TW201407636A - A conductive paste composition - Google Patents
A conductive paste composition Download PDFInfo
- Publication number
- TW201407636A TW201407636A TW102118301A TW102118301A TW201407636A TW 201407636 A TW201407636 A TW 201407636A TW 102118301 A TW102118301 A TW 102118301A TW 102118301 A TW102118301 A TW 102118301A TW 201407636 A TW201407636 A TW 201407636A
- Authority
- TW
- Taiwan
- Prior art keywords
- conductive paste
- paste composition
- hydrophilic
- hydrophobic
- group
- Prior art date
Links
- 239000000203 mixture Substances 0.000 title claims abstract description 116
- 230000002209 hydrophobic effect Effects 0.000 claims abstract description 62
- 229910052751 metal Inorganic materials 0.000 claims abstract description 58
- 239000002184 metal Substances 0.000 claims abstract description 58
- 239000011521 glass Substances 0.000 claims abstract description 44
- 239000002904 solvent Substances 0.000 claims abstract description 40
- 239000011230 binding agent Substances 0.000 claims abstract description 39
- 239000000654 additive Substances 0.000 claims abstract description 33
- 230000000996 additive effect Effects 0.000 claims abstract description 33
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 32
- 229910052709 silver Inorganic materials 0.000 claims description 27
- 239000004332 silver Substances 0.000 claims description 27
- 235000014113 dietary fatty acids Nutrition 0.000 claims description 16
- 239000000194 fatty acid Substances 0.000 claims description 16
- 229930195729 fatty acid Natural products 0.000 claims description 16
- 239000012052 hydrophilic carrier Substances 0.000 claims description 16
- 239000012051 hydrophobic carrier Substances 0.000 claims description 16
- 239000004094 surface-active agent Substances 0.000 claims description 16
- 239000000126 substance Substances 0.000 claims description 15
- 239000002245 particle Substances 0.000 claims description 13
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 12
- 239000010931 gold Substances 0.000 claims description 12
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 11
- 150000004665 fatty acids Chemical class 0.000 claims description 11
- 238000005245 sintering Methods 0.000 claims description 10
- -1 sorbitan fatty acid esters Chemical class 0.000 claims description 10
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 claims description 9
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 claims description 6
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 claims description 6
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 239000010949 copper Substances 0.000 claims description 6
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 6
- 229910052737 gold Inorganic materials 0.000 claims description 6
- 229910052759 nickel Inorganic materials 0.000 claims description 6
- 229910015902 Bi 2 O 3 Inorganic materials 0.000 claims description 5
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 claims description 5
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 claims description 4
- 239000000853 adhesive Substances 0.000 claims description 4
- 230000001070 adhesive effect Effects 0.000 claims description 4
- LZCLXQDLBQLTDK-UHFFFAOYSA-N ethyl 2-hydroxypropanoate Chemical compound CCOC(=O)C(C)O LZCLXQDLBQLTDK-UHFFFAOYSA-N 0.000 claims description 4
- IPCSVZSSVZVIGE-UHFFFAOYSA-N hexadecanoic acid Chemical compound CCCCCCCCCCCCCCCC(O)=O IPCSVZSSVZVIGE-UHFFFAOYSA-N 0.000 claims description 4
- 150000002739 metals Chemical class 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 4
- 239000003381 stabilizer Substances 0.000 claims description 4
- WRIDQFICGBMAFQ-UHFFFAOYSA-N (E)-8-Octadecenoic acid Natural products CCCCCCCCCC=CCCCCCCC(O)=O WRIDQFICGBMAFQ-UHFFFAOYSA-N 0.000 claims description 3
- OAYXUHPQHDHDDZ-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethanol Chemical compound CCCCOCCOCCO OAYXUHPQHDHDDZ-UHFFFAOYSA-N 0.000 claims description 3
- LQJBNNIYVWPHFW-UHFFFAOYSA-N 20:1omega9c fatty acid Natural products CCCCCCCCCCC=CCCCCCCCC(O)=O LQJBNNIYVWPHFW-UHFFFAOYSA-N 0.000 claims description 3
- QSBYPNXLFMSGKH-UHFFFAOYSA-N 9-Heptadecensaeure Natural products CCCCCCCC=CCCCCCCCC(O)=O QSBYPNXLFMSGKH-UHFFFAOYSA-N 0.000 claims description 3
- 229910018137 Al-Zn Inorganic materials 0.000 claims description 3
- 229910018573 Al—Zn Inorganic materials 0.000 claims description 3
- 229920002153 Hydroxypropyl cellulose Polymers 0.000 claims description 3
- 239000005642 Oleic acid Substances 0.000 claims description 3
- ZQPPMHVWECSIRJ-UHFFFAOYSA-N Oleic acid Natural products CCCCCCCCC=CCCCCCCCC(O)=O ZQPPMHVWECSIRJ-UHFFFAOYSA-N 0.000 claims description 3
- 229920002125 Sokalan® Polymers 0.000 claims description 3
- 239000002518 antifoaming agent Substances 0.000 claims description 3
- 229910000416 bismuth oxide Inorganic materials 0.000 claims description 3
- TYIXMATWDRGMPF-UHFFFAOYSA-N dibismuth;oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Bi+3].[Bi+3] TYIXMATWDRGMPF-UHFFFAOYSA-N 0.000 claims description 3
- 239000002270 dispersing agent Substances 0.000 claims description 3
- 239000001863 hydroxypropyl cellulose Substances 0.000 claims description 3
- 235000010977 hydroxypropyl cellulose Nutrition 0.000 claims description 3
- QXJSBBXBKPUZAA-UHFFFAOYSA-N isooleic acid Natural products CCCCCCCC=CCCCCCCCCC(O)=O QXJSBBXBKPUZAA-UHFFFAOYSA-N 0.000 claims description 3
- 229920000609 methyl cellulose Polymers 0.000 claims description 3
- ZQPPMHVWECSIRJ-KTKRTIGZSA-N oleic acid Chemical compound CCCCCCCC\C=C/CCCCCCCC(O)=O ZQPPMHVWECSIRJ-KTKRTIGZSA-N 0.000 claims description 3
- 239000004584 polyacrylic acid Substances 0.000 claims description 3
- 239000002562 thickening agent Substances 0.000 claims description 3
- 239000013008 thixotropic agent Substances 0.000 claims description 3
- 239000011701 zinc Substances 0.000 claims description 3
- DURPTKYDGMDSBL-UHFFFAOYSA-N 1-butoxybutane Chemical compound CCCCOCCCC DURPTKYDGMDSBL-UHFFFAOYSA-N 0.000 claims description 2
- VXQBJTKSVGFQOL-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethyl acetate Chemical compound CCCCOCCOCCOC(C)=O VXQBJTKSVGFQOL-UHFFFAOYSA-N 0.000 claims description 2
- NQBXSWAWVZHKBZ-UHFFFAOYSA-N 2-butoxyethyl acetate Chemical compound CCCCOCCOC(C)=O NQBXSWAWVZHKBZ-UHFFFAOYSA-N 0.000 claims description 2
- LPEKGGXMPWTOCB-UHFFFAOYSA-N 8beta-(2,3-epoxy-2-methylbutyryloxy)-14-acetoxytithifolin Natural products COC(=O)C(C)O LPEKGGXMPWTOCB-UHFFFAOYSA-N 0.000 claims description 2
- 229920000896 Ethulose Polymers 0.000 claims description 2
- 239000001859 Ethyl hydroxyethyl cellulose Substances 0.000 claims description 2
- 229920000663 Hydroxyethyl cellulose Polymers 0.000 claims description 2
- 239000004354 Hydroxyethyl cellulose Substances 0.000 claims description 2
- 235000021314 Palmitic acid Nutrition 0.000 claims description 2
- 229920003171 Poly (ethylene oxide) Polymers 0.000 claims description 2
- 229920002845 Poly(methacrylic acid) Polymers 0.000 claims description 2
- 239000002202 Polyethylene glycol Substances 0.000 claims description 2
- 239000004372 Polyvinyl alcohol Substances 0.000 claims description 2
- 235000021355 Stearic acid Nutrition 0.000 claims description 2
- OVPKWUBYBLOGGY-UHFFFAOYSA-N [Pb].[Bi].[B] Chemical compound [Pb].[Bi].[B] OVPKWUBYBLOGGY-UHFFFAOYSA-N 0.000 claims description 2
- 235000011054 acetic acid Nutrition 0.000 claims description 2
- WUOACPNHFRMFPN-UHFFFAOYSA-N alpha-terpineol Chemical compound CC1=CCC(C(C)(C)O)CC1 WUOACPNHFRMFPN-UHFFFAOYSA-N 0.000 claims description 2
- SQIFACVGCPWBQZ-UHFFFAOYSA-N delta-terpineol Natural products CC(C)(O)C1CCC(=C)CC1 SQIFACVGCPWBQZ-UHFFFAOYSA-N 0.000 claims description 2
- ODQWQRRAPPTVAG-GZTJUZNOSA-N doxepin Chemical compound C1OC2=CC=CC=C2C(=C/CCN(C)C)/C2=CC=CC=C21 ODQWQRRAPPTVAG-GZTJUZNOSA-N 0.000 claims description 2
- 239000003822 epoxy resin Substances 0.000 claims description 2
- 235000019326 ethyl hydroxyethyl cellulose Nutrition 0.000 claims description 2
- 229940116333 ethyl lactate Drugs 0.000 claims description 2
- 235000019447 hydroxyethyl cellulose Nutrition 0.000 claims description 2
- 229940057867 methyl lactate Drugs 0.000 claims description 2
- 239000001923 methylcellulose Substances 0.000 claims description 2
- WQEPLUUGTLDZJY-UHFFFAOYSA-N n-Pentadecanoic acid Natural products CCCCCCCCCCCCCCC(O)=O WQEPLUUGTLDZJY-UHFFFAOYSA-N 0.000 claims description 2
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 claims description 2
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 claims description 2
- 235000021313 oleic acid Nutrition 0.000 claims description 2
- 125000006353 oxyethylene group Chemical group 0.000 claims description 2
- 239000005011 phenolic resin Substances 0.000 claims description 2
- 229920000647 polyepoxide Polymers 0.000 claims description 2
- 229920001225 polyester resin Polymers 0.000 claims description 2
- 239000004645 polyester resin Substances 0.000 claims description 2
- 229920001223 polyethylene glycol Polymers 0.000 claims description 2
- 229920002635 polyurethane Polymers 0.000 claims description 2
- 239000004814 polyurethane Substances 0.000 claims description 2
- 229920005749 polyurethane resin Polymers 0.000 claims description 2
- 229920002689 polyvinyl acetate Polymers 0.000 claims description 2
- 239000011118 polyvinyl acetate Substances 0.000 claims description 2
- 229920002451 polyvinyl alcohol Polymers 0.000 claims description 2
- 229920000915 polyvinyl chloride Polymers 0.000 claims description 2
- 239000000843 powder Substances 0.000 claims description 2
- ILVGAIQLOCKNQA-UHFFFAOYSA-N propyl 2-hydroxypropanoate Chemical compound CCCOC(=O)C(C)O ILVGAIQLOCKNQA-UHFFFAOYSA-N 0.000 claims description 2
- 239000008117 stearic acid Substances 0.000 claims description 2
- 229940116411 terpineol Drugs 0.000 claims description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 2
- 229920002554 vinyl polymer Polymers 0.000 claims description 2
- RRQYJINTUHWNHW-UHFFFAOYSA-N 1-ethoxy-2-(2-ethoxyethoxy)ethane Chemical compound CCOCCOCCOCC RRQYJINTUHWNHW-UHFFFAOYSA-N 0.000 claims 1
- LIKMAJRDDDTEIG-UHFFFAOYSA-N 1-hexene Chemical compound CCCCC=C LIKMAJRDDDTEIG-UHFFFAOYSA-N 0.000 claims 1
- 239000004925 Acrylic resin Substances 0.000 claims 1
- 229920000178 Acrylic resin Polymers 0.000 claims 1
- 150000001412 amines Chemical class 0.000 claims 1
- 239000001913 cellulose Substances 0.000 claims 1
- 229920002678 cellulose Polymers 0.000 claims 1
- 229940019778 diethylene glycol diethyl ether Drugs 0.000 claims 1
- 239000000835 fiber Substances 0.000 claims 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 claims 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 claims 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 claims 1
- 239000004926 polymethyl methacrylate Substances 0.000 claims 1
- 238000000034 method Methods 0.000 description 20
- 238000007639 printing Methods 0.000 description 17
- 230000000052 comparative effect Effects 0.000 description 10
- 238000007650 screen-printing Methods 0.000 description 9
- 238000002156 mixing Methods 0.000 description 8
- 239000011248 coating agent Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000009792 diffusion process Methods 0.000 description 4
- 239000006185 dispersion Substances 0.000 description 4
- 238000000227 grinding Methods 0.000 description 4
- 230000000704 physical effect Effects 0.000 description 4
- 229910052797 bismuth Inorganic materials 0.000 description 3
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- 238000001000 micrograph Methods 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 230000009974 thixotropic effect Effects 0.000 description 3
- SVTBMSDMJJWYQN-UHFFFAOYSA-N 2-methylpentane-2,4-diol Chemical compound CC(O)CC(C)(C)O SVTBMSDMJJWYQN-UHFFFAOYSA-N 0.000 description 2
- GJCOSYZMQJWQCA-UHFFFAOYSA-N 9H-xanthene Chemical compound C1=CC=C2CC3=CC=CC=C3OC2=C1 GJCOSYZMQJWQCA-UHFFFAOYSA-N 0.000 description 2
- 239000001856 Ethyl cellulose Substances 0.000 description 2
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 description 2
- 229920001213 Polysorbate 20 Polymers 0.000 description 2
- DBMJMQXJHONAFJ-UHFFFAOYSA-M Sodium laurylsulphate Chemical compound [Na+].CCCCCCCCCCCCOS([O-])(=O)=O DBMJMQXJHONAFJ-UHFFFAOYSA-M 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 235000019325 ethyl cellulose Nutrition 0.000 description 2
- 229920001249 ethyl cellulose Polymers 0.000 description 2
- 239000000256 polyoxyethylene sorbitan monolaurate Substances 0.000 description 2
- 235000010486 polyoxyethylene sorbitan monolaurate Nutrition 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 238000010298 pulverizing process Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 239000012756 surface treatment agent Substances 0.000 description 2
- 229920001285 xanthan gum Polymers 0.000 description 2
- DAFHKNAQFPVRKR-UHFFFAOYSA-N (3-hydroxy-2,2,4-trimethylpentyl) 2-methylpropanoate Chemical compound CC(C)C(O)C(C)(C)COC(=O)C(C)C DAFHKNAQFPVRKR-UHFFFAOYSA-N 0.000 description 1
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 1
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- 239000004254 Ammonium phosphate Substances 0.000 description 1
- CPELXLSAUQHCOX-UHFFFAOYSA-M Bromide Chemical compound [Br-] CPELXLSAUQHCOX-UHFFFAOYSA-M 0.000 description 1
- LZZYPRNAOMGNLH-UHFFFAOYSA-M Cetrimonium bromide Chemical compound [Br-].CCCCCCCCCCCCCCCC[N+](C)(C)C LZZYPRNAOMGNLH-UHFFFAOYSA-M 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 238000005054 agglomeration Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 229920003180 amino resin Polymers 0.000 description 1
- 229910000148 ammonium phosphate Inorganic materials 0.000 description 1
- 235000019289 ammonium phosphates Nutrition 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- BEJRNLMOMBGWFU-UHFFFAOYSA-N bismuth boron Chemical compound [B].[Bi] BEJRNLMOMBGWFU-UHFFFAOYSA-N 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- MNNHAPBLZZVQHP-UHFFFAOYSA-N diammonium hydrogen phosphate Chemical compound [NH4+].[NH4+].OP([O-])([O-])=O MNNHAPBLZZVQHP-UHFFFAOYSA-N 0.000 description 1
- XXJWXESWEXIICW-UHFFFAOYSA-N diethylene glycol monoethyl ether Chemical compound CCOCCOCCO XXJWXESWEXIICW-UHFFFAOYSA-N 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000001761 ethyl methyl cellulose Substances 0.000 description 1
- 235000010944 ethyl methyl cellulose Nutrition 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229940051250 hexylene glycol Drugs 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 235000010981 methylcellulose Nutrition 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 229920000768 polyamine Polymers 0.000 description 1
- 229920000223 polyglycerol Polymers 0.000 description 1
- 229920000193 polymethacrylate Polymers 0.000 description 1
- 229920000136 polysorbate Polymers 0.000 description 1
- 239000002243 precursor Substances 0.000 description 1
- 238000000935 solvent evaporation Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- GPRLSGONYQIRFK-MNYXATJNSA-N triton Chemical compound [3H+] GPRLSGONYQIRFK-MNYXATJNSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/14—Conductive material dispersed in non-conductive inorganic material
- H01B1/16—Conductive material dispersed in non-conductive inorganic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
- H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/022425—Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Landscapes
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Inorganic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Sustainable Energy (AREA)
- Conductive Materials (AREA)
- Photovoltaic Devices (AREA)
Abstract
Description
本發明有關一種用於太陽能電池電極的導電膏組成物，其可提高太陽能電池的電特性，其係藉由防止網版印刷後之線寬擴散，並可輕易控制線寬以增加細線寬與高寬比來提高前述電特性。 The invention relates to a conductive paste composition for a solar cell electrode, which can improve the electrical characteristics of the solar cell by preventing the line width diffusion after screen printing, and can easily control the line width to increase the thin line width and height. The width ratio is used to increase the aforementioned electrical characteristics.
太陽能電池的前電極主要是由網版印刷製程所製造。是以，用於前電極與背電極的導電膏組成物，都在考量到適用於網版印刷製程之印刷性的條件下予以製備，但是，實際上藉由在前電極實現所需線寬而達到高解析度是很困難的。 The front electrode of the solar cell is mainly manufactured by a screen printing process. Therefore, the conductive paste composition for the front electrode and the back electrode is prepared under consideration of the printability suitable for the screen printing process, but actually, the desired line width is achieved by the front electrode. It is very difficult to achieve high resolution.
在習知方法中，舉例來說，使用銀導電膏組成物來製造前電極的諸多例子中，雖然用來網版印刷前電極的遮罩已經製造成線寬為80μm，但是實際印刷以後，前電極的線寬卻會增加10至20μm。就此點而論，太陽能電池的光接收表面會變小，導致太陽能電池的特性變差。 In the conventional method, for example, in many examples in which a silver conductive paste composition is used to manufacture a front electrode, although a mask for a front electrode for screen printing has been manufactured to have a line width of 80 μm, after actual printing, before The line width of the electrode is increased by 10 to 20 μm. As such, the light receiving surface of the solar cell becomes small, resulting in deterioration of the characteristics of the solar cell.
就無機物質在導電膏組成物中的分散性而言，在多數習知導電膏組成物中都含有之相同類型的無機表面處理劑以及有機物質，才能夠使導電膏組成物具有最大的分散性。然而，若是無法選用 最佳組成物，就會因為印刷後線寬過度擴散或表面粗糙而難以製得具有所需特性的電極。 In terms of the dispersibility of the inorganic substance in the conductive paste composition, the same type of inorganic surface treatment agent and organic substance are contained in most conventional conductive paste compositions to maximize the dispersion of the conductive paste composition. . However, if it is not available The optimum composition is difficult to produce an electrode having desired characteristics because the line width is excessively spread or the surface is rough after printing.
韓國專利公開第2011-0011974號揭示一種塗佈帶有親水性物質之疏水性薄膜的方法，其係透過加熱該疏水性薄膜，之後分別滴入親水性溶液於其上，然後再進行溶劑蒸發而完成。不過，此方法只是透過滴入親水性溶液來塗佈疏水性薄膜的方法。因此，該親水性溶液的組成成分並未揭露，在太陽能電池電極的形成上並無法達成細線寬，而且可能會有線寬擴散或表面粗糙等情況發生。 Korean Patent Publication No. 2011-0011974 discloses a method of coating a hydrophobic film with a hydrophilic substance by heating the hydrophobic film, and then dropping a hydrophilic solution thereon, followed by solvent evaporation. carry out. However, this method is only a method of coating a hydrophobic film by dropping a hydrophilic solution. Therefore, the composition of the hydrophilic solution is not disclosed, and the thin line width cannot be achieved in the formation of the solar cell electrode, and the wire may be spread widely or the surface may be rough.
本發明之一目的在於提供一種具有極高解析度性能的導電膏組成物，其係透過結合使用一親水性導電金屬、一疏水性黏合劑以及一疏水性溶劑，或者是結合使用一疏水性導電金屬、一親水性黏合劑以及一親水性溶劑所製備。 An object of the present invention is to provide a conductive paste composition having extremely high resolution performance by using a hydrophilic conductive metal, a hydrophobic adhesive and a hydrophobic solvent, or a combination of hydrophobic conductive materials. It is prepared from a metal, a hydrophilic binder, and a hydrophilic solvent.
本發明之另一目的在於提供一種能夠提升太陽能電池之特性的導電膏組成物，其可防止線寬擴散，且能夠增加線高，以提升高寬比以及改進電特性。 Another object of the present invention is to provide a conductive paste composition capable of improving characteristics of a solar cell, which can prevent line width diffusion, and can increase line height to improve aspect ratio and improve electrical characteristics.
本發明提供一種導電膏組成物，包括有(a)一親水性導電金屬、一疏水性載體(vehicle)、一玻璃料(glass frit)以及一添加劑，或是(b)一疏水性導電金屬、一親水性載體、一玻璃料以及一添加劑，其 中該疏水性載體包括有一疏水性黏合劑以及一疏水性溶劑，而該親水性載體包括有一親水性黏合劑以及一親水性溶劑。 The present invention provides a conductive paste composition comprising (a) a hydrophilic conductive metal, a hydrophobic carrier, a glass frit and an additive, or (b) a hydrophobic conductive metal, a hydrophilic carrier, a glass frit, and an additive, The hydrophobic carrier comprises a hydrophobic binder and a hydrophobic solvent, and the hydrophilic carrier comprises a hydrophilic binder and a hydrophilic solvent.
最好，本發明係提供一種導電膏組成物，其包括有40至90重量百分比(以下簡寫為wt%)之該親水性導電金屬、1至20wt%之該疏水性黏合劑、1至30wt%之該疏水性溶劑、1至10wt%之該玻璃料、以及0.01至5wt%之該添加劑。 Preferably, the present invention provides a conductive paste composition comprising 40 to 90% by weight (hereinafter abbreviated as wt%) of the hydrophilic conductive metal, 1 to 20% by weight of the hydrophobic adhesive, and 1 to 30% by weight. The hydrophobic solvent, 1 to 10% by weight of the glass frit, and 0.01 to 5% by weight of the additive.
更且，本發明係提供一種導電膏組成物，其包括有40至90wt%之該疏水性導電金屬、1至20wt%之該親水性黏合劑、1至30wt%之該親水性溶劑、1至10wt%之該玻璃料、以及0.01至5wt%之該添加劑。 Furthermore, the present invention provides a conductive paste composition comprising 40 to 90% by weight of the hydrophobic conductive metal, 1 to 20% by weight of the hydrophilic binder, 1 to 30% by weight of the hydrophilic solvent, 1 to 10% by weight of the glass frit, and 0.01 to 5% by weight of the additive.
再者，本發明提供一種包括有使用上述導電膏組成物製成之電極的太陽能電池。最好，本發明提供一種包括有一前電極的太陽能電池，該前電極具有20至35%的高寬比以及等於或低於3的串聯電阻(Rs)。 Furthermore, the present invention provides a solar cell including an electrode made using the above conductive paste composition. Preferably, the present invention provides a solar cell including a front electrode having an aspect ratio of 20 to 35% and a series resistance (Rs) equal to or lower than 3.
以下進一步詳細說明本發明。 The invention is further described in detail below.
本發明有關一種能夠達成所需線寬的導電膏組成物，前述導電膏組成物係結合使用一親水性導電金屬以及一疏水性載體，或者是結合使用一疏水性導電金屬以及一親水性載體予以製備，並且，前述導電膏組成物用於進行網版印刷製程。 The present invention relates to a conductive paste composition capable of achieving a desired line width, wherein the conductive paste composition is combined with a hydrophilic conductive metal and a hydrophobic carrier, or a combination of a hydrophobic conductive metal and a hydrophilic carrier is used. The conductive paste composition described above is prepared and used for a screen printing process.
在本發明中，利用上述結合使用兩種物質所製備的導電膏組成物係用來實現所需線寬，從而獲得足夠之太陽能電池的太陽光 接收表面。因此，本發明藉由防止短路電流(Isc)損失來提升太陽能電池之效能。 In the present invention, the conductive paste composition prepared by using the above two materials in combination is used to achieve a desired line width, thereby obtaining sufficient solar cell sunlight. Receiving surface. Therefore, the present invention enhances the performance of a solar cell by preventing short circuit current (Isc) loss.
此外，透過結合使用該親水性導電金屬以及該疏水性載體，或者是結合使用該疏水性導電金屬以及該親水性載體所製備的導電膏組成物可被賦予高觸變指數(thixo index,TI)，從而實現具有高的高度的預定線寬，亦即高的高寬比。因此，在本發明中，相同的線寬可以獲得低電阻，使太陽能電池的Rs值可被縮減，藉以提升太陽能電池的效能。 Further, the conductive paste composition prepared by using the hydrophilic conductive metal in combination with the hydrophobic carrier or the hydrophobic conductive metal and the hydrophilic carrier may be imparted with a high thixotropic index (TI). Thereby, a predetermined line width having a high height, that is, a high aspect ratio is achieved. Therefore, in the present invention, the same line width can obtain low resistance, so that the Rs value of the solar cell can be reduced, thereby improving the performance of the solar cell.
更且，由於本發明所製備的導電膏組成物展現出適用於網版印刷的流變性質，因此縱使該導電膏組成物在低剪切速率(shear rate)下具有高黏度，其於印刷過程中的高剪切速率下仍具有優異的遮罩出料特性。因此，本發明之導電膏組成物在細線寬的條件下具有優異的出料特性，以致能夠實現細線寬以及優異的印刷性。 Moreover, since the conductive paste composition prepared by the present invention exhibits rheological properties suitable for screen printing, even if the conductive paste composition has high viscosity at a low shear rate, it is in the printing process. It still has excellent mask discharge characteristics at high shear rates. Therefore, the conductive paste composition of the present invention has excellent discharge characteristics under conditions of fine line width, so that fine line width and excellent printability can be achieved.
再者，於本發明中，性質相異之無機表面處理劑以及有機物質係應用於本發明的導電膏組成物中，並且，選用最佳組成成分使前述兩者的性質能夠對導電膏組成物的分散性以及印刷性有最佳的影響。如此，本發明的導電膏組成物能夠實現細線寬以及高的高寬比。 Further, in the present invention, inorganic surface treating agents and organic substances having different properties are applied to the conductive paste composition of the present invention, and the optimum composition is selected so that the properties of the foregoing two can be applied to the conductive paste composition. The dispersion and printability have the best impact. Thus, the conductive paste composition of the present invention can achieve a fine line width and a high aspect ratio.
具體而言，本發明一較佳實施例係提供一種導電膏組成物，其包括有(a)一親水性導電金屬、一疏水性載體、一玻璃料以及一添加劑，或者是(b)一疏水性導電金屬、一親水性載體、一玻璃料以及一添加劑，其中，該疏水性載體包括一疏水性黏合劑以及一疏水性溶劑，而該親水性載體包括一親水性黏合劑以及一親水性溶劑。 Specifically, a preferred embodiment of the present invention provides a conductive paste composition comprising (a) a hydrophilic conductive metal, a hydrophobic carrier, a glass frit and an additive, or (b) a hydrophobic a conductive metal, a hydrophilic carrier, a glass frit, and an additive, wherein the hydrophobic carrier comprises a hydrophobic binder and a hydrophobic solvent, and the hydrophilic carrier comprises a hydrophilic binder and a hydrophilic solvent .
在本發明中，性質相異的金屬以及黏合劑係用來提高印刷後之電極的高寬比，以實現細線寬，因此，可降低電極的電阻以提升太陽能電池的效能。 In the present invention, the metal and the binder having different properties are used to increase the aspect ratio of the electrode after printing to achieve a fine line width, and therefore, the resistance of the electrode can be lowered to improve the performance of the solar cell.
是以，本發明提供一種包括有該親水性導電金屬以及該疏水性載體，同時具有該玻璃料以及該添加劑的導電膏組成物。前述疏水性載體可以使用疏水性黏合劑以及疏水性溶劑所製得。 Therefore, the present invention provides a conductive paste composition comprising the hydrophilic conductive metal and the hydrophobic carrier, and having the glass frit and the additive. The aforementioned hydrophobic carrier can be prepared using a hydrophobic binder and a hydrophobic solvent.
此外，本發明提供一種包括有該疏水性導電金屬以及該親水性載體，同時具有該玻璃料以及該添加劑的導電膏組成物。前述親水性載體可以使用親水性黏合劑以及親水性溶劑所製得。 Further, the present invention provides a conductive paste composition comprising the hydrophobic conductive metal and the hydrophilic carrier, and having the glass frit and the additive. The aforementioned hydrophilic carrier can be produced using a hydrophilic binder and a hydrophilic solvent.
此外，本發明之導電膏組成物可包括有(a)40至90wt%之該親水性導電金屬、1至20wt%之該疏水載體、1至10wt%之該玻璃料、以及0.01至5wt%之該添加劑，或者是(b)40至90wt%之該疏水性導電金屬、1至20wt%之該親水性載體、1至10wt%之該玻璃料、以及0.01至5wt%之該添加劑。 Further, the conductive paste composition of the present invention may comprise (a) 40 to 90% by weight of the hydrophilic conductive metal, 1 to 20% by weight of the hydrophobic carrier, 1 to 10% by weight of the glass frit, and 0.01 to 5% by weight The additive is either (b) 40 to 90% by weight of the hydrophobic conductive metal, 1 to 20% by weight of the hydrophilic carrier, 1 to 10% by weight of the glass frit, and 0.01 to 5% by weight of the additive.
在該疏水性載體中，該疏水性黏合劑與該疏水性溶劑的重量比例可為0.5：9.5至3：7。此外，在該親水性載體中，該親水性黏合劑與該親水性溶劑的重量比例可為0.5：9.5至3：7。 In the hydrophobic carrier, the weight ratio of the hydrophobic binder to the hydrophobic solvent may be from 0.5:9.5 to 3:7. Further, in the hydrophilic carrier, the weight ratio of the hydrophilic binder to the hydrophilic solvent may be from 0.5:9.5 to 3:7.
最好，本發明第一實施例係提供一種導電膏組成物，其包括有40至90wt%之該親水性導電金屬、1至20wt%之該疏水性黏合劑、1至30wt%之該疏水性溶劑、1至10wt%之該玻璃料、以及0.01至5wt%之該添加劑。 Preferably, the first embodiment of the present invention provides a conductive paste composition comprising 40 to 90% by weight of the hydrophilic conductive metal, 1 to 20% by weight of the hydrophobic adhesive, and 1 to 30% by weight of the hydrophobicity. The solvent, 1 to 10% by weight of the glass frit, and 0.01 to 5% by weight of the additive.
在本發明中，該親水性導電金屬可為一種或多種由未披覆(non-coated)或經親水性界面活性劑處理過之銀(Ag)、銅、鎳、金(Au)以及披覆銀(silver-coated)之金屬所構成之族群中所選出之具有平均粒徑為0.1至5μm的金屬。前述親水性界面活性劑處理係可透過使用一種或多種選自由聚山梨糖醇(polysorbitol)、山梨糖醇酐脂肪酸酯(sorbitan fatty acid esters)、聚甘油(丙三醇)脂肪酸酯(polyglycerin(glycerol)fatty acid esters)以及環氧乙烷(oxyethylene)所構成之族群中的物質來施行。舉例來說，施行親水性界面活性劑處理時，係可使用以吐溫(Tween)、崔坦(Triton)、十二烷基硫酸鈉(SDS(SLS))以及十六烷基三甲基溴化銨(CTAB)為基礎的界面活性劑。此外，前述披覆銀之金屬可為藉由將銀粉末披覆於諸如銀(Ag)、銅、鎳或金(Au)等導電金屬上一預定厚度，例如1nm至50nm所製得者。在本發明中，該親水性導電金屬更佳可為未披覆或經親水性界面活性劑處理過之具有平均粒徑為0.1至5μm的銀。在此情形下，本發明之導電膏組成物能夠提供相較於習知導電膏組成物而言，具有更優異效果的銀膏組成物。 In the present invention, the hydrophilic conductive metal may be one or more of silver (Ag), copper, nickel, gold (Au), and coated by a non-coated or hydrophilic surfactant. A metal having an average particle diameter of 0.1 to 5 μm selected from the group consisting of silver-coated metals. The hydrophilic surfactant treatment described above can be used by using one or more selected from the group consisting of polysorbitol, sorbitan fatty acid esters, polyglycerol (glycerol) fatty acid ester (polyglycerin). (glycerol) fatty acid esters) and substances in the group consisting of oxyethylene are used. For example, when a hydrophilic surfactant treatment is applied, Tween, Triton, sodium dodecyl sulfate (SDS) and cetyltrimethyl bromide can be used. Ammonium phosphate (CTAB) based surfactant. Further, the aforementioned silver-coated metal may be prepared by coating silver powder on a conductive metal such as silver (Ag), copper, nickel or gold (Au) for a predetermined thickness, for example, 1 nm to 50 nm. In the present invention, the hydrophilic conductive metal may more preferably be silver having an average particle diameter of 0.1 to 5 μm which is not coated or treated with a hydrophilic surfactant. In this case, the conductive paste composition of the present invention can provide a silver paste composition having a more excellent effect than the conventional conductive paste composition.
在本發明中，當該親水性導電金屬受到上述親水性界面活性劑處理時，相較於未經表面處理的例子，由於該親水性界面活性劑、該載體與該黏合劑之間的物理性質不同，因此導電膏組成物中的銀粉末聚集現象可被控制，且導電膏組成物的高觸變指數(TI)值也可被控制，從而能夠在印刷後提升高寬比。透過此種協同作用，可進一步提升太陽能電池的效能。 In the present invention, when the hydrophilic conductive metal is treated with the above hydrophilic surfactant, the hydrophilic surfactant, the physical property between the carrier and the binder are compared to the case without the surface treatment. Differently, the phenomenon of silver powder agglomeration in the conductive paste composition can be controlled, and the high thixotropic index (TI) value of the conductive paste composition can also be controlled, thereby enabling the aspect ratio to be improved after printing. Through this synergy, the performance of solar cells can be further improved.
以該導電膏組成物的總量為基準，該親水性導電金屬的含量可為40至90wt%。若其含量低於40wt%，導電膏組成物的分散性良好，但其電阻增加，且印刷後，電極之高寬比的提升會受到限制，因而難以期待效能的提升。若其含量超過90wt%，則會因為導電膏組成物的高黏度而使其分散性以及印刷性降低，如此一來，會有斷開現象發生以致無法在印刷過程中進行連續印刷。 The content of the hydrophilic conductive metal may be 40 to 90% by weight based on the total amount of the conductive paste composition. If the content is less than 40% by weight, the dispersion of the conductive paste composition is good, but the electric resistance thereof is increased, and the increase in the aspect ratio of the electrode after printing is limited, so that it is difficult to expect an improvement in performance. If the content exceeds 90% by weight, the dispersibility and the printability are lowered due to the high viscosity of the conductive paste composition, and as a result, the disconnection phenomenon occurs so that continuous printing cannot be performed in the printing process.
該疏水性黏合劑可為一種或多種選自由丙烯酸樹脂(acryl resin)、環氧樹脂(epoxy resin)、聚酯樹脂(polyester resin)、聚胺酯樹脂(polyurethane resin)、胺基樹脂(amino resin)、酚醛樹脂(phenolic resin)、乙烯基樹脂(vinyl resin)、乙基纖維素(ethyl cellulose)、聚甲基丙烯酸甲酯(polymethacrylate)、單丁醚(monobutyl ether)以及聚乙烯基樹脂(polyvinyl resin)所構成之族群中的物質。 The hydrophobic binder may be one or more selected from the group consisting of an acryl resin, an epoxy resin, a polyester resin, a polyurethane resin, an amino resin, Phenolic resin, vinyl resin, ethyl cellulose, polymethacrylate, monobutyl ether, and polyvinyl resin The substance in the group formed.
以該導電膏組成物的總量為基準，該疏水性黏合劑的含量最好為1至20wt%。若該疏水性黏合劑的含量低於1wt%，該黏合劑的量不足以讓無機物質分散在該導電膏組成物中。若該疏水性黏合劑的含量高於20wt%，雖然可以提高導電膏組成物的分散性，但是在燒結過程中會產生大量孔洞以及黃原膠(xanthan)而增加電極的電阻。 The hydrophobic binder is preferably contained in an amount of from 1 to 20% by weight based on the total mass of the conductive paste composition. If the content of the hydrophobic binder is less than 1% by weight, the amount of the binder is insufficient to allow the inorganic substance to be dispersed in the conductive paste composition. If the content of the hydrophobic binder is more than 20% by weight, although the dispersibility of the conductive paste composition can be improved, a large amount of pores and xanthan are generated during the sintering to increase the resistance of the electrode.
該疏水性溶劑可為一種或多種選自由松油醇(terpineol)、丁基卡必醇(butyl carbitol)、丁基卡必醇醋酸酯(butyl carbitol acetate)、2,2,4-三甲基-1,3戊二醇單異丁酸酯(Texanol)、乙二醇單丁醚醋酸酯(butyl cellosolve acetate)、乙二醇單丁醚(butyl cellosolve)、二乙二醇***(diethylene glycol ethylether)以及己烯乙二醇(hexylene glycol)所構成之族群中的溶劑。 The hydrophobic solvent may be one or more selected from the group consisting of terpineol, butyl carbitol, butyl carbitol acetate, 2,2,4-trimethyl. -1,3 pentanediol monoisobutyrate (Texanol), butyl cellosolve acetate, ethylene glycol monobutyl ether (butyl Solvents in the group consisting of cellosolve), diethylene glycol ethylether, and hexylene glycol.
以該導電膏組成物的總量為基準，該疏水性溶劑的含量最好為1至30wt%。若該疏水性溶劑的含量低於1wt%，在充分溶解所需黏合劑方面會受到限制，且會製備出高黏度的導電膏組成物而降低印刷性。若該疏水性溶劑的含量高於30wt%，則會製備出低黏度的導電膏組成物，以致在印刷過程中提升高寬比會受到限制。 The content of the hydrophobic solvent is preferably from 1 to 30% by weight based on the total amount of the conductive paste composition. If the content of the hydrophobic solvent is less than 1% by weight, it is limited in sufficiently dissolving the desired binder, and a highly viscous conductive paste composition is prepared to lower the printability. If the content of the hydrophobic solvent is more than 30% by weight, a low-viscosity conductive paste composition is prepared, so that the aspect ratio is limited in the printing process.
該玻璃料用來作為無機黏合劑，且可為一種或多種選自由氧化鉍基(Bi2O3-based)玻璃料、矽-硼-鉛基(Si-B-Pb-based)玻璃料、矽-鉍-鋅基(Si-Bi-Zn-based)玻璃料、以及矽-鉛-鋁-鋅基(Si-Pb-Al-Zn-based)玻璃料所構成之族群中的玻璃料。 The glass frit is used as an inorganic binder, and may be one or more selected from the group consisting of a bismuth-based (Bi 2 O 3 -based) glass frit, a bismuth-boron-based (Si-B-Pb-based) glass frit, A glass frit in a group consisting of a Si-Bi-Zn-based glass frit and a bismuth-lead-aluminum-zinc based (Si-Pb-Al-Zn-based) frit.
以該導電膏組成物的總量為基準，該玻璃料的含量最好為1至10wt%。若該玻璃料的含量低於1wt%，在電極的燒結過程中會產生大量孔洞，且太陽能電池基板與電極之間的黏著性會變弱。若該玻璃料的含量高於10wt%，則電極與太陽能電池之間的接觸電阻以及電極之電阻都會增加。 The content of the glass frit is preferably from 1 to 10% by weight based on the total amount of the conductive paste composition. If the content of the glass frit is less than 1% by weight, a large number of voids are generated during the sintering of the electrode, and the adhesion between the solar cell substrate and the electrode is weakened. If the content of the glass frit is more than 10% by weight, the contact resistance between the electrode and the solar cell and the resistance of the electrode increase.
該添加劑可為一種或多種選自由燒結助劑(sintering aid)、分散劑(dispersing agent)、消泡劑(antifoaming agent)、增稠劑(thickening agent)、觸變劑(thixotropic agent)以及穩定劑(stabilizer)所構成之族群中的物質。 The additive may be one or more selected from the group consisting of a sintering aid, a dispersing agent, an antifoaming agent, a thickening agent, a thixotropic agent, and a stabilizer. (stabilizer) A substance in a group of people.
以該導電膏組成物的總量為基準，該添加劑的含量最好為0.01至5wt%。若該添加劑的含量低於0.01wt%，該添加劑在該導 電膏組成物中不能充分作用而無法影響該導電膏組成物的物理性質。若該添加劑的含量高於5wt%，則該添加劑會大幅影響該導電膏組成物的印刷性以及燒結性質，導致難以控制該導電膏組成物的物理性質。 The content of the additive is preferably from 0.01 to 5% by weight based on the total amount of the conductive paste composition. If the content of the additive is less than 0.01% by weight, the additive is in the guide The paste composition does not function adequately to affect the physical properties of the conductive paste composition. If the content of the additive is more than 5% by weight, the additive greatly affects the printability and the sintering property of the conductive paste composition, resulting in difficulty in controlling the physical properties of the conductive paste composition.
在該導電膏組成物的製備方法中，該導電膏組成物可使用一般用於製備導電膏組成物的混合器。此外，該玻璃料係添加至由該疏水性黏合劑以及該疏水性溶劑所組成的載體中進行第一階段的混合，之後將該親水性導電金屬以及該添加劑加入以進行第二階段的混合。由此所得之混合物係使用研磨設備進行粉碎製程。前述研磨設備可為本技術領域中所熟知者，諸如珠磨裝置(beads-mill)、三輥研磨機(3-roll mill)等。 In the method of producing the conductive paste composition, the conductive paste composition may use a mixer generally used for preparing a conductive paste composition. Further, the glass frit is added to the carrier composed of the hydrophobic binder and the hydrophobic solvent for the first stage of mixing, and then the hydrophilic conductive metal and the additive are added for the second stage of mixing. The mixture thus obtained was subjected to a pulverization process using a grinding apparatus. The aforementioned grinding apparatus can be well known in the art, such as a beads-mill, a 3-roll mill, and the like.
本發明第二實施例係提供一種導電膏組成物，其包括有40至90wt%之該疏水性導電金屬、1至20wt%之該親水性黏合劑、1至30wt%之該親水性溶劑、1至10wt%之該玻璃料、以及0.01至5wt%之該添加劑。 A second embodiment of the present invention provides a conductive paste composition comprising 40 to 90% by weight of the hydrophobic conductive metal, 1 to 20% by weight of the hydrophilic binder, and 1 to 30% by weight of the hydrophilic solvent, 1 Up to 10% by weight of the glass frit, and 0.01 to 5% by weight of the additive.
該疏水性導電金屬可為一種或多種由披覆有脂肪酸之銀(Ag)、銅、鎳、金(Au)以及披覆銀(silver-coated)之金屬所構成之族群中所選出之具有平均粒徑為0.1至5μm的金屬粉末。此外，前述經脂肪酸塗覆處理之披覆銀之金屬可為藉由將銀粉末披覆於諸如銅、鎳或金(Au)等導電金屬上一預定厚度，例如1nm至50nm所製得者。 The hydrophobic conductive metal may be one or more selected from the group consisting of silver (Ag), copper, nickel, gold (Au), and silver-coated metals coated with fatty acids. A metal powder having a particle diameter of 0.1 to 5 μm. Further, the aforementioned silver-coated metal coated with a fatty acid may be prepared by coating silver powder on a conductive metal such as copper, nickel or gold (Au) at a predetermined thickness, for example, 1 nm to 50 nm.
該脂肪酸可為本技術領域中所熟知者，且該脂肪酸最好可使用諸如油酸(oleic acid)、硬脂酸(stearic acid)、棕櫚酸(palmitic acid)、醋酸(acetic acid)等。此外，該導電金屬最好塗覆0.1nm至50nm 厚度的脂肪酸。前述之脂肪酸塗覆的程序，係可藉由將一般金屬，例如銀粉末(Ag powder)，添加至溶有脂肪酸的有機溶劑中，再攪拌一預定時間，之後過濾予以施行。 The fatty acid may be well known in the art, and the fatty acid may preferably be used, for example, oleic acid, stearic acid, palmitic acid, acetic acid or the like. In addition, the conductive metal is preferably coated from 0.1 nm to 50 nm. Thickness of fatty acids. The above-described procedure for fatty acid coating can be carried out by adding a general metal such as silver powder to an organic solvent in which a fatty acid is dissolved, stirring for a predetermined time, and then filtering.
以該導電膏組成物的總量為基準，該疏水性導電金屬的含量可為40至90wt%。若其含量低於40wt%，導電膏組成物的分散性良好，但其電阻增加，且印刷後，電極之高寬比的提升會受到限制，因而難以期待效能的提升。若其含量超過90wt%，則會因為導電膏組成物的高黏度而使其分散性以及印刷性降低，如此一來，會有斷開現象發生以致無法在印刷過程中進行連續印刷。 The hydrophobic conductive metal may be contained in an amount of 40 to 90% by weight based on the total amount of the conductive paste composition. If the content is less than 40% by weight, the dispersion of the conductive paste composition is good, but the electric resistance thereof is increased, and the increase in the aspect ratio of the electrode after printing is limited, so that it is difficult to expect an improvement in performance. If the content exceeds 90% by weight, the dispersibility and the printability are lowered due to the high viscosity of the conductive paste composition, and as a result, the disconnection phenomenon occurs so that continuous printing cannot be performed in the printing process.
該親水性黏合劑可為一種或多種選自由聚乙二醇(polyethylene glycol)、聚乙烯醇(polyvinyl alcohol)、聚醋酸乙烯酯(polyvinyl acetate)、聚丙烯醯胺(polyacrylic amide)、聚丙烯酸(polyacrylic acid)、聚甲基丙烯酸(polymethacrylic acid)、聚環氧乙烷(polyethylene oxide)、乳酸甲酯(methyl lactate)、乳酸乙酯(ethyl lactate)、乳酸丙酯(propyl lactate)、水性聚胺基甲酸酯(aqueous polyurethane)、羥乙基纖維素(hydroxyethyl cellulose)、羥丙基纖維素(hydroxypropyl cellulose)、乙基羥乙基纖維素(ethylhydroxy ethyl cellulose)、甲基纖維素(methyl cellulose)以及羥烷基甲基纖維素(hydroxyalkyl methyl cellulose)所構成之族群中的物質。 The hydrophilic binder may be one or more selected from the group consisting of polyethylene glycol, polyvinyl alcohol, polyvinyl acetate, polyacrylic amide, polyacrylic acid ( Polyacrylic acid), polymethacrylic acid, polyethylene oxide, methyl lactate, ethyl lactate, propyl lactate, aqueous polyamine An aqueous polyurethane, hydroxyethyl cellulose, hydroxypropyl cellulose, ethylhydroxy ethyl cellulose, methyl cellulose And a substance in the group consisting of hydroxyalkyl methyl cellulose.
以該導電膏組成物的總量為基準，該親水性黏合劑的含量最好為1至20wt%。若該親水性黏合劑的含量低於1wt%，該黏合劑的量不足以讓無機物質分散在該導電膏組成物中。若該親水性黏合 劑的含量高於20wt%，雖然可以提高導電膏組成物的分散性，但是在燒結過程中會產生大量孔洞以及黃原膠(xanthan)而增加電極的電阻。 The hydrophilic binder is preferably contained in an amount of from 1 to 20% by weight based on the total mass of the conductive paste composition. If the content of the hydrophilic binder is less than 1% by weight, the amount of the binder is insufficient to allow the inorganic substance to be dispersed in the conductive paste composition. If the hydrophilic bond The content of the agent is higher than 20% by weight, and although the dispersibility of the conductive paste composition can be improved, a large amount of pores and xanthan are generated during the sintering to increase the resistance of the electrode.
該親水性溶劑可為一種或多種選自由丁氧乙醇(butoxyethanol)、異丙醇(isopropyl alcohol)、乙二醇(ethylene glycol)、丙酮(acetone)、甲醇(methanol)以及乙酸乙酯(ethyl acetate)所構成之族群中的溶劑。 The hydrophilic solvent may be one or more selected from the group consisting of butoxyethanol, isopropyl alcohol, ethylene glycol, acetone, methanol, and ethyl acetate. a solvent in the group formed.
以該導電膏組成物的總量為基準，該親水性溶劑的含量最好為1至30wt%。若該親水性溶劑的含量低於1wt%，在充分溶解所需黏合劑方面會受到限制，且會製備出高黏度的導電膏組成物而降低印刷性。若該親水性溶劑的含量高於30wt%，則會製備出低黏度的導電膏組成物，以致在印刷過程中提升高寬比會受到限制。 The hydrophilic solvent is preferably contained in an amount of from 1 to 30% by weight based on the total mass of the conductive paste composition. If the content of the hydrophilic solvent is less than 1% by weight, it is limited in sufficiently dissolving the desired binder, and a highly viscous conductive paste composition is prepared to lower the printability. If the content of the hydrophilic solvent is more than 30% by weight, a low-viscosity conductive paste composition is prepared, so that the aspect ratio is lowered during the printing process.
該第二實施例之導電膏組成物中之該玻璃料以及該添加劑的含量以及成分皆與前述第一實施例相同。 The content and composition of the glass frit and the additive in the conductive paste composition of the second embodiment are the same as those of the foregoing first embodiment.
因此，該玻璃料可為一種或多種選自由氧化鉍基(Bi2O3-based)玻璃料、矽-硼-鉛基(Si-B-Pb-based)玻璃料、矽-鉍-鋅基(Si-Bi-Zn-based)玻璃料、以及矽-鉛-鋁-鋅基(Si-Pb-Al-Zn-based)玻璃料所構成之族群中的玻璃料。此外，該添加劑可為一種或多種選自由燒結助劑(sintering aid)、分散劑(dispersing agent)、消泡劑(antifoaming agent)、增稠劑(thickening agent)、觸變劑(thixotropic agent)以及穩定劑(stabilizer)所構成之族群中的物質。 Therefore, the glass frit may be one or more selected from the group consisting of a bismuth-based (Bi 2 O 3 -based) glass frit, a bismuth-boron-lead-based (Si-B-Pb-based) glass frit, and a bismuth-tellurium-zinc group. A glass frit in a group consisting of (Si-Bi-Zn-based) glass frit and a bismuth-lead-aluminum-zinc based (Si-Pb-Al-Zn-based) glass frit. Further, the additive may be one or more selected from the group consisting of a sintering aid, a dispersing agent, an antifoaming agent, a thickening agent, a thixotropic agent, and the like. A substance in a group of stabilizers.
以該導電膏組成物的總量為基準，該玻璃料的含量最好為1至10wt%。以該導電膏組成物的總量為基準，該添加劑的含量最好為0.01至5wt%。 The content of the glass frit is preferably from 1 to 10% by weight based on the total amount of the conductive paste composition. The content of the additive is preferably from 0.01 to 5% by weight based on the total amount of the conductive paste composition.
在該導電膏組成物的製備方法中，該導電膏組成物可使用一般用於製備導電膏組成物的混合器。此外，該玻璃料係添加至由該親水性黏合劑以及該親水性溶劑所組成的載體中進行第一階段的混合，之後將該疏水性導電金屬以及該添加劑加入以進行第二階段的混合。由此所得之混合物係使用研磨設備進行粉碎製程。前述研磨設備可為本技術領域中所熟知者，諸如珠磨裝置(beads-mill)、三輥研磨機(3-roll mill)等。 In the method of producing the conductive paste composition, the conductive paste composition may use a mixer generally used for preparing a conductive paste composition. Further, the glass frit is added to the carrier composed of the hydrophilic binder and the hydrophilic solvent for the first stage of mixing, and then the hydrophobic conductive metal and the additive are added for the second stage of mixing. The mixture thus obtained was subjected to a pulverization process using a grinding apparatus. The aforementioned grinding apparatus can be well known in the art, such as a beads-mill, a 3-roll mill, and the like.
本發明之第三實施例提供一種包括有藉由使用上述第一以及第二實施例中任一導電膏組成物所形成之電極的太陽能電池。 A third embodiment of the present invention provides a solar cell including an electrode formed by using the conductive paste composition of any of the above first and second embodiments.
本發明之該導電膏組成物最好用來製造前述太陽能電池的前電極。在本發明中，藉由使用具有特定組成成分的導電膏組成物，其能夠在網版印刷後實現期望的線寬，從而提升高寬比以及電特性。因此，本發明提供一種具有優異效能的太陽能電池，更具體而言，係提供一種太陽能電池，其包括有一具有20至35%之高寬比以及等於或低於3之串聯電阻(Rs)的前電極。 The conductive paste composition of the present invention is preferably used to manufacture the front electrode of the aforementioned solar cell. In the present invention, by using a conductive paste composition having a specific composition, it is possible to achieve a desired line width after screen printing, thereby improving aspect ratio and electrical characteristics. Accordingly, the present invention provides a solar cell having excellent performance, and more particularly, to provide a solar cell comprising a front portion having a height to width ratio of 20 to 35% and a series resistance (Rs) equal to or lower than 3. electrode.
如此，除了使用上述之導電膏組成物之外，由於該太陽能電池之電極能夠使用本技術領域中所熟知的方法予以製造，因此有關太陽能電池之電極的詳細製造方法在此不予贅述。 Thus, in addition to the use of the above-described conductive paste composition, since the electrode of the solar cell can be manufactured by a method well known in the art, the detailed manufacturing method of the electrode of the solar cell will not be described herein.
在本發明中，係使用結合親水性導電金屬與疏水性載體或是疏水性導電金屬與親水性載體所製備之導電膏組成物來進行網版印刷，藉以改善線寬的擴散。因此本發明能夠達成期望線寬以及細線寬，以致能夠實現高的高寬比以及提升太陽能電池性能。 In the present invention, screen printing is carried out by using a conductive paste composition prepared by combining a hydrophilic conductive metal with a hydrophobic carrier or a hydrophobic conductive metal and a hydrophilic carrier, thereby improving the diffusion of the line width. Therefore, the present invention can achieve a desired line width as well as a fine line width, so that a high aspect ratio can be achieved and solar cell performance can be improved.
第1圖至第4圖為電子顯微鏡影像，顯示依據範例1至4之電極的剖面。 Figs. 1 to 4 are electron microscope images showing cross sections of the electrodes according to Examples 1 to 4.
第5圖為一電子顯微鏡影像，顯示使用本發明範例5之導電膏組成物製得之電極的剖面以及高寬比。 Fig. 5 is an electron microscope image showing a cross section and an aspect ratio of an electrode obtained by using the conductive paste composition of Example 5 of the present invention.
第6圖為依據範例5之電極的三維立體影像。 Figure 6 is a three-dimensional image of the electrode according to Example 5.
第7圖至第8圖為電子顯微鏡影像，顯示依據比較例1至2之電極的剖面。 Fig. 7 to Fig. 8 are electron microscope images showing the cross sections of the electrodes according to Comparative Examples 1 to 2.
以下，將透過下列範例以及比較例來說明本發明。然而，該等範例以及比較例僅用來說明本發明，本發明的範圍並不受限於此。 Hereinafter, the present invention will be described by way of the following examples and comparative examples. However, the examples and comparative examples are merely illustrative of the invention, and the scope of the invention is not limited thereto.
<範例1至4以及比較例1至2><Examples 1 to 4 and Comparative Examples 1 to 2>
範例以及比較例的導電膏組成物係依據下列表1的組成成分予以製備。使用之組成成分的含量亦顯示於表1(單位：wt%)。 The conductive paste compositions of the examples and comparative examples were prepared in accordance with the composition of the following Table 1. The content of the components used is also shown in Table 1 (unit: wt%).
詳而言之，係製備一種包括有1至3μm之親水性球狀銀粒子、一疏水性載體(疏水性黏合劑溶解於疏水性溶劑)、一氧化鉍(Bi2O3)基玻璃料、以及一燒結助劑添加劑(ZnO2)的導電膏組成物。 Specifically, a hydrophilic spherical silver particle having 1 to 3 μm, a hydrophobic carrier (a hydrophobic binder dissolved in a hydrophobic solvent), a bismuth oxide (Bi 2 O 3 )-based glass frit, And a conductive paste composition of a sintering aid additive (ZnO 2 ).
此外，係製備一種包括有1.5至2.5μm之疏水性球狀銀粒子、一親水性載體(親水性黏合劑溶解於親水性溶劑)、一氧化鉍(Bi2O3)基玻璃料、以及一燒結助劑添加劑(ZnO2)的導電膏組成物。 Further, a hydrophobic spherical silver particle having 1.5 to 2.5 μm, a hydrophilic carrier (a hydrophilic binder dissolved in a hydrophilic solvent), a bismuth oxide (Bi 2 O 3 )-based glass frit, and a film are prepared. A conductive paste composition of a sintering aid additive (ZnO 2 ).
此時，該疏水性球狀銀粒子係為塗覆有厚度1至2nm之脂肪酸(油酸)表面處理劑者。此外，該親水性載體係透過混合羥丙基纖維素以及乙二醇予以製備，而該疏水性載體係透過混合乙基纖維素以及丁基卡必醇予以製備。 At this time, the hydrophobic spherical silver particles are those coated with a fatty acid (oleic acid) surface treatment agent having a thickness of 1 to 2 nm. Further, the hydrophilic carrier is prepared by mixing hydroxypropylcellulose and ethylene glycol, and the hydrophobic carrier is prepared by mixing ethylcellulose and butyl carbitol.
在該導電膏組成物的製備方法中，該玻璃料係添加至該親水性載體或該疏水性載體，之後使用行星式攪拌機(Planetary Mixer,PLM)進行第一階段混合，其後將該親水性或疏水性銀粒子以及該添加劑加入，並使用前述行星式攪拌機(PLM)進行第二階段混合。所得之混合物使用三輥研磨機(3-roll mill)揉捏以製備用於太陽能電池之電極的導電膏組成物。 In the method for preparing the conductive paste composition, the glass frit is added to the hydrophilic carrier or the hydrophobic carrier, and then the first stage mixing is performed using a Planetary Mixer (PLM), after which the hydrophilicity is used. Or hydrophobic silver particles and the additive are added and the second stage mixing is carried out using the aforementioned planetary mixer (PLM). The resulting mixture was kneaded using a 3-roll mill to prepare a conductive paste composition for an electrode of a solar cell.
<範例5><Example 5>
該導電膏組成物係以與範例1相同的方式製備，除了用一親水性界面活性劑處理該親水性導電金屬之外。換句話說，就該親水性導電金屬的界面活性劑處理而言，係以界面活性劑Tween 20來處理1至3μm之親水性球狀銀粒子，再將處理過後的親水性導電金屬用來製備該導電膏組成物。 The conductive paste composition was prepared in the same manner as in Example 1 except that the hydrophilic conductive metal was treated with a hydrophilic surfactant. In other words, in the case of the surfactant treatment of the hydrophilic conductive metal, the hydrophilic spherical silver particles of 1 to 3 μm are treated with the surfactant Tween 20, and the treated hydrophilic conductive metal is used for preparation. The conductive paste composition.
詳而言之，在以親水性界面活性劑處理銀粒子的製備方面，一銀前驅物(銀粉末)係溶解於一分散有界面活性劑(Tween 20)的水溶液中，其後，銀粒子的表面在接近或低於40℃時披覆有該界面活性劑。由此製得之銀粒子最後再被清洗(水，醇類)以及乾燥(接近40℃)。 In detail, in the preparation of silver particles treated with a hydrophilic surfactant, a silver precursor (silver powder) is dissolved in an aqueous solution in which a surfactant (Tween 20) is dispersed, after which silver particles are The surface is coated with the surfactant at or near 40 °C. The silver particles thus obtained are finally washed (water, alcohol) and dried (close to 40 ° C).
<實驗例><Experimental example>
1.太陽能電池的製造 1. Manufacturing of solar cells
使用範例以及比較例之導電膏組成物來製造太陽能電池。使用片電阻值為60至65Ω/□的多晶矽晶圓(Si wafer)進行電極印刷，並且在矽(Si)晶圓上印刷背面銀(Ag)電極。接著，將背面鋁(Al)電極網版印刷至已經乾燥之背面銀(Ag)電極上，使其與已經乾燥之背面銀(Ag)電極部分重疊。各個膏狀物的乾燥溫度為170℃。 Solar cells were fabricated using the conductive paste compositions of the examples and comparative examples. Electrode printing was performed using a Si wafer having a sheet resistance value of 60 to 65 Ω/□, and a back surface silver (Ag) electrode was printed on a bismuth (Si) wafer. Next, the back aluminum (Al) electrode is screen printed onto the dried back silver (Ag) electrode to partially overlap the already dried back silver (Ag) electrode. The drying temperature of each paste was 170 °C.
再者，本發明之該導電膏組成物係利用網版印刷而印刷至前述矽晶圓，之後乾燥。在此程序中，使用網目數(mesh)為290且總厚度67μm的印刷遮罩，並且，使用由寬度80μm之指形線(finger line)與寬度2mm之匯流條(bus bar)所組成的印刷圖案來形成前電極。接著，在170℃下乾燥並進行燒結程序以製造太陽能電池。其後，進行物理性質的評估。 Furthermore, the conductive paste composition of the present invention is printed onto the tantalum wafer by screen printing and then dried. In this procedure, a printing mask having a mesh number of 290 and a total thickness of 67 μm was used, and printing using a finger line having a width of 80 μm and a bus bar having a width of 2 mm was used. A pattern is formed to form the front electrode. Next, it was dried at 170 ° C and subjected to a sintering process to manufacture a solar cell. Thereafter, an evaluation of the physical properties is performed.
2.太陽能電池效能的評估 2. Evaluation of solar cell performance
使用太陽光模擬器(solar simulator)來評估製得之太陽能電池基板的電特性(電流-電壓特性曲線(I-V curve))。電極剖面的印刷線寬度與高度係被分析以評估高寬比(Aspect ratio)。若高寬比優異，則電極的串聯電阻(Rs)會降低，因而能夠提高太陽能電池的效能。評估結果如表2所示。 The solar characteristics of the obtained solar cell substrate (I-V curve) were evaluated using a solar simulator. The printed line width and height of the electrode profile were analyzed to evaluate the aspect ratio. If the aspect ratio is excellent, the series resistance (Rs) of the electrode is lowered, so that the efficiency of the solar cell can be improved. The evaluation results are shown in Table 2.
此外，使用範例1至4之導電膏組成物所製得之電極的剖面影像，顯示於第1圖至第4圖。 Further, cross-sectional images of the electrodes prepared using the conductive paste compositions of Examples 1 to 4 are shown in Figs. 1 to 4 .
使用範例5之導電膏組成物所製得之電極的剖面影像(包括高寬比)以及立體影像分別顯示於第5圖至第6圖。 The cross-sectional images (including the aspect ratio) and the stereoscopic images of the electrodes prepared using the conductive paste composition of Example 5 are shown in Figs. 5 to 6 respectively.
再者，使用比較例1至2之導電膏組成物所製得之電極的剖面影像，顯示於第7圖至第8圖。 Further, cross-sectional images of the electrodes obtained by using the conductive paste compositions of Comparative Examples 1 to 2 are shown in Figs. 7 to 8.
如表2以及第1至6圖所示的結果，由於本發明之範例1至5係使用結合該親水性金屬、該疏水性黏合劑以及該疏水性溶劑，或是結合該疏水性金屬、該親水性黏合劑以及該親水性溶劑所製備之組成物，因此，相較於由比較例1至2之組成物所製得之電極，由範例1至5之組成物所製得之電極具有優異的高寬比。因此，本發明之電極的串聯電阻(Rs)降低，而太陽能電池的效能提升。相較於範例1至2，由於範例5係使用以界面活性劑處理過的親水性導電金屬，因此其印刷後的高寬比(Aspect ratio)有所提升。是以，串聯電阻(Rs)大幅地降低，而太陽能電池的效能被提升。 As shown in Table 2 and Figures 1 to 6, since Examples 1 to 5 of the present invention use the hydrophilic metal, the hydrophobic binder, and the hydrophobic solvent, or the hydrophobic metal, The hydrophilic binder and the composition prepared by the hydrophilic solvent, therefore, the electrode prepared from the compositions of Examples 1 to 5 is excellent as compared with the electrode prepared by the compositions of Comparative Examples 1 to 2. The aspect ratio. Therefore, the series resistance (Rs) of the electrode of the present invention is lowered, and the efficiency of the solar cell is improved. Compared to Examples 1 to 2, since Example 5 uses a hydrophilic conductive metal treated with a surfactant, the aspect ratio after printing is improved. Therefore, the series resistance (Rs) is greatly reduced, and the performance of the solar cell is improved.
相反地，如表2以及第7至8圖所示的結果，當電極是使用比較例1至2的導電膏組成物所製得時，由於導電膏組成物中僅含有親水性或者是疏水性物質，因此無法改善印刷性。是以，電極的高寬比降低且串聯電阻增加，導致太陽能電池的效能降低。此外，由 於比較例1至2使用具有相同特性的金屬以及黏合劑，因此難以控制高觸變指數(TI)，並且，由於線寬擴散，使得光接收表面變小，造成太陽能電池的效能降低。 On the contrary, as shown in Table 2 and Figures 7 to 8, when the electrodes were prepared using the conductive paste compositions of Comparative Examples 1 to 2, since the conductive paste composition contained only hydrophilic or hydrophobic Substance, so it is impossible to improve printability. Therefore, the aspect ratio of the electrode is lowered and the series resistance is increased, resulting in a decrease in the performance of the solar cell. In addition, by The metals having the same characteristics and the binder were used in Comparative Examples 1 to 2, so that it was difficult to control the high thixotropic index (TI), and the light-receiving surface became small due to the line width diffusion, resulting in a decrease in the performance of the solar cell.
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| KR102152836B1 (en) * | 2018-11-30 | 2020-09-07 | 엘에스니꼬동제련 주식회사 | Electrode Paste For Solar Cell's Electrode And Solar Cell using the same |
| KR102311273B1 (en) * | 2021-02-08 | 2021-10-13 | 장정식 | Conductive copper powder based oil paste for improved long term stability and manufacturing method thereof |
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| US7771625B2 (en) * | 2004-11-29 | 2010-08-10 | Dainippon Ink And Chemicals, Inc. | Method for producing surface-treated silver-containing powder and silver paste using surface-treated silver-containing powder |
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