TW201436704A

TW201436704A - Electronic device with heat dissipation function and heat dissipation module thereof

Info

Publication number: TW201436704A
Application number: TW102109306A
Authority: TW
Inventors: Chuan-Feng Shih; sheng-wen Fu; Hsuan-Ta Wu; Chih-Ming Lai; Jon-Lian Kwo
Original assignee: Jun Zhan Technology Co Ltd
Priority date: 2013-03-15
Filing date: 2013-03-15
Publication date: 2014-09-16

Abstract

An electronic device with heat dissipation function is disclosed. The electronic device includes a hollow casing, and a heat source. An opening is arranged at a first end of the hollow casing, and a plurality of capillary structures are arranged on an internal surface of the hollow casing. The heat source directly covers the opening to form a sealed space within the hollow casing.

Description

具散熱功能之電子裝置及其散熱模組 Electronic device with heat dissipation function and heat dissipation module thereof

本發明係相關於一種電子裝置及其散熱模組，尤指一種可改善散熱效率之電子裝置及其散熱模組。 The invention relates to an electronic device and a heat dissipation module thereof, and more particularly to an electronic device and a heat dissipation module thereof, which can improve heat dissipation efficiency.

散熱裝置與電子產品的發展息息相關。由於電子產品在運作時，電路中的電流會因阻抗的影響而產生不必要的熱能，如果這些熱能不能有效地排除而累積在電子產品內部的電子元件上，電子元件便有可能因為不斷升高的溫度而導致損壞。因此，散熱裝置的優劣影響電子產品的運作甚鉅。尤其對於發光二極體而言，當發光二極體的溫度升高時，發光二極體的發光效率會顯著下降，並縮短發光二極體的使用壽命。隨著發光二極體逐漸被應用於各種照明用途中，發光二極體的散熱問題更加重要。 Heat sinks are closely related to the development of electronic products. Since the current in the circuit generates unnecessary heat due to the influence of the impedance when the electronic product is in operation, if the thermal energy cannot be effectively eliminated and accumulated on the electronic components inside the electronic product, the electronic component may be raised because of the rising The temperature causes damage. Therefore, the advantages and disadvantages of the heat sink affect the operation of electronic products. Especially for the light-emitting diode, when the temperature of the light-emitting diode is increased, the luminous efficiency of the light-emitting diode is significantly lowered, and the service life of the light-emitting diode is shortened. As light-emitting diodes are increasingly being used in a variety of lighting applications, the heat dissipation problem of light-emitting diodes is even more important.

一般而言，習知散熱裝置是利用散熱膏連接於發熱源上以對發熱源進行散熱。然而，散熱膏的熱導係數較其他散熱材料(例如金屬)低，因此使用散熱膏作為散熱裝置及發熱源之間的連接介面會降低散熱裝置的散熱效率，進而影響發光二極體或其他電子產品的效能。 In general, conventional heat sinks are connected to a heat source by means of a heat sink to dissipate heat from the heat source. However, the thermal conductivity of the thermal grease is lower than that of other heat dissipating materials (such as metal). Therefore, the use of the thermal grease as the connection interface between the heat dissipating device and the heat source reduces the heat dissipation efficiency of the heat dissipating device, thereby affecting the light emitting diode or other electrons. Product performance.

本發明之目的在於提供一種可改善散熱效率之電子裝置及其散熱模組，以解決先前技術的問題。 It is an object of the present invention to provide an electronic device and a heat dissipation module thereof that can improve heat dissipation efficiency to solve the problems of the prior art.

本發明之電子裝置包含一中空殼體，及一發熱源。該中空殼體之第一端設有一開口，且該中空殼體之內表面設有複數個毛細結構。該發熱源係直接覆蓋於該開口以和該中空殼體形成一密閉空間。 The electronic device of the present invention comprises a hollow housing and a heat source. The first end of the hollow casing is provided with an opening, and the inner surface of the hollow casing is provided with a plurality of capillary structures. The heat source directly covers the opening to form a sealed space with the hollow casing.

本發明之散熱模組包含一中空殼體，及一管體。該中空殼體之第一端設有一第一開口，且該中空殼體之內表面設有複數個毛細結構。該管體之第一端和該中空殼體之第二端連通，且該管體之第二端設有一第二開口。 The heat dissipation module of the present invention comprises a hollow casing and a pipe body. The first end of the hollow housing is provided with a first opening, and the inner surface of the hollow housing is provided with a plurality of capillary structures. The first end of the tubular body communicates with the second end of the hollow casing, and the second end of the tubular body is provided with a second opening.

相較於先前技術，本發明具散熱功能之電子裝置可直接將發熱源直接覆蓋於散熱模組之開口，使發熱源直接和散熱液體接觸，而不需利用散熱膏作為為散熱模組及發熱源之間的連接介面。因此，本發明具散熱功能之電子裝置可大幅改善散熱效率。 Compared with the prior art, the electronic device with heat dissipation function of the present invention can directly cover the heat source directly to the opening of the heat dissipation module, so that the heat source directly contacts the heat dissipation liquid, without using the heat dissipation paste as the heat dissipation module and the heat generation. The connection interface between the sources. Therefore, the electronic device with heat dissipation function of the present invention can greatly improve heat dissipation efficiency.

100‧‧‧電子裝置 100‧‧‧Electronic devices

110‧‧‧散熱模組 110‧‧‧ Thermal Module

112‧‧‧中空殼體 112‧‧‧ hollow housing

113‧‧‧延伸部 113‧‧‧Extension

114‧‧‧管體 114‧‧‧pipe body

116‧‧‧縱向毛細結構 116‧‧‧Longitudinal capillary structure

117‧‧‧橫向毛細結構 117‧‧‧Transverse capillary structure

118‧‧‧通孔 118‧‧‧through hole

120‧‧‧發熱源 120‧‧‧heat source

122‧‧‧基板 122‧‧‧Substrate

123‧‧‧溝槽 123‧‧‧ trench

124‧‧‧發光二極體 124‧‧‧Lighting diode

H1‧‧‧第一開口 H1‧‧‧ first opening

H2‧‧‧第二開口 H2‧‧‧ second opening

L‧‧‧通孔 L‧‧‧through hole

第1圖為本發明具散熱功能之電子裝置的***示意圖。 FIG. 1 is a schematic exploded view of an electronic device with a heat dissipation function according to the present invention.

第2圖為本發明具散熱功能之電子裝置的組合示意圖。 FIG. 2 is a schematic diagram of the combination of the electronic device with heat dissipation function of the present invention.

第3圖為本發明毛細結構的示意圖。 Figure 3 is a schematic view of the capillary structure of the present invention.

第4圖為本發明另一實施例的散熱模組的示意圖。 FIG. 4 is a schematic diagram of a heat dissipation module according to another embodiment of the present invention.

第5圖為本發明另一實施例的散熱模組的示意圖。 FIG. 5 is a schematic diagram of a heat dissipation module according to another embodiment of the present invention.

第6圖為本發明另一實施例的散熱模組的示意圖。 FIG. 6 is a schematic diagram of a heat dissipation module according to another embodiment of the present invention.

請同時參考第1圖及第2圖。第1圖為本發明具散熱功能之電子裝置100的***示意圖。第2圖為本發明具散熱功能之電子裝置100 的組合示意圖。如圖所示，本發明具散熱功能之電子裝置100包含一散熱模組110及一發熱源120。散熱模組110包含一中空殼體112及一管體114。中空殼體112之第一端設有一第一開口H1，且中空殼體112之內表面設有複數個毛細結構116。管體114之第一端和中空殼體112之第二端互相連通，且管體114之第二端設有一第二開口H2。發熱源120可為電子發熱源，例如電路板、電腦晶片、發光二極體照明單元等。在本實施例中，發熱源120包含一基板122，以及至少一發光二極體124設置於基板122上。 Please refer to both Figure 1 and Figure 2. FIG. 1 is a schematic exploded view of an electronic device 100 with a heat dissipation function according to the present invention. 2 is an electronic device 100 with heat dissipation function of the present invention A schematic diagram of the combination. As shown in the figure, the electronic device 100 with heat dissipation function of the present invention comprises a heat dissipation module 110 and a heat source 120. The heat dissipation module 110 includes a hollow housing 112 and a tube body 114. The first end of the hollow housing 112 is provided with a first opening H1, and the inner surface of the hollow housing 112 is provided with a plurality of capillary structures 116. The first end of the tubular body 114 and the second end of the hollow casing 112 communicate with each other, and the second end of the tubular body 114 is provided with a second opening H2. The heat source 120 can be an electronic heat source such as a circuit board, a computer chip, a light emitting diode lighting unit, or the like. In this embodiment, the heat source 120 includes a substrate 122, and at least one light emitting diode 124 is disposed on the substrate 122.

在本發明電子裝置的製造過程中，基板122可先連接於中空殼體112之第一端以封閉第一開口H1。基板122可以用低溫焊接、熔接、膠和或黏著等方式連接於中空殼體112之第一端。當第一開口H1被基板122封閉後，散熱液體L可從管體114的第二開口H2填充至中空殼體112內，而中空殼體112內之氣體亦可經由的第二開口H2被抽出，以使中空殼體112內的剩餘空間形成真空狀態。之後，管體114的第二開口H2被封閉，以於中空殼體112內形成一密閉空間。管體114的第二開口H2可以用低溫焊接、熔接、膠和、熱壓或超音波壓合等方式封閉。另外，在本發明其他實施例中，本發明亦可封閉管體114第一端和中空殼體112第二端的相互連通處(或者封閉管體114內部通孔118的任何一處)，以於中空殼體112內形成密閉空間。 In the manufacturing process of the electronic device of the present invention, the substrate 122 may be first connected to the first end of the hollow casing 112 to close the first opening H1. The substrate 122 may be attached to the first end of the hollow casing 112 by means of low temperature soldering, welding, glue and or adhesion. After the first opening H1 is closed by the substrate 122, the heat dissipation liquid L may be filled into the hollow casing 112 from the second opening H2 of the pipe body 114, and the gas in the hollow casing 112 may also pass through the second opening H2. It is drawn out to make the remaining space in the hollow casing 112 into a vacuum state. Thereafter, the second opening H2 of the tubular body 114 is closed to form a sealed space in the hollow casing 112. The second opening H2 of the tubular body 114 can be closed by low temperature welding, welding, glue, hot pressing or ultrasonic compression. In addition, in other embodiments of the present invention, the present invention may also close the mutual connection between the first end of the tubular body 114 and the second end of the hollow casing 112 (or close any one of the internal through holes 118 of the tubular body 114) to A sealed space is formed in the hollow casing 112.

依據上述配置，本發明電子裝置100的發熱源120是直接和散熱液體L接觸，而不需透過散熱膏導熱，因此可以提高本發明電子裝置100的散熱效率。當散熱液體L吸熱後可轉變為氣體以吸收更多之熱量，而當氣體凝結成散熱液體時，中空殼體112內表面的毛細結構116可幫助凝結的散熱液體L回流至發熱源120上以再次進行散熱。 According to the above configuration, the heat source 120 of the electronic device 100 of the present invention directly contacts the heat dissipating liquid L without conducting heat through the heat dissipating paste, so that the heat dissipating efficiency of the electronic device 100 of the present invention can be improved. When the heat dissipating liquid L absorbs heat, it can be converted into a gas to absorb more heat, and when the gas condenses into a heat dissipating liquid, the capillary structure 116 on the inner surface of the hollow casing 112 can help the condensed heat dissipating liquid L to flow back to the heat source 120. To dissipate heat again.

另外，在本發明實施例中，散熱液體L包含無機化合物、水、醇類、液態金屬、酮類、冷媒等具揮發性液體。基板122可以由金屬(例如鋁、銅)、陶瓷、石墨、鑽石或以上物質之任意組合所製成，其材料包含熱導係數大於等於20 W/mK的物質。 Further, in the embodiment of the present invention, the heat dissipating liquid L contains a volatile liquid such as an inorganic compound, water, an alcohol, a liquid metal, a ketone, or a refrigerant. The substrate 122 may be made of a metal (for example, aluminum, copper), ceramic, graphite, diamond, or any combination of the above, and the material thereof contains a material having a thermal conductivity of 20 W/mK or more.

請參考第3圖，第3圖為本發明毛細結構的示意圖。如第3圖所示，中空殼體112的內表面上可形成複數個溝槽以作為毛細結構116。其中溝槽之寬度是大於或等於0.01mm，且小於或等於5mm，溝槽之深度是大於或等於0.01mm，且小於或等於5mm，而溝槽之間的間距是大於或等於0.01mm，且小於或等於5mm。另外，溝槽的剖面除了可以是矩形之外，溝槽的剖面亦可以是V形、梯形、倒梯形或U形等形狀。 Please refer to FIG. 3, which is a schematic view of the capillary structure of the present invention. As shown in FIG. 3, a plurality of grooves may be formed on the inner surface of the hollow casing 112 as the capillary structure 116. Wherein the width of the groove is greater than or equal to 0.01 mm and less than or equal to 5 mm, the depth of the groove is greater than or equal to 0.01 mm, and less than or equal to 5 mm, and the spacing between the grooves is greater than or equal to 0.01 mm, and Less than or equal to 5mm. In addition, the cross section of the trench may be a V-shaped, trapezoidal, inverted trapezoidal or U-shaped shape, in addition to being rectangular.

再者，如第1圖及第2圖所示，為了進一步改善散熱效率，基板122面向第一開口H1之一面亦可設有複數個溝槽123，以幫助散熱液體在基板122上流動及分佈。 Furthermore, as shown in FIG. 1 and FIG. 2, in order to further improve the heat dissipation efficiency, a plurality of trenches 123 may be formed on one surface of the substrate 122 facing the first opening H1 to help the heat dissipation liquid flow and distribute on the substrate 122. .

另一方面，本發明毛細結構116並不限定是溝槽式毛細結構，在本發明其他實施例中，毛細結構116亦可以是網狀式毛細結構、纖維式毛細結構或燒結式毛細結構。 On the other hand, the capillary structure 116 of the present invention is not limited to a grooved capillary structure. In other embodiments of the present invention, the capillary structure 116 may also be a mesh capillary structure, a fiber capillary structure or a sintered capillary structure.

請參考第4圖，第4圖為本發明另一實施例的散熱模組110A的示意圖。如第4圖所示，中空殼體112可另包含複數個延伸部113，從中空殼體112之外表面向外延伸，以增加中空殼體112的散熱面積，並進一步提升散熱效率。 Please refer to FIG. 4 , which is a schematic diagram of a heat dissipation module 110A according to another embodiment of the present invention. As shown in FIG. 4, the hollow casing 112 may further include a plurality of extending portions 113 extending outward from the outer surface of the hollow casing 112 to increase the heat dissipation area of the hollow casing 112 and further improve the heat dissipation efficiency.

請參考第5圖，第5圖為本發明另一實施例的散熱模組110B 的示意圖。在第1圖的實施例中，管體114是縱向設置以和中空殼體112連通。然而，如第5圖所示，管體114亦可以是橫向設置以和中空殼體112連通。管體的設置方向可視設計需求決定。 Please refer to FIG. 5 , which is a heat dissipation module 110B according to another embodiment of the present invention. Schematic diagram. In the embodiment of Fig. 1, the tubular body 114 is longitudinally disposed to communicate with the hollow casing 112. However, as shown in FIG. 5, the tubular body 114 may also be laterally disposed to communicate with the hollow casing 112. The direction in which the tube is placed can be determined by the design requirements.

請參考第6圖，第6圖為本發明另一實施例的散熱模組110C的示意圖。在第1圖的實施例中，中空殼體112內表面是設置縱向的毛細結構116以幫助凝結的散熱液體回流至發熱源。如第6圖所示，中空殼體112內表面可另外設置橫向的毛細結構117，以進一步幫助凝結的散熱液體回流至發熱源。 Please refer to FIG. 6. FIG. 6 is a schematic diagram of a heat dissipation module 110C according to another embodiment of the present invention. In the embodiment of Figure 1, the inner surface of the hollow casing 112 is provided with a longitudinal capillary structure 116 to assist in the return of the condensed heat-dissipating liquid to the heat source. As shown in Fig. 6, a lateral capillary structure 117 may be additionally provided on the inner surface of the hollow casing 112 to further assist the backflow of the condensed heat-dissipating liquid to the heat source.

另外，發熱源120可另包含一封裝單元用以包覆發光二極體124，封裝單元可由矽樹脂(silicone)、環氧樹脂(epoxy)、低溫融化玻璃、壓克力、聚合物等熱固形透光材料製成，且封裝單元可另含有螢光材料用以轉換光線波長。封裝單元可以用射出成形方式製成。中空殼體112可以用金屬鑄造、模鑄、沖壓、鋁擠成形等方式製成。 In addition, the heat source 120 may further include a package unit for encapsulating the light emitting diode 124, and the package unit may be formed by a silicone, an epoxy, a low temperature melting glass, an acrylic, a polymer, etc. The light transmissive material is made, and the package unit may further comprise a fluorescent material for converting the wavelength of the light. The package unit can be made by injection molding. The hollow casing 112 can be formed by metal casting, die casting, stamping, aluminum extrusion molding, or the like.

以上所述僅為本發明之較佳實施例，凡依本發明申請專利範圍所做之均等變化與修飾，皆應屬本發明之涵蓋範圍。 The above are only the preferred embodiments of the present invention, and all changes and modifications made to the scope of the present invention should be within the scope of the present invention.

100‧‧‧電子裝置 100‧‧‧Electronic devices

110‧‧‧散熱模組 110‧‧‧ Thermal Module

112‧‧‧中空殼體 112‧‧‧ hollow housing

114‧‧‧管體 114‧‧‧pipe body

116‧‧‧毛細結構 116‧‧‧Capillary structure

118‧‧‧通孔 118‧‧‧through hole

120‧‧‧發熱源 120‧‧‧heat source

122‧‧‧基板 122‧‧‧Substrate

123‧‧‧溝槽 123‧‧‧ trench

124‧‧‧發光二極體 124‧‧‧Lighting diode

L‧‧‧通孔 L‧‧‧through hole

Claims

一種具散熱功能之電子裝置，包含：一中空殼體，該中空殼體之第一端設有一開口，且該中空殼體之內表面設有複數個毛細結構；一發熱源，直接覆蓋於該開口以和該中空殼體形成一密閉空間。 An electronic device with a heat dissipation function, comprising: a hollow casing, the first end of the hollow casing is provided with an opening, and the inner surface of the hollow casing is provided with a plurality of capillary structures; a heat source directly Covering the opening to form a sealed space with the hollow casing.

如請求項1所述之電子裝置，其中該發熱源包含：一基板，連接於該中空殼體之第一端以封閉該開口；以及至少一發光二極體，設置於該基板上。 The electronic device of claim 1, wherein the heat generating source comprises: a substrate connected to the first end of the hollow casing to close the opening; and at least one light emitting diode disposed on the substrate.

如請求項2所述之電子裝置，其中該基板係以低溫焊接、熔接、膠和或黏著方式連接於該中空殼體之第一端以封閉該開口。 The electronic device of claim 2, wherein the substrate is attached to the first end of the hollow housing by low temperature soldering, welding, glue and or adhesive to close the opening.

如請求項2所述之電子裝置，其中該基板材料包含金屬、陶瓷、石墨、鑽石或其他高熱導率的物質。 The electronic device of claim 2, wherein the substrate material comprises metal, ceramic, graphite, diamond or other high thermal conductivity material.

如請求項2所述之電子裝置，其中該基板面向該開口之一面設有複數個溝槽。 The electronic device of claim 2, wherein the substrate faces a face of the opening with a plurality of grooves.

如請求項1所述之電子裝置，另包含一散熱液體設置於該密閉空間內。 The electronic device of claim 1, further comprising a heat dissipating liquid disposed in the sealed space.

如請求項6所述之電子裝置，其中該散熱液體係包含無機化合物、水、醇類、液態金屬、酮類、冷媒。 The electronic device according to claim 6, wherein the heat dissipation liquid system comprises an inorganic compound, water, an alcohol, a liquid metal, a ketone, and a refrigerant.

如請求項1所述之電子裝置，另包含一管體設置於該中空殼體之第二端，用以填充該散熱液體於該中空殼體內，其中該管體之一通孔係於該散熱液體填充於該中空殼體內後被封閉。 The electronic device of claim 1, further comprising a tube body disposed at the second end of the hollow housing for filling the heat dissipation liquid in the hollow housing, wherein a through hole of the tube body is Heat dissipation The liquid is sealed after being filled in the hollow casing.

如請求項8所述之電子裝置，其中該管體之該通孔係以低溫焊接、熔接、膠和、熱壓或超音波壓合方式被封閉。 The electronic device of claim 8, wherein the through hole of the tube body is closed by low temperature soldering, welding, glue, hot pressing or ultrasonic compression.

如請求項1所述之電子裝置，其中該複數個毛細結構包含複數個溝槽。 The electronic device of claim 1, wherein the plurality of capillary structures comprise a plurality of grooves.

如請求項5或10所述之電子裝置，其中該複數個溝槽之剖面係為矩形、V形、梯形、倒梯形或U形等。 The electronic device of claim 5 or 10, wherein the plurality of grooves have a rectangular, V-shaped, trapezoidal, inverted trapezoidal or U-shaped cross section.

如請求項5或10所述之電子裝置，其中該複數個溝槽之寬度大於或等於0.01mm，且小於或等於5mm，該複數個溝槽之深度大於或等於0.01mm，且小於或等於5mm，該複數個溝槽之之間的間距大於或等於0.01mm，且小於或等於5mm。 The electronic device of claim 5, wherein the width of the plurality of grooves is greater than or equal to 0.01 mm and less than or equal to 5 mm, and the depth of the plurality of grooves is greater than or equal to 0.01 mm and less than or equal to 5 mm. The spacing between the plurality of trenches is greater than or equal to 0.01 mm and less than or equal to 5 mm.

如請求項1所述之電子裝置，其中該中空殼體另包含複數個延伸部，從該中空殼體之外表面向外延伸。 The electronic device of claim 1, wherein the hollow housing further comprises a plurality of extensions extending outwardly from an outer surface of the hollow housing.