TW201346500A - Heat dissipation device - Google Patents
Heat dissipation device Download PDFInfo
- Publication number
- TW201346500A TW201346500A TW101115573A TW101115573A TW201346500A TW 201346500 A TW201346500 A TW 201346500A TW 101115573 A TW101115573 A TW 101115573A TW 101115573 A TW101115573 A TW 101115573A TW 201346500 A TW201346500 A TW 201346500A
- Authority
- TW
- Taiwan
- Prior art keywords
- refrigerant storage
- heat
- refrigerant
- tubes
- storage tube
- Prior art date
Links
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 18
- 239000003507 refrigerant Substances 0.000 claims abstract description 110
- 238000003860 storage Methods 0.000 claims abstract description 87
- 239000004020 conductor Substances 0.000 claims abstract description 6
- 239000012530 fluid Substances 0.000 claims description 21
- 230000002093 peripheral effect Effects 0.000 claims description 12
- 230000000903 blocking effect Effects 0.000 claims 2
- 230000014759 maintenance of location Effects 0.000 claims 1
- 239000007788 liquid Substances 0.000 abstract description 11
- 239000002826 coolant Substances 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 4
- 238000004891 communication Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
本發明是有關於一種散熱裝置，特別是指一種貼觸於發熱體上以進行散熱作用的散熱裝置。The invention relates to a heat dissipating device, in particular to a heat dissipating device which is attached to a heating element for heat dissipation.
參閱圖1，為中華民國第M261972號專利案所揭露的「散熱片結構」，是目前常用的一種散熱裝置1，包含一基座10，及一設置於該基座10上的片狀散熱部11，如圖2所示，該基座10內形成有多數條交錯的流道101供冷卻媒介100於其中水平流動。使用時，是將該基座10與一發熱體(圖未示)接觸，利用冷卻媒介100來吸收該發熱體產生的熱能，再由該片狀散熱部11散逸。由於冷卻媒介100通常是利用氣態與液態的轉換來達到吸收外界熱能以及重複使用的作用，而上述設計只能使冷卻媒介100水平流動，沒有足夠的空間讓冷卻媒介100進行氣液態轉換，進而影響散熱效率。Referring to FIG. 1, the "heat sink structure" disclosed in the Patent No. M261972 of the Republic of China is a commonly used heat sink 1 comprising a base 10 and a sheet-shaped heat sink disposed on the base 10. 11. As shown in FIG. 2, a plurality of staggered flow passages 101 are formed in the base 10 for the cooling medium 100 to flow horizontally therein. In use, the susceptor 10 is brought into contact with a heat generating body (not shown), and the heat medium generated by the heat generating body is absorbed by the cooling medium 100, and is dissipated by the sheet-shaped heat radiating portion 11. Since the cooling medium 100 usually uses the conversion of gas and liquid to achieve the absorption of external heat energy and reuse, the above design can only make the cooling medium 100 flow horizontally, and there is not enough space for the cooling medium 100 to perform gas-liquid conversion, thereby affecting Cooling efficiency.
因此，本發明之目的，即在提供一種可以提升散熱效率的散熱裝置。Accordingly, it is an object of the present invention to provide a heat sink that can improve heat dissipation efficiency.
於是，本發明散熱裝置，包含一傳導單元，及一與該傳導單元連通的冷媒儲存單元。該傳導單元包括一由導熱材質製成的傳導件，該傳導件包括一呈中空狀並用以貼觸於該發熱體上的周壁、多數片間隔排列並被該周壁圍繞連接的導熱片，及多個由該周壁與所述導熱片共同圍繞界定的流道，該傳導單元是向上延伸地設置，而使所述流道向上延伸。該冷媒儲存單元是用以儲放冷媒並與該傳導件的流道連通，所述流道是向上延伸，以使冷媒受熱時能沿所述流道向上移動。Thus, the heat sink of the present invention comprises a conducting unit and a refrigerant storage unit in communication with the conducting unit. The conducting unit comprises a conducting member made of a heat conductive material, the conducting member comprising a hollow wall and a peripheral wall for contacting the heat generating body, a plurality of sheets spaced apart and surrounded by the peripheral wall, and more The flow path is surrounded by the peripheral wall and the heat conducting sheet, and the conducting unit is disposed to extend upward, and the flow path is extended upward. The refrigerant storage unit is configured to store and communicate with the flow passage of the conductive member, and the flow passage is extended upward to move the refrigerant upward along the flow passage when heated.
本發明之功效在於：當該發熱體的熱能由該傳導件傳導至該冷媒儲存單元時，冷媒會吸熱而由液態轉換成氣態，並沿著所述流道向上移動，而能於該傳導件與冷媒儲存單元之間循環流動，提升散熱效率。The effect of the invention is that when the heat energy of the heat generating body is transmitted from the conductive member to the refrigerant storage unit, the refrigerant absorbs heat and is converted into a gaseous state by the liquid state, and moves upward along the flow path, and the conductive member can be used. Circulating flow with the refrigerant storage unit to improve heat dissipation efficiency.
有關本發明之前述及其他技術內容、特點與功效，在以下配合參考圖式之兩個較佳實施例的詳細說明中，將可清楚的呈現。The above and other technical contents, features and advantages of the present invention will be apparent from the following detailed description of the preferred embodiments of the invention.
在本發明被詳細描述之前，要注意的是，在以下的說明內容中，類似的元件是以相同的編號來表示。Before the present invention is described in detail, it is noted that in the following description, similar elements are denoted by the same reference numerals.
參閱圖3，為本發明散熱裝置2之第一較佳實施例，包含一傳導單元3，及一與該傳導單元3連通並用以儲放冷媒的冷媒儲存單元4。該冷媒儲存單元4包括兩個互相連通的導流體41，每一導流體41具有一第一冷媒儲存管411、一與該第一冷媒儲存管411相間隔的第二冷媒儲存管412、多數連通該第一、二冷媒儲存管411、412的引流管413，及多個設置於兩相鄰引流管413之間的散熱鰭片414。該二導流體41的第一冷媒儲存管411是互相併排且連通，且該二第二冷媒儲存管412之間的距離，是大於該二第一冷媒儲存管411之間的距離。於本實施例中，該二第一冷媒儲存管411的兩側分別透過兩個連通管415互相連通，但也可以只於單側使用一個連通管415，但此連通方式僅為本實施例的實施態樣，不以此為限。Referring to FIG. 3, a first preferred embodiment of the heat sink 2 of the present invention includes a conducting unit 3, and a refrigerant storage unit 4 connected to the conducting unit 3 for storing refrigerant. The refrigerant storage unit 4 includes two mutually communicating fluid guides 41. Each of the fluid guides 41 has a first refrigerant storage tube 411, a second refrigerant storage tube 412 spaced apart from the first refrigerant storage tube 411, and a plurality of connections. The drainage tube 413 of the first and second refrigerant storage tubes 411 and 412 and the plurality of heat dissipation fins 414 disposed between the two adjacent drainage tubes 413. The first refrigerant storage tubes 411 of the two fluid guides 41 are parallel to each other and communicate with each other, and the distance between the two second refrigerant storage tubes 412 is greater than the distance between the two first refrigerant storage tubes 411. In this embodiment, the two sides of the two first refrigerant storage tubes 411 are respectively connected to each other through the two communication tubes 415. However, one communication tube 415 may be used only on one side, but the connection manner is only the embodiment. The implementation aspect is not limited to this.
參閱圖3、4，該傳導單元3包括一由導熱材質製成的傳導件31，該傳導件31包括一呈中空狀並用以貼觸於一發熱體9上的周壁311、多數片間隔排列並被該周壁311圍繞連接的導熱片312，及多個由該周壁311與所述導熱片312共同圍繞界定的流道313。Referring to FIGS. 3 and 4, the conductive unit 3 includes a conductive member 31 made of a heat conductive material. The conductive member 31 includes a peripheral wall 311 which is hollow and is attached to a heat generating body 9. The heat conducting sheet 312 is surrounded by the peripheral wall 311, and a plurality of flow channels 313 are defined by the peripheral wall 311 and the heat conducting sheet 312.
參閱圖3、5，由於該二第二冷媒儲存管412之間的距離，是大於該二第一冷媒儲存管411之間的距離，因此該傳導單元3是向上延伸地設置，而使所述流道313向上延伸，該傳導件31之流道313的兩端是分別與該二導流體41的第二冷媒儲存管412連通，並令該所述流道313是由其中一第二冷媒儲存管412b向另一第二冷媒儲存管412a的方向傾斜向上延伸，以使該散熱裝置2是概呈三角形。Referring to FIGS. 3 and 5, since the distance between the two second refrigerant storage tubes 412 is greater than the distance between the two first refrigerant storage tubes 411, the conduction unit 3 is disposed to extend upward, and the The flow path 313 extends upwardly. The two ends of the flow path 313 of the conductive member 31 are respectively connected to the second refrigerant storage tube 412 of the two-conducting fluid 41, and the flow path 313 is stored by one of the second refrigerants. The tube 412b extends obliquely upward in the direction of the other second refrigerant storage tube 412a, so that the heat sink 2 is substantially triangular.
使用時，是使該發熱體9貼觸於該傳導件31的周壁311上，冷媒尚未吸熱時為液態，大部分是位於下方橫向設置的導流體41內，當該發熱體9的熱能由該傳導件31傳導至下方的導流體41時，冷媒會吸熱而由液態轉換成氣態，並由該第二冷媒儲存管412b沿著該傳導件31的流道313向上移動，並進入另一導流體41的第二冷媒儲存管412a，再經由所述引流管413而進入該第一冷媒儲存管411a。冷媒在經過所述引流管413的過程中，所述散熱鰭片414會進行散熱作用而使得氣態的冷媒冷卻而轉換成液態並進入該第一冷媒儲存管411a內，再由該連通管415進入該第一冷媒儲存管411b中，而使得冷媒於該傳導件31與所述導流體41之間循環流動。也就是說，冷媒是如圖5中箭頭所示的方向依該第二冷媒儲存管412b、所述流道313(見圖4)、第二冷媒儲存管412a、第一冷媒儲存管411a、第一冷媒儲存管411b，及第二冷媒儲存管412b的方向循環流動。In use, the heating element 9 is placed on the peripheral wall 311 of the conductive member 31. The refrigerant is in a liquid state when it has not absorbed heat, and is mostly located in the fluid guiding body 41 disposed laterally downward. When the heat energy of the heating element 9 is When the conductive member 31 is conducted to the lower conductive fluid 41, the refrigerant absorbs heat and is converted from a liquid state to a gaseous state, and is moved upward by the second refrigerant storage tube 412b along the flow path 313 of the conductive member 31, and enters another fluid guiding body. The second refrigerant storage tube 412a of 41 enters the first refrigerant storage tube 411a via the drainage tube 413. During the passage of the refrigerant through the drainage tube 413, the heat dissipation fins 414 perform heat dissipation to cool the gaseous refrigerant to be converted into a liquid state and enter the first refrigerant storage tube 411a, and then enter the communication tube 415. In the first refrigerant storage tube 411b, the refrigerant circulates between the conductive member 31 and the fluid guide 41. That is, the refrigerant is in the direction indicated by the arrow in FIG. 5 according to the second refrigerant storage tube 412b, the flow path 313 (see FIG. 4), the second refrigerant storage tube 412a, the first refrigerant storage tube 411a, and the first A refrigerant storage tube 411b and a second refrigerant storage tube 412b are circulated in a direction.
本發明散熱裝置2透過上述設計，提供足夠的空間讓冷媒在氣、液態轉換的過程中，能於該傳導件31與所述導流體41之間循環流動，增加冷媒的氣、液態轉換效率，進而提升散熱效率。Through the above design, the heat dissipating device 2 of the present invention provides a sufficient space for the refrigerant to circulate between the conducting member 31 and the guiding fluid 41 during gas and liquid conversion, thereby increasing the gas and liquid conversion efficiency of the refrigerant. In turn, the heat dissipation efficiency is improved.
參閱圖6、7，為本發明散熱裝置2之第二較佳實施例，於本實施例中，該二導流體41的第一冷媒儲存管411皆是位於第二冷媒儲存管412的上方，且該二第二冷媒儲存管412之間的距離，是大於該二第一冷媒儲存管411之間的距離，而該傳導件31之流道313的一端是連通於其中一第一冷媒儲存管411，並由該第一冷媒儲存管411向上延伸，以使該散熱裝置2的整體是概呈倒Y形，而該傳導件31還包括一封擋所述流道313之另一端的蓋體314，及多數由該周壁311的表面向外延伸的散熱片315，該蓋體314具有一與所述流道313連通的凹槽316。Referring to FIG. 6 and FIG. 7 , a second preferred embodiment of the heat dissipating device 2 of the present invention is provided. In this embodiment, the first refrigerant storage tubes 411 of the two conductive fluids 41 are located above the second refrigerant storage tube 412. The distance between the two second refrigerant storage tubes 412 is greater than the distance between the two first refrigerant storage tubes 411, and one end of the flow path 313 of the conductive member 31 is connected to one of the first refrigerant storage tubes. 411, and extending upward from the first refrigerant storage tube 411, so that the heat sink 2 is generally inverted Y-shaped, and the conductive member 31 further includes a cover that blocks the other end of the flow path 313. 314, and a plurality of fins 315 extending outward from the surface of the peripheral wall 311, the cover 314 having a recess 316 communicating with the flow passage 313.
當發熱體9的熱能由該傳導件31傳導至所述導流體41時，冷媒會吸熱而由液態轉換成氣態，並由所述第二冷媒儲存管412向上移動並經由第一冷媒儲存管411進入該傳導件31的流道313內，且能經由該蓋體314的凹槽316而於所述流道313之間流通移動，於所述流道313內移動的過程中，所述散熱片315會進行散熱動作，使冷媒冷卻而由氣態轉換成液態並向下流動而進入所述第一冷媒儲存管411內，再由所述第一冷媒儲存管411經由所述引流管413流回所述第二冷媒儲存管412內，在此過程中，冷媒亦能經由所述引流管413之間的散熱鰭片414進行散熱，讓冷媒進一步冷卻。藉此設計，讓冷媒同樣可以循環流動而提升散熱效率，並提供另一種使用態樣。When the heat energy of the heat generating body 9 is conducted to the conductive fluid 41 by the conductive member 31, the refrigerant absorbs heat and is converted into a gaseous state by the liquid state, and is moved upward by the second refrigerant storage tube 412 and passes through the first refrigerant storage tube 411. The flow path 313 of the conductive member 31 is inserted into the flow path 313 of the conductive member 31, and can be circulated and moved between the flow paths 313 via the groove 316 of the cover body 314. During the movement in the flow path 313, the heat sink 315 performs a heat dissipation operation to cool the refrigerant and convert it from a gaseous state to a liquid state and flow downward to enter the first refrigerant storage pipe 411, and then flow back from the first refrigerant storage pipe 411 via the drainage pipe 413. In the second refrigerant storage tube 412, in the process, the refrigerant can also dissipate heat through the heat dissipation fins 414 between the drainage tubes 413 to further cool the refrigerant. This design allows the refrigerant to circulate as well to increase heat dissipation efficiency and provide another use.
本實施例還可以是如圖8所示之態樣，只使用一個導流體41與該傳導件31連通，並且該傳導單元3還可以包括一設置於所述散熱片315上的風扇317。藉此，冷媒同樣可以向上移動而增加流動循環的空間之外，該風扇317的設置亦能加快散熱速度，提升散熱效果。In this embodiment, the conductive unit 3 may further include a fan 317 disposed on the heat sink 315. Thereby, the refrigerant can also move upwards to increase the space of the flow circulation, and the setting of the fan 317 can also accelerate the heat dissipation speed and improve the heat dissipation effect.
綜上所述，本發明散熱裝置2，透過該傳導件31與冷媒儲存單元4的設置位置變化，讓冷媒能於該傳導件31與冷媒儲存單元4之間循環流動，提升散熱效率，故確實能達成本發明之目的。In summary, the heat dissipating device 2 of the present invention changes the installation position of the conductive member 31 and the refrigerant storage unit 4, so that the refrigerant can circulate between the conductive member 31 and the refrigerant storage unit 4, thereby improving the heat dissipation efficiency. The object of the invention can be achieved.
惟以上所述者，僅為本發明之較佳實施例而已，當不能以此限定本發明實施之範圍，即大凡依本發明申請專利範圍及發明說明內容所作之簡單的等效變化與修飾，皆仍屬本發明專利涵蓋之範圍內。The above is only the preferred embodiment of the present invention, and the scope of the invention is not limited thereto, that is, the simple equivalent changes and modifications made by the scope of the invention and the description of the invention are All remain within the scope of the invention patent.
2．．．散熱裝置2. . . Heat sink
3．．．傳導單元3. . . Conduction unit
31．．．傳導件31. . . Conductor
311．．．周壁311. . . Zhou wall
312．．．導熱片312. . . Thermal sheet
313．．．流道313. . . Runner
314．．．蓋體314. . . Cover
315．．．散熱片315. . . heat sink
316．．．凹槽316. . . Groove
317．．．風扇317. . . fan
4．．．冷媒儲存單元4. . . Refrigerant storage unit
41．．．導流體41. . . Fluid guiding
411．．．第一冷媒儲存管411. . . First refrigerant storage tube
411a．．．第一冷媒儲存管411a. . . First refrigerant storage tube
411b．．．第一冷媒儲存管411b. . . First refrigerant storage tube
412．．．第二冷媒儲存管412. . . Second refrigerant storage tube
412a．．．第二冷媒儲存管412a. . . Second refrigerant storage tube
412b．．．第二冷媒儲存管412b. . . Second refrigerant storage tube
413．．．引流管413. . . Drainage tube
414．．．散熱鰭片414. . . Heat sink fin
415．．．連通管415. . . Connecting pipe
9．．．發熱體9. . . heating stuff
圖1是一立體圖，說明中華民國第M261972號專利案所揭露的「散熱片結構」；Figure 1 is a perspective view showing the "heat sink structure" disclosed in the Patent No. M261972 of the Republic of China;
圖2是一剖視圖，輔助說明圖1；Figure 2 is a cross-sectional view, assistance to illustrate Figure 1;
圖3是一立體圖，說明本發明散熱裝置之第一較佳實施例；Figure 3 is a perspective view showing a first preferred embodiment of the heat sink of the present invention;
圖4是一局部立體圖，輔助說明該第一較佳實施例中，一傳導件的內部結構；Figure 4 is a partial perspective view of the internal structure of a conductive member in the first preferred embodiment;
圖5是一側視圖，輔助說明圖3；Figure 5 is a side view, assistance to explain Figure 3;
圖6是一立體圖，說明本發明散熱裝置之第二較佳實施例；Figure 6 is a perspective view showing a second preferred embodiment of the heat sink of the present invention;
圖7是一側視圖，輔助說明圖6；及Figure 7 is a side view, which is an explanatory view of Figure 6;
圖8是一側視圖，說明該第二較佳實施例的另一種態樣。Figure 8 is a side elevational view showing another aspect of the second preferred embodiment.
2．．．散熱裝置2. . . Heat sink
3．．．傳導單元3. . . Conduction unit
31．．．傳導件31. . . Conductor
4．．．冷媒儲存單元4. . . Refrigerant storage unit
41．．．導流體41. . . Fluid guiding
411．．．第一冷媒儲存管411. . . First refrigerant storage tube
411a．．．第一冷媒儲存管411a. . . First refrigerant storage tube
411b．．．第一冷媒儲存管411b. . . First refrigerant storage tube
412．．．第二冷媒儲存管412. . . Second refrigerant storage tube
412a．．．第二冷媒儲存管412a. . . Second refrigerant storage tube
412b．．．第二冷媒儲存管412b. . . Second refrigerant storage tube
413．．．引流管413. . . Drainage tube
414．．．散熱鰭片414. . . Heat sink fin
415．．．連通管415. . . Connecting pipe
9．．．發熱體9. . . heating stuff
Claims (7)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW101115573A TW201346500A (en) | 2012-05-02 | 2012-05-02 | Heat dissipation device |
| JP2012006976U JP3181289U (en) | 2012-05-02 | 2012-11-16 | Heat dissipation device |
| US13/873,484 US20130292092A1 (en) | 2012-05-02 | 2013-04-30 | Heat Dissipating Device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW101115573A TW201346500A (en) | 2012-05-02 | 2012-05-02 | Heat dissipation device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201346500A true TW201346500A (en) | 2013-11-16 |
| TWI503655B TWI503655B (en) | 2015-10-11 |
Family
ID=49511660
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW101115573A TW201346500A (en) | 2012-05-02 | 2012-05-02 | Heat dissipation device |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US20130292092A1 (en) |
| JP (1) | JP3181289U (en) |
| TW (1) | TW201346500A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109193070A (en) * | 2018-09-05 | 2019-01-11 | 江苏奥吉瑞斯新能源有限公司 | A kind of refrigerant coolant liquid mixed type power battery heat sink |
| TWI798781B (en) * | 2021-06-21 | 2023-04-11 | 廣達電腦股份有限公司 | Liquid cooling module with movable radiators and computing device using the same |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI539894B (en) * | 2014-11-28 | 2016-06-21 | 財團法人工業技術研究院 | Power module |
| CN107548447A (en) * | 2015-04-21 | 2018-01-05 | 阿威德热合金有限公司 | Thermosyphons with multiport pipe and flow arrangement |
| US10107557B2 (en) * | 2016-05-27 | 2018-10-23 | Asia Vital Components Co., Ltd. | Integrated heat dissipation device |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4429734A (en) * | 1981-05-04 | 1984-02-07 | Kool-Fire Limited | Heat exchanger coil |
| US4926931A (en) * | 1988-11-14 | 1990-05-22 | Larinoff Michael W | Freeze protected, air-cooled vacuum steam condensers |
| US6119767A (en) * | 1996-01-29 | 2000-09-19 | Denso Corporation | Cooling apparatus using boiling and condensing refrigerant |
| US6360814B1 (en) * | 1999-08-31 | 2002-03-26 | Denso Corporation | Cooling device boiling and condensing refrigerant |
| JP4178719B2 (en) * | 2000-05-19 | 2008-11-12 | 株式会社デンソー | Boiling cooler |
| US20020121097A1 (en) * | 2001-03-02 | 2002-09-05 | Gil Chiu | Temperature balance device |
| US20070284088A1 (en) * | 2004-08-18 | 2007-12-13 | Kyo-Seok Chun | Cooling Apparatus of Looped Heat Pipe Structure |
| US20070246193A1 (en) * | 2006-04-20 | 2007-10-25 | Bhatti Mohinder S | Orientation insensitive thermosiphon of v-configuration |
| US7403392B2 (en) * | 2006-05-16 | 2008-07-22 | Hardcore Computer, Inc. | Liquid submersion cooling system |
| US7665511B2 (en) * | 2006-05-25 | 2010-02-23 | Delphi Technologies, Inc. | Orientation insensitive thermosiphon capable of operation in upside down position |
| WO2010145434A1 (en) * | 2009-06-15 | 2010-12-23 | 华为技术有限公司 | Heat exchanger, heat dissipation method of same and communication apparatus |
| JP2011196632A (en) * | 2010-03-19 | 2011-10-06 | Toyota Industries Corp | Ebullient cooling device |
| CN202143339U (en) * | 2011-07-27 | 2012-02-08 | 兆亮科技股份有限公司 | Radiating device and radiating plate thereof |
-
2012
- 2012-05-02 TW TW101115573A patent/TW201346500A/en not_active IP Right Cessation
- 2012-11-16 JP JP2012006976U patent/JP3181289U/en not_active Expired - Fee Related
-
2013
- 2013-04-30 US US13/873,484 patent/US20130292092A1/en not_active Abandoned
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109193070A (en) * | 2018-09-05 | 2019-01-11 | 江苏奥吉瑞斯新能源有限公司 | A kind of refrigerant coolant liquid mixed type power battery heat sink |
| TWI798781B (en) * | 2021-06-21 | 2023-04-11 | 廣達電腦股份有限公司 | Liquid cooling module with movable radiators and computing device using the same |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI503655B (en) | 2015-10-11 |
| JP3181289U (en) | 2013-01-31 |
| US20130292092A1 (en) | 2013-11-07 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI438388B (en) | Liquid cooling device | |
| US20150059360A1 (en) | Liquid cooling device having diversion mechanism | |
| TW201346500A (en) | Heat dissipation device | |
| US20160120063A1 (en) | Liquid cooling system having heat dissipation fins therein | |
| US20200029466A1 (en) | Liquid-heat-transmission device | |
| WO2020211416A1 (en) | Air conditioner outdoor unit and air conditioner | |
| TWM505162U (en) | Refrigerant type heat dissipation device and evaporator with heat dissipation fin | |
| KR101228757B1 (en) | Led lighting devices with dual cooling structure | |
| US20110192572A1 (en) | Heat exchanger | |
| TWM442535U (en) | Heat-dissipating device and heat-dissipating module | |
| JP2006344636A (en) | Parallel loop type heat dispersion plate | |
| TWM554979U (en) | Phase-change evaporator and phase-change heat dissipation device | |
| CN109392283A (en) | Phase change evaporator and phase-change heat sink | |
| KR101505908B1 (en) | heat exchanger | |
| JP2005011928A (en) | Liquid-cooling circulation system | |
| CN208487602U (en) | A kind of radiator structure for high-power LED light source | |
| CN108323099B (en) | Fin type heat pipe coupling radiator | |
| TWI549596B (en) | Electrode type liquid cooling device | |
| TW201723413A (en) | Cooling module | |
| CN206525069U (en) | Radiator for power electronic devices | |
| JP2017112189A (en) | Thermo-siphon cooling device | |
| TW201317400A (en) | Aluminum heat-dissipation unit and method of manufacturing same | |
| TWM396426U (en) | Structure improvement on heat dissipater | |
| CN203082846U (en) | Combined cooling device | |
| KR101376291B1 (en) | Heat exchanger |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |