TWM554979U - Phase-change evaporator and phase-change heat dissipation device - Google Patents
Phase-change evaporator and phase-change heat dissipation device Download PDFInfo
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Abstract
一種相變化蒸發器及相變化散熱裝置，相變化蒸發器係於蒸發器本體中設一補強板，將具有導熱鰭片的蒸發室區隔成兩空間，該兩空間共同連通冷媒出口，蒸發器本體的側壁設有開口面積小於冷媒出口的冷媒入口，相變化散熱裝置係自相變化蒸發器之冷媒出口及冷媒入口分別接設冷媒輸出管、冷媒回流管連接冷凝器而組成一冷媒循環迴路，冷媒循環迴路中裝填冷媒。其中利用補強板強化相變化蒸發器的構造以及將蒸發室分隔成兩個空間之構造，在相變化蒸發器接觸熱源而使冷媒蒸發為氣態時，可使蒸發室中的內部氣壓提高，搭配開口大小不等的冷媒出口與冷媒入口產生之氣體壓力差異，使得氣態冷媒能夠加速朝冷媒出口方向通過，提升冷媒循環流動性能。A phase change evaporator and a phase change heat dissipation device, wherein the phase change evaporator is provided with a reinforcing plate in the evaporator body, and the evaporation chamber having the heat transfer fins is partitioned into two spaces, the two spaces jointly communicate with the refrigerant outlet, the evaporator The side wall of the main body is provided with a refrigerant inlet having an opening area smaller than that of the refrigerant outlet, and the phase change heat dissipating device is connected to the refrigerant outlet and the refrigerant inlet of the phase change evaporator respectively to connect the refrigerant output tube and the refrigerant return tube to the condenser to form a refrigerant circulation loop. The refrigerant circulation circuit is filled with refrigerant. The structure in which the reinforcing plate is used to strengthen the phase change evaporator and the evaporation chamber is divided into two spaces, and when the phase change evaporator contacts the heat source to evaporate the refrigerant into a gaseous state, the internal gas pressure in the evaporation chamber can be increased, and the opening is matched. The difference in gas pressure between the refrigerant outlets of different sizes and the inlet of the refrigerant allows the gaseous refrigerant to accelerate toward the outlet of the refrigerant to improve the circulation performance of the refrigerant.
Description
本新型係關於一種散熱裝置，尤指一種利用冷媒相變化產生吸熱與放熱作用之散熱裝置及其相變化蒸發器。 The present invention relates to a heat dissipating device, and more particularly to a heat dissipating device that utilizes a phase change of a refrigerant to generate endothermic and exothermic effects and a phase change evaporator thereof.
現有的電子產品在運作時，通常會連帶產生熱，為避免電子產品因溫度過高而不正常運作或損壞，一般而言，在電子產品的主要發熱源處，皆會裝設有散熱裝置，通過散熱裝置吸收發熱源所產生的熱，並快速地散發於外，使電子產品維持於適當的工作溫度。 When existing electronic products are in operation, heat is usually generated in conjunction with them. In order to prevent electronic products from being abnormally operated or damaged due to excessive temperature, in general, heat dissipating devices are installed at the main heat sources of electronic products. The heat generated by the heat source is absorbed by the heat sink and quickly dissipated to maintain the electronic product at an appropriate operating temperature.
目前常用於電子產品散熱用途的散熱裝置，是以相變化散熱裝置為主，習知的相變化散熱裝置組成構造，其主要係於一蒸發器與一冷凝器之間以複數冷媒導管串接組成一密閉的冷媒循環迴路，並於該密閉的冷媒循環迴路裝填冷媒，該相變化散熱裝置利用蒸發器的底板吸收熱源產生的熱，使蒸發器中之冷媒吸熱轉化為氣態之相變化，氣態冷媒通過冷媒導管流向冷凝器散熱後，冷媒降溫而轉化為液態，液態冷媒再通通另一冷媒導管回流至蒸發器中重新再吸熱，藉此具備循環散熱功能的相變化散熱裝置為電子產品之熱源提供冷卻功能。 At present, the heat dissipating device commonly used for heat dissipation of electronic products is mainly composed of a phase change heat dissipating device, a conventional phase change heat dissipating device, which is mainly composed of a plurality of refrigerant tubes connected in series between an evaporator and a condenser. a closed refrigerant circulation loop, and the refrigerant is filled in the sealed refrigerant circulation loop, and the phase change heat dissipation device absorbs heat generated by the heat source by using the bottom plate of the evaporator, so that the heat absorption of the refrigerant in the evaporator is converted into a gaseous phase change, the gaseous refrigerant After the refrigerant conduit flows to the condenser to dissipate heat, the refrigerant is cooled and converted into a liquid state, and the liquid refrigerant is recirculated through another refrigerant conduit to the evaporator to re-absorb the heat, thereby providing a phase-change heat dissipating device with a circulating heat dissipation function for the heat source of the electronic product. Cooling function.
前揭相變化散熱裝置雖能對電子產品之熱源提供散熱功能，但是，該蒸發器因係一內有蒸發室的中空體，其結構強度較差。而且當蒸發器之底板接觸熱源後，蒸發器中的吸熱轉為氣態的冷媒位於單一寛闊的蒸發室而難達到較高的氣壓壓力狀態，加以連接於蒸發器相異兩側之冷媒管為相同口徑的 冷媒導管，彼此之流體壓力相當，致氣態冷媒難以朝向冷媒出口方向流動，造成冷媒的循環流動性不佳。雖現有相變化散熱裝置進一步利用蒸發器連接二冷媒導管之位置呈一上一下之構造，以期利用冷媒對熱的相變化，氣態冷媒上升之原理，以期導引氣態冷媒流動方向，但是現有蒸發室的構造難以有效提升其內壓，故仍有冷媒的循環流動性不佳之問題。 Although the front-removal heat-dissipating device can provide a heat-dissipating function to the heat source of the electronic product, the evaporator has a structural strength due to a hollow body having an evaporation chamber therein. Moreover, when the bottom plate of the evaporator contacts the heat source, the heat transfer in the evaporator is changed to the gaseous refrigerant in a single wide evaporation chamber, and it is difficult to reach a high pressure and pressure state, and the refrigerant tubes connected to the opposite sides of the evaporator are the same. Caliber The refrigerant conduits have the same fluid pressure as each other, and it is difficult for the gaseous refrigerant to flow toward the refrigerant outlet, resulting in poor circulating fluidity of the refrigerant. Although the existing phase change heat dissipating device further utilizes the position where the evaporator is connected to the two refrigerant conduits in a top-to-bottom configuration, in order to utilize the principle that the refrigerant phase changes with respect to the heat and the gaseous refrigerant rises, in order to guide the flow direction of the gaseous refrigerant, the existing evaporation chamber is provided. The structure is difficult to effectively increase the internal pressure, so there is still a problem that the circulating fluidity of the refrigerant is not good.
本新型之主要目的在於提供一種相變化蒸發器，解決現有相變化蒸發器之蒸發器本體強度不佳，以及難以提供氣態冷媒良好的流動性等問題。 The main purpose of the present invention is to provide a phase change evaporator which solves the problems of poor strength of the evaporator body of the existing phase change evaporator and difficulty in providing good fluidity of the gaseous refrigerant.
為了達成前揭目的，本新型所提出之相變化蒸發器係包含：一蒸發器本體，其包含一導熱底板、一外殼以及一導流端部，該外殼固設於該導熱底板上，在該外殼與該導熱底板之間形成一蒸發室，該外殼頂部具有一連通該蒸發室的通口，該外殼的側壁設有一冷媒入口，該導流端部設於該外殼的頂部，該導流端部中具有一導流室，該導流室通過該通口連通該蒸發室，該導流端部的側壁設有一連通該導流室的冷媒出口，該冷媒出口的位置高於該冷媒入口的位置，且該冷媒出口的開口面積大於該冷媒入口的開口面積；一補強板，係裝設於該蒸發器本體的蒸發室中，該補強板固接於該導熱底板與該外殼的頂部之間，且將該蒸發室區隔成兩空間以及將該蒸發室通往該通口之部位區隔為兩通道，該補強板中形成多個穿孔，使該蒸發室位於該補強板兩側的空間通過該多個穿孔而相互連通；以及多個導熱鰭片，係設置於該蒸發器本體的蒸發室中且分布於該補強板兩側的空間。 In order to achieve the foregoing, the phase change evaporator of the present invention comprises: an evaporator body comprising a heat conducting bottom plate, a casing and a flow guiding end, the casing being fixed on the heat conducting base plate, An evaporation chamber is formed between the outer casing and the heat conducting bottom plate, the top of the outer casing has a through port communicating with the evaporation chamber, and a side wall of the outer casing is provided with a refrigerant inlet, and the flow guiding end is disposed at the top of the outer casing, the flow guiding end The portion of the flow guiding chamber communicates with the evaporation chamber, and the side wall of the flow guiding end portion is provided with a refrigerant outlet communicating with the flow guiding chamber, and the refrigerant outlet is located higher than the refrigerant inlet And the opening area of the refrigerant outlet is larger than the opening area of the refrigerant inlet; a reinforcing plate is installed in the evaporation chamber of the evaporator body, and the reinforcing plate is fixed to the heat conducting bottom plate and the top of the outer casing And dividing the evaporation chamber into two spaces and separating the portion of the evaporation chamber leading to the opening into two channels, wherein the reinforcing plate forms a plurality of perforations, so that the evaporation chamber is located on both sides of the reinforcing plate Space passing A plurality of perforations communicate with each other; and a plurality of heat conducting fins space, the system is provided in the evaporation chamber of the evaporator body and distributed on both sides of the reinforcing plate.
為了達成前揭目的，本新型另外提出之相變化散熱裝置係包含：一如上所述的相變化蒸發器；一冷凝器，其包含一第一冷凝基管、一第二冷凝基管、複數散熱導管以及複數散熱件，該第一冷凝基管與第二冷凝基管係直立設置且間隔排列，該複數散熱導管上下排列地連接於該第一冷凝基管與該第二冷凝基管之間，所述複數散熱件係分布排列且導熱性接觸該複數散熱導管之外表面；一冷媒輸出管，其連接該第一冷凝基管上段與該相變化蒸發器的冷媒出口之間；一冷媒回流管，其連接該第二冷凝基管下段與該相變化蒸發器旳冷媒入口之間，該冷媒回流管的徑向截面積小於該冷媒輸出管的徑向截面積，該相變化蒸發器、該冷媒輸出管、該冷凝器與該冷媒回流管組成一封閉的冷媒循環迴路；以及一冷媒，係裝填該冷媒循環迴路中。 In order to achieve the foregoing object, the phase change heat dissipating device additionally proposed by the present invention comprises: a phase change evaporator as described above; a condenser comprising a first condensing base pipe, a second condensing base pipe, and a plurality of heat dissipation a conduit and a plurality of heat dissipating members, the first condensing base pipe and the second condensing base pipe are arranged upright and spaced apart, and the plurality of heat dissipating conduits are connected up and down between the first condensing base pipe and the second condensing base pipe. The plurality of heat dissipating members are arranged and thermally conductively contact the outer surface of the plurality of heat dissipating conduits; a refrigerant output pipe connecting the upper portion of the first condensing base pipe and the refrigerant outlet of the phase change evaporator; a refrigerant return pipe Connected between the lower portion of the second condensing base pipe and the phase change evaporator 旳 refrigerant inlet, the radial cross-sectional area of the refrigerant return pipe is smaller than the radial cross-sectional area of the refrigerant output pipe, the phase change evaporator, the refrigerant The output pipe, the condenser and the refrigerant return pipe form a closed refrigerant circulation circuit; and a refrigerant is charged in the refrigerant circulation circuit.
藉由前揭相變化蒸發器與相變化散熱裝置創作，其主要係利用相變化蒸發器之蒸發室中設置複數自導熱底板頂面向上凸伸的導熱鰭片，增加導熱面積，提昇冷媒蒸發的性能；該相變化蒸發器於蒸發器本體的蒸發室中設一具有多穿孔的補強板，強化相變化蒸發器的構造，且該補強板利用將具有導熱鰭片的蒸發室區隔成兩空間，該兩空間共同連通冷媒出口，藉此，相變化蒸發器接觸熱源，使冷媒吸熱蒸發為氣態時，分隔成兩空間的蒸發室構造可使內部氣壓提高，再搭配開口大小不等的冷媒出口與冷媒入口產生之氣體壓力差異，使得氣態冷媒能夠加速朝冷媒出口方向通過，提升冷媒循環流動性能。 It is created by the former phase change evaporator and phase change heat sink. It mainly uses the heat transfer fins in the evaporation chamber of the phase change evaporator to cover the top surface of the heat conduction base plate to increase the heat conduction area and enhance the evaporation of the refrigerant. The phase change evaporator is provided with a reinforcing plate having a plurality of perforations in the evaporation chamber of the evaporator body to strengthen the structure of the phase change evaporator, and the reinforcing plate is divided into two spaces by using an evaporation chamber having heat-conducting fins The two spaces are connected to the refrigerant outlet together, whereby the phase change evaporator contacts the heat source to evaporate the heat of the refrigerant into a gaseous state, and the evaporation chamber structure divided into two spaces can increase the internal air pressure, and then mix the refrigerant outlets of different opening sizes. The difference in gas pressure generated from the inlet of the refrigerant allows the gaseous refrigerant to accelerate toward the refrigerant outlet to enhance the refrigerant circulation performance.
10‧‧‧相變化蒸發器 10‧‧‧ phase change evaporator
11‧‧‧蒸發器本體 11‧‧‧Evaporator body
111‧‧‧導熱底板 111‧‧‧thermal base plate
112‧‧‧外殼 112‧‧‧Shell
1120‧‧‧頂板 1120‧‧‧ top board
1121‧‧‧環周壁 1121‧‧‧Circle wall
113‧‧‧導流端部 113‧‧‧drainage end
1130‧‧‧導流室 1130‧‧ ‧ diversion chamber
114‧‧‧蒸發室 114‧‧‧Evaporation room
114A、114B‧‧‧空間 114A, 114B‧‧‧ Space
115‧‧‧冷媒入口 115‧‧‧Refrigerant entrance
116‧‧‧通口 116‧‧‧ mouth
117‧‧‧冷媒出口 117‧‧‧Refrigerant exports
12‧‧‧補強板 12‧‧‧ reinforcing plate
121‧‧‧穿孔 121‧‧‧Perforation
122‧‧‧板邊 122‧‧‧ board edge
13、13A‧‧‧導熱鰭片 13, 13A‧‧‧ Thermal fins
20‧‧‧冷凝器 20‧‧‧Condenser
21‧‧‧第一冷凝基管 21‧‧‧First condensing base pipe
22‧‧‧第二冷凝基管 22‧‧‧Second condensing base pipe
23‧‧‧散熱導管 23‧‧‧heat pipe
24‧‧‧散熱件 24‧‧‧ Heat sink
30‧‧‧冷媒輸出管 30‧‧‧Refrigerant output tube
40‧‧‧冷媒回流管 40‧‧‧Refrigerant return tube
50‧‧‧發熱源 50‧‧‧heat source
圖1係本新型相變化蒸發器的一較佳實施例的立體示意圖。 BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a perspective view of a preferred embodiment of the novel phase change evaporator.
圖2係圖1所示相變化蒸發器較佳實施例的側視剖面示意圖。 Figure 2 is a side cross-sectional view showing a preferred embodiment of the phase change evaporator of Figure 1.
圖3係圖1所示相變化蒸發器的另一側視剖面示意圖。 3 is a schematic side view showing another phase change of the phase change evaporator shown in FIG. 1.
圖4係本新型相變化蒸發器的另一較佳實施例的側視剖面示意圖。 4 is a side cross-sectional view of another preferred embodiment of the novel phase change evaporator.
圖5係本新型相變化蒸發器的另一較佳實施例的俯視剖面示意圖。 Figure 5 is a top cross-sectional view of another preferred embodiment of the novel phase change evaporator.
圖6係本新型相變化散熱裝置的立體示意圖。 Figure 6 is a perspective view of the novel phase change heat sink.
圖7係圖4以及圖1至圖3所示相變化蒸發器應用於發熱源上的使用狀態參考圖。 Fig. 7 is a view showing a state of use of the phase change evaporator shown in Fig. 4 and Figs. 1 to 3 applied to a heat source.
如圖1至圖4所示，揭示本新型相變化蒸發器的數種較佳實施例，該相變化蒸發器10包含一蒸發器本體11、一補強板12以及多個導熱鰭片13。 As shown in FIGS. 1 through 4, several preferred embodiments of the novel phase change evaporator are disclosed. The phase change evaporator 10 includes an evaporator body 11, a reinforcing plate 12, and a plurality of heat transfer fins 13.
如圖1至圖3所示，所述蒸發器本體11包含一導熱底板111、一外殼112以及一導流端部113，該導熱底板111是導熱性材質製成的板體，該外殼112係一中空體並固設於該導熱底板111上，而在該外殼112與導熱底板111之間形成一蒸發室114，該外殼112包含一頂板1120以及一自該頂板1120外周緣向下延伸的環周壁1121，該環周壁1121底緣固接該導熱底板111，該環周壁1121設有一連通蒸發室114的冷媒入口115，該外殼112的頂板1120中具有一通口116，該導流端部113設於該外殼112的頂板1120上，且該導流端部113中具有一導流室1130，該導流室1130通過該通口116而連通該蒸發室114，該導流端部113的側壁設有一連通導流室1130的冷媒出口117，該冷媒出口117的位置高於該冷媒入口115的位置，且該冷媒出口117的開口面積大於冷媒入口115的開口面積。 As shown in FIG. 1 to FIG. 3, the evaporator body 11 includes a heat conducting bottom plate 111, a casing 112, and a flow guiding end portion 113. The heat conducting bottom plate 111 is a plate body made of a heat conductive material. A hollow body is fixed on the heat conducting bottom plate 111, and an evaporation chamber 114 is formed between the outer casing 112 and the heat conducting bottom plate 111. The outer casing 112 includes a top plate 1120 and a ring extending downward from the outer periphery of the top plate 1120. The bottom wall 1121 is fixed to the bottom edge of the circumferential wall 1121. The circumferential wall 1121 is provided with a refrigerant inlet 115 communicating with the evaporation chamber 114. The top plate 1120 of the outer casing 112 has a through hole 116. The flow guiding end 113 The flow guide end portion 113 has a flow guiding chamber 1130. The flow guiding chamber 1130 communicates with the evaporation chamber 114 through the through hole 116. The side wall of the flow guiding end portion 113 is disposed on the top plate 1120 of the outer casing 112. A refrigerant outlet 117 is provided to communicate with the flow guiding chamber 1130. The position of the refrigerant outlet 117 is higher than the position of the refrigerant inlet 115, and the opening area of the refrigerant outlet 117 is larger than the opening area of the refrigerant inlet 115.
如圖2、圖3、圖4所示，該補強板12裝設於該蒸發器本體11的蒸發室114中，該補強板12固接於該導熱底板111與該外殼112的頂板1120之間，藉由該補強板12對該蒸發器本體11提供補強作用而強化蒸發器本體11的構造，該補強板12將蒸發器本體11的蒸發室114區隔成兩個相互連通的空間114A、114B，且該補強板12頂端將蒸發室114通往該通口116之部位區隔為兩通道，該補強板12兩側的板邊122可接觸連接該外殼112的環周壁1121，或如圖3或圖4所示，該補強板12兩側的板邊122與該外殼112的環周壁1121之間具有間距，該補強板12中形成多個穿孔121，所述穿孔連通該蒸發室114位於補強板12兩側的空間114A、114B。 As shown in FIG. 2, FIG. 3 and FIG. 4, the reinforcing plate 12 is installed in the evaporation chamber 114 of the evaporator body 11, and the reinforcing plate 12 is fixed between the heat conducting bottom plate 111 and the top plate 1120 of the outer casing 112. The reinforcement body 12 is reinforced by the reinforcing plate 12 to strengthen the structure of the evaporator body 11, and the reinforcing plate 12 partitions the evaporation chamber 114 of the evaporator body 11 into two mutually communicating spaces 114A, 114B. The top of the reinforcing plate 12 is divided into two channels by the portion of the evaporation chamber 114 that leads to the opening 116. The edge 122 of the reinforcing plate 12 can contact the circumferential wall 1121 of the outer casing 112, or as shown in FIG. Or a gap between the edge 122 of the reinforcing plate 12 and the circumferential wall 1121 of the outer casing 112. A plurality of through holes 121 are formed in the reinforcing plate 12, and the through holes communicate with the evaporation chamber 114 to be reinforced. Spaces 114A, 114B on either side of the board 12.
所述冷媒入口115可為兩個孔洞的組合(圖未示)，該二孔洞分別與蒸發室114的二所述空間114A、114B形成一對一連通。如圖1至圖4所示，所述冷媒入口115也可以是單一個孔洞，該單一個孔洞同時連通蒸發室114的二所述空間114A、114B。 The refrigerant inlet 115 may be a combination of two holes (not shown) that are in one-to-one communication with the two spaces 114A, 114B of the evaporation chamber 114, respectively. As shown in FIG. 1 to FIG. 4, the refrigerant inlet 115 may also be a single hole that simultaneously communicates with the two spaces 114A, 114B of the evaporation chamber 114.
如圖2至圖4所示，該多個導熱鰭片13係間隔排列地固設於該蒸發器本體11的蒸發室114中且分布於該補強板12的兩側的空間，該多個導熱鰭片13係固接於導熱底板111頂面向上延伸。於本較佳實施例中，該多個導熱鰭片13頂端與頂板1120底面之間具有間距。如圖2及圖3所示，所述導熱鰭片13可為導熱金屬板彎折形成波浪狀部件，如圖2、圖3所示，當導熱鰭片13為波浪狀部件時，其波峰與波谷交替排列的方向平行於補強板12的板面，或者，如圖4所示，其波峰與波谷交替排列的方向垂直於補強板12的板面；或者，所述導熱鰭片也可以是平直板狀部件，或如圖5所示，所述導熱鰭片13A為直條狀等。 As shown in FIG. 2 to FIG. 4 , the plurality of heat conducting fins 13 are fixedly arranged in the evaporation chamber 114 of the evaporator body 11 and distributed in the space on both sides of the reinforcing plate 12 . The fins 13 are fixedly attached to the top surface of the heat conducting bottom plate 111 and extend upward. In the preferred embodiment, the top ends of the plurality of heat-dissipating fins 13 have a spacing from the bottom surface of the top plate 1120. As shown in FIG. 2 and FIG. 3, the heat-conducting fins 13 may be formed by bending a heat-conductive metal plate to form a wave-like member. As shown in FIG. 2 and FIG. 3, when the heat-dissipating fins 13 are wavy members, the peaks thereof are The direction in which the troughs are alternately arranged is parallel to the plate surface of the reinforcing plate 12, or, as shown in FIG. 4, the direction in which the peaks and troughs are alternately arranged is perpendicular to the plate surface of the reinforcing plate 12; alternatively, the heat-conducting fins may be flat The straight plate member, or as shown in FIG. 5, the heat transfer fin 13A is a straight strip or the like.
如圖1至圖4以及圖6所示，前揭相變化蒸發器應用於相變化散熱裝置時，該相變化散熱裝置係包含一所述相變化蒸發器10、一冷凝器20、一冷媒輸出管30以及一冷媒回流管40，所述冷凝器20包含一第一冷凝基管21、一第 二冷凝基管22、複數散熱導管23以及複數散熱件24，該第一冷凝基管21與第二冷凝基管22係直立設置且間隔排列，該複數散熱導管23上下排列地連接於該第一冷凝基管21與第二冷凝基管22之間，所述複數散熱件24係分布排列且導熱性接觸該複數散熱導管23之外表面，該冷媒輸出管30連接第一冷凝基管21上段與該相變化蒸發器10的冷媒出口117之間，該冷媒回流管40連接第二冷凝基管22下段與該相變化蒸發器10旳冷媒入口115之間，所述冷媒輸出管30的徑向截面積大於所述冷媒回流管40的徑向截面積，使相變化蒸發器10、冷媒輸出管30、冷凝器20與冷媒回流管40組成一封閉的冷媒循環迴路，該冷媒循環迴路中裝填有冷媒作為工作流體。 As shown in FIG. 1 to FIG. 4 and FIG. 6 , when the front phase change evaporator is applied to the phase change heat dissipation device, the phase change heat dissipation device includes a phase change evaporator 10 , a condenser 20 , and a refrigerant output. a tube 30 and a refrigerant return pipe 40, the condenser 20 includes a first condensing base pipe 21, a first a second condensing base pipe 22, a plurality of heat radiating ducts 23, and a plurality of heat radiating members 24, the first condensing base pipe 21 and the second condensing base pipe 22 are erected and spaced apart, and the plurality of heat radiating ducts 23 are vertically connected to the first Between the condensing base pipe 21 and the second condensing base pipe 22, the plurality of heat dissipating members 24 are arranged and thermally conductively contact the outer surface of the plurality of heat dissipating ducts 23. The refrigerant output pipe 30 is connected to the upper portion of the first condensing base pipe 21 and Between the refrigerant outlets 117 of the phase change evaporator 10, the refrigerant return pipe 40 is connected between the lower stage of the second condensing base pipe 22 and the phase change evaporator 10 and the refrigerant inlet 115, and the refrigerant output pipe 30 is radially cut. The area is larger than the radial cross-sectional area of the refrigerant return pipe 40, and the phase change evaporator 10, the refrigerant output pipe 30, the condenser 20 and the refrigerant return pipe 40 form a closed refrigerant circulation circuit, and the refrigerant circulation circuit is filled with the refrigerant. As a working fluid.
如圖2至圖3及圖5所示，當所述冷媒入口115為單一個孔洞，該單一個孔洞同時連通該蒸發室114的二所述空間114A、114B，連接該冷媒入口115的該冷媒回流管40為單一管件。當所述冷媒入口為兩個孔洞的組合(圖未示)，該二孔洞分別與該蒸發室的二所述空間形成一對一連通，所述冷媒回流管為二管件所組成(圖未示)，該二管件分別連接該冷媒入口的該二孔洞。 As shown in FIG. 2 to FIG. 3 and FIG. 5, when the refrigerant inlet 115 is a single hole, the single hole simultaneously communicates with the two spaces 114A and 114B of the evaporation chamber 114, and the refrigerant connected to the refrigerant inlet 115. The return line 40 is a single piece of tubing. When the refrigerant inlet is a combination of two holes (not shown), the two holes are respectively formed in one-to-one communication with the two spaces of the evaporation chamber, and the refrigerant return pipe is composed of two pipes (not shown) The two tubes are respectively connected to the two holes of the refrigerant inlet.
該相變化散熱裝置於使用時，以應用於電子產品之散熱為例，如圖6及圖7所示，其係以相變化蒸發器10的導熱底板111接觸電子產品的發熱源50，發熱源50產生的熱通過導熱底板111傳導至蒸發器本體11內部的導熱鰭片13，擴大散熱面積，並使位於蒸發器本體11的蒸發室114兩側空間114A、114B的冷媒因吸熱轉化為氣態，進而通過蒸發器本體11頂板1120中的通口116進入導流端部113，再由通過冷媒出口117、冷媒輸出管30流向冷凝器20的第一冷凝基管21，接續分散通過冷凝器20的複數散熱導管23進入第二冷凝基管22，其間，藉由熱傳導至接觸該複數散熱導管23的散熱件24，而擴大散熱表面以快速散熱，並使通過該複數散熱導管23內的氣態冷媒降溫而冷凝為液態冷媒，之後，液態冷媒通過第二冷凝基管22、冷媒回流管40以及蒸發器本體11的冷媒入 口115回流至相變化蒸發器10的蒸發室114中重新再吸熱，藉此循環，使該相變化散熱裝置能達到高效能的散熱效果。 When the phase change heat dissipating device is used, the heat dissipation applied to the electronic product is taken as an example. As shown in FIG. 6 and FIG. 7 , the heat conduction source 50 of the phase change evaporator 10 is in contact with the heat source 50 of the electronic product, and the heat source is used. The heat generated by 50 is conducted to the heat-conducting fins 13 inside the evaporator body 11 through the heat-conducting bottom plate 111 to expand the heat-dissipating area, and the refrigerant in the spaces 114A, 114B on both sides of the evaporation chamber 114 of the evaporator body 11 is converted into a gaseous state by heat absorption. Further, through the through port 116 in the top plate 1120 of the evaporator body 11, the flow guiding end portion 113 enters the flow guiding end portion 113, and then flows through the refrigerant outlet 117 and the refrigerant output pipe 30 to the first condensing base pipe 21 of the condenser 20, and then is dispersed and passed through the condenser 20. The plurality of heat dissipation ducts 23 enter the second condensing base pipe 22, and heat is radiated to the heat dissipating members 24 contacting the plurality of heat dissipating ducts 23 to expand the heat dissipating surface for rapid heat dissipation and to cool the gaseous refrigerant passing through the plurality of heat dissipating ducts 23 And condensed into a liquid refrigerant, after which the liquid refrigerant passes through the second condensing base pipe 22, the refrigerant return pipe 40, and the refrigerant of the evaporator body 11 The port 115 is recirculated to the evaporation chamber 114 of the phase change evaporator 10 to re-absorb heat, thereby circulating, so that the phase change heat sink can achieve a high-efficiency heat dissipation effect.
綜上所述，本新型除了利用相變化蒸發器與冷凝器利用冷媒輸出管、冷媒回流管串連組成一封閉的冷媒循環迴路，該冷媒循環迴路裝填冷媒，藉由相變化蒸發器吸收發熱源產生的熱，使相變化蒸發器內之冷媒吸熱轉化為氣態，氣態冷媒循序自相變化蒸發器進入冷凝器中散熱後，氣態冷媒降溫為液態冷媒回流至相變化蒸發器中，達到預定散熱功能之外。本新型還利用相變化蒸發器之蒸發室中設置複數自導熱底板頂面向上凸伸的導熱鰭片，增加導熱面積，提昇冷媒蒸發的性能；該相變化蒸發器於蒸發器本體的蒸發室中設一具有多穿孔的補強板，強化相變化蒸發器的構造，且該補強板利用將具有導熱鰭片的蒸發室區隔成兩空間，該兩空間共同連通冷媒出口，藉此，相變化蒸發器接觸熱源，使冷媒吸熱蒸發為氣態時，分隔成兩空間的蒸發室構造可使內部氣壓提高，再搭配開口大小不等的冷媒出口與冷媒入口產生之氣體壓力差異，使得氣態冷媒能夠加速朝冷媒出口方向通過，提升冷媒循環流動性能。 In summary, the present invention uses a phase change evaporator and a condenser to form a closed refrigerant circulation loop by using a refrigerant output pipe and a refrigerant return pipe in series, the refrigerant circulation circuit is filled with a refrigerant, and the heat source is absorbed by the phase change evaporator. The generated heat converts the heat absorption of the refrigerant in the phase change evaporator into a gaseous state, and the gaseous refrigerant sequentially changes from the phase change evaporator to the condenser to dissipate heat, and the gaseous refrigerant cools down to return the liquid refrigerant to the phase change evaporator to achieve a predetermined heat dissipation function. Outside. The novel also utilizes a plurality of heat-conducting fins protruding from the top surface of the heat-conducting bottom plate in the evaporation chamber of the phase-change evaporator to increase the heat-conducting area and improve the evaporation performance of the refrigerant; the phase change evaporator is in the evaporation chamber of the evaporator body A reinforcing plate having a plurality of perforations is provided to strengthen the structure of the phase change evaporator, and the reinforcing plate is partitioned into two spaces by using an evaporation chamber having heat-conducting fins, the two spaces collectively communicating with the refrigerant outlet, thereby phase-evaporating When the heat exchanger is in contact with the heat source to evaporate the refrigerant into a gaseous state, the evaporation chamber structure divided into two spaces can increase the internal air pressure, and then the gas pressure difference between the refrigerant outlet and the refrigerant inlet with different opening sizes can make the gaseous refrigerant accelerate. The direction of the refrigerant outlet is passed to improve the circulation performance of the refrigerant.
10‧‧‧相變化蒸發器 10‧‧‧ phase change evaporator
11‧‧‧蒸發器本體 11‧‧‧Evaporator body
111‧‧‧導熱底板 111‧‧‧thermal base plate
112‧‧‧外殼 112‧‧‧Shell
1120‧‧‧頂板 1120‧‧‧ top board
1121‧‧‧環周壁 1121‧‧‧Circle wall
113‧‧‧導流端部 113‧‧‧drainage end
1130‧‧‧導流室 1130‧‧ ‧ diversion chamber
114‧‧‧蒸發室 114‧‧‧Evaporation room
114A、114B‧‧‧空間 114A, 114B‧‧‧ Space
115‧‧‧冷媒入口 115‧‧‧Refrigerant entrance
116‧‧‧通口 116‧‧‧ mouth
117‧‧‧冷媒出口 117‧‧‧Refrigerate exports
12‧‧‧補強板 12‧‧‧ reinforcing plate
121‧‧‧穿孔 121‧‧‧Perforation
13‧‧‧導熱鰭片 13‧‧‧ Thermal fins
30‧‧‧冷媒輸出管 30‧‧‧Refrigerant output tube
40‧‧‧冷媒回流管 40‧‧‧Refrigerant return tube
Claims (12)
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW106211337U TWM554979U (en) | 2017-08-02 | 2017-08-02 | Phase-change evaporator and phase-change heat dissipation device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW106211337U TWM554979U (en) | 2017-08-02 | 2017-08-02 | Phase-change evaporator and phase-change heat dissipation device |
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| Publication Number | Publication Date |
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| TWM554979U true TWM554979U (en) | 2018-02-01 |
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| TW (1) | TWM554979U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI650520B (en) * | 2017-08-02 | 2019-02-11 | 萬在工業股份有限公司 | Phase change evaporator and phase change heat sink |
| TWI683078B (en) * | 2019-03-04 | 2020-01-21 | 萬在工業股份有限公司 | Gravity-type liquid gas circulation device |
| TWI715239B (en) * | 2019-10-09 | 2021-01-01 | 兆亮科技股份有限公司 | Phase change heat sink |
-
2017
- 2017-08-02 TW TW106211337U patent/TWM554979U/en unknown
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI650520B (en) * | 2017-08-02 | 2019-02-11 | 萬在工業股份有限公司 | Phase change evaporator and phase change heat sink |
| TWI683078B (en) * | 2019-03-04 | 2020-01-21 | 萬在工業股份有限公司 | Gravity-type liquid gas circulation device |
| TWI715239B (en) * | 2019-10-09 | 2021-01-01 | 兆亮科技股份有限公司 | Phase change heat sink |
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