TW201409314A - Sensing layer and method for producing the same - Google Patents
Sensing layer and method for producing the same Download PDFInfo
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- TW201409314A TW201409314A TW101145758A TW101145758A TW201409314A TW 201409314 A TW201409314 A TW 201409314A TW 101145758 A TW101145758 A TW 101145758A TW 101145758 A TW101145758 A TW 101145758A TW 201409314 A TW201409314 A TW 201409314A
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
- G06F3/0445—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
Abstract
Description
本發明係關於一種觸控面板，特別是有關於一種觸控面板感應層及其製造方法。The present invention relates to a touch panel, and more particularly to a touch panel sensing layer and a method of fabricating the same.
觸控面板的感應層至少包含電極和周邊引線，其製造方法涉及多個步驟，請參考圖1，是傳統製作電極和周邊引線的方法流程圖，其步驟包含：步驟S1，形成一透明導電層於一基板上；步驟S2，形成一光阻層於該透明導電層上；步驟S3，通過前烘乾、曝光、顯影、後烘乾、蝕刻、剝膜得到圖案化的透明導電層，即電極；步驟S4，形成一金屬層於該電極上；步驟S5，形成一光阻層於該金屬層上；步驟S6，通過前烘乾、曝光、顯影、後烘乾、蝕刻、剝膜得到圖案化的金屬層，即周邊引線。The sensing layer of the touch panel comprises at least an electrode and a peripheral lead, and the manufacturing method thereof comprises a plurality of steps. Referring to FIG. 1 , it is a flow chart of a conventional method for fabricating an electrode and a peripheral lead, the step comprising: step S1, forming a transparent conductive layer On a substrate; in step S2, a photoresist layer is formed on the transparent conductive layer; in step S3, a patterned transparent conductive layer, that is, an electrode, is obtained by pre-baking, exposure, development, post-baking, etching, and stripping. Step S4, forming a metal layer on the electrode; step S5, forming a photoresist layer on the metal layer; and step S6, patterning by pre-baking, exposure, development, post-baking, etching, and stripping The metal layer, that is, the peripheral leads.
傳統製程中，電極和周邊引線需分開進行圖案化，而圖案化這一製程動作本身又包含了複雜的工序步驟，如烘乾、曝光、顯影、蝕刻、剝膜，如此使得製程工藝複雜，導致製程效率無法提升。In the conventional process, the electrodes and the peripheral leads are separately patterned, and the process of patterning itself involves complicated process steps such as drying, exposure, development, etching, and stripping, which complicates the process, resulting in a complicated process. Process efficiency cannot be improved.
鑒於上述，本發明在於提供一種觸控感應層及其製作方法，乃利用同步圖案化的製程步驟形成電極與周邊引線，從而可簡化生產流程以提升製程效率。In view of the above, the present invention provides a touch sensing layer and a method for fabricating the same, which utilizes a synchronous patterning process step to form electrodes and peripheral leads, thereby simplifying the production process to improve process efficiency.
本發明提供一種觸控感應層的製造方法，其特徵在於，包含以下步驟：(a) 形成一第一導電層於一基板上；(b) 形成一第二導電層於該第一導電層上；(c) 同步圖案化該第一導電層和該第二導電層，以分別形成一圖案化複合導電層以及至少一周邊引綫；以及(d) 移除該圖案化複合導電層中的該第二導電層以形成至少一電極，其中該些周邊引線電性連接至對應的該些電極。The invention provides a method for manufacturing a touch sensing layer, comprising the steps of: (a) forming a first conductive layer on a substrate; and (b) forming a second conductive layer on the first conductive layer. (c) synchronously patterning the first conductive layer and the second conductive layer to form a patterned composite conductive layer and at least one peripheral lead, respectively; and (d) removing the patterned composite conductive layer The second conductive layer is formed to form at least one electrode, wherein the peripheral leads are electrically connected to the corresponding ones of the electrodes.
本發明還提供一種觸控感應層，包含：至少一電極圖案，是由一第一導電層製成；以及至少一周邊引線，分別電性連接於該些電極圖案，其中該些周邊引線為由該第一導電層與一第二導電層製成的雙層導電結構。The present invention further provides a touch sensing layer, comprising: at least one electrode pattern, which is made of a first conductive layer; and at least one peripheral lead electrically connected to the electrode patterns, wherein the peripheral leads are a double-layer conductive structure made of the first conductive layer and a second conductive layer.
以下將詳述本案的各實施例，並配合圖式作為例示。除了這些詳細描述之外，本發明還可以廣泛地施行在其他的實施例中，任何所述實施例的輕易替代、修改、等效變化都包含在本案的範圍內，並以之後的專利範圍為准。在說明書的描述中，為了使讀者對本發明有較完整的瞭解，提供了許多特定細節；然而，本發明可能在省略部分或全部這些特定細節的前提下，仍可實施。此外，眾所周知的步驟或元件並未描述於細節中，以避免造成本發明不必要之限制。圖式中相同或類似之組件將以相同或類似符號來表示。特別注意的是，圖式僅為示意之用，並非代表元件實際的尺寸或數量，除非有特別說明。The embodiments of the present invention will be described in detail below with reference to the drawings. In addition to the detailed description, the present invention may be widely practiced in other embodiments, and any alternatives, modifications, and equivalent variations of the described embodiments are included in the scope of the present invention, and the scope of the following patents is quasi. In the description of the specification, numerous specific details are set forth in the description of the invention. In addition, well-known steps or elements are not described in detail to avoid unnecessarily limiting the invention. The same or similar components in the drawings will be denoted by the same or similar symbols. It is specifically noted that the drawings are for illustrative purposes only and do not represent the actual dimensions or quantities of the components unless otherwise specified.
圖2A與圖2B為本發明一實施例中的觸控感應層結構示意圖，其中圖2B為圖2A沿A-A’線的剖面圖。本實施例中，觸控感應層10包含位於可視區VA的電極1與位於非可視區VS的周邊引線2，其中周邊引線2電性連接電極1。電極1由第一導電層21製成。周邊引線2由第一導電層21與第二導電層22製成，故周邊引線2為一種雙層導電結構。2A and FIG. 2B are schematic diagrams showing the structure of a touch sensing layer according to an embodiment of the present invention, wherein FIG. 2B is a cross-sectional view taken along line A-A' of FIG. 2A. In this embodiment, the touch sensing layer 10 includes an electrode 1 located in the visible area VA and a peripheral lead 2 located in the non-visible area VS, wherein the peripheral lead 2 is electrically connected to the electrode 1. The electrode 1 is made of the first conductive layer 21. The peripheral lead 2 is made of the first conductive layer 21 and the second conductive layer 22, so that the peripheral lead 2 is a double-layer conductive structure.
本發明一實施例中，電極1與周邊引線2均由第一導電層21製成，故電極1與周邊引線2的電性連接是通過第一導電層21本身，故電極1與周邊引線2之間無需通過其他重疊的搭接方式進行導通，換言之，電極1與周邊引線的連接處無重疊，從而避免了因重疊處存在高度差而引起的斷路等問題。In an embodiment of the invention, the electrode 1 and the peripheral lead 2 are both made of the first conductive layer 21, so that the electrical connection between the electrode 1 and the peripheral lead 2 is through the first conductive layer 21 itself, so the electrode 1 and the peripheral lead 2 There is no need to conduct conduction by other overlapping laps, in other words, there is no overlap between the electrodes 1 and the peripheral leads, thereby avoiding problems such as disconnection due to the height difference at the overlap.
圖3為製作上述觸控感應層的方法流程圖。請參照圖3，觸控感應層的製作方法包括以下步驟：(a) 形成一第一導電層於一基板上；(b) 形成一第二導電層於該第一導電層上；(c) 同步圖案化該第一導電層和該第二導電層，以分別形成一圖案化複合導電層以及至少一周邊引綫；以及(d) 移除該圖案化複合導電層中的該第二導電層以形成至少一電極，其中該些周邊引線電性連接至對應的該些電極。3 is a flow chart of a method of fabricating the touch sensing layer. Referring to FIG. 3, a method for fabricating a touch sensing layer includes the steps of: (a) forming a first conductive layer on a substrate; (b) forming a second conductive layer on the first conductive layer; (c) Synchronizing the first conductive layer and the second conductive layer to form a patterned composite conductive layer and at least one peripheral lead, respectively; and (d) removing the first of the patterned composite conductive layers The two conductive layers are formed to form at least one electrode, wherein the peripheral leads are electrically connected to the corresponding ones of the electrodes.
請合併參考圖4A與圖4B，其中圖4A是繪示上述步驟(a)的結構示意圖，圖4B為圖4A沿水平方向的剖面圖。步驟(a)，形成第一導電層21於基板20上，如圖4A至圖4B所示，其中形成的方式可為沉積、蒸鍍、印刷、塗布、濺鍍等。Please refer to FIG. 4A and FIG. 4B in combination, wherein FIG. 4A is a schematic structural view of the above step (a), and FIG. 4B is a cross-sectional view of FIG. 4A in the horizontal direction. In the step (a), the first conductive layer 21 is formed on the substrate 20, as shown in FIGS. 4A to 4B, which may be formed by deposition, evaporation, printing, coating, sputtering, or the like.
請合併參考圖5A與圖5B，其中圖5A是繪示上述步驟(b)的結構示意圖，圖5B為圖5A沿水平方向的剖面圖。步驟(b), 形成第二導電層22於第一導電層21上，如圖5A及圖5B所示，其中形成的方式可為沉積、蒸鍍、印刷、塗布、濺鍍等。Please refer to FIG. 5A and FIG. 5B in combination, wherein FIG. 5A is a schematic structural view of the above step (b), and FIG. 5B is a cross-sectional view of FIG. 5A along a horizontal direction. Step (b), forming a second conductive layer 22 on the first conductive layer 21, as shown in FIGS. 5A and 5B, which may be formed by deposition, evaporation, printing, coating, sputtering, or the like.
請合併參考圖6A與圖6B，其中圖6A是繪示上述步驟(c)的結構示意圖，圖6B為圖6A沿B-B’方向的剖面圖。步驟(c)，同步圖案化第一導電層21和第二導電層22，以分別形成圖案化複合導電層23以及周邊引綫2，如圖6A及圖6B所示。其中，周邊引線2分別電性連接於圖案化複合導電層23，且圖案化複合導電層23大致上位於基板20的可視區域VA，周邊引線2大致上位於基板20的周邊區域SA。Please refer to FIG. 6A and FIG. 6B in combination, wherein FIG. 6A is a schematic structural view of the above step (c), and FIG. 6B is a cross-sectional view of FIG. 6A along the B-B' direction. In step (c), the first conductive layer 21 and the second conductive layer 22 are synchronously patterned to form a patterned composite conductive layer 23 and a peripheral lead, respectively, as shown in FIGS. 6A and 6B. The peripheral leads 2 are electrically connected to the patterned composite conductive layer 23, and the patterned composite conductive layer 23 is substantially located in the visible region VA of the substrate 20, and the peripheral leads 2 are located substantially in the peripheral region SA of the substrate 20.
於本實施例，較佳地，是採用一雷射蝕刻方式同时圖案化第一導電層21和第二導電層22。依照所要形成的圖案，利用雷射劃線蝕刻機，控制合適的雷射蝕刻參數，同時將第二導電層22與其下方的第一導電層21所需蝕刻的部份蝕刻完全，且避免蝕刻到第一導電層21下的基板20，例如塑膠基板。在一實施例中，雷射蝕刻選用波長1064 nm的雷射光束，並搭配下列參數：功率3W，雷射頻率70K，劃線速度1000mm/s，按照上述參數，可蝕刻出線寬和線距為30±5μm的周邊引線2。在另一實施例中，雷射蝕刻選用波長355 nm的雷射光束，並搭配下列參數：功率0.7W，雷射頻率100K，劃線速度1000mm/s，按照上述參數，可蝕刻出線寬和線距為15±5μm的周邊引線2。故通過調整鐳射蝕刻時所使用的波長和其他相關參數，可得到線寬為10μm至35μm的周邊引線。由於雷射蝕刻精度上較容易控制，使用本實施例的製作方法，周邊引線2的線距可達到大約10μm至35μm。In this embodiment, preferably, the first conductive layer 21 and the second conductive layer 22 are patterned by a laser etching method. According to the pattern to be formed, the laser etching line is used to control the appropriate laser etching parameters, and the portion of the second conductive layer 22 and the underlying first conductive layer 21 to be etched is completely etched, and etching is avoided. The substrate 20 under the first conductive layer 21, such as a plastic substrate. In one embodiment, the laser beam is selected from a laser beam having a wavelength of 1064 nm and is matched with the following parameters: power 3 W, laser frequency 70 K, and scribing speed 1000 mm/s. According to the above parameters, the line width and the line spacing can be etched. It is a peripheral lead 2 of 30 ± 5 μm. In another embodiment, the laser lithography uses a laser beam with a wavelength of 355 nm and is matched with the following parameters: power 0.7 W, laser frequency 100 K, and scribing speed 1000 mm/s. According to the above parameters, the line width can be etched. The peripheral lead 2 has a line pitch of 15 ± 5 μm. Therefore, by adjusting the wavelength and other related parameters used in the laser etching, peripheral leads having a line width of 10 μm to 35 μm can be obtained. Since the laser etching precision is relatively easy to control, the line pitch of the peripheral leads 2 can be about 10 μm to 35 μm using the manufacturing method of the present embodiment.
在本發明另一實施例中，是採用微影蝕刻的方式同步圖案化第一導電層21和第二導電層22。在本實施例中，在上述步驟(b)完成後，先形成一光阻層於第二導電層22上，再經過前烘乾、曝光、顯影、後烘乾、蝕刻、剝膜等工序形成圖案化複合導電層23以及周邊引綫2。In another embodiment of the present invention, the first conductive layer 21 and the second conductive layer 22 are simultaneously patterned by photolithography. In this embodiment, after the step (b) is completed, a photoresist layer is formed on the second conductive layer 22, and then formed by processes such as drying, exposure, development, post-baking, etching, and stripping. The patterned composite conductive layer 23 and the peripheral lead 綫
請合併參考圖7A與圖7B，其中圖7A是繪示上述步驟(d)的結構示意圖，圖7B為圖7A沿C-C’方向的剖面圖。步驟(d) 移除圖案化複合導電層23中的第二導電層22以形成電極1，其中該些周邊引線2電性連接至對應的該些電極1，如圖7A及圖7B所示。例如，利用乾蝕刻或濕蝕刻移除第二導電層22。於本實施例，可視區域VA中圖案化複合導電層23中的第二導電層22，可通過一蝕刻液蝕刻移除，其中由於第一導電層21與第二導電層22具有相異的蝕刻屬性，因此可選用適當的蝕刻液，使該蝕刻液僅會對第二導電層22有蝕刻作用，卻不會對第一導電層21有蝕刻作用。因此，蝕刻液的選用需根據第二導電層22的材料來確定，例如，如果第二導電層22的材質為鉬-鋁-鉬(Mo-Al-Mo)合金，則使用醋酸-硝酸-磷酸溶液作為蝕刻液；如果第二導電層22的材質為銅，則使用氯化鐵溶液作為蝕刻液。Referring to FIG. 7A and FIG. 7B in combination, FIG. 7A is a schematic structural view of the above step (d), and FIG. 7B is a cross-sectional view of FIG. 7A along the C-C' direction. Step (d) The second conductive layer 22 in the patterned composite conductive layer 23 is removed to form the electrode 1, wherein the peripheral leads 2 are electrically connected to the corresponding electrodes 1, as shown in FIGS. 7A and 7B. For example, the second conductive layer 22 is removed using dry etching or wet etching. In this embodiment, the second conductive layer 22 in the patterned composite conductive layer 23 in the visible region VA can be removed by an etching solution, wherein the first conductive layer 21 and the second conductive layer 22 have different etchings. Attributes, therefore, an appropriate etching solution can be selected so that the etching solution can only etch the second conductive layer 22 without etching the first conductive layer 21. Therefore, the selection of the etching solution is determined according to the material of the second conductive layer 22, for example, if the material of the second conductive layer 22 is a molybdenum-aluminum-molybdenum (Mo-Al-Mo) alloy, acetic acid-nitric acid-phosphoric acid is used. The solution is used as an etching solution; if the material of the second conductive layer 22 is copper, a ferric chloride solution is used as an etching solution.
圖8為製作上述觸控感應層的另一方法流程圖。本實施例與上述方法實施例的區別之處在於：於步驟(c)與步驟(d)之間更包含一步驟(e)，即形成一保護層24在周邊引線2上，並使圖案化複合導電層23裸露。請合併參考圖9A與圖9B，其中圖9A是繪示上述步驟(e)的結構示意圖，圖9B為圖9A沿D-D’方向的剖面圖。在一實施例中，保護層24係採用絲網印刷方式形成的一防蝕刻油墨層，以遮蔽並保護周邊區域SA的周邊引線2，同時暴露出位於可視區域VA的圖案化複合導電層23；接著，以加熱或紫外光照射方式固化處理防蝕刻油墨層。於另一實施例中，以絲網印刷方法，在周邊區域SA印刷可剝離膠層24以保護周邊引線2，同時暴露出位於可視區域VA的圖案化複合導電層23；接著，通過紫外光或加熱方式使可剝離膠層固化。形成保護層24後，再進行步驟(d)的移除第二導電層22動作，以防止周邊引線2在步驟(d)的過程中被腐蝕。FIG. 8 is a flow chart of another method of fabricating the touch sensing layer. The embodiment is different from the above method embodiment in that a step (e) is further included between the step (c) and the step (d), that is, a protective layer 24 is formed on the peripheral lead 2 and patterned. The composite conductive layer 23 is bare. Referring to FIG. 9A and FIG. 9B, FIG. 9A is a schematic structural view of the above step (e), and FIG. 9B is a cross-sectional view of FIG. 9A along the D-D' direction. In one embodiment, the protective layer 24 is an anti-etching ink layer formed by screen printing to shield and protect the peripheral leads 2 of the peripheral region SA while exposing the patterned composite conductive layer 23 located in the visible region VA; Next, the anti-etching ink layer is cured by heating or ultraviolet light irradiation. In another embodiment, the peelable adhesive layer 24 is printed in the peripheral region SA by a screen printing method to protect the peripheral leads 2 while exposing the patterned composite conductive layer 23 in the visible region VA; then, through ultraviolet light or The heating method cures the peelable adhesive layer. After the protective layer 24 is formed, the removal of the second conductive layer 22 in step (d) is performed to prevent the peripheral leads 2 from being corroded during the step (d).
在本發明一實施例中，於步驟(d)之後更包含一步驟(f)，即移除上述保護層24。於本實施例，使用一剝膜液移除保護層24，例如氫氧化鉀(KOH)溶液，將防蝕刻油墨24或可剝離膠24剝離。In an embodiment of the invention, after step (d), a step (f) is further included, that is, the protective layer 24 is removed. In the present embodiment, the protective layer 24, such as a potassium hydroxide (KOH) solution, is removed using a stripping solution to strip the anti-etching ink 24 or the peelable paste 24.
在本實施例中，其餘步驟及使用材料皆與上述方法實施例類似，在此不再贅述。In the present embodiment, the remaining steps and the materials used are similar to the above method embodiments, and are not described herein again.
藉由上述方法，即可在基板20上形成觸控感應層10。The touch sensing layer 10 can be formed on the substrate 20 by the above method.
此外，較佳地，所述觸控感應層10是一種用於電容式觸控面板的觸控感應結構，其形態不拘於圖2A所示的單層單軸結構，也可以是一單層雙軸結構、一雙層雙軸結構等。In addition, the touch sensing layer 10 is a touch sensing structure for a capacitive touch panel, and the shape thereof is not limited to the single layer single axis structure shown in FIG. 2A, and may also be a single layer double Shaft structure, a double-layer biaxial structure, and the like.
需要說明的是，在前述各實施例中，基板20可以是一透明無機基板，例如一玻璃基板；或一透明有機基板，例如一塑膠基板，其材質例如聚乙烯對苯二甲酸酯(Polyethylene terephthalate,PET)、聚碳酸酯(Poly Carbonate, PC)、聚乙烯(Polyethylene, PE)或聚甲基丙烯酸甲酯(Polymethylmethacrylate,PMMA)等。第一導電層21為透明導電材料，其材料可以選自下列群組的其中之一或其組合：氧化銦錫(ITO)、氧化銻錫(ATO)、氧化鋅(ZnO)、二氧化鋅(ZnO2)、二氧化錫(SnO2)、三氧化二銦(In2O3)。第二導電材料22為金屬材料，其材料包含任何可以導電的金屬或合金，例如銅、銅合金、鉬-鋁-鉬合金、銀、銀合金等等。It should be noted that, in the foregoing embodiments, the substrate 20 may be a transparent inorganic substrate, such as a glass substrate, or a transparent organic substrate, such as a plastic substrate, such as polyethylene terephthalate (Polyethylene). Terephthalate, PET), polycarbonate (Poly Carbonate, PC), polyethylene (Polyethylene, PE) or polymethylmethacrylate (PMMA). The first conductive layer 21 is a transparent conductive material, and the material thereof may be selected from one or a combination of the following groups: indium tin oxide (ITO), antimony tin oxide (ATO), zinc oxide (ZnO), and zinc dioxide ( ZnO 2 ), tin dioxide (SnO 2 ), indium trioxide (In 2 O 3 ). The second electrically conductive material 22 is a metallic material comprising any electrically conductive metal or alloy such as copper, copper alloy, molybdenum-aluminum-molybdenum alloy, silver, silver alloy, and the like.
本發明實施例提供的觸控感應層及其製作方法，乃利用同步圖案化的製程步驟形成電極與周邊引線，從而可簡化生產流程以提升製程效率，此外若在圖案化步驟中使用鐳射蝕刻的方式，所製作出的周邊引線更加精細。The touch sensing layer provided by the embodiment of the invention and the manufacturing method thereof are formed by using a synchronous patterning process step to form electrodes and peripheral leads, thereby simplifying the production process to improve process efficiency, and further if laser etching is used in the patterning step. In this way, the peripheral leads produced are more elaborate.
以上所述僅為本發明之較佳實施例而已，並非用以限定本發明之申請專利範圍；凡其他未脫離發明所揭示之精神下所完成之等效改變或修飾，均應包含在下述之申請專利範圍內。The above is only the preferred embodiment of the present invention, and is not intended to limit the scope of the present invention; all other equivalent changes or modifications which are not departing from the spirit of the invention should be included in the following Within the scope of the patent application.
10．．．觸控感應層10. . . Touch sensing layer
1．．．電極1. . . electrode
2．．．周邊引線2. . . Peripheral lead
20．．．基板20. . . Substrate
21．．．第一導電層twenty one. . . First conductive layer
22．．．第二導電層twenty two. . . Second conductive layer
23．．．圖案化複合導電層twenty three. . . Patterned composite conductive layer
24．．．保護層twenty four. . . The protective layer
VA．．．可視區域VA. . . Visible area
SA．．．周邊區域SA. . . Surrounding area
S1．．．形成一透明導電層於一基板上S1. . . Forming a transparent conductive layer on a substrate
S2．．．形成一光阻層於該透明導電層上S2. . . Forming a photoresist layer on the transparent conductive layer
S3．．．通過前烘乾、曝光、顯影、後烘乾、蝕刻、剝膜得到圖案化的透明導電層，即電極S3. . . The patterned transparent conductive layer, that is, the electrode, is obtained by pre-baking, exposure, development, post-baking, etching, and stripping.
S4．．．形成一金屬層於該電極上S4. . . Forming a metal layer on the electrode
S5．．．形成一光阻層於該金屬層上S5. . . Forming a photoresist layer on the metal layer
S6．．．通過前烘乾、曝光、顯影、後烘乾、蝕刻、剝膜得到圖案化的金屬層，即周邊引線S6. . . The patterned metal layer is obtained by pre-baking, exposure, development, post-baking, etching, and stripping, that is, peripheral leads
a．．．形成一第一導電層於一基板上a. . . Forming a first conductive layer on a substrate
b．．．形成一第二導電層於該第一導電層上b. . . Forming a second conductive layer on the first conductive layer
c．．．同步圖案化該第一導電層和該第二導電層，以分別形成一圖案化複合導電層以及至少一周邊引綫c. . . Synchronizing the first conductive layer and the second conductive layer to form a patterned composite conductive layer and at least one peripheral lead respectively
d．．．移除該圖案化複合導電層中的該第二導電層以形成至少一電極，其中該些周邊引線電性連接至對應的該些電極d. . . Removing the second conductive layer in the patterned composite conductive layer to form at least one electrode, wherein the peripheral leads are electrically connected to the corresponding electrodes
e．．．形成保護層在周邊引線上，並使圖案化複合層裸露e. . . Forming a protective layer on the peripheral leads and exposing the patterned composite layer
f．．．移除上述保護層f. . . Remove the above protective layer
圖1為傳統觸控感應層的製作方法流程圖。圖2A為本發明一實施例中一種觸控感應層的結構示意圖。圖2B為圖2A沿A-A’方向的剖面圖。圖3為本發明一實施例的觸控感應層的製作方法流程圖。圖4A為本發明一實施例的製作方法過程中的結構示意圖。圖4B為圖4A沿水平方向的剖面圖。圖5A為本發明一實施例的製作方法過程中的結構示意圖。圖5B為圖5A沿水平方向的剖面圖。圖6A為本發明一實施例的製作方法過程中的結構示意圖。圖6B為圖6A沿B-B’方向的剖面圖。圖7A為本發明一實施例的製作方法過程中的結構示意圖。圖7B為圖7A沿C-C’方向的剖面圖。圖8為本發明一實施例的製作方法流程圖。圖9A為本發明一實施例的製作方法過程中的結構示意圖。圖9B為圖9A沿D-D’方向的剖面圖。FIG. 1 is a flow chart of a method for fabricating a conventional touch sensing layer. 2A is a schematic structural diagram of a touch sensing layer according to an embodiment of the invention. Fig. 2B is a cross-sectional view taken along line A-A' of Fig. 2A. FIG. 3 is a flow chart of a method for fabricating a touch sensing layer according to an embodiment of the invention. 4A is a schematic structural view of a manufacturing method according to an embodiment of the present invention. Figure 4B is a cross-sectional view of Figure 4A in the horizontal direction. FIG. 5A is a schematic structural diagram of a manufacturing method according to an embodiment of the present invention. Figure 5B is a cross-sectional view of Figure 5A in the horizontal direction. FIG. 6A is a schematic structural diagram of a manufacturing method according to an embodiment of the present invention. Figure 6B is a cross-sectional view taken along line B-B' of Figure 6A. FIG. 7A is a schematic structural diagram of a manufacturing method according to an embodiment of the present invention. Figure 7B is a cross-sectional view taken along line C-C' of Figure 7A. FIG. 8 is a flow chart of a manufacturing method according to an embodiment of the present invention. FIG. 9A is a schematic structural diagram of a manufacturing method according to an embodiment of the present invention. Figure 9B is a cross-sectional view of Figure 9A taken along the line D-D'.
a．．．形成一第一導電層於一基板上a. . . Forming a first conductive layer on a substrate
b．．．形成一第二導電層於該第一導電層上b. . . Forming a second conductive layer on the first conductive layer
c．．．同步圖案化該第一導電層和該第二導電層，以分別形成一圖案化複合導電層以及至少一周邊引綫c. . . Synchronizing the first conductive layer and the second conductive layer to form a patterned composite conductive layer and at least one peripheral lead respectively
d．．．移除該圖案化複合導電層中的該第二導電層以形成至少一電極，其中該些周邊引線電性連接至對應的該些電極d. . . Removing the second conductive layer in the patterned composite conductive layer to form at least one electrode, wherein the peripheral leads are electrically connected to the corresponding electrodes
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| CN201210319500.2A CN103631459B (en) | 2012-08-26 | 2012-08-26 | Touch-control sensing layer and manufacture method thereof |
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| TWI575434B (en) * | 2015-04-17 | 2017-03-21 | 宸鴻科技（廈門）有限公司 | Touch panels |
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| CN103631459B (en) * | 2012-08-26 | 2016-12-21 | 宝宸（厦门）光学科技有限公司 | Touch-control sensing layer and manufacture method thereof |
| CN103841765A (en) * | 2014-03-18 | 2014-06-04 | 蔡莳铨 | Method for machining printed circuit board |
| TWI553379B (en) * | 2014-06-25 | 2016-10-11 | 群創光電股份有限公司 | Display panel and display device applying the same |
| CN104635981B (en) * | 2014-11-26 | 2018-06-22 | 业成光电（深圳）有限公司 | Touch module and the touch control display apparatus with the touch module |
| CN104503636A (en) * | 2014-11-26 | 2015-04-08 | 业成光电（深圳）有限公司 | Touch module |
| CN106569624B (en) * | 2015-10-09 | 2020-09-29 | 群创光电股份有限公司 | Touch substrate and touch device |
| CN106909258B (en) * | 2015-12-23 | 2020-05-01 | 汉思高电子科技（义乌）有限公司 | Structure of touch screen functional sheet lead wire and manufacturing method thereof |
| CN108803946A (en) * | 2018-09-07 | 2018-11-13 | 蓝思科技（长沙）有限公司 | A kind of flexibility narrow frame touch-control sensor and preparation method thereof |
| CN116009724A (en) * | 2022-12-30 | 2023-04-25 | 浙江万超电器有限公司 | Production process and production line of laser carving automobile touch panel |
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| TWI449713B (en) * | 2008-03-24 | 2014-08-21 | Aica Kogyo Co Ltd | A resin composition, a hard coat agent, a film, and a molded article |
| TW201001004A (en) * | 2008-06-24 | 2010-01-01 | Bibest Optoelectronics Corp | Method of manufacturing insulation layer of touch panel |
| JP2011017626A (en) * | 2009-07-09 | 2011-01-27 | Sony Corp | Mechanical quantity detection member and mechanical quantity detection apparatus |
| CN201508542U (en) * | 2009-09-08 | 2010-06-16 | 敏理投资股份有限公司 | Resistance type touch panel |
| TWM383896U (en) * | 2010-01-26 | 2010-07-01 | Shineon Laser Co Ltd | Portable multimedia audio-visual karaoke with retractable screen |
| US20140191771A1 (en) * | 2010-06-16 | 2014-07-10 | Samwon St | Touch panel sensor |
| CN102207792B (en) * | 2011-06-07 | 2012-10-03 | 南京福莱克斯光电科技有限公司 | Manufacturing method of touch sensor structure based on charge transfer |
| CN102200654A (en) * | 2011-06-07 | 2011-09-28 | 南京福莱克斯光电科技有限公司 | Integrated touch display device and making method thereof |
| CN202795324U (en) * | 2012-08-26 | 2013-03-13 | 宝宸（厦门）光学科技有限公司 | Touch sensing layer |
| CN103631459B (en) * | 2012-08-26 | 2016-12-21 | 宝宸（厦门）光学科技有限公司 | Touch-control sensing layer and manufacture method thereof |
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| TWI575434B (en) * | 2015-04-17 | 2017-03-21 | 宸鴻科技（廈門）有限公司 | Touch panels |
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| TWM453901U (en) | 2013-05-21 |
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