TW201322383A - Method of manufacturing a touch panel - Google Patents
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Abstract
Description
本發明是有關於一種觸控面板的製造方法。The present invention relates to a method of manufacturing a touch panel.
近年來觸控技術被廣泛地應用在各式多媒體電子產品中，特別是隨身的移動式產品，如手機、電子書等。更由於空間與設計的需求，必須使用觸控技術作為輸入(input)之手段，以有效取代現有鍵盤或滑鼠的輸入方法。除便利性外，更由於操作的直覺性，成為極受歡迎的新型態人機介面與多媒體互動方式，因而受到相當的重視與大量開發。In recent years, touch technology has been widely used in various multimedia electronic products, especially portable mobile products such as mobile phones and e-books. Moreover, due to space and design requirements, touch technology must be used as an input method to effectively replace the input method of an existing keyboard or mouse. In addition to convenience, and because of the intuitiveness of operation, it has become a very popular new type of human-machine interface and multimedia interaction, which has received considerable attention and extensive development.
一般來說，觸控面板中具有覆蓋基板以提升觸控面板的強度。為了減少觸控面板的整體厚度，習知技術中會將觸控感應層的製程直接作在覆蓋基板上，以減少一道基板的使用。此外，在大量製造時，通常使用陣列式的製造方法，一次將多個觸控面板製作於同一片大片的覆蓋基板上，在完成所有製程後，再進行切割以得到各個觸控面板。之後，再進行後製加工的程序。Generally, the touch panel has a cover substrate to enhance the strength of the touch panel. In order to reduce the overall thickness of the touch panel, the prior art processes the touch sensing layer directly on the cover substrate to reduce the use of one substrate. In addition, in a large number of manufacturing, an array manufacturing method is generally used, and a plurality of touch panels are fabricated on the same large cover substrate at a time, and after all the processes are completed, cutting is performed to obtain the respective touch panels. After that, the post-processing process is performed.
然而，由於覆蓋基板通常選用高強度的強化玻璃，其不易進行切割的程序，因此造成切割成形後之覆蓋基板的強度下降。此外，有些高硬度的強化玻璃不易進行切割程序或是在切割的過程中產生大量碎片，而造成良率低落的情形。However, since the cover substrate is usually made of high-strength tempered glass, it is difficult to perform the cutting process, and thus the strength of the cover substrate after the dicing is lowered. In addition, some high-hardness tempered glass is not easy to perform the cutting process or generate a large amount of debris during the cutting process, resulting in a low yield.
本發明提供一種觸控面板的製造方法，其可防止觸控面板之覆蓋基板面臨切割後強度減低的問題，同時提升觸控面板的製造良率。The invention provides a method for manufacturing a touch panel, which can prevent the cover substrate of the touch panel from facing the problem of reduced strength after cutting, and at the same time improve the manufacturing yield of the touch panel.
本發明提出一種觸控面板的製造方法。首先，提供承載基板。再來，提供多個覆蓋基板(cover substrate)。接著，透過膠材以將覆蓋基板黏貼在承載基板上。之後，在覆蓋基板上進行觸控面板製造程序。最後，將覆蓋基板自承載基板上取下，以形成多個觸控面板。The invention provides a method for manufacturing a touch panel. First, a carrier substrate is provided. Further, a plurality of cover substrates are provided. Next, the cover substrate is adhered to the carrier substrate through the adhesive material. Thereafter, the touch panel manufacturing process is performed on the cover substrate. Finally, the cover substrate is removed from the carrier substrate to form a plurality of touch panels.
基於上述，本發明提供承載基板以作為基底，再將覆蓋基板藉由膠材黏貼在承載基板上，在完成觸控面板的製造程序後，移除膠材使承載基板與覆蓋基板分離，以完成觸控面板的製作。藉由上述方法可使觸控面板在完成之後不需再經過切割的程序。如此一來，可以同時提升製程的良率以及確保觸控面板具有良好的強度，且可以提高產能。Based on the above, the present invention provides a carrier substrate as a substrate, and then the cover substrate is adhered to the carrier substrate by a glue material. After the manufacturing process of the touch panel is completed, the glue material is removed to separate the carrier substrate from the cover substrate to complete The production of touch panels. By the above method, the touch panel can be processed without further cutting after completion. In this way, the process yield can be improved at the same time, and the touch panel can be ensured to have good strength and productivity can be improved.
為讓本發明之上述特徵和優點能更明顯易懂，下文特舉實施例，並配合所附圖式作詳細說明如下。The above described features and advantages of the present invention will be more apparent from the following description.
圖1A至圖1H為本發明第一實施例之觸控面板的製造流程示意圖。請參照圖1A，本實施例之觸控面板的製造方法首先提供承載基板110。承載基板110例如是玻璃或是強化玻璃，但不以此為限。1A to 1H are schematic diagrams showing a manufacturing process of a touch panel according to a first embodiment of the present invention. Referring to FIG. 1A , a method for manufacturing a touch panel of the present embodiment first provides a carrier substrate 110 . The carrier substrate 110 is, for example, glass or tempered glass, but is not limited thereto.
接著，提供多個覆蓋基板120a。在本實施例中，覆蓋基板120a例如是接受過處理程序的強化玻璃。所述的處理程序包括：使用未強化的玻璃進行切割、磨邊、鑽孔以及導角程序之後，再進行化學強化程序。之後，於玻璃之表面上進行印刷程序，即完成覆蓋基板120a的前製處理。Next, a plurality of cover substrates 120a are provided. In the present embodiment, the cover substrate 120a is, for example, a tempered glass that has been subjected to a processing procedure. The processing procedure includes a chemical strengthening procedure followed by cutting, edging, drilling, and a cornering procedure using unreinforced glass. Thereafter, a printing process is performed on the surface of the glass, that is, the pre-processing of the cover substrate 120a is completed.
再來，將膠材130a黏佈於承載基板110之一表面上。在本實施例中，膠材130a例如是物理性膠材(例如是以聚亞醯胺為基底的雙面膠帶)或是化學性膠材(例如是光硬化膠材或是熱硬化膠材)。所述雙面膠帶的上層與下層黏著劑的材質分別為矽膠(Silicone)與壓克力材質。在此，雙面膠帶中與承載基板110接觸的是壓克力材質的黏著劑。在其他實施例中，膠材130a例如是使用光硬化膠材或是熱硬化膠材，則利用照光或是加熱的方式，使覆蓋基板120a黏貼在承載基板110上。Then, the glue 130a is adhered to one surface of the carrier substrate 110. In this embodiment, the rubber material 130a is, for example, a physical rubber material (for example, a double-sided tape based on polyamine) or a chemical adhesive material (for example, a light-curing adhesive or a heat-curing adhesive). . The materials of the upper layer and the lower layer of the double-sided adhesive tape are respectively Silicone and acrylic materials. Here, in the double-sided tape, the contact with the carrier substrate 110 is an adhesive of an acrylic material. In other embodiments, the adhesive material 130a is adhered to the carrier substrate 110 by illumination or heating, for example, by using a photo-curing adhesive or a thermosetting adhesive.
然後，透過膠材130a將多個覆蓋基板120a黏貼在承載基板110上。為了清楚說明覆蓋基板120a與承載基板110的配置關係，圖1B中繪示覆蓋基板120a與承載基板110的上視示意圖。請同時參照圖1A與圖1B，在本實施例中，承載基板110例如為大面積的玻璃基板，而覆蓋基板120a例如為較小面積且接受過處理程序的強化玻璃。多個覆蓋基板120a是透過膠材130a以陣列的方式精準地黏貼在承載基板110上。Then, a plurality of cover substrates 120a are adhered to the carrier substrate 110 through the adhesive 130a. In order to clearly illustrate the arrangement relationship between the cover substrate 120a and the carrier substrate 110, a top view of the cover substrate 120a and the carrier substrate 110 is illustrated in FIG. 1B. Referring to FIG. 1A and FIG. 1B simultaneously, in the present embodiment, the carrier substrate 110 is, for example, a large-area glass substrate, and the cover substrate 120a is, for example, a tempered glass having a small area and subjected to a processing procedure. The plurality of cover substrates 120a are accurately adhered to the carrier substrate 110 in an array through the adhesive material 130a.
接著，於覆蓋基板120a上製作觸控面板的製造程序。所述製造程序例如為製造觸控感應(sensor)電路及/或外圍電路(fan-out)。在此，以其中一道感應電極的製程為例，如圖1C至圖1G所示。首先請參照圖1C，以沈積法(例如是物理或化學氣相沉積法)沉積導電層140於承載基板110以及覆蓋基板120a之上。接著，如圖1D所示，於導電層140上噴塗(Spray coat)液態的光阻層150。然後，如圖1E所示，利用電射光直接寫入曝光系統(Laser Direct Image Exposure System，LDI)以完成光阻層150的曝光程序並進行光阻層的顯影程序。再來，以圖案化的光阻層150作為蝕刻遮罩蝕刻導電層140以形成圖案化導電層140(例如是感應電極)，如圖1F所示。最後，再去除光阻層150。此外，圖案化導電層140形成的方式，不以此為限。在此僅以一道製程作為說明，當然，此領域中具有通常知識者應知完整的觸控面板的製造程序可能需要進行更多的製程才能完成觸控感應電路及/或外圍電路的製作，使用者可依需求作設計，本發明不以此為限。Next, a manufacturing process of the touch panel is fabricated on the cover substrate 120a. The manufacturing process is, for example, manufacturing a touch sensor circuit and/or a fan-out. Here, a process of one of the sensing electrodes is taken as an example, as shown in FIG. 1C to FIG. 1G. Referring first to FIG. 1C, a conductive layer 140 is deposited on the carrier substrate 110 and the cover substrate 120a by a deposition method such as physical or chemical vapor deposition. Next, as shown in FIG. 1D, a liquid photoresist layer 150 is spray coated on the conductive layer 140. Then, as shown in FIG. 1E, an exposure system (Laser Direct Image Exposure System, LDI) is directly used to complete the exposure process of the photoresist layer 150 and perform a development process of the photoresist layer. Next, the conductive layer 140 is etched with the patterned photoresist layer 150 as an etch mask to form a patterned conductive layer 140 (eg, a sensing electrode), as shown in FIG. 1F. Finally, the photoresist layer 150 is removed. In addition, the manner in which the patterned conductive layer 140 is formed is not limited thereto. Here, only one process is used as a description. Of course, those with ordinary knowledge in this field should know that the complete touch panel manufacturing process may require more processes to complete the production of touch sensing circuits and/or peripheral circuits. The design can be made according to requirements, and the invention is not limited thereto.
在完成上述觸控面板的製造程序之後，即可在覆蓋基板120a上形成觸控元件層160，如圖1G所示，所述觸控元件層160除了上述之導電層140(感應電極，未於圖上繪示)之外還包括了其他的觸控元件。之後，使用直接剝除法、熱水浸泡法或是其他適當的方法將覆蓋基板120a從承載基板100上移除。舉例來說，若本實施例之膠材130a是採用物理性膠材，因膠材130a與承載基板110之間的黏著力大於膠材130a與覆蓋基板120a之間的黏著，因此覆蓋基板120a可直接以外力從承載基板110上取下，即可得到如圖1H所示的觸控面板100。之後，再對觸控面板100進行適當的後製處理。所述的後製處理例如為清洗、紅外線油墨印刷、鏡面油墨印刷、其它特殊功能性油墨印刷或是保護層之製作。而承載基板110經由適當的處理過後，可以回收再利用。After the manufacturing process of the touch panel is completed, the touch device layer 160 can be formed on the cover substrate 120a. As shown in FIG. 1G, the touch device layer 160 is in addition to the conductive layer 140 (induction electrode, not Other touch elements are included in addition to the figure. Thereafter, the cover substrate 120a is removed from the carrier substrate 100 using a direct strip method, a hot water immersion method, or other suitable method. For example, if the adhesive material 130a of the embodiment is a physical adhesive material, since the adhesive force between the adhesive material 130a and the carrier substrate 110 is greater than the adhesion between the adhesive material 130a and the cover substrate 120a, the cover substrate 120a can be The direct external force is removed from the carrier substrate 110 to obtain the touch panel 100 as shown in FIG. 1H. After that, the touch panel 100 is subjected to an appropriate post-processing. The post-processing is, for example, cleaning, infrared ink printing, mirror ink printing, other special functional ink printing, or the production of a protective layer. After the carrier substrate 110 is properly processed, it can be recycled and reused.
在此必須說明的是，下述實施例沿用前述實施例的元件標號與部分內容，其中採用相同的標號來表示相同或近似的元件，並且省略了相同技術內容的說明。關於省略部分的說明可參考前述實施例，下述實施例不再重複贅述。It is to be noted that the following embodiments use the same reference numerals and parts of the above-mentioned embodiments, and the same reference numerals are used to refer to the same or similar elements, and the description of the same technical content is omitted. For the description of the omitted portions, reference may be made to the foregoing embodiments, and the following embodiments are not repeated.
圖2A至圖2G為本發明第二實施例之觸控面板的製造流程示意圖。請參照圖2A，本實施例之觸控面板的製造方法首先提供承載基板110。承載基板110例如是玻璃或是強化玻璃。2A to 2G are schematic diagrams showing a manufacturing process of a touch panel according to a second embodiment of the present invention. Referring to FIG. 2A , the manufacturing method of the touch panel of the embodiment first provides the carrier substrate 110 . The carrier substrate 110 is, for example, glass or tempered glass.
接著，提供多個覆蓋基板120b。在本實施例中，覆蓋基板120b例如是接受過處理程序的強化玻璃。所述的處理程序包括：使用未強化的玻璃進行導角以及打磨程序之後，再進行化學強化程序。其中，覆蓋基板120b是藉由打磨程序以形成非平面表面S。所述非平面表面S例如為弧狀表面，但不以此為限，端看設計者所需。之後，於玻璃之表面上進行印刷程序，即完成覆蓋基板120b的前製處理。Next, a plurality of cover substrates 120b are provided. In the present embodiment, the cover substrate 120b is, for example, a tempered glass that has been subjected to a processing procedure. The processing procedure includes performing a chemical strengthening procedure after conducting the lead angle and the grinding process using the unreinforced glass. Wherein, the cover substrate 120b is formed by a grinding process to form a non-planar surface S. The non-planar surface S is, for example, an arcuate surface, but is not limited thereto, and the end is required by the designer. Thereafter, a printing process is performed on the surface of the glass, that is, the pre-processing of covering the substrate 120b is completed.
再來，將多個具有非平面表面S之覆蓋基板120b透過膠材130b黏貼在承載基板110之上。具體而言，本實施例之膠材130b例如是光硬化膠材或熱硬化膠材。將具有液態性質的膠材130b填滿覆蓋基板120b之非平面表面S與承載基板110之間的空隙後，用燈源照射或加熱膠材130b。所述膠材130b會吸收燈源的波長(例如是紫外光)或因熱度而固化並產生黏性以將覆蓋基板120b黏貼在承載基板110之上。與第一實施例類似地，多個覆蓋基板120b是以陣列的方式排列在承載基板110之上。此外，覆蓋基板120b是以非平面表面S與膠材130b接觸。Then, a plurality of cover substrates 120b having non-planar surfaces S are adhered to the carrier substrate 110 through the adhesive 130b. Specifically, the rubber material 130b of the present embodiment is, for example, a photocurable rubber or a thermosetting rubber. After the rubber material 130b having a liquid property is filled to cover the gap between the non-planar surface S of the substrate 120b and the carrier substrate 110, the glue 130b is irradiated or heated with a light source. The glue 130b absorbs the wavelength of the light source (for example, ultraviolet light) or cures due to heat and generates adhesiveness to adhere the cover substrate 120b to the carrier substrate 110. Similar to the first embodiment, a plurality of cover substrates 120b are arranged in an array on the carrier substrate 110. Further, the cover substrate 120b is in contact with the glue 130b with a non-planar surface S.
接著，於覆蓋基板120b上製作觸控面板的製造程序。所述製造程序例如為觸控感應電路及/或外圍電路。在此，以其中一道感應電極的製程為例，如圖2B至圖2F所示。首先，請參照圖2B，以沈積法(例如是物理或化學氣相沉積法)沉積導電層140於承載基板110以及覆蓋基板120b之上。接著，請參照圖2C，使用滾壓貼合的方式貼附乾膜光阻層150於導電層140上。然後，請參照圖2D，利用已知的光罩曝光以及顯影方式以完成光阻層150圖案化程序。再來，利用圖案化光阻層150作為蝕刻遮罩蝕刻導電層140，以形成圖案化導電層140(例如是感應電極)，如圖2E所示。最後，再去除光阻層150。此外，圖案化導電層140形成的方式，不以此為限。在此僅以一道製程作為說明，當然，此領域中具有通常知識者應知完整的觸控面板的製造程序可能需要進行更多的製程才能完成觸控感應電路及或外圍電路的製作，使用者可依需求作設計，本發明不以此為限。Next, a manufacturing process of the touch panel is fabricated on the cover substrate 120b. The manufacturing process is, for example, a touch sensing circuit and/or a peripheral circuit. Here, a process of one of the sensing electrodes is taken as an example, as shown in FIGS. 2B to 2F. First, referring to FIG. 2B, a conductive layer 140 is deposited on the carrier substrate 110 and the cover substrate 120b by a deposition method such as physical or chemical vapor deposition. Next, referring to FIG. 2C, the dry film photoresist layer 150 is attached to the conductive layer 140 by roll bonding. Then, referring to FIG. 2D, the photomask layer 150 patterning process is completed using known mask exposure and development methods. Next, the conductive layer 140 is etched using the patterned photoresist layer 150 as an etch mask to form a patterned conductive layer 140 (eg, a sensing electrode), as shown in FIG. 2E. Finally, the photoresist layer 150 is removed. In addition, the manner in which the patterned conductive layer 140 is formed is not limited thereto. Here, only one process is used as a description. Of course, those with ordinary knowledge in this field should know that the complete touch panel manufacturing process may require more processes to complete the production of touch sensing circuits and peripheral circuits. The design can be made according to requirements, and the invention is not limited thereto.
在完成上述之觸控面板的製造程序之後，即可在覆蓋基板120b上形成觸控元件層160，如圖2F所示，所述觸控元件層160除了上述之導電層140(感應電極，未繪於圖示)之外還包括了其他的觸控元件。之後，對膠材130b進行直接剝除、熱水浸泡或是其他適當的方法，以破壞覆蓋基板120b與膠材130b之間的黏著力。如此一來，覆蓋基板120b與膠材130b之間的黏著力降低，再搭配適當的方式即可將覆蓋基板120b從承載基板110上移除，即可得到如圖2G所示的觸控面板200。之後，再對觸控面板200進行適當的後製處理。所述的後製處理例如為清洗、紅外線油墨印刷、鏡面油墨印刷、其它特殊功能性油墨印刷或是保護層之製作。而承載基板110經由適當的處理過後，可以回收再利用。After the manufacturing process of the touch panel described above is completed, the touch device layer 160 can be formed on the cover substrate 120b. As shown in FIG. 2F, the touch device layer 160 is in addition to the conductive layer 140 (induction electrode, not Other touch elements are included in addition to the illustrations. Thereafter, the glue 130b is directly stripped, hot water immersed, or other suitable method to break the adhesion between the cover substrate 120b and the glue 130b. As a result, the adhesion between the cover substrate 120b and the adhesive material 130b is reduced, and the cover substrate 120b can be removed from the carrier substrate 110 in an appropriate manner, thereby obtaining the touch panel 200 as shown in FIG. 2G. . After that, the touch panel 200 is subjected to an appropriate post-processing. The post-processing is, for example, cleaning, infrared ink printing, mirror ink printing, other special functional ink printing, or the production of a protective layer. After the carrier substrate 110 is properly processed, it can be recycled and reused.
在此說明的是，本實施例之覆蓋基板120b之非平面表面S為弧狀表面。然而，本發明不限於此，根據其他實施例，非平面表面S也可以為其他形狀之表面。如圖3A所示，在此，覆蓋基板120b之非平面表面S為同時具有凸面弧狀以及平面狀之表面。此外，如圖3B所示，在此，覆蓋基板120b之非平面表面S為凸面弧狀之表面。此外，如圖3C所示，在此，覆蓋基板120b之非平面表面S為同時具有凸狀弧形以及凹狀弧形之表面。It is explained here that the non-planar surface S of the cover substrate 120b of the present embodiment is an arcuate surface. However, the invention is not limited thereto, and according to other embodiments, the non-planar surface S may also be a surface of other shapes. As shown in FIG. 3A, here, the non-planar surface S of the cover substrate 120b is a surface having both a convex arc shape and a planar shape. Further, as shown in FIG. 3B, here, the non-planar surface S of the cover substrate 120b is a convex curved surface. Further, as shown in FIG. 3C, here, the non-planar surface S of the cover substrate 120b is a surface having both a convex arc shape and a concave arc shape.
特別一提的是，在習知技術中，通常是完成觸控感應層之後再進行曲面成型以及打磨程序，以完成覆蓋基板120b之非平面表面S。所述的曲面成型以及打磨程序會造成觸控面板200的良率下降。然而，根據本實施例之觸控面板的製造方法，覆蓋基板120藉由前製處理程序以完成非平面表面S後，再將其黏貼在承載基板110之上。因此，根據本實施例之製造方法所製造之觸控面板200的良率可以大幅提升。In particular, in the prior art, the surface forming and polishing process is usually performed after the touch sensing layer is completed to complete the non-planar surface S of the cover substrate 120b. The curved surface forming and polishing process may cause the yield of the touch panel 200 to decrease. However, according to the manufacturing method of the touch panel of the present embodiment, the cover substrate 120 is adhered to the carrier substrate 110 by the pre-processing process to complete the non-planar surface S. Therefore, the yield of the touch panel 200 manufactured according to the manufacturing method of the present embodiment can be greatly improved.
圖4A至圖4G為本發明第三實施例之觸控面板的製造流程示意圖。請參照圖4A，本實施例之觸控面板的製造方法首先提供承載基板110。承載基板110例如是具有多個凹槽C的治具。4A to 4G are schematic diagrams showing a manufacturing process of a touch panel according to a third embodiment of the present invention. Referring to FIG. 4A , the manufacturing method of the touch panel of the embodiment first provides the carrier substrate 110 . The carrier substrate 110 is, for example, a jig having a plurality of grooves C.
接著，提供多個覆蓋基板120c。在本實施例中，覆蓋基板120c例如是接受過處理程序的強化玻璃。所述的處理程序包括：使用未強化的玻璃進行切割、鑽孔、磨邊以及導角程序之後，再進行化學強化程序。之後，於玻璃之表面上進行印刷程序，即完成覆蓋基板120c的前製處理。Next, a plurality of cover substrates 120c are provided. In the present embodiment, the cover substrate 120c is, for example, a tempered glass that has been subjected to a processing procedure. The processing procedure includes a chemical strengthening procedure followed by cutting, drilling, edging, and a cornering procedure using unreinforced glass. Thereafter, a printing process is performed on the surface of the glass, that is, the pre-processing of the cover substrate 120c is completed.
再來，將多個覆蓋基板120c透過膠材130c黏貼在承載基板110之多個凹槽C內。具體而言，本實施例之膠材130c例如是光硬化膠材、熱硬化膠材或雙面膠帶。若是使用液態性質的膠材(例如光硬化膠材及熱硬化膠材)，則將未固化的液態膠材130c塗佈在凹槽C之底表面以及側表面，將覆蓋基板120c配置凹槽C內，其中覆蓋基板120c與位於凹槽C之底表面以及側表面的膠材130c接觸。換言之，覆蓋基板120c是透過位於凹槽C之底表面以及側表面的膠材130c黏貼於承載基板110上。然而，本發明不以此為限。圖5為本發明另一實施例中覆蓋基板120c、膠材130c與承載基板110的配置關係圖。請參考圖5，在此實施例中，膠材130c塗佈於凹槽C的底表面上。覆蓋基板120c與位於凹槽C的底表面上之膠材130c接觸，且覆蓋基板120c與凹槽C的側表面具有空隙。具體而言，覆蓋基板120c僅透過位於凹槽C的底表面之膠材130c黏貼於承載基板100上，膠材例如是光硬化膠材、熱硬化膠材或雙面膠帶。Then, the plurality of cover substrates 120c are adhered to the plurality of grooves C of the carrier substrate 110 through the adhesive 130c. Specifically, the glue 130c of the present embodiment is, for example, a photocurable rubber, a thermosetting rubber or a double-sided tape. If a liquid material (for example, a photocurable rubber and a thermosetting rubber) is used, the uncured liquid rubber 130c is coated on the bottom surface and the side surface of the groove C, and the cover substrate 120c is provided with the groove C. Inside, the cover substrate 120c is in contact with the glue 130c located on the bottom surface and the side surface of the groove C. In other words, the cover substrate 120c is adhered to the carrier substrate 110 through the adhesive 130c located on the bottom surface and the side surface of the recess C. However, the invention is not limited thereto. FIG. 5 is a diagram showing an arrangement relationship between a cover substrate 120c, a glue 130c, and a carrier substrate 110 according to another embodiment of the present invention. Referring to FIG. 5, in this embodiment, the glue 130c is coated on the bottom surface of the groove C. The cover substrate 120c is in contact with the glue 130c on the bottom surface of the groove C, and the cover substrate 120c has a gap with the side surface of the groove C. Specifically, the cover substrate 120c is adhered to the carrier substrate 100 only through the adhesive 130c located on the bottom surface of the recess C. The adhesive material is, for example, a photo-curing adhesive, a thermosetting adhesive or a double-sided adhesive tape.
接著，請再參考圖4A，若是使用光硬化膠材或是熱硬化膠材，則對膠材130c進行加熱或是照光。所述膠材130c在加熱或照光過後會固化並產生黏性以將覆蓋基板120c黏貼在承載基板110之凹槽C內。與第一實施例類似地，多個覆蓋基板120c是以陣列的方式排列在承載基板110之凹槽C內。Next, please refer to FIG. 4A again. If a photo-curing adhesive or a thermosetting adhesive is used, the adhesive 130c is heated or illuminated. The glue 130c is cured and viscous after heating or illuminating to adhere the cover substrate 120c to the groove C of the carrier substrate 110. Similar to the first embodiment, a plurality of cover substrates 120c are arranged in an array in the grooves C of the carrier substrate 110.
此外，黏貼在承載基板110之凹槽C內的覆蓋基板120c與承載基板110共平面。如此一來，下述的觸控感應層之製作方法將與習知技術中使用全平面基板的製程相同，因此本實施例之製作方法可與現有製程相容。然而，本發明不限於此，在其他實施例中覆蓋基板120c也可以稍微凸出於承載基板110之表面。如此一來，當觸控感應層製作完之後，可以利用此凸出的部分將觸控面板300將凹槽C取出。須注意的是，覆蓋基板120c凸出的高度不能影響習知技術中全平面基板製程的進行，以便與現有製程相容。In addition, the cover substrate 120c adhered to the groove C of the carrier substrate 110 is coplanar with the carrier substrate 110. Therefore, the manufacturing method of the touch sensing layer described below is the same as the manufacturing process of the whole planar substrate in the prior art, and thus the manufacturing method of the embodiment can be compatible with the existing process. However, the present invention is not limited thereto, and in other embodiments, the cover substrate 120c may also protrude slightly from the surface of the carrier substrate 110. In this way, after the touch sensing layer is formed, the convex portion 300 can be used to take out the groove C from the touch panel 300. It should be noted that the height at which the cover substrate 120c protrudes cannot affect the process of the full-plane substrate process in the prior art to be compatible with existing processes.
接著，於覆蓋基板120c上製作觸控面板300的製造程序。所述製造程序例如為觸控感應電路及/或外圍電路。在此，以其中一道無機透明導電層的製程為例，如圖4B至圖4F所示。首先請參照圖4B，以沈積法(例如是物理/化學氣相沉積法)沉積導電層140於承載基板110以及覆蓋基板120c之上。在此，為了提高整體光學特性，可先在導電層140之底下形成緩衝層，但本發明不以此為限。接著，如圖4C所示，使用旋轉塗佈(spin coat)、狹縫塗佈(slit coat)或其他合適的方式形成光阻層150於導電層140上。然後，如圖4D所示，利用已知的光罩曝光方式以及顯影程序以完成光阻層150的圖案化。再來，以圖案化光阻層150作為蝕刻遮罩蝕刻導電層140，以形成圖案化導電層140(例如是感應電極)。最後，再去除光阻層150。圖案化導電層140形成的方式，不以此為限。在此僅以一道導電層製程作為說明，當然，此領域中具有通常知識者應知完整的觸控面板的製造程序可能需要進行更多的製程才能完成觸控感應電路及或外圍電路的製作，使用者可依需求作設計，本發明不以此為限。Next, a manufacturing procedure of the touch panel 300 is formed on the cover substrate 120c. The manufacturing process is, for example, a touch sensing circuit and/or a peripheral circuit. Here, a process of one of the inorganic transparent conductive layers is taken as an example, as shown in FIGS. 4B to 4F. Referring first to FIG. 4B, a conductive layer 140 is deposited on the carrier substrate 110 and the cover substrate 120c by a deposition method such as physical/chemical vapor deposition. Here, in order to improve the overall optical characteristics, a buffer layer may be formed under the conductive layer 140 first, but the invention is not limited thereto. Next, as shown in FIG. 4C, the photoresist layer 150 is formed on the conductive layer 140 using a spin coat, a slit coat, or other suitable means. Then, as shown in FIG. 4D, the patterning of the photoresist layer 150 is completed using a known mask exposure method and development process. Next, the conductive layer 140 is etched with the patterned photoresist layer 150 as an etch mask to form a patterned conductive layer 140 (eg, a sensing electrode). Finally, the photoresist layer 150 is removed. The manner in which the patterned conductive layer 140 is formed is not limited thereto. Here, only one conductive layer process is used as an explanation. Of course, those skilled in the art should know that the complete touch panel manufacturing process may require more processes to complete the touch sensing circuit and the peripheral circuit. The user can design according to requirements, and the invention is not limited thereto.
在完成上述之觸控面板的製造程序之後，即可在覆蓋基板120c上形成觸控元件層160，如圖4F所示，所述觸控元件層160除了上述之導電層140(感應電極，未繪於圖示)之外還包括了其他的觸控元件。之後，對膠材130c進行直接剝除、熱水浸泡或其他適合的方法，以破壞覆蓋基板120c與膠材130c之間的黏著力。如此一來，覆蓋基板120c與膠材130c之間的黏著力降低，再搭配適當的方式即可將覆蓋基板120c從承載基板110之凹槽C內移除，即可得到如圖4G所示的觸控面板300。之後，再對觸控面板300進行適當的後製處理。所述的後製處理例如為清洗、紅外線油墨印刷、鏡面油墨印刷、其它特殊功能性油墨印刷或是保護層之製作。而承載基板110經由適當的處理過後，可以回收再利用。且覆蓋基板120c相對於承載基板110之凹槽C之表面，可為平面、弧形或是任何形狀。After the manufacturing process of the touch panel described above is completed, the touch device layer 160 can be formed on the cover substrate 120c. As shown in FIG. 4F, the touch device layer 160 is in addition to the conductive layer 140 (induction electrode, not Other touch elements are included in addition to the illustrations. Thereafter, the glue 130c is directly stripped, hot water immersed, or other suitable method to break the adhesion between the cover substrate 120c and the glue 130c. In this way, the adhesion between the cover substrate 120c and the adhesive material 130c is reduced, and the cover substrate 120c can be removed from the recess C of the carrier substrate 110 in an appropriate manner, thereby obtaining a structure as shown in FIG. 4G. The touch panel 300. After that, the touch panel 300 is subjected to an appropriate post-processing. The post-processing is, for example, cleaning, infrared ink printing, mirror ink printing, other special functional ink printing, or the production of a protective layer. After the carrier substrate 110 is properly processed, it can be recycled and reused. And covering the surface of the substrate 120c relative to the groove C of the carrier substrate 110, it may be flat, curved or any shape.
綜上所述，本發明之觸控面板的製造方法中，是先將覆蓋基板進行前製處理程序，再將其透過膠材黏貼於承載基板上。於覆蓋基板上製作觸控感應層後，再將覆蓋基板與承載基板分離。換言之，本發明之觸控面板的製作方法不需如習知技術中在完成觸控感應層的製作後，再進行切割、打磨或其他程序而造成強度下降。因此，根據本發明之觸控面板的製作方法可以得到高強度以及高良率的觸控面板，且可以提高產能。In summary, in the manufacturing method of the touch panel of the present invention, the cover substrate is first subjected to a pre-processing process, and then adhered to the carrier substrate through the adhesive material. After the touch sensing layer is formed on the cover substrate, the cover substrate is separated from the carrier substrate. In other words, the method for fabricating the touch panel of the present invention does not require the cutting, grinding, or other procedures to reduce the strength after completing the fabrication of the touch sensing layer as in the prior art. Therefore, the touch panel manufacturing method according to the present invention can obtain a touch panel with high strength and high yield, and can improve productivity.
雖然本發明已以實施例揭露如上，然其並非用以限定本發明，任何所屬技術領域中具有通常知識者，在不脫離本發明之精神和範圍內，當可作些許之更動與潤飾，故本發明之保護範圍當視後附之申請專利範圍所界定者為準。Although the present invention has been disclosed in the above embodiments, it is not intended to limit the invention, and any one of ordinary skill in the art can make some modifications and refinements without departing from the spirit and scope of the invention. The scope of the invention is defined by the scope of the appended claims.
100、200、300．．．觸控面板100, 200, 300. . . Touch panel
110．．．承載基板110. . . Carrier substrate
120a、120b、120c．．．覆蓋基板120a, 120b, 120c. . . Cover substrate
130a、130b、130c．．．膠材130a, 130b, 130c. . . Plastic material
140．．．導電層140. . . Conductive layer
150．．．光阻層150. . . Photoresist layer
160．．．觸控元件層160. . . Touch element layer
S．．．非平面表面S. . . Non-planar surface
C．．．凹槽C. . . Groove
圖1A至圖1H為本發明第一實施例之觸控面板的製造流程示意圖。1A to 1H are schematic diagrams showing a manufacturing process of a touch panel according to a first embodiment of the present invention.
圖2A至圖2G為本發明第二實施例之觸控面板的製造流程示意圖。2A to 2G are schematic diagrams showing a manufacturing process of a touch panel according to a second embodiment of the present invention.
圖3A至圖3C為本發明之數個實施例中覆蓋基板的示意圖。3A-3C are schematic views of a cover substrate in several embodiments of the present invention.
圖4A至圖4G為本發明第三實施例之觸控面板的製造流程示意圖。4A to 4G are schematic diagrams showing a manufacturing process of a touch panel according to a third embodiment of the present invention.
圖5為本發明另一實施例中覆蓋基板、膠材與承載基板的配置關係圖。FIG. 5 is a diagram showing an arrangement relationship between a cover substrate, a rubber material, and a carrier substrate according to another embodiment of the present invention.
110．．．承載基板110. . . Carrier substrate
120a．．．覆蓋基板120a. . . Cover substrate
130a．．．膠材130a. . . Plastic material
160．．．觸控元件層160. . . Touch element layer
Claims (13)
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| TW100143981A TWI464838B (en) | 2011-11-30 | 2011-11-30 | Method of manufacturing a touch panel |
| CN2012100735545A CN102629169A (en) | 2011-11-30 | 2012-03-15 | Manufacturing method of touch panel |
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| CN105975126A (en) | 2013-09-29 | 2016-09-28 | 宸鸿科技(厦门)有限公司 | Touch panel and fabrication method therefor |
| WO2015043297A1 (en) * | 2013-09-29 | 2015-04-02 | 宸鸿科技(厦门)有限公司 | Touch panel manufacturing method |
| KR102438247B1 (en) * | 2015-09-07 | 2022-08-30 | 엘지디스플레이 주식회사 | Organic Light Emitting Display Device and Method for Manufacturing the Same |
| CN108022878A (en) * | 2017-11-30 | 2018-05-11 | 武汉华星光电半导体显示技术有限公司 | Display panel and preparation method thereof |
| CN109015035B (en) * | 2018-09-18 | 2021-04-09 | 东明兴业科技股份有限公司 | High-speed processing method for sound outlet hole of mobile phone shell |
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| CN101706696B (en) * | 2009-11-05 | 2012-01-25 | 深超光电（深圳）有限公司 | Method and mother board for manufacturing touch control panel |
| TWI464633B (en) * | 2010-02-12 | 2014-12-11 | Cando Corp | Method of manufacturing flexible touch panel |
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