了的位置作為原點也可以。 In Patent Document 1, when the mechanical elastic deformation amount is smaller than the idling distance, the Nth grinding process is finished (for example, at the end of 100% or at the end of 100%), the measurement is given. The position value X(N) and the sensor measurement value S(N) are corrected based on the difference as those ==((X(N)-S(N))-(X(0)-S (0))) Correct the idling start position. Further, X(0) is the origin of the feed position value, and S(0) is the origin of the sensor measurement value, where X(0) and S(0) both take the surface position of the disc 44 as the original point. Point illustration. However, the surface position of the disk 44 is merely an example, and the position of the origin is not particularly limited, and the effect of the correction method is not change. In another example, the position where the processed thickness of the workpiece block W is added to the machining target position of the workpiece block W, that is, the surface position of the hammer 44 may be used as the origin.
但是如本實施例，第N次的研磨加工終了時對於工件塊W的大的壓住力是機械地施加的情況時，在給進位置值X(N)中，會包含不比空轉距離小，即無法忽視的機械的彈性變形量d(N)。因此，在此狀態下由使用被測量的給進位置值X(N)算出的修正值修正的話，被認為：空轉開始位置是被設定成只有彈性變形量d(N)朝後側偏離的位置，無法將該偏離由空轉距離的餘量救濟。其是因為在開始空轉的位置中，磨石2及工件塊W未接觸的狀態(即，壓住力是零)，磨石的面位置是只有彈性變形量位於後側。 However, in the present embodiment, when the large pressing force for the workpiece block W at the end of the Nth grinding process is mechanically applied, the feed position value X(N) may contain no smaller than the idling distance. That is, the amount of mechanical deformation d(N) of the machine that cannot be ignored. Therefore, when the correction value calculated using the measured feed position value X(N) is corrected in this state, it is considered that the idling start position is set to a position where only the elastic deformation amount d(N) deviates toward the rear side. The deviation cannot be relieved by the margin of the idling distance. This is because in the position where the idling is started, the state in which the grindstone 2 and the workpiece block W are not in contact (that is, the pressing force is zero), and the surface position of the grindstone is that only the amount of elastic deformation is located on the rear side.
在此，在本實施例中，終了工件塊W的研磨之後在返回磨石2的位置的途中，彈性變形量是成為可以忽視的狀態時，依據由厚度感測器S1測量的感測器測量值Sb(N)、及由給進位置感測器S2測量的給進位置值Xb(N)將修正值算出，依據該修正值修正第N+1次的空轉開始位置。 Here, in the present embodiment, when the amount of elastic deformation is in a negligible state on the way to return to the position of the grindstone 2 after the grinding of the workpiece block W, the sensor measurement according to the thickness sensor S1 is measured. The value Sb(N) and the feed position value Xb(N) measured by the feed position sensor S2 are calculated as correction values, and the N+1th idle start position is corrected based on the correction value.
說明判斷彈性變形可以忽視的狀態的方法的例。此方法，是在研磨加工裝置具備測量施加於磨石旋轉軸55的負荷的測量器，從施加於磨石旋轉軸55的負荷的變化，判斷彈性變形成為可以忽視狀態者。 An example of a method for judging a state in which elastic deformation can be ignored will be described. In this method, the polishing apparatus includes a measuring device that measures the load applied to the grinding stone rotating shaft 55, and determines that the elastic deformation is negligible from the change in the load applied to the grinding stone rotating shaft 55.
首先，控制裝置6，是測量施加於開始第N次的給進控制之前的磨石旋轉軸55的負荷並記憶。施加於磨 石旋轉軸55的負荷是例如可以藉由磨石驅動用的驅動馬達56的電流測量。進一步，控制裝置6，是依據所測量的負荷的值，設定供判斷彈性變形可以忽視的狀態用的磨石旋轉軸55的負荷的門檻值。例如，進入所測量的負荷的值的預定範圍內的話，判斷為彈性變形成為可以忽視的狀態也可以。 First, the control device 6 measures and stores the load applied to the grindstone rotating shaft 55 before the start of the Nth feeding control. Applied to the mill The load of the stone rotating shaft 55 is, for example, a current measurement of the drive motor 56 that can be driven by the grindstone. Further, the control device 6 sets a threshold value for the load of the grindstone rotating shaft 55 for determining the state in which the elastic deformation can be ignored, based on the value of the measured load. For example, if it is within a predetermined range of the value of the measured load, it may be determined that the elastic deformation is a negligible state.
且獲得同樣的效果的另一個手段，是磨石給進軸的馬達的負帶電流，由此判斷也可以。 Another means of obtaining the same effect is the negative current of the grinding stone to the motor of the input shaft, and thus the judgment is also possible.
且控制裝置6，是進行第N次的一連的研磨加工，工件塊W的研磨加工是進行至加工目標位置為止的話，使由低速將磨石2從工件塊W分離的方式開始返回的控制。該返回控制期間，控制裝置6，是監視施加於磨石旋轉軸55的負荷，負荷到達上述的門檻值的話，判斷為彈性變形成為可以忽視的狀態。 In the control device 6, the polishing process of the Nth time is performed, and the polishing process of the workpiece block W is controlled so as to start the return of the grindstone 2 from the workpiece block W at a low speed until the machining target position is reached. In the return control period, the control device 6 monitors the load applied to the grindstone rotating shaft 55, and when the load reaches the threshold value described above, it is determined that the elastic deformation is negligible.
若判斷為彈性變形是可以忽視的狀態的話，控制裝置6，是由厚度感測器S1及給進位置感測器S2將被檢出的測量值Sb(N)、Xb(N)取得。 When it is determined that the elastic deformation is a negligible state, the control device 6 acquires the detected values Sb(N) and Xb(N) detected by the thickness sensor S1 and the feed position sensor S2.
且其他例，如控制裝置6，不是如上述從施加於開始第N次的給進控制之前的磨石旋轉軸55的負荷算出各次的門檻值，而是將門檻值設定成固定也可以。 Further, as another example, the control device 6 may calculate the threshold value for each time from the load applied to the grindstone rotating shaft 55 before the Nth feeding control, and may set the threshold value to be fixed.
且其他例，如在研磨加工裝置具備測量磨石旋轉軸55的旋轉數的測量器，將磨石2與工件塊W接觸的狀態，從磨石旋轉軸55的旋轉數的變化檢出也可以。磨石旋轉軸55的旋轉數可以作為磨石驅動用的驅動馬達56的旋 轉數測量。 In another example, the polishing apparatus includes a measuring device that measures the number of rotations of the grindstone rotating shaft 55, and the state in which the grindstone 2 is in contact with the workpiece block W is detected from the change in the number of revolutions of the grindstone rotating shaft 55. . The number of rotations of the grindstone rotating shaft 55 can be used as the rotation of the drive motor 56 for the grindstone drive. Revolution measurement.
獲得測量值Sb(N)、Xb(N)的話，控制裝置6，是計算：修正值△(N)、及修正後的空轉開始位置Xpa(N+1)。修正值△(N)、及修正後的空轉開始位置Xpa(N+1)的計算式，各別為式(1)，(2)。 When the measured values Sb(N) and Xb(N) are obtained, the control device 6 calculates the corrected value Δ(N) and the corrected idle start position Xpa(N+1). The calculation formula of the correction value Δ(N) and the corrected idling start position Xpa(N+1) is expressed by equations (1) and (2).
△(N)=-((Xb(N)-Sb(N))-(X(0)-S(0)))=-((Xb(N)-X(0))-(Sb(N)-S(0)))…(1) △(N)=-((Xb(N)-Sb(N))-(X(0)-S(0)))=-((Xb(N)-X(0))-(Sb(N )-S(0)))...(1)
Xpa(N+1)=(Sa(N+1)-S(0))+X(0)-△(N)+MA…(2) Xpa(N+1)=(Sa(N+1)-S(0))+X(0)-△(N)+MA...(2)
Sa(N+1)，是顯示在第N+1次研磨的工件塊W的表面位置，(Sa(N+1)-S(0))是顯示該工件塊W的厚度。 Sa(N+1) is the surface position of the workpiece block W displayed on the (N+1)th grinding, and (Sa(N+1)-S(0)) is the thickness of the workpiece block W.
空轉開始位置Xpa(N+1)，是成為：在工件塊W的厚度(Sa(N+1)-S(0))，將給進位置的原點的值(X(0))加算，將相當於主要是磨石2的磨耗的修正值△(N)減算，進一步將餘量MA加算了的值。 The idling start position Xpa(N+1) is obtained by adding the value (X(0)) of the origin of the feed position to the thickness (Sa(N+1)-S(0)) of the workpiece block W, The correction value Δ(N) corresponding to the wear of the grindstone 2 is mainly subtracted, and the remaining amount MA is further added.
且控制裝置6，雖是在第N+1次的研磨加工空轉，但是使從被算出的空轉開始位置Xpa(N+1)的位置開始的方式將研磨加工圖型移動修正，隨著被修正的研磨加工圖型實行第N+1次的研磨加工。 In addition, the control device 6 idling in the N+1th polishing process, but corrects the polishing pattern from the position of the calculated idling start position Xpa(N+1), and is corrected as it is corrected. The grinding pattern is subjected to the N+1th grinding process.
第4圖，是顯示彈性變形量d(1)及修正量△(1)的關係的圖。在第4圖中，不是將挾盤44的表面位置，而是將工件塊W的加工目標位置作為原點S(0)、X(0)，且厚度感測器S1的感測器測量值Sb(1)、Sb(2)．．．即使將加 工的次數重疊也不會變化。 Fig. 4 is a view showing the relationship between the amount of elastic deformation d(1) and the amount of correction Δ(1). In Fig. 4, instead of the surface position of the disk 44, the machining target position of the workpiece block W is taken as the origin S(0), X(0), and the sensor measurement of the thickness sensor S1. Sb(1), Sb(2). . . Even if it will be added The number of times the work overlaps will not change.
即，S(0)=Sb(1)=Sb(2)。 That is, S(0)=Sb(1)=Sb(2).
參照第4圖的話，在第1次的研磨加工中，在直到加工目標位置為止進行研磨的狀態下，給進位置也從原點X(0)，只有朝後側變位包含機械的彈性變形量d(1)的預定距離。從該狀態進行返回控制，在機械的彈性變形可以忽視的狀態，即在只有返回彈性變形量d(1)的位置，使給進位置Xb(1)被測量。如上述因為Sb(1)=S(0)，所以由式(1)，成為修正值△(1)=-(Xb(1)-X(0))。 Referring to Fig. 4, in the first polishing process, in the state where the polishing is performed until the machining target position, the feed position is also elastically deformed from the origin X (0) only to the rear side. The predetermined distance of the quantity d (1). Return control is performed from this state, and the feed position Xb(1) is measured in a state where the mechanical elastic deformation can be ignored, that is, at a position where only the return elastic deformation amount d(1) is returned. As described above, since Sb(1) = S(0), the correction value Δ(1) = -(Xb(1) - X(0)) is obtained from the equation (1).
同樣地，由第2次的研磨加工，直到加工目標為止進行研磨的狀態下，給進位置也從原點X(0)，只有朝後側變位包含機械的彈性變形量d(2)的預定距離。從該狀態進行返回控制，在機械的彈性變形可以忽視的狀態，即只有返回彈性變形量d(2)的位置，使給進位置Xb(2)被測量。如上述因為Sb(2)=S(0)，所以由式(1)，成為修正值△(2)=-(Xb(2)-X(0))。 Similarly, in the state where the polishing is performed until the processing target by the second polishing process, the feed position is also shifted from the origin X (0) to the rear side, including the mechanical elastic deformation amount d (2). Scheduled distance. Return control is performed from this state, and the feed position Xb(2) is measured in a state where the mechanical elastic deformation can be ignored, that is, only the position where the elastic deformation amount d(2) is returned. As described above, since Sb(2) = S(0), the correction value Δ(2) = -(Xb(2) - X(0)) is obtained from the equation (1).
如以上說明，依據本實施例的研磨加工方法的話，將工件塊W直到加工目標位置為止的研磨之後在返回磨石2的位置的途中，被包含於給進台52的變位的機械的彈性變形是成為可以忽視的狀態時測量給進台52的位置或是變位量，依據被測量的給進台52的位置或是變位量算出空轉開始位置的修正值。因此，在無彈性變形的狀態下磨石2不會與工件塊W衝突，且，使加工時間縮短的方式，可以將空轉開始位置適切地修正。 As described above, according to the polishing processing method of the present embodiment, the mechanical elasticity of the displacement included in the feeding table 52 in the middle of returning the position of the grinding stone 2 after the grinding of the workpiece block W up to the machining target position is performed. When the deformation is a negligible state, the position or displacement amount of the feeding table 52 is measured, and the correction value of the idling start position is calculated based on the position or displacement amount of the feeding table 52 to be measured. Therefore, in the state of no elastic deformation, the grinding stone 2 does not collide with the workpiece block W, and the machining start time can be shortened so that the idling start position can be appropriately corrected.
且依據本實施例，被包含於給進台52的變位的機械的彈性變形是成為可以忽視狀態時，不是只有給進台52的位置或是變位量，也測量工件塊W的表面位置或是厚度，因為依據該雙方算出空轉開始位置的修正值，所以可更正確地修正空轉開始位置。 According to the present embodiment, when the elastic deformation of the mechanical mechanism included in the displacement of the feeding table 52 becomes a negligible state, not only the position or the displacement amount of the feeding table 52 but also the surface position of the workpiece block W is measured. Or the thickness, because the correction value of the idling start position is calculated based on the both sides, so that the idling start position can be corrected more accurately.
第2實施例中的研磨加工裝置，基本上是與第1實施例者具有同樣的構成，但是厚度感測器S1是接觸式的感測器，且，為了提高晶圓性狀而在返回控制中將厚度感測器S1從晶圓分離地進行控制。因此，在返回控制的途中成為無法獲得厚度感測器S1的測量值。 The polishing processing apparatus according to the second embodiment basically has the same configuration as that of the first embodiment, but the thickness sensor S1 is a contact type sensor and is in the return control in order to improve the wafer properties. The thickness sensor S1 is controlled separately from the wafer. Therefore, the measurement value of the thickness sensor S1 cannot be obtained in the middle of the return control.
在此，在本實施例中，控制裝置6，其給進控制是進行至加工目標位置為止時將厚度感測器S1的測量值S(N)取得，其後，進行返回控制，機械的彈性變形是成為可以忽視的狀態時將給進位置感測器S2的測量值Xb(N)取得。 Here, in the present embodiment, the control device 6 obtains the measured value S(N) of the thickness sensor S1 when the feed control is performed to the processing target position, and thereafter performs the return control, mechanical elasticity. When the deformation is in a negligible state, the measured value Xb(N) of the position sensor S2 is obtained.
且控制裝置6，是隨著式(3)，決定空轉開始位置的修正值△(N)。 Further, the control device 6 determines the correction value Δ(N) of the idling start position in accordance with the equation (3).
△(N)=-((Xb(N)-S(N))-(X(0)-S(0)))=-((Xb(N)-X(0))-(S(N)-S(0)))…(3) △(N)=-((Xb(N)-S(N))-(X(0)-S(0)))=-((Xb(N)-X(0))-(S(N )-S(0)))...(3)
機械的彈性變形，是對於給進位置感測器S2的測量值具有比較深的影響，但是對於厚度感測器S1的測 量值的影響比較小。因此，如本實施例，藉由式(3)可以獲得充分實用的修正值△(N)。 The mechanical elastic deformation has a relatively deep influence on the measured value of the feed position sensor S2, but the measurement of the thickness sensor S1 The effect of the magnitude is relatively small. Therefore, as in the present embodiment, a sufficiently practical correction value Δ(N) can be obtained by the equation (3).
依據本實施例的研磨加工方法的話，對於機械的彈性變形的影響小，且在返回控制中無法測量之厚度感測器S1的測量值(工件塊W的表面位置或是厚度)是在研磨的終了時測量，被彈性變形深深影響的給進位置感測器S2的測量值(給進台52的位置或是變位量)是在返回控制彈性變形可以忽視的狀態下測量。因此，在工件塊W的表面位置或是厚度的測量被限制的條件下，在無彈性變形的狀態下磨石2也不會與工件塊W衝突，且，可以使加工時間縮短的方式，將空轉開始位置適切地修正。 According to the grinding processing method of the present embodiment, the influence on the mechanical elastic deformation is small, and the measurement value of the thickness sensor S1 (the surface position or thickness of the workpiece block W) which cannot be measured in the return control is in the grinding. At the end of the measurement, the measured value of the feed position sensor S2 (the position or the displacement amount of the feed table 52) which is deeply affected by the elastic deformation is measured in a state where the return control elastic deformation can be ignored. Therefore, under the condition that the measurement of the surface position or the thickness of the workpiece block W is restricted, the grindstone 2 does not collide with the workpiece block W in the state of no elastic deformation, and the processing time can be shortened. The idling start position is corrected as appropriate.
又，將在給進控制是進行至加工目標位置為止時被測量的S(N)加上了預定的調整的值適用在上述式(3)而算出空轉開始位置的修正值△(N)也可以。例如，預先設想設定好在厚度感測器S1的測量值出現的彈性變形量，加算至給進控制進行至加工目標位置為止時被測量的S(N)也可以。 In addition, the value of S(N) measured when the feed control is performed to the machining target position is applied to the above equation (3), and the correction value Δ(N) of the idle start position is also calculated. can. For example, it is preliminarily assumed that the amount of elastic deformation occurring at the measurement value of the thickness sensor S1 is set, and it is also possible to add S(N) which is measured when the feeding control is performed to the processing target position.
第3實施例所使用的研磨加工裝置，基本上是與第1及第2實施例者具有同樣的構成。但是，本實施例，是與第1及第2實施例相異，研磨加工裝置，是給進控制進行至加工目標位置為止時將厚度感測器S1及給進位置測量器S2的測量值及彈性變形量取得，在從厚度感測器S1及給 進位置測量器S2的測量值被算出的空轉開始位置的修正值將彈性變形量加算使用者。 The polishing apparatus used in the third embodiment basically has the same configuration as those of the first and second embodiments. However, the present embodiment is different from the first and second embodiments in that the polishing processing device measures the thickness sensor S1 and the feed position measuring device S2 when the feeding control is performed to the processing target position. The amount of elastic deformation is obtained from the thickness sensor S1 and given The corrected value of the calculated idling start position of the measured value of the position measuring device S2 is added to the user by the amount of elastic deformation.
因此，本實施例中的研磨加工裝置，是具備將影響厚度感測器S1或是給進位置測量器S2的測量值的機械的彈性變形量直接地測量的測量器。測量器的具體例，是測量施加於磨石旋轉軸55的負荷的測量器。更具體而言，測量器，是測量磨石驅動用的驅動馬達56的電流的測量器。給進控制是到達加工目標位置時的驅動馬達56的電流及彈性變形量d(N)的關係可以由函數表現。 Therefore, the polishing apparatus in the present embodiment is provided with a measuring device that directly measures the amount of mechanical elastic deformation that affects the measured value of the thickness sensor S1 or the feed position measuring device S2. A specific example of the measuring device is a measuring device that measures the load applied to the grinding stone rotating shaft 55. More specifically, the measurer is a measurer that measures the current of the drive motor 56 for driving the grindstone. The relationship between the current of the drive motor 56 and the amount of elastic deformation d(N) when the feed control is reached at the machining target position can be expressed by a function.
以下，說明修正空轉開始位置的處理。 Hereinafter, the process of correcting the idle start position will be described.
首先，控制裝置6，是將給進控制到達加工目標位置時的驅動馬達56的電流及彈性變形量d(N)的關係由如式(4)的函數表現，並預先設定。fd()，~，g、o是預定的函數或是常數。 First, the control device 6 expresses the relationship between the current and the elastic deformation amount d(N) of the drive motor 56 when the feed control reaches the machining target position, and is expressed in advance as a function of the equation (4). Fd(), ~, g, o are predetermined functions or constants.
d(N)=fd(I×(N))~g．I×(N)+o…(4) d(N)=fd(I×(N))~g. I×(N)+o...(4)
一連的給進控制之後，控制裝置6，是給進控制進行至加工目標位置為止時從測量器取得：厚度感測器S1的測量值S(N)、及給進位置測量器S2的測量值X(N)、及驅動馬達56的電流值Ix(N)。 After the continuous feed control, the control device 6 is taken from the measurer when the feed control is performed to the machining target position: the measured value S(N) of the thickness sensor S1, and the measured value of the feed position measuring device S2 X(N), and the current value Ix(N) of the drive motor 56.
控制裝置6，是從被取得的厚度感測器S1的測量值S(N)及給進位置測量器S2的測量值X(N)，藉由式(5)，算出空轉開始位置的修正值△'(N)。 The control device 6 calculates the correction value of the idling start position from the measured value S(N) of the obtained thickness sensor S1 and the measured value X(N) of the feed position measuring device S2 by the equation (5). △ '(N).
△′(N)=-((X(N)-X(0))-(S(N)-S(0)))…(5) △'(N)=-((X(N)-X(0))-(S(N)-S(0))))(5)
進一步，控制裝置6，是藉由上述式(4)，從驅動馬達56的電流值Ix(N)將彈性變形量d(N)算出，藉由在空轉開始位置的修正值△'(N)將彈性變形量d(N)加算，算出考慮了彈性變形的修正值△(N)。 Further, the control device 6 calculates the elastic deformation amount d(N) from the current value Ix(N) of the drive motor 56 by the above formula (4), and the correction value Δ'(N) at the idle start position. The elastic deformation amount d(N) is added to calculate a correction value Δ(N) in consideration of the elastic deformation.
控制裝置6，是使用被算出的修正值△(N)，修正下次的研磨加工中的空轉開始位置。 The control device 6 corrects the idle start position in the next polishing process using the calculated correction value Δ(N).
以上，依據本實施例，因為將依據彈性變形所產生的狀態的測量值算出的空轉開始位置的修正值，使用被測量的彈性變形量修正，所以在無彈性變形的狀態下磨石2不會與工件塊W衝突，且，可以使加工時間縮短的方式，將空轉開始位置適切地修正。 As described above, according to the present embodiment, since the correction value of the idling start position calculated based on the measured value of the state generated by the elastic deformation is corrected using the measured elastic deformation amount, the grindstone 2 does not become in the state of no elastic deformation. The traverse start position is appropriately corrected in such a manner as to collide with the workpiece block W and shorten the machining time.
又，在本實施例中，雖顯示從驅動馬達56的電流值Ix(N)算出彈性變形量d(N)的例，但是本發明不限定於此。其他例，如將歪測量元件安裝在研磨加工裝置的機械，從由該測量元件獲得的測量值，算出彈性變形量d(N)也可以。 Further, in the present embodiment, an example in which the amount of elastic deformation d(N) is calculated from the current value Ix(N) of the drive motor 56 is shown, but the present invention is not limited thereto. In another example, if the 歪 measuring element is attached to the machine of the polishing apparatus, the amount of elastic deformation d(N) may be calculated from the measured value obtained by the measuring element.
且在本實施例中，顯示將機械的彈性變形量藉由實際測量取得的例，但是本發明不限定於此。其他例，如將給進控制進行至被加工目標位置為止時的機械性設想的彈性變形量預先記錄在記憶體，藉由從記憶體將該彈性變形量讀出將彈性變形量取得者也可以。 Further, in the present embodiment, an example in which the amount of mechanical elastic deformation is obtained by actual measurement is shown, but the present invention is not limited thereto. In another example, the amount of elastic deformation assumed by the mechanical behavior when the feeding control is performed to the position to be processed is previously recorded in the memory, and the elastic deformation amount can be read by reading the elastic deformation amount from the memory. .
以上，雖說明了本發明的實施例，但是這些 全部只是說明本發明用的例示，不是將本發明的範圍只有限定在這些的實施例。因此，本發明，在不脫離其實質，可由其他的各式各樣的形態實施。 Although the embodiments of the present invention have been described above, these are All of the examples are merely illustrative of the invention, and the scope of the invention is not limited to the embodiments. Therefore, the present invention can be embodied in other various forms without departing from the spirit thereof.
S12‧‧‧感測器 S12‧‧‧ sensor
1‧‧‧研磨加工裝置 1‧‧‧ Grinding and processing equipment
2‧‧‧磨石 2‧‧‧millstone
30‧‧‧基座構件 30‧‧‧Base member
40‧‧‧工件支撐部 40‧‧‧Workpiece support
41‧‧‧支撐台 41‧‧‧Support table
42‧‧‧工件旋轉軸 42‧‧‧Workpiece rotation axis
42A‧‧‧中心軸 42A‧‧‧Center axis
43‧‧‧驅動馬達 43‧‧‧Drive motor
44‧‧‧挾盤 44‧‧‧挟
50‧‧‧研磨加工部 50‧‧‧ Grinding and Processing Department
51‧‧‧固定台 51‧‧‧ fixed table
52‧‧‧給進台 52‧‧‧To enter the station
53‧‧‧給進驅動部 53‧‧‧Driving drive department
54‧‧‧支撐台 54‧‧‧Support table
55‧‧‧磨石旋轉軸 55‧‧‧ Millstone rotating shaft
55A‧‧‧中心軸 55A‧‧‧Center axis
56‧‧‧驅動馬達 56‧‧‧Drive motor
6‧‧‧控制裝置 6‧‧‧Control device
W‧‧‧工件塊 W‧‧‧Workpiece
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| JP2013015148A JP6023598B2 (en) | 2013-01-30 | 2013-01-30 | Grinding method |
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| KR (1) | KR20150111906A (en) |
| CN (1) | CN104853880A (en) |
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| CN112201606A (en) * | 2020-10-12 | 2021-01-08 | 华海清科股份有限公司 | Wafer centering mechanism with flexible coupling, transmission device and thinning equipment |
| TWI761776B (en) * | 2019-03-22 | 2022-04-21 | 日商住友重機械精科技股份有限公司 | Control device, program and grinding method of grinding device |
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| CN106078515B (en) * | 2016-07-26 | 2018-08-03 | 佛山职业技术学院 | It is a kind of integrate detection, grinding function constant force griding system |
| CN106078511A (en) * | 2016-07-26 | 2016-11-09 | 佛山职业技术学院 | Grinding machine on-line measurement system |
| CN106078510B (en) * | 2016-07-26 | 2019-01-18 | 佛山职业技术学院 | A kind of grinding machine with on-line measurement function |
| CN109202721B (en) * | 2017-07-03 | 2021-12-03 | 株式会社安川电机 | Control method of grinding process, grinding device and robot grinding system |
| JP7135288B2 (en) * | 2017-10-20 | 2022-09-13 | 株式会社ジェイテクト | Grinding machine and grinding method |
| JP2019155488A (en) * | 2018-03-07 | 2019-09-19 | 株式会社東京精密 | Grinding machine |
| JP6973237B2 (en) * | 2018-03-29 | 2021-11-24 | 日本電気硝子株式会社 | How to manufacture flat glass |
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| JPH06270060A (en) * | 1993-03-24 | 1994-09-27 | Shin Meiwa Ind Co Ltd | Grinding reference surface position detector for grinding robot |
| JPH06270061A (en) * | 1993-03-24 | 1994-09-27 | Shin Meiwa Ind Co Ltd | Grinding reference surface position detector for grinding robot |
| JP4338458B2 (en) * | 2003-06-30 | 2009-10-07 | コマツ工機株式会社 | Grinding apparatus and grinding method |
| JP4839720B2 (en) * | 2005-08-04 | 2011-12-21 | トヨタ自動車株式会社 | Precision processing equipment |
| JP2009214217A (en) * | 2008-03-10 | 2009-09-24 | Jtekt Corp | Grinding wheel distal end position correction method and device |
| CN102275131B (en) * | 2011-06-28 | 2013-03-20 | 上海三一精机有限公司 | Monitoring method and monitoring system for detecting processing state of grinding machine |
-
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- 2013-01-30 JP JP2013015148A patent/JP6023598B2/en not_active Expired - Fee Related
- 2013-12-18 CN CN201380064490.5A patent/CN104853880A/en active Pending
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| TWI761776B (en) * | 2019-03-22 | 2022-04-21 | 日商住友重機械精科技股份有限公司 | Control device, program and grinding method of grinding device |
| CN112201606A (en) * | 2020-10-12 | 2021-01-08 | 华海清科股份有限公司 | Wafer centering mechanism with flexible coupling, transmission device and thinning equipment |
| CN112201606B (en) * | 2020-10-12 | 2023-08-25 | 华海清科股份有限公司 | Wafer centering mechanism with flexible coupling, transmission device and thinning equipment |
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| WO2014119163A1 (en) | 2014-08-07 |
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